Power conversion device

Abstract

The power conversion device includes a power device, a heat dissipation member disposed opposite the power device with an insulating resin member interposed therebetween, and a plurality of plate-shaped bus bars having one end connected to the power device. The power conversion device includes a plurality of input bus bars connected to input terminals of the power device. At least one of the plurality of input bus bars is vertically disposed in a direction along a plate width so as to coincide with a direction along a normal line of an opposite surface of the heat dissipation member to the power device, and is disposed relative to the heat dissipation member so as to interpose the insulating resin member therebetween.

Description

Technical Field

[0001] This invention relates to an electric power conversion device.

[0002] This application claims priority based on Japanese Patent Application No. 2020-149208 filed on September 4, 2020, the contents of which are incorporated herein by reference. Background Technology

[0003] In vehicles such as electric vehicles, a power conversion unit (PCU) is installed between the battery and the motor. Such a power conversion unit has multiple power devices (power semiconductor chips) and a power module housing that houses these power devices.

[0004] For example, as disclosed in Japanese Patent No. 5671417, a plate-shaped busbar is provided in the power conversion device to form a power transmission circuit. The busbar is connected to a power device.

[0005] In Japanese Patent No. 5671417, a busbar is arranged above a cooler. The busbar is positioned with its surface and back facing vertically. In Japanese Patent No. 5671417, power devices are arranged on both sides of the centrally located busbar when viewed from above. Furthermore, the busbar and power devices are designed to be cooled together by the cooler.

[0006] However, in Japanese Patent No. 5671417, the plate-shaped busbars are arranged with their surface and back facing vertically. Therefore, it is necessary to ensure a relatively wide space for the busbars when viewed from above. Consequently, the shape of the cooler appears larger when viewed from above. Furthermore, the shape of the power conversion device appears larger when viewed from above.

[0007] For example, one could consider miniaturizing the cooler by positioning the busbars offset from above it, thereby reducing the top-view shape of the power conversion device. However, if the current supplied to the power devices increases, the heat generated by the power devices also increases. Therefore, if the busbars are positioned offset from above the cooler, the cooling of the busbars becomes insufficient, and there is a possibility that the heat from the power devices can be transferred to other circuit components via the busbars. Summary of the Invention

[0008] The present invention was made in view of the above-mentioned problems, and its object is to suppress the heat of the power device from being transferred to the outside via the busbar in a power conversion device having a power device and a busbar connected to the power device, and to reduce the size of the shape of the power conversion device when viewed from above.

[0009] As a solution to the above-mentioned problems, the present invention adopts the following approach.

[0010] The power conversion device of the first type adopts the following structure: it includes: a power device; a heat dissipation component, which is disposed opposite to the power device in such a way that an insulating resin component is sandwiched in the middle; a plurality of plate-shaped busbars, one end of which is connected to the power device; as the busbars, it includes a plurality of input busbars connected to the input terminals of the power device, at least one of the plurality of input busbars being erected in such a way that the direction along the width of the plate is aligned with the direction along the normal of the surface of the heat dissipation component opposite to the power device, and is disposed opposite to the heat dissipation component in such a way that the insulating resin component is sandwiched in the middle.

[0011] The second type of power conversion device adopts the following structure: In the first type described above, the input busbar includes a high-voltage side input busbar connected to the positive terminal of the power device, and the input busbar includes a low-voltage side input busbar connected to the negative terminal of the power device. At least one of the high-voltage side input busbar and the low-voltage side input busbar is vertically arranged so that it aligns with the direction along the width of the board and the direction along the normal to the surface of the heat dissipation member opposite to the power device, and is configured relative to the heat dissipation member so that the insulating resin member is sandwiched in the middle.

[0012] The third type of power conversion device adopts the following structure: in the first or second type described above, as the bus bar, it has a connecting bus bar that connects multiple input bus bars.

[0013] The power conversion device of the fourth method adopts the following structure: In the third method described above, the multiple input busbars and the connecting busbars are integrated.

[0014] The power conversion device of the fifth method adopts the following structure: In the third method mentioned above, the connecting bus bar is set to be separate from the input bus bar.

[0015] The power conversion device of the sixth method adopts the following structure: In the fifth method described above, it includes an electrical component for fastening the other end of the input busbar, and the connecting busbar is fastened together with the other end of the input busbar.

[0016] The power conversion device of the seventh method has the following structure: in the fifth or sixth method described above, it includes an electrical component for fastening the other end of the input busbar, and the connecting busbar is supported by the electrical component.

[0017] The power conversion device of the eighth type adopts the following structure: In any of the third to seventh types mentioned above, the connecting busbar is arranged in such a way that the direction along the width of the plate and the direction along the width of the plate are aligned with the direction of the normal to the surface of the heat dissipation component opposite to the power device.

[0018] The power conversion device of the ninth embodiment adopts the following structure: in any of the first to eighth embodiments described above, a power module housing is provided to hold a plurality of the power devices. The power module housing has a partition wall disposed between the power devices, such that the input busbar, which is erected along the width of the board and aligned with the direction of the normal to the surface of the heat dissipation component opposite to the power device, is embedded in the partition wall.

