Printed circuit board assembly and electronic device

Abstract

This application discloses a printed circuit board assembly and an electronic device, belonging to the field of circuit board technology. The printed circuit board assembly includes a first printed circuit board and a second printed circuit board stacked together. A frame is disposed on the side of the first printed circuit board facing the second printed circuit board, and the frame forms a recessed structure. The first printed circuit board is electrically connected to the second printed circuit board through multiple solder points. The multiple solder points are disposed on a first surface of the frame facing the second printed circuit board. The multiple solder points include continuous solder points, and the continuous solder points include multiple first solder points of the same type connected together. The multiple first solder points of the same type are solder points for the same signal. Continuous pads corresponding to the position and shape of the continuous solder points are disposed on the first surface.

Description

Technical Field

[0001] This application belongs to the field of circuit board technology, specifically relating to a printed circuit board assembly and electronic device. Background Art

[0002] With the development of printed circuit board (PCB) manufacturing technology, a Z-axis stacking technology, namely Cavity technology, has emerged. This technology combines the frame board and the intermediate connecting board together. The connection solder joints between the Cavity board and other PCBs are small, saving space. However, the adhesion / stress between the Cavity board and other PCBs also changes. During a drop, the solder joints are prone to cracking, abnormal contact, and consequently, related functional failures. Summary of the Invention

[0003] The purpose of this application is to provide a printed circuit board assembly and electronic device that can solve the problem in the related art of poor adhesion between the Cavity board and other printed circuit boards, easy cracking of solder joints, and subsequent failure of related functions.

[0004] In a first aspect, embodiments of this application provide a printed circuit board assembly, the printed circuit board assembly comprising:

[0005] A first printed circuit board and a second printed circuit board are stacked together. A frame is provided on the side of the first printed circuit board facing the second printed circuit board. The frame forms a recessed structure. The first printed circuit board is electrically connected to the second printed circuit board through multiple solder points.

[0006] The plurality of solder joints are disposed on the first surface of the frame facing the second printed circuit board. The plurality of solder joints include continuous solder joints, and the continuous solder joints include a plurality of first solder joints of the same type connected together. The plurality of first solder joints of the same type are solder joints for the same signal.

[0007] The first surface is provided with continuous pads corresponding to the position and shape of the continuous solder joints.

[0008] Optionally, the number of continuous solder joints is two or more, the continuous solder joints are strip-shaped, the first surface is a hollow planar closed shape, and the plurality of continuous solder joints are distributed at intervals along the extension direction of the inner side of the first surface on the inner edge of the first surface and at intervals along the extension direction of the outer side of the first surface on the outer edge of the first surface.

[0009] Optionally, the number of continuous solder joints is two, the continuous solder joints are strip-shaped, the first surface is a hollow planar closed shape, one of the continuous solder joints is located around the inner edge of the first surface, and the other continuous solder joint is located around the outer edge of the first surface.

[0010] Optionally, a plurality of through holes are also provided on the first surface. The plurality of through holes are located in the middle region between the inner edge and the outer edge of the first surface and are spaced apart along the perimeter of the first surface.

[0011] Optionally, the plurality of solder joints may further include a plurality of independent solder joints located in the intermediate region between the inner edge and the outer edge of the first surface, wherein the two opposing sides of the continuous solder joints located at the inner edge of the first surface and the continuous solder joints located at the outer edge of the first surface are both wavy.

[0012] Optionally, there are multiple consecutive solder joints, and the orthographic projection of the consecutive solder joints onto the first surface is a closed shape. The first surface is a hollow, planar closed shape, and the multiple consecutive solder joints are spaced apart along the perimeter of the first surface.

[0013] Optionally, the plurality of solder joints may further include a plurality of independent solder joints, which are distributed in the enclosed area of ​​the continuous solder joints. The enclosed area of ​​the continuous solder joints is also provided with through holes, and the inner surface of the continuous solder joints is wavy.

