SIP packaging structure and electronic device

Abstract

An embodiment of the present application provides a SIP packaging structure and electronic device; wherein the SIP packaging structure includes: a substrate, a flexible printed circuit board, and a cover layer; a plurality of surface mount components are arranged on the substrate; the flexible printed circuit board is electrically connected to the substrate via a first connector; the cover layer covers the first connector and at least a portion of the surface mount components, and the flexible printed circuit board extends beyond the cover layer and can be used to electrically connect to external devices. An embodiment of the present application provides a SIP packaging solution that utilizes a flexible printed circuit board (FPC) for switching and transmitting signals. The flexible printed circuit board (FPC) can be used to lead out a connector within the SIP packaging structure that electrically connects the substrate to external devices / signals, thereby conveniently connecting the substrate to external devices.

Description

Technical Field

[0001] The embodiments of the present application relate to the field of chip packaging technology, and more specifically, to a SIP packaging structure and an electronic device. Background Art

[0002] Nowadays, with the rapid development of electronic technology, a wide variety of electronic products are emerging. These products are becoming increasingly versatile, and the requirements for chip size are also increasing. The SIP (System in a Package) package integrates multiple functional chips, such as processors and memory, into a single package, achieving a basic complete functionality. SIP packaging can also reduce PCB area usage. In recent years, SIP packaging has been widely used in various electronic products.

[0003] However, existing SIP packaging structures typically require a large number of interposers to electrically connect the PCB within the SIP package to external devices or signals. Existing technology can lead to complex connection methods, incomplete plastic encapsulation of the functional chips on the PCB, and potentially complex assembly processes and production difficulties. Furthermore, existing interposers are susceptible to interference, such as electromagnetic interference, from the functional chips within the package when establishing electrical connections with external devices or signals.

[0004] Therefore, it is necessary to provide an improved SIP packaging structure to at least solve the above problems. Summary of the Invention

[0005] The purpose of this application is to provide a new technical solution for a SIP packaging structure and electronic equipment.

[0006] In a first aspect, the present application provides a SIP packaging structure. The SIP packaging structure includes:

[0007] A substrate, on which a plurality of mounting components are arranged;

[0008] a flexible circuit board, the flexible circuit board being electrically connected to the substrate via a first connector; and

[0009] A covering layer covers the first connector and at least a portion of the mounting device, and the flexible circuit board extends out of the covering layer and can be used for electrical connection with an external device.

[0010] Optionally, the SIP packaging structure further includes:

[0011] a first shielding structure, the first shielding structure being arranged in a vertical direction of the substrate and penetrating the cover layer;

[0012] The first connector and a portion of the flexible circuit board are jointly arranged in a shielding space enclosed by the first shielding structure. The shielding space can be used to isolate the flexible circuit board from each of the mounting components.

[0013] Optionally, the first shielding structure includes a through structure formed in the thickness direction of the cover layer, and a shielding material filled in the through structure.

[0014] Optionally, the through structure is formed by laser.

[0015] Optionally, the SIP packaging structure further includes:

[0016] The second shielding structure is covered on the outside of the cover layer, and the flexible circuit board also extends to the outside of the second shielding structure and is attached to the outer surface of the second shielding structure.

[0017] Optionally, the second shielding structure is an EMI shielding layer formed by electroplating, dispensing or spraying.

[0018] Optionally, the flexible circuit board includes: a first connecting portion, a second connecting portion, and a through portion connected between the first connecting portion and the second connecting portion;

[0019] The first connection portion is electrically connected to the substrate through the first connector, the penetration portion penetrates the cover layer along a thickness direction, and the second connection portion extends out of the cover layer.

[0020] Optionally, a second connector is provided on the second connecting portion.

[0021] Optionally, the covering layer is a plastic sealing layer.

[0022] Optionally, a chip and external solder balls are mounted on a surface of the substrate facing away from the plurality of mounted components.

[0023] In a second aspect, the present application provides an electronic device, which includes the SIP packaging structure described above.

[0024] The beneficial effects of the embodiments of the present application are:

[0025] An embodiment of the present application provides a SIP packaging solution for transferring and transmitting signals through a flexible circuit board (FPC). In the solution, a flexible circuit board (FPC) is used to lead out a connector for electrically connecting the substrate inside the SIP package to external devices / signals, enabling the substrate inside the SIP package to be conveniently connected to external devices. The solution provided by the embodiment of the present application can reduce the use of interposers, simplify the production line assembly process, and reduce production difficulty.

[0026] Other features and advantages of the present specification will become apparent from the following detailed description of exemplary embodiments of the present specification with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the specification and, together with the description, serve to explain the principles of the specification.

