Heater Support Kit for Bevel Etch Chambers

Abstract

Embodiments described herein generally relate to apparatus for processing substrates. In one or more embodiments, a heater support kit includes: a heater assembly including a heater plate having an upper surface and a lower surface; a retaining ring disposed on at least a portion of the upper surface of the heater plate; a heater arm assembly including a heater arm and supporting the heater assembly; and a heater support plate disposed between the heater plate and the heater arm and contacting at least a portion of the lower surface of the heater plate.

Description

Background of the Invention Technical Field

[0001] Embodiments described herein generally relate to methods and apparatus for processing substrates. More particularly, embodiments described herein relate to a heater support kit for a bevel etch chamber.

[0002] Description of Related Technology

[0003] Plasma processing is commonly used in many semiconductor manufacturing processes for manufacturing integrated circuits, flat panel displays, magnetic media and other devices. Plasma or ionized gas is generated in a remote plasma source (RPS) and flows into a processing chamber and is then applied to the workpiece to complete a process such as deposition, etching or implantation. The process is generally completed by introducing a precursor gas or gas mixture into a vacuum chamber that houses the substrate. During the deposition or etching process, a component (such as a mask or showerhead) can be positioned relative to the substrate. The precursor gas or gas mixture in the chamber is excited (e.g., energized) into a plasma using the RPS. The excited gas or gas mixture reacts to selectively etch a film layer on the edge of the substrate.

[0004] However, the sloped edges of a substrate (such as its sides and corners) experience conditions that may be different from those experienced at other portions of the substrate. These different conditions affect processing parameters such as film thickness, etching uniformity, and / or film stress. Differences in etching rate and / or film properties (such as film thickness or stress) between the center and edge of the substrate become significant and may result in suboptimal device performance.

[0005] Therefore, what is needed in the art is an improved apparatus for bevel etch processing. Summary of the Invention

[0006] Embodiments described herein generally relate to apparatus for processing substrates. In one or more embodiments, a heater support kit includes a heater assembly, a retaining ring, a heater arm assembly, and a heater support plate. The heater assembly includes a heater plate having an upper surface and a lower surface. The retaining ring is disposed on at least a portion of the upper surface of the heater plate. The heater arm assembly includes a heater arm and supports the heater assembly. The heater support plate is disposed between the heater plate and the heater arm and contacts at least a portion of the lower surface of the heater plate. In other embodiments, the heater support kit further includes a lower support plate disposed below the heater support plate and a center plug disposed below the lower support plate.

[0007] In one or more embodiments, a method for a bevel etch process includes placing a substrate on a substrate support within a process chamber, the substrate having a deposited layer including a center and a bevel edge. A mask is placed over the substrate. An edge ring is disposed around the substrate and on the substrate support. The method further includes flowing a process gas mixture to etch near the bevel edge; and flowing a purge gas near the top of the substrate through a first hole, a second hole, and a third hole of the mask located at the center of the substrate.

[0008] In other embodiments, a method includes placing a substrate on a substrate support within a processing chamber, the substrate having a deposited layer, the deposited layer including a center and a beveled edge. A mask is placed over the substrate. An edge ring is positioned below the substrate and over the substrate support. The method further includes raising the edge ring to contact the mask. The method further includes flowing a process gas mixture near the beveled edge; and flowing a purge gas through a first hole, a second hole, and a third hole of the mask located at the center of the substrate near the top of the substrate.

[0009] In some embodiments, a method includes placing a substrate on a substrate support inside a processing chamber, the substrate having a deposited layer, the deposited layer including a center and a bevel edge. Placing a mask over the substrate. Disposing an edge ring around the substrate and on the substrate support. The method also includes: flowing a process gas mixture near the bevel edge; and flowing a purge gas through a first hole, a second hole, and a third hole of the mask at the center of the substrate near the top of the substrate. The process gas includes one or more of nitrogen (N2), oxygen (O2), nitrogen trifluoride (NF3), argon, helium, or any combination thereof. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] In order that the above-mentioned features of the present disclosure may be understood in detail, a more particular description of the present disclosure, briefly summarized above, may be obtained by reference to the embodiments, some of which are illustrated in the accompanying drawings. It should be noted, however, that the drawings illustrate only exemplary embodiments and are therefore not to be considered limiting of its scope, which may admit to other equally effective embodiments.

