Wafer coating source machine

Abstract

The application discloses a wafer source coating machine, which comprises a rack, a feeding mechanism, a conveying mechanism, a solvent coating mechanism, a rotating mechanism, a magnetic stirrer, a heating mechanism and a receiving mechanism are sequentially arranged on the rack from left to right, a solvent bottle for containing a diffusion source is placed on the magnetic stirrer, and a first carrying mechanism, a second carrying mechanism and a third carrying mechanism are further arranged on the rack, the first carrying mechanism is used for carrying the wafer from the feeding mechanism to the conveying mechanism, the second carrying mechanism is used for carrying the wafer from the conveying mechanism to the rotating mechanism, and then carrying the wafer from the rotating mechanism to the heating mechanism, and the third carrying mechanism is used for carrying the wafer from the heating mechanism to the receiving mechanism; the wafer is automatically coated with the source, dried and placed, the production efficiency is improved, the product quality is ensured, manual carrying is avoided, the work load of workers is reduced, and the production efficiency is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of wafer production equipment, in particular to a wafer source coating machine. BACKGROUND

[0002] In the semiconductor process, the wafer needs to pass through the processing process of various machines, and in the production process of the semiconductor wafer, the surface of the wafer needs to be coated with a source before boron expansion. Before the boron expansion of the cleaned wafer, operations such as source coating, baking, and wafer collection need to be performed. At present, the source coating is mainly performed by workers using a brush to dip the diffusion source and then coat the wafer with the diffusion source. The use of the brush by workers to coat the source affects the uniformity of the boron source on the wafer surface, the production efficiency is low, and the quality is uncontrollable, which affects the quality of the wafer. Moreover, in the prior art, after the source coating is completed, the wafer needs to be manually taken out and transported to a drying device for drying, which is low in efficiency. SUMMARY

[0003] The present application aims to provide a wafer source coating machine to solve the problems in the background art.

[0004] To achieve the above-mentioned purpose, the present application provides the following technical scheme:

[0005] A wafer source coating machine comprises a rack, a protective cover is arranged above the rack, a display is mounted on the protective cover through a rotating arm, a feeding mechanism, a conveying mechanism, a solvent coating mechanism, a rotating mechanism, a magnetic stirrer, a heating mechanism, and a collecting mechanism are sequentially arranged from left to right above the rack, a solvent bottle for containing a diffusion source is placed on the magnetic stirrer, a first carrying mechanism is arranged on one side of the feeding mechanism and the conveying mechanism, a second carrying mechanism is arranged on one side of the conveying mechanism, the solvent coating mechanism, the rotating mechanism, the magnetic stirrer, and the heating mechanism, a third carrying mechanism is arranged on one side of the heating mechanism and the collecting mechanism, and a turnover mechanism is arranged on the other side of the third carrying mechanism.

[0006] The feeding mechanism and the collecting mechanism are used for storing and placing wafers, the conveying mechanism comprises a conveyor, a supporting leg, a collecting box, a material blocking rod, and a material blocking cylinder, the conveyor is fixed on the supporting leg, the collecting box is arranged on the outer side of the middle section of the conveyor in an inclined manner, the material blocking rod and the material blocking cylinder are connected, and the material blocking cylinder is fixed on the conveyor and opposite to the collecting box.

[0007] The first carrying mechanism is used for carrying the wafer from the feeding mechanism to the conveying mechanism, the second carrying mechanism is used for carrying the wafer from the conveying mechanism to the rotating mechanism, and then carrying the wafer from the rotating mechanism to the heating mechanism, and the third carrying mechanism is used for carrying the wafer from the heating mechanism to the collecting mechanism.

[0008] The solvent coating mechanism comprises a brush holder head for fixing the brush, which is fixed on a rotary lifting mechanism for driving the brush to dip into the solvent bottle to absorb the diffusion source, and then driving the brush to move above the rotary mechanism;

[0009] The rotary mechanism comprises a coating source disc, a rotating disc, a first synchronous pulley, a second synchronous pulley and a third motor, the rotating disc is concentrically arranged in the coating source disc, the mounting shaft at the lower end of the rotating disc is rotatably mounted in the coating source disc, the first synchronous pulley is fixed on the mounting shaft of the coating source disc and is in transmission connection with the second synchronous pulley through a synchronous belt, and the second synchronous pulley is fixed on the motor shaft of the third motor.

