A wave soldering carrier disassembly and reflow device and method

Abstract

The present invention discloses a wave soldering carrier disassembly and reflow device, comprising a releasing mechanism, a separating mechanism, a clamping mechanism, a PCB board transporting mechanism and a tooling reflow mechanism; the output end of the releasing mechanism is connected to the input end of the separating mechanism, and the clamping mechanism is located on one side of the separating mechanism; the releasing mechanism comprises a flipping unit and a button unit, the flipping unit flips the pressure plate, the button unit comprises a moving plate and a lever located on both sides of the moving plate, the moving plate is arranged above the wave soldering carrier and can reciprocate along a direction perpendicular to the transmission direction of the wave soldering carrier; the bottom of the lever is tangent to the buckle. The wave soldering carrier disassembly and reflow device and method provided by the present invention can automatically realize the release of the PCB board and the tooling in the wave soldering carrier, and automatically separate the PCB board and the tooling through the clamping mechanism, which greatly improves the separation efficiency of the wave soldering carrier.

Description

Technical Field

[0001] The invention belongs to the field of wave soldering blanking, and in particular relates to a wave soldering carrier disassembly and reflow device and method. Background Art

[0002] During the production process of variable frequency air conditioner controller, the power module needs to be welded on the reverse side of the welding surface and installed in the air. It has strict requirements on the welding height. Selective wave soldering is usually used in production. During the welding process, an integrated welding tool is used as a wave soldering carrier to ensure the accuracy of the welding position and height.

[0003] The wave soldering carrier includes a tool and a PCB board embedded in the tool. After the wave soldering is completed, the wave soldering carrier needs to be disassembled and separated from the tool and the PCB board. Currently, the disassembly and separation work needs to be done manually, which is labor-intensive and has a low degree of automation. Summary of the invention

[0004] The present invention aims to solve at least one of the problems in the related art to a certain extent. To this end, the purpose of the present invention is to provide a wave soldering carrier disassembly and reflow device and method, which can automatically realize the release of the PCB board and the tooling in the wave soldering carrier, and automatically separate the PCB board and the tooling through a clamping mechanism, thereby greatly improving the separation efficiency of the wave soldering carrier.

[0005] In order to achieve the above-mentioned purpose, the present invention proposes the following technical scheme: a wave soldering carrier disassembly and reflow device, the wave soldering carrier includes a tool and a PCB board embedded in the tool, the tool includes a folded pressure plate and buckles fixed on the front and rear sides of the PCB board; including a release mechanism, a separation mechanism, a clamping mechanism, a PCB board transportation mechanism and a tool reflow mechanism; the output end of the release mechanism is connected to the input end of the separation mechanism, and the clamping mechanism is located on one side of the separation mechanism, and is used to clamp the PCB board and the tool in the separation mechanism to the PCB board transportation mechanism and the tool reflow mechanism respectively;

[0006] The release mechanism includes a flipping unit and a latch unit, the flipping unit flips the pressure plate, the latch unit includes a movable plate and a lever located on both sides of the movable plate, the movable plate is arranged above the wave soldering carrier and can reciprocate along a direction perpendicular to the transmission direction of the wave soldering carrier; the bottom of the lever is tangent to the buckle.

[0007] Furthermore, the release mechanism also includes a first fixed rail and a first movable rail arranged in parallel, and first transmission chains are respectively arranged on opposite sides of the first fixed rail and the first movable rail, and both sides of the wave soldering carrier are respectively located on two first transmission chains; the first movable rail can move in a direction close to or away from the first fixed rail.

[0008] Furthermore, a first blocking cylinder is disposed at the front end of the first movable rail or the first fixed rail; a first photoelectric detector and a second photoelectric detector are disposed at the rear end and the front end of the first movable rail or the first fixed rail, respectively.

[0009] Furthermore, the flip unit includes a flip cylinder and a flip swing arm, the flip cylinder is located outside the first fixed rail, the output end of the flip cylinder is connected to the flip swing arm, and the front end of the flip swing arm includes a fixing ring.

