Cooling system for electronic modules

Abstract

Systems and methods for cooling multiple electronic devices housed within a housing of an electronic module. The system includes a first cooling circulation arrangement configured to circulate a first liquid coolant between a first electronic device and a heat exchanger, the first electronic device being thermally coupled to the first liquid coolant such that heat is transferred from the first electronic device to the first liquid coolant. The system also includes a second cooling circulation arrangement configured to circulate a second liquid coolant between a second electronic device and a heat exchanger, the second electronic device being thermally coupled to the second liquid coolant such that heat is transferred from the second electronic device to the second liquid coolant. The first and second cooling circulation arrangements are thermally coupled at least via the heat exchanger such that heat is transferred from the first liquid coolant to the second liquid coolant via the heat exchanger.

Description

Technical Field

[0001] This disclosure relates to a system for cooling multiple electronic devices housed in an electronic module. The system includes a first cooling circulation arrangement and a second cooling circulation arrangement, the first cooling circulation arrangement being configured to cool a first electronic device within the electronic module, and the second cooling circulation arrangement being configured to cool a second electronic device within the electronic module. Coolant circulating in the first cooling circulation arrangement is cooled by transferring heat to coolant circulating in the second cooling circulation arrangement via a heat exchanger. A method for cooling multiple electronic devices housed in an electronic module is also described.

[0002] This disclosure also relates to systems for cooling electronic modules configured for mounting in a rack. This disclosure also considers mounting methods for liquid cooling systems for electronic modules, and kits for such mounting methods. Background Technology

[0003] Within computers, servers, or other devices used for data processing (referred to as IT or information technology), there are numerous electronic devices called integrated circuits (ICs). These ICs can include central processing units (CPUs), application-specific integrated circuits (ASICs), graphics processing units (GPUs), random access memory (RAM), and so on. Each of these devices generates heat during use. To keep these devices at their optimal operating temperature, it is important to remove heat from them. As IT processing power increases and therefore the number of electronic devices within computers, servers, or other IT systems grows, the challenge of removing sufficient heat generated by these electronic devices increases.

[0004] Electronic devices typically mounted on printed circuit boards (PCBs) are usually housed or encapsulated within enclosures or chassis to form electronic modules. For example, computer servers often comprise multiple electronic modules that are mounted in a rack and interconnected to provide the necessary IT infrastructure. Methods are needed to remove heat from each enclosure or chassis in order to maintain the electronic equipment within the chassis at appropriate temperatures.

[0005] Electronic modules are typically cooled by passing air through or through each enclosure or chassis. The airflow is sufficient to remove some heat from inside the enclosure to the surrounding environment. Until recently, this cooling method was almost exclusively used for mass-produced IT and server equipment. However, it has been found that as the size of the technology decreases for the same performance, the heat generated by the electronic equipment increases, even when the footprint decreases. Similarly, the peak performance of IT systems is limited by the constraints of using air-cooled systems to cool electronic modules.

[0006] Therefore, more sophisticated systems and methods for cooling electronic modules have been proposed. In some cases, liquid cooling has been used, where a liquid coolant flows through or to the vicinity of a heat sink coupled to the electronic device. Heat can then be transferred from the electronic device to areas or components where heat can be removed from the liquid coolant. In some cases, liquid cooling can remove heat from electronic devices or components more efficiently and thus provide greater cooling power than air cooling systems. However, existing liquid cooling systems typically require custom-designed systems that are complex and expensive to install.

[0007] Therefore, the object of the present invention is to provide a system for cooling electronic modules, and a method for cooling such a system, which overcomes these disadvantages of prior art systems. Summary of the Invention

[0008] In this context, systems and methods for cooling multiple electronic devices housed within a housing of an electronic module are provided. Specifically, the system includes a first cooling circulation arrangement and a second cooling circulation arrangement, or a first cooling loop and a second cooling loop, each circulating a corresponding first liquid coolant and a second liquid coolant. Each cooling circulation system is used to cool the electronic devices within the multiple devices of the electronic module. However, the second cooling circulation arrangement is also configured to cool the coolant circulating in the first cooling circulation system by heat exchange between the first liquid coolant and the second liquid coolant via a heat exchanger. The first and second cooling circulation arrangements can have different efficiencies, and therefore the more efficient cooling provided by the second cooling circulation arrangement can be used to cool the first liquid coolant. Furthermore, the more efficient second cooling circulation arrangement can be focused on specific high-power electronic devices (which generate relatively more heat). The first liquid coolant can be used to maintain a generally low temperature in the overall environment within the electronic module.

[0009] In a preferred example, the second cooling circulation arrangement may include a cold plate that can be thermally coupled to a specific electronic device among a plurality of electronic devices. In contrast, the first cooling circulation system may circulate a first liquid coolant contained in a reservoir partially within an electronic module, wherein the plurality of electronic devices are at least partially immersed in the reservoir of the first liquid coolant. Furthermore, including a weir or bathtub radiator within the first cooling circulation system may provide additional advantages to the system and method as described below.

[0010] In a first aspect, a system for cooling multiple electronic devices housed in a housing of an electronic module is described, the system comprising:

[0011] A first cooling cycle arrangement is configured to circulate a first liquid coolant between a first electronic device and a heat exchanger among a plurality of electronic devices, wherein the first electronic device is thermally coupled to the first liquid coolant, such that heat is transferred from the first electronic device to the first liquid coolant; and

[0012] The second cooling cycle arrangement is configured to circulate the second liquid coolant between the second electronic device and the heat exchanger in a plurality of electronic devices, wherein the second electronic device is thermally coupled to the second liquid coolant, so that heat is transferred from the second electronic device to the second liquid coolant;

[0013] The first cooling cycle arrangement and the second cooling cycle arrangement are thermally coupled at least via a heat exchanger, such that heat is transferred from the first liquid coolant to the second liquid coolant via the heat exchanger.

[0014] Electronic devices can be any heat-generating device or component, including integrated circuits (ICs), which include central processing units (CPUs), application-specific integrated circuits (ASICs), graphics processing units (GPUs), random access memory (RAM), and so on. These devices can be connected together to form servers or other computer processing functions or other IT systems.

[0015] Electronic modules, or server modules, can be modules that form part of a computer server. Electronic modules can have a chassis or enclosure, in which each electronic device is mounted. Electronic modules can be configured for mounting or placement in a rack. For example, electronic modules can conform to industry-standard dimensions required for assembly into a standard server rack (referred to as a 1RU (one rack unit) or 1OU (one open unit)). Such a unit can be called a blade server.

[0016] The system includes a first cooling cycle arrangement and a second cooling cycle arrangement (or a first cooling loop and a second cooling loop). The cooling cycle arrangement provides a configuration for allowing the corresponding first and second coolants to flow through the electronic modules.

[0017] Specifically, the first cooling circulation arrangement circulates or flows a first liquid coolant from at least a first electronic heating device (the first liquid coolant absorbs heat from the first electronic heating device) to a heat exchanger. At the heat exchanger, heat can be removed from the first liquid coolant.

[0018] The second cooling circulation arrangement circulates or flows a second liquid coolant from at least a second electronic heating device (from which the second liquid coolant absorbs heat) to a heat exchanger. At this heat exchanger, heat from the first liquid coolant is received by the second liquid coolant.

[0019] While in some cases the second cooling cycle arrangement can be closed (in other words, the liquid coolant is recirculated and recycled within the loop), this is not always the case. Alternatively, the second cooling cycle arrangement can be described as an open loop, in which the liquid coolant is received, allowed to flow around the path, and then delivered to an outlet. For example, after passing through a heat exchanger, the second liquid coolant in the second cooling cycle arrangement is then cooled (by passing through a cooling system before being returned to the electronic module) or replenished (e.g., where the second liquid coolant is part of a facility-wide coolant source, such as facility water).

[0020] Advantageously, the system is a hybrid system of two cooling cycle arrangements. Using such a hybrid system allows for a higher-performance, more efficient cooling arrangement to be used for particularly high-temperature components (the second cooling cycle arrangement, for at least the second electronic device), as well as for using another cooling arrangement to cool other devices. However, in addition to simply using two completely independent parallel cooling systems, the inventors have recognized that the recirculation from the higher-performance cooling arrangement can also be used to remove heat from another lower-performance cooling device. To some extent, the first cooling cycle arrangement can be considered as nesting the second cooling cycle arrangement.

[0021] Optionally, the first liquid coolant is a dielectric fluid, and the second liquid coolant is water. It should be understood that although the term liquid coolant is used herein, any suitable fluid coolant can be used.

[0022] Optionally, the second cooling cycle arrangement further includes a cooling system, wherein the second cooling cycle arrangement is configured to circulate the second liquid coolant among the second electronic devices, heat exchangers, and the cooling system in a plurality of electronic devices, wherein heat is removed from the second liquid coolant by the cooling system. Preferably, the cooling system is arranged outside the electronic module. In other words, the second cooling cycle arrangement forms a closed loop, wherein the second liquid coolant received from the electronic module is cooled by the cooling system before returning to the electronic module to cool the second electronic device.

[0023] Alternatively, a second cooling circulation arrangement is connected to a second liquid coolant source, wherein the second cooling circulation arrangement is configured to circulate the second liquid coolant received from the second liquid coolant source between a second electronic device and a heat exchanger of a plurality of electronic devices, and to return it to the second liquid coolant source. In other words, the second cooling circulation arrangement is open-loop, and the second liquid coolant is fed from a facility-level source and is continuously replenished. For example, the second liquid coolant source may be a water source, from which water (as the second liquid coolant) is received, the water circulates through the second cooling circulation arrangement, and then the water is allowed to leave the second cooling circulation arrangement and enter the facility drainage device.

[0024] Preferably, the heat exchanger includes at least a first chamber and a second chamber separated by a thermal interface, wherein the heat exchanger is configured to allow a first liquid coolant to flow through at least the first chamber and a second liquid coolant to flow through at least the second chamber, such that heat is transferred from the first liquid coolant to the second liquid coolant via the thermal interface. The heat exchanger is a dedicated element configured for exchanging heat between the first liquid coolant and the second liquid coolant. Each of the first and second liquid coolants can pass through one or more dedicated chambers of the heat exchanger, wherein heat can be transferred from the first liquid coolant to the second liquid coolant via the thermal interface between the chambers. The heat exchanger can be of any suitable design and can provide multiple chambers and multiple thermal interfaces to improve the efficiency of heat exchange. Fins or other protrusions may be provided at the thermal interface to increase the surface area of ​​the thermal interface and improve the efficiency of heat exchange between the first and second liquid coolants. Optionally, the heat exchanger is a plate heat exchanger.

[0025] Preferably, the heat exchanger is arranged within the housing of the electronic module. Specifically, the heat exchanger is contained within the electronic module. This allows at least the first liquid coolant to remain completely within the electronic module. This reduces the complexity of connections to and from the electronic module. It also allows the electronic module to be provided as a sealed module, which may be advantageous if the second liquid coolant is a dielectric, and could be harmful to humans if released from the module, and expensive to replace if leaked or lost.

[0026] Optionally, the first cooling cycle arrangement is entirely contained within the housing of the electronic module. In other words, the first cooling cycle arrangement is configured such that the first liquid coolant does not leave the boundaries of the electronic module housing during normal operation.

[0027] Before the second liquid coolant circulates to the second electronic device, in the portion of the second cooling circulation arrangement having the coldest second liquid coolant, the first cooling circulation arrangement may be at least partially isolated from the second cooling circulation arrangement. Except at the heat exchanger where the first and second cooling circulation arrangements are thermally coupled, the first cooling circulation arrangement may be at least partially isolated from the second cooling circulation arrangement. In other words, the return flow of the second cooling circulation arrangement (in other words, after receiving heat from the second electronic device) is used to cool the first liquid coolant. This avoids raising the temperature of the second liquid coolant before it reaches the second electronic device, in order to maximize the cooling power (or more specifically, the temperature gradient) at the second electronic device.

[0028] Optionally, the housing of the electronic module contains a first liquid coolant, and the first electronic device is at least partially immersed in the first liquid coolant. In other words, the first cooling cycle arrangement is an immersion cooling arrangement. Heat can be transferred directly from the surface of the first electronic device to the first liquid coolant, which is at least partially immersed in the first liquid coolant. The portion of the second cooling cycle arrangement including the second electronic device can also be at least partially immersed in the first liquid coolant.

[0029] In contrast, the second cooling cycle arrangement can be configured to circulate a second liquid coolant through a cooling module and a heat exchanger, wherein the cooling module is mounted to the second electronic device at its mounting surface. Therefore, heat is indirectly exchanged between the second electronic device and the second liquid coolant via the mounting surface of the second cooling module. The cooling module, forming part of the second cooling cycle arrangement, will be discussed in more detail below.

[0030] In a preferred example, the first cooling cycle arrangement includes a weir, which comprises:

[0031] A base and a baffle extending from the base, the base and the baffle defining a volume for retaining some of the first liquid coolant;

[0032] The inlet allows the first liquid coolant to flow into the volume;

[0033] Sufficient first liquid coolant flows into the volume through the inlet, causing the first liquid coolant to overflow the baffle and be collected together with the first liquid coolant contained in the housing of the electronic module and outside the weir.

[0034] The base and the baffle can provide a container or "bathtub" from which the first coolant can overflow. The weir can be coupled to the surface of the first electronic device to serve as a heat sink for the first electronic device. Thus, the weir provides a volume for holding or maintaining the liquid coolant against the heated electronic device. Alternatively or additionally, the weir can be mounted on a PCB that is elevated relative to other components in the electronic device and / or relative to the level of the first coolant within the cavity of the electronic module's housing. In this way, the first liquid coolant is then used to flow over the first electronic device and multiple other electronic devices or components housed within the electronic module as it overflows the weir.

[0035] The weir can be configured to guide the first liquid coolant flow through the first cooling cycle arrangement. In other words, the weir can be configured such that the first liquid coolant overflowing from the weir flows onto or above a specific electronic device housed within the electronic module. Advantageously, by including a weir in the first cooling cycle arrangement, the liquid coolant can be applied more efficiently to one or more locations generating the most heat. Therefore, less coolant can be used. Since coolant is expensive and heavy, reducing the amount of coolant increases flexibility, efficiency, and reliability (e.g., due to the lower likelihood of coolant leakage and because the volume of coolant can withstand instantaneous temperature changes caused by the failure of other components in the system).

[0036] Regarding the weir, the volume used to hold or retain the first liquid coolant can be defined by a base and a baffle (which can be integral or separate). The base is part of the weir and can be mounted on top of an electronic device (more specifically, a heat transfer surface of the electronic device) and transfer heat from the heat transfer surface. The base typically has a flat surface defining the volume (and the base itself can be planar). Heat transferred (usually conductive) through the base (particularly its surface defining the volume) is transferred to the liquid coolant held in the volume. The baffle extends from the base.

[0037] One effect of the weir is to raise the level of coolant held within the volume of the weir to a level above the level outside the volume (at least when the cooling module is operating at the plane level of the electronic equipment and / or circuit boards), and the amount of coolant in the container of the cooling module is below the height of the weir.

[0038] Advantageously, the radiator has protrusions (e.g., pins and / or fins) extending within the volume from the base (or less preferably, from the baffle). These protrusions allow liquid coolant to diffuse radially away from a predetermined point on the base surface (e.g., coinciding with the hottest part of the electronic device). In particular, these protrusions can be formed in a non-linear pattern.