[0014] Optionally, the shape of the continuous weld joint is any one of the following: strip, T-shape, Z-shape, X-shape, Y-shape, and L-shape.

[0015] Optionally, the plurality of solder joints may further include a second solder joint, wherein the continuous solder joints surround the outer periphery of the second solder joint, and the second solder joint is the solder joint of the target signal.

[0016] Optionally, the first printed circuit board and the frame are integrally formed.

[0017] Secondly, embodiments of this application provide an electronic device that includes a printed circuit board assembly as described in the first aspect.

[0018] In this embodiment, the first and second printed circuit boards stacked together are electrically connected by multiple solder joints. By connecting multiple first solder joints of the same type into a continuous solder joint, the stress condition of the solder joint can be effectively improved, thereby improving the reliability of the printed circuit board assembly. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of a stacked printed circuit board in the related technology;

[0020] Figure 2 This is a schematic diagram of another type of printed circuit board stacking in related technologies;

[0021] Figure 3This is a schematic diagram of the structure of a printed circuit board assembly provided in an embodiment of this application;

[0022] Figure 4 A schematic diagram of multiple solder joints on the first surface provided in an embodiment of this application;

[0023] Figure 5 This is one of the schematic diagrams of a continuous solder joint provided in an embodiment of this application;

[0024] Figure 6 A second schematic diagram of continuous solder joints provided in the embodiments of this application;

[0025] Figure 7 This is the third schematic diagram of a continuous solder joint provided in the embodiments of this application;

[0026] Figure 8 A fourth schematic diagram of a continuous solder joint provided in the embodiments of this application;

[0027] Figure 9 Fifth schematic diagram of a continuous solder joint provided in the embodiments of this application;

[0028] Figure 10 A schematic diagram of a continuous solder joint provided in the embodiments of this application is shown in Figure 6.

[0029] Figure 11 The seventh schematic diagram of a continuous welding process provided in this application embodiment;

[0030] Figure 12 This is the eighth schematic diagram of a continuous solder joint provided in the embodiments of this application;

[0031] Figure 13 This is the ninth schematic diagram of a continuous solder joint provided in the embodiments of this application. Detailed Implementation

[0032] The technical solutions of the embodiments of this application will be clearly described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application are within the scope of protection of this application.

[0033] The terms "first," "second," etc., used in the specification and claims of this application are used to distinguish similar objects and not to describe a specific order or sequence. It should be understood that such use of data can be interchanged where appropriate so that embodiments of this application can be implemented in orders other than those illustrated or described herein, and the objects distinguished by "first," "second," etc., are generally of the same class and the number of objects is not limited; for example, a first object can be one or more. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0034] The printed circuit board assembly and electronic device provided in this application will be described in detail below with reference to the accompanying drawings and through specific embodiments and application scenarios.

[0035] Please refer to Figure 1 , Figure 1 This is a schematic diagram of a printed circuit board stack in related technologies. For example... Figure 1 As shown, in one type of printed circuit board stacking, an RF support board 11, an intermediate connection board 12, and a main board 13 are stacked. The RF support board 11 and the main board 13 are connected through the intermediate connection board 12, meaning that both ends of the intermediate connection board 13 are soldered to the RF support board 11 and the main board 13, respectively. Multiple devices 14 are disposed on the surface of the RF support board 11 facing away from the intermediate connection board 12, and these devices 14 are covered and shielded by a shielding cover 15. Multiple devices 14 are also disposed on the surface of the main board 13 facing away from the intermediate connection board 12, and these devices 14 are covered and shielded by another shielding cover 15. On the surface of the main board 13 facing the RF support board 11, multiple devices 14 are also disposed within the area enclosed by the intermediate connection board 13. This stacking method is called a "sandwich" stacking, which can utilize the Z-axis space to reduce the planar dimensions of the printed circuit board.

