Base setup using camera wafer

Abstract

A method includes: arranging a device on the top surface of a base in a processing chamber. The device includes: an annular member; N support members; and N pins, where N is an integer greater than 2. The N support members support the annular member in a plane parallel to the top surface of the base and above the top surface. The N pins are arranged perpendicular to a plane along a circumference surrounding the annular member. Each of the N pins includes a thread that can engage with a corresponding thread groove in the device. Each of the N pins includes a tapered end point pointing toward the top surface of the base and capable of engaging with the periphery of the top surface of the base. The method also includes: aligning the center of the annular member with the center of the base by adjusting one or more of the N pins.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This disclosure is a PCT international application based on U.S. Provisional Patent Application No. 62 / 879,654, filed on July 29, 2019. The entire disclosures of the above-referenced applications are incorporated herein by reference. Technical Field

[0003] The present disclosure relates generally to substrate processing systems and, more particularly, to a fixture for setting up a pedestal using a camera wafer. Background Art

[0004] The background description provided here is for the purpose of generally presenting the context of the present disclosure. No admission is made, either explicitly or implicitly, that the work of the presently designated inventors is prior art to the present disclosure to the extent that it is described in this background section and in aspects of the specification that were not determined to be prior art at the time the application was filed.

[0005] Substrate processing systems typically include multiple processing chambers (also referred to as processing modules) to perform deposition, etching, and other processes on substrates such as semiconductor wafers. Examples of processes that can be performed on substrates include, but are not limited to, plasma-enhanced chemical vapor deposition (PECVD) processes, chemically enhanced plasma vapor deposition (CEPVD) processes, and sputtering physical vapor deposition (PVD) processes. Other examples of processes that can be performed on substrates include, but are not limited to, etching (e.g., chemical etching, plasma etching, reactive ion etching, etc.) and cleaning processes.

[0006] During processing, the substrate is placed on a substrate support, such as a pedestal, electrostatic chuck (ESC), etc., in a processing chamber of a substrate processing system. During deposition, a gas mixture containing one or more precursors is introduced into the processing chamber, and a plasma is ignited to activate the chemical reaction. During etching, a gas mixture containing an etching gas is introduced into the processing chamber, and a plasma is ignited to activate the chemical reaction. A computer-controlled robot typically transfers the substrates from one processing chamber to another in the order in which they are to be processed. Summary of the Invention

[0007] A device includes: an annular member arranged along a first plane; and N first members extending perpendicularly to the first plane from an outer diameter of the annular member, where N is an integer greater than 2. A first portion of each of the N first members extends above the first plane, and a second portion of each of the N first members extends below the first plane. The device also includes: N second members extending radially outward from the second portions of the N first members along a second plane parallel to the first plane. Each of the N second members is located between a different pair of the N first members.

[0008] In another feature, the annular member, the N first members, and the N second members form a single structure.

[0009] In another feature, the annular member, the N first members, and the N second members are made of metal.

[0010] In another feature, the device further includes N third members extending downward from the N second members perpendicular to the second plane, respectively, the N third members having equal lengths and made of non-abrasive material.

[0011] In another feature, the device further comprises: N pins extending downwardly from the N second members perpendicular to the second plane, the N pins having equal lengths and tapered ends and made of a non-abrasive material, the N pins being equidistant from the center of the annular member and comprising threads that can engage with thread grooves in the N second members.

[0012] In other features, the device further includes: N third members arranged in corresponding slots in the N second members, the N third members having equal lengths and made of a non-abrasive material. Each of the N third members is arcuate and includes a first element, a second element, and a third element. The first element is fixed to a corresponding one of the N second members parallel to the second plane. The second element extends perpendicularly from the first element below the second plane and below the corresponding one of the N second members. The third element extends perpendicularly from the first element below the second plane and below the corresponding one of the N second members, and extends less than the second element.

[0013] In another feature, the first, second and third elements constitute a single structure.

[0014] In another feature, the first element has a longer arc length than the second and third elements.

[0015] In another feature, distal ends of the third elements of the N third members lie in a plane parallel to the second plane.

[0016] In another feature, the device further includes: N pins of equal length and made of non-abrasive material, the N pins extending downwardly perpendicular to the second plane at the same radial distance from the center of the annular member through corresponding thread grooves in the N second members. Each of the N pins includes: a top; a tapered bottom; and a threaded portion between the top and the bottom that is engageable with the corresponding thread groove.

[0017] In still other features, a method includes: arranging a device on a top surface of a base in a processing chamber. The device includes: an annular member; N support members; and N pins, where N is an integer greater than 2. The N support members support the annular member in a plane parallel to and above the top surface of the base. The N pins are arranged perpendicular to the plane along a circumference surrounding the annular member. Each of the N pins includes a thread that can engage with a corresponding thread groove in the device. Each of the N pins includes a tapered end point pointing toward the top surface of the base and capable of engaging with the periphery of the top surface of the base. The method also includes: aligning the center of the annular member with the center of the base by adjusting one or more of the N pins.

[0018] In other features, the method further includes: arranging N level indicators in corresponding slots of the apparatus to contact corresponding ones of the N pins. The method further includes: aligning the center of the annular member with the center of the base by adjusting one or more of the N pins until the N level indicators indicate the same level.

[0019] In other features, the method further includes: concentrically placing a wafer on the annular member; the wafer including a camera at a center of the wafer; the camera pointing toward a showerhead disposed above the susceptor in the processing chamber; the method further includes: capturing one or more images of the showerhead using the camera; and the method further includes: aligning the center of the susceptor with the center of the showerhead based on the one or more images.

[0020] In other features, the method further includes: concentrically arranging a wafer on the annular member. The wafer includes a camera at a center of the wafer. The camera is directed toward a showerhead disposed above the pedestal in the processing chamber. The wafer further includes a wireless transmitter for communicating with the camera and a computing device located outside the processing chamber. The method further includes: transmitting the one or more images to the computing device using the wireless transmitter; processing the one or more images at the computing device; and aligning the center of the pedestal with the center of the showerhead based on the processing.

