Signal device including substrate integrated waveguide
By placing antenna components in substrate integrated waveguides (SIWs) and forming direct connections using the ball grid array of signal generators, microwave losses and reflection problems caused by connections between SIWs and integrated circuit components are solved, and efficient signal transmission and maximum system performance is achieved.
Patent Information
- Application Number
- CN202111250004.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Priority Date
- 2016-03-15
- Filing Date
- 2017-03-15
- Publication Date
- 2025-05-27
- Estimated Expiration
- 2037-03-15
AI Technical Summary
In the prior art, there is microwave loss and reflection caused by interconnection transitions in the connection between the substrate integrated waveguide (SIW) and the integrated circuit components, limiting the bandwidth and performance of the system.
The interconnection transition between the signal generator and SIW is eliminated by placing the antenna members in the substrate and forming a direct welded ball connection with the metal layer of the substrate using the ball grid array of the signal generator.
The efficient connection between the signal generator and the SIW is achieved, which maximizes system performance while reducing complexity and cost.
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Figure CN113972469B_ABST
Abstract
Description
[0001] This application is a divisional application of an invention patent application with an international filing date of 2017-03-15, application number 201710153184.9 entering the Chinese national phase, and titled “Signal device including substrate integrated waveguide”. Background Art
[0002] Modern passenger cars are including more and more electronic devices. Advances in technology have made it possible to include a variety of systems on vehicles. For example, various sensor configurations have been developed to provide assistance or information to the driver regarding the environment around the vehicle. For example, various object detection and sensing technologies provide parking assistance and collision avoidance features.
[0003] Advances in radio frequency signal technology have enabled the development of complex system-on-chip integrated circuits. The functionality required for environmental sensing or communication can be embedded in an integrated circuit assembly. Example uses of such devices include automotive radar detection systems, robotic guidance systems, and Wi-Fi data transmission.
[0004] The antenna used for signal transmission can vary depending on the specific sensing or communication of interest. For example, low-gain broadband antennas are used for Wi-Fi communications, and larger high-gain antennas are often used for point-to-point data communications. Antennas used for automotive radar systems generally fall between these two extremes. One type of antenna that has been developed that can be used for in-vehicle systems is called a substrate integrated waveguide (SIW). These devices are useful in a vehicular environment because they generally have high efficiency and relatively low cost.
[0005] A challenge associated with using SIW for on-board sensing or communication systems is associated with the connection between the integrated circuit assembly and the SIW. For example, microstrip or coplanar waveguide microwave transmission lines can provide the interface between the integrated circuit assembly and the SIW. Such connections include disadvantages, such as the need to match microwave assemblies with unique field configurations for each transmission line. The transition associated with such microwave assemblies increases the loss of microwaves and introduces microwave reflections, which may limit bandwidth and affect the ability to produce such systems. When using microstrip, bandwidth may be limited by the ground connection requirements from the integrated circuit assembly connector through the SIW substrate to the metal layer on the substrate. Such connections are usually made using relatively expensive blind hole processes. Summary of the invention
[0006] An illustrative example electronic device includes a substrate integrated waveguide (SIW) including a substrate and a plurality of conductive members in the substrate. An antenna member is at least partially located in the substrate near at least some of the plurality of conductive members. A signal generator has a conductive output electrically coupled to the antenna member. The antenna member radiates a signal into the SIW based on operation of the signal generator.
[0007] An illustrative example method of manufacturing an electronic device includes placing an antenna member in a substrate. The substrate includes a plurality of conductive members. The substrate and the plurality of conductive members form a substrate integrated waveguide (SIW). The antenna member is adjacent to at least some of the conductive members. A signal generator is placed adjacent to a surface of the substrate adjacent to the antenna member. The signal generator has an output including at least one solder ball, the output being received adjacent to the substrate surface. A conductive connection is formed between the solder ball and the antenna member, and the antenna member radiates a signal into the SIW based on operation of the signal generator.
[0008] An illustrative example method of operating a transmitter comprising: a substrate integrated waveguide (SIW) having a substrate and a plurality of conductive members in the substrate; an antenna member at least partially located in the substrate near at least some of the plurality of conductive members; and a signal generator having a conductive output electrically coupled to the antenna member, comprising radiating a signal from the antenna member into the SIW. The radiated signal is based on operation of the signal generator. The signal is transmitted from the SIW.