[0010] The turning mechanism comprises a third linear module, a rotary cylinder and a fourth mounting plate, the rotary cylinder is fixedly installed on the moving end of the third linear module, the fourth mounting plate is fixedly installed on the output end of the rotary cylinder, and a wafer clamping mechanism is installed on the fourth mounting plate.

[0011] Preferably, the first, second and third conveying mechanisms are arranged at the center of the rack, and the feeding mechanism, the conveying mechanism, the solvent coating mechanism, the rotary mechanism, the magnetic stirrer, the heating mechanism and the collecting mechanism are arranged in two groups and symmetrically arranged on the front and back sides of the first, second and third conveying mechanisms.

[0012] Preferably, the feeding mechanism comprises an electric push rod, a fixed plate, positioning rods and a top disc, the electric push rod is installed below the fixed plate, the output end of the electric push rod penetrates the fixed plate from bottom to top and is fixedly connected with the top disc, the fixed plate is fixed on the rack, a plurality of positioning rods are fixedly installed on the upper end of the fixed plate in a circular array, and two installation rods are symmetrically fixed on the fixed plate.

[0013] Preferably, the collecting mechanism and the feeding mechanism are the same in structure.

[0014] Preferably, the first conveying mechanism comprises a mounting box, a guide rail, a first cylinder, a second cylinder and a suction disc, the guide rail is arranged in the mounting box, the first cylinder is fixed on the outer side of the mounting box, the piston rod of the first cylinder extends into the mounting box and is fixedly connected with a sliding block, the sliding block is slidably installed on the guide rail, the second cylinder is fixed on the outer side of the sliding block, and the piston rod of the second cylinder is fixedly installed with a suction disc for adsorbing a wafer.

[0015] Preferably, the rotating and lifting mechanism comprises a first mounting plate fixed on the frame, a threaded sleeve rotatably mounted on the first mounting plate, a screw threadedly mounted in the threaded sleeve, a first pulley mounted on the screw, a second pulley in transmission connection with the first pulley through a belt, the second pulley being fixed on a motor shaft of a first motor, a third pulley fixedly connected with the lower end of the threaded sleeve, a fourth pulley in transmission connection with the third pulley through a belt, the fourth pulley being fixed on a motor shaft of a second motor, and the first motor and the second motor being fixed on the first mounting plate.

[0016] Preferably, the heating mechanism comprises a heating table, a receiving rod, a cross rod, a vertical rod and a third cylinder, a groove for placing the receiving rod is formed in the heating table, the vertical rods are fixed on the lower ends of the left and right ends of the receiving rod, and the cross rod is fixedly installed between the two vertical rods, and the lower end of the cross rod is fixed on the piston rod of the third cylinder.

[0017] Preferably, the second carrying mechanism comprises a first linear module, a moving block, a fourth cylinder and a second mounting plate, the moving block is fixedly installed on the output end of the first linear module, the fourth cylinder is fixed on the outer side of the moving block, the output end of the fourth cylinder is fixedly connected with the second mounting plate, and the second mounting plate is provided with a wafer clamping mechanism at each of the left and right ends of the lower end thereof.

[0018] Preferably, the third carrying mechanism comprises a second linear module, a fifth cylinder and a third mounting plate, the fifth cylinder is fixedly installed on the moving end of the second linear module, the output end of the fifth cylinder is fixedly installed with the third mounting plate, and the lower end of the third mounting plate is provided with a wafer clamping mechanism.

[0019] Preferably, the wafer clamping mechanism comprises a double-head cylinder, a fifth mounting plate and a clamping rod, the fifth mounting plates are fixedly installed on the two output ends of the double-head cylinder, and the lower end of the fifth mounting plate is symmetrically provided with the two clamping rods.

