A loading apparatus

Abstract

The application provides a loading device, which comprises a chamber body, a heating disc for heating a wafer is arranged in a chamber of the chamber body, and a cooling channel is arranged in a wall of the chamber body; the cooling channel is used for connecting a constant temperature system. In the scheme, the cooling channel can be connected with the external constant temperature system, the constant temperature system is provided with a heat exchanger, a medium with constant temperature can be provided, the medium flows into the cooling channel and then flows in the wall of the chamber body, so that the wall of the chamber body has constant temperature, and the chamber body does not need to be excessively insulated, has better maintainability, and because the temperature is controlled, the sealing ring structure performance of the connection between other components and the chamber body is guaranteed, so that the reliability of the vacuum sealing is improved.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of semiconductor processing equipment, and particularly relates to a loading device. BACKGROUND

[0002] When a wafer is processed, the wafer is transported from a wafer box by a mechanical transmission structure into a vacuum process chamber for processing. The vacuum process chamber is in a vacuum environment. Therefore, the wafer is transported from the outside into the vacuum process chamber, or transported from the vacuum process chamber to the outside after processing, which may affect the vacuum environment of the vacuum process chamber.

[0003] At present, a loading device is arranged between the vacuum process chamber and the wafer box. The loading device is provided with a transition chamber. When the transition chamber of the loading device is in an atmospheric state, the transition chamber is in communication with the wafer box to transfer the wafer to the transition chamber. When the transition chamber is in a vacuum state, the transition chamber is in communication with the vacuum process chamber or a wafer transmission system in a vacuum state to transport the wafer into the vacuum process chamber. The reverse process can transport the finished wafer processed in the vacuum process chamber back to the wafer box. In order to reduce the temperature difference, a heating disc is arranged in the transition chamber to preheat the wafer. However, the temperature of the heating disc is relatively high, which leads to a high temperature of the loading device and makes it difficult to guarantee the safety factor of the working environment. SUMMARY

[0004] The application provides a loading device. The loading device comprises a chamber body. A heating disc for heating a wafer is arranged in a chamber of the chamber body. A cooling channel is arranged in a wall of the chamber body. The cooling channel is connected to a constant temperature system.

[0005] In a specific scheme, a groove is arranged in the wall of the chamber body. A cooling pipe is arranged in the groove. The cooling pipe forms the cooling channel. Alternatively, a groove is arranged in the wall of the chamber body. An opening of the groove is sealed by a metal plate. The groove and the metal plate form the cooling channel.

[0006] In a specific scheme, thermally conductive glue is filled between the cooling pipe and a groove wall of the groove. The opening of the groove is provided with the thermally conductive glue to cover the cooling pipe.

[0007] In a specific scheme, the heating disc is arranged at the bottom of the chamber body. The cooling channel is arranged at a bottom wall of the chamber body. The cooling channel surrounds the heating disc.

[0008] In a specific scheme, two heating discs are arranged in the chamber of the chamber body. The cooling channel surrounds the two heating discs.

[0009] In an embodiment, the bottom wall of the chamber body is provided with an opening, the loading device comprises a support disc sealing the opening, the heating disc is supported on the support disc, the bottom of the heating disc is connected with a long handle, the long handle extends out of the support disc, the long handle is sleeved with a sleeve structure, the top end of the sleeve structure is sealingly connected with the support disc, the bottom end of the sleeve structure is covered by a cooling module, the cooling module and the bottom end of the sleeve structure are provided with a sealing ring, the cooling module is provided with a cooling flow channel surrounding the sealing ring, and the cooling flow channel is connected with the constant temperature system.

[0010] In an embodiment, the loading device further comprises a cooling pipeline connecting the cooling flow channel and the cooling channel to the constant temperature system.

[0011] In an embodiment, the loading device further comprises a liquid leakage monitoring device, the liquid leakage monitoring device comprises a liquid receiving disc and a liquid accumulation box, the liquid receiving disc is arranged below the interface between the cooling pipeline and the cooling channel and below the interface between the cooling pipeline and the cooling flow channel, and the liquid accumulation box is provided with a liquid leakage detection sensor.