[0039] Preferably, the inlet of the weir further includes a nozzle arrangement for guiding the first liquid coolant into the volume. The nozzle arrangement may include one or more nozzles (which may be push-fit), each nozzle guiding the flowing or pumped first liquid coolant to a corresponding portion of the weir volume, particularly a portion of the weir's base. One or more nozzles may be individually arranged in the base, in a baffle, or above the top of the volume to allow the first liquid coolant to flow into it. For example, each nozzle may guide the flowing or pumped liquid coolant to a corresponding portion of the weir volume adjacent to a portion of the heat transfer surface of the electronic device that has a maximum temperature or a temperature above a threshold level (i.e., one of the hottest parts of the device). Most preferably, the nozzle arrangement guides the flowing or pumped liquid coolant in a direction perpendicular to the base of the weir. This forces the coolant directly into the volume and improves heat dissipation.

[0040] Preferably, the first cooling circulation arrangement further includes a pump configured to circulate a first liquid coolant within the arrangement. The pump may be arranged to receive the first liquid coolant from a reservoir of liquid coolant contained within the electronic module, with at least the first electronic device at least partially immersed in the reservoir. The pump may then move the received first liquid coolant to another area of ​​the electronic module, such as to a heat exchanger, and then forward to the inlet of the weir. The pump may be at least partially immersed in the first liquid coolant, which thereby also contributes to the cooling of the pump.

[0041] The first cooling circulation arrangement may also include a pump inlet configured to receive a first liquid coolant contained within the housing of the electronic module and outside the weir. In other words, the first liquid coolant contained within the electronic module can be received by the pump inlet for transfer to the pump.

[0042] Preferably, the first cooling circulation arrangement further includes at least a first pipe and a second pipe, which are arranged to deliver the first liquid coolant from the pump to the heat exchanger and from the heat exchanger to the inlet of the weir, respectively.

[0043] Preferably, the second cooling cycle arrangement further includes a cooling module configured to thermally couple the second electronic device to the second liquid coolant. The cooling module may be a specific component for efficient heat transfer from the second electronic device to the second liquid coolant. The cooling module may be mounted to the second electronic device via a mounting surface, such that heat is transferred from the second electronic device to the second liquid coolant through the mounting surface.

[0044] Preferably, the cooling module includes a cold plate, which comprises:

[0045] A cold plate housing, the surface of which is arranged to provide a thermal interface for cooling a second electronic device thermally coupled to the surface of the cold plate housing; and

[0046] At least one channel, which is located within the cold plate housing and close to the surface of the cold plate housing, is arranged for a second liquid coolant to flow through it, such that heat received from the second electronic device by the surface of the cold plate housing is transferred to the second liquid coolant.

[0047] Advantageously, this cold plate provides an efficient and effective mechanism for cooling specific electronic devices within an electronic module. The cold plate provides high-performance cooling for a second electronic device to which it is thermally coupled. Therefore, the cold plate can be coupled to one or more of the hottest components within the electronic module to provide maximum cooling power to these components.

[0048] Optionally, the surface of the cold plate housing can be directly coupled to the surface of the second electronic device. Alternatively, the housing can be coupled via another interface connecting surface or component. However, the cold plate and the second electronic device will be thermally coupled to facilitate efficient and effective heat transfer from the second electronic device to the second liquid coolant.

[0049] More than one cold plate can be arranged in the electronic module as part of the second cooling cycle arrangement. Two or more cold plates can be arranged in parallel or in series in the second cooling cycle arrangement, or a combination of parallel and series configurations can be achieved when using three or more cold plates.

[0050] Preferably, the second cooling circulation arrangement includes a plurality of conduits arranged to deliver the second liquid coolant between the cold plate and the heat exchanger, and for connection to any cooling system or coolant source outside the electronic module.

[0051] In a second aspect, a method for cooling multiple electronic devices housed in a housing of an electronic module is described, the method comprising:

[0052] Circulating the first liquid coolant within a first cooling cycle arrangement includes circulating the first liquid coolant between a first electronic device and a heat exchanger among a plurality of electronic devices, the first electronic device being thermally coupled to the first liquid coolant, such that heat is transferred from the first electronic device to the first liquid coolant; and

[0053] Circulating the second liquid coolant within the second cooling cycle arrangement includes circulating the second liquid coolant between a second electronic device and a heat exchanger in a plurality of electronic devices, the second electronic device being thermally coupled to the second liquid coolant, such that heat is transferred from the second electronic device to the second liquid coolant;

[0054] The first cooling cycle arrangement and the second cooling cycle arrangement are thermally coupled at least via a heat exchanger, such that heat is transferred from the first liquid coolant to the second liquid coolant via the heat exchanger.

[0055] In other words, the method may include circulating a first liquid coolant within a first cooling circulation arrangement and circulating a second liquid coolant within a second cooling circulation arrangement. Each of the first and second cooling circulation arrangements is configured to cool at least the corresponding first and second electronic devices. Furthermore, the second cooling circulation arrangement is arranged such that the second liquid coolant receives heat transferred from the first liquid coolant at a heat exchanger. Advantageously, this hybrid cooling system provides the benefit that a high-performance cooling system targets the hottest component (the second cooling circulation arrangement targets the first electronic device), while a separate cooling system is then used to cool other components in the electronic module. In particular, it may be impractical to install the target cooling system (e.g., provided by the second cooling circulation arrangement) onto every component within the electronic module, thus the first cooling circulation arrangement can provide additional cooling for the remaining components and lower the temperature of the general environment within the electronic module. Furthermore, the recirculation of the high-performance second cooling circulation arrangement can itself be used to remove heat from the first cooling system.

[0056] It should be understood that the features discussed above regarding the system can also be considered as disclosed in the method of using multiple electronic devices housed in the housing of the electronic module for cooling.

[0057] Specifically, preferably, the second cooling cycle arrangement further includes a cooling system, wherein circulating the second liquid coolant within the second cooling cycle arrangement includes circulating the second liquid coolant between second electronic devices, heat exchangers, and the cooling system among a plurality of electronic devices, wherein heat is removed from the second liquid coolant by the cooling system. The cooling system may be external to the electronic module and is configured to transfer heat from the second liquid coolant. For example, the cooling system may include a heat exchanger to transfer heat to another (third) liquid coolant or medium.

[0058] Alternatively, the second cooling cycle arrangement also includes a second liquid coolant source, wherein circulating the second liquid coolant within the second cooling cycle arrangement includes receiving the second liquid coolant from the second liquid coolant source, circulating the second liquid coolant between a second electronic device and a heat exchanger among a plurality of electronic devices, and then returning it to the second liquid coolant source. For example, the second liquid coolant may be water, and the second cooling cycle arrangement may be connected to a facility water source. Once the water has circulated through the second cooling cycle arrangement, it may be allowed to enter the drainage system (and therefore will not circulate through the second cooling cycle arrangement again).

[0059] A heat exchanger may include at least a first chamber and a second chamber separated by a thermal interface, wherein the heat exchanger is configured to allow a first liquid coolant to flow through at least the first chamber and a second liquid coolant to flow through at least the second chamber, such that heat is transferred from the first liquid coolant to the second liquid coolant across the thermal interface. A heat exchanger is a specific element configured for the efficient transfer of heat between the first liquid coolant and the second liquid coolant. The heat exchanger can be any suitable design to allow the first and second liquid coolants to flow through and exchange heat therebetween. Optionally, the heat exchanger is a plate heat exchanger.

[0060] Preferably, the heat exchanger is arranged within or contained within the housing of the electronic module. Advantageously, this avoids the discharge of the first liquid coolant from the electronic module. This reduces both the complexity of the connections at the housing of the electronic module and the risk of leakage or loss of the first liquid coolant.

[0061] Preferably, the first cooling cycle arrangement and the second cooling cycle arrangement are thermally coupled via a heat exchanger on the return flow of the second cooling cycle arrangement. In other words, the first cooling cycle arrangement and the second cooling cycle arrangement are thermally coupled via a heat exchanger such that the second liquid coolant passes through the heat exchanger after receiving heat from the second electronic device (when considering finding the coldest second liquid coolant at the beginning of the second cooling cycle arrangement). The first cooling cycle arrangement may be at least partially isolated from the second cooling cycle arrangement before the heat exchanger. This provides the maximum possible temperature gradient between the second liquid coolant and the second electronic device.

[0062] Preferably, the housing of the electronic module contains a first liquid coolant, and wherein the first electronic device is at least partially immersed in the first liquid coolant. In other words, the housing of the electronic device contains a reservoir of the first liquid coolant, in which at least the first electronic device is at least partially immersed. Therefore, heat is transferred directly from the surface of the first electronic device that is at least partially immersed in the first liquid coolant to the first liquid coolant.

[0063] Preferably, the first cooling cycle arrangement may include a weir. The weir may include:

[0064] A base and a baffle extending from the base, the base and the baffle defining a volume for retaining some of the first liquid coolant;

[0065] The first liquid coolant flows into the volume through the inlet;

[0066] In this process, sufficient first liquid coolant is allowed to flow into the volume through the inlet, causing the first liquid coolant to overflow the baffle and be collected together with the first liquid coolant contained in the housing of the electronic module and outside the weir.

[0067] Advantageously, the weir is used to facilitate the flow of the first liquid coolant within the electronic module. The weir can be further arranged to guide the flow of the first liquid coolant circulating through the first cooling cycle to specific electronic components.

[0068] In a particularly preferred example, the base of the weir can be thermally coupled to a first electronic device. In this way, the weir acts as an effective heat sink for the first electronic device. The weir also maintains a first liquid coolant flow that can cool heat-generating components arranged around the first electronic device to which the weir is coupled.

[0069] The inlet may also include a nozzle arrangement for guiding the first liquid coolant into the volume. The nozzle arrangement includes one or more nozzles.

[0070] A weir may also include a protrusion extending from the base and / or retaining wall within the volume of the weir.

[0071] The method may further include providing a pump within a first cooling circulation arrangement, the pump being configured to circulate a first liquid coolant within the first cooling circulation arrangement. The first cooling circulation arrangement may further include a pump inlet for receiving the first liquid coolant contained within the housing of the electronic module and outside the weir.

[0072] The method may also include providing a plurality of pipes within a first cooling circulation arrangement, the plurality of pipes being arranged to respectively deliver a first liquid coolant from the pump to a heat exchanger and from the heat exchanger to the inlet of the weir.

[0073] Preferably, the method includes providing a cooling module within a second cooling cycle arrangement, the cooling module being configured to thermally couple a second electronic device to a second liquid coolant. The cooling module may be mounted or coupled to a surface of the second electronic device. The cooling module may provide mechanisms for indirectly transferring heat from the second electronic device to the second liquid coolant via the cooling module (in other words, the second liquid coolant does not directly contact the surface of the second electronic device; instead, heat is transferred from the second electronic device through a portion of the cooling module to be received at the second liquid coolant). The cooling module may provide a higher cooling capacity than that provided by a first cooling cycle arrangement and contributes to more efficient cooling of the second electronic device.

[0074] In a preferred example, providing a cooling module within the second cooling cycle arrangement includes providing a cold plate comprising:

[0075] A cold plate housing, the surface of which is arranged to provide a thermal interface for cooling a second electronic device thermally coupled to the surface of the cold plate housing; and

[0076] At least one channel, which is located within the cold plate housing and close to the surface of the cold plate housing, is arranged for a second liquid coolant to flow through it, such that heat received from the second electronic device by the surface of the cold plate housing is transferred to the second liquid coolant.

[0077] More than one cold plate can be provided, which can be arranged in parallel or series within the second cooling cycle arrangement. The surface of the cold plate housing can be directly coupled to the surface of the second electronic device, or it can be coupled via an interface to facilitate efficient heat transfer.

[0078] The method may also include providing a plurality of conduits or pipes within a second cooling circulation arrangement, which are arranged to transport a second liquid coolant between the cold plate, the heat exchanger and the cooling system.

[0079] In another aspect, a system for cooling an electronic module (or server module) configured for mounting in a rack (or server rack) is described. The system includes at least a first and a second cold plate (or cold plate module, or cold plate assembly) mounted within the electronic module, through which a liquid coolant (e.g., water, or a dielectric fluid) circulates in a cooling loop. The first and second cold plates are each arranged on separate parallel branches of the cooling loop. During the circulation of the liquid coolant through the cold plates, heat is transferred from one or more electronic devices thermally coupled to the cold plates to the liquid coolant passing through each of the first and second cold plates. A cooling system is connected within the cooling loop to remove heat from or transfer heat away from the liquid circulating in the cooling loop. The coolant may be disposed externally or internally to the chassis or housing of the electronic module.

[0080] On the other hand, there is a system for cooling an electronic module configured for mounting in a rack, comprising a first cold plate and a second cold plate mounted within a module housing of the electronic module. Each cold plate includes a housing, wherein the surface of the housing is arranged to provide a thermal interface for cooling electronic equipment thermally coupled thereto. Each cold plate also includes at least one channel within the housing and near the surface, the at least one channel being arranged for liquid coolant to flow through it, such that heat received by the thermal interface is transferred to the liquid coolant. The first and second cold plates of the system are coupled in parallel in a cooling circuit arranged to circulate the liquid coolant.

[0081] Preferably, the system further includes a cooling system configured to remove heat from the liquid coolant, and a plurality of conduits coupled to a first and second cold plate and the cooling system for transferring the liquid coolant circulating in the cooling loop between the first and second cold plates and the cooling system. The conduits may be pipes or tubes, preferably flexible to allow for arrangement around components within the electronic module. Pipes may have small orifice sizes or diameters (e.g., between 2 mm and 20 mm, and more preferably between 3 mm and 10 mm) to facilitate arrangement within existing configurations of components within the electronic module. It is also advantageous to allow pipes or tubes to pass through existing holes, openings, or apertures in the module housing or chassis. The cooling system may include at least one heat exchanger for transferring heat from the liquid coolant to another cooling medium (e.g., a second liquid coolant or air). The cooling system may be arranged within the housing or chassis of the electronic module or may be arranged externally to the module.

[0082] Preferably, the plurality of conduits includes at least a first input conduit coupled to a first cold plate, a second input conduit coupled to a second cold plate, a supply conduit to which the first and second input conduits are coupled in parallel, a first output conduit coupled to the first cold plate, a second output conduit coupled to the second cold plate, and a receiving conduit to which the first and second output conduits are coupled in parallel. In other words, the plurality of conduits includes at least conduits forming a first parallel branch and a second parallel branch of the cooling circuit (the first input conduit and the first output conduit, and the second input conduit and the second output conduit, respectively), and two additional conduits for supplying or receiving liquid coolant to the parallel branch of the cooling circuit.

[0083] The couplings between the first and second input conduits and the supply conduit, as well as the couplings between the first and second output conduits and the receiving conduit, can be arranged within the module housing. In this case, the supply and receiving conduits are arranged through openings in the wall of the module housing. Alternatively, the couplings between the first and second input conduits and the supply conduit, as well as the couplings between the first and second output conduits and the receiving conduit, can be arranged outside the module housing. In this case, the first and second input conduits, as well as the first and second output conduits, are arranged through openings in the wall of the module housing.

[0084] Optionally, the system further includes a manifold for coupling the first and second input conduits to the supply conduit and / or for coupling the first and second output conduits to the receiving conduit. Optionally, the system includes a manifold for coupling the supply conduit to a first other conduit among a plurality of conduits, and / or for coupling the receiving conduit to a second other conduit among a plurality of conduits. The manifold can be a unit for joining or coupling conduits. Advantageously, the manifold can provide such a robust coupling. The manifold can be a single unit for coupling the input and supply conduits and the output and receiving conduits (with appropriate separation). However, two manifolds can be used, each associated with the supply and receiving sides of a cooling circuit.

