Substrate holding apparatus and substrate holding method

Abstract

The present application relates to a substrate holding device and a substrate holding method, and provides a substrate holding device and the like capable of suppressing deformation of a substrate. A substrate holding device (100) includes: a substrate holding section (e.g., a first substrate holding section (60)) provided with a suction hole for vacuum-suctioning a substrate (3); a vacuum pipe (110) connected to the suction hole (e.g., a first suction hole (66)); and a control section (2a) that controls suction force via the suction hole by controlling pressure in the vacuum pipe (110). The control section (2a) reduces the suction force via the suction hole in at least one of a case where it is determined, based on a result of acquisition of information related to whether or not the substrate (3) can be carried to a carrying destination by a moving section (64), that the substrate (3) cannot be carried, and a case where a suction time of the substrate (3) held in the substrate holding section reaches a given time.

Description

TECHNICAL FIELD

[0001] The present application relates to a substrate holding apparatus and a substrate holding method. BACKGROUND

[0002] Conventionally, there is a component press-bonding line such as one that performs a plurality of processes including a process of attaching an ACF (Anisotropic Conductive Film) as an anisotropic conductive member to an end portion of a substrate of a display panel such as a liquid crystal panel or an organic EL (Electro Luminescence) panel as an adhesive member, and a process of thermally press-bonding an electronic component such as a drive circuit to the substrate via the ACF.

[0003] In such a component press-bonding line, in order to transport the substrate between a plurality of devices that perform the respective processes, a substrate holding apparatus that holds (supports) the substrate to be transported is used (see, for example, Patent Literature 1).

[0004] PRIOR ART DOCUMENT

[0005] PATENT LITERATURE

[0006] Patent Literature 1: Japanese Patent Application Publication No. 2016-142821 SUMMARY

[0007] PROBLEMS TO BE SOLVED BY THE INVENTION

[0008] The substrate holding apparatus holds and transports the substrate by, for example, vacuum-sucking the substrate. For example, in a case where any one of a plurality of devices in a component mounting line stops due to a failure or the like, the substrate holding apparatus sometimes stops the transport of the substrate in a state of holding the substrate.

[0009] Here, for example, in a case where the substrate is a flexible substrate such as an organic EL panel, if the substrate is continuously held by vacuum-sucking, the substrate sometimes deforms.

[0010] The present application provides a substrate holding apparatus and the like that can suppress deformation of a substrate.

[0011] MEANS FOR SOLVING THE PROBLEMS

[0012] One embodiment of the present invention relates to a substrate holding device comprising: a substrate holding portion, which is provided with an adsorption hole for vacuum adsorption of a substrate; a vacuum piping, which is connected to the adsorption hole; and a control portion, which controls the adsorption force through the adsorption hole by controlling the pressure in the vacuum piping, wherein the control portion reduces the adsorption force in at least one of the following cases: a case where it is determined that the substrate cannot be handed over based on the result of obtaining information related to whether the substrate can be handed over to the conveying destination through a moving portion; and a case where the adsorption time of the substrate held on the substrate holding portion reaches a given time.

[0013] In addition, one embodiment of the present invention relates to a substrate holding method that holds the substrate by causing a substrate holding portion having an adsorption hole for vacuum adsorbing the substrate to vacuum adsorb the substrate, and reduces the adsorption force through the adsorption hole in at least one of (i) a case where it is determined that the substrate cannot be handed over based on the result of obtaining information related to whether the substrate can be handed over to a conveying destination by a moving portion, and (ii) a case where the adsorption time of the substrate held on the substrate holding portion reaches a given time.

[0014] In addition, these general or specific methods can be implemented through systems, methods, integrated circuits, computer programs or storage media such as computer-readable CD-ROMs, or through any combination of systems, methods, integrated circuits, computer programs and storage media.

[0015] Effects of the Invention

[0016] According to the present invention, it is possible to provide a substrate holding device and the like that can suppress deformation of a substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a plan view showing a component mounting line according to the embodiment.

[0018] Figure 2 This is a schematic diagram showing how components are mounted on the component mounting line according to the embodiment.

[0019] Figure 3 This is a block diagram showing the structure of a substrate holding device according to an embodiment.

[0020] Figure 4 It is a cross-sectional view showing a substrate holding portion included in the substrate holding device according to the embodiment.

[0021] Figure 5 This is a schematic configuration diagram for explaining a suction mechanism included in the substrate holding device according to the embodiment.

[0022] Figure 6This is a cross-sectional view for explaining deformation of a substrate caused by vacuum suction performed by a stage included in the substrate holding device according to the embodiment.

[0023] Figure 7 This is a cross-sectional view for explaining deformation of a substrate caused by vacuum suction performed by a transfer arm included in the substrate holding device according to the embodiment.

[0024] Figure 8 This is a flowchart for explaining the processing steps of the substrate holding device according to the embodiment.

[0025] Explanation of symbols

[0026] 1: Component installation line;

[0027] 1a, 1b, 1c: abutment;

[0028] 2: Computer;

[0029] 2a: control unit;

[0030] 2b: storage unit;

[0031] 3: Substrate;

[0032] 4: electrode part;

[0033] 5: components;

[0034] 6: Anisotropic conductive member (ACF);

[0035] 20: attachment part;

[0036] 30: pre-crimping portion;

[0037] 31: Component carrying mechanism;

[0038] 32: Component supply department;

[0039] 40: Formal crimping department;

[0040] 60, 60A, 60B, 60C, 60D: first substrate holding portion;

[0041] 61: mobile base;

[0042] 63: transport arm;

[0043] 64: Mobile unit;

[0044] 65, 73: adsorption pad;

[0045] 66: 1st adsorption hole;

[0046] 70, 70A, 70B, 70C, 70D, 70E: second substrate holding portion;

[0047] 71B, 71C, 71D: stage moving section

[0048] 72, 72A, 72B, 72C, 72D, 72E: stage

[0049] 74: second adsorption hole

[0050] 100: substrate holding device

[0051] 110: vacuum pipe

[0052] 111: first pipe

[0053] 112: second pipe

[0054] 113: third pipe

[0055] 120: valve

[0056] 121: first valve

[0057] 122: second valve

[0058] 130: regulator

[0059] 140: vacuum pump

[0060] 150, 151, 152, 153, 154, 155: contact

[0061] 200: suction mechanism DETAILED DESCRIPTION

[0062] Hereinafter, embodiments of the present application will be described in detail using the drawings. Note that each of the embodiments described below shows one specific example of the present application. Thus, numerical values, shapes, materials, constituent elements, arrangement and connection modes of the constituent elements, steps, and order of the steps and the like shown in the following embodiments are one example, and the gist of the present application is not intended to be limited to them.

[0063] Further, each drawing is a schematic view, and is not necessarily strictly illustrated. Further, in each drawing, the same symbol is sometimes attached to the same structural member, and the description is partially simplified or omitted.

