Resin molding device and method for manufacturing resin molded product

Abstract

The resin molding device and the manufacturing method of the resin molded product of the present invention stably recover the unnecessary resin on the slot block. The present invention includes: a clamping mechanism for clamping the upper mold and the lower mold; a slot block provided on the lower mold, formed with a slot for accommodating the resin material, and including an extension extending on the mold surface of the lower mold; a transfer mechanism including a plunger provided in the slot, and moving the plunger to inject the resin material from the slot into the mold cavity when the upper mold and the lower mold are clamped; and a conveying mechanism for moving the unnecessary resin on the slot block out after the resin is molded, the conveying mechanism including an unnecessary resin adsorption part for adsorbing the unnecessary resin, after the conveying mechanism brings the unnecessary resin adsorption part into contact with the unnecessary resin on the slot block, the transfer mechanism moves the plunger toward the upper mold to peel the unnecessary resin from the slot block, and thereafter, the conveying mechanism uses the unnecessary resin adsorption part to adsorb the unnecessary resin and moves the unnecessary resin out.

Description

Technical Field

[0001] The present invention relates to a resin molding device and a method for manufacturing a resin molded product. Background Art

[0002] In the past, as shown in Patent Document 1, for example, it was considered to close the upper mold and the lower mold, and in a state where the protruding portion of the pick pool block provided in the lower mold sandwiches a part of the formed object between the upper surface of the pick pool block and the lower surface of the upper mold, molten resin was injected into the mold cavity of the upper mold from the space formed between the upper surface of the pick pool block and the lower surface of the upper mold to perform resin sealing.

[0003] In the resin sealing device, when the upper mold and the lower mold are opened, the spring arranged on the lower side of the pick pool block recovers from the compressed state, and the pick pool block is pushed up relative to the upper surface (mold surface) of the lower mold, and the unnecessary resin of the pick pool block is separated from the substrate.

[0004] Since unnecessary resin remains on the pick-up pool block after resin molding, the unnecessary resin must be recovered from the pick-up pool block. Here, in the resin molding device of Patent Document 1, a suction pad for absorbing the unnecessary resin is provided on an unloader for carrying out the resin molding product, and the unnecessary resin is carried out together with the resin molding product by absorbing the unnecessary resin using the suction pad.

[0005] [Prior art literature]

[0006] [Patent Document]

[0007] [Patent Document 1] Japanese Patent No. 6655150 Summary of the invention

[0008] [Problems to be solved by the invention]

[0009] However, when the unnecessary resin is adsorbed and recovered, sometimes the unnecessary resin is in close contact with the pick-up pool block and is difficult to separate, so that the unnecessary resin cannot be recovered. In addition, when the unnecessary resin is pulled away from the pick-up pool block, the pressure in the groove becomes negative pressure, so there is a problem that the unnecessary resin is difficult to separate from the pick-up pool block. In addition, there is also a problem that the unnecessary resin is difficult to separate from the pick-up pool block due to the friction between the unnecessary resin and the upper surface of the pick-up pool block.

[0010] Furthermore, it is also considered to use the plunger in the groove to strip the unnecessary resin from the pick material pool block in advance, so that the unnecessary resin may float from the pick material pool block and become an inclined state. If the unnecessary resin becomes an inclined state, it is difficult to use the adsorption pad to absorb the unnecessary resin.

[0011] Therefore, the present invention is made to solve the above-mentioned problems, and the main problem is to stably recover the unnecessary resin on the tank block.

[0012] [Technical means to solve the problem]

[0013] That is, the resin molding device of the present invention includes: a first mold, which forms a mold cavity; a second mold, which faces the first mold and carries a molding object; a clamping mechanism, which clamps the first mold and the second mold; a groove block, which is provided in the second mold, forms a groove for accommodating a resin material, and includes a protruding portion protruding on the mold surface of the second mold; a transfer mechanism, which includes a plunger provided in the groove, and moves the plunger to inject the resin material from the groove into the mold cavity in a state where the first mold and the second mold are clamped; and a conveying mechanism, which carries out unnecessary resin on the groove block after resin molding, the conveying mechanism includes an unnecessary resin adsorption portion for adsorbing the unnecessary resin, and after the conveying mechanism brings the unnecessary resin adsorption portion into contact with the unnecessary resin on the groove block, the transfer mechanism moves the plunger toward the first mold to peel the unnecessary resin from the groove block, and then the conveying mechanism uses the unnecessary resin adsorption portion to adsorb the unnecessary resin and carries out the unnecessary resin.

[0014] Furthermore, a method for producing a resin molded product according to the present invention is a method for producing a resin molded product using the resin molding apparatus.

[0015] Furthermore, the manufacturing method of the resin molded product of the present invention is a manufacturing method of the resin molded product using a resin molding device, the resin molding device comprising: a first mold, which forms a mold cavity; a second mold, which faces the first mold and carries a molding object; a mold clamping mechanism, which clamps the first mold and the second mold; a groove block, which is provided in the second mold and forms a groove for accommodating a resin material, and includes a protruding portion protruding on the mold surface of the second mold; a transfer mechanism, which includes a plunger provided in the groove, and moves the plunger in a state where the first mold and the second mold are clamped to inject the resin material from the groove into the mold cavity. Resin material; and a conveying mechanism for carrying out the unnecessary resin remaining on the slot block after resin molding, the conveying mechanism includes an unnecessary resin adsorption portion for adsorbing the unnecessary resin, and in the manufacturing method of the resin molded product, after the conveying mechanism brings the unnecessary resin adsorption portion into contact with the unnecessary resin on the slot block, the transfer mechanism moves the plunger toward the first mold to peel off the unnecessary resin from the slot block, and thereafter, the conveying mechanism uses the unnecessary resin adsorption portion to adsorb the unnecessary resin and carry out the unnecessary resin.

[0016] [Effects of the Invention]

[0017] According to the present invention thus constituted, unnecessary resin on the tank block can be stably recovered. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram showing the structure of a resin molding device according to one embodiment of the present invention.

[0019] Figure 2 It is a schematic diagram showing the structure of the forming module of the above-mentioned embodiment.

[0020] Figure 3 It is a schematic diagram showing a substrate mounting state and a resin material filling state of the molding module according to the embodiment.

[0021] Figure 4 It is a schematic diagram showing the mold clamping state of the molding module according to the above embodiment.

