Water-cooled heat dissipation device and its manufacturing method

Abstract

This invention discloses a water-cooled heat dissipation device comprising a heat-conducting base, a cover, and a metal isolator. The heat-conducting base has a fluid-containing space and multiple heat dissipation fins. These heat dissipation fins are located in the fluid-containing space and protrude from a wall on one side of the fluid-containing space. A flow channel is formed between any two adjacent heat dissipation fins. At least a portion of these heat dissipation fins form a shielding structure on the side away from the wall, which shields at least a portion of the flow channel. The cover has a water inlet and a water outlet. The cover is mounted on the heat-conducting base such that the cover covers the fluid-containing space, and the water inlet and outlet are connected through the fluid-containing space. One side of the metal isolator is welded to the shielding structure, and the other side of the metal isolator is welded to the cover.

Description

Technical Field

[0001] This invention relates to a heat dissipation device and its manufacturing method, particularly a water-cooled heat dissipation device and its manufacturing method. Background Technology

[0002] As the computing power of electronic devices increases, the electronic components inside generate a significant amount of heat during operation. To prevent the operating temperature of these components from exceeding their maximum tolerance, heat sinks are typically installed on them to dissipate the heat. However, since the heat dissipation efficiency of heat sinks is limited per unit time, some manufacturers have replaced them with water-cooling systems, which offer superior heat dissipation performance for electronic components. A water-cooling system generally includes a water block and a radiator. The water block is equipped with a pump. The water block and the radiator are connected and together form a cooling cycle, with the water block driving the flow of the working fluid within the cooling cycle. The water block is installed on heat sources such as the processor and transfers the absorbed heat to the radiator for dissipation.

[0003] The water block currently contains a heat absorption chamber and a heat dissipation fin. The heat absorption chamber is in thermal contact with the heat source to transfer the heat generated by the heat source to the working fluid inside the heat absorption chamber. The heat dissipation fin 120 is located inside the heat absorption chamber to improve the heat conduction rate of heat transfer to the heat absorption chamber. In addition, a rubber baffle is additionally installed inside the heat absorption chamber, and the required cooling flow channels are designed by the position of the perforations in the baffle.

[0004] In addition, the working fluid can generally be changed to a refrigerant that undergoes a phase change in the operating temperature range, so as to improve the heat dissipation effect of the water cooling system through the latent heat of the phase change. However, since the internal pressure of the water cooling head increases during the phase change process, the water cooling head with the original rubber baffle is difficult to withstand. Therefore, how to improve the structural strength of the water cooling head has become a major design issue. Summary of the Invention

[0005] The present invention provides a water-cooled heat dissipation device and its manufacturing method, thereby improving the structural strength of the water cooling head.

[0006] An embodiment of the present invention discloses a water-cooled heat dissipation device comprising a heat-conducting base, a cover, and a metal isolator. The heat-conducting base has a fluid-containing space and a plurality of heat dissipation fins. These heat dissipation fins are located in the fluid-containing space and protrude from a wall surface on one side of the fluid-containing space. A flow channel is formed between any two adjacent heat dissipation fins. At least a portion of the heat dissipation fins on the side away from the wall surface forms a shielding structure, which blocks at least a portion of the flow channel. The cover has a water inlet and a water outlet. The cover is mounted on the heat-conducting base such that the cover covers the fluid-containing space, and the water inlet and outlet are connected through the fluid-containing space. One side of the metal isolator is welded to the shielding structure, and the other side of the metal isolator is welded to the cover.

[0007] Another embodiment of the present invention discloses a method for manufacturing a water-cooled heat dissipation device, comprising the following steps: forming a plurality of heat dissipation fins on a heat-conducting base; forming a plate on one side of the heat dissipation fins; the plate covering a plurality of flow channels between the heat dissipation fins; and welding a metal spacer to the plate.

[0008] According to the water-cooled heat dissipation device and its manufacturing method described in the above embodiments, since one side of the metal isolation member is welded to the shielding structure and the other side of the metal isolation member is welded to the cover, the structural strength of the water-cooled heat dissipation device can be improved. Furthermore, since the shielding structure closes at least part of the flow channels between the heat dissipation fins, solder will not flow into the flow channels when the metal isolation member is welded to the shielding structure. In other words, if the metal isolation member is directly welded to the heat dissipation fins, the solder used to weld the metal isolation member to the shielding structure may flow into the flow channels, potentially resulting in a substandard product or even rendering it unusable.

