Display module and display device

Abstract

The display module and the display device are provided. The display module comprises a display panel, a heat conduction layer located at the backlight side of the display panel, a heat dissipation structure layer located at the side of the heat conduction layer away from the display panel, and a bendable part connected with the display panel. The surface of the bendable part is bound to at least one integrated circuit chip. The heat dissipation structure layer is provided with a heat conduction groove. The bendable part is bent towards the back side of the display module, and the at least one integrated circuit chip is embedded in the heat conduction groove. The technical scheme of the display module and the display device can realize rapid heat dissipation around the integrated circuit chip, avoid high temperature around the integrated circuit chip, meet the customer demand, and reduce display defects.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to the technical field of display, and in particular, to a display module and a display device. BACKGROUND

[0002] Organic Light-Emitting Diode (OLED) is a display and lighting technology that has gradually developed in recent years, especially in the display industry. OLED display is considered to have broad application prospects due to its high response, high contrast, and flexibility. At present, flexible OLED is increasingly used in vehicle screens. Due to the self-luminous characteristics of flexible OLED and the large size of vehicle screens, flexible OLED vehicle screens need to be driven by multiple ICs, and vehicle screens need higher brightness. This results in high temperature rise after the vehicle screen is turned on, especially for screens including multiple ICs. The closer the distance to the IC, the higher the screen temperature, which cannot meet customer demand and even leads to poor display. SUMMARY

[0003] Embodiments of the present disclosure provide a display module and a display device to solve or alleviate one or more technical problems in the prior art.

[0004] As a first aspect of the embodiments of the present disclosure, the embodiments of the present disclosure provide a display module, comprising:

[0005] a display panel;

[0006] a heat conduction layer located on the backlight side of the display panel;

[0007] a heat dissipation structure layer located on the side of the heat conduction layer away from the display panel;

[0008] a bendable part connected to the display panel, a surface of the bendable part being bound to at least one integrated circuit chip, the heat dissipation structure layer being provided with a heat conduction groove, the bendable part being bent towards the back side of the display module, and the at least one integrated circuit chip being embedded in the heat conduction groove.

[0009] In some possible implementations, the at least one integrated circuit chip is coated with a heat conduction material, and after the at least one integrated circuit chip is embedded in the heat conduction groove, the heat conduction material is in contact with the inner surface of the heat conduction groove.

[0010] In some possible implementations, the heat conduction material includes heat-conducting silicone grease.

[0011] In some possible implementations, the heat dissipation structure layer includes a heat spreader and a heat sink, the heat spreader being in contact with the heat conduction layer, the heat sink being installed on the side surface of the heat spreader away from the display panel, and the side surface of the heat spreader away from the display panel being provided with a heat conduction groove.

[0012] In some possible implementation manners, a side surface of the heat conduction plate away from the display panel is provided with a mounting groove, and the heat dissipation plate is mounted in the mounting groove.

[0013] In some possible implementation manners, a side of the heat dissipation plate away from the display panel is provided with a plurality of heat dissipation grooves to form a plurality of heat dissipation fins.

[0014] In some possible implementation manners, the material of the heat dissipation plate includes aluminum, and the material of the heat conduction plate includes at least one of aluminum, copper and iron.

[0015] In some possible implementation manners, an end of the bendable part away from the display panel is connected to the surface of the heat dissipation structure layer through a heat conductive adhesive.

[0016] In some possible implementation manners, the display module further includes a first flexible circuit board, a second flexible circuit board and a touch electrode layer, the first flexible circuit board is located at a side of the heat dissipation structure layer away from the display panel and is bound to a side surface of the bendable part away from the heat dissipation structure layer, the touch electrode layer is located at a light emitting side of the display panel, the second flexible circuit board is connected to the touch electrode layer, the second flexible circuit board is bent towards a back side of the display module and is connected to the first flexible circuit board.

[0017] In some possible implementation manners, the display module further includes a first optical adhesive layer and a cover plate glass, the cover plate glass is located at a side of the touch electrode layer away from the display panel, and the first optical adhesive layer is located between the touch electrode layer and the cover plate glass.

[0018] As a second aspect of the embodiments of the present disclosure, the embodiments of the present disclosure provide a display device including the display module in the embodiments of the present disclosure.

