Thermal bridges for electrical components

Abstract

A thermal bridge (200) includes an upper bridge assembly (202) and a lower bridge assembly (204), wherein the upper bridge assembly (202) and the lower bridge assembly (204) include an upper plate (230) and a lower plate (250) arranged in a stack. The side surfaces (234, 254) of the plates face each other to thermally couple the lower plate to the upper plate. The thermal bridge includes a resilient element (206) disposed between the upper bridge assembly and the lower bridge assembly. The thermal bridge includes an internal bridge frame (208) having a connecting element (220) extending internally through the upper plate (230) and the lower plate to retain the upper plate in the upper plate stack (232) and the lower plate in the lower plate stack (252).

Description

Technical Field

[0001] The subject matter herein generally relates to heat dissipation for electrical components. Background Art

[0002] It may be desirable to transfer thermal energy (or heat) away from specific components of a system or device. Some systems use electrical components, such as electrical connectors, to transfer data and / or power to and from different systems or devices. Some systems use electrical components, such as pluggable modules, to transmit data signals in the form of optical and / or electrical signals through communication cables. Some systems use electrical components, such as integrated circuits, to control systems. The electrical components define the sources of heat generation in the system.

[0003] A common challenge facing developers of electrical systems is thermal management. Heat generated by electrical components in a system can degrade performance or even damage system components. To dissipate this heat, the system includes thermal components, such as heat sinks, which engage a heat source, absorb heat from the source, and transfer it away. Heat sinks are typically thermally coupled to other thermal components at other thermal interfaces. Components lose efficiency at each thermal interface. Furthermore, achieving effective thermal coupling at these interfaces is difficult due to limited thermal interface area and variations in surface roughness, such as the surface flatness of the coupled surfaces.

[0004] Therefore, there is a need for heat transfer assemblies that effectively transfer thermal energy away from electrical components. Summary of the Invention

[0005] According to the present invention, a thermal bridge is provided. The thermal bridge includes an upper bridge assembly, the upper bridge assembly including a plurality of upper plates arranged in a stack of upper plates. Each upper plate has a front end and a rear end. Each upper plate has a side between the front end and the rear end. Each upper plate has an inner end and an outer end. The thermal bridge includes a lower bridge assembly, the lower bridge assembly including a plurality of lower plates arranged in a stack of lower plates. Each lower plate has a front end and a rear end. Each lower plate has a side between the front end and the rear end. Each lower plate has an inner end and an outer end. The outer ends of the lower plates are configured to face and thermally couple to electrical components. The side surfaces of the lower plates face the side surfaces of the upper plates to thermally couple the lower plates to the upper plates. The thermal bridge includes an elastic element positioned between the upper bridge assembly and the lower bridge assembly. The elastic element includes an upper elastic member that engages the upper plates to bias the upper plates in a first biasing direction substantially away from the lower plates. The spring element includes a lower spring member that engages the lower plate to bias the lower plate in a second biasing direction generally away from the upper plate. The thermal bridge includes an internal bridge frame having a connecting element that extends internally through the upper plate and the lower plate to retain the upper plate in the upper plate stack and to retain the lower plate in the lower plate stack. BRIEF DESCRIPTION OF THE DRAWINGS

[0006] Figure 1 is a front perspective view of a communication system and a thermal bridge according to an exemplary embodiment for dissipating heat from at least one electrical component of the communication system.

[0007] Figure 2 is an exploded view of a thermal bridge according to an exemplary embodiment.

[0008] Figure 3 is a cross-sectional view of a thermal bridge taken through one of the upper bridge plates and one of the lower spacer plates, showing the thermal bridge in an expanded state, according to an exemplary embodiment.

[0009] Figure 4 is a cross-sectional view of a thermal bridge taken through one of the upper bridge plates and a lower spacer plate, showing the thermal bridge in a compressed state, according to an exemplary embodiment.

[0010] Figure 5 is a cross-sectional view of a thermal bridge taken through one of the upper spacer plates and one of the lower bridge plates, showing the thermal bridge in an expanded state, according to an exemplary embodiment.

[0011] Figure 6 is a cross-sectional view of a thermal bridge taken through an upper spacer plate and a lower bridge plate, showing the thermal bridge in a compressed state, according to an exemplary embodiment.

[0012] Figure 7 is a perspective view of a thermal bridge according to an exemplary embodiment.

[0013] Figure 8 is an enlarged view of a portion of a thermal bridge according to an exemplary embodiment.

[0014] Figure 9 is a perspective view of a thermal bridge according to an exemplary embodiment.

[0015] Figure 10 is an exploded view of a thermal bridge according to an exemplary embodiment.

[0016] Figure 11 is a side view of a thermal bridge according to an exemplary embodiment.

[0017] Figure 12 is an enlarged side view of a thermal bridge according to an exemplary embodiment.

[0018] Figure 13 is a side view of a portion of a thermal bridge according to an exemplary embodiment.

[0019] Figure 14 is a side view of a portion of a thermal bridge according to an exemplary embodiment.

[0020] Figure 15is an exploded perspective view of a thermal bridge according to an exemplary embodiment.

[0021] Figure 16 is a side view of a thermal bridge according to an exemplary embodiment. DETAILED DESCRIPTION

[0022] Figure 1 1 is a front perspective view of a communication system 100 and a thermal bridge 200 according to an exemplary embodiment, which is used to dissipate heat from at least one electrical component 102 of the communication system 100. Thermal bridge 200 is configured to be thermally coupled to electrical component 102 at a lower thermal interface 104 at the bottom of thermal bridge 200. In the exemplary embodiment, a heat transfer device 106 is provided to dissipate heat from thermal bridge 200. For example, thermal bridge 200 is configured to be thermally coupled to thermal transfer device 106 at an upper thermal interface 108. Thermal bridge 200 forms a thermal interface between electrical component 102 and thermal transfer device 106. Thermal transfer device 106 may be a heat sink, such as a finned plate heat sink, configured to be air-cooled by transferring heat to a passing airflow. In various other embodiments, thermal transfer device 106 may be a heat sink, a cold plate with liquid cooling, or the like.

