Liquid cooling system and electronic equipment

Abstract

The present application provides a liquid cooling system and an electronic device, wherein the liquid cooling system is located in the host device through a first cold plate, and the second cold plate is located in the display device. The first cold plate and the second cold plate both contain refrigerant. The two ends of the first cold plate are respectively connected to the two ends of the second cold plate through the shaft assembly, and the first cold plate, the second cold plate and the shaft assembly form a circulation loop for the refrigerant to flow. While having a good heat dissipation function, it can reduce the weight and volume of the shaft structure in the liquid cooling system, thereby meeting the demand for ultra-light and thin electronic equipment.

Description

Technical Field

[0001] The present application relates to the technical field of communication equipment, and in particular to a liquid cooling system and electronic equipment. Background Art

[0002] Mobile phones, computers, and other electronic devices have become an integral part of our lives, ubiquitous and significantly improving our living standards. With the rapid development of communication technology, the functionality of electronic products like laptops has increased, leading to increased energy consumption. Consequently, there is an urgent need to develop a high-performance heat dissipation system.

[0003] Currently, most terminals and terminal-like products, such as laptops, rely on natural cooling to address heat dissipation. However, because liquid cooling dissipates heat much faster than air, and liquids have a large heat capacity and a slow temperature rise, liquid cooling can significantly improve the heat dissipation capabilities of terminal products. Prior art liquid cooling systems in terminal products, such as laptops, typically incorporate liquid-cooled cold plates within the keyboard and screen housings, respectively. The liquid cooling medium between the two cold plates is connected via a liquid cooling pipe, which is wrapped around a mechanical shaft. This transfers heat from the keyboard side to the screen side, achieving overall cooling for the laptop.

[0004] However, the hinge in the above method is very thick and heavy, which cannot meet the current demand for ultra-light and thin electronic products. Summary of the Invention

[0005] The embodiments of the present application provide a liquid cooling system and an electronic device, which can reduce the weight and volume of the rotating shaft of the liquid cooling system while having good heat dissipation function, thereby meeting the demand for ultra-light and thin electronic devices.

[0006] A first aspect of an embodiment of the present application provides a liquid cooling system, which is applied to an electronic device, wherein the electronic device includes a display device and a host device rotatably connected to the display device, and the liquid cooling system includes: a first cold plate, a second cold plate, and at least two rotating shaft assemblies; the first cold plate is located in the host device, and the second cold plate is located in the display device; the first cold plate and the second cold plate both contain refrigerant, and the two ends of the first cold plate are respectively connected to the two ends of the second cold plate through the rotating shaft assemblies, and the first cold plate, the second cold plate, and the rotating shaft assemblies form a circulation loop for the refrigerant to flow.

[0007] The liquid cooling system provided in the embodiment of the present application has a first cold plate located in the host device and a second cold plate located in the display device. A refrigerant is contained in both the first and second cold plates. The two ends of the first cold plate are connected to the two ends of the second cold plate via the rotating shaft assembly. The first cold plate, the second cold plate, and the rotating shaft assembly form a circulation loop for the refrigerant to flow. While having good heat dissipation function, the weight and volume of the rotating shaft in the liquid cooling system can be reduced, thereby reducing the overall weight and volume of the electronic device, thereby meeting the demand for ultra-light and thin electronic devices. This makes the electronic device easy to carry and improves the user experience.

[0008] In one possible implementation, each of the rotating shaft assemblies includes at least: a rotating shaft, a first end of which is connected to the first cold plate, and the rotating shaft is rotatably connected to the host device; a second end of the rotating shaft is connected to the second cold plate, and the rotating shaft is fixedly connected to the display device.

[0009] In this way, the two ends of the first cold plate are connected to the two ends of the second cold plate through the rotating shaft, and the host device and the display device are connected by rotating the rotating shaft. The rotating shaft integrates mechanical rotation and heat dissipation functions into one. The overall structure is fine and can meet the needs of lightweight design. Compared with the existing technology, the heat dissipation effect is better.

[0010] In a possible implementation, each of the rotating shaft assemblies further includes: a support frame, to which the second end of the rotating shaft is fixedly connected, and the second end of the rotating shaft is connected to the second cold plate through the support frame; and the support frame is fixedly connected to the display device.

[0011] The two ends of the first cold plate are connected to the two ends of the second cold plate through the rotating shaft and the support frame respectively. The support frame is fixedly connected to the display device, the rotating shaft is fixedly connected to the support frame, and the rotating shaft is connected to the host device for relative rotation, thereby ensuring the rotation function between the host device and the display device. Moreover, compared with the fixed connection to the display device through the rotating shaft, the fixed connection to the display device through the support frame is more stable and reliable.

[0012] In a possible implementation, each of the rotating shaft assemblies further includes: a shaft sleeve, the shaft sleeve being fixedly connected to the host device; the shaft sleeve being sleeved on the rotating shaft and being rotatably arranged with the rotating shaft.

[0013] By setting a shaft sleeve, the shaft sleeve is fixedly connected to the main unit, and the shaft sleeve is rotatably set with the rotating shaft. The shaft sleeve is sleeved on the rotating shaft and is rotatably connected to the rotating shaft. Compared with the relative rotation connection between the rotating shaft and the main unit, it has strong operability, strong feasibility, more flexible rotation design, and high reliability.

[0014] In a possible implementation, each of the rotating shaft assemblies further includes a connecting pipe; the first end of the rotating shaft is connected to the first cold plate through the connecting pipe.

[0015] By setting up the connecting pipe, it can play a role of anti-torsion and transition at the same time. If the distance between the rotating shaft and the first cold plate is far, the connection performance can be ensured to avoid the problem of lack of communication between the rotating shaft and the first cold plate.

[0016] In a possible implementation, a pump body is provided on the connecting pipe, and the pump body is used to pump the refrigerant in the first cold plate into the second cold plate.

[0017] When a laptop computer is in use, the main unit is generally positioned lower than the display unit. The first cold plate is located inside the main unit, and the second cold plate is located inside the display unit. When the refrigerant in the first cold plate absorbs heat and flows into the second cold plate through the shaft assembly, the pump body can pump the refrigerant in the first cold plate into the second cold plate for heat dissipation and cooling, thereby avoiding refrigerant backflow.

[0018] In one possible implementation, the support frame includes a support frame body and an extension plate fixedly connected to the support frame body; the support frame body is respectively connected to the rotating shaft and the second cold plate, and the extension plate is fixedly connected to the display device. This can improve the connection strength and connection area between the support frame and the display device during the fixed connection, thereby preventing breakage between the support frame and the display device.

[0019] In a possible implementation, a first flow channel is provided inside the rotating shaft, a second flow channel is provided inside the support frame, and the first flow channel is communicated with the second flow channel.

[0020] By setting a first flow channel inside the rotating shaft and a second flow channel inside the support frame, and the first flow channel and the second flow channel are connected to each other, it can be ensured that the second end of the rotating shaft is connected to the second cold plate through the support frame, thereby ensuring the connection between the rotating shaft and the second cold plate.

[0021] In one possible implementation, the rotating shaft includes a first part and a second part connected to the first part; the first part is located outside the support frame, and the second part is located in the second flow channel inside the support frame; and the first part has an annular boss at one end close to the support frame.

