Water cooled head

Abstract

The present application provides a water-cooled head, comprising a heat absorbing structure, a plurality of thermal actuating members and a plurality of flow adjusting members. The heat absorbing structure comprises a main body portion and a plurality of fin portions. The fin portions extend outwardly from the main body portion and are spaced apart from each other. A plurality of flow channels are formed between the fin portions. The thermal actuating members are in thermal contact with the main body portion of the heat absorbing structure. The flow adjusting members are movably connected to the main body portion via the thermal actuating members. Each of the flow adjusting members corresponds to at least one of the flow channels. The thermal actuating members actuate the flow adjusting members in response to temperature change, thereby changing the opening degree of the flow channels via the flow adjusting members.

Description

Technical Field

[0001] This invention relates to a liquid cooling device, and more particularly to a water cooling head. Background Technology

[0002] Electronic devices generate a significant amount of heat during operation. If this heat cannot be effectively dissipated, internal electronic components may overheat, leading to malfunctions or crashes. Therefore, electronic devices are typically equipped with appropriate heat dissipation systems to ensure that components operate within their preset temperature ranges. High-performance electronic devices, in particular, often utilize liquid cooling systems for superior heat dissipation.

[0003] Existing liquid cooling systems typically consist of a water block, pump, heat dissipation components, and connecting circulation pipes. In operation, the water block contacts the heat source to absorb its heat energy. The pump drives the working fluid within the circulation pipes to flow through the water block, carrying away the absorbed heat. The heated working fluid then travels to the heat dissipation components for cooling, thus completing the cooling cycle. Furthermore, to further improve heat exchange efficiency with the heat source, the water block usually incorporates heat dissipation fins. These fins not only increase the heat contact area but also form multiple flow channels within the water block to guide the working fluid from the inlet to the outlet.

[0004] However, depending on the location of the inlet / outlet of the water block and the location and size of the heat source it is designed for, the amount of heat that each flow channel actually needs to remove varies. Currently, the heatsink fins designed by various manufacturers lack the flexibility to accommodate this, thus their heat dissipation efficiency still needs improvement. Summary of the Invention

[0005] In view of this, the present invention provides a water cooling head with flexibility to meet actual needs.

[0006] A water cooling head disclosed in an embodiment of the present invention includes a heat-absorbing structure, a plurality of thermally actuated members, and a plurality of flow-adjusting members. The heat-absorbing structure includes a main body and a plurality of finned portions. The finned portions extend outward from the main body and are spaced apart from each other. A plurality of flow channels are formed between the finned portions. The thermally actuated members are in thermal contact with the main body of the heat-absorbing structure. The flow-adjusting members are movably connected to the main body via the thermally actuated members. Each flow-adjusting member corresponds to at least one flow channel. The thermally actuated members actuate the flow-adjusting members in response to temperature changes, thereby changing the opening degree of the flow channels via the flow-adjusting members.

[0007] The water-cooling head disclosed in the foregoing embodiments of the present invention, because the thermally actuated component can change the position of the flow adjustment component with temperature changes, thereby changing the opening of the corresponding flow channel, can passively adjust the opening of the flow channel via the flow adjustment component according to the different received heat energy when the heat source corresponding to the water-cooling head produces uneven heat diffusion. This ensures that all flow channels receive sufficient working fluid flow for heat dissipation. Therefore, through the thermally actuated component and the flow adjustment component, the water-cooling head can dynamically adapt to different heat source distributions, achieving optimal efficiency when facing various heat sources, demonstrating wide applicability and flexibility.

[0008] The above description of the disclosure of this invention and the following description of the embodiments are used to demonstrate and explain the spirit and principle of this invention, and to provide a further explanation of the claims of this invention. Attached Figure Description

[0009] Figure 1 This is a schematic diagram of a cooling system for a water-cooled head according to an embodiment of the present invention.

[0010] Figure 2 for Figure 1 A magnified three-dimensional schematic diagram of a portion of the water cooling head.

[0011] Figure 3 for Figure 1 A partially enlarged side section diagram of the water cooling head.

[0012] Figure 4 for Figure 1 A schematic diagram illustrating the usage scenarios of a water cooling head.

[0013] Figure 5 This is a partially enlarged side sectional view of a water cooling head according to another embodiment of the present invention.

