Display device

Abstract

A display device includes a display panel including a first area, a curved area, and a second area, and including a plurality of pixels disposed in the first area; a driving chip disposed on an upper surface of the second area of the display panel and electrically connected to the plurality of pixels; a support layer disposed on a lower surface of the first area of the display panel; and a spacer disposed on the lower surface of the first area and overlapping the support layer in a plan view, wherein the spacer includes an upper layer, a lower layer, and a base layer, the base layer has a thermal conductivity greater than a thermal conductivity of the upper layer and a thermal conductivity of the lower layer, and the spacer overlaps the driving chip in the plan view in a case where the curved area of the display panel is folded.

Description

[0001] Cross-reference to related applications

[0002] This application claims priority and benefit to Korean Patent Application No. 10-2020-0104065, filed on August 19, 2020, with the Korean Intellectual Property Office (KIPO), the entire contents of which are incorporated herein by reference. Technical Field

[0003] The disclosures in this document relate to display devices, and more specifically, to flexible display devices. Background Technology

[0004] Display devices include a display area that is activated by an electrical signal. The display device can sense input applied from the outside through the display area, and simultaneously, can provide information to the user by displaying various images. Recently, various forms of display devices have been developed, and thus, display areas with various forms have been realized. Summary of the Invention

[0005] The present invention provides a display device with improved heat dissipation properties.

[0006] Embodiments of this disclosure provide a display device comprising: a display panel including a first region, a curved region, and a second region disposed in a first direction, and including a plurality of pixels disposed in the first region; a driving chip disposed on an upper surface of the second region of the display panel and electrically connected to the plurality of pixels; a support layer disposed on a lower surface of the first region of the display panel; and a spacer disposed on the lower surface of the first region of the display panel and overlapping the support layer in a plan view, wherein the spacer may include an upper layer, a lower layer, and a base layer, the base layer being disposed between the upper layer and the lower layer and having a thermal conductivity greater than that of the upper layer and the lower layer, and wherein, when the curved region of the display panel is folded, the spacer may overlap the driving chip in a plan view.

[0007] The base layer may include at least one of copper, copper alloys, and graphite.

[0008] The support layer may include metal.

[0009] The display device according to embodiments of the present disclosure may further include an adhesive layer disposed between an upper layer and a lower layer of a spacer, the base layer may include a plurality of openings passing through the base layer, and the adhesive layer may fill the plurality of openings.

[0010] The display device may also include an adhesive member disposed between an upper layer and a lower layer of the spacer to join the upper and lower layers of the spacer, and in a plan view, the adhesive member has a closed-loop shape surrounding a base layer of the spacer.

[0011] When the display panel is folded, the spacer can be placed between the first and second areas of the display panel.

[0012] In the plan view, the spacer can overlap with the second area of ​​the display panel.

[0013] The display device according to the embodiments of the present disclosure may further include a heat dissipation layer disposed on the lower surface of a first region of the display panel, and in a plan view, the heat dissipation layer is spaced apart from the spacer.

[0014] In a plan view, the heat dissipation layer can overlap with the support layer.

[0015] The first area of ​​the display panel may include a folding area capable of folding relative to an axis defined in a second direction intersecting the first direction, and the support layer may include a plurality of openings in an area overlapping the folding area.

[0016] In embodiments of this disclosure, the display device may include a display panel having multiple pixels, a driving chip electrically connected to the multiple pixels, a spacer disposed on the lower surface of the display panel, and a support layer disposed between the spacer and the display panel and comprising metal. The spacer includes an upper layer, a lower layer, a base layer, a first adhesive layer, and a second adhesive layer. The base layer is disposed between the upper layer and the lower layer and has a thermal conductivity greater than that of the upper layer and the lower layer. The first adhesive layer is disposed between the upper layer and the base layer, and the second adhesive layer is disposed between the lower layer and the base layer. The driving chip may be movable so as to overlap with or be spaced apart from the spacer in a plan view.

[0017] The display panel may include a first region, a curved region, and a second region arranged in a first direction. The curved region is flexible. Multiple pixels may be disposed in the first region, and a driving chip may be disposed in the second region. When the display panel is folded, the driving chip may overlap with the spacer in a plan view, and when the display panel is unfolded, the driving chip may be spaced apart from the spacer in a plan view.

[0018] The display device according to the embodiments of the present disclosure may further include a heat dissipation layer disposed on the lower surface of a second region of the display panel, and in a plan view, a spacer may be spaced apart from the heat dissipation layer.

[0019] The display device according to embodiments of the present disclosure may further include a first protective layer disposed on the lower surface of a first region of the display panel and a second protective layer disposed on the lower surface of a second region of the display panel. When the display panel is folded, a spacer may be disposed between the first and second protective layers.

[0020] The base layer may include at least one of copper, copper alloys, and graphite.

[0021] The upper and lower layers may each include insulating materials.

[0022] The display device according to embodiments of the present disclosure may further include an adhesive member disposed between an upper layer and a lower layer to bond the upper layer and the lower layer.

[0023] In a plan view, the adhesive component may have a closed-loop shape surrounding the base layer.

[0024] The adhesive component can be thicker than the first adhesive layer.

[0025] The base layer may include multiple openings through the base layer, and the first adhesive layer and the second adhesive layer may contact each other through the multiple openings. Attached Figure Description

[0026] The accompanying drawings are included to provide a further understanding of this disclosure and are incorporated in and constitute a part of this specification. The drawings illustrate exemplary embodiments of this disclosure and, together with the description, serve to explain the principles of this disclosure. In the drawings:

[0027] Figure 1A and Figure 1B It is a schematic 3D diagram of an electronic device;

[0028] Figure 2A This is a schematic exploded perspective view of an electronic device according to an embodiment of the present disclosure;

[0029] Figure 2B This is a schematic cross-sectional view of a display module according to an embodiment of the present disclosure;

[0030] Figure 2C This is a schematic plan view of a display panel according to an embodiment of the present disclosure;

[0031] Figure 2D This is a schematic rear view of a display panel according to an embodiment of the present disclosure;

[0032] Figure 3A This is a schematic cross-sectional view of a display device according to an embodiment of the present disclosure;

