Light-reflecting thermosetting resin composition, optical semiconductor element mounting substrate, and optical semiconductor device

Abstract

The light-reflecting thermosetting resin composition of the present invention contains an epoxy resin, a curing agent, an inorganic filler, a white pigment and a release agent, and the release agent contains a zinc-based metal soap and an aluminum-based metal soap.

Description

Technical Field

[0001] The present invention relates to a light-reflecting thermosetting resin composition, a substrate for mounting an optical semiconductor element, and an optical semiconductor device. Background Art

[0002] Optical semiconductor devices that combine optical semiconductor elements such as LEDs (Light Emitting Diodes) and phosphors are used in various applications such as outdoor displays, portable LCD backlights, and automotive applications due to their high energy efficiency and long life, and their demand is expanding. As a result, the high brightness of LED devices has been promoted, which requires the prevention of degradation of optical semiconductor devices caused by increased junction temperature due to increased heat generation of the elements or direct increase in light energy.

[0003] Patent Document 1 discloses a substrate for mounting an optical semiconductor element, in which a thermosetting resin composition containing an acid anhydride as a curing agent is used as a material for a reflector.

[0004] Previous technical literature

[0005] Patent Literature

[0006] Patent Document 1: Japanese Patent Application Publication No. 2006-140207 Summary of the invention

[0007] Technical issues to be solved by the invention

[0008] Generally, when a thermosetting resin composition is used to form a reflector of an LED, transfer molding is used. From the viewpoint of productivity, the thermosetting resin composition is required to have excellent demoulding properties from a molding die. In addition, the cured product formed by the thermosetting resin composition is required not only to further improve the light reflectivity, but also to have heat resistance that can maintain optical properties when used for a long time at high temperature.

[0009] Therefore, an object of the present invention is to provide a light-reflecting thermosetting resin composition having excellent releasability and heat resistance, and a substrate for mounting an optical semiconductor element and an optical semiconductor device using the light-reflecting thermosetting resin composition.

[0010] Means for solving technical problems

[0011] The invention relates to a thermosetting resin composition for light reflection, which contains epoxy resin, curing agent, inorganic filler, white pigment and release agent, wherein the release agent contains zinc metal soap and aluminum metal soap.

[0012] The zinc-based metal soap may contain a metal salt of zinc and a long-chain fatty acid having 10 or more carbon atoms. Furthermore, the long-chain fatty acid may have 20 or more carbon atoms.

[0013] The curing agent may contain tetracarboxylic dianhydride having a melting point of 180 to 400° C. The inorganic filler may contain inorganic hollow particles having a median particle size of 1 to 25 μm.

[0014] On the other hand, the present invention relates to a substrate for mounting an optical semiconductor element, which comprises a cured product of the above-mentioned thermosetting resin composition for light reflection. The substrate for mounting an optical semiconductor element according to the present invention may have a recessed portion consisting of a bottom surface and a wall surface, and the bottom surface of the recessed portion is a mounting portion for the optical semiconductor element. In this case, at least a portion of the wall surface of the recessed portion is a cured product of the above-mentioned thermosetting resin composition for light reflection. Furthermore, the substrate for mounting an optical semiconductor element according to the present invention may comprise a substrate, a first connecting terminal and a second connecting terminal disposed on the substrate, and a cured product of the above-mentioned thermosetting resin composition for light reflection disposed between the first connecting terminal and the second connecting terminal.

[0015] In still another aspect, the present invention relates to an optical semiconductor device including the above-mentioned optical semiconductor element mounting substrate and an optical semiconductor element mounted on the optical semiconductor element mounting substrate.

[0016] Effects of the Invention

[0017] According to the present invention, it is possible to provide a light-reflecting thermosetting resin composition having excellent releasability and heat resistance, and a substrate for mounting an optical semiconductor element and an optical semiconductor device using the light-reflecting thermosetting resin composition. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is a perspective view showing one embodiment of an optical semiconductor element mounting substrate.

[0019] Figure 2 This is a schematic diagram showing one embodiment of the process of manufacturing a substrate for mounting an optical semiconductor element.

[0020] Figure 3 This is a perspective view showing an embodiment of a state in which an optical semiconductor element is mounted on an optical semiconductor element mounting substrate.

[0021] Figure 4 This is a schematic cross-sectional view showing one embodiment of an optical semiconductor device.

[0022] Figure 5 It is a schematic cross-sectional view showing another embodiment of an optical semiconductor device.

[0023] Figure 6 It is a schematic cross-sectional view showing another embodiment of an optical semiconductor device.

[0024] Figure 7It is a schematic cross-sectional view showing the structure of a mold for measuring shear release force. DETAILED DESCRIPTION

[0025] Hereinafter, as required, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention is not limited to the following embodiments. In addition, in the accompanying drawings, the same elements are marked with the same symbols, and repeated descriptions are omitted. Furthermore, unless otherwise specified, the positional relationships such as up and down, left and right are based on the positional relationships shown in the accompanying drawings. Furthermore, the dimensional ratios of the accompanying drawings are not limited to the ratios shown in the drawings.

