Adapter and Electronic Device Assembly

Abstract

The present application provides an adapter and an electronic device assembly. The adapter includes: a circuit board assembly; a first housing having a receiving space for receiving the circuit board assembly, the first housing including a first surface, a second surface and a peripheral side surface, the first surface and the second surface being disposed opposite to each other, and the peripheral side surface being connected to the first surface and the second surface; and a shielding layer covering and adhering to the first surface, the second surface and the peripheral side surface of the first housing. The adapter of the present application performs electromagnetic shielding on the circuit board assembly by covering and adhering to the first surface, the second surface and the peripheral side surface of the first housing that houses the circuit board assembly. The adapter provided by the present application has good electromagnetic shielding performance.

Description

Technical Field

[0001] This application relates to the field of electronic technologies, and particularly to an adapter and an electronic device assembly. Background Art

[0002] With the continuous progress of technologies, electronic devices such as mobile phones and laptops have become necessities in people's lives. Adapters are usually used to charge electronic devices such as mobile phones and laptops.

[0003] As the size of the adapter decreases and the energy density continuously increases, the adapter will generate a strong electromagnetic field during operation, thereby causing electromagnetic interference to nearby electronic devices. Summary of the Invention

[0004] This application provides an adapter, and the adapter includes:

[0005] A circuit board assembly;

[0006] A first housing, the first housing having a receiving space for receiving the circuit board assembly, the first housing including a first surface, a second surface and a peripheral side surface, the first surface and the second surface being disposed opposite to each other, and the peripheral side surface being connected to the first surface and the second surface; and

[0007] A shielding layer, the shielding layer covering and conforming to the first surface, the second surface and the peripheral side surface of the first housing.

[0008] This application also provides an electronic device assembly, and the electronic device assembly includes an electronic device and the adapter described above, and the adapter is used to provide electrical energy for the electronic device.

[0009] When the circuit board assembly in the adapter provided by this application generates an electromagnetic field and radiates outward during operation, since the shielding layer covers the first surface, the second surface and the peripheral side surface of the first housing, electromagnetic shielding is performed on the circuit board assembly, thereby reducing or even avoiding the electromagnetic field generated by the circuit board assembly from radiating out through the first surface, the second surface and the peripheral side surface, and further enabling the adapter to have good electromagnetic shielding performance. Therefore, the adapter of this application will only emit a small amount or even no electromagnetic field during operation, has weak or even no electromagnetic interference on nearby electronic components, and the circuit board assembly in the adapter of this application is less or even not affected by the electromagnetic interference of nearby electronic components. Description of the Drawings

[0010] To more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings required for the implementation. Obviously, the drawings in the following description are some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0011] Figure 1 Schematic diagram of the application environment of the adapter provided by an embodiment of the present application.

[0012] Figure 2 Schematic diagram of the structure of the adapter provided by an embodiment of the present application.

[0013] Figure 3 For Figure 2 exploded view of the adapter in

[0014] Figure 4 Schematic diagram of the structure of the adapter provided by another embodiment of the present application.

[0015] Figure 5 For Figure 4 three-dimensional sectional view of the adapter along line A-A in the embodiment.

[0016] Figure 6 For Figure 5 partial enlarged view of a part at II in

[0017] Figure 7 For Figure 4 sectional view of the adapter along line A-A in the embodiment.

[0018] Figure 8 For Figure 7 partial enlarged view of a part at I in

[0019] Figure 9 For Figure 7 another partial enlarged view of a part at I in

[0020] Figure 10 For Figure 7 another partial enlarged view of a part at I in

[0021] Figure 11 Schematic diagram of the structure of the adapter provided by another embodiment of the present application.

[0022] Figure 12 For Figure 11 sectional view of the adapter along line B-B in the embodiment.

[0023] Figure 13 For Figure 11Partial enlarged schematic diagram of an embodiment at III in [text].

[0024] Figure 14 For Figure 11 Partial enlarged schematic diagram of another embodiment at III in [text].

[0025] Figure 15 For Figure 11 Partial enlarged schematic diagram of another embodiment at III in [text].

[0026] Figure 16 For Figure 5 Partial enlarged schematic diagram of another embodiment at II in [text].

[0027] Figure 17 Schematic structural diagram of an adapter provided by another embodiment of the present application.

[0028] Figure 18 For an adapter provided by an embodiment along Figure 17 Cross-sectional schematic diagram along the C-C line in [text].

[0029] Figure 19 For Figure 18 Partial enlarged schematic diagram of an embodiment at IV in [text].

[0030] Figure 20 For an adapter provided by another embodiment along Figure 17 Cross-sectional schematic diagram along the C-C line in [text].

[0031] Figure 21 For Figure 20 Partial enlarged schematic diagram of an embodiment at V in [text].

[0032] Figure 22 Schematic structural diagram of an adapter provided by another embodiment of the present application.

[0033] Figure 23 For an adapter provided by an embodiment along Figure 22 Cross-sectional schematic diagram along the D-D line in [text].

[0034] Figure 24 For an adapter provided by another embodiment along Figure 22 Cross-sectional schematic diagram along the D-D line in [text].

[0035] Figure 25 Schematic structural diagram of an adapter provided by another embodiment of the present application.

[0036] Figure 26 For Figure 25 Cross-sectional schematic diagram of the adapter along the E-E line in the embodiment.

[0037] Figure 27 ForFigure 26 Partial enlarged schematic view of an embodiment at VI.

[0038] Figure 28 is Figure 11 Partial enlarged schematic view of another embodiment at III.

[0039] Figure 29 is Figure 11 Partial enlarged schematic view of another embodiment at III.

[0040] Figure 30 Schematic structural view of an adapter provided by another embodiment of the present application.

[0041] Figure 31 is Figure 30 Schematic cross-sectional view of the adapter along the F-F line in the embodiment.

[0042] Figure 32 Assembly flow chart of the adapter provided by an embodiment of the present application.