[0022] Figure 5 It is a schematic diagram showing a resin injection state of the molding module according to the embodiment.

[0023] Figure 6 Schematic diagram showing a reference position X of the forming module according to the embodiment.

[0024] Figure 7 It is a schematic diagram showing the peeling state of the forming module of the above-mentioned embodiment.

[0025] Figure 8 It is a schematic diagram showing the state of the molding module at the start of the mold opening operation according to the above embodiment.

[0026] Fig. 9 It is a schematic diagram showing a gate breaking operation in the mold opening operation of the molding module according to the embodiment.

[0027] Fig.10 It is a schematic diagram showing a state after a gate is disconnected during a mold opening operation of the molding module according to the embodiment.

[0028] Fig.11 It is a schematic diagram showing the mold opening state of the forming module of the embodiment.

[0029] Fig.12 It is a schematic diagram showing a state in which each suction part of the unloader of the above-mentioned embodiment is in contact with a resin molded product and unnecessary resin.

[0030] Fig.13 This is a schematic diagram showing a state in which unnecessary resin rises and an unnecessary resin adsorption portion shrinks in the above embodiment.

[0031] Fig.14 This is a schematic diagram showing a state in which the unloader of the above-mentioned embodiment absorbs and carries out resin molded products and unnecessary resin.

[0032] Fig.15 (a) is a plan view schematically showing a tank block according to the embodiment, and (b) is a schematic view showing unnecessary resin.

[0033] Fig.16 Schematic diagrams showing (a) a scraping position and (b) a loading position in the scraping operation of the embodiment.

[0034] Explanation of symbols

[0035] 2: The first mold (upper mold, forming mold)

[0036] 2a: Cavity

[0037] 2b: concave part

[0038] 2c: Runner

[0039] 3: Second mold (lower mold, forming mold)

[0040] 4: Resin injection part

[0041] 5: Clamping mechanism

[0042] 11: Forming object supply unit

[0043] 12: Resin material supply department

[0044] 13: Transport device (loader)

[0045] 14: Storage

[0046] 15: Transport mechanism (transport device, unloader)

[0047] 15a: Adsorption part for molded products

[0048] 15a1, 15b1: Adsorption opening

[0049] 15b: Adsorption section for unnecessary resin

[0050] 41: Slot Block

[0051] 41a: Slot

[0052] 41b: Material removal pool

[0053] 41c: Gate

[0054] 41d: Connection

[0055] 42: Transmission mechanism

[0056] 43: Elastic member

[0057] 61: Ejector pin

[0058] 62: Ejector plate

[0059] 63: Elastic member

[0060] 64: Return pin

[0061] 100: Resin molding device

[0062] 100A: Supply module

[0063] 100B: Forming module

[0064] 100C: Storage module

[0065] 101: Upper die holder

[0066] 102: Upper pressure plate

[0067] 103: Upper mold base plate

[0068] 104: Lower die holder

[0069] 105: Movable pressure plate

[0070] 106: Lower mold base plate

[0071] 151: Base member

[0072] 152: Keep Claw

[0073] 153: Mobile mechanism

[0074] 410: Cylindrical member

[0075] 411: Extension

[0076] 421: Plunger

[0077] 422: Plunger drive unit

[0078] COM: Control Department

[0079] J: Resin material

[0080] K: Unnecessary resin

[0081] K1: Residue

[0082] W1: Molding object

[0083] W2: Resin molded product (molding object)

[0084] Wx: Electronic parts

[0085] X: Reference position

[0086] Y: Peeling position DETAILED DESCRIPTION

[0087] Next, the present invention will be described in more detail with reference to examples, but the present invention is not limited to the following description.

[0088] As described above, the resin molding device of the present invention includes: a first mold having a mold cavity; a second mold facing the first mold and carrying a molding object; a clamping mechanism for clamping the first mold and the second mold; a slot block provided in the second mold, having a slot for accommodating a resin material and including a protruding portion extending on a mold surface of the second mold; a transfer mechanism including a plunger provided in the slot, and moving the plunger to inject the resin material from the slot into the mold cavity when the first mold and the second mold are clamped; and a conveying mechanism for removing unnecessary resin on the slot block after resin molding, the conveying mechanism including an unnecessary resin suction portion for sucking the unnecessary resin, after the conveying mechanism brings the unnecessary resin suction portion into contact with the unnecessary resin on the slot block, the transfer mechanism moves the plunger toward the first mold to peel the unnecessary resin from the slot block, and thereafter, the conveying mechanism sucks the unnecessary resin using the unnecessary resin suction portion and removes the unnecessary resin.

[0089] In the resin molding device, after the unnecessary resin adsorption portion is brought into contact with the unnecessary resin on the slot block, the plunger is moved toward the first mold to peel the unnecessary resin from the slot block, and then the unnecessary resin is adsorbed by the unnecessary resin adsorption portion, thereby stably recovering the unnecessary resin on the slot block.

[0090] Specifically, before the unnecessary resin is absorbed by the unnecessary resin absorption part, the unnecessary resin is peeled off from the tank block by the plunger, so that the unnecessary resin absorbed by the unnecessary resin absorption part can be reliably recovered from the tank block. In addition, when the unnecessary resin is peeled off from the tank block by the plunger, the unnecessary resin absorption part contacts the unnecessary resin, so that poor absorption caused by the unnecessary resin tilting on the tank block can be prevented. Through the above, the unnecessary resin on the tank block can be stably recovered.

[0091] Even when the plunger is moved toward the first mold to peel the unnecessary resin from the groove block, if the plunger and the unnecessary resin are closely joined, there may be a problem in subsequent recovery of the unnecessary resin.

[0092] In order to solve the above problem, it is preferable that the transfer mechanism moves the plunger to the side opposite to the first mold to peel the unnecessary resin from the plunger before moving the plunger to the first mold to peel the unnecessary resin from the slot block.

[0093] According to the above structure, the plunger and the unnecessary resin are separated in advance, so the unnecessary resin can be easily recovered.

[0094] Preferably, when the unnecessary resin is peeled off from the slot block, the unnecessary resin adsorption portion elastically deforms and contracts while being in contact with the unnecessary resin on the slot block.

[0095] According to the above structure, the unnecessary resin adsorption portion can be kept in contact with the unnecessary resin without preventing the unnecessary resin from being peeled off from the slot block. Therefore, the peeled unnecessary resin can be reliably adsorbed.

