Chip mounting apparatus and method of manufacturing semiconductor device

Abstract

A chip mounting device and a manufacturing method of a semiconductor device capable of further reducing vibration are provided. The chip mounting device includes a driven body and a stage that drives the driven body. The stage includes a base, a linear motor including a first mover that moves the driven body and a stator, a first linear guide that is provided between the base and the stator to freely move the stator, a second linear guide that is provided between the base and the first mover to freely move the first mover, a second mover that is fixed to the base, and a control device that controls the first mover and the second mover. The control device is configured to move the stator along the first linear guide by the second mover.

Description

TECHNICAL FIELD

[0001] The present application relates to a chip mounting device, for example, a chip mounting device that can be applied to a chip mounting device provided with a reaction force absorbing mechanism. BACKGROUND

[0002] As one of semiconductor manufacturing devices, there is a chip mounting device such as a chip mounter that mounts a semiconductor chip called a bare chip on a substrate such as a wiring substrate or a lead frame. In the chip mounter, a bare chip is vacuum-sucked by a mounting head, and the bare chip is mounted on a substrate by ascending, horizontally moving, and descending at high speed.

[0003] The chip mounter is required to be highly precise and high speed, and in particular, the mounting head that is a core of mounting is required to be high speed. Generally, if a device is made high speed, vibration generated based on a high speed moving object becomes large, and the device can not obtain a target precision due to the vibration.

[0004] As a reaction force absorbing device that reduces the vibration, there is, for example, a device described in Japanese Patent Application Publication No. 2013-179206 (Patent Literature 1). Patent Literature 1 discloses a technology that uses a linear motor as a driving shaft of a mounting head of a chip mounter, moves a fixed body that includes a fixed magnet portion as a balance weight and freely, and moves a movable body that includes the mounting head in synchronization with the fixed body, thereby reducing vibration.

[0005] PRIOR ART DOCUMENTS

[0006] PATENT LITERATURE

[0007] Patent Literature 1: Japanese Patent Application Publication No. 2013-179206 SUMMARY

[0008] However, in a configuration that makes a fixed body (stator) freely act by a reaction force of a movable body (mover) as in the technology disclosed in Patent Literature 1, it is difficult to perform fine motion control that reduces vibration.

[0009] An object of the present application is to provide a chip mounting device that can further reduce vibration.

[0010] If a summary of a representative invention in the present application is simply explained, it is as follows.

[0011] That is, the chip mounting device has a driven body and a stage that drives the driven body. The stage has a base, a linear motor that has a first mover that moves the driven body and a stator, a first direct drive guide that is provided between the base and the stator and allows the stator to move freely, a second direct drive guide that is provided between the base and the first mover and allows the first mover to move freely, a second mover that is fixed to the base, and a control device that controls the first mover and the second mover. The control device is configured to move the stator along the first direct drive guide by the second mover.

[0012] Effects of Invention

[0013] According to the above-described chip mounting device, it is possible to further reduce vibrations. BRIEF DESCRIPTION OF DRAWINGS

[0014] Figure 1 is a plan view of the stage in the embodiment.

[0015] Figure 2 is a front view of the stage of Figure 1

[0016] Figure 3 is a sectional view at the A-A line of the stage of Figure 1

[0017] Figure 4 is a sectional view at the B-B line of the stage of Figure 1

[0018] Figure 5 is a perspective view of the stage in the embodiment.

[0019] Figure 6 is a perspective view that illustrates the reaction absorbing action of the stage shown in Figure 5

[0020] Figure 7 is a perspective view of the case where the stator is moved in the opposite direction to Figure 5 Figure 6

[0021] Figure 8 is a perspective view that illustrates the stroke of the first mover in the stage shown in Figure 7

[0022] Figure 9 is a perspective view of the stage in the first modification example.

[0023] Figure 10 is a graph that shows the waveforms of the speed and acceleration of the first mover and the acceleration of the stator.

[0024] Figure 11 is a perspective view of the stage in the second modification example.​​​​​​​

[0025] Figure 12 This is a three-dimensional view of the workbench in the third variation.

[0026] Figure 13 middle, Figure 13 (a) is the workbench in the fifth variation. Figure 1 The cross-sectional view at the BB line is equivalent to the figure. Figure 13 (b) is the workbench in other examples of the fifth variation. Figure 1 The cross-sectional view at line BB is equivalent to the figure.

[0027] Figure 14 This is a top view of the workbench in the fourth variation.

[0028] Figure 15 yes Figure 14 The main view of the workbench.

[0029] Figure 16 yes Figure 14 A cross-sectional view at the CC line.

[0030] Figure 17 yes Figure 14 A cross-sectional view at the DD line.

[0031] Figure 18 This is a perspective view illustrating the first reaction absorption action of the worktable in the fourth variation.

[0032] Figure 19 This is a perspective view illustrating the second reaction absorption action of the worktable in the fourth variation.

[0033] Figure 20 This is a perspective view showing the state in which the second moving part of the worktable in the fourth variation is moved to a specified position.

[0034] Figure 21 This is a perspective view showing the state after the stator of the worktable in the fourth variation is moved in the direction of travel.

[0035] Figure 22 This is a perspective view showing the state after the first moving part of the worktable in the fourth variation is moved in the direction of travel.

[0036] Figure 23 This is a top view showing an outline of the chip mounting machine in the first embodiment.

[0037] Figure 24 This means that in Figure 23 The diagram shows the actions of the pickup head and mounting head when viewed from the direction of arrow A.

[0038] Figure 25 It meansFigure 23 Fig. 10 is a schematic cross-sectional view of a main part of a bare chip supply section.

[0039] Figure 26 Fig. 13 is a flowchart showing a semiconductor device manufacturing method using a chip mounter. Figure 23

[0040] Figure 27 Fig. 17 is a plan view showing an outline of a chip mounter in the second embodiment.

[0041] Figure 28 Fig. 21 is a perspective view of a worktable in the sixth modification.

[0042] Figure 29 Fig. 25 is a graph showing the relationship between the speed of the first mover and the time.

[0043] Figure 30 Fig. 29 is a plan view of a worktable in the seventh modification.

[0044] Figure 31 Fig. 33 is a front view of the worktable shown in Fig. 32. Figure 30

[0045] Figure 32 Fig. 37 is a rear view of the worktable shown in Fig. 36. Figure 30

[0046] Fig. 41 is a left view of the worktable shown in Fig. 40. Figure 33 Figure 30 Fig. 45 is a plan view of a worktable in the eighth modification.

[0047] Figure 34 Fig. 49 is a rear view of the worktable shown in Fig. 48.

[0048] Figure 35 Figure 34 Fig. 53 is a rear view of the worktable shown in Fig. 52.

[0049] BRIEF DESCRIPTION OF THE DRAWINGS

[0050] 10 chip mounter (chip mounter device)

[0051] 101 base

[0052] 102 first linear motion guide

[0053] 103 second linear motion guide

[0054] 104 stator

[0055] 105 first mover

[0056] 106 second mover

[0057] 108 driven body

[0058] ​​​​110 control device DETAILED DESCRIPTION

[0059] Embodiments, modifications, and examples are described below using the drawings. In the following description, the same reference numerals are assigned to the same structural elements, and repeated description is omitted. In addition, in order to make the description clearer, the drawings schematically show the width, thickness, shape, and the like of each part compared to the actual shape, but in principle, one example is shown, and the explanation of the present application is not limited.

