Semiconductor heat treatment apparatus and exhaust device thereof

Abstract

Embodiments of the present application provide a semiconductor heat treatment equipment and an exhaust device thereof. The exhaust device comprises a gas collecting mechanism, a first pressure control assembly and a second pressure control assembly. The gas collecting mechanism is arranged on a loading and unloading chamber and is in communication with an internal space of the loading and unloading chamber, and is used for collecting gas in the loading and unloading chamber. The first pressure control assembly and the second pressure control assembly are both connected with the gas collecting mechanism. The first pressure control assembly is used for exhausting the gas collecting mechanism with a first flow rate. The second pressure control assembly is used for exhausting the gas collecting mechanism with a second flow rate, and the first flow rate is greater than the second flow rate. The gas collecting mechanism is further used for switching the exhaust by the first pressure control assembly and / or the second pressure control assembly according to the oxygen content in the loading and unloading chamber. Embodiments of the present application realize rapid pressure control and oxygen content reduction of the loading and unloading chamber, and can also reduce unnecessary energy waste, thereby improving the market competitiveness of the semiconductor heat treatment equipment.

Description

Technical Field

[0001] The present application relates to the field of semiconductor processing technology, and more specifically, to a semiconductor heat treatment device and an exhaust device thereof. Background Art

[0002] Currently, during the oxidation process in semiconductor thermal processing equipment, wafer transport and cooling, as well as the wafer lift boat, are all performed within the microenvironment of the loading and unloading chamber. This microenvironment is an area with extremely high requirements for cleanliness and sealing. These requirements primarily include strict requirements for pressure control, oxygen content, heating and cooling rates, and particle size within the loading and unloading chamber. Exhaust systems are generally used to control pressure and oxygen content within the loading and unloading chamber.

[0003] Existing exhaust systems typically use pipes and valves connected to the negative pressure exhaust line for plant services. When the oxygen content in the loading and unloading chamber exceeds the specified level, the valve is manually opened to exhaust the chamber, thereby reducing the pressure and oxygen content within the chamber. Because existing exhaust systems have limited control, they are unable to rapidly reduce the pressure and oxygen content within the loading and unloading chamber. Furthermore, the energy consumption required to rapidly reduce the pressure and oxygen content is high, which reduces the production capacity of semiconductor heat treatment equipment and, in turn, affects the market competitiveness of semiconductor heat treatment equipment. Summary of the Invention

[0004] In view of the shortcomings of the existing methods, this application proposes a semiconductor heat treatment equipment and its exhaust device to solve the technical problem that the existing technology cannot quickly reduce the pressure and oxygen content in the loading and unloading chamber.

[0005] In the first aspect, an embodiment of the present application provides an exhaust device, which is arranged on the loading and unloading chamber of a semiconductor heat treatment equipment, and is used to control the pressure and oxygen content in the loading and unloading chamber by exhaust, including: a gas collecting mechanism, a first pressure control component and a second pressure control component; the gas collecting mechanism is arranged on the loading and unloading chamber, and is connected to the internal space of the loading and unloading chamber, and is used to collect the gas in the loading and unloading chamber; the first pressure control component and the second pressure control component are both connected to the gas collecting mechanism, the first pressure control component is used to exhaust the gas collecting mechanism with a first flow rate, and the second pressure control component is used to exhaust the gas collecting mechanism with a second flow rate, and the first flow rate is greater than the second flow rate; the gas collecting mechanism is also used to switch the exhaust to the first pressure control component and / or the second pressure control component according to the oxygen content in the loading and unloading chamber.

[0006] In one embodiment of the present application, the gas collecting mechanism includes a gas collecting box and a switching assembly, the gas collecting box includes a first gas collecting chamber and a second gas collecting chamber that are interconnected, and the second gas collecting chamber is connected to the loading and unloading chamber, the first pressure control assembly is connected to the first gas collecting chamber, and the second pressure control assembly is connected to the second gas collecting chamber; the switching assembly is used to selectively connect or isolate the first gas collecting chamber and the second gas collecting chamber.

[0007] In one embodiment of the present application, the gas collecting box has a partition plate for separating the first gas collecting chamber and the second gas collecting chamber in the gas collecting box. The partition plate is provided on a connecting port for connecting the first gas collecting chamber and the second gas collecting chamber. The switching component is used to selectively close or open the connecting port.

