Lighting device

Abstract

A lighting device according to an embodiment of the present invention includes: a substrate; a plurality of light-emitting diodes arranged on the substrate; a resin layer covering the plurality of light-emitting diodes on the substrate; and a first reflecting member provided on the resin layer, wherein the resin layer includes a first surface facing the plurality of light-emitting diodes, and holes provided between the first surface and the plurality of light-emitting diodes, wherein the holes pass through the resin layer in a direction from the lower surface of the first reflecting member to the substrate, and the holes and the light-emitting diodes can overlap each other in the light-emitting direction of the light-emitting diodes.

Description

Technical Field

[0001] One embodiment of the present invention relates to an illumination module having a plurality of light-emitting devices. Embodiments of the present invention relate to an illumination module providing a linear surface light source, an illumination device having the illumination module, a lamp unit, a liquid crystal display device, and a vehicle lamp. Background Art

[0002] Illumination applications include vehicle lamps and backlights for displays and signs. Compared with conventional light sources such as fluorescent lamps and incandescent lamps, light-emitting diodes (LEDs) have advantages such as low power consumption, semi-permanent life, fast response speed, safety, and environmental friendliness. These light-emitting devices are applied to various illumination devices such as various display devices, indoor lamps, or outdoor lamps. Recently, lamps using LEDs have been proposed as light sources for vehicles. Compared with incandescent lamps, the advantage of LEDs is that they consume less power. However, since the emission angle of the light emitted from an LED is small, when using an LED as a vehicle lamp, it is necessary to increase the light-emitting area of the lamp using the LED. Since the size of an LED is small, the degree of freedom in designing the lamp can be increased, and it is relatively economical due to its semi-permanent life. Summary of the Invention

[0003] Technical Problem

[0004] Embodiments of the present invention provide an illumination module or an illumination device for emitting light emitted from a plurality of light-emitting devices in a line form. One embodiment of the present invention provides an illumination module or an illumination device having an exit surface having a line width in one direction of a plurality of light-emitting devices. One embodiment of the present invention provides an illumination module or an illumination device having a transparent exit surface having a line width surrounding a plurality of light-emitting devices. Embodiments of the present invention provide an illumination module or an illumination device in which a resin layer having one or more holes is disposed along a plurality of light-emitting devices. One embodiment of the present invention provides an illumination module or an illumination device having a resin layer in which holes are arranged in one or two rows along a plurality of light-emitting devices. One embodiment of the present invention provides an illumination module or an illumination device in which a reflection member is provided on upper and lower surfaces of a resin layer provided with a plurality of light-emitting devices. Embodiments of the present invention can provide an illumination module for irradiating side light or surface light in a line form, and an illumination device, an illumination unit, a liquid crystal display device, and a vehicle lamp having the illumination module.

[0005] Technical Solution

[0006] The lighting device according to an embodiment of the present invention includes: a substrate; a plurality of light-emitting devices disposed on the substrate; a resin layer disposed on the substrate; and a first reflecting member disposed on the resin layer, wherein the resin layer includes a first surface facing the emission surfaces of the plurality of light-emitting devices, and holes disposed between the first surface and the plurality of light-emitting devices, wherein the holes penetrate the resin layer in the direction of the substrate from the lower surface of the first reflecting member, and the holes and the light-emitting devices may overlap in the light-emitting direction of the light-emitting devices. According to an embodiment of the present invention, the holes may include a plurality of holes that face each of the plurality of light-emitting devices and are spaced apart from each other. Each of the plurality of holes may face the emission surfaces of the plurality of light-emitting devices and may have an area larger than the area of the emission surfaces. The length of the holes may be longer than the length connecting the two ends of the plurality of light-emitting devices.

[0007] According to an embodiment of the present invention, the holes may be arranged closer to the light-emitting devices than the first surface of the resin layer. The holes may be arranged in two rows between the light-emitting devices and the first surface of the resin layer, and at least one of the holes in the two rows may be arranged in plurality. An embodiment of the present invention may include a second reflecting member between the substrate and the resin layer, and the holes may be disposed between the first reflecting member and the second reflecting member. The height of the holes may be in the range of 50% to 100% of the thickness of the resin layer. The holes include a first surface portion facing the emission surfaces of the light-emitting devices and second surface portions and third surface portions that gradually narrow from both ends of the first surface portion toward the first surface of the resin layer, wherein the inner angle formed by the second surface portion and the third surface portion may be in the range of 60 degrees to 120 degrees. According to an embodiment of the present invention, the imaginary line connecting the plurality of light-emitting devices may include a straight line, an oblique line, or a curve, and the imaginary line connecting the plurality of holes may be a straight line, an oblique line, or a curve. The holes may include strips parallel to the first surface.

[0008] Advantageous Effects

[0009] According to an embodiment of the present invention, the luminous intensity of the light source can be increased and a linear surface light source can be provided by a plurality of point light sources. In addition, the manufacturing process of the lighting module can be reduced. According to an embodiment of the present invention, the light efficiency can be improved by reducing light loss. In addition, since a light-emitting module with a relatively thin thickness is provided in the form of line light, the degree of freedom in design can be increased and the light uniformity of surface light can be improved. According to an embodiment of the present invention, the optical reliability of the lighting module and the lighting device having the lighting module can be improved. In addition, the reliability of a vehicle lighting device having the lighting module can be improved. In addition, it can be applied to a lamp unit having the lighting module, various types of display devices, lighting devices, or vehicle lamps. Description of the Drawings

[0010] Figure 1 is a perspective view showing a lighting module according to a first embodiment of the present invention.

[0011] Figure 2 is Figure 1 a plan view of the lighting module.

[0012] Figure 3 is a cross-sectional view taken along the A-A side of the lighting module. Figure 2

[0013] Figure 4 is Figure 2 a cross-sectional view taken along the B-B side of the lighting module.

[0014] Figure 5 is Figure 2 a front view of the lighting module.

[0015] Figure 6 is Figure 2 an exploded perspective view of the lighting module.

[0016] Figure 7 is Figure 2 a partially enlarged view of the lighting module.

[0017] Figures 8 to 12 is Figure 2 a modified example of the hole of the lighting module.

[0018] Figure 13 is Figure 2 another example of the hole of the lighting module.

[0019] Figure 14 is an example of a plan view of a lighting module according to a second embodiment of the present invention.

[0020] Figure 15 is for explaining Figure 14 a partially enlarged view of the hole of the lighting module.

[0021] Figures 16 to 19 is Figure 14 a modified example of the hole of the lighting module.

[0022] Figure 20 From (A) to Figure 20 to (D) of Figure 2 are examples of changes in the emission side angle of the hole in the lighting module.

[0023] Figure 21 is a modified example of the lighting module according to the first embodiment or the second embodiment of the present invention.

[0024] Figure 22 is an example of providing a reflection portion at the rear side of the lighting module according to an embodiment of the present invention.​

[0025] Figure 23 of (A) to Figure 23 (C) is an example of a manufacturing process of a lighting module according to an embodiment of the present invention.

[0026] Figure 24 is a view showing the luminous intensity of a lighting module according to a first embodiment of the present invention.

[0027] Figure 25 is a view showing the luminous intensity of a lighting module according to a second embodiment of the present invention.

[0028] Figure 26 is a comparison according to Figure 20 of the luminous intensity of the emission angle of the holes of the lighting module.

[0029] Figure 27 is an example of a front view of a light-emitting device applied to a lighting module according to an embodiment of the present invention.

[0030] Figure 28 is Figure 27 an example of a module in which the light-emitting device is disposed on a circuit board.

[0031] Figure 29 is an example of a lamp to which a lighting module according to an embodiment of the present invention is applied.

[0032] Figure 30 is a plan view of a vehicle to which a lamp having a lighting device or a lighting module according to an embodiment of the present invention is applied.

