electronic devices

Abstract

The present invention discloses an electronic device comprising a substrate, an inorganic layer, and an organic layer. The substrate has a recessed portion having a side portion. The inorganic layer is disposed on the substrate. The organic layer is disposed on the inorganic layer. The organic layer and the inorganic layer have an interface, the interface including a first portion corresponding to the side portion of the recessed portion, and the first portion having an arc-shaped profile.

Description

Technical Field

[0001] The present invention relates to an electronic device, and in particular to a peripheral structure of a display panel. Background Art

[0002] In order to reduce the phenomenon of panel structure peeling caused by bending of flexible display panels, it is necessary to strengthen the peripheral area structure of the panel. The present invention discloses a new peripheral area structure and improves the manufacturing process yield through structural optimization. Summary of the Invention

[0003] Some embodiments of the present invention provide an electronic device comprising a substrate, an inorganic layer, and an organic layer. The substrate has a recessed portion having a side portion. The inorganic layer is disposed on the substrate. The organic layer is disposed on the inorganic layer. The organic layer and the inorganic layer have an interface, wherein the interface includes a first portion corresponding to the side portion of the recessed portion, and the first portion has a curved profile. BRIEF DESCRIPTION OF THE DRAWINGS

[0004] The following describes embodiments of the present invention in detail with reference to the accompanying drawings. It should be noted that, in accordance with standard industry practice, various features are not drawn to scale and are provided for illustrative purposes only. In fact, the dimensions of elements may be arbitrarily increased or decreased to clearly illustrate the features of the present invention.

[0005] Figure 1 is a top view of an electronic device according to some embodiments of the present invention;

[0006] Figure 2 is a cross-sectional view of an electronic device according to some embodiments of the present invention;

[0007] Figure 3 is a cross-sectional view of a recessed portion according to some embodiments of the present invention;

[0008] Figure 4 1 is a cross-sectional view of a recessed portion according to some embodiments of the present invention.

[0009] Explanation of symbols

[0010] 1: Device area

[0011] 1A: Active area

[0012] 1B: Dummy thin film transistor area

[0013] 1C: Routing area

[0014] 2: Overflow stop area

[0015] 3: Packaging area

[0016] 10:Substrate

[0017] 11:convex part

[0018] 14: Electronic components

[0019] 15: First inorganic layer

[0020] 16: Second inorganic layer

[0021] 17: Second organic layer

[0022] 18: buffer layer

[0023] 18A: Bottom surface

[0024] 20,22,24: concave part

[0025] 20A, 22A: Side

[0026] 20B, 22B: middle part

[0027] 20C, 22C: bottom surface

[0028] 20D, 22D: side surface

[0029] 21,23: Interface

[0030] 21A, 23A: Part 1

[0031] 21B, 23B: Part 2

[0032] 30: first organic layer

[0033] 40: Covering layer

[0034] 100: Electronic devices

[0035] I: Inorganic layer

[0036] O: organic layer

[0037] T1, T2, T3, T4, T5, T6: thickness

[0038] MA, MB, MC, MD: midpoint DETAILED DESCRIPTION

[0039] The following discloses many different implementation methods or examples for implementing the different features of the subject matter provided. Specific embodiments of components and their arrangements are described below to illustrate the present invention. Of course, these embodiments are for illustrative purposes only and should not be used to limit the scope of the present invention. For example, if the specification mentions that a first feature component is formed on a second feature component, this includes embodiments in which the first feature component and the second feature component are in direct contact, and also includes embodiments in which there are other features between the first feature component and the second feature component, that is, the first feature component and the second feature component are not in direct contact.

[0040] In addition, repeated numbers or labels may be used in different embodiments. These repetitions are only for the purpose of simply and clearly describing the present invention and do not represent a specific relationship between the different embodiments and / or structures discussed. In addition, in the present invention, forming, connecting and / or coupling to another feature component on another feature component may include embodiments in which the feature components are formed to be in direct contact, and may also include embodiments in which additional feature components can be formed to be inserted into the above-mentioned feature components, so that the above-mentioned feature components may not be in direct contact. In addition, spatially related words such as "vertical", "above", "up", "below", "bottom" and similar words (such as "downwardly", "upwardly", etc.) may be used. These spatially related words are for the purpose of facilitating the description of the relationship between one (some) element or feature and another (some) element or feature in the figure. These spatially related words are intended to cover different directions of the device including the feature.