[0008] In one embodiment of the present application, the switching component includes a driver and a closing plate. The driver is arranged at the top of the air collecting box and partially extends into the first air collecting cavity. The closing plate is arranged at the bottom of the driver and is used to perform a lifting action under the drive of the driver to selectively close or open the connecting port.

[0009] In one embodiment of the present application, the gas collecting mechanism further includes an oxygen sensor, which is disposed in the loading and unloading chamber and is used to detect the oxygen content in the loading and unloading chamber.

[0010] In one embodiment of the present application, the exhaust device also includes a controller, which is electrically connected to the oxygen sensor and the switching component, and is used to control the switching component to connect the first gas collecting chamber and the second gas collecting chamber when the oxygen content in the loading and unloading chamber is greater than a preset value, and control the first pressure control component and the second pressure control component to exhaust at the same time; and when the oxygen content in the loading and unloading chamber is less than the preset value, control the switching component to isolate the first gas collecting chamber and the second gas collecting chamber, and control the second pressure control component to exhaust.

[0011] In one embodiment of the present application, the gas collecting mechanism also includes a pressure sensor, which is arranged on one side of the gas collecting box and is connected to the second gas collecting cavity for detecting the pressure in the gas collecting box; the controller is also used to control the exhaust flow of the first pressure control component and / or the second pressure control component according to the pressure, so that the pressure in the gas collecting box is maintained within a preset pressure range.

[0012] In one embodiment of the present application, the first pressure control component and the second pressure control component both include an exhaust pipe and a valve structure, one end of the exhaust pipe is connected to the air collecting box, and the other end is connected to the negative pressure exhaust pipeline through the valve structure, and the valve structure is used to control the opening and closing degree of the exhaust pipe to adjust the exhaust flow rate.

[0013] In one embodiment of the present application, the valve structure includes a valve tube, a valve plate and a driving part. The valve plate is arranged in the valve tube and can be flipped with the radial direction of the valve tube as the axis to adjust the opening and closing degree of the valve tube; the driving part is arranged on the outside of the valve tube and is used to drive the valve plate to flip.

[0014] In the second aspect, an embodiment of the present application provides a semiconductor heat treatment device, comprising a loading and unloading chamber, a process chamber, and an exhaust device as provided in the first aspect, wherein the process chamber is connected to the loading and unloading chamber, and the exhaust device is arranged on the loading and unloading chamber.

[0015] The beneficial technical effects brought about by the technical solutions provided by the embodiments of the present application are:

[0016] The embodiment of the present application controls the first pressure control component and / or the second pressure control component to exhaust the loading and unloading chamber through the gas collecting mechanism, so that the embodiment of the present application can control the first pressure control component or the second pressure control component to exhaust the loading and unloading chamber separately according to needs, and control the first pressure control component and the second pressure control component to exhaust the loading and unloading chamber at the same time, thereby realizing the use of multiple modes to exhaust the loading and unloading chamber, which can not only quickly reduce the oxygen content in the loading and unloading chamber, and control the pressure of the loading and unloading chamber, but also reduce unnecessary energy waste, thereby improving the market competitiveness of semiconductor heat treatment equipment.

[0017] Additional aspects and advantages of the present application will be given in part in the following description, which will become apparent from the following description, or will be learned through practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the following description of the embodiments in conjunction with the accompanying drawings, in which:

[0019] Figure 1 A schematic diagram of the structure of an exhaust device and a loading and unloading chamber provided in an embodiment of the present application;

[0020] Figure 2 A schematic structural diagram of a gas collecting box provided in an embodiment of the present application;

[0021] Figure 3 A schematic structural diagram of a valve structure provided in an embodiment of the present application. DETAILED DESCRIPTION

[0022] The present application is described in detail below. Examples of embodiments of the present application are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar components or components having the same or similar functions. In addition, if the detailed description of the known technology is not necessary for the features of the present application shown, it will be omitted. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application and are not to be construed as limiting the present application.

[0023] It will be understood by those skilled in the art that, unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by those skilled in the art to which this application belongs. It should also be understood that terms such as those defined in common dictionaries should be understood to have meanings consistent with their meanings in the context of the prior art and will not be interpreted in an idealized or overly formal sense unless specifically defined as herein.

[0024] The following describes in detail the technical solution of the present application and how the technical solution of the present application solves the above-mentioned technical problems with specific embodiments.