[0022] By arranging an annular boss at one end of the first part of the rotating shaft close to the support frame, the contact area between the annular boss and the end face of the support frame facing the annular boss can be increased, thereby ensuring the connection strength and sealing performance when the rotating shaft and the support frame are connected.

[0023] In a possible implementation, the annular boss is welded to the end surface of the support frame facing the annular boss. The welding connection can greatly improve the connection strength and sealing performance between the rotating shaft and the support frame.

[0024] In one possible implementation, the second part includes a first section and a second section connected to the first section, the outer diameter of the first section is larger than the outer diameter of the second section; at least a portion of the outer periphery of the second section is provided with a sealing ring, and the sealing ring is used to make the outer wall of the second section fit tightly with the inner wall of the second flow channel.

[0025] The outer diameter of the first section of the second part of the rotating shaft in the second flow channel inside the support frame is greater than the outer diameter of the second section, and a sealing ring is provided on at least part of the outer periphery of the second section, so that the outer wall of the second section can fit tightly with the inner wall of the second flow channel, thereby realizing interference installation between the rotating shaft and the support frame and improving the sealing performance when the rotating shaft and the support frame are connected.

[0026] In a possible implementation, the first section has a recessed portion, and the second flow channel has a protruding portion at a position close to the first section, and the recessed portion cooperates with the protruding portion.

[0027] By providing a recessed portion on the first section of the second part of the rotating shaft and providing a protruding portion that cooperates with the recessed portion at a position close to the first section in the second flow channel of the support frame, it can be ensured that after the first section of the second part of the rotating shaft extends into the second flow channel of the support frame, no rotation occurs between the rotating shaft and the support frame, thereby ensuring the communication and fixed connection between the rotating shaft and the support frame.

[0028] In a possible implementation, the first cold plate includes: a first upper cover plate, a first lower cover plate, and a first side plate respectively connected to the first upper cover plate and the first lower cover plate, and the first upper cover plate, the first lower cover plate, and the first side plate form a first accommodating chamber for accommodating the refrigerant; the second cold plate includes: a second upper cover plate, a second lower cover plate, and a second side plate respectively connected to the second upper cover plate and the second lower cover plate; and the second upper cover plate, the second lower cover plate, and the second side plate form a second accommodating chamber for accommodating the refrigerant; the first accommodating chamber is communicated with the first flow channel, and the second accommodating chamber is communicated with the second flow channel.

[0029] In this way, a first accommodating cavity for accommodating refrigerant, which is enclosed by the first upper cover plate, the first lower cover plate, and the first side plate, is in communication with the first flow channel, thereby ensuring communication between the first cold plate and the rotating shaft. A second accommodating cavity for accommodating refrigerant, which is enclosed by the second upper cover plate, the second lower cover plate, and the second side plate, is in communication with the second flow channel, thereby ensuring communication between the second cold plate and the support frame.

[0030] In a possible implementation, the thickness of the first upper cover plate or the first lower cover plate is 0.05-0.1 mm; the thickness of the second upper cover plate or the second lower cover plate is 0.05-0.1 mm.

[0031] In a possible implementation, a plurality of first support columns are provided between the first upper cover plate and the first lower cover plate; and a plurality of second support columns are provided between the second upper cover plate and the second lower cover plate.

[0032] By disposing a first support column between the first upper cover plate and the first lower cover plate, the first support column can support the body of the first accommodating cavity, ensuring the unobstructed flow of the first accommodating cavity, while also improving the overall structural strength of the first cold plate. By disposing a second support column between the second upper cover plate and the second lower cover plate, the second support column can support the body of the second accommodating cavity, ensuring the unobstructed flow of the second accommodating cavity, while also improving the overall structural strength of the second cold plate.

[0033] In a possible implementation, the first cold plate is made of any one of titanium, titanium alloy, stainless steel, and aluminum alloy; the second cold plate is made of any one of titanium, titanium alloy, stainless steel, and aluminum alloy.

[0034] In a possible implementation, the support frame is made of any one of titanium, titanium alloy, stainless steel, and aluminum alloy.

[0035] In one possible implementation, the support frame and the second cold plate are integrally formed using a brazing process. This integral brazing process improves the structural strength of the connection between the support frame and the second cold plate, reducing the risk of breakage or damage at the connection between the support frame and the second cold plate.

[0036] A second aspect of an embodiment of the present application provides an electronic device, which includes at least: a host device, a display device, and any of the above-mentioned liquid cooling systems; a first cold plate in the liquid cooling system is located in the host device, and a second cold plate in the liquid cooling system is located in the display device; two ends of the first cold plate are respectively connected to two ends of the second cold plate through a rotating shaft assembly in the liquid cooling system; and the host device and the display device are rotatably connected through the rotating shaft assembly.

[0037] The electronic device provided in the embodiment of the present application is provided with the above-mentioned liquid cooling system in the electronic device. The liquid cooling system is located in the host device via the first cold plate, and the second cold plate is located in the display device. The first cold plate and the second cold plate each contain a refrigerant. The two ends of the first cold plate are respectively connected to the two ends of the second cold plate via the shaft assembly. The first cold plate, the second cold plate, and the shaft assembly form a circulation loop for the flow of the refrigerant. While having a good heat dissipation function, it can reduce the weight and volume of the shaft in the liquid cooling system, thereby reducing the overall weight and volume of the electronic device, thereby meeting the demand for ultra-light and thin electronic devices. This makes the electronic device easy to carry and improves the user experience.

[0038] These and other aspects, implementations, and advantages of the exemplary embodiments will become apparent from the embodiments described below in conjunction with the accompanying drawings. However, it should be understood that the description and drawings are for illustration only and do not constitute a definition of limitations on the embodiments of the present application, as detailed in the appended claims. Other aspects and advantages of the embodiments of the present application will be set forth in the following description, and in part will be apparent from the description or learned through practice of the embodiments of the present application. In addition, various aspects and advantages of the embodiments of the present application may be realized and obtained by the means and combinations particularly pointed out in the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] Figure 1 A schematic diagram of the structure of an electronic device provided in an embodiment of the present application;

[0040] Figure 2 Another structural diagram of an electronic device provided in an embodiment of the present application;

[0041] Figure 3 A schematic diagram of another structure of an electronic device provided in an embodiment of the present application;

[0042] Figure 4 A schematic diagram of the structure of the liquid cooling system provided in an embodiment of the present application;

[0043] Figure 5 A schematic structural diagram of a rotating shaft assembly of a liquid cooling system provided in an embodiment of the present application;

[0044] Figure 6 A schematic structural diagram of a rotating shaft of a rotating shaft assembly in a liquid cooling system provided in an embodiment of the present application;

[0045] Figure 7 Another structural schematic diagram of the shaft assembly of the liquid cooling system provided in an embodiment of the present application;

[0046] Figure 8A schematic structural diagram of a first cold plate of a liquid cooling system provided in an embodiment of the present application;

[0047] Figure 9 This is a schematic structural diagram of the second cold plate of the liquid cooling system provided in an embodiment of the present application.