[0012] In an embodiment, the loading device further comprises a support, the liquid accumulation box is mounted on the support, and the cooling pipeline is further connected with a flow meter and a flow valve, and the flow meter and the flow valve are mounted on the support.

[0013] In an embodiment, the side wall of the chamber body is provided with an observation window, and the observation window is sealingly connected with the chamber body.

[0014] In an embodiment, the chamber body comprises one or more chambers, the chambers are divided into an upper chamber and a lower chamber, and the upper chamber and the lower chamber are both provided with a conveying inlet and a conveying outlet, wherein the conveying inlet and the conveying outlet of the lower chamber are connected with a wafer box and a vacuum process chamber respectively, the conveying inlet and the conveying outlet of the upper chamber are connected with the vacuum process chamber and the wafer box respectively, the heating disc is arranged in the lower chamber, and the upper chamber is provided with a cover plate heating assembly at the top.

[0015] In this embodiment, the cooling channel can be connected with an external constant temperature system, the constant temperature system is provided with a heat exchanger, and a medium with constant temperature can be provided, the medium flows into the cooling channel and then flows in the wall of the chamber body, so that the wall of the chamber body has constant temperature, and the chamber body does not need to be excessively heat-insulated, thereby having better maintainability, and because the temperature is controlled, the performance of the sealing ring structure at the connection between other components and the chamber body is guaranteed, thereby improving the reliability of the vacuum sealing. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 Figure 1 is a schematic view of a loading device in accordance with an embodiment of the present application;

[0017] Figure 2 Figure 2 is a schematic view of a loading device in accordance with an embodiment of the present application; Figure 1 Figure 3 is a schematic view of a chamber body and a matching pipeline system of a loading device in accordance with an embodiment of the present application;

[0018] Figure 3 Figure 4 is a bottom view of a loading device in accordance with an embodiment of the present application; Figure 2

[0019] Figure 4 Figure 5 is a schematic view of a chamber body in accordance with an embodiment of the present application, showing the bottom of the chamber body; Figure 2

[0020] Figure 5 Figure 6 is a schematic view of a chamber body in accordance with an embodiment of the present application, showing the top of the chamber body; Figure 2

[0021] Figure 6 Figure 7 is an axial sectional view of a chamber body in accordance with an embodiment of the present application; Figure 5

[0022] Figure 7 Figure 8 is an axial sectional view of a support disc position in accordance with an embodiment of the present application; Figure 2

[0023] Figure 8 Figure 9 is a schematic view of a support bracket position in accordance with an embodiment of the present application. Figure 2

[0024] Figures 1-8 Figure 10 is a legend of the reference numerals in the accompanying drawings.

[0025] 11 - chamber body; 11a - first chamber; 11b - second chamber; 11c - delivery inlet; 11d - delivery inlet; 11e - observation window; 11f - air hole; 11g - delivery outlet; 11h - delivery outlet; 111 - bottom wall;

[0026] 12 - rear end isolation valve assembly; 13 - front end isolation valve assembly; 14 - cover plate heating assembly; 15 - support disc; 161 - sleeve structure; 162 - cooling module; 162a - cooling flow channel; 17 - long handle; 181 - lifting pin; 182 - lifting device; 19 - sealing ring;

[0027] 21 - cover plate; 22 - baffle plate;

[0028] 3 - liquid leakage pipeline;

[0029] 41 - first pipeline; 42 - second pipeline; 43 - third pipeline; 44 - fourth pipeline; 45 - fifth pipeline; 46 - sixth pipeline;

[0030] 5 - liquid accumulation box; 51 - liquid leakage detection sensor; 52 - liquid leakage interface;​​​​​​

[0031] 6 - bracket; 61 - third interface; 62 - fourth interface; 63 - flow meter; 64 - pneumatic diaphragm valve;

[0032] 7 - cooling pipe;

[0033] 8 - liquid receiving tray;

[0034] 100 - heating tray. DETAILED DESCRIPTION

[0035] In order to make the person skilled in the art better understand the present application, the present application will be further described in detail below in combination with the drawings and specific embodiments.