[0033] Figure 3B This is a schematic cross-sectional view of a display device according to an embodiment of the present disclosure;

[0034] Figure 4A This is a schematic rear view of a display device according to an embodiment of the present disclosure;

[0035] Figure 4BThis is a schematic plan view of the support layer according to an embodiment of the present disclosure;

[0036] Figure 4C yes Figure 4B A schematic enlarged plan view of area AA;

[0037] Figure 5A This is a schematic plan view of a spacer according to an embodiment of the present disclosure;

[0038] Figure 5B It is along Figure 5A A schematic cross-sectional view taken by line IV-IV' shown;

[0039] Figure 6A This is a schematic plan view of a spacer according to an embodiment of the present disclosure;

[0040] Figure 6B It is along Figure 6A A schematic cross-sectional view taken by line V-V' as shown;

[0041] Figure 7A This is a schematic rear view of a display device according to an embodiment of the present disclosure; and

[0042] Figure 7B This is a schematic cross-sectional view of a display module according to an embodiment of the present disclosure. Detailed Implementation

[0043] In this specification, when an element (or region, layer, part, etc.) is referred to as being "on", "connected to", or "attached to" another element, it means that the element may be directly disposed on, directly connected to, or directly attached to the other element, or that a third element may be disposed between them.

[0044] The same reference numerals denote the same elements. Furthermore, in the drawings, the thickness, proportions, and dimensions of elements may be exaggerated for the purpose of effectively describing the technical content. The term "and / or" includes all combinations that may define one or more of the relevant configurations.

[0045] It should be understood that although the terms “first,” “second,” etc., may be used herein to describe various elements, these elements should not be limited by these terms. These terms are used only to distinguish one element from another. For example, a first element may be referred to as a second element, and similarly, a second element may be referred to as a first element, without departing from the scope of the exemplary embodiments of this disclosure. Singular terms may include plural forms unless the context clearly indicates otherwise.

[0046] Furthermore, terms such as "below," "lower part," "above," and "upper part" are used to describe the relationships of the configurations shown in the accompanying drawings. These terms are used as relative concepts and are described with reference to the directions shown in the accompanying drawings.

[0047] It should be understood that the terms “comprising” or “having” are intended to specify the presence of the stated features, integrals, steps, operations, elements, components or combinations thereof in this disclosure, but do not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components or combinations thereof.

[0048] Unless otherwise defined or implied herein, all terms used herein (including technical and scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. It should also be understood that terms such as those defined in common dictionaries shall be interpreted as having a meaning consistent with their meaning in the context of the relevant technology and this disclosure, and shall not be interpreted as having an ideal or overly formal meaning unless clearly defined herein.

[0049] In the following description, embodiments of the present disclosure will be described with reference to the accompanying drawings.

[0050] Figure 1A and Figure 1B This is a schematic 3D diagram of an electronic device (ED). Figure 1A The unfolded state is shown, and Figure 1B The folded state is shown.

[0051] refer to Figure 1A and Figure 1B According to an embodiment, the electronic device ED may include a display surface DS defined by a first direction DR1 and a second direction DR2 intersecting the first direction DR1. The electronic device ED can provide an image IM to a user through the display surface DS.

[0052] The display surface DS may include a display area DA and a non-display area NDA surrounding the display area DA. The display area DA may display an image IM, and the non-display area NDA may not display an image IM. The non-display area NDA may surround the display area DA. However, the implementation is not limited to this. For example, the shape of the display area DA and the shape of the non-display area NDA may be modified.

[0053] In the following text, a direction substantially perpendicular to the plane defined by the first direction DR1 and the second direction DR2 can be defined as the third direction DR3. In this specification, "in a plan view" can be defined as viewed from above on the third direction DR3. In the following text, the first direction DR1, the second direction DR2, and the third direction DR3 correspond to the directions indicated by the first direction axis, the second direction axis, and the third direction axis, respectively, and are given the same reference numerals.

[0054] The electronic device ED may include a folded region FA and non-folded regions NFA1 and NFA2. The non-folded regions NFA1 and NFA2 may include a first non-folded region NFA1 and a second non-folded region NFA2. In the second direction DR2, the folded region FA may be disposed between the first non-folded region NFA1 and the second non-folded region NFA2.

[0055] like Figure 1B As shown, the folding region FA can be folded relative to a folding axis FX parallel to the first direction DR1. The folding region FA can have a predetermined curvature and radius of curvature. The first non-folding region NFA1 and the second non-folding region NFA2 can face each other, and the electronic device ED can be folded inward so that the display surface DS is not exposed to the outside.

[0056] In one embodiment, the electronic device ED can be folded outward, exposing the display surface DS to the outside. In another embodiment, the electronic device ED can be configured to repeatedly perform inward or outward folding operations sequentially from an unfolding operation, but the embodiment is not limited to this. In yet another embodiment, the electronic device ED can be configured to perform any operation selected from the unfolding, inward, and outward folding operations.

[0057] Figure 2A This is a schematic exploded perspective view of an electronic device ED according to an embodiment. Figure 2B This is a schematic cross-sectional view of the display module DM according to the embodiment. Figure 2C This is a schematic plan view of the display panel DP according to the embodiment. Figure 2D This is a schematic rear view of the display panel DP according to an embodiment. Figure 2B It shows the relationship with Figure 2A The cross section corresponding to line I-I'. Figure 2C The display panel DP in its unfolded state is shown, and Figure 2D The display panel DP is shown in a bent state. References will be made below. Figures 2A to 2D This disclosure is described.

[0058] like Figure 2A As shown, the electronic device ED may include a display device DD, an electronic module EM, a power module PSM, and a housing EDC. Although not shown separately, the power module PSM may also include a mechanical structure for controlling the folding operation of the display device DD.

[0059] The display device DD can generate images and sense external input. The display device DD includes a window module WM and a display module DM. The window module WM provides the front surface of the electronic device ED.

[0060] The display module DM may include at least one display panel DP. Figure 2A The display module DM is shown to be essentially the same as the display panel DP, but in reality, the display module DM can be a stacked structure in which multiple components are stacked.

