Electronic device

Abstract

The application discloses an electronic device. The electronic device comprises a metal shell and an antenna module, the antenna module is arranged on the inner side of the metal shell; the metal shell is provided with an antenna slot, the antenna slot comprises a first antenna slot and a second antenna slot which are arranged in a cross manner; the antenna module comprises an antenna unit, the antenna unit comprises a back cavity layer and a radiation layer, the back cavity layer is arranged between the radiation layer and the metal shell, the radiation layer is provided with a slot, the slot comprises a first slot and a second slot which are arranged in a cross manner; wherein the first antenna slot and the first slot are oppositely arranged and have different sizes, and the second antenna slot and the second slot are oppositely arranged and have different sizes.

Description

Technical Field

[0001] This application relates to the field of wireless communication technology, and more particularly to an electronic device. Background Technology

[0002] With the development of 5G technology, mobile phones and other electronic devices will integrate millimeter-wave antenna array systems to support 5G communication and other functions. A millimeter-wave antenna array system includes a millimeter-wave antenna and components used in conjunction with it to meet the requirements of 5G communication technology. However, since mobile phones and other electronic devices generally have metal frames or metal back covers, when the millimeter-wave antenna array system is located inside these devices, the metal frame or metal back cover will interfere with the operation of the millimeter-wave antenna, thus affecting the structural design of the millimeter-wave antenna within the electronic device. Summary of the Invention

[0003] The purpose of this application is to provide an electronic device that improves the problem of millimeter-wave antenna integration in electronic devices with 5G communication capabilities in environments with metal frames or metal back covers.

[0004] To address the aforementioned technical problems, this application provides an electronic device, comprising: a metal casing and an antenna module, wherein the antenna module is disposed inside the metal casing. The metal casing has antenna slots, including a first antenna slot and a second antenna slot that intersect. The antenna module includes an antenna element, which includes a back cavity layer and a radiating layer. The radiating layer is located between the back cavity layer and the metal casing, and the radiating layer has gaps, including a first gap and a second gap that intersect. The first antenna slot and the first gap are opposite each other and have different dimensions, as are the second antenna slot and the second gap. Based on this, through the cooperation of the metal casing and the antenna module, the antenna slots can participate in signal reception and transmission to provide a smooth communication experience. Furthermore, because the first antenna slot and the first gap have different dimensions, and the second antenna slot and the second gap have different dimensions, higher bandwidth can be provided.

[0005] In some embodiments, the radiating layer is multi-layered; the multiple radiating layers are stacked and each has gaps. In the multiple radiating layers, at least some of the gaps in the radiating layers have different sizes; or, the gaps in the multiple radiating layers all have different sizes. Based on the multi-layered radiating layer, the electronic device can have higher bandwidth to meet the frequency bands specified by the 5G standard.

[0006] In some embodiments, the multilayer radiating layers include at least a first radiating layer, a second radiating layer, a third radiating layer, a fourth radiating layer, and a fifth radiating layer stacked sequentially. The second radiating layer has a first power divider for coupling and feeding the first antenna slot and the first gap. The fourth radiating layer has a second power divider for coupling and feeding the second antenna slot and the second gap. The third radiating layer is located between the second and fourth radiating layers to improve the isolation between the feed terminals of the first and second power dividers. It should be understood that the first to fifth radiating layers may each have slots of different sizes to have different resonant points, thereby expanding the bandwidth of the electronic device. Alternatively, at least some of the radiating layers in the first to fifth radiating layers may have slots of different sizes to have more resonant points, thereby also expanding the bandwidth of the electronic device.

[0007] In some embodiments, the first radiating layer has a second protrusion at the end corresponding to the first slot, the second protrusion protruding toward the other end of the second slot to adjust the impedance matching based on the second slot and the second antenna slot. This ensures normal transmission and reception of signals generated based on each of the second slots and the second antenna slot.

[0008] In some embodiments, the first power divider includes a first feed terminal, a first feed branch, and a second feed branch; the first feed branch and the second feed branch are respectively connected to the first feed terminal. The first feed terminal is located on one side of the first slot of the second radiating layer; a portion of the first feed branch and a portion of the second feed branch are perpendicular to the first slot of the second radiating layer and span the first slot of the second radiating layer. Based on the first feed branch and the second feed branch, signals can be output with equal amplitude and phase to the first slots of each radiating layer and to the first antenna slot of the metal casing.

[0009] In some embodiments, the second power divider includes a second feed terminal, a third feed branch, and a fourth feed branch; the third feed branch and the fourth feed branch are respectively connected to the second feed terminal. The second feed terminal is located on one side of the second slot of the fourth radiating layer; a portion of the third feed branch and a portion of the fourth feed branch are perpendicular to the second slot of the fourth radiating layer and span the second slot of the fourth radiating layer. Based on the third feed branch and the fourth feed branch, signals can be output with equal amplitude and phase to the second slots of each radiating layer and to the second antenna slot of the metal casing.

[0010] In some embodiments, the fifth radiating layer has a first protrusion at the end corresponding to the first slot, the first protrusion protruding toward the other end of the first slot to adjust the impedance matching based on the first slot and the first antenna slot. This ensures normal transmission and reception of signals generated based on each first slot and the first antenna slot.

[0011] In some embodiments, the cavity back layer is located to one side of the fifth radiating layer and away from the metal housing. Based on the cavity back layer, when the antenna element is fed via a first power divider and / or a second power divider, the associated signal can be radiated more stably in a direction away from the electronic device.

[0012] In some embodiments, the inner walls of the metal casing corresponding to the first and second antenna slots are stepped. It should be understood that this stepped inner wall allows multiple first and second antenna slots of different sizes to be formed within a single antenna slot; based on this, the bandwidth of the electronic device can be extended without increasing the number of radiating layers in the antenna module, to cover the frequency bands specified by the 5G standard as much as possible.