[0019] The power conversion device of the tenth method adopts the following structure: In any of the first to ninth methods mentioned above, the power devices are arranged in a row along a straight direction, and the other end of the input busbar is arranged on one side of the power device in the orthogonal direction of the arrangement of the power devices, and the other end of the busbar connected to the output terminal of the power device is arranged on the other side of the power device in the orthogonal direction.

[0020] The power conversion device of the eleventh method has the following structure: In the tenth method described above, a capacitor is provided on one side of the power device in the orthogonal direction of the power device arrangement direction and connected to the other end of the input bus bar.

[0021] Invention Effects

[0022] According to the embodiments of the present invention described above, the input busbar is arranged relative to the heat dissipation member in such a way that the insulating resin member is sandwiched in between. Therefore, it is possible to suppress the heat transferred from the power device to the input busbar from being absorbed by the heat dissipation member and dissipated to the outside. Furthermore, in the present invention, the direction along the width of the plate-shaped input busbar is aligned with the direction along the normal to the surface of the heat dissipation member opposite the power device. Therefore, the area of ​​the input busbar in plan view is smaller compared to the case where the surface and back of the input busbar are parallel to the aforementioned opposing surface. Therefore, the installation area of ​​the input busbar in plan view can be reduced to a smaller size, and the plan view shape of the heat dissipation member can be reduced. Therefore, according to the embodiments of the present invention described above, in a power conversion device having a power device and a busbar connected to the power device, it is possible to suppress the transfer of heat from the power device to the outside via the busbar, and to reduce the size of the plan view shape of the power conversion device. Attached Figure Description

[0023] Figure 1 This is a circuit diagram showing the schematic electrical structure of the power conversion device according to the first embodiment of the present invention.

[0024] Figure 2 This is a perspective view of the power module included in the power conversion device according to the first embodiment of the present invention.

[0025] Figure 3 This is a perspective view of the power module housing of the power conversion device in the first embodiment of the present invention, omitting the power module housing.

[0026] Figure 4 This is a top view of a power device included in the power conversion device according to the first embodiment of the present invention, magnified.

[0027] Figure 5A yes Figure 4 EE sectional view.

[0028] Figure 5B yes Figure 4 FF sectional view.

[0029] Figure 6 This is an enlarged perspective view of the main parts of the power devices for the two step-up and step-down circuits included in the power conversion device of the first embodiment of the present invention.

[0030] Figure 7 yes Figure 6 GG cross-sectional view.

[0031] Figure 8 This is an enlarged perspective view of the external connection terminal portion of the high-voltage side input busbar included in the power conversion device according to the second embodiment of the present invention.

[0032] Figure 9 This is a perspective view of the connecting busbar included in the power conversion device according to the third embodiment of the present invention.

[0033] Explanation of reference numerals in the attached figures

[0034] 1 Power conversion device

[0035] 3. Capacitors (Electrical Components)

[0036] 4 reactors

[0037] 10 power modules

[0038] 10A power devices

[0039] 10b power module housing

[0040] 10b1 partition wall

[0041] 10c busbar

[0042] 10d insulating resin components

[0043] 10d1 vertical wall

[0044] 10d2 bottom

[0045] 10d3-coated wall

[0046] 10d4 plate-like portion

[0047] 10e water jacket (heat dissipation component)

[0048] 10e1 upper surface

[0049] 10e1 wing

[0050] 10i pins

[0051] 10J External Connection Terminal Section

[0052] 10k busbar main body

[0053] 10m branch

[0054] 11 Circuit Board

[0055] 21 Power devices for buck-boost circuits

[0056] 22 Power devices for inverter circuits

[0057] 31 Input bus bar

[0058] 32 output busbars

[0059] 33 Low-voltage side input busbar

[0060] 34 High-voltage side input busbar

[0061] 35 Connecting Busbars

[0062] 36 Connecting Busbars

[0063] 36a Fastener

[0064] 36b connecting piece

[0065] 36c mount

[0066] B base component

[0067] B1 First Conductor Substrate

[0068] B2 Second Conductor Substrate

[0069] Ba part

[0070] C semiconductor chip

[0071] Pb connection pads Detailed Implementation

[0072] Hereinafter, embodiments of the power conversion device of the present invention will be described with reference to the accompanying drawings.

[0073] (First Implementation)

[0074] Figure 1 This is a circuit diagram showing the general electrical structure of the power conversion device 1 according to this embodiment.

[0075] The power conversion device 1 of this embodiment is mounted on a vehicle such as an electric vehicle and is disposed between a motor (load) (not shown) and a battery. This power conversion device 1 of this embodiment includes a smart power module, a capacitor 3 (electrical component), a reactor 4, a DC-DC converter, and a main housing.

[0076] The intelligent power module includes power module 10 (see reference). Figure 2 ), circuit board, etc. The power module 10 includes: multiple power devices 10a having power semiconductor elements (see reference 10a). Figure 2 ), and the power module housing 10b that holds these power devices 10a (refer to Figure 2 ), and the busbar 10c connected to the power device 10a (refer to Figure 3 Insulating resin component 10d (refer to) to prevent short circuit of busbar 10c. Figure 2 ), and the water jacket 10e for cooling (heat dissipation component, reference) Figure 3 The circuit board is stacked on the power module 10 and includes a drive circuit for driving the power device 10a.

