MEMS Chip and Its Preparation Method, MEMS Device, Electronic Device

Abstract

The present application provides a MEMS chip and a manufacturing method thereof, which are used to improve the structural reliability of the MEMS chip and can be widely used in many fields such as wireless communication, biomedicine, aerospace, consumer electronics, automotive electronics, and instrument measurement. The MEMS chip includes a substrate, a moving component, a fixing component, and a driving component. The fixing component is located between the substrate and the moving component, wherein: the moving component includes a fixing part, a moving part, and a first support beam. The first support beam is respectively connected to the moving part and the fixing part, and a first avoidance groove is formed on the first surface of the moving part facing the fixing component; the fixing component is grounded, and one surface of the fixing component facing the moving component has a boss and a first limiting post. The boss is connected to the fixing part and is used to support the fixing part, and the first limiting post corresponds to a first avoidance groove; the driving component is connected to the moving part and is used to drive the moving part to move.

Description

Technical Field

[0001] This application relates to the field of communication technologies, and particularly to a MEMS chip, a method for manufacturing the same, a MEMS device, and an electronic device. Background Art

[0002] A MEMS (micro-electro-mechanical system) micromirror is a device that uses MEMS technology to achieve light deflection or modulation. Compared with mechanical micromirrors, MEMS micromirrors have the advantages of small size, low cost, high reliability, and being conducive to integration. Therefore, they are widely used in the field of optical communication, such as optical modulation modules like optical attenuators, wavelength selective switches, and optical cross-connectors; or are applied in the field of autonomous driving, such as optical sensing modules or display modules required for lidar, head-up displays, etc.

[0003] An existing MEMS micromirror has a structure including a fixed layer, a movable layer, and a driving structure. Among them, a support structure is provided on the fixed layer, the movable layer can be movably arranged on the support structure through support beams, and a light reflection area is provided on the side of the movable layer facing away from the fixed layer. The driving structure can be used to drive the movable layer to rotate relative to the fixed layer. The disadvantage of this micromirror is that when the micromirror is subjected to a large external impact, the support beams are relatively easy to break due to excessive rotation angle or displacement of the movable layer, resulting in low structural reliability of the micromirror.

[0004] Application Content

[0005] This application provides a MEMS chip, a method for manufacturing the same, a MEMS chip array, a MEMS device, and an electronic device to improve the structural reliability of the MEMS chip.

[0006] In a first aspect, this application provides a MEMS chip. The MEMS chip may include a substrate, a moving component, a fixing component, and a driving component. The fixing component may be located between the substrate and the moving component, and both the moving component and the fixing component can be conductive structures. Among them, the moving component may include a fixing part, a moving part, and a first support beam. The first support beam can be respectively connected to the moving part and the fixing part to rotatably arrange the moving part on the fixing part, and a first avoidance groove is formed on the first surface of the moving part facing the fixing component; a boss and a first limiting post are provided on the surface of the fixing component facing the moving component. The boss can be connected to the fixing part and support the fixing part to enable the moving part to rotate relative to the fixing component. The first limiting post is located in the area of the fixing component corresponding to the moving part, and the first limiting post corresponds to a first avoidance groove; the driving component is connected to the moving part and can be used to drive the moving part to move to realize the related functions of the MEMS chip.

[0007] In the above solution, when the MEMS chip is subjected to an external impact, the first limiting post can limit the displacement amplitude of the moving part in the direction of the fixed component, thereby reducing the risk of the first support beam breaking due to excessive displacement of the moving part and improving the structural reliability of the MEMS chip.

[0008] In some possible implementation manners, the first limiting posts and the first avoidance grooves are in one-to-one correspondence, or multiple first limiting posts correspond to the same first avoidance groove.

[0009] In some possible implementation schemes, the driving component is specifically configured to drive the moving part to rotate around a set first rotation axis, so that the moving part deflects relative to the fixed component; the first avoidance groove can be located on at least one side of the first rotation axis. In this way, when the driving component drives the moving part to rotate, the first limiting post can cooperate with the first avoidance groove to limit the rotation angle of the moving part, reducing the risk of damage to the first support beam due to excessive rotation of the moving part and improving the structural reliability of the MEMS chip.

[0010] In order to simplify the manufacturing process of the MEMS chip, in a specific implementation scheme, the first limiting post and the boss can be designed to have the same height, so that the two can be formed in one step by an etching process.

[0011] In some possible implementation schemes, the maximum rotation angle of the moving part around the first rotation axis is θ1max, and the depth d1 of the first avoidance groove and the horizontal distance L1 between the first avoidance groove and the first rotation axis satisfy: θ1max ≤ arctan(d1 / L1). The cross-section of the avoidance groove can be rectangular, circular, elliptical, triangular, etc. For different shapes, L1 can refer to the horizontal distance from the point on the edge of the avoidance groove closest to the first rotation axis to the first rotation axis. In addition, the first avoidance groove can have other forms. For example, the first rotation axis passes through the first avoidance groove. At this time, the maximum rotation angle of the moving part around the first rotation axis is θ3max, and the depth d3 of the first avoidance groove and the horizontal distance L3 from the point on the first limiting post far from the first rotation axis to the first rotation axis satisfy: θ3max ≤ arctan(d3 / L3). According to the above formula, the required depth range of the first avoidance groove at a certain position can be determined. Through the cooperation between the first avoidance groove and the first limiting post, the first limiting post can not only limit the displacement amount of the moving part in the direction of the fixed component, but also limit the rotation amount of the moving part around the first rotation axis, thereby improving the structural reliability of the MEMS chip.

[0012] The specific setting position of the driving component is related to its structural form, and the structural form of the driving component is determined by its driving method. According to the different driving methods of the driving component, the driving component can be set on the moving component, or on the fixed component, or can be respectively set on the moving component and the fixed component. Below, taking driving components with several different driving methods as examples, their structures will be specifically described.

[0013] In a specific implementation, the fixed component may include a first conductive part and at least one second conductive part. The first conductive part can be grounded, and the first conductive part and the second conductive part are insulated from each other through a first isolation groove. Since the fixed component is grounded, the first limiting post located thereon can be grounded by direct contact, avoiding subsequent complex processes such as through-silicon via technology or metal wire embedding, etc. Therefore, it is beneficial to simplify the manufacturing process of the MEMS chip.

[0014] Furthermore, the driving component may include a first comb structure and a second comb structure. Among them, the first comb structure is connected to the moving part, and the first comb structure is at least located on one side of the first rotation axis; the second comb structure can be connected to the second conductive part, and the teeth of the second comb structure are arranged in a staggered manner with the teeth of the first comb structure. In this way, when a driving voltage is applied to the second comb structure, a certain potential difference can be formed between the second comb structure and the first comb structure, so as to drive the first comb structure and the moving part to rotate around the first rotation axis. Among them, the extending direction of the first rotation axis is the extending direction of the first support beam.

[0015] In order to expand the functions of the MEMS chip, the first comb structure can also be respectively located on both sides of the first rotation axis. At this time, the second comb structure may include a first driving part and a second driving part arranged at intervals, and the first driving part and the second driving part are respectively located on different second conductive parts, and the first driving part can be correspondingly arranged with the first comb structure located on one side of the first rotation axis, and the second driving part can be correspondingly arranged with the first comb structure located on the other side of the first rotation axis. In this way, when a driving voltage is applied to the first driving part, a certain potential difference can be formed between the first driving part and the corresponding first comb structure on the same side, so as to drive the moving part to rotate towards the side where the first driving part is located; when a driving voltage is applied to the second driving part, a certain potential difference can be formed between the second driving part and the corresponding first comb structure on the same side, so as to drive the moving part to rotate towards the side where the second driving part is located.

[0016] In addition, the first avoidance groove and the first limiting post can be respectively arranged on both sides of the first rotation axis, so as to respectively limit the rotation amount of the moving part in the clockwise direction and the counterclockwise direction, avoid the first comb structure and the second comb structure from attracting each other, and improve the structural reliability of the MEMS chip.

[0017] To increase the driving force of the driving component and improve the working reliability of the MEMS chip, the first comb structure can also be located on the side of the moving part, so as to increase the relative area between the first comb and the second comb structure, and further increase the electrostatic torque formed by the potential difference between the two.

[0018] In another specific embodiment, the movement may further include a first rotating part and a second rotating part, and the fixing component may further include a second support beam, which can be respectively connected to the first rotating part and the second rotating part, so that the second rotating part can rotate relative to the first rotating part around the second rotation axis; the first support beam can be respectively connected to the first rotating part and the fixing part, so that the first rotating part and the second rotating part connected to the first rotating part rotate together around the first rotation axis, wherein the extending direction of the second rotation axis is the extending direction of the second support beam; in this solution, the second rotating part has both the rotational freedom around the first rotation axis and the rotational freedom around the second rotation axis, that is, two-dimensional rotation can be realized, so the function of the MEMS chip can be extended.

[0019] In addition, a second avoidance groove can be formed on the first surface of the second rotating part, and the second avoidance groove can be at least on one side of the second rotation axis; the surface of the first conductive part facing the moving component has a second limiting post corresponding to the second avoidance groove, so as to limit the rotation amount of the second rotating part around the second rotation axis in at least one direction.

[0020] In some possible embodiments, the maximum rotation angle of the second rotating part around the second rotation axis is θ2max, and the depth d2 of the second avoidance groove, the horizontal distance L2 between the second avoidance groove 26 and the second rotation axis satisfy: θ2max ≤ arctan(d2 / L2). The cross-section of the avoidance groove can be rectangular, circular, elliptical, triangular, etc. For different shapes, L2 refers to the horizontal distance from the point on the side of the avoidance groove closest to the second rotation axis to the second rotation axis. In addition, the second avoidance groove can have other forms. For example, the second rotation axis passes through the second avoidance groove. At this time, the maximum rotation angle of the moving part around the second rotation axis is θ5max, and the depth d5 of the second avoidance groove and the horizontal distance L5 from the point on the second limiting post far from the second rotation axis to the second rotation axis satisfy: θ5max ≤ arctan(d5 / L5). According to this formula, the required depth range of the second avoidance groove at a certain position can be determined. Through the cooperation between the second avoidance groove and the second limiting post, the second limiting post can not only limit the displacement amount of the second rotating part in the direction towards the fixing component, but also limit the rotation amount of the second rotating part around the second rotation axis, thereby improving the structural reliability of the MEMS chip.

[0021] In some possible embodiments, the fixing component may further include at least one third conductive portion, and the third conductive portion and the first conductive portion may be insulated from each other through a second isolation groove; the driving component may further include a third comb structure and a fourth comb structure. Wherein, the third comb structure may be connected to the second rotating portion, and the third comb structure may be located on at least one side of the first rotation axis; the fourth comb structure may be connected to the third conductive portion, and the teeth of the fourth comb structure are arranged in a staggered manner with the teeth of the third comb structure. In this way, when a driving voltage is applied to the fourth comb structure, a certain potential difference may be formed between the fourth comb structure and the third comb structure, so as to drive the third comb structure and the second rotating portion to rotate around the second rotation axis.

[0022] Similarly, in order to expand the functions of the MEMS chip, the third comb structure may also be located on both sides of the second rotation axis respectively. Correspondingly, the fourth comb structure may include a third driving portion and a fourth driving portion which are spaced apart, and the third driving portion and the fourth driving portion are respectively located on different third conductive portions. The third driving portion may be correspondingly arranged with the third comb structure located on one side of the second rotation axis, and the fourth driving portion may be correspondingly arranged with the third comb structure located on the other side of the second rotation axis. In this way, when a driving voltage is output to the third driving portion, a certain potential difference may be formed between the third driving portion and the corresponding third comb structure on that side, so as to drive the second rotating portion to rotate towards the side where the third driving portion is located; similarly, when a driving voltage is output to the fourth driving portion, a certain potential difference may be formed between the fourth driving portion and the corresponding third comb structure on that side, so as to drive the second rotating portion to rotate towards the side where the fourth driving portion is located.

[0023] In addition, the second avoidance groove and the second limiting post may be respectively arranged on both sides of the second rotation axis, so as to respectively limit the rotation amount of the second rotating portion in the clockwise direction and the counterclockwise direction, avoid the third comb structure and the fourth comb structure from attracting each other, and improve the structural reliability of the MEMS chip.

[0024] The specific structural forms of the first rotating portion and the second rotating portion are not limited. In a specific embodiment, the fixing portion may specifically be a columnar structure, and the number of the fixing portions is at least two. The at least two fixing portions may be arranged at intervals along the extending direction of the first support beam; the second rotating portion has an opening, at least one fixing portion may be located within the opening, one end of the first rotating portion extends into the opening, and the first end of the first rotating portion may be connected to the fixing portion within the opening through the first support beam, and may be connected to the second rotating portion through two second support beams. The second end of the first rotating portion may be connected to the fixing portion outside the opening through the first support beam. Adopting this structural form, the second rotating portion can be reliably rotatably arranged on the first rotating portion, and when the MEMS chip is used as a micromirror, it is also beneficial to improve the duty cycle of the micromirror.