[0011] Figure 1 Depicted is a schematic cross-sectional view of a processing chamber 100 according to one or more embodiments described and discussed herein.

[0012] Figure 2 Depicts a system according to one or more embodiments described and discussed herein. Figure 1 Schematic bottom view of a mask utilized in a chamber.

[0013] Figure 3Depicts a system according to one or more embodiments described and discussed herein. Figure 1 Schematic bottom view of an edge ring utilized in a chamber.

[0014] Figure 4 Depicts a system according to one or more embodiments described and discussed herein. Figure 1 Schematic top view of the cover plate utilized in the chamber.

[0015] Figure 5 Depicted is a schematic cross-sectional view of a processing chamber containing a heater support kit according to one or more embodiments described and discussed herein.

[0016] Figure 6 Depicts a system according to one or more embodiments described and discussed herein. Figure 5 Schematic top view of the heater support kit shown in .

[0017] Figure 7 Depicts a system according to one or more embodiments described and discussed herein. Figure 5 Schematic exploded view of the heater support kit shown in .

[0018] Figure 8 Depicted is a schematic cross-sectional view of a processing chamber containing another heater support kit according to one or more embodiments described and discussed herein.

[0019] Figure 9 Depicts a system according to one or more embodiments described and discussed herein. Figure 8 Schematic exploded view of the heater support kit shown in .

[0020] Figure 10 Depicted is a schematic cross-sectional view of an attachment assembly according to one or more embodiments described and discussed herein.

[0021] Figure 11 Depicted is a schematic top view of a heater assembly according to one or more embodiments described and discussed herein.

[0022] Figure 12 Depicts a system according to one or more embodiments described and discussed herein. Figure 11 A schematic perspective view of a heater assembly is shown in FIG.

[0023] 13A to 13C Depicted is a schematic diagram of a cleat assembly according to one or more embodiments described and discussed herein.

[0024] 14A to 14C Depicted is a schematic diagram of a heater support plate according to one or more embodiments described and discussed herein.

[0025] FIG. 15A to FIG. 15B Depicted is a schematic diagram of a lower support plate according to one or more embodiments described and discussed herein.

[0026] To facilitate understanding, identical reference numerals have been used, where possible, to designate identical elements that are common to the figures. It is contemplated that elements and features of one or more embodiments may be beneficially combined in other embodiments. DETAILED DESCRIPTION

[0027] Embodiments described herein generally relate to methods and apparatus for processing substrates. More specifically, embodiments described herein relate to methods and apparatus for bevel etch processing. In some embodiments, a method for cleaning a bevel edge of a semiconductor substrate is provided. The method includes placing a substrate on a cover plate inside a processing chamber, the substrate having a deposition layer, the deposition layer including a center and a bevel edge. Placing a mask over the substrate. Disposing an edge ring around / under the substrate. The method also includes: flowing a process gas mixture near the bevel edge; and flowing a purge gas through a first hole, a second hole, and a third hole of the mask at the center of the substrate near the top of the substrate.

[0028] Figure 1 A schematic cross-sectional view of a processing chamber 100 according to one aspect of the present disclosure is shown. As shown, the processing chamber 100 is an etch chamber suitable for etching a substrate, such as substrate 154. An example of a processing chamber that may be suitable for benefiting from exemplary aspects of the present disclosure is the etch chamber commercially available from Applied Materials, Inc., located in Santa Clara, California. Etching process chamber and Precision TM Processing Chamber. It is contemplated that other processing systems, including those from other manufacturers, may be adapted to benefit from aspects of the present disclosure.

[0029] The processing chamber 100 can be used for various plasma processes. In one aspect, the processing chamber 100 can be used to perform dry etching using one or more etchants. For example, the processing chamber can be used to ignite a plasma from one or more fluorocarbons (e.g., carbon tetrafluoride, hexafluoroethane, etc.), nitrogen (N2), oxygen (O2), nitrogen trifluoride (NF3), or combinations thereof. In another embodiment, the processing chamber 100 can be used for plasma-enhanced chemical vapor deposition using one or more chemistries.

