Integrated embedded microchannel cooling system and method for microsystems

Abstract

The application discloses a microsystem integrated embedded microchannel heat dissipation system and method, which comprises a packaging substrate, a packaging shell connected to the packaging substrate, a chip and a silicon adapter plate arranged in the inner cavity of the packaging shell, pin and packaging substrate circuit interconnection of the silicon adapter plate, a plurality of micro bumps connected between the silicon adapter plate and the chip, no contact between adjacent micro bumps and between the micro bumps and the inner wall of the packaging shell, the interval between the micro bumps and the inner wall of the packaging shell forming an embedded microchannel, one side of the embedded microchannel being connected with a liquid supply pipe, the other side of the embedded microchannel being connected with a liquid return pipe, the liquid supply pipe being used for outputting cooling working medium, and the liquid return pipe being used for receiving the cooling working medium after heat exchange. The whole liquid cooling heat dissipation system of the application can guarantee high-efficiency heat dissipation, and realizes light weight and miniaturization of the heat dissipation system.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of chip heat dissipation, and particularly relates to an integrated embedded micro-channel heat dissipation system and method of a microsystem. BACKGROUND

[0002] High-performance chips are important cornerstones in high-tech fields such as industrial control, big data, information communication, national defense and military industry, and aerospace, and have a profound impact on the transformation and optimization of China's industrial structure. At present, China's chip industry development still faces many difficulties. In addition to chip design and manufacturing technology, heat management technology has become a key bottleneck restricting the development of related industries in China. In recent decades, due to the continuous updating of microelectronic technology, the number of integrated circuits per unit area of chips has continued to increase. While improving performance, the heat per unit area has also increased, which can cause the chip temperature to be too high to affect the service life and operating efficiency of the chip. According to the prediction made by some institutions, the average heat flux density generated by the next generation of chips under normal working conditions will reach 500W / cm 2 , and the local hot spot heat flux density will reach 1000W / cm 2 , which has exceeded the limit of traditional heat management technology.

[0003] Microsystems based on three-dimensional integrated technology use TSV technology to realize high-density packaging of chip stacking through vertical interconnection, and are increasingly widely used in the microelectronics industry. However, with the increase of internal power density of highly integrated microsystem packaging and the increase of the number of stacked chips, a series of heat management problems have been brought. In view of the heat dissipation demand of microsystem chips under high heat flux density, the embedded micro-channel liquid cooling heat dissipation system is an effective solution. Such a system usually embeds a microscale channel heat exchanger above the chip, and applies external force such as bayonet, screw, etc. to press the heat absorption surface of the heat exchanger tightly on the heat generation surface of the chip, and fills insulating and heat-conducting materials between the contact surface of the chip and the heat exchanger to reduce the thermal resistance. When the chip is working, the heat generated is conducted to the microscale channel heat exchanger, and the liquid cooling medium is driven into the microscale channel heat exchanger by the liquid pump to absorb heat, and then flows into the heat sink to be cooled, so as to maintain the temperature of the chip, ensure the normal work of the chip and reduce the thermal stress concentration.

[0004] The main components of the existing embedded micro-channel liquid cooling heat dissipation system include a liquid cooling pump, a micro-channel, a heat sink and a liquid supply / return pipeline. In order to ensure good liquid cooling heat dissipation efficiency, the heating end and the condensing end are usually separated, so that the liquid cooling pump, the micro-channel heat exchanger and the heat sink are far away from each other, which increases the complexity of the system, and there is a problem of large system mass and volume. In addition, the product needs to be provided with an additional liquid cooling pump in the external system, which also increases the limitations of product application. Therefore, while ensuring high-efficiency heat dissipation, it is also necessary to optimize the structure of the heat dissipation system, reduce the number of components and shorten the pipeline length, so as to realize the lightweight and miniaturization of the heat dissipation system. SUMMARY

[0005] In order to solve the problems in the prior art, the present application provides a micro-system integrated embedded micro-channel heat dissipation system and method, which solves the problems of too many components, complex pipeline, large system mass and volume and product application limitations of the existing micro-channel liquid cooling heat dissipation system.

[0006] In order to achieve the above-mentioned purpose, the present application provides the following technical scheme: a micro-system integrated embedded micro-channel heat dissipation system, comprising a packaging substrate, a packaging shell connected to the packaging substrate, a chip and a silicon adapter plate arranged in the inner cavity of the packaging shell, the pins of the silicon adapter plate and the circuit of the packaging substrate being interconnected, a plurality of micro-bumps being connected between the silicon adapter plate and the chip, adjacent micro-bumps and the inner wall of the packaging shell not being in contact, a closed space being formed between the micro-bumps and the inner wall of the packaging shell through a silicon wall surface, the closed space being an embedded micro-channel, a liquid supply pipe being connected to one side of the embedded micro-channel, and a liquid return pipe being connected to the other side of the embedded micro-channel, the liquid supply pipe being used for outputting cooling working medium, and the liquid return pipe being used for receiving heat-exchanged cooling working medium.

