VR device heat dissipation device, VR device and control method

Abstract

The present invention discloses a heat dissipation device for VR equipment, which includes a pneumatic component and a heat dissipation component, wherein the pneumatic component is arranged outside the VR equipment housing, and the pneumatic component can operably introduce liquid cooling medium or air into the VR equipment housing; the heat dissipation component is arranged in the VR equipment housing, and the heat dissipation component includes: at least one heat conduction element for transferring heat to the outside; the heat dissipation component can be operably fluid-connected to the pneumatic component and configured to spray liquid cooling medium or air on the area where the heat conduction element is located. Also disclosed is a VR device and a control method for a heat dissipation device for VR equipment. The heat dissipation device for VR equipment provided by the present invention can use a gas-liquid two-phase cooling medium and adopt the principle of fluid dynamics to dissipate the heat of the VR equipment. At the same time, it can work in active heat dissipation or passive heat dissipation mode according to the actual use status, covering the heat dissipation requirements of the VR equipment in all operating states.

Description

Technical Field

[0001] The present invention belongs to the technical field of virtual reality equipment, and in particular relates to a heat dissipation device for VR equipment, a VR equipment, and a control method for the heat dissipation device for VR equipment. Background Art

[0002] There are two main heat dissipation methods commonly used in VR (Virtual Reality) devices. The first is active heat dissipation, which uses fans, heat sink fins and other parts to quickly dissipate the heat generated by electronic components on the motherboard through thermal convection to avoid heat accumulation and high temperature. The second is passive heat dissipation, which uses metal brackets, graphite sheets and the product's own shell and other parts to remove heat from VR products through thermal conduction.

[0003] As consumers' requirements for VR functions, image quality, and running content increase, the heat generated by electronic devices during use has doubled, and traditional heat dissipation methods can no longer meet the heat dissipation needs. When working in a high temperature environment, VR devices are prone to a series of problems such as frame drops, freezes, and reduced wearing comfort, which affects the user experience of VR devices. Summary of the invention

[0004] In view of the problem that traditional heat dissipation methods can no longer meet the heat dissipation requirements of VR equipment, a first aspect of the present invention designs and provides a heat dissipation device for VR equipment.

[0005] The heat dissipation device of the VR device includes: a pneumatic component and a heat dissipation component, wherein the pneumatic component is arranged on the outside of the VR device shell, and the pneumatic component can be operated to introduce liquid cooling medium or air into the VR device shell; the heat dissipation component is arranged in the VR device shell, and the heat dissipation component includes: at least one heat conduction element for transferring heat to the outside; the heat dissipation component can be operably fluidically connected to the pneumatic component and is configured to spray liquid cooling medium or air on the area where the heat conduction element is located.

[0006] From the perspective of structural design, the heat dissipation component includes a main shell, a sprayer and a bracket: a plurality of heat dissipation fins are arranged in the main shell, and at least one slot is formed on the main shell, and the slot is configured to accommodate a VR device chip; the sprayer is arranged close to the heat dissipation fins, and the sprayer is operably fluidically connected to the pneumatic component, and the sprayer is configured to atomize the liquid cooling medium and spray the atomized cooling medium on the area where the heat dissipation fins are located, or is configured to spray the air introduced by the pneumatic component on the area where the heat dissipation fins are located; the main shell is fixedly connected to the bracket, and a cooling medium attachment bed is arranged in the bracket.

[0007] In order to provide good support and positioning effects, the bracket has an internal cavity, and the cooling medium attachment bed part is arranged in the internal cavity; an air outlet is opened at the end of the bracket, and the air outlet protrudes from the bracket and is embedded in the VR device shell.

[0008] To achieve a better spraying effect, the sprayer includes a liquid inlet pipe, a column section, a cone section and a spray port; wherein the liquid inlet pipe is located outside the sprayer and is spirally wound, the column section is located downstream of the liquid inlet pipe and the fluid is connected to the liquid inlet pipe, the cone section is located downstream of the column section and the fluid is connected to the column section, and the spray port is located downstream of the cone section and the fluid is connected to the cone section; the cross-sectional radius of the cone section gradually decreases along the flow direction of the cooling medium; the cross-sectional radius of the spray port gradually increases along the flow direction of the cooling medium.

