Detection Method, Control Device and Dispensing Device for Glue Path of Device

Abstract

The present invention discloses a method for detecting the glue path of a device, a control device, and a dispensing device. The method includes the following steps: obtaining an infrared image of the glue path at a set temperature, where the set temperature is higher than the temperature of the device; obtaining the state-related parameters according to the infrared image of the glue path; and determining whether the glue path is abnormal according to the state-related parameters. By using an infrared imaging device to capture the infrared image of the glue path at a set temperature, where the set temperature is higher than the temperature of the device, there is a significant difference between the glue path and the surrounding environment (i.e., the device) in the infrared image of the glue path. Thus, the glue path can be shown obliquely. Then, the state-related parameters are obtained according to the infrared image of the glue path, and it is determined whether the glue path is abnormal according to the state-related parameters. In this way, it is possible to accurately detect the state of the glue path without adding colorants or fluorescent agents.

Description

Technical Field

[0001] The present invention relates to the technical field of dispensing equipment, and particularly relates to a method for detecting a glue path of a device, a control device, and a dispensing device. Background Art

[0002] In the assembly production process of electronic products with display screens, it is often necessary to perform static pressure holding and curing after dispensing and assembling the screen assembly and the bracket assembly. Among them, for the most critical dispensing process, when the glue and the housing are the same color or the glue is transparent, the dispensing state cannot be directly detected by a traditional CCD camera and there are a large number of misjudgments. Moreover, the glue is not allowed to be used with a colorant or a fluorescent agent for the dispensing state inspection by a traditional CCD camera (because the product will cause colored edges in the screen display and poor appearance under the light). (Because the automatic dispensing inspection equipment poses a risk of injury during operation and the glue path of the product is thin and has side walls and convex edges with oblique occlusion), manual inspection cannot be performed either. As a result, there is a large proportion of dispensing defects in the industry, which lead to losses such as airtight defective products or poor curing bonding due to the inability to control the process inspection, and currently there are no effective inspection measures for this problem in the industry. Summary of the Invention

[0003] The main object of the present invention is to propose a method for detecting a glue path of a device, a control device, and a dispensing device, aiming to accurately detect the state of the glue path without the need to add a colorant or a fluorescent agent.

[0004] To achieve the above object, the present invention provides a method for detecting a glue path of a device, including the following steps:

[0005] Obtain an infrared image of the glue path at a set temperature, where the set temperature is greater than the temperature of the device;

[0006] Obtain the state-related parameters according to the infrared image of the glue path;

[0007] Judge whether the glue path is abnormal according to the state-related parameters.

[0008] Optionally, the state-related parameters include at least one of a skew parameter, a glue break parameter, a glue hanging parameter, a glue width parameter, a height parameter, and a hollow or internal air bubble parameter of the glue path.

[0009] Optionally, the state-related parameters include a skew parameter of the glue path;

[0010] The step of obtaining the state-related parameters according to the infrared image of the glue path includes:

[0011] Obtain two contour edges of the glue path according to the infrared image of the glue path;

[0012] Calculate the positional relationship parameters between the two contour edges and the set contour edge to obtain the skew parameters of the glue path.

[0013] Optionally, the state-related parameters include the width parameter of the glue path;

[0014] The steps of obtaining the state-related parameters according to the glue path infrared image include:

[0015] Obtain the two contour edges of the glue path according to the glue path infrared image;

[0016] Calculate the distance between the two contour edges to obtain the width parameter of the glue path.

[0017] Optionally, the state-related parameters include the glue break parameter or the glue hanging parameter;

[0018] The steps of obtaining the state-related parameters according to the glue path infrared image include:

[0019] Search for the color mutation area in the glue path area on the glue path infrared image;

[0020] Obtain the glue break parameter or the glue hanging parameter according to the result of searching for the color mutation area.

[0021] Optionally, the state-related parameters include the height parameter;

[0022] The steps of obtaining the state-related parameters according to the glue path infrared image include:

[0023] Obtain the contour area of the glue path according to the glue path infrared image;

[0024] Obtain the color values of each area in the width direction of the contour area of the glue path;

[0025] Obtain the height parameters of each area in the width direction of the glue path according to the color values of each area and the mapping relationship between the height parameter and the color value.

[0026] Optionally, the state-related parameters include the hollow or internal bubble parameters of the glue path;

[0027] The steps of obtaining the state-related parameters according to the glue path infrared image include:

[0028] Obtain the contour area of the glue path according to the glue path infrared image;

[0029] Obtain the color values of each area in the width direction of the contour area of the glue path;

[0030] According to the color values of the respective regions and the mapping relationship between the gap parameter and the color value, the gap parameters of the respective regions of the glue path in its width direction are obtained, and non-destructive detection is performed on whether there is a hollow or internal bubbles in the glue path.

