Radar device

Abstract

The present invention provides a radar device (1) comprising a substrate (3), a high-frequency IC (5) mounted on the substrate, a metal housing (11) opposite to the high-frequency IC, and an electromagnetic wave absorption and heat dissipation unit (9). The electromagnetic wave absorption and heat dissipation unit covers at least a portion of the high-frequency IC. The electromagnetic wave absorption and heat dissipation unit is in contact with the metal housing. The electromagnetic wave absorption and heat dissipation unit includes an electromagnetic wave absorption and heat dissipation gel (9).

Description

[0001] Cross-reference to related applications: This international application claims priority based on Japanese Patent Application No. 2019-125991, filed with the Japan Patent Office on July 5, 2019, and all contents of Japanese Patent Application No. 2019-125991 are incorporated herein by reference. Technical Field

[0002] This disclosure relates to radar devices. Background Technology

[0003] The radar device incorporates high-frequency ICs such as MMICs (Monolithic Microwave ICs). To counteract external noise, these high-frequency ICs are covered by shielding. Technology related to the shielding is disclosed in Patent Document 1.

[0004] Patent Document 1: Japanese Patent Application Publication No. 2018-207040

[0005] The inventors' detailed research revealed the following problem: Within the shield, the electric field surrounding the transmission channel and extending to the reception channel is enhanced, leading to an increase in the received floor noise. As a result, the signal-to-noise ratio (S / N) of the radar device deteriorates, and the detection range of the radar device decreases. To suppress floor noise, it is considered to install an electromagnetic wave absorber on the inner surface of the shield.

[0006] Additionally, heat generated by the high-frequency IC needs to be dissipated. To address this, thermal gel is considered to be filled between the high-frequency IC and the shielding cover.

[0007] When thermal gel is used to fill the space between the high-frequency IC and the shield, electromagnetic wave absorbers can only be installed in the portion of the shield away from the high-frequency IC. Because the electric field surrounding the high-frequency IC is significant, electromagnetic wave absorbers installed in the portion away from the high-frequency IC cannot adequately suppress the floor noise. Summary of the Invention

[0008] In one aspect of this disclosure, a radar device is preferably provided that is capable of dissipating heat generated by a high-frequency IC and suppressing the background noise caused by the high-frequency IC.

[0009] One aspect of this disclosure is a radar device comprising: a substrate; a high-frequency IC mounted on the substrate; a metal housing opposite to the high-frequency IC; and an electromagnetic wave absorbing and heat dissipating unit covering at least a portion of the high-frequency IC, wherein the electromagnetic wave absorbing and heat dissipating unit is in contact with the metal housing, and the electromagnetic wave absorbing and heat dissipating unit comprises electromagnetic wave absorbing and heat dissipating gel.

[0010] The radar device, as one aspect of this disclosure, includes an electromagnetic wave absorbing and heat dissipating unit. The electromagnetic wave absorbing and heat dissipating unit covers at least a portion of the high-frequency IC and is in contact with a metal housing. Heat generated by the high-frequency IC is transferred to the metal housing via the electromagnetic wave absorbing and heat dissipating unit. Therefore, the radar device, as one aspect of this disclosure, can efficiently dissipate the heat generated by the high-frequency IC.

[0011] Furthermore, the radio wave absorption and heat dissipation unit absorbs radio waves generated by the high-frequency IC. Since the radio wave absorption and heat dissipation unit covers at least a portion of the high-frequency IC, the radio wave absorption effect is even higher. Therefore, the radar device, as an aspect of this disclosure, can suppress the background noise caused by the high-frequency IC. Attached Figure Description

[0012] Figure 1 This is a side sectional view showing the structure of the radar device according to the first embodiment.

[0013] Figure 2 This is a side sectional view showing the structure of the radar device according to the second embodiment.

[0014] Figure 3 It is a three-dimensional view showing the structure of the shield as viewed from the side of the metal casing.

[0015] Figure 4 This is a three-dimensional view showing the structure of the shield as viewed from the substrate side.

[0016] Figure 5 This is a side sectional view showing the structure of the radar device according to the third embodiment.

[0017] Figure 6 This is a three-dimensional view showing the structure of the shield as viewed from the substrate side.

[0018] Figure 7 This is a side sectional view showing the structure of the radar device according to the fourth embodiment. Detailed Implementation

[0019] Exemplary embodiments of this disclosure will be described with reference to the accompanying drawings.