[0077] Capacitor 3 is connected to the intelligent power module and is configured on the side of power module 10. Reactor 4 is configured below the intelligent power module. The DC-DC converter is configured on the side of reactor 4 and below the intelligent power module. It should be noted that the DC-DC converter converts battery power into a voltage suitable for surrounding electronic devices (electronic devices mounted on circuit boards, etc.). This DC-DC converter... Figure 1 The middle part is omitted.

[0078] The main casing houses the intelligent power module, capacitor 3, reactor 4, and DC-DC converter.

[0079] like Figure 1 As shown, the power conversion device 1 includes a buck-boost circuit E1, a first inverter circuit E2, and a second inverter circuit E3. These circuits are composed of power devices 10a, capacitors 3, and reactors 4. The power conversion device 1 converts power supplied from the battery into three-phase AC power and supplies it to the motor. Additionally, the power conversion device 1 returns regenerated power from the motor to the battery.

[0080] like Figure 1 As shown, the buck-boost circuit E1 includes two power devices 10a (power devices 21 for buck-boost circuits), a capacitor 3 (smoothing capacitor), and a reactor 4. Each power device 10a contains a power transistor. These power transistors serve as the semiconductor chip C (see reference). Figure 4 ) Installed on the substrate component B (refer to) which serves as a conductor substrate Figure 4 )superior.

[0081] The first inverter circuit E2 includes three power devices 10a (power devices 22 for inverter circuits). Each power device 10a contains a power transistor. These power transistors serve as a semiconductor chip C (see reference). Figure 4 ) Installed on the substrate component B (refer to) which serves as a conductor substrate Figure 4 )superior.

[0082] The second inverter circuit E3 includes three power devices 10a (power devices 22 for the inverter circuit). Each power device 10a contains a power transistor. These power transistors serve as the semiconductor chip C (see reference). Figure 4 ) Installed on the substrate component B (refer to) which serves as a conductor substrate Figure 4 )superior.

[0083] Figure 2 This is a perspective view of the power module 10 included in the power conversion device 1 of this embodiment. Additionally, Figure 3 This is a perspective view of the power module 10, omitting the power module housing 10b. It should be noted that... Figure 2 This is a perspective view of the power module 10 from the input terminal side. Additionally, Figure 3 This is a perspective view of the power module 10 from the output terminal side.

[0084] As described above, the power module 10 includes multiple (eight in this embodiment) power devices 10a, a power module housing 10b, a busbar 10c, an insulating resin component 10d, and a cooling water jacket 10e. It should be noted that... Figure 2 The water jacket 10e is omitted from the illustration. Additionally, in... Figure 3 In the diagram, only the top plate of the water jacket 10e is shown.

[0085] The power device 10a is a chip-based switching device that includes a switching element driven by a drive circuit disposed on a circuit board. The power device 10a forms, for example, an arm of the first inverter circuit E2 and the second inverter circuit E3, or a part of the buck-boost circuit E1.

[0086] Figure 4 This is a magnified top view of a power device 10a. Figure 4 In, also with Figure 3Similarly, the power module housing 10b is omitted. As shown in the figure, the power device 10a includes two base components B (a first conductor substrate B1 and a second conductor substrate B2) and a semiconductor chip C mounted on each base component B. The base component B is a conductor substrate with wiring and connection pads formed thereon. On the first conductor substrate B1, a connection pad Pb is provided that connects to the second conductor substrate B2 via the semiconductor chip C. In the first conductor substrate B1, the portion Ba where the connection pad Pb is provided protrudes toward the second conductor substrate B2.

[0087] The power module 10 includes a central lead frame 10f. The connection pad Pb of the first conductor substrate B1 and the semiconductor chip C mounted on the second conductor substrate B2 are connected through the central lead frame 10f. The central lead frame 10f is bonded to the connection pad Pb and the semiconductor chip C by solder.

[0088] Additionally, the power module 10 includes a low-voltage side leadframe 10g and a high-voltage side leadframe 10h. The semiconductor chip C and busbar 10c, mounted on the first conductor substrate B1, are connected via the low-voltage side leadframe 10g. The low-voltage side leadframe 10g is bonded to the semiconductor chip C and busbar 10c using solder. Furthermore, the semiconductor chip C and busbar 10c, mounted on the second conductor substrate B2, are connected via the high-voltage side leadframe 10h. The high-voltage side leadframe 10h is bonded to the semiconductor chip C and busbar 10c using solder.

[0089] It should be noted that each semiconductor chip C is connected to a lead 10i disposed in the power module housing 10b via a lead wire. The lead 10i is connected to the circuit board. The lead 10i is arranged to extend vertically.

[0090] like Figure 2 as well as Figure 3 As shown, in this embodiment, such power devices 10a are arranged in a straight line along one direction. It should be noted that in this embodiment, inverter circuit power devices 22 are arranged with buck-boost circuit power devices 21 sandwiched in the middle. That is, three inverter circuit power devices 22 are arranged at each end of the arrangement direction of power devices 10a, and two buck-boost circuit power devices 21 are arranged adjacent to each other in the center.

[0091] The power module housing 10b is formed of an insulating resin material. Furthermore, the power module housing 10b is formed in a generally rectangular shape with the arrangement direction of the power devices 10a as its length direction. This power module housing 10b has receiving recesses for accommodating the power devices 10a. Such a power module housing 10b holds multiple power devices 10a and, as described above, has a partition wall 10b1 for the busbar body portion 10k in which the input busbar 31 is embedded.