[0023] In the exemplary embodiment, the thermal bridge is compressible between electrical component 102 and thermal transfer device 106. In the exemplary embodiment, lower thermal interface 104 conforms to the shape of electrical component 102 and upper thermal interface 108 conforms to the shape of thermal transfer device 106 for efficient heat transfer therebetween.

[0024] In an exemplary embodiment, electrical component 102 is mounted to circuit board 110. In various embodiments, electrical component 102 may be a communication connector, such as a receptacle connector, a header connector, a plug connector, or other types of communication connectors. In other various embodiments, electrical component 102 may be an electronic package, such as an integrated circuit. In other various embodiments, electrical component 102 may be a pluggable module, such as an I / O transceiver module. In alternative embodiments, other types of electrical components may be provided.

[0025] In the exemplary embodiment, thermal bridge 200 includes an upper bridge assembly 202, a lower bridge assembly 204, a resilient element 206 between the upper and lower bridge assemblies 202, 204, and an internal bridge frame 208 for holding the upper and lower bridge assemblies 202, 204 together. Lower bridge assembly 204 is configured to thermally engage electrical component 102. Upper bridge assembly 202 is configured to dissipate heat to the external environment and / or to heat transfer device 106. Upper bridge assembly 202 is in thermal communication with lower bridge assembly 204 and dissipates heat from lower bridge assembly 204 to cool electrical component 102.

[0026] The elastic element 206 biases the upper and lower bridge assemblies 202, 204 apart. The upper and lower bridge assemblies 202, 204 are compressible relative to each other. For example, the upper and lower bridge assemblies 202, 204 are compressible between the electrical component 102 and the heat transfer device 106.

[0027] In an exemplary embodiment, an internal bridge frame 208 provides internal support for the upper and lower bridge assemblies 202, 204. The internal support eliminates the need for an external frame, providing more surface area for heat dissipation and / or for thermal coupling with the heat transfer device 106. In an exemplary embodiment, the elastic element 206 presses the upper bridge assembly 202 outward against the internal bridge frame 208 in a first biasing direction (e.g., upward), and the elastic element 206 presses the lower bridge assembly 204 outward against the internal bridge frame 208 in a second biasing direction (e.g., downward). The upper and lower bridge assemblies 202, 204 can be held by the internal bridge frame 208 in a manner that allows a limited amount of floating movement of the upper and lower bridge assemblies 202, 204 relative to the internal bridge frame 208.

[0028] Figure 2 2 is an exploded view of a thermal bridge 200 according to an exemplary embodiment. The thermal bridge 200 includes an upper bridge assembly 202 and a lower bridge assembly 204. A spring element 206 is positioned between the upper and lower bridge assemblies 202, 204. An internal bridge frame 208 is configured to hold the upper and lower bridge assemblies 202, 204.

[0029] In an exemplary embodiment, the thermal bridge 200 is a parallelepiped (e.g., roughly box-shaped). For example, the thermal bridge 200 includes a top 270, a bottom 272, a front 274, a rear 276, a first side 280, and a second side 282. The top 270 can be roughly planar. The bottom 272 can be roughly planar. The front 274 can be roughly planar. The rear 276 can be roughly planar. The first side 280 can be roughly planar. The second side 282 can be roughly planar. However, in alternative embodiments, the thermal bridge 200 can have other shapes. The frame structure for holding the thermal bridge 200 together is defined by an internal bridge frame and is configured to be generally housed within the interior of the thermal bridge 200. As such, each of the exterior surfaces of the thermal bridge 200 (e.g., the top 270, the bottom 272, the front 274, the back 276, the first side 280, and the second side 282) are exposed and accessible for heat dissipation and / or for coupling to other components, such as the electrical component 102 and / or the heat transfer device 106 (both in FIG. Figure 1). The internal bridge frame 208 allows for a large amount of usable exterior surface area for the thermal bridge 200. In the exemplary embodiment, the internal bridge frame 208 is exposed only on the first side 280 and the second side 282, preferably on a smaller footprint and away from the top 270 and bottom 272. In the exemplary embodiment, no portion of the internal bridge frame 208 extends along the front 274 and the rear 276. In the exemplary embodiment, no portion of the internal bridge frame 208 extends along the top 270 and the bottom 272.

[0030] In the exemplary embodiment, internal bridge frame 208 is remote from upper thermal interface 108 such that internal bridge frame 208 does not obstruct upper thermal interface 108 and provides a substantial amount of usable external surface area for coupling with heat transfer device 106. In the exemplary embodiment, internal bridge frame 208 is remote from lower thermal interface 104 such that internal bridge frame 208 does not obstruct lower thermal interface 104 and provides a substantial amount of usable external surface area for coupling with electrical component 102.