[0030] The processing chamber 100 includes a chamber body 102, a lid assembly 106, a support assembly 104, and a gas outlet 160. The lid assembly 106 is positioned at an upper end of the chamber body 102. Figure 1The lid assembly 106 and support assembly 104 can be used with any processing chamber for plasma or thermal processing. Chambers from other manufacturers can also be used with the above components. The support assembly 104 is disposed within the chamber body 102, and the lid assembly 106 is coupled to the chamber body 102 and encloses the support assembly 104 in the processing volume 120. The chamber body 102 includes a slit valve opening 126 formed in a sidewall of the chamber body 102. The slit valve opening 126 is selectively opened and closed to allow a substrate handling robot (not shown) to enter the processing volume 120 for substrate transfer.

[0031] The isolation body 110, which may be a dielectric material such as a ceramic or a metal oxide (e.g., aluminum oxide and / or aluminum nitride), contacts the electrode and electrically and thermally isolates the electrode from the gas distributor 112 and the chamber body 102. The gas distributor 112 has openings for admitting process gases into the processing volume 120. The process gases may be supplied to the processing chamber 100 via a conduit 114 and may enter a gas mixing region 116 before flowing through openings to the substrate 154. The gas distributor 112 may be connected to an RPS.

[0032] The support assembly 104 can be any suitable substrate support, such as a vacuum chuck, an electrostatic chuck, or a heated pedestal. In one or more embodiments, the support assembly 104 or substrate support is an "L"-shaped pedestal to conserve space for load lock mounting. The support assembly 104 includes a vacuum chuck line, a heater line, and a temperature controller for detecting the temperature of the support assembly. In some embodiments, the support assembly 104 is configured to support a substrate 154 for processing. A lift mechanism allows the support assembly 104 to move vertically within the chamber body 102 between a lower transfer position and a plurality of elevated processing positions. The support assembly 104 can be formed from a metal or ceramic material, such as a metal oxide or nitride, or an oxide / nitride mixture, such as aluminum, aluminum oxide, aluminum nitride, or an aluminum oxide / aluminum nitride mixture. A heater 122 can be coupled to the support assembly 104. The heater 122 can be embedded within the support assembly 104 or coupled to a surface of the support assembly 104. The heater 122 can be coupled to a power source extending external to the chamber 100.

[0033] The reactant blocking plate or mask 150 may be part of the cover assembly 106 or may be a separate removable piece. The mask 150 has a dome-shaped body 204 with a flat bottom surface. Figure 2As shown, the mask 150 has a circular aperture. In the center of the aperture are three openings 202 to form a small choke, thereby ensuring that the purge gas is evenly distributed in all directions. In some embodiments, the three openings 202 can be uniform in size and shape and equally spaced. The mask 150 can be lowered to contact the substrate 154. In some embodiments, the mask 150 can be quartz or other ceramic material and can be coated with Ni or NiO as needed, or can be a chemically or plasma-resistant material such as yttrium oxide or yttrium oxide. The lid assembly 106 further includes a plasma source 162. The plasma source 162 is adjacent to the mask 150.

[0034] Figure 3 According to one aspect of the present disclosure, Figure 1 FIG2 is a schematic top view of an edge ring 180 utilized in a chamber. In some embodiments, the edge ring 180 is disposed adjacent to the contact mask 150. The edge ring 180 has an annular body 306. The edge ring 180 includes several openings 304 for engaging the support assembly 104. The edge ring 180 is disposed on the support assembly 104. In some embodiments, the edge ring 180 may be disposed adjacent to the cover plate 152. The edge ring 180 may include a ceramic material such as quartz or alumina. The edge ring 180 has a plurality of protrusions 302. The protrusions 302 may be circular bumps, squares, rectangles, hexagons, or any other shape. The protrusions 302 are arranged around the body 306. Ten protrusions 302 are shown; however, there may be more or fewer protrusions 302. The protrusions may be equally spaced around the circumference of the body 306 of the edge ring 180. In some embodiments, the protrusions 302 reduce heat transfer from the support assembly 104 and the substrate 154. Additionally, edge ring 180 provides a pressure differential between the top of the substrate and the bottom of substrate 154. In some embodiments, edge ring 180 provides uniform leveling over substrate 154.