[0043] Reference numerals in the drawings: Electronic device component 1; Socket 2; Adapter 10; Electronic device 20; Circuit board assembly 110; Ground pole 111; First housing 120; Receiving space 121; First surface 122; Second surface 123; Peripheral side surface 124; First through hole 125; First housing body 126; First engaging portion 127; First groove 128; Opening 129; Shielding layer 130; First shielding layer 130a; Second shielding layer 130b; Second through hole 131; Second groove 132; Electrical connector 140; Grounding spring piece 150; Base 151; Bent portion 152; Free end 153; Second housing 160; Second housing body 161; Second engaging portion 162; First sub-housing 163; Second sub-housing 164; Third groove 165; Connector 170; Pin assembly 180; Carrier seat 181; Pin 182; Plugging surface 183; Output port 190. Detailed implementation manners

[0044] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.

[0045] In the description and claims of this application, and in the above drawings, terms such as "first" and "second" are used to distinguish different objects, rather than to describe a specific order. In addition, the terms "comprising" and "having" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or device that includes a series of steps or units is not limited to the listed steps or units, but optionally further includes steps or units not listed, or optionally further includes other steps or units inherent to these processes, methods, products, or devices.

[0046] Referring to "embodiments" or "implementations" herein means that specific features, structures, or characteristics described in connection with the embodiments or implementations can be included in at least one embodiment of this application. The appearance of this phrase at various positions in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment mutually exclusive with other embodiments. Those skilled in the art explicitly and implicitly understand that the embodiments described herein can be combined with other embodiments.

[0047] This application provides an adapter 10. Please refer to Figure 1 , Figure 1 which is a schematic diagram of the application environment of the adapter provided in an embodiment of this application. The so-called adapter 10 is a power conversion device. For example, the adapter 10 is electrically connected to a socket 2, receives a first voltage output by the socket 2, and converts the received first voltage into a second voltage, and the second voltage is used to supply power to electrical devices 20 such as laptops and mobile phones. For example, the second voltage is used to charge the battery of the electrical device 20, or the second voltage is used to directly supply power to the electronic components of the electrical device 20. In this embodiment, an example is given where the first voltage is an alternating current voltage and the second voltage is a direct current voltage. In other embodiments, both the first voltage and the second voltage are also direct current voltages; or, both the first voltage and the second voltage can also be alternating current voltages. It can be understood that the schematic diagram of the application environment of the adapter 10 only helps to understand the application of the adapter 10 and should not be construed as a limitation of the adapter 10 provided in this application.

[0048] Please refer to Figure 2 and Figure 3 , Figure 2 which is a schematic structural diagram of the adapter provided in an embodiment of this application; Figure 3 is Figure 2Explosion schematic diagram of the middle adapter. The adapter 10 includes a circuit board assembly 110, a first housing 120, and a shielding layer 130. The first housing 120 has a receiving space 121 for receiving the circuit board assembly 110. The first housing 120 includes a first surface 122, a second surface 123, and a peripheral side surface 124. The first surface 122 and the second surface 123 are arranged opposite to each other, and the peripheral side surface 124 is connected to the first surface 122 and the second surface 123. The shielding layer 130 covers and adheres to the first surface 122, the second surface 123, and the peripheral side surface 124 of the first housing 120. It should be noted that, Figure 2 and Figure 3 other structural features not introduced in the text will be explained later.

[0049] The circuit board assembly 110 refers to the part that realizes the voltage conversion function of the adapter 10. The circuit board assembly 110 generally includes a circuit board and a voltage conversion circuit (including electronic components such as transformers, capacitors, and inductors) carried on the circuit board, etc. The circuit board assembly 110 can convert the input first voltage into a second voltage for output. In this embodiment, the circuit board assembly 110 can change the type of voltage. For example, the first voltage is an alternating current voltage, and the second voltage is a direct current voltage. In another embodiment, the circuit board assembly 110 can change the amplitude of the voltage (also called the voltage value). For example, both the first voltage and the second voltage are direct current voltages, and the amplitude of the first voltage is different from that of the second voltage; or, both the first voltage and the second voltage can be alternating current voltages, and the amplitude of the first voltage is different from that of the second voltage. In other embodiments, the circuit board 110 can both change the type of voltage and change the amplitude of the voltage. For example, the type of the second voltage is different from that of the first voltage, and the voltage values are different.

[0050] Generally, the adapter 10 has an output port 190 (see Figure 2 and Figure 3 ), the output port 190 is electrically connected to the circuit board assembly 110, and is used for outputting the second voltage. The output port 190 can be but is not limited to a Universal Serial Bus (USB) interface, a Type-C interface, or a Lightning interface, etc., as long as it can realize and output the second voltage.

[0051] Please refer to Figure 4 , Figure 5 and Figure 6 , Figure 4 which is a schematic structural diagram of the adapter provided in another embodiment of the present application;

[0052] Figure 5 For Figure 4 Schematic perspective cross-sectional view of the adapter along line A-A in an embodiment; Figure 6 For Figure 5 Partial enlarged schematic view of an embodiment at II in. The shielding layer 130 covers and adheres to the first surface 122, the second surface 123, and the peripheral side surface 124 of the first housing 120. In this embodiment (see Figure 6 ), the shielding layer 130 adheres everywhere on the first surface 122, the second surface 123, and the peripheral side surface 124 of the first housing 120, so that there is no gap between the shielding layer 130 and the first housing 120, and the shielding layer 130 is continuously seamless between the first surface 122, the second surface 123, and the peripheral side surface 124 of the first housing 120, that is, no area of the first surface 122, the second surface 123, and the peripheral side surface 124 of the first housing 120 is exposed to the air.

[0053] The shielding layer 130 is made of an electromagnetic shielding material, such as a conductive electromagnetic shielding material or a magnetic electromagnetic shielding material, and can achieve an electromagnetic shielding effect by preventing the electromagnetic field generated when the circuit board assembly 110 is working from radiating outward. The type and shielding principle of the shielding layer 130 will be introduced in detail later.

[0054] In one embodiment, the shielding layer 130 is a conductive electromagnetic shielding material. For example, the shielding layer 130 can be a conductive material such as copper or aluminum. The electromagnetic field generated when the circuit board assembly 110 is working forms eddy currents inside the shielding layer 130, and the electromagnetic field will generate reflections on the surface of the shielding layer 130 close to the circuit board assembly 110, thereby greatly weakening or even blocking the electromagnetic field radiated by the circuit board assembly 110 to the outside when it is working, and thus achieving the electromagnetic shielding effect.