[0026] In this specification, the numerical range indicated by "~" indicates a range including the numerical values ​​recorded before and after "~" as the minimum and maximum values, respectively. In the numerical range recorded in stages in this specification, the upper limit or lower limit of the numerical range of a certain stage can be replaced by the upper limit or lower limit of the numerical range of another stage. In the numerical range recorded in this specification, the upper limit or lower limit of the numerical range can be replaced by the value shown in the embodiment. "A or B" only needs to include any one of A and B, and can also include both of them. Unless otherwise specified, the materials exemplified in this specification can be used alone or in combination of two or more. Furthermore, in this specification, (meth)acrylate means at least one of acrylate and its corresponding methacrylate.

[0027] [Light-reflecting thermosetting resin composition]

[0028] The light-reflecting thermosetting resin composition of the present embodiment contains an epoxy resin, a curing agent, an inorganic filler, and a white pigment, and the release agent contains a zinc-based metal soap and an aluminum-based metal soap.

[0029] (Epoxy resin)

[0030] As the epoxy resin, an epoxy resin commonly used for epoxy resin molding materials for electronic component sealing can be used. The thermosetting resin composition involved in the present embodiment can form a cured product with high thermal hardness and bending strength and improved mechanical properties by containing an epoxy resin. As the epoxy resin, for example, there can be mentioned: epoxy resins obtained by epoxidizing phenolic and aldehyde novolac resins such as phenol novolac type epoxy resins and o-cresol novolac type epoxy resins; diglycidyl ethers such as bisphenol A, bisphenol F, bisphenol S, and alkyl-substituted bisphenols; glycidylamine type epoxy resins obtained by reacting polyamines such as diaminodiphenylmethane and isocyanuric acid with epichlorohydrin; linear aliphatic epoxy resins obtained by oxidizing olefin bonds with peracids such as peracetic acid; and alicyclic epoxy resins. The epoxy resin can be used alone or in combination of two or more.

[0031] Due to the small amount of coloring, the epoxy resin may contain diglycidyl isocyanurate, triglycidyl isocyanurate, bisphenol A epoxy resin, bisphenol F epoxy resin, bisphenol S epoxy resin, diglycidyl dicarboxylate derived from 1,2-cyclohexanedicarboxylic acid, 1,3-cyclohexanedicarboxylic acid or 1,4-cyclohexanedicarboxylic acid. For the same reason, the epoxy resin is also preferably diglycidyl esters of dicarboxylic acids such as phthalic acid, tetrahydrophthalic acid, hexahydrophthalic acid, methyltetrahydrophthalic acid, nadic acid, and methylnadic acid. It may contain glycidyl esters such as nuclear hydrogenated trimellitic acid and nuclear hydrogenated pyromellitic acid having an alicyclic structure hydrogenated from an aromatic ring. The epoxy resin may contain a polyorganosiloxane having an epoxy group manufactured by heating a silane compound in the presence of an organic solvent, an organic base and water and hydrolyzing it to condense it.

[0032] Commercially available epoxy resins can be used. As 3,4-epoxycyclohexylmethyl-3',4'-epoxycyclohexanecarboxylate, for example, the product names "CELLOXIDE 2021", "CELLOXIDE 2021A" and "CELLOXIDE 2021P" of Daicel Corporation, and the product names "ERL4221", "ERL4221D" and "ERL4221E" of Dow Chemical] Japan can be obtained. As bis(3,4-epoxycyclohexylmethyl)adipate, for example, the product name "ERL4299" of Dow Chemical Japan and the product name "EXA-7015" of DIC Corporation can be obtained. As 1-oxiranyl-3,4-epoxycyclohexane or limonene diepoxide, for example, Mitsubishi Chemical Corporation's product names "jERYX8000", "jER YX8034" and "jER YL7170", Daicel Corporation's product names "CELLOXIDE2081", "CELLOXIDE 3000", "EPOLEAD GT301", "EPOLEAD GT401" and "EHPE3150" are available. As triglycidyl isocyanurate, for example, Nissan Chemical Industries, Ltd.'s product name "TEPIC-S" is available.

[0033] (Curing agent)

[0034] As a curing agent, a curing agent commonly used for epoxy resin molding materials for electronic component sealing can be used. If a cured product can be obtained by reacting with an epoxy resin, the curing agent is not particularly limited, preferably a curing agent with less coloring, more preferably a colorless or light yellow curing agent. As a curing agent, for example, anhydride curing agents, isocyanuric acid derivative curing agents and phenol curing agents can be cited. The curing agent can be used alone or in combination of two or more.