[0021] In other features, the method further includes: concentrically arranging a wafer on the annular member. The wafer includes a camera at the center of the wafer. The camera is directed toward a showerhead disposed above the pedestal in the processing chamber. The wafer further includes a wireless transmitter to communicate with the camera and a computing device located outside the processing chamber. The method also includes closing the processing chamber and generating a vacuum in the processing chamber. The method also includes: capturing one or more images of the showerhead using the camera; and transmitting the one or more images to the computing device using the wireless transmitter. The method also includes: processing the one or more images at the computing device; and moving the pedestal based on the processing until the center of the pedestal is aligned with the center of the showerhead.

[0022] Further scope of applicability of the present disclosure will become apparent from the detailed description, claims and drawings.The detailed description and specific examples are intended for purposes of illustration only and are not intended to limit the scope of the disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The present disclosure will be more fully understood from the detailed description and accompanying drawings, in which:

[0024] Figure 1 An example of a substrate processing system having a processing chamber is shown;

[0025] Figure 2 A fixture for aligning the susceptor to the showerhead in the process chamber is shown;

[0026] Figure 3 A wafer including a camera for use with the fixture to align a susceptor with a showerhead in a processing chamber is shown;

[0027] Figure 4 The fixture and the wafer containing the camera are shown;

[0028] Figure 5 A view of the fixture from the underside of the fixture is shown;

[0029] Figure 6The components of the fixture, made to close tolerances, are shown;

[0030] Figure 7 An additional view of the fixture is shown;

[0031] Figure 8 and 9 Additional structural details of the fixture are shown;

[0032] Figure 10 Shows the structural details of the contact pads of the fixture located on the base;

[0033] Figure 11 Shows the structural details of the pin on the clamp that is used to align the clamp with the base;

[0034] Figure 12 A schematic diagram of a system comprising a fixture and a computing device for aligning a base with a printhead is shown; and

[0035] Figure 13 A flow chart of a method for aligning a substrate with the showerhead using the fixture is shown.

[0036] Among the drawings, reference numerals may be repeated to identify similar and / or identical elements. DETAILED DESCRIPTION

[0037] Uniformity across the wafer (e.g., in deposition processes) depends on the alignment of the pedestal and showerhead. The gap between the pedestal and showerhead orifices affects the flow of process gases. A non-uniform gap leads to non-uniform flow, which in turn increases non-uniformity. The pedestal is typically positioned relative to the center of the process chamber, which can lead to non-uniform gaps.

[0038] A wafer with an integrated camera at its center (hereafter referred to as a camera wafer) is used to align the pedestal with the showerhead. However, achieving reproducible results is difficult when a camera wafer is used for alignment between the camera wafer and the pedestal. Current fixtures used with camera wafers are either loosely mounted on the pedestal, adversely affecting mounting repeatability, or mounted too tightly, scratching the pedestal. To achieve close alignment between the pedestal and the showerhead, the camera wafer needs to be well-centered on the pedestal. The fixture used with the camera wafer needs to provide repeatability for the alignment process. The fixture also needs to accommodate various pedestal sizes and variations (tolerances).

[0039] A fixture designed according to the present disclosure places a camera wafer on a susceptor without scratching the susceptor and provides repeatability up to 0.005". The fixture improves the repeatability of the susceptor-showerhead alignment process. The fixture accommodates susceptors of various sizes, whether bare, coated, or conditioned, and is independent of the material (e.g., metal, ceramic, etc.) that the susceptor is constructed of.

[0040] The current method for setting up the susceptor is to align it with the spindle. The fixtures used for this purpose have large tolerances and do not necessarily align the susceptor with the showerhead. Misalignment can lead to azimuthal non-uniformity. As demands for uniformity across the wafer increase, unreliable susceptor alignment can result in multiple openings in the process chamber to restore the chamber after susceptor installation or replacement.

[0041] Using the system and method of the present disclosure, the camera wafer is used to position each pedestal in alignment with its showerhead while accurately compensating for large system level tolerances. The dimensions of the fixture designed according to the present disclosure are very close to the outer diameter (OD) of the camera wafer. That is, the fixture uses the OD of the camera wafer, which is manufactured to tight tolerances, to center the camera wafer on the fixture.

[0042] The fixture with the camera wafer is located on the top surface of the base. The camera wafer is located on a raised annular platform on the fixture, which is parallel to the top surface of the base. Due to the design features of the fixture that will be described in detail below, the raised annular platform of the fixture provides a path for venting trapped air, good connectivity between the camera wafer and the data acquisition equipment for alignment, and easy access to the camera wafer for placement and removal. The fixture has three legs (referred to as contact pads in the description below) that are made of a non-abrasive surface to prevent damage to the base surface. The height tolerance and parallelism of these legs are strictly controlled.

[0043] The fixture is centered on the base using three tapered pins referenced to the base's OD. These pins are made of a non-abrasive material to protect the base surface. The pins are screwed into the fixture and can be adjusted to accommodate bases of varying ODs. The length of the pins is tightly controlled. Once the pins are adjusted to align the centers of the fixture and base, the center of the tapered end of the pin slides vertically (up and down) along the base's OD. This allows the fixture to move horizontally parallel to the base's top surface, facilitating alignment of the two centers.

[0044] To align the centers of the jig and base, the height of the top surface of the tapered pins relative to the jig's reference surface is measured using a dial indicator (level indicator). When all three tapered pins are set to the same height, their endpoints define a circle concentric with the jig and camera wafer. At this point, the centers of the jig and camera wafer are aligned with the center of the base. The base is then moved as detailed below to align the center of the base with the center of the printhead (i.e., the center of the camera wafer and the center of the jig are aligned with the hole in the center of the printhead).

[0045] The fixture can also be used to intentionally create a calculated offset between the center of the fixture and the base by varying the height of the pins. This feature can be used to create an intentional offset between the base and the printhead to compensate for other orientation non-uniformities. The fixture has a mark that the notch on the camera wafer aligns with to ensure repeatability of the alignment process.