[0010] Furthermore, the button-pulling unit also includes a fixed frame, the two ends of which are respectively fixed on the fixed rail and the movable rail, and the movable plate is slidably connected to the fixed frame; and pressure plate cylinders are respectively provided at the two ends of the fixed frame.

[0011] Furthermore, the separation mechanism includes a second fixed rail and a second movable rail corresponding to the first fixed rail and the first movable rail, a second blocking cylinder is provided at the front end of the second fixed rail or the second movable rail, and a third photoelectric detector and a fourth photoelectric detector are respectively provided at the rear end and the front end of the second fixed rail or the second movable rail.

[0012] Furthermore, the clamping mechanism includes a clamping unit, the clamping unit includes a PCB clamping sub-unit and a tooling clamping sub-unit, the PCB clamping sub-unit includes a first clamping block located on both sides of the first clamping cylinder and parallel to it; the tooling clamping sub-unit includes a second clamping block located on both sides of the second clamping cylinder and parallel to it.

[0013] Furthermore, the clamping mechanism also includes a robot, and a clamping unit is provided at the front end of the clamping swing arm of the robot.

[0014] A method for disassembling and reflowing a wave soldering carrier comprises the following steps:

[0015] S01: The wave soldering carrier enters the release mechanism, and the flip unit flips the pressure plate to the plane where the PCB is located; the moving plate in the buckle unit drives the lever to reciprocate, so that the buckle on the tooling is unscrewed, and the wave soldering carrier is in the release state;

[0016] S02: The wave soldering carrier in the released state is transferred to the separation mechanism;

[0017] S03: The clamping mechanism first clamps the PCB board and transfers it to the PCB board transport mechanism for output; then clamps the tooling and transfers it to the tooling reflow mechanism for output.

[0018] Further, the release mechanism comprises a first fixed rail and a first movable rail arranged in parallel, and the first fixed rail and the first movable rail are respectively provided with a first transmission chain on their opposite sides; the first movable rail or the first fixed rail is provided with a first blocking cylinder at its front end; the first movable rail or the first fixed rail is provided with a first photoelectric detector and a second photoelectric detector at its rear end and front end respectively; the flip unit comprises a flip cylinder and a flip swing arm, and the front end of the flip swing arm comprises a fixing ring; the button unit comprises a fixing frame and a lever cylinder, the movable plate is slidably connected to the fixing frame, and the two ends of the fixing frame are respectively provided with a pressing plate cylinder;

[0019] Step S01 specifically includes:

[0020] S011: the first photoelectric detector detects that the wave soldering carrier enters the release mechanism, and the first blocking cylinder extends; the first transmission chain starts to transmit until the wave soldering carrier is blocked by the first cylinder;

[0021] S012: When the second photoelectric detector located at the rear end of the first blocking cylinder detects that the wave soldering carrier is stationary, the pressing plate cylinder presses down to fix the wave soldering carrier; at this time, the fixing ring is located in the pressing plate opening above the pressing plate;

[0022] S013: The flip cylinder drives the flip swing arm and the fixed ring to swing, so that the pressure plate flips to the plane where the PCB board is located;

[0023] S014: The lever cylinder drives the lever to move back and forth, so that the buckle on the tooling is unscrewed.

[0024] Compared with the prior art, the above technical solution provided by the embodiment of the present application has the following advantages:

[0025] (1) After positioning the wave soldering carrier, the present application uses a flip unit to flip the pressure plate to the plane where the PCB is located, and uses a lever to unscrew the buckle, so that the wave soldering carrier is in a released state, which is convenient for the subsequent separation of the PCB and the tooling; the distance between the first fixed rail and the first movable rail of the release mechanism in the present application is adjustable, which can be suitable for the release of wave soldering carriers of different sizes, and can realize automatic positioning, flipping and lever shifting of the wave soldering carrier, realizing unmanned operation, with a high degree of automation, and significantly improving the release efficiency of the wave soldering carrier.