[0061] The display panel DP includes the display area DA of the electronic device ED (see also...). Figure 1A The corresponding display area DP-DA and the non-display area NDA (see...) Figure 1A The non-display area DP-NDA corresponds to this. In this specification, if one area / part "corresponds" to another area / part, it may mean that the one area / part and the other area / part overlap, and are not limited to being located in the same area. The display module DM may include a driver chip DIC disposed in the non-display area DP-NDA. The display module DM may also include a flexible circuit film FCB bonded to the non-display area DP-NDA.

[0062] The driver chip (DIC) may include driving elements for driving the pixels of the display panel (DP), such as data driving circuitry. Figure 2A The diagram illustrates a structure in which the driver chip DIC is mounted on the display panel DP, but the implementation is not limited to this. For example, the driver chip DIC can be mounted on the flexible circuit film FCB. The curved area BA of the display panel DP (see...) Figure 2C The variable tangent (FCB) can be omitted, and when the flexible circuit film FCB is bent, the driver chip DIC can be positioned in the spacer SPC described below (see [link to documentation]). Figure 3B When a portion of the display panel DP or flexible circuit film FCB is bent, if the driver chip DIC according to the embodiment is disposed in an area overlapping with the spacer SPC disposed on the rear surface of the display panel DP, the driver chip DIC according to the embodiment can be mounted in various positions, but the embodiment is not limited thereto.

[0063] The electronic module (EM) may include at least one main controller. The EM may include a wireless communication module, a camera module, a proximity sensor module, an image input module, an audio input module, an audio output module, memory, external interfaces, etc. These modules may be mounted on a circuit board or electrically connected via a flexible circuit board. The EM may be electrically connected to the power supply module (PSM).

[0064] The main controller controls the overall operation of the electronic device ED. For example, the main controller can activate or deactivate the display device DD. The main controller can control the operation of the display device DD and other modules. The main controller may include at least one microprocessor.

[0065] Housings EDC1 and EDC2 can accommodate the display module DM, the electronic module EM, and the power module PSM. Figure 2A Two separate housings, EDC1 and EDC2, are shown as an example, but the implementation is not limited to this. Although not shown, the electronic device ED may also include a hinged structure for connecting the two housings, EDC1 and EDC2. Housings EDC1 and EDC2 may be combined with a window module WM. The housing EDC including housings EDC1 and EDC2 can protect components housed within the housing EDC, such as the display module DM, the electronics module EM, and the power supply module PSM.

[0066] refer to Figure 2B The display module DM may include a display panel DP, an input sensor IS disposed on the display panel DP, an optical film LF disposed on the input sensor IS, and a lower component LM disposed below (or on the lower side) the display panel DP. An adhesive layer may be provided between the components as needed.

[0067] The display panel (DP) may include a base layer, a circuit element layer disposed on the base layer, a display element layer disposed on the circuit element layer, and a thin-film encapsulation layer disposed on the display element layer. The base layer may include a plastic film. For example, the base layer may include polyimide.

[0068] Circuit element layers may include organic layers, inorganic layers, semiconductor patterns, conductive patterns, signal lines, etc. Organic layers, inorganic layers, semiconductor layers, and conductive layers can be formed on a base layer using methods such as coating and vapor deposition. Subsequently, photolithography processes can be used to selectively pattern the organic layers, inorganic layers, semiconductor layers, and conductive layers to form semiconductor patterns, conductive patterns, and signal lines.

[0069] Semiconductor patterns, conductive patterns, and signal lines can be formed Figure 2C The pixel driving circuit of the pixel PX shown (which will be described below) and signal lines SL1 to SLm, DL1 to DLn, EL1 to ELm, CSL1, CSL2 and PL. The pixel driving circuit may include at least one transistor.

[0070] The display element layer may include... Figure 2C The pixel PX shown in the diagram contains a light-emitting element (or light-emitting diode). The light-emitting element may be electrically connected to at least one transistor. A thin-film encapsulation layer may be disposed on the circuit element layer to seal the display element layer. The thin-film encapsulation layer may include inorganic layers, organic layers, and inorganic layers stacked sequentially. The stacking structure of the thin-film encapsulation layer is not particularly limited.

[0071] refer to Figure 2C The display panel DP will be described in detail. Figure 2CThe image shows the scan driver SDV and driver chip DIC in the components of the pixel PX, signal lines SL1 to SLm, DL1 to DLn, EL1 to ELm, CSL1, CSL2 and PL, and display panel DP, as well as the light-emitting driver EDV.

[0072] A pixel PX may include a light-emitting element and a thin-film transistor electrically connected to the light-emitting element. In a planar view, Figure 2C The shape of the display panel DP shown can be substantially the same as the shape of the base layer described above. In the embodiment, the display area DP-DA and the non-display area DP-NDA can be defined depending on whether light-emitting elements are arranged thereon.

[0073] Figure 2C The illustration shows a pixel PX disposed in the display area DP-DA. However, this is shown as an example, and some of the pixels PX may include thin-film transistors disposed in the non-display area DP-NDA, and the implementation is not limited thereto.

[0074] The scan driver (SDV), driver chip (DIC), and light-emitting driver (EDV) can be located in the non-display area (DP-NDA). The driver chip (DIC) may include a data driver.

[0075] The display panel DP may include a first region AA1, a second region AA2, and a curved region BA, which are divided along the second direction DR2. The second region AA2 and the curved region BA may be portions of the non-display region DP-NDA. The curved region BA may be located between the first region AA1 and the second region AA2.

[0076] The first region AA1 can be... Figure 1A The area corresponding to the display surface DS. The first area AA1 may include a first non-folded area NFA10, a second non-folded area NFA20, and a folded area FA0. The first non-folded area NFA10, the second non-folded area NFA20, and the folded area FA0 may be respectively connected to... Figure 1A and Figure 1B The first non-folded region NFA1, the second non-folded region NFA2, and the folded region FA correspond to each other.

[0077] The lengths of the bending region BA and the second region AA2 in the first direction DR1 can be less than the length of the first region AA1 in the first direction DR1. Regions with shorter lengths in the bending axis direction can be bent more easily.