[0020] <First Implementation>

[0021] 1. Structure of Radar Device 1

[0022] based on Figure 1 The structure of radar device 1 will be described. Radar device 1 is, for example, a vehicle-mounted device. Radar device 1 is used, for example, in advanced driver assistance systems, autonomous driving, etc. Radar device 1 is, for example, a millimeter-wave radar.

[0023] like Figure 1As shown, the radar device 1 includes a substrate 3, an MMIC 5, a metal housing 11, an electromagnetic wave absorbing heat dissipation gel 9, and an electromagnetic wave absorbing heat dissipation gel 12. The MMIC 5 is mounted on the surface of the substrate 3 opposite to the metal housing 11. The MMIC 5 corresponds to a high-frequency IC. In this embodiment, the electromagnetic wave absorbing heat dissipation gel 9 corresponds to an electromagnetic wave absorbing heat dissipation unit.

[0024] The metal housing 11 is part of the housing of the radar device 1. The metal housing 11 is opposite to the substrate 3 and the MMIC 5. The metal housing 11 has a protrusion 21 and a sidewall portion 22. The protrusion 21 is the portion of the metal housing 11 that protrudes toward the substrate 3.

[0025] Viewed from the thickness direction of substrate 3, protrusion 21 is located at a position overlapping with MMIC5. Furthermore, viewed from the thickness direction of substrate 3, the area of ​​protrusion 21 includes MMIC5. Hereinafter, the surface of protrusion 21 opposite to MMIC5 will be designated as gel contact surface 21A.

[0026] The shape of the gel contact surface 21A is basically flat. However, the surface roughness Rz of the gel contact surface 21A is 10 or more and less than 1000. The surface roughness Rz is measured using a stylus-type roughness tester. There is a gap between the gel contact surface 21A and the MMIC5. The gel contact surface 21A is closer to the substrate 3 than the portion between the protrusion 21 and the sidewall portion 22 in the metal housing 11 (hereinafter, the peripheral portion 20).

[0027] The sidewall portion 22 is a wall-shaped member extending toward the substrate 3. Viewed from the thickness direction of the substrate 3, the sidewall portion 22 is configured to surround the protrusion 21 throughout its entire circumference. Hereinafter, the surface of the sidewall portion 22 facing the substrate 3 will be designated as the gel contact surface 22A. The shape of the gel contact surface 22A is substantially flat. However, the surface roughness Rz of the gel contact surface 22A is 10 or more and 1000 or less. A gap exists between the gel contact surface 22A and the substrate 3.

[0028] Electromagnetic wave absorbing heat dissipation gel 9 is filled between MMIC5 and gel contact surface 21A. Electromagnetic wave absorbing heat dissipation gel 9 is in contact with MMIC5. Electromagnetic wave absorbing heat dissipation gel 9 covers most of the surface of MMIC5 opposite to the metal housing 11. For example, electromagnetic wave absorbing heat dissipation gel 9 covers the entire surface of MMIC5 opposite to the metal housing 11.

[0029] Furthermore, the electromagnetic wave absorbing heat dissipation gel 9 is in contact with the gel contact surface 21A. As described above, the surface roughness Rz of the gel contact surface 21A is 10 or more and 1000 or less.

[0030] Preferably, the thermal conductivity of the electromagnetic wave absorbing heat dissipation gel 9 is 0.1 W / m·K or higher and 1 W / m·K or higher. Furthermore, when preparing a 1 mm thick sample made of the same material as the electromagnetic wave absorbing heat dissipation gel 9 and measuring the electromagnetic shielding level of this sample, the measured value of the electromagnetic shielding level is preferably 1 dB or higher and 10 dB or higher. The wavelength of the electromagnetic wave used for measuring the electromagnetic shielding level is 4 mm.

[0031] The electromagnetic wave absorbing heat dissipation gel 9 includes, for example, a resin, a heat dissipation filler, and an electromagnetic wave absorbing filler. Examples of resins include silicone-based resins. Examples of heat dissipation fillers include thermally conductive powders. Examples of thermally conductive powders include oxides, nitrides, and carbides. Examples of oxides include alumina. Examples of nitrides include boron nitride. Examples of carbides include silicon carbide. The heat dissipation filler can be composed of a single substance or a mixture of multiple substances.