[0035] Figure 4 According to one aspect of the present disclosure, Figure 1Schematic top view of cover plate 152 utilized in a chamber. Cover plate 152 includes a central aperture 402, a plurality of openings 404, a plurality of fasteners 410, a scalloped edge 406, and a plurality of spokes 408. Central aperture 402 can be a circular opening, a hexagonal opening, a rectangular opening, or any other shaped opening. The plurality of openings 404 are circular openings that are circumferentially displaced around central aperture 402. Each of the plurality of openings 404 is smaller than central aperture 402. Although eight openings 404 are shown in this disclosure, the plurality of openings 404 can include more or less than eight openings 404. In some embodiments, the openings 404 are evenly spaced around central aperture 402. In other embodiments, the distance between openings 404 varies. The plurality of spokes 408 are grooves in cover plate 152. The plurality of spokes 408 radiate from the circular groove surrounding central aperture 402. A plurality of spokes 408 are linear grooves extending radially outward toward the scalloped edge 406. The scalloped edge 406 includes a wavy pattern with uniform indentations. The scalloped edge 406 can have rounded edges, square edges, or sharp edges. The scalloped edge 406 prevents the substrate from sliding when placed on the cover plate 152 and edge ring 180.

[0036] In operation, the method of etching a substrate begins by placing the substrate on a substrate support within a processing chamber. After a deposition process in the same chamber or a different chamber, the substrate has a dielectric layer, a center, and a beveled edge. Mask 150 is lowered onto substrate 154, maintaining a small gap between the mask and substrate of between 0.003 inches and 0.100 inches. In one or more embodiments, substrate 154 and edge ring 180 are raised to contact mask 150. In some embodiments, the distance between substrate 154 and mask 150 is less than 100 mils. In some embodiments, the distance between substrate 154 and mask 150 is approximately 10 mils. In other embodiments, the distance between substrate 154 and mask 150 is less than 100 mils, such as between 5 mils and 20 mils. Edge ring 180 is positioned around / under substrate 154. In other embodiments, edge ring 180 is positioned around cover plate 152. In other embodiments, edge ring 180 is positioned above support assembly 104. The method continues by flowing a process gas mixture near the top of the substrate 154 and near the bevel edge. The process gas can be any number of etchant gases. The process gas etches the bevel edge. The process gas can include one or more of nitrogen (N2), oxygen (O2), nitrogen trifluoride (NF3), argon, helium, or any combination thereof. The method further includes flowing a purge gas through the three openings 202 of the mask 150 around the center of the substrate 154.

[0037] By flowing the etchant gas in one location and the purge gas in a second location, a more uniform and controlled etch is achieved. Additionally, the various openings in the mask create small flow chokes and ensure that the purge gas is evenly distributed in all directions. Finally, the scalloped cover provides stability during substrate placement and pickup.

[0038] Figure 5 A schematic cross-sectional view of a process chamber 500 including a heater support kit 501 according to one or more embodiments described and discussed herein is depicted. The process chamber 500 can have the same components and / or configuration as the process chamber 100 described and discussed above. Alternatively, the process kit or components in the process chamber 100 can be replaced with the heater support kit 501 and / or its components or parts. The process chamber 500 also includes a chamber body 502 and a chamber lid 504.

[0039] In one or more embodiments, the heater support kit 501 includes a retaining ring 520, a heater assembly 530, a heater arm assembly 540, a heater support plate 560, a lower support plate 580, and a center plug 590, as shown in FIG. Figure 5 shown.

[0040] According to one or more embodiments described and discussed herein, Figure 6 depicts a schematic top view of a heater support assembly 501, and Figure 7 A schematic exploded view of a heater support assembly 501 is depicted. In some embodiments, a heater assembly 530 includes a heater plate 532 having an upper surface 531 and a lower surface 533, and a retaining ring 520 is disposed on at least a portion of the upper surface 531 of the heater plate 532. A heater arm assembly 540 includes a heater arm 542 and supports the heater assembly 530. The heater arm assembly 540 also includes a heater cooling shaft 544 coupled to the lower surface of the heater arm 542. A heater support plate 560 is disposed between the heater plate 532 and the heater arm 542 and contacts at least a portion of the lower surface 533 of the heater plate 532.