[0036] As Figures 1-6 shown, Figure 1 is a schematic view of the loading device in the present application; Figure 2 is Figure 1 a schematic view of the chamber body 11 of the loading device in the present application and the matched pipeline system; Figure 3 is Figure 2 a bottom view of the loading device in the present application; Figure 4 is Figure 2 a schematic view of the chamber body 11 in the present application, showing the bottom of the chamber body 11; Figure 5 is Figure 2 a schematic view of the chamber body 11 in the present application, showing the top of the chamber body 11; Figure 6 is Figure 5 an axial sectional view of the chamber body 11 in the present application.

[0037] The loading device in the present embodiment comprises a chamber body 11 having an inner cavity, and the cavity of the chamber body 11 is a transition cavity. The loading device is arranged between a wafer box and a vacuum process chamber, and is generally arranged to have as small a volume as possible so as to use less time when it is switched between a vacuum state and an atmospheric state. When the chamber body 11 of the loading device is in the atmospheric state, it is communicated with the wafer box, and a robot or other mechanism is used to transfer wafers to the cavity of the chamber body 11. When the chamber body 11 is in the vacuum state, it is communicated with the vacuum process chamber or a wafer conveying system in the vacuum state, and the robot or other mechanism is used to convey the wafers into the vacuum process chamber. The above process is the process of transferring wafers in the atmospheric state into the vacuum process chamber through the loading device, and the reverse process can be used to transfer finished wafers processed in the vacuum process chamber back to the wafer box.

[0038] As Figure 5 shown, the chamber body 11 has two left and right cavities, defined as a first cavity 11a and a second cavity 11b. Each cavity is further divided by a partition plate (shown in Figure 6) is divided into upper and lower chambers, the upper and lower chambers are independent of each other, one side of the chamber body 11 is provided with a wafer conveying inlet 11c and a conveying outlet 11g, which can be defined as the front side of the chamber body 11, the conveying inlet 11c corresponds to the lower chamber, and the conveying outlet 11g corresponds to the upper chamber, corresponding front end isolation valve assemblies 13 are arranged at the conveying inlet 11c and the conveying outlet 11g, the other side opposite to the one side is provided with a wafer conveying inlet 11d and a conveying outlet 11h, the conveying inlet 11d corresponds to the upper chamber, and the conveying outlet 11h corresponds to the lower chamber, which can be defined as the rear side of the chamber body 11, corresponding rear end isolation valve assemblies 12 are arranged at the conveying outlet 11h and the conveying inlet 11d, and the isolation valve assemblies are used to realize the sealing of the conveying inlet 11c, the conveying outlet 11d, the conveying inlet 11d and the conveying outlet 11h.

[0039] In the embodiment, the bottom of the lower chamber is provided with a heating disc 100, the wafer can be conveyed into the lower chamber from the conveying inlet 11c of the lower chamber, and is heated and treated by the heating disc 100, the heating temperature is different according to different process requirements, for example, the temperature of the heating disc 100 can reach more than 300 degrees according to the process parameter requirements of part of products, the wafer after heating can be sent into a vacuum process chamber for processing through the conveying outlet 11h of the lower chamber, and the wafer after processing can enter the upper chamber from the conveying inlet 11d of the upper chamber, and then is output from the corresponding conveying outlet 11g of the upper chamber. The top of the chamber body 11 can be provided with a cover plate heating assembly 14, the cover plate heating assembly 14 heats the upper chamber, and the heating temperature of the cover plate heating assembly 14 is lower than that of the heating disc 100.

[0040] When the wafer is reacted in the vacuum process chamber, the temperature is high, which can reach 400-600 degrees or even higher. The liquid source does not volatilize in the vacuum environment of the vacuum process chamber. When it is transmitted to the upper chamber of the loading device, the upper chamber is backfilled with gas to the atmospheric state, which is at normal temperature and pressure. At this time, the liquid source at normal temperature and pressure will volatilize into the upper chamber of the loading chamber, and condensation will occur on the corresponding wall of the upper chamber. The cover plate heating assembly 14 of the present embodiment can improve the condensation problem. In addition, the chamber body 11 in the present embodiment is provided with a first chamber 11a and a second chamber 11b, and each chamber is further divided into an upper chamber and a lower chamber. Therefore, two wafers can be simultaneously transmitted in and out, and the wafer transmission of the upper chamber and the lower chamber is independent of each other and does not interfere with each other. At this time, two heating plates 100 and two cover plate heating assemblies 14 are correspondingly arranged, and the outer layer of the cover plate heating assembly 14 is a layer of heat insulation plate. It can be seen that the chamber of the loading device can be one or more, and each chamber can be divided into an upper chamber and a lower chamber. In this way, each upper chamber can independently serve as a transition chamber for the wafer that has been processed to a wafer box, and each lower chamber can independently serve as a transition chamber for the wafer to be transmitted to the vacuum process chamber for processing. Each lower chamber is provided with a heating plate, and each upper chamber is provided with a heating cover plate assembly 14.