[0013] In some embodiments, along the direction from the outer side to the inner side of the metal casing, the long side of the stepped inner wall gradually decreases and the short side gradually increases; or, along the direction from the outer side to the inner side of the metal casing, the long side of the stepped inner wall gradually increases and the short side gradually decreases; or, along the direction from the outer side to the inner side of the metal casing, both the long side and the short side of the stepped inner wall gradually increase; or, along the direction from the outer side to the inner side of the metal casing, both the long side and the short side of the stepped inner wall gradually decrease.

[0014] In some embodiments, the metal casing includes a metal frame, and the number of antenna modules is two. The two antenna modules are arranged opposite to each other and are respectively located inside the metal frame.

[0015] In some embodiments, the metal housing includes a metal back cover, and the number of antenna modules is two. The two antenna modules are spaced apart and are respectively located inside the metal back cover.

[0016] In some embodiments, the electronic device further includes a dielectric material. The dielectric material is disposed within the first antenna slot and the second antenna slot of the metal casing. Therefore, the dielectric material can ensure normal signal transmission and reception of the electronic device and improve its sealing performance.

[0017] In some embodiments, the dielectric material is a material with low dielectric constant and low dielectric loss. For example, the dielectric material is Teflon.

[0018] In some embodiments, the electronic device further includes a motherboard and a millimeter-wave phased array chip. The motherboard is electrically connected to the antenna module and the millimeter-wave phased array chip; the millimeter-wave phased array chip is disposed on the antenna module and away from the metal casing. The number of millimeter-wave phased array chips is the same as the number of antenna modules; that is, each antenna module is equipped with one millimeter-wave phased array chip, which can control the antenna elements in the antenna module to facilitate signal transmission and reception.

[0019] In some embodiments, the antenna module includes four antenna elements to ensure the gain and scanning of the antenna beam of the electronic device.

[0020] In some embodiments, the metal casing includes a metal frame, which includes a main body and a protrusion; the protrusion is located on one side of the main body and away from the millimeter-wave phased array chip; the protrusion is used to connect the front cover and the back cover of the electronic device. Based on this, by controlling the size of the protrusion of the metal frame, the electronic devices of various embodiments can achieve a narrow bezel appearance while providing a good communication experience, and realize the thinness and lightness of the electronic device.

[0021] In some embodiments, the millimeter-wave phased array chip is electrically connected to the antenna module via flip-chip soldering or reflow soldering to reduce signal transmission loss.

[0022] This application creates an antenna slot in the metal casing and integrates a millimeter-wave antenna module on the inside of the metal casing. Thus, the metal casing with the antenna slot can work with the antenna module to achieve signal transmission and reception and meet the bandwidth requirements of 5G communication. Attached Figure Description

[0023] Figure 1 This is a perspective view of an electronic device according to an embodiment of this application.

[0024] Figure 2 This is a partial schematic diagram of a millimeter-wave antenna array system according to an embodiment of this application.

[0025] Figure 3 This is a partial schematic diagram of the metal casing according to an embodiment of this application.

[0026] Figure 4 This is an exploded view of an antenna module according to an embodiment of this application.

[0027] Figure 5 This is a schematic diagram of the first radiating layer according to an embodiment of this application.

[0028] Figure 6 This is a schematic diagram of the fifth radiating layer according to an embodiment of this application.

[0029] Figure 7 This is a schematic diagram of the second radiating layer according to an embodiment of this application.

[0030] Figure 8 This is a schematic diagram of the fourth radiating layer according to an embodiment of this application.

[0031] Figure 9 This is a schematic diagram of the third radiating layer according to an embodiment of this application.

[0032] Figure 10 This is a perspective view of a portion of the metal casing of an embodiment of this application from a first-view perspective.

[0033] Figure 11 This is a perspective view of a portion of the metal casing of an embodiment of this application from a second perspective.

[0034] Figure 12 This is a top view of a portion of the metal casing of an embodiment of this application from a first perspective.

[0035] Figure 13 This is a top view of a portion of the metal casing of an embodiment of this application from a first perspective.

[0036] Figure 14 This is a current distribution diagram of a millimeter-wave antenna array system when fed by coupling through the first power divider.

[0037] Figure 15 and Figure 16 This is a schematic diagram of the S-parameters of a millimeter-wave antenna array system according to an embodiment of this application.

[0038] Figure 17 This is a data graph of the equivalent omnidirectional radiated power and cumulative distribution function of a millimeter-wave antenna array system according to an embodiment of this application under the action of a 3-bit phase shifter.

[0039] Figure 18 This is the cross-polarization pattern of the millimeter-wave antenna array system when fed by the first power divider.

[0040] Figure 19 This is the cross-polarization pattern of a millimeter-wave antenna array system when fed by a second power divider. Detailed Implementation

[0041] The technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings.

[0042] In electronic devices with wireless communication capabilities, the frame is mostly made of metal to balance aesthetics and practicality (such as wear and tear resistance or drop resistance). Taking mobile phones as an example, the metal frame is located between the front and back covers. A display module can be placed on one side of the front cover, which can display visual information such as text and images for the user to access. A rear camera assembly can be placed on one side of the back cover, enabling functions such as taking photos and videos. The metal frame, front cover, and back cover together form the internal space of the mobile phone, which can accommodate electronic components such as circuit boards, processors, speakers, and batteries, enabling the phone to perform functions such as data processing and music playback.

[0043] To enable communication, mobile phones typically have an internal antenna module for receiving and transmitting wireless signals. However, since most mobile phones have a metal frame, the inherent electromagnetic shielding properties of the metal frame can cause signal instability during transmission and reception, negatively impacting the user experience.