[0036] Please refer to Figure 2 , Figure 2 This is a schematic diagram of another type of printed circuit board stacking in related technologies. For example... Figure 2As shown, in another printed circuit board stacking method, the RF bracket and the intermediate connection board are directly integrated to form a complete cavity board 21. A cavity (cativy) is a recessed structure formed on the surface of the printed circuit board. The cavity board 21 and the main board 23 are stacked and electrically connected by soldering. Multiple devices 24 are disposed on the surface of the cavity board 21 facing away from the main board 23, and these devices 24 are covered and shielded by a shielding cover 25. Multiple devices 24 are also disposed on the surface of the main board 23 facing away from the cavity board 21, and these devices 24 are covered and shielded by another shielding cover 25. On the surface of the main board 23 facing the cavity board 21, multiple devices 24 are also disposed within the enclosed area of ​​the cavity board 21. Compared to the "sandwich" stacking method, this stacking method has smaller solder joints, saving space. However, due to the reduced solder joint size, the amount of solder applied is also reduced, and the adhesion between the cavity board 21 and the main board 23 also changes. When dropped, the solder joints are prone to cracking, resulting in poor contact and subsequent failure of the corresponding functions.

[0037] Therefore, please refer to Figure 3 , Figure 3 This is a schematic diagram of a printed circuit board assembly provided in an embodiment of this application. Figure 3 As shown, this application embodiment provides a printed circuit board assembly, which includes a first printed circuit board 31 and a second printed circuit board 32 stacked together. A frame 311 is provided on the side of the first printed circuit board 31 facing the second printed circuit board 32, and the frame 311 encloses a recessed structure 312. Optionally, the frame 311 can be a regular shape, such as a cylinder, and the enclosed area of ​​the frame 311 is the hollow area of ​​the cylinder, which is the recessed structure 312. Alternatively, the cross-sectional shape of the frame 311 can be a hollow rectangle, and the enclosed area of ​​the frame 311 is a cube, which is the recessed structure 312. Optionally, the shape of the frame 311 can also be irregular, for example, the cross-sectional shape of the frame 311 is a hollow and irregular closed shape.

[0038] Please refer to Figure 4 , Figure 4 This is a schematic diagram of multiple solder joints on a first surface provided in an embodiment of this application. (See attached diagram.) Figure 3 and Figure 4As shown, the first printed circuit board 31 is electrically connected to the second printed circuit board 32 via multiple solder points 33. These solder points 33 are disposed on the first surface 313 of the support plate 311 facing the second printed circuit board 32. In other words, the support plate 311 of the first printed circuit board 31 and the second printed circuit board 32 are soldered together for fixation. The multiple solder points 33 include continuous solder points 331, which consist of multiple first solder points of the same type connected together. These multiple first solder points of the same type are solder points used to connect the same signal. The first surface 313 is provided with pads whose positions and shapes correspond one-to-one with the multiple solder points 33. That is, the first surface 313 is also provided with continuous pads whose positions and shapes correspond to the continuous solder points 331. These continuous pads are formed by connecting multiple originally independent first pads together, and these first pads correspond to the connection of the same signal.

[0039] In some embodiments of this application, optionally, the first printed circuit board 31 and the frame board 311 are integrally formed, and the two can correspond to Figure 2 In the case of cavity boards, the first printed circuit board 31's frame 311 is a bone frame board, that is, the frame board 311 is in the shape of a bone protrusion.

[0040] In some other embodiments of this application, optionally, the first printed circuit board 31 and the frame 311 are separately disposed, and the two end faces of the frame 311 are electrically connected to the first printed circuit board 31 and the second printed circuit board 32 respectively through a plurality of first solder points 33, that is, corresponding to Figure 1 Stacking style in [the context of the text].

