Cooling fins and thermosyphon heat sinks

Abstract

The present invention discloses a heat dissipation fin and a thermosyphon radiator. The heat dissipation fin includes a plate body having a first end and a second end, wherein the second end is located on one side of the first end, a condensation chamber and at least one reflux channel are formed in the plate body, and the condensation chamber is arranged close to the first end, and each of the reflux channels includes a first reflux section and at least one second reflux section, wherein one end of the first reflux section is connected to the condensation chamber, and the other end extends in a direction away from the first end, and one end of the second reflux section is connected to the first reflux section, and the other end extends in a direction close to the second end and has a fluid outlet. The use of this technical solution solves the technical problem in the prior art that a large number of bubbles generated by the phase change working fluid when heated gather in the upper part of the thermosyphon radiator, causing the corresponding heat source arranged there to be unable to contact with the liquid phase change working fluid, thereby failing to achieve heat dissipation.

Description

Technical Field

[0001] The present invention relates to the technical field of heat dissipation, and in particular to a heat dissipation fin and a thermosyphon heat sink. Background Art

[0002] In the past decade, with the rapid development of communication equipment, supercomputing, data mining, e-commerce, artificial intelligence and other fields, the total heat dissipation demand has increased dramatically. The miniaturization of equipment has further increased the power density, and at the same time, it has also intensified the demand for efficient cooling solutions.

[0003] Thermosyphon heat sinks in the prior art dissipate heat from electronic equipment by evaporating a phase change fluid into a gas when heated. When multiple heat sources are arranged on the thermosyphon heat sink in the vertical direction, bubbles generated by the heated phase change fluid will gather in a large number at the upper part of the thermosyphon heat sink, causing the corresponding heat source arranged there to be unable to contact the liquid phase change fluid, and thus unable to dissipate heat from the heat source through the phase change of the phase change fluid. Summary of the invention

[0004] Based on this, it is necessary to propose a heat dissipation fin and a thermosyphon radiator to address the above-mentioned problems, so as to solve the technical problem in the prior art that a large number of bubbles generated by the heating of the phase change working fluid gather in the upper part of the thermosyphon radiator, resulting in the corresponding heat source arranged there being unable to contact with the liquid phase change working fluid, and thus unable to achieve heat dissipation.

[0005] To this end, a first aspect provides a heat dissipation fin, comprising:

[0006] A plate body having a first end and a second end, wherein the second end is located on one side of the first end, wherein a condensation chamber and at least one reflux channel are formed in the plate body, and the condensation chamber is arranged close to the first end, and each of the reflux channels comprises a first reflux section and at least one second reflux section, wherein one end of the first reflux section is connected to the condensation chamber, and the other end extends in a direction away from the first end, and one end of the second reflux section is connected to the first reflux section, and the other end extends in a direction close to the second end and has a fluid outlet.

[0007] In some embodiments of the heat dissipation fin, the second end is provided with a fluid inlet communicating with the condensation chamber.

[0008] In some embodiments of the heat dissipation fin, the first return section and the second return section both extend in a straight line.

[0009] In some embodiments of the heat sink fin, the first return section and the second return section are perpendicular to each other.

[0010] In some embodiments of the heat dissipation fin, the second return section is inclined, a higher end of the second return section is connected to the first return section, and a lower end of the second return section forms the fluid outlet.

[0011] In some embodiments of the heat dissipation fin, the first return section extends in a straight line, and the second return section extends in an arc shape.

[0012] In some embodiments of the heat dissipation fin, there are more than two second return sections, and adjacent second return sections are spaced apart and each has the fluid outlet.

[0013] In some embodiments of the heat sink fin, there are more than two return channels, and adjacent return channels are arranged at intervals and each has more than one second return section.

[0014] In some embodiments of the heat dissipation fin, adjacent first return sections are connected to each other through the second return section, and the fluid outlet of the second return section close to the second end passes through the second end.