[0046] Thus, the fixture according to the present disclosure provides a precise, reproducible, and base-specific alignment. The fixture can accommodate a variety of base sizes. The fixture has non-abrasive joints. Due to the fixture's raised annular platform for alignment processing, the fixture performs base alignment at process height.

[0047] This disclosure is organized as follows. First, reference is made to Figure 1 An example of a processing chamber is shown and described. Subsequently, the structure of the fixture according to the present disclosure is referred to Figure 2-11 After that, refer to Figure 12 and Figure 13 Describes the use of a fixture to align the base with the nozzle. Specifically, refer to Figures 2 to 7 To show and explain the structural details of the fixture. The technical drawing of the fixture is shown in Figure 8-11 Then refer to Figure 12 and Figure 13 To illustrate the use of a fixture for alignment. Figure 12 A system including a fixture and a computing device for aligning a base to a printhead is shown and described. Figure 13 A method of aligning the base with the sprinkler head using a fixture is shown and described.

[0048] Figure 1 A substrate processing system 100 is shown that includes a process chamber 102. Although this example is described in the context of plasma enhanced chemical vapor deposition (PECVD), the teachings of the present disclosure can be applied to other types of substrate processing, such as atomic layer deposition (ALD), plasma enhanced ALD (PEALD), chemical vapor deposition, or other processes including etching processes. The system 100 includes a process chamber 102 that surrounds the other components of the system 100 and contains an RF plasma (if used). The process chamber 102 includes an upper electrode 104 and an electrostatic chuck (ESC) 106 or other substrate support. During operation, a substrate 108 is disposed on the ESC 106.

[0049] For example, the upper electrode 104 can include a gas distribution device 110, such as a showerhead, to introduce and distribute the process gas. The gas distribution device 110 can include a rod having one end connected to the top surface of the process chamber 102. The base of the showerhead is generally cylindrical and extends radially outward from the opposite end of the rod at a position spaced from the top surface of the process chamber 102. The substrate-facing surface or faceplate of the base of the showerhead includes a plurality of holes through which vaporized precursors, process gases, or purge gases flow. Alternatively, the upper electrode 104 can include a conductive plate, and the process gas can be introduced in another manner.

[0050] ESC 106 includes a bottom plate 112 that serves as a lower electrode. Bottom plate 112 supports a heater plate 114, which may correspond to a ceramic multi-zone heater plate. A thermal resistance layer 116 may be disposed between heater plate 114 and bottom plate 112. Bottom plate 112 may include one or more channels 118 for flowing a coolant through bottom plate 112.

[0051] If plasma is used, the RF generation system 120 generates an RF voltage and outputs the RF voltage to one of the upper electrode 104 and the lower electrode (e.g., the bottom plate 112 of the ESC 106). The other of the upper electrode 104 and the bottom plate 112 can be DC grounded, AC grounded, or at a floating potential. By way of example only, the RF generation system 120 can include an RF generator 122 that generates RF power that is fed to the upper electrode 104 or the bottom plate 112 by a matching and distribution network 124. In other examples, the plasma can be generated inductively or remotely.

[0052] Gas delivery system 130 includes one or more gas sources 132-1, 132-2, ..., and 132-N (collectively, gas sources 132), where N is an integer greater than zero. Gas sources 132 are connected to manifold 140 via valves 134-1, 134-2, ..., and 134-N (collectively, valves 134) and mass flow controllers 136-1, 136-2, ..., and 136-N (collectively, mass flow controllers 136). Vapor delivery system 142 supplies vaporized precursors to manifold 140 or another manifold (not shown) connected to process chamber 102. Gas output from manifold 140 is fed to process chamber 102.

[0053] The temperature controller 150 can be connected to a plurality of thermal control elements (TCEs) 152 arranged in the heating plate 114. The temperature controller 150 can be used to control a plurality of TCEs 152 to control the temperature of the ESC 106 and the substrate 108. The temperature controller 150 can be communicated with a coolant assembly 154 to control the coolant to flow through the channel 118. For example, the coolant assembly 154 can include a coolant pump, a reservoir, and one or more temperature sensors (not shown). The temperature controller 150 operates the coolant assembly 154 so that the coolant selectively flows through the channel 118 to cool the ESC 106. A valve 156 and a pump 158 can be used to discharge reactants from the processing chamber 102. The system controller 160 controls the components of the system 100.

[0054] Figure 2 A fixture 200 for aligning a susceptor with a showerhead according to the present disclosure is shown. The fixture 200 comprises an annular platform 202 on which a camera wafer ( Figure 3 Annular platform 202 may also be referred to as an annular element, portion, or component of jig 200. Annular platform 202 is parallel to the plane of the camera wafer. The outer diameter (OD) of annular platform 202 closely matches the OD of the camera wafer. Jig 200 is manufactured so that the OD of annular platform 202 matches the OD of the camera wafer. Therefore, when a camera wafer is placed on annular platform 202, the centers of the camera wafer and annular platform 202 are automatically aligned.

[0055] The OD of the annular platform 202 (and therefore the OD of the camera wafer) is constrained by a plurality of curved vertical elements of the fixture 200. For example, three vertical elements are shown at 204-1, 204-2, and 204-3 (collectively referred to as vertical elements 204). The vertical elements 204 may also be referred to as vertical portions or members of the fixture 200. Each vertical element 204 extends around the OD of the annular platform 202. The vertical elements 204 are perpendicular to the plane in which the annular platform 202 lies (and therefore perpendicular to the plane in which the camera wafer lies). The vertical elements 204 are integral with the annular platform 202 and extend from the annular platform 202. That is, the vertical elements 204 and the annular platform 202 are manufactured as a single piece and cannot be separated from each other.