[0033] Figure 31 is a view showing a lamp having Figure 30 a lighting module or a lighting device. Detailed Description

[0034] Hereinafter, preferred embodiments that can be easily implemented by those of ordinary skill in the art will be described in detail with reference to the accompanying drawings. However, it should be understood that the embodiments described in the specification and the configurations shown in the drawings are only preferred embodiments of the present invention, and there are various equivalents and modifications that can replace the embodiments and configurations at the time of filing this application. When describing the operating principle of the preferred embodiments of the present invention in detail, the detailed description of known functions or configurations will be omitted when it is considered that the detailed description unnecessarily obscures the gist of the present disclosure. The terms described later are defined in consideration of the functions of the present invention, and the meaning of each term should be interpreted based on the content of the entire specification. Throughout the drawings, the same reference numerals are used for components having similar functions and operations. The lighting device according to the present invention can be applied to various lamp devices that require lighting, such as vehicle lamps, household lighting devices, and industrial lighting devices. For example, when the lighting device is applied to a vehicle lamp, it can be applied to a headlamp, a side marker lamp, a rearview mirror lamp, a fog lamp, a taillight, a brake lamp, a daytime running lamp, an interior lighting, a door scar, a rear combination lamp, a reverse lamp, etc. The lighting device of the present invention can be applied to indoor and outdoor advertising devices, display devices, and various electric vehicle fields. In addition, it can be applied to all lighting-related fields or advertising-related fields that are currently developed and commercialized or may be realized according to future technological developments. Hereinafter, the embodiments will become apparent through the description of the drawings and the embodiments. In the description of the embodiments, each layer (film), region, pattern, or structure is formed "on" or "under" a substrate, each layer (film), region, pad, or pattern. In the described case, "on" and "under" include both "directly" formed or "indirectly" formed through another layer. In addition, the reference for the top or bottom of each layer will be described based on the drawings.

[0035] <Lighting module>

[0036] As Figures 1 to 7 shown, the lighting module 200 according to an embodiment of the present invention is a device that includes a plurality of light-emitting devices 100 and emits the light emitted from the light-emitting devices 100 as linear surface light. The lighting module 200 may have a side surface, an exit surface, or a transparent surface having a line width surrounding the plurality of light-emitting devices 100. The lighting module 200 may be provided with a transparent surface or an exit surface having a predetermined width on one surface of the plurality of light-emitting devices 100. The lighting module 200 may include a first surface S1 facing one surface of the light-emitting device 100, a second surface S2 opposite to the first surface S1, and third surfaces S3 and fourth surfaces S4 extending in a second direction from both ends of the first surface S1 and the second surface S2. The first surface S1 and the second surface S2 may face each other. At least a part of the third surface S3 and the fourth surface S4 may face each other. As another example, as Figure 21As shown, the third surface S3 and the fourth surface S4 may not face each other. The minimum distance between the first surface S1 and the second surface S2 may be less than the minimum distance between the third surface S3 and the fourth surface S4.

[0037] The first surface S1 and the second surface S2 may have a longer length in one direction or the first direction X. One direction or the first direction X may be a straight line or may include a curve, such as Figure 21 as shown. The third surface S3 and the fourth surface S4 may be perpendicular to the first direction X, or may be perpendicular to the first surface S1 or the second surface S2. The first surface S1 may face the emission surface 111 of the light-emitting device 100, or may be a surface exposed from the first ends of the third surface S3 and the fourth surface S4 in the second direction. The second surface S2 may be a surface facing the non-emission surface of the plurality of light-emitting devices 100 or a surface exposed from the second ends of the third surface S3 and the fourth surface S4 in the second direction. The third surface S3 and the fourth surface S4 may be different from the first surface S1 and the second surface S2.

[0038] In the lighting module 200, the plurality of light-emitting devices 100 may be arranged in the first direction or in the region between the first surface S1 and the second surface S2. The plurality of light-emitting devices 100 may be arranged in a row. The imaginary line connecting the light-emitting devices 100 arranged in a row may be a straight line or may include a curve with curvature. As another example, the plurality of light-emitting devices may be arranged in two rows, and the light-emitting devices in the second row are arranged between the first surface S1 and the second surface S2 in the column direction (e.g., the Y direction). They may be arranged so as not to overlap each other. The plurality of light-emitting devices 100 arranged in the first direction X may respectively face the first surface S1 or the emission surface. Each of the emission surfaces 111 of the plurality of light-emitting devices 100 may face the first surface S1. The light emitted from the light-emitting device 100 may be emitted through the first surface S1, and a part of the light may be emitted through at least one of the second surface S2, the third surface S3, and the fourth surface S4.

[0039] As Figures 2 to 5 shown, the length X1 of the lighting module 200 in the first direction X may be longer than the width Y1 in the second direction Y. The length X1 in the first direction may vary according to the number of the arranged light-emitting devices 100, and may be, for example, 30 mm or more. The width Y1 in the second direction may be 13 mm or more or 16 mm or more. The width Y1 of the lighting module 200 in the second direction Y may provide a region for diffusing the emitted light of the light-emitting device 100 and a region for protecting the rear part of the light-emitting device 100. As Figure 2As shown, based on the light-emitting device 100, the distance D1 between the light-emitting device 100 and the first surface S1 and the distance D5 between the light-emitting device 100 and the second surface S2 can be different from each other. The distance D5 between the light-emitting device 100 and the second surface S2 can be 2 mm or more, for example, it can be in the range of 2 mm to 20 mm. When the distance D5 between the light-emitting device 100 and the second surface S2 is less than the above range, the area where moisture may penetrate or the circuit pattern may be formed can be reduced, while when it is greater than the above range, the size of the lighting module 200 will increase. In the lighting module 200, the first surface S1, the second surface S2, the third surface S3, and the fourth surface S4 can be set as surfaces perpendicular to the third direction Z. The third direction Z can be a direction orthogonal to the first direction X and the second direction Y. The first surface S1, the second surface S2, the third surface S3, and the fourth surface S4 can have the same thickness or the same height in the third direction Z. The lighting module 200 includes a substrate 210, a resin layer 220 on the substrate 210, and a first reflection member 240 on the resin layer 220. The first to fourth surfaces S1, S2, S3, and S4 can be the side surfaces of the resin layer 220. The resin layer 220 includes the first surface S1, the second surface S2, the third surface S3, and the fourth surface S4. The resin layer 220 can be set to surround the devices provided on the substrate 210, such as one or more light-emitting devices 100. At least three or more of the plurality of light-emitting devices 100 can be arranged in the first direction and can be provided in the resin layer 220. The plurality of light-emitting devices 100 can be provided between the substrate 210 and the first reflection member 240. The resin layer 220 can be made of a light-transmitting material such as silicone resin or epoxy resin. The resin layer 220 can include a glass material as another material.

[0040] The lighting module 200 may include a second reflecting member 230 between the resin layer 220 and the substrate 210. The second reflecting member 230 may not be formed, and a reflecting member may be attached to the upper surface of the substrate 210 to serve as the second reflecting member 230. The substrate 210 includes a printed circuit board (PCB), such as a resin-based printed circuit board (PCB), a metal core PCB, a flexible PCB, and a ceramic PCB, or includes an FR-4 substrate. The substrate 210 may be a flexible or non-flexible substrate. A circuit pattern may be provided on the substrate 210. The circuit pattern of the substrate 210 may include a plurality of pads in a region corresponding to the light-emitting device 100. In the region of the substrate 210, the rear region with respect to the light-emitting device 100 is a region opposite to the light-emitting region, and a circuit pattern for connecting the light-emitting device 100 may be provided. The width of the rear region may vary according to the number of the light-emitting devices 100 or the connection method of the light-emitting devices 100. The width of the rear region is the distance D5 between the light-emitting device 100 and the second surface S2, and may be 2 mm or more. Accordingly, a circuit pattern for connecting a plurality of light-emitting devices 100 and suppressing moisture from penetrating from the rear of the light-emitting device 100 may be formed.

