A method for manufacturing a missile-borne dual-polarized dual-band integrated antenna assembly

Abstract

The application discloses a kind of adhesion manufacturing methods of missile-borne dual-polarized dual-band integrated antenna assembly, it is related to radar electronic antenna feeder subsystem manufacturing technical field, comprising the following steps: step one: process multiple recesses on a shell, and in multiple recesses are all point coating conductive glue;Step two: insert Ku / Ka frequency band elastic connector in multiple recesses, and the interconnection of shell and elastic connector is completed by curing process;Step three: lay integrated conductive glue film on integrated antenna microstrip board, and install positioning pin;Step four: integrated antenna microstrip board is installed on shell by positioning pin, assembled to glue joint tooling;The application realizes the multidimensional interconnection of dual-polarized antenna assembly at lower temperature by conductive glue and conductive glue film, with high integration and high reliability;And the missile-borne dual-polarized dual-band integrated antenna assembly can be used in Ku / Ka dual, since microstrip antenna ground is continuous, standing wave can be realized ≤1.5, and millimeter wave use range electrical performance is excellent.

Description

A method for adhesive bonding manufacturing of a missile-borne dual-polarization dual-band integrated antenna assembly Technical Field

[0001] This invention relates to the field of radar electronic antenna feed system manufacturing technology, specifically to an adhesive manufacturing method for a missile-borne dual-polarization dual-band integrated antenna assembly. Background Technology

[0002] To meet the evolving needs of military equipment, missile-borne antennas require higher standards in miniaturization, structural strength, bandwidth, beam coverage, and equivalent radiated power. With the development of missile-borne systems, their size and weight have become increasingly constrained, making the miniaturization of antennas, as a crucial component, a growing trend. Missile-borne phased array radar systems often employ a tile-stacking, vertically blind-connected interconnection mode. As the radar's front-end, the antenna assembly, limited by size and assembly processes, necessitates the development of highly integrated, dual-polarization, dual-band systems.

[0003] Previous research has solved the design and partial integrated manufacturing of dual-band transceiver antennas. Based on the fabrication of planar multilayer microstrip boards and the vertical interconnection process of flexible connectors, it has opened up scalable splicing manufacturing and integration process paths for one microstrip board to multiple housings and multiple microstrip boards to one housing. However, one-to-many or many-to-one splicing methods still suffer from low positioning accuracy and long process flow, especially as the antenna aperture increases, the flatness and consistency of the antenna array deteriorate significantly. When the total number of antenna elements expands to more than 960, the pass rate of the transceiver path drops by 30%. Since the microstrip board and antenna housing have undergone multiple heating processes, they are not reworkable, which significantly increases the antenna manufacturing cost and cycle time. Therefore, it is necessary to develop an adhesive bonding manufacturing method for integrated antenna components.

[0004] When using solder to assemble an integrated antenna housing and a set of microstrip boards, the presence of numerous densely distributed elastic inner conductors in the connectors makes it highly susceptible to short circuits caused by solder overflow and overall deformation of the housing, resulting in a deterioration of the antenna's vertical path signal. Due to the poor solderability of the housing's metal material, surface treatment is necessary to achieve good wetting and welding between the solder and the housing. However, the quality of local modification of densely stepped deep holes is difficult to control, easily leading to defects such as poor plating and local burrs, resulting in poor welding. The integrated microstrip boards have a large area and high warpage, making large-format connections difficult. In addition, the high requirements for pattern accuracy and interlayer alignment of large-size microstrip boards result in low yield.

[0005] In view of the above-mentioned defects, the inventors of this invention have finally obtained this invention after a long period of research and practice. Summary of the Invention

[0006] The purpose of this invention is to provide an adhesive manufacturing method for a missile-borne dual-polarized dual-band integrated antenna assembly, which solves a series of problems caused by low precision of large-size microstrip boards and housings, low yield, poor connection, and decreased electrical performance and reliability due to housing deformation during heating. This provides a further solution for the efficient and highly reliable integration of missile-borne miniaturized dual-band dual-polarized antenna assemblies.