[0032] Examples of fillers used for absorbing electromagnetic waves include magnetic powders. Examples of magnetic powders include ferrites, iron carbonyl, and flat magnetic metal powders. Fillers for absorbing electromagnetic waves can be composed of a single substance or a mixture of multiple substances.

[0033] The higher the amount of heat dissipation filler used, the higher the thermal conductivity of the electromagnetic wave absorbing heat dissipation gel 9. The higher the amount of electromagnetic wave absorbing filler used, the higher the electromagnetic shielding capacity of the electromagnetic wave absorbing heat dissipation gel 9.

[0034] The thickness of the electromagnetic wave absorbing heat dissipation gel 9 is, for example, 0.1 mm or more and 2.0 mm or less. The electromagnetic wave absorbing heat dissipation gel 9 can be formed, for example, by coating the MMIC 5 or the gel contact surface 21A with a material corresponding to the electromagnetic wave absorbing heat dissipation gel 9.

[0035] Electromagnetic wave absorbing heat dissipation gel 12 is filled between the gel contact surface 22A and the substrate 3. Electromagnetic wave absorbing heat dissipation gel 12 has, for example, the same composition as electromagnetic wave absorbing heat dissipation gel 9. Electromagnetic wave absorbing heat dissipation gel 12 corresponds to electromagnetic wave absorbing gel. Alternatively, electromagnetic wave absorbing gel with lower heat dissipation function may be used instead of electromagnetic wave absorbing heat dissipation gel 12. Electromagnetic wave absorbing gel with lower heat dissipation function is, for example, the same as electromagnetic wave absorbing heat dissipation gel 9 in terms of electromagnetic wave absorption function.

[0036] The thickness of the electromagnetic wave absorbing heat dissipation gel 12 is, for example, 0.1 mm or more and 2.0 mm or less. The electromagnetic wave absorbing heat dissipation gel 12 can be formed, for example, by coating a material corresponding to the electromagnetic wave absorbing heat dissipation gel 12 onto the gel contact surface 22A or the substrate 3.

[0037] 2. The effect of radar device 1

[0038] (1A) The radar device 1 includes a radio wave absorbing heat dissipation gel 9. The radio wave absorbing heat dissipation gel 9 covers at least a portion of the MMIC 5 and is in contact with the metal housing 11. The heat generated by the MMIC 5 is transferred to the metal housing 11 via the radio wave absorbing heat dissipation gel 9. Therefore, the radar device 1 can effectively dissipate the heat generated by the MMIC 5.

[0039] Furthermore, the radio wave absorbing heat dissipation gel 9 absorbs the radio waves generated by the MMIC5. Since the radio wave absorbing heat dissipation gel 9 covers at least a portion of the MMIC5, its radio wave absorption effect is even higher. Therefore, the radar device 1 is able to suppress the background noise caused by the MMIC5.

[0040] (1B) The metal casing 11 has a protrusion 21 on the portion opposite to the MMIC5. The protrusion 21 protrudes toward the MMIC5 side. The radio wave absorbing heat dissipation gel 9 is in contact with the protrusion 21. Therefore, the thickness of the radio wave absorbing heat dissipation gel 9 is thinner compared to the case without the protrusion 21. As a result, the radar device 1 can further effectively dissipate the heat generated by the MMIC5.

[0041] Furthermore, the metal housing 11 includes a peripheral portion 20. The distance between the peripheral portion 20 and the substrate 3 is greater than the distance between the protrusion 21 and the substrate 3. Therefore, a component with a higher height can be mounted on the portion of the substrate 3 opposite to the peripheral portion 20. Additionally, the metal housing 11 includes a sidewall portion 22. The sidewall portion 22 can suppress external noise.

[0042] (1C) If the sidewall portion 22 is pressed directly onto the substrate 3, the substrate 3 will warp, generating welding stress and reducing the welding life. In the radar device 1, there is a gap between the sidewall portion 22 and the substrate 3, and this gap is filled with electromagnetic wave absorbing heat dissipation gel 12. Therefore, the radar device 1 can suppress the reduction in welding life. In addition, in the radar device 1, since the gap between the sidewall portion 22 and the substrate 3 is blocked by electromagnetic wave absorbing heat dissipation gel 12, external noise can be further suppressed.