[0041] The heater support assembly 501 includes a lower support plate 580 disposed below the heater support plate 560. The heater support assembly 501 includes a center plug 590 disposed below the lower support plate 580. The center plug 590 can be coupled or attached to the chamber body 502. The lower support plate 580 contains or includes one or more materials such as steel, stainless steel, iron, chromium, nickel, aluminum, alloys thereof, or any combination thereof. The heater support assembly 501 further includes a pumping plate 510 coupled to the heater arm assembly 540, such as Figure 7 shown.

[0042] In other embodiments, the heater support kit 501 includes a heater assembly 530 including a heater plate 532 having an upper surface 531 and a lower surface 533; a retaining ring 520 disposed on at least a portion of the upper surface 531 of the heater plate 532; a heater arm assembly 540 including a heater arm 542 and supporting the heater assembly 530; and a heater support plate 560 disposed between the heater plate 532 and the heater arm 542 and contacting at least a portion of the lower surface 533 of the heater plate 532. The heater support kit 501 also includes a lower support plate 580 disposed below the heater support plate 560 and a center plug 590 disposed below the lower support plate 580.

[0043] Figure 8 A schematic cross-sectional view of a process chamber 800 including a heater support assembly 801 according to one or more embodiments described and discussed herein is depicted. The process chamber 800 can have the same components and / or configuration as the process chamber 100 described and discussed above. Alternatively, the process assembly or components in the process chamber 100 can be replaced with the heater support assembly 801 and / or its components or parts. The process chamber also includes a chamber body 802 and a chamber lid 804.

[0044] In one or more embodiments, the heater support kit 801 includes a retaining ring 520, a heater assembly 530, a heater arm assembly 840, a heater support plate 560, and a center plug 890, as shown in FIG. Figure 8 shown. Figure 9 Depicted is a schematic exploded view of a heater support assembly 801 according to one or more embodiments described and discussed herein.

[0045] In other embodiments, the heater support assembly 801 further includes a center plug 890 disposed below the heater support plate 560. The center plug 890 can be coupled or attached to the chamber body 802. The heater support assembly 801 further includes a pumping plate 810 coupled to the heater arm assembly 840, such as Figure 9 As shown, heater arm assembly 840 includes cleat assembly 845 and heater cooling shaft 544. Cleat assembly 845 may include cleat 846 and spindle 847. Cleat 846 may rotate about spindle 847 and may engage and disengage spindle 847 while reducing or eliminating any space or gap between chamber components (e.g., chamber body 802 and / or chamber lid 804) and / or cleat 846.

[0046] In some embodiments, heater support kit 801 includes: heater assembly 530, heater assembly 530 including heater plate 532 having upper surface 531 and lower surface 533; snap ring 520 disposed on at least a portion of the upper surface of heater plate 532; and heater arm assembly 540 including heater arm 542 and supporting heater assembly 530. Heater support kit 801 also includes: heater support plate 560 disposed between heater plate 532 and heater arm 542 and in contact with at least a portion of the lower surface of heater plate 532; and center plug 890 disposed below heater plate 560.

[0047] Figure 10 A schematic cross-sectional view of an attachment assembly 535 according to one or more embodiments described and discussed herein is depicted. The attachment assembly 535 may be included and used on either heater support kit 501, 801. The attachment assembly 535 includes an attachment assembly 535 that couples the heater plate 532 and the center plug 590, 890 together. The attachment assembly 535 includes a clamping plug 534, one or more fasteners 536, and one or more actuators 538. In some examples, the attachment assembly 535 includes two or more fasteners 536 and two or more actuators 538. The fasteners 536 may be or include bolts, screws, etc. The actuator 538 includes one or more springs. In some examples, the actuator 538 is one or more wave springs. When the heater support kit 501, 801 is assembled, the one or more actuators 538 can be used to generate a load for controlling the preload force.

[0048] According to one or more embodiments described and discussed herein, Figure 11 A schematic top view of heater assembly 530 is depicted, and Figure 12 5 shows a schematic perspective view of a heater assembly 530. The heater plate 532 may include a groove 537 surrounding an outer portion of the heater plate 532. As shown, the retaining ring 520 may be positioned on the groove 537. The heater plate 532 may include one or more materials such as aluminum, an aluminum alloy, titanium, steel, stainless steel, alloys thereof, or any combination thereof.