[0009] The foregoing description of the invention and the following description of the embodiments are intended to demonstrate and explain the spirit and principles of the invention, and to provide a further explanation of the scope of protection of the patent application claims. Attached Figure Description

[0010] Figure 1 This is a three-dimensional schematic diagram of the water-cooled heat dissipation device according to the first embodiment of the present invention.

[0011] Figure 2 for Figure 1 The exploded diagram.

[0012] Figure 3 for Figure 1 Cross-sectional view.

[0013] Figure 4 for Figure 3 A magnified view of a portion of the image.

[0014] Figures 5 to 7 for Figure 1 The manufacturing process flow chart of the water-cooled heat dissipation device.

[0015] 10. Water-cooled heat dissipation device

[0016] 100 Thermally Conductive Base

[0017] 110 Fluid containment space

[0018] 111 wall

[0019] 120 heatsink fins

[0020] 130 Shielding Structure

[0021] 131 Circulation Area

[0022] 140 thermal contact surface

[0023] 200 Cover

[0024] 210 water inlet

[0025] 220 Outlet

[0026] 300 Metal Spacer

[0027] 310 First slot

[0028] 320 Second slot

[0029] 330 Third slot

[0030] G-channel Detailed Implementation

[0031] Please see Figures 1 to 4 . Figure 1 This is a three-dimensional schematic diagram of the water-cooled heat dissipation device according to the first embodiment of the present invention. Figure 2 for Figure 1 The exploded diagram. Figure 3 for Figure 1 Cross-sectional view. Figure 4 for Figure 3 A magnified view of a portion of the image.

[0032] In this embodiment, the water-cooled heat dissipation device 10 is, for example, a water-cooling block or a water-cooling plate, and the material of the water-cooled heat dissipation device 10 is, for example, gold, silver, copper, or aluminum. It is thermally coupled to a heat source (not shown in the figure). The heat source (not shown in the figure) is, for example, a central processing unit or a video processor. The water-cooled heat dissipation device 10 includes, for example, a heat-conducting base 100, a cover 200, and a metal insulating member 300.

[0033] The heat-conducting base 100 is made of a good thermally conductive material such as gold, silver, copper, or aluminum, and has a fluid-containing space 110 and a plurality of heat dissipation fins 120. These heat dissipation fins 120 are located in the fluid-containing space 110 and protrude from a wall 111 on one side of the fluid-containing space 110. A flow channel G is formed between any two adjacent heat dissipation fins 120. In this embodiment, these heat dissipation fins 120 are, for example, machined heat dissipation fins, but are not limited thereto. In other embodiments, these heat dissipation fins can also be replaced with extruded aluminum heat dissipation fins.

[0034] At least a portion of these heat dissipation fins 120 form a shielding structure 130 on the side away from the wall 111. The shielding structure 130 is, for example, a sheet-like structure and blocks at least a portion of the flow channel G.

[0035] Furthermore, the heat-conducting base 100 has a thermal contact surface 140. The thermal contact surface 140 faces away from the wall surface 111 and is used for thermal coupling to a heat source.

[0036] The cover 200 is made of materials such as, but not limited to, gold, silver, copper, etc., which are good thermal conductors, and has a water inlet 210 and a water outlet 220. The water inlet 210 and the water outlet 220 are respectively used to connect to the water outlet and water inlet of a water-cooled radiator (not shown in the figure) through flow pipes, so that the water-cooled heat dissipation device 10 and the water-cooled radiator together form a cooling cycle. The cover 200 is installed on the heat-conducting base 100 so that the cover 200 covers the fluid receiving space 110, and the water inlet 210 and the water outlet 220 are connected through the fluid receiving space 110.

[0037] One side of the metal isolation member 300 is welded to the shielding structure 130, and the other side of the metal isolation member 300 is welded to the cover 200.

[0038] In this embodiment, the metal separator 300 has a first slot 310. A shielding structure 130 surrounds a flow area 131. The first slot 310 communicates with the flow channels G through the flow area 131. The inlet 210 is sequentially connected to the flow channels G in the fluid receiving space 110 through the first slot 310 and the flow area 131. Furthermore, the metal separator 300 may also have two second slots 320 and a third slot 330. The flow channels G are connected to the outlet 220 through the second slots 320 and the third slot 330.

[0039] In this embodiment, since one side of the metal isolator 300 is welded to the shielding structure 130 and the other side of the metal isolator 300 is welded to the cover 200, the structural strength of the water-cooled heat dissipation device 10 can be improved. Furthermore, since the shielding structure 130 closes at least part of the flow channel G between the heat dissipation fins 120, solder will not flow into the flow channel G when the metal isolator 300 is welded to the shielding structure 130. In other words, if the metal isolator 300 is directly welded to the heat dissipation fins 120, the solder used to weld the metal isolator 300 to the shielding structure 130 may flow into the flow channel G, potentially rendering the finished product substandard or even unusable.

