Server and heat exchanger

Abstract

The present invention provides a server and a heat exchanger; the server includes a chassis, a motherboard, a heat source, and a heat exchanger. The motherboard is disposed in the chassis, the heat source is disposed and electrically connected to the motherboard. The heat exchanger includes a first cavity, a plurality of heat dissipation plates, and a plurality of heat dissipation fins. The first cavity is in thermal contact with the heat source and has a first flow channel. The heat dissipation plates are in thermal contact with and inserted into the first cavity. Each heat dissipation plate has a second flow channel. The first flow channel of the first cavity communicates with the second flow channels of the heat dissipation plates. The heat dissipation fins are in thermal contact with the heat dissipation plates. In the present invention, since the first flow channel of the first cavity communicates with the second flow channels of the heat dissipation plates, and the heat dissipation fins are in thermal contact with the heat dissipation plates, the working fluid in the first flow channel of the first cavity can dissipate heat more effectively with the assistance of the heat dissipation fins in the second flow channels of the heat dissipation plates after absorbing the heat generated by the heat source. In this way, the heat exchanger can more effectively dissipate the heat generated by the heat source in a limited space.

Description

Technical Field

[0001] The present invention belongs to the technical field of heat dissipation, and particularly relates to a server and a heat exchanger with a heat dissipation plate having a flow channel. Background Art

[0002] In an electronic device, in order to remove the heat generated by a heat source, a heat exchanger in thermal contact with the heat source is usually provided. Such a heat exchanger includes a heat conducting block, a heat pipe, and a heat dissipation fin group. The heat conducting block is in thermal contact with the heat source, and opposite ends of the heat pipe are respectively in thermal contact with the heat conducting block and the heat dissipation fin group.

[0003] However, since the heat pipe has disadvantages such as a large thermal resistance value, a large volume, and a large weight, when designing a heat exchanger including a heat pipe, the structure of the heat exchanger is often made more complex, and such a heat exchanger using a heat pipe for heat transfer is difficult to effectively dissipate the heat generated by the heat source in a limited space. Summary of the Invention

[0004] In view of the above-mentioned disadvantages of the prior art, the purpose of the present invention is to provide a server and a heat exchanger, which are used to solve the problem that a heat exchanger using a heat pipe for heat transfer is difficult to effectively dissipate the heat generated by the heat source in a limited space.

[0005] To achieve the above object and other related objects, the present invention provides a server, which includes a chassis, a main board, a heat source, and a heat exchanger. The main board is disposed in the chassis. The heat source is disposed and electrically connected to the main board. The heat exchanger includes a first cavity, a plurality of heat dissipation plates, and a plurality of heat dissipation fins. The first cavity is in thermal contact with the heat source and has a first flow channel. The heat dissipation plates are in thermal contact with and inserted into the first cavity. Each of the heat dissipation plates has a second flow channel. The first flow channel of the first cavity communicates with the second flow channels of the heat dissipation plates. The heat dissipation fins are in thermal contact with the heat dissipation plates.

[0006] The present invention provides a heat exchanger for thermally contacting a heat source and accommodating a working fluid. The heat exchanger includes a first cavity, a plurality of heat dissipation plates, and a plurality of heat dissipation fins. The first cavity is used for thermally contacting the heat source and has a first flow channel. The heat dissipation plates are in thermal contact with and inserted into the first cavity. Each of the heat dissipation plates has a second flow channel. The first flow channel of the first cavity communicates with the second flow channels of the heat dissipation plates, and the first flow channel and the second flow channels are used for accommodating the working fluid. The heat dissipation fins are in thermal contact with the heat dissipation plates.

[0007] For the server and heat exchanger of the present invention, since the first flow channel of the first cavity communicates with the second flow channel of the heat dissipation plate, and the heat dissipation fins are in thermal contact with the heat dissipation plate, the working fluid in the first flow channel of the first cavity can dissipate heat more effectively with the assistance of the heat dissipation fins in the second flow channel of the heat dissipation plate after absorbing the heat generated by the heat source. In this way, the heat exchanger can dissipate the heat generated by the heat source more effectively in a limited space. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Figure 1 It shows a schematic side cross-sectional view of the server of the present invention in an embodiment.