[0055] In another embodiment, the shielding layer 130 is a magnetic electromagnetic shielding material. For example, the shielding layer 130 can be a magnetic material such as iron or silicon steel. The electromagnetic field generated when the circuit board assembly 110 is working will not only form eddy currents inside the shielding layer 130, but also the magnetic field lines will be introduced into the shielding layer 130 and be restricted inside the shielding layer 130, thereby greatly weakening or even blocking the electromagnetic field radiated by the circuit board assembly 110 to the outside when it is working, and thus achieving the electromagnetic shielding effect.

[0056] It should be noted that, whether the shielding layer 130 is made of a conductive electromagnetic shielding material or a magnetic electromagnetic shielding material, the shielding layer 130 mainly utilizes the electromagnetic field generated by the circuit board assembly 110 during operation to form eddy currents inside the shielding layer 130, and prevents the electromagnetic field from radiating outside the shielding layer 130, thereby achieving the effect of electromagnetic shielding.

[0057] In one embodiment, the shielding layer 130 is an electromagnetic shielding material and has good heat conduction effect. For example, the shielding layer 130 is an electromagnetic shielding material and a metal material. The shielding layer 130 can not only have the effect of electromagnetic shielding, but also play a good role in heat conduction. The shielding layer 130 improves the heat dissipation of the adapter 10 by quickly guiding the heat generated by the operation of the adapter 10 to the outside.

[0058] The shielding layer 130 is one layer or multiple layers. By multiple layers, it means two or more layers. For example, the number of layers of the shielding layer 130 is two layers, three layers or even more layers. In one embodiment (see Figure 8 ), the shielding layer 130 is one layer. The shielding layer 130 is an electromagnetic shielding material, such as a conductive electromagnetic shielding material or a magnetic electromagnetic shielding material, and can shield the electromagnetic field generated by the circuit board assembly 110 during operation.

[0059] In another embodiment, please refer to Figure 7 and Figure 9 , Figure 7 is Figure 4 a schematic cross-sectional view of the adapter along the A-A line in the embodiment; Figure 9 is Figure 7Partial enlarged schematic diagram of another embodiment at position I. The shielding layer 130 has two layers. In other words, the adapter 10 includes two shielding layers 130 stacked on top of each other. For ease of description, the shielding layer 130 on the side close to the circuit board assembly 110 is named the first shielding layer 130a, and the shielding layer facing away from the circuit board assembly 110 is named the second shielding layer 130b. The first shielding layer 130a is made of a magnetic electromagnetic shielding material, and the second shielding layer 130a is made of a conductive electromagnetic shielding material. Some or even all of the magnetic field lines generated when the circuit board assembly 110 is working are introduced into the first shielding layer 130a and will be restricted inside the first shielding layer 130a. Thus, the electromagnetic field radiated by the circuit board assembly 110 to the outside during operation is greatly weakened or even blocked, thereby achieving the effect of electromagnetic shielding. If some of the magnetic field lines generated when the circuit board assembly 110 is working are introduced into the first shielding layer 130a, then some other magnetic field lines enter the second shielding layer 130b. That is, some of the electromagnetic fields generated when the circuit board 110 is working enter the second electromagnetic shielding layer 130b. The part of the electromagnetic field that enters the second shielding layer 130b generates eddy currents inside the second shielding layer 130b, and the part of the electromagnetic field is reflected by the second shielding layer 130b. Thus, the electromagnetic field radiated by the circuit board assembly 110 to the outside during operation is greatly weakened or even blocked, thereby achieving the effect of electromagnetic shielding. For example, the first shielding layer 130a can be a magnetic material such as iron or silicon steel, and the second shielding layer 130b can be a conductive material such as copper or aluminum.

[0060] In other embodiments, please refer to Figure 7 and Figure 10 , Figure 10 is Figure 7 Partial enlarged schematic diagram of another embodiment at position I. The number of layers of the shielding layer 130 is three or more, and the shielding layer 130 is arranged in an alternating manner of conductive electromagnetic shielding materials and magnetic electromagnetic shielding materials, which can further enhance the electromagnetic shielding effect of the shielding layer 130.

[0061] As can be seen from the foregoing, the shielding layer 130 can cause eddy currents to be generated inside the shielding layer 130 by the electromagnetic field, thereby preventing the electromagnetic field from penetrating the shielding layer 130 and playing the role of electromagnetic shielding. Therefore, the shielding layer 130 can not only block the electromagnetic field radiation generated when the circuit board assembly 110 is working from reaching the outside world, but also block the electromagnetic field radiation from the outside world from entering the adapter 10. Therefore, the shielding layer 130 can not only reduce or even eliminate the electromagnetic interference of the electromagnetic field generated by the operation of the adapter 10 on nearby electronic components, but also reduce or even eliminate the electromagnetic interference of the electromagnetic field generated by the operation of nearby electronic components on the adapter 10.

[0062] In summary, when the circuit board assembly 110 in the adapter 10 provided by the present application generates and radiates an electromagnetic field during operation, since the shielding layer 130 covers and adheres to the first surface 122, the second surface 123, and the peripheral side surface 124 of the first housing 120, the electromagnetic field generated by the circuit board assembly 110 is reduced or even prevented from radiating out through the first surface 122, the second surface 123, and the peripheral side surface 124. As a result, the adapter 10 has good electromagnetic shielding performance. Therefore, when the adapter 10 of the present application is operating, it will only emit a small amount of electromagnetic radiation or even no electromagnetic radiation, and has weak or even no electromagnetic interference on nearby electronic components. Moreover, since the shielding layer 130 of the adapter 10 of the present application covers and adheres to the first surface 122, the second surface 123, and the peripheral side surface 124 of the first housing 120, electromagnetic interference from electronic components to the circuit board assembly 110 of the adapter 10 can be reduced or even prevented.