[0041] The cover plate heating assembly 14 can be provided with a heating wire inside to achieve the purpose of heating, and a temperature sensor can also be provided inside. The cover plate heating assembly 14 is provided with a through hole for the power supply line joint of the heating wire and the signal line joint of the temperature sensor on the top to establish a connection with the outside. A handle can also be provided on the top of the cover plate heating assembly 14 for loading and unloading operations.

[0042] It is worth noting that the wall of the chamber body 11 in the present embodiment is provided with a cooling channel, which is specifically arranged in the bottom wall 111 of the chamber body 11, as shown in Figure 4 The outer surface of the bottom wall 111 of the chamber body 11 is provided with a groove, and the cooling pipe 7 is arranged in the groove, i.e. the cooling pipe 7 is embedded in the groove. It should be noted that the present application defines the direction close to the chamber of the chamber body 11 as inside, and the direction away from the chamber as outside.

[0043] The cooling pipe 7 can be connected to an external constant temperature system, which is provided with a heat exchanger and can provide a medium with constant temperature, such as water. The medium flows into the cooling pipe 7 and then flows in the wall of the chamber body 11, so that the wall of the chamber body 11 has a constant temperature. Therefore, the chamber body 11 does not need to be subjected to excessive heat insulation treatment, which has better maintainability. Moreover, since the temperature is controlled, the sealing ring structure performance at the connection between other components and the chamber body 11 is guaranteed, thereby improving the reliability of the vacuum seal.

[0044] As shown in Figure 2As shown, the bottom of the chamber body 11 is provided with a support disc 15 supporting the heating disc 100, and the bottom wall 111 of the chamber body 11 is provided with an opening, the heating disc 100 is placed into the first chamber 11a or the second chamber 11b of the chamber body 11 from the opening position, and the support disc 15 and the bottom wall 111 of the chamber body 11 are sealingly fixed. Since the heating disc 100 is arranged at the bottom of the first chamber 11a or the second chamber 11b, the wall of the chamber body 11 that is easy to generate high temperature is the bottom wall 111, and therefore, in the embodiment, a groove is arranged on the bottom wall 111 of the chamber body 11, so that the cooling medium can flow along the bottom wall 111 to more quickly and effectively reduce the temperature of the chamber body 11 and better maintain the constant temperature of the chamber body 11.

[0045] Moreover, as shown, Figure 4 In the embodiment, the chamber body 11 forms two chambers and has two heating discs 100, and therefore, the cooling pipe 7 can be arranged around the two heating discs 100, so that the cooling is more targeted, and the temperature transmission path of the heating disc 100 in the chamber body 11 is more quickly cut off, and the heat transmission to other walls of the chamber body 11 is reduced. Figure 4 In the embodiment, the heating disc 100 is circular, and the cooling pipe 7 is arranged around the two circular heating discs 100 to be distributed in a substantially "8" shape.

[0046] Figure 4 In the embodiment, the bottom wall 111 of the chamber body 11 is provided with four air holes 11f, which are two air inlet holes and two air outlet holes, one set of air inlet hole and air outlet hole communicates with the upper chambers of the first chamber 11a and the second chamber 11b, and the other set of air inlet hole and air outlet hole communicates with the lower chambers of the first chamber 11a and the second chamber 11b, the air inlet hole can be converted into an atmospheric environment, and the air outlet hole can be converted into a vacuum environment, and the two sets of air inlet hole and air outlet hole are shared by the two upper chambers and the two lower chambers, so that the air supply and air exhaust are more convenient, and it can be known that each upper chamber and lower chamber can also be provided with independent air inlet hole and air outlet hole. The four air holes are arranged between the first chamber 11a and the second chamber 11b and located at the middle part of the bottom wall 111 of the chamber body 11, and when the cooling pipe 7 is arranged around the heating disc 100 and extends to the middle part of the bottom wall 111, the cooling pipe 7 can pass through between the two air holes 11f.