[0044] With the development and popularization of 5G, incorporating millimeter-wave antenna modules into electronic devices has become a requirement for meeting user communication experience needs. Since millimeter waves have a wavelength range of 1mm to 10mm and a corresponding frequency band of 26.5GHz to 300GHz, metal frames have a more significant impact on signals within this frequency band. Therefore, electronic devices often modify their metal frames in various ways to ensure that the millimeter-wave antenna modules within the device can stably transmit signals at specific frequencies. For example, opening holes in the phone's frame to embed the millimeter-wave antenna module. However, these methods result in a narrower frequency band for the phone's transmission and reception and are prone to impedance mismatch, poor structural stability, and poor antenna-chip interconnection, leading to significant signal loss during transmission and reception.

[0045] Please refer to this simultaneously. Figures 1 to 19 Based on the above problems, the embodiments of this application provide an electronic device 10, which includes a millimeter-wave antenna array system 20. Through the cooperation of the metal casing and the antenna module, both the millimeter-wave antenna array system 20 and the corresponding electronic device 10 can meet the bandwidth requirements of 5G and provide a good 5G communication experience.

[0046] In some embodiments, the millimeter-wave antenna array system 20 can be applied to IEEE 802.11.ad (60GHz WiGig), IEEE 802.11.aj (45GHz Q-Link-Pan) and other high-frequency mobile and wireless communication systems, and this application does not limit it in this regard.

[0047] It should be understood that the millimeter-wave antenna array system 20 of each embodiment integrates 5G communication-related structures and can be configured in various types of electronic devices 10. For ease of understanding, the electronic device 10 of each embodiment is primarily illustrated using a widely used electronic device such as a mobile phone, but this is not a limitation. For example, the electronic device 10 of each embodiment can also be a car navigation system, a tablet computer, or a laptop computer, etc.; or, the electronic device 10 can also be a wearable electronic device 10, such as a smartwatch or a smart bracelet, etc. Similarly, the metal casing of the millimeter-wave antenna array system 20 is primarily illustrated using a metal frame, but this is not a limitation. For example, the metal casing can be a metal back cover; or, the metal casing includes a metal frame and a metal back cover.

[0048] In addition to the millimeter-wave antenna array system 20, the electronic devices 10 in each embodiment may also include modules such as camera modules and display modules to meet various user needs.

[0049] In some embodiments, the camera module may include a front-facing camera component and a rear-facing camera component. The front-facing camera component may include at least one camera to provide functions such as identity recognition (e.g., facial recognition), selfies, and video calls. The rear-facing camera component may include one, two, or more cameras to provide a variety of video recording and other functions. It should be understood that when the rear-facing camera component includes at least two cameras, it may include a combination of at least two of the following: a high-definition camera, a telephoto camera, a wide-angle camera, a depth camera, etc., without limitation.

[0050] In some embodiments, the display module may include a self-emissive display panel or a passively illuminated display panel. The self-emissive display panel may be, for example, an OLED display panel. The passively illuminated display panel may be, for example, a liquid crystal display panel, and works in conjunction with a related backlight unit to display visual information.

[0051] Please refer to this simultaneously. Figure 2 and Figure 3 The millimeter-wave antenna array system 20 provided in this application embodiment includes a metal housing and an antenna module 200. The antenna module 200 is disposed on the inner side of the metal housing and is attached to the metal housing, thereby realizing the electrical connection between the metal housing and the antenna module 200. The inner side of the metal housing refers to the side facing the internal space of the mobile phone, and the outer side of the metal housing refers to the side facing free space; correspondingly, the antenna module 200 is located in the internal space of the mobile phone. As described above, an example of the metal housing is a metal frame 100.

[0052] Please refer to Figure 3In some embodiments, to improve the signal transmission and reception performance of the millimeter-wave antenna array system 20, a cross-shaped slot is formed in the metal frame 100 as an antenna slot 100a. The antenna module 200 is located inside the metal frame 100 and directly opposite the antenna slot 100a. The antenna slot 100a includes a first antenna slot and a second antenna slot that are arranged in a cross configuration. Based on this, when transmitting and receiving signals, the metal frame 100 with the antenna slot 100a can cooperate with the antenna module 200 to achieve signal transmission and reception.

[0053] In some embodiments, the connection between the metal frame 100 and the antenna module 200 includes, but is not limited to, threaded connection, welding, conductive adhesive bonding, etc., and this application does not limit this.

[0054] Please refer to the same information again. Figures 1 to 3 When the metal casing is a metal frame 100, the metal frame 100 includes a main body 110 and a protrusion 120. The protrusion 120 protrudes relative to the main body 110 and is located on the side of the main body 110 away from the internal space; the antenna slot passes through the main body 110 and the protrusion 120. The protrusion 120 is located on the outside of the main body 110 and is used to connect the front cover and the back cover. It should be understood that when the millimeter-wave antenna array system 20 is applied to a mobile phone, the protrusion 120 is the part of the metal frame 100 exposed to the outside. When a user holds the mobile phone, the part of the metal frame 100 that the user's palm touches refers to the protrusion 120. Based on this, by controlling the size of the protrusion 120 of the metal frame 100, the electronic devices 10 of various embodiments can achieve a narrow bezel appearance while providing a good communication experience, and realize the thinness and lightness of the electronic devices 10.

[0055] Please refer to Figure 2 In some embodiments, the antenna slot 100a of the metal frame 100 is filled with a low-loss, low-dielectric-constant dielectric material 130. For example, Teflon is filled into the antenna slot 100a of the metal frame 100. Based on this, the dielectric material 130 can ensure normal signal transmission and reception and improve the sealing performance of the mobile phone (e.g., waterproof, dustproof, etc.).

[0056] In some other embodiments, the metal casing includes at least a metal back cover, which may consist only of a main body and without any protrusions. The metal back cover may have an antenna slot, allowing it to work with an antenna module to transmit and receive signals.

[0057] In some other embodiments, the metal casing includes at least a metal frame and a metal back cover. Both the metal frame and the metal back cover have antenna slots.