[0085] The system may include at least one connector for connecting a first input conduit and a second input conduit and / or a first output conduit and a second output conduit to a manifold. The system may also include at least one connector for connecting a supply conduit and / or a receiving conduit to a manifold. Any type of suitable connector can be used to connect the conduits to the manifold. In one example, a drip-free manual connector is used, which requires direct manual manipulation by the installer. In another example, a blind-fit connector can be used, which is a push-fit connector that does not require specific manipulation to mate and seal the connectors. The drip-free, manually connected connector is advantageous for connection to existing IT systems because the tubing can exit the module housing regardless of where openings or orifices exist. Blind-fit connectors will require custom brackets for each electronic module but can provide easier mating.

[0086] In one example, the system may include a bracket for securing the manifold to the module housing. In another example, the system may include a bracket for securing the manifold to a rack. The manifold-to-electronics-to-rack mounting can be selected based on the available space in the rack and the system requirements. The manifold-to-electronics-module connection can reduce movement and strain on the connection between conduits. However, the manifold-to-rack connection can be more compact and less susceptible to impact or accidental damage.

[0087] In a particularly advantageous example, the manifold can be mounted to the rack within a defined slot that allows cables connected to the electronic modules to pass through. As mentioned above, the electronic modules and racks are typically industry-standard. Typically, the rack includes a rear cavity, section, or slot where cables and data cables can be housed or pass through before being connected to individual electronic modules. This cavity or slot can be used to accommodate one or more manifolds mounted therein. This provides a more robust system, and the manifolds are protected and partially enclosed by the slot. The slot walls also provide suitable mounting points for the manifolds (especially when the slot typically includes existing bores for feedthrough or cable securing).

[0088] Preferably, the system includes a third cold plate coupled in series with a first or second cold plate within the cooling circuit. In fact, the system may include more than three or any number of cold plates. Specifically, the system may include two or more cold plates on each parallel branch of the cooling circuit. For example, a first parallel branch of the cooling circuit may include a single first cold plate, and a second parallel branch of the cooling circuit may include a second and a third cold plate, wherein the second and third cold plates are themselves arranged in series. More than two cold plates may be arranged in series on each parallel branch of the cooling circuit.

[0089] Furthermore, more than two parallel branches of the cooling circuit can be arranged in the electronic module, each parallel branch having one or more cold plates connected thereto. If more than one cold plate is arranged on a particular parallel branch of the cooling circuit, additional cold plates can be arranged in series on a given branch.

[0090] Advantageously, the system can allow liquid coolant to circulate through the cold plate, either individually or in groups, in parallel or in series, or as a mixture of both.

[0091] In another aspect, a method for cooling an electronic module configured for mounting in a rack is described, comprising circulating a liquid coolant around a cooling circuit, wherein a first cold plate and a second cold plate are coupled in parallel within the cooling circuit, and wherein the first and second cold plates are housed within a module housing of the electronic module. Each of the first and second cold plates includes a housing, the surface of which is arranged to provide a thermal interface for cooling electronic equipment thermally coupled thereto, and at least one channel within the housing and near the surface, arranged for the liquid coolant to flow through, such that heat received by the thermal interface is transferred to the liquid coolant. Each feature of the cooling system mentioned in this disclosure can be achieved via the cooling method of this aspect.

[0092] The cooling system described in this disclosure can be fitted into typical or standard electronic modules (or server modules) configured for mounting in racks (or server racks). In particular, the cooling system can be advantageously retrofitted into existing electronic modules (or the panels of server modules within server racks). The cooling system can be used to replace existing cooling systems such as those typical of air-cooled systems in conventional or mass-produced server modules. Such air-cooled systems typically include air-cooled radiators within the chassis of the server module, and this can be removed and replaced by cold plates described as part of the cooling system of this disclosure. Similarly, the “footprint” (or the size of each cold plate in the plane of the server module, e.g., 50mm × 50mm to 150mm × 150mm) can be the same as or similar to the footprint of a typical air-cooled radiator used for this type of server module.

[0093] Advantageously, the liquid-cooled cold plate-based cooling system of this disclosure is more efficient and provides greater cooling power than the air-cooled systems it is intended to replace. Providing a more efficient cooling system for electronic modules or server modules allows for the inclusion of a greater number of components within a particular electronic module (thus improving space efficiency) and / or allows components within the electronic module to operate at a higher performance-power ratio. In particular, using the cold plate (and cooling system) allows components within an electronic module (e.g., a CPU) to operate at higher rates for longer periods because the system is more efficient in removing heat. Similarly, providing the cooling system eliminates some of the limitations currently imposed on computing performance and space usage in electronic modules or server modules due to the challenges of adequate cooling seen in prior art systems.

[0094] Therefore, it is particularly advantageous to retrofit the cooling system described in this disclosure into existing electronic modules that previously utilized alternative cooling systems. Similarly, in another aspect, a method for installing a liquid cooling system for an electronic module configured for mounting in a rack is provided. This method includes removing an air-cooled radiator contained within a module housing of the electronic module, installing a cold plate within the module housing, coupling an input conduit to an inlet cooling port of the cold plate at the previous location of the air-cooled radiator, coupling an output conduit to an outlet cooling port of the cold plate, and connecting the input and output conduits within a liquid coolant fluid loop such that liquid coolant circulating around the liquid coolant fluid loop passes through at least the input conduit, through the cold plate, and through the output conduit. Each cold plate may include a housing; a surface of the housing arranged to provide a thermal interface for cooling electronic equipment thermally coupled thereto; at least one channel inside the housing and near the surface arranged for liquid coolant to flow through it, such that heat received by the thermal interface is transferred to the liquid coolant; an inlet coolant port extending outside the housing for transferring liquid coolant to the at least one channel; and an outlet coolant port extending outside the housing for transferring liquid coolant from the at least one channel. It is understood that more than one cold plate can be installed according to this method. In particular, two or more air-cooled radiators can be removed from the electronic module and replaced by corresponding two or more cold plates. Two or more cold plates may be assembled and arranged in parallel within a cooling circuit (as discussed above), or alternatively, they may be arranged in series within a cooling circuit.

[0095] Preferably, the method further includes arranging the input conduit and the output conduit through openings in the wall of the module housing.

[0096] Preferably, connecting the input conduit and the output conduit within the liquid coolant fluid loop may include coupling the input conduit to a first outlet port of the manifold, coupling the output conduit to a first inlet port of the manifold, coupling the supply conduit to a second inlet port of the manifold for transferring liquid coolant from the heat exchanger to the manifold, and coupling the receiving conduit to a second outlet port of the manifold for transferring liquid coolant from the manifold to the heat exchanger.

[0097] Optionally, the method further includes securing the manifold to a rack. In one example, securing the manifold to the rack includes securing the manifold within a defined slot in the rack for passage of cables connected to the electronic module.

[0098] The method may further include connecting a heat exchanger between the supply conduit and the receiving conduit, the heat exchanger being configured to transfer heat from the liquid coolant. The method may also include connecting a pump between the supply conduit and the receiving conduit, the pump being configured to circulate the liquid coolant around a liquid coolant fluid loop.

[0099] Alternatively, for example when there is no manifold within the cooling circuit, a heat exchanger can be connected between the inlet and outlet conduits. Similarly, a pump can be connected between the inlet and outlet conduits. This example can be used when the entire cooling circuit is located within the module housing of the electronic module. Therefore, the pump, cooling system (or heat exchanger), and cold plate are all within the module housing. The cooling system can be used to transfer heat from the liquid coolant in the cooling circuit to another medium (e.g., a second cooling circuit arranged through the housing).

[0100] In another aspect, a kit for the aforementioned installation method is disclosed. The kit may include at least one cold plate, a first conduit serving as an inlet conduit, and a second conduit serving as a second conduit. For example, the kit may include any of the components described above with respect to other aspects. The options, features, and benefits mentioned above with respect to each component apply to this aspect.

[0101] Preferably, the inlet coolant port and outlet coolant port of the cold plate each include an independently rotating fluid connector, thereby allowing adjustment in the direction of the first or second pipe coupled to the respective coolant port.

[0102] Preferably, the cold plate further includes pins and / or fins arranged within at least one channel. Optionally, the pins and / or fins are arranged to extend from the bottom surface of at least one channel to the top surface of at least one channel, the bottom surface of which is close to the surface of the housing arranged to provide a thermal interface, and the top surface of which is away from the surface of the housing arranged to provide a thermal interface.

[0103] Preferably, the kit further includes a manifold for connecting the input conduit and the output conduit within the liquid coolant fluid circuit. The manifold includes a first inlet port for coupling to the output conduit, a first outlet port for coupling to the input conduit, a second inlet port for receiving liquid coolant at the manifold via a supply conduit, and a second outlet port for transferring liquid coolant from the manifold via a receiving conduit. Optionally, two separate manifolds may be provided, for example, one for coupling the input conduit to the supply conduit and the other for coupling the output conduit to the receiving conduit, each manifold having appropriate ports.

[0104] Optionally, the manifold is configured to be fixed to the rack, and more preferably fixed to the rack in a groove defined in the rack for passing cables connected to the electronic module.

[0105] The kit may also include a heat exchanger and / or a pump. The heat exchanger and / or pump may be used for the connection between the supply conduit and the receiving conduit, or, depending on the arrangement of the cooling circuit, for the connection between the supply conduit and the receiving conduit.

[0106] In yet another example, there is a system for cooling an electronic module configured for mounting in a rack, comprising: a first cooling circuit through which a first liquid coolant circulates, the first cooling circuit including at least one cold plate; a second cooling circuit through which a second liquid coolant circulates; and a cooling system for transferring heat from the first liquid coolant to the second liquid coolant; wherein the first coolant circuit and the cooling system are contained within a housing of the electronic module.

[0107] The first and second cooling circuits can be considered as a first cooling circulation arrangement and a second cooling circulation arrangement, respectively. Advantageously, this configuration allows the first liquid coolant circulating through at least one cold plate to be completely contained within the electronic module (i.e., enclosed within the electronic module's housing or chassis). Therefore, when the electronic module is installed in or unloaded from the rack, it is not necessary to connect or disconnect from the first coolant circuit; the first coolant circuit is a "closed loop" throughout the installation process. This reduces or avoids the risk of leakage or loss of expensive and sometimes toxic coolant fluids. Furthermore, different types of coolant fluids (e.g., more expensive dielectric liquids) can be used as the first liquid coolant, while a more abundant second fluid (e.g., water) can be used as the second liquid coolant. Using water as the second liquid coolant can help allow for higher flow rates and provide increased cooling power; however, advantageously, this configuration can maintain the second liquid coolant at a distance from any electrical components or electronic equipment housed within the chassis.

[0108] Preferably, each cold plate includes: a housing, the surface of which is arranged to provide a thermal interface for cooling an electronic device thermally coupled thereto; and at least one channel within the housing and adjacent to the surface, the at least one channel being arranged for a first liquid coolant to flow through it, such that heat received by the thermal interface is transferred to the first liquid coolant.

[0109] Optionally, the first coolant circuit includes a first cold plate and a second cold plate installed inside the housing of the electronic module, the first cold plate and the second cold plate being coupled in parallel in the first cooling circuit.

[0110] Preferably, the first cooling circuit further includes a pump for circulating the first liquid coolant around the first cooling circuit, the pump being housed within the housing or chassis of the electronic module.

[0111] Preferably, the cooling system is a heat exchanger. Optionally, the cooling system is a first cooling system, and the second cooling circuit further includes a second cooling system for transferring heat from the second liquid coolant.

[0112] Preferably, the second cooling circuit further includes a pump for circulating the second liquid coolant around the second cooling circuit.

[0113] The following numbered items are for illustrative purposes only:

[0114] 1. A system for cooling an electronic module configured for mounting in a rack, the system comprising:

[0115] A first cold plate and a second cold plate are installed inside the module housing of the electronic module, each cold plate comprising:

[0116] A housing, the surfaces of which are arranged to provide a thermal interface for cooling electronic devices thermally coupled thereto; and

[0117] At least one channel, the at least one channel being within the housing and close to the surface, the at least one channel being arranged for liquid coolant to flow through it, such that heat received by the thermal interface is transferred to the liquid coolant;

[0118] The first cold plate and the second cold plate are connected in parallel in a cooling circuit, which is arranged to circulate the liquid coolant.

[0119] 2. The system according to item 1 further includes:

[0120] A cooling system configured to remove heat from the liquid coolant; and

[0121] Multiple conduits coupled to a first cold plate and a second cold plate, and a cooling system, for transferring liquid coolant circulating in the cooling circuit between the first cold plate and the second cold plate and the cooling system.

[0122] 3. The system according to claim 2, wherein the cooling system includes a heat exchanger for transferring heat from a liquid coolant to another cooling medium.

[0123] 4. The system according to claim 2 or 3, wherein the plurality of catheters comprises at least:

[0124] A first inlet conduit is coupled to the first cold plate.

[0125] The second inlet conduit is coupled to the second cold plate.

[0126] A supply conduit, wherein the first input conduit and the second input conduit are coupled in parallel to the supply conduit;

[0127] A first output conduit is coupled to the first cold plate;

[0128] A second output conduit, coupled to the second cold plate; and

[0129] A receiving conduit, wherein the first output conduit and the second output conduit are coupled in parallel to the receiving conduit.

[0130] 5. The system according to item 4, wherein the coupling between the first input conduit and the second input conduit and the supply conduit is arranged within the module housing;

[0131] The coupling between the first output conduit and the second output conduit and the receiving conduit is arranged within the module housing; and

[0132] The supply conduit and the receiving conduit are arranged to pass through openings in the wall of the module housing.

[0133] 6. The system according to claim 4, wherein the coupling between the first input conduit and the second input conduit and the supply conduit is arranged outside the module housing;

[0134] The coupling between the first output conduit and the second output conduit and the receiving conduit is arranged outside the module housing; and

[0135] The first input conduit and the second input conduit, as well as the first output conduit and the second output conduit, are arranged to pass through openings in the wall of the module housing.

[0136] 7. The system according to claim 4 or 6 further includes a manifold for coupling the first input conduit and the second input conduit to the supply conduit and / or for coupling the first output conduit and the second output conduit to the receiving conduit.

[0137] 8. The system according to claim 7 further includes at least one connector for connecting the first input conduit and the second input conduit and / or the first output conduit and the second output conduit to the manifold.

[0138] 9. The system according to any one of claims 4 to 6 further includes a manifold for coupling the supply conduit to a first other conduit among the plurality of conduits, and / or for coupling the receiving conduit to a second other conduit among the plurality of conduits.

[0139] 10. The system according to claim 9 further includes at least one connector for connecting the supply conduit and / or the receiving conduit to the manifold.

[0140] 11. The system according to any one of items 7 to 10 further includes a bracket for securing the manifold to the module housing.

[0141] 12. The system according to any one of items 7 to 11 further includes a bracket for securing the manifold to the rack.

[0142] 13. The system according to claim 12, wherein the manifold is configured to be fixed to the rack within a groove defined in the rack for allowing cables connected to the electronic module to pass through.

[0143] 14. The system according to any of the preceding items further includes a third cold plate, which is coupled in series with the first cold plate or the second cold plate in the cooling circuit.