[0020] Compared with the prior art, the present application has the following beneficial effects:

[0021] The present application realizes automatic source coating, drying and placing of wafers, improves the efficiency, guarantees the product quality, avoids manual carrying, reduces the work load of workers, and improves the production efficiency. BRIEF DESCRIPTION OF DRAWINGS

[0022] Figure 1 It is a schematic diagram of the overall structure of the present application;

[0023] Figure 2 It is a schematic diagram of the internal structure of the present application;

[0024] Figure 3 It is a schematic diagram of the internal structure of the present application;

[0025] Figure 4 Structure diagram of the material releasing mechanism of the present application;

[0026] Figure 5 Structure diagram of the material collecting mechanism of the present application;

[0027] Figure 6 Structure diagram of the material releasing mechanism, the conveying mechanism and the first carrying mechanism of the present application;

[0028] Figure 7 Structure diagram of the conveying mechanism of the present application;

[0029] Figure 8 Structure diagram of the conveying mechanism, the solvent coating mechanism, the rotating mechanism, the magnetic stirrer, the heating mechanism and the second carrying mechanism of the present application;

[0030] Figure 9 Structure diagram of the second carrying mechanism of the present application;

[0031] Figure 10 Structure diagram of the wafer clamping mechanism of the present application;

[0032] Figure 11 Structure diagram of the solvent coating mechanism, the rotating mechanism and the heating mechanism of the present application;

[0033] Figure 12 Structure diagram of the heating mechanism, the material collecting mechanism, the third carrying mechanism and the wafer turning mechanism of the present application;

[0034] Figure 13 Structure diagram of the third carrying mechanism of the present application;

[0035] Figure 14 Structure diagram of the wafer turning mechanism of the present application.

[0036] In the figure: 1 rack, 2 feeding mechanism, 21 electric push rod, 22 fixed plate, 23 positioning rod, 24 mounting rod, 25 air nozzle, 26 top disc, 3 conveying mechanism, 31 conveyor, 32 supporting leg, 33 material receiving box, 34 material blocking rod, 35 material blocking cylinder, 4 first carrying mechanism, 41 mounting box, 42 guide rail, 43 first cylinder, 44 second cylinder, 45 suction cup, 5 solvent application mechanism, 501 first mounting plate, 502 screw rod, 503 threaded sleeve, 504 first pulley, 505 second pulley, 506 first motor, 507 third pulley, 508 fourth pulley, 509 second motor, 510 brush clamping head, 511 brush, 6 rotating mechanism, 61 source coating disc, 62 rotating disc, 63 first synchronous pulley, 64 second synchronous pulley, 65 third motor, 7 magnetic stirrer, 8 heating mechanism, 81 heating table, 82 material receiving rod, 83 horizontal rod, 84 vertical rod, 85 third cylinder, 9 second carrying mechanism, 91 first linear module, 92 moving block, 93 fourth cylinder, 94 second mounting plate, 10 material receiving mechanism, 11 third carrying mechanism, 111 second linear module, 112 fifth cylinder, 113 third mounting plate, 12 surface turning mechanism, 121 third linear module, 122 rotating cylinder, 123 fourth mounting plate, 13 wafer, 14 solvent bottle, 15 wafer clamping mechanism, 151 double-head cylinder, 152 fifth mounting plate, 153 clamping rod, 16 protective cover, 17 display. DETAILED DESCRIPTION

[0037] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by a person of ordinary skill in the art without creative work fall within the protection scope of the present application.

[0038] Please refer to Figure 1 The present application provides a technical solution:

[0039] A wafer source coating machine comprises a rack 1, a protective cover 16 is arranged above the rack 1, a display 17 is mounted on the protective cover 16 through a rotating arm, and the display 17 serves as a man-machine interactive interface to control the mechanisms in the rack 1.

[0040] The rack 1 is provided with a feeding mechanism 2, a conveying mechanism 3, a solvent coating mechanism 5, a rotating mechanism 6, a magnetic stirrer 7, a heating mechanism 8 and a receiving mechanism 10 from left to right above the rack 1 in sequence, the magnetic stirrer 7 is provided with a solvent bottle 14 for containing a diffusion source, the diffusion source in the solvent bottle 14 is stirred by the magnetic stirrer 7 to keep the diffusion source uniform and ensure the quality of the coating source. The feeding mechanism 2 and the conveying mechanism 3 are provided with a first carrying mechanism 4 on one side, the conveying mechanism 3, the solvent coating mechanism 5, the rotating mechanism 6, the magnetic stirrer 7 and the heating mechanism 8 are provided with a second carrying mechanism 9 on one side, the heating mechanism 8 and the receiving mechanism 10 are provided with a third carrying mechanism 11 on one side, and the other side is provided with a turnover mechanism 12.