[0058] Please refer to this simultaneously. Figures 1 to 3In some embodiments, after the antenna slot 100a is opened, the metal frame 100 remains an integrated housing structure. Correspondingly, the connection between the metal frame 100 and the antenna module 200 can be more robust to ensure the normal transmission and reception of signals by the millimeter-wave antenna array system 20. Furthermore, the integrated metal frame 100 also has strong resistance to deformation to protect the relevant electronic components located within the internal space of the mobile phone.

[0059] Please refer to Figure 1 In some embodiments, the millimeter-wave antenna array system 20 exemplary includes two antenna modules 200, but is not limited thereto.

[0060] Taking the metal frame 100 as an example, the metal frame 100 is generally rectangular, including a top and a bottom, and a first and a second side located between the top and the bottom. Two antenna modules 200 can be located on the two sides of the metal frame 100, respectively. Based on this, the two antenna modules 200 can work in conjunction with the metal frame 100 to radiate in different directions and achieve signal transmission and reception.

[0061] In some embodiments, the antenna module may be located in the upper-middle part of the side of the metal frame, thereby avoiding the area held by the user's hand as much as possible, reducing the possibility of the antenna module being blocked by the user and improving the radiation efficiency of the antenna module.

[0062] Taking a metal back cover as an example, two antenna modules can be positioned at intervals on the inside of the metal back cover and facing the internal space. Based on this, the two antenna modules can work together with the metal back cover to radiate into free space and achieve signal transmission and reception.

[0063] Taking a metal casing including a metal frame and a metal back cover as an example, one of the two antenna modules can be located on the first side of the metal frame and facing the internal space of the phone, while the other antenna module can be located on the metal back cover and facing the internal space of the phone. Based on this, one antenna module can work with the metal frame to radiate towards the side of the phone, and the other antenna module can work with the metal back cover to radiate towards the back of the phone, thereby achieving signal transmission and reception.

[0064] In other embodiments, the number of antenna modules can be one or more, depending on structural design, signal coverage, and other requirements; this application does not limit this. For example, the number of antenna modules may be three, four, or five, etc.

[0065] For example, the metal casing has a metal frame, and the number of antenna modules is four. These four antenna modules can be divided into two groups, located on both sides of the metal frame. Specifically, the two antenna modules located on the first side of the metal frame are spaced apart, and the two antenna modules located on the second side of the metal frame are also spaced apart to improve the stability of signal transmission and reception.

[0066] Alternatively, two antenna modules can be located on either side of the metal frame, while two other antenna modules can be located at the top and bottom of the metal frame. That is, an antenna module is located on each of the first, second, top, and bottom sides of the metal frame. Therefore, by coordinating antenna modules in different locations with the metal frame, the stability of the phone's signal transmission and reception can be improved, thereby enhancing the user's communication experience.

[0067] Please refer to Figure 2 In some embodiments, each antenna module 200 includes at least one antenna element 210, which can be used in conjunction with structures such as millimeter-wave phased array chips to perform signal modulation, mixing, and filtering. It should be understood that the total number of antenna elements 210 is the same as the number of antenna slots 100a in the metal frame 100.

[0068] For example, a millimeter-wave antenna array system includes two antenna modules, and each antenna module includes four antenna elements, resulting in a total of eight antenna elements. Based on this, the metal casing will have eight antenna slots to correspond with these eight antenna elements and enable signal transmission and reception.

[0069] For example, a millimeter-wave antenna array system includes three antenna modules, and each antenna module includes three antenna elements, resulting in a total of nine antenna elements. Based on this, the metal casing will have nine antenna slots to correspond with these nine antenna elements and enable signal transmission and reception.

[0070] It should be understood that the antenna module 200 in each embodiment exemplarily includes four antenna elements 210 to ensure antenna beam gain and scanning; correspondingly, the metal frame 100 also has four antenna slots at positions corresponding to the antenna module 200 to accommodate the four antenna elements 210. In other embodiments, each antenna module may include one, two, three, or five antenna elements, and this application does not limit the number of antenna elements that can be set in the antenna module.

[0071] In some embodiments, each antenna element 210 includes a radiating layer and a cavity layer, the cavity layer being located on one side of the radiating layer and away from the metal casing; that is, the radiating layer is located between the cavity layer and the metal casing. The radiating layer has a first slot and a second slot that are arranged in a cross configuration; wherein the first slot and the first antenna slot are opposite each other and have different dimensions, and the second slot and the second antenna slot are opposite each other and have different dimensions. Based on this, the millimeter-wave antenna array system 20 and the electronic device 10 can have higher bandwidth to provide a smooth communication experience.

[0072] Please refer to this simultaneously. Figure 2 and Figure 4 In some embodiments, each antenna element 210 has a first slot antenna assembly, which includes at least a first radiating layer 220, a second radiating layer 230, a third radiating layer 240, a fourth radiating layer 250, and a fifth radiating layer 260 stacked sequentially. A dielectric is provided between adjacent radiating layers; generally, the multiple radiating layers and dielectric can be compared to a multilayer PCB board or substrate. The first to fifth radiating layers (220, 230, 240, 250, 260) all have slots to allow the corresponding radiating layer (220, 230, 240, 250, 260) to function as a slot antenna.

[0073] It should be understood that, such as Figure 2 As shown, along the extension direction a of the metal frame (e.g., along the extension direction of the side), the gaps of each radiating layer and the antenna gaps on the metal frame 100 are all cross gaps placed at ±45°. While achieving ±45° dual polarization, the spacing between the antenna elements 210 is minimized as much as possible to reduce the overall size of the antenna module.

[0074] In some embodiments, the size of the slots in each radiating layer (220, 230, 240, 250, 260) is different; based on this, the slot antennas in each radiating layer (220, 230, 240, 250, 260) have different resonant points, and the corresponding millimeter-wave antenna array system 20 can provide higher bandwidth to better cover the frequency bands specified by the 5G standard; for example, the millimeter-wave antenna array system 20 provided in each embodiment can cover the frequency bands n257 (26.5 GHz ~ 29.5 GHz) and n258 (24.25 GHz ~ 27.5 GHz) as much as possible to achieve smooth 5G communication and other functions.

