Heat dissipation device and box-shaped electronic device

Abstract

The embodiment of the present application provides a heat dissipation device and a box type electronic equipment. The device comprises: an air duct shell, the air duct shell comprising an air duct air inlet and an air duct air outlet, the air duct air inlet corresponding to a first heat source in the box type electronic equipment; a first fixing structure arranged at the air duct air inlet, used for abutting the equipment air inlet and the air duct air inlet, and contacting the first heat source through a heat conducting medium, so that the heat generated by the first heat source is transported into the air duct shell through the air duct air inlet; a fan unit arranged at the air duct air outlet, used for cooling the hot air in the air duct shell, and after the cooled cold air is blown out through the air duct air outlet, the cold air is discharged from the box type electronic equipment through the equipment air outlet; and a second fixing structure used for fixing the fan unit. The embodiment of the present application transports the heat generated by the heat source into the air duct shell, cools the hot air by using the fan unit and discharges the hot air from the box type electronic equipment, so that the purpose of cooling the internal heat source of the box type electronic equipment is achieved.

Description

Technical Field

[0001] The embodiments of the present invention relate to the field of communication technology, specifically to a heat dissipation device and a box-type electronic device. Background Technology

[0002] Currently, most small electronic devices, such as miniature box switches, rely on natural heat dissipation. However, as miniaturized electronic devices perform more and more functions, their power consumption is also increasing. When using natural heat dissipation, the surface temperature of these devices is rising. Since these devices are often deployed indoors, excessively high surface temperatures can negatively impact people and the surrounding environment, and may even pose safety hazards.

[0003] Figures 1-2 This is a schematic diagram of a heat dissipation device for a box-type electronic device in the prior art. Figure 1 In the heat dissipation device shown, the heat source transfers heat to the shell through a heat-conducting medium. The shell has heat dissipation fins, and the shell exchanges heat with the outside through natural convection. Figure 2 In the heat dissipation device shown, the heat source is equipped with a radiator, and the four side walls of the shell and the upper and lower covers are perforated to achieve natural convection heat exchange with the outside.

[0004] However, Figure 1 The high surface temperature of the heat dissipation device casing can have a heating effect on people and the surrounding environment. Figure 2 The openings on the top and bottom shells of the heat dissipation device affect dust and water resistance. In addition, the heat dissipation performance will be worse when the surface of the shell is covered by foreign objects. Summary of the Invention

[0005] To address the shortcomings of existing technologies, embodiments of the present invention provide a heat dissipation device and a box-type electronic device.

[0006] In a first aspect, embodiments of the present invention provide a heat dissipation device applied in a box-type electronic device, the box-type electronic device having an air inlet and an air outlet, comprising:

[0007] The air duct housing includes an air duct inlet and an air duct outlet, wherein the air duct inlet corresponds to the first heat source in the box-type electronic device.

[0008] A first fixed structure is provided at the air inlet of the air duct for connecting the air inlet of the equipment and the air inlet of the air duct, and for contacting the first heat source through a heat-conducting medium to transfer the heat generated by the first heat source to the air duct housing through the air inlet of the air duct.

[0009] A fan unit is located at the air outlet of the air duct and is used to cool the hot air inside the air duct housing. The cooled air is then blown out through the air outlet of the air duct and discharged from the box-type electronic device through the device air outlet.

[0010] The second fixing structure is disposed opposite to the first fixing structure and is used to fix the fan unit.

[0011] Optionally, as described in the above device, the second fixing structure is further used for:

[0012] It comes into contact with a second heat source in the box-type electronic device through a heat-conducting medium;

[0013] Accordingly, the fan unit is also used to cool the second heat source.

[0014] As described above, optionally, the air duct inlet includes a plurality of air inlets corresponding to the equipment air inlet.

[0015] As described above, the first fixing structure may optionally be a box-type structure;

[0016] The front and upper surfaces of the first fixing structure are open;

[0017] The lower surface of the first fixed structure is provided with a plurality of first fins that are evenly distributed and perpendicular to the side surface of the first fixed structure and are the same size as the side surface. Two adjacent first fins form a first air duct space with a vertical opening. One end of the first air duct space is seamlessly connected to each air inlet of the equipment air inlet, and the other end of the first air duct space is seamlessly connected to each air inlet of the air duct air inlet.