[0049] 13A to 13CA schematic diagram of a cleat assembly 545 is depicted, according to one or more embodiments described and discussed herein. Cleat assembly 545 includes a cleat 546 coupled to an upper surface 541 of a heater arm 542. In some embodiments, cleat assembly 545 includes one or more fasteners 548. Each of fasteners 548 can independently be or include a bolt or a screw. In some examples, each of fasteners 548 can be a set screw, a locking set screw, a guide screw, a shoulder screw, or the like. In one or more embodiments, cleat assembly 545 further includes a set screw, a shoulder screw, a bridging rod, and a locking set screw. For example, cleat assembly 545 can include two or more set screws and two or more shoulder screws.

[0050] 14A to 14C A schematic diagram of a heater support plate 560 is depicted according to one or more embodiments described and discussed herein. The heater support plate 560 has an upper surface 561 and a lower surface 563, as shown in FIG. Figure 14A and Figure 14C As shown respectively. Figure 14B A cross-sectional view of heater support plate 560 is depicted. Heater support plate 560 is a ring having an aperture or hole 562 extending through heater support plate 560 between an upper surface 561 and a lower surface 563. One or more raised features 562 extend from lower surface 563 and are disposed around the outer edge of heater support plate 560.

[0051] The heater support plate 560 provides physical support on the outer edge of the heater plate 532. The attachment assembly 535 provides an axial force downward on the heater plate 532, and the heater support plate 560 maintains the heater plate 532 from bending or deforming under the axial force. The heater support plate 560 contains one or more materials such as quartz, silicon dioxide or silicon dioxide, aluminum oxide or aluminum oxide, aluminum nitride, aluminum oxynitride, yttrium oxide or yttrium oxide, one or more metals, their silicates, their ceramics, or any combination thereof. Exemplary metals contained in the heater support plate 560 can be or include steel, stainless steel, iron, chromium, nickel, aluminum, alloys thereof, or any combination thereof.

[0052] FIG. 15A to FIG. 15B A schematic diagram of a lower support plate 580 is depicted according to one or more embodiments described and discussed herein. The lower support plate 580 has an upper surface 581 and a lower surface 583, as shown in FIG. Figure 15A and Figure 15B The lower support plate 580 may include one or more materials such as steel, stainless steel, iron, chromium, nickel, aluminum, alloys thereof, or any combination thereof.

[0053] In one or more embodiments, the support structure of the heater is helpful in the bevel etching chamber. When the heater is operated at a higher temperature and the spacing requirement is strict (± several mils), the heater surface can be supported by a heater support plate. The gas purge flow passes through the center of the mask, and the O2 / N2 radical flow is at the wafer bevel surface. The operating spacing condition between the wafer and the mask is at a distance of about 5 mils to about 20 mils, but the spacing tolerance is ± about 1 mil. In some examples, if the spacing is not maintained, an impact on the bevel etching performance and chamber productivity may be generated. The heater support plate helps to maintain the desired spacing.

[0054] Because etching occurs on the wafer bevel surface, the support structure is more robust at the heater edge, as shown in the figure. Therefore, a heater support plate is used below the heater edge surface. In some examples, the heater support plate is made of a material that can withstand high temperature operation without deformation, such as quartz, steel or other metals, AlOx, AlN, or a combination thereof. In some configurations, the heater support plate supports the heater surface and also provides a uniform pumping channel below the heater surface. The heater is spring-loaded at the center.

[0055] The heater support plate provides robustness that makes bevel etch performance more uniform and does not allow for any heater deformation / creep with wafer cycling.

[0056] The heater support plate can be any geometric design under the heater. The heater support plate can be glued or clamped, or placed just under the heater surface. The heater support plate can be uniform on the edge or on the heater structure or only in the center.

[0057] Embodiments of the present disclosure further relate to any one or more of the following paragraphs 1 to 18:

[0058] 1. A heater support kit comprising: a heater assembly, the heater assembly including a heater plate having an upper surface and a lower surface; a retaining ring disposed on at least a portion of the upper surface of the heater plate; a heater arm assembly, the heater arm assembly including a heater arm and supporting the heater assembly; and a heater support plate disposed between the heater plate and the heater arm and in contact with at least a portion of the lower surface of the heater plate.