[0031] The present invention further provides a control device, including a memory, a processor, and a detection program for the glue path of the device stored in the memory. The processor executes the detection program for the glue path of the device to implement the steps of the detection method for the glue path of the device as described in any one of the above.

[0032] The present invention further provides a dispensing device, including:

[0033] A mounting base;

[0034] A dispensing device disposed on the mounting base;

[0035] An infrared imaging device for obtaining an infrared image of the glue path when the glue path is at a set temperature, where the set temperature is greater than the temperature of the device; and,

[0036] A control device electrically connected to the infrared imaging device, and the control device is the above control device.

[0037] Optionally, the dispensing device further includes an alarm device electrically connected to the control device;

[0038] The control device is used to control the alarm device to alarm when the glue path is abnormal.

[0039] In the technical solution provided by the present invention, an infrared image of the glue path corresponding to the glue path at a set temperature is captured by the infrared imaging device, where the set temperature is greater than the temperature of the device, so that there is an obvious difference between the glue path and the surrounding environment (i.e., the device) in the infrared image of the glue path. Furthermore, the glue path can be shown obliquely. Then, according to the infrared image of the glue path, the state-related parameters are obtained, and according to the state-related parameters, it is determined whether the glue path is abnormal. In this way, it is possible to accurately detect the state of the glue path without adding a colorant or a fluorescent agent. Description of the Drawings

[0040] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on the structures shown in these drawings without creative efforts.

[0041] Figure 1 A three-dimensional schematic diagram of an embodiment of the dispensing device provided by the present invention;

[0042] Figure 2 It is a schematic flowchart of an embodiment of the detection method for the glue path of the device provided by the present invention.

[0043] The realization of the object of the present invention, its functional features and advantages will be further described in conjunction with the embodiments and with reference to the accompanying drawings. Specific Embodiments

[0044] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without making creative efforts fall within the scope of protection of the present invention.

[0045] It should be noted that if there are directional indications (such as up, down, left, right, front, back...) involved in the embodiments of the present invention, the directional indications are only used to explain the relative positional relationship and movement conditions between components in a specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indications will also change accordingly.

[0046] In addition, if there are descriptions such as "first", "second", etc. involved in the embodiments of the present invention, the descriptions of "first", "second", etc. are only for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first", "second" may explicitly or implicitly include at least one of such features. In addition, the meaning of "and / or" appearing throughout the text includes three parallel solutions. Taking "A and / or B" as an example, it includes solution A, solution B, or the solution where A and B are satisfied simultaneously. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the fact that those of ordinary skill in the art can implement them. When the combination of technical solutions results in contradictions or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0047] The present invention provides a dispensing device 100, Figure 1 For an embodiment of the dispensing device 100 provided by the present invention, please refer to Figure 1 , the dispensing device 100 includes a mounting base 1, a dispensing device 2, an infrared imaging device 3, and a control device.

[0048] The dispensing device 2 is disposed on the mounting base 1, and the infrared imaging device 3 is disposed on the mounting base 1. Specifically, a robotic arm is provided on the mounting base 1, and the dispensing device 2 and the infrared imaging device 3 are disposed on the robotic arm. The dispensing device 2 is used to dispense glue at a set position of the device to form a glue path. The device can be, but is not limited to, a display screen, or other devices. The infrared imaging device is used to obtain an infrared image of the glue path when the glue path is at a set temperature, where the set temperature is higher than the temperature of the device. Specifically, in an embodiment of the present invention, the set temperature is 80 - 150°C. Obviously, it is not limited to this temperature. The minimum temperature value can be less than 80°C, such as 50°C, or the maximum temperature value can be greater than 150°C, such as 500°C, as long as the temperature of the glue path can be distinguished from the temperature of the device, and the glue path and the device can be clearly distinguished in the infrared image of the glue path. The infrared image of the glue path can be taken when the dispensing is completed but the glue path has not completed cooling and curing at the set temperature.