[0063] In the related art, electromagnetic shielding is usually achieved by covering the first surface 122 and the second surface 123 of the first housing 120 with metal sheets. Since the process of forming the metal sheets into curved or bent structures is very complex, and the first housing 120 usually has a peripheral side surface 124 with a curved or bent structure, the metal sheets cannot cover the peripheral side surface 124 of the first housing 120, allowing the electromagnetic field to radiate out through these uncovered peripheral side surfaces 124.

[0064] In one embodiment, the shielding layer 130 of the present application (see Figure 6 ) covers and adheres to the first surface 122, the second surface 123, and the peripheral side surface 124 of the first housing 120 by means of coating. In one embodiment, the shielding layer 130 is formed on the outer surface of the first housing 120 by Physical Vapor Deposition (PVD). In another embodiment, the shielding layer 130 is formed on the first surface 122, the second surface 123, and the peripheral side surface 124 of the first housing 120 by Chemical Vapor Deposition (CVD). Coating directly on the first surface 122, the second surface 123, and the peripheral side surface 124 of the first housing 120 by means of PVD or CVD can achieve better coverage of the first housing 120 and improve the electromagnetic shielding effect of the shielding layer 130 on the circuit board assembly 110.

[0065] Specifically, PVD refers to a process of achieving material transfer by physical means, transferring atomic or molecular sources to the surface of a substrate. The function of PVD is to spray certain particles with special properties (such as conductivity, magnetism, high strength, wear resistance, heat dissipation, etc.) on a matrix with lower performance, so that the matrix has better performance. Common coating processes of PVD include vacuum evaporation, sputtering coating, ion plating, etc.

[0066] In this embodiment, the sputtering coating method is taken as an example for illustration. Place the first housing 120 in a vacuum space filled with argon (Ar) gas, place a target material with electromagnetic shielding performance corresponding to the first housing 120, and make the argon gas glow discharge. Argon atoms are ionized into argon ions, and under the action of the electric field force, the argon ions are accelerated to bombard the target material. The bombarded part of the target material is bombarded into particles and sputtered out. During the process of flying towards the first housing 120, the sputtered particles collide with the argon gas, causing the movement direction of the collided particles to change and the movement direction to be random. Therefore, the shielding layer 130 with a relatively uniform thickness is formed on the first surface 122, the second surface 123, and the circumferential side surface 124 of the first housing 120. Further, in order to coat the shielding layer 130 more uniformly on the first surface 122, the second surface 123, and the circumferential side surface 124 of the first housing 120, the first surface 122, the second surface 123, and the circumferential side surface 124 of the first housing 120 are respectively aligned with the target material for multiple coatings, further making the shielding layer 130 fit with the first surface 122, the second surface 123, and the circumferential side surface 124 of the first housing 120. In addition, since the argon ions will give the particles sputtered from the target material a certain acceleration when bombarding the target material, these particles will impact the first surface 122, the second surface 123, and the circumferential side surface 124 of the first housing 120. Therefore, these particles will fit tightly with the first surface 122, the second surface 123, and the circumferential side surface 124 of the first housing 120, so that finally after the coating is completed, the shielding layer 130 fits tightly with the first surface 122, the second surface 123, and the circumferential side surface 124 of the first housing 120 without gaps.

[0067] Please refer to Figure 11 , Figure 12 , Figure 13 and Figure 14 , Figure 11 which is a schematic structural diagram of an adapter provided in another embodiment of the present application; Figure 12 is Figure 11 a schematic cross-sectional view of the adapter along the B-B line in the embodiment; Figure 13 is Figure 11 a partial enlarged schematic view of a certain embodiment at III in Figure 14 is Figure 11Partial enlarged schematic view of yet another embodiment at III in the figure. The first housing 120 has a first through hole 125, the shielding layer 130 has a second through hole 131, and the first through hole 125 communicates with the second through hole 131. The circuit board assembly 110 has a ground electrode 111, and the ground electrode 111 is disposed corresponding to the first through hole 125. The adapter 10 further includes an electrical connector 140 and a grounding spring piece 150. The electrical connector 140 covers at least a part of the second through hole 131 and is electrically connected to the shielding layer 130. The grounding spring piece 150 is disposed in the first through hole 125 and the second through hole 131, and the grounding spring piece 150 is electrically connected to the ground electrode 111 and the electrical connector 140.

[0068] Both the electrical connector 140 and the grounding spring piece 150 are conductive members, which may be, but are not limited to, copper or aluminum, etc. When the adapter 10 is connected to a power supply and operates, the electronic components in the voltage conversion circuit of the circuit board assembly 110 can be electrically connected to the ground electrode 111 to be grounded.

[0069] As can be seen from the foregoing, when the adapter 10 operates, the circuit board assembly 110 generates an electromagnetic field, and the electromagnetic field forms eddy currents inside the shielding layer 130, making it difficult for the electromagnetic field to penetrate the shielding layer 130, thereby achieving the effect of electromagnetic shielding. By electrically connecting the grounding spring piece 150 and the shielding layer 130 through the electrical connector 140, the shielding layer 130 is electrically connected to the ground electrode 111, and the eddy currents formed by the electromagnetic field inside the shielding layer 130 can be grounded, so that the energy of the electromagnetic field is converted into the energy of the eddy currents formed inside the shielding layer 130 and consumed through grounding, further preventing the electromagnetic field from radiating to the outside of the adapter 10, that is, further playing the role of electromagnetic shielding.

[0070] The electrical connector 140 covers at least a part of the second through hole 131 and is electrically connected to the shielding layer 130. Since the shielding layer 130 has the second through hole 131, the electromagnetic field can pass through the shielding layer 130 through the second through hole 131. Therefore, the electromagnetic shielding effect of the shielding layer 130 is proportional to the sealing performance. In one embodiment, the electrical connector 140 covers a part of the second through hole 131, increasing the sealing performance of the shielding layer 130, thereby improving the electromagnetic shielding effect of the shielding layer 130. In yet another embodiment, the electrical connector 140 completely covers the second through hole 131, further increasing the sealing performance of the shielding layer 130, thereby further improving the electromagnetic shielding effect of the shielding layer 130.