[0031] In an exemplary embodiment, each of the bridge assemblies 202, 204 includes a plurality of plates arranged together in a plate stack. The plates are interleaved with one another to provide thermal communication between the upper bridge assembly 202 and the lower bridge assembly 204. The individual plates can move relative to one another so that the plates can be individually articulated to conform to the electrical component 102 and / or the thermal transfer device 106. For example, an individual plate can conform to the electrical component 102 at the lower thermal interface 104 to improve contact and / or proximity between the thermal bridge 200 and the electrical component 102, and / or an individual plate can conform to the thermal transfer device 106 at the upper thermal interface 108 to improve contact and / or proximity between the thermal bridge 200 and the thermal transfer device 106. Gaps or spacing can be provided between the plates of the bridge assemblies 202, 204 to allow for compressive movement of the elastic element 206 between the bridge assemblies 202, 204.

[0032] In the exemplary embodiment, upper bridge assembly 202 includes a plurality of upper plates 230 arranged in an upper plate stack 232. Each upper plate 230 has a side 234 extending between an inner end 236 and an outer end 238 of the upper plate 230. The inner end 236 faces toward lower plate assembly 204. The outer end 238 faces outward, such as toward heat transfer device 106. Optionally, the various upper plates 230 may have different shapes between the inner end 236 and the outer end 238, such as different heights and / or different features.

[0033] In the exemplary embodiment, the upper plates 230 include an upper bridge plate 240 and an upper spacer plate 242. The upper spacer plate 242 is positioned between the upper bridge plates 240. Each upper bridge plate 240 includes a base 300 at an outer end 238 and overlap regions 312, 314 at an inner end 236, which are configured to overlap with an adjacent lower plate of the lower bridge assembly 204. In the illustrated embodiment, the upper bridge plates 240 are in an inverted U-shape; however, in alternative embodiments, the upper bridge plates 240 may have other shapes. In various embodiments, the upper bridge plates 240 include a first leg 302 extending downwardly from the base 300 and a second leg 304 extending downwardly from the base 300, and an upper receiving portion 306 positioned between the first leg 302 and the second leg 304. The upper receiving portion 306 is open at the inner end, for example, to receive a lower plate of the lower bridge assembly 204. The upper receiving portion 306 is defined by an edge 308 that extends along the base 300 and the legs 302, 304. The edge 308 at the top of the upper receiving portion 306 is configured to engage the elastic element 206 after assembly. For example, the elastic element 206 can be received in the upper receiving portion 306.

[0034] In the exemplary embodiment, first leg 302 defines an overlap region 312 at side 234 of upper bridge plate 240, and second leg 304 defines an overlap region 314 at side 234 of upper bridge plate 240. Overlap regions 312, 314 are configured to overlap an adjacent lower plate of lower bridge assembly 204. Overlap regions 312, 314 provide a larger surface area that is configured to be thermally coupled to the lower plate.

[0035] In the exemplary embodiment, the upper bridge plate 240 includes a slot 310 that receives the inner bridge frame 208. In the exemplary embodiment, the slot 310 is elongated, such as in a vertical direction, to allow vertical movement of the upper bridge plate 240 relative to the inner bridge frame 208.

[0036] Each upper spacer plate 242 includes a spacer base 350 at the outer end 238 and a spacer tab 352 extending from the spacer base 350. The spacer tab 352 extends to the inner end 236 of the upper spacer plate 242. The spacer tab 352 can be generally centered along the spacer base 350. The spacer base 350 includes a first arm 354 extending to a first side of the spacer tab 352 and a second arm 356 extending to a second side of the spacer tab 352. In the illustrated embodiment, the upper spacer plates 242 are T-shaped; however, in alternative embodiments, the upper spacer plates 242 can have other shapes.

[0037] In an exemplary embodiment, the spacer tab 352 is configured to align with a corresponding lower plate of the lower bridge assembly 204 , for example to be received in a receptacle of such a lower plate. Upon assembly, the bottom edge of the spacer tab 352 can engage the resilient element 206 .

[0038] In the exemplary embodiment, the upper spacer plate 242 includes a slot 360 that receives the inner bridge frame 208. In the exemplary embodiment, the slot 360 is elongated, such as in a vertical direction, to allow vertical movement of the upper spacer plate 242 relative to the inner bridge frame 208.

[0039] In the exemplary embodiment, the lower bridge assembly 204 includes a plurality of lower plates 250 arranged in a lower plate stack 252. Each lower plate 250 has a side 254 extending between an inner end 256 and an outer end 258 of the lower plate 250. The inner end 256 faces the upper plate assembly 202. The outer end 258 faces outward, for example, toward the electrical component 102 (in the embodiment of FIG. Figure 1 ). Optionally, the various lower plates 250 may have different shapes and / or heights between the inner end 256 and the outer end 258.

[0040] In the exemplary embodiment, the lower plates 250 include a lower bridge plate 260 and a lower spacer plate 262. The lower spacer plate 262 is positioned between the lower bridge plates 260. Each lower bridge plate 260 includes a base 400 at an outer end 258 and overlap regions 412, 414 at an inner end 256. The overlap regions 412, 414 are configured to overlap with an adjacent upper plate 230 of the upper bridge assembly 202. For example, the overlap regions 412, 414 overlap with the overlap regions 312, 314 of the upper bridge plate 240. In the illustrated embodiment, the lower bridge plates 260 are U-shaped; however, in alternative embodiments, the lower bridge plates 260 may have other shapes. In various embodiments, the lower bridge plates 260 include a first leg 402 extending upward from the base 400, a second leg 404 extending upward from the base 400, and a lower receiving portion 406 positioned between the first leg 402 and the second leg 404. The lower receiving portion 406 is open at the inner end 256, for example, to receive the corresponding spacer tab 352 of the upper spacer plate 242. The lower receiving portion 406 is defined by an edge 408 extending along the base 400 and the legs 402, 404. The edge 408 can guide the spacer tab 352 into the lower receiving portion 406. Alternatively, the edge 408 can be chamfered to guide the spacer tab 352 into the lower receiving portion 406. The edge 408 at the bottom of the lower receiving portion 406 is configured to engage the elastic element 206 after assembly. For example, the elastic element 206 can be received in the lower receiving portion 406.