[0075] In other embodiments, at least some of the slots in each radiating layer have different sizes. Taking a five-layer radiating layer as an example, the slots in the first and second radiating layers are the same size, the slots in the fourth and fifth radiating layers are the same size, while the slots in the second, third, and fourth radiating layers are different sizes. Based on this, the slotted antenna in each radiating layer has more resonant points, and the corresponding millimeter-wave antenna array system can provide higher bandwidth to better cover the frequency bands specified by the 5G standard.

[0076] In some embodiments, the radiating layers (220, 230, 240, 250, 260) of the first slot antenna assembly are electrically connected through metallized vias (not shown). Based on this, after coupling and feeding, all multiple radiating layers (220, 230, 240, 250, 260) can transmit and receive signals into free space to achieve functions such as 5G communication. Furthermore, because the slots of the multiple radiating layers (220, 230, 240, 250, 260) have different shapes and / or patterns and / or sizes, the millimeter-wave antenna array system 20 has a higher bandwidth and can more stably transmit and receive signals.

[0077] Please refer to Figure 5 In some embodiments, the first radiating layer 220 has a first slot 220a, which includes a first slot 220b and a second slot 220c that are perpendicularly intersecting. The first radiating layer 220 has a second protrusion 222 at one end of the second slot 220c. The second protrusion 222 protrudes toward the other end of the second slot 220c. Therefore, based on the structure of the second protrusion 222, the impedance matching of the second antenna slots of the metal frame and the second slots of each radiating layer can be adjusted overall, ensuring normal transmission and reception of signals generated based on each second slot and the second antenna slot.

[0078] Please refer to Figure 6 In some embodiments, the fifth radiating layer 260 has a fifth slot 260a, which includes a first slot 260b and a second slot 260c that intersect perpendicularly. Corresponding to the second protrusion 222 of the first radiating layer 220, the fifth radiating layer 260 has a first protrusion 262 at the end of the first slot 260b. The first protrusion 262 protrudes toward the other end of the first slot 260b. Thus, based on the structure of the first protrusion 262, the impedance matching of the first antenna slot of the metal frame and the first slots of each radiating layer as a whole can be adjusted to ensure normal transmission and reception of signals generated based on each first slot and the first antenna slot.

[0079] Please refer to Figure 7In some embodiments, the second radiating layer 230 has a second slot 230a, which includes a first slot 230b and a second slot 230c that intersect perpendicularly. To feed power to each of the first slots, the second radiating layer 230 further includes a first power divider 232. The first power divider 232 includes a first feed terminal 232a and a first feed branch 232b and a second feed branch 232c respectively connected to the first feed terminal 232a. The first feed terminal 232a is located on one side of the first slot 230b; a portion of the first feed branch 232b and a portion of the second feed branch 232c are both perpendicular to the first slot 230b, and both portions of the first feed branch 232b and the second feed branch 232c span the first slot 230b.

[0080] In some embodiments, both feed branches (232b, 232c) include a connecting portion and a parallel portion, with the parallel portion spanning the first gap 230b and the connecting portion connecting the parallel portion and the first feed end. The parallel portions of both feed branches (232b, 232c) extend perpendicularly to the first gap 230b and both cross the first gap 230b. The shape of the connecting portion is typically straight, but not limited to this; in other embodiments, the shape of the connecting portion of the two feed branches (232b, 232c) can also be curved, zigzag, or wavy, etc.

[0081] In some embodiments, the first feed terminal 232a of the first power divider 232 can be connected to various types of coaxial cables to input signals via the coaxial cables. Correspondingly, other radiating layers located on the side of the second radiating layer 230 and away from the first radiating layer 220 will have corresponding vias (not shown) that allow coaxial cables to pass through these radiating layers and connect to the feed terminal 232a of the first power divider 232. For example, the first feed terminal 232a can be connected to a SICL (Substrate Integrated Coaxial Line) or a SIW (Substrate Integrated Waveguide). Based on the first feed branch 232b and the second feed branch 232c, the signal can be output with equal amplitude and phase to the first slots of each radiating layer and to the first antenna slot of the metal frame.

[0082] Please refer to Figure 8In some embodiments, the fourth radiating layer 250 has a fourth slot 250a, which includes a first slot 250b and a second slot 250c that intersect perpendicularly. To feed each of the second slots, similar to the structure of the first power divider 232 in the second radiating layer 230, the fourth radiating layer 250 also includes a second power divider 252. The second power divider 252 includes a second feed terminal 252a and a third feed branch 252b and a fourth feed branch 252c respectively connected to the second feed terminal 252a. The second feed terminal 252a is located on one side of the second slot 250c, and a portion of the third feed branch 252b and a portion of the fourth feed branch 252c are perpendicular to the second slot 250c, and both portions of the third feed branch 252b and the fourth feed branch 252c span the second slot 250c.

[0083] In some embodiments, similar to the feed branches (232b, 232c) of the first power divider, both feed branches (252b, 252c) include a connecting portion and a parallel portion. The parallel portion spans the second gap 250c, and the connecting portion connects the parallel portion between the second feed end and the second feed end. The parallel portions of both feed branches (252b, 252c) extend perpendicularly to the second gap 250c and both cross the second gap 250c. The shape of the connecting portion is typically straight, but not limited to this; in other embodiments, the shape of the connecting portion of the two feed branches (252b, 252c) can also be curved, zigzag, or wavy, etc.