[0041] The first carrying mechanism 4, the second carrying mechanism 9 and the third carrying mechanism 11 are arranged at the center of the rack 1, and the feeding mechanism 2, the conveying mechanism 3, the solvent coating mechanism 5, the rotating mechanism 6, the magnetic stirrer 7, the heating mechanism 8 and the receiving mechanism 10 are arranged in two groups and symmetrically arranged on the front and back of the first carrying mechanism 4, the second carrying mechanism 9 and the third carrying mechanism 11.

[0042] The feeding mechanism 2 and the receiving mechanism 10 are used for storing wafers 13, the feeding mechanism 2 includes an electric push rod 21, a fixed plate 22, a positioning rod 23 and a top disc 26, the electric push rod 21 is installed below the fixed plate 22, the output end of the electric push rod 21 penetrates the fixed plate 22 from bottom to top and is fixedly connected with the top disc 26, the fixed plate 22 is fixed on the rack 1, a plurality of positioning rods 23 arranged in a circular array are fixedly installed on the upper end of the fixed plate 22, and two installation rods 24 are symmetrically fixed on the fixed plate 22, and an air nozzle 25 is fixed above the installation rod 24. The wafer 13 without coating source is placed on the top disc 26, the position of the wafer 13 without coating source is constrained by the four positioning rods 23, air is blown to the uppermost wafer 13 without coating source through the air nozzle 25, so that the suction cup 45 only sucks one wafer 13 at a time, the top disc 26 is pushed up by the electric push rod 21, so that the uppermost wafer 13 without coating source is always at the same height, and the first carrying mechanism 4 is convenient to carry.

[0043] The first carrying mechanism 4 is used for carrying the wafer 13 from the feeding mechanism 2 to the conveying mechanism 3, and comprises a mounting box 41, guide rails 42, a first cylinder 43, a second cylinder 44 and a suction disc 45. In the embodiment, two guide rails 42, two first cylinders 43, two second cylinders 44 and two suction discs 45 are arranged, which can carry the wafer 13 without source on both sides of the first carrying mechanism 4. The guide rails 42 are arranged in the mounting box 41, the first cylinder 43 is fixed outside the mounting box 41, the piston rod of the first cylinder 43 extends into the mounting box 41 and is connected with a sliding block, the sliding block is slidably arranged on the guide rail 42, the second cylinder 44 is fixed outside the sliding block, the piston rod of the second cylinder 44 is fixedly connected with the suction disc 45 for adsorbing the wafer 13, the suction disc 45 moves left and right through the extension and contraction of the piston rod of the first cylinder 43, and the suction disc 45 moves up and down through the extension and contraction of the piston rod of the second cylinder 44, so as to facilitate the carrying of the wafer at different positions and heights.

[0044] The conveying mechanism 3 comprises a conveyor 31, a supporting leg 32, a receiving box 33, a blocking rod 34 and a blocking cylinder 35. The conveyor 31 is fixed on the supporting leg 32, the receiving box 33 is arranged on the outer side of the middle section of the conveyor 31, the blocking rod 34 is connected with the blocking cylinder 35, the blocking cylinder 35 is fixed on the conveyor 31 and opposite to the receiving box 33. The wafer 13 without source is carried to the conveyor 31 by the first carrying mechanism 4. In the transmission process of the wafer 13 from left to right, whether the wafer 13 is single or double is detected by a sensor. If the wafer 13 is double or more, the blocking cylinder 35 is extended to drive the blocking rod 34 to rise, so as to separate two or more wafers 13 stacked together, and the excess wafer enters the receiving box 33, so that only one wafer 13 without source is transmitted to the right end of the conveyor 31 each time.