[0144] 15. A method for cooling an electronic module configured for mounting in a rack, comprising:

[0145] The liquid coolant circulates around a cooling circuit, wherein a first cold plate and a second cold plate are coupled in parallel within the cooling circuit, and wherein the first cold plate and the second cold plate are housed within the module housing of the electronic module, and further wherein each of the first cold plate and the second cold plate comprises:

[0146] A housing, the surfaces of which are arranged to provide a thermal interface for cooling electronic devices thermally coupled thereto; and

[0147] At least one channel, which is located within the housing and near the surface, is arranged for liquid coolant to flow through it, such that heat received by the thermal interface is transferred to the liquid coolant.

[0148] 16. A method of mounting a liquid cooling system for an electronic module configured for mounting in a rack, the method comprising:

[0149] Remove the air-cooled radiator contained within the module housing of the electronic module;

[0150] In the preceding position of the air-cooled radiator, a cold plate is installed inside the module housing, the cold plate comprising:

[0151] A housing, the surfaces of which are arranged to provide a thermal interface for cooling electronic devices thermally coupled thereto;

[0152] At least one channel, said at least one channel being within the housing and near the surface, said at least one channel being arranged for liquid coolant to flow through therethrough, such that heat received by the thermal interface is transferred to the liquid coolant;

[0153] An inlet coolant port, extending outside the housing, for delivering liquid coolant to the at least one channel; and

[0154] An outlet coolant port, which extends outside the housing, is used to transfer liquid coolant from the at least one channel;

[0155] The input conduit is coupled to the inlet cooling port of the cold plate;

[0156] The output conduit is coupled to the outlet cooling port of the cold plate; and

[0157] The inlet conduit and the outlet conduit are connected within the liquid coolant fluid circuit such that the liquid coolant circulating around the liquid coolant fluid circuit passes at least through the inlet conduit, through the cold plate, and through the outlet conduit.

[0158] 17. The method according to item 16 further includes:

[0159] The input conduit and the output conduit are arranged to pass through openings in the wall of the module housing.

[0160] 18. The method according to claim 16 or 17, wherein connecting the inlet conduit and the outlet conduit within the liquid coolant fluid circuit comprises:

[0161] The input conduit is coupled to the first outlet port of the manifold;

[0162] The output conduit is coupled to the first inlet port of the manifold;

[0163] A supply conduit is coupled to the second inlet port of the manifold for transferring liquid coolant from the heat exchanger to the manifold; and

[0164] A receiving conduit is coupled to the second outlet port of the manifold for transferring liquid coolant from the manifold to the heat exchanger.

[0165] 19. The method of claim 18 further includes securing the manifold to the frame.

[0166] 20. The method of claim 19, wherein securing the manifold to the rack comprises securing the manifold within a defined slot in the rack for passage of cables connected to the electronic module.

[0167] 21. The method according to any one of items 18 to 20, further comprising:

[0168] The heat exchanger is connected between the supply conduit and the receiving conduit and is configured to transfer heat from the liquid coolant.

[0169] 22. The method according to any one of items 18 to 21, further comprising:

[0170] A pump is connected between the supply conduit and the receiving conduit, and the pump is configured to circulate the liquid coolant around the liquid coolant fluid loop.

[0171] 23. The method according to item 16 or 17 further includes:

[0172] The heat exchanger is connected between the inlet conduit and the outlet conduit and is configured to transfer heat from the liquid coolant.

[0173] 24. The method according to item 16, item 17 or item 23 further includes:

[0174] A pump is connected between the inlet conduit and the outlet conduit, and the pump is configured to circulate the liquid coolant around the liquid coolant fluid loop.

[0175] 25. A kit for the installation method of items 16 to 24, comprising:

[0176] Cold plate;

[0177] The first conduit serves as the inlet conduit; and

[0178] The second conduit serves as a second conduit.

[0179] 26. The kit according to item 25, wherein the inlet coolant port and the outlet coolant port of the cold plate each include independently rotating fluid connectors, thereby allowing adjustment in the direction of the first or second conduit coupled to the respective coolant port.

[0180] 27. The kit according to item 25 or 26, wherein the cold plate further includes pins and / or fins arranged in at least one channel.

[0181] 28. The kit according to item 27, wherein the pin and / or the fin is arranged to extend from the bottom surface of at least one channel to the top surface of at least one channel, the bottom surface of the at least one channel being close to the surface of the housing arranged to provide a thermal interface, and the top surface of the at least one channel being away from the surface of the housing arranged to provide a thermal interface.

[0182] 29. The kit according to any one of claims 25 to 28 further includes a manifold for connecting the inlet conduit and the outlet conduit within the liquid coolant fluid circuit, the manifold comprising:

[0183] The first inlet port is used to couple to the output conduit;

[0184] The first outlet port is used to couple to the input conduit;

[0185] A second inlet port is used to receive the liquid coolant at the manifold via a supply conduit; and

[0186] The second outlet port is used to transfer the liquid coolant from the manifold via a receiving conduit.

[0187] 30. The kit according to item 29, wherein the manifold is configured to be secured to the rack within a groove defined in the rack for passage of cables connected to the electronic module.

[0188] 31. The kit according to item 29 or 30 further includes a heat exchanger for connecting the supply conduit and the receiving conduit.

[0189] 32. The kit according to any one of items 29 to 31 further includes a pump for connecting the supply conduit and the receiving conduit, the pump being configured to circulate the liquid coolant around the liquid coolant fluid loop.

[0190] 33. The kit according to any one of items 25 to 29 further includes a heat exchanger for connecting the inlet conduit and the outlet conduit.

[0191] 34. The kit according to any one of items 25 to 29 or item 33 further includes a pump for connecting the supply conduit and the receiving conduit, the pump being configured to circulate the liquid coolant around the liquid coolant fluid loop. Attached Figure Description

[0192] This disclosure can be implemented in various ways, and preferred embodiments will now be described by way of example only and with reference to the accompanying drawings, wherein:

[0193] Figure 1 A plan view of an electronic module housing multiple electronic devices cooled by the system is shown;

[0194] Figure 2 Depicting Figure 1 A 3D view of the electronic module;

[0195] Figure 3 Depicting Figure 1 and Figure 2 Different second-dimensional views of the electronic modules;

[0196] Figure 4A A schematic diagram depicting a first example of a second cooling cycle arrangement;

[0197] Figure 4B A schematic diagram depicting a second example of a second cooling cycle arrangement;

[0198] Figure 5 A schematic diagram depicts multiple electronic modules installed in a rack;

[0199] Figure 6 A three-dimensional view of the weir within the first cooling cycle arrangement is shown;

[0200] Figure 7An exploded view of the weir within the first cooling cycle arrangement is shown;

[0201] Figure 8 A cross-sectional view of the weir within the first cooling cycle arrangement is shown;

[0202] Figure 9 Another diagram of the weir within the first cooling cycle arrangement is shown;

[0203] Figure 10 Another example of a weir within the first cooling cycle arrangement is shown;

[0204] Figure 11 Another example of a weir within the first cooling cycle arrangement is shown;

[0205] Figure 12A A schematic perspective view of an example cold plate is shown;

[0206] Figure 12B Show Figure 12A A plan view of the internal structure of an example cold plate;

[0207] Figure 12C Show Figure 12A Example cross-sectional view of a cold plate;

[0208] Figure 13A A schematic diagram depicting another example of the system;

[0209] Figure 13B A schematic diagram depicting yet another example of the system;

[0210] Figure 14 A floor plan depicting an example electronic module or blade server in which an example cold plate is installed;

[0211] Figure 15 A perspective view of a second example of an electronic module or blade server in which two example cold plates are installed is depicted;

[0212] Figure 16 Show Figure 15 A floor plan of a second example of an electronic module or blade server;

[0213] Figure 17 A plan view of a third example of an electronic module or blade server in which an example cold plate is installed is shown;

[0214] Figure 18 A plan view of a fourth example of an electronic module or blade server in which an example cold plate is installed is shown;

[0215] Figure 19 A plan view of a fifth example of an electronic module or blade server in which an example cold plate is installed is shown;

[0216] Figure 20 A plan view of a sixth example of an electronic module or blade server in which an example cold plate is installed is shown;

[0217] Figure 21 A plan view of a seventh example of an electronic module or blade server, including a manifold, in which an example cold plate is installed;

[0218] Figure 22 A plan view of an eighth example of an electronic module or blade server, including a manifold, in which an example cold plate is installed;

[0219] Figure 23 This is a schematic diagram of an example of a single-rack server cooling system according to this disclosure;

[0220] Figure 24 This is a schematic diagram of another example of a single-rack server cooling system according to this disclosure; and

[0221] Figure 25 A schematic diagram of a multi-server cooling system according to this disclosure is shown.

[0222] In the accompanying drawings, the same parts are indicated by the same reference numerals. The drawings are not drawn to scale. Detailed Implementation

[0223] An electronic module 100 with a hybrid cooling system is described, which includes two cooperating liquid coolant circulation loops. First, refer to... Figure 1 The preferred embodiment of the electronic module 100 is described. The electronic module may be a module or a server blade, having appropriate size and external connectors for mounting in a common server rack (not shown). Figure 2 and Figure 3 The same electronic module 100 is shown in the figure. Figure 2 and Figure 3 Each module was depicted in a different 3D form.

[0224] The electronic module has an outer housing or enclosure 110 with a base, walls, and a cover, and may be sealable. Multiple electronic devices (or heat-generating components) are mounted within the housing. In some cases, components may be mounted on a printed circuit board (PCB) 120, which may be connected to the base, cover, or walls of the housing. The system attempts to remove heat generated by the electronic devices from the electronic module.

[0225] The first cooling cycle arrangement (or first cooling circuit) is used to cool certain electronic devices among a plurality of electronic devices installed within the electronic module. The second cooling cycle arrangement (or second cooling circuit) is used to cool other heat-generating components. For example, the second cooling cycle arrangement may be provided with greater cooling power and is therefore used to cool specific components that generate more heat than those cooled by the first cooling cycle arrangement.

[0226] exist Figure 1 , Figure 2 and Figure 3 In the depicted example, the electronic module has a first cooling circulation arrangement (or first cooling loop) providing immersion cooling. The first cooling circulation arrangement is entirely contained within the housing 110 of the electronic module. Specifically, a first liquid coolant is contained within the sealable housing of the electronic module such that a plurality of components 115 to be cooled are at least partially immersed in the first liquid coolant. The first liquid coolant contained within the volume of the housing of the electronic module can be considered as a reservoir for the first liquid coolant.

[0227] The first liquid coolant from the reservoir is collected or received at pump inlet 190. Pump inlet 190 may be configured to improve the flow of liquid coolant toward pump 185. Pump 185 moves the first liquid coolant through a first cooling circulation arrangement (or a first cooling loop). The first liquid coolant moving through pump 185 passes through conduit 195 and enters heat exchanger 170, where it is cooled. In particular, heat retained in the first coolant fluid may be transferred to a second coolant fluid, which, as described below, also passes through the heat exchanger. As will be understood, the first liquid coolant entering the heat exchanger is at a higher temperature than the first liquid coolant exiting the heat exchanger.

[0228] exist Figure 1 , Figure 2 and Figure 3 In the example, pipe 200 is connected to a heat exchanger to transport a first cooling fluid output from heat exchanger 170. At the distal end of pipe 200 are one or more outlets or nozzles 205a, 205b. Figure 1 , Figure 2 and Figure 3 In a specific example, the outlet or nozzle 205a respectively forms the inlet of the weirs 202a and 202b. The weirs function as radiators and are part of the first cooling cycle arrangement. The following is about... Figures 6 to 11 Provide a more detailed description of the weir.

[0229] The first cooling fluid exits from outlets or nozzles 205a, 205b and passes through weirs 202a, 202b until it is collected in a reservoir of first liquid coolant contained within the volume of the housing 110 of the electronic module 100. In this way, the cooler first cooling fluid, having passed through the heat exchanger, can be reintroduced into the bath or reservoir of first cooling fluid within the housing 110, and cools any electronic components partially immersed in the reservoir. Specifically, the cooled first liquid coolant absorbs heat from the surfaces of electronic devices (including first electronic devices in contact with them). Finally, the first liquid coolant is collected again at the pump inlet, thus completing the first cooling cycle arrangement (or first cooling loop).

[0230] Figure 1 , Figure 2 and Figure 3 A second cooling cycle arrangement is also described. This second cooling cycle arrangement incorporates one or more cold plates 125a, 125b, each mounted on one or more electronic devices 130a, 130b. Ideally, the electronic devices 130a, 130b require higher performance cooling. The cold plates 125a, 125b are modules or chambers through which a second coolant fluid (e.g., water) can pass. By allowing heat conduction through the mounting surfaces of the cold plates coupled to a given electronic device, heat can be transferred from the electronic devices 130a, 130b to the second coolant fluid within the cold plates. The following will discuss… Figure 12A , Figure 12B and Figure 12C The cold plates 125a and 125b of the second cooling cycle arrangement are discussed in more detail.

[0231] Figure 1 , Figure 2 and Figure 3 The second cooling circulation arrangement has two parallel-connected cold plates. Specifically, a single inlet conduit 135 is connected to an inlet 145 at the wall of the housing to receive the second coolant fluid input to the electronics module. The inlet 145 includes a connector, which can be of any suitable type, including a quick-disconnect connector. At the distal end, the single inlet conduit 135 is connected to an inlet manifold 150, to which two additional inlet conduits 140a and 140b are connected. The additional inlet conduits 140a and 140b are each connected to a corresponding cold plate 125a and 125b. In this way, the second coolant fluid can be delivered in parallel to each cold plate 125a and 125b in the electronics module. As follows regarding… Figure 12A , Figure 12B and Figure 12C The second liquid coolant then passes through the cold plate.

[0232] Output conduits 155a and 155b are connected to each of the individual cold plates 125a and 125b. Output conduits 155a and 155b receive, in parallel, a second liquid coolant output from each of the cold plates 125a and 125b. Output conduits 155a and 155b are connected to an output manifold 160, to which a single output conduit 165 is also connected for discharging the second liquid coolant out of the output manifold 160.

[0233] A single output conduit 165 connects to the heat exchanger 170 discussed above regarding the arrangement of the first cooling cycle. The heat exchanger 170 is entirely housed within the electronic module's housing 110. Figure 1 , Figure 2 and Figure 3 In a specific example, heat exchanger 170 is a plate heat exchanger and is connected to the wall of housing 110. However, other suitable types of heat exchangers can be used (as discussed further below), and other suitable types of heat exchangers can be arranged anywhere within the electronic module (and less preferably outside the electronic module).

[0234] The heat exchanger 170 can be any suitable type that allows heat exchange between a first coolant fluid and a second coolant fluid while maintaining the separation (non-mixing) of the two liquid coolants. For example, the heat exchanger may have a first chamber through which the first liquid coolant flows, separated from a second chamber through which the second coolant fluid flows. One or more walls separating the first and second chambers serve as a thermal interface through which heat can be transferred. In particular, heat can be transferred from the hotter liquid coolant (in this example, the second liquid coolant under normal operation) to the colder liquid coolant (in this example, the first liquid coolant under normal operation) due to the temperature gradient at the thermal interface. As those skilled in the art will envision, the heat exchanger may include more than two chambers and may provide more than one thermal interface to separate the chambers through which the different liquid coolants flow. The heat exchanger may include fins or other features at the thermal interfaces to facilitate heat exchange.