[0084] It should be understood that the second feed terminal 252a of the second power divider 252 can also be connected to various types of coaxial cables to input signals via coaxial cables. Correspondingly, other radiating layers located on the side of the fourth radiating layer 250 and away from the third radiating layer 240 (e.g., the fifth radiating layer 260) will also have corresponding through-holes (not shown) to allow coaxial cables to pass through these radiating layers and connect to the feed terminal 252a of the second power divider 252. For example, similar to the first feed terminal 232a, the second feed terminal 252a of the second power divider 252 can also be connected to SICL or SIW. Based on the third feed branch 252b and the fourth feed branch 252c, the signal can also be output with equal amplitude and phase to the second slots of each radiating layer and to the second antenna slot of the metal frame.

[0085] Please refer to Figure 9 In some embodiments, the third radiating layer 240 has a third slot 240a, which includes a first slot 240b and a second slot 240c that intersect perpendicularly. It should be understood that, as Figures 7 to 9The third radiating layer 240 is located between the second radiating layer 230 and the fourth radiating layer 250. Based on the inherent electromagnetic shielding characteristics of metal, the third radiating layer 240 can isolate the effects of feeding the first power divider 232 and the second power divider 252, thereby reducing interference between the first slots and the second slots of the antenna element 120. Based on this, the third radiating layer 240, while providing the third slot antenna 240a, can ensure sufficient isolation between the first feed terminal 232a and the second feed terminal 252a, thereby ensuring the normal operation of the antenna module 200.

[0086] Please refer to this again. Figure 5 and Figure 6 In some embodiments, the second protrusion 222 and the first protrusion 262 are both illustrated as semi-circular; however, this application does not limit the structure, number, position, or other relationships of the second protrusion 222, as long as the second protrusion 222 can achieve the adjustment of impedance matching for each second slot and the second antenna slot. Similarly, this application does not limit the structure, number, position, or other relationships of the first protrusion 262, as long as the first protrusion 262 can achieve the adjustment of impedance matching for each first slot and the first antenna slot. For example, the first protrusion 262 can be triangular or rectangular, and the second protrusion 222 can be rectangular or semi-elliptical, etc.; the number of first protrusions 262 can be one or two; the first protrusion 262 can be disposed within the fifth radiating layer and located at any position of the second slot.

[0087] Please refer to Figure 4 In some embodiments, the back cavity layer 270 of the antenna element 210 is located on one side of the fifth radiating layer 260 and away from the first radiating layer 220. The back cavity layer 270 has no gaps, and the space between the back cavity layer 270 and the fifth radiating layer 260 forms the back cavity of the antenna element 210. Based on this back cavity, when the antenna element is fed through the first power divider and / or the second power divider, the relevant signals can be radiated more stably in a direction away from the mobile phone.

[0088] In some embodiments, a dielectric material is provided between the radiating layers and between the fifth radiating layer and the cavity layer. The dielectric material may also be removed between the cavity layer 270 and the fifth radiating layer 260, forming an air cavity to extend the bandwidth of the antenna element 210. It should be understood that the shape of the air cavity can be rectangular, triangular, or cross-shaped, etc., and there is no limitation thereto.

[0089] In some embodiments, the number of radiating layers in each antenna element 210 may be greater than or equal to six layers, and this application does not impose a limitation on this. It should be understood that, similar to the first radiating layer 220 to the fifth radiating layer 260, the sixth radiating layer or higher all have cross-shaped slots; wherein the size of the cross-shaped slots in each radiating layer is different; or, at least some of the radiating layers have cross-shaped slots of different sizes. Based on this, through the cooperation of these radiating layers, the bandwidth of the millimeter-wave antenna array system 20 and the electronic device 10 can be extended as much as possible. These radiating layers, when fed by corresponding power dividers, can all realize signal transmission and reception to meet the 5G communication requirements as much as possible.

[0090] It should be understood that the difference in size can refer to the different lengths of the cross gaps, the different widths of the cross gaps, or both the different lengths and widths of the cross gaps.

[0091] Please refer to this simultaneously. Figure 10 , Figure 11 , Figure 12 and Figure 13 In some embodiments, the metal frame 100 forms antenna slots 100a by creating cross-shaped slots. To extend the bandwidth of the millimeter-wave antenna array system 20, the inner wall of the metal frame 100 corresponding to the antenna slot 100a is stepped. It should be understood that, based on this stepped inner wall, the metal frame 100 can divide a single antenna slot 100a into multiple slots of different sizes. Therefore, the metal frame 100 can serve as a second slotted antenna assembly, extending the bandwidth of the millimeter-wave antenna array system 20.

[0092] For example, if the inner wall of the antenna slot 100a of the metal frame 100 has four steps, then four slots of different sizes will be formed on the metal frame 100 accordingly. The metal frame 100 with these four slots can be used in conjunction with the first slot antenna assembly to enable the millimeter-wave antenna array system 20 to have a higher bandwidth and cover the frequency bands specified by the 5G standard as much as possible.

[0093] In some embodiments, each antenna slot 100a of the metal frame 100 includes a plurality of intersecting perpendicular first antenna slots 100b and second antenna slots 100c. It should be understood that the dimensions of each first antenna slot 100b and each second antenna slot 100c are also different based on the different steps of the inner wall in the long side direction and the short side direction.

[0094] like Figure 12 and Figure 13Taking an antenna slot 100a comprising four first antenna slots 100b and four second antenna slots 100c as an example, from the outside to the inside of the metal frame 100, the long sides (L1, L2, L3, L4) of the stepped inner wall gradually decrease, while the short sides (W1, W2, W3, W4) gradually increase. Thus, through the stepped structure of the inner wall corresponding to antenna slot 100a, while forming antenna slot 100a, the dimensions of the corresponding first antenna slots 100b and second antenna slots 100c are also different, and their corresponding resonant points are also different, thereby expanding the bandwidth of the millimeter-wave antenna array system 20.

[0095] In other embodiments, the long side of the stepped inner wall gradually increases from the outer to the inner side of the metal frame, while the short side gradually decreases. This also extends the bandwidth of the millimeter-wave antenna array system.