[0014] The attached figures are labeled as follows:

[0015] 1.1' Water cooling block

[0016] 7 Circuit Boards

[0017] 8 pumps

[0018] 9. Heat dissipation components

[0019] 10. Cover

[0020] 20, 20' heat-absorbing structure

[0021] 30 Thermally Actuated Components

[0022] 40, 40' Flow Adjustment Components

[0023] 50 Liquid-tight components

[0024] 210, 210' Main body

[0025] 213, 213' Groove

[0026] 215 Connecting slot

[0027] 230 Fin section

[0028] 240 flow channel

[0029] 1011 water inlet

[0030] 1012 Outlet

[0031] C chamber

[0032] H heat source Detailed Implementation

[0033] The following detailed description of the features and advantages of the present invention in the embodiments is sufficient to enable those skilled in the art to understand the technical content of the present invention and to implement it accordingly. Based on the disclosure, claims, and drawings in this specification, those skilled in the art can easily understand the related objects and advantages of the present invention. The following embodiments further illustrate the viewpoints of the present invention in detail, but are not intended to limit the scope of the present invention in any way.

[0034] Furthermore, for the sake of neatness, some commonly known structures and components may be shown in the accompanying drawings in a simplified schematic manner. Some features in the drawings may be slightly enlarged or their scale or size altered to facilitate understanding and viewing of the technical features of the invention, but this is not intended to limit the invention. Additionally, the perspective of the drawings can be understood from the accompanying coordinate axes.

[0035] Additionally, the following text may use terms such as “end,” “section,” “part,” “region,” and “location” to describe specific elements and structures or specific technical features thereon or therebetween, but these elements and structures are not limited by these terms. The following text may also use terms such as “substantially,” “about,” and “probably” to describe reasonable or acceptable deviations from the modified situation or event that may still achieve the intended result. Furthermore, unless specifically indicated, the term “at least one” as used below means that the number of specific components and structures is one or more.

[0036] Furthermore, unless otherwise defined, all words or terms used herein, including technical and scientific terms, have their usual meanings and should be understood by those skilled in the art.

[0037] First, please refer to Figure 1A schematic diagram of a cooling system for a water-cooled head 1 according to an embodiment of the present invention is shown. In this cooling system, the water-cooled head 1 is connected to a pump 8 and a heat dissipation assembly 9 via a circulation pipe (not labeled). In configuration, the water-cooled head 1 is adapted to have thermal contact with a heat source H (as described later) disposed on a circuit board 7. Figure 4 As shown, the heat source H described herein can be, but is not limited to, electronic components that generate heat during operation (such as central processing chips, graphics processing chips, etc.), but the present invention is not limited to the type, specifications, and quantity of heat source H. The water cooling head 1 can be used to absorb the heat energy of the heat source H to maintain the heat source H within a predetermined operating temperature range. The pump 8 can be, but is not limited to, any power device suitable for driving the working fluid within the circulation pipes, and can be used to drive the working fluid to circulate in the cooling system. The heat dissipation assembly 9 can be, but is not limited to, a combination including one or more heat dissipation fins and one or more fans (not labeled), and a portion of the circulation pipes can come into contact with the heat source for heat exchange.

[0038] In operation, pump 8 drives the working fluid to flow through the water cooling head 1, continuously carrying away the heat energy absorbed by the water cooling head 1 from the heat source H. The working fluid then flows through the heat dissipation assembly 9, which absorbs the heat energy carried by the working fluid and discharges it to the outside. Pump 8 continues to operate, continuously performing the aforementioned cooling cycle. However, the pump 8, heat dissipation assembly 9, and circulation pipeline shown in the figure are only for illustrating the water cooling head 1 of this embodiment and are not intended to limit the invention in any way.

[0039] Please continue reading below. Figures 2-3 The water cooling head of this embodiment will be described in detail. Figure 2 This is a partially enlarged 3D schematic diagram of water block 1. Figure 3 This is a partially enlarged side section diagram of water cooling head 1.

[0040] In this embodiment, the water-cooling head 1 may include a cover 10 and a heat-absorbing structure 20. The heat-absorbing structure 20 is the part of the water-cooling head 1 that contacts the heat source H, and is used for thermal contact and absorption of the heat energy generated by the heat source H. Furthermore, although not shown, the water-cooling head 1 may, but is not limited to, have a suitable fixing mechanism or screw holes for mounting on the circuit board 7. The cover 10 is adapted to be assembled onto the heat-absorbing structure 20 to together form a chamber C. The chamber C may be a sealed space that can accommodate a certain amount of working fluid to carry away the absorbed heat energy. Depending on the manufacturing method of the heat-absorbing structure 20, the side of the chamber C may be formed by the portion of the heat-absorbing structure 20 extending towards the cover 10 (e.g., ...). Figure 1 (as shown), or, in other embodiments, it may be formed by the portion of the cover 10 extending in the direction of the heat-absorbing structure 20, but the present invention is not limited thereto.