[0009] Figure 2 Shown as Figure 1 A partial enlarged view of a perspective view of the heat exchanger of the server in an embodiment.

[0010] Figure 3 Shown as Figure 1 A partial enlarged view of a schematic side cross-sectional view of the heat exchanger of the server in an embodiment.

[0011] Figure 4 Shown as Figure 1 A schematic side cross-sectional view of the first cavity of the heat exchanger of the server in an embodiment.

[0012] Figure 5 Shown as Figure 1 A schematic view of the capillary structure of the heat exchanger in an embodiment.

[0013] Figure 6 Shown as Figure 1 A partial enlarged view of a side view of the heat exchanger in an embodiment.

[0014] Figure 7 Shown as Figure 1 A partial enlarged view of a schematic side cross-sectional view of the heat exchanger in an embodiment.

[0015] SYMBOL DESCRIPTION

[0016] 10 Server

[0017] 100 Cabinet

[0018] 200 Motherboard

[0019] 300 Heat Source

[0020] 400 Heat Exchanger

[0021] 410 First Cavity

[0022] 411 First Flow Channel

[0023] 412 Heat Dissipation Surface

[0024] 413 Heat absorption surface

[0025] 414 Side peripheral surface

[0026] 415 First slot

[0027] 416 Opening

[0028] 417 First screw hole

[0029] 420 Heat dissipation plate

[0030] 421 Second flow channel

[0031] 430 Heat dissipation fins

[0032] 440 Second cavity

[0033] 441 Third flow channel

[0034] 442 Second slot

[0035] 445 Fin structure

[0036] 446 Capillary structure

[0037] 450 Mounting plate

[0038] 451 First surface

[0039] 452 Second surface

[0040] 453 Mounting hole

[0041] 454 Connecting hole

[0042] 455 Second screw hole

[0043] 456 Annular groove

[0044] 460 Flow tube

[0045] 465 Screw

[0046] 468 Sealing ring

[0047] 470 Valve part

[0048] 475 Connector

[0049] 480 Nut

[0050] 485 Sleeve

[0051] E Extension direction

[0052] D1, D2, D3 Diameter Specific implementation manner

[0053] The following describes in detail the detailed features and advantages of the embodiments of the present invention in the embodiments, the content of which is sufficient to enable any person with ordinary knowledge in the art to understand the technical content of the embodiments of the present invention and implement it accordingly. And according to the content disclosed in this specification, the scope of the patent application and the drawings, any person with ordinary knowledge in the art can easily understand the related purposes and advantages of the present invention. The following embodiments further illustrate the viewpoints of the present invention in detail, but do not limit the scope of the present invention in any way.

[0054] Please refer to Figure 1 and Figure 2 , Figure 1 , which shows a side cross-sectional schematic view of the server of the present invention in an embodiment. Figure 2 Shown as Figure 1 A partial enlarged view of a perspective view of the heat exchanger of the server in [reference] in an embodiment. In this embodiment, the server 10 includes a chassis 100, a main board 200, a heat source 300, and a heat exchanger 400. The main board 200 is disposed in the chassis 100. The heat source 300 is disposed and electrically connected to the main board 200. The heat source 300 is, for example, a central processing unit (CPU) or a graphics processing unit (GPU).

[0055] Please refer to Figures 1 to 5 . Figure 3 Shown as Figure 1 A partial enlarged view of a side cross-sectional schematic view of the heat exchanger of the server in [reference] in an embodiment. Figure 4 Shown as Figure 1 A side cross-sectional schematic view of the first cavity of the heat exchanger of the server in [reference] in an embodiment. Figure 5 Shown as Figure 1 A schematic view of the capillary structure of the heat exchanger in [reference] in an embodiment.