[0048] Description of reference numerals:

[0049] 100-laptop; 1-liquid cooling system; 10-first cold plate; 101-first upper cover; 102-first lower cover; 103-first side plate; 104-first support column; 11-first accommodating chamber; 20-second cold plate; 201-second upper cover; 202-second lower cover; 203-second side plate; 204-second support column; 21-second accommodating chamber; 30-rotating shaft assembly; 31-rotating shaft; 311-first end; 312-second end; 313-second end A flow channel; 314-first part; 3141-annular boss; 315-second part; 3151-first section; 3152-recessed portion; 3153-second section; 3154-sealing ring; 32-support frame; 321-support frame body; 322-extension plate; 3221-first through hole; 323-second flow channel; 33-sleeve; 34-connecting pipe; 35-fastener; 2-display device; 2001-camera; 3-host device; 3001-central processing unit. DETAILED DESCRIPTION

[0050] The terms used in the implementation section of this application are only used to explain the specific embodiments of this application and are not intended to limit this application. The implementation of the embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0051] Electronic devices such as mobile phones and computers have become indispensable elements of our daily lives, even becoming an integral part of our lives. In recent years, consumers have placed increasingly high demands on the heat dissipation performance of electronic devices. Currently, most terminal and terminal-like products, such as laptops, rely on natural cooling to address this issue. However, since liquid cooling dissipates heat much faster than air, and liquids have a large heat capacity and a slow temperature rise, adopting liquid cooling can significantly improve the heat dissipation capabilities of terminal products.

[0052] It should be noted that liquid cooling involves using a pump to circulate coolant through a heat pipe or cold plate to dissipate heat. The heat-absorbing portion of the radiator (called a heat sink in a liquid cooling system) absorbs heat from the computer's central processing unit (CPU) and graphics card. The heat absorbed by the heat-absorbing portion is then discharged to the outside of the computer or transferred to another side through a radiator designed on the back of the computer. For example, cold plate liquid cooling, which uses coolant to circulate through a cold plate to dissipate heat, uses a working fluid as an intermediate heat transfer medium, transferring heat from a hot zone to a distant location for further cooling. In this technology, the working fluid is separated from the object being cooled and does not come into direct contact with the electronic device. Instead, the working fluid transfers heat from the object being cooled to the refrigerant through high-efficiency heat-conducting components such as the liquid cold plate. Therefore, cold plate liquid cooling is also known as indirect liquid cooling. This technology directs the coolant directly to the heat source. At the same time, since the specific heat of liquid is greater than that of air, the heat dissipation speed is much faster than that of air. Therefore, the cooling efficiency is much higher than air cooling. The heat transferred per unit volume, that is, the heat dissipation efficiency, is as high as 1000 times. It can effectively solve the heat dissipation problem of high-density servers, reduce the energy consumption of the cooling system and reduce noise.

[0053] In the prior art, the liquid cooling system in terminal products such as laptop computers typically includes liquid-cooled cold plates in the keyboard-side housing and the screen-side housing, respectively. The liquid cooling medium between the two liquid-cooled cold plates is connected via a liquid cooling pipe, which is wrapped around a mechanical shaft. This transfers heat from the keyboard side to the screen side, achieving overall heat dissipation for the laptop computer. However, the internal space of terminal products such as laptop computers is limited, and the liquid cooling system must be refined, that is, the volume of the liquid cooling cold plate or pipe must meet the requirements of being lightweight and thin. However, the method of wrapping the above-mentioned liquid cooling pipe around the mechanical shaft makes the shaft in the electronic device bulky, thereby increasing the overall mass of the electronic device or curved screen device. This cannot meet the current demand for ultra-light and thin electronic products, making it difficult to carry and reducing the user's comfort.

[0054] Based on this, the embodiment of the present application provides an electronic device, and takes a laptop computer 100 as an example for explanation. Figure 1 and Figure 2 As shown, the laptop computer 100 may include at least a host device 3 and a display device 2, wherein the host device 3 and the display device 2 are rotatably connected via a hinge assembly 30. Thus, the host device 3 and the display device 2 can each rotate about the hinge assembly 30, so that the ends of the host device 3 and the display device 2 away from the hinge assembly 30 can be relatively close to or relatively far apart, thereby allowing the laptop computer 100 to assume different states, such as a folded state and an unfolded state.

[0055] Reference Figure 3 As shown, the laptop computer 100 may further include: a liquid cooling system 1, wherein the first cold plate 10 in the liquid cooling system 1 may be located in the host device 3, the second cold plate 20 in the liquid cooling system 1 may be located in the display device 2, and both ends of the first cold plate 10 may be connected to both ends of the second cold plate 20 via a rotating shaft assembly 30 in the liquid cooling system 1. For example, Figure 3 In the embodiment, the first cold plate 10 and the second cold plate 20 are connected via two rotating shaft assemblies 30 .

[0056] The components inside the notebook computer 100, such as the main circuit board, the central processing unit 3001 (see Figure 3 As shown), memory and camera 2001 (see Figure 1 ), etc., can be fixed to the host device 3 or the display device 2, respectively. For example, the main circuit board, central processing unit 3001, and memory and other components can be arranged inside the host device 3, while the display device 2 can be used to carry components such as the camera 2001. The host device 3 can include a keyboard-side housing and the main circuit board, central processing unit 3001, and memory and other components arranged inside the keyboard-side housing. The keyboard can be located on the keyboard-side housing. The display device 2 can include a display-side housing and a display screen, which is located on one side of the display-side housing. The host device 3 and the display device 2 can be connected to the keyboard-side housing and the display-side housing respectively via a hinge assembly 30 to achieve rotational connection.

[0057] It should be noted that if Figure 3 As shown, the central processing unit 3001 is located in the host device 3, and heat is easily generated in the host device 3. By arranging a first cold plate 10 in the host device 3 and the first cold plate 10 is in contact with the central processing unit 3001, the heat generated by the central processing unit 3001 can be transferred to the first cold plate 10. The first cold plate 10 and the second cold plate 20 can contain refrigerant. The refrigerant in the first cold plate 10 that absorbs heat flows into the second cold plate 20 in the display device 2 through the hinge assembly 30. After the second cold plate 20 dissipates heat, the temperature drops and then flows back to the first cold plate 10 in the host device 3 through another hinge assembly 30. This cycle is repeated to dissipate heat.

[0058] It should be understood that the illustrated structure of the embodiments of the present application does not constitute a specific limitation on the laptop computer 100. In other embodiments of the present application, the laptop computer 100 may include more or fewer components than shown, or may combine or separate certain components, or have different component arrangements. The illustrated components may be implemented in hardware, software, or a combination of software and hardware.

[0059] Based on the above description, the specific structure and working principle of the liquid cooling system 1 in the laptop computer 100 are introduced below.

[0060] The liquid cooling system 1 provided in the embodiment of the present application is applied to an electronic device. Taking a laptop computer 100 as an example, the laptop computer 100 may include a display device 2 and a host device 3 rotatably connected to the display device 2, wherein Figure 3 As shown, the liquid cooling system 1 may include: a first cold plate 10 , a second cold plate 20 and at least two rotating shaft assemblies 30 . The first cold plate 10 is located in the host device 3 , and the second cold plate 20 is located in the display device 2 .

[0061] like Figure 3 As shown, the CPU 3001 is located within the host device 3 and in contact with the CPU 3001. The first cold plate 10 and the second cold plate 20 can contain refrigerant. The two ends of the first cold plate 10 are connected to the two ends of the second cold plate 20 via the shaft assembly 30. The first cold plate 10, the second cold plate 20, and the shaft assembly 30 form a circulation loop for the refrigerant to flow.

