A method for processing special-shaped holes in glass

Abstract

The present invention belongs to the technical field of processing special-shaped holes in glass materials, and is a method for processing special-shaped holes in glass. Step 1: editing the processing path of the special-shaped hole; step 2: cutting the glass to be processed by a laser, the laser moving path executes the processing path of the special-shaped hole, and the laser beam executes the optimized scanning path to complete the processing of the special-shaped hole in the glass. When the special-shaped hole to be processed is a closed hole, the optimization of the laser beam scanning path includes: optimizing the scanning filling trajectory in the xy plane, rounding the features such as right angles, optimizing the spacing of the filling scanning trajectory and the overall slit width; using a narrow upper and wide lower slit in the depth direction of the glass to ensure the discharge of powder and the fall-off of the residual material in the hole; using a spiral filling curve and optimizing the start and end point scanning delay. When the special-shaped hole to be processed is a non-closed hole, laser processing is performed at the edge of the opening of the non-closed hole to form a closed hole with a thin edge wall retained at the opening of the non-closed hole, and then the non-closed hole is formed by grinding and removing the thin edge wall through a mechanical processing method.

Description

Technical Field

[0001] The invention belongs to the technical field of processing special-shaped holes in glass materials, in particular to a method for processing special-shaped holes in glass. Background Art

[0002] Glass products are widely used in photovoltaics, electronics, construction and other fields. With the development of diversified integration of various products, higher requirements are placed on the processing of special-shaped holes and boundary features on glass.

[0003] The traditional processing method for special-shaped holes in glass is to use diamond drill bits for mechanical processing. This processing method has poor hole quality, limited hole size and depth-to-diameter ratio, cannot process small curvature radius features, and has defects such as diamond drill bit wear, which cannot meet the market demand for increasingly miniaturized and high-precision products. Figure 1 As shown in the figure, the mechanical processing method of butterfly clamp holes is very prone to edge collapse at corners and other parts with right-angle features. Some special processing methods, such as abrasive water jet processing technology, cooperate with CNC systems, and are flexible in processing, especially for special-shaped holes with complex features. The operation is simple and the processing efficiency is high, but the energy consumption is high, the waste treatment is troublesome, and due to the jet sluggishness and uneven distribution of abrasives, the processing surface is prone to defects such as diagonal stripes.

[0004] Laser processing is a non-contact, high-precision processing technology with no mechanical force during the processing. It is widely used in the processing of hard and brittle materials. When processing holes in glass materials, it has the advantages of non-contact, small edge collapse, small internal stress, and simple operation. However, it has low efficiency and poor quality for cutting special-shaped holes with complex features. When it comes to holes with non-closed features on the edge of the glass, the glass-air interface at the processing edge will affect the focus of the laser, resulting in cutting failure. In addition, at the chamfer of the glass, the laser beam cannot be focused normally due to the refraction of the laser, resulting in cutting failure. Summary of the invention

[0005] In order to solve the above problems, the present invention proposes a method for processing special-shaped holes in glass, which can solve the problems existing in laser cutting of complex special-shaped holes and non-closed edge features in glass materials.

[0006] To achieve the above object, the technical solution adopted by the present invention is:

[0007] A method for processing special-shaped holes in glass comprises the following steps:

[0008] Step 1: Edit the processing path of the special-shaped hole;

[0009] Step 2: Cut the glass to be processed by laser, the laser moving path executes the processing path of the special-shaped hole, and the laser beam executes the optimized scanning path to complete the processing of the special-shaped hole in the glass.

[0010] Preferably, when processing the special-shaped hole as a closed hole, the optimization of the laser beam scanning path includes: optimizing the scanning filling trajectory in the xy plane, rounding the features such as right angles, optimizing the spacing of the filling scanning trajectory and the overall slit width; adopting a narrow top and wide bottom slit in the depth direction of the glass to ensure the discharge of powder and the falling off of the residual material in the hole, thereby improving the cutting success rate; adopting a spiral filling curve and optimizing the scanning delay of the start and end points to eliminate starting defects.

[0011] Preferably, when the processed special-shaped hole is a non-closed hole, the optimization of the laser beam scanning path includes: performing laser processing at an edge portion away from the opening of the non-closed hole to form a closed hole with a thin edge wall retained at the opening of the non-closed hole, and then grinding away the thin edge wall by mechanical processing to form a non-closed hole.

[0012] Preferably, the edge thin wall thickness is 1mm-3mm.

[0013] Preferably, the laser source is a nanosecond green laser, and the scanning system is a digital galvanometer system.

[0014] Preferably, the glass material includes quartz glass, bathroom glass, or photovoltaic glass, and the glass thickness is less than 15 mm.