[0026] (2) For a wave soldering carrier in a released state, the present application first uses a robot to drive a PCB board clamping subunit to clamp a PCB board and place it on the PCB board transport mechanism output, and then uses a robot to drive a tooling clamping subunit to clamp a tooling and place it on the tooling reflow mechanism output, thereby realizing automatic separation of the PCB board and the tooling in the wave soldering carrier in the released state, and further improving the separation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and, together with the description, serve to explain the principles of the invention.

[0028] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0029] In the attached figure:

[0030] Attached Figure 1 It is a schematic diagram of the overall structure of the wave soldering carrier disassembly and reflow device in the present invention;

[0031] Attached Figure 2 It is a structural schematic diagram of the release mechanism in the present invention;

[0032] Attached Figure 3 It is a partial schematic diagram of the release mechanism in the present invention;

[0033] Attached Figure 4 It is a structural schematic diagram of the separation mechanism in the present invention;

[0034] Attached Figure 5 It is a structural schematic diagram of the PCB board transportation mechanism in the present invention;

[0035] Attached Figure 6 It is a structural schematic diagram of the clamping mechanism in the present invention;

[0036] Figure numbers: 1. Release mechanism; 2. Separation mechanism; 3. PCB board transportation mechanism; 4. Clamping mechanism; 5. Tool reflow mechanism; 6. First fixed rail; 7. First photoelectric detector; 8. Second photoelectric detector; 10. First moving rail; 11. First blocking cylinder; 12. Fixed frame; 13. Push rod cylinder; 14. Moving plate; 15. Push rod; 17. Flip cylinder; 18. Flip swing arm; 19. Wave soldering carrier; 20. Press plate mouth; 21. Buckle; 23. Second fixed rail; 24. Third photoelectric detector; 25. Fourth photoelectric detector Detector; 26, second blocking cylinder; 28, PCB board through hole; 30, second moving rail; 31, tooling clamping position; 33, robot; 34, fixture mounting plate; 35, first lifting cylinder; 36, first clamping cylinder; 37, first clamping block; 38, second lifting cylinder; 39, second clamping cylinder; 40, second clamping block; 42, third fixed rail; 43, fifth photoelectric detector; 44, PCB board; 45, third moving rail; 46, PCB board clamping position; 48, sixth photoelectric detector; 49, pressure plate cylinder; 51, pressure plate. DETAILED DESCRIPTION

[0037] In order to have a clearer understanding of the technical features, purposes and effects of the present invention, the specific embodiments of the present invention are now described in detail with reference to the accompanying drawings. In the following description, it should be understood that the directions or positional relationships indicated by "front", "back", "up", "down", "left", "right", "longitudinal", "horizontal", "vertical", "horizontal", "top", "bottom", "inside", "outside", "head", "tail", etc. are based on the directions or positional relationships shown in the accompanying drawings, are constructed and operated in a specific direction, and are only for the convenience of describing the present technical solution, rather than indicating that the device or element referred to must have a specific direction, and therefore cannot be understood as a limitation to the present invention.

[0038] It should also be noted that, unless otherwise clearly specified and limited, the terms such as "installed", "connected", "connected", "fixed", "set" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral one; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. When an element is referred to as being "on" or "under" another element, the element can be "directly" or "indirectly" located on the other element, or there may be one or more intermediate elements. The terms "first", "second", "third", etc. are only for the convenience of describing the present technical solution, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first", "second", "third", etc. can explicitly or implicitly include one or more of the features. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to the specific circumstances.

[0039] In the following description, specific details such as specific system structures, technologies, etc. are provided for the purpose of illustration rather than limitation, so as to provide a thorough understanding of the embodiments of the present invention. However, it should be clear to those skilled in the art that the present invention may be implemented in other embodiments without these specific details. In other cases, detailed descriptions of well-known systems, devices, circuits, and methods are omitted to prevent unnecessary details from obstructing the description of the present invention.