[0235] Back Figure 1 , Figure 2 and Figure 3 An output conduit 175 connected to heat exchanger 170 is arranged to receive a second liquid coolant passing through the heat exchanger. As will be understood, due to the heat absorbed from the first liquid coolant within heat exchanger 170, the second liquid coolant exiting heat exchanger 170 will be at a higher temperature than the second liquid coolant entering heat exchanger 170. The output conduit 175 connects to an outlet 180 at a wall of the housing 110 of the electronic module. Outlet 180 includes a connector, which can be any suitable type of connector, including quick-disconnect connectors.

[0236] Despite Figure 1 , Figure 2 and Figure 3 As not shown, inlet 145 and outlet 180 can each be connected to a cooling system or a second liquid coolant source (e.g., via additional piping as needed, connected to inlet 145 and outlet 180). This will be discussed below regarding... Figure 4A and Figure 4B Further detailed discussion.

[0237] As will be understood, different devices within an electronic module can generate different amounts of heat than other components, and therefore require different cooling rates. Therefore, this invention provides a cooling system that provides effective and efficient cooling for all electronic devices within an electronic module. Specifically, a second cooling loop arrangement can provide high-performance cooling for the hottest components, while a first cooling loop arrangement can provide cooling for other components within the electronic module. Although some prior art systems have described the use of a first cooling loop and a second cooling loop within an electronic module (e.g., as described in U.S. Patent No. 7,724,524), the use of a heat exchanger in this application to exchange heat between the first and second cooling loop arrangements improves the overall cooling efficiency. In contrast, in prior art systems, cooling can be limited because the reservoir of the first coolant is exposed to a cold plate cooled by the second coolant.

[0238] Figure 4A and Figure 4B A schematic diagram of the first and second cooling cycle arrangements is shown when the electronic module 100 is connected in the rack 400. The arrangement of the first and second cooling cycle arrangements within the electronic module is related to... Figure 4A and Figure 4B The two examples are the same, and with Figure 1 , Figure 2 and Figure 3 The first and second cooling cycle arrangements are aligned (the difference is that...) Figure 4A and Figure 4B In the example of the first cooling cycle system, only a single weir 202 is provided. However, the device for providing a second liquid coolant at low temperature to the electronic modules is... Figure 4A and Figure 4B These two examples are different.

[0239] First, consider these common aspects. Figure 4A and Figure 4B A first cooling circulation system as described above is shown, which has a pump inlet 190, a pump 185, a heat exchanger 170 and a weir 202 for circulating a first liquid coolant 401 within the housing of the electronic module 100. Figure 4A and Figure 4B A second cooling cycle arrangement as described above is also shown. In this arrangement, a second liquid coolant 402 is received into the electronic module 100 through inlet 145 and supplied to two parallel-arranged cold plates 125a, 125b via conduits. After passing through the cold plates 125a, 125b, the second liquid coolant is conveyed through various conduits to a heat exchanger 170, in which heat is transferred from the first liquid coolant to the second liquid coolant. The second liquid coolant is discharged from the heat exchanger 170 to the electronic module via outlet 180. Inlet 145 and outlet 180 may each be connected to an inlet manifold 405 or an outlet manifold 410 at a server rack 400 in which the electronic module 100 is mounted.

[0240] exist Figure 4A In this example, cooling system 450 is connected as part of a second cooling cycle arrangement. Specifically, a second liquid coolant exiting from outlet 180 of the electronic module and transferred to outlet manifold 410 is introduced into cooling system 450. Cooling system 450 includes heat exchanger 455 and pump 460. Heat is transferred from the second liquid coolant to another cooling medium 470 at heat exchanger 455, wherein the cooled second liquid coolant is pumped back to inlet manifold 405 and inlet 145 of electronic module 100. The additional cooling medium 470 may be, for example, air or another liquid coolant.

[0241] exist Figure 4B In this example, the second cooling cycle arrangement can be supplied with a lower-temperature second liquid coolant via a facility-level supply. Specifically, the second liquid coolant is water and is fed from a facility-level water source 490. The higher-temperature second liquid coolant received from the electronics module can be transferred to the main discharge port 495 at the facility level.

[0242] Figure 5 It shows the installation Figure 4A According to rack 400 Figure 1 , Figure 2 and Figure 3 Examples of multiple electronic modules 100. Here, a second cooling cycle is arranged connected to a rack-level cooling system 450. In particular, multiple electronic modules are connected in parallel, wherein a single cooling system 450 (as described above regarding...) Figure 4A The secondary liquid coolant supplied to each electronic module 100 within the rack 400 is used for cooling.

[0243] It should be understood that, with Figure 5 The second cooling cycle arrangement of multiple electronic modules mounted in rack 400 as shown can also be achieved by connecting to a facility-level cooling system (e.g., Figure 4BThe facility-level cooling water system shown is supplied with a second liquid coolant at a lower temperature (the system is fed by tap water).

[0244] Now refer to Figures 6 to 11 The weir of the first cooling circulation system is described in more detail. This weir provides a particular advantage for guiding and increasing the flow of the first liquid coolant in the first cooling circulation arrangement. By using the weir, the first liquid coolant can be guided to flow through or across specific areas of the electronic module and any electronic devices installed therein. In some examples, the base of the weir can be coupled to the first electronic device (or another electronic device) and thus act as a heat sink for the coupled device. Furthermore, as discussed further below, the use of the weir makes it possible to reduce the required level of the first liquid coolant in the electronic module.

[0245] First refer to Figure 6 This illustrates a first embodiment of a weir or weir-type radiator for a first cooling cycle system. (Refer to...) Figure 7 , showed Figure 6 An exploded view of the embodiment is shown. The weir 600 includes: a base consisting of a base 610 and a planar substrate 615 fixed to the base 610; a baffle 620 attached to the planar substrate 615; a protrusion (shown as a pin) 625; and a fixing screw 630 that attaches the substrate 615 to the base 610. In this way, the planar substrate 615 is located directly on a high-temperature component, which may be a first electronic device 635. Therefore, heat is transferred from the first electronic device 635 to the volume defined by the planar substrate 615 and the baffle 620, in which the protrusion 625 is provided.

[0246] The weir radiator 600 can be made from a single component, for example, by operations such as die casting; lost-wax casting; metal injection mold (MIM); additive manufacturing; or forging. It can also be machined or cut from a single piece of material. The weir radiator 600 can be formed from any thermally conductive material such as metal or other heat conductors. Some examples may include aluminum, copper, or carbon.

[0247] Figure 6 and Figure 7 The diagram also shows a conduit 640 and an inlet at a nozzle 645 leading to a weir. A first liquid coolant is delivered to the weir-type radiator 600 via the nozzle 645. The nozzle 645 is arranged to guide the coolant in a plane perpendicular to the substrate 615. This forces the jet or flow of liquid coolant directly into the volume defined by the baffle 620 of the radiator 600 and the substrate 615. Therefore, heat dissipation is improved. This is especially true compared to systems that guide coolant flow through the radiator in a direction parallel to the plane of the radiator substrate (e.g., air cooling systems).

[0248] exist Figure 6 and Figure 7 In the example shown, nozzle 645 delivers coolant directly to the center of the volume defined by substrate 615 and baffle 620. In this example, the center of the volume corresponds to the hottest portion of the area of ​​substrate 615, which is adjacent to (and directly on) the high-temperature component 635. This provides counterflow, allowing the coldest coolant to be directed to contact the hottest area of ​​the weir radiator. The coolant then moves radially away from the hottest portion.

[0249] Reference Figure 8 , showed Figure 6 A cross-sectional view of the weir-type radiator in operation. Features identical to those shown in the preceding figures are indicated by the same reference numerals. Arrows indicate the coolant flow within conduit 640 to provide a first liquid coolant 805 within the volume defined by the baffle 620 and substrate 615 of the radiator 600, and a first liquid coolant 810 outside the radiator 1. As previously described, the first liquid coolant discharged from nozzle 645 is directed to the center of the volume (corresponding to the center of the surface area of ​​substrate 615) and moves radially outward toward the baffle 620 from there. Sufficient first liquid coolant is pumped into the volume via nozzle 645 such that it overflows 810 from the baffle 620 and is collected together with the remaining first liquid coolant 815 outside the weir-type radiator 600.

[0250] The baffle 620, serving as a sidewall, allows for different levels of coolant. The first liquid coolant 805 within the volume of the weir radiator 600 is at a relatively high level, while the coolant 815, at least partially immersed in the electronic module (not shown in the figure), is at a lower level. This allows for the use of significantly less liquid coolant than in other similar systems that cover all components at the same height.

[0251] This yields several benefits. First, if a dielectric coolant is used as the primary liquid coolant, less primary liquid coolant is used. This has two main benefits: dielectric coolants can be expensive, so costs can be significantly reduced, and dielectric liquid coolants are typically very heavy, so the weight of the electronic module can be reduced. Furthermore, by using less liquid coolant, the electronic module 100 can be installed and / or lifted more directly. Similarly, installing the electronic module 100 requires less infrastructure. Additionally, the electronic module 100 is easier to handle compared to similar devices that use significantly more primary liquid coolant. The level of the primary liquid coolant 815 within most of the container 110 does not approach the top of the container. Therefore, the likelihood of spillage during component maintenance or replacement is lower. The risk of leakage is also reduced.

[0252] The baffle 630 creates a weir effect and promotes the flow of the first liquid coolant. The coolant 815, at a relatively low level, cools the electronic equipment (the first electronic device and any other electronic equipment) in the electronic module 100. The first electronic device and any other electronic equipment do not need to be completely immersed in the first liquid coolant. In the event of a failure of the pump 185 or other components, the first liquid coolant retained in the weir-type radiator 600 can also provide some redundancy for cooling the first cooling cycle arrangement.

[0253] Next, refer to Figure 9 , showed Figure 7 A top view of the embodiment shows the nozzle arrangement. As previously described, nozzle 645 is coupled to conduit 640. Nozzle 645 is positioned at the center of a surface region facing substrate 615 (not shown in this figure). The radial flow of coolant is indicated by arrows in this figure.

[0254] Alternative locations for nozzle 640 are possible. Now refer to... Figure 10 Describe some such locations, Figure 10 It shows Figure 6 A top view of a first variant of the nozzle arrangement in the embodiment, and referring to Figure 11 , Figure 11 It shows Figure 6 A top view of a second variation of the nozzle arrangement in the implementation method. First refer to... Figure 10 Nozzle 645 is shown off-center. This arrangement can be provided if the hottest part of the first electronic device (not shown, but potentially coupled to the weir-type heat sink 600) is not adjacent to the center of the substrate 615. (Refer to...) Figure 11 Two nozzles are shown. The two nozzles 645 are positioned above the surface area of ​​the substrate 615 (not shown) adjacent to the two hottest portions of the hottest portions of the first electronic device (not shown, to which the weir-type heat sink 600 may be coupled).

[0255] The protrusion 625 (as a pin and / or fin) can be integrally formed with the rest of the radiator 600 or made as a separate component. The protrusion 625 can be mitered, glued, or brazed into place. Alternatively or additionally, the baffle 620 can be integrally formed with the rest of the radiator 600 or made separately (e.g., by extrusion or manufacturing of a sheet metal component). The baffle 620 can then be mitered, glued, brazed, or welded into place.

[0256] Now refer to Figures 12A to 12CThe cold plate of the second cooling cycle arrangement is described in more detail. The cold plate has particular advantages in providing high-performance, efficient cooling to the specific electronic device coupled to it. Therefore, the second cooling cycle arrangement, more specifically the cold plate, can be coupled to the electronic device in the electronic module that generates the most heat. While cooling every electronic device in the electronic module in this way is impractical, using a cold plate as part of the second cooling cycle arrangement allows for centralized cooling, which reduces the burden on the entire volume of the electronic module being cooled by the first cooling cycle system. Thus, the first and second cooling cycle arrangements work together to provide a particularly effective and efficient cooling system for the electronic module.

[0257] Another benefit of the cold plates within the second cooling cycle arrangement is that it provides a closed, sealed system where the second liquid coolant does not come into direct contact with any electronic equipment. This allows the use of water as the second liquid coolant (instead of, for example, a dielectric fluid), which is readily available and inexpensive. Large water throughput through the second cooling cycle arrangement is possible if it is connected to a facility water source and drainage system, or to a powerful pump system external to the electronic modules, further increasing its potential cooling capacity.

[0258] Generally, this document describes a cold plate comprising a housing (which may be integrally formed) with surfaces (typically planar) arranged to provide a thermal interface (which may be referred to as a conductive surface) for cooling electronic equipment thermally coupled thereto. The cold plate also includes at least one channel within the housing and near the surface. One or more channels may be formed by other spaces or volumes, internal chambers (or multiple chambers) for containing a liquid coolant (e.g., water, a water-based coolant, a coolant substantially comprising water, or a high specific heat capacity liquid alternative such as mineral oil or a dielectric fluid). One or more channels are arranged for the liquid coolant to flow through them, such that heat received by the thermal interface is transferred to the liquid coolant. Optionally, multiple parallel channels may be provided, each extending from a coolant port. As will be discussed further below, pins and / or fins are preferably arranged within at least one channel.

[0259] The cold plate also includes coolant ports extending outside the housing for conveying liquid coolant to and / or from at least one channel. The coolant ports can be connectors, couplings, joints, or other similar structures. Inlet and outlet coolant ports can be provided. At least one conduit, such as a pipe, hose, or tube (preferably flexible), can be coupled to the coolant ports for conveying liquid coolant to and / or from the coolant ports to the liquid coolant. Advantageously, the cold plate is configured such that the liquid coolant remains substantially liquid throughout the cooling system (i.e., single-phase liquid cooling).

[0260] First refer to Figure 12A An embodiment of a cold plate (or cold plate assembly) 1200 used as a cooling module for a second cooling cycle arrangement is schematically shown. In particular, the cold plate is advantageous for use in electronic modules or server blades (or similar modules). The cold plate assembly includes: a cold plate housing 1210 (preferably integrally formed); connectors 1220a, 1220b forming the inlet / outlet ports of the cold plate; and inlet / outlet conduits 1225 (here, pipes or tubes). Fixing points 1230 for the cold plate 1200 are also shown. These fixing points can advantageously replicate those found on air-cooled radiators in typical server chassis, thus allowing the cold plate to be retrofitted into server blades.

[0261] In a preferred embodiment, such as Figure 12A As shown, multiple coolant ports 1220a and 1220b are used. A first coolant port 1220a is provided for transferring liquid coolant to the cold plate 1200, and a second coolant port 1220a is provided for transferring liquid coolant from the cold plate 1200. Figure 12A In the example, coolant ports 1220a and 1220b are coupled to independently rotating fluid connectors (or rotary joints or rotary elbow connectors, the terms are used synonymously herein), thereby allowing adjustment in the orientation of the inlet conduit 1225a / outlet conduit 1225b coupled to coolant ports 1220a and 1220b. Therefore, this type of connector is particularly useful when configuring or mounting cold plate assemblies for operation. Rotary joints increase the flexibility of cold plate placement. This makes it easier to retrofit cold plates to existing electronic modules such as servers or other computer systems without requiring any additional changes to the unit or system. Cold plates can be configured, for example, to replace air-cooled radiators.

[0262] Preferably, the surface arranged to provide a thermal interface to an electronic device (such as a second electronic device) to which the cold plate is coupled is the bottom surface of the cold plate housing (e.g., Figure 12AThe coolant ports 1220a and 1220b are advantageously located on the lower side of the cold plate housing 1210 (not shown). In a preferred embodiment, the coolant ports extend in a direction perpendicular to the top surface of the housing. A rotary joint can then allow the coolant ports to extend in different directions, generally more parallel to the top surface of the housing. Advantageously, the rotary joint allows adjustment of the pipe direction about an axis perpendicular to the top surface of the housing. In particular, the rotary joint allows the pipe direction to be adjusted by at least 90 degrees, 180 degrees, 270 degrees, and preferably up to (and including) 360 degrees, especially about an axis perpendicular to the top surface of the housing. Therefore, the rotary connector allows for complete rotational freedom of the coolant ports.