[0009] In order to reduce the flow noise of the cooling medium, the sprayer also includes a guide arc, which is located between the vertebral body segment and the spray port, and the guide arc smoothly transitions to the inner wall of the vertebral body segment and the spray port respectively.

[0010] In order to achieve a larger spraying area and improve the heat dissipation efficiency at the same time, the heat dissipation component also includes: a cover unit, on which a plurality of sprayers distributed in a matrix are arranged.

[0011] In the design of the pneumatic component, the pneumatic component preferably includes a liquid storage tank and an air pump, wherein the liquid storage tank stores liquid cooling medium, a first flow path is formed between the air pump and the heat dissipation component, a first valve element is provided on the first flow path, and the first valve element is operably configured to be unidirectional from the outlet of the air pump to the heat dissipation component; a second flow path is formed between the air pump, the liquid storage tank and the heat dissipation component, a second valve element is provided on the second flow path, the second valve element is provided between the liquid storage tank and the heat dissipation component, and the second valve element is operably configured to be unidirectional from the outlet of the liquid storage tank to the heat dissipation component; the pneumatic component and the heat dissipation component are operably fluidically connected via a pneumatic quick connector.

[0012] In order to improve the heat dissipation efficiency in the active heat dissipation mode, the first valve element and the second valve element are switched on alternately.

[0013] A second aspect of the present invention provides a VR device, the VR device includes a VR device heat dissipation device; the VR device heat dissipation device includes: a pneumatic component and a heat dissipation component, wherein the pneumatic component is arranged on the outside of the VR device housing, and the pneumatic component can be operated to introduce cooling medium or air into the VR device housing; the heat dissipation component is arranged in the VR device housing, and the heat dissipation component includes: at least one heat conduction element for transferring heat to the outside; the heat dissipation component is operably fluidically connected to the pneumatic component and is configured to spray cooling medium or air on the area where the heat conduction element is located.

[0014] A third aspect of the present invention provides a method for controlling a heat dissipation device of a VR device, comprising the following steps:

[0015] Sampling the real-time temperature of the set area in the VR device shell;

[0016] Compare the real-time temperature with the set temperature;

[0017] If the real-time temperature is higher than the set temperature, the pneumatic component and the heat dissipation component are configured to be fluidically connected, the liquid cooling medium is introduced into the VR device housing, and the liquid cooling medium or air is sprayed on the area where the heat conduction element is located;

[0018] If the real-time temperature is lower than the set temperature, the pneumatic component and the heat dissipation component are separated, and the heat conduction element transfers heat to the outside.

[0019] Compared with the prior art, the advantages and positive effects of the present invention are: through the combination of pneumatic components and heat dissipation components, when operating at high power, the gas-liquid two-phase mixed cooling medium can be sprayed on the area where the heat conduction element is located, and the heat conduction element and the cooling medium are used to achieve heat dissipation, thereby improving the heat dissipation efficiency. When operating at low power, the heat conduction element is the main factor in transferring heat to the outside, covering the heat dissipation requirements of the VR device in all operating states.

[0020] After reading the specific embodiments of the present invention in conjunction with the accompanying drawings, other features and advantages of the present invention will become more clear. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0022] Figure 1 This is a schematic diagram of the structure of the VR device heat dissipation device provided by the present invention in a use state;

[0023] Figure 2 For Figure 1 A schematic diagram of a portion of the structure of a heat dissipation component in a heat dissipation device for a VR device is shown;

[0024] Figure 3 For Figure 1 The schematic diagram of the structure of the cooling medium attachment bed in the heat dissipation device of the VR equipment shown;

[0025] Figure 4 For Figure 1 A schematic diagram of the structure of a sprayer in a heat dissipation device of a VR device is shown;

[0026] Figure 5 for Figure 2 A local enlarged schematic diagram of the middle A;

[0027] Figure 6 This is a flow chart of a method for controlling a heat dissipation device of a VR device provided by the present invention. DETAILED DESCRIPTION

[0028] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments.