[0071] Please refer to again Figure 13 and Figure 14。The grounding spring piece 150 is electrically connected to the ground electrode 111 and the electrical connector 140, so that the ground electrode 111 is electrically connected to the shielding layer 130, thereby consuming the eddy current formed by the electromagnetic field inside the shielding layer 130 through grounding, and enhancing the electromagnetic shielding effect of the shielding layer 130. In one embodiment (see Figure 13 ), the electrical connector 140 and the grounding spring piece 150 are respectively arranged on the outer side of the shielding layer 130 and the inner side of the first housing 120. The electrical connector 140 abuts against the grounding spring piece 150, and the electrical connector 140 abuts against the shielding layer 130. In another embodiment (see Figure 14 ), the electrical connector 140 and the grounding spring piece 150 are a conductive part with an integral structure, marked as 140(150) in the figure. One end of the conductive part with an integral structure is electrically abutted against the ground electrode 111, and the other end of the conductive part with an integral structure abuts against the shielding layer 130. The electrical connector 140 and the grounding spring piece 150 being a conductive part with an integral structure enables a better conductivity for the electrical connection between the shielding layer 130 and the ground electrode 111, which is beneficial to consuming the eddy current in the shielding layer 130 through grounding, and can further enhance the electromagnetic shielding effect of the shielding layer 130.

[0072] Please refer to Figure 15 , Figure 15 which is Figure 11 a partial enlarged schematic view of another embodiment at III in

[0073] In this embodiment, the electrical connector 140 covers the second through hole 131, and the electrical connector 140 partially overlaps with the shielding layer 130. That is, the size of the electrical connector 140 is larger than the size of the second through hole 131, and the electrical connector 140 abuts against the shielding layer 130 on the outer side of the shielding layer 130.

[0074] In this embodiment, the electrical connector 140 covers the second through hole 131, that is, the size of the electrical connector 140 is larger than the size of the first through hole 125 and the second through hole 131.

[0075] The electrical connector 140 covers the second through hole 131, and the electrical connector 140 partially overlaps with the shielding layer 130. In one embodiment, the electrical connector 140 directly covers the second through hole 131. In another embodiment (see Figure 15 ), the first housing 120 has a first groove 128 at the first through hole 125. In other words, the first through hole 125 and the first groove 128 of the first housing 120 communicate to form a stepped hole. The shielding layer 130 is partially disposed in the first groove 128, and the shielding layer 130 has a second groove 132 at the second through hole 131. In other words, the second through hole 131 of the shielding layer and the second groove 132 communicate to form a stepped hole. The electrical connector 140 is disposed in the second groove 132, so that the electrical connector 140 can better cover the second through hole 131 in the second groove 132, preventing the electrical connector 140 from sliding and causing the electrical connector 140 to deviate from the second through hole 131, thereby causing electromagnetic leakage of the shielding layer 130. Therefore, the provision of the first groove 128 and the second groove 132 is conducive to improving the tightness of the shielding layer 130 and enhancing the electromagnetic shielding effect of the shielding layer 130.

[0076] In yet another embodiment, the first housing 120 has a first groove 128 at the first through hole 125. In other words, the first through hole 125 and the first groove 128 of the first housing 120 communicate to form a stepped hole. The shielding layer 130 is partially disposed in the first groove 128, and the shielding layer 130 has a second groove 132 at the second through hole 131. In other words, the first through hole 131 of the shielding layer and the second groove 132 communicate to form a stepped hole. The electrical connector 140 is disposed in the second groove 132, and the size of the electrical connector 140 is less than or equal to that of the second groove 132, and the thickness of the electrical connector 140 is less than the depth of the second groove 132, improving the flatness of the overall outer surface of the shielding layer 130, which is conducive to the further installation of the subsequent adapter 10.

[0077] Please refer to Figure 16 , Figure 16 For Figure 5Partial enlarged schematic view of another embodiment at II in the figure. In one embodiment, the thickness d of the shielding layer 130 ranges from 0.1 mm ≤ d ≤ 0.2 mm. The electromagnetic field generated when the circuit board assembly 110 is working will form eddy currents inside the shielding layer 130. The eddy currents are usually concentrated on the surface of the shielding layer 130, and as the thickness of the shielding layer 130 increases, the energy intensity of the eddy currents decays exponentially. Therefore, after the shielding layer 130 has a certain thickness, it can shield the electromagnetic field, and as the thickness of the shielding layer 130 increases, the electromagnetic shielding effect is better. However, due to process costs and subsequent assembly requirements of the adapter 10, the thickness of the shielding layer 130 should not be too thick. Therefore, the selected range of the thickness d of the shielding layer 130 is 0.1 mm ≤ d ≤ 0.2 mm, which can not only meet the electromagnetic shielding effect of the shielding layer 130, but also meet the process costs and subsequent assembly requirements of the adapter 10. In this embodiment, the thickness of the shielding layer 130 covered on the first surface 122, the second surface 123 and the circumferential side surface 124 of the first housing 120 is all d. Specifically, in one embodiment, the thickness d of the shielding layer 130 = d1, and the electromagnetic shielding efficiency of the shielding layer 130 reaches the first shielding efficiency a%. In another embodiment, the thickness d of the shielding layer 130 = d2, and the electromagnetic shielding efficiency of the shielding layer 130 reaches the second shielding efficiency b%, where d1 < d2 and a% < b%. For example, d1 = 0.1 mm, d2 = 0.2 mm, a% = 75%, b% = 95%.

[0078] Please also refer to Figure 17 、 Figure 18 and Figure 19 , Figure 17 is a schematic structural diagram of the adapter provided by another embodiment of the present application; Figure 18 is a schematic cross-sectional view of the adapter provided by one embodiment along Figure 17 the C-C line in Figure 19 is Figure 18 a partial enlarged schematic view of one embodiment at IV in

[0079] It should be noted that in this embodiment, the outer surface of the first housing body 126 is the same surface as the outer surface of the first housing 120. And the outer surface of the first housing 120 includes the first surface 122, the second surface 123 and the circumferential side surface 124, and the first engaging portion 127 can be provided on one or more of the first surface 122, the second surface 123 and the circumferential side surface 124.