[0041] Compared to the existing technology where each solder joint is set independently, this embodiment of the application connects multiple originally independent solder pads into a continuous solder pad, which effectively increases the amount of solder applied to the continuous solder pad during soldering. Furthermore, by connecting multiple first solder joints of the same type into a single unit during soldering, the stress at the soldering position is effectively improved, thereby enhancing the connection strength between the first printed circuit board 31 and the second printed circuit board 32. This reduces the probability of the solder joints between the first printed circuit board 31 and the second printed circuit board 32 breaking during a drop or impact, and improves the reliability of the printed circuit board assembly.

[0042] Therefore, in this embodiment of the application, the first printed circuit board 31 and the second printed circuit board 32 stacked together are electrically connected by a plurality of solder joints 33. By connecting a plurality of first solder joints of the same type among the plurality of solder joints 33 into a continuous solder joint 331, the stress condition of the solder joint can be effectively improved, thereby improving the reliability of the printed circuit board assembly.

[0043] Please refer to Figure 5 , Figure 5This is one of the schematic diagrams of a continuous solder joint provided in an embodiment of this application. For example... Figure 5 As shown, in some embodiments of this application, the number of consecutive solder joints 331 is two or more, the consecutive solder joints 331 are strip-shaped, and the first surface 313 of the frame 311 on the first printed circuit board 31 is a hollow planar closed shape. The planar closed shape can be a regular shape, such as a ring, a hollow rectangle, etc. Optionally, the planar closed shape can also be an irregular shape. The first surface 313 includes an inner side and an outer side, and the enclosed area of ​​its inner side is the hollow part of the first surface 313. The multiple consecutive solder joints 331 are distributed at intervals along the extension direction of the inner side of the first surface 313 on the inner edge of the first surface 313, and are distributed at intervals along the extension direction of the outer side of the first surface 313 on the outer edge of the first surface 313.

[0044] Therefore, multiple continuous solder joints 331 are arranged in segments on the inner and outer edges of the soldering surface (i.e., the first surface 313). This allows the continuous solder joints 331 to absorb stress, thereby reducing the stress value at the location of the continuous solder joints 331 and improving the connection strength. Furthermore, since the continuous solder joints 331 are arranged at intervals, the flux used during the soldering process can be released from the gap 34 between two adjacent continuous solder joints 331, thereby reducing the probability of solder migration on the solder pads and ensuring the quality of the finished product.

[0045] In some embodiments of this application, the plurality of solder points 33 further include a plurality of independent solder points 332, which are located in the middle region between the inner and outer sides of the first surface 313. Furthermore, the two opposing sides of the continuous solder points 331 located on the inner edge of the first surface 313 and the continuous solder points 331 located on the outer edge of the first surface 313 are both wavy. That is, the side of the continuous solder points 331 located on the inner edge of the first surface 313 facing the continuous solder points 331 located on the outer edge of the first surface 313 is wavy, and the side of the continuous solder points 331 located on the outer edge of the first surface 313 facing the continuous solder points 331 located on the inner edge of the first surface 313 is also wavy. Since the multiple independent solder points 332 located in the middle area are usually circular, the wavy side of the continuous solder point 331 can ensure that the gaps 34 between the multiple independent solder points 332 adjacent to the continuous solder point 331 and the continuous solder point 331 are all the same. This allows the multiple independent solder points 332 to be designed with consistent dimensions, making their positions easier to set and reducing the possibility of accidental contact between the independent solder points 332 and the continuous solder point 331.

[0046] In some embodiments, among the plurality of independent solder points 332 adjacent to the wavy side of the continuous solder point 331, each independent solder point 332 is directly opposite a recessed portion of the wavy side to ensure that the gap 34 between the plurality of independent solder points 332 adjacent to the continuous solder point 331 and the continuous solder point 331 is the same.