[0007] The present invention solves the above-mentioned technical problems through the following technical solution, and the present invention includes the following steps:

[0008] Step 1: Machining multiple grooves on a shell, and applying conductive adhesive to each groove;

[0009] Step 2: Insert Ku / Ka band flexible connectors into multiple grooves, and complete the interconnection between the housing and the flexible connectors through a curing process;

[0010] Step 3: Lay an integrated conductive adhesive film on the integrated antenna microstrip board and install positioning pins;

[0011] Step 4: Install the integrated antenna microstrip board onto the housing using positioning pins and assemble it into the bonding fixture;

[0012] Step 5: The conductive adhesive film is cured by vacuum bag pressing, and the integrated antenna microstrip board is bonded to the housing. The inner conductor of the elastic connector is tightly attached to the integrated antenna microstrip board to form the antenna array. The antenna array is then installed on the adapter board.

[0013] Step 6: Perform vapor deposition protection on the antenna array surface.

[0014] Preferably, in step one, the material of the shell is one of aluminum-silicon gradient composite material, Kovar alloy, aluminum alloy, titanium alloy, and magnesium alloy.

[0015] Preferably, in step one, the conductive adhesive is a silver-based conductive adhesive or a gold-based conductive adhesive. The silver-based conductive adhesive is solvent-free, and after curing, it should meet the following requirements: mass loss ≤ 0.5% and volume resistivity ≤ 5*10⁻⁶. -4 Ω·cm, chip shear force ≥48N (2mm*2mm), glass transition temperature ≥90℃.

[0016] Preferably, in step two, the elastic connector is fixed to the housing using an adhesive bonding fixture. The adhesive bonding fixture is placed in a vacuum oven and cured according to the curing conditions of the conductive adhesive, which is 120-150℃ for 30-60 minutes. After the adhesive bonding is completed, the adhesive bonding fixture is removed, the solder resist is peeled off, and the housing is subjected to vapor phase cleaning.

[0017] Preferably, in step three, before laying the conductive adhesive film, the integrated antenna microstrip board needs to be pre-baked at a temperature of 110-130°C for 1.5-4.5 hours.

[0018] Preferably, in step three, the conductive adhesive film is cut using laser cutting, with its size being 0.1mm smaller than the size of the integrated antenna microstrip board, and the conductive adhesive film is cut out in the corresponding installation areas of the elastic connector and positioning pin.

[0019] Preferably, in step one, the housing is machined by CNC milling, and the groove size accuracy is ±0.02mm, and the flatness of the elastic connector mounting surface is ≤0.03mm.

[0020] Preferably, the specific content of step five is as follows: the assembled bonding fixture is placed into a vacuum bag, put into a vacuum autoclave, and cured. The curing temperature of the conductive adhesive film is lower than that of the conductive adhesive. The curing conditions are: pressure 0.1 MPa, temperature 120-130°C, curing time 1.5-3 hours. After the autoclaving is completed, the bonding fixture is removed.

[0021] Preferably, in step six, the vapor deposition material used for vapor deposition protection of the antenna array is Parylene C.

[0022] The present invention also proposes a dual-polarization dual-band integrated antenna assembly manufactured using the above-mentioned adhesive bonding method for the missile-borne dual-polarization dual-band integrated antenna assembly.

[0023] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0024] 1. This missile-borne dual-polarization dual-band integrated antenna assembly achieves multi-dimensional interconnection of the dual-polarization antenna assembly at a lower temperature through conductive adhesive and conductive film, exhibiting high integration and high reliability; moreover, this missile-borne dual-polarization dual-band integrated antenna assembly can be used in both Ku / Ka bands, and due to the continuity of the microstrip antenna ground, the standing wave ratio can be ≤1.5, demonstrating excellent electrical performance in the millimeter-wave range.