[0056] The heat exchanger 400 includes a first cavity 410, a plurality of heat dissipation plates 420, and a plurality of heat dissipation fins 430. The first cavity 410 is in thermal contact with the heat source 300 and has a first flow channel 411. In this embodiment, the first cavity 410 further has a heat dissipation surface 412, a heat absorption surface 413, and a side peripheral surface 414 that are opposite to the first flow channel 411. The heat dissipation surface 412 and the heat absorption surface 413 face each other. The side peripheral surface 414 connects the heat dissipation surface 412 and the heat absorption surface 413. The heat absorption surface 413 is in thermal contact with the heat source 300. The heat dissipation plates 420 are in thermal contact with the heat dissipation surface 412 of the first cavity 410 and are inserted into the first cavity 410. Each of the heat dissipation plates 420 has a second flow channel 421. The first flow channel 411 of the first cavity 410 communicates with the second flow channel 421 of the heat dissipation plates 420. The heat dissipation fins 430 are in thermal contact with the heat dissipation plates 420. In addition, in this embodiment, the heat dissipation plates 420 are, for example, in a flat plate shape.

[0057] In this embodiment, the first cavity 410 further has a plurality of first slots 415. The first slots 415 are located on the heat dissipation surface 412 and communicate with the first flow channel 411. These heat dissipation plates 420 are respectively inserted into these first slots 415. In other embodiments, the first slots may also be located on the side peripheral surface and extend from the side peripheral surface to the side of the heat dissipation surface away from the heat absorption surface. Alternatively, in still other embodiments, the heat dissipation plates may also be inserted into the first slots and the first flow channel and contact the surface of the first cavity that forms the first flow channel. In such an embodiment, the side of the heat dissipation plate that contacts the surface of the first cavity that forms the first flow channel may have an opening communicating with the first flow channel.

[0058] In this embodiment, the heat dissipation plates 420 extend along an extending direction E away from the heat dissipation surface 412 of the first cavity 410, and the heat dissipation fins 430 are interposed between these heat dissipation plates 420 and arranged along the extending direction E. In other embodiments, the heat dissipation fins may also be arranged in a direction not parallel to the extending direction of the heat dissipation plates.

[0059] In this embodiment, the heat exchanger 400 further includes a second cavity 440. The second cavity 440 has a third flow channel 441 and a plurality of second slots 442 that communicate with each other. The side of the heat dissipation plate 420 away from the first cavity 410 is in thermal contact with the second cavity 440 and is respectively inserted into these second slots 442 of the second cavity 440. The third flow channel 441 communicates with the first flow channel 411 of the first cavity 410 through the second flow channel 421 of the heat dissipation plate 420. In other embodiments, the heat exchanger may not need to include the second cavity 440. In such an embodiment, the side of the heat dissipation plate away from the first cavity may be a closed end. In other embodiments, the heat dissipation plates may also be inserted into the second slots and the third flow channel and contact the surface of the second cavity that forms the third flow channel. In such an embodiment, the side of the heat dissipation plate that contacts the surface of the second cavity that forms the third flow channel may have an opening communicating with the third flow channel.

[0060] It should be noted that the cross-sectional schematic diagrams shown are respectively drawn according to different cross-sections. Figure 3 and Figure 4 As shown in Figure 3 and Figure 4 In this embodiment, the heat exchanger 400 further includes a fin structure 445, and the fin structure 445 is located in the first flow channel 411 of the first cavity 410. The fin structure 445 is, for example, wavy. In other embodiments, the heat exchanger may not need to include the fin structure 445.

[0061] And, as shown in Figures 3 to 5 In this embodiment, the heat exchanger 400 further includes a plurality of capillary structures 446. These capillary structures 446 are respectively located in the second flow channel 421 of the heat dissipation plate 420. As shown in Figure 5As shown, these capillary structures 446 are, for example, porous and are, for example, sintered structures formed by sintering copper powder. In other embodiments, the heat exchanger may also not include the capillary structure 446.

[0062] Please refer to Figure 6 and Figure 7 , Figure 6 shown as Figure 1 a partially enlarged side view of the heat exchanger in an embodiment in Figure 7 shown as Figure 1 a partially enlarged side sectional schematic view of the heat exchanger in an embodiment in

