Wafer box and wafer checking method

Abstract

The present invention relates to a wafer box and a method for checking wafers. The wafer box is additionally provided with a control module and an image acquisition module. The wafer identification number information of the wafer is collected by the image acquisition module as the checking information of the wafer. Meanwhile, the collected wafer identification number information is processed by the control module, thereby avoiding the problem that the wafer identification number information of the wafer is recognized by the naked eye manually, which is inefficient and prone to errors, and the efficiency of wafer checking is improved.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor display technology, and in particular to a wafer box and a method for checking wafers. Background Art

[0002] At present, the production process of traditional light-emitting diodes (LEDs) includes a wafer production process. During the wafer production process, the wafers after each process are placed in a wafer box (Cassette). It is necessary to check whether the identification number of each wafer in the wafer box is consistent with the standard wafer identification number in the process card. If they are consistent, the wafer will be sent to the next station for production. If they are inconsistent, the wafer cannot be sent to the next station for production. The existing verification efficiency is low and errors are prone to occur.

[0003] Therefore, how to improve the efficiency and accuracy of checking the wafers in the wafer box is an issue that needs to be addressed urgently. Summary of the invention

[0004] In view of the deficiencies of the above-mentioned related technologies, the purpose of the present application is to provide a wafer box and a method for checking wafers, aiming to solve the problems in the related technologies of low efficiency and easy error in checking each wafer in the wafer box.

[0005] A wafer box, comprising: a wafer box body, a control module, and an image acquisition module; the wafer box body is provided with a plurality of slots for accommodating wafers, one side of the wafer is provided with a wafer identification number, the position of the image acquisition module corresponds to the side of the wafer provided with the wafer identification number, and the control module is connected to the image acquisition module; wherein the image acquisition module is used to scan each wafer in the slot to collect the wafer identification number information corresponding to each wafer as verification information of each wafer, and transmit it to the control module for processing.

[0006] The above-mentioned wafer box has added a control module and an image acquisition module. The wafer identification number information of the wafer is collected through the image acquisition module. At the same time, the collected wafer identification number information is processed through the control module, thereby avoiding the problem of inefficient and error-prone recognition of the wafer identification number information of the wafer by human eyes, thereby improving the efficiency of wafer verification.

[0007] Optionally, the control module is configured to identify the wafer identification number information to obtain the wafer identification number, and compare a standard wafer identification number set with the wafer identification number to verify the wafer.

[0008] Optionally, the wafer box further includes: a communication module, wherein the communication module is used to establish a communication connection between the control module and an external device.

[0009] Optionally, the control module is also configured to identify the wafer identification number information to obtain the wafer identification number, and transmit the wafer identification number to the external device through the communication module, so that the external device compares the standard wafer identification number set with the wafer identification number to verify the wafer.

[0010] Optionally, the image acquisition module includes:

[0011] A slide rail and a single charge coupler arranged on the slide rail, the sliding direction of the slide rail is consistent with the setting direction of the card slot, and the charge coupler can slide along the sliding direction of the slide rail to sequentially scan each wafer in the card slot, collect the wafer identification number information of each wafer in turn, and transmit it to the control module for processing.

[0012] Optionally, the image acquisition module includes: a slide rail, and at least two charge couplers arranged on the slide rail, at least two of the charge couplers can slide along the sliding direction of the slide rail to scan each wafer in the card slot, and at the same time collect the wafer identification number information of multiple wafers and transmit it to the control module for processing.

[0013] Optionally, the wafer box further includes: a display module connected to the control module, wherein the display module is configured to display the wafer identification numbers and highlight incorrect wafer identification numbers.

[0014] Based on the same concept, the present application also provides a method for verifying wafers, which is applied to a wafer box as described in any of the above items. The method for verifying wafers includes: scanning each wafer in the card slot of the wafer box to collect the wafer identification number information corresponding to each wafer as verification information of each wafer; transmitting the collected wafer identification number information to the control module for processing.

[0015] The above-mentioned method for checking wafers collects the wafer identification number information of the wafer through the image acquisition module; at the same time, the collected wafer identification number information is processed by the control module, thereby avoiding the problem of low efficiency and easy error in manually identifying the wafer identification number information of the wafer, thereby improving the efficiency of wafer checking.

[0016] Optionally, the step of the control module processing the wafer identification information includes: identifying the wafer identification number information to obtain the wafer identification number; comparing the standard wafer identification number set with the wafer identification number to verify the wafer; wherein the standard wafer identification number set is pre-stored in the control module or the control module obtains it from an external device through a communication module.