[0015] In some embodiments of the heat dissipation fin, a plurality of first condensation sections and a plurality of second condensation sections are formed in the condensation chamber, adjacent first condensation sections are connected through the second condensation sections, and the first condensation section is connected to the first reflux section.

[0016] In some embodiments of the heat dissipation fin, the number of the first condensation sections is the same as the number of the first reflux sections.

[0017] In some embodiments of the heat sink fin, the first condensation section and the first reflux section are located on the same straight line.

[0018] A second aspect of the present invention provides a thermosyphon radiator, comprising a substrate having a receiving cavity and the heat dissipation fins described in the first aspect, wherein the heat dissipation fins are fixed on the substrate, and the fluid inlet and the fluid outlet are both connected to the receiving cavity.

[0019] The embodiments of the present invention have the following beneficial effects:

[0020] In the present invention, the second end of the heat dissipation fin is fixed to the substrate so that the first end of the plate body corresponds to the higher end of the substrate; therefore, the condensation chamber arranged near the first end can be connected to the upper part of the receiving chamber, and the liquid phase-change working medium in the receiving chamber is evaporated by heat to form a gaseous phase-change working medium, and the gaseous phase-change working medium flows into the condensation chamber of the heat dissipation fin for condensation, thereby condensing the gaseous phase-change working medium into a liquid phase-change working medium; wherein each reflux channel includes a first reflux section and at least one second reflux section, one end of the first reflux section is connected to the condensation chamber, and the other end extends in a direction away from the first end, that is, the first reflux section extends from high to low, so as to facilitate the introduction of the liquid phase-change working medium condensed in the condensation chamber into the first reflux section; one end of the second reflux section is connected to the first reflux section, and the other end extends in a direction close to the second end and has a fluid outlet at the second end, that is, the second reflux section is connected to the lower part of the receiving chamber through the fluid outlet, and the second reflux section The function is to guide the liquid phase-change working fluid in the first reflux section into the receiving chamber; multiple heat sources can be installed on the substrate in the vertical direction, and the phase-change working fluid will diffuse to the condensation chamber through two paths after being heated and evaporated: one is that the bubbles generated by the phase-change working fluid located in the lower part of the receiving chamber will diffuse to the second reflux section, the first reflux section, and the condensation chamber through the fluid outlets at the corresponding heights in turn, and condense in the condensation chamber and then flow back to the receiving chamber through the first reflux section and the second reflux section to continue to be heated; that is, the bubbles generated by the phase-change working fluid in the lower part can be evacuated through several fluid outlets to avoid the phenomenon of bubbles gathering above the phase-change working fluid, that is, it will not affect the heat dissipation of the heat source arranged on the upper part of the substrate; the second is that the gas generated by the phase-change working fluid located in the upper part of the receiving chamber will directly diffuse to the condensation chamber through the fluid inlet, and condense in the condensation chamber to form liquid phase-change working fluid, and then flow back to the receiving chamber through the reflux channel and the fluid outlet in turn to continue to be heated. The application of this technical solution solves the technical problem in the prior art that bubbles generated by the phase change working fluid when heated gather in large quantities at the upper part of the thermal siphon radiator, causing the corresponding heat source arranged there to be unable to contact the liquid phase change working fluid, thereby failing to achieve heat dissipation. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0022] in:

[0023] Figure 1 It shows a schematic diagram of the overall structure of a thermosyphon radiator provided according to the present invention;

[0024] Figure 2A schematic diagram of the exploded structure of a thermosyphon radiator provided according to the present invention is shown;

[0025] Figure 3 A partial structural schematic diagram of a thermosyphon radiator is shown;

[0026] Figure 4 A partial structural schematic diagram of a heat dissipation fin is shown;

[0027] Figure 5 A schematic structural diagram of a heat dissipation fin in an embodiment is shown;

[0028] Figure 6 A schematic diagram of the structure of heat dissipation fins in another embodiment is shown;

[0029] Figure 7 A schematic diagram of the structure of heat dissipation fins in another embodiment is shown;

[0030] Figure 8 A schematic diagram of the structure of heat dissipation fins in another embodiment is shown;

[0031] Fig. 9 A schematic diagram of the structure of heat dissipation fins in another embodiment is shown;

[0032] Fig.10 A schematic structural diagram of a heat dissipation fin in another embodiment is shown.