[0025] 2. This invention enables dual-polarized antenna transmission and reception with a unit spacing of less than 9.2mm×9.2mm. Compared with an antenna array spliced ​​from multiple antenna units, the flatness is improved by more than 0.3mm (root mean square), resulting in better consistency. Compared with previous spliced ​​antennas, the planar size can be reduced by 15%, meeting the higher technical requirements of miniaturization and high consistency for product models.

[0026] 3. The production efficiency of the process method of the present invention is higher. Because vacuum phase welding can only weld one piece at a time in order to maintain high temperature and high consistency in the furnace cavity, the conductive adhesive bonding process in the present invention can cure ten or even dozens of pieces at a time, depending on the volume of the oven and vacuum autoclave, which greatly improves the production efficiency.

[0027] 4. The integrated antenna assembly prepared in this invention has higher strength and consistency due to the integrated shell and integrated microstrip board. The curing temperature is lower than the welding temperature, which reduces the deformation of the connector PTFE dielectric sleeve. It can meet the environmental test requirements of 200 temperature cycles (-40℃ to +75℃) and 13.8g random vibration. It has good reliability and environmental adaptability and can meet the high service environment requirements of missiles. Attached Figure Description

[0028] Figure 1 is a schematic cross-sectional view of a comparative multi-Ka / Ku dual-polarized microstrip antenna assembly;

[0029] Figure 2 is a top view of the structure of a comparative multi-Ka / Ku dual-polarized microstrip antenna assembly;

[0030] Figure 3 is a cross-sectional structural diagram of the dual-polarized Ka / Ku integrated antenna assembly of Embodiment 1;

[0031] Figure 4 is a top view of the dual-polarized Ka / Ku integrated antenna assembly of Embodiment 1;

[0032] Figure 5 is a process flow diagram of the dual-polarized Ka / Ku integrated antenna assembly of Embodiment 1;

[0033] Figure 6 is a top view of the Ka / Ku dual-polarized microstrip antenna assembly in Embodiment 2. Detailed Implementation

[0034] The above-mentioned and other technical features and advantages of the present invention will be described in more detail below with reference to the accompanying drawings.

[0035] Comparative Example

[0036] This comparative example is a dual-polarized Ka / Ku one-to-many microstrip antenna assembly, as shown in Figure 1-2. This antenna assembly includes four sets of aluminum alloy antenna elements. Each Ka / Ku dual-polarized microstrip antenna element contains 24 sets of Ku-band flexible connectors 11 and 24 sets of Ka-band flexible connectors 10. The structure, from top to bottom, consists of one 96-element antenna microstrip board 1. The bottom of the antenna microstrip board 1 has contact pads 2 that contact the flexible connectors. The lower side of the antenna microstrip board 1 has a conductive adhesive film 3 with a first through-hole for the flexible connectors and positioning pins to pass through. The housing 4 is assembled with flexible connectors. The housing 4 includes a partially silver-plated groove 12, a Ku-band flexible connector 11, and a Ka-band flexible connector 10. The Ku-band flexible connector 11 and the Ka-band flexible connector 10 are both welded and fixed in the corresponding groove 12 by 62Sn36Pb2Ag solder 5. The flexible connector includes an outer conductor, a glass sintered body, a PTFE insulating dielectric sleeve 13, a flexible mechanism, and an inner conductor 14 (for clarity of illustration, the glass sintered body and the flexible mechanism inside the connector are internal structures and are not shown. The number of antenna assembly units and connectors is reduced).

[0037] The assembled comparative antenna assembly is formed by one antenna microstrip board and four sets of housings. The four sets of antenna assembly units are spliced ​​together to form an antenna array. The antenna array includes, from bottom to top, a KK adapter 7, a fixing screw 9, an adapter plate 6, and a second through hole 8 opened on the adapter plate 6. The fixing screw 9 installs and fixes the housing 4 on the adapter plate 6.