[0096] As a specific structure for making the unnecessary resin adsorption portion easily elastically deform and shrink, it is desirable that the unnecessary resin adsorption portion is a bellows-type adsorption pad.

[0097] Ideally, the conveying mechanism includes a molded product suction portion for sucking the resin molded product, and the unnecessary resin suction portion is used to suck the unnecessary resin, and the molded product suction portion is used to suck the resin molded product, and the unnecessary resin and the resin molded product are conveyed out.

[0098] According to the above structure, the resin molded product and unnecessary resin can be carried out at once by using a common conveying mechanism, so the time for carrying them out can be shortened and the structure of the resin molding device can be simplified.

[0099] In order to prevent the protruding portion of the groove block from interfering with the resin molded product when the resin molded product is moved out, it is ideal that the conveying mechanism includes a moving mechanism, which moves the molded product adsorbed with the resin molded product by the adsorption portion away from the resin injection portion, and moves the resin molded product to a position further outside than the protruding portion.

[0100] When a plurality of the grooves are formed in the groove block, unnecessary resins are generated for each of the plurality of grooves. In this case, when unnecessary resin adsorption portions are provided for each of the plurality of unnecessary resins, the structure of the conveying mechanism becomes complicated.

[0101] Therefore, it is desirable that the tank block includes a connecting portion for connecting unnecessary resin that flows out of the plurality of tank blocks.

[0102] According to the above structure, a plurality of unnecessary resins can be connected into one block, so the number of unnecessary resin adsorption parts can be reduced, and the structure of the transport mechanism can be simplified.

[0103] As a specific embodiment for connecting the unnecessary resin, it is considered that the slot block is formed with a plurality of ejection pools corresponding to the plurality of slots, respectively, and the plurality of ejection pools are connected to each other by the connecting portion.

[0104] As a pre-stage for stably recovering the unnecessary resin, the resin molded product must be reliably separated from the unnecessary resin. Therefore, it is desirable that during the mold opening operation of the mold clamping mechanism opening the first mold and the second mold, the transfer mechanism moves the plunger toward the first mold to separate the resin molded product on the mold surface of the second mold from the unnecessary resin on the groove block.

[0105] Since the resin molded product and the unnecessary resin are separated using the plunger as described above, they can be reliably separated.

[0106] In a case where the groove block is arranged to be able to advance and retreat relative to the second mold via an elastic member, it is ideal that during the mold opening operation of the mold clamping mechanism to open the first mold and the second mold, the groove block is moved toward the first mold by the restoring force of the elastic member, thereby separating the resin molded product on the mold surface of the second mold from the unnecessary resin on the groove block.

[0107] According to the above structure, the resin molded product can be separated from unnecessary resin by utilizing the elastic force of the elastic member compressed when the mold is closed.

[0108] Ideally, the slot block is in a state of sandwiching the unnecessary resin between the slot block and the first mold by utilizing the elastic force of the elastic member during a specified period from the start of the mold opening action, and after the specified period, the unnecessary resin is retained while being peeled off from the first mold.

[0109] According to the above structure, the resin molded product is separated from the unnecessary resin when the slot block sandwiches the unnecessary resin between the slot block and the first mold, thereby preventing the unnecessary resin from accidentally falling off from the slot block when they are separated. In addition, the unnecessary resin does not fall off from the slot block when they are separated, thereby preventing poor adsorption caused by the unnecessary resin tilting on the slot block.

[0110] When collecting the unnecessary resin after mold opening, if the groove block has not returned to the initial state of the elastic member, the groove block may accidentally move before or after the unnecessary resin adsorption portion contacts the unnecessary resin. As a result, there is a risk that the unnecessary resin cannot be adsorbed and the collection is poor.

[0111] In order to solve the problem, it is ideal that the transfer mechanism moves the plunger toward the first mold until the elastic member is restored to its initial state before the mold opening performed by the mold clamping mechanism is completed, and the conveying mechanism causes the unnecessary resin adsorption portion to contact the unnecessary resin on the groove block that has become the initial state.

[0112] Furthermore, a method for manufacturing a resin molded product using the resin molding apparatus is also one embodiment of the present invention.

[0113] Furthermore, the manufacturing method of the resin molded product of the present invention is a manufacturing method of the resin molded product using a resin molding device, the resin molding device comprising: a first mold, which forms a mold cavity; a second mold, which faces the first mold and carries a molding object; a mold clamping mechanism, which clamps the first mold and the second mold; a groove block, which is provided in the second mold and forms a groove for accommodating a resin material, and includes a protruding portion protruding on the mold surface of the second mold; a transfer mechanism, which includes a plunger provided in the groove, and moves the plunger in a state where the first mold and the second mold are clamped to inject the resin material from the groove into the mold cavity. The resin material; and a conveying mechanism for carrying out the unnecessary resin remaining on the slot block after resin molding, the conveying mechanism includes an unnecessary resin adsorption portion for adsorbing the unnecessary resin, and the manufacturing method of the resin molded product is that after the conveying mechanism brings the unnecessary resin adsorption portion into contact with the unnecessary resin on the slot block, the transfer mechanism moves the plunger toward the first mold to peel off the unnecessary resin from the slot block, and thereafter, the conveying mechanism uses the unnecessary resin adsorption portion to adsorb the unnecessary resin and carry out the unnecessary resin.

[0114] <One embodiment of the present invention>

[0115] Hereinafter, one embodiment of the resin molding device of the present invention will be described with reference to the accompanying drawings. In order to facilitate understanding, any of the following drawings are schematically depicted in an appropriately omitted or exaggerated manner. The same components are marked with the same reference numerals and the description thereof is appropriately omitted.

[0116] <Overall structure of resin molding device>

[0117] The resin molding apparatus 100 of the present embodiment performs resin molding of a molding target object W1 to which an electronic component Wx is connected by transfer molding using a resin material J.

[0118] Here, the molding object W1 includes, for example, a metal substrate, a resin substrate, a glass substrate, a ceramic substrate, a circuit substrate, a semiconductor substrate, a wiring substrate, a lead frame, etc., regardless of whether or not there is wiring. In addition, the resin material J used for resin molding is, for example, a composite material containing a thermosetting resin, and the resin material J is in the form of particles, powder, liquid, sheet, or small pieces. Furthermore, the electronic component Wx connected to the upper surface of the molding object W1 is, for example, a bare chip or a chip sealed with resin.