[0096] In other embodiments, the long and short sides of the stepped inner wall gradually increase from the outer to the inner side of the metal frame. Based on this, the bandwidth of the millimeter-wave antenna array system can also be extended.

[0097] In other embodiments, the long and short sides of the stepped inner wall gradually decrease from the outer to the inner side of the metal frame. Based on this, the bandwidth of the millimeter-wave antenna array system can also be extended.

[0098] In other embodiments, the long side of the stepped inner wall can increase and then decrease, or decrease and then increase, from the outer to the inner side of the metal frame. Similarly, the short side of the stepped inner wall can also increase and then decrease, or decrease and then increase. That is, the steps of the inner wall of the metal frame are not monotonically changing, which can also extend the bandwidth of the millimeter-wave antenna array system.

[0099] In some embodiments, each first slot (220b, 230b, 240b, 250b, 260b) in the first slot antenna assembly and each first antenna slot 100b in the second slot antenna assembly are coupled and fed through a first power divider 232; each second slot (220c, 230c, 240c, 250c, 260c) and each second antenna slot 100c are coupled and fed through a second power divider 252. However, it should be understood that the dimensions of each slot (220a, 230a, 240a, 250a, 260a) in the first slot antenna assembly and the antenna slot 100a in the second slot antenna assembly are not the same; however, as explained above, the dimensions of each slot (220a, 230a, 240a, 250a, 260a) may be at least partially different or all different. Based on this, through the cooperation of the first slot antenna assembly and the second slot antenna assembly, the millimeter-wave antenna array system 20 can achieve dual polarization while having higher bandwidth to meet the bandwidth requirements of the 5G standard.

[0100] In some embodiments, when the antenna module 200 includes at least two antenna elements 210, the first radiating antenna component in each antenna element 210 has a radiating antenna of a different size, thereby extending the bandwidth of the millimeter-wave antenna array system 20 and improving the stability of the transmitted and received signals.

[0101] The following will use simulation diagrams to provide a detailed description of the millimeter-wave antenna array system 20 in the above embodiments.

[0102] Please refer to Figure 14 In some embodiments, when the first antenna slots of the metal frame and the various first slots of the antenna module are excited by the first power divider, these first slots and the first antenna slots have a strong current around them as a whole, while the current around each second slot and the second antenna slot is very small. Based on this, the mutual influence between the two polarizations can be minimized by isolating the second and fourth radiating layers by the third radiating layer.

[0103] Please refer to Figure 15 In the millimeter-wave antenna array systems and electronic devices of the various embodiments of this application, the return loss of each port is better than 10dB over a wide range, which essentially covers the frequency bands n257 and n258 specified by the 5G standard. Please refer to... Figure 16 In the millimeter-wave antenna array system and electronic device of the various embodiments of this application, the isolation between each port is substantially better than 15dB due to the isolation effect of the third radiating layer. Therefore, when this millimeter-wave antenna array is applied to a mobile phone, it can meet the various 5G communication needs of users in their daily lives.

[0104] Please refer to Figure 17With the help of the 3-bit phase shifter, the millimeter-wave antenna array systems of various embodiments of this application meet the 3GPP standard for EIRP (Equivalent Isotropically Radiated Power) at 26GHz and 28GHz. Based on the 3GPP standard, the millimeter-wave antenna module for 5G communication has an EIRP of 11.5dB at 50% CDF (Cumulative Distribution Function). However, the millimeter-wave antenna array systems and electronic devices of various embodiments, under reasonable assumptions regarding the output power of the power amplifier and other losses, have an EIRP of 18dB at 50% CDF. That is, the millimeter-wave antenna array systems of various embodiments have a margin of 6.5dB at 50% CDF. Therefore, when this millimeter-wave antenna array is applied to actual communication, the corresponding electronic devices can have better signal quality, enabling users to perform functions such as calls and video chats.

[0105] Please refer to Figure 18 In some embodiments, each first slot and first antenna slot exhibits good overall gain after being excited. For example, there is a large gain difference between the main polarization and the cross-polarization in the direction of -60° to 60°. It can be seen that when each first slot and first antenna slot is excited, the interference effect of each second slot and second antenna slot is small, and the signals emitted by each first slot and first antenna slot can propagate relatively stably in free space.

[0106] Please refer to Figure 19 In some embodiments, each second slot and each second antenna slot also exhibits good overall gain after being excited. For example, there is a large gain difference between the main polarization and the cross-polarization in the direction of -100° to 100°. It can be seen that when each second slot and each second antenna slot is excited, the interference effect of each first slot and each first antenna slot is small, and the signals emitted by each second slot and each second antenna slot can propagate relatively stably in free space.

[0107] The millimeter-wave antenna array system 20 in each embodiment achieves signal transmission and reception through the structure of the metal frame 100 and antenna element 210. It should be understood that, unlike the millimeter-wave antenna modules in other mobile phones, as shown in the above embodiments, the millimeter-wave antenna array system 20 in these electronic devices 10 provides high bandwidth by basically covering the frequency bands n257 and n258, while its structure is relatively simple and easy to assemble in electronic devices, and the manufacturing process is relatively easy, thereby facilitating industrial manufacturing.

[0108] Please refer to this again. Figure 1The electronic device 10 provided in this application embodiment also includes a motherboard 30 and a millimeter-wave phased array chip 40. The motherboard 30 is electrically connected to the antenna module 200, and the millimeter-wave phased array chip 40 is located on one side of the antenna module 200 and away from the metal frame 100. The number of millimeter-wave phased array chips 40 is the same as the number of antenna modules 200; that is, each antenna module 200 is equipped with one millimeter-wave phased array chip 40. Each millimeter-wave phased array chip 40 can control at least one antenna element 210 in the antenna module 200 to facilitate signal transmission and reception.

[0109] In some embodiments, the millimeter-wave phased array chip 40 can be an unpackaged die or a packaged chip, and this application does not impose any restrictions on this. The millimeter-wave phased array chip 40 can be electrically connected to the antenna module 200 by flip-chip soldering or reflow soldering to reduce signal transmission loss.