[0263] In principle, a single coolant port can provide both an inlet for liquid coolant to enter the channel and an outlet for liquid coolant to flow out of the channel. In a preferred embodiment, such as Figure 12A As shown, multiple coolant ports are used. A coolant port is a first coolant port for transferring liquid coolant to at least one channel. The cold plate may include a second coolant port for transferring liquid coolant from at least one channel.

[0264] The housing of the cold plate and the arrangement of the ports on the cold plate can take any shape that facilitates coolant flow through the cold plate and to the portion of the cold plate coupled to the second electronic device. In some examples, the housing is elongated, and the first and second coolant ports are located at opposite ends of the housing along the elongation, which can facilitate liquid coolant flow through the thermal interface surface and / or aid in flexible placement of the cold plate. Alternatively or additionally, the second coolant port (similar to the first coolant port) may include a rotary joint, thereby allowing adjustment in the direction of the conduit coupled to the second coolant port. Providing two coolant ports, each with a rotary joint, can allow for improved coupling of the cold plate within the cooling system, including the possibility of coupling the cold plates together.

[0265] Reference Figure 12B It describes the situation based on Figure 12A The example is a top view of the interior (plan view) of an example cold plate. For clarity, the cover and nozzle have been removed from this drawing.

[0266] Figure 12BThe diagram shows: a coolant inlet port 1225a; a coolant outlet or discharge port 1225b; a coolant flow channel 1235; and a pin 1240. It can be seen that the flow channel is formed between the coolant inlet port 1225a and the coolant outlet or discharge port 1225b, through which a second liquid coolant can flow when the cold plate is in use. This configuration, especially the configuration of the pin 1240, distributes the coolant flow in all directions within the cold plate, allowing the coolant to be evenly distributed on the cold plate.

[0267] Reference Figure 12C , showed Figure 12B A side view (cross-sectional view) of the embodiment is shown, in which connectors are coupled to ports 1225a, 1225b and cold plate base 1245. A cold plate cover 1250 is also shown. The substrate 1245 and the cover 1250 can be formed together. Figure 12A The cold plate housing 1210 is shown in the figure. (As shown in the figure) Figure 12C As shown, pin 1240 connects to base 1245 and cover 1250. This ensures that the flow of liquid coolant through channel 106 does not short-circuit or bypass pin 109. In this way, pin 109 can guide the flow of coolant within the cold plate.

[0268] The substrate 1245 can provide a thermal interface to which a second electronic device can be coupled. Specifically, the cold plate 1200 can be mounted to electronic devices (e.g., a second electronic device 130a or a third electronic device 130b, such as…). Figure 1 , Figure 2 and Figure 3 As shown in the diagram, the substrate 125 of the cold plate is in direct contact with the surface of the second electronic device. In this way, heat can be transferred from the surface of the electronic device to the liquid coolant flowing within the cold plate through the thermal interface provided by the substrate 1245.

[0269] All features disclosed herein can be combined in any combination, except for combinations in which at least some of such features and / or steps are mutually exclusive. In particular, preferred features of the invention apply to all aspects of the invention and can be used in any combination. Similarly, features described in non-essential combinations can be used individually (not in combination).

[0270] In particular, despite the above Figures 1 to 4BA particularly preferred embodiment of the invention has been discussed, in which one or more weirs are incorporated within a first cooling circulation system, and one or more cold plates are incorporated within a second cooling circulation arrangement; however, these components are not essential. In particular, in its most general form, the concept described herein is to use a cooperative first and second cooling circulation system (or cooling loop), whereby both the first and second cooling circulation arrangements cool different electronic devices within an electronic module, and further, wherein the second cooling circulation arrangement is used to cool the first cooling circulation system.

[0271] This most basic idea is in Figure 13A and Figure 13B As described in the text. Figure 13A and Figure 13B The example illustrates the following first common feature: a first cooling circulation system (dashed line) arranged to circulate a first liquid coolant between a first electronic device 1320 and a heat exchanger 1330 among a plurality of electronic devices. Figure 13A and Figure 13B In a specific example, pump 1325 is shown as part of forming the first cooling circulation system, although this is not necessary, and circulation can be achieved through other mechanisms such as convection. Figure 13A and Figure 13B In the first cooling cycle system, the first electronic device 1320 is thermally coupled to the circulating first liquid coolant (when the system is in use), so that heat is transferred from the first electronic device 1320 to the first liquid coolant.

[0272] Figure 13A and Figure 13B The example illustrates the following second common feature: a second cooling circulation arrangement (thick line) is arranged such that a second liquid coolant circulates between a second electronic device 1335 (and a third electronic device 1340, in parallel) and a heat exchanger 1330 among a plurality of electronic devices. The second electronic device 1335 and the third electronic device 1340 are thermally coupled to the second liquid coolant circulating in the second cooling circulation arrangement (when the system is in use), such that heat is transferred from the second electronic device 1335 and the third electronic device 1340 to the second liquid coolant.

[0273] Figure 13A and Figure 13B The example illustrates the following third common feature: the first cooling cycle arrangement and the second cooling cycle arrangement are thermally coupled via heat exchanger 1330. In other words, when the first liquid coolant and the second liquid coolant each pass through heat exchanger 1330, heat is transferred from the first liquid coolant to the second liquid coolant via a thermal interface within heat exchanger 1330.

[0274] in addition, Figure 13AThe cooling system, as part of the second cooling cycle arrangement, is described, and Figure 13B The arrangement of the second cooling cycle, connected to the tap water and drainage system, is described. This is equivalent to the above regarding... Figure 4A and Figure 4B These parts of the second cooling cycle arrangement are discussed.

[0275] Therefore, a system is shown that removes and transfers heat from a first liquid coolant in a first cooling cycle arrangement to a second liquid coolant in a second cooling cycle arrangement via heat transfer. The heat transfer primarily occurs at a dedicated heat exchanger 1330, which provides efficient removal of heat from the first cooling cycle arrangement. The system allows for the efficient cooling of two specific components of an electronic module (via the second cooling cycle arrangement) and also allows for the cooling of the overall volume of the electronic module (via the first cooling cycle arrangement). Furthermore, due to the closed-loop first cooling cycle arrangement and the quick-disconnect mechanism for the second cooling cycle arrangement, the system is compact enough to be used within industry-standard server blades or chassis and can be more easily installed in common server racks.

[0276] Therefore, the system described is an efficient and adaptable system that utilizes a hybrid arrangement of volumetric cooling and targeted cooling within the electronic module.

[0277] Despite the above Figures 1 to 4B The diagram illustrates a specific configuration of two cold plates in an electronic module; however, it should be understood that various cold plate configurations are possible. Furthermore, the connection of the associated circulation system to the rack (or server) and different cold plate configurations can provide numerous benefits. Various systems configured for cooling electronic modules mounted in a rack are now described, along with methods for installing liquid cooling systems for the electronic modules. Each described configuration includes at least one cold plate (as described above regarding...). Figure 12A , Figure 12B and Figure 12C (as described above), and can be combined with the above embodiments, particularly in the second cooling cycle device.

[0278] Figure 14 A plan view of an electronic module (or server module) in which a cold plate assembly 1401 is arranged is shown. The electronic module is of the type intended for installation in existing rack server systems. The cold plate assembly 1401 can be installed in place of a previous air-cooled radiator module. Advantageously, the cold plate assembly can be installed in the same footprint as an air-cooled radiator module. Therefore, the cold plate assembly has the same or similar footprint or dimensions as a commonly used air-cooled radiator module.

[0279] The cold plate assembly 1401 is mounted within the housing or chassis (or server chassis) 1420 of the electronic module 1410. The server chassis 1420 may be, for example, a 1RU server chassis conforming to established industry standards. The substrate of the cold plate module 1401 is arranged to be thermally coupled to the electronic equipment mounted within the housing. The cold plate module may be directly mounted to a substrate (or printed circuit board) 1425 forming the base of the module housing 1420. An input conduit 1430 is coupled to the inlet port 1435 of the cold plate. An output conduit 1440 is connected to the outlet port 1445 of the cold plate. In addition to the new features associated with the cold plate assembly, the illustrated electronic module also shows a variety of other features typical of standard electronic modules, in particular: input / output ports 1450 for electrical or data connections (including USB, QSFP, and Ethernet ports) (located at the front of the electronic module if viewed from the rack) and a fan 1455 for air cooling the cavity within the module housing (located at the rear of the electronic module if viewed from the rack). The module housing can accommodate various electronic components or devices 1460 (RAM chips, etc.).

[0280] In use, the cold plate assembly 1401, together with the inlet conduit 1430 and the outlet conduit 1440, is used in conjunction with the cooling system and pump. Figure 14 (Not shown in the image) are connected together within the cooling circuit. The liquid coolant circulates around the cooling circuit. Specifically, the liquid coolant enters the cold plate assembly 1401 through the inlet conduit 1430. The liquid coolant passes through channels in the housing of the cold plate assembly (as described above regarding...) Figure 12A , Figure 12B and Figure 12C (As discussed), so as to receive heat transferred to the liquid coolant from the electronic equipment thermally coupled to the cold plate housing. Therefore, the liquid coolant leaving the cold plate assembly 1401 has a higher temperature than the liquid coolant entering the cold plate assembly 1401.

[0281] Liquid coolant exiting the cold plate assembly 1401 is received via outlet conduit 1440. The liquid coolant is then transferred via outlet conduit 1440 to a cooling system and pump (not shown, and which may include a combined unit). At the cooling system, a heat exchanger is provided to transfer heat from the liquid coolant to a second cooling medium. The second cooling medium may be, for example, air, or a second cooling loop through which the second liquid coolant circulates. The cooling system lowers the temperature of the liquid coolant or cools the liquid coolant. The liquid coolant cooling loop may be formed as part of a larger cooling facility (e.g., a building cooling water loop). In an alternative example, the liquid cooling loop may be formed as a smaller loop local to the server module or the rack to which the server module is connected. The liquid cooling loop may be arranged according to local regulations and requirements.

[0282] After being cooled at the cooling system, the cooled liquid coolant then circulates further around the cooling loop and reaches the cold plate module 1401 through the input conduit 1430, thereby completing the cooling loop.

[0283] As those skilled in the art will understand, various other components may be included within the cooling circuit (e.g., switches, valves, manifolds, or additional pumps). As described below, additional cold plate assemblies may also be included within the cooling circuit. The cooling circuit is provided for illustrative purposes and is not intended to be limiting.

[0284] Figure 15 Another example of an electronic module (or server module) 1510 is described, in which two cold plate assemblies 1401a and 1401b are arranged. Figure 16 The same example is depicted in a plan view. Electronic module 1510 includes a module housing 1420 having a substrate 1425, input / output ports 1450, and a fan 1455. Electronic components, including computer RAM 1460 and capacitors 1565, are housed in the module housing 1520.

[0285] A first inlet port 1435a and a first outlet port 1445a are disposed in the cover of the first cold plate assembly 1401a. Similarly, a second inlet port 1435b and a second outlet port 1445b are disposed in the cover of the second cold plate assembly 1401b. A first input conduit 1430a and a second input conduit 1430b are respectively attached to the first inlet port 1435a and the second inlet port 1435b, and a first output conduit 1440a and a second output conduit 1440b are respectively attached to the first outlet port 1445a and the second outlet port 1445b. The first cold plate assembly 1401a and the second cold plate assembly 1401b are arranged in a parallel configuration within the cooling circuit. Therefore, a single supply conduit 1550 is connected to both the first inlet conduit 1430a and the second inlet conduit 1430b. Similarly, a single receiving conduit 1555 is connected to both the first output conduit 1440a and the second output conduit 1440b. For example, the supply conduit 1550 can be considered as “split” into parallel conduits supplied by a first input conduit and a second input conduit.

[0286] At least one connector 1570a, 1570b is provided for connecting the supply conduit 1550 to the first inlet conduit 1430a and the second inlet conduit 1430b, and / or for connecting the first output conduit 1440a and the second output conduit 1440b to the receiving conduit 1555. In this example, the connectors 1570a, 1570b are located outside the module housing 1420. Thus, the first input conduit 1430a and the second input conduit 1430b, as well as the first output conduit 1440a and the second output conduit 1440b, are arranged through an opening 1480 in the wall of the housing 1420 to transfer liquid coolant between the interior and exterior of the cavity in the electronic module. Advantageously, the opening 1480 is a hole located at the rear of a typical server module, such as an existing PCIe card slot (e.g., Figure 15 (As shown).

[0287] like Figure 3 As shown in Figure 4, input conduits 1430a, 1430b and output conduits 1440a, 1440b are arranged around electrical components 1565, 1460 disposed within the module housing. Advantageously, the conduits are provided as flexible tubes or conduits with narrow diameters (or orifice sizes). Similarly, the conduits can be more easily assembled around the electrical components. Furthermore, the tubes can be arranged through holes typically provided or existing in the walls of the module housing (such as holes for electrical or data ports, or holes for components such as data cards).

[0288] The features described in cold plate assemblies 1401a and 1401b are particularly useful when the cold plate assemblies are being retrofitted, for example, to replace air-cooled radiators, because electrical components are already mounted in the module housing, and it is desirable that existing components not be moved or repositioned. Therefore, when retrofitting cold plate assemblies, the installer can advantageously fit the cold plate module within the footprint of the previous cooling unit (due to the size of the cold plate assembly), and furthermore, the flexible narrow tubes for the conduits, along with the rotating nozzles at the ports of each cold plate assembly, allow the installer to assess and apply the most natural route for the tubes through the server chassis and around existing components.

[0289] In use, liquid coolant is supplied via supply conduit 1550, via connector 1570a to first input conduit 1430a and second input conduit 1430b. From here, first cold plate assembly 1401a and second cold plate assembly 1401b form part of separate first and second parallel branches of a cooling circuit. The liquid coolant circulates through each of the parallel first input conduit 1430a and second input conduit 1430b to be input through inlet ports 1435a, 1435b of the first and second cold plates for each of the corresponding first and second input conduits. Then, before leaving the cold plates through outlet ports 1445a, 1445b, the liquid coolant receives heat transferred from thermally coupled electronic equipment through the internal channels of each cold plate. The liquid coolant is then delivered to each of the first output conduit 1440a and second output conduit 1440b to engage receiving conduit 1555 at connector 1570b.

[0290] In use, as mentioned above... Figure 14 As described in the example, supply conduit 1550 and receiving conduit 1555 are connected to a cooling system and / or a pump to complete the cooling circuit. The cooling system is used to remove heat from the liquid coolant, thus removing the heat initially transferred from the electrical components outside the cooling circuit.

[0291] Figure 17 A plan view of another example of an electronic module 1710 including four cold plate assemblies is shown. The configurations of the first cold plate assembly 1401a, the second cold plate assembly 1401b, the third cold plate assembly 1401c, and the fourth cold plate assembly 1401d are each similar. Figure 15 and Figure 16 The arrangement of the first cold plate assembly and the second cold plate assembly is shown.