[0035] The curing agent involved in the present embodiment contains tetracarboxylic dianhydride (hereinafter, sometimes referred to as "tetracarboxylic dianhydride") having a melting point of 180 to 400°C as an acid anhydride curing agent. By using such tetracarboxylic dianhydride as a curing agent, the heat resistance of the thermosetting resin composition can be further improved. From the viewpoint of uniformly dispersing in the resin composition, the melting point of tetracarboxylic dianhydride can be 200 to 380°C or 210 to 350°C.

[0036] In order to further improve heat resistance, the tetracarboxylic dianhydride may have an aromatic ring or an alicyclic ring. The tetracarboxylic dianhydride having an aromatic ring may be at least one selected from the group consisting of tetracarboxylic dianhydrides having two or more benzene rings and tetracarboxylic dianhydrides having a naphthalene ring.

[0037] The tetracarboxylic dianhydride having two or more benzene rings may be a compound represented by the following formula (1).

[0038]

[0039] In the formula (1), R represents a single bond, an ether bond, an alkyl group, a carbonyl group, a sulfonyl group, a hexafluoroisopropylidene group or a fluorenyl group.

[0040] Examples of tetracarboxylic dianhydrides having an alicyclic ring include 1,2,3,4-cyclobutanetetracarboxylic dianhydride. Examples of tetracarboxylic dianhydrides having an aromatic ring include 4,4'-diphthalic anhydride, 4,4'-carbonyldiphthalic anhydride, 4,4'-sulfonyldiphthalic anhydride, 4,4'-(hexafluoroisopropylidene)diphthalic anhydride, 4,4'-oxydiphthalic anhydride, 9,9-bis(3,4-dicarboxyphenyl)fluorene dicarboxylic anhydride, and 2,3,6,7-naphthalenetetracarboxylic anhydride.

[0041] The curing agent involved in this embodiment may contain an anhydride curing agent having a melting point lower than 180° C. Examples of the anhydride curing agent having a melting point lower than 180° C. include phthalic anhydride, maleic anhydride, trimellitic anhydride, hexahydrophthalic anhydride, tetrahydrophthalic anhydride, methyl nadic anhydride, nadic anhydride, glutaric anhydride, dimethyl glutaric anhydride, diethyl glutaric anhydride, succinic anhydride, methyl hexahydrophthalic anhydride, methyl tetrahydrophthalic anhydride, and tetracarboxylic dianhydride represented by the following formula (2).

[0042]

[0043] In formula (2), Rx represents a divalent organic group, and n represents an integer of 1 to 10. The divalent organic group may be a divalent saturated hydrocarbon group having a saturated hydrocarbon ring, and examples of the saturated hydrocarbon include cyclobutane, cyclopentane, cyclohexane, cycloheptane, cyclooctane, norbornene, dicyclopentadiene, adamantane, hydrogenated naphthalene, and hydrogenated biphenyl.

[0044] Examples of the isocyanuric acid derivatives include 1,3,5-tris(1-carboxymethyl)isocyanurate, 1,3,5-tris(2-carboxyethyl)isocyanurate, 1,3,5-tris(3-carboxypropyl)isocyanurate, and 1,3-bis(2-carboxyethyl)isocyanurate.

[0045] Examples of the phenolic curing agent include: novolac-type phenolic resins obtained by condensing or co-condensing phenols such as phenol, cresol, resorcinol, catechol, bisphenol A, bisphenol F, phenylphenol, and aminophenol and / or naphthols such as d-naphthol, β-naphthol, and dihydroxynaphthalene with aldehydes such as formaldehyde, benzaldehyde, and salicylaldehyde in the presence of an acidic catalyst; phenol aralkyl resins synthesized from phenols and / or naphthols and dimethoxy-p-xylene or bis(methoxymethyl)biphenyl; aralkyl-type phenolic resins such as biphenylene-type phenol aralkyl resins and naphthol aralkyl resins; dicyclopentadiene-type phenolic resins synthesized by copolymerizing phenols and / or naphthols with dicyclopentadiene; triphenylmethane-type phenolic resins; terpene-modified phenolic resins; p-xylene and / or m-xylene-modified phenolic resins; melamine-modified phenolic resins; and phenolic resins obtained by copolymerizing two or more of these.

[0046] In the thermosetting resin composition according to the present embodiment, the content of the curing agent may be 10 to 150 parts by mass, 50 to 130 parts by mass, or 60 to 120 parts by mass relative to 100 parts by mass of the epoxy resin.

[0047] Regarding the mixing ratio of the curing agent, the active group (anhydride group or hydroxyl group) in the curing agent that can react with the epoxy group can be 0.5 to 2.0 equivalents, 0.6 to 1.5 equivalents, or 0.7 to 1.2 equivalents relative to 1 equivalent of the epoxy group in the epoxy resin. If the above-mentioned active group is 0.5 equivalents or more, the glass transition temperature of the cured product formed by the thermosetting resin composition becomes higher, and it is easy to obtain a sufficient elastic modulus. On the other hand, if the above-mentioned active group is 2.0 equivalents or less, the strength after curing is not easy to decrease.