[0119] Specifically, if Figure 1 As shown, the resin molding device 100 includes the following components as constituent elements: a supply module 100A, which supplies a molding object W1 and a resin material J before molding; a molding module 100B, which performs resin molding; and a storage module 100C, which stores a molding object W2 (hereinafter referred to as a resin molded product W2) after molding. Furthermore, the supply module 100A, the molding module 100B, and the storage module 100C are mutually detachable and replaceable relative to other constituent elements. In addition, the molding module 100B can be set to two or three, etc., to increase each constituent element.

[0120] The supply module 100A is provided with the following components: a forming object supply section 11 for supplying a forming object W1; a resin material supply section 12 for supplying a resin material J; and a conveying device 13 (hereinafter referred to as a loader 13) for receiving the forming object W1 from the forming object supply section 11 and conveying it to the forming module 100B, and for receiving the resin material J from the resin material supply section 12 and conveying it to the forming module 100B.

[0121] The loader 13 reciprocates between the supply module 100A and the forming module 100B, and moves along a rail (not shown) provided across the supply module 100A and the forming module 100B.

[0122] like Figure 2 As shown, the forming module 100B includes: a first mold 2 (hereinafter referred to as the upper mold 2), which is one of the forming molds having a mold cavity 2a for injecting a resin material J; a second mold 3 (hereinafter referred to as the lower mold 3), which is another of the forming molds arranged opposite to the upper mold 2 and provided with a resin injection portion 4 for injecting the resin material J into the mold cavity 2a; and a clamping mechanism 5 for clamping the upper mold 2 and the lower mold 3. The upper mold 2 is held by an upper mold holder 101, and the upper mold holder 101 is fixed to an upper platen 102. In addition, the upper mold 2 is mounted on the upper mold holder 101 via an upper mold base plate 103. The lower mold 3 is held by a lower mold holder 104, and the lower mold holder 104 is fixed to a movable platen 105 raised and lowered by the clamping mechanism 5. In addition, the lower mold 3 is mounted on the lower mold holder 104 via a lower mold base plate 106.

[0123] The resin injection unit 4 includes a slot block 41 having a slot 41a for receiving the resin material J and a transfer mechanism 42 including a plunger 421 disposed in the slot 41a. The slot 41a is formed by, for example, a cylindrical member 410. The cylindrical member 410 is inserted into a through hole formed in the slot block 41.

[0124] The slot block 41 is elastically supported by the elastic member 43 so as to be able to rise and fall relative to the lower mold 3. That is, the slot block 41 is provided so as to be able to rise and fall relative to the lower mold 3 via the elastic member 43. In addition, the elastic member 43 is provided on the lower side of the slot block 41.

[0125] In addition, at the upper end of the groove block 41, there is formed an extension portion 411 extending from the mold surface which is the upper surface of the lower mold 3. Furthermore, on the upper surface of the groove block 41, there are formed a material removal pool portion 41b and a gate portion 41c which serve as a resin flow path for introducing the resin material J injected from the groove 41a into the mold cavity 2a. In addition, when the upper mold 2 and the lower mold 3 are closed, the upper surface of the extension portion 411 contacts the upper mold 2, and the lower surface sandwiches the molding object W1 between the mold surface of the lower mold 3.

[0126] The transfer mechanism 42 moves the plunger 421 to inject the resin material J from the groove 41a into the cavity 2a when the upper mold 2 and the lower mold 3 are clamped. Specifically, the transfer mechanism 42 includes a plunger 421 for pressure-feeding the resin material J heated and melted in the groove 41a, and a plunger driving unit 422 for driving the plunger 421.

[0127] The upper mold 2 is formed with a cavity 2a, which accommodates the electronic component Wx of the molding object W1 and is injected with molten resin material J. In addition, the upper mold 2 is formed with a recessed portion 2b in the portion facing the slot block 41, and a runner portion 2c is formed to connect the ejection pool portion 41b and the gate portion 41c of the slot block 41 with the cavity 2a. Furthermore, although not shown in the figure, an exhaust port is formed in the upper mold 2 on the side opposite to the slot block 41. In addition, the runner portion 2c may be omitted, and the ejection pool portion 41b may be directly connected to the cavity 2a via the gate portion 41c.

[0128] In addition, a plurality of ejector pins 61 are provided in the upper mold 2, and the plurality of ejector pins 61 are used to demold the molded object W2 after resin molding from the upper mold 2. These ejector pins 61 are provided to penetrate the required parts of the upper mold 2 and can be raised and lowered relative to the upper mold 2, and are fixed to the ejector plate 62 provided on the upper side of the upper mold 2. The ejector plate 62 is provided on the upper pressing plate 102 or the like via an elastic member 63, and includes a return pin 64. When the mold is closed, the return pin 64 contacts the outside of the loading area of ​​the molded object W1 in the lower mold 3, thereby raising the ejector plate 62 relative to the upper mold 2. As a result, when the mold is closed, the ejector pins 61 are in a state of being retracted into the mold surface of the upper mold 2. On the other hand, when the mold is opened, as the lower mold 3 descends, the ejector plate 62 descends relative to the upper mold 2, and the ejector pins 61 use the elastic force of the elastic member 63 to demold the resin molded product W2 from the upper mold 2.

[0129] When the upper mold 2 and the lower mold 3 are clamped by the clamping mechanism 5, the resin flow path including the material removal pool 41b, the gate portion 41c, the recessed portion 2b and the runner portion 2c connects the groove 41a with the cavity 2a (see Figure 4 ). In addition, when the upper mold 2 and the lower mold 3 are molded together, the groove side end of the molding object W1 is sandwiched between the lower surface of the extension 411 of the groove block 41 and the mold surface of the lower mold 3. When the molten resin material J is injected into the mold cavity 2a by the plunger 421 in this state, the electronic component Wx of the molding object W1 is sealed with resin.

[0130] like Figure 1 As shown, the storage module 100C is provided with a storage section 14 for storing the resin molded product W2 and a conveying device 15 (hereinafter referred to as an unloader 15 ) for receiving the resin molded product W2 from the molding module 100B and conveying it to the storage section 14 .