[0007] Further, the micro-bumps are located at the bottom of the chip, a micro-pump is arranged at the top of the chip, the micro-pump is connected to the wall surface of the packaging shell, the cooling working medium outlet of the micro-pump is connected to the inlet of the liquid supply pipe, the outlet of the liquid supply pipe is connected to one side of the embedded micro-channel, and the return inlet of the micro-pump is connected to the liquid return pipe.

[0008] Further, the micro-pump is also connected to an external heat sink, and the external heat sink is used for cooling the cooling working medium in the micro-pump.

[0009] Further, the top of the chip is also provided with a buffer pad, the buffer pad is located between the chip and the micro-pump, and the micro-pump is also fixedly connected with the buffer pad.

[0010] Further, the buffer pad is a silica gel pad.

[0011] Further, the chip and the silicon adapter plate are electrically interconnected through a TSV through hole.

[0012] Further, the pin of the silicon adapter plate is connected with a first solder ball, and the silicon adapter plate is electrically connected with the package substrate through the first solder ball.

[0013] Further, the silicon adapter plate and the package substrate are filled with a filling glue.

[0014] Further, the micro bump adopts a second solder ball, and the second solder ball is connected with the chip and the silicon adapter plate by soldering.

[0015] The application also provides a heat dissipation method of an integrated embedded micro-channel heat dissipation system of a micro system, which comprises the following steps: a liquid supply pipe inputs cooling working medium into the embedded micro-channel; heat generated by the chip during operation is directly conducted to the cooling working medium through the bottom of the chip and conducted to the cooling working medium through the micro bump; the cooling working medium is input into a liquid return pipe after convection heat exchange; and the above process is repeated to realize the heat dissipation process of the micro-channel heat dissipation system.

[0016] Compared with the prior art, the application has at least the following beneficial effects:

[0017] The application also provides an integrated embedded micro-channel heat dissipation system of a micro system. The main components of the existing embedded micro-channel liquid cooling heat dissipation system include a liquid cooling pump, a micro-channel, a heat sink and liquid supply / return pipes, and there are problems of complex structure, large system mass and large system volume. In the application, the liquid supply pipe and the liquid return pipe and the chip and the silicon adapter plate are integrated and designed to form a liquid cooling channel, thereby reducing the number of system components and shortening the length of the liquid cooling pipe. The chip and the silicon adapter plate are interconnected through the micro bump, the space between the micro bumps is used to form an embedded micro-channel, and a liquid cooling loop is formed through the liquid supply pipe and the liquid return pipe, so as to finally form an embedded micro-channel liquid cooling heat dissipation system. Compared with the traditional design, the application does not need to additionally install a micro-channel device. Compared with the traditional design, the entire liquid cooling heat dissipation system of the application can ensure high-efficiency heat dissipation while reducing the overall mass and volume of the system, so as to realize light weight and miniaturization of the heat dissipation system. In addition, the application does not need to additionally install a liquid cooling pump, so that the application range of the embedded micro-channel heat dissipation system in micro system engineering applications is expanded.

[0018] Further, the micro pump simultaneously assumes the functions of the liquid cooling pump and the heat dissipation cover plate, thereby reducing the number of system components and shortening the length of the liquid cooling pipe. Moreover, the presence of the micro pump enables the application to realize high-efficiency heat dissipation of high-power chips in the micro system without additionally installing a liquid cooling pump, so as to reduce the overall mass and volume of the system and realize light weight and miniaturization of the heat dissipation system.

[0019] Further, the cooling working medium flowing back into the micro pump is subjected to convection heat exchange with an external heat sink used in a board-level application of the micro system, so as to dissipate the absorbed heat into the system heat dissipation environment to realize cooling and complete a working cycle.

[0020] Further, the buffer pad has insulation, heat insulation and damping functions, the micro pump is fixed on the buffer pad, the buffer pad can reduce heat conduction from the chip to the micro pump, and buffers vibration of the micro pump during operation to protect the chip.

[0021] Further, the silicon adapter plate is connected through the first solder ball and the filling glue and the packaging substrate, and the stability and reliability of the whole micro-channel heat dissipation system are increased. BRIEF DESCRIPTION OF DRAWINGS

[0022] Figure 1 The figure is a structural schematic diagram of the integrated embedded micro-channel heat dissipation system in the application.