[0033] Description of main component symbols:

[0034] 100. Thermosyphon heat sink; 10. Base plate; 10a. Accommodating cavity; 10c. First plate surface; 10d. Second plate surface; 10e. First connecting hole; 10f. Second connecting hole; 11. Main board; 12. Cover plate; 13. Second supporting member; 20. Heat dissipating fins; 21. Plate body; 211. First end; 212. Second end; 213. Condensation cavity; 2131. First condensation section; 2132. Second condensation section; 214. Reflux channel; 2141. First reflux section; 2142. Second reflux section; 215. Fluid inlet; 216. Fluid outlet; 22. First supporting member; 30. Heat source. DETAILED DESCRIPTION

[0035] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present invention are given in the drawings. However, the present invention can be implemented in many other different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present invention more thorough and comprehensive.

[0036] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

[0037] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0038] See also Figure 1 and Figure 2 In an embodiment of the present invention, a thermosyphon heat sink 100 is provided. The thermosyphon heat sink 100 can dissipate heat from a heat source 30 such as a central processing unit and a chip of a power electronic device, thereby ensuring that the power electronic device operates stably within a rated temperature range. The thermosyphon heat sink includes a substrate 10 having a receiving cavity 10a and a heat sink fin 20 fixed on the substrate 10 and connected to the receiving cavity 10a. The receiving cavity 10a contains a phase change medium. The liquid phase change medium is evaporated by the heat source 30 to form a gaseous phase change medium and flows into the heat sink fin 20. The gaseous phase change medium condenses in the heat sink fin 20 to form a liquid phase change medium and flows back to the receiving cavity 10a, thereby completing a heat dissipation cycle.

[0039] Combination Figure 3 and Figure 4 , wherein the heat dissipation fin 20 includes a plate body 21, the plate body 21 has a first end 211 and a second end 212, the second end 212 is located on one side of the first end 211, specifically, the second end 212 can be arranged adjacent to the first end 211, and the two are directly connected. Of course, the second end 212 and the first end 211 can also be indirectly connected through other end faces, as long as the second end 212 is located on one side of the first end 211, for example Figure 5 The second end 212 is shown to be located on the right side of the first end 211; a condensation chamber 213 and at least one reflux channel 214 are formed in the plate body 21, and the condensation chamber 213 is arranged close to the first end 211, each reflux channel 214 includes a first reflux section 2141 and at least one second reflux section 2142, one end of the first reflux section 2141 is connected to the condensation chamber 213, and the other end extends in a direction away from the first end 211, one end of the second reflux section 2142 is connected to the first reflux section 2141, and the other end extends in a direction close to the second end 212 and has a fluid outlet 216.