[0131] The unloader 15 reciprocates between the forming module 100B and the storage module 100C, and moves along a rail (not shown) provided across the forming module 100B and the storage module 100C. The specific structure of the unloader 15 will be described later.

[0132] <Operation of resin molding device 100>

[0133] Reference Figure 3 to Figure 14 The operation of the resin molding device 100 will be briefly described. Figure 3 to Figure 14 Only one side (left side) of the slot block 41 is shown, and the other side (right side) is omitted, but the state of the other side in each figure is the same as the state of one side. In addition, the following actions are performed by, for example, controlling each part by the control unit COM provided in the supply module 100A.

[0134] like Figure 3As shown in FIG. 1 , in the state where the upper mold 2 and the lower mold 3 are opened, the loader 13 conveys the molding object W1 before molding, and transfers it to the lower mold 3 and places it. At this time, the upper mold 2 and the lower mold 3 are heated to a temperature at which the resin material J can be melted and hardened. Thereafter, the resin material J is conveyed by the loader 13 and accommodated in the groove 41a of the groove block 41.

[0135] In the above state, when the lower mold 3 is raised by the mold clamping mechanism 5, Figure 4 As shown in FIG. 1 , the groove block 41 contacts the upper mold 2 and descends relative to the lower mold 3, and the lower surface of the protruding portion 411 contacts the groove side end of the molding object W1. In addition, the lower surface of the upper mold 2 contacts the outer peripheral portion of the molding object W1 that the protruding portion 411 does not contact. In this way, the upper mold 2 and the lower mold 3 are molded together. After the mold is closed, when the transmission mechanism 42 uses the plunger driving unit 422 to raise the plunger 421, as shown in FIG. Figure 5 As shown, the molten resin material J in the groove 41a passes through the resin passage and is injected into the cavity 2a. Then, after a predetermined molding time has passed and the resin material J is hardened in the cavity 2a, the mold clamping mechanism 5 opens the upper mold 2 and the lower mold 3.

[0136] Here, the resin molding device 100 of this embodiment performs an operation (gate disconnection operation) of separating the resin molded product W2 from the unnecessary resin K during the mold opening operation of the mold clamping mechanism 5 to open the upper mold 2 and the lower mold 3. The unnecessary resin K is the resin that remains on the groove block 41 and hardens.

[0137] For example, just before the molding time is about to pass (before the start of the mold opening action), Figure 6 As shown in FIG. 1 , the transmission mechanism 42 reduces the force of the plunger 421 pressing the unnecessary resin K to a force of a predetermined value (for example, a relatively small force that can maintain the contact state between the plunger 421 and the unnecessary resin K without peeling off). The force of the plunger 421 pressing is measured by a force sensor (including a weight sensor, a load cell, etc.) such as a load cell (not shown) provided on a driving shaft (transmission shaft) of the plunger driving unit 422.

[0138] Then, the control unit COM stores the position of the plunger 421 when the force becomes the predetermined value as the reference position X (refer to Figure 6 The reference position X is a position that serves as a reference for the gate disconnection operation described later and the demolding / recovery of the unnecessary resin K. The reference position X is not limited to the position of the plunger 421, and may be the position of other components such as the drive shaft (transmission shaft) of the plunger drive unit 422 connected to the plunger 421.

[0139] Then, before the mold opening operation begins, Figure 7As shown in FIG. 1 , the transmission mechanism 42 causes the plunger 421 to descend to the side opposite to the upper mold 2 and to descend to a predetermined peeling position Y. By lowering the plunger 421 to the peeling position Y, the upper surface of the plunger 421 and the lower surface of the unnecessary resin K are peeled off. After the peeling action, the transmission mechanism 42 causes the plunger 421 to rise to the reference position X. At this time, the upper surface of the plunger 421 contacts the lower surface of the unnecessary resin K ( Figure 6 status).

[0140] Then, if Figure 8 As shown, the mold clamping mechanism 5 starts the descent of the lower mold 3 and starts the mold opening action. When the mold clamping mechanism 5 starts the mold opening action and the clamping force is reduced to a specified value (different from the specified value in the transmission mechanism 42), as shown in FIG. Fig. 9 As shown, the transmission mechanism 42 causes the plunger 421 to rise toward the upper mold 2. As a result, the unnecessary resin K on the groove block 41 is pressed toward the upper mold 2 by the plunger 421. Furthermore, the clamping force is measured by a force sensor (including a weight sensor, a load sensor, etc.) such as a load sensor (not shown) provided on the clamping shaft of the mold clamping mechanism 5.

[0141] In addition, when the transmission mechanism 42 causes the plunger 421 to rise to the upper mold 2, as shown in FIG. Fig. 9 As shown, the slot block 41 is subjected to the restoring force, i.e., the elastic force, of the compressed elastic member 43 and rises from the lower mold 3 to the upper mold 2. That is, in the mold opening operation, while the slot block 41 is subjected to the elastic force of the elastic member 43 and rises from the lower mold 3 to the upper mold 2, the transmission mechanism 42 causes the plunger 421 to rise from the lower mold 3 to the upper mold 2.

[0142] Furthermore, during the mold opening operation, the timing at which the groove block 41 starts to rise from the lower mold 3 to the upper mold 2 due to the elastic force of the elastic member 43 and the timing at which the plunger 421 starts to rise from the lower mold 3 to the upper mold 2 using the transmission mechanism 42 may be the same or different.

[0143] By utilizing the rise of the plunger 421 of the transmission mechanism 42 and the rise of the slot block 41 utilizing the elastic force of the elastic member 43, as shown in FIG. Fig.10 As shown, the resin molded product W2 on the mold surface of the lower mold 3 is separated from the unnecessary resin K on the groove block 41 (gate disconnection).

[0144] At this time, the resin molded product W2 on the lower mold 3 is pressed toward the mold surface of the lower mold 3 by the ejector pin 61 provided on the upper mold 2, and the lower surface of the resin molded product W2 is in close contact with the mold surface of the lower mold 3 (refer to Fig. 9The ejector pin 61 functions as a pressing member for pressing the resin molded product W2 against the mold surface of the lower mold 3 when separating the resin molded product W2 from the unnecessary resin K. Since the resin molded product W2 is pressed against the mold surface of the lower mold 3 by the pressing member as described above, shear stress is easily applied between the resin molded product W2 and the unnecessary resin K, and the gate is easily disconnected.