[0048] (white pigment)

[0049] The white pigment is used to impart a white color tone to a cured product (molded article) obtained from the thermosetting resin composition according to the present embodiment. In particular, by making the color tone highly white, the light reflectance of the molded article can be increased.

[0050] As white pigment, for example, rare earth oxides such as yttrium oxide, titanium oxide, zinc oxide, aluminum oxide (alumina), magnesium oxide, antimony oxide, zinc sulfate and zirconium oxide can be enumerated. They can be used alone or in combination of two or more. Due to further improving light reflectivity, the white pigment preferably contains at least one selected from the group consisting of titanium oxide, zinc oxide, aluminum oxide, magnesium oxide, antimony oxide and zirconium oxide, more preferably contains at least one selected from the group consisting of titanium oxide, antimony oxide and zirconium oxide.

[0051] The median particle size of the white pigment may be 0.05 to 10 μm, 0.08 to 8 μm, or 0.1 to 5 μm. If the median particle size of the white pigment is 0.05 μm or more, the dispersibility becomes better, and if it is less than 10 μm, the light reflection characteristics of the cured product become better. In this specification, the median particle size can be obtained as the mass average D50 (or median diameter) in the particle size distribution measurement using the laser diffraction method.

[0052] (Inorganic filler)

[0053] From the viewpoint of improving moldability, the thermosetting resin composition involved in the present embodiment contains an inorganic filler. Examples of the inorganic filler include quartz, fumed silica, precipitated silica, silicic anhydride, fused silica, crystalline silica, ultrafine amorphous silica, barium sulfate, magnesium carbonate, barium carbonate, aluminum hydroxide, magnesium hydroxide, potassium titanate, calcium silicate, and inorganic hollow particles.

[0054] From the viewpoint of moldability, the inorganic filler may contain fused silica. From the viewpoint of improving the packing property with the white pigment, the median particle size of the fused silica may be 1 to 100 μm, 1 to 50 μm, or 1 to 40 μm.

[0055] In order to further improve the crushability of the thermosetting resin composition, the inorganic filler may contain inorganic hollow particles with a median particle size of 1 to 25 μm. Inorganic hollow particles are particles having a void portion inside. Inorganic hollow particles refract and reflect incident light through the surface and inner wall, so by using them together with white pigments, a cured product with further improved light reflectivity and mechanical properties can be formed.

[0056] As the inorganic hollow particles, for example, sodium silicate glass, aluminosilicate glass, sodium borosilicate glass and white sand can be enumerated. From the viewpoint of heat resistance and compressive strength, the shell of the inorganic hollow particles is preferably composed of at least one material selected from the group consisting of sodium silicate glass, aluminosilicate glass, sodium borosilicate glass, white sand, cross-linked styrene resin and cross-linked propylene resin, and more preferably composed of at least one material selected from the group consisting of sodium silicate glass, aluminosilicate glass, sodium borosilicate glass and white sand.

[0057] Since it is easy to evenly disperse the inorganic hollow particles when preparing the thermosetting resin composition, the median particle size of the inorganic hollow particles can be 1 μm or more, 5 μm or more, or 10 μm or more. In addition, since it is easy to improve the light reflection characteristics of the formed cured product, the median particle size of the inorganic hollow particles can be 25 μm or less or 22 μm or less.

[0058] In order to improve the mechanical properties of the thermosetting resin composition, the thickness of the outer shell of the inorganic hollow particles may be 0.4 to 1.3 μm, 0.45 to 1.2 μm, 0.5 to 1.1 μm, or 0.55 to 1.0 μm.

[0059] Due to the improved light reflectivity, the bulk density of the inorganic hollow particles can be 0.20 to 0.36 g / cm 3 , 0.25~0.35g / cm 3 or 0.26~0.34g / cm 3 The bulk density is the density calculated by filling a container of a certain volume with inorganic hollow particles and taking the internal volume as the volume.

[0060] Due to the excellent balance between light reflectivity and mechanical properties, the true density of the inorganic hollow particles can be 0.40 to 0.75 g / cm 3 , 0.45~0.70g / cm 3 or 0.50~0.65g / cm 3 The true density can be measured according to ASTM D2840.

[0061] Since the strength of the cured product of the thermosetting resin composition is improved, the compressive strength of the inorganic hollow particles can be 100 MPa or more, 110 MPa or more, 125 MPa or more, or 150 MPa or more at 25° C. Since the moldability of the thermosetting resin composition is improved, the compressive strength of the inorganic hollow particles can be 500 MPa or less, 300 MPa or less, or 200 MPa or less at 25° C. The compressive strength can be measured according to ASTM D3 102.

[0062] From the viewpoint of further improving the light reflectance, the content of the inorganic hollow particles is preferably 60 to 200 parts by mass, more preferably 80 to 180 parts by mass, and even more preferably 100 to 170 parts by mass based on 100 parts by mass of the epoxy resin.