[0017] Optionally, the comparison of the standard wafer identification number set with the wafer identification number includes: comparing the wafer identification number with each standard wafer identification number in the standard wafer identification number set, and when the wafer identification number and each standard wafer identification number cannot be successfully matched, determining that the wafer identification number is incorrect. Or, comparing the order of the wafer identification number in the wafer box with the order of the standard wafer identification number matching the wafer identification number in the standard wafer identification number set, and when the order is inconsistent, determining that the wafer identification number is incorrect. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 A schematic diagram of the basic structure of a wafer box provided by an embodiment of the present invention;

[0019] Figure 2 A schematic diagram of the basic structure of another wafer box provided by an embodiment of the present invention;

[0020] Figure 3 A schematic diagram of the basic structure of a wafer flat edge provided by an embodiment of the present invention;

[0021] Figure 4 A schematic diagram of the basic components of an image acquisition module provided in an embodiment of the present invention;

[0022] Figure 5 A schematic diagram of highlighting a display module is provided for an embodiment of the present invention;

[0023] Figure 6 A schematic diagram of the basic structure of another wafer box provided by an embodiment of the present invention;

[0024] Figure 7 A basic flow chart of a method for checking wafers provided in another optional embodiment of the present invention;

[0025] Description of reference numerals:

[0026] 1-wafer box, 10-wafer box body, 11-control module, 12-image acquisition module, 13-wafer box cover, 14-communication module, 15-display module, 16-switch module, 2-wafer flat edge, 3-slide rail, 4-charged coupler, 5-light source emitter. DETAILED DESCRIPTION

[0027] In order to facilitate the understanding of the present application, the present application will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present application are given in the drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present application more thoroughly and comprehensively understood.

[0028] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application.

[0029] The production process of traditional light-emitting diodes (LEDs) includes a wafer production process. During the wafer production process, wafers after each process are placed in a wafer box (Cassette). It is necessary to check whether the identification number of each wafer in the wafer box is consistent with the identification number in the process card. If they are consistent, the wafer will be sent to the next station for production. If they are inconsistent, they cannot be sent to the next station for production. This verification process relies on staff to verify information. In actual production, staff verification errors often occur, and when verifying information, it is necessary to remove the upper cover of the wafer box and visually identify the wafers in the wafer box, which is easy to cause particle contamination. In addition, the wafer identification number is very small. For example, when the wafer identification number is a laser-engraved number, the laser-engraved number has a maximum of 11 characters and is very small. The height of the laser-engraved number is about 0.8 mm, which is difficult to identify with the naked eye. At the same time, each wafer box has multiple wafers, and the information of each wafer needs to be verified. Long-term use of the human eye will cause eye fatigue and lack of concentration, resulting in low verification efficiency or errors. This will cause rework and repair in the production process and the problem of untraceability, which brings many difficulties and risks to production management.

[0030] The present application hopes to provide a solution that can solve the above-mentioned technical problems, and the details thereof will be described in subsequent embodiments.

[0031] Embodiments of the present invention

[0032] In order to solve the problem of low efficiency and easy error in checking the identification number of each wafer in the wafer box in the related art, the embodiment of the present invention proposes a wafer box 1, such as Figure 1As shown, the wafer box 1 comprises: a wafer box body 10, a control module 11, and an image acquisition module 12. The wafer box body 10 is provided with a plurality of slots for accommodating wafers, a wafer identification number is provided on one side of the wafer, the position of the image acquisition module 12 corresponds to the side of the wafer provided with the wafer identification number, and the control module 11 is connected to the image acquisition module 12; wherein, the image acquisition module 12 is used to scan each wafer in the slot to collect the wafer identification number information corresponding to each wafer as the verification information of each wafer, and transmit it to the control module 11 for processing. It should be noted that the wafer identification number information is used as the verification information of each wafer to verify the wafer, but the process of verifying the wafer can be performed in whole or in part by the wafer box.

[0033] The wafer box 1 provided in this embodiment adds a control module 11 and an image acquisition module 12, and the wafer identification number information of the wafer is collected by the image acquisition module 12, and the collected wafer identification number information is processed by the control module 11, thereby avoiding the problem of low efficiency and easy error in human eye recognition of the wafer identification number information of the wafer, and improving the efficiency of wafer verification.