[0025] In another specific embodiment, the first rotating part can be a frame structure, and the second rotating part can be connected to the inner side of the first rotating part through a second support beam. The MEMS chip structure in this form has relatively high stability.

[0026] In some possible embodiments, the MEMS chip may further include a first stop structure. A slot for accommodating the first stop structure is formed on the moving part. The first stop structure is located in the slot, and there is a gap between the periphery of the first stop structure and the inner wall of the slot. Additionally, a first support pillar may be further provided on the surface of the first conductive part facing the moving component to support the first stop structure. In this solution, the first stop structure can limit the rotation of the moving part in the plane, avoiding short circuit caused by the teeth of the first comb structure contacting the teeth of the second comb structure due to excessive rotation of the moving part, which may cause irreversible damage to the device, and thus improving the structural reliability of the MEMS chip.

[0027] In addition, to reduce the risk of adhesion between the first stop structure and the moving part after contact, a first protrusion structure is further provided on the periphery of the first stop structure to reduce the contact area between the first stop structure and the moving part.

[0028] In some possible embodiments, when the MEMS chip may further include an insulating layer between the substrate and the fixed component, a first through slot is further formed on the insulating layer at a position corresponding to the first isolation slot, so as to avoid exposure of insulating material in the first isolation slot, and further avoid reliability problems of the driving component caused by gradual accumulation of net charge of the insulating material, which helps to improve the long-term stability of the rotation angle or rotation frequency of the MEMS chip. Similarly, a second through slot may be further formed on the insulating layer at a position corresponding to the second isolation slot to avoid exposure of insulating material in the second isolation slot.

[0029] In a specific embodiment, the driving component may include a driving coil and a magnet. Specifically, the driving coil may be located on one side of the moving part, and both ends of the driving coil may be respectively connected to the positive and negative electrodes of a driving power supply; the magnet is located on one side of the MEMS chip or may also be located on the fixed component to generate a magnetic field passing through the moving part, so that the energized driving coil generates a Lorentz force under the action of the magnetic field, driving the moving part to rotate around the first rotation axis. Further, the coil may be spiral.

[0030] In the above solution, the moving part may also include a first rotating part and a second rotating part. The first rotating part may specifically be a frame structure. The moving component may further include a second support beam, which can be respectively connected to the inner sides of the second rotating part and the first rotating part, so that the second rotating part can rotate relative to the first rotating part around the second rotation axis. The first support beam can be respectively connected to the first rotating part and the fixed part, so that the first rotating part and the second rotating part connected to the first rotating part rotate together around the first rotation axis.

[0031] When specifically arranged, a second avoidance groove may be formed on the surface of the second rotating part facing the fixed component. The second avoidance grooves may be respectively located on both sides of the second rotation axis. The surface of the fixed component facing the moving component has second limit posts respectively corresponding to the second avoidance grooves to limit the rotation amount of the second rotating part around the second rotation axis. In addition, the first avoidance grooves may also be respectively located on both sides of the first rotation axis. At this time, the surface of the fixed component facing the moving component has first limit posts respectively corresponding to the first avoidance grooves on both sides, so as to limit the rotation amount of the first rotating part and the second rotating part around the first rotation axis.

[0032] In a specific implementation, the number of the first support beams may be two. The driving component may include a first piezoelectric driving structure arranged on each first support beam. The first piezoelectric driving structure can be used to drive the moving part to rotate around the first rotation axis. Among them, the extending direction of the first rotation axis is perpendicular to the connection line of the connection positions of the two first support beams and the moving part. The first avoidance groove and the first limit post may be respectively arranged on both sides of the first rotation axis, so as to respectively limit the rotation amount of the moving part around the first rotation axis in the clockwise direction and the counterclockwise direction, and improve the structural reliability of the MEMS chip.

[0033] In addition, the moving component may further include two second support beams, which are also respectively connected to the moving part and the fixed part. The driving component may further include a second piezoelectric driving structure arranged on each second support beam. The second piezoelectric driving structure can be used to drive the moving part to rotate around the second rotation axis. Among them, the extending direction of the second rotation axis is perpendicular to the connection line of the connection positions of the two second support beams and the moving part. With this solution, the moving part has both the rotational freedom around the first rotation axis and the rotational freedom around the second rotation axis, and can achieve two-dimensional rotation. Therefore, the function of the MEMS chip can be expanded.

[0034] In the above solution, the second avoidance groove and the second limit post may also be respectively arranged on both sides of the second rotation axis, so as to respectively limit the rotation amount of the moving part around the second rotation axis in the clockwise direction and the counterclockwise direction, and improve the structural reliability of the MEMS chip.

[0035] In some possible embodiments, the MEMS chip may further include a second stop structure, which may be located on the periphery of the moving part with a gap therebetween; the side of the fixing component facing the moving component may also have a second support post for supporting the second stop structure. When the MEMS chip is subjected to an external impact, the second stop structure can limit the rotation or movement of the moving part in the plane, reducing the risk of breakage of the first support beam or the second support beam caused by excessive rotation or movement of the moving part, and improving the structural reliability of the MEMS chip.

[0036] In some possible embodiments, the material of the moving component can be highly doped silicon, and the moving component can be specifically fabricated through an SOI wafer; similarly, the material of the fixing component can also be highly doped silicon, and the fixing components can also be fabricated through an SOI wafer.

[0037] In some possible embodiments, the second surface of the moving part facing away from the fixing component further has a mirror area, and the MEMS chip may further include a reflective layer located in the mirror area. At this time, the MEMS chip can be used as a micromirror.

[0038] In a second aspect, the present application also provides a MEMS chip array, which may include the MEMS chip in any of the foregoing possible embodiments, and a plurality of MEMS chips are arranged in an array. When the MEMS chip is a micromirror, the MEMS chip array is a micromirror array. In actual use, each micromirror in the micromirror array can correspond to a beam of incident light to adjust the reflection direction of the incident light. In this way, the entire micromirror array can precisely control the reflection directions of different light beams, thereby expanding its application scenarios.

[0039] In a third aspect, the present application also provides a MEMS device, which may include the MEMS chip 10 in any of the foregoing possible embodiments, as well as a substrate and a cover plate. The cover plate can cover the substrate and form a packaging space with the substrate; the MEMS chip can be disposed on the substrate and located within the packaging space. Pins are provided on the substrate. The first end of the pin is connected to the driving component, and the second end can extend outside the packaging space to be connected to a driving signal outside the device, so that a driving voltage or current can be output to the driving component to enable the MEMS chip to operate normally.

[0040] In addition, when the MEMS chip is used as a micromirror, the side of the cover plate facing the substrate can be made of a transparent material so that the light beam outside the device can irradiate the micromirror in the packaging space through the transparent cover plate.

[0041] Fourth aspect, the present application further provides an electronic device, which may include a circuit board, a control chip, a connector, and the MEMS device in the foregoing embodiments. Among them, the MEMS device and the control chip are respectively located on one side of the circuit board, and the connector can be used to connect the second end of the control chip and the pin to output the driving voltage or current output by the control chip to the MEMS device.

[0042] Fifth aspect, the present application further provides a method for manufacturing an MEMS chip, including the following steps:

[0043] Form a moving component on the first side of the first wafer;

[0044] Form a fixed component on the first side of the second wafer, and the second side of the second wafer has a substrate;

[0045] Bond and fix the first wafer and the second wafer, and make the first side of the first wafer opposite to the first side of the second wafer so that the moving component and the fixed component are arranged opposite to each other;

[0046] Among them, forming a moving component on one side of the first wafer specifically includes: forming a fixing part, a moving part, and a first support beam on the first side of the first wafer, and the first support beam is respectively connected to the fixing part and the moving part to rotatably arrange the moving part on the fixing part;

[0047] Forming a fixed component on the first side of the second wafer specifically includes: forming a boss and a first limiting post on the first side of the second wafer. After bonding and fixing the first wafer and the second wafer, the boss can be connected to the fixing part and support the fixing part so that the moving part is suspended on the fixed component; the first limiting post is located in the area of the fixed component corresponding to the moving part, and there is a gap between the first limiting post and the surface of the moving part facing the fixed component;

[0048] Form a driving component on the first wafer and / or the second wafer, and the driving component can be used to drive the moving part to move.

[0049] In the above solution, when the MEMS chip is impacted by the outside world, the first limiting post can limit the displacement amplitude of the moving part in the direction towards the fixed component, thereby reducing the risk of the first support beam breaking due to excessive displacement of the moving part and improving the structural reliability of the MEMS chip.

[0050] In some possible embodiments, the above manufacturing method may further include: forming a first avoidance groove on the surface of the moving part facing the fixed component, and the first avoidance groove can be specifically arranged in one-to-one correspondence with the first limiting post, so that the top of the first limiting post is spaced from the bottom wall of the first avoidance groove.

[0051] In some possible embodiments, the driving component is specifically configured to drive the moving part to rotate around a set first rotation axis, so that the moving part deflects relative to the fixed component; the first avoidance groove may be located on at least one side of the first rotation axis. In this way, when the driving component drives the moving part to rotate, the first limiting post can cooperate with the first avoidance groove to limit the rotation angle of the moving part, reducing the risk of damage to the first support beam due to excessive rotation amount of the moving part, and improving the structural reliability of the MEMS chip.

[0052] To simplify the manufacturing process of the MEMS chip, in a specific embodiment, the height of the first limiting post and the height of the boss can be the same, so that the two can be etched integrally, thereby simplifying the preparation process of the MEMS chip.

[0053] In some possible embodiments, the maximum rotation angle of the moving part around the first rotation axis is θ1max, and the depth d1 of the first avoidance groove and the horizontal distance L1 between the first avoidance groove and the first rotation axis satisfy: θ1max ≤ arctan(d1 / L1). According to this formula, the required depth range of the first avoidance groove at a certain position can be determined. Through the cooperation between the first avoidance groove and the first limiting post, the first limiting post can not only limit the displacement amount of the moving part towards the fixed component, but also limit the rotation amount of the moving part around the first rotation axis, thereby improving the structural reliability of the MEMS chip.

[0054] In some possible embodiments, the preparation method may further include: forming a first conductive part and at least one second conductive part on the first side of the second wafer, forming a first isolation groove between the second conductive part and the first conductive part, and grounding the first conductive part. Since the first conductive part is grounded, the first limiting post formed thereon can be grounded by direct contact, avoiding complex processes such as subsequent through-silicon via process or metal buried line, which is beneficial to simplifying the preparation process of the MEMS chip.

[0055] In some possible embodiments, the preparation method may further include: forming a driving component on the first wafer and / or the second wafer, including:

[0056] Forming a first comb structure connected to the moving part on the first side of the first wafer, the first comb structure is connected to the moving part, and the first comb structure is at least located on one side of the first rotation axis;

[0057] Forming a second comb structure on the second conductive part, the teeth of the second comb structure are arranged in a staggered manner with the teeth of the first comb structure, and the second comb structure is configured to drive the first comb structure and the moving part to rotate around the first rotation axis when receiving a driving voltage;

[0058] The extending direction of the first rotation axis is the same as the extending direction of the first support beam.

[0059] In this way, when a driving voltage is applied to the second comb structure, a certain potential difference can be formed between the second comb structure and the first comb structure, so that the first comb structure and the moving part can be driven to rotate around the first rotation axis.