[0038] The comparative process flow is as follows: 62Sn36Pb2Ag solder paste is applied to the groove 12 of the partially silver-plated housing 4; Ka-band flexible connector 10 and Ku-band flexible connector 11 are installed into the housing 4 using a fixture, and the welding fixture is assembled; the interconnection between the flexible connectors and the housing is completed by vacuum phase welding at a welding temperature of 210℃; a conductive adhesive film 3, model J-468, is placed on the 96-element antenna microstrip board 1; the antenna microstrip board 1 is installed on the housing with the flexible connectors welded on using positioning pins, and assembled into the adhesive welding fixture; the conductive adhesive film 3 is cured by vacuum bag pressing at 130℃ for 1.5 hours; one set of antenna components is assembled on the adapter plate 6 to form an antenna array; the antenna array is protected by vapor deposition, and then assembled with the adapter plate 6 using fixing screws 9; after assembly, the tolerance between the antenna component units is ±0.045mm.

[0039] Example 1

[0040] This embodiment provides a technical solution: a method for adhesive bonding manufacturing of a missile-borne dual-polarization dual-band integrated antenna assembly, as shown in Figures 3-5, including the following steps:

[0041] Step 1: Machining multiple grooves 18 on a housing 15, and applying conductive adhesive 16 to each of the multiple grooves 18;

[0042] The groove 18 has a connector bottom ring, a filler ring, and a connector top ring;

[0043] The housing 15 is made of metal and its shape is machined by CNC milling. The dimensional accuracy of the groove 18 is ±0.02mm, and the flatness of the mounting surface of the elastic connector is ≤0.03mm.

[0044] The material of the shell 15 is one of aluminum-silicon gradient composite material, Kovar alloy, aluminum alloy, titanium alloy, and magnesium alloy, preferably aluminum-silicon gradient composite material, with a silicon content of 25% to 29%.

[0045] The conductive adhesive 16 used for dotting is either silver-based or gold-based, preferably silver-based with a metal filler weight percentage of 85% or higher. The silver-based conductive adhesive 16 is one of the following: Epo-tek's H20E, Henkel's 84-1A, Heilongjiang Petrochemical Research Institute's J-423, J-425, J-427, J-428, or Zhengzhou Silande's MF1343. The selected silver-based conductive adhesive 16 is solvent-free, and after curing, it should meet the following requirements: mass loss ≤ 0.5% and volume resistivity ≤ 5*10⁻⁶. -4 Ω·cm, chip shear force ≥48N (2mm*2mm), glass transition temperature ≥90℃;

[0046] Apply conductive adhesive 16 in one or more circles, but no more than three circles. The diameter of the adhesive line of conductive adhesive 16 should be 70-90% of the width of the filling ring. The shape of the adhesive line of conductive adhesive 16 after application should be smooth and should not have sharp points or tails to ensure the stability of the bonding elastic connector.

[0047] Step 2: Insert Ku / Ka band flexible connectors into multiple grooves 18, and complete the interconnection between the housing 15 and the flexible connectors through a curing process;

[0048] Ku / Ka band flexible connectors are multi-band flexible connectors; multi-band flexible connectors suitable for two frequency bands are transferred into the groove 18. Each flexible connector contains at least two inner conductors suitable for different frequency bands within each outer conductor. The number of inner conductors is a multiple of 2, such as twin connectors, quad connectors, octuplet connectors, etc.

[0049] The insulating dielectric material of the flexible connector is one or a combination of glass, PTFE, and PEEK. The inner conductor of the flexible connector protrudes from the PTFE dielectric sheath outside the outer conductor. Both the inner conductor and the bottom socket of the flexible connector are coated with peelable solder resist to prevent the conductive adhesive 16 from forming a short circuit between the outer conductor and the inner conductor. The peelable solder resist is one of Henkel's Spot-on, ITW's 2111 WonderMaskP, or ChemaskW8.

[0050] The curing process is as follows: install the adhesive bonding fixture, fix the elastic connector to the housing 15 position through the adhesive bonding fixture, after the elastic connector is installed, its bottom surface is flush with the bottom surface of the housing 15, and then tighten the adhesive bonding fixture.

