A guide structure for taking and placing wafers

Abstract

The present invention provides a guide structure for taking and placing wafers, comprising: a wafer box, a plurality of wafer box slots are arranged in the wafer box, and the wafer box is provided with a first take-in and put-out port; a guide structure main body, connected to the side of the wafer box where the first take-in and put-out port is arranged, the guide structure main body is provided with a second take-in and put-out port connected with the first take-in and put-out port, a guide structure slot is arranged in the guide structure main body, the side of the guide structure slot close to the first take-in and put-out port is connected with the wafer box slot, and the guide structure slot gradually expands along the wafer removal path. The present invention solves the problem of wafer breakage caused by the wafer box slot being too narrow in the wafer box by arranging the guide structure main body and the guide structure slot therein.

Description

Technical Field

[0001] The invention relates to the technical field of wafers, and in particular to a guiding structure for taking and placing wafers. Background Art

[0002] In the field of semiconductor manufacturing, wafers are processed through processes such as lithography, etching, and physical / chemical deposition to realize chip structures on wafers. This process is called semiconductor wafer manufacturing. In a complete set of semiconductor manufacturing processes, semiconductor wafers need to go through multiple process steps. Semiconductor wafers are thin slices of semiconductor materials. During the transfer, loading and unloading processes of each process, wafers are prone to damage and contamination. In order to avoid the above abnormalities in production and to meet the needs of large-scale production, wafers are usually placed in multi-wafer boxes (cassettes) for transfer. Wafer boxes such as Figure 4 and 5 As shown, a slot is provided in the wafer box, and the wafer is fixed in the slot.

[0003] During the loading process of the semiconductor process, the wafer needs to be taken out of the wafer box, and during the unloading process after the process, the wafer needs to be placed in the corresponding card slot of the wafer box. For fragile wafers (compound semiconductor wafers), during the wafer placement process, especially the process that requires manual placement, the wafer is easy to get stuck in the card slot of the wafer box, causing the wafer to break, seriously affecting the production yield. Summary of the invention

[0004] The present invention provides a guide structure for taking and placing a wafer, so as to solve the above technical problem.

[0005] In order to solve the above technical problems, the present invention discloses a guide structure for taking and placing a wafer, comprising:

[0006] A wafer box, wherein a plurality of wafer box slots are arranged in the wafer box, and the wafer box is provided with a first loading and unloading port;

[0007] The guide structure body is connected to the side of the wafer box where the first pick-up and release port is set. The guide structure body is provided with a second pick-up and release port connected with the first pick-up and release port. A guide structure slot is set in the guide structure body. The side of the guide structure slot close to the first pick-up and release port is connected with the wafer box slot. The guide structure slot gradually expands in width along the wafer removal path.

[0008] Preferably, the wafer box is a structure with first access openings provided on two opposite sides, and the wafer box card slots are provided on the inner walls at the upper and lower ends of the wafer box;

[0009] The guide structure main body is a structure with second pick-up and release ports on two relatively sides, a first pick-up and release port of the wafer box is fixedly connected and communicated with a second pick-up and release port of the guide structure main body, the guide structure card slot is arranged on the inner walls at the upper and lower ends of the guide structure main body, and the side of the guide structure card slot close to the second pick-up and release port is communicated with the side of the wafer box card slot close to the first pick-up and release port.

[0010] Preferably, the opening of the guide structure slot is greater than or equal to 5 mm.

[0011] Preferably, when the wafer is a 3-inch wafer, the depth of the guide structure slot is greater than or equal to 80 mm, and the opening of the guide structure slot is greater than or equal to 5 mm.

[0012] Preferably, when the wafer is a 4-inch wafer, the depth of the guide structure slot is greater than or equal to 110 mm, and the opening of the guide structure slot is greater than or equal to 8 mm.

[0013] Preferably, the guiding structure main body is connected to the wafer box via a positioning structure.

[0014] Preferably,

[0015] The first access openings are arranged on the left and right sides of the wafer box, and the wafer box slots are arranged on the inner walls at the upper and lower ends of the wafer box;

[0016] The guide structure for taking and placing wafers further includes: a limiting device, which is arranged on the wafer box;

[0017] The limiting device comprises:

[0018] Two limit assemblies are arranged at the upper and lower ends of the wafer box or at the front and rear sides of the wafer box;

[0019] The limiting component comprises:

[0020] An L-shaped fixed bracket is composed of a horizontal section and a vertical section fixedly connected to the lower end of the horizontal section, the lower end of the vertical section is fixedly connected to the outer wall of the wafer box, the horizontal section extends in the left-right direction and is arranged toward the first access opening, the outer wall of the wafer box is provided with a first slide groove in the left-right direction, the vertical section is provided with a horizontal through hole parallel to the first slide groove, a second slide groove in the left-right direction is provided on a side of the horizontal section away from the wafer box, and a second slider is slidably connected in the second slide groove;

[0021] A mounting bracket, fixedly connected to the outer wall of the wafer box and located on a side of the vertical section away from the horizontal section;

[0022] A first sliding block, located inside the L-shaped fixed bracket, one end of the first sliding block being slidably connected to the first sliding groove on the outer wall of the wafer box;

[0023] A spring, one end of which is fixedly connected to the first sliding block, and the other end of which is fixedly connected to the inner side wall of the L-shaped fixing bracket;

[0024] An electric winding wheel is mounted on the mounting bracket, a pull rope is wound around the electric winding wheel, and one end of the pull rope passes through the horizontal through hole and is fixedly connected to the first sliding block;

[0025] A rotating rod, one end of which is rotatably connected to the first sliding block, the rotating rod is provided with a third sliding groove, and a pulley is slidably connected in the third sliding groove;

[0026] A limiting plate connected to the other end of the rotating rod;

[0027] A first connecting rod, fixedly connected to the second sliding block, wherein one end of the first connecting rod close to the rotating rod is connected to the pulley through a second connecting rod;

[0028] A fixed plate, fixedly connected to the other end of the first connecting rod;

[0029] An electric telescopic rod is arranged parallel to the second slide groove, the fixed end of the electric telescopic rod is fixedly connected to the L-shaped fixed bracket, and the telescopic end of the electric telescopic rod is fixedly connected to the fixed plate;

[0030] The microcontroller is electrically connected to the electric telescopic rod and the electric winding wheel.