[0041] Furthermore, the use of ordinal numbers such as "first" and "second" in the specification and claims to modify claim elements does not in itself imply or represent any previous ordinal number of the claimed element, nor does it represent the order of one claimed element and another claimed element, or the order in the manufacturing method. The use of such ordinal numbers is only used to clearly distinguish a claimed element with a certain name from another claimed element with the same name.

[0042] Furthermore, in some embodiments of the present invention, terms such as "connect," "connect," and "interconnect," unless otherwise specified, may refer to two structures being in direct contact, or to two structures not being in direct contact, with another structure positioned between them. Furthermore, such terms may include situations where both structures are movable or both structures are fixed.

[0043] Please refer to Figure 1 as well as Figure 2 ,in Figure 1 is a top view of an electronic device 100 according to some embodiments of the present invention, and Figure 2is a cross-sectional view of an electronic device 100 according to some embodiments of the present invention. The electronic device 100 may be a display device, and the panel of the display device may include a substrate, such as a soft substrate or a flexible substrate, but the present invention is not limited thereto. The above-mentioned display device may include a liquid crystal (LC) display device, an organic light-emitting diode (OLED) display device, a quantum dot (QD) display device, a fluorescence material (fluorescence material) display device, a phosphor material (phosphor material) display device, a light-emitting diode (LED) display device such as a mini-LED or Micro LED display device, or other display devices. It should be noted that, for the convenience of description, the electronic device of the present invention takes an organic light-emitting diode display device as an example, but the present invention is not limited thereto. The above-mentioned electronic device may also be, for example, a sensing device, an antenna device, or a combination or splicing of the above-mentioned electronic devices.

[0044] like Figure 1 As shown, the electronic device 100 may include an active area 1A, a dummy thin-film transistor (dummy TFT) area 1B, a wiring area 1C, an overflow area 2, and a packaging area 3, but the present invention is not limited thereto. In the present invention, the active area 1A may include, but is not limited to, a plurality of wirings, a plurality of transistors, and a plurality of electrodes to constitute an electronic component (such as a sub-pixel in a display device). In some embodiments, the active area 1A, the dummy thin-film transistor area 1B, and the wiring area 1C may be collectively referred to as the device area 1. In some embodiments, the electronic device 100 may also include other areas depending on design requirements.

[0045] like Figure 2 As shown, in a cross-sectional view, the electronic device 100 may mainly include a substrate 10, a buffer layer 18, an inorganic layer I (which may include a first inorganic layer 15 and / or a second inorganic layer 16, etc.), an organic layer O (which may include a first organic layer 30 and / or a second organic layer 17, etc.), a light-emitting diode layer (not shown), a reflective electrode layer (not shown), etc., but is not limited thereto. In some embodiments, an electronic component 14, such as the aforementioned actuator component, may be provided on the device area 1. For example, Figure 2As shown, the electronic component 14 may be disposed on the substrate 10, and a buffer layer 18 may be disposed between the electronic component 14 and the substrate 10. In some embodiments, a cover layer 40 may be disposed above the first organic layer 30. The cover layer 40 may include, for example, a touch layer, a polarizing layer, a protective layer (e.g., glass), other suitable layers, or a combination thereof, but is not limited thereto.

[0046] In some embodiments, when the electronic device 100 is a display device, the active area 1A can be used as a display area, and the dummy thin film transistor area 1B, the routing area 1C, the overflow area 2, and the packaging area 3 can be used as a peripheral area (or non-display area), but is not limited thereto. The peripheral area can be located at the edge of a display panel. Or when there is a through hole on the display panel (for example, a through hole for a camera module is provided on the display panel of a mobile phone), the peripheral area can be located at the junction of the through hole and the display area. In some embodiments, the width of the peripheral area (for example Figure 1 The combined width of the dummy thin-film transistor region 1B, the routing region 1C, the overflow / stop region 2, and the packaging region 3 in the X-direction can be less than approximately 1 mm to reduce the width of the display device's bezel. In some embodiments, the peripheral region may also include other features depending on design requirements. In some embodiments, the width of the packaging region 3 (e.g., the width in the X-direction) can be less than approximately 400 μm, but is not limited thereto.