[0025] The embodiment of the present application provides an exhaust device, which is arranged on the loading and unloading chamber of the semiconductor heat treatment equipment and is used to control the pressure and oxygen content in the loading and unloading chamber by exhaust. The structural diagram of the exhaust device is shown in FIG. Figure 1 As shown, it includes: a gas collecting mechanism 1, a first pressure controlling component 2 and a second pressure controlling component 3; the gas collecting mechanism 1 is arranged on the loading and unloading chamber 200, and is connected to the internal space of the loading and unloading chamber 200, and is used to collect the gas in the loading and unloading chamber 200; the first pressure controlling component 2 and the second pressure controlling component 3 are both connected to the gas collecting mechanism 1, the first pressure controlling component 2 is used to exhaust the gas collecting mechanism 1 with a first flow rate, and the second pressure controlling component 3 is used to exhaust the gas collecting mechanism 1 with a second flow rate, and the first flow rate is greater than the second flow rate; the gas collecting mechanism 1 is also used to switch the exhaust to the first pressure controlling component 2 and / or the second pressure controlling component 3 according to the oxygen content in the loading and unloading chamber 200.

[0026] like Figure 1As shown, the semiconductor heat treatment equipment is used, for example, to perform an oxidation process on the wafer, and the loading and unloading chamber 200 can provide a microenvironment for the transmission and cooling of the wafer and the lifting boat, but the embodiment of the present application does not limit the specific process type performed by the semiconductor heat treatment equipment, and those skilled in the art can adjust the settings according to actual conditions. The gas collecting mechanism 1 can be arranged at the top of the loading and unloading chamber 200, and is connected to the internal space of the loading and unloading chamber 200, for collecting the gas in the loading and unloading chamber 200. The first pressure control component 2 can be arranged at the top of the gas collecting mechanism 1, for exhausting the loading and unloading chamber 200 using a first flow rate. The second pressure control component 3 can be arranged on the right side of the gas collecting mechanism 1, or on the left side of the gas collecting mechanism 1. The embodiment of the present application is not limited to this. The second pressure control component 3 can exhaust the loading and unloading chamber 200 using a second flow rate. Furthermore, the exhaust flow rate of the loading and unloading chamber 200 using the first pressure-control component 2 is greater than the exhaust flow rate of the loading and unloading chamber 200 using the second pressure-control component 3, that is, the first flow rate is greater than the second flow rate, thereby achieving rapid pressure control and oxygen content control in the loading and unloading chamber 200. The gas collection mechanism 1 can be connected to the host computer of the semiconductor heat treatment equipment to obtain the oxygen content in the loading and unloading chamber 200, and can control the exhaust flow of the first pressure-control component 2 and / or the second pressure-control component 3 based on the oxygen content. For example, when the oxygen content in the loading and unloading chamber 200 is high, the gas collecting mechanism 1 can control the first pressure control component 2 and the second pressure control component 3 to exhaust the loading and unloading chamber 200 at the same time, so as to quickly reduce the oxygen content in the loading and unloading chamber 200 to a preset level; when the oxygen content in the loading and unloading chamber 200 is moderate, the gas collecting mechanism 1 can control the first pressure control component 2 to exhaust the loading and unloading chamber 200, so as to reduce the oxygen content in the loading and unloading chamber 200 to a preset level; when the oxygen content in the loading and unloading chamber 200 is relatively low, the gas collecting mechanism 1 can control the second pressure control component 3 to exhaust the loading and unloading chamber 200, so as to reduce the oxygen content in the loading and unloading chamber 200 to a preset level, thereby saving energy consumption while quickly reducing the oxygen content in the loading and unloading chamber 200.

[0027] The embodiment of the present application controls the first pressure control component and / or the second pressure control component to exhaust the loading and unloading chamber through the gas collecting mechanism, so that the embodiment of the present application can control the first pressure control component or the second pressure control component to exhaust the loading and unloading chamber separately according to needs, and control the first pressure control component and the second pressure control component to exhaust the loading and unloading chamber at the same time, thereby realizing the use of multiple modes to exhaust the loading and unloading chamber, which can not only quickly reduce the oxygen content in the loading and unloading chamber, and control the pressure of the loading and unloading chamber, but also reduce unnecessary energy waste, thereby improving the market competitiveness of semiconductor heat treatment equipment.

[0028] It should be noted that the present embodiment does not limit the specific positions of the first pressure control component 2 and the second pressure control component 3. For example, the positions of the two components can be interchanged. Therefore, the present embodiment is not limited to this, and those skilled in the art can adjust the settings according to actual conditions.