[0063] (Release Agent)

[0064] The release agent of the present embodiment contains zinc metal soap and aluminum metal soap. Zinc metal soap is a metal salt of zinc and a long-chain fatty acid. By using zinc metal soap, the demolding property of the thermosetting resin composition of the present embodiment from the molding die can be improved. Aluminum metal soap is a metal salt of aluminum and a long-chain fatty acid. By using aluminum metal soap, the heat resistance of the thermosetting resin composition of the present embodiment can be improved.

[0065] From the viewpoint of further improving the mold release property, the number of carbon atoms of the long-chain fatty acid may be 10 or more, 14 or more, 18 or more, or 20 or more. From the viewpoint of uniformly dispersing in the resin composition, the number of carbon atoms of the long-chain fatty acid may be 40 or less, 36 or less, 30 or less, or 26 or less. Examples of the long-chain fatty acid include lauric acid, myristic acid, palmitic acid, stearic acid, behenic acid, arachidic acid, lignoceric acid, cerotic acid, and montanic acid.

[0066] The zinc-based metal soap may contain a metal salt of zinc and a long-chain fatty acid having at least 10 carbon atoms. The long-chain fatty acid constituting the zinc-based metal soap preferably has at least 14 carbon atoms, more preferably at least 18 carbon atoms, and even more preferably at least 20 carbon atoms.

[0067] The aluminum-based metal soap may contain aluminum and a long-chain fatty acid having at least 10 carbon atoms. The long-chain fatty acid constituting the aluminum-based metal soap preferably has at least 14 carbon atoms, more preferably at least 16 carbon atoms, and even more preferably at least 18 carbon atoms.

[0068] The content of the release agent in the thermosetting resin composition (the total amount of the zinc-based metal soap and the aluminum-based metal soap) may be 1 to 15 parts by mass, 2 to 10 parts by mass, or 3 to 8 parts by mass relative to 100 parts by mass of the epoxy resin.

[0069] (Curing accelerator)

[0070] In order to promote the curing reaction of epoxy resin, the thermosetting resin composition involved in the present embodiment may contain a curing accelerator. As the curing accelerator, for example, an amine compound, an imidazole compound, an organic phosphorus compound, an alkali metal compound, an alkaline earth metal compound and a quaternary ammonium salt can be cited. Among these curing accelerators, an amine compound, an imidazole compound or an organic phosphorus compound is preferably used. The curing accelerator can be used alone or in combination of two or more.

[0071] Examples of the amine compound include 1,8-diazabicyclo[5.4.0]undecene-7, triethylenediamine, and tri-2,4,6-dimethylaminomethylphenol. Examples of the imidazole compound include 2-ethyl-4-methylimidazole. Examples of the organophosphorus compound include triphenylphosphine, tetraphenylphosphonium tetraphenylborate, tetra-n-butylphosphonium-o,o-diethyl dithiophosphate, tetra-n-butylphosphonium-tetrafluoroborate, and tetra-n-butylphosphonium-tetraphenylborate.

[0072] The content of the curing accelerator in the thermosetting resin composition may be 0.01 to 8 parts by mass, 0.1 to 5 parts by mass, or 0.3 to 4 parts by mass relative to 100 parts by mass of the epoxy resin. If the content of the curing accelerator is 0.01 parts by mass or more, it is easy to obtain a sufficient curing acceleration effect, and if it is 8 parts by mass or less, it is easy to suppress the discoloration of the cured product.

[0073] (Coupling agent)

[0074] In order to improve the adhesion of the inorganic filler and the epoxy resin, a coupling agent can be added to the thermosetting resin composition. As the coupling agent, there is no particular limitation, and examples thereof include silane coupling agents and titanate coupling agents. As the silane coupling agent, examples thereof include epoxy silane compounds, amino silane compounds, cationic silane compounds, vinyl silane compounds, acrylic silane compounds, and mercapto silane compounds. Based on the total amount of the thermosetting resin composition, the content of the coupling agent can be less than 5% by mass.

[0075] To the thermosetting resin composition according to the present embodiment, additives such as an antioxidant, an ion scavenger, and a wax dispersant may be added as necessary.

[0076] The thermosetting resin composition involved in this embodiment can be prepared by uniformly dispersing and mixing the above-mentioned various components. The preparation method, conditions, etc. are not particularly limited. As a common method for preparing a thermosetting resin composition, a method of mixing the components by a kneader, a roller, an extruder, a crusher, or a planetary mixer combining rotation and revolution can be cited. When mixing the components, it is preferably carried out in a molten state from the viewpoint of improving dispersibility.

[0077] The conditions for kneading can be appropriately determined according to the type or amount of each component. For example, it is preferably kneaded at 15 to 100° C. for 5 to 40 minutes, and more preferably kneaded at 20 to 100° C. for 10 to 30 minutes. If the kneading temperature is above 15° C., it is easy to knead the components, thereby improving dispersibility. If the kneading temperature is below 100° C., it is possible to suppress the high molecular weight of the epoxy resin during kneading and solidify. If the kneading time is more than 5 minutes, it is easy to obtain a sufficient dispersion effect. If the kneading time is less than 40 minutes, it is possible to suppress the high molecular weight of the epoxy resin during kneading and solidify.