[0060] USING Figures 1 to 5 The structure of the worktable in the embodiment is described. Figure 1 is a plan view of the worktable in Figure 2 is a front view of the worktable of Figure 1 Figure 3 is a sectional view at the A-A line of Figure 1 Figure 4 is a sectional view at the B-B line of Figure 1 Figure 5 is a perspective view of the state before the first mover moves in the chip mounting device having Figure 1

[0061] The worktable 100 in the embodiment uses a linear motor as a driving source. The worktable 100 includes a base 101, a first linear guide 102 provided on the base 101, a second linear guide 103 arranged on the base 101 in parallel with the first linear guide 102, and a stator 104 provided above the first linear guide 102. The base 101 is fixed to a stage (not shown) of a chip mounting device 10. The first linear guide 102 and the second linear guide 103 extend in the Y-axis direction. The first linear guide 102 is longer than the second linear guide 103.

[0062] The stator 104 includes a magnet portion 104a including a plurality of permanent magnets in which N poles and S poles of the respective permanent magnets are alternately arranged in the Y direction, a flat plate-shaped yoke 104b coupling the magnetic flux of a plurality of combinations of adjacent permanent magnets among the plurality of permanent magnets, and a first linear slider 104c moving on the first linear guide 102. The magnet portion 104a is provided on the upper surface of the yoke 104b, and the first linear slider 104c is provided on the lower surface of the yoke 104b.

[0063] ​​​​The worktable 100 also includes a first mover 105 and a second mover 106 disposed above the stator 104. The first mover 105 includes a coil portion 105a, a support body 105b supporting the coil portion 105a, and a second linear slider 105c that moves on the second linear guide 103. The coil portion 105a includes a coil that generates magnetic flux through current, an iron core, and a magnetic yoke that couples adjacent magnetic fluxes, forming an electromagnet. The support body 105b is disposed above the second linear slider 105c. The first mover 105 is capable of moving freely on the second linear guide 103.

[0064] The second mover 106 includes a coil portion 106a and a support body 106b that supports the coil portion 106a. The coil portion 106a has the same structure as the coil portion 105a. The support body 106b is provided on the base 101. The second mover 106 is fixed to the base 101 and cannot move.

[0065] The lengths of the first mover 105 (coil section 105a) and the second mover 106 (coil section 106a) in the Y-axis direction are shorter than the length of the stator 104 (magnet section 104a) in the Y-axis direction. The combined length of the first mover 105 (coil section 105a) and the second mover 106 (coil section 106a) in the Y-axis direction is also shorter than the length of the stator 104 (magnet section 104a) in the Y-axis direction.

[0066] like Figure 5 As shown, a driven body 108 is connected to the first mover 105. The driven body 108 is, for example, a Z-drive shaft that drives the placement head in the up-down direction. The placement head is also included in the driven body 108.

[0067] Furthermore, the worktable 100 includes a scale 107 provided over approximately the entire area of ​​the base 101 in the Y-axis direction. A linear sensor is constructed from the scale 107 and a sensor (not shown, such as an optical sensor) provided on the driven body 108. The linear sensor detects the position of the driven body 108 in the Y-axis direction, and based on the output of the linear sensor, movement control towards the target position, such as position control or speed control, is performed. Thus, for example, the control method described in Japanese Patent Application Publication No. 2015-173551 can be used to control the first mover 105.

[0068] The operation of the worktable 100 is controlled by the control device 110. That is, the control device 110 controls the current flowing in the coils of the first mover 105 and the second mover 106 by driving I / O connected to the network, actuators, etc., thereby controlling the operation of the worktable 100.

[0069] use Figure 6 Explain the reaction absorption action of the worktable in the implementation method.Figure 6 is a diagram illustrating Figure 5 a reaction force absorbing action of the work table.

[0070] The control device 110 virtually moves the second mover 106 in the same direction as the direction (Y-axis direction) in which the first mover 105 moves in parallel with the movement of the first mover 105. Further, the second mover 106 cannot move because it is fixed to the base 101. The case where the current is caused to flow in the manner that the second mover 106 moves in the case where the second mover 106 is not fixed is referred to as virtually moving the second mover 106.

[0071] Here, let the mass of the first mover 105 be ml, the mass of the stator 104 be m2, the acceleration of the first mover 105 be al, the acceleration of the second mover 106 be a2, the acceleration of the stator 104 be a3, the thrust acting on the first mover 105 be Fl, the thrust acting on the second mover 106 be F2, and the thrust acting on the stator 104 be F3. Each of the motion equations is expressed by the following equations.

[0072] Fl = ml x al ··· (1)

[0073] F2 = m2 x a2 ··· (2)

[0074] F3 = m2 x a3 ··· (3)

[0075] The reaction force absorbing (cancelling) mechanism exerts an effect when the motion equations of the first mover 105 and the stator 104 are equal. That is, the following equation is established.

[0076] Fl = F3 ··· (4)

[0077] Here, let the thrust acting on the stator 104 when the first mover 105 moves be F', and let its acceleration be a'. The acceleration (a3) of the stator 104, which is a balance weight, is the sum of the acceleration (a') caused by the thrust (F') acting on the stator 104 when the first mover 105 moves (here a' < al), and the acceleration (a2) of the second mover 106, which is stationary. That is, the following equation is established.

[0078] a3 = a' + a2 ··· (5)

[0079] F3 = F' + F2 ··· (6)

[0080] The acceleration sought for the second mover 106 at this time is calculated using the above equations. That is, the equations (1) (3) (5) are substituted into the equation (4).

[0081] ml x al = m2 x a3

[0082] =m2(a'+a2)

[0083] ∴a2=(m1 / m2)×a1-a'···(7)

[0084] The counteracting mechanism works by setting the acceleration of the second mover 106 to a2, calculated by substituting the values ​​into the above formula (7). However, as described above, since the second mover 106 is fixed to the base 101, the stator 104 will move in the opposite direction to the first mover 105 instead of the second mover 106. Thus, vibration reduction of the worktable 100 can be achieved.

[0085] In this embodiment, a second mover 106 is fixed to the base 101, and the stator 104 is allowed to move freely. Therefore, since the stator 104 can be used as a counterweight, the compensation mechanism can be miniaturized. Furthermore, since the acceleration of the stator 104 is controlled by the stationary second mover 106, the appropriate damping travel distance can be adjusted for each worktable, thereby achieving a compensation mechanism that matches mechanical errors.

[0086] Essentially, the calculation of the acceleration of the stator 104 that matches the acceleration of the first mover 105 is as described above. Using Figure 29 The vt diagram shown illustrates this. Figure 29 This is a graph showing the relationship between the speeds of the first mover and the stator and time. When the acceleration time, constant speed time, and deceleration time of the first mover 105 are set as ta, tc, and td respectively, the acceleration time, constant speed time, and deceleration time of the stator 104, which operates using the second mover 106, are matched relative to the first mover 105, thus achieving cancellation. At this time, the stator 104, moving using the second mover 106, needs to move with the same stroke as the mover. However, when using the stator 104, since the acceleration of the stator 104 relative to the acceleration of the first mover 105 can be varied by a mass ratio m1 / m2, the operating speed of the stator 104 can be freely adjusted. Therefore, the stroke range can be narrower than that of the first mover 105.

[0087] Since the worktable in this embodiment can freely control the damping action, when other worktables, different from this one, are mounted on the same device, the stator can be moved by the second mover of this worktable to generate vibrations that eliminate the vibrations of other worktables during operation. Therefore, it can be used even without adding a damping mechanism to other worktables, thus preventing bulkiness and simultaneously reducing space and cost within the device.