[0078] Signal lines SL1 to SLm, DL1 to DLn, EL1 to ELm, CSL1, CSL2, and PL may include scan lines SL1 to SLm, data lines DL1 to DLn, light-emitting lines EL1 to ELm, a first control line CSL1, a second control line CSL2, and a power line PL. Each of the signal lines SL1 to SLm, DL1 to DLn, EL1 to ELm, CSL1, CSL2, and PL may be electrically connected to a pad PD. In this case, m and n are natural numbers. Pixel PX may be electrically connected to scan lines SL1 to SLm, data lines DL1 to DLn, and light-emitting lines EL1 to ELm.

[0079] Scan lines SL1 to SLm can extend in the first direction DR1 to be electrically connected to the scan driver SDV. Data lines DL1 to DLn can extend in the second direction DR2 to be electrically connected to the driver chip DIC via the bend region BA. Light emission lines EL1 to ELm can extend in the first direction DR1 to be electrically connected to the light emission driver EDV.

[0080] The power line PL may include a portion extending in the second direction DR2 and a portion extending in the first direction DR1. The portions of the power line PL extending in the first direction DR1 and the portions of the power line PL extending in the second direction DR2 may be disposed on different layers. The portion of the power line PL extending in the second direction DR2 may extend to the second region AA2 via the bending region BA. The power line PL can provide a first voltage to the pixel PX.

[0081] The first control line CSL1 can be electrically connected to the scan driver SDV and can extend through the curved area BA toward the lower end of the second area AA2. The second control line CSL2 can be electrically connected to the light-emitting driver EDV and can extend through the curved area BA toward the lower end of the second area AA2.

[0082] In the plan view, the pad PD can be positioned adjacent to the lower end of the second region AA2. The driver chip DIC, power line PL, first control line CSL1, and second control line CSL2 can be electrically connected to the pad PD. The flexible circuit film FCB can be electrically connected to the pad PD through an anisotropic conductive adhesive layer.

[0083] refer to Figure 2DThe curved region BA can bend towards the rear surface of the display panel DP. When the display panel DP is bent, the second region AA2 and the rear surface of the display panel DP can face the same direction. Therefore, when the display panel DP is not bent, the driver chip DIC can be observed on the front surface of the display panel DP, while when the display panel DP is bent, the driver chip DIC can be observed on the rear surface of the display panel DP.

[0084] According to this disclosure, because the curved area BA of the display panel DP can be bent, it is possible to prevent the non-display area NDA of the display device DD from increasing to the same area as the second area AA2 or the curved area BA. Therefore, a display device DD with a narrow bezel can be provided.

[0085] Return to reference Figure 2B The input sensor IS can be disposed on the display panel DP. The input sensor IS may include a sensing electrode (not shown) for sensing external input, a trace (not shown) electrically connected to the sensing electrode, and an inorganic and / or organic layer for insulating and / or protecting the sensing electrode or trace. The input sensor IS may be a capacitive sensor, but is not limited thereto.

[0086] When manufacturing a display panel DP, the input sensor IS can be formed directly on the thin-film encapsulation layer via a continuous process. In this description, the display panel DP integrated with the input sensor IS can be defined as an electronic panel EP. However, the implementation is not limited to this, and the input sensor IS can be manufactured as a panel separate from the display panel DP, and can be attached to the display panel DP via an adhesive layer.

[0087] The sensing electrodes can overlap with the display area DP-DA. The traces are configured to overlap with the non-display area DP-NDA. The traces can extend via the curved area BA toward the lower end of the second area AA2 to be adjacent to the pad PD, as will be described below. In this case, the traces can be located on a different layer than the signal lines SL1 to SLm, DL1 to DLn, EL1 to ELm, CSL1, CSL2, and PL of the circuit element layer.

[0088] The traces can be electrically connected to signal lines (input signal lines) set for the input sensors IS of the display panel DP in the first region AA1. The input signal lines can be different from the signal lines SL1 to SLm, DL1 to DLn, EL1 to ELm, CSL1, CSL2, and PL of the circuit element layer, but can be located on the same layer as any of them. Each input signal line can be electrically connected to its corresponding pad PD. As a result, the traces and signal lines of the circuit element layer can be electrically connected to the same flexible circuit film FCB.

[0089] An optical film (LF) can reduce the reflectivity of external light. An optical film (LF) may include a phase retarder and / or a polarizer. An optical film (LF) may include at least one polarizing film.

[0090] The lower component LM may include various functional components. Examples of various functional components may include a light-shielding layer for blocking light incident on the display panel DP, an impact-absorbing layer for absorbing external impacts, a support layer for supporting the display panel DP, and a heat dissipation layer for dissipating heat generated from the display panel DP. The stacking structure of the lower component LM is not particularly limited.

[0091] Figure 3A This is a schematic cross-sectional view of a display device DD according to an embodiment. Figure 3B This is a schematic cross-sectional view of a display device DD according to an embodiment. Figure 4A This is a schematic rear view of the display device DD. Figure 4B This is a schematic plan view of the support layer PLT according to the implementation method. Figure 4C yes Figure 4B A schematic enlarged plan view. Figure 3A The display device DD is shown in the state where the display panel DP is extended, and Figure 3B The display device DD is shown in a bent state of the display panel DP. Figure 3A It shows the relationship with Figure 2C The cross section corresponding to line II-II'. Figure 3B It shows the relationship with Figure 4A The cross section corresponding to line III-III'. Figure 4A Can be with Figure 3A The schematic rear view of the display device DD shown corresponds to this. In the following text, reference will be made to... Figures 3A to 4C This disclosure is described.

[0092] refer to Figure 3A and Figure 3B The display device DD may include a window module WM and a display module DM. The window module WM may include a thin glass substrate UTG, a plastic film PF, an adhesive layer AL1 (hereinafter referred to as the first adhesive layer) and a border pattern BP.

[0093] Border pattern BP can be with Figure 2AThe non-display area DP-NDA overlaps as shown. The border pattern BP can be disposed on the surface of the thin glass substrate UTG or the surface of the plastic film PF. In this embodiment, a border pattern BP disposed on the lower (or rear) surface of the plastic film PF is shown as an example. The embodiment is not limited thereto, and the border pattern BP can be disposed on the upper surface of the plastic film PF. The border pattern BP can be a colored light-shielding film and can be formed by, for example, a coating method. The border pattern BP can include a base material and a dye or pigment mixed with the base material.