[0034] In some examples of this embodiment, Figure 2 As shown, the wafer box 1 also includes a switch module 16, which is used to connect with the control module 11. When the switch module 16 receives an external start-up instruction, it sends a start signal to the control module 11 according to the start-up instruction, and the control module 11 drives the image acquisition module 12 to scan; in some examples, the switch module 16 can be directly connected to the image acquisition module 12. When the switch module 16 receives an external start-up instruction, it sends a start signal to drive the image acquisition module 12 to scan according to the start-up instruction; in some examples, the image acquisition module 12 can start scanning directly after powering on without waiting for the start signal. Among them, the switch module 16 includes but is not limited to one of a physical switch, a touch screen switch, etc. that can be set on the wafer box 1.

[0035] It is understandable that the wafer box body 10 is provided with a plurality of symmetrical slots, the size of which is strictly uniform and used to support both sides of the wafer, and a symmetrical slot is used to accommodate a wafer, and the wafers that the wafer box body 10 can accommodate are not limited. Preferably, the wafer box body 10 is provided with 25 symmetrical slots, which can hold 25 wafers. In some examples, the wafer box 1 also includes: a wafer box cover 13, which can cooperate with the wafer box body 10 to form a sealed box body.

[0036] There is no doubt that the material of the wafer box body 10 is generally heat-resistant, wear-resistant and anti-static material. For example, the material of the wafer box is heat-resistant, wear-resistant and anti-static transparent plastic material; for another example, the material of the wafer box is aluminum profile.

[0037] In some examples of this embodiment, the wafer box 1 also includes: a communication module 14, which is used to establish a communication connection between the control module 11 and an external device, and the communication module 14 includes but is not limited to at least one of the following: a wireless communication interface, an RS232 interface, an RS485 interface, a GPIB interface, an Ethernet interface, a USB interface, and a multi-machine synchronization interface; wherein the wireless communication method in the wireless communication interface includes but is not limited to at least one of the following: Bluetooth, WiFi, infrared communication, and near field communication technology (Near Field Communication, NFC).

[0038] It should be understood that the control module 11 of the wafer box 1 can establish a communication connection with an external device through the communication module 14. For example, the control module 11 of the wafer box 1 can be connected to a manufacturing execution system (MES) reporting computer through the communication module 14. The external device can also be other devices.

[0039] It is understood that the wafer identification number is set on either side of the wafer; preferably, Figure 3 As shown, there is a flat edge on the wafer, and the wafer identification number is set on the flat edge 2 of the wafer. When the wafer is placed in the wafer box, each wafer flat edge 2 faces one direction; at the same time, the position of the image acquisition module 12 corresponds to the wafer flat edge 2, so that the wafer identification number information corresponding to the wafer identification number can be acquired. For example, when the wafer flat edge 2 faces the bottom, the image acquisition module 12 is set at the bottom of the wafer box body 10; in some examples, the wafer box 1 includes a wafer box cover 13, and when the wafer flat edge faces the wafer box cover 13, at this time, the image acquisition module 12 is set on the side of the wafer box cover 13 facing the wafer flat edge 2; it should be understood that the control module 11, the communication module 14 and other modules can be set in the wafer box body 10, and can also be set in the wafer box cover 13.

[0040] In some examples of this embodiment, Figure 4As shown, the image acquisition module 12 includes: a slide rail 3, and a single charge coupler 4 (CCD) arranged on the slide rail 3. The sliding direction of the slide rail 3 is consistent with the setting direction of the card slot, and the charge coupler 4 can slide along the sliding direction of the slide rail 3 to sequentially scan the wafers in the card slot, so as to collect the wafer identification number information of each wafer in turn, and transmit it to the control module 11 for processing; for example, the charge coupler 4 slides from front to back (the 1st to the 25th wafer) through the slide rail 3 to scan, and the scanning time interval is calculated according to the sliding speed of the charge coupler 4 and the distance between each wafer. The charge coupler 4 slides in front of the side of each wafer with the wafer identification number, and scans the wafer identification number at the position of the flat edge 2 of the wafer. When the external yellow light (or other light that will not affect the photosensitive adhesive on the wafer) is reflected from the wafer identification number of the wafer, it is shot into the charge coupler 4 through the lens. The charge coupler 4 converts the light into an analog voltage signal and marks the grayscale of each pixel. The analog-to-digital converter then converts the analog voltage signal into a digital signal and converts the light signal into an electrical signal. The wafer marking information of the 1st to 25th wafer positions is recorded in sequence, and the wafer identification number information of wafers 1-25 is obtained in sequence.