[0029] It should be noted that in the description of the present invention, the terms "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" and the like indicating directions or positional relationships are based on the directions or positional relationships shown in the drawings, which are only for the convenience of description, and do not indicate or imply that the device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0030] In view of the problem that traditional heat dissipation methods cannot meet the heat dissipation requirements of VR equipment, a newly designed VR equipment heat dissipation device is proposed. Figure 1 As shown. This VR device heat dissipation device provides a gas-liquid dual-phase VR device heat dissipation method, which can meet the heat dissipation requirements of VR devices under various operating conditions by switching different heat dissipation methods: when running at high power, active heat dissipation plays a leading role, and a gas-liquid dual-phase cooling medium is used to quickly remove the heat generated by the heat source, avoiding problems such as frame drop, freeze, and stuffiness when wearing; when running at low power, passive heat dissipation plays a leading role, and the heat generated by the heat source is transferred to the outside of the VR device by heat conduction. See below Figure 1 The structure of the heat dissipation device of the VR device is introduced in detail. From the structural point of view, the heat dissipation device of the VR device provided by the present invention mainly includes two parts: a pneumatic component 10 and a heat dissipation component 20, wherein the pneumatic component 10 is arranged outside the VR device housing 1. The pneumatic component 10 can be operated to introduce liquid cooling medium or air into the VR device housing 1 through a pipeline. In contrast, the heat dissipation component 20 is arranged in the VR device housing 1, and at least one heat conduction element for transferring heat to the outside is arranged in the heat dissipation component 20. The heat dissipation component 20 can be operably connected to the pneumatic component 10 by fluid and is configured to spray the liquid cooling medium or air introduced through the pneumatic component on the area where the heat conduction element is located. Through the combination of the pneumatic component 10 and the heat dissipation component 20, when operating at high power, the cooling medium mixed with gas and liquid can be sprayed on the area where the heat conduction element is located, and the heat conduction element and the cooling medium are used to achieve heat dissipation, thereby improving the heat dissipation efficiency. When operating at low power, the heat conduction element is the main factor in transferring heat to the outside, covering the heat dissipation requirements of the VR device in all operating states.

[0031] The following combination Figures 1 to 3The preferred structure of the heat dissipation component 20 is introduced in detail. As shown in the figure, the heat dissipation component 20 is mainly composed of a main housing 21, a sprayer 25 and a bracket 26. In a preferred embodiment, the heat conduction element arranged in the heat dissipation component 20 is realized by a heat dissipation fin 22 and a plurality of heat dissipation fins 22 are distributed at intervals, preferably evenly distributed at equal intervals. It can be understood that the heat conduction element can also be other forms of micro heat exchangers, which are not listed here one by one. At least one slot configured to accommodate a VR device chip is formed on the main housing 21. In view of the characteristics of the VR device, a CPU slot 24 and a GPU slot 23 are preferably opened, wherein the CPU slot 24 is configured to accommodate the processor on the VR device motherboard, and the GPU slot 23 is configured to accommodate the graphics card on the VR device motherboard. As an optional example, the CPU slot 24 and the GPU slot 23 are both opened on the bottom wall of the main housing 21, and one end of a plurality of evenly distributed heat dissipation fins 22 at equal intervals is fixed to the bottom wall of the main housing 21, and the whole is located above the CPU slot 24 and the GPU slot 23. The CPU slot 24 and the GPU slot 23 are preferably provided with thermal grease.

[0032] The sprayer 25 is disposed near the heat sink fins 22. Continuing with the above example, for the heat sink fins 22 that are evenly spaced longitudinally, the sprayer 25 is preferably disposed above the heat sink fins 22. Figure 1 As shown, a cover unit 36 ​​is provided in conjunction with the main housing 21, and sprayers 25 distributed in a 2×2 matrix are fixedly provided on the cover unit 36. The number of sprayers 25 on the cover unit 36 ​​is not further limited here. According to the requirements of heat dissipation efficiency, sprayers 25 distributed in a 3×2 matrix or sprayers 25 distributed in a 2×3 matrix, etc. can also be provided. The cover unit 36 ​​and the main housing 21 together enclose a closed cavity 34, and the sprayer 25 is operably fluidly connected to the pneumatic component 10 through a pipeline. The sprayer 25 is configured to atomize the liquid cooling medium and spray the atomized cooling medium on the area where the heat dissipation fins 22 are located, or to spray the gas introduced by the pneumatic component 10 on the area where the heat dissipation fins 22 are located in a larger area. The main shell 21 is preferably maintained in the middle position of the enclosed cavity 34 by a bracket 26, preferably by four brackets 26 symmetrically distributed along the main shell 21. The main shell 21 is fixedly connected to the bracket 26, and a cooling medium attachment bed 27 is provided in the bracket 26.