[0040] In the present invention, the second end 212 of the heat dissipating fin 20 is fixed to the substrate 10, so that the first end 211 of the plate body 21 corresponds to the higher end of the substrate 10; therefore, the condensation chamber 213 arranged near the first end 211 can be connected to the upper part of the receiving chamber 10a, and the liquid phase change medium in the receiving chamber 10a is evaporated by heat to form a gas phase change medium, and the gas phase change medium flows into the condensation chamber 213 of the heat dissipating fin 20 for condensation, thereby condensing the gas phase change medium into a liquid phase change medium; wherein each reflux channel 214 includes a first reflux section 2141 and at least one The first reflux section 2141 has one end in communication with the condensation chamber 213, and the other end extends in a direction away from the first end 211, that is, the first reflux section 2141 extends from high to low, so as to facilitate the introduction of the liquid phase-change working medium condensed in the condensation chamber 213 into the first reflux section 2141; the second reflux section 2142 has one end in communication with the first reflux section 2141, and the other end extends in a direction close to the second end 212 and has a fluid outlet 216 at the second end 212, that is, the second reflux section 2142 is connected to the receiving chamber 10a through the fluid outlet 216. The lower part is connected, and the function of the second reflux section 2142 is to guide the liquid phase-change working medium in the first reflux section 2141 to the recovery chamber 10a; multiple heat sources 30 can be installed on the substrate 10 in the vertical direction, and the phase-change working medium is heated and evaporated. Then, after being heated, it diffuses to the condensation chamber 213 through two paths: one is that the bubbles generated by the phase-change working medium located in the lower part of the receiving chamber 10a when heated will diffuse to the second reflux section 2142, the first reflux section 2141, and the condensation chamber 213 through the fluid outlet 216, and condense in the condensation chamber 213 and then pass through the first reflux section 2141, the second reflux section 2142, and the second reflux section 2141. The flow section 2142 flows back to the receiving chamber 10a to continue to be heated; that is, the bubbles generated by the phase change medium in the lower part can be evacuated through the fluid outlet 216 to avoid the phenomenon of bubbles gathering above the phase change medium, that is, it will not affect the heat dissipation of the heat source 30 arranged on the upper part of the substrate 10; secondly, the gas generated by the phase change medium located in the upper part of the receiving chamber when heated directly diffuses to the condensation chamber 213 through the fluid inlet 215, and condenses in the condensation chamber 213 to form a liquid phase change medium, and then flows back to the receiving chamber 10a through the reflux channel 214 and the fluid outlet 216 to continue to be heated. The use of this technical solution solves the technical problem in the prior art that a large number of bubbles generated by the phase change medium when heated gather at the upper part of the thermal siphon radiator 100, resulting in the heat source 30 arranged there being unable to contact the liquid phase change medium, and thus unable to achieve heat dissipation.

[0041] At the same time, in the process of liquid phase change flowing back to the receiving chamber 10a through the reflux channel 214, the phase change working medium in the reflux channel 214 further exchanges heat with the outside to reduce the temperature. The phase change working medium in the reflux channel 214 has a lower temperature and a higher density than the phase change working medium in the receiving chamber 10a. Conversely, the phase change working medium in the receiving chamber 10a has a higher temperature and a lower density than the phase change working medium in the reflux channel 214. Therefore, the phase change working medium in the reflux channel 214 flows to the receiving chamber 10a and drives the phase change working medium in the receiving chamber 10a to move upward, forming natural convection to enhance the cooling effect on the heat source 30.

[0042] In one embodiment, the second end 212 is provided with a fluid inlet 215 communicating with the condensation chamber 213. Therefore, the fluid inlet 215 and the fluid outlet 216 both pass through the second end 212, that is, for the heat dissipation fin 20, the inflow and outflow of the phase change medium are both realized on the same side thereof, thereby facilitating the assembly of the heat dissipation fin 20 and the substrate 10.

[0043] In one embodiment, the first reflow section 2141 and the second reflow section 2142 both extend in a straight line. Figure 5-Figure 8 The first reflux section 2141 extends in a straight line to ensure that the liquid phase-change medium flows smoothly into the first reflux section 2141, and the second reflux section 2142 extends in a straight line to ensure that the liquid phase-change medium in the first reflux section 2141 can smoothly flow back into the receiving chamber 10a through the second reflux section 2142; on the other hand, the first reflux section 2141 and the second reflux section 2142 extend in a straight line, which is conducive to the regular arrangement of the reflux channel 214.

[0044] Furthermore, the first reflow section 2141 is perpendicular to the second reflow section 2142. By vertically connecting the first reflow section 2141 with the second reflow section 2142, not only the first reflow section 2141 and the second reflow section 2142 are arranged in a regular manner, but also the reflow path of the entire reflow channel 214 can be lengthened.