[0047] The substrate 10 may have a plurality of recesses in the peripheral region, such as the recess 20 , the recess 22 , and / or the recess 24 . Figure 1 and Figure 2 The number of the recesses 20, 22, and 24 is only for illustration, and the number of the recesses 20, 22, and 24 can be changed according to design requirements. Figure 1 and Figure 2 As shown, the substrate 10 may have a plurality of recesses 20, a recess 22 and a recess 24, but the present invention is not limited thereto. Figure 3 and Figure 4 The recess may have side portions (e.g., side portion 20A of recess 20, side portion 22A of recess 22, etc.) and a middle portion (e.g., middle portion 20B of recess 20, middle portion 22B of recess 22, etc.), which will be described in detail later. In some embodiments, substrate 10 can bend due to force. In some embodiments, substrate 10 includes a suitable flexible material, such as polycarbonate, polyimide, polypropylene, or polyethylene terephthalate, other suitable materials, or combinations thereof, but is not limited thereto.

[0048] like Figure 2 As shown, the inorganic layer 1 can be disposed on the substrate 10, and the organic layer 0 can be disposed on the inorganic layer 1. For example, the first inorganic layer 15 can be disposed on the substrate 10, and the second organic layer 17 can be disposed on the first inorganic layer 15. The second inorganic layer 16 can also be disposed on the substrate 10, and the first inorganic layer 15 can be partially located between the second inorganic layer 16 and the substrate 10 (e.g., Figure 2 Alternatively, the first inorganic layer 15 and the second organic layer 17 may be partially located between the second inorganic layer 16 and the substrate 10 (as shown on the left side of FIG. Figure 2 (as shown on the right side of the figure), depending on design requirements. Furthermore, in some embodiments, the first organic layer 30 may be at least partially disposed on the first inorganic layer 15 and / or the second inorganic layer 16. In some embodiments, the first inorganic layer 15, a portion of the second inorganic layer 16, and a portion of the first organic layer 30 may be disposed in the recess 20 and / or the recess 24, but this is not limited thereto.

[0049] In some embodiments, the first inorganic layer 15 and the second inorganic layer 16 may comprise the same or different materials, but are not limited thereto. For example, tetraethylorthosilicate (TEOS), oxygen, argon, nitrogen trifluoride (NF3), monosilane (SiH4), nitrous oxide (N2O), ammonia (NH3), nitrogen, other suitable materials, or combinations thereof, may be used to form the first inorganic layer 15 or the second inorganic layer 16, but are not limited thereto. In some embodiments, the first inorganic layer 15 or the second inorganic layer 16 may be formed by a physical vapor deposition (PVD) process, a chemical vapor deposition (CVD) process, a coating process, other suitable methods, or combinations thereof. The physical vapor deposition process may include, for example, a sputtering process, an evaporation process, or a pulsed laser deposition process, but is not limited thereto. The chemical vapor deposition process may include, for example, a low-pressure chemical vapor deposition process (LPCVD), a low-temperature chemical vapor deposition process (LTCVD), a rapid-thermal chemical vapor deposition process (RTCVD), a plasma-enhanced chemical vapor deposition process (PECVD), or an atomic layer deposition process (ALD), but is not limited thereto.

[0050] In some embodiments, the first organic layer 30 and the second organic layer 17 may comprise different materials, but are not limited thereto. For example, the material of the first organic layer 30 may include epoxy acrylates, polyester acrylates, urethane acrylates, photosensitive polyimides, phenolic epoxy resins, siloxanes, other suitable materials, or combinations thereof, but the present invention is not limited thereto. The second organic layer 17 may include a flowable adhesive, or may include pressure-sensitive adhesive, heat-curing adhesive, light-curing adhesive, hot melt adhesive, moisture-curing adhesive, two-component adhesive, other suitable adhesives, or combinations thereof, but the present invention is not limited thereto. In some embodiments, the first organic layer 30 and the second organic layer 17 may comprise the same material.