[0041] In some examples of this embodiment, the image acquisition module 12 includes: a slide rail 3, and at least two charge couplers 4 arranged on the slide rail 3, at least two of the charge couplers 4 can slide along the sliding direction of the slide rail 3 to scan each wafer in the card slot, so as to simultaneously collect the wafer identification number information of multiple wafers and transmit it to the control module 11 for processing; for example, the image acquisition module 12 includes: a slide rail 3, and two charge couplers 4 arranged on the slide rail 3, two charge couplers 4 are respectively arranged at both ends of the slide rail 3, and the two charge couplers 4 are respectively on the slide rail 3, and slide toward the center direction for scanning, and the scanning time interval is calculated according to the sliding speed of each charge coupler 4 and the distance between each wafer, and the charge coupler 4 slides to the front of the side of the wafer with the wafer identification number, and scans the wafer identification number at the flat edge position, and when the external light is reflected from the wafer identification number of the wafer, it is respectively shot into the charge coupler 4 through the lens, thereby realizing simultaneous scanning of multiple wafers.

[0042] In some examples of this embodiment, the image acquisition module 12 includes: a charge coupler 4, which simultaneously scans each wafer in the card slot to simultaneously collect wafer identification number information of all wafers in the wafer box body 10, and transmits it to the control module 11 for processing.

[0043] In some examples of this embodiment, the image acquisition module 12 also includes a light source emitter 5, wherein the light source emitter 5 is used to emit light to illuminate the wafer identification number of the wafer, thereby forming a fill light effect for the shooting of the charge coupler 4, thereby making the wafer identification number of the wafer scanned by the charge coupler 4 clearer.

[0044] It should be understood that the light source emitter 5 includes but is not limited to: one of: a yellow light source emitter 5, a white light source emitter 5, etc.; there is no doubt that photosensitive glue may be provided on the wafer in the wafer box body 10, in order to avoid the phenomenon that the light emitted by the light source emitter 5 causes light irradiation to the photosensitive glue; preferably, the light source emitter 5 adopts a yellow light source emitter 5 that will not cause light irradiation to the photosensitive glue, and emits yellow light to illuminate the wafer identification number of the wafer.

[0045] In some examples of this embodiment, the communication module 14 is used to receive the standard wafer identification number transmitted externally and transmit it to the control module 11; the devices that transmit the standard wafer identification number include but are not limited to: MES reporting computers, control terminals and other devices that store standard wafer identification numbers. After the communication module 14 receives the standard wafer identification number transmitted externally, it transmits it to the control module 11.

[0046] In some examples of this embodiment, the control module 11 is configured to identify the wafer identification number information, obtain the wafer identification number, and compare the standard wafer identification number set with the wafer identification number to verify the wafer. The standard wafer identification number set can be pre-stored in the control module 11 in any manner; or it can be obtained from the outside in real time, for example, the standard wafer identification number set is obtained by the control module 11 from an external device through the communication module 14, that is, the standard wafer identification number set transmitted by the external device can be received.

[0047] It can be understood that the number of standard wafer identification numbers in the standard wafer identification number set corresponds to the number of wafers contained in the wafer box 1; for example, when the number of wafers contained in the wafer box 1 is 25, there are 25 standard wafer identification numbers in the standard wafer identification number set.

[0048] It can be understood that the wafer identification number information recorded by the charge coupler 4 is a kind of image information, and the control module 11 can extract the text information in the wafer identification number information recorded by the charge coupler 4 through the optical character recognition (OCR) technology, and then obtain the wafer identification number corresponding to the wafer identification number information; for example, the text information in the image recorded by the charge coupler 4 is extracted through the opencv algorithm in the optical character recognition technology, and the text is positioned and corrected through binarization, noise filtering, and correlation domain analysis. The text is recognized and compared with the standard library (numbers, letters, fonts) using algorithms such as logistic regression, SVM, Adaboost, and character cutting. Finally, the recognized wafer identification number is output, and the wafer identification number corresponding to the wafer identification number information is obtained. It should be understood that the recognized wafer identification numbers correspond to the order of the wafers in the wafer box body.

[0049] In some examples of this embodiment, the control module 11 is configured to identify the wafer identification number information to obtain a wafer identification number, and transmit the wafer identification number to the external device through the communication module 14, so that the external device compares the standard wafer identification number set with the wafer identification number to verify the wafer.

[0050] In some examples of this embodiment, the control module 11 is configured to send the wafer identification number information to an external device through the communication module 14, so that the external device identifies the wafer identification number information, obtains the wafer identification number, and compares the standard wafer identification number set with the wafer identification number to verify the wafer.