[0033] like Figure 2 , Figure 3 and Figure 5As shown, an internal cavity 32 is formed in each bracket 26, and the internal cavity 32 formed in the four brackets 26 is connected to the closed cavity 34 in the main shell 21. The cooling medium attachment bed 27 is partially arranged in the internal cavity 32, and the other part is arranged in the closed cavity 34. The cooling medium attachment bed 27 conforms to and covers the bottom wall of the entire main shell 21 and each bracket 26. The cooling medium attachment bed 27 is made of a loose, multi-gap, heat-conductive fiber material with capillary function. A portion of the cooling medium attachment bed 27 arranged in the closed cavity 34 is provided with a through-hole groove 35, and the heat dissipation fins 22 pass through the through-hole groove 35. At the same time, the positioning of the cooling medium attachment bed 27 is achieved by the cooperation of the heat dissipation fins 22 and the through-hole groove 35. An air outlet 33 is provided at one end of the bracket 26 away from the main shell 21. The air outlet 33 protrudes from the bracket 26 and is embedded in the VR device shell 1, which plays a role in the engagement and positioning of the bracket 26 and the VR device shell 1. The main housing 21 and the bracket 26 are preferably made of alloy heat-conducting materials. The bracket 26 is preferably L-shaped. In the assembled state, the outer surface of the bracket 26 fits the inner surface of the VR device housing 1, which is conducive to transferring heat to the VR device housing 1 and improving the heat dissipation efficiency. The position of the VR device housing 1 accommodating the air outlet 33 is preferably provided with a dustproof net 30.

[0034] In the present invention, the structure of the sprayer 25 is further designed. Figure 3As shown, the sprayer 25 mainly includes a liquid inlet pipe 251, a column section 252, a cone section 253 and a spray port 254. The liquid inlet pipe 251 is located on the upper outer side of the sprayer 25 and is spirally wound, preferably entering the interior of the column section 252 in a 270-degree spiral. The column section 252 is located downstream of the liquid inlet pipe 251 and is fluidly connected to the liquid inlet pipe 251. Further, the cone section 253 is located downstream of the column section 252 and is fluidly connected to the column section 252. The cross-sectional radius of the cone section 253 gradually decreases along the flow direction of the cooling medium. Downstream of the cone section 253 is the spray port 254, which is fluidly connected to the cone section 253. The cross-sectional radius of the spray port 254 gradually increases along the flow direction of the cooling medium. The cone section 253 can have the same cone angle as the spray port 254, or more preferably, the cone angle of the spray port 254 is greater than the cone angle of the cone section 253. The sprayer 25 is a key component of the heat dissipation device of the VR device provided by the present invention. The sprayer 25 can evenly spray the liquid cooling medium and / or air onto the heat dissipation fins 22 and the cooling medium attachment bed 27. The sprayer 25 is small in size, requires a small atomization pressure, has uniform atomized particles, and has a larger spraying area at a short distance. After the cooling medium mixed with gas and liquid spirals into the column section 252 along the liquid inlet pipe 251, a stable spiral flow is formed in the column section 252, flows downward along the side wall and maintains a gas-liquid two-phase mixed state to enter the vertebral section 253. The cooling medium in the vertebral section 253 narrows the flow diameter, accelerates the movement speed, increases the centrifugal force, and further enters the spray port 254. Because the spray port 254 is a large-angle conical shape, the diameter of the cooling medium flow path mixed with gas and liquid suddenly increases, and the cooling medium will be sprayed around under the action of centrifugal force, forming a conical spraying area under the guidance of the spray port 254. The sprayer 25 is preferably provided with a guide arc 255, which is located between the vertebral body segment 253 and the spray port 254. The guide arc 255 smoothly transitions with the inner wall of the vertebral body segment 253 and the spray port 254, respectively, to avoid noise. In order to facilitate the installation of the sprayer 25 on the cover unit 36 ​​and maintain a stable working state, the outer side of the sprayer 25 is preferably provided with a clamping table 256, which cooperates with the cover unit 36 ​​to play a positioning role.