[0041] In the exemplary embodiment, the first leg 402 defines an overlap region 412 at the side 254 of the lower bridge plate 260, and the second leg 404 defines an overlap region 414 at the side 254 of the lower bridge plate 260. The overlap regions 412, 414 are configured to overlap with the overlap regions 312, 314 of the adjacent upper bridge plate 240. The overlap regions 412, 414 provide a large surface area that is configured to be thermally coupled to the upper bridge plate 240. The overlap regions 412, 414 are configured to overlap with the overlap regions 312, 314 at an overlap distance that is sufficient to allow efficient heat transfer between the lower plate 250 and the upper plate 230. The sides of the plates can slide relative to each other to allow movement between the upper plate 230 and the lower plate 250 and to change the overlap distance.

[0042] In the exemplary embodiment, lower bridge plate 260 includes a slot 410 that receives inner bridge frame 208. In the exemplary embodiment, slot 410 is elongated, such as in a vertical direction, to allow vertical movement of lower bridge plate 260 relative to inner bridge frame 208.

[0043] Each lower spacer plate 262 includes a spacer base 450 at an outer end 258 and a spacer tab 452 extending from the spacer base 450. The spacer tab 452 extends to the inner end 256 of the lower spacer plate 262. The spacer tab 452 can be approximately centered along the spacer base 450. The spacer base 450 includes a first arm 454 extending to a first side of the spacer tab 452 and a second arm 456 extending to a second side of the spacer tab 452. In the illustrated embodiment, the lower spacer plates 262 are in an inverted T-shape; however, in alternative embodiments, the lower spacer plates 262 can have other shapes. In the exemplary embodiment, the spacer tab 452 is configured to align with the upper receptacle 306 of the corresponding upper bridge plate 240, for example, to be received within the upper receptacle 306. The spacer tab 452 can be guided into the upper receptacle 306 by the edge 308. The edge 308 can be chamfered to guide the spacer tab 452 into the upper receptacle 306. After assembly, the top edge of the spacer tab 452 can engage the resilient element 206.

[0044] In the exemplary embodiment, the lower spacer plate 262 includes a slot 460 that receives the inner bridge frame 208. In the exemplary embodiment, the slot 460 is elongated, such as in a vertical direction, to allow vertical movement of the lower spacer plate 262 relative to the inner bridge frame 208.

[0045] In an exemplary embodiment, the elastic element 206 is separate and discrete from the upper and lower bridge assemblies 202 and 204. The elastic element 206 may be a stamped and formed component. The elastic element 206 is made of a thin metal material, making it flexible. In an exemplary embodiment, the elastic element 206 includes a plurality of elastic plates 210, which are arranged in a stack of elastic plates located between the upper and lower bridge assemblies 202 and 204. In the illustrative embodiment, the elastic plates 210 are stacked vertically to provide a spring force in the vertical direction. In alternative embodiments, other types of elastic elements 206 may be used, such as coil springs, leaf springs, C-shaped channel springs, etc. Alternatively, the elastic element 206 may be segmented to include a plurality of elastic tabs separated by gaps, which can move independently of each other to provide independent elastic pressure.

[0046] The elastic element 206 is configured to be received in the upper and lower receptacles 306 and 406. The elastic element 206 is positioned between the upper plate 230 and the lower plate 250. For example, the elastic element 206 is positioned between the spacer tab 352 and the edge 408 at the bottom of the lower receptacle 406, and the elastic element 206 is positioned between the spacer tab 452 and the edge 308 at the top of the upper receptacle 306. The elastic plates 210 are compressible between the upper plate 230 and the lower plate 250. In the illustrated embodiment, the elastic plates 210 are cup-type leaf springs arranged back-to-back to form the elastic element 206. The elastic plates 210 are arranged in an alternating upward-facing and downward-facing pattern. The elastic plates 210 converge at the outer edges or at the center of the stack of elastic plates. Any number of elastic plates 210 may be provided, depending on the amount of elastic force required, the distance between the upper plate 230 and the lower plate 250, and the size of the elastic plates 210. In alternative embodiments, other types of elastic elements may be provided.

[0047] The elastic element 206 extends between a first side 212 and a second side 214. The elastic element 206 includes tabs 216, 218 on the first and second sides 212, 214, respectively. The tabs 216, 218 can be used to position the elastic element 206 relative to the internal bridge frame 208. The tabs 216, 218 can engage the internal bridge frame 208 to position the elastic element 206 internally within the thermal bridge 200. The tabs 216, 218 can be located at the outer ends of the elastic element 206. The tabs 216, 218 can alternatively (or additionally) be approximately centered between the edges rather than approximately centered between the outer ends.

[0048] In the exemplary embodiment, the internal bridge frame 208 includes connecting elements 220 extending internally through the upper bridge assembly 202 and the lower bridge assembly 204. The connecting elements 220 are configured to capture the upper plate 230 within the upper plate stack 232 and the lower plate 250 within the lower plate stack 252. The connecting elements 220 can be coupled to the opposing side plates 222 or 224. For example, the connecting elements can be latched or welded to the opposing side plates 222, 224. In the exemplary embodiment, the connecting elements 220 include one or more upper connecting elements and one or more lower connecting elements. The upper connecting elements 220 are received in the upper slots 310, 360 of the upper bridge plate 240 and the upper spacer plate 242, respectively. The lower connecting elements 220 are received in the lower slots 410, 460 of the lower bridge plate 260 and the lower spacer plate 262, respectively.