[0064] Further, in the present specification and the drawings, an X axis, a Y axis, and a Z axis represent three axes of a three-dimensional orthogonal coordinate system. The X axis and the Y axis are orthogonal to each other, and are each an axis orthogonal to the Z axis. Further, in the following embodiments, the carrying direction of a substrate is sometimes taken as the positive direction of the X axis, the positive direction of the Z axis is taken as the upward direction, and the negative direction of the Z axis is taken as the downward direction, and thus described.

[0065] (Embodiment)

[0066] [Overall Summary]

[0067] First, refer to Figure 1 as well as Figure 2 , an overall overview of a component installation line including a substrate holding device according to an embodiment is described.

[0068] Figure 1 It is a top view of the component mounting line 1 according to the embodiment. Figure 2 1 is a schematic diagram showing the state of the component installation line 1 according to the embodiment of the present invention. Figure 1 In the figure, the suction mechanism 200 is omitted (see Figure 4 ), the suction mechanism 200 is a mechanism for causing the first substrate holding parts 60A to 60D and the second substrate holding parts 70A to 70E to vacuum-absorb the substrate 3 .

[0069] Component mounting line 1 is a component mounting system used to produce organic EL panels and the like, and thermally compresses component 5, such as a driver circuit, onto substrate 3. Specifically, component mounting line 1 attaches an anisotropic conductive member (ACF) 6 to substrate 3, which has electrode portions 4 formed thereon, and thermally compresses the substrate 3 and component 5 through ACF 6.

[0070] The component mounting line 1 includes an attaching section 20, a preliminary pressing section 30, a final pressing section 40, a substrate holding device 100, and a computer 2. Figure 1 , a computer 2 is shown as a functional block. The computer 2 is connected to the attaching unit 20, the preliminary pressing unit 30, the final pressing unit 40, and the substrate holding device 100 in a manner that enables wireless communication or wired communication via a control line, etc., and controls each device.

[0071] The attaching section 20, the pre-pressing section 30, and the final pressing section 40 are connected in this order. The component mounting line 1 performs component mounting operations, attaching components 5 to a plurality of electrode sections 4. The plurality of electrode sections 4 are provided around the periphery of a rectangular substrate 3, such as an organic EL panel substrate, that has been brought into the attaching section 20 upstream of the substrate 3. While the substrate holding device 100 appropriately transports the substrate 3, the attaching section 20, the pre-pressing section 30, and the final pressing section 40 perform various operations on the substrate 3. Each of the plurality of electrode sections 4 is composed of, for example, a plurality of electrodes.

[0072] The attaching section 20 is a device that performs an attaching operation for attaching the ACF 6 as an adhesive member to the electrode portion 4 of the substrate 3 .

[0073] The attaching section 20 has a plurality of attaching heads arranged in the X-axis direction above the base 1b. In the present embodiment, the attaching section 20 has two attaching heads. Each of the attaching heads has a supply section that supplies the ACF 6 and an attaching tool that attaches the ACF 6 to the substrate 3. The plurality of attaching heads attach the ACF 6 supplied from the supply section to the substrate 3 at positions corresponding to the plurality of electrode sections 4.

[0074] The pre-pressing section 30 is a device that performs a pre-pressing process of mounting the component 5 at the position on the substrate 3 where the ACF 6 is attached by the attaching section 20 and pre-pressing the component 5.

[0075] The pre-pressing section 30 has a component mounting mechanism 31 and a component supply section 32.

[0076] The component mounting mechanism 31 is provided on the base 1b and has a mounting head, a mounting head moving mechanism, and a mounting support table. The mounting head is freely moved in the horizontal plane by the mounting head moving mechanism and is raised and lowered in the Z-axis direction to pick up the component 5 supplied from the component supply section 32 from above. The component mounting mechanism 31 mounts the picked-up component 5 on the ACF 6 and presses the component 5 and the substrate 3 together on the mounting support table, thereby pre-pressing the component 5 to the substrate 3.

[0077] The component supply section 32 is a mechanism that supplies the component 5 to the component mounting mechanism 31.

[0078] The final-pressing section 40 is a device that performs a final-pressing process (i.e., a heat-pressing process) of final-pressing (i.e., heat-pressing) the component 5 pre-pressed by the pre-pressing section 30 to the substrate 3. Thus, the electrode section 4 of the substrate 3 and the component 5 are electrically connected via the ACF 6.

[0079] The substrate carrying device 100 is a device that holds the substrate 3 or holds and carries the substrate 3.

[0080] The substrate carrying device 100 holds the substrate 3 carried into the second substrate holding section 70A by the first substrate holding section 60A and carries it to the second substrate holding section 70B. In the present embodiment, the second substrate holding section 70B is a table on which the substrate 3 to which the ACF 6 is attached by the attaching section 20 is placed.

[0081] Further, the substrate holding device 100 holds the substrate 3 to which the ACF 6 is attached by the first substrate holding section 60B and carries it to the second substrate holding section 70C. In the present embodiment, the second substrate holding section 70C is a table on which the substrate 3 to which the component 5 is pre-pressed by the pre-pressing section 30 is placed.

[0082] The substrate holding device 100 holds the substrate 3 to which the component 5 is temporarily bonded by the first substrate holding portion 60C and transfers it to the second substrate holding portion 70D. In this embodiment, the second substrate holding portion 70D is a stage for placing the substrate 3 to which the component 5 is bonded by the final bonding portion 40.

[0083] Furthermore, the substrate holding device 100 holds the substrate 3 to which the component 5 is permanently pressure-bonded by the first substrate holding portion 60D, and conveys the substrate 3 to the second substrate holding portion 70E.

[0084] In addition, the number of the first substrate holding parts provided in the substrate holding device 100 is not particularly limited. The substrate holding device 100 may include one or a plurality of first substrate holding parts.

[0085] In addition, the number of the second substrate holding parts included in the substrate holding device 100 is not particularly limited. The substrate holding device 100 may include one or a plurality of second substrate holding parts.

[0086] Furthermore, conveying (carrying in) the substrate 3 to the second substrate holding portion 70B is also referred to as conveying (carrying in) the substrate 3 to the attaching portion 20. Furthermore, conveying (carrying in) the substrate 3 to the second substrate holding portion 70C is also referred to as conveying (carrying in) the substrate 3 to the preliminary pressing portion 30. Furthermore, conveying (carrying in) the substrate 3 to the second substrate holding portion 70D is also referred to as conveying (carrying in) the substrate 3 to the final pressing portion 40.

[0087] The specific structure of the substrate holding device 100 will be described later.