[0047] Please refer to Figure 6 , Figure 6 This is a second schematic diagram of continuous solder joints provided in an embodiment of this application. For example... Figure 6 As shown, in some other embodiments of this application, the number of continuous solder joints 331 is two. The continuous solder joints 331 are strip-shaped, and the first surface 313 is a hollow planar closed shape. The planar closed shape can be a regular shape, such as a ring, a hollow rectangle, etc. Optionally, the planar closed shape can also be an irregular shape. The first surface 313 includes an inner edge and an outer edge. The area enclosed by its inner edge is the hollow part of the first surface 313. One continuous solder joint 331 is arranged around the inner edge of the first surface 313, and the other continuous solder joint 331 is arranged around the outer edge of the first surface 313. For example, one continuous solder joint 331 is arranged along the extension direction of the inner edge of the first surface 313 and connected end to end to form a circle, and the other continuous solder joint 331 is arranged along the extension direction of the outer edge of the first surface 313 and connected end to end to form a circle.

[0048] Thus, the two continuous weld points 331 are arranged in a ring on the inner and outer edges of the welding surface (i.e., the first surface 313), thereby absorbing stress and reducing the stress value at the location of the continuous weld points 331, thus improving the connection strength.

[0049] In some embodiments of this application, a plurality of through holes 35 are also provided on the first surface 313. These through holes 35 are located in the intermediate region between the inner and outer edges of the first surface 313 and are spaced apart along the circumference of the first surface 313, or in other words, spaced apart along the length of the first surface 313. Flux used during soldering can be released from the spaced through holes 35, thereby reducing the probability of solder migration from the pads and ensuring the quality of the finished product. Of course, the through holes 35 can also be provided on the second printed circuit board 32 in the region directly opposite the first surface 313, achieving the same effect.

[0050] In some embodiments of this application, the plurality of solder points 33 further include a plurality of independent solder points 332, which are located in the middle region between the inner and outer sides of the first surface 313. Furthermore, the two opposing sides of the continuous solder points 331 located on the inner edge of the first surface 313 and the continuous solder points 331 located on the outer edge of the first surface 313 are both wavy. That is, the side of the continuous solder points 331 located on the inner edge of the first surface 313 facing the continuous solder points 331 located on the outer edge of the first surface 313 is wavy, and the side of the continuous solder points 331 located on the outer edge of the first surface 313 facing the continuous solder points 331 located on the inner edge of the first surface 313 is also wavy. Since the multiple independent solder points 332 located in the middle area are usually circular, the wavy side of the continuous solder point 331 can ensure that the gaps 34 between the multiple independent solder points 332 adjacent to the continuous solder point 331 and the continuous solder point 331 are all the same. This allows the multiple independent solder points 332 to be designed with consistent dimensions, making their positions easier to set and reducing the possibility of accidental contact between the independent solder points 332 and the continuous solder point 331.

[0051] In some embodiments, among the plurality of independent solder points 332 adjacent to the wavy side of the continuous solder point 331, each independent solder point 332 is directly opposite a recessed portion of the wavy side to ensure that the gap 34 between the plurality of independent solder points 332 adjacent to the continuous solder point 331 and the continuous solder point 331 is the same.

[0052] Please refer to Figure 7 and Figure 8 , Figure 7 This is the third schematic diagram of a continuous solder joint provided in the embodiments of this application. Figure 8 This is the fourth schematic diagram of a continuous solder joint provided in an embodiment of this application. Figure 7 , Figure 8 As shown, in some embodiments of this application, the plurality of solder joints 33 further include second solder joints 333, and continuous solder joints 331 are located on the outer periphery of the second solder joints 333. The second solder joints 333 are solder joints for the target signal. That is, the target signal is an important signal, and the second solder joints 333 are solder joints for the important signal line. By forming a continuous solder joint 331 by integrating the plurality of first solder joints around the second solder joint 333, stress is further absorbed, thereby improving the stress condition of the internal solder joints. Optionally, the continuous solder joints 331 located on the outer periphery of the second solder joint 333 are grounded solder joints to avoid interfering with the target signal on the second solder joint 333.

[0053] like Figure 7 , Figure 8 As shown, the continuous solder joint 331 in this embodiment is... Figure 6Based on the shape of the continuous solder joint 331, the first solder joints of the same type inside are further connected into a whole, thereby further improving the stress situation.