[0029] In one embodiment of the present application, Figure 1 and Figure 2 As shown, the gas collecting mechanism 1 includes a gas collecting box 11 and a switching assembly 12. The gas collecting box 11 includes a first gas collecting chamber 111 and a second gas collecting chamber 112 that are interconnected, and the second gas collecting chamber 112 is connected to the loading and unloading chamber 200. The first pressure control assembly 2 is connected to the first gas collecting chamber 111, and the second pressure control assembly 3 is connected to the second gas collecting chamber 112. The switching assembly 12 is used to selectively connect or isolate the first gas collecting chamber 111 and the second gas collecting chamber 112.

[0030] like Figure 1 and Figure 2 As shown, the gas collecting box 11 can be a rectangular parallelepiped structure made of metal material. The gas collecting box 11 is provided with a first gas collecting chamber 111 and a second gas collecting chamber 112 that are interconnected. The first gas collecting chamber 111 is connected to the first pressure control component 2, and one side of the second gas collecting chamber 112 is connected to the second pressure control component 3. The bottom opening of the second gas collecting chamber 112 is connected to the exhaust port at the top of the loading and unloading chamber 200. A flexible sealing ring can be used to seal between the two. The two sides of the sealing ring can be coated with glue and bonded to the opening and the exhaust port respectively, thereby greatly improving the sealing effect between the gas collecting box 11 and the loading and unloading chamber 200. However, the embodiment of the present application does not limit the sealing method of the two. The switching assembly 12 can be disposed on the plenum box 11 and is used to selectively connect or isolate the first plenum chamber 111 and the second plenum chamber 112. For example, when the first and second pressure-controlling assemblies are connected, the first and second pressure-controlling assemblies 2 and 3 simultaneously exhaust the loading and unloading chamber 200. Alternatively, by disabling either the first or second pressure-controlling assemblies 2 and 3, a single pressure-controlling assembly can be used for exhaust. When the first and second pressure-controlling assemblies are isolated, the second pressure-controlling assembly 3 can exhaust the loading and unloading chamber 200. This design simplifies the structure and control logic of the present embodiment, significantly reducing application and maintenance costs.

[0031] It should be noted that the present embodiment does not limit the specific positions of the first plenum chamber 111 and the second plenum chamber 112. For example, the positions of the first plenum chamber 111 and the second plenum chamber 112 can be interchanged. Therefore, the present embodiment is not limited to this, and those skilled in the art can adjust the settings according to actual conditions.

[0032] In one embodiment of the present application, Figure 1 and Figure 2As shown, the gas collecting box 11 has a partition plate 113 for separating the first gas collecting chamber 111 and the second gas collecting chamber 112 in the gas collecting box 11. The partition plate 113 is provided with a connecting port 114 for connecting the first gas collecting chamber 111 and the second gas collecting chamber 112. The switching assembly 12 is used to selectively close or open the connecting port 114. Specifically, the partition plate 113 can be a plate-like structure made of metal material, and can be extended in the horizontal direction to separate the first gas collecting chamber 111 and the second gas collecting chamber 112. The periphery of the partition plate 113 is fixedly connected to the inner wall of the gas collecting box 11 by welding, or the partition plate 113 and the gas collecting box 11 can also be made in an integrally formed manner, and the embodiments of the present application are not limited thereto. A communication port 114 may be formed at the left end of the partition plate 113 for connecting the first plenum chamber 111 and the second plenum chamber 112. A switching assembly 12 may be disposed at the top of the communication port 114, selectively closing or opening the communication port 114 to connect or isolate the first plenum chamber 111 and the second plenum chamber 112. With this design, the partition plate 113 extends horizontally, resulting in a larger cross-sectional area for the second plenum chamber 112, significantly improving the efficiency of gas passage, thereby further enhancing the operating efficiency of the present embodiment.

[0033] It should be noted that the embodiment of the present application does not limit the specific implementation of the partition plate 113. For example, it can be extended in the vertical direction, and the first pressure control assembly 2 and the second pressure control assembly 3 are respectively located on both sides of the air collecting box 11. Therefore, the embodiment of the present application is not limited to this, and those skilled in the art can adjust the configuration according to actual conditions.

