Docking mechanism and device

Through the docking mechanism of the three-level correction module, the deviation of electronic components is corrected step by step, solving the problems of low docking accuracy and low efficiency in the existing technology and realizing efficient and accurate batch testing.

CN114137255BActive Publication Date: 2025-09-16SUZHOU JIERUISI INTELLIGENT TECH CO LTD
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Patent Information

Application Number
CN202111655573.4
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2021-12-30
Publication Date
2025-09-16
Estimated Expiration
2041-12-30

AI Technical Summary

Technical Problem

In the existing technology, the docking accuracy and efficiency of electronic component testing are low, manual operation can easily damage components, and automatic machine operation can only perform single tests, which is difficult to meet mass production requirements.

Method used

The docking mechanism adopts a three-level correction module, including the first correction module, the second correction module and the third correction module. Through the combination of the probe module, the guide module and the movable plate, the deviation between the test object and the probe tip is corrected step by step to achieve high-precision docking.

Benefits of technology

It improves the accuracy and efficiency of electronic component docking, reduces the difficulty of docking, and enables simultaneous testing of multiple components to meet mass production needs.

✦ Generated by Eureka AI based on patent content.

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Abstract

The present invention discloses a docking mechanism, comprising a first correction module, the first correction module comprising a probe module and a guide module arranged relative to each other, the guide module and the probe module being movable relative to each other in the X, Y, and Z directions to correct the deviation between the probe tip and the joint of the object to be tested. The docking mechanism of the present invention aligns the carrier, the object to be tested, and the joint of the object to be tested step by step by providing a three-level correction module, thereby improving the alignment accuracy of the joint of the object to be tested and the probe tip, and reducing the difficulty of docking; and each docking mechanism automatically corrects itself separately without interfering with each other, thereby improving work efficiency.
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Description

Technical Field

[0001] The present invention relates to the technical field of testing equipment, and in particular to a docking mechanism. Background Art

[0002] As society evolves, electronic components are becoming increasingly complex, requiring them to be miniaturized and reliable. After completing the manufacturing process, they need to be tested. During this testing process, poor docking accuracy and even damage to the components can occur.

[0003] Current solutions, either manual or automated, still have drawbacks. For example, manual testing of electronic components can lead to inaccurate wiring connections, potentially damaging the components. This is both inefficient and costly. Automated testing, which uses vision guidance for connection accuracy, can only test individual components, resulting in low efficiency and insufficient mass production. Summary of the Invention

[0004] The object of the present invention is to provide a docking mechanism and device that can dock quickly and with high docking precision.

[0005] To achieve the above-mentioned purpose, the present invention provides a docking mechanism, including a first correction module, wherein the first correction module includes a probe module and a guide module arranged relatively to each other, and the guide module and the probe module can move relative to each other in three directions of X, Y, and Z to correct the deviation between the probe end and the docking joint of the product to be tested.

[0006] In one embodiment of the present invention, a plurality of first elastic members are provided between the probe module and the guide module, the guide module is processed with a guide groove, and the guide groove is processed with a 45-degree chamfer.

[0007] In one embodiment of the present invention, the docking mechanism also includes a second correction module, the second correction module includes a second movable plate and a second substrate, the second movable plate and the second substrate can move relative to each other in the X, Y, and Z directions, and the probe module is fixedly connected to the second movable plate.

[0008] In one embodiment of the present invention, the second movable plate and the second base plate are connected via a plurality of second tapered holes and a plurality of second tapered members, and a plurality of second elastic members are disposed between the second movable plate and the second base plate.

[0009] In one embodiment of the present invention, the second tapered hole and the second tapered member are clearance-fitted, and the line-surface angles of the generatrices of the second tapered hole and the second tapered member are both 45 degrees.

[0010] In one embodiment of the present invention, the docking mechanism also includes a third correction module, which includes a third movable plate and a third substrate. The third movable plate and the third substrate can move relative to each other in the X, Y, and Z directions. The second substrate is fixedly connected to the third movable plate. A pair of positioning pins is provided on the second substrate / third movable plate, and the top height of the positioning pins is higher than the height of the first correction module.

[0011] In one embodiment of the present invention, the third movable plate and the third base plate are connected to a plurality of third cone members through a plurality of third cone holes, and a third elastic member is sleeved on the outer surface of the third cone member.

[0012] In one embodiment of the present invention, the third tapered hole and the third tapered member are clearance-fitted, the line-plane angles of the generatrix of the third tapered hole and the third tapered member are both 45 degrees, and the line-plane angle of the generatrix of the locating pin is 60 degrees.