[0062] Since the CPU 3001 easily generates heat in the host device 3, by setting a first cold plate 10 in the host device 3 and the first cold plate 10 is in contact with the CPU 3001, the heat generated by the CPU 3001 can be transferred to the first cold plate 10. The first cold plate 10 can contain a refrigerant. Figure 3 As shown by the curved arrow in FIG, the refrigerant after absorbing heat flows into the second cold plate 20 in the display device 2 through the rotating shaft assembly 30. After the second cold plate 20 dissipates heat, the refrigerant with a lowered temperature flows back to the first cold plate 10 in the host device 3 through another rotating shaft assembly 30. The refrigerant circulates back and forth in the circulation loop formed by the first cold plate 10, the second cold plate 20 and the rotating shaft assembly 30, thereby achieving the heat dissipation effect.

[0063] In this way, while the laptop computer 100 has its own good heat dissipation function, the embodiment of the present application can reduce the weight and volume of the hinge assembly 30 in the liquid cooling system 1 compared to the prior art, thereby meeting the demand for ultra-light and thin laptop computer 100, making the laptop computer 100 easy to carry and optimizing the experience effect of the laptop computer 100.

[0064] In the embodiment of the present application, each shaft assembly 30 may include at least: a shaft 31, wherein a first end 311 of the shaft 31 (see Figure 5 As shown) can be connected to the first cold plate 10, and the shaft 31 is connected to the host device 3 for relative rotation, and the second end 312 of the shaft 31 (see Figure 5As shown, the first cold plate 10 is connected to the second cold plate 20, and the rotating shaft 31 is fixedly connected to the display device 2. Thus, the two ends of the first cold plate 10 can be connected to the two ends of the second cold plate 20 via the rotating shaft 31, and the host device 3 and the display device 2 are rotatably connected via the rotating shaft 31. The rotating shaft 31 combines mechanical rotation and heat dissipation functions in one, resulting in a fine overall structure that meets the requirements of a lightweight and thin design and provides better heat dissipation than the existing technology.

[0065] like Figure 4 and Figure 5 As shown, each shaft assembly 31 30 may further include a support frame 32, wherein the second end 312 of the shaft 31 is fixedly connected to the support frame 32, and the second end 312 of the shaft 31 is connected to the second cold plate 20 via the support frame 32, and the support frame 32 is fixedly connected to the display device 2. The two ends of the first cold plate 10 are connected to the two ends of the second cold plate 20 via the shaft 31 and the support frame 32, respectively, the support frame 32 is fixedly connected to the display device 2, the shaft 31 is fixedly connected to the support frame 32, and the shaft 31 is connected to the host device 3 for relative rotation, ensuring the rotation function between the host device 3 and the display device 2. Moreover, the fixed connection to the display device 2 via the support frame 32 is more stable and reliable than the fixed connection to the display device 2 via the shaft 31.

[0066] Specifically, when the second end 312 of the rotating shaft 31 is connected to the second cold plate 20 through the support frame 32, refer to Figure 5 As shown, the interior of the rotating shaft 31 may have a first flow channel 313, and the interior of the support frame 32 may have a second flow channel 323, and the first flow channel 313 and the second flow channel 323 are interconnected. By providing the first flow channel 313 for circulating the refrigerant inside the rotating shaft 31 and the second flow channel 323 for circulating the refrigerant inside the support frame 32, and by interconnecting the first flow channel 313 and the second flow channel 323, it is possible to ensure that the second end 312 of the rotating shaft 31 can communicate with the second cold plate 20 through the support frame 32, thereby ensuring the connection between the rotating shaft 31 and the second cold plate 20.

[0067] In one possible implementation, the material of the support frame 32 can be any one of titanium, titanium alloy, stainless steel, aluminum alloy, etc. Of course, in other embodiments, the support frame 32 can also be made of other materials. The embodiment of the present application does not limit the material of the support frame 32, nor is it limited to the above example.

[0068] In an embodiment of the present application, the support frame 32 and the second cold plate 20 can be integrally formed using a brazing process. The brazing process refers to a welding method in which a brazing material below the melting point of the weldment and the weldment are simultaneously heated to the melting temperature of the brazing material, and the gap between the solid workpieces is filled with liquid brazing material to connect the metals. Specifically, when brazing, the oxide film and oil stains on the contact surface of the base material must first be removed to facilitate the capillary to function after the brazing material melts, thereby increasing the wettability and capillary fluidity of the brazing material. By integrally forming the support frame 32 and the second cold plate 20 using a brazing process, the structural strength of the connection between the support frame 32 and the second cold plate 20 can be improved, and the risk of problems such as breakage or damage at the connection position between the support frame 32 and the second cold plate 20 can be reduced.

[0069] In the embodiment of the present application, each shaft 31 assembly 30 may further include: a sleeve 33, wherein, as Figure 4 or Figure 5 As shown, the sleeve 33 is fixedly connected to the host device 3, and the sleeve 33 is sleeved on the rotating shaft 31 and is rotatably arranged with the rotating shaft 31. By providing the sleeve 33, the sleeve 33 is fixedly connected to the host device 3, and the sleeve 33 is rotatably arranged with the rotating shaft 31. The sleeve 33 is sleeved on the rotating shaft 31 and is rotatably connected to the rotating shaft 31. Compared with the relative rotation connection between the rotating shaft 31 and the host device 3, the operation is strong, the feasibility is strong, the rotation design is more flexible, and the reliability is high.

[0070] Continue to refer to the attached Figure 4 Each shaft assembly 31 may further include a connecting pipe 34, wherein the first end 311 of the shaft 31 is connected to the first cold plate 10 via the connecting pipe 34. The connecting pipe 34 not only prevents torsional movement but also acts as a transition. If the shaft 31 is far from the first cold plate 10, the connecting pipe 34 ensures connection performance and avoids the problem of communication failure between the shaft 31 and the first cold plate 10.

[0071] It is understood that when the first end 311 of the rotating shaft 31 is connected to the connecting pipe 34, a mechanical interference fit can be used to ensure the sealing performance between the rotating shaft 31 and the connecting pipe 34, thereby preventing the refrigerant from leaking from the connection between the rotating shaft 31 and the connecting pipe 34. Figure 4 As shown, in order to further ensure the connection strength between the rotating shaft 31 and the connecting pipe 34 , the rotating shaft 31 and the connecting pipe 34 can be fixedly connected by a fastener 35 .

[0072] In one possible implementation, the connecting pipe 34 is a flexible and bendable hose. This allows for greater flexibility and improved design in the connection between the first cold plate 10 and the rotating shaft 31. For example, the connecting pipe 34 can be a metal hose or a rubber hose. It should be noted that the present embodiment does not impose any restrictions on the material of the connecting pipe 34, nor is it limited to the above examples.

[0073] In some embodiments, a pump (not shown) may be further provided on the connecting pipe 34 to pump the refrigerant within the first cold plate 10 into the second cold plate 20. During use of the laptop computer 100, the host device 3 is generally positioned lower than the display device 2. The first cold plate 10 is located within the host device 3, and the second cold plate 20 is located within the display device 2. When the refrigerant, which has absorbed heat within the first cold plate 10, flows through the rotating shaft assembly 30 into the second cold plate 20, the pump circulates the refrigerant within the first cold plate 10 into the second cold plate 20 for heat dissipation and cooling, thereby preventing refrigerant backflow.