[0040] Example 1

[0041] Please see attached Figure 1-6 A wave soldering carrier disassembly and reflow device comprises a releasing mechanism 1, a separating mechanism 2, a clamping mechanism 4, a PCB board transporting mechanism 3 and a tooling reflow mechanism 5; the output end of the releasing mechanism 1 is connected to the input end of the separating mechanism 2, and the clamping mechanism 4 is located on one side of the separating mechanism 2, for clamping the PCB board and the tooling in the separating mechanism 2 to the PCB board transporting mechanism 3 and the tooling reflow mechanism 5 respectively.

[0042] In this embodiment, the wave soldering carrier 19 includes a tooling and a PCB board embedded in the tooling. The front end of the tooling includes a folded pressure plate 51. When the pressure plate 51 is flipped to the top of the PCB board, the PCB board is tightly fixed in place; when the pressure plate 51 is flipped to the plane where the PCB board is located, the PCB board will not be limited. The PCB board is embedded in the rear end of the tooling, and is fixed at the front and rear ends of the PCB by buckles 21. The buckle 21 includes a fixed end fixed in the tooling and a sliding end that can rotate around the fixed end. When the sliding end slides onto the PCB board, the PCB board is fixed; when the sliding end slides onto the tooling, the buckle 21 will not limit the PCB board. PCB board through holes 28 are provided on the left and right sides of the PCB board to facilitate the clamping of the PCB board during the subsequent separation process.

[0043] The front end and the rear end of this embodiment are relative to the transmission direction of the wave soldering carrier 19. In the wave soldering process, the end that is first output from the release mechanism 1 is the front end, and the end that is later output from the release mechanism 1 is the rear end; similarly, the end that first contacts the track of the wave soldering carrier 19 is the front end, and the end that contacts the track of the wave soldering carrier 19 is the rear end. When the tooling and the PCB board in the wave soldering carrier 19 need to be disassembled and separated, the pressure plate 51 in the wave soldering carrier 19 needs to be flipped to the plane where the PCB board is located, and the sliding end of the buckle 21 is rotated to the top of the tooling, so that the wave soldering carrier 19 is in a released state.

[0044] The release mechanism 1 includes a first fixed rail 6 and a first movable rail 10 arranged in parallel. The first movable rail 10 can move in a direction close to or away from the first fixed rail 6 to adjust the distance between the first fixed rail 6 and the first movable rail 10, so that the device in this embodiment is suitable for wave soldering carriers 19 of different sizes.

[0045] First transmission chains are respectively arranged on opposite sides of the first fixed rail 6 and the first movable rail 10 , and both sides of the wave soldering carrier 19 are respectively located on the two first transmission chains; the two first transmission chains move synchronously, driving the wave soldering carrier to move forward.

[0046] The front end of the first movable rail 10 is provided with a first blocking cylinder 11, which is used to block the wave soldering carrier from moving forward when it moves to the designated position; the rear end and the front end of the first movable rail 10 are respectively provided with a first photodetector 7 and a second photodetector 8; the first photodetector is used to detect whether the wave soldering carrier 19 enters the first transmission chain, and the second photodetector is used to detect whether the wave soldering carrier is blocked by the first blocking cylinder and is in a stationary state. Among them, the first photodetector 7 can be located at the end of the rear end of the first movable rail 10, and the second photodetector 8 can be located at the rear end of the first blocking cylinder 11. Of course, the first blocking cylinder 11, the first photodetector 7 and the second photodetector 8 can also be arranged in the first fixed rail 6.

[0047] The flipping unit includes a flipping cylinder 17 and a flipping swing arm 18. The flipping cylinder 17 is located outside the first fixed rail. The output end of the flipping cylinder is connected to the flipping swing arm 18. The front end of the flipping swing arm 18 includes a fixing ring. When the wave soldering carrier is blocked by the first blocking cylinder 11, the fixing ring is just located in the pressure plate opening 20 above the pressure plate. The flipping cylinder can drive the flipping swing arm 18, the pressure plate opening 20 and the pressure plate to flip together, so that the pressure plate is flipped to the plane where the PCB board is located.