[0015] As a preferred method, the processing path editing of the special-shaped hole in step 1 includes the import of the special-shaped hole vector diagram, and the optimization of the laser beam scanning path through the special-shaped hole vector diagram.

[0016] Preferably, before processing the special-shaped hole, the laser focusing spot is regulated, and the regulation content includes the spot size, energy density control and spot distortion correction.

[0017] Preferably, laser optimization is performed before processing special-shaped holes in glass. The laser optimization includes system delay parameters, laser on delay, laser off delay, scanning delay and idling delay, to ensure the quality consistency of the starting and ending points of the cutting and improve the success rate of hole cutting.

[0018] Preferably, when the thickness of the glass to be processed is not greater than 5 mm, the spacing of the laser beam scanning tracks is 0.03 mm-0.05 mm, and the overall width of the slit is 0.3 mm-0.5 mm.

[0019] The beneficial effects of using the present invention are:

[0020] According to the characteristics of special-shaped holes, this processing method optimizes the scanning and filling trajectory in the xy plane, rounds the features such as right angles, optimizes the spacing of the filling scanning trajectory and the overall slit width; adopts a slit that is narrow at the top and wide at the bottom in the depth direction of the glass; adopts a spiral filling curve and optimizes the scanning delay of the start and end points. The above optimization methods can improve the cutting success rate and eliminate starting point defects.

[0021] When the processed hole is an open hole, based on the above optimization method, a closed hole is first cut, and then a non-closed hole is formed by mechanical grinding, which can solve the problem of laser cutting of complex special-shaped holes and non-closed edge features of glass materials. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a schematic diagram of the mechanical processing of butterfly clamps in the prior art.

[0023] Figure 2 It is a schematic diagram of the optimization of the dumbbell hole path in the glass special-shaped hole processing method of the present invention.

[0024] Figure 3 This is a laser-mechanical composite processing process for non-closed holes in the glass special-shaped hole processing method of the present invention. DETAILED DESCRIPTION

[0025] In order to make the purpose, technical solution and advantages of the technical solution more clear, the technical solution is further described in detail below in conjunction with specific implementation methods. It should be understood that these descriptions are only exemplary and are not intended to limit the scope of the technical solution.

[0026] This embodiment provides a method for processing a special-shaped hole in glass, comprising the following steps:

[0027] Step 1: Edit the processing path of the special-shaped hole;

[0028] Step 2: Cut the glass to be processed by laser, the laser moving path executes the processing path of the special-shaped hole, and the laser beam executes the optimized scanning path to complete the processing of the special-shaped hole in the glass.

[0029] When processing special-shaped holes as closed holes, the optimization of the laser beam scanning path includes: optimizing the scanning and filling trajectory in the xy plane, rounding the features such as right angles, optimizing the spacing of the filling scanning trajectory and the overall slit width; using a narrow top and wide bottom slit in the depth direction of the glass to ensure the discharge of powder and the fall off of excess material in the hole, thereby improving the cutting success rate; using a spiral filling curve and optimizing the scanning delay of the start and end points to eliminate starting defects.

[0030] When the processed special-shaped hole is a non-closed hole, the optimization of the laser beam scanning path includes: performing laser processing at the edge of the opening of the non-closed hole to form a closed hole with a thin edge wall retained at the opening of the non-closed hole, and then grinding away the thin edge wall through mechanical processing methods to form a non-closed hole.

[0031] The thickness of the edge thin wall is 1mm-3mm.

[0032] The laser source is a nanosecond green laser, and the scanning system is a digital galvanometer system.

[0033] The glass material includes quartz glass, bathroom glass, or photovoltaic glass, and the glass thickness is less than 15 mm.

[0034] The processing path editing of the special-shaped hole in step 1 includes the import of the special-shaped hole vector diagram, and the optimization of the laser beam scanning path through the special-shaped hole vector diagram

[0035] Preferably, before processing the special-shaped holes, in order to ensure the processing accuracy and quality and meet different processing requirements, it is necessary to adjust the laser focus spot, and the adjustment content includes spot size, energy density control and spot distortion correction.

[0036] Laser optimization is performed before processing special-shaped holes in glass. The laser optimization includes system delay parameters, laser on delay, laser off delay, scanning delay and idle delay to ensure the quality consistency of the cutting start and end points and improve the success rate of hole cutting.

[0037] When the thickness of the glass to be processed is not greater than 5 mm, the spacing of the laser beam scanning tracks is 0.03 mm to 0.05 mm, and the overall width of the slit is 0.3 mm to 0.5 mm.

[0038] The specific method of processing closed special-shaped holes and non-closed special-shaped holes by the present method is described in detail below through examples.