[0018] The other side of the lower surface of the first fixing structure is provided with an adhesive backing containing a thermally conductive medium, which is used to attach a first heat source located on the PCB board inside the box-type electronic device.

[0019] As described above, optionally, the fan unit has a box-type structure, and the first fixing structure and the second fixing structure are also used to fix the air duct housing.

[0020] As described above, the air duct outlet may optionally include multiple air outlets.

[0021] As described above, the second fixing structure may optionally include: a fixing plate;

[0022] The upper surface of the fixing plate is provided with a plurality of evenly distributed second fins, and two adjacent second fins form a second air duct space with three open sides. The first end of the second air duct space is seamlessly connected to each air outlet of the air duct outlet.

[0023] The lower surface of the fixing plate is in contact with a second heat source located on the PCB board inside the box-type electronic device through a heat-conducting medium;

[0024] The mounting plate secures the fan unit and the mounting plate together with studs, and the mounting plate is fixed to the PCB with screws.

[0025] Optionally, as described in the above device, the fan unit is further used for:

[0026] The cold air blown out through each of the second or third ends of the second air duct space cools the third heat source in the box-type electronic device, wherein the third heat source is located in the channel between the second or third end and the air outlet of the device.

[0027] Optionally, as described above, the inner wall of the air duct housing is provided with a plurality of staggered noise reduction blocks for noise reduction processing of the noise generated by the fan unit.

[0028] Optionally, the noise reduction block in the aforementioned device is sound-absorbing cotton.

[0029] Secondly, embodiments of the present invention provide a box-type electronic device, the box-type electronic device having an air inlet and an air outlet, characterized in that it includes: a heat dissipation device as described above.

[0030] The heat dissipation device provided in this embodiment of the invention fixes the air duct housing and the fan unit through a fixed structure, and transports the heat generated by the heat source to the air inlet of the air duct. The fan unit cools the hot air inside the air duct housing, and the cooled air is blown out through the air outlet of the air duct and then discharged from the box-type electronic device through the device outlet, thereby achieving the purpose of cooling the heat source inside the box-type electronic device. Attached Figure Description

[0031] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0032] Figures 1-2 This is a schematic diagram of a heat dissipation device for a box-type electronic device in the prior art;

[0033] Figure 3 A schematic diagram of a heat dissipation device for a box-type electronic device provided in an embodiment of the present invention;

[0034] Figure 4 A schematic diagram of a box-type electronic device provided in an embodiment of the present invention;

[0035] Figure 5 This is a schematic diagram of the first fixing structure in the heat dissipation device of the box-type electronic device provided in an embodiment of the present invention;

[0036] Figure 6 This is a schematic diagram of the second fixing structure in the heat dissipation device of the box-type electronic device provided in an embodiment of the present invention;

[0037] Figure label:

[0038] 01-Box-type electronic equipment; 02-Equipment air inlet; 03-Equipment air outlet;

[0039] 04-Duct housing; 05-Duct inlet; 06-Duct outlet;

[0040] 07-First fixed structure; 08-Fan unit; 09-Second fixed structure;

[0041] 10 - First heat source; 11 - Second heat source; 12 - Third heat source;

[0042] 13-Noise reduction block; 14-First fin; 15-First air duct space;

[0043] 16-Adhesive backing; 17-Fixing plate; 18-Second fin;

[0044] 19 - Second air duct space; 20 - Heat transfer medium; 21 - Stud;

[0045] 22-Screw. Detailed Implementation

[0046] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0047] Figure 3 This is a schematic diagram of a heat dissipation device for a box-type electronic device provided in an embodiment of the present invention. Figure 4 A schematic diagram of a box-type electronic device provided in an embodiment of the present invention, as shown below. Figures 3-4 As shown, the box-type electronic device 01 has an air inlet 02 and an air outlet 03. A heat dissipation device is disposed inside the box-type electronic device 01 and includes:

[0048] The air duct housing 04 includes an air duct inlet 05 and an air duct outlet 06. The air duct inlet 05 corresponds to the first heat source 10 in the box-type electronic device 01, where the first heat source 10 is a heat-generating unit to be dissipated in the box-type electronic device 01, such as a heat-generating chip. The air duct inlet 05 also corresponds to the device air inlet 02, and the air duct outlet 06 corresponds to the device air outlet 03. In this way, an airflow can be formed between the air duct inlet 05 and the air duct outlet 06 by means of the device air inlet 02 and the device air inlet 03.