[0054] Please refer to Figure 9 , Figure 9 This is the fifth schematic diagram of a continuous solder joint provided in an embodiment of this application. Figure 9 As shown, in some other embodiments of this application, the number of consecutive solder joints 331 is multiple. The orthographic projection of the consecutive solder joints 331 onto the first surface 313 is a closed shape. This closed shape can be a regular shape, such as a triangle, rectangle, ellipse, pentagon, etc., or it can be an irregular shape, as long as it forms a circle. The first surface 313 is a hollow planar closed shape. This planar closed shape can be a regular shape, such as a ring, a hollow rectangle, etc. Optionally, this planar closed shape can also be an irregular shape. The multiple consecutive solder joints 331 are spaced apart along the perimeter of the first surface 313, or in other words, spaced apart along the length extension direction of the first surface 313.

[0055] As a result, multiple continuous weld points 331 are arranged in a fully enclosed and spaced manner on the welding surface (i.e., the first surface 313), so that the continuous weld points 331 can absorb stress, thereby reducing the stress value at the location of the continuous weld points 331 and improving the connection strength.

[0056] In some embodiments of this application, the plurality of solder joints 33 further include a plurality of independent solder joints 332, which are distributed within a closed area (i.e., a hollow portion) enclosed by each consecutive solder joint 331. Each consecutive solder joint 331 also has at least one through-hole 35 within its closed area. Flux used during soldering can be released from the spaced through-holes 35, thereby reducing the probability of solder migration from the solder pads and ensuring the quality of the finished product. Alternatively, the through-holes 35 can also be located on the second printed circuit board 32 in an area directly opposite the first surface 313, achieving the same effect.

[0057] In some embodiments, the inner surface of the continuous solder joint 331 is optionally wavy. Since the multiple independent solder joints 332 located in the enclosed area are generally circular, the wavy inner surface of the continuous solder joint 331 can ensure that the gaps 34 between the multiple independent solder joints 332 adjacent to the continuous solder joint 331 and the continuous solder joint 331 are all the same. This allows the multiple independent solder joints 332 to be designed with consistent dimensions, making their positions easier to set and reducing the possibility of accidental contact between the independent solder joints 332 and the continuous solder joint 331.

[0058] In some embodiments, among the plurality of independent solder points 332 adjacent to the wavy inner side of the continuous solder point 331, each independent solder point 332 is directly opposite a recessed portion of the wavy inner side to ensure that the gap 34 between the plurality of independent solder points 332 adjacent to the continuous solder point 331 and the continuous solder point 331 is the same.

[0059] Please refer to Figure 10 , Figure 10 This is a sixth schematic diagram of a continuous solder joint provided as an embodiment of this application. Figure 10 As shown, in some embodiments of this application, the plurality of solder joints 33 further include a second solder joint 333, and a continuous solder joint 331 surrounds the outer periphery of the second solder joint 333. The second solder joint 333 is a solder joint for the target signal. That is, the target signal is an important signal, and the second solder joint 333 is a solder joint for the important signal line. By forming a continuous solder joint 331 by integrating the plurality of first solder joints around the second solder joint 333, stress is further absorbed, thereby improving the stress condition of the internal solder joints. Optionally, the continuous solder joint 331 located on the outer periphery of the second solder joint 333 is a grounded solder joint to avoid interfering with the target signal on the second solder joint 333.

[0060] like Figure 10 As shown, the continuous solder joint 331 in this embodiment is... Figure 9 Based on the shape of the continuous solder joint 331, the first solder joints of the same type inside are further connected into a whole, thereby further improving the stress situation.