[0060] In some possible implementation manners, when the MEMS chip may further include an insulating layer located between the substrate and the fixing component, the manufacturing method may further include: forming a first through groove at a position of the insulating layer corresponding to the first isolation groove, so as to avoid exposure of the insulating material in the first isolation groove, and further avoid the reliability problem of the driving component caused by the gradual accumulation of net charges of the insulating material, which helps to improve the long-term stability of the rotation angle or rotation frequency of the MEMS chip. Description of the Drawings

[0061] Figure 1 A side view of the MEMS chip provided by an embodiment of the present application;

[0062] Figure 2 A schematic diagram of a state when the MEMS chip provided by an embodiment of the present application is impacted;

[0063] Figure 3 A schematic diagram of a working state of the MEMS chip provided by an embodiment of the present application;

[0064] Figure 4 A schematic diagram of a structure when the MEMS chip provided by an embodiment of the present application adopts an electrostatic driving method;

[0065] Figure 5 For Figure 4 An exploded view of the MEMS chip in

[0066] Figure 6 For Figure 4 A schematic diagram of the structure of the moving component of the MEMS chip in

[0067] Figure 7 Another schematic diagram of a structure when the MEMS chip provided by an embodiment of the present application adopts an electrostatic driving method;

[0068] Figure 8 Another schematic diagram of a structure when the MEMS chip provided by an embodiment of the present application adopts an electrostatic driving method;

[0069] Figure 9 Another schematic diagram of a structure when the MEMS chip provided by an embodiment of the present application adopts an electrostatic driving method;

[0070] Figure 10Another schematic diagram of the MEMS chip provided by the embodiment of the present application when using the electrostatic drive method;

[0071] Figure 11 Another schematic diagram of the MEMS chip provided by the embodiment of the present application when using the electrostatic drive method;

[0072] Figure 12 Another schematic diagram of the MEMS chip provided by the embodiment of the present application when using the electrostatic drive method;

[0073] Figure 13 Another schematic diagram of the MEMS chip provided by the embodiment of the present application when using the electrostatic drive method;

[0074] Figure 14 Another schematic diagram of the MEMS chip provided by the embodiment of the present application when using the electrostatic drive method;

[0075] Figure 15 For Figure 14 The exploded view of the MEMS chip in

[0076] Figure 16 For Figure 14 The structural schematic diagram of the moving component of the MEMS chip in

[0077] Figure 17 Another schematic diagram of the MEMS chip provided by the embodiment of the present application when using the electrostatic drive method;

[0078] Figure 18 For Figure 17 The exploded view of the MEMS chip in

[0079] Figure 19 For Figure 17 The structural schematic diagram of the moving component of the MEMS chip in

[0080] Figure 20 Another schematic diagram of the MEMS chip provided by the embodiment of the present application when using the electrostatic drive method;

[0081] Figure 21 For Figure 20 The exploded view of the MEMS chip in

[0082] Figure 22 For Figure 20 The partial top view of the MEMS chip in

[0083] Figure 23 Another schematic diagram of the MEMS chip provided by the embodiment of the present application when using the electrostatic drive method;

[0084] Figure 24 For Figure 23 Explosion schematic diagram of the MEMS chip in

[0085] Figure 25 For Figure 23 Schematic diagram of the structure of the moving component of the MEMS chip in

[0086] Figure 26 Schematic diagram of the structure of the MEMS chip provided by the embodiment of the present application when using electromagnetic drive;

[0087] Figure 27 For Figure 26 Explosion schematic diagram of the MEMS chip in

[0088] Figure 28 For Figure 26 Schematic diagram of the structure of the moving component of the MEMS chip in

[0089] Figure 29 Schematic diagram of a structure of the MEMS chip provided by the embodiment of the present application when using piezoelectric drive;

[0090] Figure 30 For Figure 29 Explosion schematic diagram of the MEMS chip in

[0091] Figure 31 For Figure 29 Schematic diagram of the structure of the first support beam of the MEMS chip in

[0092] Figure 32 For Figure 29 Schematic diagram of the structure of the moving component of the MEMS chip in

[0093] Figure 33 Schematic diagram of another structure of the MEMS chip provided by the embodiment of the present application when using piezoelectric drive;

[0094] Figure 34 Schematic diagram of a structure of the MEMS chip provided by the embodiment of the present application;

[0095] Figure 35a - Figure 35i Schematic diagram of a preparation process flow of the MEMS chip provided by the embodiment of the present application;

[0096] Figure 36 Schematic diagram of a structure of the MEMS chip array provided by the embodiment of the present application;

[0097] Figure 37 Schematic diagram of another structure of the MEMS chip array provided by the embodiment of the present application;

[0098] Figure 38Schematic structural diagram of the MEMS device provided by the embodiment of the present application;

[0099] Figure 39 Partial structural schematic diagram of the electronic device provided by the embodiment of the present application;

[0100] Figure 40 Side view of another MEMS chip provided by the embodiment of the present application;

[0101] Figure 41 Schematic diagram of the working state of another MEMS chip provided by the embodiment of the present application;

[0102] Figure 42 Side view of yet another MEMS chip provided by the embodiment of the present application;

[0103] Figure 43 Schematic diagram of the working state of yet another MEMS chip provided by the embodiment of the present application.

[0104] Reference numerals:

[0105] 100 - MEMS chip; 10 - substrate; 20 - moving component; 30 - fixing component; 21 - fixing part; 22 - moving part;

[0106] 23 - first support beam; 31 - boss; 32 - first limit post; 40 - reflective layer; 50 - insulating layer; 24 - first avoidance groove;

[0107] 33 - first conductive part; 34 - second conductive part; 35 - first isolation groove; 60 - driving component; 61 - first comb - tooth structure;

[0108] 62 - second comb - tooth structure; 51 - first through - slot; 621 - first driving part; 622 - second driving part; 341 - first conductor;

[0109] 342 - second conductor; 221 - first rotating part; 222 - second rotating part; 25 - second support beam; 26 - second avoidance groove;

[0110] 36 - second limit post; 37 - third conductive part; 38 - second isolation groove; 63 - third comb - tooth structure; 64 - fourth comb - tooth structure;

[0111] 52 - second through - slot; 371 - third conductor; 372 - second conductor; 223 - opening; 224 - notch; 641 - third driving part;

[0112] 642 - fourth driving part; 70 - first stop structure; 225 - slotted; 331 - first support post; 71 - first convex structure;

[0113] 65 - Driving coil; 66 - First piezoelectric driving structure; 661 - First electrode; 662 - Piezoelectric material; 663 - Second electrode;

[0114] 67 - Second piezoelectric driving structure; 80 - Second stop structure; 39 - Second support column; 81 - Second protrusion structure;

[0115] 1 - First wafer; 01 - First alignment mark; 2 - Second wafer; 02 - Second alignment mark; 211 - Metal electrode;

[0116] 200 - MEMS chip array; 300 - MEMS device; 310 - Substrate; 320 - Cover plate; 330 - Encapsulation space;

[0117] 311 - Pin; 400 - Electronic device; 410 - Circuit board; 420 - Control chip; 430 - Connector. Detailed implementation manners

[0118] In order to make the objectives, technical solutions, and advantages of the present application clearer, the present application will be further described in detail below with reference to the accompanying drawings.

[0119] To facilitate the understanding of the MEMS chip provided in the embodiments of the present application, the application scenarios thereof will be described first below. MEMS (micro - electro - mechanical system) is a micro - integrated system that uses manufacturing technologies and micro - processing technologies similar to those of integrated circuits to fabricate micro - structures, micro - sensors, micro - actuators, signal processing and control circuits and interfaces, communications, and power supplies on one or more chips. MEMS has the advantages of miniaturization, intelligence, integration, low cost, and mass production, and has been widely used in many fields such as wireless communication, biomedicine, aerospace, consumer electronics, automotive electronics, and instrument measurement. An MEMS chip generally includes a fixed layer, a movable layer, and a driving structure. One side of the fixed layer has a support structure, and the movable layer is movably arranged on the support structure through support beams, and the movable layer can rotate relative to the fixed layer under the driving action of the driving structure to realize the related functions of the MEMS chip. In some existing MEMS chips, when subjected to external impacts, the movable layer is relatively likely to have a large displacement under the impact, and then the deformation amount of the support beam is too large and finally breaks, affecting the structural reliability of the MEMS chip. In addition, when the driving structure adopts an electrostatic driving method, the movable layer and the fixed layer are relatively likely to be attracted under the action of the electrostatic torque. After the attraction phenomenon occurs, the movable layer can no longer rotate relative to the fixed layer, resulting in the limitation of the functions of the MEMS chip.

[0120] Based on this, the embodiments of the present application provide an MEMS chip with relatively high structural reliability, and the following will specifically describe the embodiments provided by the present application with reference to the accompanying drawings.

[0121] First, referring to Figure 1 as shown Figure 1 is a side view of the MEMS chip provided by the embodiment of the present application. The MEMS chip 100 provided by the embodiment of the present application may include a substrate 10, a moving component 20, and a fixing component 30 located between the substrate 10 and the moving component 20. Among them, the moving component 20 may include a fixing part 21, a moving part 22, and a first support beam 23. The first support beam 23 is respectively connected to the fixing part 21 and the moving part 22 to rotatably arrange the moving part 22 on the fixing part 21; on the side of the fixing component 30 facing the moving component 20, there are a boss 31 and a first limiting post 32. The boss 31 can be connected to the fixing part 21 and support the fixing part 21, so that the moving part 22 floats above the fixing component 30. The first limiting post 32 is located in the area of the fixing component 30 corresponding to the moving part 22, and there is a certain interval between the first limiting post 32 and the surface of the moving part 22 facing the fixing component 30. On the one hand, this can enable the moving part 22 to rotate relative to the fixing component 30 to realize the related functions of the MEMS chip 100. On the other hand, when the MEMS chip 100 is subjected to an external impact, also referring to Figure 2 as shown, through the blocking effect of the first limiting post 32, it is also possible to prevent the moving part 22 from having excessive displacement in the direction close to the fixing component 30 (negative z-axis direction), thereby reducing the risk of fracture of the first support beam 23 and improving the structural reliability of the MEMS chip 100.

[0122] The specific type of the MEMS chip 100 is not limited. For example, it can be a MEMS mechanical sensor, a MEMS electrical sensor, a MEMS acoustic sensor, or it can also be a MEMS micromirror, etc. It should be noted that when used as a MEMS micromirror, the side of the moving part 22 facing away from the fixing component 30 also has a mirror area. At this time, the MEMS chip may further include a reflective layer 40 located in the mirror area to reflect the incident light and realize the functions of light deflection or modulation. Among them, the specific material of the reflective layer 50 is not limited. For example, it can be gold, silver, aluminum, dielectric material, or other reflective materials, etc., which will not be elaborated here too much.

[0123] In the embodiments of the present application, the specific materials of the moving component 20 and the fixed component 30 are not limited. For example, they can be made of silicon material. Specifically, during implementation, the moving component 20 and the fixed component 30 can be respectively fabricated by highly doped SOI (silicon on insulator). And to simplify the manufacturing process of the MEMS chip 100, the fixed component 30 and the underlying substrate 10 can be fabricated using the same SOI wafer, that is, the fixed component 30 and the substrate 10 can be respectively formed on both sides of the same SOI wafer. At this time, the structure of the MEMS chip 100 can further include an insulating layer 50 located between the substrate 10 and the fixed component 30.

[0124] Specifically during implementation, the structural form of the boss 31 can be diverse. For example, it can be a columnar structure arranged at intervals on the fixed component 30, or it can be an annular structure connected as a whole. The present application does not make specific limitations in this regard. The structural form of the first limiting post 32 can also be diverse. For example, the cross-sectional shape of the first limiting post 32 can be rectangular, circular, polygonal, elliptical, or triangular, etc.

[0125] In addition, the specific structural form of the first support beam 23 is also not limited, as long as it can connect the moving part 22 and the fixed part 21 and generate corresponding torsional deformation or bending deformation when the moving part 22 rotates or moves relative to the fixed part 21. Figure 1 Taking the coordinate system shown as an example, when the moving part 22 rotates around the x-axis or moves along the z-axis, the first support beam 23 will generate a certain amount of bending deformation, and when the moving part 22 rotates around the y-axis, the first support beam 23 will generate a certain amount of torsional deformation.

[0126] In order to form a gap between the first limiting post 32 and the moving part 22, in a specific embodiment of the present application, a first avoidance groove 24 is formed on the surface of the moving part 22 facing the fixed component 30. The first avoidance groove 24 can be specifically arranged in one-to-one correspondence with the first limiting post 32, so that the top of the first limiting post 32 is spaced from the bottom wall of the first avoidance groove 24. It should be noted that in this embodiment, the height of the first limiting post 32 can be the same as or different from that of the boss 31. The present application does not make specific limitations in this regard, as long as there is a spacing between the top of the first limiting post 32 and the bottom wall of the first avoidance groove 24. It can be understood that when the height of the first limiting post 32 is the same as that of the boss 31, the two can be integrally formed by etching process, thereby reducing the manufacturing difficulty of the MEMS chip.

[0127] Of course, in other embodiments of the present application, the height of the first limiting post 32 can also be made less than the height of the boss 31. In this way, a gap can also be formed between the top of the first limiting post 32 and the moving part 22. During specific implementation, it can be designed according to actual needs and will not be elaborated here.

[0128] In addition, in the embodiment of the present application, the MEMS chip 100 may further include a driving component connected to the moving part 22. The driving component can be used to drive the moving part 22 to rotate around a set first rotation axis, so that the moving part 22 deflects relative to the fixed component 30, realizing the related functions of the MEMS chip 100. Specifically, when implemented, the extending direction of the first rotation axis can be any direction with an angle less than 90° with the fixed component 30. For example Figure 1 the x-axis direction or the y-axis direction shown in. When the driving component drives the moving part 22 to rotate around the first rotation axis, in order to reduce the risk of damage to the first support beam 23 due to excessive rotation of the moving part 22, the position of the first limiting post 32 or the first avoidance groove 24, and the distance between the first limiting post 32 and the moving part 22 can also be reasonably set, so that the first limiting post 32 limits the rotation angle of the moving part 22, so that the moving part 22 rotates within the allowable rotation angle range.

[0129] Referring to Figure 3 shown, taking the direction of the first rotation axis as the x-axis direction as an example, when the maximum rotation angle of the moving part 22 around the x-axis is θ1max, the first avoidance groove 24 can be set on one side of the x-axis. According to relevant geometric principles, the distance between the first limiting post 32 and the moving part 22 (when the first limiting post 32 has the same height as the boss 31, this distance is the depth d1 of the first avoidance groove 24), and the horizontal distance L1 between the center of the first avoidance groove 24 and the first rotation axis satisfy:

[0130] θ1max≤arctan(d1 / L1)

[0131] According to the above formula, the required depth range that the first avoidance groove 24 needs to satisfy at a certain position can be determined. Through the cooperation between the first avoidance groove 24 and the first limiting post 32, the first limiting post 32 can not only limit the displacement amount of the moving part 22 along the negative z-axis direction, but also limit the rotation amount of the moving part 22 in the clockwise direction around the x-axis, thereby improving the structural reliability of the MEMS chip.