[0110] In some embodiments, each antenna element 210 of the antenna module 200 can be grounded through the millimeter-wave phased array chip 40. For example, each antenna element 210 is electrically connected to the ground pin of the millimeter-wave phased array chip 40 through a ground via on the antenna module 200.

[0111] In some embodiments, the motherboard 30 can be electrically connected to the antenna module 200 via various transmission lines 50 suitable for millimeter-wave signal transmission. These transmission lines 50 can be, for example, flexible printed circuit board (FPCB) transmission lines or radio frequency (RF) coaxial cables.

[0112] In some embodiments, the electronic device 10 may also include structures such as decoupling capacitors, filters, and flexible circuit board interfaces.

[0113] In some embodiments, the electronic device 10 may also include other types of antenna modules suitable for millimeter waves. These millimeter wave antenna modules can be used in conjunction with the millimeter wave antenna modules 200 of various embodiments of this application to realize functions such as 5G calls. For example, the millimeter wave antenna module of the embodiments of this application can be attached to the inside of the metal frame, while other types of millimeter wave antenna modules can be attached to the metal back cover, without limitation.

[0114] The above describes specific embodiments of this application. It should be noted that those skilled in the art can make several improvements and modifications without departing from the principles of this application, and these improvements and modifications are also considered to be within the scope of protection of this application.

Claims

1. An electronic device, characterized in that, include: A metal casing and an antenna module, wherein the antenna module is located inside the metal casing; The metal casing has an antenna slot, which includes a first antenna slot and a second antenna slot that are arranged in a cross pattern. The antenna module includes an antenna unit, which includes a cavity layer and a radiating layer. The radiating layer is located between the cavity layer and the metal shell. The radiating layer is multi-layered and stacked, and each of the multi-layered radiating layers has a slot. The slots include a first slot and a second slot that are intersected. The multi-layered radiating layer includes a second radiating layer, a third radiating layer, and a fourth radiating layer. The second radiating layer has a first power divider, which is used to couple and feed power to the first antenna slot and the first slot. The fourth radiating layer has a second power divider for coupling and feeding the second antenna slot and the second gap. The third radiating layer is located between the second radiating layer and the fourth radiating layer and is used to improve the isolation between the feed terminals of the first power divider and the feed terminals of the second power divider. The first antenna slot and the first gap are arranged opposite each other and have different sizes, and the second antenna slot and the second gap are arranged opposite each other and have different sizes.

2. The electronic device as claimed in claim 1, characterized in that, In the multiple radiation layers, at least some of the gaps in the radiation layers have different sizes; or, the gaps in all of the multiple radiation layers have different sizes.

3. The electronic device as described in claim 2, characterized in that, The multilayer radiation layer includes at least a first radiation layer, a second radiation layer, a third radiation layer, a fourth radiation layer, and a fifth radiation layer stacked sequentially.

4. The electronic device as claimed in claim 3, characterized in that, The first radiating layer has a second protrusion at the end corresponding to the second slot, and the second protrusion protrudes toward the other end of the second slot to adjust the impedance matching based on the second slot and the second antenna slot.

5. The electronic device as described in claim 3 or 4, characterized in that, The first power divider includes a first feed terminal, a first feed branch, and a second feed branch; the first feed branch and the second feed branch are respectively connected to the first feed terminal; The first feed terminal is located on one side of the first gap in the second radiating layer; A portion of the first feed branch and a portion of the second feed branch are both perpendicular to the first gap in the second radiation layer and span the first gap in the second radiation layer.

6. The electronic device as claimed in claim 3, characterized in that, The second power divider includes a second feed terminal, a third feed branch, and a fourth feed branch; the third feed branch and the fourth feed branch are respectively connected to the second feed terminal; The second feed terminal is located on one side of the second slot of the fourth radiation layer; a portion of the third feed branch and a portion of the fourth feed branch are both perpendicular to the second slot of the fourth radiation layer and cross the second slot of the fourth radiation layer.

7. The electronic device as claimed in claim 3, characterized in that, The fifth radiating layer has a first protrusion at the end corresponding to the first slot, and the first protrusion protrudes toward the other end of the first slot to adjust the impedance matching based on the first slot and the first antenna slot.

8. The electronic device as claimed in claim 3, characterized in that, The back cavity layer is located on one side of the fifth radiation layer and away from the metal casing.

9. The electronic device as claimed in claim 1, characterized in that, The inner walls of the metal casing corresponding to the first antenna slot and the second antenna slot are stepped.

10. The electronic device as claimed in claim 9, characterized in that, Along the direction from the outer to the inner side of the metal casing, the long side of the stepped inner wall gradually decreases, while the short side gradually increases; or, Along the direction from the outer to the inner side of the metal casing, the long side of the stepped inner wall gradually increases, and the short side gradually decreases; or, Along the direction from the outer to the inner side of the metal casing, both the long and short sides of the stepped inner wall gradually increase; or, Along the direction from the outside to the inside of the metal casing, both the long and short sides of the stepped inner wall gradually decrease.

11. The electronic device as claimed in claim 1, characterized in that, The electronic device further includes: a dielectric material; the dielectric material is disposed within the first antenna slot and the second antenna slot of the metal casing.

12. The electronic device according to any one of claims 1 to 11, characterized in that, The electronic device also includes: a motherboard and a millimeter-wave phased array chip; The motherboard is electrically connected to the antenna module and the millimeter-wave phased array chip; the millimeter-wave phased array chip is located on the antenna module and away from the metal casing.

13. The electronic device as claimed in claim 12, characterized in that, The metal casing includes a metal frame, which includes a main body and a protrusion; the protrusion is located on one side of the main body and away from the millimeter-wave phased array chip; the protrusion is used to connect the front cover and the back cover of the electronic device.

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