[0034] In one embodiment of the present application, Figure 1 and Figure 2As shown, the switching assembly 12 includes a driver 121 and a closing plate 122. The driver 121 is arranged at the top of the air collecting box 11 and partially extends into the first air collecting chamber 111. The closing plate 122 is arranged at the bottom of the driver 121 and is used to perform a lifting action under the drive of the driver 121 to selectively close or open the connecting port 114. Specifically, a mounting port 115 is provided on the left side of the top of the air collecting box 11 for installing the switching assembly 12; a first connecting port is provided on the right side of the top of the air collecting box 11 for connecting to the first pressure control assembly 2. The driver 121 can adopt a telescopic cylinder, wherein the cylinder body of the driver 121 is arranged at the mounting port 115, and the telescopic rod of the driver 121 extends into the first air collecting chamber 111. The closing plate 122 is arranged at the bottom of the driver 121 and is connected to the bottom end of the telescopic rod. It is used to perform a lifting action under the drive of the driver 121 to selectively open or close the connecting port 114. Furthermore, both the communication port 114 and the closing plate 122 are rectangular in design, and a sealing strip coated with glue is provided on the periphery of the communication port 114 to improve the sealing effect between the closing plate 122 and the communication port 114. However, the specific sealing method of the two is not limited in the embodiment of the present application. The above design makes the embodiment of the present application simple in structure, which not only reduces the application and maintenance costs, but also significantly extends the service life. Optionally, the switching assembly 12 also includes guide rails, and the two guide rails are respectively provided on both sides of the telescopic rod of the driver 121 to guide and limit the closing plate 122, thereby further improving the stability of the embodiment of the present application.

[0035] It should be noted that the embodiment of the present application does not limit the specific positional relationship between the mounting port 115 and the first connection port. For example, the positions of the two can be interchanged, as long as the mounting port 115 and the communication port 114 are arranged correspondingly. Therefore, the embodiment of the present application is not limited to this, and those skilled in the art can adjust the settings according to actual conditions.

[0036] In one embodiment of the present application, Figure 1 and Figure 2 As shown, the gas collecting mechanism 1 also includes an oxygen sensor (not shown in the figure), which is arranged in the loading and unloading chamber 200 and is used to detect the oxygen content in the loading and unloading chamber 200. Specifically, the oxygen sensor can be arranged in the loading and unloading chamber 200, so as to realize the monitoring of the oxygen content in the loading and unloading chamber 200, so as to provide a basis for the gas collecting mechanism 1 to switch the first pressure control component 2 and the second pressure control component 3, thereby further improving the accuracy of oxygen content control. However, the embodiment of the present application does not limit the specific position of the oxygen sensor. Since the gas collecting box 11 is connected to the loading and unloading chamber 200, the oxygen sensor can also be arranged in the gas collecting box 11. Therefore, the embodiment of the present application is not limited to this, and those skilled in the art can adjust the setting according to actual conditions.

[0037] In an embodiment of the present application, as shown in Figure 1 and Figure 2 The exhaust device further comprises a controller (not shown in the figure) electrically connected with the oxygen sensor and the switching assembly 12, for controlling the switching assembly 12 to communicate the first gas collection chamber 111 and the second gas collection chamber 112 and controlling the first pressure control assembly 2 and the second pressure control assembly 3 to simultaneously perform exhaust when the oxygen content in the loading and unloading chamber 200 is greater than a preset value, and for controlling the switching assembly 12 to isolate the first gas collection chamber 111 and the second gas collection chamber 112 and controlling the second pressure control assembly 3 to perform exhaust when the oxygen content in the loading and unloading chamber 200 is less than the preset value.

[0038] As shown in Figure 1 and Figure 2 The controller, for example, adopts a single-chip microcomputer or a programmable controller, is electrically connected with the oxygen sensor and the switching assembly 12 to obtain the monitoring data of the oxygen sensor in real time, sends a control signal to the driver 121 when the oxygen content in the loading and unloading chamber 200 is greater than a preset value, at which time the driver 121 drives the closing plate 122 to rise to open the communication port 114, so that the first gas collection chamber 111 and the second gas collection chamber 112 are communicated, thereby realizing that the first pressure control assembly 2 and the second pressure control assembly 3 simultaneously perform exhaust on the loading and unloading chamber 200, or sends a control signal to the driver 121 when the oxygen content in the loading and unloading chamber 200 is less than a preset value, at which time the driver 121 drives the closing plate 122 to descend to close the communication port 114, so that the first gas collection chamber 111 and the second gas collection chamber 112 are isolated, thereby realizing that only the second pressure control assembly 3 performs exhaust on the loading and unloading chamber 200. Further, the preset value can be 10 ppm, but the embodiment of the present application does not limit the specific value of the preset value, and a person skilled in the art can adjust and set it according to different types of processes. The above design makes the embodiment of the present application realize automatic control according to the oxygen content in the loading and unloading chamber 200, which not only can realize rapid reduction of the oxygen content in the loading and unloading chamber 200, but also can improve the automation level of the embodiment of the present application.