[0051] In some embodiments, the substrate 10 may further include a protrusion 11 disposed on the top surface of the substrate 10, and the protrusion 11 may be located between the recess 22 and the recess 24. More specifically, the recess 24 is located between the recess 20 and the protrusion 11. In the normal direction (Z direction) of the substrate 10, the protrusion 11 at least partially overlaps with the second organic layer 17. By providing the protrusion 11, the recess 22, and the recess 24 on the substrate 10, the possibility of the flowable second organic layer 17 flowing into the recess 20 of the encapsulation area 3 can be reduced. For example, the protrusion 11 can limit the overflow of the second organic layer 17, while the recess 22 and the recess 24 can accommodate excess or overflowing second organic layer 17. In some embodiments, the second organic layer 17 covers a portion of the recess 24 and exposes another portion of the recess 24. In other words, a portion of the first organic layer 30 and a portion of the second organic layer 17 may be disposed in the concave portion 24, and the first inorganic layer 15 and the second inorganic layer 16 may also directly contact and overlap in the concave portion 24, but the present invention is not limited thereto. Figure 2 The second organic layer 17 is shown as being disposed on the convex portion 11 and within the concave portion 22 and the concave portion 24, but the present invention is not limited thereto. For example, the second organic layer 17 may not be located within the concave portion 24, or may be blocked by the convex portion 11 and not completely cover the convex portion 11, depending on design requirements and fabrication process parameter settings.

[0052] Since the present invention uses an organic light-emitting diode display device as an example, in some embodiments, the electronic component 14 may include an organic light-emitting diode (OLED). However, when the electronic device of the present invention is a display device, antenna device, or sensor device of other forms, the electronic component 14 may also include a quantum dot light-emitting diode (QLED / QDLED), a light-emitting diode (LED) such as, but not limited to, a micro LED (micro light-emitting diode) or a mini LED (mini light-emitting diode), or a transceiver unit of an antenna device or a sensor unit of a sensor device. In some embodiments, the electronic component 14 may also include a thin-film transistor, such as a top-gate, bottom-gate, or multi-gate thin-film transistor with a channel region made of amorphous silicon, low-temperature polysilicon (LTPS), or metal oxide, which may be located on the dummy thin-film transistor region 1B of the device region 1. In some embodiments, the electronic component 14 may also include circuitry.

[0053] In some embodiments, the buffer layer 18 may be disposed above the substrate 10, and other components may be disposed above the buffer layer 18. For example, the buffer layer 18 may be disposed between the substrate 10 and the inorganic layer 1, such as between the substrate 10 and the first inorganic layer 15, or the aforementioned protrusion 11 or the electronic component 14 may be disposed on the buffer layer 18. Figure 3 As shown, in the normal direction of the substrate 10 (for example, the Z direction), the buffer layer 18 partially overlaps with the recess 20. In some embodiments, the buffer layer 18 can be formed by a physical vapor deposition process (PVD), a chemical vapor deposition process (CVD), a coating process, other suitable methods, or a combination of the foregoing. The physical vapor deposition process may, for example, include a sputtering process, an evaporation process, or a pulsed laser deposition process, but is not limited thereto. The chemical vapor deposition process may, for example, include a low-pressure chemical vapor deposition process (LPCVD), a low-temperature chemical vapor deposition process (LTCVD), a rapid temperature chemical vapor deposition process (RTCVD), a plasma-assisted chemical vapor deposition process (PECVD), or an atomic layer deposition process (ALD), but is not limited thereto. It should be noted that the buffer layer 18 protrudes and partially overlaps with the recess 20, which can create some mosaic effects after the organic layer is filled, further strengthening the structure of the peripheral area of ​​the panel.

[0054] In some embodiments, the buffer layer 18 may be formed of an insulating material, but is not limited thereto. In some embodiments, the material of the buffer layer 18 may include an organic material, an inorganic material, or a combination thereof, but is not limited thereto. The organic material may include polyethylene terephthalate (PET), polyethylene (PE), polyethersulfone (PES), polycarbonate (PC), polymethylmethacrylate (PMMA), isoprene, phenol-formaldehyde resin, benzocyclobutene (BCB), perfluorocyclobutane (PECB), or a combination thereof, but is not limited thereto. In some embodiments, the inorganic material may include silicon oxide, silicon nitride, silicon oxynitride, aluminum oxide, aluminum nitride, aluminum oxynitride, titanium oxide, other suitable materials, or a combination thereof, but is not limited thereto.

[0055] In some embodiments, the buffer layer 18 may be a single layer structure. In other embodiments, the buffer layer 18 may include multiple sublayers. In embodiments where the buffer layer 18 includes multiple sublayers, the materials of each sublayer may be the same or different, depending on design requirements.