[0092] Busbar 10c is a plate-shaped conductive part that connects a battery or motor to a power device 10a. Busbar 10c has an external connection terminal section 10j and a busbar body section 10k. Multiple busbars 10c are provided for each power device 10a, with one end connected to the power device 10a. The external connection terminal section 10j is used by the power module 10 as a terminal section for external connection. The busbar body section 10k is configured to guide from the external connection terminal section 10j to the lead frame (central lead frame 10f, low-voltage side lead frame 10g, and high-voltage side lead frame 10h) connected to the power device 10a.

[0093] In this embodiment, the power module 10 includes an input bus 31 and an output bus 32 as a bus 10c. The input bus 31 is the bus 10c that connects the capacitor 3 and the input terminal of the power device 10a. In addition, the input bus 31 is connected to the battery via the output terminal of the buck-boost circuit E1. The input bus 31 connected to the low-voltage terminal of the buck-boost circuit E1 (battery) (the input bus 31 connected to the negative terminal of the power device 10a) is called the low-voltage side input bus 33, and the input bus 31 connected to the high-voltage terminal of the buck-boost circuit E1 (battery) (the input bus 31 connected to the positive terminal of the power device 10a) is called the high-voltage side input bus 34.

[0094] Figure 5A yes Figure 4 EE sectional view. Additionally... Figure 5B yes Figure 4 The FF sectional view. It should be noted that, in Figure 5A as well as Figure 5B The diagram shows that in Figure 4 The power module housing 10b is omitted. (See image for details.) Figure 4 , Figure 5A as well as Figure 5B As shown, the input busbar 31 is configured such that the width direction (the width direction orthogonal to the current flow direction and the plate thickness direction) of the busbar body 10k aligns with the vertical direction. In this embodiment, the upper surface of the water jacket 10e (the upper surface 10e1 of the top plate portion) is set as the opposing surface to the power device 10a. This opposing surface is a horizontal plane. Therefore, the input busbar 31 is vertically installed such that its width direction aligns with the direction of the normal to the opposing surface of the water jacket 10e to the power device 10a. The busbar body 10k of such an input busbar 31 is vertically installed relative to the water jacket 10e as described above. Therefore, the installation space of the input busbar 31 when viewed from above is extremely small compared to the case where the busbar body 10k is laid flat parallel to the opposing surface of the water jacket 10e.

[0095] In this embodiment, between the power devices 10a, which are rectangular in shape when viewed from above, the main body 10k of each input busbar 31 is erected as described above. Therefore, it is not necessary to use a structure in which the input busbars 31 and the water jacket 10e are placed parallel to the surfaces facing the power devices 10a, and multiple power devices 10a are arranged on both sides of the flat input busbars 31. Therefore, the installation space of the input busbars 31 when viewed from above can be reduced, and the size of the power module 10, and consequently the power conversion device 1, can be reduced when viewed from above.

[0096] It should be noted that, as Figure 5A As shown, the busbar body 10k of the low-voltage side input busbar 33 and the busbar body 10k of the high-voltage side input busbar 34 are arranged in parallel, with the vertical wall 10d1 of the insulating resin component 10d sandwiched between them. The busbar body 10k of the low-voltage side input busbar 33 and the busbar body 10k of the high-voltage side input busbar 34, which are connected to a power device 22 for an inverter circuit, form a pair and are arranged in parallel with the vertical wall 10d1 of the insulating resin component 10d sandwiched between them.

[0097] Furthermore, to suppress the transfer of heat generated by the power device 10a to the capacitor 3, it is preferable that the input busbar 31 has a large heat capacity. Therefore, it is preferable that the lower end of the busbar body 10k of the input busbar 31 is as close as possible to the opposing surface of the water jacket 10e. Additionally, it is preferable that the upper end of the busbar body 10k of the input busbar 31 is as far away as possible from the water jacket 10e. Therefore, as... Figure 5A As shown, the lower end of the busbar body 10k of the input busbar 31 is positioned closer to the water jacket 10e than, for example, the upper surface of the power device 10a. Additionally, as... Figure 5A As shown, the upper end of the busbar body 10k of the input busbar 31 is configured, for example, to be higher than the upper end of the lead frame (central lead frame 10f, low-voltage side lead frame 10g, and high-voltage side lead frame 10h).

[0098] It should be noted that the main body 10k of the input busbar 31 is configured relative to the water jacket 10e such that only the bottom 10d2 of the insulating resin component 10d is sandwiched in the middle. Therefore, in this embodiment, heat from the input busbar 31 can easily escape relative to the water jacket 10e. Thus, it is possible to suppress the heat transferred from the power device 10a to the input busbar 31 from being absorbed by the water jacket 10e and dissipated to the outside.

[0099] Figure 6 This is an enlarged perspective view of the main components, including the power devices 21 used in the two buck-boost circuits. Figure 6 The power module housing 10b is also omitted in the text. Additionally, Figure 7 yes Figure 6 The GG sectional view. It should be noted that in... Figure 7 The diagram shows the power module housing 10b. As shown in these figures, the low-voltage side input bus 33 is shared in both power devices 21 for the buck-boost circuit. Furthermore, the high-voltage side input bus 34 is also shared in both power devices 21 for the buck-boost circuit. That is, in this embodiment, the power module 10 has a common input bus that spans the enclosure wall 10d3 and connects to the two power devices 10a.