[0045] In another embodiment, the second reflux section 2142 is tilted, the higher end of the second reflux section 2142 is connected to the first reflux section 2141, and the lower end of the second reflux section 2142 forms a fluid outlet 216. This allows the gaseous phase-change working medium formed by heat in the receiving chamber 10a to be better exchanged with the liquid phase-change working medium refluxed through the reflux channel 214, that is, the bubbles are more easily diffused into the second reflux section 2142, and the liquid phase-change working medium in the second reflux section 2142 is also more easily refluxed to the receiving chamber 10a.

[0046] In this embodiment, the first reflux section 2141 may also be extended along a straight line with reference to the above embodiment to ensure that the liquid phase-change working medium flows smoothly into the first reflux section 2141 and then flows into the second reflux section 2142 .

[0047] In another embodiment, the first reflux section 2141 extends in a straight line, and the second reflux section 2142 extends in an arc shape, so that the gas phase-change working medium formed by heat in the receiving chamber 10a and the liquid phase-change working medium refluxed through the reflux channel 214 can be better exchanged, that is, the bubbles can be more easily diffused into the second reflux section 2142, and the liquid phase-change working medium in the second reflux section 2142 can also be more easily refluxed to the receiving chamber 10a.

[0048] It should be noted that the shape settings of the first reflow section 2141 and the shape settings of the second reflow section 2142 include but are not limited to the above.

[0049] On the basis of the above-mentioned embodiment, the features such as the number of the second reflux sections 2142 and the reflux channels 214 are further configured.

[0050] In one embodiment, see Figure 5 , there are more than two second reflux sections 2142, and adjacent second reflux sections 2142 are arranged at intervals and all have the fluid outlet 216. That is, in this embodiment, each reflux channel 214 has more than two second reflux sections 2142, and the liquid phase-change working medium condensed in the condensation chamber 213 first flows into the first reflux section 2141, and then begins to split to flow to each second reflux section 2142, and then flows back to the receiving chamber 10a through the fluid outlets of each second reflux section 2142 to exchange with the gaseous phase-change working medium located at different heights in the receiving chamber 10a, that is, the bubbles in the receiving chamber 10a can diffuse into the reflux channel 214 through different fluid inlets 215.

[0051] See Figure 5 The heat dissipation fin 20 is formed with a reflux channel 214 , and there are five second reflux sections 2142 , that is, the liquid phase-change working medium condensed in the condensation chamber 213 first flows into the first reflux section 2141 , and then can be diverted to the five second reflux sections 2142 .

[0052] In one embodiment, see Figure 6 and Figure 7 , there are more than two reflux channels 214, and adjacent reflux channels 214 are arranged at intervals and each has more than one second reflux section 2142. Therefore, by increasing the reflux channels 214, not only the second reflux sections 2142 are multiple, but also the first reflux sections 2141 are multiple. Through the multiple first reflux sections 2141, the speed at which the liquid phase-change working medium condensed in the condensation chamber 213 flows into the reflux channel 214 can be accelerated, and the diffusion speed of the gas phase-change working medium formed by heating in the receiving chamber 10a through the reflux channel 214 to the condensation chamber 213 can also be accelerated.

[0053] exist Figure 6In the embodiment, there are three return channels 214 , and each return channel 214 has a first return section 2141 and a second return section 2142 .

[0054] exist Figure 7 In the embodiment, there are three return channels 214 , wherein one return channel 214 has a first return section 2141 and a second return section 2142 , and the other two return channels 214 have a first return section 2141 and three second return sections 2142 .

[0055] In one embodiment, see Figure 8 , the adjacent first reflux sections 2141 are interconnected through the second reflux sections 2142, and the fluid outlet 216 of the second reflux section 2142 near the second end 212 penetrates the second end 212, thereby realizing the connection between the reflux channels 214 and increasing the reflux path of the reflux channel 214. Specifically, through the cross-communication of multiple first reflux sections 2141 and multiple second reflux sections 2142, on the one hand, the shunt area and shunt branches of the liquid phase-change medium from the first reflux section 2141 to the second reflux section 2142 can be increased, thereby improving the heat exchange efficiency between the liquid phase-change medium and the heat dissipation fins 20; on the other hand, the diffusion speed of the gas phase-change medium formed by the heating in the receiving cavity 10a in the reflux channel 214 is accelerated, and on the other hand, the reflux path of the reflux channel 214 can be lengthened and increased.