[0043] (1D) The surface roughness Rz of the gel contact surface 21A is 10 or more and 1000 or less. Therefore, the electromagnetic wave absorbing heat dissipation gel 9 has a high adhesion to the gel contact surface 21A. As a result, it is possible to prevent the electromagnetic wave absorbing heat dissipation gel 9 from drooping from its original position.

[0044] Furthermore, the surface roughness Rz of the gel contact surface 22A is 10 or more and 1000 or less. Therefore, the adhesion of the electromagnetic wave absorbing heat dissipation gel 12 to the gel contact surface 22A is high. As a result, it is possible to prevent the electromagnetic wave absorbing heat dissipation gel 12 from sagging off from its original position.

[0045] <Second Implementation>

[0046] 1. Differences from the first embodiment

[0047] Since the basic structure of the second embodiment is the same as that of the first embodiment, the differences will be described below. Furthermore, the same reference numerals as in the first embodiment denote the same structures, as explained above. Compared with the first embodiment described above, the second embodiment differs in the following aspects.

[0048] like Figure 2 As shown, the radar device 1 of the second embodiment further includes a shielding cover 7, a housing support 13, and an electromagnetic wave absorbing heat dissipation gel 23. In the second embodiment, the shielding cover 7, the electromagnetic wave absorbing heat dissipation gel 9, and the electromagnetic wave absorbing heat dissipation gel 23 correspond to an electromagnetic wave absorbing heat dissipation unit.

[0049] like Figure 2 As shown, the outer casing support 13 is mounted on the surface of the substrate 3 opposite to the metal casing 11. The outer casing support 13 is a wall-shaped component configured to surround the MMIC 5. The outer casing support 13 is made of metal.

[0050] like Figure 2 As shown, the shielding cover 7 is housed within a space surrounded by the metal housing 11 and the substrate 3. Figures 2-4 As shown, the shielding cover 7 is a box-shaped component with an opening on the side of the substrate 3. The shielding cover 7 includes a top plate portion 15 and a side plate portion 17. The top plate portion 15 is a plate-shaped component facing the substrate 3. There is a space between the top plate portion 15 and the substrate 3. The side plate portion 17 is a plate-shaped component extending from the outer periphery of the top plate portion 15 towards the substrate 3. The side plate portion 17 is provided throughout the entire circumference of the top plate portion 15. The shielding cover 7 is made of metal.

[0051] like Figure 2 As shown, the shield 7 is mounted on the substrate 3 by inserting the outer casing support 13 into the inner side of the side portion 17. When the shield 7 is mounted on the substrate 3, the shield 7 houses the MMIC 5. The shield 7 suppresses external noise.

[0052] The shielding cover 7 includes a protrusion 19. The protrusion 19 is a portion of the top plate portion 15 that protrudes toward the MMIC5 side. The protrusion 19 is located at the center of the top plate portion 15. Viewed from the thickness direction of the substrate 3, the protrusion 19 is positioned to overlap with the MMIC5, the electromagnetic wave absorbing heat dissipation gel 9, the electromagnetic wave absorbing heat dissipation gel 23, and the protrusion 21. Furthermore, viewed from the thickness direction of the substrate 3, the area of ​​the protrusion 19 includes the MMIC5, the electromagnetic wave absorbing heat dissipation gel 9, and the electromagnetic wave absorbing heat dissipation gel 23.

[0053] Hereinafter, the surface of the protrusion 19 opposite to MMIC5 will be designated as the gel contact surface 19A. The shape of the gel contact surface 19A is basically flat. However, the surface roughness Rz of the gel contact surface 19A is 10 or more and 1000 or less.

[0054] There is a gap between the gel contact surface 19A and the MMIC5. The gel contact surface 19A is closer to the substrate 3 than the portion other than the protrusion 19 in the top plate portion 15 (hereinafter, the peripheral portion 31).

[0055] Electromagnetic wave absorbing heat dissipation gel 9 is filled between MMIC 5 and gel contact surface 19A. Electromagnetic wave absorbing heat dissipation gel 9 is in contact with MMIC 5. Electromagnetic wave absorbing heat dissipation gel 9 covers most of the surface of MMIC 5 opposite to shielding cover 7. For example, electromagnetic wave absorbing heat dissipation gel 9 covers the entire surface of MMIC 5 opposite to shielding cover 7.

[0056] Furthermore, the electromagnetic wave absorbing heat dissipation gel 9 is in contact with the gel contact surface 19A. As described above, the surface roughness Rz of the gel contact surface 19A is 10 or more and 1000 or less.