[0041] In this embodiment, the water-cooling head 1 may also have an inlet 1011 and an outlet 1012 connected to the chamber C, for use in circulating the working fluid of the chamber C to other components in the cooling system, such as the pump 8 and the heat dissipation assembly 9. However Figure 1 The positions of the water outlet and water inlet shown are for illustrative purposes only and are not intended to limit the invention. For example, in some other embodiments, depending on the actual needs, the water outlet and water inlet of the water cooling head may also be configured in other suitable positions on the heat absorption structure and / or the cover.

[0042] Furthermore, in this embodiment, the heat-absorbing structure 20 absorbs the heat energy from the heat source H and exchanges heat with the working fluid in the chamber C. Specifically, the heat-absorbing structure 20 may be, but is not limited to, a structure made of a suitable thermally conductive material such as copper. It may include a main body 210 and a plurality of finned portions 230 extending outward from the main body 210 and spaced apart from each other. Specifically, the main body 210 may be, but is not limited to, a structure consisting of a plate capable of thermally contacting the heat source H and sidewalls surrounding the periphery of the plate (none are labeled), with the finned portions 230 protruding from the plate. In this configuration, the heat energy from the heat source H is conducted to the finned portions 230 via the main body 210. Furthermore, a plurality of flow channels 240 are formed between the finned portions 230, which can be used to divert the working fluid injected into the chamber C from the inlet 1011 and guide its flow in a specific direction. It should be noted that the main body 210 and the fin portion 230 may be an integrally formed single structure; or, in some embodiments, the fin portion 230 may be fixed to the main body 210 by an additional process (such as welding).

[0043] Furthermore, in this embodiment, the water-cooling head 1 also includes multiple thermally actuated components 30 and multiple flow adjustment components 40. Correspondingly, the main body 210 of the heat-absorbing structure 20 may have multiple grooves 213 and multiple connecting grooves 215. The grooves 213 may be, but are not limited to, disposed on the side of the main body 210 closer to the water inlet 1011, and are respectively formed on one side of the flow channel 240 and can communicate with the flow channel 240. Specifically, the grooves 213 are located on the surface of the main body 210 forming the flow channel 240 and are located between adjacent fin portions 230. In short, the grooves 213 are respectively located on one side of the flow channel 240 between the fin portions 230. The connecting grooves 215 are also respectively located on one side of the flow channel 240, and the connecting grooves 215 are respectively connected to the grooves 213, such as Figure 2 As shown, the connecting groove 215 extends through and connects to the recess 213, thereby allowing the working fluid to flow into the recess 213 via the connecting groove 215.

[0044] The thermally actuated member 30 is disposed in the groove 213, but the present invention is not limited to the number of thermally actuated members 30 disposed in each groove 213. Flow adjustment members 40 are respectively located in the groove 213 and partially inserted in the groove 213, and are movably connected to the main body 210 via the thermally actuated member 30. Furthermore, the flow adjustment members 40 are substantially vertical and extend between the fin portions 230, and the flow adjustment members 40 in these flow channels 240 are substantially arranged along a straight line.

[0045] Furthermore, the thermally actuated component 30 is made of a suitable shape memory alloy, especially a suitable shape memory alloy with a two-way shape memory effect, which can remember different shapes at low and high temperatures respectively. Thus, the thermally actuated component 30 can recover its shape from the shape remembered at high temperature when heated, and recover its shape from the shape remembered at low temperature when cooled. In other words, the thermally actuated component 30 can change its shape with temperature rise and fall, thereby changing the position of the connected flow adjustment component 40 during temperature changes.

[0046] In this embodiment, the thermally actuated member 30 is in the form of a helical spring, and is designed to return to a relatively contracted shape when heated and to return to a relatively extended shape when cooled. However, the spring-shaped thermally actuated member 30 is merely illustrative and is not intended to limit the invention.

[0047] It should be further noted that the alloys suitable for use as the aforementioned thermally actuated component 30 may be, for example, gold-cadmium (Au-Cd) alloys, silver-cadmium (Ag-Cd) alloys, copper-zinc (Cu-Zn) alloys, copper-zinc-aluminum (Cu-Zn-Al) alloys, copper-zinc-tin (Cu-Zn-Sn) alloys, copper-zinc-silicon (Cu-Zn-Si) alloys, copper-tin (Cu-Sn) alloys, copper-zinc-gallium (Cu-Zn-Ga) alloys, indium-titanium (In-Ti) alloys, gold-copper-zinc (Au-Cu-Zn) alloys, nickel-aluminum (Ni-Al) alloys, iron-platinum (Fe-Pt) alloys, titanium-nickel (Ti-Ni) alloys, titanium-nickel-palladium (Ti-Ni-Pd) alloys, titanium-niobium (Ti-Nb) alloys, uranium-niobium (U-Nb) alloys, iron-manganese-silicon (Fe-Mn-Si) alloys, or combinations thereof, but the present invention is not limited thereto.