[0047] In the embodiment, the groove is arranged on the bottom wall 111 of the chamber body 11 and the cooling pipe 7 is embedded in the groove to cool the bottom wall 111, and it can be known that the cooling pipe 7 can also be arranged at other positions of the chamber body 11, which can be designed according to the actual cooling requirement, such as being arranged at the left and right sides or the top wall of the chamber body 11. Figure 4In the embodiment, the front side and the rear side of the chamber body 11 are used to set the valve isolation assembly, the left and right sides have limited area and are used to set the observation window 11e, and the heating disc 100 is arranged close to the bottom wall 111, so the cooling pipe 7 is embedded in the bottom wall 111 of the chamber body 11, so as to make full use of the space of the bottom wall 111 and achieve better cooling and constant temperature maintaining effect and simpler engineering application.

[0048] In addition, in order to achieve better cooling effect, the cooling pipe 7 can be filled with heat-conducting glue between the groove wall, so as to improve the heat exchange efficiency, and the groove opening can be provided with heat-conducting glue to cover the cooling pipe 7, which can protect the cooling pipe 7, facilitate sealing and prevent leakage, and also accelerate heat dissipation of the cooling pipe 7.

[0049] In the above embodiment, the groove is arranged on the wall of the chamber body 11 and the cooling pipe 7 is embedded to form the cooling channel for the cooling medium to flow, and it can be known that the forming mode of the cooling channel is not limited to this. For example, the groove can be opened on the wall of the chamber body 11, and then a metal plate is welded to the groove opening position to seal the opening, so that the metal plate can form the cooling channel together with the groove. Of course, the above-mentioned mode of embedding the cooling pipe 7 to form the cooling channel is not easy to leak. Alternatively, the cooling channel can be integrally formed on the bottom wall 111, but the mode of arranging the groove is easier to process and manufacture.

[0050] Please continue to refer to Figure 7 , Figure 7 For Figure 2 The axial sectional view of the position of the support disc 15 in the embodiment, the support disc 15 supports the heating disc 100.

[0051] As described above, in the embodiment, the heating disc 100 is installed in the chamber of the chamber body 11, the support disc 15 supports the heating disc 100, the support disc 15 is also provided with a lifting groove, and the lifting device 182 can be lifted in the lifting groove to drive the lifting pin 181 to lift, and the lifting pin 181 can lift the wafer supported on the heating disc 100.

[0052] The heating disc 100 is provided with a heating wire inside to realize the heating function, at this time, power supply line needs to be supplied from the outside to the heating wire, as shown in Figure 7 The bottom of the heating disc 100 is provided with a long handle 17, the long handle 17 penetrates out of the support disc 15 from inside to outside, the inside of the long handle 17 is arranged with power supply line for heating the heating disc 100, and the inside of the long handle 17 can also be arranged with detection line connected to the temperature sensor inside the heating disc 100 to transmit the temperature signal detected by the temperature sensor outward. Since the long handle 17 needs to penetrate out of the support disc 15, the long handle 17 needs to be sealed with the support disc 15 through a sealing component. As shown in Figure 7As shown, the part of the long handle 17 extending out of the support plate 15 is sleeved with a sleeve structure 161, the top end of the sleeve structure 161 and the bottom surface of the support plate 15 are sealed by a sealing ring, the bottom end of the sleeve structure 161 is capped by a cooling module 162, and the cooling module 162 is also sealed from the sealing ring 19.