[0009] The numerous features and advantages of at least one disclosed example embodiment will become apparent to those skilled in the art from the following detailed description.The drawings that accompany the detailed description can be briefly described as follows. BRIEF DESCRIPTION OF THE DRAWINGS
[0010] Figure 1 A vehicle is diagrammatically shown which includes a signaling device designed according to an embodiment of the invention.
[0011] Figure 2 A signaling device designed according to an embodiment of the present invention is shown in a diagrammatic manner.
[0012] Figure 3 It is along Figure 2 A cross-sectional view taken along line 3-3.
[0013] Figure 4 An example antenna assembly is diagrammatically shown.
[0014] Figure 5 Schematically shows Figure 2 and Figure 3 Selected portions of an example apparatus are shown.
[0015] Figure 6 It is along Figure 5 A cross-sectional view taken along line 6-6. DETAILED DESCRIPTION
[0016] Embodiments of the present invention provide a signal device having a unique connection between a signal generator output and a substrate integrated waveguide (SIW). Embodiments of the present invention eliminate interconnect transitions between the signal generator and the SIW, which maximizes system performance while minimizing complexity.
[0017] Figure 1 A vehicle 20 is shown including a plurality of signal devices schematically shown at 22. In some examples, the signal devices 22 are configured as radar signal devices used to detect objects near the vehicle 20 based on signals schematically shown at 24 transmitted by the devices 22. Example signal devices 22 may be used for parking assist, collision avoidance, and other object detection features on passenger vehicles.
[0018] Substrate 26 comprises known integrated circuit substrate materials. A variety of dielectric materials are suitable as substrate 26. Multiple conductive members 28 are located in substrate 26 to form SIW 30, which can be used as, for example, a microwave antenna. SIW 30 in this example has a direction of signal transmission represented by arrow 32. In one example, conductive member 28 comprises a metallized through hole in substrate 26. In another example, conductive member 28 comprises a metal-filled through hole in substrate 26.
[0019] A signal generator assembly 34 is supported on the substrate 26. In this example, the signal generator assembly 34 includes an integrated circuit that is configured in a known manner to generate a desired type of signal. In this example, the signal generator assembly 34 includes all the functionality required for a radio-based signal that can be used, for example, for sensing and communication. In an example embodiment, the signal generator assembly 34 is configured for radar detection signal transmission.
[0020] The signal generator assembly 34 in this example includes a ball grid array for making connections to, for example, a metal layer on the substrate 26 . Figure 3 Three of the solder balls of the ball grid array are shown at 36, 38, and 40. In this example, solder ball 38 provides a direct connection between signal generator assembly 34 and antenna member 44, which is at least partially located in substrate 26.
[0021] like Figure 4 As shown, the antenna member 44 in this example comprises a generally flat, generally circular plate of a conductive material such as metal. In some examples, the antenna member 44 comprises a copper disk printed on a metal layer supported on the substrate 26. In the example shown, a through hole 46 provides a connection to the antenna member 44. The dimensions of the through hole 46 and the antenna member 44 form the resonant frequency of the antenna member.
[0022] Reference Figure 5 and Figure 6 , solder pads 48 are supported on substrate 26, such as on a metal layer on one surface of substrate 26. During a reflow process used to mount signal generator assembly 34 on substrate 26, solder balls 38 connect to solder pads 48. Solder balls 38, solder pads 48, and vias 46 provide a direct connection between antenna member 44 and the operating circuitry of signal generator assembly 34. Such direct connection does not include or introduce microwave losses or microwave reflections, such as those typically associated with connections to microstrip.
[0023] The antenna member 44 radiates a signal into the SIW 30 based on the operation of the signal generator assembly 34. Figure 5 As best understood, the antenna member 44 is spaced from the conductive member 28 of the SIW 30. There is at least some substrate material between the antenna member 44 and the conductive member 28. The size of the antenna member 44 and its position relative to the conductive member 28 can be varied to meet different needs in different situations. For example, the desired transmission frequency and substrate material have an impact on the desired relationship between the antenna member 44 and the conductive member 28. Given this description, those skilled in the art will be able to select appropriate dimensions and materials to meet their specific needs.