[0013] In one embodiment of the present invention, a plurality of probes are provided on the probe module, and the plurality of probes can be extended through the guide module.

[0014] The docking device of the present invention comprises at least two of the aforementioned docking mechanisms, and further comprises a pressing plate for pressing downward and a driving mechanism for driving the pressing plate to press downward.

[0015] To sum up, the docking mechanism of the present invention aligns the carrier, the object to be tested, and the object to be tested joint step by step by setting up a three-level correction module, thereby improving the alignment accuracy of the object to be tested joint and the probe end and reducing the difficulty of docking; and each docking mechanism automatically corrects separately without interfering with each other, thereby improving work efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a structural diagram of the docking device of the present invention;

[0017] Figure 2 It is a front view of the docking mechanism of the present invention;

[0018] Figure 3 is a cross-sectional view of a third correction module of the present invention;

[0019] Figure 4 This is a structural diagram of the combination of the second correction module and the third correction module of the present invention;

[0020] Figure 5 for Figure 4 A cross-sectional view taken along line AA;

[0021] Figure 6 for Figure 4 A cross-sectional view taken along line BB;

[0022] Figure 7is a structural diagram of the second movable plate of the present invention;

[0023] In the figure, D, docking mechanism; 1, pressure plate; 2, driving mechanism; 3, carrier placement plate;

[0024] 4. First calibration module; 41. Probe module; 42. Guide module; 43. First elastic member; 44. First groove; 45. Guide groove; 46. Probe;

[0025] 5. Second correction module; 51. Second movable plate; 52. Second base plate; 53. Second tapered hole; 54. Second tapered member; 55. Second groove; 56. Second elastic member; 57. Accommodation portion; 58. Opening;

[0026] 6. Third correction module; 61. Third movable plate; 62. Third base plate; 63. Third tapered hole; 64. Third cone member; 65. Third elastic member; 66. Positioning pin. DETAILED DESCRIPTION

[0027] The present invention will be further described below with reference to the accompanying drawings and specific embodiments so that those skilled in the art can better understand the present invention and implement it. However, the embodiments are not intended to limit the present invention.

[0028] The present invention is a docking mechanism for correcting the deviation between the electronic component joint and the probe tip when testing electronic components, which is used to improve test accuracy and test efficiency and reduce docking difficulty. In the following embodiments, the electronic component to be tested is referred to as a test product.

[0029] like Figure 1 As shown, the docking device of this embodiment includes eight docking mechanisms D, a pressure plate 1 and a driving mechanism 2. The driving mechanism 2 drives the pressure plate 1 to press toward the docking mechanism D. The eight docking mechanisms D are fixed on the same fixed plate and are synchronously moved closer to or away from the pressure plate 1 under the drive of a driving member. The eight docking mechanisms D are arranged in two rows on the fixed plate, with four docking mechanisms D in each row. Each docking mechanism D works independently without affecting each other. The eight docking mechanisms D dock with the products to be tested at the same time to improve efficiency. A carrier placement plate 3 is provided above the eight docking mechanisms D. A carrier is placed on the carrier placement plate 3. Eight products to be tested corresponding to the eight docking mechanisms D are placed on the carrier. They can dock with each docking mechanism D under the action of the pressure plate 1, thereby realizing the function of testing the products to be tested.

[0030] like Figure 2As shown, each docking mechanism D includes a first calibration module 4, a second calibration module 5, and a third calibration module 6, arranged in order from top to bottom. The first calibration module 4 corrects the deviation between the multiple probe tips and the joints of the DUT, the second calibration module 5 corrects the deviation between the first calibration module 4 and the DUT, and the third calibration module corrects the deviation between the docking mechanism D and the carrier.

[0031] like Figure 3 As shown, the third correction module 6 includes a third movable plate 61 and a third base plate 62. The third base plate 62 is fixedly connected to the fixed plate, and the second correction module 5 is fixedly connected to the third movable plate 61. The third base plate 62 is machined with two pairs of third tapered holes 63. Each third tapered hole 63 is equipped with a third cone member 64. The outer cylindrical surface of each third cone member 64 is sleeved with a third elastic member 65. The third cone members 64 are collectively connected to the third movable plate 61. One end of each third elastic member 65 abuts the lower surface of the third movable plate 61, and the other end abuts the upper surface of the third base plate 62. The third tapered hole 63 and the third cone member 64 are loosely matched, with an axial hole clearance of 0.8 mm. The tapered portions are completely aligned, and the line-to-surface angle of the generatrix of the third tapered hole 63 and the third cone member 64 is 45 degrees. The third elastic member 65 is disposed between the third movable plate 61 and the third base plate 62, providing a restoring force after the third movable plate 61 is pressed against the third base plate 62.