[0051] Place the housing 15, which is held by the bonding fixture, into a vacuum oven and cure it according to the curing conditions of the conductive adhesive 16. The curing conditions are 120-150℃ for 30-60 minutes. After the bonding is completed, remove the bonding fixture, peel off the solder resist, and perform vapor phase cleaning on the housing 15.

[0052] Step 3: Lay an integrated conductive adhesive film 3 on the integrated antenna microstrip board 1 and install positioning pins;

[0053] The integrated antenna microstrip board 1 has the same external dimensions as the housing 15. Both the integrated antenna microstrip board 1 and the housing 15 have corresponding positioning holes. The positioning pin is installed into the positioning hole on the housing 15 by plugging in, and a part of the positioning pin protrudes to the outside.

[0054] Before laying the conductive adhesive film, pre-bake the integrated antenna microstrip board 1 at a temperature of 110-130℃ for 1.5-4.5 hours.

[0055] The conductive adhesive film 3 is cut into a shape that is roughly the same as the integrated antenna microstrip board 1 by laser cutting, with the size being 0.1mm smaller than the size of the integrated antenna microstrip board 1. The contact area of ​​the elastic connector and the mounting area of ​​the positioning pin are hollowed out to avoid interference with the installation of the elastic connector and the positioning pin. The conductive adhesive film 3 is one of Henkel's CF3350, Zhonglan Chenguang's CSJM8272, and Heilongjiang Petrochemical Research Institute's J-468.

[0056] Step 4: Install the integrated antenna microstrip board 1 onto the housing 15 using positioning pins, and assemble it into the bonding fixture;

[0057] The cut conductive adhesive film 3 is laid on the bonding surface of the integrated antenna microstrip board 1. The conductive adhesive film 3 is preheated by the hot table to make it without gaps between it and the integrated antenna microstrip board 1. The integrated antenna microstrip board 1 with conductive adhesive film 3 is assembled with the housing 15 of the bonding connector. The positioning pin is inserted into the positioning hole on the integrated antenna microstrip board 1 to realize the positioning and alignment of the integrated antenna microstrip board 1 and the housing 15.

[0058] The bonding tooling and additional fastening device ensure tight contact between the integrated antenna microstrip board 1 and the conductive adhesive film 3, the conductive adhesive film 3 and the housing 15, and the inner conductor of the flexible connector and the microstrip board, and then the locating pin is removed.

[0059] Step 5: The conductive adhesive film 3 is cured by vacuum bag pressing, the integrated antenna microstrip board 1 is bonded to the housing 15, the inner conductor of the elastic connector is tightly attached to the integrated antenna microstrip board 1 to form the antenna array, and the antenna array is installed on the adapter plate 6.

[0060] The assembled bonding fixture is placed into a vacuum bag and then into a vacuum autoclave for curing. The curing temperature of conductive adhesive film 3 is lower than that of conductive adhesive 16. The curing conditions are: pressure 0.1 MPa, temperature 120-130℃, curing time 1.5-3 hours. After the autoclaving is completed, the bonding fixture is removed.

[0061] Step Six: Perform vapor deposition protection on the antenna array surface;

[0062] The vapor deposition material used for vapor deposition protection of the antenna array is Parylene C. Subsequently, the elastic connector on the housing 15 is interconnected with the transceiver subsystem via the KK adapter 7.

[0063] Example 2

[0064] This embodiment is a further refinement of Embodiment 1, as shown in Figures 3-5. The dual-polarized dual-band integrated antenna assembly includes an integrated housing 15. The housing 15 is provided with 24 sets of quadruple Ku / Ka band flexible connectors 17. The conductive adhesive 16 used to bond the Ku / Ka band flexible connectors 17 is of type 84-1A. The structure from top to bottom consists of an integrated antenna microstrip board 1, a conductive adhesive film 3 with a first through hole, and a housing 15 with a groove 18. The integrated antenna microstrip board 1 and the housing 15 are interconnected through the conductive adhesive film 3.