[0049] The first fixed structure 07 is located at the air inlet 05 of the air duct, used to connect the equipment air inlet 02 and the air duct air inlet 05, and to contact the first heat source 10 through a heat-conducting medium, so that the heat generated by the first heat source 10 is transferred to the air duct housing 04 through the air inlet 05. It should be noted that the equipment air inlet 02 and the air duct air inlet 05 can be seamlessly connected, that is, the airflow at the equipment air inlet 02 can be completely blown to the air duct air inlet 05, and then flow to the air duct outlet 06 through the air duct air inlet 05. The equipment air outlet 03 and the air duct outlet 06 can be connected or not connected. If connected, the air flowing out of the air duct outlet 06 will be blown to the equipment air outlet 03, and discharged outside the box-type electronic device 01 through the equipment air outlet 03. If not connected, due to the airflow between the equipment air inlet 02 and the equipment air outlet 03, the air flowing out of the duct outlet 06 will be blown into the airflow channel between the equipment air outlet 03 and the duct outlet 06.

[0050] The fan unit 08 is located at the air outlet 06 of the air duct and is used to cool the hot air inside the air duct housing 04. The cooled air is then blown out through the air outlet 06 and discharged from the box-type electronic equipment 01 through the equipment outlet 03.

[0051] The second fixing structure 09, disposed opposite to the first fixing structure 07, is used to fix the fan unit 08. The first fixing structure 07 and the second fixing structure 09 together are used to fix the air duct housing 04, so that the air duct housing 04 does not shake in the box-type electronic device 01 and will not affect the normal operation of other components in the box-type electronic device 01.

[0052] Specifically, the first heat source 10 transfers the generated heat to the first fixed structure 07 through a heat-conducting medium. The first fixed structure 07 then transports the heat to the air duct housing 04 through the air duct inlet 05. The fan unit 08 cools the hot air inside the air duct housing 04 and blows the cooled air out through the air duct outlet 06, and then discharges it from the box-type electronic device 01 through the equipment outlet 03, thereby achieving the purpose of cooling the first heat source.

[0053] The heat dissipation device provided in this embodiment of the invention fixes the air duct housing and the fan unit through a fixed structure, and transports the heat generated by the heat source to the air inlet of the air duct. The fan unit cools the hot air inside the air duct housing, and the cooled air is blown out through the air outlet of the air duct and then discharged from the box-type electronic device through the device outlet, thereby achieving the purpose of cooling the heat source inside the box-type electronic device.

[0054] Based on the above embodiments, the second fixing structure 09 is further used to: contact the second heat source 11 in the box-type electronic device 01 through a heat-conducting medium; correspondingly, the fan unit 08 is further used to: cool the second heat source 11.

[0055] Specifically, in addition to fixing the fan unit 08, the second fixing structure 09 can also contact the second heat source 11 in the box-type electronic device 01 through a heat-conducting medium to absorb the heat generated by the second heat source 11. Since the second fixing structure 09 is located at the air outlet 06 of the air duct, and the fan unit 08 is located at the air outlet 06, the fan unit 08 can directly cool the heat absorbed by the second fixing structure 09, thereby achieving the purpose of cooling the second heat source 11. Furthermore, since the first fixing structure 07 and the second fixing structure 09 are used together to fix the air duct housing 04, the positions of the first heat source 10 and the second heat source 11 also need to ensure that they can fix the air duct housing 04. Optionally, the first heat source 10 and the second heat source 11 are heat sources that are correspondingly arranged on the diagonal of the air duct housing 04, so that the first fixing structure 07 and the second fixing structure 09 are arranged opposite each other on the diagonal of the air duct housing 04. Through the heat-conducting medium, the second fixed structure 09 contacts the second heat source 11, and the fan unit cools the second heat source 11, thereby improving the heat dissipation efficiency of the box-type electronic device 01.

[0056] Based on the above embodiments, if the equipment air inlet 02 includes multiple air inlets, the air duct air inlet 05 is provided with multiple air inlets corresponding to the equipment air inlet 02 to ensure seamless connection of each air inlet.

[0057] Based on the above embodiments, further, Figure 4 This is a schematic diagram of a box-type electronic device provided in an embodiment of the present invention. Figure 5 This is a schematic diagram of the first fixing structure in the heat dissipation device of the box-type electronic device provided in an embodiment of the present invention, as shown below. Figures 4-5 As shown, the box-type electronic device 01 has an air inlet 02 and an air outlet 03. The heat dissipation device is placed inside the box-type electronic device 01. Both the air inlet 02 and the air duct inlet 05 have multiple air inlets.