[0048] The button unit includes a fixed frame 12, both ends of which are respectively fixed on the first fixed rail and the first movable rail. A pressure plate cylinder 49 is respectively arranged on the inner side of both ends of the fixed frame 12. The pressure plate cylinder 49 is located above the tooling. When the wave soldering carrier is blocked by the first blocking cylinder 11, the pressure plate cylinder 49 is pressed down to position the tooling to prevent it from moving during the flipping of the pressure plate 51.

[0049] A lever cylinder 13 is arranged above the fixing member; at the same time, the movable plate 14 and the levers 15 located on both sides of the movable plate 14 are slidably connected. The movable plate 14 can reciprocate along the transmission direction perpendicular to the wave soldering carrier 19 driven by the lever cylinder 13. The bottom of the lever 15 is tangent to the buckle 21; as shown in the attached Figure 3 As shown, when the buckle 21 is cam-shaped, the buckle 21 includes two arcs, one large and one small. The large arc is the fixed end, which is fixed to the tooling by screws, and the small arc is the sliding end, which can slide on the tooling and the PCB board. The bottom of the lever 15 is tangent to the buckle, which specifically means that the bottom of the lever 15 is tangent to the outer circle of the large arc, so that during the movement of the lever 15, it is in close contact with the buckle 21, driving it to rotate and open.

[0050] After positioning the wave soldering carrier 19, the present application flips the pressure plate to the plane where the PCB board is located through the flip unit, and the buckle 21 is unscrewed through the lever 15, so that the wave soldering carrier 19 is in a released state, which is convenient for the subsequent separation of the PCB board and the tooling; the distance between the first movable rail and the first fixed rail in the release mechanism 1 in the present application is adjustable, which can be suitable for wave soldering carriers of different sizes, and can realize automatic positioning, flipping and lever 15 of the wave soldering carrier 19, realizing unmanned operation, with a high degree of automation, and significantly improving the release efficiency of the wave soldering carrier 19.

[0051] The separation mechanism 2 includes a second fixed rail 23 and a second movable rail 30 corresponding to the first fixed rail 6 and the first movable rail 10, and the second movable rail 30 can move toward or away from the second fixed rail 23. In this embodiment, the distance between the first fixed rail 6 and the first movable rail 10 is equal to the distance between the second fixed rail 23 and the second movable rail 30, and the objects transmitted by the two are the same. Similarly, a second transmission chain is set on the side opposite to the second fixed rail 23 and the second movable rail 30.

[0052] The front end of the second fixed rail 23 is provided with a second blocking cylinder 26; the rear end and the front end of the second fixed rail 23 are respectively provided with a third photodetector 24 and a fourth photodetector 25; when the third photodetector 24 detects the wave soldering carrier 19, the second blocking cylinder extends; the second transmission chain starts to drive until the wave soldering carrier 19 is blocked by the second blocking cylinder 26, and the second transmission chain stops driving. At this time, the wave soldering carrier 19 is in a released state, that is, the PCB board is no longer restricted by the tooling, and the PCB board can be easily taken out through the PCB board through holes 28 on both sides of the PCB board; at the same time, the gap of the pressure plate and the end of the tooling constitute the tooling clamping position 31. The clamping mechanism 4 can only start the clamping action when the fourth photodetector 25 detects that the wave soldering carrier is stationary.

[0053] The clamping mechanism 4 includes a robot 33, the front end of the robot 33 is provided with a clamping swing arm that can swing freely in three-dimensional space, the front end of the clamping swing arm is provided with a clamping unit, the clamping unit includes a PCB clamping subunit and a tooling clamping subunit, the PCB clamping subunit includes a first clamping cylinder 36 and first clamping blocks 37 on both sides and parallel to the first clamping cylinder 36; wherein the first lifting cylinder 35, the first lifting cylinder 35 is connected to the first clamping cylinder 36, used to drive the first clamping cylinder 36 to lift, the first clamping cylinder 36 is connected to the first clamping block 37, used to drive the two first clamping blocks 37 to tighten and loosen. The first lifting cylinder 35 and the second lifting cylinder 38 are fixed together at the front end of the clamping swing arm through the fixture mounting plate 34.