[0039] It should be noted that the embodiment of the present application does not limit the specific type of the controller, for example, the controller can be a host computer of the semiconductor heat treatment equipment, that is, the oxygen sensor and the switching assembly 12 are both controlled by the host computer. Therefore, the embodiment of the present application is not limited thereto, and a person skilled in the art can adjust and set it according to the actual situation.

[0040] In an embodiment of the present application, as shown in Figure 1 and Figure 2As shown, the gas collecting mechanism 1 also includes a pressure sensor 13, which is arranged on one side of the gas collecting box 11 and is connected to the second gas collecting chamber 112 for detecting the pressure of the gas collecting box 11; the controller is also used to control the exhaust flow of the first pressure control component 2 and / or the second pressure control component 3 according to the pressure, so that the pressure in the gas collecting box 11 is maintained within a preset pressure range.

[0041] like Figure 1 and Figure 2 As shown, the left and right sides of the gas collecting box 11 are provided with a detection port 116 and a second connection port (not shown in the figure), wherein the detection port 116 on the left is used to connect the pressure sensor 13, and the second connection port on the right is used to connect the second pressure control component 3, but the embodiment of the present application does not limit the positions of the detection port 116 and the second connection port, for example, the positions of the two can be interchanged. Specifically, the pressure sensor 13 can be connected to the detection port 116 through a straight connecting pipe to detect the pressure in the second gas collecting chamber 112, that is, to detect the pressure in the gas collecting box. Since the second gas collecting chamber 112 is connected to the loading and unloading chamber 200, the pressure sensor 13 can detect the pressure in the loading and unloading chamber 200. The controller can compare the pressure with the preset pressure range, and control the exhaust flow of the first pressure control component 2 and / or the second pressure control component 3 according to the comparison result, that is, control the specific values ​​of the first flow and the second flow, so that the pressure in the gas collecting box 11 is maintained within the preset pressure range, thereby keeping the pressure in the loading and unloading chamber 200 within the preset pressure range, which can be set by the controller, for example. By adopting the above-mentioned design, the embodiment of the present application can realize the effect of automatic voltage control and the purpose of precise voltage regulation, thereby greatly improving the stability of semiconductor heat treatment equipment and further improving the production capacity of semiconductor heat treatment equipment.

[0042] It should be noted that the embodiment of the present application does not limit the specific location of the pressure sensor 13. For example, the pressure sensor 13 can also be set on the loading and unloading chamber 200. Therefore, the embodiment of the present application is not limited to this, and those skilled in the art can adjust the setting according to actual conditions.

[0043] In one embodiment of the present application, Figure 1 and Figure 2 As shown, the first pressure control component 2 and the second pressure control component 3 both include an exhaust pipe 41 and a valve structure 42. One end of the exhaust pipe 41 is connected to the air collecting box 11, and the other end is connected to the negative pressure exhaust pipeline (not shown in the figure) through the valve structure 42. The valve structure 42 is used to control the opening and closing degree of the exhaust pipe 41 to adjust the exhaust flow rate.

[0044] like Figure 1 and Figure 2As shown, the exhaust pipe 41 can be a circular tubular structure made of heat-resistant material, and the diameter of the exhaust pipe 41 of the first pressure control component 2 is larger than the diameter of the exhaust pipe 41 of the second pressure control component 3, but the embodiment of the present application does not limit the specific ratio of the two, and those skilled in the art can adjust the settings according to actual conditions. Furthermore, the exhaust pipe 41 of the first pressure control component 2 can be connected to the gas collecting box 11 through a straight pipe 51, and the exhaust pipe 41 and the straight pipe 51 can be fixedly connected by a clamp, and the straight pipe 51 and the gas collecting box 11 can be connected by welding or bolts, but the embodiment of the present application does not limit the connection method of each component. The exhaust pipe 41 of the second pressure control component 3 can be connected to the side of the gas collecting box 11 through a right-angle pipe 52, so that the exhaust pipe 41 can be extended in the vertical direction, thereby saving space. The exhaust pipe 41 and the right-angle pipe 52 can be fixedly connected by a clamp, and the right-angle pipe 52 and the gas collecting box 11 can be connected by welding or bolts, but the embodiment of the present application does not limit the connection method of each component. Two valve structures 42 can be respectively installed at the top of the two exhaust pipes 41 and connected to the negative pressure exhaust pipeline of the factory. The valve structures 42 can respectively control the opening and closing degree of the two exhaust pipes 41, thereby adjusting the exhaust flow of the exhaust pipes 41. The above design makes the embodiment of the present application simple in structure, thereby improving stability and reducing application and maintenance costs.