[0078] The thermosetting resin composition according to the present embodiment is useful in various applications such as substrate materials for mounting optical semiconductor elements, electrical insulating materials, optical semiconductor sealing materials, adhesive materials, coating materials, and epoxy resin molding materials for transfer molding, which require high light reflectivity and heat resistance. Hereinafter, an example in which the thermosetting resin composition according to the present embodiment is used as an epoxy resin molding material for transfer molding will be described.

[0079] From the perspective of ensuring filling properties into the mold, the flow distance (spiral flow) of the thermosetting resin composition involved in this embodiment when transfer molding is performed under the conditions of a molding mold temperature of 180°C, a molding pressure of 6.9 MPa, and a curing time of 90 seconds can be 60 to 200 cm, 80 to 180 cm, or 100 to 160 cm.

[0080] From the viewpoint of improving the brightness of the optical semiconductor device, the initial light reflectance at a wavelength of 460 nm of the cured product of the thermosetting resin composition involved in this embodiment is preferably 93.0% or more, and more preferably 93.5% or more. From the viewpoint of improving the heat coloration resistance, the light reflectance at a wavelength of 460 nm after the cured product is heat-treated at 150° C. for 168 hours is preferably 91.0% or more, and more preferably 91.2% or more.

[0081] [Optical semiconductor element mounting substrate]

[0082] The optical semiconductor element mounting substrate of the present embodiment has a recessed portion consisting of a bottom surface and a wall surface. The bottom surface of the recessed portion is the optical semiconductor element mounting portion (optical semiconductor element mounting area), and the wall surface of the recessed portion, that is, at least a portion of the inner peripheral side surface of the recessed portion is formed by a cured product of the light-reflecting thermosetting resin composition of the present embodiment.

[0083] Figure 11 is a perspective view showing an embodiment of a substrate for mounting an optical semiconductor element. The substrate 110 for mounting an optical semiconductor element includes a metal line 105 (a first connection terminal and a second connection terminal) formed with a Ni / Ag plating layer 104, an insulating resin molded body 103' and a reflector 103 provided between the metal line 105 (the first connection terminal and the second connection terminal), and has an optical semiconductor element mounting region (recess) 200 formed by the metal line 105, the insulating resin molded body 103' and the reflector 103. The bottom surface of the recess 200 is formed by the metal line 105, the insulating resin molded body 103' and the reflector 103, and the wall surface of the recess 200 is formed by the reflector 103. The reflector 103 and the insulating resin molded body 103' are molded bodies formed by the cured product of the thermosetting resin composition for light reflection involved in the above-mentioned present embodiment.

[0084] The method for producing the optical semiconductor element mounting substrate is not particularly limited, and the substrate can be produced, for example, by transfer molding using a light reflecting thermosetting resin composition. Figure 2 1 is a schematic diagram showing an embodiment of the process of manufacturing a substrate for mounting an optical semiconductor element. The substrate for mounting an optical semiconductor element can be manufactured, for example, by the following process: forming a metal line 105 from a metal foil by a known method such as stamping and etching, and performing a Ni / Ag plating layer 104 by electroplating ( Figure 2 (a)); then, the metal circuit 105 is arranged in a mold 151 of a predetermined shape, and a light-reflecting thermosetting resin composition is injected from a resin injection port 150 of the mold 151, and a transfer molding process is performed under predetermined conditions ( Figure 2 (b)); then the process of removing the mold 151 ( Figure 2 (c)). In this way, an optical semiconductor element mounting area (recess) 200 surrounded by a reflector 103 made of a cured product of a light-reflecting thermosetting resin composition is formed on the optical semiconductor element mounting substrate. In addition, the bottom surface of the recess 200 is composed of a metal line 105 serving as a first connecting terminal and a metal line 105 serving as a second connecting terminal and an insulating resin molded body 103' formed of a cured product of a light-reflecting thermosetting resin composition disposed therebetween. In addition, as the conditions for the above-mentioned transfer molding, it is preferred to perform the molding at a mold temperature of 170 to 200°C (more preferably 170 to 190°C) and a molding pressure of 0.5 to 20 MPa (more preferably 2 to 8 MPa) for 60 to 120 seconds, and at a post-curing temperature of 120°C to 180°C for 1 to 3 hours.

[0085] [Optical semiconductor device]

[0086] The optical semiconductor device involved in this embodiment has the above-mentioned optical semiconductor element mounting substrate and the optical semiconductor element mounted on the optical semiconductor element mounting substrate. As a more specific example, there can be cited an optical semiconductor device comprising the above-mentioned optical semiconductor element mounting substrate, the optical semiconductor element disposed in the concave portion of the optical semiconductor element mounting substrate, and a sealing resin portion containing a fluorescent body that fills the concave portion and seals the optical semiconductor element.