[0056] The first (top) portion of each vertical element 204 extends vertically above the annular platform 202 and restrains the camera wafer. The second (bottom) portion of each vertical element 204 extends vertically below the annular platform 202 and does not contact the top surface of the base. However, when the fixture 200 is placed on the top surface of the base, the bottom portion of the vertical elements 204 and the annular platform 202 are lifted above the top surface of the base by a set of contact pads (described below).

[0057] The vertical elements 204 are not connected to each other to form a cylindrical shape around the annular platform 202. Instead, in the example shown with three vertical elements 204, the arc length of each vertical element 204 is less than one-third of the OD of the annular platform 202. That is, the sum of the arc lengths of the vertical elements 204 is less than the OD of the annular platform 202. The centers of the arc lengths of the vertical elements 204 are located at the vertices of an equilateral triangle. The centers of the arc lengths of the vertical elements 204 and the vertices of the equilateral triangle are located on a circle concentric with the center of the annular platform 202 (i.e., the center of the fixture 200). Although three vertical elements are shown here, N vertical elements may be used instead, where N is an integer greater than 2.

[0058] The fixture 200 also includes a plurality of arcuate horizontal elements 206-1, 206-2, and 206-3 (collectively referred to as horizontal elements 206, all three of which may be Figure 5 and Figure 8 204 ), these horizontal elements extend radially outward from the OD of the annular platform 202. The horizontal elements 206 may also be referred to as the horizontal portion or member of the fixture 200. The horizontal elements 206 are perpendicular to the vertical elements 204. The horizontal elements 206 lie in a plane parallel to the plane of the annular platform 202 (and therefore parallel to the plane of the camera wafer).

[0059] The plane in which the horizontal element 206 lies is below the plane in which the annular platform 202 lies (and therefore below the plane of the camera wafer). The plane in which the horizontal element 206 lies is closer to the top surface of the base than the plane in which the annular platform 202 lies. In the following description, the plane in which the horizontal element 206 lies is also referred to as the reference plane. The bottom portion of the horizontal element 206 and the bottom portion of the vertical element 204 lie in the same plane.

[0060] Similar to vertical elements 204, horizontal elements 206 are not connected to each other to form an annular shape around annular platform 202. Instead, the ends of each horizontal element 206 are connected to two vertical elements 204. Specifically, each horizontal element 206 is connected to a different pair of vertical elements 204. For example, the first and second ends of horizontal element 206-1 are connected to the first ends of vertical elements 204-1 and 204-2, respectively; the first and second ends of horizontal element 206-2 are connected to the second end of vertical element 204-2 and the first end of vertical element 204-3, respectively; and the first and second ends of horizontal element 206-3 are connected to the second ends of vertical elements 204-3 and 204-1, respectively.

[0061] The center of the arc length of the horizontal element 206 is also located at the vertex of the equilateral triangle. The center of the arc length of the horizontal element 206 and the vertex of the equilateral triangle are located on a circle concentric with the center of the annular platform 202 (i.e., the center of the clamp 200). The number of horizontal elements 206 is the same as the number of vertical elements 204. The horizontal elements 206 are integrated with the vertical elements 204 and extend from the vertical elements 204. In other words, the horizontal elements 206, the vertical elements 204, and the annular platform 202 are manufactured as a single piece, i.e., the clamp 200, and are inseparable from each other.

[0062] Each horizontal element 206 includes contact pads (shown as 208-1, 208-2, and 208-3; collectively referred to as contact pads 208) disposed on a base. Contact pads 208 are also arc-shaped similar to horizontal elements 206 and are inserted into slots in horizontal elements 206. Figure 10 The contact pad 208 is shown and described in greater detail. The contact pad 208 may also be referred to as a support structure, member, or element of the fixture 200. By way of example only, the contact pad 208 may be located at or near the first end of the horizontal member 206. Thus, the contact pad 208 is located at the vertex of an equilateral triangle and on a circle concentric with the center of the annular platform 202 (i.e., the center of the fixture 200).

[0063] Each horizontal member 206 includes a pin 210 for alignment. The pin 210 is inserted into a threaded groove in the horizontal member 206. Each pin 210 includes a top measuring surface (or head) 212, threads 214, and a tapered portion 216 (or bottom portion) for adjustment, as described in detail below. The pin 210 is positioned at Figure 11 The threads 214 engage with the thread grooves in the horizontal member 206 and are small enough (eg, 100 threads per inch) to allow for fine adjustments during alignment.

[0064] The tapered portion 216 is designed to engage and slide vertically along the OD (i.e., perimeter, circumference) of the top surface of the base as the pin 210 rotates. That is, the tapered portion 216 is designed to slide perpendicular to the plane of the annular platform 202 and the plane of the camera wafer. The tapered portion 216 is designed to accommodate and adjust to bases with varying ODs, as described below with reference to FIG. Figure 12 As described.

[0065] For example, pins 210 can be positioned adjacent to contact pads 208 on horizontal element 206. Pins 210 are located at the vertices of an equilateral triangle. Furthermore, due to the tight tolerances in manufacturing jig 200, the positions of pins 210 are tightly controlled relative to the center of jig 200 (which is also the center of the camera wafer). Specifically, the positions of pins 210 are located on a circle concentric with the center of jig 200 (i.e., the center of annular platform 202), which facilitates the alignment process as explained in detail below.

[0066] Each horizontal element 206 includes a receptacle for mounting a leveling device (or level indicator) 220. Each level indicator 220 measures or indicates the level of the corresponding horizontal element 206 relative to the plane of the annular platform 202 (and therefore relative to the plane of the camera wafer). By way of example only, the level indicator 220 may be located at or near the second end of the horizontal element 206. The level indicator 220 reads a base level (zero) on a reference plane, which is the plane in which the horizontal element 206 lies. The level indicator 220 measures the height of the pins 210. When the heights on all three pins 210 are equal, the tapered end points of the pins 210 define (i.e., are located on) concentric circles relative to the center of the fixture 200 (which is also the center of the camera wafer and the center of the annular platform 202).