[0056] In some embodiments, a buffer layer 18 may be formed on the substrate 10 first, and then a portion of the buffer layer 18 may be removed by a patterning process to expose the substrate 10. In some embodiments, the patterning process may include a photolithography process and an etching process. The photolithography process may include photoresist coating (such as spin coating), soft baking, hard baking, mask alignment, exposure, post-exposure baking, photoresist development, cleaning and drying, etc., but is not limited thereto. The etching process may include a dry etching process, but is not limited thereto. Then, the exposed substrate 10 may be etched back by laser heating to form recesses 20, 22, and 24. Although in Figure 1 The recess 20 is shown as a groove, but is not limited thereto. For example, in some embodiments, the recess 20 may also include a blind hole or other structure, depending on design requirements. In some embodiments, the recess 22 or the recess 24 may include a groove surrounding the device area 1.

[0057] Figure 3 is a cross-sectional view of the recess 20 according to some embodiments of the present invention. Figure 3As shown, an interface 21 may be defined between the first organic layer 30 and the inorganic layer 1 (particularly, the second inorganic layer 16). The interface 21 may include a first portion 21A and a second portion 21B. The first portion 21A may correspond to the side portion 20A of the recess 20. In cross-sectional view, the first portion 21A may have an S-shape, while the second portion 21B may correspond to the middle portion 20B of the recess 20. In other words, the first portion 21A may be the boundary between the second inorganic layer 16 and the first organic layer 30 at the side portion 20A, while the second portion 21B may be the boundary between the second inorganic layer 16 and the first organic layer 30 at the middle portion 20B. In some embodiments, the first portion 21A and the second portion 21B may have curved profiles.

[0058] In the present invention, the side portion 20A of the recess 20 may be defined as a side portion 20A perpendicular to the normal of the substrate 10 (eg Figure 3 The X direction) is defined as the left and right portions of the concave portion 20, which are each one-fifth of the width, and the middle portion 20B can be defined as the middle portion of the concave portion 20, which is three-fifths of the width. Figure 3 As shown, the width of the side portions 20A on the left and right sides of the middle portion 20B in the X direction is each one-third of the width of the middle portion 20B.

[0059] In some embodiments, the curved profile of the first portion 21A may be located within the recess 20, for example, between the extended surface of the bottom surface 18A of the buffer layer 18 (indicated by the dashed line) and the bottom surface 20C of the recess 20 in the Z direction. Furthermore, in some embodiments, the curved profile of the first portion 21A may be located outside the recess 20, for example, on a side higher than the extended surface of the bottom surface 18A of the buffer layer 18 in the Z direction. By designing the interface 21 (including the first portion 21A and the second portion 21B) with a curved profile, the probability of turbulence occurring when the liquid raw material of the first organic layer 30 flows into the recess 20 during subsequent deposition of the first organic layer 30 (whether within or outside the recess 20), thereby reducing the likelihood of a gap being generated between the formed first organic layer 30 and the second inorganic layer 16, and achieving better adhesion between the first organic layer 30 and the second inorganic layer 16.

[0060] Please refer to Figure 3 In some embodiments, the thickness T1 of the first inorganic layer 15 may be greater than the thickness T2 of the second inorganic layer 16, but is not limited thereto. In some embodiments, the thickness T4 of the inorganic layer I (including the first inorganic layer 15 and the second inorganic layer 16) located in the middle portion 20B may be greater than the thickness T3 of the inorganic layer I located in the side portion 20A, but is not limited thereto. For example, the thickness T1 and the thickness T2 may be, for example, the maximum thickness of the buffer layer 18, and may be measured in the normal direction of the substrate 10 (e.g., Figure 3In the concave portion 20, the thickness T3 may be, for example, the distance from the bottom to the top of the inorganic layer 1 measured at the midpoint MA of the side portion 20A in the X direction. Similarly, the thickness T4 may be, for example, the distance from the bottom to the top of the inorganic layer 1 measured at the midpoint MB of the middle portion 20B in the X direction. In addition, it should be noted that although Figure 3 The thickness of the second inorganic layer 16 is roughly the same at all positions, but in some embodiments, the thickness of the second inorganic layer 16 may also vary with different positions. For example, the second inorganic layer 16 closer to the side surface 20D of the recess 20 may be thinner than the thickness of the second inorganic layer 16 at the middle portion 20B corresponding to the recess 20.