[0035] The following reference Figure 1The pneumatic assembly 10 is described in detail. The pneumatic assembly 10 is provided with a liquid storage tank 14 for storing liquid cooling medium. The power source of the pneumatic assembly 10 is a micro air pump 12. In the pneumatic assembly 10, the air pump 12 and the heat dissipation assembly 20 are connected by a pipeline to form a first flow path F1. A first valve element 16 is provided on the first flow path F1. The first valve element 16 is operably configured to be unidirectional from the outlet of the air pump 12 to the heat dissipation assembly 20. In parallel with the first flow path F1, a second flow path F2 is formed between the air pump 12, the liquid storage tank 14 and the heat dissipation assembly 20. A second valve element 18 is provided on the second flow path F2. The second valve element 18 is provided between the liquid storage tank 14 and the heat dissipation assembly 20. The second valve element 18 is operably configured to be unidirectional from the outlet of the liquid storage tank 14 to the heat dissipation assembly 20. The first valve element 16 and the second valve element 18 are preferably not turned on at the same time, that is, they are switched alternately to be in a turned-on state. For example, in the initial state, the first valve element 16 is kept closed and the second valve element 18 is opened. Under the action of the air pump 12, the liquid cooling medium in the liquid storage tank 14 is pushed into the heat dissipation component 20 along the second flow path F2, that is, pushed into the corresponding one or more sprayers 25. Under the action of the sprayer 25, the liquid cooling medium is atomized, and the atomized liquid cooling medium is evenly sprayed onto the heat dissipation fins 22 and the cooling medium attachment bed 27. After reaching the set running time, the first valve element 16 is switched to open and the second valve element 18 is closed. Under the action of the air pump 12, the airflow generated by the air pump 12 enters the heat dissipation component 20, that is, the corresponding one or more sprayers 25, along the first flow path F1. Through the centrifugal action of the sprayer 25, the gas can also achieve point-to-surface coverage, so that the air can be more evenly distributed on the surface of the cooling medium attachment bed 27 and the heat dissipation fins 22.

[0036] The outlet of the air pump 12 is preferably connected through a three-way pipe 13. Similarly, at one end of the heat dissipation assembly 20, it is also preferably connected to the heat dissipation assembly 20 through a three-way pipe 15. The pneumatic assembly 10 and the heat dissipation assembly 20 are separable, and the two are operably fluidically connected through a pneumatic quick connector 31. In the connected state, the pneumatic quick connector 31 is preferably located in a through hole opened on the VR device housing 1. On the one hand, it protects the connection structure to avoid separation caused by unexpected circumstances, and on the other hand, it makes the overall appearance of the VR device more concise.

[0037] The second aspect of the present invention provides a VR device. The VR device includes a VR device heat dissipation device. The specific structure of the VR device heat dissipation device refers to the detailed description of the above embodiment and the detailed description of the drawings in the specification, and will not be repeated here. The VR device provided with the VR device heat dissipation device can achieve the same technical effect.

[0038] A third aspect of the present invention provides a control method for the above-mentioned VR device heat dissipation device. Figure 6 As shown, the control method includes the following steps:

[0039] Step S1: sampling the real-time temperature of a set area in the shell of the VR device. The real-time temperature may be the regional temperature of the set area in the shell of the VR device detected by a temperature sensor, or the ambient temperature or operating temperature of the electronic components of the VR device detected by a thermistor electronic element, or the calculated temperature calculated by a set algorithm based on the above sampled value.

[0040] Step S2: Compare the real-time temperature with the set temperature. The set temperature is obtained by R&D personnel under experimental conditions and represents the temperature threshold that may cause problems with the VR device or affect the user's comfort. The set temperature can be set to multiple values ​​for different working conditions, for example, a first set temperature is set for a high-power working condition, and a second set temperature is set for a low-power working condition.

[0041] Steps S3 to S4: If the comparison result is that the real-time temperature is higher than the set temperature, for example, higher than the first set temperature, the pneumatic component and the heat dissipation component are configured to be fluidically connected, the liquid cooling medium is introduced into the VR device housing, and the liquid cooling medium or air is sprayed on the area where the heat conduction element is located.