[0063] In this embodiment, the first cavity 410 further has an opening 416, and the heat exchanger 400 further includes a mounting plate 450, a flow tube 460, and a valve member 470. In this embodiment, the opening 416 of the first cavity 410 communicates with the first flow channel 411 and is located on the side peripheral surface 414. In this embodiment, the mounting plate 450 is fixed to the side peripheral surface 414 of the first cavity 410. The mounting plate 450 has a first surface 451, a second surface 452, a mounting hole 453, and a communication hole 454. The first surface 451 and the second surface 452 face away from each other. The first surface 451 is closer to the first cavity 410 than the second surface 452. The communication hole 454 is located on the first surface 451. The mounting hole 453 is located on the second surface 452 and communicates with the communication hole 454. One end of the flow tube 460 is received in the mounting hole 453 and communicates with the communication hole 454. The valve member 470 is mounted on the other end of the flow tube 460 and communicates with the flow tube 460. That is, in this embodiment, the valve member 470 is mounted on the first cavity 410 through the mounting plate 450 and the flow tube 460 and communicates with the opening 416 of the first cavity 410. In this embodiment, the valve member 470 is, for example, a three-way valve.

[0064] In this embodiment, please refer to again Figure 2, the heat exchanger 400 further includes two screws 465. The first cavity 410 further has two first screw holes 417 separated from each other, and the mounting plate 450 further has two second screw holes 455. The two first screw holes 417 are located on the side peripheral surface 414. The two second screw holes 455 are located on the first surface 451 and are separated from the communication hole 454. The two screws 465 are respectively screwed into the two first screw holes 417 and the two second screw holes 455 to fix the mounting plate 450 to the first cavity 410. In other embodiments, the heat exchanger may also include only one screw. In such an embodiment, the first cavity has only one first screw hole and the mounting plate has only one second screw hole. Or, in other embodiments, the heat exchanger may not need to include the screw 465. In such an embodiment, the first cavity does not need to have the first screw hole 417, the mounting plate does not need to have the second screw hole 455, and the mounting plate can also be fixed to the side peripheral surface of the first cavity by an adhesive.

[0065] Please refer to again Figure 6 and Figure 7 , in this embodiment, one end of the flow tube 460 is fixed to the mounting plate 450 by welding, for example, but not limited thereto. In other embodiments, one end of the flow tube can also be fixed to the mounting plate by an adhesive.

[0066] In this embodiment, as Figure 7 shown, the heat exchanger 400 further includes a sealing ring 468, and the mounting plate 450 further has an annular groove 456. The annular groove 456 is recessed from the first surface 451. The annular groove 456 surrounds the communication hole 454 and is not communicated with the communication hole 454. The sealing ring 468 is received in the annular groove 456 to improve the sealing degree between the communication hole 454 of the mounting plate 450 and the opening 416 of the first cavity 410. In other embodiments, the heat exchanger may not need to include the sealing ring 468. In such an embodiment, the mounting plate does not need to have the annular groove 456.

[0067] In this embodiment, as Figure 7 shown, the diameter D1 of the mounting hole 453 is greater than the diameter D2 of the flow tube 460, and the diameter D2 of the flow tube 460 is greater than the diameter D3 of the communication hole 454. Specifically, in this embodiment, the diameter D2 of the flow tube 460 refers to the inner diameter of the flow tube. In this way, the sealing performance between the mounting plate 450 and the flow tube 460 can be improved. In other embodiments, the diameters of the mounting hole of the mounting plate, the diameter of the flow tube, and the diameter of the communication hole of the mounting plate may also be the same as each other.

[0068] In this embodiment, as Figure 6As shown, the heat exchanger 400 further includes a joint 475, which includes a nut 480 and a sleeve 485. The other end of the flow tube 460 is installed on the valve member 470 through the nut 480 and the sleeve 485 to improve the sealing performance between the flow tube 460 and the valve member 470. In other embodiments, the heat exchanger may not include the joint 475.

[0069] It should be noted that in other embodiments, as long as the flow tube does not interfere with other components, the mounting plate can be fixed to the heat dissipation surface or the heat absorption surface of the first cavity. In other embodiments, the heat exchanger may not include the mounting plate 450 and the flow tube 460, and the valve member may be directly installed on the first cavity. In still other embodiments, the heat exchanger may not include the mounting plate 450, the flow tube 460, and the valve member 470.