[0088] use Figures 5 to 8 The stroke extension action of the worktable in the implementation method is explained. Figure 7 IsFigure 5 the worktable shown in the figure moves in the opposite direction to the stator Figure 6 the worktable shown in the figure moves in the opposite direction to the stator Figure 8 is a view showing Figure 7 the worktable shown in the figure moves in the opposite direction to the stator

[0089] As described above, in the case of performing the reaction force absorbing action in the worktable 100, as shown in the figure, the control device 110 makes the immobile second mover 106 hypothetically move in the same direction as the direction in which the first mover 105 moves, whereby the stator 104 moves in the opposite direction to the first mover 105, performing the canceling action. Here, the stroke (movable range) of the first mover 105 is LI. In addition, as shown in the figure, the right end of the second mover 106 is fixed at a distance L2 from the right end of the stator 104 before the first mover 105 and the stator 104 move. Figure 6 Figure 5

[0090] As shown in the figure, when the control device 110 makes the second mover 106 hypothetically move in the opposite direction to the direction (Y-axis direction) in which the first mover 105 moves, the stator 104 moves in the same direction as the direction in which the first mover 105 moves. Since the stator 104 can move by a maximum of L2, as shown in the figure, it is possible to extend the stroke of the first mover 105 from LI to (LI + L2). As such, in the case of extending the stroke, it is possible to minimize the bulk of the worktable, and to suppress costs through compact design and reduction in assembly man-hours and number of parts. Figure 7 Figure 8

[0091] For example, in the case of providing the present worktable as a mounting worktable of a chip mounting device, by providing a unit for replacing, cleaning, etc. of a collet, which is a consumable (which is different from the stroke for performing chip mounting and processes a bare chip within the extended stroke range), it is possible to improve the quality and maintainability of the chip mounting device. In addition, in long-stroke driving of a double-channel device, etc. provided with two channels for carrying a substrate in the extension direction (Y-axis direction) of the mounting worktable, it is also possible to miniaturize the stator and implement it inexpensively.

[0092]

[0093] ​​​​​The following illustrates several representative modifications of the embodiment. In the following description of the modifications, the same reference numerals are used for portions having the same structure and function as those described in the above embodiment. Also, the description of these portions can appropriately cite the description in the above embodiment within a range not contradictory in technology. In addition, all or a part of the above embodiment and the modifications can be appropriately combined within a range not contradictory in technology.

[0094] (First Modification)

[0095] Using Figure 9 and Figure 10 The worktable in the first modification is described. Figure 9 is a perspective view of the worktable in the first modification. Figure 10 is a graph showing the waveforms of the velocity and acceleration of the first mover, and the acceleration of the stator.

[0096] As shown in Figure 9 , the worktable 100 in the first modification is provided with an acceleration sensor 109 at the front end of the driven body 108 connected to the first mover 105 in the worktable in the embodiment, and has the same structure as the worktable in the embodiment otherwise.

[0097] When the first mover 105 is subjected to the acceleration / deceleration as shown in Figure 10 , the stator 104 cancels the establishment of the acceleration by performing the action of the acceleration time waveform (FAW) in the opposite phase to the acceleration time waveform (MAW) of the first mover 105. As described above, the control device 110 in the embodiment independently controls the first mover 105 and the second mover 106, and moves the second mover 106 in the same direction asynchronously in parallel with the movement of the first mover 105, thereby performing the cancellation action. In the first modification, in the same cancellation action as the embodiment, the waveform of the back-and-forth swing accompanying the acceleration is measured by the acceleration sensor 109, and the waveform is reflected in the standard acceleration waveform of the second mover 106 to make the stator 104 act.

[0098] Specifically, according to the waveform measured by the acceleration sensor 109, the waveform in the opposite phase is calculated by the measuring section and the arithmetic section of the control device 110, thereby calculating the acceleration of the second mover 106 in real time to make the cancellation action established.

[0099] The counteracting action of the embodiment is performed for the optimum action that is evaluated in the action of mounting and the like performed in advance, in which acceleration and the like is measured. For example, a value evaluated using a standard value obtained from the measurement data stored in advance, or using a correlation between the vibration and the acceleration calculated in advance. For the optimum action obtained from the evaluation result, the thrust is calculated from the acceleration of the first mover 105 calculated by calculation and the weight of the first mover 105, and the kinetic energy is calculated. In order to become the same energy as the kinetic energy, the required acceleration is calculated from the weight of the stator 104 as a whole. The required acceleration of the stator 104 is input to the second mover 106 at the same time as the acceleration time of the first mover 105 to be implemented.

[0100] As in the present modification example, in the case where the acceleration is measured in real time by the acceleration sensor 109, the calculation is performed by the control device 110 performing the above calculation each time, and the acceleration input to the second mover 106 is corrected in real time, whereby the counteracting at the appropriate acceleration can be automatically achieved. Although the acceleration of the mounting head and the like first mover 105 of the embodiment is automatically set according to the set speed, there is a case where it changes due to the temporal change of the load of the linear guide and the like, and therefore the present modification example is effective.

[0101] (Second Modification Example)

[0102] Use Figure 11 The worktable in the second modification example will be described. Figure 11 is a perspective view of the worktable in the second modification example.

[0103] The worktable 100 in the second modification example is provided with two or more weight sensors 201 in parallel with the first linear guide 102 or the second linear guide 103 below the common base 101 on which the first linear guide 102 and the second linear guide 103 in the embodiment are mounted, and the other structures are the same as those of the worktable in the embodiment. If the counteracting action that considers only the vibration suppression in the Y-axis direction is only considered, it is sufficient to be provided at both ends (two places) in the Y-axis direction of the base 101, and in the case where the X-axis component of the center of gravity of the worktable is considered, it is provided at the four corners (four places) of the base 101 as shown in Figure 11

[0104] ​In the canceling operation in the embodiment, the following control is performed in the second modification. Before the first mover 105 moves, the weights of the two weight sensors 201 are stored, for example. When the first mover 105 operates, the stator 104 is controlled to move by the second mover 106 so as to operate in such a manner that the balance of the weights detected by the weight sensors 201 is maintained. That is, the second mover 106 imparts a thrust to the stator 104 in such a manner that the position of the center of gravity of the first mover 105 and the stator 104 combined is always the same as the position of the center of gravity before the operation starts, and thus the operation control is performed in the direction opposite to the first mover 105.

[0105] The following operation is performed by a manual operation in advance. Here, the weight balance is the ratio of the weights detected by the two weight sensors 201, and is not the absolute value of the difference between the two weights. In addition, the driven body 108 is described as an example of a mounting head.

[0106] (Simple operation)

[0107] (1-1) The first mover 105 that drives the mounting head is moved to a pickup position (start position) of a bare chip, and the weight balance at this position is measured. Here, the stator 104 is kept in the start position.

[0108] (1-2) The first mover 105 is moved to a mounting position (stop position) of the bare chip, and the weight balance thereof is measured. Here, the stator 104 is not moved and kept in the start position.

[0109] (1-3) In the state where the first mover 105 is moved to the mounting position, the stator 104 is moved until the weight balance of the pickup position (start position) is obtained, and the position is stored.

[0110] (1-4) The stator 104 is operated between the start position thereof and the position of (1-3) at the same time as the operation (Y-axis) of the first mover 105 from the pickup position (start position) to the mounting position (stop position).

[0111] (Detailed operation)

[0112] In the acceleration operation of the mounting head, the operation described in the first modification is performed, and in the low-speed operation, the mounting head is operated in such a manner that the above-described operation considering the weight balance is performed including the amount of movement at the acceleration of the mounting head.

[0113] In addition, the weight sensors 201 can be provided below both end portions of the first linear guide 102 and the second linear guide 103 and above the base 101.

[0114] (Third modification)

[0115] UseFigure 12 Explain the workbench in the third variation. Figure 12 This is a three-dimensional view of the workbench in the third variation.