[0056] See also Fig. 9 and Fig.10 A plurality of first condensation sections 2131 and a plurality of second condensation sections 2132 are formed in the condensation chamber 213, wherein adjacent first condensation sections 2131 are connected through the second condensation sections 2132, thereby ensuring sufficient flow of the gaseous phase-change working medium in the condensation chamber 213 to achieve condensation; and the first condensation section 2131 is connected to the first reflux section 2141, so as to guide the liquid phase-change working medium formed by condensation into the first reflux section 2141.

[0057] In one embodiment, the number of the first condensation sections 2131 is the same as the number of the first reflux sections 2141. Fig. 9 and Fig.10 , that is, each first condensation section 2131 is correspondingly connected to each first reflux section 2141 , thereby improving the efficiency of introducing the liquid phase-change working medium from the condensation chamber 213 into the reflux channel 214 .

[0058] Furthermore, the first condensation section 2131 and the first reflux section 2141 are located on the same straight line, see Fig. 9 and Fig.10, which ensures the smoothness of the connection between the first condensation section 2131 and the first reflux section 2141. On the one hand, the liquid phase change medium in the first condensation section 2131 flows smoothly into the first reflux section 2141. On the other hand, the first condensation section 2131 and the first reflux section 2141 can be formed at one time, that is, the processing steps of the first condensation section 2131 and the processing steps of the first reflux section 2141 are integrated into one processing step, thereby simplifying the processing steps of the heat sink fin 20 and improving the processing efficiency.

[0059] It should be noted that the condensation chamber 213 is always higher than the liquid level of the phase change medium in the receiving chamber 10a, that is, the phase change medium enters the condensation chamber 213 above for condensation after vaporization, and then flows back to the reflux channel 214 below, see Fig. 9 and Fig.10 The second end 212 of the heat dissipation fin 20 is basically entirely connected to the receiving cavity 10 a of the substrate 10 .

[0060] In one embodiment, the heat sink 20 also includes a plurality of first support members 22 arranged at intervals from each other in the condensation chamber 213. The first support members 22 can prevent the heat sink 20 from collapsing or swelling due to the working environment of the condensation chamber 213 being set to vacuum or high pressure; and the plurality of first support members 22 are arranged at intervals from each other, that is, the first condensation section 2131 and the second condensation section 2132 are formed by the intervals between the plurality of first support members 22, so that the gaseous phase change medium diffused into the condensation chamber 213 can move fully, reducing the resistance of the first support members 22 to the gaseous phase change medium, thereby ensuring the fluidity and diffusion rate of the phase change medium.

[0061] In some specific embodiments, see Fig. 9 , the first support member 22 can be configured as a rectangle; or, see Fig.10 , the first support member 22 can be configured as a hexagon. It should be noted that the structure of the first support member 22 includes but is not limited to this.

[0062] See also Figure 1 and Figure 2 The substrate 10 has a first plate surface 10c and a second plate surface 10d which are arranged opposite to each other. The first plate surface 10c is formed with a heat dissipation station for installing the heat source 30, and the heat dissipation fins 20 are arranged on the second plate surface 10d. This is to avoid the heat source 30 interfering with the heat dissipation of the heat dissipation fins 20 when the heat source 30 and the heat dissipation fins 20 are located on the same side of the substrate 10, thereby ensuring the heat exchange efficiency between the heat dissipation fins 20 and the environment.