[0061] Figure 4 is a cross-sectional view of the recess 22 according to some embodiments of the present invention. Figure 4 As shown, a portion of the first inorganic layer 15 and a portion of the second organic layer 17 are disposed in the recess 22. An interface 23 may be formed between the second organic layer 17 and the first inorganic layer 15. The interface 23 may include a first portion 23A and a second portion 23B. The first portion 23A may correspond to the side portion 22A of the recess 22, while the second portion 23B may correspond to the middle portion 22B of the recess 22. In other words, the first portion 23A may be the boundary between the first inorganic layer 15 and the second organic layer 17 at the side portion 22A, while the second portion 23B may be the boundary between the first inorganic layer 15 and the second organic layer 17 at the middle portion 22B. In some embodiments, the first portion 23A and the second portion 23B may have an arcuate profile. It should be noted that the aforementioned second inorganic layer 16 is not disposed in the recess 22. In other words, the inorganic layer in the recess 22 may include the first inorganic layer 15.

[0062] In the present invention, in a direction perpendicular to the normal direction of the substrate 10 (eg Figure 4 The side portions 22A of the recess 22 can be defined as the portions of one fifth of the width of the recess 22 on the left and right sides, and the middle portion 22B can be defined as the portion of the middle three fifths of the width of the recess 22. Figure 4 As shown, the width of the side portions 22A on the left and right sides of the middle portion 22B in the X direction is one third of the width of the middle portion 22B.

[0063] In some embodiments, the curved profile of the first portion 23A may be located in the recess 22. The recess 22 is the space between an extended plane (shown in dotted lines) of the bottom surface 18A of the buffer layer 18 and the bottom surface 22C of the recess 22. In addition, in other embodiments, the curved profile of the first portion 23A may be located outside the recess 22, for example, above the bottom surface 18A of the buffer layer 18 in the Z direction. By designing the interface 23 (including the first portion 23A and the second portion 23B) to have a curved profile, the probability of turbulence when the liquid raw material of the second organic layer 17 flows into the recess 22 when the second organic layer 17 is subsequently disposed (whether in the recess 22 or outside the recess 22) can be reduced, thereby making it less likely that a gap will be generated between the formed second organic layer 17 and the first inorganic layer 15, thereby achieving a better bonding effect between the second organic layer 17 and the first inorganic layer 15.

[0064] and Figure 3 Similar, in Figure 4 In some embodiments shown, the thickness T6 of the first inorganic layer 15 in the middle portion 22B may be greater than the thickness T5 of the first inorganic layer 15 in the side portion 22A, but the present invention is not limited thereto. For example, in the recessed portion 22, the thickness T5 may be the distance from the bottom to the top of the first inorganic layer 15 measured at the midpoint MC of the side portion 22A in the X direction, while the thickness T6 may be the distance from the bottom to the top of the first inorganic layer 15 measured at the midpoint MD of the middle portion 22B in the X direction.

[0065] It should be noted that if Figure 2 As shown, the aforementioned second inorganic layer 16 and first organic layer 30 may also be provided above the recess 22. The second inorganic layer 16 may be provided on the second organic layer 17, and the first organic layer 30 may be provided on the second inorganic layer 16. In other words, above the recess 22, the first inorganic layer 15, the second organic layer 17, the second inorganic layer 16, and the first organic layer 30 may be arranged in sequence in the Z direction.

[0066] In summary, the present invention provides an electronic device, in particular, a structure for a peripheral area of ​​a display panel. The electronic device may include a substrate, an inorganic layer, and an organic layer. The substrate may have a concave portion, and the concave portion may have a side portion. The inorganic layer may be arranged on the substrate. The organic layer may be arranged on the inorganic layer, and the organic layer and the inorganic layer may have an interface, and the interface may include a first portion corresponding to the side portion of the concave portion, and the first portion may have an arc-shaped profile. By designing an arc-shaped profile, the probability of turbulence of the liquid raw materials used when arranging various film layers on the substrate can be reduced, thereby enhancing the bonding effect between the film layers to strengthen the peripheral area of ​​the display panel.

[0067] The electronic device produced by the aforementioned embodiment of the present invention can also be integrated with a touch function as a touch electronic device. In addition, the electronic device or touch electronic device produced by the aforementioned embodiment of the present invention can be applied to any electronic device that requires a display screen, such as a monitor, a mobile phone, a watch, a notebook computer, a video camera, a camera, a mobile navigation device, a television, etc. However, the above devices are only examples, and the application of the present invention is not limited thereto. The touch electronic device produced by the aforementioned embodiment of the present invention can also be applied to an antenna device with a touch function or other types of electronic devices. In addition, the features of each embodiment can be mixed and matched as long as they do not violate the spirit of the invention or conflict with each other.