[0031] Preferably, the second connecting rod is electrically connected to the microcontroller, one end of the second connecting rod is rotationally connected to the first connecting rod, and the other end of the second connecting rod is rotationally connected to the pulley.

[0032] Preferably, the second access openings are arranged on both the left and right sides of the guide structure body, and the guide structure slots are arranged on the inner walls at the upper and lower ends of the guide structure body;

[0033] The guide structure for taking and placing wafers further includes: a dust removal device connected to the front side or the rear side of the guide structure body;

[0034] The dust removal device comprises:

[0035] A housing, fixedly connected to the front side or the rear side of the guide structure body, wherein the front side or the rear side wall of the guide structure body is provided with an arc-shaped through hole;

[0036] A fourth slide groove is arranged on the front side or rear side wall of the guide structure body, and a third sliding block is slidably connected in the fourth slide groove;

[0037] A fifth slide groove, wherein a fifth slide groove is provided on the front side or the rear side wall of the guide structure body, another fifth slide groove is provided on the side wall of the shell body opposite to the fifth slide groove, and a fourth slider is slidably connected in both the fifth slide grooves, and the fifth slide groove is located below the fourth slide groove;

[0038] A fourth connecting rod, both ends of which are fixedly connected to the two fourth sliding blocks respectively, a second through hole along the left-right direction is provided in the fourth connecting rod, and a sliding rod is slidably connected in the second through hole;

[0039] A turntable is rotatably connected in the housing via first rotating shafts arranged at the front and rear, and a sliding rod is fixedly connected to the turntable;

[0040] A driving motor, disposed in the housing, for driving the turntable;

[0041] A rack, arranged in the housing, one end of which is fixedly connected to the third slider via a third connecting rod, and the other end of which is fixedly connected to the fourth connecting rod;

[0042] A second rotating shaft is parallel to the fourth connecting rod, and two ends of the second rotating shaft are respectively rotatably connected to the side walls of the housing where the two fifth sliding grooves are located or the side walls of the guide structure body;

[0043] A gear, fixedly connected to the second rotating shaft, the gear meshing with the rack for transmission;

[0044] a fifth connecting rod, disposed in the housing and parallel to the rack, wherein one end of the fifth connecting rod is connected to the second rotating shaft;

[0045] A dust removal member is arranged in the housing and is located at the other end of the fifth connecting rod. The output end of the dust removal member is connected to a dust removal pipe, which is connected to the arc-shaped through hole.

[0046] Preferably, the second access openings are arranged on both the left and right sides of the guide structure body, and the guide structure slots are arranged on the inner walls at the upper and lower ends of the guide structure body;

[0047] A plurality of pressure detection devices are arranged at intervals along a reference pick-and-place path of the wafers on the inner wall of the bottom end of the guide structure slot near the wafer box;

[0048] The guide structure for placing and picking up the wafer also includes:

[0049] A displacement detection device is arranged on the guide structure slot, or on the inner walls at the front and rear sides of the guide structure body;

[0050] A plurality of first detection devices are arranged at different positions of the docking place between the guide structure slot and the wafer box slot, and are used to obtain the deviation information of the guide structure slot and the wafer box slot at the docking place between the guide structure slot and the wafer box slot, wherein the deviation information includes horizontal deviation information and vertical deviation information;

[0051] A memory storing a reference pick-and-place path of a wafer;

[0052] A controller, a first alarm, and a second alarm, wherein the controller is electrically connected to the pressure detection device, the displacement detection device, the first detection device, the first alarm, the second alarm, and the memory;

[0053] The controller controls the first alarm and the second alarm to work based on the pressure detection device, the displacement detection device, the memory, and the first detection device, including the following steps:

[0054] Step 1: Before placing the wafer, the controller calculates a comprehensive deviation evaluation value based on the first detection device and formula (1);

[0055]

[0056] Wherein, a-a0>0, b-b0>0, P is the comprehensive deviation evaluation value, N is the total number of the first detection devices, A i is the horizontal deviation value obtained based on the i-th first detection device, a is the slot width of the guide structure slot at the junction of the wafer box slot and the guide structure slot, a0 is the slot width of the wafer box slot at the junction of the wafer box slot and the guide structure slot, b is the height of the guide structure slot at the junction of the wafer box slot and the guide structure slot, b0 is the height of the wafer box slot at the junction of the wafer box slot and the guide structure slot, B i is the vertical deviation value obtained based on the i-th first detection device;

[0057] Step 2: The controller compares the comprehensive deviation evaluation value with a preset deviation reference value. When the comprehensive deviation evaluation value is greater than or equal to the preset deviation reference value, the controller controls the first alarm to alarm; when the comprehensive deviation evaluation value is less than the preset deviation reference value, the controller does not trigger the first alarm;

[0058] Step 3: During wafer placement, the controller constructs an actual pick-and-place path based on the displacement detection device, obtains the reference pick-and-place path based on the memory, and divides the actual pick-and-place path and the reference pick-and-place path into several sections based on the position of the pressure detection device on the reference pick-and-place path. The reference pick-and-place path or the actual pick-and-place path between adjacent pressure detection devices is one section.

[0059] The controller compares the similarity of the actual pick-and-place path of each segment with the corresponding reference pick-and-place path;

[0060] Step 4: When the controller does not trigger the first alarm in step 2, the controller calculates the wafer breakage assessment value based on the comprehensive deviation assessment value calculated in step 1, step 3, the pressure detection device and formula (2); when the wafer breakage assessment value is greater than or equal to the corresponding wafer breakage reference value, the controller controls the second alarm to sound an alarm; when the wafer breakage assessment value is less than the corresponding wafer breakage reference value, the controller does not trigger the alarm;

[0061]

[0062] Wherein, Q is the wafer breakage assessment value, K1 is the first preset weight, K2 is the second preset weight, M is the total number of pressure detection devices, S M is the detection value of the Mth pressure detection device, S j is the detection value of the jth pressure detection device, L j is the similarity between the first section of the reference pick-and-place path at the jth pressure detection device and the corresponding section of the actual pick-and-place path, L M-1 It is the similarity between the section after the M-1th pressure detection device in the reference pick-up and placement path and the corresponding section of the actual pick-up and placement path.