[0057] A gap exists between the protrusion 19 and the gel contact surface 21A. Electromagnetic wave absorbing heat dissipation gel 23 fills the gap between the protrusion 19 and the gel contact surface 21A. Electromagnetic wave absorbing heat dissipation gel 23 is in contact with both the protrusion 19 and the gel contact surface 21A. Electromagnetic wave absorbing heat dissipation gel 23, for example, has the same composition as electromagnetic wave absorbing heat dissipation gel 9. Alternatively, a heat dissipation gel with lower electromagnetic wave absorbing function may be used instead of electromagnetic wave absorbing heat dissipation gel 23. The heat dissipation gel with lower electromagnetic wave absorbing function, for example, has the same heat dissipation function as electromagnetic wave absorbing heat dissipation gel 9.

[0058] The thickness of the electromagnetic wave absorbing heat dissipation gel 23 is, for example, 0.1 mm or more and 2.0 mm or less. The electromagnetic wave absorbing heat dissipation gel 23 can be formed, for example, by coating the protrusion 19 or the gel contact surface 21A with a material corresponding to the electromagnetic wave absorbing heat dissipation gel 23.

[0059] 2. The effect of radar device 1

[0060] The second embodiment described in detail above achieves the same effect as the first embodiment. However, in the second embodiment, the shielding cover 7, the electromagnetic wave absorbing heat dissipation gel 9, and the electromagnetic wave absorbing heat dissipation gel 23 achieve the same effect as the electromagnetic wave absorbing heat dissipation gel 9 in the first embodiment. Furthermore, the second embodiment achieves the following effects.

[0061] (2A) The radar device 1 is equipped with a shield 7. The shield 7 houses the MMIC 5. Therefore, the electromagnetic wave shielding effect of the radar device 1 is higher.

[0062] <Third Implementation Method>

[0063] 1. Differences from the second embodiment

[0064] Since the basic structure of the third embodiment is the same as that of the second embodiment, the differences will be described below. Furthermore, the same reference numerals as in the second embodiment denote the same structures, as described previously.

[0065] In the second embodiment described above, no components are mounted on the peripheral portion 31. In contrast, in the third embodiment, as... Figure 5 , Figure 6 As shown, the difference from the second embodiment is that an electromagnetic wave absorber 25 is provided on the inner surface of the peripheral portion 31.

[0066] like Figure 6 As shown, the electromagnetic wave absorber 25 is configured to surround the protrusion 19. Viewed from the thickness direction of the substrate 3, the electromagnetic wave absorber 25 is configured to surround the MMIC 5. The electromagnetic wave absorber 25 includes, for example, a filler for electromagnetic wave absorption. Examples of fillers for electromagnetic wave absorption include magnetic powder. Examples of magnetic powders include ferrite, iron carbonyl, and flat magnetic metal powder. The filler for electromagnetic wave absorption can be composed of a single substance or a mixture of multiple substances. The electromagnetic wave absorber 25 is a plate-shaped component. The electromagnetic wave absorber 25 absorbs electromagnetic waves generated by the MMIC 5.

[0067] 2. The effect of radar device 1

[0068] In addition to achieving the effects of the second embodiment described above, the third embodiment, as detailed above, also achieves the following effects.

[0069] (3A) The radar device 1 also includes an electromagnetic wave absorber 25. The electromagnetic wave absorber 25 is disposed on the inner surface of the shield 7. The electromagnetic wave absorber 25 absorbs the electromagnetic waves generated by the MMIC5. Therefore, the radar device 1 can further suppress the background noise caused by the MMIC5.

[0070] <Fourth Implementation>

[0071] 1. Differences from the first embodiment

[0072] Since the basic structure of the fourth embodiment is the same as that of the first embodiment, the differences will be described below. Furthermore, the same reference numerals as in the first embodiment denote the same structures, as described previously.

[0073] In the fourth embodiment, such as Figure 7 As shown, in addition to the structure of the first embodiment, it also includes a shielding cover 7.

[0074] The shielding cover 7 is housed within a space surrounded by the metal housing 11 and the substrate 3. The shielding cover 7 is a box-shaped component with an opening on the side of the substrate 3. The shielding cover 7 has a top plate portion 15 and a side plate portion 17. The top plate portion 15 is a plate-shaped component facing the substrate 3. There is a space between the top plate portion 15 and the substrate 3.