[0065] In this embodiment, a set of antenna components is formed by splicing a set of microstrip boards to a set of housings 15 at a ratio of 1 set of microstrip boards. After assembly, an antenna array is formed. The antenna array is directly installed to the adapter plate 6 by screws 9. The adapter plate 6 has multiple second through holes 8. The multiple second through holes 8 correspond one-to-one with multiple Ku / Ka band flexible connectors 17 for plugging in KK adapters 7.

[0066] As shown in Figure 5, the specific manufacturing process of the shell 15 in this embodiment is as follows: an aluminum-silicon gradient composite material with a silicon content of 27% is selected, silver is locally plated in the contact area between the second through hole 8 and the elastic microstrip plate, and conductive adhesive 16 of model 84-1A is dotted in the groove 18, with 2 circles of conductive adhesive 16 applied.

[0067] Apply a peelable solder mask Spot-on to the inner conductor and bottom socket of the flexible connector. Install the Ka / Ku quadruple flexible connector into the housing 15 using a tooling. Assemble the bonding tooling. Place the assembled bonding tooling into a vacuum oven and cure at 150°C for 60 minutes. Then remove it from the oven, take off the bonding tooling, peel off the solder mask, and perform vapor phase cleaning on the housing 15.

[0068] A conductive adhesive film 3 of model J-468 is laid on the integrated antenna microstrip board 1; the integrated antenna microstrip board 1 is assembled with the housing 15 and assembled into a bonding fixture; the conductive adhesive film 3 is cured in a vacuum bag at 130°C for 1.5 hours to form the antenna array; the antenna array is protected by vapor deposition.

[0069] The dual-polarized dual-band integrated antenna assembly in this embodiment has a Ka-band element standing wave ratio (SWR) of ≤1.5 and a Ku-band element SWR of ≤1.5; a cross-sectional thickness of ≤9.2mm and a flatness of ≤0.2mm (root mean square); and a planar dimension that is more than 30% smaller than the standard size. It can meet the environmental test requirements of 200 temperature cycles (-40℃ to +75℃) and 13.88g random vibration, and has good reliability and environmental adaptability.

[0070] Example 3

[0071] This embodiment is a further refinement based on Embodiment 1. The process flow of this embodiment is the same as that of the comparative example. The structural difference is that the Ku / Ka band flexible connector 17 installed on the housing 15 is a Ku / Ka octet connector with a total of 12 sets, as shown in Figure 6.

[0072] The manufacturing process of the housing 15 is as follows: Kovar alloy is selected, and silver is locally plated in the contact area between the second through hole 8 and the integrated antenna microstrip board 1; conductive adhesive 16J-423 is dotted in the groove 18, and conductive adhesive 16 is coated in one ring.

[0073] Apply peelable solder resist ChemaskW8 to the inner conductor and bottom socket of the flexible connector. Use a tooling to install the Ka / Ku octet flexible connector into the groove 18 of the housing 15 and assemble the bonding tooling. Place the assembled tooling in a vacuum oven and cure at 130°C for 30 minutes. Remove the oven, take off the tooling, peel off the solder resist, and perform vapor phase cleaning on the housing 15.

[0074] Conductive adhesive film 3 (model J-468) is placed on the integrated antenna microstrip board 1; the integrated antenna microstrip board 1 is assembled with the integrated housing 15 and fitted into a bonding fixture; the conductive adhesive film 3 is cured for 2 hours under vacuum pressure at CSJM8272℃ to form the antenna array. The antenna array is protected by vapor deposition; after assembly, the tolerance between antenna component units is ±0.02mm.

[0075] The dual-polarized dual-band integrated antenna assembly of this embodiment has a Ka-band element standing wave ratio (SWR) of ≤1.5 and a Ku-band element SWR of ≤1.5; a cross-sectional thickness of ≤9.2mm and a flatness of ≤0.2mm (root mean square); and a planar dimension that is more than 40% smaller than the standard size. It can meet the environmental test requirements of 200 temperature cycles (-40℃ to +75℃) and 13.88g random vibration, and has good reliability and environmental adaptability.