[0116] In the third variation, the worktable 100 in the embodiment has vibration damping components 202, such as dampers or stabilizers (pendulum balancers), for absorbing vibrations in the Z direction, located below both ends of the first linear guide 102 and the second linear guide 103 and above the base 101. Other structures are the same as the worktable in the embodiment. Alternatively, vibration damping components 202 can be installed below the four corners of the base 101 and above the device's frame.

[0117] (Fourth variation)

[0118] use Figures 14 to 17 Explain the structure of the worktable in the fourth variation. Figure 14 This is a top view of the workbench in the fourth variation. Figure 15 yes Figure 14 The main view of the workbench.

[0119] Figure 16 yes Figure 14 A cross-sectional view at the CC line. Figure 17 yes Figure 14 A cross-sectional view at the DD line.

[0120] In the fourth variation, the worktable 100, compared to the worktable in the embodiment, further includes an electromagnetic clutch 111 capable of fixing and moving the stator 104, and a fixing plate 112 capable of fixing the second mover 106. Furthermore, the second mover 106, like the first mover 105, is mounted on the second linear guide 103. Therefore, the second linear guide 103 is configured to extend longer in the Y-axis direction than in the embodiment. In the fourth variation, the second mover 106 includes a support body 106b supporting the coil portion 106a, and a second linear slider 106c that moves on the second linear guide 103. The support body 106b, like the support body 105b, is mounted on the second linear slider 105c. The other structures of the worktable 100 in the fourth variation are the same as in the embodiment.

[0121] The electromagnetic clutch 111 is composed of a coil. The electromagnetic force generated by energizing the coil attracts the stator 104 to its magnetic yoke 104b, which is formed of a strongly magnetic material, thus fixing the stator 104 in place. By cutting off the energizer to the coil, the electromagnetic force disappears, the force attracting the magnetic yoke 104b disappears, and the stator 104 becomes movable. The electromagnetic clutch 111 allows the stator 104 to be fixed at any position.

[0122] The fixed plate 112 is formed of a ferromagnetic body and is disposed extending along the second linear-motion guide 103. The support body 106b has a coil like the electromagnetic clutch 111, and the second mover 106 is fixed by the electromagnetic force generated by energizing the coil attracting the fixed plate 112. By cutting off the energization to the coil, the electromagnetic force disappears, the force attracting the fixed plate 112 disappears, and the second mover 106 becomes movable. By the electromagnetic clutch function of the support body 106b and the fixed plate 112, the second mover 106 can be fixed at an arbitrary position.

[0123] The use Figure 18 and Figure 19 The reaction force absorbing action of the stage in the fourth modification example is described. Figure 18 is a perspective view illustrating the first reaction force absorbing action of the stage in the fourth modification example. Figure 19 is a perspective view illustrating the second reaction force absorbing action of the stage in the fourth modification example.

[0124] In the case where the first mover 105 performs a large-amplitude action, as shown in Figure 18 , the second mover 106 is fixed to the fixed plate 112 by the electromagnetic clutch function of the support body 106b, and the stator 104 is made movable by the electromagnetic clutch 111, and the canceling action based on the stator 104 is performed like in the embodiment.

[0125] In the case where the first mover 105 performs a small-amplitude action, as shown in Figure 19 , the second mover 106 is made movable by the electromagnetic clutch function of the support body 106b, and the stator 104 is fixed by the electromagnetic clutch 111, and the canceling action based on the second mover 106 is performed.

[0126] The use Figures 20 to 22 The stroke extension action of the stage in the fourth modification example is described. Figure 20 is a perspective view showing a state where the second mover of the stage in the fourth modification example is moved to a prescribed position. Figure 21 is a perspective view showing a state after the stator of the stage in the fourth modification example is moved in the advancing direction. Figure 22 is a perspective view showing a state after the first mover of the stage in the fourth modification example is moved in the advancing direction.

[0127] The stator 104 is fixed by the electromagnetic clutch 111, and the second mover 106 is made movable by the electromagnetic clutch function of the support body 106b. As shown in Figure 20 , after the second mover 106 is moved in the advancing direction to move the first mover 105 by a prescribed distance, the second mover 106 is fixed by the electromagnetic clutch function of the support body 106b. As shown in Figure 21As shown, when the second mover 106 is imaginarily moved in the opposite direction to the direction in which the first mover 105 moves, the stator 104 moves in the same direction as the direction in which the first mover 105 moves. Thus, as... Figure 22 As shown, the stroke of the first mover 105 can be extended in the same manner as in the embodiment.

[0128] (Fifth variation)

[0129] use Figure 13 (a) and Figure 13 (b) illustrates the structure of the workbench in the fifth variation. Figure 13 (a) is the workbench in the fifth variation. Figure 1 The cross-sectional view at the BB line is equivalent to the figure. Figure 13 (b) is the workbench in other examples of the fifth variation. Figure 1 The cross-sectional view at the BB line is equivalent to the figure.

[0130] In the fifth variation, the worktable is further provided with a linear sensor for detecting the position of the stator 104, relative to the worktable in the embodiment.

[0131] like Figure 13 As shown in (a), a linear sensor is constructed from a scale 107a mounted on the side of the second mover 106 of the stator 104 and an optical detection sensor 109a mounted on the support 106b of the second mover 106. Therefore, position control or speed control, or other movement control towards the target position, can be performed on the stator 104 based on the output of the linear sensor. For example, the second mover 106 can be controlled using the control method described in Japanese Patent Application Publication No. 2015-173551.

[0132] In addition, such as Figure 13 As shown in (b), a linear sensor can also be constructed from an optical detection sensor 109b provided on the stator 104 and a scale 107 provided on the base 101.

[0133] (Sixth variation)

[0134] use Figure 28 Explain the structure of the workbench in the sixth variation. Figure 28 This is a three-dimensional view of the workbench in the sixth variation.

[0135] In the embodiment, an example is described where the N pole and S pole of the permanent magnet in the magnet section 104a of the stator 104 are arranged in equal proportions, but as... Figure 28As shown, the thrust can also be increased by making the arrangement of the N and S poles of the permanent magnets in the part of the magnet section 104a of the stator 104 that works opposite to the second mover 106 more dense, or by changing the size of the magnets. That is, in the sixth modified example, by appropriately miniaturizing and densely arranging several permanent magnets for the N and S poles of the magnet section 104a arranged on the yoke 104b without changing the arrangement, detailed operation of the coil section 106a of the second mover 106 can be achieved. Generally, stators made of magnetic plates are heavy and have a small amount of movement. When the spacing between the S and N poles is narrow, the coil section 106a of the second mover 106 can move with high precision over a small stroke. Therefore, even when the weights of the first mover 105 and the stator 104 are significantly different, or when the movement of the second mover 106 and the stator 104 is different (their movement becomes very small), it is possible to synchronize the movement of the second mover 106 with the movement of the stator 104, and to make the second mover 106 and the stator 104 operate with the same precision. For example, if the SN poles are arranged at a density of 5 times with a weight ratio of 5:1, synchronization control is easy to achieve.

[0136] (Seventh variation)

[0137] use Figures 30 to 33 Explain the structure of the workbench in the seventh variation. Figure 30 This is a top view of the workbench in the seventh variation. Figure 31 yes Figure 30 The front view of the workbench shown. Figure 32 yes Figure 30 The rear view of the workbench shown. Figure 33 yes Figure 30 The left view of the workbench shown.

[0138] In the embodiment, the scale 107 of the linear sensor for detecting the position of the first mover 105 is provided on the base 101. However, in the seventh modification, the scale 213 for detecting the position of the first mover 105 is provided on the stator 104. Furthermore, in the seventh modification, the scale 215 for detecting the position of the stator 104 is also provided on the stator 104. Moreover, in the seventh modification, since the scales 213 and 215 are provided on the stator 104, the structure of the stator 104 differs from that in the embodiment. The worktable 100 in the seventh modification has the same structure as in the embodiment, except for the linear sensor association structure. Hereinafter, the worktable 100 in the seventh modification will be described focusing on the differences from the embodiment.