[0074] In the embodiments of this application, Figure 4 As shown, the support frame 32 may include a support frame body 321 and an extension plate 322. The extension plate 322 is fixedly connected to the support frame body 321. The support frame body 321 is respectively connected to the rotating shaft 31 and the second cold plate 20. The extension plate 322 is fixedly connected to the display device 2. This can improve the connection strength and connection area between the support frame 32 and the display device 2 during the fixed connection, and prevent the support frame 32 and the display device 2 from breaking.

[0075] In one possible implementation, the extension plate 322 may have at least one first through hole 3221, and the outer shell of the display device 2 (for example, the display device 2) may have at least one second through hole (not shown in the figure), and the display device 2 and the extension plate 322 may be threadedly connected by bolts (not shown in the figure) passing through the first through hole 3221 and the second through hole.

[0076] In another possible implementation, the extension plate 322 may have at least one first through hole 3221, and the outer shell of the display device 2 (for example, the display device 2) may have at least one second through hole (not shown in the figure), and the first through hole 3221 and the second through hole are used for positioning, and the display device 2 and the extension plate 322 are bonded and connected.

[0077] Of course, in other embodiments, the display device 2 and the extension plate 322 may be connected by other detachable means, such as a pin connection or a snap connection. The present embodiment does not limit the specific structure of the detachable connection, nor is it limited to the above example. Furthermore, the display device 2 and the extension plate 322 may be connected by a non-detachable means, such as where both the connection end of the display device 2 and the connection end of the extension plate 322 are made of metal and the two are connected by welding.

[0078] like Figure 5 As shown, the rotating shaft 31 may include a first portion 314 and a second portion 315 connected to the first portion 314, wherein the first portion 314 is located outside the support frame 32, the second portion 315 is located in the second flow channel 323 inside the support frame 32, and the end of the first portion 314 close to the support frame 32 has an annular boss 3141 (see Figure 6 By providing an annular boss 3141 at one end of the first portion 314 of the rotating shaft 31 close to the support frame 32, the contact area between the annular boss 3141 and the end surface of the support frame 32 facing the annular boss 3141 can be increased, thereby ensuring the connection strength and sealing performance when the rotating shaft 31 and the support frame 32 are connected.

[0079] As an optional embodiment, the annular boss 3141 and the end surface of the support frame 32 facing the annular boss 3141 can be connected by welding. The welding connection can greatly improve the connection strength and sealing between the rotating shaft 31 and the support frame 32.

[0080] In the embodiment of the present application, after the rotating shaft 31 is inserted into the support frame 32 , the annular boss 3141 and the end surface of the support frame 32 facing the annular boss 3141 can be welded and sealed, for example, by using laser welding.

[0081] Reference Figure 7 As shown, the second portion 315 may include a first section 3151 and a second section 3153 connected to the first section 3151. The outer diameter of the first section 3151 is larger than the outer diameter of the second section 3153. A sealing ring 3154 is provided on at least a portion of the outer periphery of the second section 3153. The sealing ring 3154 is used to tightly fit the outer wall of the second section 3153 against the inner wall of the second flow channel 323. The outer diameter of the first section 3151 of the second portion 315 located within the second flow channel 323 within the support frame 32 via the rotating shaft 31 is larger than the outer diameter of the second section 3153. The sealing ring 3154 is provided on at least a portion of the outer periphery of the second section 3153. This allows the outer wall of the second section 3153 to tightly fit against the inner wall of the second flow channel 323, achieving an interference fit between the rotating shaft 31 and the support frame 32 and improving the sealing performance when the rotating shaft 31 and the support frame 32 are connected.

[0082] The sealing ring 3154 can be directly mounted on the outer periphery of the first section 3151 of the second portion 315 of the rotating shaft 31, or can be formed on the outer periphery of the first section 3151 of the second portion 315 of the rotating shaft 31 by insert molding. Insert molding refers to a molding process in which a pre-prepared insert of a different material is placed in a mold, resin is injected, and the molten material bonds with the insert and solidifies to form an integrated product.

[0083] In a possible implementation, the first section 3151 may have a recessed portion 3152 (see Figure 6 The second flow channel 323 may have a protrusion (not shown) near the first section 3151, and the recess 3152 may cooperate with the protrusion. By providing the recess 3152 on the first section 3151 of the second portion 315 of the rotating shaft 31 and providing a protrusion that cooperates with the recess 3152 near the first section 3151 in the second flow channel 323 of the support frame 32, it is possible to ensure that after the first section 3151 of the second portion 315 of the rotating shaft 31 extends into the second flow channel 323 of the support frame 32, the rotating shaft 31 and the support frame 32 will not rotate, thereby ensuring communication and a fixed connection between the rotating shaft 31 and the support frame 32.

[0084] Based on the above description, the connection between the rotating shaft 31 and the support frame 32 is described below. Specifically, the connection between the rotating shaft 31 and the support frame 32 includes but is not limited to the following three possible implementations:

[0085] The first possible implementation is: Figure 5 As shown, the first portion 314 of the rotating shaft 31 located outside the support frame 32 has an annular boss 3141 at one end close to the support frame 32, and the annular boss 3141 is connected to the end surface of the support frame 32 facing the annular boss 3141 by welding.

[0086] The second possible implementation is: Figure 7 As shown, the outer diameter of the first section 3151 of the second part 315 of the rotating shaft 31 in the second flow channel 323 inside the support frame 32 is greater than the outer diameter of the second section 3153, and a sealing ring 3154 is provided on at least part of the outer periphery of the second section 3153. The outer wall of the second section 3153 fits tightly with the inner wall of the second flow channel 323, and an interference fit is achieved between the rotating shaft 31 and the support frame 32.

[0087] Reference Figure 8As shown, in the embodiment of the present application, the first cold plate 10 may include: a first upper cover plate 101, a first lower cover plate 102, and a first side plate 103, wherein the first side plate 103 is a circumferential side plate, and the first side plate 103 is connected to the first upper cover plate 101 and the first lower cover plate 102 respectively, and the first upper cover plate 101, the first lower cover plate 102, and the first side plate 103 together form a first accommodating chamber 11 for accommodating refrigerant, and the first accommodating chamber 11 is connected to the first flow channel 313. In this way, the first accommodating chamber 11 for accommodating refrigerant, which is jointly formed by the first upper cover plate 101, the first lower cover plate 102, and the first side plate 103, is connected to the first flow channel 313, which can ensure the communication between the first cold plate 10 and the rotating shaft 31.

[0088] Similarly, refer to Figure 9 As shown, the second cold plate 20 may include: a second upper cover plate 201, a second lower cover plate 202, and a second side plate 203, wherein the second side plate 203 is a circumferential side plate and is connected to the second upper cover plate 201 and the second lower cover plate 202, respectively. The second upper cover plate 201, the second lower cover plate 202, and the second side plate 203 enclose a second accommodating chamber 21 for accommodating refrigerant, and the second accommodating chamber 21 is connected to the second flow channel 323. In this way, the second accommodating chamber 21 for accommodating refrigerant, which is enclosed by the second upper cover plate 201, the second lower cover plate 202, and the second side plate 203, is connected to the second flow channel 323, thereby ensuring communication between the second cold plate 20 and the support frame 32.