[0023] Figure 2 The figure is a heat dissipation path diagram of the integrated embedded micro-channel heat dissipation system.

[0024] In the drawings: 1 - packaging substrate, 2 - embedded micro-channel, 3 - first solder ball, 4 - silicon adapter plate, 5 - chip, 6 - buffer pad, 7 - liquid return pipe, 8 - micro pump, 9 - liquid supply pipe, 10 - micro bump, 11 - packaging shell, 12 - filling glue. DETAILED DESCRIPTION

[0025] The application will be further described below in combination with the drawings and specific embodiments.

[0026] As shown in Figure 1 and Figure 2 , the application provides an integrated embedded micro-channel heat dissipation system of a micro system, a micro pump 8 and a chip 5 are integrated and designed as a liquid cooling channel, the micro pump 8 simultaneously undertakes the functions of a liquid cooling pump and a heat dissipation cover plate, thereby reducing the number of components of the system and shortening the length of the liquid cooling pipeline. The chip 5 and the silicon adapter plate 4 are interconnected through micro bumps 10, a closed space is formed between the micro bumps 10 and the inner wall of the packaging shell through a silicon wall surface, the closed space is an embedded micro-channel, and a liquid cooling loop is formed through a liquid supply pipe 9 and a liquid return pipe 7, finally forming a liquid cooling heat dissipation system of the embedded micro-channel 2. Compared with the traditional design, the application does not need to additionally install a liquid cooling pump, the whole liquid cooling heat dissipation system reduces the overall mass and volume of the system while ensuring high-efficiency heat dissipation, and realizes lightweight and miniaturization of the heat dissipation system.

[0027] In the embodiment, the bottom layer of the application is the packaging substrate 1 of the micro system, the pins of the silicon adapter plate 4 are connected with the circuit on the packaging substrate 1 through the first solder ball 3 and fixed on the packaging substrate 1, the electrical interconnection between the chip 5 and the silicon adapter plate 4 is realized through the TSV through hole, and the chip 5 and the silicon adapter plate 4 are interconnected through the micro bump 10. The micro bump 10 is provided with a plurality of micro bumps 10, and the adjacent micro bumps 10 and the inner wall of the packaging shell 11 are not in contact. The interval between the micro bump 10 and the inner wall of the packaging shell 11 forms an embedded micro channel 2, and a liquid cooling loop is formed through the liquid supply pipe 9 and the liquid return pipe 7. One side of the embedded micro channel 2 is connected with the liquid supply pipe 9, the other side of the embedded micro channel 2 is connected with the liquid return pipe 7, the liquid supply pipe 9 is used for outputting the cooling medium, and the liquid return pipe 7 is used for receiving the cooling medium after heat exchange. Finally, an embedded micro channel liquid cooling heat dissipation system is formed. The heat generated by the chip 5 during work is conducted to the embedded micro channel 2 along the bottom of the chip and the micro bump 10, and the cooling medium flowing in the embedded micro channel 2 absorbs heat through convection heat exchange of the cooling medium, so as to realize the cooling of the chip 5 in the micro system. Preferably, the micro bump 10 adopts the second solder ball.

[0028] Preferably, the silicon adapter plate and the packaging substrate are also filled with filling glue.

[0029] Specifically, the micro system module as a whole adopts the packaging shell 11 for protection, the chip 5 and the silicon adapter plate 4 are located in the packaging shell 11, the top of the chip 5 is also provided with a buffer pad 6 with the functions of insulation, heat insulation and vibration reduction, and the micro pump 8 is fixed on the buffer pad 6. Preferably, the buffer pad 6 adopts a silica gel pad, which can reduce the heat conduction of the chip 5 to the micro pump 8 and buffer the vibration of the micro pump 8 during work to protect the chip 5. The micro pump 8 also has the function of the packaging cover plate, and is fixed as a whole with the packaging shell 11. The cooling medium outlet of the micro pump 8 is connected with the inlet of the liquid supply pipe 9, the outlet of the liquid supply pipe 9 is connected with one side of the embedded micro channel 2, the return inlet of the micro pump 8 is connected with the liquid return pipe 7, and the micro pump 8 is also connected with an external radiator for cooling the cooling medium in the micro pump 8.