[0041] Multiple light-emitting devices 100 may have joints disposed thereunder and may be electrically connected to pads of a substrate 210. The multiple light-emitting devices 100 may be connected in series through a circuit pattern of the substrate 210. As another example, the multiple light-emitting devices 100 may be connected in parallel through the circuit pattern of the substrate 210, or two or more groups connected in series may be connected in parallel. The light-emitting device 100 may include a device having a light-emitting chip or a package encapsulating an LED chip. The light-emitting chip may emit at least one of blue light, red light, green light, and ultraviolet (UV) light. The light-emitting device 100 may emit at least one of white, blue, red, and green light. The light-emitting device 100 may emit light in a lateral direction, and a bottom thereof may be disposed on the substrate 210. The light-emitting device 100 may be a side-view type. As another example, the light-emitting device 100 may be an LED chip, and one surface of the LED chip may be open and a reflecting member may be disposed on the other surface. An emission surface 111 of the light-emitting device 100 may be disposed on a surface adjacent to the substrate 210, for example, on a side adjacent to an upper surface of the substrate 210. The emission surface 111 is disposed on a side surface between a bottom surface and an upper surface of the light-emitting device 100 and emits light in a second direction Y. The emission surface 111 of the light-emitting device 100 may be adjacent to a second reflecting member 230 and may be a surface perpendicular to an upper surface of the substrate 210 and an upper surface of the second reflecting member 230. A thickness of the light-emitting device 100 may be less than a length of the light-emitting device 100 in a first direction X. The thickness of the light-emitting device 100 may be 3 mm or less, for example, 2 mm or less. The thickness of the light-emitting device 100 may be in a range of 1 mm to 2 mm, for example, in a range of 1.2 mm to 1.8 mm. Refer to Figure 4 and Figure 5 , a pitch G1 between the light-emitting devices 100 may be 10 mm or more, for example, 10 mm to 30 mm. Additionally, a distance G2 between an outermost light-emitting device 100 and a third surface S3 or a fourth surface S4 of the resin layer 220 may be less than the pitch G1 and may be 10 mm or less. A length of the light-emitting device 100 in the first direction X ( Figure 7 L1 in) may be greater than a thickness of the light-emitting device 100, for example, 1.5 times or more the thickness of the light-emitting device 100. Since the light-emitting device 100 has a relatively thin thickness and a relatively long length in the first direction X, a light emission angle in the first direction X (a left-right direction with respect to the center of the light-emitting device 100) may be set to be relatively wide. Here, the light emission angle of the light-emitting device 100 in the first direction X may be greater than the light emission angle in a third direction Z (a vertical direction). The light emission angle of the light-emitting device 100 in the second direction Y may be in a range of 110 degrees to 160 degrees. Here, as Figure 3As shown, the thickness Za of the substrate 210 may be less than the thickness of the light-emitting device 100. The thickness of the light-emitting device 100 may be greater than twice the thickness Za of the substrate 210, for example, it may be in the range of 2 to 4 times. Since the thickness Za of the substrate 210 is thin, the lighting module 200 can be provided as a flexible board.

[0042] The resin layer 220 may be disposed on the substrate 210. The second reflective member 230 may be disposed between the resin layer 220 and the substrate 210. The resin layer 220 may cover the light-emitting device 100, and the first reflective member 240 may cover the upper surface of the resin layer 220. The resin layer 220 may be in contact with the upper surface and the side surfaces of the light-emitting device 100. The resin layer 220 may be in contact with the upper surface of the second reflective member 230. A part of the resin layer 220 may be in contact with the substrate 210 through the opening 232 of the second reflective member 230. The resin layer 220 may be in contact with the light-emitting surface of the light-emitting device 100. The first surface S1, the second surface S2, the third surface S3, and the fourth surface S4 of the resin layer 220 are the side surfaces between the first reflective member 240 and the second reflective member 230. The first surface S1, the second surface S2, the third surface S3, and the fourth surface S4 may be the peripheral surface of the light-emitting device 100 or the surface corresponding to the side surface of the light-emitting device 100. The upper surface area of the resin layer 220 may be the same as the upper surface area of the substrate 210, the upper surface area of the second reflective member 230, or the upper surface area of the first reflective member 240. The length of the resin layer 220 in the first direction may be the same as the length of the substrate 210, the length of the second reflective member 230, or the length of the first reflective member 240. The maximum width Y1 of the resin layer 220 in the second direction may be the same as the maximum width of the substrate 210, the maximum width of the second reflective member 230, or the maximum width of the first reflective member 240. The resin layer 220 may be disposed between the first reflective member 240 and the second reflective member 230. The upper surface of the second reflective member 230 and the lower surface of the first reflective member 240 may be arranged to face each other on the lower surface and the upper surface of the resin layer 220. The upper surface of the first reflective member 230 and the lower surface member 230 of the second reflective member 240 may have the same area. Therefore, the resin layer 220 may diffuse the light emitted from the light-emitting device 100 and the light reflected by the first reflective member 240 and the second reflective member 230 to guide them in the lateral direction. The resin layer 220 may be formed to have a thickness Zb thicker than the thickness of the light-emitting device 100. Therefore, the resin layer 220 may protect the upper part of the light-emitting device 100 and prevent moisture penetration. Since the substrate 210 is disposed on the lower part of the light-emitting device 100 and the resin layer 220 is disposed on the upper part of the light-emitting device 100, the light-emitting device 100 can be protected. Therefore, the interval between the upper surface of the resin layer 220 and the light-emitting device 100 may be 0.6 mm or less, for example, in the range of 0.5 mm to 0.6 mm. The upper part of the resin layer 220 may be arranged to have the same thickness as the gap to protect the upper part of the light-emitting device 100.The thickness Zb of the resin layer 220 is the distance between the first reflecting member 240 and the second reflecting member 230, and the distance (e.g., Zb) between the first reflecting member 240 and the second reflecting member 230 can be less than the distance between the first surface S1 and the second surface S2. For example, the distance between the first surface S1 and the second surface S2 can include a maximum distance or a minimum distance. The distance or interval between the second reflecting member 230 and the first reflecting member 240 can be less than the distance or interval between the first surface S1 and the second surface S2 of the resin layer 220. By setting the distance between the first reflecting member 240 and the second reflecting member 230 to be less than the width Y1 or the minimum width of the lighting module 200 in the second direction, linear surface light is provided, the luminous intensity is increased, and hot spots can be prevented. In addition, a lighting module flexible in the third direction can be provided. The thickness Zb of the resin layer 220 can be less than or equal to twice the thickness of the light-emitting device 100, for example, greater than 1 time and up to 2 times or less. The thickness Zb of the resin layer 220 can be, for example, in the range of 1.5 mm to 1.9 mm or in the range of 1.6 mm to 1.8 mm. The thickness Zb of the resin layer 220 can be 0.8 times or less of the thickness Z1 of the lighting module 200, for example, in the range of 0.4 times to 0.8 times the thickness Z1 of the lighting module 200. Since the difference between the thickness of the resin layer 220 and the thickness Z1 of the lighting module 200 is 1.2 mm or less, a decrease in light efficiency in the lighting module 200 can be prevented and the extension characteristics can be enhanced. The resin layer 220 can include a resin material such as silicone resin, silicone resin molding compound (SMC), epoxy resin, or epoxy resin molding compound (EMC). The resin layer 220 can include a UV (ultraviolet) curable resin or a thermosetting resin material. For example, PC, OPS, PMMA, PVC, etc. can be selectively included. The resin layer 220 can include a phosphor. The phosphor can include at least one of a yellow phosphor, a green phosphor, a blue phosphor, and a red phosphor. A light extraction structure such as a concavo-convex structure can be provided on the first surface S1 of the resin layer 220, but the present invention is not limited thereto. On the first surface S1, a first region horizontally overlapping the light-emitting device 100 and a second region horizontally overlapping the region between the light-emitting devices can be provided on the same plane. As another example, the second region can be recessed more in the direction of the second surface than the first region, or the first region can protrude more than the second region.

[0043] The second reflecting member 230 can reflect the light emitted from the light-emitting device 100. The second reflecting member 230 can be formed on the upper surface of the substrate 210. The second reflecting member 230 can be formed as an upper layer of the substrate 210 or as a separate layer. The second reflecting member 230 can be attached to the upper surface of the substrate 210 by an adhesive. The resin layer 220 can be attached to the upper surface of the second reflecting member 230. The second reflecting member 230 has a plurality of openings 232 in a region corresponding to the lower surface of the light-emitting device 100, and the light-emitting device 100 can be connected to the substrate 210 through the openings 232. A part of the resin layer 220 can be in contact with the substrate 210 through the openings 232. The openings 232 can be regions where the light-emitting device 100 can be joined to the substrate 210. The second reflecting member 230 can be formed as a single-layer or multi-layer structure. The second reflecting member 230 can include a material that reflects light, such as a metal or non-metal material. When the second reflecting member 230 is a metal, it can include a metal layer such as stainless steel, aluminum (Al), or silver (Ag), and in the case of a non-metal material, it can include a white resin material or a plastic material. The second reflecting member 230 can include a white resin material or a polyester (PET) material. The second reflecting member 230 can include at least one of a low-reflection film, a high-reflection film, a diffused reflection film, and a regular reflection film. The second reflecting member 230 can be provided as, for example, a regular reflection film for reflecting incident light to the first surface S1.