[0089] It should be noted that in the embodiment of the present application, the material of the first cold plate 10 can be any one of titanium, titanium alloy, stainless steel, and aluminum alloy, and the material of the second cold plate 20 can be any one of titanium, titanium alloy, stainless steel, and aluminum alloy. Of course, in other embodiments, the first cold plate 10 and the second cold plate 20 can also be made of other materials. The embodiment of the present application does not limit the materials of the first cold plate 10 and the second cold plate 20, nor is it limited to the above examples.

[0090] As an optional embodiment, the thickness of the first upper cover plate 101 or the first lower cover plate 102 can be 0.05-0.1 mm. For example, the thickness of the first upper cover plate 101 or the first lower cover plate 102 can be 0.05 mm, 0.06 mm, 0.07 mm, etc. This embodiment of the present application is not limited to this, nor is it limited to the above example. Similarly, the thickness of the second upper cover plate 201 or the second lower cover plate 202 can also be 0.05-0.1 mm. For example, the thickness of the second upper cover plate 201 or the second lower cover plate 202 can be 0.05 mm, 0.06 mm, 0.07 mm, etc. This embodiment of the present application is not limited to this, nor is it limited to the above example.

[0091] Reference Figure 8As shown, a plurality of first support columns 104 may be further provided between the first upper cover plate 101 and the first lower cover plate 102. By providing the first support columns 104 between the first upper cover plate 101 and the first lower cover plate 102, the first support columns 104 can support the body of the first accommodating cavity 11, ensuring unobstructed access to the first accommodating cavity 11, while also improving the overall structural strength of the first cold plate 10.

[0092] As an optional embodiment, the height of the first support column 104 can be 0.2-0.6 mm. For example, the height of the first support column 104 can be 0.3 mm, 0.4 mm, 0.5 mm, etc. The embodiment of the present application is not limited to this and is not limited to the above examples.

[0093] Similarly, refer to Figure 9 As shown, a plurality of second support columns 204 can be provided between the second upper cover plate 201 and the second lower cover plate 202. By providing the second support columns 204 between the second upper cover plate 201 and the second lower cover plate 202, the second support columns 204 can support the second accommodating cavity 21, ensuring the unobstructed flow of the second accommodating cavity 21, while also improving the overall structural strength of the second cold plate 20.

[0094] As an optional embodiment, the height of the second support column 204 can be 0.2-0.6 mm. For example, the height of the second support column 204 can be 0.3 mm, 0.4 mm, 0.5 mm, etc. The embodiment of the present application is not limited to this and is not limited to the above examples.

[0095] Based on the above description, this application describes the structure and material composition of the liquid cooling system 1 in combination with specific scenarios, as follows:

[0096] Scene 1

[0097] In this scenario, the rotating shaft 31, the support frame 32, and the second cold plate 20 are all made of stainless steel. The rotating shaft 31 and the support frame 32 can be formed by metal injection molding (MIM), computer numerical control machine tools (CNC), and additive manufacturing (AM).

[0098] Among them, metal injection molding refers to a molding method in which a plasticized mixture of metal powder and its binder is injected into a mold. It is a new type of powder metallurgy near-net molding technology derived from the plastic injection molding industry. Plastic injection molding technology can produce products of various complex shapes at a low price, but the strength of plastic products is not high. Therefore, in order to improve its performance, metal or ceramic powder can be added to the plastic to obtain products with higher strength and good wear resistance.

[0099] Computer numerically controlled (CNC) machine tools, also known as CNC milling machines, are a more precise milling process. They are controlled by digital signals from an electronic computer. The surface shapes machined by a milling machine are generally composed of straight lines, arcs, or other curves. Conventional milling machine operators continuously change the relative position between the tool and the workpiece according to the drawing requirements. This, combined with the selected milling cutter speed, allows the tool to cut the workpiece, resulting in a variety of workpiece shapes. However, CNC machine tool processing divides the coordinates of the tool and workpiece into the smallest units, or minimum displacements. The CNC system then moves each coordinate by a certain number of minimum displacements, as specified by the workpiece program, thereby achieving relative motion between the tool and workpiece to complete the part machining.

[0100] Additive manufacturing, also known as 3D printing, is a manufacturing technology that integrates computer-aided design, material processing, and molding technologies. Based on digital model files, software and numerical control systems are used to build up specialized metals, non-metallic materials, and biomedical materials layer by layer through methods such as extrusion, sintering, melting, photocuring, and spraying to create physical objects. Unlike traditional processing methods that involve removing, cutting, and assembling raw materials, this method uses a "bottom-up" approach to manufacturing through the accumulation of materials.

[0101] It should be noted that the embodiment of the present application does not limit the molding method of the rotating shaft 31 and the support frame 32, nor is it limited to the above examples.

[0102] The second cold plate 20 can be processed using etching or stamping. Etching is a semiconductor manufacturing process, a key patterning process associated with photolithography. It is essentially photolithographic etching, where the photoresist is first exposed to light by photolithography, and then the desired portion is etched away by other methods. Etching is the process of selectively removing unwanted material from the silicon wafer surface using chemical or physical methods. Its primary goal is to accurately replicate the mask pattern on the coated silicon wafer. With the advancement of microfabrication, etching has become a processing method for stripping and removing materials using solutions, reactive ions, or other mechanical methods.

[0103] Stamping is a metal processing method based on the plastic deformation of metal. It uses molds and stamping equipment to apply pressure to the sheet material to cause plastic deformation or separation of the sheet material, thereby obtaining parts (stamping parts) with a certain shape, size and performance.

[0104] It should be noted that the embodiment of the present application does not limit the processing method of the second cold plate 20 and is not limited to the above example.

[0105] In this scenario, the connection between the shaft 31 and the support frame 32 is as follows Figure 5 As shown, the first portion 314 of the rotating shaft 31, located outside the support frame 32, has an annular boss 3141 at one end thereof, which is close to the support frame 32. The annular boss 3141 is welded to the end surface of the support frame 32 facing the annular boss 3141. This increases the contact area between the annular boss 3141 and the end surface of the support frame 32 facing the annular boss 3141, thereby ensuring sealing performance when the rotating shaft 31 and the support frame 32 are connected, and greatly improving the connection strength between the rotating shaft 31 and the support frame 32 when connected.

[0106] The support frame 32 and the second cold plate 20 can be integrally formed using a brazing process. Brazing involves simultaneously heating a brazing filler metal (lower than the melting point of the workpiece) and the workpiece to the melting point of the filler metal. Liquid filler metal then fills the gap between the solid workpieces, creating a metal-to-metal connection. Specifically, during brazing, the oxide film and oil stains on the contact surface of the parent metal must first be removed to facilitate capillary action after the filler metal melts, thereby increasing the filler metal's wettability and capillary flow.

[0107] By integrally forming the support frame 32 and the second cold plate 20 through a brazing process, the structural strength of the connection between the support frame 32 and the second cold plate 20 is enhanced, reducing the risk of breakage or damage at the connection between the support frame 32 and the second cold plate 20. Specifically, the support frame 32 and the second cold plate 20 are both made of stainless steel and are brazed together in a furnace using a nickel-based solder.

[0108] Scene 2

[0109] In this scenario, the shaft 31, support frame 32, and second cold plate 20 are all made of stainless steel. The shaft 31 and support frame 32 can be formed using methods such as metal injection molding (MIM), computer numerical control (CNC), and additive manufacturing (AM). The second cold plate 20 can be processed using etching or stamping.