[0028] Figure 1 This is a schematic diagram of the SIP packaging structure provided in an embodiment of the present application.

[0029] Reference numerals:

[0030] 1. Substrate; 2. Flexible circuit board; 21. First connecting portion; 22. Second connecting portion; 23. Through portion; 3. First connector; 4. Cover layer; 5. First shielding structure; 6. Second shielding structure; 7. Second connector; 8. Chip; 9. External solder ball. DETAILED DESCRIPTION

[0031] Various exemplary embodiments of the present application will now be described in detail with reference to the accompanying drawings. It should be noted that unless otherwise specifically stated, the relative arrangements of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present application.

[0032] The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the present disclosure, its application, or uses.

[0033] Techniques and equipment known to ordinary technicians in the relevant art may not be discussed in detail, but where appropriate, the techniques and equipment should be considered part of the specification.

[0034] In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not limiting. Therefore, other examples of the exemplary embodiments may have different values.

[0035] It should be noted that like reference numerals and letters refer to like items in the following figures, and therefore, once an item is defined in one figure, it need not be further discussed in subsequent figures.

[0036] The present application provides a SIP package structure that can be applied to various types of electronic devices. The SIP package structure can be a well-known system-in-package (SIP) in the electronic device field, such as the packaging of communication chips such as WiFi and Bluetooth, and is not further detailed in this application.

[0037] Figure 1 A structural schematic diagram of a SIP packaging structure provided in an embodiment of the present application is shown.

[0038] According to an embodiment of the present application, a SIP packaging structure is provided, such as Figure 1 As shown, the SIP package structure includes: a substrate 1, a flexible circuit board 2 and a cover layer 4;

[0039] A plurality of mounting components are arranged on the substrate 1;

[0040] The flexible circuit board 2 is electrically connected to the substrate 1 via a first connector 3;

[0041] The cover layer 4 covers the first connector 3 and at least a portion of the mounting device, and the flexible circuit board 2 extends out of the cover layer 4 and can be used for electrical connection with external devices.

[0042] That is to say, the solution provided in the embodiment of the present application utilizes a flexible circuit board (FPC) for electrical switching and transmission of electrical signals, thereby eliminating the use of switching devices such as interposers.

[0043] An embodiment of the present application provides a SIP packaging solution for electrically switching and transmitting electrical signals through a flexible circuit board (FPC), wherein a flexible circuit board 2 (FPC) is used to lead out a connector (i.e., the first connector 3) for electrically connecting a substrate 1 inside the SIP package to external devices / signals, enabling the substrate 1 inside the SIP package to be conveniently connected to external devices or external signals.

[0044] The technical solution provided in the embodiment of the present application can reduce the use of interposers, simplify the production line assembly process, and reduce production difficulty.

[0045] The substrate 1 is, for example, a printed circuit board PCB.

[0046] The substrate 1 is a support for the SMT components and also a carrier for electrical connection of the SMT components.

[0047] The mounted device is, for example, a functional chip, such as a processor chip, a memory chip, a Bluetooth chip, or a WiFi chip. It should be noted that the mounted chip includes but is not limited to the aforementioned functional chips.

[0048] It should be noted that in a large-scale batch production process, multiple mounted devices (such as functional chips) can be arranged in batches on the substrate 1 through a process familiar to those skilled in the art to form a single SIP packaging structure, and each SIP packaging structure is arranged in a modular form on the same substrate 1.

[0049] After the placement components are arranged on the substrate 1 , the cover layer 4 is used to package the placement components on the substrate 1 .

[0050] The cover layer 4 may be made of materials and processes well known to those skilled in the art, so as to package the arranged surface mount devices on the substrate 1 .

[0051] The material of the covering layer 4 includes but is not limited to polymer materials such as injection-molded plastics or silicon materials such as silicon dioxide.

[0052] like Figure 1 As shown, three SMD components are arranged on the substrate 1. Of course, for those skilled in the art, there can be more SMD components on the substrate 1. Multiple SMD components are arranged on the substrate 1 in a matrix, for example, which will not be described in detail here.

[0053] In some examples of this application, the SIP packaging structure, such as Figure 1 As shown, it also includes a first shielding structure 5, which is arranged in the vertical direction of the substrate 1 and passes through the covering layer 4; wherein the first connector 3 and part of the flexible circuit board 2 are jointly arranged in a shielding space enclosed by the first shielding structure 5, and the shielding space can be used to isolate the flexible circuit board 2 from each of the mounting devices.