[0132] Of course, in other embodiments of the present application, the first limiting post 32 can also be set on the other side of the x-axis, and at this time, the rotation amount of the moving part 22 in the counterclockwise direction around the x-axis can be limited; or, the first limiting post 32 can also be symmetrically set on both sides of the x-axis to limit the rotation amount of the moving part 22 in the clockwise direction and the counterclockwise direction around the x-axis respectively.

[0133] It can be understood that the rotation angle and rotation direction of the moving part 22 are both determined by the driving force applied by the driving component. When the driving component applies a driving force to the moving part 22, the moving part 22 can rotate around the first rotation axis, and its rotation angle can increase as the driving force increases. When the moving part 22 contacts the first limit post 32 below it, due to the stopping effect of the first limit post 32, the rotation angle of the moving part 22 will no longer increase. In the embodiment of the present application, the driving force applied by the driving component to the moving part 22 can also be controlled to regularly drive the moving part 22 to contact the first limit post 32 arranged grounded, so as to release the net charge accumulated on the moving part, improve the performance drift of the MEMS chip caused by charge accumulation, and improve the reliability of the MEMS chip.

[0134] When specifically setting the driving component, according to different driving methods, the driving component can have various structural forms. Here, taking the electrostatic driving method, electromagnetic driving method, and piezoelectric driving method as examples respectively, the structure of the driving component will be specifically described.

[0135] Refer to together Figure 4 and Figure 5 as shown, Figure 4 FIG. is a schematic structural diagram of a MEMS chip provided by an embodiment of the present application when using the electrostatic driving method, Figure 5 is Figure 4 an exploded schematic diagram of the MEMS chip in. In this embodiment, both the moving component and the fixed component can be conductors. The fixed component 30 can include a first conductive part 33 and a second conductive part 34. Specifically, in implementation, the first conductive part 33 can be grounded, and the first conductive part 33 and the second conductive part 34 can be insulated from each other through a first isolation groove 35. The above-mentioned boss 31 and the first limit post 32 are arranged on the first conductive part 33. In this way, the first limit post and the boss can be simply grounded respectively, avoiding complex processes such as the through-silicon via process or metal buried line in the follow-up to achieve grounding, which is beneficial to simplifying the manufacturing process of the MEMS chip; the driving component 60 can include a first comb structure 61 and a second comb structure 62. Among them, the first comb structure 61 can be connected to the moving part 22, and then can be electrically connected to the boss through the movable part, the first support beam, and the fixed part in sequence to achieve electrical grounding. The first comb structure 61 can be located on one side of the first rotation axis; the second comb structure 62 can be connected to the second conductive part 34, and the teeth of the second comb structure 62 are arranged in a staggered manner with the teeth of the first comb structure 61. In this way, when a driving voltage is applied to the second comb structure 62, a certain potential difference can be formed between the second comb structure 62 and the first comb structure 61, so as to drive the first comb structure 61 and the moving part 22 to rotate around the first rotation axis. It can be seen that at this time, the extending direction of the first rotation axis is the extending direction of the first support beam 23, that is, the x-axis direction in the figure.

[0136] In addition, when the MEMS chip 100 further includes an insulating layer 50 located between the substrate 10 and the fixing component 30, a first through groove 51 may be formed at a position corresponding to the first isolation groove 35 on the insulating layer 50, so as to avoid exposure of insulating materials at the position of the first isolation groove 35, thereby avoiding reliability problems of the driving component 60 caused by the gradual accumulation of net charges in the insulating materials, and contributing to improving the long-term stability of the rotation angle or rotation frequency of the MEMS chip 100.

[0137] It can be understood that in order to expand the functions of the MEMS chip 100 so that the driving component 60 can drive the moving part 22 to rotate clockwise and counterclockwise, in a specific embodiment of the present application, the first comb structure 61 can be located on both sides of the first rotation axis (i.e., the x-axis). Correspondingly, the second comb structure 62 can include a first driving part 621 and a second driving part 622 spaced apart from each other, and the first driving part 621 and the second driving part 622 are respectively located on different second conductive parts 34. The first driving part 621 can be correspondingly arranged with the first comb structure 61 on one side of the first rotation axis, and the second driving part 622 can be correspondingly arranged with the first comb structure 61 on the other side of the first rotation axis. In this way, when a driving voltage is applied to the first driving part 621, a certain potential difference can be formed between the first driving part 621 and the first comb structure 61 on the corresponding side, so as to drive the moving part 22 to rotate counterclockwise; similarly, when a driving voltage is applied to the second driving part 622, a certain potential difference can be formed between the second driving part 622 and the first comb structure 61 on the corresponding side, so as to drive the moving part 22 to rotate clockwise.

[0138] Continue to refer to Figure 4 and Figure 5 As shown, a first conductor 341 is further provided on the surface of the second conductive part 34 facing the moving component. Correspondingly, the moving component 20 further includes a second conductor 342 connected to the first conductor 341. The second conductor 342 can be electrically connected to the driving power supply by setting a metal electrode, so as to transmit the driving voltage output by the driving power supply to the second conductive part 34 through the first conductor 341, and then transmit it to the first driving part 621 or the second driving part 622 through the second conductive part 34, so as to drive the first comb structure 61 and the moving part 22 to rotate; similarly, the fixing part 21 can also be connected to the grounding line by setting a metal electrode, and further, the first conductive part 33 electrically connected to the fixing part 21 through the boss 31 can be grounded.

[0139] Refer to together Figure 6As shown in the above embodiments, in the first avoidance groove 24 and the first limiting post 32 can be respectively arranged on both sides of the first rotation axis (i.e., the x-axis), so as to respectively limit the clockwise rotation amount and the counterclockwise rotation amount of the moving part 22, avoid the first comb structure 61 and the second comb structure 62 from being attracted to each other, and improve the structural reliability of the MEMS chip 100.

[0140] In addition, in specific implementation, the specific shape of the moving part 22 can be diverse. For example, it can be Figure 4 and Figure 5 the rectangle shown in Figure 7 or Figure 8 the circle shown in Figure 9 or

[0141] Continue to refer to Figures 4 to 9 , when setting the position of the first comb structure 61, the first comb structure 61 can be located on the side of the first support beam 23. At this time, the overall size of the MEMS chip 100 is relatively small, so the occupied space in the electronic device is also relatively small.

[0142] In order to increase the driving force of the driving component to improve the working reliability of the MEMS chip 100, in other embodiments of the present application, as Figure 10 shown, the first comb structure 61 can also be located on the side of the moving part, so as to increase the relative area between the first comb 61 and the second comb structure 62, and further increase the electrostatic torque formed by the potential difference between the two. Similarly, in this embodiment, the shape of the moving part 22 can be Figure 9 the rectangle shown in Figure 11 or Figure 12 the circle shown in Figure 13 or

[0143] Refer to Figure 14 and Figure 15 shown together, Figure 14 is another structural schematic diagram of the MEMS chip provided by the embodiment of the present application when using the electrostatic driving method, Figure 15 is Figure 14Explosion schematic diagram of the MEMS chip in it. In this embodiment, the moving part 22 may include a first rotating part 221 and a second rotating part 222. The moving component 20 may further include a second support beam 25, and the second support beam 25 may be connected to the first rotating part 221 and the second rotating part 222 respectively, so that the second rotating part 222 can rotate relative to the first rotating part 221 around the second rotation axis; and the aforementioned first support beam 23 can be connected to the first rotating part 221 and the fixing part 21 respectively, so that the first rotating part 221 and the second rotating part 222 connected to the first rotating part 221 rotate around the first rotation axis together. When the MEMS chip 100 is a micromirror, the reflective layer 40 of the micromirror can be specifically arranged on the side of the second rotating part 222 facing away from the fixing component 30.

[0144] Similarly, the specific structural form of the second support beam 25 is not limited either, as long as it can connect the second rotating part 222 to the first rotating part 221, and when the second rotating part 222 rotates or moves relative to the first rotating part 221, corresponding torsional deformation or bending deformation can be generated. It can be understood that in this embodiment, the extending direction of the first rotation axis is the extending direction of the first support beam 23, that is, the x-axis direction in the figure, and the extending direction of the second rotation axis is the extending direction of the second support beam 25, that is, the y-axis direction in the figure.

[0145] Refer to together Figure 16 As shown, a second avoidance groove 26 is also formed on the side of the second rotating part 222 facing the fixing component 30. The second avoidance groove 26 can be located on one side of the second rotation axis. At this time, the second limiting post 36 corresponding to the second avoidance groove 26 is provided on the side of the first conductive part 33 facing the moving component 20, so that the rotational amount of the second rotating part 222 around the second rotation axis in the clockwise direction can be restricted.

[0146] When the maximum rotation angle of the second rotating part 222 around the second rotation axis (y-axis direction) is θ2max, according to relevant geometric principles, the depth d2 of the second avoidance groove, and the horizontal distance L2 between the center of the second avoidance groove 26 and the second rotation axis satisfy:

[0147] θ2max≤arctan(d2 / L2)

[0148] According to the above formula, the required depth range that the second avoidance groove 26 needs to satisfy at a certain position can be determined. Through the cooperation between the second avoidance groove 26 and the second limiting post 36, the second limiting post 36 can not only restrict the displacement amount of the second rotating part 222 in the z-axis direction, but also restrict the rotational amount of the second rotating part 222 around the second rotation axis (y-axis direction), thereby improving the structural reliability of the MEMS100.

[0149] Continue to refer toFigure 14 and Figure 15 As shown in Figure 15 , in this embodiment, the fixing component 30 may further include a third conductive portion 37. The third conductive portion 37 and the first conductive portion 33 may be insulated from each other through a second isolation groove 38. The driving component 60 further includes a third comb structure 63 and a fourth comb structure 64. Among them, the third comb structure 63 may be connected to the second rotating portion 222, and the third comb structure 63 may be located on one side of the first rotation axis. The fourth comb structure 64 is connected to the third conductive portion 37, and the teeth of the fourth comb structure 64 are arranged in a staggered manner with the teeth of the third comb structure 63. In this way, when a driving voltage is applied to the fourth comb structure 64, a certain potential difference can be formed between the fourth comb structure 64 and the third comb structure 63, so as to drive the third comb structure 63 and the second rotating portion 22 to rotate around the second rotation axis.

[0150] Similarly, when the MEMS chip 100 further includes an insulating layer 50 located between the substrate 10 and the fixing component 30, a second through groove 52 may also be formed at a position corresponding to the second isolation groove 38 on the insulating layer 50. This can prevent the exposure of insulating materials at the position of the second isolation groove 38, and further avoid the reliability problems of the driving component 60 caused by the gradual accumulation of net charges in the insulating materials, which helps to improve the long-term stability of the rotation angle or rotation frequency of the MEMS chip.

[0151] In addition, it should be noted that the first comb structure 61 of the driving component 60 may be connected to the first rotating portion 221, so that when the second comb structure 62 receives a driving voltage, the first rotating portion 221 and the second rotating portion 222 connected to the first rotating portion 221 can rotate around the first rotation axis together. That is to say, in the embodiment of the present application, the second rotating portion 222 has both the rotational freedom around the first rotation axis and the rotational freedom around the second rotation axis, that is, two-dimensional rotation can be realized, so the function of the MEMS chip 100 can be extended.

[0152] In the above embodiment, a third conductor 371 is further provided on the surface of the third conductive portion 37 facing the moving component 20. Correspondingly, the moving component 20 further includes a fourth conductor 372 connected to the third conductor 371. The fourth conductor 372 can be electrically connected to a driving power supply, so as to transmit the driving voltage output by the driving power supply to the fourth conductor 372 through the third conductor 371, and then transmit it to the fourth comb structure 64 through the fourth conductor 372 to drive the third comb structure 63 and the second rotating portion 222 to rotate.

[0153] The specific structural forms of the first rotating portion 221 and the second rotating portion 222 are not limited. For example, in Figure 14 and Figure 15In the illustrated embodiment, the fixing portion 21 may specifically be a columnar structure, and the number of the fixing portions 21 is at least two. The at least two fixing portions 21 may be arranged at intervals along the extending direction of the first support beam 23. An opening 223 is provided on the second rotating portion 222. At least one fixing portion 21 may be located within the opening 223. One end of the first rotating portion 221 extends into the opening 223. The first end of the first rotating portion 221 may be connected to the fixing portion 21 located within the opening 223 through the first support beam 23, and may be connected to the second rotating portion 222 through two second support beams 25. The second end of the first rotating portion 221 may be connected to the fixing portion 21 located outside the opening 223 through the first support beam 23. With this structural form, the second rotating portion 222 can be reliably rotatably arranged on the first rotating portion 221, and it is beneficial to increase the duty ratio of the MEMS mirror 100.