[0094] Thin glass substrate UTG can have a thickness of approximately 15 μm to approximately 45 μm. Thin glass substrate UTG can be chemically tempered glass. Even under repeated folding and unfolding, thin glass substrate UTG can minimize wrinkle formation.

[0095] The plastic film PF can be disposed on a thin glass substrate UTG. The plastic film PF can have a thickness of about 50 μm to about 80 μm. The plastic film PF can include polyimide, polycarbonate, polyamide, triacetyl cellulose, polymethyl methacrylate, or polyethylene terephthalate. Although not shown separately, at least one of a hard coating, an anti-fingerprint layer, and an anti-reflective layer can be disposed on the upper surface of the plastic film PF.

[0096] The first adhesive layer AL1 bonds the thin glass substrate UTG and the plastic film PF. The first adhesive layer AL1 may include a pressure-sensitive adhesive (PSA) or an optically clear adhesive (OCA). The adhesive layers described below may be substantially the same as the first adhesive layer AL1 and may include conventional adhesives.

[0097] The first adhesive layer AL1 can be separated from the thin glass substrate UTG. The plastic film PF has lower strength than the thin glass substrate UTG and is therefore more prone to scratches. After the first adhesive layer AL1 and the plastic film PF are separated from the thin glass substrate UTG, a new plastic film PF can be attached to the thin glass substrate UTG.

[0098] The display module DM may include an optical film LF, a display panel DP, a panel protective layer PPL, a barrier layer BRL, a support layer PLT, a cover layer SCV, a heat dissipation layer RHL, a buffer layer CUL, an insulating layer INL, spacers SPC, a step compensation pattern CP, and second adhesive layers AL2 to eleventh adhesive layers AL11. The second adhesive layers AL2 to eleventh adhesive layers AL11 may include transparent adhesives, such as pressure-sensitive adhesives or optically transparent adhesives. In embodiments, some of the components described above may be omitted. For example, the step compensation pattern CP and its associated tenth adhesive layer AL10 and eleventh adhesive layer AL11 may be omitted.

[0099] The optical film LF can be set in Figure 2C In the first region AA1 shown, the optical film LF may cover at least the display area DP-DA, or overlap with at least the display area DP-DA. The second adhesive layer AL2 can bond the optical film LF and the window module WM, and the third adhesive layer AL3 can bond the optical film LF and the display panel DP. Figure 3A and Figure 3B Only the display panel DP is shown, but an input sensor IS can also be placed between the display panel DP and the third adhesive layer AL3, such as... Figure 2B The electronic panel EP shown.

[0100] The panel protective layer PPL can be disposed below or on the lower side of the display panel DP. The panel protective layer PPL protects the lower portion of the display panel DP. The panel protective layer PPL can include a flexible plastic material. For example, the panel protective layer PPL can include polyethylene terephthalate. In an embodiment, the panel protective layer PPL may not be disposed in the folded area FA. The fourth adhesive layer AL4 bonds the panel protective layer PPL to the display panel DP, and the fifth adhesive layer AL5 bonds the panel protective layer PPL to the barrier layer BRL.

[0101] The panel protective layer PPL may include a first panel protective layer PPL-1 for protecting a first region AA1 of the display panel DP and a second panel protective layer PPL-2 for protecting a second region AA2. In the case of a bent region BA, the second panel protective layer PPL-2 may be disposed below or beneath the first region AA1 and the first panel protective layer PPL-1, together with the second region AA2. The panel protective layer PPL may not be disposed in the bent region BA, and therefore the bent region BA can be bent more easily. The fourth adhesive layer AL4 may include a first portion AL4-1 corresponding to the first panel protective layer PPL-1 and a second portion AL4-2 corresponding to the second panel protective layer PPL-2.

[0102] A barrier layer (BRL) can be disposed beneath the panel protective layer (PPL). The barrier layer (BRL) increases resistance to compressive forces caused by external pressure. Therefore, the barrier layer (BRL) prevents deformation of the display panel (DP). The barrier layer (BRL) can comprise flexible plastic materials, such as polyimide or polyethylene terephthalate. The barrier layer (BRL) can be a colored film with low light transmittance. The barrier layer (BRL) absorbs light incident from the outside. For example, the barrier layer (BRL) can be a black plastic film. When viewing the display device (DD) from above the window module (WM), the components disposed beneath the barrier layer (BRL) are not visible to the user. A fifth adhesive layer (AL5) bonds the panel protective layer (PPL) and the barrier layer (BRL), and a sixth adhesive layer (AL6) bonds the barrier layer (BRL) and the support layer (PLT).

[0103] A support layer PLT can be disposed below the barrier layer BRL. The support layer PLT can comprise a material having an elastic modulus of approximately 60 GPa or higher. The support layer PLT can comprise a metallic material, such as stainless steel. For example, the support layer PLT can comprise SUS304, but the implementation is not limited to this, and the support layer PLT can comprise various metallic materials. The support layer PLT can support the display panel DP. The heat dissipation performance of the display device DD can be improved at least in part due to the support layer PLT.

[0104] An opening OP may be defined in the portion of the support layer PLT corresponding to the folded region FA0. The flexibility of the support layer PLT can be improved at least in part due to the opening OP. The sixth adhesive layer AL6 may include a first portion AL6-1 and a second portion AL6-2 spaced apart from each other. The flexibility of the support layer PLT can be improved by not providing the sixth adhesive layer AL6 in the region corresponding to the folded region FA0.

[0105] refer to Figure 4B and Figure 4C The support layer PLT will be described in detail. The support layer PLT may include... Figure 3A The diagram shows a folded region PLT-F corresponding to the folded region FA0, a first region PLT-1 corresponding to the first non-folded region NFA10, and a second region PLT-2 corresponding to the second non-folded region NFA20. An opening OP may be formed in the folded region PLT-F.

[0106] The open-ended features (OPs) can be arranged according to predetermined rules. The open-ended features can be arranged in a grid pattern. The open-ended features can be formed within the folded region PLT-F, thereby reducing the area of ​​the folded region PLT-F and thus lowering its stiffness. Therefore, compared to the case where no open-ended features are formed, the folded region PLT-F can have higher flexibility.