[0075] Side portion 17 is a plate-shaped component extending from the outer periphery of top plate portion 15 toward substrate 3. Side portion 17 is provided all around the circumference of top plate portion 15. Shielding cover 7 is made of metal. Shielding cover 7 houses MMIC 5. Shielding cover 7 suppresses external noise.

[0076] The top plate portion 15 has an opening 27 in the portion opposite to the MMIC5. The opening 27 is located in the center of the top plate portion 15. The opening 27 is a hole that passes through the top plate portion 15. The electromagnetic wave absorbing heat dissipation gel 9 passes through the opening 27. The electromagnetic wave absorbing heat dissipation gel 9 is in contact with the inner edge 29 of the opening 27.

[0077] 2. The effect of radar device 1

[0078] According to the fourth embodiment described in detail above, the effects of the first embodiment described above are achieved, and the following effects are also achieved.

[0079] (4A) The radar device 1 is equipped with a shield 7. The shield 7 houses the MMIC 5. Therefore, the electromagnetic wave shielding effect of the radar device 1 is higher.

[0080] (4B) Compared to the case where both the electromagnetic wave absorbing heat dissipation gel 9 and the electromagnetic wave absorbing heat dissipation gel 23 are provided as in the second embodiment, in the fourth embodiment, only the electromagnetic wave absorbing heat dissipation gel 9 needs to be provided. Therefore, the process of providing the electromagnetic wave absorbing heat dissipation gel 9 can be simplified. As a result, the manufacturing cost of the radar device 1 can be reduced.

[0081] <Other Implementation Methods>

[0082] The embodiments of this disclosure have been described above, but this disclosure is not limited to the above embodiments and can be implemented in various ways.

[0083] (1) In the above embodiment, the radar device 1 includes MMIC5, but is not limited to it. For example, the radar device 1 may also include a high-frequency IC other than MMIC5.

[0084] (2) Multiple functions of one component in the above embodiments can be achieved through multiple components, or one function of one component can be achieved through multiple components. Alternatively, multiple functions of multiple components can be achieved through one component, or one function achieved by multiple components can be achieved through one component. Furthermore, a portion of the structure in the above embodiments can be omitted. Additionally, at least a portion of the structure in other above embodiments can be added to or replaced.

[0085] (3) In addition to the radar device 1 described above, this disclosure can also be implemented in various ways, such as a system that uses the radar device 1 as a component or a method for manufacturing the radar device 1.

Claims

1. A radar device comprising: a substrate; a high-frequency IC mounted on the substrate; a metal case opposed to the high-frequency IC; and a wave-absorbing heat-dissipating unit covering at least a portion of the high-frequency IC, and contacting the metal case, the wave-absorbing heat-dissipating unit including a shield case housing the high-frequency IC, and a wave-absorbing heat-dissipating gel, the metal case including a side wall portion extending toward the substrate, the radar device further comprising a wave-absorbing gel filled between the side wall portion and the substrate, the wave-absorbing gel filled between the side wall portion of the metal case and the substrate having a function of dissipating heat from the substrate together with the side wall portion of the metal case, a first protrusion is provided on a top plate portion of the shield case to intervene between a first wave-absorbing heat-dissipating gel and a second wave-absorbing heat-dissipating gel as the wave-absorbing heat-dissipating gel, and a wave-absorbing body is provided on an inner surface of the top plate portion of the shield case to surround the first protrusion.

2. The radar device according to claim 1, wherein the metal case includes a second protrusion protruding toward the high-frequency IC, the side wall portion is configured to surround the second protrusion, and the wave-absorbing heat-dissipating unit contacts the second protrusion.

3. The radar device according to claim 1, wherein the metal case further includes a gel contact surface contacting the wave-absorbing heat-dissipating gel, and a surface roughness Rz of the gel contact surface is 10 or more and 1000 or less.

4. The radar device according to claim 2, wherein the metal case further includes a gel contact surface contacting the wave-absorbing heat-dissipating gel, and a surface roughness Rz of the gel contact surface is 10 or more and 1000 or less.

5. The radar device according to any one of claims 1 to 4, wherein the shield case includes an opening portion at a portion opposed to the high-frequency IC, and the wave-absorbing heat-dissipating unit passes through the opening portion. ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​

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