[0145] Here, the ejector pin 61 as the pressing member presses the resin molded product W2 against the mold surface of the lower mold 3 at least until the resin molded product W2 is separated from the unnecessary resin K. In other words, during the mold opening operation, while the ejector pin 61 is pressing the resin molded product W2, the separation of the resin molded product W2 from the unnecessary resin K is completed by the rise of the groove block 41 and the rise of the plunger 421.

[0146] In the gate cutoff, the unnecessary resin K is sandwiched between the upper surface of the slot block 41 pressed upward by the elastic force of the elastic member 43 and the lower surface of the upper mold 2 (see Fig. 9 and Fig.10 ). That is, the groove block 41 is in a state of sandwiching unnecessary resin K between the upper mold 2 and the groove block 41 by the elastic force of the elastic member 43 during a predetermined period from the start of the mold opening operation. The so-called predetermined period is at least a period until the gate is disconnected and the lower mold 3 is lowered to the initial state (the state before being pressed and compressed by the upper mold 2) of the elastic member 43.

[0147] Then, after a predetermined period of time, the lower mold 3 is further lowered by the mold clamping mechanism 5. Fig.11 As shown, the groove block 41 peels the unnecessary resin K from the upper mold 2 while retaining the unnecessary resin K. Here, the groove block 41 is formed with a material removal pool 41b and a gate 41c, and the contact area between the groove block 41 and the unnecessary resin K is larger than the contact area between the upper mold 2 and the unnecessary resin K, so that the unnecessary resin K is not peeled off from the groove block 41, but is peeled off from the upper mold 2. As a result, the ejector pin for contacting with the unnecessary resin K and peeling the unnecessary resin K from the upper mold 2 is not required.

[0148] Furthermore, as the transfer mechanism 42 raises the plunger 421 toward the upper die 2 , the extension portion 411 of the slot block 41 changes from a state where the resin molded product W2 is sandwiched between the die surface of the lower die 3 to a state where the extension portion 411 is not in contact with the resin molded product W2 .

[0149] In addition to the gate disconnection, the transmission mechanism 42 causes the plunger 421 to rise toward the upper mold 2 until the elastic member 43 on the lower side of the slot block 41 returns to the initial state before the mold is closed (see Fig.11). Thus, in the next resin molding, when the molding object W1 is placed on the lower side of the protruding portion 411, the protruding portion 411 does not become an obstacle.

[0150] After the mold opening operation is performed as described above and the resin molded product W2 is separated from the unnecessary resin K, Figure 12 to Figure 14 As shown, the resin molded product W2 and unnecessary resin K are unloaded by the unloader 15 .

[0151] like Fig.12 As shown, the unloader 15 includes a suction portion 15a for molded products and a suction portion 15b for unnecessary resin. The suction portion 15a for molded products and the suction portion 15b for unnecessary resin both include suction pads made of resin, and in particular, the suction portion 15b for unnecessary resin is, for example, a bellows type (also called an accordion type), and has better elasticity than the suction portion 15a for molded products. In addition, the suction portion 15a for molded products and the suction portion 15b for unnecessary resin are arranged on the base member 151, and are connected to a suction source such as a suction pump not shown. The suction portion 15a for molded products sucks air using the suction source, thereby sucking the resin molded product W2 at its suction opening 15a1. The suction portion 15b for unnecessary resin sucks air using the suction source, thereby sucking the unnecessary resin K at its suction opening 15b1.

[0152] Furthermore, at least the molded product suction unit 15a is configured to be movable in the left-right direction and the up-down direction relative to the base member 151 by a moving mechanism 153. The moving mechanism 153 includes: a left-right direction moving unit including, for example, a rail and a slider for moving the molded product suction unit 15a in the left-right direction; and an up-down direction moving unit including, for example, a rail and a slider for moving the molded product suction unit 15a in the up-down direction. In addition, the unloader 15 is provided with a holding claw 152 for holding the resin molded product W2 sucked by the molded product suction unit 15a and preventing it from falling.

[0153] After the mold opening operation is completed, the unloader 15 is moved between the upper mold 2 and the lower mold 3. Fig.12 As shown, the suction opening 15a1 of the molded product suction part 15a is brought into contact with the upper surface of the resin molded product W2, and the suction opening 15b1 of the unnecessary resin suction part 15b is brought into contact with the upper surface of the unnecessary resin K.

[0154] In the above state, Fig.13As shown, the transfer mechanism 42 causes the plunger 421 to rise and lift the unnecessary resin K from the groove block 41. Here, in the case where the unnecessary resin K remains in the groove 41a, the residual portion K1 rises to a degree that does not hinder the recovery of the unnecessary resin K. As a result, the unnecessary resin K is demolded from the groove block 41 and is in close contact with the unnecessary resin adsorption portion 15b. At this time, the unnecessary resin adsorption portion 15b is elastically deformed and shrunk in a state where the adsorption opening 15b1 is in contact with the unnecessary resin K.

[0155] Here, in the slot block 41, Fig.15 As shown in (a), a plurality of grooves 41a are formed, and a plurality of material removal pools 41b and gates 41c are formed corresponding to the plurality of grooves 41a, respectively. It is considered that the plurality of material removal pools 41b are connected to each other by connecting portions 41d. In the case of the above structure, Fig.15 As shown in (b) of FIG. 1 , the unnecessary resin K becomes a single mass connected across a plurality of the pick pools 41 b , thereby reducing the amount of the unnecessary resin K. Accordingly, the number of the unnecessary resin adsorption portions 15 b can also be reduced.

[0156] After the unnecessary resin suction part 15b is set to the contracted state, suction of the unnecessary resin suction part 15b is started, and the suction opening 15b1 of the unnecessary resin suction part 15b suctions the unnecessary resin K. In addition, suction of the molded product suction part 15a is started, and the suction opening 15a1 of the molded product suction part 15a suctions the resin molded product W2.

[0157] Then, if Fig.14 As shown in FIG. 1 , the molded product adsorption portion 15a adsorbing the resin molded product W2 is moved in a direction away from the groove block 41 by the moving mechanism 153, so that the resin molded product W2 is moved outside the extension portion 411. Thereafter, the unloader 15 is raised and withdrawn from the upper mold 2 and the lower mold 3. Thus, the resin molded product W2 and the unnecessary resin K are carried out by the unloader 15. Here, since the unnecessary resin K is separated from the plunger 421 when the gate is disconnected, that is, before the unnecessary resin K is separated from the groove block 41 as described above, the unnecessary resin K can be easily recovered.