[0068] Although the present invention has been disclosed in conjunction with the above embodiments, it should be understood that any person having ordinary knowledge in the art may make combinations, changes, substitutions and modifications without departing from the spirit and scope of the present invention. In addition, the scope of protection of the present invention is not limited to the manufacturing processes, machines, manufacturing, material compositions, devices, methods and steps in the specific embodiments described in the specification, and any person having ordinary knowledge in the art may understand from the disclosure of the present invention that the manufacturing processes, machines, manufacturing, material compositions, devices, methods and steps currently or in the future developed can be used in accordance with the present invention as long as they can implement substantially the same functions or obtain substantially the same results in the embodiments described herein. Therefore, the scope of protection of the present invention includes the above-mentioned manufacturing processes, machines, manufacturing, material compositions, devices, methods and steps. In addition, the scope of protection of the present invention also includes the combination of each claim and embodiment.

Claims

1. An electronic device, characterized in that: include: a base plate having a recessed portion with side portions; an inorganic layer disposed on the substrate, comprising a first inorganic layer and a second inorganic layer, wherein the first inorganic layer and the second inorganic layer are disposed in the concave portion; an organic layer disposed on the inorganic layer, wherein the organic layer and the inorganic layer have an interface, the interface including a first portion corresponding to the side of the recess, and the first portion having an arc-shaped profile; and a buffer layer disposed between the substrate and the inorganic layer, wherein a portion of the buffer layer overlaps the side portion of the recess; In the normal direction of the substrate, at least a portion of the organic layer is located between the portion of the buffer layer and the substrate. 2 . The electronic device as claimed in claim 1 , wherein the arc-shaped contour of the first portion is located in the recess. The electronic device as claimed in claim 1 , wherein the arc-shaped contour of the first portion is located outside the recess. 4 . The electronic device as claimed in claim 1 , wherein the interface comprises a second portion located in a middle portion of the recess, and the second portion comprises an arc-shaped profile. 5 . The electronic device as claimed in claim 4 , wherein a thickness of the inorganic layer located in the middle portion is greater than a thickness of the inorganic layer located in the side portion. The electronic device as claimed in claim 1 , wherein in a normal direction of the substrate, the buffer layer partially overlaps with the recess. The electronic device as claimed in claim 6 , wherein the buffer layer comprises a plurality of sub-layers. 8 . The electronic device as claimed in claim 1 , wherein the first inorganic layer is located between the substrate and the second inorganic layer. 9 . The electronic device as claimed in claim 8 , wherein a portion of the organic layer is disposed in the recess. 10 . The electronic device as claimed in claim 9 , further comprising another organic layer, wherein the first inorganic layer and the another organic layer are at least partially located between the second inorganic layer and the substrate. 11 . The electronic device as claimed in claim 10 , further comprising a protrusion disposed on the substrate, wherein in a normal direction of the substrate, the protrusion at least partially overlaps with the other organic layer. 12 . The electronic device as claimed in claim 11 , wherein the substrate further comprises another concave portion, and the convex portion is located between the concave portion and the other concave portion. 13 . The electronic device as claimed in claim 12 , wherein the first inorganic layer, the another organic layer, the second inorganic layer, and the organic layer are sequentially arranged above the another concave portion. The electronic device as claimed in claim 11 , wherein the substrate further comprises another concave portion, and the another concave portion is located between the concave portion and the convex portion. 15 . The electronic device as claimed in claim 14 , wherein in the other recess, the first inorganic layer directly contacts and overlaps the second inorganic layer. 16 . The electronic device as claimed in claim 14 , wherein a portion of the organic layer and a portion of the other organic layer are disposed in the other recess. The electronic device as claimed in claim 8 , wherein a thickness of the first inorganic layer is greater than a thickness of the second inorganic layer. The electronic device as claimed in claim 1 , wherein the concave portion is a groove. The electronic device as claimed in claim 1 , wherein the recess is a blind hole.

20. The electronic device as claimed in claim 1, wherein the first portion has an S-shape.

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