[0087] Figure 3 1 is a perspective view showing an embodiment of a state where an optical semiconductor element 100 is mounted on an optical semiconductor element mounting substrate 110. Figure 3 As shown, the optical semiconductor element 100 is mounted at a predetermined position of an optical semiconductor element mounting region (recess) 200 of an optical semiconductor element mounting substrate 110 , and is electrically connected to a metal line 105 via a bonding wire 102 . Figure 4 and Figure 5 FIG. 1 is a schematic cross-sectional view showing one embodiment of an optical semiconductor device. Figure 4 and Figure 5 As shown, the optical semiconductor device includes a substrate 110 for mounting an optical semiconductor element, an optical semiconductor element 100 arranged at a specified position in a recess 200 of the substrate 110 for mounting an optical semiconductor element, and a sealing resin portion formed of a transparent sealing resin 101 containing a fluorescent body 106 that fills the recess 200 and seals the optical semiconductor element. The optical semiconductor element 100 is electrically connected to a metal circuit 105 formed with a Ni / Ag plating layer 104 via a bonding wire 102 or a solder bump 107.

[0088] Figure 6 This is also a schematic cross-sectional view showing one embodiment of an optical semiconductor device. Figure 6 In the optical semiconductor device shown, an LED element 300 is arranged at a predetermined position on a lead 304 formed with a reflector 303 via a die bonding material 306 , the LED element 300 and the lead 304 are electrically connected by a bonding wire 301 , and the LED element 300 is sealed by a transparent sealing resin 302 containing a fluorescent substance 305 .

[0089] As mentioned above, although the preferred embodiment of the present invention was described, the present invention is not limited thereto.

[0090] Example

[0091] Hereinafter, the present invention will be described in detail with reference to Examples, but the present invention is not limited thereto.

[0092] [Preparation of light-reflecting thermosetting resin composition]

[0093] In order to prepare the thermosetting resin compositions of Examples and Comparative Examples, the following components were prepared.

[0094] (Epoxy resin)

[0095] Trade name "TEPIC-S" manufactured by Nissan Chemical Industries, Ltd. (triglycidyl isocyanurate, epoxy equivalent: 100)

[0096] (Curing agent)

[0097] Tetracarboxylic dianhydride of formula (2) (Rx: cyclohexane ring, softening point: 40°C)

[0098] New Japan Chemical Co., Ltd., trade name "RIKACID HH" (hexahydrophthalic anhydride, melting point: 35°C)

[0099] Trade name "ODPA" manufactured by Manac Incorporated (4,4'-oxydiphthalic anhydride, melting point: 229°C)

[0100] (Curing accelerator)

[0101] Trade name "PX-4PB" (tetrabutylphosphonium tetraphenylborate) manufactured by Nippon Chemical Industrial Co., Ltd.

[0102] (Coupling agent)

[0103] Epoxysilane compound (3-glycidoxypropyltrimethoxysilane)

[0104] (Release Agent)

[0105] NOF CORPORATION's trade name "ZNST" (zinc stearate)

[0106] Trade name "SCI-ZNB" (zinc behenate) manufactured by UN ACE CORPORATION

[0107] Trade name "Al-St (102)" (aluminum stearate) manufactured by Nitto Chemical Industry Co., Ltd.

[0108] (additive)

[0109] ADEKA CORPORATION product name "ADEKA STAB AO-60" (hindered phenol antioxidant)

[0110] ADEKA CORPORATION product name "ADEKA STAB PEP-36A" (phosphite-based antioxidant)

[0111] Trade name "DBL-C32" (silicone wax dispersant) manufactured by Gelest, Inc.

[0112] (Inorganic hollow particles)

[0113] 3M Japan Limited product name "iM30K" (median particle size: 18 μm, shell layer thickness: 0.61 μm, bulk density: 0.33 g / cm 3 , compressive strength: 186MPa)

[0114] (Silicon Dioxide)

[0115] Trade name "FP-950" (fused silica) manufactured by Denka Company Limited

[0116] Made by Admatechs Company Limited, trade name "S0-25R" (fused silica)

[0117] Trade name "SYLOPHOBIC 702" (hydrophobic fine powder silica) manufactured by FUJI SILYSIA CHEMICAL LTD.

[0118] (white pigment)

[0119] Titanium oxide (median particle size 0.2 μm)

[0120] Each component was blended in the proportion (parts by mass) shown in Table 1 or Table 2, and fully kneaded in a mixer, and then melt-kneaded in a mixing roll at 40° C. for 15 minutes to obtain a kneaded product. The kneaded product was cooled and pulverized to prepare thermosetting resin compositions of Examples and Comparative Examples.