[0100] like Figure 7 As shown, the insulating resin component 10d has a covering wall portion 10d3 (wall portion) that covers the high-voltage side input busbar 34 connected to a power device 21 for a step-up / step-down circuit. A branch portion 10m is provided on the busbar body portion 10k of the low-voltage side input busbar 33, extending across the covering wall portion 10d3. One end of the branch portion 10m is soldered to the low-voltage side lead frame 10g of one power device 21 for a step-up / step-down circuit. The other end of the branch portion 10m is soldered to the low-voltage side lead frame 10g of another power device 21 for a step-up / step-down circuit.

[0101] The output busbar 32 is a busbar 10c connecting the motor and the power device 10a. The output busbar 32 is configured such that the width direction (the width direction orthogonal to the current flow direction and the thickness direction) of the busbar body 10k aligns with the vertical direction. In this embodiment, the output busbar 32 is vertically positioned such that its width direction aligns with the direction normal to the surface of the water jacket 10e opposite the power device 10a. The busbar body 10k of this output busbar 32 is vertically positioned relative to the water jacket 10e as described above. Therefore, the installation space for the output busbar 32, viewed from above, is significantly smaller than when the busbar body 10k is laid flat parallel to the surface of the water jacket 10e.

[0102] Thus, in this embodiment, the main body 10k of the output busbar 32 is vertically arranged between the power devices 10a, which are rectangular in shape when viewed from above, as described above. Therefore, the installation space of the input busbar 31 when viewed from above can be reduced, the power module 10 can be reduced, and the top view shape of the power conversion device 1 can be reduced.

[0103] It should be noted that, in order to suppress the heat transfer from the power device 10a to the outside, the output busbar 32 preferably has a large heat capacity. Therefore, it is preferable that the lower end of the busbar body 10k of the output busbar 32 is as close as possible to the opposing surface of the water jacket 10e. Furthermore, it is preferable that the upper end of the busbar body 10k of the output busbar 32 is as far away as possible from the water jacket 10e. Therefore, the lower end of the busbar body 10k of the output busbar 32 is, for example, positioned closer to the water jacket 10e than the upper surface of the power device 10a. Additionally, the upper end of the busbar body 10k of the output busbar 32 is, for example, positioned higher than the upper end of the lead frame (central lead frame 10f, low-voltage side lead frame 10g, and high-voltage side lead frame 10h).

[0104] Furthermore, the main body 10k of the output busbar 32 is configured relative to the water jacket 10e such that only the bottom 10d2 of the insulating resin component 10d is sandwiched in the middle. Therefore, in this embodiment, heat from the output busbar 32 can easily escape relative to the water jacket 10e. Thus, it is possible to suppress the heat transferred from the power device 10a to the output busbar 32 from being absorbed by the water jacket 10e and dissipated to the outside.

[0105] like Figure 5A , Figure 5B as well as Figure 7 As shown, the busbar body 10k of the input busbar 31 and the busbar body 10k of the output busbar 32 are both built into the power module housing 10b. The power module housing 10b has a partition wall 10b1. Furthermore, the partition wall 10b1 is disposed between power devices 10a and power devices 10a. For example, the busbar body 10k of the input busbar 31 and the busbar body 10k of the output busbar 32 are embedded in the partition wall 10b1.

[0106] Additionally, the external connection terminal 10j of the input busbar 31 is the terminal that connects to the capacitor 3. For example... Figure 2 as well as Figure 3 As shown, the external connection terminal portion 10j is configured with the connection surface facing upwards. Thus, in this embodiment, the external connection terminal portion 10j, serving as the other end of the input busbar 31, is disposed on one side of the power device 10a in a direction orthogonal to the arrangement direction of the power devices 10a. Furthermore, in this embodiment, all the external connection terminal portions 10j of the input busbar 31 are disposed on one side of the power module 10, which sandwiches the power devices 10a in the middle. Therefore, by disposing of the capacitor 3 on the side of the power module 10, it is easy to connect the capacitor 3 to the external connection terminal portions 10j of the input busbar 31.

[0107] Furthermore, in this embodiment, the external connection terminal portion 10j of the input busbar 31 is disposed outside the lead pin 10i in a direction orthogonal to the arrangement direction of the power device 10a. Therefore, the external connection terminal portion 10j of the input busbar 31 is prevented from being covered by the circuit board, and the capacitor 3 and the external connection terminal portion 10j of the input busbar 31 can be easily connected.

[0108] It should be noted that, as Figure 3 As shown, the external connection terminals 10j of all low-voltage side input busbars 33 are arranged at the same height. Similarly, the external connection terminals 10j of all high-voltage side input busbars 34 are arranged at the same height. Furthermore, the external connection terminals 10j of the low-voltage side input busbars 33 are positioned higher than the external connection terminals 10j of the high-voltage side input busbars 34. Therefore, based on their positions in the height direction, the external connection terminals 10j of the low-voltage side input busbars 33 and the external connection terminals 10j of the high-voltage side input busbars 34 can be easily identified.