[0070] In this embodiment, the heat exchanger 400 is used to accommodate a working fluid (not shown), and the working fluid is, for example, water or refrigerant. Please refer again to Figure 2 , Figure 3 and Figure 6 , the first flow channel 411 of the first cavity 410, the second flow channel 421 of these heat dissipation plates 420, and the third flow channel 441 of the second cavity 440 are used to accommodate the working fluid. The working fluid absorbs the heat generated by the heat source 300 in the first flow channel 411 of the first cavity 410 and evaporates into a gas state. The working fluid evaporated into a gas state will flow from the first flow channel 411 to the second flow channel 421 of the heat dissipation plate 420 through the pressure difference and the assistance of the fin structure 445 in the first flow channel 411 and condense into a liquid state through the assistance of the heat dissipation fins 430. The working fluid condensed into a liquid state in the second flow channel 421 will flow into the third flow channel 441 and then return to the first flow channel 411 of the first cavity 410 again. When the valve member 470 is in the closed state, the first flow channel 411, the second flow channel 421, and the third flow channel 441 will jointly form an independent closed loop, enabling the working fluid to circulate in this independent closed loop and generate a phase change. That is to say, the heat exchanger 400 according to the present invention does not have a flow outlet and a flow inlet communicating with the outside. The opening 416 of the first cavity 410 is only used to replace the working fluid or adjust the amount of the working fluid in the heat exchanger 400 when the valve member 470 is in the open state.

[0071] Since the valve member 470 communicates with the first flow channel 411 of the first cavity 410 through the opening 416 of the first cavity 410, only by opening the valve member 470 can the working fluid be replaced or the amount of the working fluid in the heat exchanger 400 be adjusted. In this way, it is not necessary to disassemble and assemble the mounting plate 450 and the screws 465 to replace the working fluid or adjust the amount of the working fluid in the heat exchanger 400, thereby preventing the working fluid from leaking out of the heat exchanger 400.

[0072] According to the server and heat exchanger disclosed in the above embodiments, since the first flow channel of the first cavity is connected to the second flow channel of the heat dissipation plate, and the heat dissipation fins are in thermal contact with the heat dissipation plate, the working fluid in the first flow channel of the first cavity can dissipate heat more effectively with the assistance of the heat dissipation fins in the second flow channel of the heat dissipation plate after absorbing the heat generated by the heat source. In this way, the heat exchanger can more effectively dissipate the heat generated by the heat source in a limited space.

[0073] Although the present invention has been disclosed above with the foregoing embodiments, it is not intended to limit the present invention. Any person skilled in this technology can make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of patent protection of the present invention shall be subject to the scope defined by the claims of the present invention.

Claims

1. A server, characterized in that, Comprising: A housing; A main board disposed in the housing; A heat source disposed and electrically connected to the main board; And A heat exchanger comprising a first cavity, a plurality of heat dissipation plates and a plurality of heat dissipation fins. The first cavity is in thermal contact with the heat source and has a first flow channel. A plurality of the heat dissipation plates are in thermal contact with and inserted into the first cavity. Each of the plurality of heat dissipation plates has a second flow channel. The first flow channel of the first cavity communicates with the plurality of second flow channels of the plurality of heat dissipation plates. A plurality of the heat dissipation fins are in thermal contact with the plurality of heat dissipation plates; The heat exchanger further comprises a valve member. The first cavity further has an opening which communicates with the first flow channel. The valve member is installed in the first cavity and communicates with the opening; The heat exchanger further comprises a mounting plate and a flow pipe. The mounting plate is fixed to the first cavity. The mounting plate has a first surface, a second surface, a mounting hole and a communication hole. The first surface and the second surface face away from each other. The first surface is closer to the first cavity than the second surface. The communication hole is located on the first surface. The mounting hole is located on the second surface and communicates with the communication hole. One end of the flow pipe is received in the mounting hole and communicates with the communication hole. The valve member is installed at the other end of the flow pipe and communicates with the flow pipe.

2. The server according to claim 1, wherein One end of the flow pipe is fixed to the mounting plate by welding.

3. The server according to claim 2, wherein The diameter of the mounting hole is larger than the diameter of the flow pipe, and the diameter of the flow pipe is larger than the diameter of the communication hole.

4. The server according to claim 1, wherein The heat exchanger further comprises a joint. The other end of the flow pipe is installed on the valve member through the joint.

5. The server according to claim 1, wherein The heat exchanger further comprises a sealing ring. The mounting plate further has an annular groove which is recessed from the first surface. The annular groove surrounds the communication hole and does not communicate with the communication hole. The sealing ring is received in the annular groove.