[0121] [evaluate]

[0122] (Spiral Flow)

[0123] The thermosetting resin composition was transfer molded using a spiral flow measurement mold conforming to the EMMI-1-66 standard at a molding mold temperature of 180°C, a molding pressure of 6.9 MPa, and a curing time of 90 seconds. The flow distance (cm) of the thermosetting resin composition during transfer molding was measured.

[0124] (Light reflectivity)

[0125] The thermosetting resin composition was transfer molded under the conditions of a molding die temperature of 180°C, a molding pressure of 6.9 MPa, and a curing time of 90 seconds, and then post-cured at 150°C for 2 hours to produce a test piece with a thickness of 3.0 mm. The light reflectance of the test piece at a wavelength of 460 nm was measured using an integrating sphere spectrophotometer V-750 (manufactured by JASCO Corporation).

[0126] (Mold release)

[0127] The thermosetting resin composition was poured into a mold for shear demolding force measurement (reference Figure 7 ) was molded. The molding conditions were mold temperature of 180°C, molding pressure of 6.9 MPa, and curing time of 90 seconds. Figure 7 As shown, the die 400 for measuring the shear demolding force is composed of an upper die 410 and a lower die 416, and the upper die 410 is provided with a resin injection port 412 and a concave portion 414 for molding a disk-shaped molded product with a diameter of 20 mm and a thickness of 2 mm. A chrome-plated stainless steel plate 420 with a length of 50 mm×width of 35 mm×thickness of 0.4 mm is inserted into the die 400 for measuring the shear demolding force, and after the thermosetting resin composition is molded on the stainless steel plate 420, the stainless steel plate 420 is immediately pulled out, and the maximum pull-out force at this time is measured using a push-pull force gauge (manufactured by IMADA SEISAKUSHO CO., LTD, model name "SH").

[0128] The maximum pull-out force was defined as the shear demolding force of the first injection, and the thermosetting resin composition was repeatedly molded using the same stainless steel plate to measure the shear demolding force. The number of injections at which the shear demolding force reached 0 MPa is shown in Tables 1 and 2.

[0129] [Table 1]

[0130]

[0131] [Table 2]

[0132]

[0133] From Table 1 and Table 2, it can be confirmed that the light-reflecting thermosetting resin composition of the example has excellent mold release property and heat resistance.

[0134] Explanation of symbols

[0135] 100-optical semiconductor element, 101-sealing resin, 102-bonding wire, 103-reflector, 103'-insulating resin molded body, 104-Ni / Ag plating, 105-metal line, 106-phosphor, 107-solder bump, 110-substrate for mounting optical semiconductor element, 150-resin injection port, 151-mold, 200-optical semiconductor element mounting area, 300-LED element, 301-bonding wire, 302-sealing resin, 303-reflector, 304-lead, 305-phosphor, 306-grain bonding material, 400-mold for measuring shear demolding force, 410-upper mold, 412-resin injection port, 414-recess, 416-lower mold, 420-stainless steel plate.

Claims

1. A light-reflecting thermosetting resin composition comprising an epoxy resin, a curing agent, an inorganic filler, a white pigment and a release agent, The release agent contains zinc metal soap and aluminum metal soap, The zinc metal soap is a metal salt of zinc and a long-chain fatty acid. The aluminum metal soap is a metal salt of aluminum and a long-chain fatty acid. The curing agent contains tetracarboxylic dianhydride having a melting point of 180 to 400° C. The amount of the release agent is 1 to 15 parts by mass relative to 100 parts by mass of the epoxy resin. The content of the curing agent is 10 to 150 parts by mass based on 100 parts by mass of the epoxy resin.

2. The light-reflecting thermosetting resin composition according to claim 1, wherein The zinc-based metal soap contains a metal salt of zinc and a long-chain fatty acid having 10 or more carbon atoms.

3. The light-reflecting thermosetting resin composition according to claim 2, wherein: The long-chain fatty acid has 20 or more carbon atoms.

4. The light-reflecting thermosetting resin composition according to any one of claims 1 to 3, wherein The inorganic filler contains inorganic hollow particles with a median particle size of 1 μm to 25 μm. 5 . A substrate for mounting an optical semiconductor element, comprising a cured product of the light-reflecting thermosetting resin composition according to claim 1 .

6. A substrate for mounting an optical semiconductor element, comprising a recessed portion consisting of a bottom surface and a wall surface, wherein the bottom surface of the recessed portion is a mounting portion for the optical semiconductor element. At least a part of the wall surface of the recessed portion is formed of a cured product of the light-reflecting thermosetting resin composition according to any one of claims 1 to 4 .

7. A substrate for mounting an optical semiconductor element, comprising a substrate and a first connection terminal and a second connection terminal provided on the substrate, A cured product of the light-reflecting thermosetting resin composition according to any one of claims 1 to 4 is provided between the first connection terminal and the second connection terminal. 8 . An optical semiconductor device comprising the optical semiconductor element mounting substrate according to claim 5 and an optical semiconductor element mounted on the optical semiconductor element mounting substrate.

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