[0045] The second carrying mechanism 9 is used for carrying the wafer 13 from the conveying mechanism 3 to the rotating mechanism 6, and then carrying the wafer 13 from the rotating mechanism 6 to the heating mechanism 8. The solvent coating mechanism 5 comprises a brush holder 510 for fixing a brush 511, and the brush holder 510 is fixed on a rotating lifting mechanism. The rotating lifting mechanism is used for driving the brush 511 to dip into the solvent bottle 14 to absorb the diffusion source, and then driving the brush 511 to move above the rotating mechanism 6.

[0046] As Figure 11As shown, in this embodiment: the rotating lifting mechanism includes a first mounting plate 501 fixed on the frame 1, a threaded sleeve 503 is rotatably installed on the first mounting plate 501, a screw rod 502 is threadedly installed in the threaded sleeve 503, a first pulley 504 is installed on the screw rod 502, the first pulley 504 is drivingly connected with a second pulley 505 through a belt, the second pulley 505 is fixed on a motor shaft of a first motor 506, the screw rod 502 is driven to rotate by the first motor 506, the first pulley 504 and the second pulley 505, so as to realize the rotary swing of the screw rod 502; the lower end of the threaded sleeve 503 is fixedly connected with a third pulley 507, the third pulley 507 is drivingly connected with a fourth pulley 508 through a belt, the fourth pulley 508 is fixed on a motor shaft of a second motor 509, the first motor 506 and the second motor 509 are both fixed on the first mounting plate 501, the threaded sleeve 503 is driven to rotate by the second motor 509, the third pulley 507 and the fourth pulley 508, since the threaded sleeve 503 and the screw rod 502 are threadedly installed, the threaded sleeve 503 realizes the rising or lowering of the screw rod 502 in the rotating process.

[0047] The rotating mechanism 6 includes a source disc 61, a rotating disc 62, a first synchronous pulley 63, a second synchronous pulley 64 and a third motor 65, the rotating disc 62 is concentrically arranged in the source disc 61, a mounting shaft at the lower end of the rotating disc 62 is rotatably installed in the source disc 61, the first synchronous pulley 63 is fixed on the mounting shaft of the source disc 61, and is drivingly connected with the second synchronous pulley 64 through a synchronous belt, the second synchronous pulley 64 is fixed on a motor shaft of the third motor 65. The second carrying mechanism 9 carries the wafer 13 without source from the conveying mechanism 3 to the rotating disc 62 of the rotating mechanism 6, the rotating lifting mechanism rotates the brush 511 to above the solvent bottle 14, then drives the brush 511 to move downward, dips the diffusion source, then the brush 511 rises and rotates to above the center of the wafer 13 without source, the rotating disc 62 and the wafer 13 without source above the rotating disc 62 are driven to rotate by the third motor 65, the first synchronous pulley 63 and the second synchronous pulley 64, then the rotating lifting mechanism drives the brush 511 to swing to the outside of the wafer 13, so as to realize the source coating of the wafer 13, after the source coating is completed, the rotating lifting mechanism drives the brush 511 to return to above the solvent bottle 14, the rotation of the rotating disc 62 and the swing of the brush 511 make the source coating uniform.

[0048] The heating mechanism 8 comprises a heating table 81, a receiving rod 82, a horizontal rod 83, a vertical rod 84 and a third cylinder 85, the heating table 81 is provided with a groove for placing the receiving rod 82, the lower ends of the left and right ends of the receiving rod 82 are fixedly provided with the vertical rods 84, the horizontal rod 83 is fixedly installed between the two vertical rods 84, and the lower end of the horizontal rod 83 is fixed on the piston rod of the third cylinder 85. The second carrying mechanism 9 carries the coated wafer 13 from the rotating mechanism 6 to the upper side of the heating table 81 of the heating mechanism 8, the third cylinder 85 is started, the piston rod of the third cylinder 85 extends upward, the receiving rod 82 is driven to rise through the horizontal rod 83 and the vertical rod 84, until the receiving rod 82 reaches the lower side of the coated wafer 13, the second carrying mechanism 9 releases the coated wafer 13, the piston rod of the third cylinder 85 retracts downward, so that the coated wafer 13 reaches the heating table 81 for drying.