[0110] The support frame 32 and the second cold plate 20 can be integrally formed using a brazing process. This process improves the structural strength of the connection between the support frame 32 and the second cold plate 20 and reduces the risk of breakage or damage at the connection between the support frame 32 and the second cold plate 20. Specifically, when both the support frame 32 and the second cold plate 20 are made of stainless steel, the support frame 32 and the second cold plate 20 are brazed together in a furnace, and the solder can be nickel-based solder or copper-based solder.

[0111] The difference from the above scenario is that the connection between the shaft 31 and the support frame 32 in this scenario is as follows: Figure 7 As shown, the outer diameter of the first section 3151 of the second portion 315 of the rotating shaft 31, located within the second flow channel 323 within the support frame 32, is greater than the outer diameter of the second section 3153. A sealing ring 3154 is provided on at least a portion of the outer circumference of the second section 3153. This allows the outer wall of the second section 3153 to fit tightly against the inner wall of the second flow channel 323, achieving an interference fit between the rotating shaft 31 and the support frame 32 and improving the sealing performance when the rotating shaft 31 and the support frame 32 are in communication.

[0112] Scene 3

[0113] In this scenario, the shaft 31 is made of stainless steel, and the support frame 32 and the second cold plate 20 are made of titanium or a titanium alloy. The shaft 31 and the support frame 32 can be formed by metal injection molding (MIM), computer numerical control (CNC), additive manufacturing (AM), etc. The second cold plate 20 can be processed by etching or stamping.

[0114] In this scenario, the connection between the shaft 31 and the support frame 32 is as follows Figure 7 As shown, the outer diameter of the first section 3151 of the second portion 315 of the rotating shaft 31, located within the second flow channel 323 within the support frame 32, is greater than the outer diameter of the second section 3153. A sealing ring 3154 is provided on at least a portion of the outer circumference of the second section 3153. This allows the outer wall of the second section 3153 to fit tightly against the inner wall of the second flow channel 323, achieving an interference fit between the rotating shaft 31 and the support frame 32 and improving the sealing performance when the rotating shaft 31 and the support frame 32 are in communication.

[0115] The support frame 32 and the second cold plate 20 can be integrally formed by a brazing process. By using the brazing process to integrally form the support frame 32 and the second cold plate 20, the structural strength of the connection between the support frame 32 and the second cold plate 20 can be improved, and the risk of breakage or damage at the connection position between the support frame 32 and the second cold plate 20 can be reduced.

[0116] Different from the above scenario 2, the support frame 32 and the second cold plate 20 are both made of titanium or titanium alloy. The support frame 32 and the second cold plate 20 are brazed together in a furnace, and the brazing material can be titanium-based brazing material.

[0117] Scene 4

[0118] In this scenario, the rotating shaft 31 and the support frame 32 are made of stainless steel, and the second cold plate 20 is made of titanium or titanium alloy. The rotating shaft 31 and the support frame 32 can be formed by metal injection molding (MIM), computer numerical control machine tools (CNC), and additive manufacturing (AM).

[0119] In this scenario, the connection between the shaft 31 and the support frame 32 is as follows Figure 5 As shown, the first portion 314 of the rotating shaft 31, located outside the support frame 32, has an annular boss 3141 at one end thereof, which is close to the support frame 32. The annular boss 3141 is welded to the end surface of the support frame 32 facing the annular boss 3141. This increases the contact area between the annular boss 3141 and the end surface of the support frame 32 facing the annular boss 3141, thereby ensuring sealing performance when the rotating shaft 31 and the support frame 32 are connected, and greatly improving the connection strength between the rotating shaft 31 and the support frame 32 when connected.

[0120] The support frame 32 and the second cold plate 20 can be integrally formed by a brazing process. By using the brazing process to integrally form the support frame 32 and the second cold plate 20, the structural strength of the connection between the support frame 32 and the second cold plate 20 can be improved, and the risk of breakage or damage at the connection position between the support frame 32 and the second cold plate 20 can be reduced.

[0121] It should be noted that in this scenario, the support frame 32 is made of stainless steel and the second cold plate 20 is made of titanium or titanium alloy. Before the support frame 32 and the second cold plate 20 are put into the furnace for brazing, it is necessary to first copper-plate the surface of the support frame 32, then nickel-plate the surface of the copper, and then apply titanium-based brazing filler metal on the surface of the nickel, and then put the support frame 32 and the second cold plate 20 into the furnace for brazing.

[0122] Nickel plating before applying the titanium-based brazing filler metal serves to isolate the stainless steel material of the support frame 32 from the titanium or titanium alloy material of the second cold plate 20. This prevents chemical reactions between the two materials during the furnace brazing process, which could result in a brittle metal compound and potentially fracture. Copper plating before nickel plating ensures operability of the nickel plating process on the support frame 32, increases surface adhesion between the nickel layer and the support frame 32, and prevents separation of the nickel layer from the stainless steel.

[0123] Specifically, in the embodiment of the present application, an electroplating process can be used to electroplate copper on the surface of the support frame 32, and then nickel can be electroplated on the surface of the copper. Electroplating refers to the process of plating a thin layer of other metals or alloys on the surface of a metal using the principle of electrolysis. During electroplating, the plating metal or other insoluble material acts as the anode, and the workpiece to be plated acts as the cathode. The cations of the plating metal are reduced on the surface of the workpiece to be plated to form a coating. The purpose of electroplating is to plate a metal coating on the substrate to change the surface properties or size of the substrate. For example, copper plating is used as a base to enhance the adhesion of the electroplated layer. Nickel plating is used as a base or to achieve an aesthetically pleasing appearance, enhance corrosion resistance and wear resistance, etc.

[0124] Scene 5

[0125] In this scenario, the rotating shaft 31 and the support frame 32 are made of stainless steel, and the second cold plate 20 is made of titanium or titanium alloy. The rotating shaft 31 and the support frame 32 can be formed by metal injection molding (MIM), computer numerical control machine tools (CNC), and additive manufacturing (AM).

[0126] The support frame 32 and the second cold plate 20 can be integrally formed by a brazing process. By using the brazing process to integrally form the support frame 32 and the second cold plate 20, the structural strength of the connection between the support frame 32 and the second cold plate 20 can be improved, and the risk of breakage or damage at the connection position between the support frame 32 and the second cold plate 20 can be reduced.

[0127] It should be noted that in this scenario, the support frame 32 is made of stainless steel and the second cold plate 20 is made of titanium or titanium alloy. Before the support frame 32 and the second cold plate 20 are put into the furnace for brazing, it is necessary to first copper-plate the surface of the support frame 32, then nickel-plate the surface of the copper, and then apply titanium-based brazing filler metal on the surface of the nickel, and then put the support frame 32 and the second cold plate 20 into the furnace for brazing.

[0128] Nickel plating before applying the titanium-based brazing filler metal serves to isolate the stainless steel material of the support frame 32 from the titanium or titanium alloy material of the second cold plate 20, preventing chemical reactions between the two materials during the furnace brazing process. Copper plating before nickel plating ensures operability of nickel plating on the support frame 32, increases surface adhesion between the nickel layer and the support frame 32, and prevents detachment of the nickel layer from the stainless steel.