[0051] It can be understood that by comparing the wafer identification numbers through the control module 11 or by the control module 11 cooperating with external equipment to compare the wafer identification numbers, the process of manually comparing the wafer identification numbers is avoided, which is more conducive to improving the efficiency and accuracy of wafer verification.

[0052] There is no doubt that the standard wafer identification number is stored in the external device, wherein the standard wafer identification number in the external device can be a device with a standard wafer identification number such as an MES reporting computer and a control terminal, which is transmitted to the external device. Alternatively, the external device itself stores the standard wafer identification number stored according to the input instruction.

[0053] It is understandable that the external device can also extract the text information in the wafer identification number information recorded by the charge coupler 4 through optical character recognition technology, and then obtain the wafer identification number corresponding to the wafer identification number information, which will not be repeated here.

[0054] In some examples of this embodiment, the comparison of the standard wafer identification number set with the wafer identification number includes: comparing the wafer identification number with each standard wafer identification number in the standard wafer identification number set, and when the wafer identification number cannot be successfully matched with each standard wafer identification number, it is determined that the wafer identification number is incorrect. Specifically, when the wafer identification number is inconsistent with all standard wafer identification numbers in the standard wafer identification number set, it is determined that the wafer identification number does not belong to the standard wafer identification number set. At this time, it is determined that the wafer identification number corresponding to the wafer identification number information is incorrect, that is, the verification of the wafer corresponding to the wafer identification number is incorrect. On the contrary, when the wafer identification number is consistent with any one of the standard wafer identification numbers in the standard wafer identification number set, it is determined that the wafer identification number belongs to the standard wafer identification number set. At this time, it is determined that the wafer identification number corresponding to the wafer identification number information is correct, that is, the verification of the wafer corresponding to the wafer identification number is correct.

[0055] In some examples of this embodiment, the comparison of the standard wafer identification number set with the wafer identification number includes: comparing the order of the wafer identification number in the wafer box 1 with the order of the standard wafer identification number that matches the wafer identification number in the standard wafer identification number set, and when the order is inconsistent, determining that the wafer identification number is incorrect. Specifically, the order of each wafer identification number in the wafer box 1 represents the order of each wafer in the wafer box 1. When the order of the wafer identification number in the wafer box 1 is inconsistent with the order of the standard wafer identification number that matches the wafer identification number in the standard wafer identification number set, it indicates that the wafers are out of order and are incorrect from the standard order. At this time, it can also be determined that the wafer identification number corresponding to the wafer identification number information is incorrect, that is, the wafer corresponding to the wafer identification number is incorrectly checked and is out of order. On the contrary, when the order of the wafer identification numbers in the wafer box 1 is consistent with the order of the standard wafer identification numbers matching the wafer identification numbers in the standard wafer identification number set, it indicates that there is no disorder in the wafers and they are correct in the standard order. At this time, it can also be determined that the wafer identification number corresponding to the wafer identification number information is correct, that is, the wafer corresponding to the wafer identification number is checked correctly.

[0056] In some examples of this embodiment, the display module 15 is configured to display the wafer identification number and highlight the incorrect wafer identification number; wherein the display module 15 includes but is not limited to: various display screens, such as LED display screens, etc. For example, Figure 5As shown, the display module 15 can display each wafer identification number identified through the display screen. If the wafer identification number is correct, it is displayed with a gray background; when a wafer identification number is incorrect, the background of the incorrect wafer identification number is changed to a red background to remind the user that the wafer corresponding to the wafer identification number is incorrect. In some other examples, the wafer box also includes other modules such as speakers that can provide message prompts. For example, when a wafer identification number is identified as incorrect, the speaker also broadcasts the wafer identification number as incorrect, and says the serial number of the wafer identification number in the wafer box 1, thereby reminding the user that the wafer corresponding to the wafer identification number is incorrect.

[0057] It should be understood that the display module 15 can be connected to the control module 11, receive the information that the wafer identification number is incorrect transmitted by the control module 11, and then highlight it; the display module 15 can also be directly connected to an external device, receive the information that the wafer identification number is incorrect transmitted by the external device, and then highlight it. It should be understood that in some examples, the wafer box 1 is not provided with a display module 15, and the prompt that the wafer identification number is incorrect is directly provided by an external device.