[0019] The technical scheme of the embodiments of the present disclosure, heat generated by the display panel can be conducted to the heat dissipation structure layer through the heat conduction layer for heat dissipation, a side surface of the heat dissipation structure layer away from the display panel is provided with a heat conduction groove, and at least one integrated circuit chip is embedded in the heat conduction groove, the heat conduction groove can increase the contact area of the integrated circuit chip and the heat dissipation structure layer, so that the heat conduction groove can more quickly conduct the heat generated by the integrated circuit chip to the heat dissipation structure layer and dissipate, realizing rapid heat dissipation around the integrated circuit chip, avoiding high temperature around the integrated circuit chip, meeting customer demand and reducing display panel display defects.

[0020] The above summary is only for the purpose of the description and is not intended to limit in any way. In addition to the illustrative aspects, embodiments and features described above, further aspects, embodiments and features of the present disclosure will be readily apparent to those skilled in the art by reference to the drawings and the following detailed description. BRIEF DESCRIPTION OF DRAWINGS

[0021] In the drawings, like reference numerals refer to like elements throughout the various figures. The drawings are not necessarily to scale, the emphasis instead being placed upon illustrating the principles of the disclosure. It should be understood that the drawings are merely

[0022] Figure 1 is a schematic view of a planar structure of a small-size display module;

[0023] Figure 2 is a schematic view of a cross-sectional structure of a heat dissipation film in a small-size display module;

[0024] Figure 3 is a schematic view of a structure of a display module;

[0025] Figure 4 is a schematic view of a structure of a display module in an embodiment of the disclosure;

[0026] Figure 5 is a schematic view of a planar development structure of a display module in an embodiment of the disclosure;

[0027] Figure 6 is a schematic view of a heat dissipation structure layer in a display module in an embodiment of the disclosure.

[0028] Legend of reference signs:

[0029] 10, display panel; 11, bendable portion; 111, integrated circuit chip; 113, first flexible circuit board; 20, touch electrode layer; 21, second flexible circuit board; 30, glass cover plate; 40, heat conduction layer; 50, heat dissipation structure layer; 51, heat spreading plate; 511, heat conduction groove; 512, mounting groove; 521, heat dissipation fin; 52, heat dissipation plate; 520, heat dissipation groove; 521, heat dissipation fin; 600, heat conduction material; 61, first optical adhesive layer; 62, second optical adhesive layer. DETAILED DESCRIPTION

[0030] In the following, only certain example embodiments are simply described. As those skilled in the art can recognize, the described embodiments can be modified in various different ways without departing from the spirit or scope of the disclosure. Therefore, the drawings and the description are to be considered exemplary in nature but not limiting.

[0031] Figure 1 is a schematic view of a planar structure of a small-size display module. The vehicle-mounted screen of a flexible OLED is distinguished from small-size products such as mobile phones. The vehicle-mounted screen is larger in size, and generally, the size of the vehicle-mounted screen is greater than or equal to 10 inches, requiring multiple ICs for driving. The small-size display module can adopt a structure as shown in Figure 1 for screen heat dissipation, as shown inFigure 1 As shown, the small-sized display module may include a cover glass 30, a display panel 10, and a heat dissipation film 70. The heat dissipation film 70 is attached to the display panel 10 to dissipate heat from the display panel. The display module may also include a chip-on-film (COF) package 71, which includes an integrated circuit (IC) chip located on its surface. The display module also includes a first flexible circuit board 113, which is connected to the COF package 71.

[0032] Figure 2 This is a schematic diagram of the cross-sectional structure of a heat dissipation film in a small-sized display module. Figure 1 As shown, the heat dissipation film 71 may include a mesh adhesive 711, foam 712 and copper foil 713 stacked in sequence.

[0033] Figure 3 This is a schematic diagram of the structure of a display module. For example... Figure 3 As shown, the display module may include a display panel 10, a touch electrode layer 20, a first optical adhesive layer 61, and a cover glass 30. The touch electrode layer 20 is located on the light-emitting side of the display panel 10, and the cover glass 30 is located on the side of the touch electrode layer 20 facing away from the display panel 10. The first optical adhesive layer 61 is located between the touch electrode layer 20 and the cover glass 30. The display module may also include a thermally conductive layer 40 and a heat sink 52. The thermally conductive layer 40 is located on the backlight side of the display panel 10, and the heat sink 52 is located on the side of the thermally conductive layer 40 facing away from the display panel 10.