[0067] The illustrated positions of the contact pads 208, pins 210, and level indicators 220 are merely examples. These positions may vary from the illustrated positions, as long as the symmetry of the positions is maintained. For example, the positions of the contact pads 208 and level indicators 220 on each horizontal element 206 may be swapped (i.e., interchanged). Alternatively, the level indicator 220 may be located between the contact pads 208 and pins 210 on the corresponding horizontal element 206. Alternatively, the contact pads 208 may be located between the level indicators 220 and pins 210 on the corresponding horizontal element 206.

[0068] Note that the number of contact pads 208, pins 210, and level indicators 220 is the same as the number of horizontal elements 206. Throughout this disclosure, the number of three vertical elements 204, horizontal elements 206, contact pads 208, pins 210, and level indicators 220 is used for illustrative purposes only. The number of each of these items can be any number greater than or equal to three. For example, if four of each of these items are used, a symmetrical arrangement of these items can be represented by a square, rather than an equilateral triangle, where the vertices of the square are located on a circle concentric with the center of the fixture 200.

[0069] Furthermore, although the arc length of vertical element 204 is shown as being greater than the arc length of horizontal element 206 , the arc length of vertical element 204 may be less than or equal to the arc length of horizontal element 206 .

[0070] Because the annular platform 202 is elevated by the second (bottom) portion of the vertical element 204, and because the horizontal element 206 is located at a plane lower than the plane of the annular platform 202, a cutout (i.e., a gap, opening, passage, or window) exists between the annular platform 202 and the horizontal element 206. The cutouts are shown at 222-1, 222-2, and 222-3 (collectively referred to as cutouts 222, in FIG. Figure 5 All three cutouts 222 can be seen in the figure. The number of cutouts 222 is the same as the number of horizontal elements 206 and vertical elements 204. The cutouts 222 provide a path for entrapped air to escape, good connectivity between the camera wafer and data acquisition equipment for alignment, and easy access to the camera wafer for placement and removal.

[0071] The fixture 200 is made of metal as a single piece and includes an annular platform 202 and vertical and horizontal elements 204 and 206. The fixture 200 can also be made of non-metallic materials. The contact pad 208 of the fixture 200 is made of a non-metallic material and a non-abrasive material (for example, polyoxymethylene or polyetheretherketone (PEEK)). The contact pad 208 is fixed (for example, bolted) and sealed to the fixture 200 to prevent dimensional deviation. The pin 210 is made of a non-metallic and non-abrasive material such as polyoxymethylene or polyetherimide. The pin 210 is locked using a set screw. When the contact pad 208 and / or the pin 210 contact the top surface of the base, these non-metallic and non-abrasive materials prevent the base from being scratched.

[0072] The jig 200 includes a mark 230 to which the notch on the camera wafer is aligned. However, the camera wafer can be aligned with any other reference point on the jig 200. The jig 200 includes a mark 232 to align the jig 200 with the base hole. The jig 200 includes a mark 234 to align the jig 200 with the spindle orientation.

[0073] Figure 3 The camera wafer 300 is shown. On a first (top) side facing the showerhead, the camera wafer 300 comprises a camera 302 at its center. On a second (bottom) side facing the base, the camera wafer 300 comprises a camera 302 as shown in FIG. Figure 12 Shown is a wireless transmitter (eg, a Bluetooth device) and electrical contacts 304 for charging the wireless transmitter and camera 302. The fixture 200 is manufactured so that the OD of the annular platform 202 of the fixture 200 closely matches the OD 306 of the camera wafer 300.

[0074] Figure 4 The fixture 200 is shown, along with the camera wafer 300. As can be seen, the OD 306 of the camera wafer 300 closely matches the OD of the annular platform 202 of the fixture 200.

[0075] Figure 5 A view from the bottom of the clamp 200 is shown. This view shows all three horizontal elements 206 and all three pins 210. For simplicity, only one level indicator 220 is shown.

[0076] Figure 6A portion of the fixture 200 is shown to illustrate the components manufactured to tight tolerances. These components include an annular platform 202 that defines the wafer plane and is perfectly horizontal. The OD 203 of the annular platform 202 closely matches the OD 306 of the camera wafer 300 (to center the camera wafer 300 in the center of the fixture 200). The top surface 205 of the horizontal element 206 defines a reference plane that is perfectly horizontal and lies in a plane parallel to the plane of the annular platform 202 (i.e., the wafer plane). The top surfaces 205 of all horizontal elements 206 are perfectly horizontal and lie in the same plane (i.e., the reference plane) that is parallel to the plane of the annular platform 202 (i.e., the wafer plane). The depiction of the set screws 250 is for illustration only and is not required. The fixture 200 described operates with or without the set screws 250.

[0077] The top surfaces of all pins 210 are perfectly horizontal and lie in the same plane, parallel to the plane of the annular platform 202. The threads 214 of the pins 210 are small enough to allow for fine adjustments during the alignment process. The tapered portion 216 is designed to accommodate and adjust to bases with different ODs. The pins 210 are nearly identical. Specifically, the length of the pins 210, the pitch of the threads 214, and the dimensions of the tapered portion 216 are all tightly controlled.

[0078] The dimensions of all components of the fixture 200 are strictly controlled to provide precise alignment between the fixture 200 and the camera wafer, between the fixture 200 and the susceptor, and between the fixture 200, the susceptor, and the showerhead. The strictly controlled dimensions also ensure the repeatability of the alignment process within the same chamber and across different chambers.

[0079] Figure 7 Additional views of the clamp 200 are shown. Figure 8-11 A technical diagram of the clamp 200 is shown, illustrating further details of the features of the clamp 200 . Figure 8 and 9 Additional views and details of the clamp 200 are shown. Figure 10 Additional views and details of contact pad 208 are shown. Figure 11 Additional views and details of pin 210 are shown.

[0080] exist Figure 10 2. The contact pad 208 is shown in more detail in FIG. The contact pad 208 includes a first portion 1000, a second portion 1002, and a third portion 1004. The first, second, and third portions 1000, 1002, and 1004 may also be referred to as first, second, and third elements or components of the contact pad 208. The first, second, and third portions 1000, 1002, and 1004 are made as a single piece and are inseparable from each other.