[0058] In order to better understand the present invention, this embodiment provides a more specific example to illustrate the wafer box 1 provided by the present invention. Figure 6 As shown, the wafer box 1 includes but is not limited to: a wafer box body 10, a wafer box cover 13, a communication module 14, a control module 11, an image acquisition module 12, a display module 15, and a switch module 16; the control module 11 is respectively connected to the communication module 14, the image acquisition module 12, the display module 15, and the switch module 16;

[0059] Among them, 25 pairs of symmetrical card slots are provided in the wafer box body 10, and one pair of symmetrical card slots is used to accommodate a wafer. The sizes of the card slots are strictly unified and used to support both sides of the wafer. The wafer box body 10 can hold 25 wafers. The wafer box cover 13 can cooperate with the wafer box body 10 to form a sealed box body for storing and transporting wafers. The wafer identification number on each wafer is a laser engraved number.

[0060] It can be understood that there is a flat edge on the wafer, and the wafer laser engraving mark is set on the flat edge 2 of the wafer. When the wafer is placed in the wafer box, each wafer flat edge 2 faces the upper cover; the image acquisition module 12 is set on the side of the wafer box upper cover 13 facing the wafer flat edge 2, so as to be able to collect the laser engraving mark of each wafer.

[0061] In some examples of this embodiment, after the wafer box cover 13 is closed, and when the switch module 16 receives an external start-up command, a start-up signal is sent to the control module 11 according to the external start-up command, and the control module 11 drives the image acquisition module 12 to scan; the control module 11 is also used to receive the batch number and laser marking number set of the batch of wafer products transmitted by the MES reporting computer through the wireless interface in the communication module 14, wherein the batch number is the number of a batch of products, which is used to check the production time, quality and validity period of the products, etc., and the laser marking number set includes 25 standard laser marking numbers.

[0062] It should be understood that the image acquisition module 12 includes: a slide rail 3, a single charge coupler 4 arranged on the slide rail 3, and a yellow light source emitter 5, wherein the yellow light source emitter 5 is used to emit yellow light to illuminate the flat edge 2 of the wafer, thereby forming an illumination for the laser engraved mark, forming a fill light effect for the shooting of the charge coupler 4, thereby making the laser engraved mark of the wafer scanned by the charge coupler 4 clearer.

[0063] The sliding direction of the slide rail 3 is consistent with the setting direction of the card slot, and the charge coupler 4 can slide along the sliding direction of the slide rail 3 to sequentially scan each wafer in the card slot, so as to sequentially collect the laser marking number information of each wafer and transmit it to the control module 11 for processing;

[0064] In some examples of this embodiment, the control module 11 sends instructions to the image acquisition module 12, and the image acquisition module 12 feeds back the specific position of the charge coupler 4 on the slide rail 3 to the controller, and sends instructions to the charge coupler 4 to collect images, thereby obtaining the laser engraving information, and then feeds back the collected image signal to the control module 11. Specifically, the charge coupler 4 slides from front to back (the 1st to the 25th) through the slide rail 3 to scan, and the scanning time interval is calculated according to the sliding speed of the charge coupler 4 and the distance between each wafer. The charge coupler 4 slides in front of the side of each wafer with the laser engraving, and scans the laser engraving at the flat edge position. When the external yellow light is reflected from the wafer identification number of the wafer, it is shot into the charge coupler 4 through the lens. The charge coupler 4 converts the light into an analog voltage signal and marks the grayscale of each pixel. The analog-to-digital converter then converts the analog voltage signal into a digital signal and converts the light signal into an electrical signal. The wafer marking information of the 1st to 25th wafer positions is recorded in sequence, and the wafer laser marking information of wafers 1-25 is obtained in sequence.

[0065] Continuing with the above example, the control module 11 extracts the text information from the image information recorded by the charge coupled device 4 through the opencv algorithm in the optical character recognition technology, and performs pre-processing such as positioning and correction of the text through binarization, noise filtering, and correlation domain analysis. It uses algorithms such as logistic regression, SVM, Adaboost, and character cutting to perform text recognition and compare it with the standard library (numbers, letters, fonts). Finally, it outputs the recognized laser engraving number, and checks the laser engraving number with the standard laser engraving number transmitted by the previous MES reporting computer through the wireless communication module 14 in turn.

[0066] In some examples of this embodiment, the display module 15 includes but is not limited to a display screen arranged on a side of the wafer box upper cover 13 away from the wafer, the control module 11 sends the identified laser engraving number information to the display module 15, and the display module 15 displays the laser engraving numbers corresponding to the 1st to 25th wafers through the display screen. If the laser engraving number identified by scanning is inconsistent with the transmitted standard laser engraving number, the display background of the laser engraving number is red for warning. If the verification is correct, the display background of the laser engraving number is gray.