[0107] Return to reference Figure 3A and Figure 3B The seventh adhesive layer AL7 bonds the support layer PLT and the capping layer SCV, and the eighth adhesive layer AL8 bonds the capping layer SCV and the heat dissipation layer RHL. The capping layer SCV may cover or overlap the opening OP defined in the support layer PLT. The capping layer SCV may have a lower elastic modulus than the support layer PLT. For example, the capping layer SCV may comprise thermoplastic polyurethane, rubber, and silicone, but the embodiments are not limited thereto.

[0108] The capping layer SCV can be prepared in sheet form and attached to the support layer PLT. The eighth adhesive layer AL8 may include a first portion AL8-1 and a second portion AL8-2 spaced apart from each other. The flexibility of the capping layer SCV can be improved by omitting the eighth adhesive layer AL8 in the region corresponding to the folded region FA0.

[0109] The heat dissipation layer RHL can be a sheet material with thermal conductivity. The heat dissipation layer RHL can include at least one of copper, copper alloy and graphite. The ninth adhesive layer AL9 can bond the heat dissipation layer RHL and the buffer layer CUL.

[0110] The cushioning layer (CUL) can absorb external impacts to protect the display panel (DP). The cushioning layer (CUL) may include a foam sheet with predetermined elasticity. The cushioning layer (CUL) may include sponge or polyurethane.

[0111] The insulating layer INL can be placed beneath the buffer layer CUL. An example with insulating tape is shown. The insulating layer INL prevents static electricity from flowing in. Although in Figure 3B Not shown in the image, but Figure 3A The flexible circuit film FCB shown can be disposed on the insulating layer INL while the display panel DP is bent. The insulating layer INL prevents electrical interference between the flexible circuit film FCB and the components disposed on the insulating layer INL.

[0112] The heat dissipation layer RHL, the ninth adhesive layer AL9, the buffer layer CUL, and the insulating layer INL may each comprise two spaced-apart portions with a predetermined gap GP between them. The gap GP may be from about 0.3 mm to about 3 mm and may be configured to correspond to the folded area FA0.

[0113] When viewed from the rear surface of the display panel DP, a conductive film FFL can be disposed between the spacer SPC and the heat dissipation layer RHL. The conductive film FFL can be attached to the flexible circuit film FCB. The conductive film FFL can contact each of the flexible circuit film FCB and the support layer PLT. Static electricity generated in the flexible circuit film FCB can diffuse and disperse into the support layer PLT through the conductive film FFL. Therefore, the electrical reliability of the flexible circuit film FCB can be improved. However, this is presented as an example, and in another embodiment, the conductive film FFL can be omitted.

[0114] The surface of the step compensation pattern CP can be bonded to the support layer PLT via the tenth adhesive layer AL10. The eleventh adhesive layer AL11 can be disposed on the other surface of the step compensation pattern CP. The eleventh adhesive layer AL11 can be used when the display device DD is bonded to other components of the electronic device ED (see Figure 1). Figure 2B The lower component LM shown may include from Figure 3AThe stacked structure of the fourth insulating layer AL4 to the insulating layer INL.

[0115] refer to Figure 3A and Figure 3B The curved region BA can be bent such that the second region AA2 is positioned below the first region AA1. Therefore, the driver chip DIC can be positioned below the first region AA1. For example, the first region AA1 and the second region AA2 can be positioned on different planes (or reference planes). In a cross-sectional view, the curved region BA can be bent into a convex shape in the horizontal direction. The curved region BA can have a predetermined curvature and a predetermined radius of curvature. The radius of curvature can be from about 0.1 mm to about 0.5 mm.

[0116] The bending protection layer BPL may be disposed at least in the bending region BA. The bending protection layer BPL may overlap with the bending region BA, the first region AA1, and the second region AA2. The bending protection layer BPL may be disposed in a portion of the first region AA1 and a portion of the second region AA2.

[0117] The bending protection layer BPL and the bending region BA can be bent. The bending protection layer BPL protects the bending region BA from external impacts and controls the neutral plane of the bending region BA. The bending protection layer BPL controls the stress in the bending region BA, so that the neutral plane is closer to the signal lines (e.g., SL1 to SLm, DL1 to DLn, EL1 to ELm, CSL1, CSL2, and PL) located in the bending region BA.

[0118] The surface of the second portion AL4-2 of the second panel protective layer PPL-2, which is not attached to the fourth adhesive layer AL4, can be attached to the spacer SPC. The spacer SPC can prevent excessive bending of the display panel DP and can allow the display panel DP to bend while maintaining a predetermined curvature.

[0119] Figure 3B The detailed stacking structure of the spacer SPC is shown. The spacer SPC may include a lower layer SP1, an upper layer SP2, a base layer RD, a first spacer adhesive layer ALS1, and a second spacer adhesive layer ALS2.

[0120] In the cross-sectional view, the lower layer SP1 and the upper layer SP2 may be spaced apart from each other, with the base layer RD between them. The lower layer SP1 and the upper layer SP2 may each be formed of an insulating material. For example, the lower layer SP1 and the upper layer SP2 may each comprise a polymer material, such as polyethylene terephthalate (PET), polycarbonate (PC), or polyurethane (PU). The lower layer SP1 and the upper layer SP2 may each be rigid or elastic, and the implementation is not limited thereto.

[0121] The lower layer SP1 can be positioned further away from the support layer PLT than the upper layer SP2. In the case of a bent display panel DP, the lower layer SP1 can be positioned between the base layer RD and the second panel protective layer PPL-2. The upper layer SP2 can be positioned on the lower (or rear) surface of the support layer PLT. Although not shown, the upper layer SP2 can be bonded to the support layer PLT via a predetermined adhesive layer.

[0122] A base layer RD can be disposed between the lower layer SP1 and the upper layer SP2. The base layer RD can include a material with high heat dissipation properties. For example, the base layer RD can be formed of a material with high thermal conductivity. For example, the base layer RD can include at least one of graphite, copper, and copper alloys. However, the implementation is not limited to this. For example, the base layer RD can include various materials, as long as these materials have higher heat dissipation properties than the lower layer SP1 or the upper layer SP2. However, the implementation is not limited to this.