[0049] The second carrying mechanism 9 comprises a first linear module 91, a moving block 92, a fourth cylinder 93 and a second mounting plate 94, as shown in the drawings, Figure 9 The output end of the first linear module 91 is fixedly provided with the moving block 92, the fourth cylinder 93 is fixed on the outer side of the moving block 92, the output end of the fourth cylinder 93 is fixedly connected with the second mounting plate 94, and the left and right ends of the lower end of the second mounting plate 94 are respectively provided with a wafer clamping mechanism 15. By installing two wafer clamping mechanisms 15 on the lower end of the second mounting plate 94, the wafer 13 can be carried from the conveying mechanism 3 to the rotating mechanism 6, and at the same time, the wafer 13 can be carried from the rotating mechanism 6 to the heating mechanism 8, thereby saving the carrying time, and preventing the interference of the wafer 13 on the conveying mechanism 3, the rotating mechanism 6 and the heating mechanism 8.

[0050] The wafer clamping mechanism 15 comprises a double-head cylinder 151, a fifth mounting plate 152 and a clamping rod 153, the two output ends of the double-head cylinder 151 are respectively provided with a fifth mounting plate 152, the lower end of the fifth mounting plate 152 is symmetrically provided with two clamping rods 153, and through the extension and retraction of the piston rod of the double-head cylinder 151, the two fifth mounting plates 152 are relatively close or far away, and the four clamping rods 153 clamp the wafer.

[0051] The third carrying mechanism 11 is used for carrying the wafer 13 from the heating mechanism 8 to the receiving mechanism 10, the receiving mechanism 10 and the feeding mechanism 2 have the same structure, and the movement direction of the electric push rod 21 of the receiving mechanism 10 is opposite to that of the feeding mechanism 2.

[0052] The third carrying mechanism 11 comprises a second linear module 111, a fifth cylinder 112 and a third mounting plate 113, two groups of the third carrying mechanism 11 are symmetrically arranged in the embodiment, the fifth cylinder 112 is fixedly installed on the moving end of the second linear module 111, the third mounting plate 113 is fixedly installed on the output end of the fifth cylinder 112, and a wafer clamping mechanism 15 is installed on the lower end of the third mounting plate 113.

[0053] The turning mechanism 12 comprises a third linear module 121, a rotating cylinder 122 and a fourth mounting plate 123, the rotating cylinder 122 is fixedly installed on the moving end of the third linear module 121, the fourth mounting plate 123 is fixedly installed on the output end of the rotating cylinder 122, and a wafer clamping mechanism 15 is installed on the fourth mounting plate 123.

[0054] The working principle of the present application is as follows:

[0055] The first carrying mechanism 4 is used for carrying the wafer 13 without a source from the feeding mechanism 2 to the conveying mechanism 3, the conveying mechanism 3 is used for conveying the wafer 13 without a source from the left end to the right end, the stopper rod 34 and the stopper cylinder 35 are used for separating the wafers 13 without a source which are adhered together during the conveying process, so that only one wafer 13 without a source is conveyed to the right end of the conveying machine 31 each time, then the second carrying mechanism 9 is used for carrying the wafer 13 without a source from the conveying mechanism 3 to the rotating mechanism 6, the solvent coating mechanism 5 is used for driving the brush 511 to dip into the solvent bottle 14 to absorb the diffusion source, then the brush 511 is moved above the rotating mechanism 6 to coat the wafer 13 without a source, after the coating is completed, the second carrying mechanism 9 is used for carrying the wafer 13 with a source from the rotating mechanism 6 to the heating mechanism 8, and meanwhile, the second carrying mechanism 9 is used for carrying the new wafer 13 without a source to the rotating mechanism 6, the heating mechanism 8 is used for drying the wafer 13 with a source, after the drying is completed, the third carrying mechanism 11 is used for carrying the wafer 13 from the heating mechanism 8 to the receiving mechanism 10 for storage, in addition, the turning mechanism 12 is arranged to take out the dried wafer 13 and turn the wafer 13, and the third carrying mechanism 11 is used for carrying the wafer 13 to the receiving mechanism 10, so as to facilitate the arrangement of the wafer 13 according to the requirements of customers.