[0063] The technical solution of the present invention is further described in detail below through the accompanying drawings and embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0064] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0065] Figure 1 It is a structural schematic diagram of the connection between the wafer box and the guide structure main body of the present invention.

[0066] Figure 2 This is a bird's-eye view of an embodiment of the guiding structure body of the present invention.

[0067] Figure 3 for Figure 2 Front view of the main body of the guide structure.

[0068] Figure 4 Aerial view of a wafer cassette in the prior art where wafers are placed.

[0069] Figure 5 for Figure 4 Front view of the wafer cassette.

[0070] Figure 6 A schematic structural diagram of an embodiment of a position limiting device of the present invention.

[0071] Figure 7 A schematic structural diagram of an embodiment of a dust removal device of the present invention.

[0072] In the figure: 1, wafer box; 11, wafer box slot; 12, first access port; 2, guide structure body; 21, second access port; 22, guide structure slot; 221, opening of guide structure slot; 3, limit assembly; 31, L-shaped fixing bracket; 3101, horizontal section; 3102, vertical section; 32, second slider; 33, mounting bracket; 34, first slider; 35, spring; 36, electric winding wheel; 361, pull rope; 37, rotating rod; 38, limit plate; 39, first connecting rod; 310, Pulley; 311, fixed plate; 312, electric telescopic rod; 313, third slide groove; 314, second connecting rod; 4, dust removal device; 41, shell; 42, fourth slide groove; 43, fifth slide groove; 44, fourth connecting rod; 45, third slider; 46, fourth slider; 47, turntable; 48, arc-shaped through hole; 49, slide rod; 410, rack; 411, second rotating shaft; 412, gear; 413, fifth connecting rod; 414, dust removal part; 415, dust removal pipe; 416, second through hole; 5, wafer. DETAILED DESCRIPTION

[0073] The preferred embodiments of the present invention are described below in conjunction with the accompanying drawings. It should be understood that the preferred embodiments described herein are only used to illustrate and explain the present invention, and are not used to limit the present invention.

[0074] In addition, in the present invention, the descriptions of "first", "second", etc. are only used for descriptive purposes, and do not specifically refer to the order or sequence, nor are they used to limit the present invention. They are only used to distinguish components or operations described with the same technical terms, and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the technical solutions and technical features between the various embodiments can be combined with each other, but they must be based on the ability of ordinary technicians in the field to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0075] A guide structure for placing and picking up wafers, such as Figure 1-5 As shown, including:

[0076] A wafer box 1, wherein a plurality of wafer box slots 11 are arranged in the wafer box 1, and a first loading and unloading port 12 is arranged in the wafer box 1;

[0077] The guide structure main body 2 is connected to the side of the wafer box 1 where the first pick-up and release port 12 is set. The guide structure main body 2 is provided with a second pick-up and release port 21 connected to the first pick-up and release port 12. A guide structure slot 22 is set in the guide structure main body 2. The side of the guide structure slot 22 close to the first pick-up and release port is connected to the wafer box slot 11.

[0078] Preferably, the guide structure main body 2 is detachably connected to a side of the wafer box 1 where the first loading and unloading port 12 is provided; preferably, the guide structure main body 2 is connected to the wafer box 1 via a positioning structure; the positioning structure may be an existing positioning structure, or may be the following structure: a positioning hole, provided on the wafer box, a positioning rod, used to be inserted into the positioning hole, the positioning rod being provided on the guide structure main body to ensure reliable positioning; preferably, the positioning structure corresponding to the above-mentioned positioning hole may also include: a connecting plate, connecting plates parallel to their respective docking surfaces are respectively provided on both sides of a side where the guide structure main body and the wafer box are docked with each other, and the connecting plates on the wafer box and the guide structure main body are connected by a bolt and nut assembly.

[0079] Preferably, the guide structure slot 22 gradually expands in width along the wafer 5 removal path, that is, the guide structure slot 22 gradually expands in width along the direction from the first access port 12 to the second access port 21. Preferably, the width of the guide structure slot 22 on the side close to the first access port (and the side connected to the wafer box slot) may be equal to or greater than the wafer box slot width;

[0080] Preferably, the depth of the guide structure slot 22 is designed according to the size of the wafer, and the size of the opening 221 of the guide structure slot (i.e., the opening of the guide structure slot away from the first access opening, which is the opening for manually accessing the wafer) is designed according to the number of wafers to be accessed and the ease of access, preferably ≥ 5mm. Avoid the guide structure slot being too narrow, which makes it difficult to access the wafer.

[0081] The working principle and beneficial effects of the above technical solution are:

[0082] The present invention is based on the existing wafer box and sets the guide structure body. During the wafer loading process, the wafer box and the guide structure body are fixed together (such as Figure 1 As shown in the figure, firstly, the wafers are placed one by one in the guide structure slots on the guide structure, and the wafers are pushed along the guide structure slots into the wafer box slots of the wafer box, and then the wafer box is taken out from the guide structure body and placed (as shown in the figure). Figure 1 The side view state is restored to the wafers being placed with intervals up and down), completing the wafer placing operation; in the wafer taking process, the wafers are pushed from the wafer box slots in the wafer box to the guide structure slots, and then the wafers are taken out one by one to complete the wafer taking operation.

[0083] Since manual wafer placement is completed in the guide structure slot in the guide structure main body, during the wafer placement process, the wafer is first placed in the guide structure main body. Relative to the wafer box slot of the wafer box, the guide structure slot gradually expands along the removal path. Since the opening of the guide structure (that is, the opening of the guide structure slot away from the first placement port, which is the opening for manual wafer placement) is relatively large, even manual operation will not cause the wafer to get stuck or break.

[0084] The guiding structure body and the guiding structure slot inside it solve the problem that the wafer is stuck and broken because the wafer box slot inside the wafer box is too narrow;

[0085] In summary, the present invention solves the problem in the prior art that fragile wafers (compound semiconductor wafers) are easily stuck in the card slot of the wafer box during the wafer picking and placing process, especially the process that requires manual picking and placing, causing the wafers to break, seriously affecting the production yield.