[0109] Additionally, the external connection terminal 10j of the output busbar 32 is a terminal that connects to the motor. For example... Figure 3 As shown, the external connection terminal portion 10j is configured with the connection surface facing to the side. Thus, in this embodiment, the external connection terminal portion 10j, serving as the other end of the output busbar 32, is disposed on the other side of the power device 10a in a direction orthogonal to the arrangement direction of the power device 10a. Furthermore, in this embodiment, all the external connection terminal portions 10j of the output busbar 32 are disposed on one side of the power module 10 that sandwiches the power device 10a in the middle (the side opposite to the external connection terminal portions 10j of the input busbar 31). Therefore, the motor and the external connection terminal portions 10j of the output busbar 32 can be easily connected.

[0110] Furthermore, in this embodiment, the external connection terminal portion 10j of the output busbar 32 is disposed outside the lead pin 10i in a direction orthogonal to the arrangement direction of the power device 10a. Therefore, the external connection terminal portion 10j of the output busbar 32 is prevented from being covered by the circuit board, and the motor and the external connection terminal portion 10j of the output busbar 32 can be easily connected.

[0111] The insulating resin component 10d is an insulating material used to prevent short circuits between conductors. This insulating resin component 10d includes a vertical wall 10d1, a bottom 10d2, a covering wall portion 10d3, and a sheet-like portion 10d4 (see reference). Figure 7The vertical wall 10d1 is disposed between the power devices 10a. The bottom 10d2 is disposed between the busbar body 10k and the water jacket 10e of the busbar 10c. The covering wall 10d3 is disposed between the power devices 21 of the step-up / step-down circuit. The sheet-like portion 10d4 is inserted between the power devices 10a and the water jacket 10e.

[0112] A water jacket 10e is positioned below the power device 10a to absorb the heat generated by the power device 10a. The water jacket 10e has a top plate. The upper surface 10e1 of the top plate faces the power device 10a. Furthermore, a plurality of fins 10e2 are provided on the back side of the top plate. This water jacket 10e is positioned opposite the power device 10a such that a sheet-like portion 10d4 of the insulating resin component 10d is sandwiched in between.

[0113] In this embodiment, when the power device 10a is heated by driving the power device 10a, heat is transferred from the power device 10a to the busbar 10c. The heat transferred to the busbar 10c is then transferred to the water jacket 10e. This prevents heat transfer from the power device 10a to the outside of the water jacket 10e.

[0114] The power conversion device 1 of this embodiment includes a power device 10a, a water jacket 10e disposed opposite to the power device 10a such that an insulating resin component 10d is sandwiched in between, and a plurality of plate-shaped busbars 10c connected at one end to the power device 10a. Furthermore, the power conversion device 1 of this embodiment includes a plurality of input busbars 31 as busbars 10c connected to the input terminals of the power device 10a. The input busbars 31 are vertically arranged such that their width direction aligns with the direction normal to the surface of the water jacket 10e opposite to the power device 10a, and are disposed opposite the water jacket 10e such that the insulating resin component 10d is sandwiched in between.

[0115] According to the power conversion device 1 of this embodiment, the input busbar 31 is arranged relative to the water jacket 10e in such a way that the insulating resin component 10d is sandwiched in between. Therefore, it is possible to suppress the heat transferred from the power device 10a to the input busbar 31 from being absorbed by the water jacket 10e and dissipated to the outside. In addition, in the power conversion device 1 of this embodiment, the direction along the width of the plate-shaped input busbar 31 is aligned with the direction along the normal of the surface of the water jacket 10e opposite to the power device 10a. Therefore, the area of ​​the input busbar 31 when viewed from above is smaller than when the surface and back of the input busbar 31 are parallel to the aforementioned opposing surface. Therefore, the installation area of ​​the input busbar 31 when viewed from above can be suppressed to be smaller, and the shape of the water jacket 10e when viewed from above can be reduced. Therefore, according to the power conversion device 1 of this embodiment, it is possible to suppress the heat of the power device 10a from being transferred to the outside via the busbar 10c, and reduce the size of the shape of the power conversion device 1 when viewed from above.

[0116] Furthermore, the power conversion device 1 of this embodiment, as an input busbar 31, includes a high-voltage side input busbar 34 connected to the positive terminal of the power device 10a and a low-voltage side input busbar 33 connected to the negative terminal of the power device 10a. For example, a portion of the low-voltage side input busbar 33 and a portion of the high-voltage side input busbar 34 are biased and arranged such that insulating material is sandwiched in between. Thus, a portion of the low-voltage side input busbar 33 and a portion of the high-voltage side input busbar 34 are integrated with insulating material sandwiched in between. Therefore, the low-voltage side input busbar 33 and the high-voltage side input busbar 34 can be easily installed. In addition, it is preferable that at least one of the high-voltage side input busbar 34 and the low-voltage side input busbar 3433 is erected such that the direction along the width of the plate is aligned with the direction normal to the surface of the water jacket 10e opposite to the power device 10a, and is arranged relative to the water jacket 10e such that the insulating resin component 10d is sandwiched in between. By vertically positioning at least one input busbar 31 and placing it close to the water jacket 10e, the heat from the power device 10a can be effectively transferred to the water jacket 10e.