[0032] The second calibration module 5 includes a second movable plate 51 and a second base plate 52. The third calibration module 6 also includes a pair of positioning pins 66 disposed on the second base plate 52. The tops of the positioning pins 66 are higher than the height of the first calibration module 4. Together with the third calibration module 6, the positioning pins 66 calibrate the second calibration module 5. The pair of positioning pins 66 pass through the positioning holes of the carrier, guiding the second calibration module 5 toward the carrier.

[0033] The pair of positioning pins 66 cooperate with the third movable plate 61 and the third base plate 62 to enable the second correction module 5 to move relative to the third base plate 62 in the X, Y, and Z directions, driven by the third movable plate 61. The X, Y, and Z directions are the X-axis, Y-axis, and Z-axis directions in a rectangular coordinate system.

[0034] The position where the probe end of the docking mechanism D is accurately aligned with the docking joint of the object to be tested and does not require three-level correction is recorded as the reference position. The adjustment range of the third correction module 6 on the second correction module 5 is ±2mm in the X and Y directions, -2.5mm in the Z direction, and ±2 degrees of three rotational freedom.

[0035] like Figure 2 、 Figure 4As shown, the second base plate 52 is fixedly connected to the third movable plate 61, and the first correction module 4 is fixedly connected to the second movable plate 51. The second movable plate 51 is processed with two pairs of second tapered holes 53, each of which is provided with a second cone member 54. The second cone members 54 are connected to the second base plate 52. The second tapered holes 53 and the second cone members 54 are clearance-matched. The axial hole clearance is 0.5mm, and the taper parts are completely fitted. The line-surface angle of the second tapered holes 53 and the second cone member 54 generatrix is ​​45 degrees. Figure 5 As shown, four pairs of second grooves 55 are machined on the opposing surfaces of the second movable plate 51 and the second base plate 52, distributed at the four corners of the second movable plate 51 and the second base plate 52. A second elastic member 56 is disposed in each pair of second grooves 55. The second elastic member 56 is disposed between the second movable plate 51 and the second base plate 52 to provide a restoring force when the second movable plate 51 is pressed against the second base plate 52.

[0036] Because the first calibration module 4 is fixed to the second movable plate 51, it can move relative to the second base plate 52 in the X, Y, and Z directions. The second calibration module 5 can adjust the first calibration module 4 within a range of ±1 mm in the X and Y directions, -0.9 mm in the Z direction, and ±1 degree of rotational freedom.

[0037] like Figure 2 、 Figure 6 As shown, the first correction module 4 includes a probe module 41 and a guide module 42, and the probe module 41 is fixedly connected to the second movable plate 51. The guide module 42 is connected to the probe module 41 through a plurality of first elastic members 43. The relative surfaces of the guide module 42 and the probe module 41 are processed with a plurality of pairs of first grooves 44, and each first elastic member 43 is arranged in the first groove 44. The guide module 42 is processed with a guide groove 45, and a plurality of probes 46 are provided on the probe module 41. The guide groove 45 is processed with through holes corresponding to the plurality of probes 46, and the plurality of probes 46 can extend through the corresponding through holes. The guide groove 45 is processed with a 0.4mm long, 45-degree chamfer, which cooperates with the joint of the test piece to guide the joint to slide into the guide groove 45. Since the probe module 41 and the guide module 42 are connected by the first elastic member 43, the probe module 41 and the guide module 42 can move relative to each other in the three directions of X, Y, and Z. The first elastic member 43 is disposed between the probe module 41 and the guide module 42 to provide a restoring force when the guide module 42 is pressed close to the probe module 41. The first calibration module 4 can adjust the guide module 42 within a range of ±0.4 mm in the X and Y directions and -0.7 mm in the Z direction.

[0038] like Figure 7As shown, in order to make more rational use of space, a receiving portion 57 for accommodating the probe module 41 is provided on the lower surface of the second movable plate 51. The probe module 41 is arranged in the receiving portion 57 and is fixedly connected to the second movable plate 51. The receiving portion 57 passes upward through the second movable plate 51 and is processed with an opening 58. The guide module 42 is connected to the probe module 41 through a plurality of first elastic members 43 and extends through the opening 58. The opening 58 is clearance-matched with the probe module 41, and the clearance is 0.2 mm, so that the probe module 41 and the guide module 42 can move relative to each other in the three directions of X, Y, and Z.