[0054] In other words, the solution provided in the embodiment of the present application utilizes the first shielding structure 5 to surround the first connector 3 and a portion of the flexible circuit board 2 (specifically, the portion that passes through the cover layer 4). This allows the flexible circuit board 2, which is used for electrical connection and signal output, to be separated from other surface-mounted components on the substrate 1. In other words, by utilizing cavity shielding technology, the flexible circuit board 2 can be isolated from other surface-mounted components. This can shield the flexible circuit board 2 from signal crosstalk, thus preventing system performance degradation.

[0055] In some examples of this application, such as Figure 1 As shown, the first shielding structure 5 includes a through structure formed in the thickness direction of the cover layer 4 and a shielding material filled in the through structure.

[0056] That is to say, in the solution provided in the embodiment of the present application, the first shielding structure 5 is a structure that runs through the entire thickness direction of the covering layer 4, which can be used to surround a section located inside the covering layer 4 on the outside of the flexible circuit board 2, thereby isolating the flexible circuit board 2 from the surrounding mounting devices, thereby achieving the effect of shielding the signal crosstalk of the connection link of the flexible circuit board 2.

[0057] The through structure is formed by laser, for example.

[0058] That is, a through structure of a predetermined shape may be formed on the cover layer 4 by means of a laser, and the first shielding structure 5 may be formed by filling the through structure with a shielding material.

[0059] It should be noted that the through structure is not limited to being formed by laser cutting, but can also be formed by cutting by other methods known to those skilled in the art. Laser cutting can reduce problems such as burrs and help make the surface of the first shielding structure 5 uniform and smooth.

[0060] The shielding material is, for example, a metal material.

[0061] In this way, the first shielding structure 5 is a shielding structure made of metal.

[0062] In some examples of this application, the SIP packaging structure, such as Figure 1 As shown, it also includes a second shielding structure 6; wherein, the second shielding structure 6 is covered on the outside of the cover layer 4, and the flexible circuit board 2 also extends to the outside of the second shielding structure 6 and is attached to the outer surface of the second shielding structure 6.

[0063] That is, in the solution provided in the embodiment of the present application, the SIP package structure not only has the above-mentioned first shielding structure 5, but also has the second shielding structure 6. The second shielding structure 6 can be used to electromagnetically shield all the mounted components below the cover layer 4, thereby forming a conformal shield for the SIP package structure.

[0064] The second shielding structure 6 covers the cover layer 4 and also covers the side of the cover layer 4 to cover the cover layer 4.

[0065] Furthermore, it should be noted that, after being led out of the SIP packaging structure, the flexible circuit board 2 is actually located on the outer surface of the second shielding structure 6 and can also be isolated from the various mounted components on the substrate 1 .

[0066] In the solution provided in the embodiment of the present application, based on the layout of the first shielding structure 5 and the second shielding structure 6, not only can the flexible circuit board 2 be isolated from other mounted devices, but also mutual electromagnetic interference effects between the mounted devices in the SIP packaging structure can be avoided, thereby avoiding the decline in system performance.

[0067] This also makes the solution provided by the present application suitable for some high-frequency chip packaging structures.

[0068] For example, high-frequency chips such as RF chips, GPS chips, and Bluetooth chips are packaged into an integrated structure through SIP packaging. The electromagnetic interference between different chips is relatively small, and it is not easy to generate electromagnetic interference (EMI) within the package.

[0069] In some examples of the present application, the second shielding structure 6 can be an EMI shielding layer formed by electroplating, dispensing or spraying.

[0070] Specifically, an EMI shielding layer may be formed on the exposed surface of the cover layer 4 by electroplating, dispensing or spraying, for example. The EMI shielding layer may cover the cover layer 4 of the SIP packaging structure to form an electromagnetic shielding structure.

[0071] In some examples of this application, such as Figure 1 As shown, the flexible circuit board 2 includes a first connecting portion 21, a second connecting portion 22 and a through portion 23 connected between the first connecting portion 21 and the second connecting portion 22;

[0072] The first connection portion 21 is electrically connected to the substrate 1 through the first connector 3 , the penetration portion 23 penetrates the cover layer 4 along the thickness direction, and the second connection portion 22 extends out of the cover layer 4 .

[0073] That is to say, the flexible circuit board 2 can be designed as a three-section structure; the parts located at the two ends are the first connecting part 21 and the second connecting part 22, the first connecting part 21 is used to form an electrical connection with the substrate 1 through the first connector 3, and the second connecting part 22 is used to electrically connect with external devices or signals, and the through part 23 located between the above two connecting parts is used to lead the second connecting part out of the SIP packaging structure for electrical connection.

[0074] Among them, such as Figure 1 As shown, the second connecting portion 22 of the flexible circuit board 2 is provided with a second connector 7 , for example.