[0088] The computer 2 is a control device (computer) for controlling the operation of each device in the component mounting line 1, including the substrate holding device 100. Specifically, the computer 2 is implemented by a communication interface for communicating with the attaching unit 20, the preliminary crimping unit 30, the final crimping unit 40, and the substrate holding device 100, a non-volatile memory storing a program, a volatile memory serving as a temporary storage area for executing the program, an input / output port for transmitting and receiving signals, and a processor for executing the program.

[0089] The computer 2 controls the attaching section 20, the pre-pressing section 30, the official pressing section 40, and the substrate holding device 100, thereby causing each work section (the attaching section 20, the pre-pressing section 30, and the official pressing section 40) to perform each work on the substrate 3, and causes the substrate holding device 100 to perform a substrate carrying work of carrying the substrate 3 to the work tables 72B, 72C, 72D disposed in the vicinity of the work sections in order for each work section to perform each work. For example, the substrate holding device 100 carries the substrate 3 placed on the work table 72A to the work table 72B by the first substrate holding section 60A, and carries the substrate 3 on which the attaching work has been completed to the work table 72C by the first substrate holding section 60B. Further, for example, the substrate holding device 100 carries the substrate 3 on which the pre-pressing work has been completed to the work table 72D by the first substrate holding section 60C, and carries the substrate 3 on which the official pressing work has been completed to the work table 72E by the first substrate holding section 60D. The carrying of the substrate 3 from the upstream side to the downstream side in the substrate carrying work is performed by each work section and the substrate holding device 100 in synchronization.

[0090] [Structure of substrate holding device]

[0091] Next, the specific structure of the substrate holding device 100 will be described.

[0092] Figure 3 is a block diagram showing the structure of the substrate holding device 100 to which the embodiment is related. Figure 4 is a cross-sectional view showing a substrate holding section (the first substrate holding section 60 and the second substrate holding section 70) that the substrate holding device 100 according to the embodiment is provided with. The first substrate holding section 60 and the second substrate holding section 70 are each an example of the substrate holding section that the substrate holding device 100 is provided with.

[0093] In addition, in Figure 3 , a substrate holding section that holds and carries the substrate 3 by vacuum suction as the first substrate holding section 60A, 60B, 60C, 60D is shown as the first substrate holding section 60. Further, in Figure 3 , a substrate holding section that holds the substrate 3 placed by vacuum suction as the second substrate holding section 70A, 70B, 70C, 70D, 70E is shown as the second substrate holding section 70. Further, Figure 4 The hollow arrows shown in

[0094] Figure 1The first substrate holders 60A, 60B, 60C, and 60D shown in the figure have the same structure. Furthermore, the second substrate holder 70A has the same structure as the second substrate holder 70E. Furthermore, the second substrate holders 70B, 70C, and 70D each have a stage moving portion 71B, 71C, and 71D in addition to the structure of the second substrate holder 70A.

[0095] The table moving parts 71B, 71C, and 71D are mechanisms for moving the tables 72B, 72C, and 72D in the X-axis direction, the Y-axis direction, and the Z-axis direction, or rotating the tables 72B, 72C, and 72D around the Z-axis. The table moving parts 71B, 71C, and 71D are implemented, for example, by guide members and motors.

[0096] In addition, each of the second substrate holding portion 70A and the second substrate holding portion 70E may or may not include a stage moving portion for moving the stages 72A and 72E in the X-axis direction, the Y-axis direction, and the Z-axis direction or rotating them around the Z-axis.

[0097] like Figure 3 As shown, the substrate holding device 100 includes a moving base 61 , a first substrate holding portion 60 , a second substrate holding portion 70 , a suction mechanism 200 , and a computer 2 .

[0098] The moving base 61 is a rail extending in the X-axis direction across the base 1 a , the base 1 b , and the base 1 c and for moving the first substrate holding part 60 in the X-axis direction.

[0099] The first substrate holding unit 60 is a mechanism for holding and conveying the substrate 3 by vacuum adsorption. The first substrate holding unit 60 includes a conveying arm 63 and a moving unit 64.

[0100] The transport arm 63 is an arm for holding the substrate 3 by vacuum suction. Specifically, the first substrate holding portion 60 holds the upper surface of the substrate 3 by vacuum suction through the first suction holes 66. The transport arm 63 extends in the Y-axis direction, has a suction cup 65 at one end, and is connected to the moving portion 64 at the other end.

[0101] The suction pad 65 is a suction portion that comes into contact with the substrate 3 when the transport arm 63 holds the substrate 3. The suction pad 65 is an elastic member such as rubber. The suction pad 65 is provided with a first suction hole 66.

[0102] The first suction holes 66 are holes used by the transport arm 63 to vacuum-suction and hold the substrate 3. The first suction holes 66 are hollow spaces formed inside the transport arm 63 and communicate with a cavity connected to the vacuum pipe 110. The transport arm 63 holds the substrate 3 by vacuum-suctioning through the first suction holes 66.

[0103] The moving section 64 is a driving mechanism for moving the carrying arm 63. The moving section 64 is connected to the carrying arm 63 and is movably installed to the moving base 61. The moving section 64 includes, for example, a motor, a gear, and the like.

[0104] The 2nd substrate holding section 70 is a stage for holding the substrate 3 by vacuum suction. The 2nd substrate holding section 70 includes a work table 72.

[0105] The work table 72 is a stage on which the substrate 3 is placed. Specifically, the work table 72 is provided with, for example, a 2nd suction hole 74 on the upper surface, in other words, the 2nd suction hole 74 is provided on the upper surface, and the substrate 3 placed on the upper surface is held by vacuum suction through the 2nd suction hole 74. In the present embodiment, the 2nd suction hole 74 is provided so as to penetrate the work table 72 from the upper surface to the lower surface in the work table 72. In addition, it is not necessary that one end of the 2nd suction hole 74 is provided on the upper surface of the work table 72 and the other end is the lower surface. The work table 72 has a suction pad 73 as a protruding portion on the upper surface.

[0106] The suction pad 73 is a suction portion that comes into contact with the substrate 3 when the substrate 3 is placed on the work table 72. In addition, the suction pad 73 is a protruding portion formed on the work table 72 so as to protrude from the upper surface of the work table 72. The suction pad 73 is, for example, an elastic member such as rubber. In the present embodiment, the 2nd suction hole 74 is provided, in other words, formed, in the suction pad 73.

[0107] In addition, in the present embodiment, the work table 72 has the suction pad 73 as a protruding portion on the upper surface. Specifically, the work table 72 has a flat portion whose upper surface is flat and the suction pad 73 which is a separate member from the flat portion, but is not limited thereto. For example, the work table 72 can have a flat portion and a protruding portion which is formed by protruding a part of the flat portion and is formed integrally with the flat portion from the same member.