[0081] Although contact pad 208 is curved, it generally has the shape of the letter "T." First portion 1000 forms the top horizontal portion of the letter "T." Second and third portions 1002 and 1004 form the vertical portions of the letter "T." The arc length or width of first portion 1000 is greater than the arc length or width of second and third portions 1002 and 1004, thereby giving contact pad 208 a T-like shape. Third portion 1004 is shorter than second portion 1002, forming a stepped structure as described below.

[0082] The first portion 1000 is parallel to the plane of the annular platform 202 and the horizontal element 206 (i.e., the wafer plane and the reference plane). The first portion 1000 includes one or more receptacles for receiving fasteners to secure the contact pads 208 to the corresponding horizontal element 206. The second and third portions 1002 and 1004 extend vertically downward from the first portion 1000, away from the horizontal element 206, toward the base. The second portion 1002 is longer than the third portion 1004. Thus, a step-like structure is formed between the distal ends of the second portion 1002 and the third portion 1004. Specifically, the step-like structure is formed by extending the distal end of the third portion 1004 toward near the center of the second portion 1002, with the remaining portion of the second portion 1002 extending downward toward the base, away from the distal end of the third portion 1004 (and the step portion).

[0083] The remainder of second portion 1002 (i.e., from the step to the distal end of second portion 1002) surrounds the OD of the base, while the distal end (i.e., the step portion) of third portion 1004 rests on the base. The length (or height) of third portion 1004 is slightly greater than the length (or height) of horizontal element 206. In other words, third portion 1004 extends slightly beyond the bottom of horizontal element 206 (and therefore the bottom of the vertical element, since the bottoms of horizontal element 206 and vertical element 204 are located on the same plane). In other words, the distal end (i.e., the step portion) of third portion 1004 extends slightly beyond the bottom of horizontal element 206. Consequently, contact pad 208 elevates vertical element 204 and horizontal element 206 above the top surface of the base.

[0084] Thus, contact pad 208 prevents contact between the top surface of the base and the bottoms of horizontal element 206 and vertical element 204, and prevents scratching of the top surface of the base. The only elements of clamp 200 that come into contact with the top surface of the base are the distal end (i.e., the stepped portion) of third portion 1004 of contact pad 208 and tapered portion 216 of pin 210.

[0085] Furthermore, the distance between the distal end of the second portion 1002 and the point where the distal end of the third portion 1004 meets the second portion 1002 (i.e., where the step is formed) is greater than the portion of the pin 210 (e.g., the tapered portion 216) that protrudes below the horizontal member 206. Therefore, when the clamp 200 is placed on the contact pad 208 on any surface (i.e., when the distal end of the second portion 1002 of the contact pad 208 is resting), especially when the clamp 200 is not in use and is stored, the tip of the tapered portion 216 of the pin 210 is protected (to prevent damage).

[0086] Figure 12 A system 1200 is schematically shown, which includes a fixture 200 and a computing device 1202 for aligning a pedestal 1204 with a showerhead 1206 in a processing chamber 1208. The fixture 200 uses a camera wafer 300, which includes a camera 302, to align the pedestal 1204 with the showerhead 1206, as described below. The camera wafer 300 includes a wireless transmitter (e.g., a Bluetooth device) 1210 that communicates with the camera 302 and the computing device 1202.

[0087] Computing device 1202 is located outside of processing chamber 1208 and includes a wireless transmitter (e.g., a Bluetooth device). For example, computing device 1202 may include a laptop, tablet, or smartphone. Computing device 1202 includes a database of images of various printheads, such as printhead 1206, captured from the center of a pedestal, such as pedestal 1204. These images serve as reference images during the alignment process.

[0088] The computing device 1202 executes an application that receives images of the printhead 1206 captured by the camera 302. The computing device 1202 compares these images with reference images of the printhead in a database and guides the alignment process as explained below. The system 1200 includes a base movement mechanism 1212 (e.g., one or more actuators) that can be used to move the base 1204 during the alignment process as explained below.

[0089] In use, the camera wafer 300 is placed on the annular platform 202 of the jig 200. Due to the tight tolerances observed during the manufacture of the jig 200, the ODs of the camera wafer 300 and the annular platform 202 are almost perfectly matched. Therefore, the centers of the camera wafer 300 and the annular platform 202, and thus the center of the jig 200, are automatically aligned.

[0090] Next, the jig 200 with the camera wafer 300 is placed on the base 1204. The bottom portions of the contact pads 208 (specifically, the bottom portion or step portion of the component) are placed on the top surface of the base 1204. When the jig 200 is manufactured, the contact pads 208 are fixed to the corresponding horizontal members 206, and then the bottom portions of the contact pads 208 (specifically, the bottom portion or step portion of the component) are machined so that the bottom portions or step portions of the component are located in the same plane. The machining ensures that the horizontal members 206 are all located in the same horizontal plane (reference plane) parallel to the plane passing through the bottom portions of the contact pads 208 (specifically, passing through the bottom portion or step portion of the component).

[0091] Therefore, assuming the top surface of the pedestal 1204 is horizontal (achieved using some other mechanism), it is parallel to the plane of the horizontal element 206 (i.e., the reference plane) and parallel to the plane of the camera wafer 300 (i.e., the wafer plane). In other words, the contact pads 208 ensure that when the jig 200 containing the camera wafer 300 is placed on the top surface of the pedestal 1204, the top surfaces of the jig 200, the camera wafer 300, and the pedestal 1204 are parallel to each other.

[0092] The next task is to align the center of the jig 200 (i.e., the center of the camera wafer 300) with the center of the base 1204. To align the center of the jig 200 with the center of the base 1204, the pin 210 is adjusted as follows. The pin 210 is adjusted so that the jig 200, the camera wafer 300, and the top surface of the base 1204 are concentric as described above. Figure 2 As shown, the pins 210 on the horizontal member 206 of the jig 200 are positioned on a circle concentric with the center of the jig 200 (and the center of the camera wafer 300). The tapered portion 216 of the pins 210 is used to align the jig 200 with bases having varying ODs. The amount of OD variation for which the pins 210 can be adjusted is a function of the size of the tapered portion 216.