[0053] The temperature of the heating plate 100 is transmitted outwardly through the long handle 17, which may affect the performance of the sealing ring. The sealing ring at the top end of the sleeve structure 161 is in contact with the support plate 15, and the support plate 15 is fixed to the bottom wall 111 of the chamber body 11. Since the chamber body 11 is kept at a constant temperature, and the heating plate 100 is also provided with a cooling component, the temperature of the support plate 15 can also be reduced, so the temperature at this position does not affect the performance of the sealing ring at the top. However, since the heating plate 100 transmits heat outwardly through the long handle 17, the heat transmitted to the bottom of the long handle 17 cannot be cooled, so the constant temperature system in this embodiment also provides a medium to the position of the cooling module 162, such as Figure 7 As shown, the cooling module 162 is provided with a cooling flow channel 162a surrounding the long handle 17, so that the temperature at the position of the sealing ring 19 at the bottom end of the sleeve structure 161 can be reduced, thereby ensuring the sealing performance of the sealing ring 19 at this position.

[0054] As shown in Figure 1 , 2 The loading device in this embodiment includes a cooling pipeline, which connects the cooling flow channel 162a of the cooling module 162 and the cooling pipeline 7 in the bottom wall 111 of the chamber body 11 in series. The two ends of the cooling pipeline 7 are connected to the outlet and inlet of the constant temperature system, respectively. In this way, the medium of the constant temperature system can flow out from the outlet, then enter the cooling flow channel 162a of the cooling module 162 and the cooling pipeline 7 in the wall of the chamber body 11 (it can also flow to the cooling pipeline 7 first, and then to the cooling module 162), and then flow to the inlet of the constant temperature system, thereby forming a circulating flow of the cooling medium. In this way, one loop can simultaneously cool the cooling module 162 of the long handle 17 of the heating plate 100 and the cooling pipeline 7 of the chamber body 11, and the pipeline system is more simple to set up.

[0055] Specifically combined Figure 2 and Figure 8 understand, Figure 8 for Figure 2 the schematic view of the position of the support 6 in this embodiment.

[0056] The loading device in this embodiment is also provided with a support 6, which is provided with a first interface, a second interface, a third interface 62, and a fourth interface 61. The first interface and the second interface are respectively connected to the two ends of the cooling pipeline, and the first interface and the second interface are not shown due to the angle of view, Figure 2In the embodiment, the cooling pipe is composed of several sections, which are defined as the first pipe 41, the second pipe 42, the third pipe 43, the fourth pipe 44 and the fifth pipe 45, respectively, in consideration of the bending radius and the purpose of connecting the cooling module 162 and the cooling pipe 7. The ends of the first pipe 41 and the second pipe 42 are the two ends of the cooling pipe, the first pipe 41 is connected to the first interface, the second pipe 42 is connected to the second interface, the third interface 62 and the fourth interface 61 are connected to the outlet and the inlet of the thermostat system, respectively, as shown in Figure 2 The third interface 62 and the fourth interface 61 are connected to the thermostat system through the seventh pipe 47 and the eighth pipe 48, respectively. The first interface and the third interface are in communication, and a flow meter 63 can be arranged therebetween, which is convenient for monitoring the flow of the medium flowing in. The flow meter 63 can be installed on the support 6, and the third interface 62 and the fourth interface 61 are in communication, and the flow meter 63 can also detect the flow of the medium flowing out at the same time.

[0057] As shown in Figure 2 The medium flowing into the third interface 62 flows to the first interface, and then flows from the first pipe 41 to the second pipe 42, and then flows to the heating module of the heating disc 100 corresponding to the first chamber 11a, and then flows out to enter the third pipe 43, and then flows to the heating module of the heating disc 100 corresponding to the second chamber 11b, and then flows out to enter the fourth pipe 44, and then flows to the cooling pipe 7 in the bottom wall 111 of the chamber body 11, and then flows out to enter the fifth pipe 45, and then flows to the sixth pipe 46, and then flows to the second interface through the sixth pipe 46, and then flows to the fourth interface, and then flows to the seventh pipe, and then flows to the inlet of the thermostat system.