[0292] More specifically, the first cold plate assembly 1401a and the second cold plate assembly 1401b are connected in parallel within the liquid coolant circuit, and their arrangement is similar to that of the... Figure 15 and Figure 16 The described arrangement (but the positions of the first cold plate assembly 1401a and the second cold plate assembly 1401b on the substrate 1425 of the electronic module are different) Figure 15 and Figure 16 The positions of the first input conduit 1430a and the second input conduit 1430b, as well as the first output conduit 1440a and the second output conduit 1440b, are optimized for arrangement. In this example, the supply conduit and the receiving conduit refer to the first supply conduit 1550a and the first receiving conduit 1555a.

[0293] A third cold plate 1401c and a fourth cold plate 1401d are also provided. The system of the third and fourth cold plates, the third input conduit 1430c and the fourth input conduit 1430d, and the third output conduit 1440c and the fourth output conduit 1440d is equivalent to the system of the first and second cold plates, the first input conduit and the second input conduit, and the first output conduit and the second output conduit, respectively. Similarly, the third cold plate assembly 1401c and the fourth cold plate assembly 1401d are connected in parallel within the liquid coolant circuit. The third input conduit 1430c and the fourth input conduit 1430d are coupled to and receive liquid coolant from the second supply conduit 1550b. Similarly, the third output conduit 1440c and the fourth output conduit 1440d are coupled to and pass liquid coolant to the second receiving conduit 1555.

[0294] Figure 17 The first supply conduit 1550a and the second supply conduit 1550b shown can be connected in parallel in the liquid cooling circuit. In other words, a single output of the cooling system from the cooling circuit can be separated and connected to the first supply conduit 1550a and the second supply conduit 1550b, respectively. Similarly, the first receiving conduit 1555a and the second receiving conduit 1555b can be connected in parallel, such that the first receiving conduit and the second receiving conduit engage as a single entity leading to the input of the cooling system.

[0295] In an alternative example, the first supply conduit 1550a and the second supply conduit 1550b, as well as the first receiving conduit 1555a and the second receiving conduit 1555b, can be connected in separate, corresponding first and second cooling circuits, each with its own cooling system. This can provide greater cooling power than the arrangement discussed above, in which the first supply conduit 1550a and the second supply conduit 1550b, as well as the first receiving conduit 1555a and the second receiving conduit 1555b, are arranged in series. However, it requires more complex infrastructure and may be more expensive. The connection can be selected based on cooling requirements and the infrastructure of the specific server facility. Figure 17 The examples (and other examples depicted herein) show the specific configuration of the cooling circuit of the device.

[0296] Figure 18 An electronic module 1810 is depicted in which a first cold plate assembly 1401a and a second cold plate assembly 1401b are installed. In this example, the first and second cold plates are arranged in parallel in a cooling circuit, having a first input conduit 1430a and a second input conduit 1430b, a first output conduit 1440a and a second output conduit 1440b, connectors 1570a and 1570b, and a source conduit 1550 and a receiving conduit 1555, which are connected to... Figure 15 and Figure 16 The arrangement is almost identical. However, in this example, the connector 1570a, which couples the first input conduit 1430a and the second input conduit 1430b to the supply conduit 1555, and the connector 1570b, which couples the first output conduit 1440a and the second output conduit 1440b to the receiving conduit 1555, are arranged within the module housing 1420. In this case, the source conduit 1550 and the receiving conduit 1555 are arranged through an opening in the module housing.

[0297] and Figure 15 and Figure 16 Compared to the previous arrangement, the advantage of this configuration is that fewer pipes or tubes must be fed through the walls of the module housing. However, in order to maintain a generally effective flow of liquid coolant through the first and second cooling components, the source and receiving conduits will typically be provided with tubes having a larger orifice size or diameter than each of the first and second input conduits and the first and second output conduits. Therefore, in some cases, the connector is placed inside the module housing (e.g., Figure 15 and Figure 16 (As shown in the example) can be preferred because it allows for greater flexibility in the placement of feedthroughs for each catheter.

[0298] Figure 19 A plan view of an electronic module 1910 accommodating a first cold plate 1401a and a second cold plate 1401b is depicted. However, compared to the previous example, the first cold plate 1401a and the second cold plate 1401b are arranged in series within a cooling circuit. Therefore, although the first input conduit 1430a is connected to the first inlet port 1435a of the first cold plate and the second output conduit 1440b is connected to the outlet port 1440b of the second cold plate as previously described, in this case, the first outlet port 1445a is directly coupled to the second inlet port 1435b via a connecting conduit 1915. The first input conduit 1430a and the second output conduit 1440b are arranged through openings in the wall of the module housing 1420. The first input conduit 1430a and the second output conduit 1440b are then connected to the cooling circuit as previously described.

[0299] In operation, the liquid coolant is delivered through the first inlet conduit 1430a and received at the inlet port 1435a of the first cold plate 1401a. The liquid coolant passes through the channels of the first cold plate, receiving heat transferred from electronic devices thermally coupled thereto. The coolant then exits the first cold plate via the first outlet port 1445a and is delivered through the connecting conduit 1915 to the inlet port 1435a of the second cold plate 1401b. The liquid coolant then further passes through the channels of the second cold plate, receiving heat transferred from electronic devices thermally coupled to the second cold plate. The liquid coolant then exits the second cold plate via the second outlet port 1445b to the second outlet conduit 1440b. The liquid coolant further circulates within the cooling system of the cooling loop.

[0300] exist Figure 19 In the series-connected cold plates, the liquid coolant has a first temperature before entering the first cold plate (i.e., in the first inlet conduit 1430a), a second temperature after leaving the first cold plate and before entering the second cold plate (i.e., in the connecting conduit 1915), and a third temperature after leaving the second cold plate (i.e., in the second outlet conduit 1440b). The first temperature will be lower than the second temperature, and the second temperature will be lower than the third temperature. In other words, the liquid coolant becomes increasingly hot as it passes through the other cold plates due to the heat transferred within the channels of each cold plate.

[0301] The efficiency of heat transfer from the electronic device to the liquid coolant in the cold plate channel depends on the temperature gradient (or temperature difference) between the electronic device and the liquid coolant. Therefore, when the liquid coolant temperature is high and thus closer to the operating temperature of the electronic device, heat transfer (i.e., cooling) from the electronic device to the liquid coolant may become less efficient. Therefore, in Figure 19 In the illustrated series configuration of cold plates, electronic devices thermally coupled to the first cold plate 1401a can be cooled more effectively than those thermally coupled to the second cold plate 1401b. However, the series configuration of the cold plate modules is more compact and requires fewer pipes and tubes to act as conduits. Furthermore, for each electronic device within a given electronic module, maximum possible cooling efficiency may not be required. Therefore, the order of the cold plate modules in the series configuration can be chosen to provide sufficient cooling to each electronic device to be cooled.

[0302] For example, through Figure 15 , Figure 16 , Figure 17 and Figure 18 The example shows a cooling circuit where each cold plate is supplied in parallel, which can effectively overcome... Figure 19The difference in cooling efficiency between the first and second cold plates is described in the diagram. In a parallel configuration, the temperature of the liquid coolant circulating through each cold plate is the same. Therefore, for an electronic device operating at a given temperature, each cold plate attached to each parallel branch of the cooling circuit has the same potential cooling efficiency.

[0303] However, installing the parallel configuration in server blades can be more cumbersome (especially when the cooling system is modified) because it requires a greater number of conduits (pipes or tubes) and connectors to achieve the parallel configuration, particularly when more cold plates are added to a particular electronic module or server blade. It may be necessary to supply a greater number of conduits through existing holes or openings in the module housing walls to serve the parallel-arranged cold plate modules. Therefore, in some cases, a series-arranged cold plate module may be preferred over a parallel-arranged cold plate module, depending on the specific space considerations and cooling requirements of the particular electronic module.

[0304] With this in mind, Figure 20 Another example of a liquid cooling system installed within an electronic module 2010 is depicted. In this example, two parallel branches of the cooling loop circulate through cold plates installed in the electronic module. On the first branch of the cooling loop, a first, second, and third cold plate are arranged in series. On the second branch of the cooling loop, a fourth and fifth cold plate are arranged in series. The area and volume occupied by each cold plate (first, second, and third cold plate) on the first branch are smaller than those occupied by each cold plate (fourth and fifth cold plate) on the second branch. The cooling capacity of the larger cold plates (fourth and fifth cold plates) can be greater than that of the smaller cold plates (first, second, and third cold plates) because they provide a larger surface area for transferring heat from the electronic equipment to the coolant. However, the cooling capacity will be limited to some extent by the flow rate of the liquid coolant through each branch of the cooling loop (which can in turn be determined by the orifice size or diameter of the pipes forming the conduits for connecting the cold plates).

[0305] Figure 20The specific liquid cooling system includes a first cold plate 1401a, a second cold plate 1401b, a third cold plate 1401c, a fourth cold plate 1401d, and a fifth cold plate 1401e. Each cold plate has its own inlet port and outlet port. A supply conduit 350 provides a passage for the liquid coolant before it is divided into two parallel branches of the cooling circuit from the liquid coolant received from the cooling system. In the first branch from the supply conduit, a first input conduit 1430a is arranged to deliver liquid coolant to the inlet port 1435a of the first cold plate, a first connecting conduit 1915a is arranged to deliver liquid coolant from the first outlet port 1445a of the first cold plate to the second inlet port 1435b of the second cold plate, a second connecting conduit 1915b is arranged to deliver liquid coolant from the second outlet port 1445b of the second cold plate to the third inlet port 1435a of the third cold plate, and a first output conduit 1440a is arranged to deliver liquid coolant from the outlet port 1445c of the third cold plate to a connector 1570b having a receiving conduit 1555. In the second branch from the supply conduit (arranged in parallel with the first branch), the second input conduit 1430b is arranged to deliver liquid coolant to the inlet port 1435d of the fourth cold plate, the third connecting conduit 1915c is arranged to deliver liquid coolant from the outlet port 1445d of the fourth cold plate to the inlet port 1435e of the fifth cold plate, and the second output conduit 1440b is arranged to deliver liquid coolant from the outlet port 1445e of the fifth cold plate to the connector having a receiving conduit 1555.

[0306] In operation, the liquid coolant circulates around each branch of the cooling circuit. Relatively cold liquid coolant is supplied by a supply conduit to the input conduit of each branch, and relatively hot liquid coolant is received at the receiving conduit from each output conduit of each branch. A pump and cooling system (as described above) can be arranged between the receiving and supply conduits within the cooling circuit to circulate the liquid coolant and transfer heat from it.

[0307] As will be understood, any number of configurations for the cold plates and cooling circuits can be arranged based on the outlined examples. More than two parallel branches of the cooling circuit can be arranged in the electronic module, and any number of cold plates can be arranged in series on each branch of the cooling circuit. The specific arrangement will be selected based on the cooling requirements of the particular electronic module and given the space and configuration constraints of the electronic module (especially when retrofitting the cooling system into an existing electronic module). A specific arrangement can be selected (e.g., by the installer) in light of these requirements and constraints to optimize the effective cooling of the electronic module.

[0308] Figure 21A plan view showing another example of a cooling system installed in electronic module 2110 is shown. Electronic module 2110 is shown installed within rack 2100. In this example, a first cold plate 1401a and a second cold plate 1401b are arranged in parallel within the cooling circuit. Within the boundary of module housing 1420, the configuration of the first input conduit 1430a and the second input conduit 1430b, the first output conduit 1440a and the second output conduit 1440b, and the first and second cold plates is consistent with the above description. Figure 15 and Figure 16 The example described is the same. However, in this example, the first manifold 2120a and the second manifold 2120b are provided externally to the electronic module. The first manifold 2120a is coupled to the first input conduit 1430a and the second input conduit 1430b, and the second manifold 2120b is coupled to the first output conduit 1440a and the second output conduit 1440b. It can be understood that the source conduit and the receiver conduit will be connected to the first manifold and the second manifold, respectively, and each manifold has the same characteristics as described above in the cooling circuit. Figure 15 and Figure 16 The described source and receiving catheters function similarly. Figure 21 In this configuration, the source and receiving conduits are invisible and connect to the manifold perpendicular to the flow direction of the liquid coolant in the inlet and outlet conduits (i.e., in...). Figure 21 In the middle, the liquid coolant flow through the source conduit and the receiving conduit will enter / exit the plane of the electronic module.

[0309] Each manifold provides a unit having a passage or channel for supplying liquid coolant to a conduit. The passage or channel within the manifold may have a wider diameter or orifice size than the conduit to avoid restricting the flow rate of liquid coolant through the manifold. The manifold unit is made rigid, allowing for greater flexibility than flexible tubing (e.g., as per [reference to...]). Figure 15 and Figure 16 The simple coupling between the connectors (shown in 1570a and 1570b) facilitates easier attachment to the electronic module or rack. Furthermore, providing a rigid manifold as the connection point between the input and output conduits and the corresponding supply and receiving conduits reduces strain on the connectors and thus helps prevent leakage of liquid coolant or pressure drop in the liquid cooling circuit. Finally, the use of the manifold facilitates the installation and assembly of the cooling system because it allows for disconnectable connections between the conduits and therefore allows for flexibility in the arrangement of various components of the cooling system.

[0310] The manifold can be supported by bracket 2130, in Figure 21 In the example, the bracket is attached to the rear of the module housing. In an alternative example, the bracket can be attached to a rack.

[0311] Each of the first and second input conduits uses connectors 2125a and 2125b, and more specifically, blind-mating connectors, to connect or couple to the first manifold, although other types of connectors may be used. Blind-mating connectors have a "push-in" mating action, in other words, by sliding or snapping the connector plug into the socket. Therefore, the connector is easier to assemble without the need for tools such as wrenches. Furthermore, no torque needs to be applied to the pipe or multiple conduits providing the conduit during assembly (this allows for greater control over the arrangement of conduits within the cooling system). Additionally, blind-mating connectors have a self-aligning feature, which allows for flexibility in the presence of small misalignments during mating. Therefore, this type of connector provides greater convenience for assembling cooling systems, especially when replacing air-cooled radiator systems with existing electronic modules.

[0312] Figure 22 A plan view depicting another example of a cooling system installed within electronic module 2200 is shown. This example also includes a manifold, but... Figure 21 The comparison shown is for another configuration. Figure 22 The cooling system includes a first cold plate 1401a and a second cold plate 1401b arranged in parallel within a cooling circuit. The arrangement of the first cold plate 1401a and the second cold plate 1401b, the first input conduit 1430a and the second input conduit 1430b, the first output conduit 1440a and the second output conduit 1440b, as well as the source conduit 1550 and the receiving conduit 1555, is consistent with the above-mentioned... Figure 15 and Figure 16 The examples described are the same as those.

[0313] exist Figure 22 In the example, the source conduit 1550 and the receiver conduit 1555 are respectively connected to the corresponding first manifold 2120a and second manifold 2120b. As previously described, the manifolds can connect the source and receiver conduits to a cooling circuit. (This is related to the above regarding...) Figure 21 The manifolds discussed are similar; manifolds 2120a and 2120b are units or elements having passages or channels for supplying liquid coolant to conduits. They can be rigid and provide the various benefits outlined above.

[0314] The supply and receiving conduits can be connected to the manifold via connectors 2225a and 2225b. These connectors can be, for example, manual connectors, which require manual connection (or disconnection) during installation to remove the electronics module from the rack. Such connectors are relatively simple to install and less complex than other types of connectors. Therefore, this type of drip-free manual connector can be particularly useful when retrofitting the cooling system to existing electronics modules.