[0067] The wafer box provided in this embodiment adds a control module, an image acquisition module, a communication module, and a display module. The wafer identification number information of the wafer is collected through the image acquisition module, thereby avoiding errors caused by manual recognition of the wafer identification number information of the wafer by the naked eye; at the same time, the collected wafer identification number information is processed by the control module to check each wafer in the wafer box body, thereby avoiding manual checking of each wafer in the wafer box, which is inefficient and prone to errors. Furthermore, when a problem is found during checking, the user is directly reminded through the display module, thereby improving the efficiency of wafer checking.

[0068] Another optional embodiment of the present invention

[0069] Based on the same concept, the present invention also provides a method for checking wafers, which is applied to the wafer box as described above. Figure 7 As shown, the method for checking the wafer includes but is not limited to:

[0070] S101, scanning each wafer in the card slot of the wafer box to collect the wafer identification number information corresponding to each wafer;

[0071] The step of collecting the wafer identification number information can be implemented by an image acquisition module. The collected wafer identification number information is used as the verification information of the wafer, that is, the wafer identification number information is used to verify the wafer.

[0072] S102, transmitting the collected wafer identification number information to the control module for processing;

[0073] The wafer identification number information is used to check the wafer. The method for checking wafers provided in this embodiment collects the wafer identification number information of the wafer through the image acquisition module, and at the same time, processes the collected wafer identification number information through the control module, thereby avoiding the problem that the wafer identification number information of the wafer is inefficient and prone to errors when the human naked eye recognizes the wafer, and improves the efficiency of wafer checking.

[0074] In some examples of this embodiment, the method for verifying the wafer further includes: identifying the wafer identification number information to obtain the wafer identification number; comparing the standard wafer identification number set with the wafer identification number to verify the wafer. The standard wafer identification number set may be pre-stored in the control module in any manner; or may be obtained from the outside in real time, for example, the standard wafer identification number set is the standard wafer identification number set transmitted by the external device and received by the control module through the communication module.

[0075] In some examples of this embodiment, the method for verifying wafers also includes: identifying the wafer identification number information to obtain a wafer identification number; transmitting the wafer identification number to an external device so that the external device compares a standard wafer identification number set with the wafer identification number to verify the wafer.

[0076] In some examples of this embodiment, the method for verifying wafers also includes: sending the wafer identification number information to an external device so that the external device identifies the wafer identification number information to obtain a wafer identification number, and compares a standard wafer identification number set with the wafer identification number to verify the wafer.

[0077] In some examples of this embodiment, the comparison of the standard wafer identification number set with the wafer identification number includes: comparing the wafer identification number with each standard wafer identification number in the standard wafer identification number set, and when the wafer identification number cannot be successfully matched with each of the standard wafer identification numbers, it is determined that the wafer identification number is incorrect. Specifically, when the wafer identification number is inconsistent with all the standard wafer identification numbers in the standard wafer identification number set, it is determined that the wafer identification number does not belong to the standard wafer identification number set. At this time, it is determined that the wafer identification number corresponding to the wafer identification number information is incorrect, that is, the verification of the wafer corresponding to the wafer identification number is incorrect. On the contrary, when the wafer identification number is consistent with any one of the standard wafer identification numbers in the standard wafer identification number set, it is determined that the wafer identification number belongs to the standard wafer identification number set. At this time, it is determined that the wafer identification number corresponding to the wafer identification number information is correct, that is, the verification of the wafer corresponding to the wafer identification number is correct.

[0078] In some examples of this embodiment, the comparison of the standard wafer identification number set with the wafer identification number includes: comparing the order of the wafer identification number in the wafer box with the order of the standard wafer identification number that matches the wafer identification number in the standard wafer identification number set, and when the order is inconsistent, determining that the wafer identification number is incorrect. Specifically, the order of each wafer identification number in the wafer box represents the order of each wafer in the wafer box. When the order of the wafer identification number in the wafer box is inconsistent with the order of the standard wafer identification number that matches the wafer identification number in the standard wafer identification number set, it indicates that the wafers are out of order and are incorrect from the standard order. At this time, it can also be determined that the wafer identification number corresponding to the wafer identification number information is incorrect, that is, the wafer corresponding to the wafer identification number is incorrectly checked and is out of order. On the contrary, when the order of the wafer identification numbers in the wafer box is consistent with the order of the standard wafer identification numbers matching the wafer identification numbers in the standard wafer identification number set, it indicates that there is no disorder in the wafers and they are correct in the standard order. At this time, it can also be determined that the wafer identification number corresponding to the wafer identification number information is correct, that is, the wafer corresponding to the wafer identification number is checked correctly.