[0093] First, a level indicator 220 is mounted on each level element 206 of the jig 200 and set to zero. Next, the level indicator 220 is moved to contact the top surface 212 of the corresponding pin 210. The height of the pin 210 is adjusted by rotating the top surface 212 of the pin 210 clockwise or counterclockwise until all level indicators 220 read the same height (i.e., display the same reading). At this point, the tips of the tapered portions 216 of the pins define a circle concentric with the center of the jig 200. That is, the center of the jig 200 and the center of the camera wafer 300 are aligned with the center of the base 1204. If an offset between the center of the wafer and the center of the base is desired, the pins 210 are adjusted until the desired offset is achieved.

[0094] Next, the center of pedestal 1204 is aligned with the center of showerhead 1206 as follows. Processing chamber 1208 is closed. Pedestal 1204 is optionally moved to a processing position using pedestal movement mechanism 1212. A vacuum is created in processing chamber 1208. Camera 302 on camera wafer 300 captures an image of showerhead 1206. Wireless transmitter 1210 then sends the captured image of showerhead 1206 to computing device 1202.

[0095] Computing device 1202 compares the captured image with a reference image of printhead 1206 stored in a database. Based on this comparison, computing device 1202 determines whether the center of printhead 1206 in the captured image is aligned with camera 302 and, therefore, with the center of base 1204. If not, base movement mechanism 1212 is used to move base 1204, and another image of printhead 1206 is captured and sent to computing device 1202. This process is repeated until alignment is achieved (i.e., until the captured image matches the reference image). At this point, the center of base 1204 is aligned with the center of printhead 1206 (e.g., aligned with the hole in the center of printhead 1206). Thus, the center of base 1204, the center of camera wafer 300, and the center of printhead 1206 are aligned.

[0096] Thus, the fixture 200 and camera wafer 300 are used to initially align the center of the fixture / wafer with the center of the pedestal, and then to align the center of the pedestal with the center of the showerhead. The fixture 200 provides repeatability within 0.005 inches. For example, when the fixture 200 is used and then used again to align the pedestal with the showerhead in the same process chamber, and the fixture 200 is rotated, for example, 180 degrees, in the later use case relative to the previous use case, the alignment results in the two cases differ by less than or equal to 0.005 inches. Similar repeatability can also be achieved between process chambers (for example, when the fixture 200 is used in different process chambers).

[0097] Figure 13 A method 1300 for aligning a susceptor with a showerhead in a processing chamber using the fixture 200 is shown. At step 1302, a camera wafer is placed in the fixture. At step 1304, the fixture with the camera wafer is placed on the susceptor. At step 1306, a level indicator is placed on the fixture. At step 1308, the level indicator is reset to zero. At step 1310, the level indicator is moved to contact the tops of pins on the fixture.

[0098] At step 1312, method 1300 determines whether all level indicators show the same reading (i.e., whether the top surfaces of the pins are at the same level or in the same plane). At step 1314, the head of one or more pins is adjusted by rotating it clockwise or counterclockwise until all level indicators read the same reading. At step 1316, after all level indicators read the same reading (i.e., after all pins are at the same level), the center of the fixture and the center of the camera wafer are aligned with the center of the pedestal, and the processing chamber is closed. At step 1318, the pedestal can optionally be moved to the processing position. At step 1320, a vacuum is created in the processing chamber.

[0099] At step 1322, a camera located at the center of the camera wafer of the fixture captures an image of the printhead. At step 1324, a wireless transmitter in the camera wafer transmits the captured image to a computing device outside the processing chamber. At step 1326, the computing device compares the captured image with a reference image. At step 1328, method 1300 determines whether the camera (i.e., the center of the pedestal) is aligned with the center of the printhead. If the camera (i.e., the center of the pedestal) is aligned with the center of the printhead, method 1300 ends. At step 1330, if the camera (i.e., the center of the pedestal) is not aligned with the center of the printhead, the pedestal is moved, and method 1300 returns to step 1322.

[0100] The foregoing description is merely illustrative in nature and is in no way intended to limit the present disclosure, its application or use. The broad teachings of the present disclosure can be implemented in various forms. Therefore, although the present disclosure includes specific examples, the true scope of the present disclosure should not be so limited, because other modifications will become apparent when studying the drawings, description and appended claims. It should be understood that one or more steps in the method can be performed in a different order (or simultaneously) without changing the principles of the present disclosure.

[0101] Furthermore, while each embodiment is described above as having certain features, any one or more of those features described with respect to any embodiment of the present disclosure may be implemented in and / or combined with features of any other embodiment, even if the combination is not explicitly described. In other words, the described embodiments are not mutually exclusive, and substitution of one or more embodiments for one another remains within the scope of the present disclosure.

[0102] Various terms are used to describe spatial and functional relationships between elements (e.g., between modules, between circuit elements, between semiconductor layers, etc.), including "connected," "engaged," "coupled," "adjacent," "next to," "on top of," "above," "below," and "disposed." Unless the relationship between a first and a second element is explicitly described as "direct," when such a relationship is described in the above disclosure, the relationship can be a direct relationship, in which there are no other intervening elements between the first and second elements, but can also be an indirect relationship, in which there are one or more intervening elements (spatially or functionally) between the first and second elements.

[0103] As used herein, the phrase “at least one of A, B, and C” should be construed to mean a logical (A or B or C), using a non-exclusive logical OR, and should not be construed to mean “at least one of A, at least one of B, and at least one of C.”

[0104] In some implementations, the controller is part of a system, which can be part of the examples described above. Such a system can include semiconductor processing equipment, which includes one or more processing tools, one or more chambers, one or more platforms for processing, and / or specific processing components (wafer pedestals, gas flow systems, etc.). These systems can be integrated with electronics for controlling their operation before, during, and after processing of semiconductor wafers or substrates.