[0086] In one embodiment,

[0087] The wafer box 1 is a structure in which first access openings 12 are provided on two opposite sides (such as the front and rear sides), and the wafer box card slots 11 are provided on the inner walls of the upper and lower ends of the wafer box 1;

[0088] The guide structure main body 2 is a structure with second pick-up and release ports 21 on both relatively sides (such as the front and rear sides), a first pick-up and release port 12 of the wafer box 1 is fixedly connected and communicated with a second pick-up and release port 21 of the guide structure main body 2, and the guide structure card slot 22 is arranged on the inner walls at the upper and lower ends of the guide structure main body 2, and the side of the guide structure card slot 22 close to the second pick-up and release port 21 is communicated with the side of the wafer box card slot 11 close to the first pick-up and release port 12.

[0089] The working principle and beneficial effects of the above technical solution are as follows: the arrangement of the above technical solution facilitates the taking and placing of wafers.

[0090] In one embodiment, Figure 2-3 As shown, when the wafer 5 is a 3-inch wafer 5 , the depth of the guide structure slot 22 is greater than or equal to 80 mm, and the opening 221 of the guide structure slot is greater than or equal to 5 mm.

[0091] The working principle and beneficial effects of the above technical solution are as follows: the size of the guide structure slot 22 is set to facilitate the placement and removal of wafers.

[0092] In one embodiment, Figure 4-5As shown, when the wafer 5 is a 4-inch wafer 5, the depth of the guide structure slot 22 is greater than or equal to 110 mm, and the opening 221 of the guide structure slot is greater than or equal to 8 mm.

[0093] The working principle and beneficial effects of the above technical solution are as follows: the size of the guide structure slot 22 is set to facilitate the placement and removal of wafers.

[0094] In one embodiment, Figure 6 As shown, the first access openings 12 are arranged on the left and right sides of the wafer box 1, and the wafer box card slots 11 are arranged on the inner walls of the upper and lower ends of the wafer box 1;

[0095] The guide structure for taking and placing the wafer 5 further includes: a limiting device, which is arranged on the wafer box 1;

[0096] The limiting device comprises:

[0097] Two limit assemblies 3 are arranged at the upper and lower ends of the wafer box 1 or at the front and rear sides of the wafer box 1;

[0098] The limiting component 3 includes:

[0099] The L-shaped fixed bracket 31 is composed of a horizontal section 3101 and a vertical section 3102 fixedly connected to the lower end of the horizontal section 3101, the lower end of the vertical section 3102 is fixedly connected to the outer wall of the wafer box 1 (when the limit assembly is only provided at the upper and lower ends of the wafer box 1, the lower end of the vertical section is connected to the inner wall of the upper end or the lower end of the wafer box), the horizontal section 3101 extends in the left-right direction and is provided toward the first loading and unloading port 12, the outer wall of the wafer box 1 is provided with a first slide groove in the left-right direction, the vertical section 3102 is provided with a horizontal through hole parallel to the first slide groove, and a second slide groove in the left-right direction is provided on the side of the horizontal section 3101 away from the wafer box 1, and a second slider 32 is slidably connected in the second slide groove;

[0100] A mounting bracket 33, fixedly connected to the outer wall of the wafer box 1, and located on a side of the vertical section 3102 away from the horizontal section 3101;

[0101] A first sliding block 34 is located inside the L-shaped fixing bracket 31 , and one end of the first sliding block 34 is slidably connected to the first sliding groove on the outer wall of the wafer box 1 ;

[0102] A spring 35, one end of which is fixedly connected to the first slider 34, and the other end of which is fixedly connected to the inner wall of the L-shaped fixing bracket;

[0103] An electric winding wheel 36 is mounted on the mounting bracket 33. A pull rope 361 is wound around the electric winding wheel 36. One end of the pull rope 361 passes through the horizontal through hole and is fixedly connected to the first slider 34.

[0104] The rotating rod 37 has one end rotatably connected to the first slider 34, and a third slide groove 313 is provided on the rotating rod 37, and a pulley 310 is slidably connected in the third slide groove 313; (Specifically, when the limit assembly is provided at the upper and lower ends of the wafer box 1, one end of the rotating rod is rotatably connected to the front side of the first slider through the rotating shaft provided at the front and rear, and the second connecting rod is connected to the rear side of the pulley)

[0105] A limiting plate 38 connected to the other end of the rotating rod 37;

[0106] A first connecting rod 39 is fixedly connected to the second sliding block 32, and one end of the first connecting rod 39 close to the rotating rod 37 is connected to the pulley 310 through a second connecting rod;

[0107] A fixing plate 311, fixedly connected to the other end of the first connecting rod 39;

[0108] An electric telescopic rod 312 is arranged parallel to the second slide groove, the fixed end of the electric telescopic rod 312 is fixedly connected to the L-shaped fixed bracket 31, and the telescopic end of the electric telescopic rod 312 is fixedly connected to the fixed plate 311;

[0109] The microcontroller is electrically connected to the electric telescopic rod and the electric winding wheel.

[0110] The working principle and beneficial effects of the above technical solution are as follows: when it is necessary to take or place a wafer in the wafer box, the controller controls the electric telescopic rod to extend to the right, the upper first connecting rod drives the upper rotating rod to rotate clockwise, and the lower first connecting rod drives the lower rotating rod to rotate counterclockwise, so that the limit plates connected to the two rotating rods are away from each other and away from the first taking or placing opening (such as Figure 6 ), so as to facilitate the placement and pickup of wafers. When the wafer is placed, the controller controls the electric telescopic rod to restore the two limit plates to be close to each other, and the wafer is limited to prevent the wafer from falling from the first placement and pickup port due to operational errors during transportation. The length of the electric telescopic rod can be controlled, and the position of the pulley on the rotating rod can be adjusted, so that the limit plates can be pressed at different positions by the pulley to meet different pressing requirements;

[0111] The controller controls the electric winding wheel to rotate, driving the pull rope to move left and right, so that the first slider moves left and right in the first slide slot, thereby adjusting the distance that the limit plate exceeds the first pick-up and release port to adapt to wafers of different sizes. Even if the size of the wafer is larger than the wafer box, it can be limited, making the present invention more widely used;

[0112] The guiding effect of the first slider, the guiding effect of the second slider, and the guiding effect of the pull rope in the horizontal through hole improve the movement stability of the present invention.