[0049] In an exemplary embodiment, the internal bridge frame 208 includes a first side plate 222 on a first side of the upper bridge assembly 202 and a first side of the lower bridge assembly 204, and a second side plate 224 on a second side of the upper bridge assembly 202 and a second side of the lower bridge assembly 204. A connecting element 220 extends between the first side plate 222 and the second side plate 224. In various embodiments, the connecting element 220 can be integrally formed with the first side plate 222 and / or the second side plate 224. For example, the side plates 222, 224 and the connecting element 220 can be stamped from sheet metal. In alternative embodiments, the connecting element 220 can be separate from the side plates 222, 224 and secured to the side plates 222, 224, for example, by brazing, crimping, latching, clamping, using fasteners, or otherwise securing the connecting element 220 to the side plates 222, 224. In other alternative embodiments, the connecting element 220 can be secured to the thermal bridge 200 without the side plates 222, 224. For example, the connecting elements 220 may be secured directly to the plates of the upper bridge assembly 202 and / or the lower bridge assembly 204 .

[0050] In the exemplary embodiment, the connecting element 220 is a flat, planar spar configured to pass through the upper and lower panels 230, 250. For example, the connecting element 220 can be stamped from sheet metal. The connecting element 220 can be generally rectangular in cross-section. However, in alternative embodiments, other types of connecting elements can be used. For example, the connecting element 220 can be a round or square pin, which can be manufactured through an extrusion process. In alternative embodiments, other types of connecting elements 220 can be used.

[0051] In an exemplary embodiment, the first and second side plates 222 and 224 include slots 226 and 228, respectively. The slots 226 and 228 receive the tabs 216 and 218 of the elastic element 206. For example, the tabs 216 and 218 may protrude from the plate stack into the slots 226 and 228. The slots 226 and 228 may be located near the sides. Alternatively, the slots 226 and 228 may additionally or alternatively be located in the center of the corresponding plate 222 and 224. Optionally, the slots 226 and 228 may be oversized relative to the tabs 216 and 218 to allow a limited amount of floating movement of the tabs 216 and 218 within the slots 226 and 228. For example, the slots 226 and 228 may accommodate compression and expansion of the elastic element 206. The slots 226 and 228 may accommodate vertical movement within the slots 226 and 228, as well as horizontal movement within the slots 226 and 228. Providing oversized slots 226, 228 resists binding of the elastic element 206 when the elastic element 206 expands or contracts.

[0052] In the exemplary embodiment, thermal bridge 200 includes a first cover plate 290 and a second cover plate 292. First cover plate 290 is disposed on first side 280, and second cover plate 292 is disposed on second side 282. Upper plate stack 232 and lower plate stack 252 are held between cover plates 290, 292. In the exemplary embodiment, each cover plate 290, 292 includes an opening 294 for receiving elastic element 206. Opening 294 aligns with upper and lower receiving portions 306, 406. In the exemplary embodiment, each cover plate 290, 292 includes a slot 296 for receiving connecting element 220. Slot 296 aligns with slots 310, 410. First and second side plates 222, 224 are configured to couple to first and second cover plates 290, 292. In alternative embodiments, thermal bridge 200 may be provided without side plates 222, 224 and / or without cover plates 290, 292. For example, the connecting elements 220 may be coupled directly to the cover plates 290, 292 rather than the side plates 222, 224. In alternative embodiments, the thermal bridge 220 may be provided without the cover plates 290, 292, but using the side plates 222, 224 to hold the plate stack.

[0053] Figure 3 is a cross-sectional view of thermal bridge 200 taken through one of upper bridge plates 240 and one of lower spacer plates 262 , illustrating thermal bridge 200 in an expanded state, according to an exemplary embodiment. Figure 4 is a cross-sectional view of thermal bridge 200 taken through one of upper bridge plates 240 and lower spacer plate 262 , showing thermal bridge 200 in a compressed state, according to an exemplary embodiment.

[0054] After assembly, the lower spacer plate 262 is aligned with the upper bridge plate 240. The spacer tabs 452 are aligned with the upper receiving portion 306. As the thermal bridge 200 is compressed and expanded, the spacer tabs 452 are movable within the upper receiving portion 306. The edges 308 of the upper receiving portion 306 guide the spacer tabs 452 within the upper receiving portion 306.

[0055] The spring element 206 is received in an upper receiving portion 306 between the upper plate 230 and the lower plate 250. The spring element 206 compresses the upper plate 230 in an upward biasing direction and compresses the lower plate 250 in a downward biasing direction. The spring element 206 tends to separate the upper plate 230 from the lower plate 250, thereby pressing the base 300 of the upper bridge plate 240 into thermal engagement with the heat transfer device 106 and the base 450 of the lower spacer plate 262 into thermal engagement with the electrical component 102. The upper bridge plate 240 and the lower spacer plate 262 are independently movable relative to each other and relative to the adjacent upper plate 230 and lower plate 250. The upper plate 230 is configured to float relative to the lower plate 250, and the spring element 206 allows for the floating movement of the upper plate 230 and the lower plate 250. As such, the upper mating interface conforms to thermal transfer device 106 , and the lower mating interface conforms to electrical component 102 .

[0056] The internal bridge frame 208 passes through the upper bridge plate 240 and the lower spacer plate 262. For example, the connecting element 220 passes through the slot 310 and the slot 460. In the expanded state, the connecting element 220 is located at or near the inner edge of the slots 310, 460. In the compressed state, the connecting element 220 is located at or near the outer edge of the slots 310, 460.