[0080] In this embodiment, the second engaging portion 162 cooperates with the first engaging portion 127 to embed the first housing 120 into the second housing 160. Since the shielding layer 130 has a certain thickness, the size of the second housing 160 is slightly larger than the size of the first housing 120, so that the first housing 120 can still be embedded into the second housing 160 after the shielding layer 130 is provided on the outer surface. Embedding the first housing 120 into the second housing 160 means that the first housing 120 is inserted into the second housing 160 by sliding, or the second housing 160 is sleeved on the first housing 120 by sliding.

[0081] In this embodiment, the second housing 160 can also squeeze the electrical connector 140, so that the electrical connector 140 is closely attached to the shielding layer 130, improving the sealing performance of the shielding layer 130, and thus improving the electromagnetic shielding effect of the shielding layer 130.

[0082] The first housing 120 has a first engaging portion 127, and the first engaging portion 127 is provided on the outer surface of the first housing body 126; the adapter 10 further includes a second housing 160, and the second housing body 161 has a second engaging portion 162, and the second engaging portion 162 is provided on the inner surface of the second housing body 161.

[0083] In one embodiment (see Figure 18 and Figure 19 ), the first engaging portion 127 and the second engaging portion 162 can be an interference fit connection. For example, specifically, the first engaging portion 127 is a protrusion protruding from the outer surface of the first housing body 123, the second engaging portion 162 is a groove recessed in the inner surface of the second housing body 161, and the first engaging portion 127 and the second engaging portion 162 are in interference fit, and the second engaging portion 162 has a sliding groove on the side in the direction of inserting the first housing 120, and the width dimension of the sliding groove is larger than that of the first engaging portion 127, so that the first engaging portion 127 can be introduced into the second engaging portion 162 through the sliding groove for installation.

[0084] In another embodiment, please refer to Figure 20and Figure 21 , Figure 20 The adapter provided for another embodiment is along the Figure 17 Schematic cross-sectional view along line C-C in Figure 21 For Figure 20 Partial enlarged schematic view of an embodiment at V in . The first engaging portion 127 and the second engaging portion 162 may be in a snap-fit. For example, specifically, the first engaging portion 127 is a snap protruding from the outer surface of the first housing body 123, and the second engaging portion 162 is a slot provided in the second housing body 161, and the snap and the slot are connected by snap connection. In another embodiment, the second housing 160 may be, but is not limited to, directly manufactured on the outer surfaces of the first housing 120 and the shielding layer 130 by forming processes such as injection molding, blow molding, or thermoforming, which can improve the fitting degree of the second housing 160 and the first housing 120, thereby enhancing the sealing performance and texture of the adapter 10.

[0085] Please refer to Figure 22 , Figure 23 and Figure 24 , Figure 22 Schematic structural view of the adapter provided for another embodiment of the present application; Figure 23 For the adapter provided for an embodiment along the Figure 22 Schematic cross-sectional view along line D-D in Figure 24 For the adapter provided for another embodiment along the Figure 22 Schematic cross-sectional view along line D-D in . In another embodiment, the adapter 10 further includes a second housing 160 and a connecting member 170. The second housing 160 houses the first housing 120, and the connecting member 170 connects the second housing 160 and the first housing 120.

[0086] The connecting member 170 connects the second housing 160 and the first housing 120. In one embodiment (see Figure 23 ), the connecting member 170 is provided between the first housing 120 and the second housing 160, and the first housing 120 and the second housing 160 are connected by the connecting member 170. The connecting member 170 may be, but is not limited to, glue, adhesive tape, or a polyurethane layer, as long as the connecting member 170 can connect the first housing 120 and the second housing 160. In another embodiment (see Figure 24) In this case, the second housing 160 includes a first sub-housing 163 and a second sub-housing 164. The first sub-housing 163 and the second sub-housing 164 are connected by the connecting member 170, and the first sub-housing 163 and the second sub-housing 164 can be connected together to jointly accommodate the first housing 120. For example, specifically, the connecting member 170 can be, but is not limited to, dispensing glue, adhesive tape, or a polyurethane layer, etc.

[0087] Please refer to Figure 25 、 Figure 26 and Figure 27 , Figure 25 which is a schematic structural diagram of an adapter provided by another embodiment of the present application; Figure 26 is Figure 25 a schematic cross-sectional view of the adapter along the E-E line in an embodiment; Figure 27 is Figure 26 a partially enlarged schematic view of a VI position in an embodiment of. In one embodiment, the electrical connecting member 140 is disposed on the inner surface of the second housing 160. So that the electrical connecting member 140 and the second housing 160 can be installed simultaneously and fixed together, avoiding the electrical connecting member 140 sliding on the shielding layer 130 resulting in the electrical connecting member 140 not completely covering the second through hole 131, thereby weakening the electromagnetic shielding effect of the shielding layer 130.

[0088] In this embodiment (see Figure 27 ), the second housing 160 has a third groove 165, and the electrical connecting member 140 is disposed in the third groove 165, and the thickness of the electrical connecting member 140 is greater than or the third groove 165, ensuring that when the second housing 160 is installed on the first housing 120, the electrical connecting member 140 can be electrically connected to the shielding layer 130 and cover the second through hole 131, ensuring the electromagnetic shielding effect of the shielding layer 130.

[0089] Please refer to Figure 28 , Figure 28 which is Figure 11 a partially enlarged schematic view of another III position in. The grounding spring piece 150 includes a base 151, a bent portion 152, and a free end 153 connected in sequence. The base 151 is electrically connected to the ground electrode 111. The free end 153 is bent and connected to the base 151 through the bent portion 152, and the free end 153 elastically abuts against the electrical connecting member 140.