[0059] 2. A heater support kit comprising: a heater assembly, the heater assembly including a heater plate having an upper surface and a lower surface; a retaining ring, the retaining ring being disposed on at least a portion of the upper surface of the heater plate; a heater arm assembly, the heater arm assembly including a heater arm and supporting the heater assembly; a heater support plate, the heater support plate being disposed between the heater plate and the heater arm and in contact with at least a portion of the lower surface of the heater plate; a lower support plate, the lower support plate being disposed below the heater support plate; and a center plug, the center plug being disposed below the lower support plate.

[0060] 3. A heater support kit comprising: a heater assembly, the heater assembly including a heater plate having an upper surface and a lower surface; a retaining ring, the retaining ring being disposed on at least a portion of the upper surface of the heater plate; a heater arm assembly, the heater arm assembly including a heater arm and supporting the heater assembly; a heater support plate, the heater support plate being disposed between the heater plate and the heater arm and in contact with at least a portion of the lower surface of the heater plate; and a center plug, the center plug being disposed below the heater support plate.

[0061] 4. The heater support kit according to any of paragraphs 1 to 3, further comprising a lower support plate disposed below the heater support plate.

[0062] 5. The heater support kit of any of paragraphs 1 to 4, further comprising a center plug disposed below the lower support plate.

[0063] 6. The heater support kit of any of paragraphs 1 to 5, wherein the lower support plate comprises steel, stainless steel, iron, chromium, nickel, aluminum, alloys thereof, or any combination thereof.

[0064] 7. The heater support kit of any of paragraphs 1 to 6, further comprising a center plug disposed below the heater support plate.

[0065] 8. The heater support kit of any of paragraphs 1 to 7, further comprising an attachment assembly coupling the heater plate and center plug together.

[0066] 9. The heater support kit of any of paragraphs 1 to 8, wherein the attachment assembly comprises a clamping plug, a fastener, and an actuation device.

[0067] 10. The heater support kit of any of paragraphs 1 to 9, wherein the attachment assembly comprises two or more fasteners and two or more actuation devices.

[0068] 11. A heater support kit according to any of paragraphs 1 to 10, wherein the fastener comprises a bolt or screw and the actuating means comprises a spring.

[0069] 12. The heater support kit of any of paragraphs 1 to 11, wherein the spring is a wave spring.

[0070] 13. The heater support kit of any of paragraphs 1 to 12, wherein the heater arm assembly further comprises a cleat coupled to an upper surface of the heater arm.

[0071] 14. The heater support kit of any of paragraphs 1 to 13, wherein the cleat further comprises a set screw, a shoulder screw, a bridging rod, and a locking set screw.

[0072] 15. The heater support kit of any of paragraphs 1 to 14, wherein the cleat further comprises two or more set screws and two or more shoulder screws.

[0073] 16. The heater support kit of any of paragraphs 1 to 15, wherein the heater arm assembly further comprises a heater cooling shaft coupled to a lower surface of the heater arm.

[0074] 17. The heater support kit of any of paragraphs 1 to 16, further comprising a pumping plate coupled to the heater arm assembly.

[0075] 18. A heater support kit according to any of paragraphs 1 to 17, wherein the heater support plate comprises quartz, silica, silicon dioxide, alumina, aluminum oxide, aluminum nitride, aluminum oxynitride, yttrium oxide, yttrium oxide, a metal, a silicate thereof, a ceramic thereof, or any combination thereof.

[0076] Although the foregoing is directed to embodiments of the present disclosure, other and further embodiments may be envisioned without departing from the basic scope of the present disclosure, and the scope of the present disclosure is determined by the scope of the appended claims. All documents described herein are incorporated herein by reference, including any priority documents and / or testing procedures that are not inconsistent with this text. It is apparent from the foregoing general description and specific embodiments that, although the forms of the present disclosure have been shown and described, various modifications may be made without departing from the spirit and scope of the present disclosure. Therefore, it is not intended to limit the present disclosure thereby. Similarly, for the purposes of U.S. law, the term "comprising" is considered to be synonymous with the term "including". Similarly, whenever the transition phrase "comprising" is added before a composition, element, or a group of elements, it should be understood that it is also envisioned to add the transition phrase "essentially consisting of," "consisting of," "selected from a group consisting of," or "is" before the same composition or the same group of elements to state the composition, one element, or multiple elements, and vice versa.