[0117] Furthermore, the power conversion device 1 of this embodiment includes a power module housing 10b that holds multiple power devices 10a. The power module housing 10b also has a partition wall 10b1 disposed between the power devices 10a. Additionally, the input busbar 31 is erected such that its direction along the width of the plate aligns with the direction of the normal to the surface of the water jacket 10e opposite to the power devices 10a. The input busbar 31 is embedded in the partition wall 10b1. Thus, by embedding the input busbar 31 in the partition wall 10b1, it is not necessary to ensure a dedicated placement area for the embedded portion of the input busbar 31. Therefore, the top view shape of the power conversion device 1 can be further miniaturized.

[0118] Furthermore, in the power conversion device 1 of this embodiment, power devices 10a are arranged in a single column along a straight line. Additionally, on one side of the power devices 10a in a direction orthogonal to the arrangement direction of the power devices 10a, the end of an input busbar 31 is disposed. On the other side of the power devices 10a in the aforementioned orthogonal direction, the end of a busbar 10c, one end of which is connected to the output terminal of the power devices 10a, is disposed. Therefore, in the power conversion device 1 of this embodiment, it is not necessary to place the busbar 10c and the water jacket 10e parallel to the surfaces facing the power devices 10a, and to arrange multiple power devices 10a on both sides of the flat input busbar 31. Therefore, the installation space of the input busbar 31 under top view can be reduced, the power module 10 can be reduced, and thus the top view shape of the power conversion device 1 can be reduced.

[0119] Furthermore, the power conversion device 1 of this embodiment includes a capacitor 3, which is connected to the end of the input busbar 31 on the side of the power device 10a in a direction orthogonal to the arrangement direction of the power device 10a. With this power conversion device 1 of this embodiment, the capacitor 3 can be positioned near the power device 10a, thereby reducing power loss between the power device 10a and the capacitor 3.

[0120] (Second Implementation)

[0121] Next, a second embodiment of the present invention will be described. It should be noted that in the description of this second embodiment, the parts that are the same as those in the first embodiment described above are omitted or simplified.

[0122] Figure 8 This is an enlarged perspective view of the external connection terminal portion 10j of the high-voltage side input busbar 34 included in the power conversion device of the second embodiment. Figure 8 As shown, the power conversion device of this embodiment includes a connecting busbar 35 that connects to the high-voltage side input busbar 34.

[0123] The connecting busbar 35 is an integral part of the high-voltage side input busbar 34. The connecting busbar 35 is formed, for example, of the same material as the high-voltage side input busbar 34. However, the connecting busbar 35 may also be formed of a different material than the high-voltage side input busbar 34.

[0124] By incorporating such a connecting busbar 35, the heat capacity of the connecting busbar 35 can be utilized to more reliably prevent heat transfer from the power device 10a to the capacitor 3. That is, even if the heat generation of the power device 10a temporarily increases and the heat capacity of the high-voltage side input busbar 34 reaches its limit, heat can still be stored in the connecting busbar 35. Therefore, when the heat generation of the power device 10a decreases, the stored heat can be transferred to the water jacket 10e, preventing heat transfer to the outside. Furthermore, multiple high-voltage side input busbars 34 are connected via the connecting busbar 35. Therefore, the current in the high-voltage side input busbars 34 is smoothed, reducing the current density flowing through the capacitor 3.

[0125] like Figure 8 As shown, the connecting busbar 35 is plate-shaped, and like the main body 10k of the high-voltage side input busbar 34, it is configured such that the direction along the width of the plate is aligned with the vertical direction. That is, the connecting busbar 35 is configured such that the direction along the width of the plate is aligned with the direction of the normal to the surface of the water jacket 10e opposite to the power device 10a.

[0126] In this way, by arranging the connecting busbars 35 in the same direction along the width of the board and in the vertical direction, the installation space of the connecting busbars 35 when viewed from above can be suppressed. Furthermore, it is possible to suppress the increase in the size of the power module 10 due to the presence of the connecting busbars 35.

[0127] It should be noted that the above description describes the structure of connecting multiple high-voltage side input busbars 34 to the connecting busbar 35. Similarly, the connecting busbar 35 can be connected to multiple low-voltage side input busbars 33.

[0128] (Third Implementation)

[0129] Next, a third embodiment of the present invention will be described. It should be noted that in the description of this third embodiment, the parts that are the same as those in the first embodiment described above have been omitted or simplified.

[0130] Figure 9 This is a perspective view of the connecting busbar 36 included in the power conversion device of the third embodiment. The connecting busbar 36 is a busbar 10c that connects the low-voltage side input busbars 33 to each other, and is configured to be separate from the low-voltage side input busbars 33.

[0131] like Figure 9As shown, the connecting busbar 36 includes a fastening tab 36a, a connecting tab 36b, and a mounting tab 36c. The fastening tab 36a is a portion that is fastened to the external connection terminal portion 10j of the low-voltage side input busbar 33. The fastening tab 36a is provided on each low-voltage side input busbar 33 connected by a single connecting busbar 36. The connecting tab 36b is a portion that extends horizontally and connects the fastening tabs 36a to each other. The mounting tab 36c is a plate-shaped portion that protrudes from the upper edge of the connecting tab 36b to the side opposite to the fastening tab 36a. This mounting tab 36c is a portion that abuts against the upper surface of the capacitor 3 from above.