[0057] Figure 5 is a cross-sectional view of thermal bridge 200 taken through one of upper spacer plates 242 and one of lower bridge plates 260 , illustrating thermal bridge 200 in an expanded state, according to an exemplary embodiment. Figure 6 is a cross-sectional view of thermal bridge 200 taken through upper spacer plate 242 and lower bridge plate 260 , illustrating thermal bridge 200 in a compressed state, according to an exemplary embodiment.

[0058] After assembly, the upper spacer plate 242 is aligned with the lower bridge plate 260. The spacer tab 352 is aligned with the lower receiver 406. As the thermal bridge 200 is compressed and expanded, the spacer tab 352 is movable within the lower receiver 406. The edge 408 of the lower receiver 406 guides the spacer tab 352 within the lower receiver 406.

[0059] The spring element 206 is received in the lower receiving portion 406 between the upper plate 230 and the lower plate 250. The spring element 206 presses the upper plate 230 in an upward biasing direction and presses the lower plate 250 in a downward biasing direction. The spring element 206 tends to separate the upper plate 230 from the lower plate 250, thereby pressing the base 350 of the upper spacer plate 242 into thermal engagement with the heat transfer device 106 and the base 400 of the lower bridge plate 260 into thermal engagement with the electrical component 102. The upper spacer plate 242 and the lower bridge plate 260 are independently movable relative to each other and relative to the adjacent upper plate 230 and lower plate 250.

[0060] The internal bridge frame 208 passes through the upper spacer plate 242 and the lower bridge plate 260. For example, the connecting element 220 passes through the slot 360 and the slot 410. In the expanded state, the connecting element 220 is located at or near the inner edge of the slots 360, 410. In the compressed state, the connecting element 220 is located at or near the outer edge of the slots 360, 410.

[0061] Figure 7 is a perspective view of a thermal bridge 500 according to an exemplary embodiment. Figure 8 is an enlarged view of a portion of a thermal bridge 500 according to an exemplary embodiment. The size and shape of the thermal bridge 500 are designed to Figure 1 and Figure 2 Thermal bridge 500 is different from the thermal bridge shown in FIG. Thermal bridge 500 includes similar features as thermal bridge 200. Thermal bridge 500 is shaped differently from thermal bridge 200, being shorter and longer, as opposed to being generally cubical. Other shapes are possible in alternative embodiments of thermal bridge 500 or thermal bridge 200.

[0062] Thermal bridge 500 includes an upper bridge assembly 502, which includes a plurality of upper plates 530, and a lower bridge assembly 504, which includes a plurality of lower plates 550. A resilient element 506 is disposed between upper bridge assembly 502 and lower bridge assembly 504. Thermal bridge 500 includes an internal bridge frame 508 that extends through the interior of thermal bridge 500 to hold the upper and lower plate stacks together. Thermal bridge 500 includes cover plates 590, 592 on first and second sides of thermal bridge 500 to hold the upper and lower plate stacks together. Internal bridge frame 508 is coupled to cover plates 590, 592.

[0063] In an exemplary embodiment, the internal bridge frame 508 includes connecting elements 520 that pass through slots in the upper plate 530 and the lower plate 550. Optionally, each upper plate 530 may include multiple slots that receive corresponding connecting elements 520, and each lower plate 550 may include multiple slots that receive corresponding connecting elements 520. In various embodiments, the connecting elements 520 may have various shapes and may be connected to the cover plate by various methods. For example, the connecting elements 520 may include a head 524 ( Figure 7 ) and end 526( Figure 8 ) between the pins 522. The ends 526 can be deformed, for example by pressing, stamping or riveting the ends of the pins 522. In the illustrated embodiment, three sets of connecting elements 520 are provided, for example at the front, rear and middle of the thermal bridge 500.

[0064] In an exemplary embodiment, the elastic element 506 is approximately centered between the front and rear portions of the thermal bridge 500. A tab 516 extends from the end of the elastic element 506. The tab 516 is received in an opening 518 in the cover plates 590, 592. The tab 516 can be used to position the elastic element 506 relative to the upper and lower plates 530, 550. The tabs 516, 518 can be located at the outer ends of the elastic element 506. The tabs 516, 518 can alternatively (or additionally) be approximately centered between the edges rather than between the outer ends. Alternatively, the elastic element 506 can be segmented to include a plurality of elastic tabs separated by gaps, which can move independently of each other to provide independent elastic pressure.

[0065] Figure 9 is a perspective view of a thermal bridge 600 according to an exemplary embodiment. Figure 10 is an exploded view of thermal bridge 600 according to an exemplary embodiment. Figure 11 is a side view of thermal bridge 600 according to an exemplary embodiment. Figure 12 is an enlarged side view of thermal bridge 600 according to an exemplary embodiment.

[0066] The size and shape of the Thermal Bridge 600 are designed to be different from Figure 1 and Figure 2 The thermal bridge 200 shown in FIG. Figure 7 Thermal bridge 500 is shown in FIG. Thermal bridge 600 includes similar features to thermal bridges 200 , 500 .

[0067] Thermal bridge 600 includes an upper bridge assembly 602, which includes a plurality of upper plates 630, and a lower bridge assembly 604, which includes a plurality of lower plates 650. One or more elastic elements 606 are positioned between upper bridge assembly 602 and lower bridge assembly 604. Thermal bridge 600 includes an internal bridge frame 608 that extends through the interior of thermal bridge 600 to hold the upper and lower plate stacks together. Thermal bridge 600 includes cover plates 690, 692 on first and second sides of thermal bridge 600 to hold the upper and lower plate stacks together. Internal bridge frame 608 is coupled to cover plates 690, 692.