[0108] The 2nd suction hole 74 is a hole for vacuum suction of the substrate 3 by the work table 72 for holding. The 2nd suction hole 74 is a through hole that penetrates from the upper surface to the lower surface of the work table 72, and communicates with the through hole that communicates with the vacuum pipe 110. The work table 72 holds the substrate 3 by vacuum suction through the 2nd suction hole 74.

[0109] The 1st substrate holding section 60 and the 2nd substrate holding section 70 are disposed in a region (a region on the negative side of the Y-axis) in front of the attaching section 20, the pre-pressing section 30, and the formal pressing section 40.

[0110] The vacuum pipe 110 is a pipe for vacuum-adsorbing the substrate 3 via the first adsorption hole 66 or the second adsorption hole 74 to hold the substrate 3 in the first substrate holding section 60 or the second substrate holding section 70. The vacuum pipe 110 is connected at one end to be in communication with the first adsorption hole 66 and the second adsorption hole 74, and connected at the other end to be in communication with the vacuum pump 140, for example. The pressure (air pressure) inside the vacuum pipe 110 is reduced by the vacuum pump 140, whereby the first substrate holding section 60 vacuum-adsorbs the substrate 3 via the first adsorption hole 66, and the second substrate holding section 70 vacuum-adsorbs the substrate 3 via the second adsorption hole 74.

[0111] The suction mechanism 200 is a mechanism for vacuum-adsorbing the substrate 3 by the first substrate holding sections 60A to 60D and the second substrate holding sections 70A to 70E. The suction mechanism 200 is provided with the vacuum pipe 110, the valve 120, the regulator 130, and the vacuum pump 140.

[0112] The valve 120 is a solenoid valve for switching whether or not the first substrate holding section 60 vacuum-adsorbs the substrate 3, and is a solenoid valve for switching whether or not the second substrate holding section 70 vacuum-adsorbs the substrate 3. The control section 2a is connected to the valve 120 by a control line or the like so as to be able to control the valve 120, and switches whether or not the first substrate holding section 60 vacuum-adsorbs the substrate 3 and switches whether or not the second substrate holding section 70 vacuum-adsorbs the substrate 3 by controlling the valve 120.

[0113] The regulator 130 is a pressure regulator (valve) for adjusting the adsorption force when the substrate 3 is vacuum-adsorbed by the vacuum pump 140 via the first adsorption hole 66 or the second adsorption hole 74.

[0114] The vacuum pump 140 is a pump for vacuum-adsorbing the substrate 3 via the first adsorption hole 66 or the second adsorption hole 74.

[0115] Figure 5 is a schematic configuration view for describing the suction mechanism 200 provided in the substrate holding apparatus 100 according to the embodiment. In Figure 5 , a schematic view of a structure for vacuum-adsorbing the substrate 3 by the table 72 is shown. Further, Figure 5 The hollow arrows shown in the drawing show the direction of suction by the vacuum pump 140.

[0116] The vacuum pipe 110 is provided with a first pipe 111, a second pipe 112, and a third pipe 113, for example.

[0117] The first pipe 111 is connected at one end to the vacuum pump 140, and divided at the other end into two, and one of the two end portions is directly connected to the first valve 121, and the other of the two end portions is a vacuum pipe connected to the first valve 121 via the regulator 130.

[0118] The second pipe 112 is a vacuum pipe having one end connected to the first valve 121 and the other end connected to the second valve 122.

[0119] The third pipe 113 is a vacuum pipe having one end connected to the second valve 122 and the other end connected to the stage 72 (more specifically, the second suction hole 74 provided in the second adsorption pad 73 possessed by the stage 72).

[0120] Further, for example, the valve 120 is provided with the first valve 121 and the second valve 122.

[0121] The first valve 121 and the second valve 122 are solenoid valves whose connection target (in other words, the suction path based on the vacuum pump 140) at one end can be switched.

[0122] For example, the contact 151 and the contact 152 of the first valve 121 are connected to the first pipe 111 divided into two, and one contact 151 at one end is connected to the vacuum pump 140 via the first pipe 111 and without passing through the regulator 130, and the other contact 152 at one end is connected to the vacuum pump 140 via the first pipe 111 and the regulator 130. Further, the contact 150 at the other end of the first valve 121 is connected to the contact 153 at one end of the second valve 122 via the second pipe 112. Thereby, the first valve 121 is used to switch the path in which the suction force is stronger (higher) in which the pressure (air pressure) inside the first pipe 111 is directly reduced by the vacuum pump 140, and the path in which the suction force is weaker (lower) in which the pressure inside the first pipe is reduced under control by the regulator 130.

[0123] For example, the contact 154 at the other end of the second valve 122 is connected to the stage 72 via the third pipe 113, and the other contact 155 at one end is not connected to anything. Further, the contact 153 at one end of the second valve 122 is connected to the first valve 121 via the second pipe 112. Thereby, the second valve 122 is used to switch the path in which the pressure inside the third pipe 113 is reduced and the path in which the pressure inside the third pipe 113 is not reduced. That is, by controlling the second valve 122, the opening and closing of vacuum adsorbing the substrate 3 to the stage 72 is switched.

[0124] In addition, in the present embodiment, the first valve 121 and the second valve 122 are provided as the valve 120, but the present embodiment is not limited thereto. Figures 3 to 5In the embodiment, only one vacuum piping 110, valve 120, regulator 130, and vacuum pump 140 are illustrated, but the substrate holding device 100 can also be provided with a plurality of these structures connected to any one of the stages 72A to 72E. Further, although not illustrated, the substrate holding device 100 is also provided with these structures connected to the carrying arm 63. Further, the substrate holding device 100 can also be provided with a plurality of these structures connected to any one of a plurality of carrying arms 63, for example, in a case where a plurality of carrying arms 63 are provided as the first substrate holding sections 60A to 60D. In addition, even in such a case, a part of the constituent elements such as the vacuum pump 140 can be one (common).

[0125] According to the above-described structure, the first state in which the substrate 3 is vacuum-sucked by the first suction force, the second state in which the substrate 3 is vacuum-sucked by the second suction force weaker than the first suction force by the regulator 130, and the third state in which the substrate 3 is not vacuum-sucked can be switched among the carrying arm 63 and the stage 72.

[0126] Figure 6 is a cross-sectional view for explaining deformation of the substrate 3 caused by vacuum-sucking by the stage 72 provided in the substrate holding device 100 according to the embodiment. Figure 7 is a cross-sectional view for explaining deformation of the substrate 3 caused by vacuum-sucking by the carrying arm 63 provided in the substrate holding device 100 according to the embodiment.

[0127] In addition, Figure 6 is a cross-sectional view for explaining deformation of the substrate 3 caused by vacuum-sucking by the stage 72 provided in the substrate holding device 100 according to the embodiment. Figure 4 is a cross-sectional view of an area surrounded by the broken line VI in Figure 7 is a cross-sectional view for explaining deformation of the substrate 3 caused by vacuum-sucking by the carrying arm 63 provided in the substrate holding device 100 according to the embodiment. Figure 4 is a cross-sectional view of an area surrounded by the broken line VI in Figure 6 and Figure 7 indicated by the hollow arrows indicate directions in which the substrate 3 is sucked.