[0039] Example 1

[0040] In this embodiment, when processing the special-shaped hole into a closed hole, specifically as follows Figure 2 As shown, this embodiment provides a method for cutting a dumbbell hole in a glass material, which comprises the following steps:

[0041] Nanosecond green laser is emitted by the laser, passes through the reflector, complex optical path system (including beam expander, dynamic focusing unit), scanning head, and emits light from the telecentric field mirror. The laser focus is located at the bottom of the glass material, using a spiral filling curve and optimizing the start and end point scanning delay to eliminate the starting point defect. The laser focus spot state and scanning trajectory are controlled by a computer.

[0042] Scanning path optimization, including rounding of dumbbell hole corners, adjustment of scanning track spacing and overall slit width. Generally, for glass with a thickness of 5mm or less, the scanning track spacing is 0.03-0.05mm, and the overall slit width is 0.3-0.5mm.

[0043] The adjustment of the state of the focused light spot includes the regulation of parameters such as the light spot size and energy density. The laser selected in the present invention is a Nd:YVO4 nanosecond solid laser with a wavelength of 532nm, and the maximum diameter of the central focused light spot is no more than 20μm.

[0044] The laser focus spot moves from bottom to top along the scanning path. The temperature of the area to be processed rises and compressive stress is generated. Air convection causes residual stress in this area. When this residual stress is greater than the strength limit of the glass, micro cracks are generated. The cracks extend along the scanning path to form processing cuts. The optimization of the scanning path makes laser processing smoother and greatly improves the success rate of products.

[0045] Example 2

[0046] In this embodiment, based on the scheme of embodiment 1, when the processed hole is a non-closed special-shaped hole, a closed special-shaped hole is first cut out, and then the non-closed special-shaped hole is formed by mechanically processing the closed special-shaped hole. The details are as follows:

[0047] like Figure 3 As shown, this embodiment provides a method for cutting a butterfly clamp hole on the edge of a glass material, wherein the hole is a non-closed special-shaped hole, and the method comprises the following steps:

[0048] The scanning path is planned, and nanosecond green laser processing is used in the area within 1-3mm away from the edge. The vector diagram of the laser-processed part of the special-shaped hole is imported into the computer, and the scanning path is optimized.

[0049] Adjust the position and state of the laser focus, adjust the height of the workbench, focus the laser on the lower surface of the glass material, and adjust the appropriate processing parameters according to the material thickness and processing requirements.

[0050] The edge of the glass to be processed is quickly ground with a mechanical grinding head to achieve laser-mechanical composite processing.

[0051] The above contents are only preferred embodiments of the present invention. For ordinary technicians in this field, many changes can be made in the specific implementation methods and application scopes based on the ideas of the present technical content. As long as these changes do not deviate from the concept of the present invention, they all fall within the scope of protection of this patent.

Claims

1. A method for processing special-shaped holes in glass, characterized in that: The steps include: Step 1, editing the processing path of the special-shaped hole, and the processing path editing of the special-shaped hole includes importing the special-shaped hole vector diagram, and optimizing the laser beam scanning path through the special-shaped hole vector diagram; Step 2: Cut the glass to be processed by laser, the laser moving path executes the processing path of the special-shaped hole, and the laser beam executes the optimized scanning path to complete the processing of the special-shaped hole in the glass; before the special-shaped hole processing, the laser focusing spot is regulated, and the regulation content includes the spot size, energy density control and spot distortion correction; When processing special-shaped holes as closed holes, the optimization of the laser beam scanning path includes: optimizing the scanning filling trajectory in the xy plane, rounding the right-angle features, optimizing the spacing of the filling scanning trajectory and the overall slit width; using a narrow top and wide bottom slit in the depth direction of the glass; using a spiral filling curve and optimizing the start and end point scanning delay to eliminate starting point defects; When the processed special-shaped hole is a non-closed hole, the optimization of the laser beam scanning path includes: performing laser processing at the edge of the opening of the non-closed hole to form a closed hole with a thin edge wall retained at the opening of the non-closed hole, and then grinding and removing the thin edge wall by a mechanical processing method to form a non-closed hole; performing laser optimization before processing the special-shaped hole in the glass, the laser optimization includes setting system delay parameters, and the system delay parameters include laser on delay, laser off delay, scanning delay and idling delay; when the thickness of the glass to be processed is not more than 5mm, the laser beam scanning track spacing is 0.03mm-0.05mm, and the overall width of the slit is 0.3mm-0.5mm.

2. The method for processing special-shaped holes in glass according to claim 1, characterized in that: The thickness of the edge thin wall is 1mm-3mm.

3. The method for processing special-shaped holes in glass according to claim 1, characterized in that: The laser source is a nanosecond green laser, and the scanning system is a digital galvanometer system.

4. The method for processing special-shaped holes in glass according to claim 1, characterized in that: The glass material includes quartz glass, and the glass thickness is less than 15 mm.

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