[0139] First, let's explain stator 104 in the seventh variation. For example... Figure 33As shown, the magnetic yoke 104b is U-shaped when viewed from the side. The magnet part 104a is provided on the lower surface of the upper horizontal part of the magnetic yoke 104b, the other parts are provided on the upper surface of the lower horizontal part of the magnetic yoke 104b, and the first direct-moving slider 104c is provided on the lower surface of the lower horizontal part of the magnetic yoke 104b.

[0140] Next, the first mover 105 in the seventh variation will be described. The support body 105b is erected above the second linear slider 105c and extends to a position above the upper surface of the upper horizontal portion of the magnetic yoke 104b. The coil portion 105a is supported on the support body 105b in such a way that it is located in the middle of the vertical direction between the upper and lower horizontal portions of the magnetic yoke 104b.

[0141] Next, the second mover 106 in the seventh variation will be described. The second mover 106 has the same structure as in the embodiment, and the coil portion 106a is supported on the upper side of the support body 106b in such a way that it is located in the middle of the upper side horizontal portion and the lower side horizontal portion of the magnetic yoke 104b in the vertical direction.

[0142] Next, the linear sensor in the seventh modified example will be described. A scanning head 212 for the first mover 105 is connected to the upper surface of the support 105b of the first mover 105. A driven body, the same as that shown in the embodiment, is connected to the scanning head 212. The scanning head 214 for the stator 104 is supported on the upper surface of the support 216 fixed on the base 101.

[0143] Additionally, the worktable 100 includes: a scale 213 for a first mover 105 extending along the Y-axis direction on the upper surface of the upper horizontal portion of the magnetic yoke 104b; and a scale 215 for a stator 104 located on the side of the vertical portion of the magnetic yoke 104b covering approximately the entire area along the Y-axis direction. The scale 213 and an optical detection sensor (not shown) provided on the scanning head 212 constitute a first linear sensor. The scale 215 and an optical detection sensor (not shown) provided on the scanning head 214 constitute a second linear sensor.

[0144] A first linear sensor detects the position of the first mover 105 relative to the stator 104 in the Y-axis direction, and a second linear sensor detects the position of the stator 104 relative to the base 101 in the Y-axis direction. Based on the output of the first linear sensor, position control or speed control is performed to move the first mover 105 to the target position, and based on the output of the second linear sensor, position control or speed control is performed to move the stator 104 to the target position.

[0145] Generally, a Hall sensor is used in a motor. The Hall sensor refers to a sensor that applies a current magnetic effect called a Hall effect. The uses are generally rotation detection, position detection, opening / closing detection, current detection, azimuth detection, and the like. As a use in a linear motor, position detection that converts the strength and orientation of a magnetic field into a voltage.

[0146] In order to perform the canceling mechanism using the linear motor, it is necessary to be able to correctly detect the direction in which the coil portion 105a of the first mover 105 is to be moved and move the indicated distance when the magnet portion 104a of the stator 104 is moved. It is assumed that in the case where the phases of the first mover 105 and the stator 104 are different, insufficient torque and opposite actions can be thought of.

[0147] In the case where the linear sensor is used to detect the position (absolute position) of the first mover 105 with respect to the base 101, since the stator 104 is moved in the canceling action, the relative position of the first mover 105 and the stator 104 cannot be grasped. Therefore, it is necessary to detect the position of the first mover 105 with respect to the stator 104 using the Hall sensor provided to the coil portion 105a of the first mover 105 and control in such a manner that the phases of the first mover 105 and the stator 104 do not differ (become the same).

[0148] In the seventh modified example, the relative position of the first mover 105 and the stator 104 is grasped by installing the scale 215 for the first mover 105 on the stator 104 side. Thereby, it is possible to make the position of the scale 215 in the action of the stator 104 follow the arrangement of the magnetic poles of the magnet portion 104a. Therefore, even if the control is not performed, it is possible to grasp the relative positional relationship of the first mover 105 and the stator 104 and make the current having the correct phase (θ) flow in the coil of the first mover 105, and thus it is possible to correctly generate the thrust force by the linear motor. At this time, in order to move the first mover 105 to the destination position, it is necessary to consider the amount of movement of the stator 104 in the canceling action control. The amount of movement of the stator 104 in the canceling action control is found based on the time-velocity change of the stator 104 generated based on the weight ratio of the first mover 105 and the stator 104.

[0149] (Eighth Modified Example)

[0150] Use Figure 34 and Figure 35 The structure of the worktable in the eighth modified example is described. Figure 34 is a plan view of the worktable in the eighth modified example. Figure 35 is Figure 34 is a rear view of the worktable shown in FIG. 8.

[0151] In the seventh modification, the scale 213 for the first mover 105 and the scale 215 for the stator 104 are different scales. In the eighth modification, one scale 213 is provided to cover the entire area of the stator 104, and different positions of the same scale 213 are detected by the first linear sensor of the first mover 105 and the second linear sensor provided on the second mover 106 fixed to the base 101, respectively.

[0152] The following description applies the worktable in the embodiments or modifications to an embodiment of a chip mounter as one example of a chip mounter.

[0153] [Embodiment 1]

[0154] Figure 23 is a plan view showing an outline of the chip mounter in the first embodiment. Figure 24 is a view showing the operation of the pickup head and the mount head when viewed from the arrow A direction in Figure 23

[0155] The chip mounter 10 generally has a die supply section 1 for supplying a die D to be mounted on a substrate S, a pickup section 2, an intermediate stage section 3, a mount section 4, a conveyance section 5, a substrate supply section 6, a substrate conveyance-out section 7, and a control device 8 for monitoring and controlling the operation of each section. The Y-axis direction is the front-rear direction of the chip mounter 10, and the X-axis direction is the left-right direction. The die supply section 1 is disposed on the near side of the chip mounter 10, and the mount section 4 is disposed on the inner side. Here, one or more product areas (hereinafter referred to as package areas P) that eventually become single packages are printed on the substrate S.

[0156] First, the die supply section 1 supplies the die D to be mounted on the package area P of the substrate S. The die supply section 1 has a wafer holding table 12 that holds a wafer 11, and a peeling unit 13 shown by a broken line that peels the die D from the wafer 11. The die supply section 1 moves in the XY-axis directions by a driving mechanism not shown, and moves the die D to be picked up to the position of the peeling unit 13.

[0157] The pickup section 2 has a pickup head 21 that picks up the die D, a Y-axis drive section 23 of the pickup head 21 that moves the pickup head 21 in the Y-axis direction, and driving sections not shown that raise and lower, rotate, and move the collet 22 in the X-axis direction. The pickup head 21 has the collet 22 (see also Figure 24 ) that adsorptively holds the die D to be peeled at the front end, picks up the die D from the die supply section 1, and places it on the intermediate stage 31. The pickup head 21 has driving sections not shown that raise and lower, rotate, and move the collet 22 in the X-axis direction.

[0158] ​The intermediate stage 3 has an intermediate stage 31 for temporarily mounting the bare chip D, and a stage recognition camera 32 for recognizing the bare chip D on the intermediate stage 31.