[0128] As the substrate 3, for example, a substrate having flexibility such as an organic EL panel can be assumed. That is, the first substrate holding section 60 and the second substrate holding section 70 hold the substrate 3 having flexibility by vacuum-sucking, for example. In this case, for example, the substrate 3 is deformed if the substrate 3 is vacuum-sucked by the carrying arm 63 or the stage 72.

[0129] Generally, even if the substrate is held and carried by vacuum suction, the shape of the deformed substrate returns to the original shape. However, for example, in the case of emergency stop such as the formal press bonding portion due to the poor operation and the like, the substrate is vacuum-sucked by the carrying arm or the table for a long time without being carried at the usual pace. In this case, with respect to the substrate, the shape of the substrate deformed by the vacuum suction does not return to the original shape in some cases.

[0130] Therefore, the substrate holding device 100 switches, in each of the carrying arm 63 and the table 72, the first state in which the substrate 3 is vacuum-sucked by the first suction force and the second state in which the substrate 3 is vacuum-sucked by the second suction force weaker than the first suction force, by the regulator 130, at an appropriate timing by the computer 2 (more specifically, the control section 2a described later), thereby suppressing the deformation of the substrate 3.

[0131] Further, with respect to the first suction force and the second suction force described above, it is not particularly limited as long as the second suction force is lower (weaker) than the first suction force. For example, the second suction force is 1 / 2 or less of the first suction force. For example, the first suction force is about -70 kPa, and the second suction force is about -30 kPa.

[0132] Referring again to Figure 3 , the computer 2 is a computer for controlling each constituent element of the substrate holding device 100. In addition, in the present embodiment, the case where the computer 2 possessed by the component mounting line 1 is explained. For example, the computer 2 that controls each constituent element of the substrate holding device 100 can be the same as or different from the computer that controls each device other than the substrate holding device 100, such as the attaching portion 20, the pre-press bonding portion 30, and the like, possessed by the component mounting line 1.

[0133] For example, the computer 2 has a control section 2a and a storage section 2b.

[0134] The control section 2a is for controlling the attaching portion 20, the pre-press bonding portion 30, the formal press bonding portion 40, and the processing portion of the substrate holding device 100. The control section 2a is realized by, for example, a control program stored in the storage section 2b for controlling each device possessed by the component mounting line 1 and a CPU (Central Processing Unit) that executes the control program. In addition, the control section 2a can be realized by a dedicated electronic circuit. The control section 2a is communicably connected to the substrate holding device 100, for example, via a communication interface possessed by the computer 2.

[0135] Furthermore, the control unit 2a controls the suction force through the first suction holes 66 and the second suction holes 74 by controlling the pressure within the vacuum pipe 110. Specifically, the control unit 2a controls the air pressure within the vacuum pipe 110 by controlling the valve 120, thereby controlling the suction force of the transport arm 63 through the first suction holes 66 and the suction force of the worktable 72 through the second suction holes 74. When the first substrate holder 60 cannot transport the substrate 3 held by the first substrate holder 60 or the second substrate holder 70, the control unit 2a reduces the suction force of the vacuum suction of the first substrate holder 60 or the second substrate holder 70 that holds the substrate 3. Specifically, when the first substrate holder 60 cannot transport (hand over) the substrate 3 held by the first substrate holder 60 to the second substrate holder 70, the control unit 2a reduces the suction force of the first substrate holder 60 that holds the substrate 3. Alternatively, when the substrate 3 held by the second substrate holding portion 70 cannot be transferred to the first substrate holding portion 60 for transport by the first substrate holding portion 60 , the control portion 2 a reduces the vacuum suction force of the second substrate holding portion 70 holding the substrate 3 .

[0136] Here, the state where the substrate 3 cannot be transported (delivered) by the first substrate holding portion 60 is, for example, a state where the first substrate holding portion 60 holds the substrate 3 and the second substrate holding portion 70 at the transport destination still places the substrate 3.

[0137] For example, when the attaching section 20 stops due to malfunction, etc., the first substrate, as an example of substrate 3, may be placed directly on the workbench 72B without the ACF 6 attached to it. In this case, for example, when the first substrate holding section 60A holds the second substrate, as another example of substrate 3, the second substrate cannot be transported (handed over) to the workbench 72B, and thus the workbench 72B is kept in standby mode while holding the second substrate. In this case, the first substrate held on the workbench 72B cannot complete the operation performed by the attaching section 20, so the first substrate holding section 60B cannot receive the first substrate from the second substrate holding section 70B and transport (hand over) it to the second substrate holding section 70C. For example, this state is a state in which the substrate 3 held by the first substrate holding section 60 or the second substrate holding section 70 cannot be transported (handed over) by the first substrate holding section 60.

[0138] For example, when the attaching section 20, the pre-pressing section 30, and the final pressing section 40 complete the attaching, pre-pressing, or final pressing operation on the substrate 3, information indicating the completion of the operation (start information) is transmitted to the computer 2. For example, upon receiving (acquiring) this information, the control section 2a controls the substrate holding device 100 to start transporting the substrate 3 that has completed the operation. On the other hand, if, for example, the control section 2a does not acquire this information within a predetermined time, it determines that the first substrate holding section 60 cannot transport (hand over) the substrate 3 to the second substrate holding section 70 at the destination.

[0139] The predetermined time can be arbitrarily determined and is not particularly limited. The control unit 2a may include a timing unit such as an RTC (Real Time Clock) for measuring time.

[0140] Alternatively, the attaching section 20, the pre-pressing section 30, and the formal pressing section 40 may each include a cover (not shown) that covers each device and can be opened and closed at will by the operator. In this case, for example, the attaching section 20, the pre-pressing section 30, and the formal pressing section 40 may each include a sensor that detects whether the cover is opened. When the control section 2a detects that the cover is opened through the sensor, it stops part of the actions performed by the attaching section 20, the pre-pressing section 30, and the formal pressing section 40 for safety reasons. In this case, when the first substrate holding section 60 and the second substrate holding section 70 hold the substrate 3 by vacuum adsorption, the control section 2a, for example, does not cause the attaching section 20, the pre-pressing section 30, and the formal pressing section 40 to perform operations such as attaching, pre-pressing, or formal pressing, but maintains the state of the first substrate holding section 60 or the second substrate holding section 70 holding the substrate 3. Thus, for example, when the control unit 2a acquires information (stop information) from the above-mentioned sensor, it determines that the first substrate holding unit 60 cannot transfer (deliver) the substrate 3 to the second substrate holding unit 70 located at the transfer destination.