[0044] One end of the second reflecting member 230 can be disposed on the same plane as the first surface S1. The other end of the second reflecting member 230 can be disposed on the same plane as the second surface S2. As another example, one end and the other end of the second reflecting member 230 can be spaced apart from the first surface S1 and the second surface S2 and can be in contact with the resin layer 220. That is, the outer side of the second reflecting member 230 can be covered with the resin layer 220 to prevent moisture penetration. The thickness Zc of the second reflecting member 230 can be less than the thickness Za of the substrate 210. The thickness Zc of the second reflecting member 230 can be 0.5 times or more of the thickness Za of the substrate 210 to reduce the transmission loss of incident light. The thickness Zc of the second reflecting member 230 can be in the range of 0.2 mm to 0.4 mm. When it is less than the above range, light transmission loss may occur, and when it is greater than the above range, the thickness Z1 of the lighting module 200 may increase.

[0045] The first reflection member 240 may be disposed on the resin layer 220. The first reflection member 240 may be attached to the upper surface of the resin layer 220. The first reflection member 240 may be disposed on the entire upper surface of the resin layer 220 to reduce light loss. The first reflection member 240 may be made of the same material as the second reflection member 230. In order to reflect light and reduce the light transmission loss, the first reflection member 240 may be made of a material having a higher light reflectivity than that of the second reflection member 230 or may have a thicker thickness. The first reflection member 240 may have the same or thicker thickness as the second reflection member 230. For example, the first reflection member 240 and the second reflection member 230 may be provided with the same material and the same thickness. The first reflection member 230 may be spaced apart from the edge of the substrate 210, and a part of the resin layer 220 may be in contact with the upper surface on the edge side of the substrate 210. When the resin layer 220 is in contact with the edge of the substrate 210, moisture penetration can be suppressed. The thickness Zd of the first reflection member 240 may be less than the thickness Za of the substrate 210. The thickness Zd of the first reflection member 240 is set to be more than 0.5 times the thickness Za of the substrate 210, thereby reducing the transmission loss of incident light. The thickness Zd of the first reflection member 240 may be in the range of 0.2 mm to 0.4 mm. When it is less than this range, light transmission loss may occur, and when it is greater than the above range, the thickness Z1 of the lighting module 200 may increase. The first reflection member 240 may be formed as a single-layer or multi-layer structure. The first reflection member 240 may include a material that reflects light, such as a metal or non-metal material. When the first reflection member 240 is a metal, it may include a metal layer such as stainless steel, aluminum (Al), or silver (Ag), and in the case of a non-metal material, it may include a white resin material or a plastic material. The first reflection member 240 may include a white resin material or a polyester (PET) material. The first reflection member 240 may include at least one of a low reflection film, a high reflection film, a diffused reflection film, and a regular reflection film. The first reflection member 240 may be provided as a regular reflection film such that, for example, incident light propagates in the direction of the first surface S1.

[0046] The exit surface of the resin layer 220 may be processed to be matte so that light can be diffused. The matte surface may be processed to be a rougher surface than the inner surface of the resin layer 220 to diffuse the emitted light.

[0047] The lighting module 200 according to an embodiment of the present invention may provide a thickness Z1 in the third direction in the form of a line to provide a surface light source in the form of a ductile line. The thickness Z1 of the lighting module 200 may be 3 mm or less. That is, the lighting module 200 may be provided as a linear surface light source of 3 mm or less. As another example, the lighting module 200 may be greater than 3 mm and may be arranged to be 6 mm or less. In this case, the thickness of the lighting module 200 increases, but the thickness of the resin layer 220 increases to increase the line width and the light distribution area. Refer to Figure 3 , observing the thicknesses of the respective components in the lighting module 200, the thickness of the substrate 210 is Za, the thickness of the resin layer 220 is Zb, the thickness of the second reflecting member 230 is Zc, and the thickness of the first reflecting member 240 is Zd. There may be a relationship of Zb > Za > Zd ≥ Zc. The interval between the lower surface of the substrate 210 and the upper surface of the first reflecting member 240 is the thickness Z1 of the lighting module 200. The ratio of the thickness Zb to Z1 may be 0.4 to 0.8, the ratio of the thickness Za to Z1 may be 0.14 to 0.18, and the ratio of the thickness Zd or Zc to Z1 may be 0.08 to 0.12. The ratio of Zb to Za may be 3.5 to 4. The ratio of Zb to Zc or Zd may be 5.8 to 6.4. By setting the thickness Zb of the resin layer 220 to be thicker than the thickness Za of the substrate 210, the light-emitting device 100 can be protected and the light can be diffused to guide it, and the ductility can be enhanced. In addition, since a linear light-emitting surface having the thickness Zb or height of the resin layer 220 is provided, a linear light-emitting surface can be provided.

[0048] Refer to Figure 2 and Figure 7, in the first embodiment of the present invention, the resin layer 220 includes holes R0 therein. The holes R0 may penetrate the resin layer 220 from the upper surface of the resin layer 220 toward the substrate 210, or may be recessed through the resin layer 220. One or more holes R0 may be provided. The holes R0 may be provided between each light-emitting device 100 and the first surface S1. At least a part of the holes R0 may horizontally overlap with the emission surface 111 of the light-emitting device 100. The holes R0 may diffuse the light emitted from the light-emitting device 100. The refractive index of the material filling the holes R0 may be different from the refractive index of the resin layer 220. The refractive index of the material filling the holes R0 may be lower than the refractive index of the material of the resin layer 220. A gas may be provided in the holes R0, and the gas may include, for example, air, or at least one of oxygen, nitrogen, hydrogen, argon, and carbon dioxide gas. The holes R0 may be in a vacuum state. As another example, the holes R0 may be filled with a material having a refractive index higher than the refractive index of the resin layer 220. The material having a high refractive index may include metal oxides or metal nitrides. The holes R0 and each light-emitting device 100 may overlap in the direction from the first surface S1 toward the light-emitting device 100. The area of each hole R0 may be larger than the area of each emission surface of the light-emitting device 100. That is, holes R0 having an area larger than the front area of each light-emitting device 100 may be provided in front of each light-emitting device 100. The maximum length B1 of the holes R0 in the first direction X may be larger than the length L1 of each light-emitting device 100 in the first direction. The maximum length B1 of the holes R0 in the first direction may be larger than the length of the emission surface 111 of each light-emitting device 100 in the first direction. Therefore, the holes R0 may cover the emission-side region of the light-emitting device 100 in the first direction and may diffuse the incident light having a predetermined angular distribution. The length B1 may be more than 1 mm larger than the length L1 of the light-emitting device 100, or may be 115% or more of the length L1. The maximum width B2 of the holes R0 in the second direction may be equal to or larger than the width L2 of the light-emitting device 100. The maximum width B2 of the holes R0 in the second direction may be 1 mm or more, for example, 1 mm to 4 mm. When the maximum width B2 of the holes R0 in the second direction is less than the above range, processing is difficult, while when it is greater than the above range, the improvement rate of light uniformity may not be significant. The holes R0 may be provided in a region of 5% or more, for example, 5% to 60% of the distance D1 between the light-emitting device 100 and the first surface S1.