[0049] The control device is electrically connected to the infrared imaging device 3. The control device includes a memory, a processor, and a detection program for the glue path of the device stored in the memory. The processor executes the detection program for the glue path of the device to implement the steps of the detection method for the glue path of the device as described below: obtaining an infrared image of the glue path when the glue path is at a set temperature, where the set temperature is higher than the temperature of the device; obtaining the state-related parameters according to the infrared image of the glue path; and judging whether the glue path is abnormal according to the state-related parameters. It should be noted here that the control device can be independent of the dispensing device 2, or can be a part of the dispensing device 2. For example, the control device can be a remotely controlled controller. Therefore, in an embodiment of the present invention, a control device is further provided. The control device includes a memory, a processor, and a detection program for the glue path of the device stored in the memory. The processor executes the detection program for the glue path of the device to implement the steps of the detection method for the glue path of the device as described below.

[0050] In the technical solution provided by the present invention, an infrared image of the glue path corresponding to the glue path when it is at a set temperature is taken by the infrared imaging device 3, where the set temperature is higher than the temperature of the device, so that there is an obvious difference between the glue path and the surrounding environment (i.e., the device) in the infrared image of the glue path. Furthermore, the glue path can be shown obliquely. Then, the state-related parameters are obtained according to the infrared image of the glue path, and it is judged whether the glue path is abnormal according to the state-related parameters. In this way, it is possible to accurately detect the state of the glue path without adding a colorant or a fluorescent agent.

[0051] In an embodiment of the present invention, the dispensing device 100 further includes an alarm device electrically connected to the control device. The control device is configured to control the alarm device to give an alarm when the glue path is abnormal. The alarm device can be an audible and visual alarm device, or a display device and a communication device, etc., as long as it can inform the set personnel of the abnormal information.

[0052] The technical solution provided by the present invention can realize non-destructive detection of the glue path blocked after assembly, the glue path blocked by dust prevention and protection, and the glue path in a lightless environment by using infrared imaging characteristics.

[0053] The present invention also provides a method for detecting the glue path of a device. Figure 1 As an embodiment of the method for detecting the glue path of a device provided by the present invention, the method for detecting the glue path of the device includes the following steps:

[0054] Step S10: Obtain an infrared image of the glue path at a set temperature, where the set temperature is higher than the temperature of the device.

[0055] The set temperature is 80 - 150 °C. Obviously, it is not limited to this temperature. The minimum temperature value can be less than 80 °C, such as 50 °C, and the maximum temperature value can be greater than 150 °C, such as 500 °C. As long as the temperature of the glue path can be distinguished from the temperature of the device and the glue path and the device can be clearly distinguished in the infrared image of the glue path, the infrared image of the glue path can be taken after the dispensing is completed but the glue path has not completed cooling and curing at the set temperature.

[0056] Step S20: Obtain the state-related parameters according to the infrared image of the glue path.

[0057] There is an obvious color difference between the glue path and the surrounding environment (device) in the infrared image of the glue path. Obviously, the color of the glue path is red, and the surrounding area with a lower temperature can be green. Therefore, the structure of the glue path can be clearly presented in the infrared image of the glue path. Furthermore, relevant processing can be performed on the infrared image of the glue path (see the subsequent part for details) to obtain the state-related parameters, which can reflect whether the glue path is qualified.

[0058] Step S30: Judge whether the glue path is abnormal according to the state-related parameters.

[0059] Specifically, the state-related parameters are matched with the set parameters, which can be comparing the magnitudes, so as to judge whether the glue path is abnormal.

[0060] In the technical solution of the present invention, when the glue path is photographed by the infrared photographing device 3 at a set temperature, the corresponding infrared image of the glue path is obtained. Among them, the set temperature is greater than the temperature of the device, so that there is an obvious difference between the glue path and the surrounding environment (i.e., the device) in the infrared image of the glue path. Furthermore, the glue path can be displayed obliquely. Then, according to the infrared image of the glue path, the state-related parameters are obtained, and according to the state-related parameters, it is judged whether the glue path is abnormal. In this way, it is possible to accurately detect the state of the glue path without adding colorants or fluorescent agents.

[0061] The state-related parameters are parameters that can reflect the state of the glue path, that is, the relevant parameters for judging whether the glue path is qualified. Specifically, in the embodiments of the present invention, the state-related parameters include at least one of the skew parameter, the glue break parameter, the glue hanging parameter, the glue width parameter, the height parameter, and the hollow or internal bubble parameter of the glue path.

[0062] In an embodiment of the present invention, the state-related parameters include the skew parameter of the glue path, and step S20 includes:

[0063] Step S21a: Obtain the two contour edges of the glue path according to the infrared image of the glue path;

[0064] As can be seen from the foregoing, there is an obvious temperature difference between the glue path and the surrounding environment. Furthermore, there is an obvious difference in color on the infrared image of the glue path. In this way, the two contour edges of the glue path can be clearly identified;

[0065] Step S22a: Calculate the position relationship parameter between the two contour edges and the set contour edge to obtain the skew parameter of the glue path.