6. The server according to claim 1, wherein The first cavity of the heat exchanger further has a heat dissipation surface, a heat absorption surface and a side peripheral surface. The heat dissipation surface and the heat absorption surface face away from each other. The side peripheral surface connects the heat dissipation surface and the heat absorption surface. The heat absorption surface is in thermal contact with the heat source. A plurality of the heat dissipation plates are in thermal contact with the heat dissipation surface. The mounting plate is fixed to the side peripheral surface.

7. The server according to claim 1, wherein The heat exchanger further comprises a screw. The first cavity further has a first screw hole. The mounting plate further has a second screw hole. The second screw hole is located on the first surface and is separated from the communication hole. The screw is screwed into the first screw hole and the second screw hole to fix the mounting plate to the first cavity.

8. The server according to claim 1, wherein The first cavity of the heat exchanger has a heat dissipation surface, a heat absorption surface and a plurality of slots. The heat dissipation surface and the heat absorption surface face away from each other. The heat absorption surface is in thermal contact with the heat source. The plurality of slots are located on the heat dissipation surface and communicate with the first flow channel. A plurality of the heat dissipation plates are respectively inserted into the plurality of slots.

9. The server according to claim 8, wherein Each of the heat dissipation plates extends along an extending direction away from the heat dissipation surface of the first cavity. A plurality of the heat dissipation fins are disposed between the plurality of heat dissipation plates and along the extending direction.

10. The server according to claim 1, characterized in that The heat exchanger further includes a second cavity. One side of the plurality of heat dissipation plates away from the first cavity is in thermal contact with and inserted into the second cavity. The second cavity has a third flow channel, and the third flow channel communicates with the first flow channel of the first cavity through the plurality of second flow channels of the plurality of heat dissipation plates.

11. A heat exchanger for thermally contacting a heat source and containing a working fluid, characterized in that, The heat exchanger includes: a first cavity for thermally contacting the heat source and having a first flow channel; a plurality of heat dissipation plates, which are in thermal contact with and inserted into the first cavity. Each of the plurality of heat dissipation plates has a second flow channel. The first flow channel of the first cavity communicates with the plurality of second flow channels of the plurality of heat dissipation plates, and the first flow channel and the plurality of second flow channels are used to accommodate the working fluid; and a plurality of heat dissipation fins in thermal contact with the plurality of heat dissipation plates; The heat exchanger further includes a valve member. The first cavity has an opening, and the opening communicates with the first flow channel. The valve member is installed in the first cavity and communicates with the opening; The heat exchanger further includes a mounting plate and a flow pipe. The mounting plate is fixed to the first cavity. The mounting plate has a first surface, a second surface, a mounting hole, and a communication hole. The first surface and the second surface face away from each other. The first surface is closer to the first cavity than the second surface. The communication hole is located on the first surface, and the mounting hole is located on the second surface and communicates with the communication hole. One end of the flow pipe is received in the mounting hole and communicates with the communication hole. The valve member is installed at the other end of the flow pipe and communicates with the flow pipe.

12. The heat exchanger according to claim 11, wherein, One end of the flow pipe is fixed to the mounting plate by welding.

13. The heat exchanger according to claim 12, wherein, The diameter of the mounting hole is larger than the diameter of the flow pipe, and the diameter of the flow pipe is larger than the diameter of the communication hole.

14. The heat exchanger according to claim 11, wherein, The heat exchanger further includes a joint, and the other end of the flow pipe is installed on the valve member through the joint.

15. The heat exchanger according to claim 11, characterized in that, The heat exchanger further includes a sealing ring. The mounting plate further has an annular groove, which is recessed from the first surface. The annular groove surrounds the communication hole and does not communicate with the communication hole. The sealing ring is received in the annular groove.

16. The heat exchanger according to claim 11, wherein The working fluid absorbs the heat generated by the heat source in the first flow channel of the first cavity and evaporates into a gas state. The working fluid in the gas state flows from the first flow channel to the plurality of second flow channels of the plurality of heat dissipation plates through the pressure difference and condenses into a liquid state with the assistance of the plurality of heat dissipation fins. The working fluid condensed into a liquid state in the plurality of second flow channels returns to the first flow channel of the first cavity again.

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