[0034] like Figure 3 As shown, the display module may further include a bendable portion 11, which is connected to the display panel 10. At least one integrated circuit chip 111 is bonded to the bendable portion 11. The bendable portion 11 is bent toward the back side of the display module, such that the surface of the at least one integrated circuit chip 111 contacts the surface of the heat sink 52. The heat sink 52 dissipates heat for the display panel 10 and the at least one integrated circuit chip 111.

[0035] Figure 3 The display module shown, when the display panel is lit, both the display panel and the integrated circuit chip 111 generate heat, especially around the integrated circuit chip 111, which is the area of ​​concentrated heat. Figure 3 In the display module shown, the heat sink 52 has poor heat dissipation effect and cannot achieve heat dissipation well, resulting in poor display after the display module is turned on due to excessive temperature.

[0036] Figure 4 This is a schematic diagram of the structure of a display module in one embodiment of the present disclosure. Figure 5 This is a schematic diagram of the planar unfolded structure of a display module according to an embodiment of this disclosure. Figure 4 andFigure 5 As shown, the display module can include a display panel 10, a heat conduction layer 40, a heat dissipation structure layer 50, and a bendable portion 11. The heat conduction layer 40 is located on the backlight side of the display panel 10, and the heat dissipation structure layer 50 is located on the side of the heat conduction layer 40 away from the display panel 10. The bendable portion 11 is connected with the display panel 10, and the surface of the bendable portion 11 is bound to connect at least one integrated circuit chip (IC) 111. The side surface of the heat dissipation structure layer 50 away from the display panel 10 is provided with a heat conduction groove 511, and the bendable portion 11 is bent towards the back side of the display module, so that the at least one integrated circuit chip 111 is embedded in the heat conduction groove 511.

[0037] The display module of the embodiment of the present disclosure can conduct the heat generated by the display panel 10 to the heat dissipation structure layer 50 through the heat conduction layer 40 for heat dissipation. The side surface of the heat dissipation structure layer 50 away from the display panel 10 is provided with a heat conduction groove 511, and the at least one integrated circuit chip 111 is embedded in the heat conduction groove 511. Compared with the prior art, the heat conduction groove 511 can increase the contact area between the integrated circuit chip 111 and the heat dissipation structure layer 50, so that the heat conduction groove 511 can more quickly conduct the heat generated by the integrated circuit chip 111 to the heat dissipation structure layer 50 and dissipate it away, realizing rapid heat dissipation around the integrated circuit chip 111, avoiding high temperature around the integrated circuit chip 111, meeting the customer demand, and reducing display panel display defects. Figure 3 As shown, the display module, the heat conduction groove 511 can increase the contact area between the integrated circuit chip 111 and the heat dissipation structure layer 50, so that the heat conduction groove 511 can more quickly conduct the heat generated by the integrated circuit chip 111 to the heat dissipation structure layer 50 and dissipate it away, realizing rapid heat dissipation around the integrated circuit chip 111, avoiding high temperature around the integrated circuit chip 111, meeting the customer demand, and reducing display panel display defects.

[0038] Exemplarily, Figure 5 As shown in the middle, the bendable portion 11 is 3, and the integrated circuit chip 111 is three. It can be understood that the specific number of the bendable portion 11 and the number of the integrated circuit chip 111 arranged thereon can be set as needed, and is not limited to 3. The number of the heat conduction groove 511 can be the same as the number of the integrated circuit chip 111, so that all the integrated circuit chips 111 can be embedded in the corresponding heat conduction grooves 511.

[0039] It should be noted that the display panel 10 can include a flexible substrate and a light-emitting structure layer arranged on the flexible substrate, the bendable portion 11 can be formed by the flexible substrate extending outward, and the integrated circuit chip 111 is arranged on the part of the flexible substrate extending outward, so the bendable portion 11 can also be called chip on film (COF).