[0066] The position relationship parameter between the two contour edges and the set contour edge can be the tilt angle, or the degree of coincidence between the two contour edges and the set contour edge. Whether the glue path is skewed can be obtained according to this position relationship parameter, and these parameters are the skew parameters of the glue path.

[0067] In an embodiment of the present invention, the state-related parameters include the width parameter of the glue path, and step S20 includes:

[0068] Step S21b: Obtain the two contour edges of the glue path according to the infrared image of the glue path;

[0069] Step S22b: Calculate the distance between the two contour edges to obtain the width parameter of the glue path.

[0070] The distances between the two contour edges are generally not equal. Therefore, the average value can be calculated to obtain the width parameter of the glue path.

[0071] In an embodiment of the present invention, the state-related parameters include glue-breaking parameters or glue-hanging parameters, and step S20 includes:

[0072] Step S21c: Search for a color mutation area in the glue path area on the infrared image of the glue path.

[0073] First, find the glue path area on the infrared image of the glue path. The specific finding method can be as described above. First, find the two contour edges of the glue path, and then the area between the two contour edges is the glue path area. Then, search for a color mutation area on the glue path area. This search method can refer to the calculation method of image processing and will not be introduced in detail here.

[0074] Step S22c: Obtain the glue-breaking parameters or glue-hanging parameters according to the result of the searched color mutation area.

[0075] When the color mutation area includes a red deepening mutation area and a different color area, when it is a red deepening mutation area, it indicates that there is too much glue, or the mutation of the color mutation area exceeds the set boundary, that is, glue hanging. And when it is a different color area, it indicates that there is no glue in this area, that is, glue breaking. Thus, the glue-breaking parameters or glue-hanging parameters can be obtained according to the result of the searched color mutation area, that is, whether there is a color mutation area, and the type and quantity of the color mutation areas.

[0076] In an embodiment of the present invention, the state-related parameters include height parameters, and step S20 includes:

[0077] Step S21d: Obtain the contour area of the glue path according to the infrared image of the glue path.

[0078] Step S22d: Obtain the color values of each area in the width direction of the contour area of the glue path.

[0079] The contour area of the glue path can be divided into multiple intervals in its width direction, and then the color values of each interval are calculated.

[0080] Step S23d: Obtain the height parameters of each area in the width direction of the glue path according to the color values of each area and the mapping relationship between the height parameters and the color values.

[0081] Obviously, when the temperature of the glue path is constant, the difference in color values of each area is manifested as the difference in the height of the glue path in the corresponding area. By collecting the height parameters of each area in the width direction, the height parameters in the length direction of the entire glue path are obtained. Therefore, the mapping relationship between the height parameters and the color values is stored in the system. It should be noted that for each set temperature of the glue path, the mapping relationship between the height parameters and the color values is different. Therefore, this mapping relationship between the height parameters and the color values corresponds to the above set temperature. Furthermore, based on the color values of each area and the mapping relationship between the height parameters and the color values, the height parameters of each area of the glue path in its width direction can be obtained.

[0082] In an embodiment of the present invention, the state-related parameters include void parameters, and step S20 includes:

[0083] Step S21e: Obtain the contour area of the glue path according to the infrared image of the glue path;

[0084] Step S22e: Obtain the color values of each area of the contour area of the glue path in its width direction;

[0085] Step S23e: Obtain the void parameters of each area of the glue path in its width direction according to the color values of each area and the mapping relationship between the void parameters and the color values, and perform non-destructive detection on whether there are voids or internal bubbles in the glue path.

[0086] The cross-section of the glue path is in the shape of a parabola, that is, large in the middle and small at both ends. Moreover, the color values of each area of the glue path in its width also conform to a certain set relationship. The mapping relationship between the void parameters and the color values is stored in the system. It should be noted that for each set temperature of the glue path, the mapping relationship between the void parameters and the color values is different. Therefore, this mapping relationship between the void parameters and the color values corresponds to the above set temperature. Furthermore, based on the color values of each area and the mapping relationship between the void parameters and the color values, the void parameters of each area of the glue path in its width direction can be obtained.

[0087] It should be noted that in this article, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or system including a series of elements not only includes those elements, but also includes other elements not expressly listed, or also includes elements inherent to such a process, method, article or system. Without further limitations, an element defined by the statement "including one..." does not exclude the existence of additional identical elements in the process, method, article or system including that element.