[0077] Certain embodiments and features have been described using a set of numerical upper limits and a set of numerical lower limits. It should be understood that, unless otherwise indicated, ranges are contemplated that include any combination of two values, such as any lower limit combined with any upper limit, any two lower limits combined, and / or any two upper limits combined. Certain lower limits, upper limits, and ranges appear in one or more of the appended claims.

Claims

1. A heater support kit, comprising: a heater assembly comprising a heater plate having an upper surface and a lower surface; a snap ring disposed on at least a portion of the upper surface of the heater plate; a heater arm assembly including a heater arm, the heater arm assembly contacting at least a portion of the lower surface of the heater plate and supporting the heater assembly; and A heater support plate is disposed between the heater plate and the heater arm and contacts at least a portion of the lower surface of the heater plate. 2 . The heater support kit of claim 1 , further comprising a lower support plate disposed below the heater support plate. 3 . The heater support kit of claim 2 , further comprising a center plug disposed below the lower support plate.

4. The heater support kit of claim 2, wherein the lower support plate comprises steel, stainless steel, iron, chromium, nickel, aluminum, alloys thereof, or any combination thereof. 5 . The heater support kit of claim 1 , further comprising a center plug disposed below the heater support plate.

6. The heater support kit of claim 1 further comprising an attachment assembly coupling the heater plate and center plug together.

7. The heater support kit of claim 6, wherein the attachment assembly includes a clamping plug, a fastener, and an actuation device.

8. The heater support kit of claim 7, wherein the attachment assembly comprises two or more fasteners and two or more actuation devices.

9. The heater support kit of claim 7, wherein the fastener comprises a bolt or a screw and the actuating means comprises a spring.

10. The heater support kit of claim 9, wherein the spring is a wave spring.

11. The heater support kit of claim 1 , wherein the heater arm assembly further comprises a cleat coupled to an upper surface of the heater arm.

12. The heater support kit of claim 11, wherein the cleat further comprises a set screw, a shoulder screw, a bridging rod, and a locking set screw.

13. The heater support kit of claim 12, wherein the cleat further comprises two or more set screws and two or more shoulder screws.

14. The heater support kit of claim 1, wherein the heater arm assembly further comprises a heater cooling shaft coupled to a lower surface of the heater arm.

15. The heater support kit of claim 1, further comprising a pumping plate coupled to the heater arm assembly.

16. The heater support kit of claim 1, wherein the heater support plate comprises quartz, silicon dioxide, silicon dioxide, aluminum oxide, aluminum nitride, aluminum oxynitride, yttrium oxide, yttrium oxide, metals, silicates thereof, ceramics thereof, or any combination thereof.

17. A heater support kit comprising: a heater assembly comprising a heater plate having an upper surface and a lower surface; a snap ring disposed on at least a portion of the upper surface of the heater plate; a heater arm assembly including a heater arm, the heater arm assembly contacting at least a portion of the lower surface of the heater plate and supporting the heater assembly; a heater support plate disposed between the heater plate and the heater arm and in contact with at least a portion of the lower surface of the heater plate; a lower support plate, the lower support plate being arranged below the heater support plate; and A center plug is disposed below the lower support plate.

18. The heater support kit of claim 17, wherein the heater support plate comprises quartz, silicon dioxide, silicon dioxide, aluminum oxide, aluminum nitride, aluminum oxynitride, yttrium oxide, yttrium oxide, metals, silicates thereof, ceramics thereof, or any combination thereof.

19. The heater support kit of claim 18, wherein the lower support plate comprises steel, stainless steel, iron, chromium, nickel, aluminum, alloys thereof, or any combination thereof.

20. A heater support kit comprising: a heater assembly comprising a heater plate having an upper surface and a lower surface; a snap ring disposed on at least a portion of the upper surface of the heater plate; a heater arm assembly including a heater arm, the heater arm assembly contacting at least a portion of the lower surface of the heater plate and supporting the heater assembly; a heater support plate disposed between the heater plate and the heater arm and in contact with at least a portion of the lower surface of the heater plate; and A center plug is disposed below the heater support plate.

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