[0158] Here, the unloader 15 may include a cleaning mechanism (not shown) for cleaning the upper mold 2 and the lower mold 3. The cleaning mechanism may include a rotating brush and a suction unit that sucks and discharges dust.

[0159] In this case, the unloader 15 having sucked the resin molded product W2 and unnecessary resin K stays between the upper mold 2 and the lower mold 3 and performs a cleaning operation.

[0160] Here, first, the transfer mechanism 42 performs the action of scraping out the resin adhering to the groove 41a. Fig.16 As shown, the transfer mechanism 42 raises the plunger 421 to a predetermined scraping position. Here, the predetermined scraping position is, for example, a position where the upper surface of the plunger 421 is located above the opening position of the groove 41a. Then, the transfer mechanism 42 is lowered from the predetermined scraping position to a loading position for accommodating the resin material J. Thereafter, the transfer mechanism 42 raises the plunger 421 to the predetermined scraping position again. Thus, the resin attached to the groove is scraped out of the groove 41a.

[0161] Thereafter, the upper mold 2, the lower mold 3, the groove block 41 and the plunger 421 are cleaned by the cleaning mechanism provided in the unloader 15. After the cleaning operation is completed, the unloader 15 withdraws from the upper mold 2 and the lower mold 3 to carry out the resin molded product W2 and unnecessary resin K.

[0162] <Effects of the present embodiment>

[0163] According to the resin molding device 100 of the present embodiment, the unnecessary resin K is peeled off from the tank block 41 by the plunger 421 before the unnecessary resin adsorption portion 15b adsorbs the unnecessary resin K, so that the unnecessary resin K adsorbed by the unnecessary resin adsorption portion 15b can be reliably recovered from the tank block 41. In addition, when the unnecessary resin K is peeled off from the tank block 41 by the plunger 421, the unnecessary resin adsorption portion 15b contacts the unnecessary resin K, so that poor adsorption caused by the unnecessary resin K tilting on the tank block 41 can be prevented. Through the above, the unnecessary resin K on the tank block 41 can be stably recovered.

[0164] Here, in this embodiment, before the unnecessary resin K is peeled off from the groove block 41, the plunger 421 is lowered to the side opposite to the upper mold 2, and the lower surface of the unnecessary resin K is peeled off from the upper surface of the plunger 421, so that the separated unnecessary resin K can be easily recovered.

[0165] In addition, in the present embodiment, when the unnecessary resin K is peeled off from the groove block 41, the unnecessary resin adsorption portion 15b is elastically deformed and contracted while being in contact with the unnecessary resin K, so that the unnecessary resin adsorption portion 15b can be maintained in contact with the unnecessary resin K without hindering the peeling of the unnecessary resin K from the groove block 41. Therefore, the unnecessary resin K after peeling can be reliably adsorbed.

[0166] Furthermore, in this embodiment, the unloading machine 15 includes a suction portion 15a for the molded product and a suction portion 15b for the unnecessary resin, so that the resin molded product W2 and the unnecessary resin K can be carried out at one time using a common conveying mechanism, thereby shortening their carrying-out time and simplifying the structure of the resin molding device 100.

[0167] In addition, in the present embodiment, during the mold opening operation, while the groove block 41 is lifted by the elastic force of the elastic member 43, the transmission mechanism 42 lifts the plunger 421 to separate the resin molded product W2 from the unnecessary resin K. Therefore, the elastic force of the elastic member 43 compressed during mold closing can be used to reliably separate the resin molded product W2 from the unnecessary resin K. In addition, since the plunger 421 is used to separate the resin molded product W2 from the unnecessary resin K, it is not necessary to increase the elastic force of the elastic member 43, thereby preventing the elastic member 43 from being enlarged, and further does not cause the upper mold 2 and the lower mold 3 to be enlarged or the unnecessary resin K to be enlarged.

[0168] Furthermore, in the present embodiment, the unnecessary resin K is sandwiched between the groove block 41 and the upper mold 2 during the period from the start of the mold opening operation to the completion of the gate disconnection, so that the unnecessary resin K can be prevented from accidentally falling off from the groove block 41 due to the reaction of the unnecessary resin K being separated from the resin molded product W2. In addition, the unnecessary resin K does not fall off from the groove block 41 during their separation, so that poor adsorption caused by the unnecessary resin K tilting on the groove block can be prevented.

[0169] Furthermore, in the present embodiment, before the unnecessary resin adsorption portion 15b recovers the unnecessary resin K, the transfer mechanism 42 causes the plunger 421 to rise toward the upper mold 2 until the elastic member 43 returns to its initial state, so that the front and rear groove blocks 41 that cause the unnecessary resin adsorption portion 15b to contact the unnecessary resin do not rise unexpectedly, thereby enabling the unnecessary resin K to be recovered stably.

[0170] <Other Modified Embodiments>

[0171] Furthermore, the present invention is not limited to the above-described embodiments.

[0172] For example, in the embodiment, before the resin molded product W2 is separated from the unnecessary resin K, the plunger 421 is lowered to peel off the upper surface of the plunger 421 from the lower surface of the unnecessary resin K, but the plunger 421 may be lowered to peel off the upper surface of the plunger 421 from the lower surface of the unnecessary resin K after the resin molded product W2 is separated from the unnecessary resin K and before the groove block 41 is peeled off from the unnecessary resin K.

[0173] In the above embodiment, the plunger 421 is raised when separating the resin molded product W2 from the unnecessary resin K. However, the resin molded product W2 and the unnecessary resin K may be separated only by the elastic member 43 without raising the plunger 421 .

[0174] Furthermore, in the above-described embodiment, the resin molded product W2 and the unnecessary resin K are both carried out by the common unloading machine 15, but the following structure may be provided: a conveying mechanism for carrying out the resin molded product W2 and a conveying mechanism for carrying out the unnecessary resin K are included separately.

[0175] In addition, in the embodiment, the following structure is set: before the resin molded product W2 is separated from the unnecessary resin K, the resin molded product W2 is pressed against the mold surface of the lower mold 3 using the ejector pin 61 provided on the upper mold 2, but in addition to the ejector pin 61, a pressing member for pressing the resin molded product W2 against the mold surface of the lower mold 3 may also be provided.