[0045] It should be noted that the embodiments of the present application do not limit the specific implementations of the first pressure-control assembly 2 and the second pressure-control assembly 3. For example, the exhaust pipe 41 and the valve structure 42 can be integrally formed. Therefore, the embodiments of the present application are not limited to this, and those skilled in the art can adjust the configuration according to actual circumstances.

[0046] In one embodiment of the present application, Figures 1 to 3 As shown, the valve structure 42 includes a valve tube 421, a valve plate 422 and a driving part 423. The valve plate 422 is arranged in the valve tube 421 and can be flipped with the radial direction of the valve tube 421 as the axis to adjust the opening and closing degree of the valve tube 421; the driving part 423 is arranged on the outside of the valve tube 421, and is used to drive the valve plate 422 to flip.

[0047] like Figures 1 to 3As shown, the valve tube 421 can be a circular tubular structure made of a heat-resistant material, and the diameter of the valve tube 421 is set to the exhaust pipe 41 of the corresponding first pressure control component 2 or the second pressure control component 3. The top of the valve tube 421 can be connected to the negative pressure exhaust pipeline through a flange structure, and the bottom end is fixedly connected to the exhaust pipe 41 by a clamp. The valve plate 422 can be a circular plate structure made of metal material, and the outer peripheral edge is arranged to fit the inner peripheral wall of the valve tube 421. The valve plate 422 can be turned around the radial direction of the valve tube 421 as the axis. Specifically, the valve plate 422 can be set in the valve tube 421 through a pivot shaft, and one end of the pivot shaft is exposed on the outer periphery of the valve tube 421. The driving part 423 can be a servo motor and is arranged on the outer periphery of the valve tube 421, which is used to drive the valve plate 422 to turn through the pivot shaft to adjust the opening and closing degree of the valve tube 421, thereby adjusting the opening and closing degree of the exhaust pipe 41. Furthermore, the drive unit 423 can be electrically connected to the controller to drive the valve plate 422 to flip to a preset angle under the control of the controller, thereby further improving the automation level of the embodiment of the present application. The above design not only realizes automated pressure control, but also further improves the accuracy of pressure control.

[0048] It should be noted that the embodiments of the present application do not limit the specific implementation of the valve structure 42. For example, the valve structure 42 may also adopt other types of electrically controlled valves or pneumatic valves. Therefore, the embodiments of the present application are not limited to this, and those skilled in the art may adjust the settings according to actual conditions.

[0049] Based on the same inventive concept, an embodiment of the present application provides a semiconductor heat treatment equipment, including: a loading and unloading chamber, a process chamber and an exhaust device as provided in the above embodiments, the process chamber is connected to the loading and unloading chamber, and the exhaust device is arranged on the loading and unloading chamber.

[0050] By applying the embodiments of the present application, at least the following beneficial effects can be achieved:

[0051] The embodiment of the present application controls the first pressure control component and / or the second pressure control component to exhaust the loading and unloading chamber through the gas collecting mechanism, so that the embodiment of the present application can control the first pressure control component or the second pressure control component to exhaust the loading and unloading chamber separately according to needs, and control the first pressure control component and the second pressure control component to exhaust the loading and unloading chamber at the same time, thereby realizing the use of multiple modes to exhaust the loading and unloading chamber, which can not only quickly reduce the oxygen content in the loading and unloading chamber, and control the pressure of the loading and unloading chamber, but also reduce unnecessary energy waste, thereby improving the market competitiveness of semiconductor heat treatment equipment.

[0052] It will be understood that the above embodiments are merely exemplary embodiments for illustrating the principles of the present invention, and the present invention is not limited thereto. Those skilled in the art will appreciate that various modifications and improvements can be made without departing from the spirit and substance of the present invention, and such modifications and improvements are also considered to be within the scope of protection of the present invention.

[0053] In the description of this application, it should be understood that the terms "center", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0054] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the technical features being referred to. Thus, a feature specified as "first" or "second" may explicitly or implicitly include one or more of such features. In the description of the present invention, unless otherwise specified, "plurality" means two or more.

[0055] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood broadly. For example, they may refer to fixed connections, detachable connections, or integral connections; they may refer to direct connections, indirect connections through an intermediate medium, or internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on the specific circumstances.