[0049] The minimum distance D2 between the first surface S1 of the resin layer 220 and the hole R0 can be less than the minimum distance D1 between the light-emitting device 100 and the first surface S1 of the resin layer 220. The minimum distance D2 between the first surface S1 of the resin layer 220 and the hole R0 can be equal to or greater than the minimum distance D3 between the hole R0 and the light-emitting device 100. That is to say, the hole R0 can be arranged to be closer to the light-emitting device 100 than the first surface S1 of the resin layer 220. The minimum distance D1 between the light-emitting device 100 and the first surface S1 of the resin layer 220 can be 4 mm or more, for example, between 4 mm and 10 mm, or between 4 mm and 20 mm. Since the minimum distance D2 is set within the range of 10% to 60% of the distance D1, the incident light can be refracted by the hole R0 and then diffused. The minimum distance D3 between the hole R0 and the light-emitting device 100 can be 2 mm or more, for example, between 2 mm and 4 mm. When the minimum distance D3 is less than the above range, the distribution of the beam angle of the light-emitting device 100 may be affected, and the light extraction efficiency may be reduced. Considering the error between the mounting process of the light-emitting device 100 and the fixing pin (see Figure 23 of 291) inserted when forming the hole R0, the minimum distance D3 can be the minimum distance. The distance G4 between the light-emitting devices 100 can be 5 mm or more, for example, between 5 mm and 18 mm. When the distance G4 is too narrow, the number of the light-emitting devices 100 may increase, and when the distance G4 is too wide, a dark portion may be generated between the light-emitting devices 100. The distance G4 can vary according to the distribution of the orientation angles of the light-emitting devices 100. The holes R0 can be arranged in one-to-one correspondence with the light-emitting devices 100, thereby reducing the hot spots on the central region of the light-emitting devices 100. When a plurality of holes R0 are provided, the distance G3 between the holes R0 can be less than the distance G4 between the light-emitting devices 100. The distance G3 can be 100% or more of the distance G4, for example, within the range of 100% to 200%. When the distance G3 is less than the distance G4, the difference in the luminous intensity between the region passing through the hole R0 and its periphery may increase. Here, the adjacent holes R0 can be connected to each other.

[0050] As Figure 3As shown, the height of the hole R0 is the same as the thickness Zb of the resin layer 220, or within the range of 50% to 100% or 80% to 100% of the thickness Zb of the resin layer 220. The lower surface of the first reflective member 240 may be disposed on the upper surface of the hole R0. On the lower surface of the hole R0, the upper surface of the second reflective member 230 may be disposed, the upper surface of the substrate 210 may be disposed, or a part of the resin layer 220 may be disposed. The hole R0 may be formed by providing fixing pins in the resin layer 220 and removing the fixing pins after the resin layer 220 is cured. Here, when the fixing pins are first provided during the formation of the hole R0 and then the resin layer 220 is dispensed and cured, the resin may not be provided at the bottom of the fixing pins. As another example, when the resin layer 220 is dispensed and the fixing pins are inserted before curing, a part of the resin may be present at the bottom of the fixing pins. Therefore, the height of the hole R0 may be equal to the thickness Zb of the resin layer 220 or within the range of 50% to 100% or 80% to 100% of the thickness Zb of the resin layer 200. The top view shape of the hole R0 may include a polygonal shape or a shape having a curved surface. The polygon may be a triangle, a quadrilateral, a pentagon, or a shape with more sides. The hole R0 may include a first surface portion Ra facing the light-emitting device 100, and a second surface portion Rb and a third surface portion Rc facing the first surface S1. The first surface portion Ra may be an area where light is incident. The second surface portion Rb and the third surface portion Rc may be surfaces for emitting light that travels through the first surface portion Ra or another surface portion.

[0051] The first surface portion Ra may have the height of the hole R0 and the maximum length of the hole R0 in the first direction X. The second surface portion Rb and the third surface portion Rc may be provided to be inclined from both ends of the first surface portion Ra. The distance between the second surface portion Rb and the third surface portion Rc may be the largest in the first surface portion Ra and the smallest at the point closest to the first surface S1. The second surface portion Rb and the third surface portion Rc may provide vertices at the intersection thereof. The interior angle C1 of the vertex Rp may be 120 degrees or less, for example, within the range of 60 degrees to 120 degrees. That is, the interior angle C1 of the vertex Rp is the angle between the second surface portion Rb and the third surface portion Rc or the interior angle of the emission region, and may be 60 degrees or more or within the range of 60 degrees to 120 degrees. Here, Figure 20 (A) of is a case where the interior angle C1 of the emission region of the hole R0 is 60 degrees, Figure 20 (B) of is a case where it is 90 degrees, Figure 20 (C) of is a case where it is 120 degrees, and Figure 20 (D) of may be set to 150 degrees. Here, when the interior angle C1 of the emission region of the hole R0 changes, the position and length of the first surface portion Ra are fixed and measured. A luminance map according to the interior angle of the hole R0 may be provided, asFigure 26 As shown. As shown in Table 1, when the inner angle C1 is from 60 degrees to 120 degrees, the light uniformity can be 84% or more, and when the inner angle C1 is 150 degrees, the light uniformity is about 80%.

[0052] [Table 1]

[0053] Interior angle (degrees) 60 90 120 150 Uniformity (%) 85.4％ 85.1％ 84.8％ 79.7％ Luminance (nit) 6477 6720 6881 7015

[0054] Therefore, by selecting the inner angle C1 of the emission region of the hole R0 within the range of 60 degrees to 120 degrees, the uniformity of the light emitted through the second surface portion Rb and the third surface portion Rc of the hole R0 can be improved. In the first embodiment, the resin layer 220 is adjacent to the first surface S1 and has a plurality of holes R0 arranged along the first surface S1, and each of the plurality of holes R0 can be respectively provided between each light-emitting device 100 and the first surface S1. Therefore, since the light emitted through the light-emitting device 100 is diffused by the hole R0, the uniformity of the light emitted through the first surface S1 can be improved. In addition, hot spots can be eliminated. In addition, in order to improve the light uniformity on the first surface S1, a convex lens may not be formed. In addition, since the distance between the first surface S1 and the light-emitting device 100 can be reduced, an increase in the module width can be suppressed. Figures 8 to 12 is an example in which the hole of the lighting module according to the first embodiment is modified. For ease of description, the configuration of the first embodiment will be selectively included, and the modified hole will be described. Refer to Figure 8 , the hole R0 may include a first surface portion Ra, a second surface portion Rb, and a third surface portion Rc, and a fourth surface portion Rd facing the first surface portion Ra. The fourth surface portion Rd may be connected between the second surface portion Rb and the third surface portion Rc, and may have a length B3 smaller than the length B1 of the first surface portion Ra. The fourth surface portion Rd may have a shape with the vertex removed Figure 7 . The fourth surface portion Rd can minimize the transmission of the light incident through the first surface portion Ra. A raised pattern may be formed on the first surface S1 facing the fourth surface portion Rd, but the present invention is not limited thereto. Refer to Figure 9 , the hole R0 includes a first surface portion Ra, a second surface portion Rb, and a third surface portion Rc, and the second surface portion Rb and the third surface portion Rc may include a concavo-convex pattern Rr1. The concavo-convex pattern Rr1 may be set in a triangular prism shape and can diffuse the incident light. The light incident through the concavo-convex pattern Rr1 can be diffused through various paths, and the light uniformity can be further improved. Refer to Figure 10 , the fourth surface portion Rd of the hole R0 may include a plurality of concavo-convex patterns Rr2. Since the fourth surface portion Rd has a plurality of concavo-convex patterns Rr2, hot spots caused by the light emitted through the fourth surface portion Rd of the hole R0 can be suppressed. Refer toFigure 11 , the hole R0 includes a first surface portion Ra, a second surface portion Rb, and a third surface portion Rc, and may include a recess Re recessed in a direction toward the light-emitting device in a region between the second surface portion Rb and the third surface portion Rc, and the recess Re may face the light-emitting device 100. A first vertex portion Rp1 may be connected between the recess Re and the second surface portion Rb, and a second vertex portion Rp2 may be connected between the recess Re and the third surface portion Rc. The depth B5 of the recess Re may be more than 10% of the width B2 of the hole R0, for example, in the range of 10% to 50%. The low point of the recess Re may be set closer to the first surface portion Ra than the first vertex portion Rp1 and the second vertex portion Rp2. The center of the recess Re may be set in the same region as the center of the light-emitting device 100. The recess Re adjusts the diffusion degree of incident light according to the depth B5, thereby suppressing hot spots at the center of the light-emitting device 100. Refer to Figure 12 , the hole R01 may include a first surface portion Ra1 protruding in the direction of the first surface S1 of the resin layer 220 and a curved second surface portion Rb1 facing the first surface portion Ra1. The interval between the first surface portion Ra1 and the second surface portion Rb1 may be constant or may become wider toward the center of the hole R01. The outer surface Rk1 between the first surface portion Ra1 and the second surface portion Rb1 may be a horizontal surface or an inclined surface. The first surface portion Ra1 may refract incident light, and the second surface portion Rb2 may refract the refracted light again. The hole RO1 may diffuse light incident through the first surface portion Ra1 and the second surface portion Rb1.