[0054] The tool clamping subunit includes a second lifting cylinder 38, a second clamping cylinder 39, and second clamping blocks 40 on both sides of and parallel to the second clamping cylinder 39; wherein the second lifting cylinder 38 is connected to the second clamping cylinder 39 to drive the second clamping cylinder 39 to lift and lower, and the second clamping cylinder 39 is connected to the second clamping block 40 to drive the tightening and loosening of the two second clamping blocks 40. The tool clamping subunit directly clamps the tool and transmits it to the tool return mechanism 5, and a transmission chain is set on the upper surface of the tool return mechanism 5 to output the tool.

[0055] The PCB board transport mechanism 3 includes a third fixed rail 42 and a third movable rail 45. Similarly, the third movable rail 45 can move in a direction close to or away from the second fixed rail 23. In this embodiment, the distance between the third fixed rail 42 and the third movable rail 45 is smaller than the distance between the second fixed rail 23 and the second movable rail 30. The third fixed rail 42 and the third movable rail 45 are used to transport the PCB board 44, and the width of the PCB board 44 is smaller than the width of the wave soldering carrier 19. Similarly, a third transport chain is arranged on the side opposite to the third fixed rail 42 and the third movable rail 45.

[0056] A fifth photodetector 43 and a sixth photodetector 48 are respectively disposed at the rear end and the front end of the third fixed rail 42; the fifth photodetector 43 detects whether a PCB board is placed on the third transmission chain, and the sixth photodetector 48 is used to detect whether the PCB board is output. A PCB board clamping position 46 is also disposed on both sides of the third movable rail 45 and the third fixed rail 42. When the PCB clamping subunit places the PCB board on the third transmission chain, the first clamping block 37 after being released is exactly located at the PCB board clamping position 46, and then moves out of the PCB board clamping position 46 under the drive of the clamping swing arm.

[0057] Example 2

[0058] A method for disassembling and reflowing a wave soldering carrier 19 includes the device structure in Example 1 and a control center of the entire device. The signals of each mechanism in the embodiment are transmitted to the control center and uniformly coordinated by the control center. Specifically, the following steps are included:

[0059] S01: The wave soldering carrier 19 enters the release mechanism 1, and the flip unit flips the pressure plate to the plane where the PCB board is located; the moving plate 14 in the buckle unit drives the lever 15 to reciprocate, so that the buckle 21 on the tooling is unscrewed, and the wave soldering carrier 19 is in the released state.

[0060] Step S01 specifically includes:

[0061] S011: The first photoelectric detector 7 detects that the wave soldering carrier 19 enters the release mechanism 1, and the control center controls the first blocking cylinder 11 to extend; the control center controls the first transmission chain to start transmission until the wave soldering carrier 19 is blocked by the first cylinder, and the control center controls the first transmission chain to stop transmission.

[0062] S012: The second photoelectric detector 8 located at the rear end of the first blocking cylinder 11 detects that the wave soldering carrier is stationary; the pressure plate cylinders 49 on both sides press down to fix the tooling in the wave soldering carrier 19; at this time, the fixing ring is located in the pressure plate opening 20 above the pressure plate;

[0063] S013: The turning cylinder 17 drives the turning swing arm 18 and the fixing ring to swing, so that the pressing plate 51 turns to the plane where the PCB board is located;

[0064] S014: The lever cylinder 13 drives the lever 15 to move back and forth, so that the buckle 21 on the tooling is unscrewed; at this time, the wave soldering carrier 19 is in a released state, that is, the PCB board and the tooling remain independent of each other.