[0063] In one embodiment, the substrate 10 includes a plurality of second support members 13 arranged at intervals in the receiving chamber 10a. The second support members 13 can be provided to prevent the substrate 10 from collapsing or swelling due to the receiving chamber 10a being in a vacuum or high pressure state; and the plurality of second support members 13 are arranged at intervals from each other, that is, gaps are formed between the plurality of second support members 13, so that bubbles formed by heat can flow through the gaps and then flow toward the condensation chamber 213 or the reflux channel, thereby reducing the resistance of the second support members 13 to the bubbles, thereby ensuring the flow speed of the bubbles.

[0064] In some specific embodiments, the substrate 10 is further formed with a first communicating hole 10e and a second communicating hole 10f, through which the fluid inlet 215 is connected to the receiving cavity 10a, and through which the fluid outlet 216 is connected to the receiving cavity 10a.

[0065] In some specific embodiments, the substrate 10 includes a main board 11 and a cover 12 covering the main board 11. A groove is formed on a surface of the main board 11 facing the cover 12. The cover 12 covers the groove on the main board 11 to form a receiving cavity 10a.

[0066] In one embodiment, the substrate 10 is further provided with a liquid injection hole communicating with the receiving cavity 10 a ; wherein the liquid injection hole may be provided at the top end of the substrate 10 .

[0067] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0068] The above embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the patent application. It should be pointed out that, for those of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A thermosyphon radiator, characterized in that: The thermosyphon heat sink comprises a base plate with a receiving cavity and heat dissipation fins, wherein the heat dissipation fins are fixed on the base plate: The heat dissipation fin includes a plate body having a first end and a second end, the second end being located on one side of the first end, a condensation chamber and at least one reflux channel being formed in the plate body, and the condensation chamber is arranged close to the first end, and the second end is provided with a fluid inlet connected to the condensation chamber, each of the reflux channels includes a first reflux section and at least one second reflux section, one end of the first reflux section is connected to the condensation chamber, and the other end extends in a direction away from the first end, one end of the second reflux section is connected to the first reflux section, and the other end extends in a direction close to the second end and has a fluid outlet, the fluid inlet and the fluid outlet both pass through the second end, and the fluid inlet and the fluid outlet are both connected to the accommodating chamber.

2. The thermosyphon radiator according to claim 1, characterized in that: The first reflux section and the second reflux section both extend in a straight line.

3. The thermosyphon radiator according to claim 1, characterized in that: The first reflux section and the second reflux section are perpendicular to each other.

4. The thermosyphon radiator according to claim 1, characterized in that: The second reflux section is arranged obliquely, the higher end of the second reflux section is communicated with the first reflux section, and the lower end of the second reflux section forms the fluid outlet.

5. The thermosyphon radiator according to claim 1, characterized in that: The first reflux section extends in a straight line, and the second reflux section extends in an arc shape.

6. The thermosyphon radiator according to claim 1, characterized in that: There are more than two second reflux sections, and adjacent second reflux sections are spaced apart and each has the fluid outlet.

7. The thermosyphon radiator according to claim 1, characterized in that: There are more than two reflux channels, and adjacent reflux channels are arranged at intervals and each has more than one second reflux section.

8. The thermosyphon radiator according to claim 7, characterized in that: Adjacent first reflux sections are connected to each other through the second reflux section, and the fluid outlet of the second reflux section close to the second end passes through the second end.

9. The thermosyphon radiator according to any one of claims 1 to 8, characterized in that: A plurality of first condensation sections and a plurality of second condensation sections are formed in the condensation chamber, adjacent first condensation sections are connected through the second condensation sections, and the first condensation section is connected with the first reflux section.

10. The thermosyphon radiator according to claim 9, characterized in that: The number of the first condensation sections is the same as the number of the first reflux sections.

11. The thermosyphon radiator according to claim 10, characterized in that: The first condensation section and the first reflux section are located on the same straight line.

12. The thermosyphon radiator according to claim 1, characterized in that: The thermosyphon heat sink further includes a plurality of first support members arranged in intervals and disposed in the condensation chamber.

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