[0042] Steps S5 to S6: If the comparison result is that the real-time temperature is lower than the set temperature, for example, lower than the second set temperature, the pneumatic component and the heat dissipation component are separated, and the heat transfer element is dominant to transfer heat to the outside.

[0043] Combined with the specific structure provided in the above embodiment, through this control method, when the VR device is running at high power, the heat dissipation device of the VR device adopts active heat dissipation. When the real-time temperature is higher than the set temperature, the air pump in the pneumatic component is controlled to automatically open. In the initial state, the second valve element is kept open and the first valve element is closed. The airflow output by the air pump pushes the liquid cooling medium in the liquid storage tank along the second flow path to the sprayer, and the atomized liquid cooling medium is evenly sprayed on the area where the heat conduction element is located, that is, sprayed on the heat dissipation fins and the cooling medium attachment bed. After running for a set time, the first valve element is switched on and the second valve element is closed. The airflow output by the air pump enters the sprayer through the first flow path. Through the centrifugal action of the sprayer, the gas is sprayed out to achieve point-to-surface coverage, and evenly distribute the cooling medium attachment bed and the surface of the heat dissipation fins. During the active heat dissipation process, the heat generated by the electronic components in the VR device diffuses outward through two paths. In the first path, the heat generated by the electronic components is first transferred to the thermal grease in the CPU slot and the GPU slot, and then to the main housing and the heat sink fins through the thermal grease, and then to the cooling medium on the cooling medium attachment bed. The cooling medium absorbs heat and evaporates, and forms an air flow under the action of the air sprayed by the sprayer. The air flow also accelerates the evaporation process of the cooling medium, thereby improving the heat dissipation efficiency of the heat sink fins. The cooling medium and the air after heat exchange are discharged outward along the bracket. After reaching the bracket, the cooling medium will be partially condensed and gathered on the cooling medium attachment bed in the bracket due to the lower temperature. The condensed cooling medium returns to another part of the cooling medium attachment bed in the main housing under the capillary action of the cooling medium attachment bed and continues to participate in the heat dissipation cycle. The other part of the uncondensed cooling medium gas is discharged with the air flow. In the second path, after the heat generated by the electronic components is transferred to the main housing, it is further transferred to the VR device housing through the bracket and further directly dissipated. When the VR device is running at low power, the VR device cooling device adopts passive cooling. For example, when the real-time temperature is lower than the set temperature, the pneumatic assembly and the cooling assembly are separated through the pneumatic quick connector. The heat generated by the electronic components is first transferred to the thermal grease in the CPU slot and the GPU slot, and then transferred to the main shell and the cooling fins through the thermal grease. The heat transferred to the main shell will be transferred to the VR device shell along the bracket to dissipate the heat. The heat transferred to the cooling fins will be directly dissipated into the sealed cavity and transferred out through the air outlet on the bracket.

[0044] Through the VR device heat dissipation device, VR device and control method of the VR device heat dissipation device provided by the present invention, firstly, a gas-liquid two-phase cooling medium can be used to dissipate heat from the VR device by means of fluid dynamics principles; secondly, a matrix-distributed sprayer can be used to spray the liquid cooling medium over a large range over a short distance, and to achieve uniform distribution of the cooling medium point to surface; thirdly, various operating states of the VR device can be fully covered to meet the heat dissipation requirements of high-power operation and low-power operation, and to provide a flexible combination of active heat dissipation and passive heat dissipation; fourthly, the cooling medium is blocked by the cooling medium attachment bed in the sealed cavity surrounded by the main shell and the cover unit, forming a dual flow mode of open and closed circulation, the cooling medium in the open circulation is evaporated by heat and discharged with the gas, the cooling medium in the closed circulation is condensed in the internal cavity of the bracket and gathered on the cooling medium attachment bed, and returned to the main shell through capillary action to re-participate in the heat dissipation cycle, thereby realizing the recycling of the cooling medium.

[0045] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned embodiments, it is still possible for a person skilled in the art to modify the technical solutions described in the aforementioned embodiments, or to replace some of the technical features therein by equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions claimed to be protected by the present invention.