[0090] In this embodiment, the grounding spring piece 150 is made of a conductive material, which may include, but is not limited to, aluminum, copper, etc. The base 151 abuts against the ground electrode 111, and the base 151 supports the bent portion 152 and the free end 153. The grounding spring piece 150 has elasticity due to the design of the bent portion 152, so that the free end 153 can move relative to the base 151 through the bent portion 152. When the grounding spring piece 150 is not subject to external force, the grounding spring piece 150 can abut against the electrical connector 140. When pressure is applied to the electrical connector 140 to make the electrical connector 140 fit better with the shielding layer 130, the free end 153 can be stressed and move towards the base 151, and the grounding spring piece 150 can rely on its elasticity to keep the free end 153 in contact with the electrical connector 140, ensuring that the shielding layer 130 can be electrically connected to the ground electrode 111. The grounding spring piece 150 has elasticity due to the structure of the bent portion 152, which provides an adjustable space for the installation of the electrical connector 140 and makes the connection between the grounding spring piece 150 and the electrical connector 140 tighter, facilitating the electrical connection of the shielding layer 130 to the abutment, thereby improving the electromagnetic shielding effect of the shielding layer 130.

[0091] In another embodiment, please refer to Figure 29 , Figure 29 is Figure 11 a partial enlarged schematic view of another embodiment at III in

[0092] In this embodiment, the size of the free end 153 is larger than that of the second through hole 131, and the free end 153 can cover the second through hole 131. The sizes of the bent portion 152 and the base 151 are smaller than those of the second through hole 131, so that the bent portion 152 and the base 151 can pass through the second through hole 131. Due to the structure of the bent portion 152, the integral conductive member has elasticity. In a state where no external force is applied, the base 151 abuts against the ground electrode 111, and the free end 153 does not contact the shielding layer 130 or just touches the shielding layer 130. When the free end 153 is subjected to a pressure in the direction from the free end 153 to the base 151, the free end 153 can move towards the base 151 through the bent portion 152, and the free end 153 abuts against the shielding layer 130, so as to completely cover the second through hole 131 and electrically connect the shielding layer 130 to the ground electrode 111, improving the electromagnetic shielding effect of the shielding layer 130.

[0093] Please refer to Figure 3 , Figure 30 and Figure 31 , Figure 30 which is a schematic structural diagram of an adapter provided in another embodiment of the present application;

[0094] Figure 31 is Figure 30 a schematic cross-sectional view of the adapter along the F-F line in the embodiment. The first housing 120 further has an opening 129 which communicates with the receiving space 121. The adapter 10 further includes a pin assembly 180, and the pin assembly 180 includes a carrier 181 and pins 182. The carrier 181 is used for carrying the pins 182, and the carrier 181 is fixed to the first housing 120 and seals the opening 129, and the pins 182 are electrically connected to the circuit board assembly 110.

[0095] The pin 182 is used to be inserted into the socket 2 to receive the first voltage. When the pin 182 is inserted into the socket 2, the surface that mates with the socket 2 is called the plugging surface 183 of the adapter 10, and the plugging surface 183 meets the requirements of the safety regulations of the adapter 10. When the pin 182 of the adapter 10 is inserted into the socket 2, a surface that only mates with the socket 2 but does not meet the safety regulations of the adapter 10 cannot be called the plugging surface 183 of the adapter 10. Specifically, for the adapter 10, when the pin 182 of the adapter 10 is inserted into the socket 2, in order to prevent the electrical energy of the socket 2 from leaking out through the pin 182 and causing harm to the user, the distance between the edge of the pin 182 closest to the plugging surface 183 needs to be greater than or equal to a preset distance (also called the safety distance). For example, for the adapter 10 applicable to China, the preset distance is 6.5 mm. For the adapter 10 applicable to other countries, the distance is other values. Specifically, the distances on both sides of the pin from the surfaces adjacent to the adapter 10 are greater than or equal to the preset distance. For example, in order to meet the requirements of the safety regulations of the adapter 10, the width of the plugging surface 183 of the adapter 10 is set to 22 mm.

[0096] The carrier seat 181 and the pin 182 can be fixed by in-mold injection molding, and the pin 182 is partially exposed from the carrier seat 181. The carrier seat 181 is fixed to the first housing 120 and seals the opening 129. The carrier seat 181 can seal the opening 129 by, but not limited to, clamping or gluing. The carrier seat 181 closing the opening 129 improves the sealing performance of the adapter 10.

[0097] The installation process of the adapter 10 will be described below through an embodiment of the present application to facilitate understanding of the structural composition of the adapter 10.

[0098] In one embodiment, the adapter 10 includes a circuit board assembly 110, a first housing 120, a shielding layer 130, an electrical connector 140, a grounding spring piece 150, and a pin assembly. Among them, the circuit board assembly 110 has a ground electrode 111. Among them, the first housing 120 has a receiving space 121 for receiving the circuit board assembly 110. Among them, the first housing 120 has a first through hole 125, the shielding layer 130 has a second through hole 131, and the first through hole 125 communicates with the second through hole 131 and is disposed corresponding to the ground electrode 111. Among them, the first housing 120 has a first groove 128 at the first through hole 125, and the first through hole 125 and the first groove 128 of the first housing 120 communicate to form a stepped hole. Correspondingly, the shielding layer 130 has a second groove 132 at the second through hole 131, and the first through hole 131 of the shielding layer communicates with the second groove 132 to form a stepped hole. The electrical connector 140 is disposed in the second groove 132, and the size of the electrical connector 140 is less than or equal to the second groove 132, and the thickness of the electrical connector 140 is less than the depth of the second groove 132. Among them, the electrical connector 140 completely covers the second through hole 131 and partially overlaps with the shielding layer 130, and the electrical connector 140 is electrically connected to the shielding layer 130. Among them, the grounding spring piece 150 includes a base 151, a bent portion 152, and a free end 153 connected in sequence. The base 151 abuts against and is electrically connected to the ground electrode 111. The free end 153 is bent and connected to the base 151 through the bent portion 152, and the free end 153 elastically abuts against and is electrically connected to the electrical connector 140. Among them, the second housing 160 houses the first housing 120 through an injection molding process. Among them, the first housing 120 further has an opening 129, and the opening 129 communicates with the receiving space 121. Among them, the pin assembly 180 includes a carrier 181 and pins 182. The carrier 181 is used to carry the pins 182, and the carrier 181 is fixed to the first housing 120 and seals the opening 129, and the pins 182 are electrically connected to the circuit board assembly 110. Please refer to Figure 32 , Figure 32 is an assembly flow chart of the adapter provided in an embodiment of the present application. The assembly method of the adapter 10 provided in this embodiment includes but is not limited to S1, S2, S3, S4, S5, and S6, and S1, S2, S3, S4, S5, and S6 are introduced in detail as follows.