[0065] S02: The wave soldering carrier 19 in the released state is transferred to the separation mechanism 2. Specifically, it includes:

[0066] S021: The first blocking cylinder 11 is lifted, and at the same time, the pressing plate cylinder 49 is retracted upward, and the control center controls the first transmission chain to start transmission, and the wave soldering carrier in the released state continues to move forward to the second transmission chain in the separation mechanism 2;

[0067] S022: When the third photoelectric detector 24 detects that the wave soldering carrier enters the second transmission chain, the second blocking cylinder 26 extends; at the same time, the second transmission chain drives the wave soldering carrier to move until it is blocked by the second blocking cylinder 26;

[0068] S03: When the fourth photoelectric detector 25 detects that the wave soldering carrier is stationary, the clamping mechanism 4 first clamps the PCB board and transfers it to the PCB board transport mechanism for output; then clamps the tooling and transfers it to the tooling reflow mechanism 5 for output. Specifically including:

[0069] S031: The fourth photoelectric detector 25 located at the rear end of the second blocking cylinder 26 detects that the wave soldering carrier is stationary; the clamping swing arm in the robot 33 drives the PCB board clamping subunit to move above the PCB board, the first lifting cylinder 35 extends downward, and the two first clamping blocks 37 fall into the two PCB board through holes 28 respectively, the first clamping cylinder 36 drives the first clamping blocks 37 to tighten, and the first lifting cylinder 35 drives the PCB board and the first clamping blocks 37 to shrink upward, so that the PCB board is separated from the wave soldering carrier 19;

[0070] S032: The PCB board clamping subunit places the PCB board in the PCB board transport mechanism 3, and the first clamping block 37 is just located inside the PCB board clamping position 46. The first clamping cylinder 36 drives the first clamping block 37 to loosen, and the PCB board is placed on the third transmission chain. At the same time, the loosened first clamping block 37 is located in the PCB board clamping position 46, and the first lifting cylinder drives the first clamping block 37 to retract upward. After the fifth photoelectric detector 43 detects the PCB board, the third transmission chain starts to move, and the PCB board clamping subunit can place the next PCB board 44 to the PCB board transport mechanism 3 until the sixth photoelectric detector 48 detects the PCB board.

[0071] S033: The clamping swing arm in the robot 33 drives the tooling clamping unit to move above the tooling, the second lifting cylinder 38 extends downward, the two second clamping blocks 40 respectively fall to the two tooling clamping positions 31, the second clamping cylinder 39 drives the second clamping blocks 40 to tighten, the second lifting cylinder 38 drives the tooling and the second clamping blocks 40 to retract upward, and places the tooling in the tooling reflux mechanism 5 for transmission.

[0072] The PCB board and the tooling in the wave soldering carrier in the released state are in an independent state. In this application, the robot first drives the PCB board clamping subunit to clamp the PCB board and place it on the PCB board transportation mechanism output, and then drives the tooling clamping subunit to clamp the tooling and place it on the tooling reflow mechanism output, thereby realizing the automatic separation of the PCB board and the tooling in the wave soldering carrier in the released state, and further improving the separation efficiency.

[0073] It can be understood that the above embodiments only express the preferred implementation modes of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the patent scope of the present invention. It should be pointed out that, for ordinary technicians in this field, the above technical features can be freely combined without departing from the concept of the present invention, and several deformations and improvements can be made, which all belong to the protection scope of the present invention. Therefore, all equivalent changes and modifications made to the scope of the claims of the present invention should belong to the coverage of the claims of the present invention.