[0129] Specifically, in the embodiment of the present application, an electroplating process can be used to electroplate copper on the surface of the support frame 32, and then nickel can be electroplated on the surface of the copper. Electroplating refers to the process of plating a thin layer of other metals or alloys on the surface of a metal using the principle of electrolysis. During electroplating, the plating metal or other insoluble material acts as the anode, and the workpiece to be plated acts as the cathode. The cations of the plating metal are reduced on the surface of the workpiece to be plated to form a coating. The purpose of electroplating is to plate a metal coating on the substrate to change the surface properties or size of the substrate. For example, copper plating is used as a base to enhance the adhesion of the electroplated layer. Nickel plating is used as a base or to achieve an aesthetically pleasing appearance, enhance corrosion resistance and wear resistance, etc.

[0130] The difference from the above scenario 4 is that the connection between the shaft 31 and the support frame 32 in this scenario is as follows: Figure 7 As shown, the outer diameter of the first section 3151 of the second portion 315 of the rotating shaft 31, located within the second flow channel 323 within the support frame 32, is greater than the outer diameter of the second section 3153. A sealing ring 3154 is provided on at least a portion of the outer circumference of the second section 3153. This allows the outer wall of the second section 3153 to fit tightly against the inner wall of the second flow channel 323, achieving an interference fit between the rotating shaft 31 and the support frame 32 and improving the sealing performance when the rotating shaft 31 and the support frame 32 are in communication.

[0131] In the description of the embodiments of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they may refer to a fixed connection, an indirect connection via an intermediate medium, internal communication between two components, or an interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in the embodiments of this application based on specific circumstances.

[0132] In the embodiments of the present application, any device or element referred to or implied must have a specific orientation, be constructed and operate in a specific orientation, and therefore should not be understood as limiting the embodiments of the present application. In the description of the embodiments of the present application, the meaning of "plurality" is two or more, unless otherwise specifically specified.

[0133] The terms "first", "second", "third", "fourth", etc. (if any) in the specification and claims of the embodiments of the present application and the above-mentioned drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequential order. It should be understood that the data used in this way can be interchangeable where appropriate, so that the embodiments of the embodiments of the present application described herein can, for example, be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device comprising a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0134] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the embodiments of the present application, rather than to limit them. Although the embodiments of the present application have been described in detail with reference to the aforementioned embodiments, ordinary technicians in this field should understand that they can still modify the technical solutions recorded in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. These modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A liquid cooling system for an electronic device comprising a display device and a host device rotatably connected to the display device, characterized in that: include: a first cold plate, a second cold plate, and at least two rotating shaft assemblies; The first cold plate is located in the host device, and the second cold plate is located in the display device; The first cold plate and the second cold plate both contain refrigerant, and two ends of the first cold plate are connected to two ends of the second cold plate through the rotating shaft assembly, and the first cold plate, the second cold plate and the rotating shaft assembly form a circulation loop for the refrigerant to flow; Each of the rotating shaft components at least includes: a rotating shaft and a support frame; The rotating shaft has a first flow channel inside, the support frame has a second flow channel inside, and the first flow channel is connected to the second flow channel; The rotating shaft includes a first portion and a second portion connected to the first portion; the first portion is located outside the support frame, and the second portion is located inside the support frame; and the first portion has an annular boss welded to the support frame at one end close to the support frame; The annular boss is welded to the end surface of the support frame facing the annular boss; The second portion includes a first section, the first section has a recessed portion, the second flow channel has a protruding portion at a position close to the first section, and the recessed portion matches the protruding portion.

2. The liquid cooling system according to claim 1, characterized in that The first end of the rotating shaft is in communication with the first cold plate, and the rotating shaft is rotatably connected to the host device; The second end of the rotating shaft is communicated with the second cold plate, and the rotating shaft is fixedly connected to the display device.

3. The liquid cooling system according to claim 2, characterized in that: The second end of the rotating shaft is fixedly connected to the support frame, and the second end of the rotating shaft is connected to the second cold plate through the support frame; The support frame is fixedly connected to the display device.

4. The liquid cooling system according to claim 3, characterized in that: Each of the rotating shaft assemblies further includes: a shaft sleeve, the shaft sleeve being fixedly connected to the host device; The shaft sleeve is sleeved on the rotating shaft and the shaft sleeve and the rotating shaft are rotatably arranged.

5. The liquid cooling system according to claim 3 or 4, characterized in that: Each of the rotating shaft assemblies further includes a connecting pipe; the first end of the rotating shaft is connected to the first cold plate through the connecting pipe.

6. The liquid cooling system according to claim 5, characterized in that: A pump body is provided on the connecting pipe, and the pump body is used to pump the refrigerant in the first cold plate into the second cold plate.

7. The liquid cooling system according to any one of claims 3 to 6, characterized in that: The support frame includes: a support frame body and an extension plate fixedly connected to the support frame body; The support frame body is communicated with the rotating shaft and the second cold plate respectively, and the extension plate is fixedly connected to the display device.

8. The liquid cooling system according to any one of claims 3 to 7, characterized in that: The second portion is located in the second flow channel inside the support frame.

9. The liquid cooling system according to claim 8, characterized in that: The second portion includes the first segment and a second segment connected to the first segment, and the outer diameter of the first segment is greater than the outer diameter of the second segment; A sealing ring is provided on at least a portion of the outer periphery of the second section, and the sealing ring is used to ensure that the outer wall of the second section is in close contact with the inner wall of the second flow channel.

10. The liquid cooling system according to any one of claims 3 to 9, characterized in that: The first cold plate includes: a first upper cover plate, a first lower cover plate, and first side plates connected to the first upper cover plate and the first lower cover plate respectively, and the first upper cover plate, the first lower cover plate, and the first side plates enclose a first accommodating cavity for accommodating the refrigerant; The second cold plate includes: a second upper cover plate, a second lower cover plate, and second side plates respectively connected to the second upper cover plate and the second lower cover plate; and the second upper cover plate, the second lower cover plate, and the second side plates form a second accommodating chamber for accommodating the refrigerant; The first accommodating chamber is communicated with the first flow channel, and the second accommodating chamber is communicated with the second flow channel.

11. The liquid cooling system according to claim 10, characterized in that: The thickness of the first upper cover plate or the first lower cover plate is 0.05-0.1 mm; The thickness of the second upper cover plate or the second lower cover plate is 0.05-0.1 mm.

12. The liquid cooling system according to claim 10 or 11, characterized in that: A plurality of first support columns are provided between the first upper cover plate and the first lower cover plate; A plurality of second support columns are provided between the second upper cover plate and the second lower cover plate.

13. The liquid cooling system according to any one of claims 1 to 12, characterized in that: The material of the first cold plate is any one of titanium, titanium alloy, stainless steel, and aluminum alloy; The second cold plate is made of any one of titanium, titanium alloy, stainless steel and aluminum alloy.

14. The liquid cooling system according to any one of claims 3 to 12, characterized in that: The material of the support frame is any one of titanium, titanium alloy, stainless steel and aluminum alloy.

15. The liquid cooling system according to claim 14, wherein: The support frame and the second cold plate are integrally formed by a brazing process.

16. An electronic device, characterized in that: At least: A host device, a display device, and a liquid cooling system according to any one of claims 1 to 15; The first cold plate in the liquid cooling system is located in the host device, and the second cold plate in the liquid cooling system is located in the display device; The two ends of the first cold plate are respectively connected to the two ends of the second cold plate through the rotating shaft assembly in the liquid cooling system; The host device and the display device are rotatably connected via the rotating shaft assembly.

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