[0076] The above description is merely a preferred embodiment of the present invention and is illustrative rather than restrictive. Those skilled in the art will understand that many changes, modifications, and even equivalents can be made within the spirit and scope defined by the claims of the present invention, all of which will fall within the protection scope of the present invention.

Claims

1. A method for adhesive bonding manufacturing of a missile-borne dual-polarization dual-band integrated antenna assembly, characterized in that: Includes the following steps: Step 1: Machining multiple grooves on a housing, and applying conductive adhesive to each groove; Step 2: Inserting Ku / Ka band flexible connectors into each groove, and completing the interconnection between the housing and the flexible connectors through a curing process; Step 3: Laying an integrated conductive adhesive film on the integrated antenna microstrip board and installing positioning pins; Step 4: Installing the integrated antenna microstrip board onto the housing using the positioning pins, assembling it into a bonding fixture; Step 5: Curing the conductive adhesive film through vacuum bag pressing, bonding the integrated antenna microstrip board to the housing, ensuring the inner conductor of the flexible connector is tightly fitted to the integrated antenna microstrip board to form the antenna array, and installing the antenna array onto the adapter board; Step 6: Performing vapor deposition protection on the antenna array; In Step 1, the conductive adhesive is a silver-based or gold-based conductive adhesive, wherein the silver-based conductive adhesive is solvent-free, and after curing, the mass loss should be ≤0.5%, and the volume resistivity should be ≤5*10. -4 Ω·cm, chip shear force ≥48N (2mm*2mm), glass transition temperature ≥90℃; In step two, the elastic connector and the shell are fixed using an adhesive bonding fixture. The adhesive bonding fixture is placed in a vacuum oven and cured according to the curing conditions of the conductive adhesive. The curing conditions are 120~150℃ for 30~60min. After the bonding is completed, the adhesive bonding fixture is removed, the solder resist is peeled off, and the shell is subjected to vapor phase cleaning; In step five, the assembled adhesive bonding fixture is placed in a vacuum bag and placed in a vacuum autoclave for curing. The curing temperature of the conductive adhesive film is lower than that of the conductive adhesive. The curing conditions are: pressure 0.1Mpa, temperature 120~130℃, curing time 1.5~3 hours. After the autoclaving is completed, the adhesive bonding fixture is removed.

2. The adhesive bonding manufacturing method for a missile-borne dual-polarization dual-band integrated antenna assembly according to claim 1, characterized in that, In step one, the shell material is one of aluminum-silicon gradient composite material, Kovar alloy, aluminum alloy, titanium alloy, and magnesium alloy.

3. The adhesive bonding manufacturing method for a missile-borne dual-polarization dual-band integrated antenna assembly according to claim 1, characterized in that, In step three, before laying the conductive adhesive film, the integrated antenna microstrip board needs to be pre-baked at a temperature of 110~130℃ for 1.5~4.5 hours.

4. The adhesive bonding manufacturing method for a missile-borne dual-polarization dual-band integrated antenna assembly according to claim 1, characterized in that, In step three, the conductive adhesive film is cut using laser cutting, with its size being 0.1mm smaller than the size of the integrated antenna microstrip board, and the conductive adhesive film is cut out in the corresponding installation areas of the elastic connector and positioning pin.

5. The adhesive bonding manufacturing method for a missile-borne dual-polarization dual-band integrated antenna assembly according to claim 1, characterized in that, In step one, the housing is machined by CNC milling, and the groove size accuracy is ±0.02mm, and the flatness of the elastic connector mounting surface is ≤0.03mm.

6. The adhesive bonding manufacturing method for a missile-borne dual-polarization dual-band integrated antenna assembly according to claim 1, characterized in that, In step six, the vapor deposition material used for vapor deposition protection of the antenna array is Parylene C.

7. A dual-polarization dual-band integrated antenna assembly manufactured using the adhesive bonding method described in any one of claims 1-6.

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