[0141] Alternatively, the control unit 2a may not determine whether the substrate 3 can be transferred based on the result of obtaining the above-mentioned information, but may reduce the suction force when a given time has passed since the first substrate holding unit 60 or the second substrate holding unit 70 was holding the substrate 3, that is, when the suction time has reached the given time. For example, the operation time of the operation performed by the attaching unit 20, the pre-pressing unit 30, and the main pressing unit 40 on one substrate 3 is already determined to some extent. Therefore, for example, if the control unit 2a cannot obtain the above-mentioned start information within the given time, it may determine that the operation on the substrate 3 has not been properly performed, that is, the state in which the substrate 3 can be transferred is not possible. Therefore, the control unit 2a may also determine that the substrate 3 cannot be transferred when a given time has passed since the first substrate holding unit 60 or the second substrate holding unit 70 was holding the substrate 3, that is, when the suction time has reached the given time, and reduce the suction force.

[0142] Thus, for example, if the control unit 2a determines that the first substrate holding unit 60 cannot transfer the substrate 3 to the second substrate holding unit 70 located at the transfer destination of the working unit, such as the attaching unit 20, based on the information obtained from the working unit 20 and information indicating whether the substrate 3 can be transferred, such as the holding time of the substrate 3, the control unit 2a reduces the suction force of the vacuum suction of the first substrate holding unit 60 or the second substrate holding unit 70 holding the substrate 3. For example, the control unit 2a reduces the suction force in at least one of the following situations: (i) if the control unit 2a determines that the substrate 3 cannot be transferred based on the information obtained regarding whether the moving unit 64 can transfer the substrate 3 to the transfer destination (e.g., the start information and stop information described above), or (ii) if the suction time of the substrate 3 held by the substrate holding unit reaches a predetermined time. This information is obtained, for example, from the sensor described above. To obtain this information, the computer 2 includes, for example, an acquisition unit implemented by a communication interface such as the input / output port described above.

[0143] Furthermore, for example, if the control unit 2a determines that the substrate 3 cannot be transferred by the transport arm 63, the control unit 2a stops the movement of the transport arm 63 by the moving unit 64 after the transport arm 63 has held the substrate 3 for a predetermined period of time, and then reduces the suction force. For example, if the control unit 2a cannot transfer the substrate 3 held by the first substrate holding unit 60 to the second substrate holding unit 70, the control unit 2a stops the movement of the transport arm 63 by the moving unit 64, and then reduces the suction force by the first suction holes 66.

[0144] Furthermore, the control unit 2a stops the movement of the transport arm 63 by the moving unit 64. For example, the control unit 2a stops the movement of the transport arm 63 when, during the period when the transport arm 63 is being moved by the moving unit 64, the control unit 2a determines that the substrate 3 cannot be transferred by the transport arm 63 or that the substrate 3 has been held by the transport arm 63 for a predetermined time. Alternatively, the control unit 2a stops the movement of the transport arm 63 by the moving unit 64. For example, the control unit 2a keeps the transport arm 63 stopped without moving the transport arm 63 and when, during the period when the transport arm 63 is being moved by the moving unit 64, the control unit 2a determines that the substrate 3 cannot be transferred by the transport arm 63 or that the substrate 3 has been held by the transport arm 63 for a predetermined time.

[0145] In addition, the control unit 2a may stop the movement of the transport arm 63 by the moving unit 64 when it is determined that the transport arm 63 cannot transfer the substrate 3, and further reduce the suction force when the suction time of the transport arm 63 on the substrate 3 reaches a predetermined time.

[0146] In addition, the suction force in the first substrate holding part 60 and the suction force in the second substrate holding part 70 may be the same or different.

[0147] The storage unit 2b stores various data required for component mounting operations, such as the dimensions of substrates 3, such as liquid crystal panel substrates, manufactured by the component mounting line 1; the types, mounting positions, and mounting directions of components 5 to be mounted on the substrates 3; and the timing for transporting the substrates 3 between various workstations; as well as control programs executed by the control unit 2a. The storage unit 2b is implemented using ROM (Read Only Memory) and RAM (Random Access Memory), etc.

[0148] [Processing steps]

[0149] Next, the specific operation of the substrate holding device 100 will be described.

[0150] Figure 8 1 is a flowchart for explaining the processing steps of the substrate holding device 100 according to the embodiment. Figure 8 In Figure 1 The case where the first substrate holding portion 60A shown holds the substrate 3 held by the second substrate holding portion 70A and transfers the held substrate 3 to the second substrate holding portion 70B will be described as an example.

[0151] First, the control unit 2a controls the moving unit 64 and the valve 120 to cause the first substrate holding unit 60A to hold the substrate 3 held by the second substrate holding unit 70A by vacuum suction (step S101). For example, the control unit 2a controls the first valve 121 so as not to connect the vacuum pump 140 to the first substrate holding unit 60A via the regulator 130.

[0152] Next, the control unit 2 a moves the first substrate holding unit 60A holding the substrate 3 toward a transfer position for transferring the substrate 3 to the second substrate holding unit 70B (step S102 ).

[0153] Next, the control unit 2a determines whether the substrate 3 can be transferred to the second substrate holding unit 70B (step S103). As described above, for example, the control unit 2a determines whether the first substrate holding unit 60A can transfer the substrate 3 to the second substrate holding unit 70B based on the result of obtaining information regarding whether the substrate 3 can be transferred to the second substrate holding unit 70B by the moving unit 64. For example, if the control unit 2a does not receive the above-mentioned start information from the attaching unit 20 within a predetermined arbitrary time period after the first substrate holding unit 60A is placed to hold the substrate 3, the control unit 2a determines that the substrate 3 cannot be transferred from the first substrate holding unit 60A to the second substrate holding unit 70B, which is the transfer destination. Alternatively, if the control unit 2a receives the above-mentioned stop information from the attaching unit 20, the control unit 2a determines that the substrate 3 cannot be transferred from the first substrate holding unit 60A to the second substrate holding unit 70B, which is the transfer destination.

[0154] Next, when the control unit 2a determines that the substrate 3 can be transferred to the second substrate holding unit 70B (Yes in step S103), it causes the first substrate holding unit 60A moved to the transfer position to transfer the substrate 3 to the second substrate holding unit 70B (step S108).

[0155] On the other hand, if the control unit 2a determines that the substrate 3 cannot be transferred to the second substrate holding unit 70B (No in step S103), the first substrate holding unit 60A does not transfer the substrate 3. In other words, the first substrate holding unit 60A does not transfer the held substrate 3 to the second substrate holding unit 70B and continues to hold the substrate 3.

[0156] Next, the control unit 2a determines whether a predetermined time has elapsed since the first substrate holding unit 60A was caused to hold the substrate 3 by vacuum suction (step S104). Specifically, the control unit 2a determines whether the suction time, which is the time during which the first substrate holding unit 60A was caused to hold the substrate 3 by vacuum suction, has reached a predetermined time.