[0040] like Figure 2 As shown, in this embodiment, the working fluid (not shown in the figure) flows in from the inlet 210 along the direction F, then flows into the flow channel G between the heat dissipation fins 120 through the first slot 310 and the flow area 131, then flows to the space on both sides of the heat dissipation fins 120, and flows out from the outlet 220 through the second slot 320 and the third slot 330.

[0041] Please see Figures 3 to 7 . Figures 5 to 7 for Figure 1 A flowchart illustrating the manufacturing process of a water-cooled heat dissipation device. (See attached diagram.) Figure 5 As shown, for example, a plurality of heat dissipation fins 120 are formed on a heat-conducting base 100 by a cutting process. However, forming the heat dissipation fins 120 by a cutting process is not intended to limit the invention. In other embodiments, the heat dissipation fins can also be formed by an aluminum extrusion process. Next, as Figure 6 As shown, for example, a shielding structure 130 is formed on one side of these heat dissipation fins 120 by an extrusion process. The shielding structure 130 shields the multiple flow channels G between these heat dissipation fins 120. Then, as... Figure 7 As shown, a metal spacer 300 is welded to the shielding structure 130. Then, as... Figure 3 and Figure 4 As shown, a cover 200 is welded to the side of the metal isolation member 300 away from the shielding structure 130 to create a water-cooled heat dissipation device 10.

[0042] According to the water-cooled heat dissipation device and its manufacturing method described in the above embodiments, since one side of the metal isolation member is welded to the shielding structure and the other side of the metal isolation member is welded to the cover, the structural strength of the water-cooled heat dissipation device can be improved. Furthermore, since the shielding structure closes at least part of the flow channels between the heat dissipation fins, solder will not flow into the flow channels when the metal isolation member is welded to the shielding structure. In other words, if the metal isolation member is directly welded to the heat dissipation fins, the solder used to weld the metal isolation member to the shielding structure may flow into the flow channels, potentially resulting in a substandard product or even rendering it unusable.

Claims

1. A water-cooled heat dissipation device, characterized in that, The water-cooled heat dissipation device includes: A heat-conducting base has a fluid-containing space and a plurality of heat dissipation fins. The heat dissipation fins are located in the fluid-containing space and protrude from a wall on one side of the fluid-containing space. A flow channel is formed between any two adjacent heat dissipation fins. At least a portion of the heat dissipation fins have a shielding structure on the side away from the wall, and the shielding structure blocks at least a portion of the flow channel. A cover having an inlet and an outlet, the cover being mounted on a heat-conducting base such that the cover covers the fluid-containing space, and the inlet and outlet being connected through the fluid-containing space; and A metal isolator is welded to the shielding structure on one side and to the cover on the other side. The metal isolator has a first slot, a second slot, and a third slot. The shielding structure surrounds a flow area. The first slot communicates with the flow channels through the flow area. The flow channels communicate with the outlet through the second and third slots. The inlet communicates with the outlet through the flow channels, the flow area, the first slot, the second slot, and the third slot in the fluid containing space. The working fluid first flows in from the inlet, then flows through the first slot and the flow area into the flow channel between the heat dissipation fins, then flows to the space on both sides of the heat dissipation fins, and finally flows out from the outlet through the second and third slots.

2. The water-cooled heat dissipation device as described in claim 1, characterized in that, These heat dissipation fins are cut-type heat dissipation fins.

3. The water-cooled heat dissipation device as described in claim 1, characterized in that, The heat-conducting base has a thermal contact surface that faces away from the wall surface.

4. A method for manufacturing a water-cooled heat dissipation device, characterized in that, The method for manufacturing the water-cooled heat dissipation device as described in claim 1 comprises: Multiple heat dissipation fins are formed on a single heat-conducting base; A shielding structure is formed on one side of the heat dissipation fins, which blocks multiple flow channels between the heat dissipation fins; and A metal isolation element is welded to the shielding structure.

5. The manufacturing method of the water-cooled heat dissipation device as described in claim 4, characterized in that, It further includes welding a cover to the side of the metal partition away from the shielding structure.

6. The manufacturing method of the water-cooled heat dissipation device as described in claim 4, characterized in that, The process for forming these heat dissipation fins is a cutting process.

7. The manufacturing method of the water-cooled heat dissipation device as described in claim 4, characterized in that, The process for forming this shielding structure is an extrusion process.

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