[0099] S1, plating the first housing 120, and plating an electromagnetic shielding material film on the first surface 122, the second surface 123, and the circumferential side surface 124 of the first housing 120 by using PVD technology.

[0100] S2, install the circuit board assembly 110 into the receiving space 121 of the first housing 120 through the opening 129, and the ground pole 111 is arranged corresponding to the first through hole 125.

[0101] S3, fix the carrier 181 to the first housing 120 and seal the opening 129, so that the pin 182 is electrically connected to the circuit board assembly 110.

[0102] S4, arrange the grounding elastic piece 150 corresponding to the first through hole 125 and the second through hole 131, and electrically connect it to the ground pole 111.

[0103] S5, place the electrical connector 140 in the second groove 132 and cover the second through hole 131, so that the electrical connector 140 abuts against the grounding elastic piece 150.

[0104] S6, use an injection molding process to form the second housing 160. The second housing 160 houses the first housing 120, the shielding layer 130 and the carrier 181 to form the adapter 10. The injection pressure during the injection molding process will firmly press the electrical connector 140 and the shielding layer 130.

[0105] It should be noted that the order in S1-S6 above can be adjusted as needed. For example, in one embodiment, the assembly method of the adapter 10 includes S1, S2, S4, S5, S6 and S3 performed in sequence.

[0106] Please refer to again Figure 1 , this application also provides an electronic device assembly 1. The electronic device assembly 1 includes an electronic device 20 and the adapter 10 as described above. The adapter 10 is used to provide electrical energy for the electronic device 20. When the adapter 10 is plugged into the socket 2 to connect to the power supply, the current flows through the pin 182 and the circuit board assembly 110 into the electronic device 20 and provides electrical energy for the electronic device 20.

[0107] The adapter 10 can convert the input first voltage into a second voltage and output it to the electronic device 20. In one embodiment, the circuit board assembly 110 can change the type of voltage. For example, the first voltage is an alternating current voltage and the second voltage is a direct current voltage. In another embodiment, the circuit board assembly 110 can change the amplitude of the voltage (also referred to as the voltage value). For example, both the first voltage and the second voltage are direct current voltages, and the amplitude of the first voltage is different from the amplitude of the second voltage; or, both the first voltage and the second voltage can be alternating current voltages, and the amplitude of the first voltage is different from the amplitude of the second voltage. In other embodiments, the circuit board 110 can both change the type of voltage and change the amplitude of the voltage. For example, the type of the second voltage is different from that of the first voltage, and the voltage values are different.

[0108] Generally, the household voltage is an alternating current voltage of 220V, which is much higher than the operating voltage of the electronic device 20, and the operating voltage of some of the electronic devices 20 is a direct current voltage. Therefore, during the process of the adapter 10 providing electrical energy to the electronic device 20, the adapter 10 will convert the incoming first voltage into a second voltage and transmit it to the electronic device 20. For example, the first voltage is an alternating current voltage of 220V and the second voltage is a direct current voltage of 5V. In other words, the adapter 10 converts the alternating current voltage of 220V into a direct current voltage of 5V. The first voltage is an alternating current voltage of 240V and the second voltage is an alternating current voltage of 100V. In other words, the adapter 10 converts the alternating current voltage of 240V into an alternating current voltage of 100V.

[0109] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and should not be construed as limitations of the present application. Those of ordinary skill in the art can make changes, modifications, substitutions, and variations to the above embodiments within the scope of the present application, and these improvements and refinements are also regarded as the protection scope of the present application.

Claims

1. An adapter, characterized in that, The adapter includes: A circuit board assembly for converting an input first voltage into a second voltage for output, the circuit board assembly having a ground pole; A first housing having a receiving space for receiving the circuit board assembly. The first housing includes a first surface, a second surface and a peripheral side surface. The first surface and the second surface are disposed opposite to each other, and the peripheral side surface is connected to the first surface and the second surface. The first housing further has a first through hole and a first groove at the first through hole. The first through hole and the first groove communicate to form a stepped hole, and the ground pole is disposed corresponding to the first through hole; A shielding layer covering and conforming to the first surface, the second surface and the peripheral side surface of the first housing. The shielding layer has a second through hole and a second groove at the second through hole. The second through hole and the second groove form a stepped hole; An electrical connector disposed in the second groove, covering at least part of the second through hole, and electrically connecting the shielding layer; and A grounding spring piece disposed in the first through hole, the second through hole and the second groove, and electrically connecting the ground pole and the electrical connector.

2. The adapter according to claim 1, characterized in that The electrical connector covers the second through hole, and the electrical connector partially overlaps with the shielding layer.

3. The adapter according to claim 1, characterized in that The thickness d of the shielding layer ranges from 0.1 mm to 0.2 mm.

4. The adapter according to claim 1, characterized in that The first housing has: A first housing body; and A first fitting portion disposed on the outer surface of the first housing body; The adapter further includes a second housing having: A second housing body; and A second fitting portion disposed on the inner surface of the second housing body, and the second fitting portion cooperates with the first fitting portion to embed the first housing into the second housing.

5. The adapter according to claim 1, characterized in that, The adapter further includes: A second housing for receiving the first housing; and A connecting member connecting the second housing and the first housing.

6. The adapter according to claim 5, wherein, The electrical connector is disposed on the inner surface of the second housing.

7. The adapter according to claim 1, characterized in that, The grounding spring piece includes a base, a bent portion and a free end connected in sequence. The base is electrically connected to the ground pole, the free end is bent and connected to the base through the bent portion, and the free end elastically abuts against the electrical connector.

8. The adapter according to claim 1, wherein The first housing further has an opening communicating with the receiving space. The adapter further includes: A pin assembly including a carrier seat and pins. The carrier seat is used for carrying the pins, and the carrier seat is fixed to the first housing and seals the opening. The pins are electrically connected to the circuit board assembly.

9. An electronic device component, characterized in that, The electronic device assembly includes an electronic device and the adapter according to any one of claims 1-8, and the adapter is used to supply electrical energy to the electronic device.

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