[0039] The first elastic member 43 , the second elastic member 56 , and the third elastic member 65 are preferably springs, which provide a restoring force for each correction module of the docking mechanism D.

[0040] In this embodiment, the working process of the docking device is as follows:

[0041] The carrier with the test object is placed on the carrier placement plate 3 , the driving member drives the carrier placement plate 3 to be placed under the pressing plate 1 , and the driving mechanism 2 drives the pressing plate 1 to press toward the docking mechanism D.

[0042] During the downward movement, the positioning holes on the carrier first contact the pair of positioning pins 66. With the carrier fixed, the third calibration module 6 adjusts the position of the second calibration module 5 within the constraints of the carrier's positioning holes and the pair of positioning pins 66, shifting the entire second calibration module 5 toward the carrier, eliminating any misalignment between the docking mechanism D and the carrier.

[0043] Subsequently, the pressure plate 1 continues to press down, and the docking joint of the product to be tested contacts the guide module 42 and slides into the guide groove 45 through the guide groove 45. The position of the docking joint of the product to be tested is fixed. Under the restriction of the docking joint of the product to be tested and the guide groove 45, the second correction module 5 adjusts the position of the first correction module 4 so that the first correction module 4 is offset as a whole toward the product to be tested, thereby eliminating the deviation between the first correction module 4 and the product to be tested.

[0044] Finally, the pressure plate 1 continues to press downward, and the probe 46 extends from the guide slot 45. Due to the two-stage deviation correction described above, the deviation between the joint of the test object and the probe tip is relatively small. Because the joint of the test object is fixed in position, under the constraints of the joint and the probe tip, the probe module 41 deflects toward the joint of the test object, allowing the joint to mate with the probe tip, eliminating the deviation between the joint and the probe tip.

[0045] The above three-stage calibration module can improve docking efficiency. In the case where the deviation between the docking joint of the test object and the probe tip is small, the adjustment of the third calibration module 6 / the second calibration module 5 will not be started.

[0046] The above embodiments are merely preferred embodiments for the purpose of fully illustrating the present invention, and the scope of protection of the present invention is not limited thereto. Equivalent substitutions or modifications made by those skilled in the art based on the present invention are all within the scope of protection of the present invention. The scope of protection of the present invention shall be subject to the claims.

Claims

1. A docking mechanism, comprising a first calibration module, characterized in that: The first correction module includes a probe module and a guide module arranged relative to each other, wherein the guide module and the probe module can move relative to each other in the three directions of X, Y, and Z to correct the deviation between the probe tip and the joint of the test object; The docking mechanism further includes a second correction module, the second correction module including a second movable plate and a second base plate, the second movable plate and the second base plate being movable relative to each other in the X, Y, and Z directions to correct the deviation between the first correction module and the object to be tested; The docking mechanism further includes a third correction module, which includes a third movable plate and a third base plate. The third movable plate and the third base plate are movable relative to each other in the X, Y, and Z directions to correct the deviation between the docking mechanism and the carrier. The probe module is fixedly connected to the second movable plate, the second base plate is fixedly connected to the third movable plate, and a pair of positioning pins are provided on the second base plate / third movable plate, and the top height of the positioning pins is higher than the height of the first correction module; The second movable plate and the second base plate are connected through a plurality of second conical holes and a plurality of second cone members, and a plurality of second elastic members are provided between the second movable plate and the second base plate; The second tapered hole and the second tapered member are clearance-matched, and the line-surface angles of the generatrices of the second tapered hole and the second tapered member are both 45 degrees; The third movable plate and the third base plate are connected to a plurality of third cone members through a plurality of third cone holes, and a third elastic member is sleeved on the outer surface of the third cone member; The third tapered hole and the third tapered member are clearance-fitted, the line-plane angles of the generatrix of the third tapered hole and the third tapered member are both 45 degrees, and the line-plane angle of the generatrix of the locating pin is 60 degrees.

2. The docking mechanism according to claim 1, wherein: A plurality of first elastic members are provided between the probe module and the guide module. The guide module is processed with a guide groove, and the guide groove is processed with a 45-degree chamfer.

3. The docking mechanism according to claim 1, wherein: The probe module is provided with a plurality of probes, and the plurality of probes can be extended through the guide module.

4. A docking device comprising at least two docking mechanisms according to any one of claims 1 to 3, characterized in that: The docking device also includes a pressing plate for pressing downward and a driving mechanism for driving the pressing plate to press downward.

Citation Information

Patent Citations

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