[0159] The mounting unit 4 picks up the bare die D from the intermediate stage 31 and mounts it onto the packaging area P of the transported substrate S, or mounts it by stacking it onto the bare die already mounted on the packaging area P of the substrate S. The mounting unit 4 includes, similar to the pick-up head 21, a clip 42 for holding the bare die D at its front end (see also...). Figure 24 The system includes a placement head 41; a Y-axis drive unit 43 that moves the placement head 41 in the Y-axis direction; and a substrate recognition camera 44 that captures images of the position recognition mark (not shown) of the packaging area P of the substrate S and identifies the placement position. The Y-axis drive unit 43 is composed of one of the worktables in the embodiments and the first to fourth modifications, or a worktable composed of combinations thereof. The placement head 41 is the driven body 108 in the embodiment. With this structure, the placement head 41 corrects the pick-up position and posture based on the image data captured by the stage recognition camera 32, picks up the bare chip D from the intermediate stage 31, and places the bare chip D onto the substrate based on the image data captured by the substrate recognition camera 44.

[0160] The transport section 5 has a substrate transport claw 51 for gripping and transporting the substrate S, and a transport channel 52 for moving the substrate S. The substrate S is moved by driving a nut (not shown) on the substrate transport claw 51 provided in the transport channel 52 using a ball screw (not shown) provided along the transport channel 52. With this structure, the substrate S moves from the substrate supply section 6 along the transport channel 52 to the mounting position, and after mounting, moves to the substrate delivery section 7, where the substrate S is delivered.

[0161] The control device 8 corresponds to the control device 110 in the embodiment and includes: a memory that stores a program (software) that monitors and controls the operation of each part of the chip placement machine 10; and a central processing unit (CPU) that executes the program stored in the memory.

[0162] Next, use Figure 25 Explain the structure of bare chip supply unit 1. Figure 25 It means Figure 23 A schematic cross-sectional view of the main parts of the bare chip supply department.

[0163] The bare die supply unit 1 includes a wafer holding stage 12 that moves in the horizontal direction (XY plane) and a stripping unit 13 that moves in the vertical direction. The wafer holding stage 12 has an extension ring 15 that holds a wafer ring 14 and a support ring 17 that horizontally positions a dicing strip 16 held in the wafer ring 14 and to which multiple bare dies D are attached. The stripping unit 13 is disposed inside the support ring 17.

[0164] The die supply section 1 lowers the spreader ring 15 holding the wafer ring 14 when the die D is pushed. As a result, the dicing tape 16 held on the wafer ring 14 is stretched, the interval of the dies D is expanded, the die D is peeled from the dicing tape 16 by the peeling unit 13, and the pickup property of the die D is improved. Further, the adhesive bonding the die to the substrate changes from a liquid state to a film state, and a film-like adhesive material called die attach film (DAF) 18 is attached between the wafer 11 and the dicing tape 16. The wafer 11 with the die attach film 18 is cut. Therefore, the wafer 11 and the die attach film 18 are peeled from the dicing tape 16 in the peeling process.

[0165] Next, a manufacturing method of a semiconductor device using the chip mounter in the first embodiment will be described. Figure 26 A flowchart showing the manufacturing method of a semiconductor device using the chip mounter in the first embodiment will be described. Figure 26 Figure 23 A flowchart showing the manufacturing method of a semiconductor device using the chip mounter in the first embodiment will be described.

[0166] (Wafer, substrate carrying-in process (step Sll))

[0167] The wafer ring 14 holding the dicing tape 16 to which the die D separated from the wafer 11 is attached is stored in a wafer cassette (not shown) and carried into the chip mounter 10. The control device 8 supplies the wafer ring 14 from the wafer cassette filled with the wafer ring 14 to the die supply section 1. In addition, the substrate S is prepared and carried into the chip mounter 10. The control device 8 mounts the substrate S to the substrate carrying jaw 51 by the substrate supply section 6.

[0168] (Pickup process (step S12))

[0169] The control device 8 peels the die D from the wafer 11 as described above. Thus, the die D peeled from the dicing tape 16 together with the one piece of die attach film 18 is sucked and held by the collet 22 and carried to the next process (step S13). And, when the collet 22 carrying the die D to the next process returns to the die supply section 1, the next die D is peeled from the dicing tape 16 in accordance with the above step, and thereafter the die D is peeled one by one from the dicing tape 16 in accordance with the same step.

[0170] (Mounting process (step S13))

[0171] The control device 8 mounts the picked-up die on the substrate S or on the already mounted die. The control device 8 places the die D picked up from the wafer 11 on the intermediate stage 31 and picks up the die D again from the intermediate stage 31 by the mounting head 41 to mount it on the carried substrate S. ​

[0172] (Substrate unloading step: Step S14)

[0173] The control device 8 takes out the substrate S on which the die D is mounted from the substrate transfer chuck 51 by the substrate unloading section 7. The substrate S is unloaded from the die mounter 10.

[0174] As described above, the die D is mounted on the substrate S via the die adhesive film 18 and is unloaded from the die mounter. Then, in the wire bonding step, the die D is electrically connected to the electrodes of the substrate S via the Au wire. Next, the substrate S on which the die D is mounted is carried into the die mounter and the second die D is stacked on the die D mounted on the substrate S via the die adhesive film 18, and after the substrate S is unloaded from the die mounter, in the wire bonding step, the die D is electrically connected to the electrodes of the substrate S via the Au wire. The second die D is carried to the die mounting step after being peeled from the dicing tape 16 by the above-described method and is stacked on the die D. After the above-described steps are repeated a predetermined number of times, the substrate S is carried to the mold pressing step and the plurality of dies D and the Au wire are encapsulated with a mold resin (not shown), whereby the stacked package is completed.

[0175] [Example 2]

[0176] Figure 27 is a plan view showing an outline of the die mounter in the second embodiment.

[0177] The die mounter 10 in the second embodiment is generally composed of a wafer cassette elevator 311, a workpiece supply / carrier 305, a pretreatment section 302, a die mount section 304, and a control device 308 that monitors and controls the operation of each section.

[0178] The wafer cassette elevator 311 is provided with a wafer cassette 312 that is filled with the wafer ring 14. The workpiece supply / carrier 305 is provided with a frame pusher 353, a loading elevator 354, a frame feeder 355, a loader 356, and an unloader 357. The die mount section 304 is provided with a mount head 341 and a mount table 343. The pretreatment section 302 is provided with a pretreatment head 321 and a pretreatment table 323.

[0179] The wafer cassette 312 filled with the wafer ring 14 is set on the wafer cassette elevator 311, and the wafer ring 14 is supplied to the wafer ring holder 312. In parallel therewith, the workpiece supplied from the frame pusher 353 or the loading elevator 354 of the loader 356 is subjected to die adhesive application or cleaning by the pretreatment section 302 and is carried to the mount point on the frame feeder 355.

[0180] In the wafer ring holder 312, as in the first embodiment, the dicing tape (not shown) is stretched downward (expanded), the interval of the die (not shown) is enlarged, and the die pickup property is improved. Then, the die is pushed up from the lower side by the push-up section 313 via the dicing tape, picked up by the mounting head 341, and mounted on a workpiece (not shown) such as a lead frame. The wafer ring holder 312 is arranged on an XY linear table, linearly moved to the next die position after pickup, and repeatedly performs the die mounting operation.

[0181] The mounting head 341 is provided to a mounting table 343. The mounting table 343 is one of the tables in the embodiment and the first to fourth modified examples or a table in which several of these tables are combined. The pretreatment table 323 that drives the pretreatment head 321, the XY table that drives the wafer ring holder 312, and the XY table that drives the push-up section 313 can also be one of the tables in the embodiment and the first to fourth modified examples or a table in which these tables are combined.

[0182] The above describes the invention completed by the present inventors based on the embodiment, the modified examples, and the examples, but the present invention is not limited to the above-described embodiment, the modified examples, and the examples, and various modifications can of course be made.