[0113] In one embodiment, the second connecting rod is electrically connected to the microcontroller, one end of the second connecting rod is rotationally connected to the first connecting rod, and the other end of the second connecting rod is rotationally connected to the pulley.

[0114] The working principle and beneficial effects of the above technical solution are:

[0115] The controller controls the electric winding wheel to rotate, driving the pull rope to move left and right, so that the first slider moves left and right in the first slide groove, so as to adjust the distance that the limit plate exceeds the first pick-up and release port to adapt to wafers of different sizes. Even if the wafer size is larger than the wafer box, it can be limited, making the application of the present invention more extensive; and in this process, the extension length of the second connecting rod can be controlled by the controller to ensure that the rotating rod is always in a horizontal position, and then the left and right movement can realize pushing the wafer into the wafer box through the limit plate, realizing automatic pushing, and can push several wafers at a time to improve work efficiency.

[0116] In addition, when it is necessary to take or place a wafer in the wafer box, the controller controls the electric telescopic rod to extend to the right, the upper first connecting rod drives the upper rotating rod to rotate clockwise, and the lower first connecting rod drives the lower rotating rod to rotate counterclockwise, so that the limit plates connected to the two rotating rods move away from each other and away from the first taking or placing opening (such as Figure 6 ), so as to facilitate the placement and pickup of wafers. When the wafer is placed, the controller controls the electric telescopic rod to restore the two limit plates to be close to each other, and the wafer is limited to prevent the wafer from falling from the first placement and pickup port due to operational errors during transportation. The length of the electric telescopic rod can be controlled to adjust the position of the pulley on the rotating rod, so that the limit plates can be pressed at different positions by the pulley to meet different pressing requirements, and the pressing force of the pulley can be adjusted by adjusting the length of the second connecting rod.

[0117] In one embodiment, the second access openings 21 are provided on both the left and right sides of the guide structure body 2, and the guide structure slots 22 are provided on the inner walls at the upper and lower ends of the guide structure body;

[0118] The guide structure for placing and taking the wafer 5 further includes: a dust removal device 4 connected to the front side or the rear side of the guide structure body 2; Figure 7 As shown,

[0119] The dust removal device 4 comprises:

[0120] A housing 41, fixedly connected to the front side or the rear side of the guide structure body 2, and an arc-shaped through hole 48 is provided on the front side or the rear side wall of the guide structure body 2;

[0121] A fourth slide groove 42 is provided on the front side or rear side wall of the guide structure main body 2, and a third slider 45 is slidably connected in the fourth slide groove 42;

[0122] A fifth slide groove 43, a fifth slide groove 43 is provided on the front or rear side wall of the guide structure main body 2, another fifth slide groove 43 is provided on a side wall of the housing 41 opposite to the fifth slide groove 43, and a fourth slider 46 is slidably connected in both fifth slide grooves 43, and the fifth slide groove 43 is located below the fourth slide groove 42;

[0123] The fourth connecting rod 44 has two ends fixedly connected to two fourth sliding blocks 46 respectively. A second through hole along the left-right direction is provided in the fourth connecting rod 44. A sliding rod 49 is slidably connected in the second through hole 416.

[0124] A rotating disk 47 is rotatably connected to the housing 41 via first rotating shafts arranged at the front and rear, and a sliding rod 49 is fixedly connected to the rotating disk 47;

[0125] A driving motor, disposed in the housing 41, for driving the rotating disk 47;

[0126] A rack 410 is disposed in the housing 41, one end of which is fixedly connected to the third slider 45 via a third connecting rod, and the other end of which is fixedly connected to the fourth connecting rod;

[0127] The second rotating shaft 411 is parallel to the fourth connecting rod 44, and the two ends of the second rotating shaft 411 are respectively rotatably connected to the side walls of the housing 41 where the two fifth sliding grooves 43 are located or the side walls of the guiding structure body 2;

[0128] A gear 412 is fixedly connected to the second rotating shaft 411, and the gear 412 is meshed with the rack 410 for transmission;

[0129] A fifth connecting rod 413 is disposed in the housing 41 and parallel to the rack 410 , and one end of the fifth connecting rod 413 is connected to the second rotating shaft 411 ;

[0130] The dust removal member 414 is disposed in the housing 41 and is located at the other end of the fifth connecting rod 413. The output end of the dust removal member 414 is connected to a dust removal pipe 415, and the dust removal pipe 415 is connected to the arc-shaped through hole 48. Preferably, the dust removal member can be a high-pressure dust collector, and the dust removal pipe is an air outlet pipe; or the dust removal member can be a water cleaning device, and the dust removal pipe is a water outlet pipe;

[0131] The working principle and beneficial effects of the above technical scheme are as follows: the turntable is driven to rotate by the driving motor, and when the slide bar on the turntable rotates in a circle, the fourth connecting rod is driven to move up and down, and the fourth connecting rod slides in the corresponding fifth slide groove through the fourth slider, and the up and down movement of the fourth connecting rod drives the rack to move up and down, and the up and down movement of the rack drives the gear to rotate, and the rotation of the gear makes the second rotating shaft rotate synchronously, so that the fifth connecting rod connected to the second rotating shaft rotates in a circle, and the dust removal part and dust removal pipe connected to the fifth connecting rod rotate in a circle, and the dust removal pipe rotates in a circle in the arc-shaped through hole, and the dust collector is started at this time to realize dust removal at different positions inside the guide structure body, improve the dust removal efficiency, and ensure the dust removal effect.

[0132] The arrangement of the third slider and the fourth slider ensures reliable movement of the rack, thereby improving the movement stability of the present invention; and the above arrangement of the present invention avoids connecting the dust removal device in the guide structure body to affect the placement of the wafer, and ensures the dust removal effect.