[0154] During specific implementation, in order to reduce the manufacturing process difficulty of the MEMS chip 100 and improve its structural integrity, the first comb structure 61 may specifically be arranged on the first rotating portion 221. Correspondingly, the third comb structure 63 may be arranged on the second rotating portion 222. In addition, when the number of the fixing portions 21 is three or more, at least one notch 224 may be formed between the first end and the second end of the first rotating portion 221, so that the fixing portions 21 other than those at the two ends of the first rotating portion 221 can be arranged in the corresponding notches 224 and connected to the first rotating portion 221 through the first support beam 23, so that the first rotating portion 221 can be more stably suspended on the fixing component 30, thereby improving the structural reliability of the MEMS chip 100.

[0155] In the above embodiment, the third comb structure 63 is located on one side of the second rotation axis (y-axis direction). Referring to Figure 16 as shown, the second avoidance groove 26 and the second limiting post 36 are also located on the corresponding side of the second rotation axis. At this time, the driving component can drive the second rotating portion to rotate clockwise around the y-axis, and the second limiting post 36 can limit the rotation amount of the second rotating portion in the counterclockwise direction around the y-axis.

[0156] It can be understood that in order to drive the second rotating portion 222 to rotate in two directions, clockwise and counterclockwise, around the second rotation axis, in another specific embodiment of the present application, referring to Figure 17 and Figure 18As shown, the third comb structure 63 can also be located on both sides of the second rotation axis. Correspondingly, the fourth comb structure 64 can include a spaced third driving portion 641 and a fourth driving portion 641, and the third driving portion 641 and the fourth driving portion 642 are respectively located on different third conductive portions 37. The third driving portion 641 can be correspondingly arranged with the third comb structure 63 on one side of the second rotation axis, and the fourth driving portion 642 can be correspondingly arranged with the third comb structure 63 on the other side of the second rotation axis. In this way, when a driving voltage is output to the third driving portion 641, a certain potential difference can be formed between the third driving portion 641 and the corresponding third comb structure 63 on the corresponding side, so as to drive the second rotating portion 222 to rotate counterclockwise; similarly, when a driving voltage is output to the fourth driving portion 642, a certain potential difference can be formed between the fourth driving portion 642 and the corresponding third comb structure 63 on the corresponding side, so as to drive the second rotating portion 222 to rotate clockwise.

[0157] Combined with Figure 19 As shown in the above embodiments, the second avoidance groove 26 can be symmetrically arranged on both sides of the second rotation axis. At this time, the first conductive portion 33 is provided with second limiting posts 36 respectively corresponding to the second avoidance grooves 26 on both sides, so as to respectively limit the rotation amounts of the second rotating portion 222 in the clockwise direction and the counterclockwise direction, and improve the structural reliability of the MEMS chip 100.

[0158] Refer to together Figure 20 and Figure 21 As shown, Figure 20 This is another structural schematic diagram of the MEMS chip provided by the embodiment of the present application when using an electrostatic drive method. Figure 21 is Figure 20 An exploded schematic diagram of the MEMS chip in. In this embodiment, the MEMS chip may further include a first stop structure 70. A slot 225 for accommodating the first stop structure 70 is formed on the moving portion 22. The first stop structure 70 is located in the slot 225, and there is a gap between the circumferential side of the first stop structure 70 and the inner wall of the slot 225; in addition, a first support post 331 may also be provided on the surface of the first conductive portion 33 facing the moving assembly for supporting the above-mentioned first stop structure 70.

[0159] Combined with Figure 22As shown, for the mutually cooperating first comb structure 61 and second comb structure 62, the comb teeth A of the first comb structure 61 are located between two comb teeth B of the second comb structure 62. During the preparation process of the MEMS chip, due to the limited alignment accuracy of the preparation process, there may be a certain error in the horizontal distance between the comb tooth A and the two comb teeth B on its two sides, that is, d1 and d2 are not absolutely unequal. In this way, when a driving voltage is applied to the second comb structure 62, in the xoy plane, the electrostatic attraction forces of the comb teeth B on both sides of the comb tooth A cannot be completely offset, resulting in the rotation of the moving part 22 in the xoy plane. In the embodiment of the present application, the first stop structure 70 can abut against the moving part 22 when the rotation angle of the moving part is relatively large, thereby preventing the further rotation of the moving part 22, avoiding short circuit caused by excessive rotation of the moving part 22 and contact between the comb tooth A and the comb tooth B, and causing irreversible damage to the device, and further improving the structural reliability of the MEMS chip 100.

[0160] The specific opening position of the above-mentioned slot 224 is not limited. For example, it can be opened on the first rotating part 221 as shown in Figure 21 This is beneficial to improving the duty cycle of the MEMS mirror. Of course, in other embodiments of the present application, the above-mentioned slot 224 can also be opened on the second rotating part, and this can also achieve the purpose of restricting the rotation amount of the moving part in the xoy plane.

[0161] In addition, in order to reduce the risk of adhesion after the first stop structure 70 abuts against the moving part 22, the circumferential side of the first stop structure 70 also has a first convex structure 71 to reduce the contact area between the first stop structure 70 and the moving part 22. The specific shape of the first convex structure 71 is not limited. In the embodiment of the present application, in order to avoid impact damage to the moving part 22 when the first convex structure 71 contacts the moving part 22, the top of the first convex structure 71 can be designed to be arc-shaped.

[0162] Refer to Figure 23 and 24 shown, Figure 23 This is another structural schematic diagram of the MEMS chip provided by the present application when using the electrostatic drive method. Figure 24 is Figure 23Explosion schematic diagram of the MEMS chip in it. In this embodiment, the first rotating part 221 can be a frame structure, and the second rotating part 222 can be connected to the inner side of the first rotating part 221 through the second support beam 25; similar to the foregoing embodiment, the first comb structure 61 of the driving component 60 can be connected to the first rotating part 221, so that when the second comb structure 62 receives a driving voltage, the first rotating part 221 and the second rotating part 222 connected to the first rotating part 221 can be driven to rotate together around the first rotation axis; the third comb structure 63 can be connected to the second rotating part 222, so that when the fourth comb structure 64 receives a driving voltage, the second rotating part 222 can be driven to rotate around the second rotation axis.

[0163] During specific implementation, the first comb structure 61 can be located on the side of the first support beam 23, and the second comb structure 64 can also be located on the side of the second support beam 25, which can reduce the overall size of the MEMS chip 100, and further reduce the occupied space of the MEMS chip 100 in the electronic device. Of course, in order to increase the driving force of the driving component 60 to improve the working reliability of the MEMS chip 100, in other embodiments of the present application, the first comb structure 61 can also be located on the side of the first rotating part 221. Similarly, the third comb structure 63 can also be located on the side of the second rotating part 222, which can increase the relative area between the first comb structure 61 and the second comb structure 62, and between the third comb structure 63 and the fourth comb structure 64, and further increase the electrostatic torque formed by the potential difference therebetween. In addition, the specific shape of the second rotating part 222 can be circular, polygonal, elliptical or rectangular, etc., and the present application does not limit this.

[0164] Refer to together Figure 25 As shown, in the embodiment of the present application, the first avoidance groove 24 and the second avoidance groove 26 can both be opened on the second rotating part 222. Among them, the first avoidance groove 24 can be symmetrically arranged on both sides of the first rotation axis (x-axis direction), and the first conductive part 33 has first limit posts 32 respectively corresponding to the first avoidance grooves 24 on both sides, so that the rotation amount of the moving part 22 around the first rotation axis in the clockwise direction and the counterclockwise direction can be respectively limited; similarly, the second avoidance groove 26 can be symmetrically arranged on both sides of the second rotation axis (y-axis direction), and the first conductive part 33 has second limit posts 36 respectively corresponding to the second avoidance grooves 26 on both sides, so that the rotation amount of the second rotating part 222 around the second rotation axis in the clockwise direction and the counterclockwise direction can be respectively limited, improving the structural reliability of the MEMS chip 100.

[0165] The above are several possible structural forms when the MEMS chip adopts the electrostatic drive method. Next, the specific structures when the MEMS chip adopts the electromagnetic drive method and the piezoelectric drive method respectively will be described.

[0166] Refer to both Figure 26 and Figure 27 as shown, Figure 26 which is a schematic structural diagram of the MEMS chip provided by the embodiment of the present application when it adopts the electromagnetic drive method, Figure 27 and Figure 26 is an exploded schematic diagram of the MEMS chip in . In this embodiment, the driving component may include a driving coil 65 and a magnet (not shown in the figure). Among them, the driving coil 65 may be specifically arranged in a spiral shape on one side of the moving part 22, and both ends of the driving coil 65 may be respectively connected to the positive and negative electrodes of the driving power supply; the magnet is located on one side of the MEMS chip 100, or may also be located on the fixing component 30 to generate a magnetic field passing through the moving part. The included angle between the direction of this magnetic field ( Figure 26 the arrow direction in ) and the extending direction of the first rotation axis may be specifically greater than 0°, so that the energized driving coil 65 generates a Lorentz force under the action of the magnetic field, driving the moving part 22 to rotate around the first rotation axis.

[0167] When electrically connecting the driving coil 65 to the driving power supply, both ends of the driving coil 65 may be respectively led out to two spaced fixing parts 21, and are connected to the positive and negative electrodes of the driving power supply through the driving electrodes provided on the fixing parts 21.

[0168] Continue to refer to Figure 26 and Figure 27 as shown. In the embodiment of the present application, the moving part 22 may also include a first rotating part 221 and a second rotating part 222. The moving component 20 may further include a second support beam 25, and the second support beam 25 may be respectively connected to the first rotating part 221 and the second rotating part 222, so that the second rotating part 222 can rotate relative to the first rotating part 221 around the second rotation axis; the first support beam 23 may be respectively connected to the first rotating part 221 and the fixing part 21, so that the first rotating part 221 and the second rotating part 222 connected to the first rotating part 221 rotate together around the first rotation axis. When specifically arranging the driving coil, the driving coil 65 may be located on the first rotating part 221 or on the second rotating part 222, and the present application does not limit this.

[0169] In the above embodiment, the first rotating part 221 may specifically be a frame structure. At this time, the second rotating part 222 may be connected to the inside of the first rotating part 221 through the second support beam 25. It can be understood that in the embodiment of the present application, the extending direction of the first rotation axis is the extending direction of the first support beam 23, that is, the x-axis direction in the figure, and the extending direction of the second rotation axis is the extending direction of the second support beam 25, that is, the y-axis direction in the figure.

[0170] In order to drive the second rotating part 222 to rotate around the second rotation axis, in the embodiment of the present application, the included angle between the direction of the magnetic field generated by the magnet and the extending direction of the second rotation axis is also greater than 0°. That is to say, the direction of this magnetic field forms an acute angle with the extending direction of the first rotation axis and the extending direction of the second rotation axis respectively. In this way, when a periodically changing current is output to the driving coil 65, the first rotating part 221 and the second rotating part 222 can resonate under the action of the periodically changing Lorentz force. Furthermore, the first rotating part 221 and the second rotating part 222 connected to the first rotating part 221 can be made to rotate around the first rotation axis, and the second rotating part 222 can be made to rotate around the second rotation axis, so that the second rotating part 222 has both the rotational freedom around the first rotation axis and the rotational freedom around the second rotation axis, and two-dimensional rotation can be realized. Therefore, the function of the MEMS chip 100 can be expanded.

[0171] Combined with Figure 28 As shown, a second avoidance groove 26 is formed on the surface of the second rotating part 222 facing the fixed component 30. The second avoidance groove 26 can be located on both sides of the second rotation axis respectively. The surface of the fixed component 30 facing the moving component 20 has second limiting posts 36 respectively corresponding to the second avoidance groove 26 to limit the rotation amount of the second rotating part around the second rotation axis; in addition, the first avoidance groove 24 can also be located on both sides of the first rotation axis respectively. At this time, the surface of the fixed component 30 facing the moving component 20 has first limiting posts 32 respectively corresponding to the first avoidance grooves 24 on both sides, so as to limit the rotation amount of the first rotating part 221 and the second rotating part 222 around the first rotation axis.

[0172] Referring together to Figure 29 and Figure 30 as shown, Figure 29 is a schematic structural diagram of the MEMS chip provided by the embodiment of the present application when adopting the piezoelectric driving method, Figure 30 is Figure 29 an exploded schematic diagram of the MEMS chip in Figure 31As shown, the first piezoelectric drive structure 66 may further include a first electrode 661, a piezoelectric material 662, and a second electrode 663 that are stacked in sequence. When a voltage is applied to the first electrode 661 and the second electrode 663 of the first piezoelectric drive structure 66, the piezoelectric material 662 can be deformed under the drive of the voltage between the first electrode 661 and the second electrode 663, and then can drive the first support beam 23 to move. According to this principle, opposite voltages can be applied to the first piezoelectric drive structures 66 on the two first support beams 23 respectively, so that the two first support beams 23 generate displacements in opposite directions, which is equivalent to applying a rotational torque to the moving part 22, thereby driving the moving part 22 to rotate.