[0056] The above description is only a partial implementation method of the present application. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present application. These improvements and modifications should also be regarded as the scope of protection of the present application.

Claims

1. An exhaust device, provided on a loading and unloading chamber of a semiconductor heat treatment device, for controlling the pressure and oxygen content in the loading and unloading chamber by exhaust, wherein the loading and unloading chamber is used for wafer transportation, characterized in that: include: Gas collecting mechanism, first pressure control component and second pressure control component; The gas collecting mechanism is provided on the loading and unloading chamber and is in communication with the inner space of the loading and unloading chamber, and is used to collect the gas in the loading and unloading chamber; The first pressure-controlling assembly and the second pressure-controlling assembly are both connected to the gas collecting mechanism, the first pressure-controlling assembly is used to exhaust the gas collecting mechanism at a first flow rate, and the second pressure-controlling assembly is used to exhaust the gas collecting mechanism at a second flow rate, and the first flow rate is greater than the second flow rate; The gas collecting mechanism is further used to switch exhaust by the first pressure control component and / or the second pressure control component according to the oxygen content in the loading and unloading chamber.

2. The exhaust device according to claim 1, wherein: The gas collecting mechanism includes a gas collecting box and a switching assembly. The gas collecting box includes a first gas collecting chamber and a second gas collecting chamber that are interconnected, and the second gas collecting chamber is connected to the loading and unloading chamber. The first pressure control assembly is connected to the first gas collecting chamber, and the second pressure control assembly is connected to the second gas collecting chamber. The switching assembly is used to selectively connect or isolate the first gas collecting chamber and the second gas collecting chamber.

3. The exhaust device according to claim 2, wherein: The gas collecting box has a partition plate for separating the first gas collecting chamber and the second gas collecting chamber in the gas collecting box. The partition plate is provided on a connecting port for connecting the first gas collecting chamber and the second gas collecting chamber. The switching component is used to selectively close or open the connecting port.

4. The exhaust device according to claim 3, characterized in that The switching assembly includes a driver and a closing plate. The driver is arranged at the top of the air collecting box and partially extends into the first air collecting cavity. The closing plate is arranged at the bottom of the driver and is used to perform a lifting action under the drive of the driver to selectively close or open the connecting port.

5. The exhaust device according to claim 2, wherein: The gas collecting mechanism further includes an oxygen sensor, which is disposed in the loading and unloading chamber and is used to detect the oxygen content in the loading and unloading chamber.

6. The exhaust device according to claim 5, wherein: The exhaust device also includes a controller, which is electrically connected to the oxygen sensor and the switching component, and is used to control the switching component to connect the first gas collecting chamber and the second gas collecting chamber when the oxygen content in the loading and unloading chamber is greater than a preset value, and control the first pressure control component and the second pressure control component to exhaust at the same time; and when the oxygen content in the loading and unloading chamber is less than the preset value, control the switching component to isolate the first gas collecting chamber and the second gas collecting chamber, and control the second pressure control component to exhaust.

7. The exhaust device according to claim 6, wherein: The gas collecting mechanism further includes a pressure sensor, which is arranged on one side of the gas collecting box and is connected to the second gas collecting cavity, and is used to detect the pressure in the gas collecting box; The controller is further configured to control the exhaust flow of the first pressure control component and / or the second pressure control component according to the pressure, so as to keep the pressure in the air collecting box within a preset pressure range.

8. The exhaust device according to claim 7, wherein: The first pressure control component and the second pressure control component both include an exhaust pipe and a valve structure. One end of the exhaust pipe is connected to the air collecting box, and the other end is connected to the negative pressure exhaust pipeline through the valve structure. The valve structure is used to control the opening and closing degree of the exhaust pipe to adjust the exhaust flow rate.

9. The exhaust device according to claim 8, wherein: The valve structure includes a valve tube, a valve plate and a driving part. The valve plate is arranged in the valve tube and can be flipped with the radial direction of the valve tube as the axis to adjust the opening and closing degree of the valve tube; the driving part is arranged on the outside of the valve tube and is used to drive the valve plate to flip.

10. A semiconductor heat treatment device, characterized in that: It comprises a loading and unloading chamber, a process chamber and an exhaust device as described in any one of claims 1 to 9, wherein the loading and unloading chamber is used for wafer transmission, the process chamber is connected to the loading and unloading chamber, and the exhaust device is arranged on the loading and unloading chamber.

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