[0157] The control section 2a returns the process to step S103 in a case where it is determined that the given time has not elapsed since the first substrate holding section 60A started holding the substrate by vacuum suction (NO in step S104).

[0158] On the other hand, the control section 2a reduces the suction force of the substrate 3 held by the first substrate holding section 60A by controlling the valve 120 (step S105) in a case where it is determined that the given time has elapsed since the first substrate holding section 60A started holding the substrate by vacuum suction (YES in step S104). For example, the control section 2a controls the first valve 121 so as to connect the vacuum pump 140 and the first substrate holding section 60 without passing through the regulator 130. Specifically, the control section 2a controls the valve 120 so as to switch from a first state in which the substrate 3 is vacuum-sucked by the carrying arm 63 with a first suction force to a second state in which the substrate 3 is vacuum-sucked by the carrying arm 63 with a second suction force weaker than the first suction force.

[0159] In this way, the control section 2a continues vacuum-suction of the substrate 3 by the carrying arm 63 with the first suction force in a case where it is determined that the given time has not elapsed, for example, and reduces the suction force in a case where it is determined that the given time has elapsed.

[0160] In addition, the control section 2a can not perform the process of step S104. For example, the control section 2a can reduce the suction force without performing step S104 (step S105) in a case where it is NO in step S103.

[0161] Further, the control section 2a can not perform step S102. In this case, for example, the control section 2a can start moving the first substrate holding section 60A holding the substrate 3 toward the handover position for handing over the substrate 3 to the second substrate holding section 70B, that is, moving the carrying arm 63 by the moving section 64, in a case where it is YES in step S103.

[0162] Next, the control section 2a determines whether or not it is possible to hand over the substrate 3 to the second substrate holding section 70B (step S106). For example, the control section 2a determines on the basis of the acquisition result of the signal from the attaching section 20 as in step S102.

[0163] The control section 2a repeats the determination of step S106 in a case where it is determined that it is not possible to hand over the substrate 3 to the second substrate holding section 70B (NO in step S106). That is, the control section 2a causes the first substrate holding section 60A to continue standby in a state of holding the substrate 3 without moving until it is determined that it is possible to hand over the substrate 3 to the second substrate holding section 70B.

[0164] On the other hand, if the control unit 2a determines that the substrate 3 can be transferred to the second substrate holding portion 70B (Yes in step S106), the control unit 2a returns the suction force to the original state (step S107). Specifically, the control unit 2a controls the valve 120 to change the suction force of the vacuum suction of the first substrate holding portion 60 holding the substrate 3 from the second suction force to the first suction force.

[0165] Next, the control unit 2 a causes the first substrate holding unit 60A moved to the handover position to hand over the substrate 3 to the second substrate holding unit 70B (step S108 ).

[0166] Alternatively, the control unit 2a may not execute steps S102 and S103. Thus, the control unit 2a can determine whether to reduce the suction force based on whether the first substrate holding unit 60 has held the substrate 3 for a predetermined time, regardless of the result of acquiring the signal from the attaching unit 20 or other working units, as determined in step S104.

[0167] Furthermore, in step S101, the substrate 3 may be held by the second substrate holding portion 70A by vacuum suction, rather than by the first substrate holding portion 60A. In this case, for example, in step S105, the control unit 2a reduces the suction force of the second substrate holding portion 70A. Furthermore, in this case, for example, in step S108, the control unit 2a controls the moving portion 64 and the valve 120 to transfer the substrate 3 from the second substrate holding portion 70A to the first substrate holding portion 60A. Thereafter, the control unit 2a controls the moving portion 64 to move the transport arm 63, thereby transporting the substrate 3 to the first substrate holding portion 60A.

[0168] [Effects, etc.]

[0169] As described above, the substrate holding device 100 according to the embodiment includes a substrate holding portion having suction holes for vacuum suction of a substrate 3, a vacuum pipe 110 connected to the suction holes, and a control unit 2a that controls the suction force through the suction holes by controlling the pressure within the vacuum pipe 110. The control unit 2a reduces the suction force in at least one of the following situations: (i) when the moving unit 64 determines that the substrate 3 cannot be transferred to the destination, based on the result of obtaining information regarding whether the substrate 3 can be transferred to the destination; and (ii) when the suction time of the substrate 3 held on the substrate holding portion reaches a predetermined time. In this embodiment, the control unit 2a controls the suction mechanism 200 to reduce the suction force of the first substrate holding portion 60, which holds the substrate 3 by vacuum suction through the first suction holes 66, in at least one of the above situations (i) and (ii). Alternatively, the control unit 2a controls the suction mechanism 200 to reduce the suction force of the second substrate holding portion 70, which holds the substrate 3 by vacuum suction through the second suction holes 74, in at least one of the above situations (i) and (ii).

[0170] Thus, when the substrate holding portion (the first substrate holding portion 60 or the second substrate holding portion 70 ) must continue to hold the substrate 3 , the substrate holding device 100 can suppress deformation of the substrate 3 caused by vacuum adsorption by reducing the adsorption force.

[0171] Furthermore, for example, the second substrate holding portion 70 includes a stage 72 having second suction holes 74 on its upper surface, and holds the substrate 3 placed on the upper surface by vacuum suction through the second suction holes 74 .

[0172] Thus, in the stage 72 that performs vacuum suction on the substrate 3 placed on the upper surface, deformation of the substrate 3 due to vacuum suction can be suppressed.

[0173] Furthermore, for example, the table 72 includes a protrusion on the upper surface, and the second adsorption holes 74 are provided on the protrusion. In this embodiment, the protrusion is the adsorption pad 73.

[0174] When substrate 3 is placed on a worktable with a flat top surface, such as worktable 72, the contact area between substrate 3 and worktable 72 is large, and the possibility of damage to substrate 3 is high. Therefore, a protrusion (adsorption pad 73) is provided on the top surface of worktable 72. Since substrate 3 is supported by the protrusion, the possibility of damage to substrate 3 is reduced compared to a case where substrate 3 is placed directly on the top surface of worktable 72 without the protrusion.

[0175] Furthermore, for example, the first substrate holding section 60 includes a transport arm 63 , and the transport arm 63 holds the upper surface of the substrate 3 by vacuum suction through the first suction holes 66 .

[0176] For example, when the first substrate holding portion 60 includes a transport arm 63 as a structure for holding the substrate 3, a device for transporting the substrate 3 may employ a transport arm 63 that vacuum-suctions the upper surface of the substrate 3 to hold the substrate 3. In such a case, the substrate holding device 100 is particularly effective because it can suppress deformation of the substrate 3 due to vacuum suction.