[0132] The connecting busbar 36 is fastened together with the external connection terminal 10j of the low-voltage input busbar 33 by a fastener (not shown) that fastens both the terminals of the capacitor 3 and the external connection terminal 10j. Specifically, the fastening piece 36a of the connecting busbar 36 is fastened together with the external connection terminal 10j. In addition, the connecting busbar 36 is supported by the capacitor 3 by being mounted on the upper surface of the capacitor 3 by a mounting piece 36c.

[0133] This embodiment of the power conversion device includes a connecting busbar 36 as a busbar 10c that connects multiple input busbars 31. Therefore, the heat capacity of the connecting busbar 36 can be utilized to more reliably prevent heat transfer from the power device 10a to the capacitor 3. That is, even if the heat generation of the power device 10a temporarily increases and the heat capacity of the low-voltage side input busbar 33 reaches its upper limit, heat can be stored in the connecting busbar 36. Therefore, when the heat generation of the power device 10a decreases, the stored heat can be transferred to the water jacket 10e, preventing heat transfer to the outside. Furthermore, multiple low-voltage side input busbars 33 are connected via the connecting busbar 36. Therefore, the current in the low-voltage side input busbars 33 is smoothed, reducing the current density flowing through the capacitor 3.

[0134] Furthermore, in the power conversion device of this embodiment, the connecting busbar 36 and the input busbar 31 are separate. Therefore, the shape of the connecting busbar 36 can be set independently of the input busbar 31. Therefore, according to the connecting busbar 36 in this embodiment, a mounting plate 36c mounted on the capacitor 3 can be included.

[0135] Furthermore, in the power conversion device of this embodiment, the connecting busbar 36 is fastened to the other end (external connection terminal 10j) of the input busbar 31. Therefore, it is not necessary to provide a separate part on the input busbar 31 for fastening the connecting busbar 36, thus preventing the shape of the input busbar 31 from becoming complicated.

[0136] Furthermore, in the power conversion device of this embodiment, the connecting busbar 36 is supported by the capacitor 3. Therefore, the connecting busbar 36 can be stably supported.

[0137] The preferred embodiments of the present invention have been described above with reference to the accompanying drawings, but the present invention is not limited to the above embodiments. The various shapes and combinations of the constituent components shown in the above embodiments are examples, and various modifications can be made based on design requirements, etc., without departing from the spirit of the present invention.

Claims

1. A power conversion device, characterized in that, have: Power devices; A heat dissipation component is configured opposite to the power device in such a way that an insulating resin component is sandwiched in between; Multiple plate-shaped busbars, one end of which is connected to the power device; As the busbar, it includes multiple input busbars connected to the input terminals of the power device. At least one of the plurality of input busbars has a busbar body portion. The main body of the busbar is erected so that its direction along the width of the plate coincides with the direction of the normal to the surface of the heat dissipation component opposite to the power device, and is configured relative to the heat dissipation component so that the insulating resin component is sandwiched in the middle, and is smoothly formed along the width of the plate.

2. The power conversion device as described in claim 1, characterized in that, As the input busbar, a high-voltage side input busbar is provided that is connected to the positive terminal of the power device. As the input busbar, it includes a low-voltage side input busbar connected to the negative terminal of the power device. The input busbar of at least one of the high-voltage side input busbar and the low-voltage side input busbar has a busbar body portion. The main body of the busbar is erected so that its direction along the width of the plate is aligned with the direction of the normal to the surface of the heat dissipation component opposite to the power device, and is configured relative to the heat dissipation component so that the insulating resin component is sandwiched in the middle, and is formed smoothly along the width of the plate.

3. The power conversion device as described in claim 1, characterized in that, As the busbar, there is a connecting busbar that connects multiple input busbars.

4. The power conversion device as described in claim 3, characterized in that, The multiple input busbars and the connection busbars are integrated.

5. The power conversion device as described in claim 3, characterized in that, The connecting bus bar is configured to be separate from the input bus bar.

6. The power conversion device as described in claim 5, characterized in that, The device includes an electrical component for fastening the other end of the input busbar, wherein the connecting busbar is fastened together with the other end of the input busbar.

7. The power conversion device as described in claim 5, characterized in that, The connection busbar is supported by an electrical component for fastening the other end of the input busbar.

8. The power conversion device as described in claim 3, characterized in that, The connecting busbar is arranged such that the direction along the width of the board and the direction along the width of the board are aligned with the direction of the normal to the surface of the heat dissipation component opposite to the power device.

9. The power conversion device as claimed in claim 1, characterized in that, A power module housing is provided to hold multiple of the power devices. The power module housing has a partition wall disposed between the power device and the power device. The input busbar is embedded in the partition wall in such a way that it is erected along the width of the plate and in a manner that aligns with the direction of the normal to the surface of the heat dissipation component opposite to the power device.

10. The power conversion device as claimed in claim 1, characterized in that, The power devices are arranged in a single column along a straight line. The other end of the input busbar is disposed on one side of the power device in a direction orthogonal to the arrangement direction of the power devices. On the other side of the power device in the orthogonal direction, there is a busbar whose end is connected to the output end of the power device.

11. The power conversion device as claimed in claim 10, characterized in that, A capacitor is provided on one side of the power device in the orthogonal direction of the power device arrangement direction, which is connected to the other end of the input busbar.

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