[0048] In the aforementioned configuration, the heat energy absorbed by the main body 210 of the heat-absorbing structure 20 can be directly transferred to the thermally actuated member 30. Simultaneously, the working fluid can also flow into the groove 213 via the connecting groove 215 and come into thermal contact with the thermally actuated member 30. These pathways transfer heat energy to the thermally actuated member 30, causing it to deform. Thus, as... Figure 3As indicated by the arrow, the thermally actuated member 30 enables the flow adjustment member 40 to move up and down in the groove 213 when the temperature changes, thereby allowing the flow adjustment member 40 to form a barrier in the flow channel 240 that passively responds to temperature changes. That is, the flow adjustment member 40 can passively change the opening of the flow channel 240 in response to temperature changes.

[0049] Furthermore, to enhance the blocking effect of the flow adjustment component 40, in this embodiment, the water cooling head 1 may also include multiple liquid-tight components 50. These liquid-tight components 50 may be, but are not limited to, made of suitable materials such as rubber. The liquid-tight components 50 are respectively sandwiched between the flow adjustment component 40 and the fin portion 230 of the heat absorption structure 20, which can prevent the working fluid from passing through the area between the flow adjustment component 40 and the fin portion 230. However, the present invention is not limited to the liquid-tight components 50 and their number shown in the figure. Any suitable structure that can achieve a liquid-tight effect between the flow adjustment component and the fin portion can be used as the liquid-tight component of the present invention.

[0050] Next, please refer to the following: Figure 4 The effect of water block 1 is illustrated using a schematic diagram of its usage scenario. For example... Figure 4 As shown, due to the size of the heat source H and its relative position to the water-cooling head 1, the heat source H may cause the central region of the main body 210 of the heat-absorbing structure 20 to generate a higher temperature than the surrounding region. In other words, the heat source H may cause uneven heat diffusion on the main body 210 of the heat-absorbing structure 20. In this case, the thermally actuated member 30 closer to the central region of the main body 210 of the heat-absorbing structure 20 will receive more heat energy than the thermally actuated members 30 in the surrounding region. Therefore, the thermally actuated member 30 closer to the central region can have a larger temperature rise and generate a larger amount of contraction (or deformation). Thus, the thermally actuated member 30 can cause the connected flow adjustment member 40 to undergo varying degrees of downward movement. For example... Figure 4 As shown, the rate of decrease of the flow adjustment component 40 gradually increases from the surrounding area to the central area, thereby causing the opening of the flow channel 240 to gradually increase from the surrounding area to the central area. It is understood that the terms "central" or "central area" used herein or subsequently are based on the main body of the heat-absorbing structure.

[0051] Therefore, in the working fluid injected into chamber C from inlet 1011, the flow channel 240 in the central region, due to its larger opening, can receive a larger flow rate, ensuring that the central region with higher thermal energy receives sufficient working fluid. In other words, the thermally actuated component 30 enables the flow adjustment component 40 to passively adjust its position in response to the heat energy distribution of the water-cooled head 1 caused by the heat source H, thereby dynamically changing the opening of the flow channels 240 at different locations to ensure that all flow channels 240 receive the sufficient working fluid flow required for heat decomposition. In short, through the thermally actuated component 30 and the flow adjustment component 40, the water-cooled head 1 can dynamically adapt to different heat source distributions generated by different heat sources, achieving optimal efficiency when facing various heat sources, demonstrating wide applicability and flexibility.

[0052] But it is understandable Figure 4 This is for illustrative purposes only; the actual position of the flow adjustment component 40 depends on the specific application. For example, when the heat source H can produce a uniform heat distribution for the water cooling head 1, the thermally actuated component 30 may also produce a similar amount of deformation or no deformation at all. In this case, the flow adjustment component 40 can be maintained in a similar position so that the flow channel 240 has a similar or identical opening.

[0053] The foregoing embodiments are merely one example of the present invention and are not intended to limit the invention. For example, please refer to... Figure 5 Another embodiment of the present invention provides a water cooling head 1'. It should be stated first that the difference between the water cooling head 1' of this embodiment and the water cooling head 1 of the previous embodiment lies only in the flow adjustment component 40' and its associated adjustment. Therefore, for the purpose of brief explanation, the following description only focuses on the differences between the embodiments, and similar or identical parts can be understood by referring to the foregoing description and will not be repeated.