[0133] In one embodiment, the second access openings 21 are provided on both the left and right sides of the guide structure main body 2, and the guide structure slots 22 are provided on the inner walls at the upper and lower ends of the guide structure main body 2;

[0134] The inner wall of the bottom end of the guide structure slot 22 is close to the wafer box 1, and a plurality of pressure detection devices are arranged at intervals along the reference pick-up and placement path of the wafer 5;

[0135] The guide structure for placing and picking up the wafer also includes:

[0136] A displacement detection device is arranged on the guide structure slot 22, or on the inner walls at the front and rear sides of the guide structure body 2;

[0137] A plurality of first detection devices are arranged at different positions of the docking place between the guide structure slot 22 and the wafer box slot 11, and are used to obtain the deviation information between the guide structure slot 22 and the wafer box slot 11 at the docking place between the guide structure slot 22 and the wafer box slot 11, wherein the deviation information includes horizontal deviation information and vertical deviation information; the horizontal deviation information, such as the difference between the horizontal distance detection value of the first detection device at a certain position and the corresponding horizontal reference value;

[0138] A memory storing a reference pick-and-place path of the wafer 5;

[0139] A controller, a first alarm, and a second alarm, wherein the controller is electrically connected to the pressure detection device, the displacement detection device, the first detection device, the first alarm, the second alarm, and the memory;

[0140] The controller controls the first alarm and the second alarm to work based on the pressure detection device, the displacement detection device, the memory, and the first detection device, including the following steps:

[0141] Step 1: Before placing the wafer, the controller calculates a comprehensive deviation evaluation value based on the first detection device and formula (1);

[0142]

[0143] Wherein, a-a0>0, b-b0>0, P is the comprehensive deviation evaluation value, N is the total number of the first detection devices, A i is the horizontal deviation value obtained based on the i-th first detection device, a is the slot width of the guide structure slot at the junction of the wafer box slot and the guide structure slot, a0 is the slot width of the wafer box slot at the junction of the wafer box slot and the guide structure slot, b is the height of the guide structure slot at the junction of the wafer box slot and the guide structure slot (the slot height of the guide structure slot on the upper end face or the lower end face of the guide structure main body), b0 is the height of the wafer box slot at the junction of the wafer box slot and the guide structure slot, B i is the vertical deviation value obtained based on the i-th first detection device;

[0144] Step 2: The controller compares the comprehensive deviation evaluation value with a preset deviation reference value. When the comprehensive deviation evaluation value is greater than or equal to the preset deviation reference value, the controller controls the first alarm to alarm; when the comprehensive deviation evaluation value is less than the preset deviation reference value, the controller does not trigger the first alarm;

[0145] Step 3: During wafer placement, the controller constructs an actual pick-and-place path based on the displacement detection device, obtains the reference pick-and-place path based on the memory, and divides the actual pick-and-place path and the reference pick-and-place path into several sections based on the position of the pressure detection device on the reference pick-and-place path. The reference pick-and-place path or the actual pick-and-place path between adjacent pressure detection devices is one section.

[0146] The controller compares the similarity of the actual pick-and-place path of each segment with the corresponding reference pick-and-place path;

[0147] Step 4: When the controller does not trigger the first alarm in step 2, the controller calculates the wafer breakage assessment value based on the comprehensive deviation assessment value calculated in step 1, step 3, the pressure detection device and formula (2); when the wafer breakage assessment value is greater than or equal to the corresponding wafer breakage reference value, the controller controls the second alarm to sound an alarm; when the wafer breakage assessment value is less than the corresponding wafer breakage reference value, the controller does not trigger the alarm;

[0148]

[0149] Wherein, Q is the wafer breakage assessment value, K1 is the first preset weight, K2 is the second preset weight, M is the total number of pressure detection devices, S M is the detection value of the Mth pressure detection device, S j is the detection value of the jth pressure detection device, L j is the similarity between the previous section of the reference pick-and-place path at the jth pressure detection device and the corresponding section of the actual pick-and-place path (for example, when the guide slot extends in the left-right direction, a pressure detection device is set every 1 cm in the left-right direction, such as the first pressure detection device is at 1 cm in the left-right direction of the reference pick-and-place path, and the first pressure detection device is a section from 1 cm in the reference pick-and-place path to the initial point of the reference pick-and-place path; S2 is a section between the first pressure detection device and the second pressure detection device in the reference pick-and-place path), L M-1 It is the similarity between the section after the M-1th pressure detection device in the reference pick-and-place path (and the section from the location of the last pressure sensor to the end of the pick-and-place path) and the corresponding section of the actual pick-and-place path.

[0150] The working principle and beneficial effects of the above technical solution are as follows: before placing the wafer, the controller calculates the comprehensive deviation evaluation value based on the first detection device and formula (1), wherein the first detection device is used to obtain the horizontal deviation information and vertical deviation information of the docking point of the guide structure slot 22 and the wafer box slot 11 at different positions; in formula (1), the comprehensive deviation evaluation value is calculated based on the horizontal deviation information and vertical deviation information of different positions, and the slot width and slot height of the guide structure slot at the docking point of the wafer box slot and the guide structure slot, and the slot width and slot height of the wafer box slot, so as to first evaluate the state of the docking point of the guide slot and the wafer box slot before placing the wafer box; when the comprehensive deviation evaluation value is greater than or equal to the preset deviation reference value, the controller controls the first alarm to sound an alarm to remind the user to adjust the docking state of the guide structure body and the wafer box body as the first protection measure to ensure reliable wafer placement, and considering the comprehensive deviation evaluation value of the above multi-parameter technology, the calculation result is more reliable;

[0151] During the wafer placement process, the controller constructs an actual pick-and-place path based on the displacement detection device, the controller obtains the reference pick-and-place path based on the memory, and the controller divides the actual pick-and-place path and the reference pick-and-place path into a plurality of sections based on the position of the pressure detection device in the reference pick-and-place path, and the reference pick-and-place path or the actual pick-and-place path between adjacent pressure detection devices is one section; when the controller does not trigger the first alarm in step 2, the controller calculates the wafer breakage assessment value based on the comprehensive deviation assessment value calculated in step 1, step 3, the pressure detection device and formula (2); when the wafer breakage assessment value is greater than or equal to the corresponding wafer breakage reference value, the controller controls the second alarm to sound an alarm; when the wafer breakage assessment value is less than the corresponding wafer breakage reference value, the controller does not trigger the alarm; by obtaining the actual pick-and-place path, the actual pick-and-place path and the reference pick-and-place path are compared in sections to obtain similarity. The similarity of each section, the wafer pressure, and the comprehensive deviation evaluation value indicating the docking state of the wafer slot and the guide structure slot in step 2 in formula (2) are used to obtain the wafer breakage evaluation value, and the breakage evaluation is comprehensively calculated from three aspects: the docking state of the two slots, the pick-and-place path deviation information, and the pressure information actually obtained by the pressure sensor. Considering the above multiple factors, the calculation result is more reliable. When the wafer breakage evaluation value is greater than or equal to the corresponding wafer breakage reference value, the controller controls the second alarm to alarm to remind the user to adjust the pick-and-place path and the pick-and-place pressure. When the wafer breakage evaluation value is less than the corresponding wafer breakage reference value, the controller does not trigger the alarm. The above technical solution realizes dual protection of pick-and-place path deviation protection and pick-and-place excessive pressure protection.