[0173] Specifically, when a positive voltage is applied to the first piezoelectric drive structure 66 on the first support beam C, a negative voltage can be applied to the first piezoelectric drive structure 66 on the first support beam D at the same time. At this time, the first support beam C can move upward under the drive of the corresponding piezoelectric material 662, while the first support beam D can move downward under the drive of the corresponding piezoelectric material 662, so that the moving part 22 can be driven by the first support beams 23 on both sides to rotate counterclockwise around the first rotation axis; when a negative voltage is applied to the first piezoelectric drive structure 66 on the first support beam C, a positive voltage can be applied to the first piezoelectric drive structure 66 on the first support beam D at the same time. At this time, the first support beam C can move downward under the drive of the corresponding piezoelectric material 662, while the first support beam D can move upward under the drive of the corresponding piezoelectric material 662, so that the moving part 22 can be driven by the first support beams 23 on both sides to rotate clockwise around the first rotation axis. It can be understood that in this embodiment, the direction of the first rotation axis is the x-axis direction, that is, the direction perpendicular to the line connecting the connection positions of the two first support beams 23 and the moving part 22.

[0174] Referring together to Figure 32 As shown, in the above embodiment, the first avoidance groove 24 and the first limiting post 32 can be respectively arranged on both sides of the first rotation axis, so as to respectively limit the clockwise rotation amount and the counterclockwise rotation amount of the moving part 22 around the first rotation axis, and improve the structural reliability of the MEMS chip 100.

[0175] Continuing to refer to Figure 29 and Figure 30, in the embodiment of the present application, the motion component may further include two second support beams 25, and the second support beams 25 are also respectively connected to the motion part 22 and the fixed part 21; the driving component may further include second piezoelectric driving structures 67 arranged on each second support beam. Similar to the first piezoelectric driving structure 66, the second piezoelectric driving structure 67 may also include a first electrode, a piezoelectric material, and a second electrode. Similarly, when a positive voltage is applied to the second piezoelectric driving structure 67 on the second support beam E, a negative voltage may be simultaneously applied to the second piezoelectric driving structure 67 on the second support beam F. At this time, the second support beam E can move upward driven by the corresponding piezoelectric material, while the second support beam F can move downward driven by the corresponding piezoelectric material, so that the motion part 22 can be driven by the second support beams 25 on both sides to rotate clockwise around the second rotation axis; when a negative voltage is applied to the second piezoelectric driving structure 67 on the second support beam E, a positive voltage may be simultaneously applied to the second piezoelectric driving structure 67 on the second support beam F. At this time, the second support beam E can move downward driven by the corresponding piezoelectric material, while the second support beam F can move upward driven by the corresponding piezoelectric material, so that the motion part 22 can be driven by the second support beams 25 on both sides to rotate counterclockwise around the second rotation axis. It can be understood that in this embodiment, the direction of the second rotation axis is the y-axis direction, that is, the direction perpendicular to the connection line of the connection positions of the two second support beams 25 and the motion part 22.

[0176] It can be seen that in the embodiment of the present application, the motion part 22 has both the rotational freedom around the first rotation axis and the rotational freedom around the second rotation axis, and can achieve two-dimensional rotation, so the function of the MEMS chip 100 can be extended.

[0177] Referring together to Figure 32 As shown, in the above embodiment, the second avoidance groove 26 and the second limit post 36 may also be respectively arranged on both sides of the second rotation axis, so as to respectively limit the clockwise rotation amount and the counterclockwise rotation amount of the motion part around the second rotation axis, and improve the structural reliability of the MEMS chip.

[0178] It should be noted that in the embodiment of the present application, the two first support beams 23 may be symmetrically arranged around the circumference of the motion part so that the first rotation axis can pass through the center of the motion part 22, which is beneficial to improving the structural stability of the MEMS chip 100; similarly, the two second support beams 25 may also be symmetrically arranged around the circumference of the motion part 22 so that the second rotation axis can also pass through the center of the motion part 22, which is beneficial to improving the structural stability of the MEMS chip 100.

[0179] In addition, referring to Figure 33As shown, in another possible embodiment of the present application, the MEMS may further include three first support beams 23, and the three first support beams 23 may be equally spaced on the periphery of the moving part 22. When adopting this structure, when positive voltages are applied to the first piezoelectric drive structures on the first support beams G and H respectively, a reverse voltage may be applied to the first drive voltage on the first support beam I at the same time. At this time, the first support beams G and H can move upward under the drive of the corresponding piezoelectric materials, while the first support beam I can move downward under the drive of the corresponding piezoelectric materials, so that the moving part can rotate clockwise around the first rotation axis l1 under the drive of the three first support beams; when reverse voltages are applied to the first piezoelectric drive structures on the first support beams G and H respectively, a positive voltage may be applied to the first drive voltage on the first support beam I at the same time. At this time, the first support beams G and H can move downward under the drive of the corresponding piezoelectric materials, while the first support beam I can move upward under the drive of the corresponding piezoelectric materials, so that the moving part can rotate counterclockwise around the first rotation axis l1 under the drive of the three first support beams; it can be understood that the direction of the first rotation axis l1 is parallel to the connection line between the connection positions of the first support beams G and H and the moving part;

[0180] Similarly, when positive voltages are applied to the first piezoelectric drive structures on the first support beams G and I respectively, a reverse voltage may be applied to the first drive voltage on the first support beam H at the same time. At this time, the first support beams G and I can move upward under the drive of the corresponding piezoelectric materials, while the first support beam H can move downward under the drive of the corresponding piezoelectric materials, so that the moving part can rotate clockwise around the second rotation axis l2 under the drive of the three first support beams; when reverse voltages are applied to the first piezoelectric drive structures on the first support beams G and I respectively, a positive voltage may be applied to the first drive voltage on the first support beam H at the same time. At this time, the first support beams G and I can move downward under the drive of the corresponding piezoelectric materials, while the first support beam H can move upward under the drive of the corresponding piezoelectric materials, so that the moving part can rotate counterclockwise around the second rotation axis l2 under the drive of the three first support beams; it can be understood that the direction of the second rotation axis l2 is parallel to the connection line between the connection positions of the first support beams G and I and the moving part;

[0181] Moreover, when a positive voltage is applied to the first piezoelectric drive structures on the first support beams H and I respectively, a reverse voltage can be applied to the first drive voltage on the first support beam G simultaneously. At this time, the first support beams H and I can move upward driven by the corresponding piezoelectric materials, while the first support beam G can move downward driven by the corresponding piezoelectric materials, so that the moving part can rotate clockwise around the third rotation axis l3 driven by the three first support beams; when a reverse voltage is applied to the first piezoelectric drive structures on the first support beams H and I respectively, a positive voltage can be applied to the first drive voltage on the first support beam G simultaneously. At this time, the first support beams H and I can move downward driven by the corresponding piezoelectric materials, while the first support beam G can move upward driven by the corresponding piezoelectric materials, so that the moving part can rotate counterclockwise around the third rotation axis l3 driven by the three first support beams; it can be understood that the direction of the third rotation axis l3 is parallel to the connection line between the connection positions of the first support beams H and I and the moving part.

[0182] Reference Figure 34 shown in Figure 34 As shown in the figure, it is a schematic structural diagram of a MEMS chip provided by an embodiment of the present application. In this embodiment, the MEMS chip 100 may further include a second stop structure 80 disposed on the same layer as the moving part 22. Specifically, during implementation, the second stop structure 80 may be located on the periphery of the moving part 22 and have a gap with the moving part 22; the side of the fixing component 30 facing the moving component 20 may further have a second support post 39 for supporting the second stop structure 80. When the MEMS chip 100 is subjected to an external impact, if the moving part moves or rotates in the xoy plane, the second stop structure 80 can abut against the moving part 22 when the rotation angle or displacement of the moving part 22 is too large, thereby preventing further rotation or movement of the moving part 22, and further reducing the risk of fracture of the first support beam 23 or the second support beam 25, and improving the structural reliability of the MEMS chip 100.

[0183] In addition, in order to reduce the risk of adhesion after the second stop structure 80 abuts against the moving part 22, the periphery of the second stop structure 80 further has a second protrusion structure 81 to reduce the contact area between the second stop structure 80 and the moving part 22. The specific shape of the second protrusion structure 81 is not limited. For example, it can be an arc-shaped protrusion, which can reduce the risk of impact damage to the moving part 22 caused by the second protrusion structure 81.

[0184] Reference Figure 1 As shown in the figure, an embodiment of the present application also provides a method for manufacturing a MEMS chip, including the following steps:

[0185] Form the moving component 20 on the first side of the first wafer;

[0186] A fixing component 30 is formed on the first side of the second wafer, and a substrate 10 is provided on the second side of the second wafer;

[0187] Bond and fix the first wafer and the second wafer, and make the first side of the first wafer opposite to the first side of the second wafer, so that the moving component 20 and the fixing component 30 are arranged opposite to each other;

[0188] Wherein, a moving component 20 is formed on one side of the first wafer, specifically including: a fixing part 21, a moving part 22 and a first support beam 23 are formed on the first side of the first wafer, and the first support beam 23 is respectively connected to the fixing part 21 and the moving part 22 to rotatably arrange the moving part 22 on the fixing part 21;

[0189] A fixing component 30 is formed on the first side of the second wafer, specifically including: a boss 31 and a first limiting post 32 are formed on the first side of the second wafer. After the first wafer and the second wafer are bonded and fixed, the boss 31 can be connected to the fixing part 21 and support the fixing part 21, so that the moving part 22 is suspended on the fixing component 30; the first limiting post 32 is located in the area of the fixing component 30 corresponding to the moving part 22, and there is a gap between the first limiting post 32 and the surface of the moving part 22 facing the fixing component 30;

[0190] A driving component is formed on the first wafer and / or the second wafer, and the driving component can be used to drive the movement of the moving part.

[0191] In the above solution, when the MEMS chip 100 is subjected to an external impact, the first limiting post 32 can limit the displacement amplitude of the moving part 22 in the direction towards the fixing component 30, thereby reducing the risk of the first support beam 23 breaking due to excessive displacement of the moving part 22 and improving the structural reliability of the MEMS chip 100; in addition, since the fixing component 30 is grounded, the first limiting post 32 formed thereon can be grounded by direct contact, avoiding complex processes such as subsequent through-silicon via process or metal buried line, so it is beneficial to simplify the manufacturing process of the MEMS chip 100.

[0192] In order to form a gap between the first limiting post 32 and the moving part 22, the above manufacturing method may further include: forming a first avoidance groove 24 on the surface of the moving part 22 facing the fixing component 30, and the first avoidance groove 24 can be specifically arranged in one-to-one correspondence with the first limiting post 32, so that the top of the first limiting post 32 is spaced from the bottom wall of the first avoidance groove 24.

[0193] In addition, in the embodiment of the present application, the height of the first limiting post 32 and the height of the boss 31 can be the same, so that the two can be etched integrally, thereby simplifying the manufacturing process of the MEMS chip 100.

[0194] Refer to togetherFigure 1 and Figure 3 As shown in Figure 3 , in the embodiment of the present application, the driving component can be specifically used to drive the moving part 22 to rotate around the first rotation axis, so that the moving part 22 deflects relative to the fixed component 30, realizing the related functions of the MEMS chip 100. Taking the direction of the first rotation axis as the x-axis direction as an example, when the maximum rotation angle of the moving part 22 around the x-axis is θ1max, the first avoidance groove 24 can be arranged on one side of the x-axis. The distance between the first limiting post 32 and the moving part 22 (when the height of the first limiting post 32 is the same as that of the boss 31, this distance is the depth d1 of the first avoidance groove 24), and the horizontal distance L1 between the center of the first avoidance groove 24 and the first rotation axis satisfy:

[0195] θ1max≤arctan(d1 / L1)

[0196] According to the above formula, the required depth range of the first avoidance groove 24 at a certain position can be determined. Through the cooperation between the first avoidance groove 24 and the first limiting post 32, the first limiting post 32 can not only limit the displacement amount of the moving part 22 along the negative z-axis direction, but also limit the rotation amount of the moving part 22 in the clockwise direction around the x-axis, thereby improving the structural reliability of the MEMS chip.

[0197] When specifically setting the driving component, according to different driving methods, the specific structural forms of the driving component are also different. Taking the driving component using the electrostatic driving method as an example, the preparation method of the MEMS chip will be described in detail below.