[0079] In some examples of this embodiment, the method for checking wafers further includes: highlighting the incorrect wafer identification number through a display module when the wafer identification number corresponding to the wafer identification number information is incorrect; wherein the display module includes but is not limited to: various display screens. For example, each identified wafer identification number can be displayed through a display screen, and if the wafer identification number is correct, it is displayed with a gray background; when a wafer identification number is incorrect, the background of the incorrect wafer identification number is changed to a red background to remind the user that the wafer corresponding to the wafer identification number is incorrect.

[0080] It should be understood that the application of the present invention is not limited to the above examples. For ordinary technicians in this field, improvements or changes can be made based on the above description. All these improvements and changes should fall within the scope of protection of the claims attached to the present invention.

Claims

1. A wafer box, characterized in that: The wafer box includes: a wafer box body, a control module, and an image acquisition module; The wafer box body is provided with a plurality of slots for accommodating wafers, a wafer identification number is provided on the side of the wafer, the position of the image acquisition module corresponds to the side of the wafer provided with the wafer identification number, and the control module is connected to the image acquisition module; Wherein, the image acquisition module is used to scan each wafer in the card slot to collect the wafer identification number information corresponding to each wafer as the verification information of each wafer, and transmit it to the control module for processing; wherein, the image acquisition module includes a slide rail, at least one charge coupler arranged on the slide rail, and at least two light source emitters arranged on both sides of the slide rail, the sliding direction of the slide rail is consistent with the setting direction of the card slot, and the light source emitter is used to emit light from both sides to illuminate the wafer identification number of the wafer, so as to provide fill light during the process of the charge coupler scanning the wafer identification number of the wafer.

2. The wafer box according to claim 1, characterized in that: The control module is configured to identify the wafer identification number information to obtain the wafer identification number, and compare the standard wafer identification number set with the wafer identification number to verify the wafer.

3. The wafer box according to claim 1, characterized in that: The wafer box also includes: a communication module, and the communication module is used to establish a communication connection between the control module and an external device.

4. The wafer box according to claim 3, characterized in that: The control module is also configured to identify the wafer identification number information to obtain the wafer identification number, and transmit the wafer identification number to the external device through the communication module, so that the external device compares the standard wafer identification number set with the wafer identification number to verify the wafer.

5. The wafer box according to any one of claims 1 to 4, characterized in that: The image acquisition module comprises: A slide rail and a single charge coupler arranged on the slide rail, the sliding direction of the slide rail is consistent with the setting direction of the card slot, and the charge coupler can slide along the sliding direction of the slide rail to sequentially scan each wafer in the card slot, collect the wafer identification number information of each wafer in turn, and transmit it to the control module for processing.

6. The wafer box according to any one of claims 1 to 4, characterized in that: The image acquisition module comprises: A slide rail, and at least two charge couplers arranged on the slide rail, at least two of the charge couplers can slide along the sliding direction of the slide rail to scan each wafer in the card slot, and at the same time collect the wafer identification number information of multiple wafers and transmit it to the control module for processing.

7. The wafer box according to any one of claims 1 to 4, characterized in that: The wafer box also includes: A display module is connected to the control module, and is configured to display the wafer identification numbers and highlight incorrect wafer identification numbers.

8. A method for checking wafers, applied to the wafer box according to any one of claims 1 to 7, characterized in that: The method for checking wafers comprises: Scanning each wafer in the card slot of the wafer box to collect the wafer identification number information corresponding to each wafer as verification information of each wafer; The collected wafer identification number information is transmitted to the control module for processing.

9. The method for checking wafers according to claim 8, wherein: The step of the control module processing the wafer identification information includes: Identify the wafer identification number information to obtain the wafer identification number; The standard wafer identification number set is compared with the wafer identification number to verify the wafer; wherein the standard wafer identification number set is pre-stored in the control module or the control module obtains it from an external device through a communication module.

10. The method for checking wafers according to claim 9, wherein: The comparing the standard wafer identification number set with the wafer identification number comprises: Comparing the wafer identification number with each standard wafer identification number in the standard wafer identification number set, and when the wafer identification number and each standard wafer identification number cannot be successfully matched, determining that the wafer identification number is incorrect; or, The order of the wafer identification numbers in the wafer box is compared with the order of standard wafer identification numbers matching the wafer identification numbers in the standard wafer identification number set. When the orders are inconsistent, it is determined that the wafer identification number is incorrect.

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