[0040] In one embodiment, the at least one integrated circuit chip 111 is coated with a heat-conductive material 600, which is in contact with the inner surface of the heat-conductive groove 511 after the at least one integrated circuit chip 111 is embedded in the heat-conductive groove 511. It can be understood that there will be a gap between the integrated circuit chip and the inner surface of the heat-conductive groove 511 after the integrated circuit chip is embedded in the heat-conductive groove 511, which reduces the contact area between them. By coating the at least one integrated circuit chip 111 with the heat-conductive material 600, the heat-conductive material 600 can be in good contact with the inner surface of the heat-conductive groove 511 after the at least one integrated circuit chip 111 is embedded in the heat-conductive groove 511, avoiding the presence of air gap, so as to maximize the contact area between the integrated circuit chip 111 and the heat-conductive groove 511, increase the heat conduction between them, and facilitate the rapid conduction of heat generated by the integrated circuit chip 111 to the heat dissipation structure layer 50 through the inner surface of the heat-conductive groove 511, achieving rapid heat dissipation of the integrated circuit chip 111.

[0041] Exemplarily, the heat-conductive material 600 can include heat-conductive silicone grease or heat-conductive glue. The heat-conductive silicone grease and heat-conductive glue have good heat conductivity and can quickly conduct the heat on the integrated circuit chip to the heat dissipation structure layer 50.

[0042] The shape of the heat-conductive groove 511 can be set as needed. In one embodiment, the shape of the heat-conductive groove 511 can match the shape of the integrated circuit chip 111, so that each surface of the integrated circuit chip 111 can be in contact with the inner surface of the heat-conductive groove 511. Exemplarily, the shape of the heat-conductive groove 511 can be rectangular.

[0043] In one embodiment, as shown in Figure 4 The heat-conductive groove 511 is formed on the side surface of the heat spreader 51 away from the display panel 10.

[0044] Such a structure, the heat spreader 51 can uniformly conduct the heat generated by the display panel 10 to the heat sink 52, avoiding local temperature of the display panel 10 too high. The heat-conductive groove 511 is arranged on the surface of the heat spreader 51, which facilitates the heat spreader 51 to uniformly conduct the heat generated by the integrated circuit chip 111 to the heat sink 52. The heat spreader 51 not only can conduct the heat generated by the display panel 10 and the integrated circuit chip to the heat sink 52, but also can make the heat on the surface of the display panel 10 uniform, avoiding local temperature too high to affect the display, improving the display effect.

[0045] Exemplarily, the material of the heat spreader 51 can be metal, such as aluminum, iron, copper, etc., which is conducive to the heat spreader 51 to conduct heat more uniformly.

[0046] In one implementation, such as Figure 4 The heat sink 51 shown has a mounting groove 512 on the side of its surface facing away from the display panel 10, and the heat sink 52 is installed in the mounting groove 512. This structure allows the heat sink 52 to be installed in the mounting groove, which reduces the thickness of the display module.

[0047] Figure 6 This is a schematic diagram showing the structure of a heat dissipation layer in a module according to an embodiment of the present disclosure. In one embodiment, such as Figure 6 As shown, light holes can be provided on the heat sink 52, and threaded holes can be provided on the heat spreader 51. The heat sink 52 and the heat spreader 51 can be connected by screws.

[0048] In one implementation, such as Figure 4 As shown, the heat sink 52 has multiple heat dissipation slots 520 on the side opposite to the display panel 10 to form multiple heat dissipation fins 521. The heat dissipation fins 521 can increase the heat dissipation surface area of ​​the heat sink 52, enabling faster heat dissipation of the display module. The size of the heat dissipation fins 521 can be set as needed.

[0049] For example, the heat sink 52 can be made of a metal with high thermal conductivity, such as aluminum, copper, or iron. This type of heat sink 52 has good thermal conductivity, which can increase the heat dissipation rate and allow for faster heat dissipation.

[0050] In one implementation, such as Figure 5 As shown, in the first direction X, the distance between the edge of the heat spreader 51 and the edge of the display panel 10 is 'a', and in the second direction Y, the distance between the edge of the heat spreader 51 and the edge of the display panel 10 is 'b', where both 'a' and 'b' range from 0.5 mm to 0.8 mm (inclusive). The first direction can be the length direction of the display panel (in...). Figure 5 The first direction is horizontal, and the second direction is perpendicular to the first direction.