[0058] In the heat dissipation device, the first fixing structure 07 is a box-type structure with openings on its front and upper surfaces. A plurality of first fins 14, uniformly distributed and perpendicular to the side surface of the first fixing structure, and of the same size as the side surface, are provided on one side of the lower surface of the first fixing structure. The same size means that the first fins and the side surface have the same shape, and their length and width dimensions are also the same. Adjacent first fins 14 form a vertically opening first air duct space 15. One end of the first air duct space 15 is seamlessly connected to each air inlet of the device air inlet 02, and the other end of the first air duct space 15 is seamlessly connected to each air inlet of the air duct air inlet 05. The other side of the lower surface of the first fixing structure 07 is provided with an adhesive backing containing a thermally conductive medium. The adhesive backing 16 is used to adhere the first heat source 10 located on the printed circuit board (PCB) inside the box-type electronic device 01.

[0059] Specifically, the first fixing structure 07 absorbs heat from the first heat source 10 through the adhesive backing 16, and obtains airflow from the equipment air inlet 02 through the first air duct space 15, carrying the heat into the air duct housing 04. The fan unit 08 cools the heat, and the cooled air is sent to the equipment air outlet 03 through the air duct outlet 06 and discharged outside the box-type electronic device 01. For example, if the first heat source 10 is an optical module, the adhesive backing 16 can be directly pasted onto the optical module cage, and the optical module is cooled by the cooling cage.

[0060] Based on the above embodiments, further, such as Figure 6 As shown, the fan unit 08 has a box-type structure. The first fixing structure 07 and the second fixing structure 09 are used to fix the air duct housing 04. The sum of the height of the second fixing structure 09 and the fan unit 08 is the same as that of the first fixing structure 07, ensuring that the heat dissipation device will not shake after being installed on the PCB board and will not affect other components.

[0061] Furthermore, the equipment air outlet 03 may also include multiple air outlets, and correspondingly, the air duct outlet 06 includes multiple air outlets. The second fixing structure 09 includes: a fixing plate 17; the upper surface of the fixing plate 17 is provided with a plurality of evenly distributed second fins 18, and two adjacent second fins 18 form a second air duct space 19 with three openings. The first end of the second air duct space 19 is seamlessly connected to each air outlet of the air duct outlet 06; the second end and the third end of the second air duct space 19 are outlet ends, and there is an airflow channel between the outlet end and the equipment air outlet 03. A third heat source 12 on the PCB board is provided on the channel.

[0062] The lower surface of the fixing plate 17 is in contact with the second heat source 11 located on the PCB board inside the box-type electronic device 01 through the thermal conductive medium 20. The thermal conductive medium 20 can be a thermal interface material (TIM). The fixing plate 17 fixes the fan unit 08 and the fixing plate 17 through studs 21, and fixes the fixing plate 17 to the PCB through screws 22.

[0063] Specifically, the heat-conducting medium 20 absorbs the heat from the second heat source 11, and the fan unit 08 fixed by the fixing plate 17 directly cools the second heat source 11. At the same time, the cold air cooled by the first heat source 10 flows out from the outlet end of the second air duct space 19. The cold air flows through the third heat source 12 between the outlet end and the equipment air outlet 03, and cools the third heat source 12. This solves the heat dissipation problem of multiple heat sources in the box-type electronic device and improves the heat dissipation efficiency of the box-type electronic device.

[0064] Based on the above embodiments, a plurality of noise reduction blocks 13 are further provided on the inner wall of the air duct housing 04 in a maze pattern, which are staggered and arranged to reduce the noise generated by the fan unit 08. The noise reduction blocks 13 can be sound-absorbing cotton. The noise reduction blocks 13 inside the air duct housing 04 are arranged in a maze pattern. The noise generated by the fan in the fan unit 08 is repeatedly refluxed in the air duct housing 04. The noise is absorbed by the sound-absorbing cotton to achieve the noise reduction function.