[0088] The serial numbers of the embodiments of the present invention above are only for description and do not represent the advantages or disadvantages of the embodiments.

[0089] Through the description of the above embodiments, those skilled in the art can clearly understand that the above embodiment methods can be implemented by means of software plus a necessary general hardware platform. Of course, they can also be implemented by hardware, but in many cases the former is a better implementation method. Based on such an understanding, the technical solution of the present invention, in essence, or the part that contributes to the prior art can be embodied in the form of a software product. The computer software product is stored in a storage medium as described above (such as ROM / RAM, magnetic disk, optical disk), and includes several instructions to enable a terminal device (which can be a mobile phone, computer, server, television, or network device, etc.) to execute the methods of the various embodiments of the present invention.

[0090] The above are only the preferred embodiments of the present invention, and do not limit the patent scope of the present invention accordingly. Any equivalent structural transformation made by using the description of the present invention and the content of the drawings under the inventive concept of the present invention, or direct / indirect application in other related technical fields, is included in the patent protection scope of the present invention.

Claims

1. A method for detecting the glue path of a device, characterized in that, applied to the scenario where the glue is transparent or the glue and the device have the same color, including the following steps: obtaining an infrared image of the glue path at a set temperature, where the set temperature is greater than the temperature of the device, and the set temperature is 80 - 150 °C; so that there is an obvious difference between the glue path and the device in the infrared image of the glue path; obtaining state-related parameters according to the infrared image of the glue path; wherein, the state-related parameters include at least one of the skew parameter, broken glue parameter, hanging glue parameter, glue width parameter, height parameter, and hollow or internal bubble parameter of the glue path; judging whether the glue path is abnormal according to the state-related parameters.

2. The method for detecting the glue path of a device according to claim 1, characterized in that, the state-related parameters include the skew parameter of the glue path; the step of obtaining the state-related parameters according to the infrared image of the glue path includes: obtaining the two contour edges of the glue path according to the infrared image of the glue path; calculating the position relationship parameters between the two contour edges and a set contour edge to obtain the skew parameter of the glue path.

3. The method for detecting the glue path of a device according to claim 1, characterized in that, the state-related parameters include the width parameter of the glue path; the step of obtaining the state-related parameters according to the infrared image of the glue path includes: obtaining the two contour edges of the glue path according to the infrared image of the glue path; calculating the distance between the two contour edges to obtain the width parameter of the glue path.

4. The method for detecting the glue path of a device according to claim 1, characterized in that, the state-related parameters include the broken glue parameter or the hanging glue parameter; the step of obtaining the state-related parameters according to the infrared image of the glue path includes: searching for a color mutation area in the glue path area on the infrared image of the glue path; obtaining the broken glue parameter or the hanging glue parameter according to the result of searching for the color mutation area.

5. The method for detecting the glue path of a device according to claim 1, characterized in that, the state-related parameters include the height parameter; the step of obtaining the state-related parameters according to the infrared image of the glue path includes: obtaining the contour area of the glue path according to the infrared image of the glue path; obtaining the color values of each area in the width direction of the contour area of the glue path; according to the color values of each area and the mapping relationship between the height parameter and the color value, obtaining the height parameters of each area in the width direction of the glue path.

6. The method for detecting the glue path of a device according to claim 1, characterized in that, the state-related parameters include the hollow or internal bubble parameter of the glue path; the step of obtaining the state-related parameters according to the infrared image of the glue path includes: obtaining the contour area of the glue path according to the infrared image of the glue path; obtaining the color values of each area in the width direction of the contour area of the glue path; according to the color values of each area and the mapping relationship between the void parameter and the color value, obtaining the void parameters of each area in the width direction of the glue path, and performing non-destructive detection on whether the glue path has a hollow or internal bubble.

7. A control device, characterized in that, it includes a memory, a processor, and a detection program for the glue path of the device stored in the memory, and the processor executes the detection program for the glue path of the device to implement the steps of the detection method for the glue path of the device according to any one of claims 1 to 6.

8. A dispensing device, characterized in that, applied to the scenario where the transparent glue or the glue has the same color as the device, and includes: a mounting base; a dispensing device disposed on the mounting base; an infrared imaging device for obtaining an infrared image of the glue path when the glue path is at a set temperature, the set temperature being greater than the temperature of the device; the set temperature is 80 - 150 °C; and, a control device electrically connected to the infrared imaging device, and the control device is the control device according to claim 7.

9. The dispensing device according to claim 8, characterized in that, the dispensing device further includes an alarm device electrically connected to the control device; the control device is used to control the alarm device to give an alarm when the glue path is abnormal.

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