[0315] exist Figure 22In the example, the first manifold 2120a and the second manifold 2120b are supported by the rack 2100. More specifically, the first manifold 2120a and the second manifold 2120b are mounted in a slot (or channel, or cavity) 2101 provided in a typical rack for accommodating cables and data cables. The slot 2101 provides a cavity adjacent to the rear of the electronic module 2100, such that the first manifold 2120a and the second manifold 2120b mounted therein are accommodated in a compact and robust manner. Advantageously, this arrangement for accommodating the manifolds 2120a and 2120b does not necessarily require any additional brackets or foundation structures to support the manifolds, and still securely and firmly holds the manifolds in place.

[0316] Note that the above is about Figure 21 and Figure 22 The described manifold is shown as a separate manifold unit for each of the inlet and outlet sections of the cooling circuit. It is understood that both the inlet and outlet sections could be served by a single manifold unit with appropriate separation therein. However, separate manifolds for each of the inlet and outlet sections can provide additional flexibility in manifold arrangement, especially when retrofitting a cooling system to an existing server blade.

[0317] The cooling circuit has been described above, and the aforementioned cold plate device forms part of that cooling circuit. Figure 23 A schematic diagram illustrating the specific configuration of the complete cooling circuit is shown through examples. Figure 23 The following are shown: an electronic module or server chassis 2300; a first cold plate 2320a and a second cold plate 2320b according to this disclosure; a water-based cooling circuit 2330 (which is a "cooling circuit" circulating through the cold plates, as described with reference to the example above); a first manifold 2340a and a second manifold 2340b; and a cooling distribution unit (CDU) 2350, which includes a heat exchanger 2360 (or cooling system) for transferring heat from the liquid coolant in the liquid cooling circuit 2330 to the radiator 2380. A facility-level pump 2370 is used to distribute coolant to all the cold plates 2320a, 2320b within the cooling circuit 2330. The electronic module or server chassis 2300 may be mounted within a rack 2310, wherein the manifolds 2340a, 2340b are mounted to the rack and are also used to direct coolant to and from other servers (not shown). Figure 22 As shown, manifolds can be installed in slots within racks used for the storage and passage of cables and data cables.

[0318] It should be understood that, despite Figure 23The pump and heat exchanger are shown within the unit (CDU), but alternatively, a separate cooling system (or heat exchanger) and pump can be implemented within the cooling circuit 2330.

[0319] Figure 24 An alternative example of a cooling circuit is shown, in which one or more cold plates described in the example above can form part of the cooling circuit. Figure 24 A schematic diagram of an electronic module 2400 mounted in a rack 2410 is depicted, including: a first cold plate 2420a and a second cold plate 2420b according to the present disclosure; a first cooling circuit 2430 (which is a "cooling circuit" circulating through the cold plates, as described with reference to the examples above); a cooling system including a heat exchanger 2465, a first pump 2475, a second cooling circuit 2435, a first manifold 2440a and a second manifold 2440b; and a cooling distribution unit (CDU) 2450, which includes a heat exchanger 2460 for transferring heat to a radiator 2480 and a facility-level pump 2470.

[0320] In this example, the first cooling circuit 2430 (or “cooling circuit”, as described above with respect to Figures 13-22) circulates through cold plates 2420a and 2420b and is entirely contained within the chassis of the electronic module 2400. The first cooling circuit 2430 circulates via a pump 2475, which is also housed within the chassis. The first cooling circuit 2430 is connected to a cooling system, which includes a heat exchanger 2465 for transferring heat from the liquid coolant circulating in the first cooling circuit to a cooling medium (e.g., water or another liquid coolant) circulating in the second cooling circuit 2435. In this way, heat is removed from the first cooling circuit 2430. In this example, the cooling system is also housed within the chassis of the electronic module 2400.

[0321] The second cooling loop 2435 circulates between the heat exchanger and the cooling distribution unit. This circulation can be achieved by a pump 2470 within the CDU. The second cooling loop 2435 can be a facility-level cooling loop (i.e., a building water cooling loop). Alternatively, for example, the second cooling loop 2435 can be local to the electronic module, rack-local to the electronic module, or local to the server room housing the module. The second cooling loop can be achieved via manifolds 2440a and 2440b installed to rack 2410. Alternatively, the manifolds can be installed to the electronic module.

[0322] At the CDU, heat is transferred from the second cooling circuit 2435 via heat exchanger 2460. The heat is then transferred to radiator 2480. It should be understood that radiator 2480 can represent an air-cooled radiator. Alternatively, radiator 2480 can form part of an additional (third) cooling circuit through which liquid coolant circulates. This may be appropriate if the second cooling circuit is rack-specific to the electronic module and the third cooling circuit is a facility-level cooling circuit (such as a building water cooling circuit).

[0323] As those skilled in the art will understand, such as the above regarding Figures 14 to 24 The electronic modules discussed are configured to be mounted in racks. Specifically, each rack can hold multiple electronic modules. In this way, a library of electronic modules is formed, for example, each electronic module providing a server within a server library. Therefore, the cooling systems discussed above regarding the individual electronic modules form part of a larger cooling system capable of serving multiple electronic modules in one or more racks.

[0324] Figure 25 A schematic diagram of an example cooling system is shown, comprising multiple electronic modules, each equipped with a cooling system. Figure 25 A server chassis or electronic module 2500 is shown mounted within rack 2510. Multiple racks may be provided, each capable of housing up to 42 electronic modules 2500. In this example, a water-based cooling circuit 2530 is provided across all electronic modules 2500. The cooling circuit 2530 is cooled using a single coolant distribution unit (CDU) 2550. The CDU 2550 includes a heat exchanger 2560 and a facility-level pump 2570, wherein heat is transferred to a radiator 2580. The radiator 2580 itself may be air-cooled. Alternatively, the radiator 2580 may form part of a second coolant circuit (not shown). In either case, the heat exchanger facilitates the transfer of heat from the liquid coolant circulating in the cooling circuit 2530. Thus, a single pump 2570 can be used in systems with multiple (or even hundreds) electronic modules 2500.

[0325] Notice, Figure 25 Each of the server chassis or electronic modules 2500 shown is based on Figure 23 The server chassis or electronic module 2300, shown in more detail, is equipped with a cooling circuit. However, it will be understood that... Figure 25 Each of the electronic modules 2500 in the middle can alternatively have according to Figure 24 The configuration of the electronic module 2400 is shown. Specifically, Figure 25 Each electronic module 2500 can be based on Figure 24The electronic module 2400 shown includes a cooling system (including at least a heat exchanger 2465 to transfer heat to a second cooling circuit 2435) and a pump 2475 within the main body of the electronic module or server chassis.

[0326] In summary, embodiments according to this disclosure offer a range of benefits. These are particularly advantageous for cold plates used to cool electronic devices in intensive applications (e.g., 1U servers in multiple racks) and ultra-intensive applications. The adaptability and configuration of the cooling system offer particular benefits, making it especially suitable for retrofitting existing electronic modules or server chassis systems. Furthermore, the described system can be applied to standard or typical server chassis or server racks without complex customization.

[0327] also, Figures 14 to 25 Any of the configurations described above for the cold plate can be applied as per the above. Figures 1 to 4B The first and second cooling cycle arrangements are discussed. Specifically, the first cooling cycle arrangement can be compared with a reference... Figures 14 to 25 Any of the aforementioned cold plate configuration combinations (and implemented as a second cooling cycle arrangement) wherein a suitable heat exchanger 170 is added for transferring heat between the first cooling cycle arrangement and the second cooling cycle arrangement.

[0328] Those skilled in the art will envision various combinations of the described embodiments. All features disclosed herein can be combined in any way, except for combinations in which at least some such features and / or steps are mutually exclusive. In particular, preferred features of the invention apply to all aspects of the invention and can be used in any combination. Similarly, features described in non-essential combinations can be used individually (not in combination).

Claims

1. A system for cooling a plurality of electronic devices housed in a housing of an electronic module, the system comprising: A first cooling cycle arrangement is configured to circulate a first liquid coolant between a first electronic device and a heat exchanger among a plurality of electronic devices, the housing of the electronic module containing the first liquid coolant, the first electronic device being in contact with the first liquid coolant, such that heat is transferred from the surface of the first electronic device in contact with the first liquid coolant to the first liquid coolant. as well as A second cooling circulation arrangement is configured to circulate a second liquid coolant between a second electronic device and the heat exchanger in the plurality of electronic devices, wherein the second electronic device is thermally coupled to the second liquid coolant, such that heat is transferred from the second electronic device to the second liquid coolant; The first cooling cycle arrangement and the second cooling cycle arrangement are thermally coupled at least via the heat exchanger, such that heat is transferred from the first liquid coolant to the second liquid coolant via the heat exchanger. The heat exchanger includes at least a first chamber and a second chamber separated by a thermal interface, wherein the heat exchanger is configured to allow the first liquid coolant to flow through at least the first chamber, such that heat is transferred from the first liquid coolant to the second liquid coolant through the thermal interface.

2. The system according to claim 1, wherein, The second cooling circulation arrangement further includes a cooling system, wherein the second cooling circulation arrangement is configured to circulate the second liquid coolant between the second electronic device of the plurality of electronic devices, the heat exchanger and the cooling system, wherein heat is removed from the second liquid coolant by the cooling system.

3. The system according to claim 1, wherein, The second cooling circulation arrangement is connected to a second liquid coolant source, wherein the second cooling circulation arrangement is configured to circulate the second liquid coolant received from the second liquid coolant source between the second electronic device and the heat exchanger in the plurality of electronic devices, and to return it to the second liquid coolant source.

4. The system according to any one of claims 1 to 3, wherein, The heat exchanger is arranged inside the housing of the electronic module.

5. The system according to any one of claims 1 to 3, wherein, The first electronic device is at least partially immersed in the first liquid coolant.

6. The system according to claim 5, wherein, The first cooling circulation arrangement further includes a weir, the weir comprising: A base and a baffle extending from the base, the base and the baffle defining a volume for retaining a portion of the first liquid coolant in the first liquid coolant; The first liquid coolant flows into the volume through the inlet; Sufficient first liquid coolant flows into the volume through the inlet, causing the first liquid coolant to overflow the baffle to contact the surface of the first electronic device, so that heat is transferred to the first liquid coolant, thereby allowing the overflowed first liquid coolant to be collected together with the first liquid coolant contained in the housing of the electronic module and outside the weir for recirculation within the first cooling cycle arrangement.

7. The system according to claim 6, wherein, The inlet also includes a nozzle arrangement for guiding the first liquid coolant into the volume.

8. The system according to claim 6, wherein, The weir also includes a protrusion extending from the base and / or the retaining wall within the volume of the weir.

9. The system according to claim 6, wherein, The weir is coupled to the surface of the first electronic device to serve as a heat sink.

10. The system according to claim 6, wherein, The first cooling cycle arrangement further includes: A pump configured to circulate the first liquid coolant within the first cooling circulation arrangement.

11. The system according to claim 10, wherein, The first cooling circulation arrangement further includes a pump inlet, which is arranged to receive the first liquid coolant contained within the housing of the electronic module and outside the weir.

12. The system according to claim 10, wherein, The first cooling cycle arrangement further includes: At least a first pipe and a second pipe are arranged to deliver the first liquid coolant from the pump to the heat exchanger and from the heat exchanger to the inlet of the weir, respectively.

13. The system of claim 2, wherein the second cooling circulation arrangement further comprises a cooling module configured to thermally couple the second electronic device to the second liquid coolant.

14. The system according to claim 13, wherein, The cooling module includes a cold plate, and the cold plate includes: A cold-plate housing, the surface of which is arranged to provide a thermal interface for cooling the second electronic device, the second electronic device being thermally coupled to the surface of the cold-plate housing; and At least one channel, within the cold plate housing and near the surface of the cold plate housing, is arranged to allow the second liquid coolant to flow through the at least one channel, such that heat received from the second electronic device through the surface of the cold plate housing is transferred to the second liquid coolant.

15. The system of claim 14, wherein the second cooling circulation arrangement further comprises a plurality of conduits arranged to deliver the second liquid coolant between the cold plate, the heat exchanger and the cooling system.

16. A method for cooling a plurality of electronic devices housed in a housing of an electronic module, the method comprising: The first liquid coolant is circulated within a first cooling cycle arrangement, including circulating the first liquid coolant between a first electronic device and a heat exchanger in a plurality of electronic devices, the housing of the electronic module containing the first liquid coolant, the first electronic device being in contact with the first liquid coolant, such that heat is transferred from the surface of the first electronic device in contact with the first liquid coolant to the first liquid coolant. as well as Circulating the second liquid coolant within the second cooling cycle arrangement includes circulating the second liquid coolant between a second electronic device in the plurality of electronic devices and the heat exchanger, wherein the second electronic device is thermally coupled to the second liquid coolant, such that heat is transferred from the second electronic device to the second liquid coolant; The first cooling cycle arrangement and the second cooling cycle arrangement are thermally coupled at least via the heat exchanger, such that heat is transferred from the first liquid coolant to the second liquid coolant via the heat exchanger. The heat exchanger includes at least a first chamber and a second chamber separated by a thermal interface, wherein the heat exchanger is configured to allow the first liquid coolant to flow through at least the first chamber, such that heat is transferred from the first liquid coolant to the second liquid coolant through the thermal interface.

17. The method according to claim 16, wherein, The second cooling cycle arrangement further includes a cooling system, wherein circulating the second liquid coolant within the second cooling cycle arrangement includes circulating the second liquid coolant between the second electronic device of the plurality of electronic devices, the heat exchanger, and the cooling system, wherein heat is removed from the second liquid coolant by the cooling system.

18. The method according to claim 16, wherein, The second cooling cycle arrangement further includes a second liquid coolant source, wherein circulating the second liquid coolant within the second cooling cycle arrangement includes: receiving the second liquid coolant from the second liquid coolant source, circulating the second liquid coolant between the second electronic device and the heat exchanger of the plurality of electronic devices, and returning to the second liquid coolant source.

19. The method according to any one of claims 16 to 18, wherein, The heat exchanger is configured to allow the second liquid coolant to flow through at least the second chamber.

20. The method according to any one of claims 16 to 18, wherein, The heat exchanger is arranged inside the housing of the electronic module.

21. The method according to any one of claims 16 to 18, wherein, The first electronic device is at least partially immersed in the first liquid coolant.

22. The method according to any one of claims 16 to 18, wherein, The first cooling circulation arrangement further includes a weir, the weir comprising: A base and a baffle extending from the base, the base and the baffle defining a volume for retaining a portion of the first liquid coolant in the first liquid coolant; The first liquid coolant flows into the volume through the inlet; In this process, sufficient first liquid coolant is allowed to flow into the volume through the inlet, causing the first liquid coolant to overflow the baffle and contact the surface of the first electronic device, thereby transferring heat to the first liquid coolant. The overflowed first liquid coolant is then collected together with the first liquid coolant contained in the housing of the electronic module and outside the weir for recirculation within the first cooling cycle arrangement.

23. The method according to any one of claims 16 to 18, wherein, The second cooling circulation arrangement further includes a cooling module configured to thermally couple the second electronic device to the second liquid coolant.

24. The method according to claim 23, wherein, The cooling module includes a cold plate, and the cold plate includes: A cold-plate housing, the surface of which is arranged to provide a thermal interface for cooling the second electronic device, the second electronic device being thermally coupled to the surface of the cold-plate housing; and At least one channel, within the cold plate housing and near the surface of the cold plate housing, the at least one channel being arranged to allow the second liquid coolant to flow through the at least one channel, such that heat received from the second electronic device through the surface of the cold plate housing is transferred to the second liquid coolant.

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