[0068] In the exemplary embodiment, the internal bridge frame 608 includes connection elements 620 that pass through slots in the upper plate 630 and the lower plate 650. Optionally, each upper plate 630 may include multiple slots that receive corresponding connection elements 620, and each lower plate 650 may include multiple slots that receive corresponding connection elements 620. In various embodiments, the connection elements 620 include pins 622. In the illustrative embodiment, three sets of connection elements 620 are provided, for example, at the front, rear, and center of the thermal bridge 600.

[0069] In the exemplary embodiment, thermal bridge 600 includes a plurality of spring elements 606. For example, in the illustrative embodiment, thermal bridge 600 includes a front spring element 606 near the front of thermal bridge 600 and a rear spring element 606 near the rear of thermal bridge 600. The spring elements 606 can be identical to each other.

[0070] Figure 13 is a side view of a portion of thermal bridge 600 according to an exemplary embodiment. Figure 14 is a side view of a portion of thermal bridge 600 according to an exemplary embodiment.

[0071] Each upper plate 630 has a side 634 extending between an inner end 636 and an outer end 638 of the upper plate 630. The inner end 636 faces the lower plate assembly 604. The outer end 638 faces outward, for example, to couple with the heat transfer device 106 (at Figure 1 In an exemplary embodiment, the upper plate 630 includes an upper bridge plate 640 ( Figure 13 ) and upper spacer plate 642 ( Figure 14 ). Upper spacer plates 642 are located between upper bridge plates 640. Upper spacer plates 642 are shorter than upper bridge plates 640. Upper bridge plates 640 include overlap regions 644 configured to overlap adjacent lower plates 650 for heat transfer between lower plates 650 and upper plates 630.

[0072] Each lower plate 650 has a side 654 extending between an inner end 656 and an outer end 658 of the lower plate 650. The inner end 656 faces the upper plate assembly 602. The outer end 658 faces outward, for example, to couple with the electrical component 102 (in the embodiment of FIG. Figure 1 In an exemplary embodiment, the lower plate 650 includes a lower bridge plate 660 ( Figure 14 ) and lower spacer plate 662 ( Figure 13 ). A lower spacer plate 662 is located between the lower bridge plates 660. The lower spacer plate 662 is shorter than the lower bridge plates 660. The lower bridge plates 660 include an overlap region 664 configured to overlap with an adjacent upper plate 630 for heat transfer between the lower plate 650 and the upper plate 630.

[0073] After assembly, the upper bridge plate 640 is aligned with the lower spacer plate 662, and the lower bridge plate 660 is aligned with the upper spacer plate 642. A gap may be provided between the upper plate 630 and the lower plate 650 to allow for compression or movement of the upper plate 630 relative to the lower plate 650. As the thermal bridge 600 is compressed, the amount of overlap between the overlap regions 644, 664 increases.

[0074] The frame structure for holding the thermal bridge 600 together is defined by the internal bridge frame 608 and is configured to be generally housed within the interior of the thermal bridge 600. As such, each of the exterior surfaces (e.g., top, bottom, front, back, first side, and second side) of the thermal bridge 600 is exposed and accessible for heat dissipation and / or for coupling to other components, such as the electrical components 102 and / or the heat transfer device 106 (both within the thermal bridge 600). Figure 1 The internal bridge frame 608 allows the thermal bridge 600 to have a large amount of usable exterior surface area.

[0075] Figure 15 is an exploded perspective view of thermal bridge 700 according to an exemplary embodiment. Figure 16 is a side view of a thermal bridge 700 according to an exemplary embodiment.The thermal bridge 700 is similar to the thermal bridges 200, 500, 600 and includes similar features as the thermal bridges 200, 500, 600.

[0076] Thermal bridge 700 includes an upper bridge assembly 702, which includes a plurality of upper plates 730, and a lower bridge assembly 704, which includes a plurality of lower plates 750. A resilient element 706 is disposed between upper bridge assembly 702 and lower bridge assembly 704. Thermal bridge 700 includes an internal bridge frame 708 that extends through the interior of thermal bridge 700 to hold the upper and lower plate stacks together. Thermal bridge 700 includes cover plates 790, 792 on first and second sides of thermal bridge 700 to hold the upper and lower plate stacks together. Internal bridge frame 708 is coupled to cover plates 790, 792.

[0077] In the exemplary embodiment, the internal bridge frame 708 includes connecting elements 720 that pass through slots in the upper plate 730 and the lower plate 750. Optionally, each upper plate 730 may include multiple slots that receive corresponding connecting elements 720, and each lower plate 750 may include multiple slots that receive corresponding connecting elements 720. In various embodiments, the connecting elements 720 include pins 722. In the illustrative embodiment, three sets of connecting elements 720 are provided, for example, at the front, rear, and center of the thermal bridge 700.

[0078] In an exemplary embodiment, thermal bridge 700 includes a plurality of elastic elements 706. For example, in the illustrative embodiment, thermal bridge 700 includes four elastic elements 706 that are positioned approximately equidistantly along the length of thermal bridge 700. The elastic elements 706 can be identical to one another.