[0056] Although the embodiments of the present application have been shown and described, it should be understood by those ordinary skilled in the art that various changes, modifications, replacements and variations can be made to the embodiments without departing from the principles and spirits of the present application, and the scope of the present application is defined by the appended claims and their equivalents.

Claims

1. A wafer coating source machine, comprising a frame (1), a protective cover (16) arranged above the frame (1), and a display (17) mounted on the protective cover (16) through a rotating arm, characterized in that: the frame (1) is sequentially provided with a feeding mechanism (2), a conveying mechanism (3), a solvent coating mechanism (5), a rotating mechanism (6), a magnetic stirrer (7), a heating mechanism (8) and a collecting mechanism (10) from left to right above the frame (1), the magnetic stirrer (7) is provided with a solvent bottle (14) for containing a diffusion source, a first carrying mechanism (4) is arranged on one side of the feeding mechanism (2) and the conveying mechanism (3), a second carrying mechanism (9) is arranged on one side of the conveying mechanism (3), the solvent coating mechanism (5), the rotating mechanism (6), the magnetic stirrer (7) and the heating mechanism (8), a third carrying mechanism (11) is arranged on one side of the heating mechanism (8) and the collecting mechanism (10), and a turnover mechanism (12) is arranged on the other side of the third carrying mechanism (11); the feeding mechanism (2) and the collecting mechanism (10) are used for storing wafers (13), the conveying mechanism (3) comprises a conveyor (31), a supporting leg (32), a collecting box (33), a material blocking rod (34) and a material blocking cylinder (35), the conveyor (31) is fixed on the supporting leg (32), the collecting box (33) is arranged on the outer side of the middle section of the conveyor (31) in an inclined manner, the material blocking rod (34) is connected with the material blocking cylinder (35), the material blocking cylinder (35) is fixed on the conveyor (31) and opposite to the collecting box (33); the first carrying mechanism (4) is used for carrying the wafer (13) from the feeding mechanism (2) to the conveying mechanism (3), the second carrying mechanism (9) is used for carrying the wafer (13) from the conveying mechanism (3) to the rotating mechanism (6), and then carrying the wafer (13) from the rotating mechanism (6) to the heating mechanism (8), and the third carrying mechanism (11) is used for carrying the wafer (13) from the heating mechanism (8) to the collecting mechanism (10); the solvent coating mechanism (5) comprises a brush holder (510) for fixing a brush (511), the brush holder (510) is fixed on a rotating lifting mechanism, the rotating lifting mechanism is used for driving the brush (511) to dip into the solvent bottle (14) to absorb the diffusion source, and then driving the brush (511) to move above the rotating mechanism (6); the rotating mechanism (6) comprises a coating source disc (61), a rotating disc (62), a first synchronous pulley (63), a second synchronous pulley (64) and a third motor (65), the rotating disc (62) is concentrically arranged in the coating source disc (61), a mounting shaft at the lower end of the rotating disc (62) is rotatably mounted in the coating source disc (61), the first synchronous pulley (63) is fixed on the mounting shaft of the coating source disc (61) and is in transmission connection with the second synchronous pulley (64) through a synchronous belt, and the second synchronous pulley (64) is fixed on the motor shaft of the third motor (65). The turnover mechanism (12) comprises a third linear module (121), a rotary air cylinder (122) and a fourth mounting plate (123), the rotary air cylinder (122) is fixedly installed on the moving end of the third linear module (121), the fourth mounting plate (123) is fixedly installed on the output end of the rotary air cylinder (122), and a wafer clamping mechanism (15) is installed on the fourth mounting plate (123). The feeding mechanism (2) comprises an electric push rod (21), a fixed plate (22), positioning rods (23) and a top disc (26), the electric push rod (21) is installed below the fixed plate (22), the output end of the electric push rod (21) penetrates the fixed plate (22) from bottom to top and is fixedly connected with the top disc (26), the fixed plate (22) is fixed on the rack (1), the upper end of the fixed plate (22) is fixedly installed with a plurality of positioning rods (23) arranged in a circular array, and two mounting rods (24) are also fixedly arranged on the fixed plate (22) in a symmetrical mode, and the upper end of each mounting rod (24) is fixedly provided with an air nozzle (25).