[0055] Figure 13 is a modified example of the hole. The hole R02 may include a first hole portion R21 having a longer length in one direction and a second hole portion R22 protruding from the first hole portion R21 in the direction of the first surface S1 of the resin layer 220. The first hole portion R21 may include a first surface portion Ra2 facing a plurality of light-emitting devices 100, and a second surface portion Rb2 opposite to the first surface portion Ra2 may be an exit surface. The second hole portion R22 includes an exit surface portion Rc having a third inclined surface portion Rc1 and a fourth inclined surface portion Rc2, and the third surface portion Rc1 and the fourth surface portion Rc2 may horizontally overlap each of the light-emitting devices 100. The third surface portion Rc1 and the fourth surface portion Rc2 form vertices in a region adjacent to the first surface S1, and the inner angle of the vertices may be 120 degrees or less, for example, 60 to 120 degrees. The second hole portion R22 may guide incident light and propagate it laterally.

[0056] Figures 14 to 19This is an example of a plan view showing the holes of the lighting module according to the second embodiment. The configuration of the lighting module can be selectively applied to the configuration of the first embodiment, and the changed parts will be described.

[0057] Reference Figure 14 and 15 , the resin layer 220 includes a plurality of holes R1 therein, and the plurality of holes R1 can respectively correspond to the light-emitting devices 100. The plurality of holes R1 can be respectively disposed between the light-emitting devices 100 and the first surface S1 of the resin layer 220. The holes R1 can be strip-shaped or rectangular having an elongated shape in one direction. The length B1 of the holes R1 in the first direction can be longer than the length L1 of the light-emitting devices 100 in the first direction. The plurality of holes R1 can be spaced apart from each other.

[0058] The length B1 of the holes R1 in the first direction can be more than 1 mm longer than the length L1 of the light-emitting devices 100 in the first direction. The width B2 of the holes R1 in the second direction can be 1 mm or more, for example, 1 mm to 3 mm. The distance D3 between the holes R1 and the light-emitting devices 100 can be closer than the distance D2 between the holes R1 and the first surface S1. The holes R1 can include a first surface portion R11 facing the light-emitting devices 100 and a second surface portion R12 facing the first surface S1. An outer surface Rs1 is provided at both ends between the first surface portion R11 and the second surface portion R12, and the outer surface Rs1 can extend perpendicular to at least one or both of the first surface portion R11 and the second surface portion R12. Therefore, the light incident on the holes R1 can be diffused, and the diffused light can be output as line surface light.

[0059] As Figure 16 shown, a single hole R2 can be provided to have a length covering a plurality of light-emitting devices 100. The hole R2 can be strip-shaped or rectangular. The length of the hole R2 in the first direction can be 80% or more of the maximum length of the resin layer 220 in the first direction. The length of the hole R2 in the first direction can be greater than the length connecting the outermost ends of the plurality of light-emitting devices 100. Therefore, the hole R2 can be disposed between each light-emitting device 100 and the first surface S1 and can be disposed to correspond to the region between the light-emitting devices 100. Therefore, since the hole R2 covers the emission side of the light-emitting devices 100 and the external region thereof, the incident light can be diffused and hot spots on the first surface S1 can be prevented. The hole R2 can be provided in a sine wave shape or can include convex portions protruding toward the light-emitting devices 100 and / or concave portions protruding toward the first surface S1. The strip-shaped hole R2 can reduce the straightness of the incident light.

[0060] As Figure 17As shown, the resin layer 220 may include a first hole R1 adjacent to the light-emitting device 100 and a second hole R2 adjacent to the first surface S1 of the resin layer 220. At least one of the first hole R1 and the second hole R2 may be singular or plural. A plurality of holes R1 and R2 may be arranged in at least two rows between the light-emitting device 100 and the first surface S1 of the resin layer 220. The plurality of first holes R1 may be arranged in a first direction and may face each of the plurality of light-emitting devices 100. The first holes R1 may be respectively provided between the light-emitting devices 100 and the second hole R2. A single second hole R2 may be provided in the first direction and may be respectively provided between the first hole R1 and the first surface S1 of the resin layer 220. The length of the longer one of the first hole R1 and the second hole R2 may be two times or more than five times the length of the shorter hole. The long hole R2 among the first hole R1 and the second hole R2 may be spaced apart from the third side surface S3 and the fourth side surface S4. The distance D6 between the first hole R1 and the second hole R2 may be separated by at least 1 mm and may be equal to or less than the distance D3 between the first hole R1 and the light-emitting device 100. At least a part of the first hole R1 and the second hole R2 may be connected to each other, which may vary according to the shape of the fixing pin. The length of the first hole R1 in the first direction X may be equal to or shorter than the length of the second hole R3. On the contrary, the positions of the first hole R1 and the second hole R2 may be changed with each other. The first hole R1 and the second hole R2 are arranged in a double structure and overlap the light-emitting device 100 in the horizontal direction, thereby reducing the hot spot at the center of the light-emitting device.

[0061] As Figure 18 shown, the resin layer 220 may include a first hole R1 adjacent to the light-emitting device 100 and a second hole R3 adjacent to the first surface S1 of the resin layer 220. The first hole R1 and the second hole R3 may be plural. The plurality of first holes R1 may be arranged in a first direction X and face each light-emitting device 100. The first holes R1 may be respectively provided between the light-emitting devices 100 and the second hole R3. The plurality of second holes R3 may be arranged in the first direction X and may be provided between the first hole R1 and the first surface S1 of the resin layer 220. The lengths B11 and B1 of the first hole R1 and the second hole R3 in the first direction are equal to each other, or the length B11 of the second hole R3 may be shorter than the length B1 of the first hole R1. Alternatively, the positions of the first hole R1 and the second hole R3 may be changed with each other. The first hole R1 and the second hole R3 are provided in a double structure and overlap the light-emitting device 100 in the horizontal direction, thereby reducing the hot spot at the center of the light-emitting device.

[0062] As Figure 19As shown, a plurality of holes R2a and R2b have a longer length in the first direction. The plurality of holes R2a and R2b can overlap in the second direction and can include regions that do not overlap in the first direction. The plurality of holes R2a and R2b can be arranged parallel to each other. The first hole R2a adjacent to the light-emitting device 100 among the plurality of holes R2a and R2b can be parallel to the straight line connecting the light-emitting device 100. The second hole R2b adjacent to the first surface S1 among the plurality of holes R2a and R2b can be parallel to the first surface S1. Each of the plurality of holes R2a and R2b can be spaced apart from the third side surface S3 and the fourth side surface S4. The plurality of holes R2a and R2b can be arranged closer to the third side surface S3 and the fourth side surface S4 than the outermost light-emitting device 100. Therefore, the light incident from the entire light-emitting device 100 can be diffused.

[0063] As Figure 21 shown, the lighting module 201 can be arranged in a curved shape based on the horizontal straight line X0. When applied to a vehicle ramp, the lighting module 201 can be combined in a curved ramp shape extending to the rear (or front) and side of the vehicle. In the lighting module 201, the angle between the straight line X0 and the imaginary straight line X2 connecting the two ends of the first surface S1 can be an angle C2 in the range of 10 degrees to 60 degrees, and the imaginary straight line X3 extending tangentially from the first surface S1 provided at one end of the lighting module 201 can have an angle C3 in the range of 5 degrees to 30 degrees. The imaginary lines connecting the adjacent light-emitting devices 100 in the lighting module 201 can include straight lines, oblique lines, or curves. The imaginary lines connecting the plurality of holes R0 can include straight lines, oblique lines, or curves. Here, a part of the line connecting the light-emitting devices 100 can be arranged closer to the first surface direction than the imaginary straight line connecting one end and the other end of the first surface S1 of the lighting module 201.

[0064] As Figure 22 shown, in the lighting module, the third reflection member 245 can be provided behind the resin layer or on the second side surface S2. The third reflection member 245 can be a metal or non-metal material among the materials of the reflection members disclosed above. The third reflection member 245 extends from the side surface of the substrate 210 to the side surface of the first reflection member 240 or can be provided on the side surface of the resin layer 220 at the side surface height of the resin layer 220. The third reflection member 245 can reflect again the light reflected from the holes R0 or the first surface S1.