[0177] Furthermore, for example, the substrate holding device 100 further includes a moving unit 64 that moves the transport arm 63. In this case, for example, if the control unit 2a determines that the substrate 3 cannot be transferred by the transport arm 63, it stops the movement of the transport arm 63 by the moving unit 64 after the transport arm 63 has held the substrate 3 for a predetermined time, and then reduces the vacuum suction force on the substrate 3 through the first suction holes 66.

[0178] Typically, when the transport arm 63 is performing vacuum suction to hold the substrate 3, the suction force is pre-set to enable it to continue holding the substrate 3 even when the transport arm 63 moves. On the other hand, if the transport arm 63 is not moving, the substrate 3 can be held even if the suction force is low, compared to when the transport arm 63 is moving (more specifically, when the transport arm 63 starts moving while stopped or stops while moving). Therefore, when the control unit 2a moves the transport arm 63, it stops the movement and then reduces the suction force. This allows the transport arm 63 to continue holding the substrate 3 even if the suction force is reduced.

[0179] In addition, for example, when the control unit 2a determines that the substrate 3 cannot be transferred through the conveying arm 63, the control unit 2a stops the movement of the conveying arm 63 by the moving unit 64, and then when the adsorption time of the conveying arm 63 on the substrate 3 reaches a given time, the adsorption force of the substrate 3 by the vacuum adsorption through the first adsorption hole 66 is reduced.

[0180] Thus, when the control unit 2a temporarily stops the movement of the transport arm 63 and then immediately moves the transport arm 63 again, the adsorption force can be changed at an appropriate timing without continuously changing the adsorption force such as restoring the adsorption force to its original state immediately after weakening the adsorption force.

[0181] In addition, for example, the substrate holding portion holds the flexible substrate 3 by vacuum suction. That is, the substrate 3 has flexibility, for example.

[0182] Substrate 3 may be a flexible substrate, such as an organic EL panel, rather than a rigid substrate, such as a liquid crystal panel. Flexible substrates 3 are easily deformed by vacuum suction. Therefore, when flexible substrates 3 are used, the substrate holding device 100 is particularly effective when holding the substrate 3 by vacuum suction.

[0183] In addition, the substrate holding method involved in the embodiment holds the substrate 3 by causing a substrate holding portion having an adsorption hole for vacuum adsorbing the substrate 3 to vacuum adsorb the substrate 3 (step S101), and reduces the adsorption force through the adsorption hole in at least one of (i) a case where it is determined that the substrate 3 cannot be handed over based on the result of obtaining information related to whether the substrate 3 can be handed over to the conveying destination through the moving portion 64, and (ii) a case where the adsorption time of the substrate 3 held on the substrate holding portion reaches a given time (for example, steps S102 to S104).

[0184] Thus, for example, when the substrate 3 must be continuously held by the first substrate holding portion 60 or the second substrate holding portion 70 , deformation of the substrate 3 caused by vacuum adsorption can be suppressed by reducing the adsorption force.

[0185] (Other embodiments)

[0186] As mentioned above, although the substrate holding device etc. which concern on this embodiment were demonstrated based on the said embodiment, this invention is not limited to the said embodiment.

[0187] For example, in the above-described embodiment, all or part of the components of the computer 2 may be formed by dedicated hardware, or may be implemented by executing software programs suitable for each component. Each component may also be implemented by a program execution unit such as a CPU (Central Processing Unit) or a processor reading and executing a software program stored in a storage medium such as an HDD (Hard Disk Drive) or a semiconductor memory.

[0188] Furthermore, the components of the computer 2 may be constituted by one or more electronic circuits. Each of the one or more electronic circuits may be a general-purpose circuit or a dedicated circuit.

[0189] One or more electronic circuits may include, for example, semiconductor devices, ICs (Integrated Circuits), or LSIs (Large Scale Integrations). ICs or LSIs can be integrated into one chip or multiple chips. Here, they are referred to as ICs or LSIs, but the name may vary depending on the degree of integration and may be referred to as system LSIs, VLSIs (Very Large Scale Integrations), or ULSIs (Ultra Large Scale Integrations). In addition, FPGAs (Field Programmable Gate Arrays) programmed after the LSI is manufactured can also be used for the same purpose.

[0190] In addition, the present invention also includes various modifications that can be conceived by those skilled in the art to the embodiments and embodiments achieved by arbitrarily combining components and functions in the embodiments without departing from the spirit of the present invention.

[0191] Industrial applicability

[0192] The present invention can be used in a substrate holding device for holding and conveying a substrate in a component mounting line for producing a display panel.

Claims

1. A substrate holding device comprising: The substrate holding portion is provided with adsorption holes for vacuum adsorption of the substrate; a vacuum pipe connected to the adsorption hole; and a control unit that controls the adsorption force through the adsorption hole by controlling the pressure in the vacuum pipe, The control unit reduces the suction force in at least one of a case where it is determined based on the result of acquiring information related to whether the substrate can be delivered to the transport destination by the moving unit that the substrate cannot be delivered and a case where the suction time of the substrate held by the substrate holding unit reaches a predetermined time. The substrate holding portion holds the flexible substrate by vacuum suction, and suppresses deformation of the substrate caused by vacuum suction by reducing the suction force.

2. The substrate holding device according to claim 1, wherein: The substrate holding portion includes a stage having the suction holes on an upper surface thereof, and holds the substrate placed on the upper surface by vacuum suction through the suction holes.

3. The substrate holding device according to claim 2, wherein: The workbench has a protrusion on the upper surface, The adsorption hole is provided on the protrusion.

4. The substrate holding device according to claim 1, wherein: The substrate holding portion includes a transport arm configured to hold the substrate by vacuum-adsorbing the upper surface of the substrate through the adsorption holes.

5. The substrate holding device according to claim 4, wherein: The substrate holding device further includes the moving portion for moving the transport arm. When the control unit determines that the substrate cannot be transferred by the transport arm, the control unit stops the movement of the transport arm by the moving unit after the transport arm absorbs the substrate for a predetermined time, and then reduces the absorption force. The substrate holding device according to claim 5 , wherein: When the control unit determines that the transport arm cannot transfer the substrate, the control unit stops the movement of the transport arm by the moving unit, and further reduces the suction force when the transport arm's suction time for the substrate reaches the predetermined time.

7. A substrate holding method, The substrate is held by vacuum-adsorbing the substrate through a substrate holding portion having adsorption holes for vacuum-adsorbing the substrate. reducing the suction force through the suction holes in at least one of (i) a case where it is determined that the substrate cannot be delivered based on a result of acquiring information related to whether the substrate can be delivered to a destination by the moving unit, and (ii) a case where the suction time of the substrate held by the substrate holding unit reaches a predetermined time, The substrate holding portion holds the flexible substrate by vacuum suction, and suppresses deformation of the substrate caused by vacuum suction by reducing the suction force.

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