[0183] For example, in the embodiment, an example of a table that moves the driving body in a horizontal plane is described, but it can also be applied to a table that moves the driving body in the upward and downward directions.

[0184] In the embodiment, an example of a mounting head is described as a driven body, but it can also be an optical system unit such as the substrate recognition camera in the first embodiment used in a chip mounting mechanism.

[0185] The first modified example describes an example in which acceleration is measured to suppress vibration, but vibration of a table of another unit or the like can also be acquired by a sensor that senses vibration and fed back to suppress vibration in the device. That is, using a sensor that senses vibration, vibration when another unit is operating is acquired, directly converted into an opposite phase, and an instruction is sent to the second mover 106 that moves the stator 104 that is a countermeasure, whereby vibration is suppressed. For example, the same configuration is provided for all three axes of XYZ, and the stator of an axis that is not actually operating is made to operate in a manner that cancels the resultant waveform of the acceleration calculated from the three-axis acceleration sensor or the linear sensor, whereby vibration is suppressed. Here, the first mover of the axis that is not operating operates in a manner that maintains the original position.

[0186] In addition, the Y-axis drive section 23 in the first embodiment can also be configured by one of the tables in the embodiment and the first to sixth modified examples or a table in which these tables are combined.

[0187] In addition, in the first embodiment, the chip mounter that picks up the bare chip from the bare chip supply section by the pickup head and places it on the intermediate stage, and mounts the bare chip placed on the intermediate stage on the substrate by the mount head is described, but the worktable in the embodiment can be applied to a flip chip mounter that picks up the bare chip from the bare chip supply section, rotates the bare chip pickup head upward to deliver the bare chip to a transfer head or a mount head, and mounts the bare chip on the substrate by the mount head.

Claims

1. A chip mounting apparatus, characterized in that, have: Driven body; and The worktable that drives the driven body. The workbench has the following features: Base; A linear motor having a first mover and a stator for moving the driven body; A first direct-drive guide is disposed between the base and the stator, allowing the stator to move freely; A second direct-acting guide is disposed between the base and the first moving element, allowing the first moving element to move freely; The second moving part is fixedly disposed on the base; and A control device that controls the first and second actuators. The control device is configured to suppress vibrations when the driven body moves by moving the first mover along the second linear guide in a first direction and by using the second mover to move the stator along the first linear guide in a second direction that is opposite to the first direction.

2. The chip mounting apparatus as described in claim 1, characterized in that, It has a first linear sensor for detecting the position of the first mover. The control device is configured to perform position control, speed control, or movement control towards the target position of the first mover based on the output of the first linear sensor.

3. The chip mounting apparatus as described in claim 2, characterized in that, It is equipped with a second linear sensor for detecting the position of the stator. The control device is configured to perform position control, speed control, or movement control to a target position on the stator based on the output of the second linear sensor.

4. The chip mounting apparatus as described in claim 1, characterized in that, have: A first linear sensor for detecting the position of the first mover relative to the stator; and A second linear sensor for detecting the position of the stator relative to the base. The control device is configured to perform position control, speed control, or movement control towards the target position of the first mover based on the outputs of the first linear sensor and the second linear sensor.

5. The chip mounting apparatus according to any one of claims 1 to 4, characterized in that, The control device is configured to use the second mover to move the stator along the first linear guide in a first direction, thereby expanding the range of motion of the first mover in the first direction.

6. The chip mounting apparatus according to any one of claims 1 to 4, characterized in that, The stator includes a plurality of permanent magnets and a magnetic yoke that couples the magnetic flux of a plurality of adjacent combinations of the permanent magnets. The first moving element includes: a first coil portion disposed above the stator and forming an electromagnet; and a support body disposed above the second direct-acting guide and supporting the first coil portion. The second mover includes: a second coil portion disposed above the stator and forming an electromagnet; and a support body disposed on the base and supporting the second coil portion.

7. The chip mounting apparatus as described in claim 1, characterized in that, The control device is configured such that, when the first mover is accelerated or decelerated, the stator controls the second mover based on a waveform that is out of phase with the acceleration time waveform in the first mover, thereby causing the stator to move.

8. The chip mounting apparatus as described in claim 7, characterized in that, The control device is configured to independently control the first mover and the second mover via a network, and to move the second mover in the same direction in parallel with the movement of the first mover.

9. The chip mounting apparatus as described in claim 8, characterized in that, The driven body has an acceleration sensor at its front end. The control device is configured such that, when the first mover is accelerated or decelerated, the acceleration sensor measures the waveform of the back-and-forth oscillation that accompanies the acceleration, and the waveform is reflected in the standard acceleration waveform that causes the stator to move using the second mover.

10. The chip mounting apparatus as described in claim 1, characterized in that, The control device is configured such that the center of gravity of the first mover and the stator together is always the same as the center of gravity before the start of the action when the first mover moves, and the second mover applies a thrust to the stator.

11. The chip mounting apparatus as described in claim 10, characterized in that, It also has two or more weight sensors. The weight sensor is disposed parallel to the first or second linear guide below the base, or disposed below both ends of the first and second linear guides and above the base. The control device is configured to store the weight detected by the weight sensor before the first mover moves, and to move the stator using the second mover in a manner that maintains weight balance based on the stored weight when the first mover moves.

12. The chip mounting apparatus as described in claim 1, characterized in that, It also includes other worktables different from the stated worktable, and sensors for detecting vibrations of the other worktables. The control device is configured to move the stator using the second mover based on the detected vibration.

13. The chip mounting apparatus according to any one of claims 1 to 4, characterized in that, The stator has multiple permanent magnets and a magnetic yoke that couples the magnetic flux of adjacent permanent magnets. When viewed from above, the portion of the stator that overlaps with the second mover is configured such that the permanent magnets are arranged more densely than in other portions of the stator.

14. The chip mounting apparatus as described in claim 1, characterized in that, Stabilizers or dampers for absorbing vertical vibrations are provided below both ends of the first linear guide.

15. The chip mounting apparatus according to any one of claims 1 to 4, characterized in that, The driven body is a mounting head that picks up bare chips and mounts them onto a substrate.

16. The chip mounting apparatus according to any one of claims 1 to 4, characterized in that, The driven body is a pretreatment head that applies bare chip adhesive to a substrate or cleans the substrate.

17. A chip mounting apparatus, characterized in that, have: Driven body; and The worktable that drives the driven body. The workbench has the following features: Base; A linear motor having a first mover and a stator for moving the driven body; A first direct-acting guide is disposed between the base and the stator, which allows the stator to move; Second mover; A second direct-acting guide is disposed between the base and the first and second moving parts, so as to move the first and second moving parts; The first fixing part is used to fix and release the stator; The second fixing part is used to fix and release the second moving part; and A control device that controls the first mover, the second mover, the first fixed part, and the second fixed part. The control device is configured to move the stator using the first fixing part and fix the second moving part using the second fixing part, thereby moving the first moving part along the second linear guide in a first direction and moving the stator along the first linear guide in a second direction opposite to the first direction, thereby suppressing vibration when the driven body moves.

18. The chip mounting apparatus as described in claim 17, characterized in that, The control device is configured to fix the stator using the first fixing part, and to enable the second moving part to move using the second fixing part, and to move the second moving part a predetermined distance in a first direction along the second linear guide. The first fixing part enables the stator to move, and the second fixing part fixes the second moving part. The second moving part causes the stator to move along the first linear guide in a second direction that is opposite to the first direction, thereby expanding the range of motion of the first moving part in the first direction.