[0058] In addition, the embodiment also provides a liquid leakage monitoring device, which comprises the liquid accumulation box 5 and the liquid receiving disc 8. The liquid receiving disc 8 is arranged below the interface position of the cooling pipe and the cooling pipe 7, and the liquid receiving disc 8 is also arranged below the interface position of the cooling module 162 and the cooling pipe. Figure 2As shown, the liquid receiving tray 8 is arranged on the left side and the liquid receiving tray 8 is arranged on the right side. In this embodiment, the cooling pipe 7 of the bottom wall 111 of the chamber body 11 extends from one end of the chamber body 11, surrounds the two heating plates 100, and then winds to the end again. Two interfaces are arranged at the end of the chamber body 11, which are connected with the fourth pipeline 44 and the fifth pipeline 45 respectively. The end corresponds to the first chamber 11a. The cooling module 162 below the heating plate 100 of the first chamber 11a is arranged with the interfaces connected with the second pipeline 42 and the third pipeline 43. Therefore, the liquid receiving tray 8 is arranged to receive the liquid leakage that may occur at the two interfaces of the chamber body 11 and the liquid leakage that may occur at the interfaces connected with the second pipeline 42 and the third pipeline 43 of the cooling module 162. The cooling module 162 below the heating plate 100 of the second chamber 11b of the chamber body 11 is arranged with the interfaces connected with the third pipeline 43 and the fourth pipeline 44. The liquid receiving tray 8 is arranged below to receive the liquid leakage that may occur at the interfaces.

[0059] In addition, the liquid receiving tray 8 at the left end and the right end is connected to the liquid accumulation box 5 through the corresponding liquid leakage pipeline 3. The liquid accumulation box 5 can be arranged with a liquid leakage interface 52 to communicate with the liquid leakage pipeline 3. The liquid accumulation box 5 is also mounted on the bracket 6, as shown in Figure 8 As shown, the liquid accumulation box 5 is arranged with a liquid leakage detection sensor 51. When liquid leakage occurs, the liquid receiving tray 8 receives the liquid leakage and flows to the liquid accumulation box 5 through the liquid leakage pipeline 3. The liquid leakage detection sensor 51 can detect the liquid leakage, so that the operator can know the occurrence of the liquid leakage. The liquid accumulation box 5 can be arranged at the lowest position. The liquid leakage detection sensor 51 is arranged at the lowest position, so that the liquid leakage information can be detected in time. For example, the bottom of the liquid accumulation box 5 is a flat plate and is arranged to be inclined relative to the horizontal direction. The liquid leakage detection sensor 51 is arranged at the low position of the inclination. Alternatively, the liquid accumulation box 5 is arranged in a funnel shape and the liquid leakage detection sensor 51 is arranged at the low position. In addition, the liquid accumulation box 5 can be arranged with a discharge valve. When the liquid leakage is detected and repaired, the discharge valve can be opened to discharge the liquid leakage in the liquid accumulation box 5.

[0060] Figure 8 In the second interface to the fourth interface, the pipeline is also arranged with a flow valve, and a control valve island for controlling the flow valve is arranged to automatically control the flow and interruption of the medium in the constant temperature system. The flow valve can be a pneumatic diaphragm valve 64. The flow valve can also be mounted on the bracket.

[0061] As shown in Figure 1As shown, the chamber body 11 of the loading device is covered with a cover plate 21, and the lower sides of the chamber body 11 are provided with baffles 22. The cover plate 21 and the baffles 22 can both play a protective role. Although the temperature of the chamber body 11 is reduced by cooling, in order to ensure safety and in case of failure of the cooling function, the cover plate 21 can further ensure the safety of the operator. The lower side of the chamber body 11 also has a certain temperature, and the baffles 22 are also to prevent the operator from entering the lower side of the chamber body 11, thereby ensuring safety.

[0062] As shown in Figure 3 , 5 As shown, the left and right side walls of the chamber body 11 are provided with windows, and observation windows 11e are installed. The left and right sides are adjacent to the front and rear sides, and the observation windows 11e and the windows are sealingly connected. The upper chamber and the lower chamber of the first chamber 11a and the second chamber 11b are each provided with an observation window 11e, and a total of four observation windows are provided. It can be understood that the chamber body 11 can also be divided into two or more chambers, and each chamber can be provided with an observation window 11e corresponding to the upper chamber and the lower chamber. The observation window 11e is beneficial for the operator to monitor the state of the wafer inside from the outside, as shown in Figure 1 The cover plate 21 covering the outside of the chamber body 11 also has a window corresponding to the observation window 11e. In this embodiment, the observation window assembly specifically includes a transparent observation window 11e, an observation window gasket, an observation window cover plate, and a high-temperature sealing rubber ring. The observation window 11e is connected to the chamber body 11 by inserting a fastening screw. The fastening screw can be inserted into the observation window gasket, and the high-temperature sealing rubber ring is compressed. The high-temperature sealing rubber ring is a sealing rubber ring that can ensure sealing performance at high temperatures, and the observation window cover plate is located outside the observation window.