[0176] Furthermore, in the above-described embodiment, the groove block 41 is provided with the material removal pool 41b and the gate 41c, but the material removal pool and the gate may be formed in the concave portion 2b of the upper mold 2. In this case, when the upper mold 2 and the lower mold 3 are opened, the unnecessary resin K may be demolded from the groove block 41 and remain in the concave portion 2b of the upper mold 2, so an ejector pin for demolding the unnecessary resin K may also be provided in the upper mold 2.

[0177] The resin molding apparatus of the present invention is not limited to ordinary transfer molding, and may be any structure as long as it includes a transfer mechanism.

[0178] In addition, the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the gist of the present invention.

Claims

1. A resin molding device, comprising: A first mold is formed with a mold cavity; A second mold, facing the first mold, and carrying the molding object; A mold clamping mechanism for clamping the first mold and the second mold; a groove block, which is disposed on the second mold, is formed with a groove for receiving the resin material, and includes a protruding portion protruding on the mold surface of the second mold; a transfer mechanism including a plunger disposed in the groove, and moving the plunger to inject the resin material from the groove into the cavity when the first mold and the second mold are in a clamped state; as well as The conveying mechanism removes unnecessary resin from the slot block after the resin is formed. The conveying mechanism includes an unnecessary resin adsorption portion for adsorbing the unnecessary resin. In a state where the mold clamping mechanism clamps the first mold and the second mold, the transfer mechanism moves the plunger to a side opposite to the first mold to peel off the unnecessary resin from the plunger. After the transfer mechanism peels off the unnecessary resin from the plunger, the mold clamping mechanism opens the first mold and the second mold. After the clamping mechanism opens the first mold and the second mold, the conveying mechanism causes the unnecessary resin adsorption portion to contact the unnecessary resin on the slot block. After the conveying mechanism brings the unnecessary resin adsorption portion into contact with the unnecessary resin on the slot block, the transfer mechanism moves the plunger toward the first mold to peel the unnecessary resin from the slot block, and then the conveying mechanism uses the unnecessary resin adsorption portion to adsorb the unnecessary resin and carry the unnecessary resin out.

2. The resin molding device according to claim 1, wherein: When the unnecessary resin is peeled off from the slot block, the unnecessary resin suction portion elastically deforms and contracts while in contact with the unnecessary resin on the slot block.

3. The resin molding device according to claim 1 or 2, wherein: The unnecessary resin adsorption portion is a bellows-type adsorption pad.

4. The resin molding device according to claim 1 or 2, wherein: The conveying mechanism includes a molded product adsorption portion for adsorbing the resin molded product. The unnecessary resin is sucked by the unnecessary resin sucking section, and the resin molded product is sucked by the molded product sucking section, and the unnecessary resin and the resin molded product are carried out.

5. The resin molding device according to claim 4, wherein: The conveying mechanism includes a moving mechanism that moves the molded product suction portion that suctions the resin molded product away from the resin injection portion and moves the resin molded product to an outer side of the extending portion.

6. The resin molding device according to claim 1 or 2, wherein: The slot block includes a plurality of slots formed therein and a connecting portion for connecting unnecessary resin that flows out of the plurality of slots.

7. The resin molding device according to claim 6, wherein: The slot block is provided with a plurality of material removal pools corresponding to the plurality of slots, respectively, and the plurality of material removal pools are connected to each other by the connection part.

8. The resin molding device according to claim 1 or 2, wherein: During the mold opening operation in which the mold clamping mechanism opens the first mold and the second mold, the transfer mechanism moves the plunger toward the first mold to separate the resin molded product on the mold surface of the second mold from unnecessary resin on the groove block.

9. The resin molding device according to claim 1 or 2, wherein: The slot block is configured to be able to advance and retreat relative to the second die via an elastic member. During the mold opening operation of the mold clamping mechanism to open the first mold and the second mold, the groove block is moved toward the first mold by the restoring force of the elastic member, thereby separating the resin molded product on the mold surface of the second mold from unnecessary resin on the groove block.

10. The resin molding device according to claim 9, wherein: The slot block is in a state of sandwiching the unnecessary resin between the slot block and the first mold by utilizing the elastic force of the elastic member during a specified period from the start of the mold opening operation, and after the specified period, the slot block retains the unnecessary resin while peeling the unnecessary resin from the first mold.

11. The resin molding device according to claim 9, wherein: The transmission mechanism moves the plunger toward the first mold until the elastic member returns to its initial state before the mold opening by the mold clamping mechanism is completed. The conveying mechanism brings the unnecessary resin adsorption portion into contact with the unnecessary resin on the slot block in the initial state.

12. A method for producing a resin molded product, using the resin molding apparatus according to any one of claims 1 to 11.

13. A method for manufacturing a resin molded product, the method comprising using a resin molding device, the resin molding device comprising: A first mold is formed with a mold cavity; A second mold, facing the first mold, and carrying the molding object; A mold clamping mechanism for clamping the first mold and the second mold; a groove block provided in the second mold, formed with a groove for accommodating the resin material, and including an extension extending on the mold surface of the second mold; a transfer mechanism including a plunger provided in the groove, and moving the plunger to inject the resin material from the groove into the mold cavity when the first mold and the second mold are in a clamped state; and a conveying mechanism for conveying the unnecessary resin remaining on the slot block after the resin molding, the conveying mechanism comprising an unnecessary resin adsorption portion for adsorbing the unnecessary resin, and in the method for manufacturing the resin molded product, In a state where the mold clamping mechanism clamps the first mold and the second mold, the transfer mechanism moves the plunger to a side opposite to the first mold to peel off the unnecessary resin from the plunger. After the transfer mechanism peels off the unnecessary resin from the plunger, the mold clamping mechanism opens the first mold and the second mold. After the clamping mechanism opens the first mold and the second mold, the conveying mechanism causes the unnecessary resin adsorption portion to contact the unnecessary resin on the slot block. After the conveying mechanism brings the unnecessary resin adsorption portion into contact with the unnecessary resin on the slot block, the transfer mechanism moves the plunger toward the first mold to peel the unnecessary resin from the slot block, and then the conveying mechanism uses the unnecessary resin adsorption portion to adsorb the unnecessary resin and carry the unnecessary resin out.

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