[0051] For example, such as Figure 5 As shown, in the first direction X, the distance between the heat dissipation groove 520 for forming heat dissipation fins 521 near the edge of the heat dissipation plate 52 and the edge of the heat dissipation plate 52 is d, and the range of d is 0.5 mm to 1 mm (including the endpoint value).

[0052] For example, such as Figure 5 As shown, multiple heat dissipation slots 520 can be arranged side by side in the first direction, thereby forming multiple heat dissipation fins 521 that are also arranged side by side in the first direction, improving the heat dissipation effect. The distance between the edge of the heat dissipation slot 520 and the corresponding edge of the heat sink 52 is c, and the range of c is 0.5 mm to 1 mm (inclusive of the endpoint value).

[0053] It should be noted that in actual implementation, the specific values of a, b, c, and d can be set as needed, and are not specifically limited here. In one embodiment, as shown in FIG. 11, one end of the bendable portion 11 away from the display panel 10 can be connected in contact with the surface of the heat dissipation structure layer 50 through a heat-conducting adhesive 112. In this way, the end of the bendable portion 11 can be prevented from warping, and the heat on the surface of the bendable portion 11 can be conducted to the heat dissipation structure layer 50 through the heat-conducting adhesive 112 for heat dissipation, further improving the heat dissipation efficiency. Figure 4

[0054] Exemplarily, one end of the bendable portion 11 away from the display panel 10 is connected in contact with the surface of the heat dissipation plate 52 through the heat-conducting adhesive 112.

[0055] The display module can further include a first flexible circuit board 113, a touch electrode layer 20, and a second flexible circuit board 21. The first flexible circuit board 113 is located on the side of the heat dissipation structure layer 50 away from the display panel 10 and is bound and connected to the side surface of the bendable portion 11 away from the heat dissipation structure layer 50. The touch electrode layer 20 is located on the light-emitting side of the display panel 10, the second flexible circuit board 21 is connected to the touch electrode layer 20, the second flexible circuit board 21 is bent towards the back side of the display module, and the second flexible circuit board 21 is connected to the first flexible circuit board 113. Exemplarily, the second flexible circuit board 21 can be plug-connected to the first flexible circuit board 113.

[0056] In one embodiment, as shown in FIG. 13, the display module can further include a first optical adhesive layer 61 and a cover glass 30. The cover glass 30 is located on the side of the touch electrode layer 20 away from the display panel 10, and the first optical adhesive layer 61 is located between the touch electrode layer 20 and the cover glass 30. Figure 4

[0057] In one embodiment, the display module can further include a polarizer. The polarizer can be located on the side of the touch electrode layer 20 away from the display panel 10, or the polarizer can be located on the side of the touch electrode layer 20 towards the display panel 10. Exemplarily, the polarizer is located on the side of the touch electrode layer 20 towards the display panel 10, and a second optical adhesive layer 62 can be provided between the polarizer and the display panel 10.

[0058] In one embodiment, the display module can be a vehicle-mounted flexible display module, and the substrate of the display panel can be a substrate made of polyimide (PI) material.

[0059] In one embodiment, the display panel can be various types of display panels such as an organic light-emitting diode (OLED) display panel, an LED display panel, a quantum dot light-emitting diode (QLED) display panel, and a liquid crystal display panel. ​​

[0060] Based on the inventive concept of the foregoing embodiments, the display device provided by the embodiments of the present disclosure comprises the display module of the foregoing embodiments. The display device can further comprise a heat dissipation fan, which can be mounted on the heat dissipation plate 52. The heat dissipation fan can suck the heat dissipated by the heat dissipation plate 52 and accelerate heat dissipation.

[0061] The display device can be a vehicle-mounted display device. The display device can be any product or component with display function, such as a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a navigator, and the like.

[0062] The technical solutions of the embodiments of the present disclosure can balance the temperature of the display panel, rapidly dissipate heat of the display panel and the integrated circuit chip, avoid local temperature from being too high, and improve the display effect of the display device.