[0079] In the illustrative embodiment, the elastic element 706 is a C-shaped leaf spring. In alternative embodiments, other types of elastic elements may be used. Each elastic element 706 includes an upper elastic member 710 and a lower elastic member 712. A connecting section 714 extends between the upper and lower elastic members 710, 712. The connecting section 714 can be curved, for example, C-shaped. The connecting section 714 is flexible and configured to extend the upper and lower elastic members 710, 712 when the connecting section is fixed or compressed. The upper elastic member 710 is configured to engage the upper plate 730 and is configured to resiliently bias the upper plate 730 in a first biasing direction (e.g., generally upward) that is substantially away from the lower plate 750. The lower elastic member 712 is configured to engage the lower plate 750 and is configured to resiliently bias the lower plate 750 in a second biasing direction (e.g., generally downward) that is substantially away from the upper plate 730. Upper plate 730 is configured to float relative to lower plate 750, and spring elements 706 allow for floating movement of upper and lower plates 730, 750. As such, the upper mating interface conforms to thermal transfer device 106, and the lower mating interface conforms to electrical component 102.

[0080] In an exemplary embodiment, the upper elastic member 710 is segmented to include a plurality of upper elastic tabs separated by upper gaps. The upper elastic tabs are configured to engage corresponding upper plates 730. The upper elastic tabs can move independently of each other, for example, to provide independent elastic pressure to corresponding upper plates 730. Alternatively, the upper elastic tabs can flare outwardly away from the lower elastic member 712, for example, at a certain angle.

[0081] In an exemplary embodiment, the lower elastic member 712 is segmented to include a plurality of lower elastic tabs separated by lower gaps. The lower elastic tabs are configured to engage corresponding lower plates 750. The lower elastic tabs can move independently of each other, for example, to provide independent elastic pressure to corresponding lower plates 750. Alternatively, the lower elastic tabs can flare outwardly away from the upper elastic member 710, for example, at a certain angle.

Claims

1. A thermal bridge (200), comprising: an upper bridge assembly (202) comprising a plurality of upper plates (230) arranged in an upper plate stack (232), each upper plate having a front end and a rear end, each upper plate having a side (234) between the front end and the rear end, each upper plate having an inner end (236) and an outer end (238); a lower bridge assembly (204) comprising a plurality of lower plates (250) arranged in a lower plate stack (252), each lower plate having a front end and a rear end, each lower plate having a side (254) between the front end and the rear end, each lower plate having an inner end (256) and an outer end (258), the outer ends of the lower plates being configured to face and thermally couple to electrical components, the side faces of the upper plate to thermally couple the lower plates to the upper plate; a resilient element (206) disposed between the upper bridge assembly and the lower bridge assembly, the resilient element comprising an upper resilient member (710) engaging the upper plate to bias the upper plate in a first biasing direction away from the lower plate, the resilient element comprising a lower resilient member (712) engaging the lower plate to bias the lower plate in a second biasing direction away from the upper plate; as well as An internal bridge frame (208) having connecting elements (220) extending internally through the upper plate and the lower plate to retain the upper plate in the upper plate stack and to retain the lower plate in the lower plate stack.

2. The thermal bridge (200) according to claim 1, wherein The internal bridge frame (208) is exposed only on the first side (280) and the second side (282) of the upper bridge assembly (202) and the first side (280) and the second side (282) of the lower bridge assembly (204), wherein no portion of the internal bridge frame extends along the front (274) of the upper bridge assembly or the front (274) of the lower bridge assembly, no portion of the internal bridge frame extends along the rear (276) of the upper bridge assembly or the rear (276) of the lower bridge assembly, no portion of the internal bridge frame extends along the top (270) of the upper bridge assembly, and no portion of the internal bridge frame extends along the bottom (272) of the lower bridge assembly.

3. The thermal bridge (200) according to claim 1, wherein The connecting element (220) is distal to a top (270) of the upper bridge assembly (202).

4. The thermal bridge (200) according to claim 1, wherein The upper bridge assembly (202) includes an upper thermal interface (108) configured to be thermally coupled to a heat transfer device (106), the inner bridge frame (208) being remote from the upper thermal interface such that the inner bridge frame does not obstruct the upper thermal interface.

5. The thermal bridge (200) according to claim 1, wherein The connecting element (220) includes a pin extending completely through the upper bridge assembly (202) and the lower bridge assembly (204).

6. The thermal bridge (200) according to claim 1, wherein The upper plate (230) includes an upper slot (310) in which the connecting element (220) extends internally through the upper plate, and the lower plate (250) includes a lower slot (360) in which the connecting element (220) extends internally through the lower plate.

7. The thermal bridge (200) according to claim 6, wherein The upper slot (310) is elongated, and the upper plate (230) is movable relative to the inner bridge frame (208) when the connecting element (220) moves relative to the upper plate in the upper slot.

8. The thermal bridge (200) according to claim 1, wherein The internal bridge frame (208) includes a first side plate (222) on a first side (280) of the upper bridge assembly (202) and a first side (280) of the lower bridge assembly (204), and the internal bridge frame includes a second side plate (224) on a second side (282) of the upper bridge assembly and a second side (282) of the lower bridge assembly, the connecting element (220) extending between the first side plate and the second side plate.

9. The thermal bridge (200) according to claim 1, wherein The upper plate (230) includes an upper overlap region (644) and the lower plate (250) includes a lower overlap region (664), the upper bridge assembly (202) and the lower bridge assembly (204) being nested within each other such that the upper overlap region overlaps the lower overlap region to thermally couple the upper and lower plates.

10. The thermal bridge (200) according to claim 1, wherein The upper plate (230) includes upper bridge plates (240) and upper spacer plates (242) between the upper bridge plates, and the lower plate (250) includes lower bridge plates (260) and lower spacer plates (262) between the lower bridge plates, the upper bridge plates are aligned with the lower spacer plates, and the lower bridge plates are aligned with the upper spacer plates.

11. The thermal bridge (200) according to claim 1, wherein The upper plates (230) are movable relative to each other, and the lower plates (250) are movable relative to each other and relative to the upper plates.

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