[0152] In summary, the multiple protections of the above technical solutions ensure that the present invention can reliably take and place wafers.

[0153] Preferably, the above-mentioned process of placing the wafer is: the wafer moves in the guide structure slot to a process close to the wafer box slot, so that the above-mentioned steps 3 and 4 are performed based on the process of the wafer moving in the guide structure slot to a process close to the wafer box slot, thereby achieving reliable guidance of the wafer before entering the wafer box slot.

[0154] Obviously, those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include these modifications and variations.

Claims

1. A guide structure for taking and placing a wafer, characterized in that: include: A wafer box (1), wherein a plurality of wafer box slots (11) are arranged in the wafer box (1), and the wafer box (1) is provided with a first loading and unloading port (12); A guide structure body (2) is connected to a side of the wafer box (1) where the first access opening (12) is provided, the guide structure body (2) is provided with a second access opening (21) connected to the first access opening (12), a guide structure card slot (22) is provided in the guide structure body (2), a side of the guide structure card slot (22) close to the first access opening (12) is connected to the wafer box card slot (11), and the guide structure card slot (22) gradually expands in width along a path for taking out the wafer (5); The wafer box (1) is a structure in which first access openings (12) are arranged on two opposite sides, and the wafer box clamping slots (11) are arranged on the inner walls at the upper and lower ends of the wafer box (1); The guide structure main body (2) is a structure with second access openings (21) arranged on two opposite sides, a first access opening (12) of the wafer box (1) is fixedly connected and communicated with a second access opening (21) of the guide structure main body (2), the guide structure card slot (22) is arranged on the inner walls at the upper and lower ends of the guide structure main body (2), and a side of the guide structure card slot (22) close to the second access opening (21) is communicated with a side of the wafer box card slot (11) close to the first access opening (12); The second access openings (21) are arranged on both the left and right sides of the guide structure main body (2), and the guide structure clamping grooves (22) are arranged on the inner walls at the upper and lower ends of the guide structure main body (2); The guide structure for placing and taking wafers further comprises: a dust removal device (4) connected to the front side or the rear side of the guide structure body (2); The dust removal device (4) comprises: A shell (41) is fixedly connected to the front side or the rear side of the guide structure body (2), and an arc-shaped through hole (48) is provided on the side wall of the front side or the rear side of the guide structure body (2); A fourth sliding groove (42) is arranged on the front side or rear side wall of the guide structure body (2), and a third sliding block (45) is slidably connected in the fourth sliding groove (42); A fifth slide groove (43), a fifth slide groove (43) is provided on the front side or rear side wall of the guide structure main body (2), another fifth slide groove (43) is provided on the side wall of the shell (41) opposite to the fifth slide groove (43), and a fourth sliding block (46) is slidably connected in both the fifth slide grooves (43), and the fifth slide groove (43) is located below the fourth slide groove (42); A fourth connecting rod (44), both ends of which are respectively fixedly connected to two fourth sliding blocks (46); a second through hole (416) along the left-right direction is provided in the fourth connecting rod (44); a sliding rod (49) is slidably connected in the second through hole (416); A rotating disk (47) is rotatably connected to the housing (41) via first rotating shafts arranged at the front and rear, and a sliding rod (49) is fixedly connected to the rotating disk (47); A driving motor, disposed in the housing (41) and used for driving the rotating disk (47); A rack (410) is arranged in the housing (41), one end of which is fixedly connected to the third slider (45) via a third connecting rod, and the other end of which is fixedly connected to the fourth connecting rod (44); A second rotating shaft (411) is parallel to the fourth connecting rod (44), and two ends of the second rotating shaft (411) are respectively rotatably connected to the side walls of the housing (41) where the two fifth sliding grooves (43) are located or the side walls of the guide structure body (2); A gear (412) is fixedly connected to the second rotating shaft (411), and the gear (412) is meshed with the rack (410) for transmission; a fifth connecting rod (413), arranged in the housing (41) and parallel to the rack (410), one end of the fifth connecting rod (413) being connected to the second rotating shaft (411); The dust removal member (414) is arranged in the shell (41) and is located at the other end of the fifth connecting rod (413). The output end of the dust removal member (414) is connected to a dust removal pipe (415), and the dust removal pipe (415) is connected to the arc-shaped through hole (48).

2. A guide structure for taking and placing a wafer according to claim 1, characterized in that: The opening (221) of the guide structure slot is greater than or equal to 5 mm.

3. The guide structure for taking and placing a wafer according to claim 1, characterized in that: When the wafer (5) is a 3-inch wafer (5), the depth of the guide structure slot (22) is greater than or equal to 80 mm, and the opening (221) of the guide structure slot is greater than or equal to 5 mm.

4. The guide structure for taking and placing a wafer according to claim 1, characterized in that: When the wafer (5) is a 4-inch wafer (5), the depth of the guide structure slot (22) is greater than or equal to 110 mm, and the opening (221) of the guide structure slot is greater than or equal to 8 mm.

5. The guide structure for taking and placing a wafer according to claim 1, characterized in that: The guiding structure main body (2) is connected to the wafer box (1) via a positioning structure.