[0054] like Figure 5 As shown, in the water-cooled head 1', the groove 213' of the main body 210' of the heat-absorbing structure 20' and the flow adjustment member 40' located in the groove 213' have a relatively long length in the direction of the flow channel 240. Correspondingly, a larger number of thermally actuated members 30 can be arranged in the groove 213', and the thermally actuated members 30 can be arranged along the direction of the flow channel 240 to uniformly raise and lower the longer flow adjustment member 40'. Furthermore, a larger number of liquid-tight members 50 can be arranged between the flow adjustment member 40' and the fin portion 230 to ensure liquid tightness between the flow adjustment member 40' and the fin portion 230.

[0055] In this configuration, the flow adjustment member 40' can be regarded, for example, as a base plate on the main body 210' for forming the flow channel 240. Thus, when the flow adjustment member 40' rises and falls with the temperature, it can also achieve the aforementioned effect of adjusting the flow of the flow channel 240.

[0056] Furthermore, it should be noted that the aforementioned connecting groove in the heat-absorbing structure is optional. For example, in some other embodiments, the heat-absorbing structure may not have the aforementioned connecting groove. In this configuration, the heat energy absorbed by the main body of the heat-absorbing structure can still be continuously and directly transferred to the thermally actuated component, thereby achieving the effect of changing the shape of the thermally actuated component with temperature changes. In addition, the aforementioned flow adjustment component and flow channel are configured one-to-one, but the present invention is not limited to this. For example, in other embodiments, the flow adjustment component may be configured on one side of the main body, thereby corresponding to multiple flow channels simultaneously.

[0057] In summary, the water-cooling head disclosed in the foregoing embodiments of this invention, because the thermally actuated component can change the position of the flow adjustment component with temperature changes, thereby changing the opening of the corresponding flow channel, can passively adjust the opening of the flow channel via the flow adjustment component in response to the different received heat energy when the heat source corresponding to the water-cooling head produces uneven heat diffusion. This ensures that all flow channels receive the sufficient working fluid flow required for heat decomposition. Therefore, through the thermally actuated component and the flow adjustment component, the water-cooling head can dynamically adapt to different heat source distributions generated by different heat sources, achieving optimal efficiency when facing various heat sources, demonstrating wide applicability and flexibility.

[0058] While the present invention has been disclosed above with reference to the foregoing embodiments, it is not intended to limit the invention. Any modifications and refinements made without departing from the spirit and scope of the invention are within the scope of patent protection of the present invention. For a description of the scope of protection defined in the present invention, please refer to the appended claims.

Claims

1. A water cooling head, characterized in that, Include: A heat-absorbing structure includes a main body and a plurality of fin portions, wherein the plurality of fin portions extend outward from the main body and are spaced apart from each other, wherein a plurality of flow channels are formed between the plurality of fin portions; Multiple thermally actuated components are in thermal contact with the main body of the heat-absorbing structure; as well as Multiple flow adjustment components are movably connected to the main body via multiple thermally actuated components, wherein each flow adjustment component corresponds to at least one flow channel, and the multiple thermally actuated components actuate the multiple flow adjustment components in response to temperature changes, thereby changing the opening degree of the multiple flow channels via the multiple flow adjustment components; The main body has multiple grooves, which are located on one side of multiple flow channels, and multiple thermally actuating components are located in the multiple grooves. Multiple flow adjustment components are partially inserted into the multiple grooves.

2. The water cooling head as described in claim 1, characterized in that, Each of these thermally actuated components is in the form of a helical spring and is made of a shape memory alloy with a two-way shape memory effect.

3. The water cooling head as described in claim 2, characterized in that, Each of these thermally actuated components has the characteristic of relatively contracting when heated and relatively expanding when cooled.

4. The water cooling head as described in claim 1, characterized in that, The plurality of flow adjustment components are perpendicular to the plurality of fin portions.

5. The water cooling head as described in claim 1, characterized in that, The multiple flow adjustment components in the multiple flow channels are arranged in a straight line.

6. The water cooling head as described in claim 1, characterized in that, The main body also has a plurality of connecting grooves, which are located on one side of the plurality of flow channels and extend into the plurality of grooves and are connected to the plurality of grooves respectively.

7. The water cooling head as described in claim 1, characterized in that, It also includes multiple liquid-tight components sandwiched between the multiple flow adjustment components and the multiple fin portions.

8. The water cooling head as described in claim 1, characterized in that, It also includes a cover body disposed on the main body of the heat-absorbing structure to form a chamber together with the main body. The water-cooling head has a water inlet and a water outlet, which are located on the main body and / or the cover body. A plurality of the thermally actuating components are located on the side of the main body near the water inlet.

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