Claims

1. A heat dissipation device for VR equipment, characterized in that: include: A pneumatic assembly disposed outside the VR device housing and operable to introduce a liquid cooling medium or air into the VR device housing; It includes: a liquid storage tank in which liquid cooling medium is stored; and air pump; A heat dissipation component is provided in a VR device housing, and the heat dissipation component comprises: at least one heat sink; A sprayer, which is arranged close to the heat sink fins to spray liquid cooling medium or air to the area where the heat sink fins are located; A first flow path is formed between the air pump and the heat dissipation component, a first valve element is provided on the first flow path, the first valve element is operably configured to be unidirectional from the outlet of the air pump to the heat dissipation component, and the airflow generated by the air pump enters the sprayer along the first flow path; a second flow path is formed between the air pump, the liquid storage tank and the heat dissipation component, a second valve element is provided on the second flow path, the second valve element is provided between the liquid storage tank and the heat dissipation component, the second valve element is operably configured to be unidirectional from the outlet of the liquid storage tank to the heat dissipation component, and the liquid cooling medium in the liquid storage tank is pushed into the sprayer along the second flow path.

2. The VR device heat dissipation device according to claim 1, characterized in that: The heat dissipation component comprises: A main housing, wherein a plurality of heat dissipation fins are arranged at intervals, and at least one slot is formed on the main housing, wherein the slot is configured to accommodate a VR device chip; The main shell is fixedly connected to the bracket, and a cooling medium attachment bed is arranged in the bracket.

3. The VR device heat dissipation device according to claim 2, characterized in that: The bracket has an internal cavity, and the cooling medium attachment bed portion is arranged in the internal cavity; an air outlet is opened at the end of the bracket, and the air outlet protrudes from the bracket and is embedded in the VR device shell.

4. The heat dissipation device for VR equipment according to claim 2, characterized in that: The sprayer comprises: A liquid inlet pipe, the liquid inlet pipe is located outside the sprayer and is spirally wound; a column section, the column section being located downstream of the liquid inlet pipe and being fluidically connected to the liquid inlet pipe; a vertebral body segment, the vertebral body segment being located downstream of the column segment and being fluidically connected to the column segment, the cross-sectional radius of the vertebral body segment gradually decreasing along the flow direction of the cooling medium; and A spray port is located downstream of the vertebral body segment and is fluidically connected to the vertebral body segment. The cross-sectional radius of the spray port gradually increases along the flow direction of the cooling medium.

5. The heat dissipation device for VR equipment according to claim 4, characterized in that: The sprayer also includes: A guide arc is located between the vertebral body segment and the spray port, and the guide arc smoothly transitions with the vertebral body segment and the inner wall of the spray port respectively.

6. The heat dissipation device for VR equipment according to any one of claims 2 to 5, characterized in that: The heat dissipation component also includes: A cover unit is provided with a plurality of sprayers distributed in a matrix.

7. The VR device heat dissipation device according to any one of claims 1 to 5, characterized in that: The pneumatic assembly and the heat dissipation assembly are operably fluidly connected via a pneumatic quick connector.

8. The heat dissipation device for VR equipment according to claim 7, characterized in that: The first valve element and the second valve element are switched on and off alternately.

9. A VR device, characterized in that: Comprising the VR equipment heat dissipation device as described in any one of claims 1 to 8.

10. A method for controlling a heat dissipation device for VR equipment according to any one of claims 1 to 8, characterized in that: The following steps are involved: Sampling the real-time temperature of a set area in the housing of the VR device; comparing the real-time temperature with the set temperature; If the real-time temperature is higher than the set temperature, the pneumatic component and the heat dissipation component are configured to be fluidically connected, the air pump is controlled to be turned on, the second valve element is kept open and the first valve element is closed in the initial state, and the airflow output by the air pump pushes the liquid cooling medium in the liquid storage tank along the second flow path to the sprayer; after running for a set time, the first valve element is switched on and the second valve element is closed, and the airflow output by the air pump enters the sprayer via the first flow path; If the real-time temperature is lower than the set temperature, the pneumatic component and the heat dissipation component are separated, and the heat dissipation fins transfer heat to the outside.

Images