[0198] Step 1: Referring to Figure 35a As shown in Figure 35a , the first avoidance groove 24 and the first support beam 23 are etched on the first side of the first wafer 1, and the first alignment mark 01 is etched on the second side of the first wafer;

[0199] Step 2: Referring to Figure 35b As shown in Figure 35b , the first isolation groove 35 is etched on the first side of the second wafer 2, and the second alignment mark 02 is etched on the second side of the second wafer;

[0200] In this step, the silicon layer on the first side of the second wafer 2 can be divided into the first conductive part 33 and the second conductive part 34 that are insulated from each other through the first isolation groove 35, wherein the first conductive part 33 can be grounded;

[0201] Step 3: Referring to Figure 35c As shown in Figure 35c , the boss 31 and the first limiting post 32 are etched on the first conductive part 33, and the second comb structure 62 is etched on the second conductive part 34, thus completing the preparation of the fixed component on the first side of the second wafer 2;

[0202] Step Four: Referring to Figure 35d as shown, using the first alignment mark 01 and the second alignment mark 02 as the positioning reference, bond and fix the first wafer 1 and the second wafer 2, and make the first side of the first wafer 1 opposite to the first side of the second wafer 2 in position;

[0203] Step Five: Referring to Figure 35e as shown, etch away the silicon layer on the second side of the first wafer 1;

[0204] Step Six: Referring to Figure 35f as shown, etch away the intermediate insulating layer of the first wafer 1, so that the silicon layer on the first side of the first wafer 1 forms a fixing part 21 at the position corresponding to the boss, and a moving part 22 connected to the fixing part 21 through the first support beam 23 is formed;

[0205] Step Seven: Referring to Figure 35g as shown, etch and form a first comb structure 61 on the first wafer 1, and etch away the silicon layer in the area corresponding to the first isolation groove 35 on the first wafer; wherein, the teeth of the first comb structure 61 are arranged in a staggered manner with the teeth of the second comb structure 62, the first comb structure 61 can be located on one side of the first support beam 23, or can also be located on both sides of the first support beam 23, and the first comb structure 61 is connected to the moving part 22, so that when the second comb structure 62 receives a driving voltage, the first comb structure 61 and the moving part can be driven to rotate around the first support beam 23;

[0206] Step Eight: Referring to Figure 35h as shown, etch and form a first through groove 51 at the position of the intermediate insulating layer 50 of the first wafer 1 corresponding to the first isolation groove, so as to avoid the exposure of insulating materials at the position of the first isolation groove 35, thereby avoiding the reliability problems of the driving component caused by the gradual accumulation of net charges of the insulating materials, and contributing to improving the long-term stability of the rotation angle or rotation frequency of the MEMS chip;

[0207] Step Nine: Referring to Figure 35i as shown, prepare a metal electrode 211 on the fixing part 21, so that the fixing part 21 can be grounded through the metal electrode 211, and further the first conductive part 33 electrically connected to the fixing part 21 through the boss can be grounded; in addition, when the MEMS chip is used as a micromirror, in this step, a reflective layer 40 can also be prepared on the side of the moving part 22 facing away from the fixing component 30.

[0208] The above steps are the specific manufacturing process of a MEMS chip when using the electrostatic drive method. It should be understood that for MEMS chips using other drive methods, they can also be manufactured through corresponding manufacturing processes according to the specific structural form of the drive component, and will not be elaborated here too much.

[0209] Reference Figure 36 As shown, an embodiment of the present application further provides a MEMS chip array 200, which includes a plurality of MEMS chips 100 in any of the foregoing possible embodiments, and the plurality of MEMS chips 100 are arranged in an array. Specifically, the plurality of MEMS chips 100 may be arranged in a one-dimensional layout or a two-dimensional layout, and the present application does not limit this; in addition, when the MEMS chips 100 adopt different structural forms, they may also have different layout methods, for example Figure 36 and Figure 37 As shown, it can be specifically designed according to actual needs.

[0210] When the MEMS chip 100 is a micromirror, the MEMS chip array is a micromirror array. In actual use, each micromirror in the micromirror array can correspond to a beam of incident light to adjust the reflection direction of the incident light. In this way, the entire micromirror array can precisely control the reflection directions of different light beams, thereby expanding its application scenarios.

[0211] Reference Figure 38 As shown, an embodiment of the present application further provides a MEMS device 300, which may include the MEMS chip 100 in any of the foregoing possible embodiments, as well as a substrate 310 and a cover plate 320. Among them, pins 311 are provided on the substrate 310, and the cover plate 320 can be covered on one side of the substrate 310 to form a packaging space 330 that can be used to package the MEMS chip 100; the MEMS chip 100 is located in the packaging space 330, and the driving component of the MEMS chip 100 can be connected to the first end of the pin 311, and the second end of the pin 311 can extend outside the packaging space 330 to be connected to a driving signal outside the device, so that a driving voltage or current can be output to the driving component to enable the MEMS chip 100 to work properly.

[0212] It should be noted that when the MEMS chip 100 is a micromirror, the side of the cover plate 320 opposite to the substrate 310 can be made of a transparent material so that the light beam outside the device can irradiate the micromirror in the packaging space 300 through the transparent cover plate 320.

[0213] Reference Figure 39As shown in the figure, the embodiment of the present application further provides an electronic device 400, which can be an optical attenuator, a wavelength selective switch, an optical cross-connector, an optical radar, a head-up display, etc. in the prior art. The electronic device 400 may include a circuit board 410, a control chip 420, a connector 430, and the MEMS device 300 in the foregoing embodiment. Among them, the MEMS device 300 and the control chip 420 are respectively located on one side of the circuit board 410. The connector 430 can be used to connect the second end of the control chip 420 and the pin to output the driving voltage or current output by the control chip 420 to the MEMS device 300.

[0214] In addition, in addition to Figure 1 the MEMS chip structure shown, the embodiment of the present application provides another MEMS chip structure, and its side view is as shown in Figure 40 the figure. The MEMS chip 100 may include a substrate 10, a moving component 20, and a fixed component 30 located between the substrate 10 and the moving component 20. Among them, the moving component 20 may include a fixing part 21, a moving part 22, and a first support beam 23. The first support beam 23 is respectively connected to the fixing part 21 and the moving part 22 to rotatably arrange the moving part 22 on the fixing part 21; the fixing component 30 is provided with a boss 31 and a first limiting post 32 on the surface facing the moving component 20. The boss 31 can be connected to the fixing part 21 and support the fixing part 21 to make the moving part 22 suspended above the fixing component 30. The first limiting post 32 is located in the area corresponding to the moving part 22 on the fixing component 30, and there is a certain interval between the first limiting post 32 and the surface of the moving part 22 facing the fixing component 30. On the one hand, this can make the moving part 22 rotate relative to the fixing component 30 to realize the related functions of the MEMS chip 100. On the other hand, when the MEMS chip 100 is impacted by the outside world, through the stopping action of the first limiting post 32, it can also prevent the moving part 22 from having excessive displacement in the direction close to the fixing component 30 (negative z-axis direction), thereby reducing the risk of the first support beam 23 breaking and improving the structural reliability of the MEMS chip 100.

[0215] The basic structure of the embodiment of the present application is similar to that of the Figure 1 MEMS chip shown, and the specific type of the MEMS chip 100, the materials of each component, the driving method of the moving part 22, the form of the boss 31 and the support beam 23, etc. can be seen in the relevant description of the Figure 1 MEMS chip shown. The description of this embodiment will not be repeated. This embodiment and Figure 1The difference of the MEMS chip shown is that there is an avoidance groove formed by etching the moving part 22 corresponding to each limiting post. The horizontal distance from one side of the avoidance groove to the axis of the first rotating shaft is W1, and the other end of the avoidance groove extends to the edge of the moving part 22. The horizontal distance from the point on the limiting post close to the first rotation axis to the axis of the first rotating shaft is L4. Considering the process tolerance conditions, W1 < L4. The width of the limiting post is W0.

[0216] The maximum rotation angle θ4max or displacement that the moving part 22 can rotate determines the depth d4 of the avoidance groove and the horizontal distance L4 between the limiting post and the rotation axis of the moving part 22 in this embodiment. Refer to Figure 41 As shown, taking the direction of the first rotation axis as the x-axis direction as an example, when the maximum rotation angle of the moving part 22 around the x-axis is θ4max, according to the relevant geometric principles, the following conditions are satisfied between the depth d4 of the avoidance groove and the horizontal distance L4 from the point on the limiting post close to the first rotation axis to the axis of the first rotating shaft and θ4max:

[0217] θ4max≤arctan[d4 / (L4+W0)]

[0218] According to the above formula, through the cooperation between the avoidance groove 24 and the first limiting post 32, the first limiting post 32 can not only limit the displacement of the moving part 22 in the negative z-axis direction, but also limit the rotation amount of the moving part 22 in the clockwise direction around the x-axis, thereby improving the structural reliability of the MEMS chip. Therefore, the maximum rotation angle of the moving part 22 can also be increased by increasing d4 or decreasing (L4 + W0). It should be understood that in addition to the rectangular cross-section, the cross-section of the limiting post can also be circular, elliptical, triangular, etc. For different shapes, the above formula can be changed to:

[0219] θ4max≤arctan(d4 / L3)

[0220] Wherein, L3 can refer to the horizontal distance from the point on the limiting post farthest from the first rotation axis to the first rotation axis.

[0221] In addition, referring to the expression method in the previous embodiment, the maximum rotation angle θ4max that the moving part 22 can rotate satisfies the following conditions:

[0222] θ4max≤arctan[d4 / (L1)]

[0223] Wherein, d4 is the depth of the avoidance groove, and L1 is the horizontal distance from the first avoidance groove to the first rotation axis. The cross-section of the avoidance groove can be rectangular, circular, elliptical, triangular, etc. For different shapes, L1 can refer to the horizontal distance from the point on the side of the first avoidance groove closest to the first rotation axis to the first rotation axis. It should be understood that, for example Figure 1In the shown structure, the horizontal distance L1 from the first avoidance groove to the first rotation axis can also meet the above limitations.

[0224] Of course, in other embodiments of the present application, the first limiting post 32 can also be arranged on the other side of the first rotation axis. In this case, the rotation amount of the moving part 22 around the first rotation axis in the counterclockwise direction can be limited; or, the first limiting post 32 can also be arranged on both sides of the first rotation axis to respectively limit the rotation amounts of the moving part 22 around the first rotation axis in the clockwise direction and the counterclockwise direction; or the first limiting post 32 can also be arranged on both sides of the second rotation axis or on both sides of the first rotation axis and the second rotation axis simultaneously to play a more comprehensive limiting role. The second rotation axis is along the y-axis direction. Optionally, the limiting posts can also be symmetrically arranged with the first rotation axis and / or the second rotation axis as the center.

[0225] It should be noted that an avoidance groove 24 with a depth of d4 is etched on the moving part 22 above the limiting post to Figure 40 Taking the first limiting post 32 shown as an example, the corresponding avoidance groove 24 can be a strip-shaped avoidance groove that is only wider than the first limiting post 32, or an avoidance groove that is completely etched off along the x-axis direction and has a depth of d4; the avoidance grooves corresponding to other limiting posts can also be formed in a similar manner, which is not limited in the present application.

[0226] Furthermore, the present application also provides another MEMS chip structure, the side view of which is as Figure 42 shown. The basic structure and requirements are the same as Figure 1 and Figure 40 similar, and the present application will not elaborate here; the difference is that there is an avoidance groove formed by etching from the bottom of the moving part 22 corresponding above the limiting post. The horizontal distance from one side of the avoidance groove to the first rotation axis of the shaft is W2. The horizontal distance from the vertex of the limiting post far from the first rotation axis to the first rotation axis of the shaft is L3. Considering the process tolerance conditions, W2 > L3. The width of the limiting post is W0, and multiple limiting posts can correspond to the same avoidance groove 24.

[0227] The maximum rotation angle θ3max or displacement that the moving part 22 can rotate determines the depth d3 of the avoidance groove and the horizontal distance L3 of the limiting post relative to the rotation axis of the moving part 22. Referring to Figure 43 shown, taking the direction of the first rotation axis as the x-axis direction as an example, when the maximum rotation angle of the moving part 22 around the x-axis is θ3max, according to relevant geometric principles, the following conditions are satisfied between the depth d3 of the avoidance groove and the horizontal distance L3 from the point of the limiting post far from the first rotation axis to the first rotation axis of the shaft and θ3max:

[0228] θ3max ≤ arctan(d3 / L3)

[0229] According to the above formula, through the cooperation between the avoidance groove 24 and the first limit post 32, the first limit post 32 can not only limit the displacement of the moving part 22 in the negative z-axis direction, but also limit the rotation of the moving part 22 in the clockwise direction around the x-axis, thereby improving the structural reliability of the MEMS chip. Therefore, the maximum rotation angle of the moving part 22 can also be increased by increasing d3 or decreasing L3. It should be understood that the cross-section of the limit post can be rectangular, circular, elliptical, triangular, etc. For different shapes, L3 can refer to the horizontal distance from the point on the limit post farthest from the first rotation axis to the first rotation axis.

[0230] Of course, in other embodiments of the present application, the first limit post 32 can also be arranged on the other side of the first rotation axis, in which case the rotation of the moving part 22 in the counterclockwise direction around the first rotation axis can be limited; or, the first limit post 32 can also be arranged on both sides of the first rotation axis to respectively limit the rotation of the moving part 22 in the clockwise direction and the counterclockwise direction around the first rotation axis; or the first limit post 32 can also be arranged on both sides of the second rotation axis or on both sides of the first rotation axis and the second rotation axis at the same time to play a more comprehensive limiting role, and the second rotation axis is along the y-axis direction. Optionally, the limit post can also be symmetrically arranged with the first rotation axis and / or the second rotation axis as the center.