[0123] The first spacer adhesive layer ALS1 and the second spacer adhesive layer ALS2 may each include a transparent adhesive, such as a pressure-sensitive adhesive or an optically transparent adhesive. The first spacer adhesive layer ALS1 may be disposed between the lower layer SP1 and the base layer RD. The first spacer adhesive layer ALS1 bonds the lower layer SP1 and the base layer RD. The second spacer adhesive layer ALS2 may be disposed between the upper layer SP2 and the base layer RD to bond the upper layer SP2 and the base layer RD.

[0124] According to this disclosure, in a plan view, the spacer SPC can be disposed in the area overlapping with the driver chip DIC. During operation of the display device DD, high heat may be generated from the driver chip DIC. The heat generated from the driver chip DIC can be dissipated by moving to the support layer PLT via the spacer SPC. Therefore, degradation of the driver chip DIC can be prevented, and thus the reliability of the display device DD can be improved.

[0125] Figure 4A The support layer PLT can be shown as viewed from its rear surface. A capping layer SCV, a heat dissipation layer RHL, a buffer layer CUL, an insulating layer INL, and spacers SPC can be disposed on the lower surface of the support layer PLT. This stacked structure can be disposed in a portion of the lower surface of the support layer PLT. The capping layer SCV can overlap with the folded region PLT-F. The areas of the capping layer SCV, heat dissipation layer RHL, buffer layer CUL, and insulating layer INL are shown decreasing in the described order, but the implementation is not limited to this. The spacers SPC are positioned to space away from the stacked structure. Reference Figure 4A Spacer PCs can be placed outside the stacked structure and along the edge of the support layer PLT.

[0126] When the display panel (DP) is bent, the conductive film (FFL) attached to the flexible circuit film (FCB) can be disposed in the areas exposed from the cover layer (SCV), heat dissipation layer (RHL), buffer layer (CUL), insulating layer (INL), and spacer (SPC) on the support layer (PLT). Therefore, the flexible circuit film (FCB) can be supported by the conductive film (FFL) in areas that do not overlap with the spacer (SPC).

[0127] The spacer SPC can be configured to overlap with the support layer PLT in a planar view. As described above, heat generated from the driver chip DIC can be diffused through the base layer RD of the spacer SPC, and heat transferred to the spacer SPC can be dispersed through the support layer PLT. Therefore, the spacer SPC can support the curved display panel DP while preventing the driver chip DIC from deteriorating, thereby improving the thermal reliability of the display device DD.

[0128] According to this disclosure, the driver chip DIC can dissipate heat through the spacer SPC, and therefore, the heat dissipation layer RHL does not need to overlap with the driver chip DIC. According to this disclosure, the heat dissipation layer RHL may include regions spaced apart from the driver chip DIC, so as to overlap only with regions where the driver chip DIC is not present. Therefore, excessive increase in the area of ​​the heat dissipation layer RHL can be prevented, and the weight of the display module DM can be reduced, thereby improving the portability of the display device DD.

[0129] Figure 5A This is a schematic plan view of the spacer SPC1 according to the embodiment. Figure 5B It is along Figure 5A The schematic cross-sectional view shown is taken by line IV-IV'. Figure 6A This is a schematic plan view of the spacer SPC2 according to the embodiment. Figure 6B It is along Figure 6A The schematic cross-sectional view shown is taken along line V-V'. Reference will be made below. Figures 5A to 6B Describe spacers SPC1 and SPC2.

[0130] like Figure 5A and Figure 5B As shown, the spacer SPC1 may also include an adhesive member AF. In the plan view, the adhesive member AF may be positioned along the edges of the upper layer SP1 and the lower layer SP2, and may have a closed-loop shape around the base layer RD.

[0131] The adhesive member AF may have a thickness greater than the thickness of the first spacer adhesive layer ALS1 or the second spacer adhesive layer ALS2. For example, the adhesive member AF may have a thickness corresponding to the sum of the thicknesses of the first spacer adhesive layer ALS1, the second spacer adhesive layer ALS2, and the base layer RD.

[0132] The adhesive component AF may be adhesive. The adhesive component AF may include pressure-sensitive adhesive (PSA) or optically clear adhesive (OCA), but the type of adhesive is not limited to these. The adhesive component AF may be provided in tape form or liquid form. However, the implementation is not limited to these.

[0133] According to this disclosure, the spacer SPC1 may further include an adhesive member AF to supplement the adhesion between the base layer RD, the upper layer SP1, and the lower layer SP2. The spacer SPC1 can block external exposure of the base layer RD, thereby easily preventing defective peeling or delamination defects between the base layer RD and the upper layer SP1 or between the base layer RD and the lower layer SP2.

[0134] As another example, such as Figure 6A and Figure 6B As shown, in spacer SPC2, an opening OP_R can be formed in the base layer RD. The opening OP_R can be defined by the base layer RD. Adhesive layer ALS can fill the opening OP_R. Adhesive layer ALS can be bonded to the first spacer layer ALS1 therein (see...). Figure 3B ) and second spacer adhesive layer ALS2 (see Figure 3B They correspond to each other in a unified form (or structure) through openings OP_R, which are in contact with each other.

[0135] The adhesive layer ALS can pass through the opening OP_R to bond the upper layer SP1 and the lower layer SP2. Therefore, the bonding strength between the base layer RD, the upper layer SP1 and the lower layer SP2 can be improved, and interlayer delamination defects in the spacer SPC2 can be reduced.

[0136] Figure 7A This is a schematic rear view of a display device DD according to an embodiment. Figure 7B This is a schematic cross-sectional view of the display module DM according to the embodiment. Figure 7A The support layer PLT is shown as viewed from its rear surface, and... Figure 7B It shows along Figure 7A The area intercepted by line VI-VI' shown in the diagram. Reference will be made below. Figure 7A and Figure 7B This disclosure describes the same figures. The same reference numerals denote the same components, and repeated descriptions will be omitted.