6. The guide structure for taking and placing a wafer according to claim 1, characterized in that: The first access opening (12) is arranged on the left and right sides of the wafer box (1), and the wafer box clamping slot (11) is arranged on the inner walls at the upper and lower ends of the wafer box (1); The guide structure for taking and placing wafers further comprises: a limiting device, which is arranged on the wafer box (1); The limiting device comprises: Two limit assemblies (3) are arranged at the upper and lower ends of the wafer box (1) or at the front and rear sides of the wafer box (1); The limiting component (3) comprises: An L-shaped fixed bracket (31), which is composed of a horizontal section (3101) and a vertical section (3102) fixedly connected to the lower end of the horizontal section (3101); the lower end of the vertical section (3102) is fixedly connected to the outer wall of the wafer box (1); the horizontal section (3101) extends in the left-right direction and is arranged toward the first loading and unloading port (12); the outer wall of the wafer box (1) is provided with a first slide groove in the left-right direction; the vertical section (3102) is provided with a horizontal through hole parallel to the first slide groove; a second slide groove in the left-right direction is provided on a side of the horizontal section (3101) away from the wafer box (1); a second slider (32) is slidably connected in the second slide groove; A mounting bracket (33) fixedly connected to the outer wall of the wafer box (1) and located on a side of the vertical section (3102) away from the horizontal section (3101); A first sliding block (34) is located inside the L-shaped fixed bracket (31), and one end of the first sliding block (34) is slidably connected to the first sliding groove on the outer wall of the wafer box (1); a spring (35), one end of which is fixedly connected to the first sliding block (34), and the other end of which is fixedly connected to the inner wall of the L-shaped fixing bracket (31); An electric winding wheel (36) is mounted on the mounting bracket (33), a pull rope (361) is wound around the electric winding wheel (36), and one end of the pull rope (361) passes through the horizontal through hole and is fixedly connected to the first sliding block (34); A rotating rod (37), one end of which is rotatably connected to the first sliding block (34); a third sliding groove (313) is provided on the rotating rod (37); a pulley (310) is slidably connected in the third sliding groove (313); A limiting plate (38) connected to the other end of the rotating rod (37); A first connecting rod (39) is fixedly connected to the second sliding block (32); an end of the first connecting rod (39) close to the rotating rod (37) is connected to the pulley (310) via a second connecting rod (314); A fixed plate (311) fixedly connected to the other end of the first connecting rod (39); An electric telescopic rod (312) is arranged parallel to the second slide groove, the fixed end of the electric telescopic rod (312) is fixedly connected to the L-shaped fixed bracket (31), and the telescopic end of the electric telescopic rod (312) is fixedly connected to the fixed plate (311); A microcontroller is electrically connected to the electric telescopic rod (312) and the electric winding wheel (36).

7. The guide structure for taking and placing a wafer according to claim 6, characterized in that: The second connecting rod (314) is electrically connected to the microcontroller, one end of the second connecting rod (314) is rotationally connected to the first connecting rod (39), and the other end of the second connecting rod (314) is rotationally connected to the pulley (310).

8. The guide structure for taking and placing a wafer according to claim 1, characterized in that: The second access openings (21) are arranged on both the left and right sides of the guide structure main body (2), and the guide structure clamping grooves (22) are arranged on the inner walls at the upper and lower ends of the guide structure main body (2); A plurality of pressure detection devices are arranged at intervals on the inner wall of the bottom end of the guide structure slot (22) near the wafer box (1) along a reference pick-up and placement path of the wafer (5); The guide structure for placing and picking up the wafer also includes: A displacement detection device is arranged on the guide structure slot (22), or on the inner walls at the front and rear sides of the guide structure body (2); A plurality of first detection devices are arranged at different positions of the docking point between the guide structure slot (22) and the wafer box slot (11), and are used to obtain deviation information of the guide structure slot (22) and the wafer box slot (11) at the docking point between the guide structure slot (22) and the wafer box slot (11), wherein the deviation information includes horizontal deviation information and vertical deviation information; A memory storing a reference pick-and-place path of a wafer (5); A controller, a first alarm, and a second alarm, wherein the controller is electrically connected to the pressure detection device, the displacement detection device, the first detection device, the first alarm, the second alarm, and the memory; The controller controls the first alarm and the second alarm to work based on the pressure detection device, the displacement detection device, the memory, and the first detection device, including the following steps: Step 1: Before placing the wafer, the controller calculates a comprehensive deviation evaluation value based on the first detection device and formula (1); Wherein, a-a0>0, b-b0>0, P is the comprehensive deviation evaluation value, N is the total number of the first detection devices, A i is the horizontal deviation value obtained based on the i-th first detection device, a is the slot width of the guide structure slot at the junction of the wafer box slot and the guide structure slot, a0 is the slot width of the wafer box slot at the junction of the wafer box slot and the guide structure slot, b is the height of the guide structure slot at the junction of the wafer box slot and the guide structure slot, b0 is the height of the wafer box slot at the junction of the wafer box slot and the guide structure slot, B i is the vertical deviation value obtained based on the i-th first detection device; Step 2: The controller compares the comprehensive deviation evaluation value with a preset deviation reference value. When the comprehensive deviation evaluation value is greater than or equal to the preset deviation reference value, the controller controls the first alarm to alarm; when the comprehensive deviation evaluation value is less than the preset deviation reference value, the controller does not trigger the first alarm; Step 3: During wafer placement, the controller constructs an actual pick-and-place path based on the displacement detection device, obtains the reference pick-and-place path based on the memory, and divides the actual pick-and-place path and the reference pick-and-place path into several sections based on the position of the pressure detection device on the reference pick-and-place path. The reference pick-and-place path or the actual pick-and-place path between adjacent pressure detection devices is one section. The controller compares the similarity of the actual pick-and-place path of each segment with the corresponding reference pick-and-place path; Step 4: When the controller does not trigger the first alarm in step 2, the controller calculates the wafer breakage assessment value based on the comprehensive deviation assessment value calculated in step 1, step 3, the pressure detection device and formula (2); when the wafer breakage assessment value is greater than or equal to the corresponding wafer breakage reference value, the controller controls the second alarm to sound an alarm; when the wafer breakage assessment value is less than the corresponding wafer breakage reference value, the controller does not trigger the alarm; Wherein, Q is the wafer breakage assessment value, K1 is the first preset weight, K2 is the second preset weight, M is the total number of pressure detection devices, S M is the detection value of the Mth pressure detection device, S j is the detection value of the jth pressure detection device, L j is the similarity between the first section of the reference pick-and-place path at the jth pressure detection device and the corresponding section of the actual pick-and-place path, L M-1 It is the similarity between the section after the M-1th pressure detection device in the reference picking and placing path and the corresponding section of the actual picking and placing path.

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