Claims

1. A wave soldering carrier disassembly and reflow device, the wave soldering carrier comprising a tool and a PCB board embedded in the tool, the tool comprising a folded pressing plate and buckles fixed on the front and rear sides of the PCB board; characterized in that: It includes a releasing mechanism, a separating mechanism, a clamping mechanism, a PCB board transporting mechanism and a tooling reflow mechanism; the output end of the releasing mechanism is connected to the input end of the separating mechanism, and the clamping mechanism is located on one side of the separating mechanism, and is used to clamp the PCB board and the tooling in the separating mechanism to the PCB board transporting mechanism and the tooling reflow mechanism respectively; The release mechanism includes a flip unit and a button unit, the flip unit flips the pressure plate, the button unit includes a moving plate and a lever located on both sides of the moving plate, the moving plate is arranged above the wave soldering carrier and can reciprocate along a direction perpendicular to the transmission direction of the wave soldering carrier; the bottom of the lever is tangent to the buckle; The release mechanism also includes a first fixed rail and a first movable rail arranged in parallel, and the first fixed rail and the first movable rail are respectively provided with first transmission chains on opposite sides, and the two sides of the wave soldering carrier are respectively located on the two first transmission chains; the first movable rail or the first fixed rail is provided with a first blocking cylinder at the front end; the first movable rail or the first fixed rail is provided with a first photoelectric detector and a second photoelectric detector at the rear end and the front end respectively; the flip unit includes a flip cylinder and a flip swing arm, and the front end of the flip swing arm includes a fixing ring; the button unit includes a fixing frame and a lever cylinder, the moving plate is slidably connected to the fixing frame, and the two ends of the fixing frame are provided with a pressing plate cylinder respectively; The output end of the flip cylinder is connected to the flip swing arm; The method of disassembling and reflowing a wave soldering carrier includes the following steps: S01: The wave soldering carrier enters the release mechanism, and the flip unit flips the pressure plate to the plane where the PCB is located; the moving plate in the buckle unit drives the lever to reciprocate, so that the buckle on the tooling is unscrewed, and the wave soldering carrier is in the release state; S02: The wave soldering carrier in the released state is transferred to the separation mechanism; S03: The clamping mechanism first clamps the PCB board and transfers it to the PCB board transport mechanism for output; Then the tooling is clamped and transferred to the tooling return mechanism for output; Step S01 specifically includes: S011: The first photoelectric detector detects that the wave soldering carrier enters the release mechanism, and the first blocking cylinder extends; The first transmission chain starts to transmit until the wave soldering carrier is blocked by the first cylinder; S012: When the second photoelectric detector located at the rear end of the first blocking cylinder detects that the wave soldering carrier is stationary, the pressing plate cylinder presses down to fix the wave soldering carrier; at this time, the fixing ring is located in the pressing plate opening above the pressing plate; S013: The flip cylinder drives the flip swing arm and the fixed ring to swing, so that the pressure plate flips to the plane where the PCB board is located; S014: The lever cylinder drives the lever to move back and forth, so that the buckle on the tooling is unscrewed.

2. A wave soldering carrier disassembly and reflow device according to claim 1, characterized in that: The first movable rail is capable of moving in a direction approaching or moving away from the first fixed rail.

3. A wave soldering carrier disassembly and reflow device according to claim 1, characterized in that: The tilting cylinder is located outside the first fixed rail.

4. A wave soldering carrier disassembly and reflow device according to claim 1, characterized in that: The two ends of the fixing frame are respectively fixed on the fixed rail and the movable rail.

5. The wave soldering carrier disassembly and reflow device according to claim 1, characterized in that: The separation mechanism includes a second fixed rail and a second movable rail corresponding to the first fixed rail and the first movable rail, a second blocking cylinder is arranged at the front end of the second fixed rail or the second movable rail, and a third photoelectric detector and a fourth photoelectric detector are arranged at the rear end and the front end of the second fixed rail or the second movable rail respectively.

6. The wave soldering carrier disassembly and reflow device according to claim 1, characterized in that: The clamping mechanism includes a clamping unit, which includes a PCB clamping subunit and a tooling clamping subunit. The PCB clamping subunit includes a first clamping block located on both sides of a first clamping cylinder and parallel to the first clamping cylinder; the tooling clamping subunit includes a second clamping block located on both sides of a second clamping cylinder and parallel to the first clamping cylinder.

7. A wave soldering carrier disassembly and reflow device according to claim 6, characterized in that: The clamping mechanism also includes a robot, and a clamping unit is arranged at the front end of the clamping swing arm of the robot.

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