[0063] The principles and implementation modes of the present application are described by using specific examples in this paper. The above examples are only used to help understand the method of the present application and its core idea. It should be noted that for ordinary skilled persons in the technical field, without departing from the principles of the present application, the present application can be improved and modified in several ways, and these improvements and modifications also fall within the protection scope of the claims of the present application.

Claims

1. A load apparatus provided between a wafer cassette and a vacuum process chamber, the load apparatus comprising a chamber body having a heating plate provided inside the chamber body for heating a wafer, characterized in that, A cooling channel is arranged in the wall of the chamber body, and the cooling channel is connected to a constant temperature system; The bottom wall of the chamber body is provided with an opening, and the loading device comprises a support disc sealing the opening. The heating disc is supported on the support disc, and the bottom of the heating disc is connected with a long handle which extends out of the support disc. The long handle is provided with a sleeve structure, and the top end of the sleeve structure is sealingly connected with the support disc. The bottom end of the sleeve structure is covered by a cooling module, and the bottom end of the sleeve structure and the cooling module are provided with a sealing ring. The cooling module is provided with a cooling flow channel surrounding the sealing ring, and the cooling flow channel is connected to the constant temperature system. The loading device further comprises a cooling pipeline which is connected in series with the cooling flow channel and the cooling channel to the constant temperature system.

2. The loading apparatus according to claim 1, characterized in that, The wall of the chamber body is provided with a groove, and a cooling pipe is arranged in the groove. The cooling pipe forms the cooling channel. Alternatively, the wall of the chamber body is provided with a groove, and the groove is sealed by a metal plate. The groove and the metal plate form the cooling channel.

3. The loading apparatus according to claim 2, characterized in that, The groove between the cooling pipe and the groove wall is filled with heat-conducting glue, and the groove opening is provided with heat-conducting glue to cover the cooling pipe.

4. The loading apparatus according to claim 1, characterized by The heating disc is arranged at the bottom of the chamber body, and the cooling channel is arranged at the bottom wall of the chamber body and surrounds the heating disc.

5. The loading apparatus according to claim 4, characterized in that, The chamber of the chamber body is provided with two heating discs, and the cooling channel surrounds the two heating discs.

6. The loading apparatus according to any one of claims 1 to 5, characterized in that, The liquid leakage monitoring device comprises a liquid receiving disc and a liquid accumulation box. The liquid receiving disc is arranged below the interface of the cooling pipeline and the cooling channel, and below the interface of the cooling pipeline and the cooling flow channel. The liquid accumulation box is provided with a liquid leakage detection sensor.

7. The loading apparatus according to claim 6, characterized in that, The loading device further comprises a support, and the liquid accumulation box is arranged on the support. The cooling pipeline is further connected with a flow meter and a flow valve, and the flow meter and the flow valve are arranged on the support.

8. The loading apparatus according to any one of claims 1 to 5, characterized by The side wall of the chamber body is provided with an observation window which is sealingly connected with the chamber body.

9. The loading apparatus according to any one of claims 1 to 5, characterized by The chamber body comprises one or more chambers which are divided into an upper chamber and a lower chamber. The upper chamber and the lower chamber are provided with a conveying inlet and a conveying outlet. The conveying inlet and the conveying outlet of the lower chamber are connected with a wafer box and a vacuum process chamber, respectively. The conveying inlet and the conveying outlet of the upper chamber are connected with the vacuum process chamber and the wafer box, respectively. The heating disc is arranged in the lower chamber, and the upper chamber is provided with a cover plate heating assembly at the top.

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