[0105] The electronic device may be referred to as a "controller," which may control various components or subcomponents of one or more systems. Depending on the processing requirements and / or the type of system, the controller may be programmed to control any of the processes disclosed herein, including the delivery of process gases, temperature settings (e.g., heating and / or cooling), pressure settings, vacuum settings, power settings, radio frequency (RF) generator settings, RF matching circuit settings, frequency settings, flow rate settings, fluid delivery settings, position and operation settings, wafer transfer into and out of tools and other transfer tools, and / or load locks connected to or interfaced with a particular system.

[0106] In general terms, a controller can be defined as an electronic device having various integrated circuits, logic, memory, and / or software that receive instructions, issue instructions, control operations, enable cleaning operations, enable endpoint measurements, etc. The integrated circuits can include chips in the form of firmware that store program instructions, digital signal processors (DSPs), chips defined as application specific integrated circuits (ASICs), and / or one or more microprocessors or microcontrollers that execute program instructions (e.g., software).

[0107] Program instructions may be instructions sent to a controller in the form of various individual settings (or program files) that define operating parameters for performing a particular process on or for a semiconductor wafer or system. In some embodiments, the operating parameters may be part of a recipe defined by a process engineer to accomplish one or more processing steps during the fabrication of one or more layers, materials, metals, oxides, silicon, silicon dioxide, surfaces, circuits, and / or dies of a wafer.

[0108] In some implementations, the controller can be part of or coupled to a computer that is integrated with the system, coupled to the system, otherwise networked to the system, or a combination thereof. For example, the controller can be in the "cloud" or all or part of a wafer fab host system that can allow remote access to wafer processing. The computer can enable remote access to the system to monitor the current progress of manufacturing operations, review the history of past manufacturing operations, review trends or performance metrics for multiple manufacturing operations, change parameters of a current process, set processing steps to follow a current process, or start a new process.

[0109] In some examples, a remote computer (e.g., a server) can provide process recipes to the system via a network (which can include a local network or the Internet). The remote computer can include a user interface that enables the input or programming of parameters and / or settings, which are then sent from the remote computer to the system. In some examples, the controller receives instructions in the form of data that specify parameters for each process step to be performed during one or more operations. It should be understood that the parameters can be specific to the type of process to be performed and the type of tool with which the controller is configured to interface or control the tool.

[0110] Thus, as described above, the controller can be distributed, for example, by including one or more discrete controllers networked together and working toward a common purpose (e.g., process and control as described herein). An example of a distributed controller for such a purpose is one or more integrated circuits on a chamber communicating with one or more integrated circuits remotely (e.g., at a platform level or as part of a remote computer), which combine to control the process on the chamber.

[0111] Example systems may include, but are not limited to, plasma etch chambers or modules, deposition chambers or modules, spin rinse chambers or modules, metal plating chambers or modules, cleaning chambers or modules, bevel edge etch chambers or modules, physical vapor deposition (PVD) chambers or modules, chemical vapor deposition (CVD) chambers or modules, atomic layer deposition (ALD) chambers or modules, atomic layer etch (ALE) chambers or modules, ion implantation chambers or modules, track chambers or modules, and any other semiconductor processing system that may be associated with or used in the manufacture and / or preparation of semiconductor wafers.

[0112] As described above, depending on one or more processing steps to be performed by the tool, the controller can communicate with one or more other tool circuits or modules, other tool components, cluster tools, other tool interfaces, adjacent tools, neighboring tools, tools located throughout the factory, a host computer, another controller, or tools used in the material transport of wafer containers to and from tool locations and / or load ports in a semiconductor manufacturing facility.

Claims

1. An apparatus for a substrate processing system, comprising: an annular member arranged along a first plane; N first members extending from a circumference of the annular member perpendicular to the first plane, wherein N is an integer greater than 2, wherein a first portion of each of the N first members extends above the first plane, and wherein a second portion of each of the N first members extends below the first plane; N second members extending radially outward from the second portions of the N first members along a second plane parallel to the first plane, wherein each of the N second members is located between a different pair of the N first members; as well as N pins extending downwardly from the N second members perpendicular to the second plane, the N pins having tapered end points, The N pins are equidistant from the center of the annular member and include threads that can engage with the thread grooves in the N second members. 2 . The device according to claim 1 , wherein the annular member, the N first members, and the N second members constitute a single structure. 3 . The device according to claim 1 , wherein the annular member, the N first members, and the N second members are made of metal. 4 . The device according to claim 1 , further comprising N third members respectively extending downward from the N second members perpendicular to the second plane, the N third members having equal lengths and made of non-abrasive material.

5. The device according to claim 4, wherein: The N pins have equal length; The N pins are made of non-abrasive material.

6. The device of claim 1, further comprising: N third members arranged in corresponding slots in the N second members, the N third members having equal length and made of non-abrasive material, Each of the N third members is arc-shaped and comprises: a first element fixed to a corresponding one of the N second members parallel to the second plane; a second element extending perpendicularly from the first element below the second plane and below the corresponding one of the N second members; as well as A third element extends perpendicularly from the first element below the second plane and below the corresponding one of the N second members, and extends less than the second element.

7. The device of claim 6, wherein the first, second and third elements comprise a single structure.

8. The device of claim 6, wherein the first element has a longer arc length than the second and third elements.

9. The device of claim 6, wherein distal ends of the third elements of the N third members are located in a plane parallel to the second plane.

10. The apparatus according to claim 6, wherein: The N pins have equal length; The N pins are made of non-abrasive material; The N pins extend downwardly perpendicular to the second plane through corresponding thread grooves in the N second members at the same radial distance from the center of the annular member; as well as wherein each of the N pins comprises: top; Conical bottom; as well as A threaded portion between the top portion and the bottom portion is engageable with the corresponding thread groove.

Images