19. The chip mounting apparatus as described in claim 17 or 18, characterized in that, The stator includes a plurality of permanent magnets and a magnetic yoke that couples the magnetic flux of a plurality of adjacent combinations of the permanent magnets. The first mover and the second mover each include: a coil portion disposed above the stator and forming an electromagnet; and a support body disposed above the second direct-acting guide and supporting the coil portion. The first fixing part is disposed close to the stator and is composed of an electromagnet. The second fixing part is an electromagnet provided on the support body of the second moving part.

20. The chip mounting apparatus as described in claim 17, characterized in that, The control device is configured such that, when the first mover is accelerated or decelerated, the stator controls the second mover based on a waveform that is out of phase with the acceleration time waveform in the first mover, thereby causing the stator to move.

21. The chip mounting apparatus as described in claim 20, characterized in that, The control device is configured to independently control the first mover and the second mover via a network, and to move the second mover in the same direction in parallel with the movement of the first mover.

22. The chip mounting apparatus as described in claim 21, characterized in that, The driven body has an acceleration sensor at its front end. The control device is configured such that, when the first mover is accelerated or decelerated, the acceleration sensor measures the waveform of the back-and-forth oscillation that accompanies the acceleration, and the waveform is reflected in the standard acceleration waveform that causes the stator to move using the second mover.

23. The chip mounting apparatus as described in claim 17, characterized in that, The control device is configured such that the center of gravity of the first mover and the stator together is always the same as the center of gravity before the start of the action when the first mover moves, and the second mover applies a thrust to the stator.

24. The chip mounting apparatus as described in claim 23, characterized in that, It also has two or more weight sensors. The weight sensor is disposed parallel to the first or second linear guide below the base, or disposed below both ends of the first and second linear guides and above the base. The control device is configured to store the weight detected by the weight sensor before the first mover moves, and to move the stator using the second mover in a manner that maintains weight balance based on the stored weight when the first mover moves.

25. The chip mounting apparatus as described in claim 17, characterized in that, It also includes other worktables different from the stated worktable, and sensors for detecting vibrations of the other worktables. The control device is configured to move the stator using the second mover based on the detected vibration.

26. The chip mounting apparatus as described in claim 17 or 18, characterized in that, The stator has multiple permanent magnets and a magnetic yoke that couples the magnetic flux of adjacent permanent magnets. When viewed from above, the portion of the stator that overlaps with the second mover is configured such that the permanent magnets are arranged more densely than in other portions of the stator.

27. The chip mounting apparatus as described in claim 17, characterized in that, Stabilizers or dampers for absorbing vertical vibrations are provided below both ends of the first linear guide.

28. The chip mounting apparatus as described in claim 17 or 18, characterized in that, The driven body is a mounting head that picks up bare chips and mounts them onto a substrate.

29. The chip mounting apparatus as described in claim 17 or 18, characterized in that, The driven body is a pretreatment head that applies bare chip adhesive to a substrate or cleans the substrate.

30. A chip mounting apparatus, characterized in that, have: Driven body; and The worktable that drives the driven body. The workbench has the following features: Base; A linear motor having a first mover and a stator for moving the driven body; A first direct-acting guide is disposed between the base and the stator, which allows the stator to move; Second mover; A second direct-acting guide is disposed between the base and the first and second moving parts, so as to move the first and second moving parts; The first fixing part is used to fix and release the stator; The second fixing part is used to fix and release the second moving part; and A control device that controls the first mover, the second mover, the first fixed part, and the second fixed part. The control device is configured to fix the stator using the first fixing part and to move the second moving part using the second fixing part, thereby causing the first moving part to move along the second linear guide in a first direction and the second moving part to move along the second linear guide in a second direction that is opposite to the first direction, thereby suppressing vibration when the driven body moves.

31. The chip mounting apparatus as described in claim 30, characterized in that, The control device is configured to fix the stator using the first fixing part, and to enable the second moving part to move using the second fixing part, and to move the second moving part a predetermined distance in a first direction along the second linear guide. The first fixing part enables the stator to move, and the second fixing part fixes the second moving part. The second moving part causes the stator to move along the first linear guide in a second direction that is opposite to the first direction, thereby expanding the range of motion of the first moving part in the first direction.

32. The chip mounting apparatus as described in claim 30 or 31, characterized in that, The stator includes a plurality of permanent magnets and a magnetic yoke that couples the magnetic flux of a plurality of adjacent combinations of the permanent magnets. The first mover and the second mover each include: a coil portion disposed above the stator and forming an electromagnet; and a support body disposed above the second direct-acting guide and supporting the coil portion. The first fixing part is disposed close to the stator and is composed of an electromagnet. The second fixing part is an electromagnet provided on the support body of the second moving part.

33. The chip mounting apparatus as described in claim 30, characterized in that, The control device is configured such that, when the first mover is accelerated or decelerated, the stator controls the second mover based on a waveform that is out of phase with the acceleration time waveform in the first mover, thereby causing the stator to move.

34. The chip mounting apparatus as described in claim 33, characterized in that, The control device is configured to independently control the first mover and the second mover via a network, and to move the second mover in the same direction in parallel with the movement of the first mover.

35. The chip mounting apparatus as described in claim 34, characterized in that, The driven body has an acceleration sensor at its front end. The control device is configured such that, when the first mover is accelerated or decelerated, the acceleration sensor measures the waveform of the back-and-forth oscillation that accompanies the acceleration, and the waveform is reflected in the standard acceleration waveform that causes the stator to move using the second mover.

36. The chip mounting apparatus as described in claim 30, characterized in that, The control device is configured such that the center of gravity of the first mover and the stator together is always the same as the center of gravity before the start of the action when the first mover moves, and the second mover applies a thrust to the stator.

37. The chip mounting apparatus as described in claim 36, characterized in that, It also has two or more weight sensors. The weight sensor is disposed parallel to the first or second linear guide below the base, or disposed below both ends of the first and second linear guides and above the base. The control device is configured to store the weight detected by the weight sensor before the first mover moves, and to move the stator using the second mover in a manner that maintains weight balance based on the stored weight when the first mover moves.

38. The chip mounting apparatus as described in claim 30, characterized in that, It also includes other worktables different from the stated worktable, and sensors for detecting vibrations of the other worktables. The control device is configured to move the stator using the second mover based on the detected vibration.

39. The chip mounting apparatus as described in claim 30 or 31, characterized in that, The stator has multiple permanent magnets and a magnetic yoke that couples the magnetic flux of adjacent permanent magnets. When viewed from above, the portion of the stator that overlaps with the second mover is configured such that the permanent magnets are arranged more densely than in other portions of the stator.

40. The chip mounting apparatus as described in claim 30, characterized in that, Stabilizers or dampers for absorbing vertical vibrations are provided below both ends of the first linear guide.

41. The chip mounting apparatus as described in claim 30 or 31, characterized in that, The driven body is a mounting head that picks up bare chips and mounts them onto a substrate.

42. The chip mounting apparatus as described in claim 30 or 31, characterized in that, The driven body is a pretreatment head that applies bare chip adhesive to a substrate or cleans the substrate.

43. A method for manufacturing a semiconductor device, characterized in that, have: In the substrate loading process, a substrate is loaded into a chip mounting apparatus, wherein the chip mounting apparatus includes: a mounting head; a worktable for driving the mounting head; a base; a linear motor having a first mover and a stator for moving the mounting head in a horizontal plane; and a first linear guide disposed between the base and the stator for allowing the stator to move freely. A second linear guide is provided between the base and the first mover, allowing the first mover to move freely; and a second mover is fixedly provided on the base; and In the mounting process, a bare chip is picked up and mounted onto the substrate. In the mounting process, the first mover is moved along the second linear guide in a first direction, and the second mover is used to move the stator along the first linear guide in a second direction that is opposite to the first direction.

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