2. The wafer coating source machine of claim 1, wherein: The first carrying mechanism (4), the second carrying mechanism (9) and the third carrying mechanism (11) are arranged at the center of the rack (1), and the feeding mechanism (2), the conveying mechanism (3), the solvent coating mechanism (5), the rotating mechanism (6), the magnetic stirrer (7), the heating mechanism (8) and the receiving mechanism (10) are arranged in two groups and are symmetrically arranged on the front and back sides of the first carrying mechanism (4), the second carrying mechanism (9) and the third carrying mechanism (11).

3. The wafer coating source machine of claim 2, wherein: The receiving mechanism (10) and the feeding mechanism (2) are the same in structure.

4. The wafer coating source machine of claim 3, wherein: The first carrying mechanism (4) comprises a mounting box (41), a guide rail (42), a first air cylinder (43), a second air cylinder (44) and a suction disc (45), the guide rail (42) is arranged in the mounting box (41), the first air cylinder (43) is fixed on the outer side of the mounting box (41), the piston rod of the first air cylinder (43) extends into the mounting box (41) and is fixedly connected with a sliding block, the sliding block is slidably arranged on the guide rail (42), the outer side of the sliding block is fixedly provided with the second air cylinder (44), and the piston rod of the second air cylinder (44) is fixedly provided with the suction disc (45) for adsorbing the wafer (13).

5. The wafer coating source machine of claim 4, wherein: The rotating and lifting mechanism comprises a first mounting plate (501) fixed on the rack (1), a threaded sleeve (503) rotatably installed on the first mounting plate (501), a screw rod (502) threadedly installed in the threaded sleeve (503), a first pulley (504) installed on the screw rod (502), a second pulley (505) in transmission connection with the first pulley (504) through a belt, the second pulley (505) being fixed on the motor shaft of a first motor (506), a third pulley (507) fixedly connected with the lower end of the threaded sleeve (503), a fourth pulley (508) in transmission connection with the third pulley (507) through a belt, the fourth pulley (508) being fixed on the motor shaft of a second motor (509), and the first motor (506) and the second motor (509) being both fixed on the first mounting plate (501).

6. The wafer coating source machine of claim 5, wherein: The heating mechanism (8) comprises a heating table (81), a material receiving rod (82), a horizontal rod (83), a vertical rod (84) and a third cylinder (85), the heating table (81) is provided with a groove for placing the material receiving rod (82), the lower end of the left and right ends of the material receiving rod (82) is fixed with the vertical rod (84), the horizontal rod (83) is fixed between the two vertical rods (84), and the lower end of the horizontal rod (83) is fixed on the piston rod of the third cylinder (85).

7. The wafer coating source machine of claim 6, wherein: The second carrying mechanism (9) comprises a first linear module (91), a moving block (92), a fourth cylinder (93) and a second mounting plate (94), the output end of the first linear module (91) is fixedly provided with the moving block (92), the fourth cylinder (93) is fixed outside the moving block (92), and the output end of the fourth cylinder (93) is fixedly connected with the second mounting plate (94); the left and right ends of the lower end of the second mounting plate (94) are respectively provided with a wafer clamping mechanism (15).

8. The wafer coating source machine of claim 7, wherein: The third carrying mechanism (11) comprises a second linear module (111), a fifth cylinder (112) and a third mounting plate (113), the fifth cylinder (112) is fixedly installed on the moving end of the second linear module (111), the output end of the fifth cylinder (112) is fixedly provided with the third mounting plate (113), and the lower end of the third mounting plate (113) is provided with a wafer clamping mechanism (15).

9. The wafer coating source machine of claim 8, wherein: The wafer clamping mechanism (15) comprises a double-head cylinder (151), a fifth mounting plate (152) and a clamping rod (153), the two output ends of the double-head cylinder (151) are respectively provided with a fifth mounting plate (152), and the lower end of the fifth mounting plate (152) is symmetrically provided with two clamping rods (153).

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