[0137] like Figure 7A and Figure 7BAs shown, the display module DM may further include a support film PT. The support film PT may be disposed below the support layer PLT. In an embodiment, the support film PT may be disposed in the second region PLT-2 of the support layer PLT and may be configured to overlap with the spacer SPC. In the plan view, the support film PT is shown to have a shape that does not overlap with the cover layer SCV, the heat dissipation layer RHL, the buffer layer CUL, the insulating layer INL, and the eleventh adhesive layer AL11.

[0138] A support film PT can be disposed on the cover film CVC. The cover film CVC can be disposed on the display panel DP to cover a portion of the bending protection layer BPL and the driver chip DIC, or to overlap with a portion of the bending protection layer BPL and the driver chip DIC. The cover film CVC can block the external exposure of the signal lines (not shown) of the driver chip DIC and the display panel DP. This is given by way of example, and in the display module DM according to the embodiment, the cover film CVC can be omitted, and the support film PT can be disposed directly on the display panel DP.

[0139] The support film PT protects the cover film CVC. The support film PT is configured not to overlap with the driver chip DIC in a plan view. The support film PT prevents external impacts from being applied to the driver chip DIC. Although not shown, the support film PT may include a base film and an adhesive disposed on the surface of the base film.

[0140] The support film PT can be a release film. Therefore, the support film PT can be bonded to the cover film CVC or the support layer PLT to facilitate separation and attachment from the cover film CVC or the support layer PLT.

[0141] According to this disclosure, heat generated from the driver chip can be dissipated to prevent chip degradation. Therefore, the reliability of the display device can be improved. According to this disclosure, the portability of the display device can be increased by reducing its weight.

[0142] Although this disclosure has been described with reference to some embodiments, it should be understood that this disclosure is not intended to be limited to these embodiments, but rather that various changes and modifications can be made by those skilled in the art without departing from the spirit and scope of this disclosure. Therefore, the scope of this disclosure is not intended to limit the content set forth in the detailed description of the specification, and the claimed invention will be defined by the appended claims.

Claims

1. A display device, comprising: a display panel including a first area, a bending area, and a second area arranged in a first direction, and including a plurality of pixels disposed in the first area; a driving chip disposed on an upper surface of the second area of the display panel and electrically connected to the plurality of pixels; a support layer disposed on a lower surface of the first area of the display panel and including a metal; and a spacer disposed on the lower surface of the first area of the display panel and overlapping the support layer in a plan view, wherein the spacer includes: an upper layer; a lower layer; and a base layer disposed between the upper layer and the lower layer and having a thermal conductivity greater than a thermal conductivity of the upper layer and a thermal conductivity of the lower layer, and the spacer overlaps the driving chip in the plan view in a case where the display panel is folded at the bending area, the display device further comprising: a flexible circuit film; a heat dissipation layer disposed on the lower surface of the first area of the display panel and spaced apart from the spacer in the plan view, and a conductive film disposed between the spacer and the heat dissipation layer and contacting each of the flexible circuit film and the support layer.

2. The display device of claim 1, wherein, The base layer includes at least one of copper, a copper alloy, and graphite. 3.The display device of claim 1, further comprising an adhesive layer disposed between the upper layer and the lower layer of the spacer, wherein the base layer includes a plurality of openings passing through the base layer, and the adhesive layer fills the plurality of openings. 4.The display device of claim 1, further comprising an adhesive member disposed between the upper layer and the lower layer of the spacer to join the upper layer and the lower layer of the spacer and having a closed loop shape around the base layer of the spacer in the plan view.

5. The display device of claim 1, wherein, The spacer is disposed between the first area and the second area of the display panel in a case where the display panel is folded.

6. The display device of claim 5, wherein, The spacer overlaps the second area of the display panel in the plan view.

7. The display device of claim 1, wherein, The heat dissipation layer overlaps the support layer in the plan view. 8.The display device of claim 1, wherein, the first area of the display panel includes a folding area foldable with respect to an axis defined in a second direction intersecting the first direction, and the support layer includes a plurality of openings in an area overlapping the folding area. 9.A display device, comprising: a display panel including a plurality of pixels; a driving chip electrically connected to the plurality of pixels; a spacer disposed on a lower surface of the display panel, the spacer including: an upper layer; a lower layer; a base layer disposed between the upper layer and the lower layer and having a thermal conductivity greater than a thermal conductivity of the upper layer and a thermal conductivity of the lower layer; a first adhesive layer disposed between the upper layer and the base layer; and a second adhesive layer provided between the lower layer and the base layer; and a support layer provided between the spacer and the display panel and including a metal, wherein the driver chip is movable so as to overlap with the spacer or be spaced apart from the spacer in the plan view, the display device further includes: a flexible circuit film; a heat dissipation layer provided on the lower surface of the display panel and spaced apart from the spacer in the plan view, and a conductive film provided between the spacer and the heat dissipation layer and contacting each of the flexible circuit film and the support layer.

10. The display device of claim 9, wherein the display panel includes a first area, a curved area, and a second area arranged in a first direction, the curved area being bendable, the plurality of pixels are provided in the first area, the driver chip is provided in the second area, the driver chip overlaps with the spacer in the plan view in a case where the display panel is folded, and the driver chip is spaced apart from the spacer in the plan view in a case where the display panel is unfolded.

11. The display device of claim 10, the heat dissipation layer is provided on the lower surface of the second area of the display panel.

12. The display device of claim 10, further comprising: a first protective layer provided on the lower surface of the first area of the display panel; and a second protective layer provided on the lower surface of the second area of the display panel, wherein the spacer is provided between the first protective layer and the second protective layer in a case where the display panel is folded. the base layer includes at least one of copper, a copper alloy, and graphite.

13. The display device of claim 9, wherein, the upper layer and the lower layer each include an insulating material.

14. The display device of claim 13, wherein, 15. The display device of claim 13, further comprising an adhesive member provided between the upper layer and the lower layer to join the upper layer and the lower layer. the adhesive member has a closed loop shape around the base layer in the plan view.

16. The display device of claim 15, wherein, the adhesive member is thicker than the first adhesive layer.

17. The display device of claim 15, wherein, 18. The display device of claim 13, wherein the base layer includes a plurality of openings through the base layer, and the first adhesive layer and the second adhesive layer contact each other through the plurality of openings. ​

Images