[0065] Figure 23 of (A) to Figure 23 of (C) are views showing the manufacturing process of the lighting module according to an embodiment. As Figure 23As shown in (A) of FIG. , the fixing pin 291 can penetrate through the resin layer 220 and contact the second reflection member 230 or the substrate 210. In this case, the fixing pin 291 can be provided before the resin layer 220 is formed, and after the resin layer 220 is dispensed and cured, the fixing pin 291 can be separated, as Figure 23 shown in (B) of FIG. . As another example, after the resin layer 220 is dispensed, the fixing pin 291 is provided, and when the resin layer 220 is cured, the fixing pin can be separated, as Figure 23 shown in (B) of FIG. . As Figure 23 shown in (C) of FIG. , when the hole R0 is formed in the area where the fixing pin is removed, the first reflection member 240 is formed on the resin layer 220. The first reflection member 240 can be provided on the resin layer 220 and the hole R0. At least one position of the hole R0 can be provided between the light-emitting device 100 and the first surface S1.

[0066] Figure 24 is the luminous intensity distribution of the lighting module according to the first embodiment of the present invention, Figure 25 is a diagram showing the luminous intensity distribution of the lighting module according to the second embodiment. As Figure 24 shown, the light intensity distribution based on the triangular hole can provide a light uniformity of more than 80%, for example, more than 85%. As Figure 25 shown, it can be seen that the light intensity distribution based on the linear or strip-shaped hole has a light uniformity of more than 50%. Figure 26 is a diagram showing the luminous intensity distribution at 60 degrees, 90 degrees, 120 degrees, and 150 degrees of the inner corner C1 of each lighting module according to Figure 20 of FIGS. (A) to (D). It can be seen that the inner corner range from 60 degrees to 120 degrees has a uniform distribution of about 85%, and in the case of 150 degrees, it can be seen that there is a uniform distribution of about 80%.

[0067] Figure 27 is an example of a module in which the light-emitting device is provided on the circuit board in the lighting module according to the embodiment of the present invention, Figure 28 is a view of the module observed from the other side of Figure 27 . Referring to Figure 27 and 28, the light-emitting device 100 includes a main body 10 having a cavity 20, a plurality of lead frames 30 and 40 in the cavity 20, and one or more light-emitting chips 71 disposed on at least one of the plurality of lead frames 30 and 40. The light-emitting device 100 is an example of the light-emitting device disclosed in the above embodiments and can be implemented as a side-emitting type package. The length of the light-emitting device 100 in the first direction X (or the length of the long side) can be more than three times the width in the second direction Y, for example, more than four times. The length of the second direction Y can be 2.5 mm or more, for example, in the range of 2.7 mm to 6 mm, or in the range of 2.5 mm to 3.2 mm. The light-emitting device 100 can reduce the number of light-emitting devices 100 in the first direction X by providing a longer length in the first direction X. The light-emitting device 100 can provide a relatively thin thickness, thereby reducing the thickness of the lighting device having the light-emitting device 100. The thickness of the light-emitting device 100 can be in the range of 2 mm or less, for example, 1.5 mm or less, or 0.6 mm to 1 mm. The main body 10 has a cavity 20, and the length of the main body 10 in the first direction X can be more than three times the thickness of the main body 10 to widen the light beam angle in the first direction X. At least one or more lead frames 30 and 40 are disposed on the main body 10. At least one or more lead frames 30 and 40 are disposed on the bottom of the cavity 20. For example, the first lead frame 30 and the second lead frame 40 are coupled to the main body 10. The main body 10 can be formed of an insulating material. The main body 10 can be formed of a reflective material. The main body 10 can be formed of a material having a reflectivity higher than the transmittance for the wavelength of the light emitted from the light-emitting chip, for example, a material having a reflectivity of 70% or more. When the reflectivity is 70% or more, the main body 10 can be defined as a non-transmissive material or a reflective material. The main body 10 can be formed of a resin-based insulating material, for example, a resin material such as polyphthalamide (PPA). The main body 10 can be formed of a silicone-based, epoxy-based resin or a thermosetting resin including a plastic material, or can be formed of a material having high heat resistance and high light resistance. The main body 10 can include a reflective material, for example, a resin material added with a metal oxide, and the metal oxide can include at least one of TiO2, SiO2, and Al2O3. The main body 10 can effectively reflect incident light. As another example, the main body 10 can be formed of a translucent resin material or a resin material having a phosphor for converting the wavelength of incident light. The first side portion 15 of the main body 10 can be the surface on which the cavity 20 is provided, or the surface on which light is emitted. The second side portion of the main body 10 can be the opposite side or the second side of the first side portion 15.

[0068] The first lead frame 30 may include a first lead portion 31 disposed on the bottom of the cavity 20, a first bonding portion 32 disposed in a first outer region of the third side surface portion 11 of the main body 10, and a first heat dissipation portion 33 disposed on the third side surface portion 13 of the main body 10. The first bonding portion 32 is bent and protrudes from the first lead portion 31 in the main body 10 to the third side surface portion 11, and the first heat dissipation portion 33 may be bent from the first bonding portion 32. The first outer region of the third side surface portion 11 may be a region adjacent to the third side surface portion 13 of the main body 10. The second lead frame 40 may include a second lead portion 41 on the bottom of the cavity 20, a second bonding portion 42 disposed in a second outer region of the third side surface portion 11 of the main body 10, and a second heat dissipation portion 43 disposed on the fourth side surface portion 14 of the main body 10. The second bonding portion 42 may be bent from the second lead portion 41 in the main body 10, and the second heat dissipation portion 43 may be bent from the second bonding portion 42. The second outer region of the third side surface portion 11 may be a region adjacent to the fourth side surface portion 14 of the main body 10. The spacer 17 between the first lead portion 31 and the second lead portion 41 may be formed of the material of the main body 10, and may be on the same level as the bottom of the cavity 20, or may protrude, but is not limited thereto. As another example, two or more lead frames may be provided in the main body 10. For example, three lead frames may be provided, where one lead frame may be a heat dissipation frame or a positive polarity frame, and the other two lead frames may have different negative polarities.

[0069] Here, the light-emitting chip 71 may be disposed, for example, on the first lead portion 31 of the first lead frame 30, and may be connected to the first lead portion 31 through wires 72 and 73, or may be connected to the first lead portion 31 with an adhesive and connected to the second lead portion 41 with a wire. The light-emitting chip 71 may be a horizontal chip, a vertical chip, or a chip having a through-hole structure. The light-emitting chip 71 may be mounted by a flip-chip method. The light-emitting chip 71 may selectively emit light in the wavelength range from ultraviolet to visible light. The light-emitting chip 71 may emit, for example, ultraviolet light or light having a blue peak wavelength. The light-emitting chip 71 may include at least one of II-VI group compounds and III-V group compounds. The light-emitting chip 71 may be formed, for example, of a compound selected from the group consisting of GaN, AlGaN, InGaN, AlInGaN, GaP, AlN, GaAs, AlGaAs, InP, and mixtures of the foregoing. A plurality of light-emitting chips 71 may be connected in series or a plurality of light-emitting chips 71 may be connected in parallel. One or more light-emitting chips 71 may be provided, and one or more light-emitting chips 71 are disposed in the cavity 20 of the light-emitting device 100 according to the embodiment. The light-emitting chip 71 may be selected from, for example, red LED chips, blue LED chips, green LED chips, and yellow-green LED chips.