[0231] It should be noted that the limit posts arranged on both sides of the x-axis or the y-axis can correspond to the same avoidance groove 24. As Figure 42 shown, the first limit post 32 and the second limit post 36 correspond to the same avoidance groove 24. The avoidance groove 24 can be a strip-shaped avoidance groove that is only wider than the two limit posts and has a depth of d3, or an avoidance groove with a depth of d3 that is completely etched away along the x-axis direction; similarly, if there are two limit posts on both sides of the y-axis, these two limit posts can also correspond to the same avoidance groove, and the avoidance groove can be a strip-shaped avoidance groove that is only wider than the two limit posts and has a depth of d3, or an avoidance groove with a depth of d3 that is completely etched away along the y-axis direction; further, if there are multiple limit posts at the same time, such as limit posts on both sides of the x-axis and the y-axis, at this time, the multiple limit posts can also correspond to the same avoidance groove. Optionally, the cross-sectional shape of the avoidance groove can be rectangular, circular, polygonal, elliptical, triangular, etc., which is not limited in this application.

[0232] The above is only the specific implementation manner of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present application can easily think of changes or substitutions, which should all be covered by the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A MEMS chip, characterized in that, It includes a substrate, a moving component, a fixed component, and a driving component. The fixed component is located between the substrate and the moving component, where: The moving component includes a fixed part, a moving part, and a first support beam. The first support beam is connected to the moving part and the fixed part respectively, and a first avoidance groove is formed on the first surface of the moving part facing the fixed component; One surface of the fixed component facing the moving component has a boss and a first limiting post. The boss is connected to the fixed part and is used to support the fixed part, and the first limiting post corresponds to one of the first avoidance grooves; The driving component is connected to the moving part and is used to drive the moving part to move.

2. The MEMS chip according to claim 1, wherein The driving component is used to drive the moving part to rotate around a first rotation axis; The first avoidance groove is at least on one side of the first rotation axis.

3. The MEMS chip according to claim 1, wherein The height of the first limiting post is equal to the height of the boss.

4. The MEMS chip according to claim 2, wherein, The maximum rotation angle of the moving part around the first rotation axis is θ1max. The depth d1 of the first avoidance groove and the horizontal distance L1 between the first avoidance groove and the first rotation axis satisfy: θ1max ≤ arctan(d1 / L1).

5. The MEMS chip according to claim 2, wherein The first rotation axis passes through the first avoidance groove. The maximum rotation angle of the moving part around the first rotation axis is θ3max. The depth d1 of the first avoidance groove and the horizontal distance L3 between the point of the first limiting post far from the first rotation axis and the first rotation axis satisfy: θ3max ≤ arctan(d1 / L3).

6. The MEMS chip according to claim 2, characterized in that, The material of the fixed component is a conductive material, and the fixed component includes a first conductive part and at least one second conductive part. The first conductive part is grounded, and the second conductive part is insulated from the first conductive part through a first isolation groove.

7. The MEMS chip according to claim 6, wherein The driving component includes a first comb structure and a second comb structure. The first comb structure is connected to the moving part and is at least on one side of the first rotation axis; the second comb structure is connected to the second conductive part, and the teeth of the second comb structure are arranged in a staggered manner with the teeth of the first comb structure. The second comb structure is used to drive the first comb structure and the moving part to rotate around the first rotation axis when receiving a driving voltage; The extending direction of the first rotation axis is the same as the extending direction of the first support beam.

8. The MEMS chip according to claim 7, wherein The first comb structure is on both sides of the first rotation axis. The second comb structure includes a first driving part and a second driving part spaced apart from each other. The first driving part and the second driving part are respectively located on different second conductive parts, and the first driving part and the second driving part are respectively arranged corresponding to the first comb structures on both sides of the first rotation axis; The first surface of the moving part is provided with the first avoidance groove on both sides of the first rotation axis respectively.

9. The MEMS chip according to claim 6, wherein, The moving part includes a first rotating part and a second rotating part; The moving component further includes a second support beam, which is respectively connected to the first rotating part and the second rotating part and is used to make the second rotating part rotate around the second rotation axis; the first support beam is respectively connected to the first rotating part and the fixed part and is used to make the first rotating part and the second rotating part rotate around the first rotation axis; the extending direction of the first rotation axis is the same as the extending direction of the first support beam, and the extending direction of the second rotation axis is the same as the extending direction of the second support beam; A second avoidance groove is formed on at least one side of the first surface of the second rotating part along the second rotation axis, and a second limiting post is provided on the surface of the first conductive part facing the moving component, and the second limiting posts are arranged in one-to-one correspondence with the second avoidance grooves.

10. The MEMS chip according to claim 9, characterized in that, The maximum rotation angle of the second rotating part around the second rotation axis is θ2max, and the depth d2 of the second avoidance groove and the horizontal distance L2 between the second avoidance groove and the second rotation axis satisfy: θ2max≤arctan(d2 / L2).

11. The MEMS chip according to claim 9, wherein The fixed component further includes at least one third conductive part, and the third conductive part and the first conductive part are insulated by a second isolation groove; The driving component further includes a third comb structure and a fourth comb structure. The third comb structure is connected to the second rotating part and is at least located on one side of the second rotation axis; the fourth comb structure is connected to the third conductive part, and the teeth of the fourth comb structure are arranged in a staggered manner with the teeth of the third comb structure. The fourth comb structure is used to drive the third comb structure and the second rotating part to rotate around the second rotation axis when receiving a driving voltage.

12. The MEMS chip according to claim 11, characterized in that, The third comb structure is located on both sides of the second rotation axis. The fourth comb structure includes a third driving part and a fourth driving part arranged at intervals. The third driving part and the fourth driving part are respectively arranged on different third conductive parts, and the third driving part and the fourth driving part are respectively arranged corresponding to the third comb structures located on both sides of the second rotation axis; The second avoidance grooves are respectively formed on both sides of the first surface of the second rotating part along the second rotation axis.

13. The MEMS chip according to any one of claims 6 to 12, characterized in that, It further includes a first stop structure; The moving part has a slot, the first stop structure is located in the slot, and there is a gap between the periphery of the first stop structure and the inner wall of the slot; A first support post is provided on the surface of the first conductive part facing the moving component, and the first support post is used to support the first stop structure.

14. The MEMS chip according to claim 13, characterized in that, The periphery of the first stop structure has a first protrusion structure.

15. The MEMS chip according to claim 11, wherein The MEMS chip further includes an insulating layer located between the substrate and the fixed component, and a first through groove is formed in the insulating layer corresponding to the position of the first isolation groove; and / or, A second through groove is formed in the insulating layer corresponding to the position of the second isolation groove.

16. The MEMS chip according to any one of claims 2 to 5, characterized in that, The driving component includes a driving coil and a magnet; The driving coil is located on one surface of the moving part; The magnet is located on one side of the MEMS chip and is used to drive the moving part to rotate around the first rotation axis by the energized driving coil.

17. The MEMS chip according to claim 16, wherein The moving part includes a first rotating part and a second rotating part, and the first rotating part is a frame structure; The moving assembly further includes a second support beam, and the second support beam is respectively connected to the inner sides of the second rotating part and the first rotating part and is used to make the second rotating part rotate around the second rotation axis; the first support beam is respectively connected to the outer sides of the fixed part and the second rotating part and is used to make the first rotating part and the second rotating part rotate around the first rotation axis; the extending direction of the first rotation axis is the same as the extending direction of the first support beam, and the extending direction of the second rotation axis is the same as the extending direction of the second support beam; On both sides of the second rotation axis on the first surface of the second rotating part, second avoidance grooves are respectively formed, and on the surface of the fixed assembly facing the moving assembly, second limit posts are arranged, and the second limit posts are arranged in one-to-one correspondence with the second avoidance grooves; The driving coil is located on the first rotating part or the second rotating part.

18. The MEMS chip according to any one of claims 2 to 5, characterized in that The number of the first support beams is two; The driving assembly includes a first piezoelectric driving structure arranged on the first support beam, and the first piezoelectric driving structure is used to drive the moving part to rotate around the first rotation axis, and the extending direction of the first rotation axis is perpendicular to the connection line of the connection positions of the two first support beams and the moving part; On both sides of the first rotation axis on the first surface of the moving part, the first avoidance grooves are respectively formed.

19. The MEMS chip according to claim 18, wherein, The moving assembly further includes two second support beams, and the second support beams are respectively connected to the moving part and the fixed part; The driving assembly further includes a second piezoelectric driving structure arranged on the second support beam, and the second piezoelectric driving structure is used to drive the moving part to rotate around the second rotation axis, and the extending direction of the second rotation axis is perpendicular to the connection line of the connection positions of the two second support beams and the moving part; On both sides of the second rotation axis on the first surface of the moving part, second avoidance grooves are respectively formed, and on the surface of the fixed assembly facing the moving assembly, second limit posts are arranged, and the second limit posts are arranged in one-to-one correspondence with the second avoidance grooves.

20. The MEMS chip according to any one of claims 1 to 12, characterized in that, It further includes a second stop structure, and the second stop structure is located on the periphery of the moving part and has a gap with the moving part; On the surface of the fixed assembly facing the moving assembly, there is a second support post, and the second support post is used to support the second stop structure.

21. The MEMS chip according to any one of claims 1 to 12, characterized in that, The material of the moving assembly is silicon; and / or, the material of the fixed assembly is silicon.

22. The MEMS chip according to any one of claims 1 to 12, characterized in that, The second surface of the moving part facing away from the fixed assembly has a mirror area; The MEMS chip further includes a reflective layer located in the mirror area.

23. A MEMS chip array, characterized in that, It includes a plurality of MEMS chips according to any one of claims 1 to 22, and the plurality of MEMS chips are arranged in an array.

24. A MEMS device, characterized in that, It includes a MEMS chip according to any one of claims 1 to 22, and a substrate and a cover plate covering the substrate and forming a packaging space with the substrate; The MEMS chip is disposed on the substrate and within the encapsulation space; Pins are provided on the substrate. A first end of the pin is connected to the driving component, and a second end of the pin extends outside the encapsulation space; A side of the cover plate opposite to the substrate is made of a transparent material.

25. An electronic device, characterized in that, It includes the MEMS device as described in claim 24, a circuit board, a control chip, and a connector. The MEMS device and the control chip are respectively located on one side of the circuit board, and the connector is used to connect the control chip and the second end of the pin.

26. A method for fabricating a MEMS chip, characterized in that, It includes: Form a moving component on a first side of a first wafer; Form a fixed component on a first side of a second wafer. A second side of the second wafer has a substrate; Bond and fix the first wafer and the second wafer, and arrange the moving component and the fixed component opposite to each other; Among them, forming the moving component on the first side of the first wafer includes: forming a fixing part, a moving part, and a first support beam on the first side of the first wafer. The first support beam is respectively connected to the moving part and the fixing part, and a first avoidance groove is formed on a first surface of the moving part facing the fixed component; Forming the fixed component on the first side of the second wafer includes: forming a boss and at least one first limiting post on the first side of the second wafer. The boss is connected to the fixing part and is used to support the fixing part, and the first limiting posts are arranged in one-to-one correspondence with the first avoidance grooves; Form a driving component on the first wafer and / or the second wafer. The driving component is used to drive the moving part to move.

27. The preparation method according to claim 26, wherein, The driving component is used to drive the moving part to rotate around a first rotation axis; The first avoidance groove is formed on at least one side of the first rotation axis.

28. The preparation method according to claim 27, wherein, A maximum rotation angle of the moving part around the first rotation axis is θ1max. A depth d1 of the first avoidance groove and a horizontal distance L1 between the first avoidance groove and the first rotation axis satisfy: θ1max ≤ arctan(d1 / L1).

29. The preparation method according to claim 27, characterized in that, The manufacturing method further includes: Form a first conductive part and at least one second conductive part on the first side of the second wafer, and form a first isolation groove between the second conductive part and the first conductive part, and ground the first conductive part.

30. The preparation method according to claim 29, wherein, Forming the driving component on the first wafer and / or the second wafer includes: Form a first comb structure connected to the moving part on the first side of the first wafer. The first comb structure is connected to the moving part, and the first comb structure is at least located on one of the sides of the first rotation axis; Form a second comb structure on the second conductive part. Teeth of the second comb structure are arranged in a staggered manner with teeth of the first comb structure. The second comb structure is used to drive the first comb structure and the moving part to rotate around the first rotation axis when receiving a driving voltage; An extending direction of the first rotation axis is the same as an extending direction of the first support beam.

31. The preparation method according to any one of claims 29 or 30, characterized in that, The second wafer includes an insulating layer between the substrate and the fixed component. The manufacturing method further includes: A first through groove is formed at a position of the insulating layer corresponding to the first isolation groove.

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