[0024] One feature of the illustrated example is a backshort formed by a plurality of conductive members 28'. In the illustrated example, the three rightmost conductive members 28' (according to the drawing) form the backshort. Some of the conductive members 28 are located on a first side of the antenna member 44. The direction of signal transmission indicated at 32 is on the first side of the antenna member 44. RF signal energy radiated from the antenna member 44 toward the first side of the antenna member 44 travels in the direction of signal transmission 32. Some RF energy will be radiated from the antenna member 44 toward a different second side of the antenna member 44, which is in a direction opposite to the direction of signal transmission shown at 32. The conductive members 28' of the backshort reflect such RF energy and direct it into or toward the direction 32 of signal transmission. The size of the area on the substrate 26 for forming the backshort is determined based on the substrate material and the frequency of the signal transmitted by the device 22. The RF energy reflected by the backshort is preferably of the same order as the radiated energy from the antenna member 44 that has moved in the direction 32 of signal transmission. The arrangement of conductive members 28' on substrate 26 necessary to achieve a desired reflection of radiated energy from antenna members 44 for a particular implementation may be determined by one skilled in the art having the benefit of this description.
[0025] The illustrated example signal device 22 includes a ball grid array of signal generator components 34 and a direct connection of the SIW 30. With the illustrated embodiment, there is no need for loss-inducing transmission from the signal generator components to the planar waveguide and then from the planar waveguide to the SIW. It is thus known that the illustrated example signal device is more efficient and has potentially wider applications than previous signal device configurations.
[0026] In the example shown, the radiating structure of the antenna member 44 is achieved using standard planar printed circuit board technology, so no special processing is required. In addition, external components are not required. Compared to the previous configuration, the example shown provides a lower cost solution.
[0027] The above description is exemplary rather than limiting in nature. Variations and modifications to the disclosed examples may become apparent to those skilled in the art without departing from the essence of the invention. The scope of legal protection afforded to this invention can only be determined by the following claims.
Claims
1. A radar signaling device for detecting an object near a vehicle, the device include: a substrate comprising a metal layer on at least one side of said substrate; a substrate integrated waveguide (SIW) comprising a portion of the substrate and a plurality of conductive members in the substrate; an antenna member located at least partially in the substrate, within the SIW, and proximate at least some of the plurality of conductive members; a radar detection signal generator assembly located on the at least one side of the substrate, the radar detection signal generator assembly having a conductive output directly connected to the metal layer on the at least one side of the substrate; as well as a through hole, the through hole being directly connected to the metal layer and the antenna member, in: The radar detection signal generator assembly includes a ball array, and the ball array includes a plurality of welded balls. the conductive output comprises at least one solder ball of the plurality of solder balls, The antenna member radiates a radar detection signal into the SIW based on the operation of the signal generator, and The SIW transmits the radar detection signal from the SIW to the vicinity of the vehicle.
2. The device according to claim 1, It is characterized in that The metal layer includes pads on the at least one side of the substrate, and The via establishes a conductive connection between the pad and the antenna member.
3. The device as claimed in claim 2, It is characterized in that At least some of the material of the at least one solder ball of the plurality of solder balls is reflowed to connect the solder pad to the radar detection signal generator component.
4. The device according to claim 1, It is characterized in that Each of the plurality of conductive members of the SIW comprises a metallized via or a metal-filled via in the substrate, respectively; The SIW transmits the radar detection signal out of the SIW on a first side of the antenna element in a direction of signal output; The SIW comprises a plurality of rear short vias in the substrate on a second side of the antenna member; At least some of the second sides face in a direction opposite to the signal output direction; and The plurality of rear short vias reflect radiation from the antenna member in the signal output direction.
5. The device according to claim 1, It is characterized in that The material of the substrate separates the antenna member from the at least some of the plurality of conductive members of the SIW.
6. The device according to claim 1, It is characterized in that The plurality of conductive features in the substrate of the SIW leaves one side of the SIW open.
7. A radar signaling device for detecting an object in the vicinity of a vehicle, the device include: a substrate comprising a metal layer on at least one side of said substrate; a substrate integrated waveguide (SIW) comprising a portion of the substrate and a plurality of conductive members in the substrate; an antenna member located at least partially in the substrate, within the SIW, and proximate at least some of the plurality of conductive members; a radar detection signal generator assembly located on the at least one side of the substrate, the radar detection signal generator assembly having a conductive output directly connected to the metal layer on the at least one side of the substrate; as well as a through hole, the through hole being directly connected to the metal layer and the antenna member, in: The antenna member comprises a portion of a metal layer in the substrate, comprising a circular and flat disk, The antenna member radiates a radar detection signal into the SIW based on the operation of the signal generator, and The SIW transmits the radar detection signal from the SIW to the vicinity of the vehicle.
Citation Information
Patent Citations
Microwave millimeter-wave substrate integrated waveguide medium resonator antenna
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Planar coupler for waveguide and HF line - is oriented at right angles to waveguide end and has two conductive layers on either side of dielectric
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