[0030] In another embodiment of the application, a heat dissipation method of the integrated embedded micro channel heat dissipation system of the micro system is also provided, which comprises the following steps: the liquid supply pipe 9 inputs the cooling medium to the embedded micro channel 2, the heat generated by the chip 5 during work is directly conducted to the cooling medium through the bottom of the chip 5 and the micro bump 10, the cooling medium enters the liquid return pipe 7 after convection heat exchange, and the above process is repeated to realize the heat dissipation process of the micro channel heat dissipation system.

[0031] Specifically, the internal flow channel of the micropump 8 is connected with the embedded microchannel 2 at the bottom of the chip 5 through the liquid supply pipe 9 and the liquid return pipe 7 to form a closed and sealed circulation loop. When the heat dissipation system is running, the micropump 8 outputs liquid cooling medium under electric drive, flows into the embedded microchannel 2 through the liquid supply pipe, absorbs the heat generated by the operation of the chip 5, and the cooling medium after absorbing heat and rising in temperature flows back to the micropump 8 through the liquid return pipe 7. The working medium flowing back into the micropump 8 exchanges heat with the external heat sink used in the microsystem board level application by convection, dissipates the absorbed heat into the system heat dissipation environment to realize cooling, and completes the working cycle.

[0032] Finally, it should be noted that: the above-described embodiments are only specific implementations of the present application, which are used to illustrate the technical solutions of the present application, but not to limit it, the protection scope of the present application is not limited to this, although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand: any person skilled in the art within the technical range disclosed by the present application, it can still modify or easily think of changes to the technical solutions recorded in the foregoing embodiments, or make equivalent replacement to part of the technical features; and these modifications, changes or replacements do not make the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application, and should be covered in the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope described in the claims.

Claims

1. An integrated embedded microchannel cooling system for microsystems, comprising: The application relates to a micro-channel heat dissipation system, which comprises a packaging substrate (1), a packaging shell (11) connected to the packaging substrate (1), a chip (5) and a silicon adapter plate (4) arranged in the inner cavity of the packaging shell (11), pin leads of the silicon adapter plate (4) and the circuit of the packaging substrate (1) are electrically interconnected, a plurality of micro-bumps (10) are arranged between the silicon adapter plate (4) and the chip (5), adjacent micro-bumps (10) and the inner wall of the packaging shell (11) are not in contact, a closed space is formed between the micro-bumps (10) and the silicon adapter plate (4) through the silicon wall of the silicon adapter plate (4), the closed space is an embedded micro-channel (2), one side of the embedded micro-channel (2) is connected with a liquid supply pipe (9), the other side of the embedded micro-channel (2) is connected with a liquid return pipe (7), the liquid supply pipe (9) is used for outputting cooling working medium, and the liquid return pipe (7) is used for receiving the cooling working medium after heat exchange. The micro-bumps (10) are arranged at the bottom of the chip (5), a micropump (8) is arranged at the top of the chip (5), the micropump (8) is connected to the inner wall of the packaging shell (11), the cooling working medium outlet of the micropump (8) is connected with the inlet of the liquid supply pipe (9), the outlet of the liquid supply pipe (9) is connected to one side of the embedded micro-channel (2), and the return inlet of the micropump (8) is connected with the liquid return pipe (7). The micropump (8) is further connected with an external radiator, and the external radiator is used for cooling the cooling working medium in the micropump (8). The chip (5) and the silicon adapter plate (4) are electrically interconnected through TSV through holes. First solder balls (3) are arranged on the pin leads of the silicon adapter plate (4), and the silicon adapter plate (4) is electrically interconnected with the packaging substrate (1) through the first solder balls (3). The micro-bumps (10) adopt second solder balls, and the second solder balls, the chip and the silicon adapter plate (4) are all connected through welding.

2. The integrated embedded microchannel cooling system of a microsystem of claim 1, wherein, A buffer pad (6) is further arranged at the top of the chip (5), the buffer pad (6) is arranged between the chip (5) and the micropump (8), and the micropump (8) is further fixedly connected with the buffer pad (6).

3. The integrated embedded microchannel cooling system of a microsystem of claim 2, wherein, The buffer pad (6) adopts a silica gel pad.

4. The integrated embedded microchannel cooling system of claim 1, wherein, The silicon adapter plate (4) and the packaging substrate (1) are further filled with filling glue (12).

5. The method of claim 1-4, wherein, The application further discloses a micro-channel heat dissipation system. The liquid supply pipe (9) inputs cooling working medium into the embedded micro-channel (2), the heat generated by the chip (5) during work is directly conducted to the cooling working medium through the bottom of the chip (5) and the cooling working medium, and the cooling working medium is conducted to the liquid return pipe (7) after heat exchange, the above process is circular, and the heat dissipation process of the micro-channel heat dissipation system is realized.

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