[0070] Observe the inner surface of the cavity 20. The inner surface disposed around the cavity 20 can be inclined with respect to the horizontal straight line of the upper surfaces of the lead frames 30 and 40. The inner surface of the cavity 20 can have a region stepped vertically from the first side portion 15 of the main body 10. The stepped region can be arranged to be stepped between the first side portion 15 and the inner surface of the main body 10. The stepped region can control the direction characteristics of the light emitted through the cavity 20. A molding member 81 is disposed in the cavity 20 of the main body 10. The molding member 81 includes a light-transmissive resin, such as silicone resin or epoxy resin, and can be formed as a single layer or multiple layers. The molding member 81 or the light-emitting chip 71 can include a phosphor for changing the wavelength of the emitted light. The phosphor can be selectively formed from quantum dots, YAG, TAG, silicate, nitride, and oxynitride-based materials. The phosphor can include at least one of a red phosphor, a yellow phosphor, and a green phosphor, but is not limited thereto. The surface of the molding member 81 can be formed into a planar shape, a concave shape, a convex shape, etc., but is not limited thereto. As another example, a light-transmissive film having a phosphor can be disposed on the cavity 20, but the present disclosure is not limited thereto. A lens can be further formed on the upper portion of the main body 10, and the lens can include a structure of a concave lens and / or a convex lens, and can adjust the light distribution of the light emitted from the light-emitting device 100.

[0071] A semiconductor device such as a light-receiving device or a protection device can be mounted on the main body 10 or on any one of the lead frames, and the protection device can be implemented as a thyristor, a Zener diode, or a TVS (transient voltage suppressor). The Zener diode protects the light-emitting chip from electrostatic discharge (ESD).

[0072] Reference Figure 28 , at least one or more light-emitting devices 100 are disposed on the support member 210, and a protective layer and / or a reflective member 260 are disposed around the lower portion of the light-emitting device 100. The light-emitting device 100 is an example of the light-emitting device disclosed in the present embodiment, emits light in the direction of the central axis Y0, and can be applied to the lighting device disclosed above. The first lead portion 33 and the second lead portion 43 of the light-emitting device 100 are joined to the electrode patterns 213 and 215 of the substrate 210 using solder or a conductive tape as the conductive bonding members 217 and 219.

[0073] The lighting module according to an embodiment of the present invention can be applied to a lamp as Figure 29 shown. The lamp is an example of a vehicle lamp, such as a headlamp, a side lamp, a side mirror lamp, a fog lamp, a tail lamp, a brake lamp, a daytime running lamp, an interior lighting, a door step, a rear combination lamp, or can be applied to a reverse lamp. Reference Figure 29, the lighting module 200 disclosed above can be coupled to a lamp in a housing 503 having an inner lens 502. The thickness of the lighting module 200 is set such that it can be inserted into the inner width of the housing 503. The width Z3 of the light-emitting portion 515 of the inner lens 502 can be equal to or less than twice the thickness of the lighting module 200, thereby preventing a reduction in light-emitting intensity. The inner lens 502 can be spaced apart from the first surface of the lighting module 200 by a predetermined distance, for example, 10 mm or more. The outer lens 501 can be disposed on the emission side of the inner lens 502. A lamp having such a lighting module 200 is an example and can be applied to other lamps as a structure having ductility (e.g., a curved surface or a structure curved when viewed from the side).

[0074] Figure 30 is a top view of a vehicle having a vehicle lamp to which the lighting module according to the embodiment is applied, Figure 31 is a view showing a vehicle lamp having the lighting module or the lighting device disclosed in the embodiment. Refer to Figure 30 and 31 , the taillight 800 in the vehicle 900 may include a first lamp unit 812, a second lamp unit 814, a third lamp unit 816, and a housing 810. Here, the first lamp unit 812 may be a light source that functions as a turn indicator, the second lamp unit 814 may be a light source that functions as a side lamp, and the third lamp unit 816 may be a light source that functions as a brake lamp, but is not limited thereto. At least one or all of the first lamp unit 812, the second lamp unit 814, and the third lamp unit 816 may include the lighting device or module disclosed in the embodiment. The housing 810 houses the first lamp unit 812, the second lamp unit 814, and the third lamp unit 816, and the housing 810 may be made of a light-transmissive material. In this case, the housing 810 may have a curve according to the design of the vehicle body, and the first lamp unit 812, the second lamp unit 814, and the third lamp unit 816 may implement a surface light source that may have a curved surface according to the shape of the housing 810. When the lamp unit is applied to the taillight, brake lamp, or turn signal lamp of a vehicle, such a vehicle lamp can be applied to the turn signal lamp of a vehicle.

Claims

1. A lighting device, comprising: a substrate; a plurality of light-emitting devices disposed on the substrate; a resin layer disposed on the upper surface of the substrate and configured to surround the plurality of light-emitting devices; and a first reflecting member disposed on the upper surface of the resin layer, wherein the resin layer includes a first surface facing the emission surfaces of the plurality of light-emitting devices, a second surface opposite to the first surface, and a plurality of holes disposed between the first surface and each of the plurality of light-emitting devices, wherein the plurality of light-emitting devices are arranged along a region between the first surface and the second surface, wherein the plurality of holes respectively face the plurality of light-emitting devices, and the plurality of holes are spaced apart from each other, wherein each of the holes is disposed closer to each of the light-emitting devices than the first surface of the resin layer, wherein each of the holes passes through the resin layer from the lower surface of the first reflecting member toward the substrate, wherein each of the holes and each of the light-emitting devices overlap in the light-emitting direction of the light-emitting devices, wherein the holes are disposed between the upper surface of the substrate and the lower surface of the first reflecting member, wherein the resin layer diffuses the light emitted from the light-emitting devices and the light reflected by the first reflecting member, and emits the diffused light through the first surface, wherein the first surface includes a first region horizontally overlapping with the light-emitting devices and a second region horizontally overlapping with the region between the light-emitting devices, wherein the first region and the second region of the first surface are disposed in the same plane, wherein the minimum distance between the first surface of the resin layer and each of the holes is equal to or greater than the minimum distance between each of the holes and each of the light-emitting devices, wherein the minimum distance between the first surface of the resin layer and each of the holes is in the range of 10% to 60% of the minimum distance between each of the light-emitting devices and the first surface of the resin layer, wherein each of the holes includes a first surface portion opposite to the emission surface of each of the light-emitting devices, and a second surface portion and a third surface portion whose distances gradually narrow from both ends of the first surface portion toward the first surface of the resin layer, and wherein the area of the first surface portion of each of the plurality of holes is larger than the area of the emission surface of each of the light-emitting devices, wherein in the first surface portion, the distance between the second surface portion and the third surface portion is the largest, wherein in the resin layer, the minimum distance between each of the holes and each of the light-emitting devices is in the range of 2 mm to 4 mm, wherein the interior angle formed by the second surface portion and the third surface portion is in the range of 60 degrees to 120 degrees, and Wherein, the holes are filled with a material having a refractive index higher than that of the resin layer, and the material includes a metal oxide or a metal nitride.

2. The lighting device according to claim 1, Among them, a minimum distance between the first surface of the resin layer and each of the holes is less than a minimum distance between each of the light-emitting devices and the first surface of the resin layer, and wherein, the second surface portion and the third surface portion are surfaces from which light traveling through the first surface portion exits.

3. The lighting device according to claim 2, wherein, The second surface portion of each of the holes includes a concavo-convex pattern.

4. The lighting device according to claim 3, wherein, The third surface portion of each of the holes includes a concavo-convex pattern.

5. The lighting device according to any one of claims 1 to 4, wherein, Each of the holes includes a fourth surface portion that connects between the second surface portion and the third surface portion, and a length of the fourth surface portion is less than a length of the first surface portion.

6. The lighting device according to claim 5, wherein, The fourth surface portion has a plurality of concavo-convex patterns.

7. The lighting device according to any one of claims 1 to 4 further includes a second reflection member disposed between the substrate and the resin layer, wherein, Each of the holes is disposed between the lower surface of the first reflecting member and the upper surface of the second reflecting member, wherein, one end of the second reflecting member is disposed on the same surface as the first surface, and the other end of the second reflecting member is disposed on the same surface as the second surface, wherein, the resin layer diffuses light emitted from the light-emitting device and light reflected by the first reflecting member and the second reflecting member.

8. The lighting device according to any one of claims 1 to 4, wherein A height of each of the holes is in a range of 50% to 100% of a thickness of the resin layer.

9. The lighting device according to any one of claims 1 to 4, wherein, An imaginary line connecting the plurality of light-emitting devices is a straight line, an oblique line, or a curve, and wherein, an imaginary line connecting the plurality of holes is a straight line, an oblique line, or a curve.

10. The lighting device according to any one of claims 1 to 4, wherein Each of the holes has a plurality of vertices, and the second surface portion and the third surface portion intersect at one of the plurality of vertices.

Images