[0063] In the description of the present disclosure, it should be understood that the orientation or positional relationship indicated by the terms “center”, “longitudinal”, “lateral”, “length”, “width”, “thickness”, “upper”, “lower”, “front”, “rear”, “left”, “right”, “vertical”, “horizontal”, “top”, “bottom”, “inner”, “outer”, “clockwise”, “counterclockwise”, “axial”, “radial”, “circumferential” and the like is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present disclosure and simplifying the description, and does not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present disclosure.

[0064] In addition, the terms “first” and “second” are only for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined with “first” and “second” can explicitly or implicitly include one or more of the features. In the description of the present disclosure, the meaning of “plurality” is two or more, unless otherwise specifically limited.

[0065] In the present disclosure, unless otherwise specifically defined and limited, the terms “mounting”, “connection”, “connecting”, “fixing” and the like should be understood in a broad sense, for example, can be fixed connection, can also be detachable connection, or can be integrated; can be mechanical connection, can also be electrical connection, or can be communication; can be directly connected, or can be indirectly connected through an intermediate medium; can be the communication or interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the present disclosure can be understood according to the specific circumstances.

[0066] In the present disclosure, unless specifically defined otherwise, "on" or "under" of a first feature with respect to a second feature can include that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact through another feature between them. Also, "on", "over", and "above" of a first feature with respect to a second feature include that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is horizontally higher than the second feature. "Under", "below", and "underneath" of a first feature with respect to a second feature include that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is horizontally lower than the second feature.

[0067] The above disclosure provides many different embodiments or examples for implementing different structures of the present disclosure. In order to simplify the present disclosure, the components and settings of specific examples are described in the above. Of course, they are only examples, and the purpose is not to limit the present disclosure. In addition, the present disclosure can repeatedly refer to numbers and / or letters in different examples, and such repetition is for the purpose of simplification and clarity, which itself does not indicate the relationship between the various embodiments and / or settings discussed.

[0068] The above is only a specific implementation of the present disclosure, but the protection scope of the present disclosure is not limited thereto, and any person skilled in the art can easily think of various changes or replacements within the technical scope disclosed by the present disclosure, which should be covered within the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be subject to the protection scope of the claims.

Claims

1. A display module, characterized by The display module comprises a display panel, a heat-conducting layer located on the backlight side of the display panel, a heat-dissipating structure layer located on the side of the heat-conducting layer away from the display panel, a bendable part connected to the display panel, a surface of the bendable part being bound to at least one integrated circuit chip, the heat-dissipating structure layer being provided with a heat-conducting groove, the bendable part being bent towards the back side of the display module, and the at least one integrated circuit chip being embedded in the heat-conducting groove. The at least one integrated circuit chip is coated with a heat-conducting material, the heat-conducting material being in contact with the inner surface of the heat-conducting groove after the at least one integrated circuit chip is embedded in the heat-conducting groove. The heat-dissipating structure layer comprises a heat spreader and a heat sink, the heat spreader being in contact with the heat-conducting layer, the heat sink being installed on the side surface of the heat spreader away from the display panel, and the side surface of the heat spreader away from the display panel being provided with the heat-conducting groove. The side surface of the heat spreader away from the display panel is provided with an installation groove, and the heat sink is installed in the installation groove. The heat sink is made of at least one of aluminum, copper and iron. The end of the bendable part away from the display panel is connected to the surface of the heat-dissipating structure layer through heat-conducting glue. The display module further comprises a first flexible circuit board, a second flexible circuit board and a touch electrode layer, the first flexible circuit board being located on the side of the heat-dissipating structure layer away from the display panel and being bound to the side surface of the bendable part away from the heat-dissipating structure layer, the touch electrode layer being located on the light-emitting side of the display panel, the second flexible circuit board being connected to the touch electrode layer, the second flexible circuit board being bent towards the back side of the display module and being connected to the first flexible circuit board. The display module further comprises a first optical adhesive layer and a cover plate glass, the cover plate glass being located on the side of the touch electrode layer away from the display panel, and the first optical adhesive layer being located between the touch electrode layer and the cover plate glass.

2. The display module of claim 1, wherein, The display module comprises any one of claims 1-6.

3. The display module of claim 1, wherein, The display module comprises any one of claims 1-6.

4. The display module of claim 1, wherein, ​ 5. The display module of any one of claims 1-4, wherein, ​ 6. The display module of claim 5, wherein, ​ 7. A display device, characterized by comprising: ​

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