[0065] This invention, through the design of a noise-reducing cooling air duct, achieves a 10°C reduction in the shell temperature of a miniaturized box-type device, while simultaneously reducing the temperature of key temperature-rising components by 6°C and lowering the noise level to below 30 dBA. This allows the device to meet the requirement of a room temperature rise of less than 25°C, and desktop deployment stacking scenarios do not affect the device's reliability and surface temperature requirements.

[0066] The heat dissipation device for box-type electronic devices provided in this invention can be used for heat dissipation of single or multiple heat sources in box-type electronic devices. It makes reasonable use of the internal space of the box-type device and has the characteristics of low noise, thereby improving the heat dissipation efficiency of box-type electronic devices.

[0067] Based on the same inventive concept, embodiments of the present invention also provide a box-type electronic device, such as... Figure 4 As shown, the box-type electronic device has an air inlet and an air outlet, and includes a heat dissipation device as described above, as detailed in the above-described heat dissipation device embodiments, which will not be repeated here.

[0068] The embodiments described above, such as the apparatus, are merely illustrative. The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the modules can be selected to achieve the purpose of this embodiment according to actual needs. Those skilled in the art can understand and implement this without any creative effort.

[0069] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the embodiments of the present invention, and are not intended to limit them. Although the embodiments of the present invention have been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A heat dissipation device, applied in a box-type electronic device, the box-type electronic device having an air inlet and an air outlet, characterized in that, include: The air duct housing includes an air duct inlet and an air duct outlet, wherein the air duct inlet corresponds to the first heat source in the box-type electronic device. A first fixing structure is disposed at the air inlet of the air duct, for connecting the air inlet of the equipment and the air inlet of the air duct, and for contacting the first heat source through a heat-conducting medium, so as to transport the heat generated by the first heat source to the air duct housing through the air inlet of the air duct. The first fixing structure is a box-type structure with openings on the front and upper surfaces. The air duct inlet includes multiple air inlets corresponding to the equipment air inlet; The lower surface of the first fixing structure has a plurality of first fins that are evenly distributed and perpendicular to the side surface of the first fixing structure and are the same size as the side surface. Two adjacent first fins form a first air duct space with a vertical opening. One end of the first air duct space is seamlessly connected to each air inlet of the device air inlet, and the other end of the first air duct space is seamlessly connected to each air inlet of the air duct air inlet. The other side of the lower surface of the first fixing structure is provided with an adhesive backing containing a thermally conductive medium. The adhesive backing is used to attach a first heat source located on the PCB board inside the box-type electronic device. A fan unit is located at the air outlet of the air duct and is used to cool the hot air inside the air duct housing. The cooled air is then blown out through the air outlet of the air duct and discharged from the box-type electronic device through the device air outlet. The second fixing structure is disposed opposite to the first fixing structure and is used to fix the fan unit.

2. The apparatus according to claim 1, characterized in that, The second fixing structure is also used for: It comes into contact with a second heat source in the box-type electronic device through a heat-conducting medium; Accordingly, the fan unit is also used to cool the second heat source.

3. The apparatus according to claim 1, characterized in that, The fan unit has a box-type structure, and the first fixing structure and the second fixing structure are also used to fix the air duct housing.

4. The apparatus according to claim 1, characterized in that, The air duct outlet includes multiple air outlets.

5. The apparatus according to claim 1, characterized in that, The second fixing structure includes: a fixing plate; The upper surface of the fixing plate is provided with a plurality of evenly distributed second fins, and two adjacent second fins form a second air duct space with three open sides. The first end of the second air duct space is seamlessly connected to each air outlet of the air duct outlet. The lower surface of the fixing plate is in contact with a second heat source located on the PCB board inside the box-type electronic device through a heat-conducting medium; The mounting plate secures the fan unit and the mounting plate together with studs, and the mounting plate is fixed to the PCB with screws.

6. The apparatus according to claim 5, characterized in that, The fan unit is also used for: The cold air blown out through each of the second or third ends of the second air duct space cools the third heat source in the box-type electronic device, wherein the third heat source is located in the channel between the second or third end and the air outlet of the device.

7. The apparatus according to any one of claims 1-6, characterized in that, Multiple staggered noise reduction blocks are provided on the inner wall of the air duct housing to reduce the noise generated by the fan unit.

8. The apparatus according to claim 7, characterized in that, The noise reduction block is sound-absorbing cotton.

9. A box-type electronic device, the box-type electronic device having an air inlet and an air outlet, characterized in that, include: The heat dissipation device as described in any one of claims 1-8.

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