[0075] The second connector 7 can easily establish an electrical connection with an external device or signal.

[0076] It should be noted that the first connector 3 and the second connector 7 may be of the same or different forms. The first connector 3 and the second connector 7 may be electrical connection devices well known to those skilled in the art, and this application does not limit this.

[0077] In some examples of the present application, the covering layer 4 is a plastic sealing layer.

[0078] The plastic encapsulation layer is filled between the substrate 1 and the second shielding structure 6. The plastic encapsulation layer can be used to encapsulate / cover part of the surface mount components or all of the surface mount components, as well as the first connector 3 and the like.

[0079] Furthermore, the covering layer 4 is, for example, a resin plastic layer.

[0080] In some examples of the present application, a chip 8 and external solder balls 9 are mounted on the surface of the substrate 1 facing away from the plurality of mounted components.

[0081] The external solder balls 9 can be provided as one or more as needed, which is not limited in this application. The external solder balls 9 can serve as the overall input / output terminals of the SIP package structure to provide transmission of power, signal, ground, etc.

[0082] It should be noted that the various mounted components arranged on the substrate 1 and the chip 8 can be high-frequency chips.

[0083] For example, the high-frequency chip may be an RF chip, a GPS positioning chip, a DRAM memory chip, a Bluetooth chip, etc. In addition, the chip may be connected to the substrate 1 by, for example, SMT or metal wire bonding.

[0084] According to another embodiment of the present application, an electronic device is also provided.

[0085] The electronic device includes the SIP packaging structure as described in any one of the above items.

[0086] The electronic device is, for example, a smart phone, a tablet computer, a wearable device, etc., and this application does not limit this.

[0087] The above embodiments focus on the differences between the various embodiments. As long as the different optimization features between the various embodiments are not contradictory, they can be combined to form a better embodiment. Considering the simplicity of the text, they will not be repeated here.

[0088] Although some specific embodiments of the present invention have been described in detail by way of example, it should be understood by those skilled in the art that the above examples are for illustration only and are not intended to limit the scope of the present invention. It should be understood by those skilled in the art that modifications may be made to the above embodiments without departing from the scope and spirit of the present invention. The scope of the present invention is defined by the appended claims.

Claims

1. A SIP packaging structure, characterized in that: include: A substrate (1), with a plurality of mounting components arranged on the substrate (1); a flexible circuit board (2), the flexible circuit board (2) being electrically connected to the substrate (1) via a first connector (3); and A covering layer (4), the covering layer (4) covers the first connector (3) and at least a portion of the mounting device, and the flexible circuit board (2) extends out of the covering layer (4) and can be used for electrical connection with an external device ； The SIP packaging structure further includes: a first shielding structure (5), the first shielding structure (5) being arranged in a vertical direction of the substrate (1) and penetrating the covering layer (4); The first connector (3) and part of the flexible circuit board (2) are jointly arranged in a shielding space enclosed by the first shielding structure (5), and the shielding space can be used to isolate the flexible circuit board (2) from each of the mounting components; The first shielding structure (5) comprises a through structure formed in the thickness direction of the covering layer by laser irradiation, and a metal shielding material filled in the through structure.

2. The SIP packaging structure according to claim 1, characterized in that: Also includes: A second shielding structure (6), the second shielding structure (6) is covered on the outside of the cover layer (4), and the flexible circuit board (2) also extends to the outside of the second shielding structure (6) and is attached to the outer surface of the second shielding structure (6).

3. The SIP packaging structure according to claim 2, characterized in that: The second shielding structure (6) is an EMI shielding layer formed by electroplating, dispensing or spraying.

4. The SIP packaging structure according to claim 1, characterized in that: The flexible circuit board (2) comprises: a first connecting portion (21), a second connecting portion (22), and a through portion (23) connected between the first connecting portion (21) and the second connecting portion (22); The first connecting portion (21) is electrically connected to the substrate (1) via the first connector (3), the penetrating portion (23) penetrates the covering layer (4) along the thickness direction, and the second connecting portion (22) extends out of the covering layer (4).

5. The SIP packaging structure according to claim 4, characterized in that: A second connector (7) is provided on the second connecting portion (22).

6. The SIP packaging structure according to claim 1, characterized in that: The covering layer (4) is a plastic sealing layer.

7. The SIP packaging structure according to claim 1, wherein: A chip (8) and an external solder ball (9) are mounted on a surface of the substrate (1) facing away from the plurality of mounted components.

8. An electronic device, characterized in that: include: The SIP packaging structure according to any one of claims 1 to 7.

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