[0061] Please refer to Figures 11 to 13 , Figure 11 This is the seventh schematic diagram of a continuous welding process provided in the embodiments of this application. Figure 12 This is the eighth schematic diagram of a continuous solder joint provided in the embodiments of this application. Figure 13 This is the ninth schematic diagram of a continuous solder joint provided in an embodiment of this application. In some embodiments of this application, the shape of the continuous solder joint 331 can optionally be any one of a strip shape, T-shape, Z-shape, X-shape, Y-shape, or L-shape. By connecting multiple originally independent solder pads into a continuous solder pad, the amount of solder applied to the continuous solder pad is effectively increased during soldering. Furthermore, by connecting multiple first solder joints of the same type into a single unit during soldering, the stress at the soldering position is effectively improved, thereby enhancing the connection strength between the first printed circuit board 31 and the second printed circuit board 32. This reduces the probability of the solder joint between the first printed circuit board 31 and the second printed circuit board 32 breaking during a drop impact, thus improving the reliability of the printed circuit board assembly. Figure 11 As shown, the continuous solder joint 331 is X-shaped, as... Figure 12 As shown, the continuous solder joint 331 is in an inverted T-shape, as... Figure 13As shown, the continuous solder joints 331 are Z-shaped. Of course, the shape of the continuous solder joints 331 in this embodiment is not limited to the above shape, and can also be other regular or irregular shapes.

[0062] In summary, in the embodiments of this application, the first and second printed circuit boards stacked together are electrically connected by multiple solder joints. By connecting multiple first solder joints of the same type among the multiple solder joints into a continuous solder joint, the stress condition of the solder joints can be effectively improved, thereby improving the reliability of the printed circuit board assembly.

[0063] Another embodiment of this application also provides an electronic device that includes the printed circuit board assembly as described in the above embodiments and can achieve the same technical effect. To avoid repetition, it will not be described again here.

[0064] In this embodiment, the electronic device can be a terminal or other devices besides a terminal. For example, the electronic device can be a mobile phone, tablet computer, laptop computer, PDA, in-vehicle electronic device, mobile internet device (MID), augmented reality (AR) / virtual reality (VR) device, robot, wearable device, ultra-mobile personal computer (UMPC), netbook, or personal digital assistant (PDA), etc. It can also be a server, network attached storage (NAS), personal computer (PC), television set (TV), ATM, or self-service machine, etc. This embodiment does not specifically limit the specific type of electronic device.

[0065] It should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element. Furthermore, it should be noted that the scope of the methods and apparatuses in the embodiments of this application is not limited to performing functions in the order shown or discussed, but may also include performing functions substantially simultaneously or in the reverse order, depending on the functions involved. For example, the described methods may be performed in a different order than described, and various steps may be added, omitted, or combined. Additionally, features described with reference to certain examples may be combined in other examples.

[0066] Through the above description of the embodiments, those skilled in the art can clearly understand that the methods of the above embodiments can be implemented by means of software plus necessary general-purpose hardware platforms. Of course, they can also be implemented by hardware, but in many cases the former is a better implementation method. Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, can be embodied in the form of a computer software product. This computer software product is stored in a storage medium (such as ROM / RAM, magnetic disk, optical disk) and includes several instructions to cause a terminal (which may be a mobile phone, computer, server, or network device, etc.) to execute the methods described in the various embodiments of this application.

[0067] The embodiments of this application have been described above with reference to the accompanying drawings. However, this application is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of this application without departing from the spirit and scope of the claims, and all of these forms are within the protection scope of this application.

Claims

1. A printed circuit board assembly, characterized in that, The device includes a first printed circuit board and a second printed circuit board stacked together. A frame is provided on the side of the first printed circuit board facing the second printed circuit board, and the frame is arranged to form a recessed structure. The first printed circuit board is electrically connected to the second printed circuit board through multiple solder points, and the multiple solder points are provided on the first surface of the frame facing the second printed circuit board. The plurality of solder joints includes continuous solder joints, and the continuous solder joints include a plurality of first solder joints of the same type connected together, wherein the plurality of first solder joints of the same type are solder joints of the same signal; The first surface is provided with continuous pads corresponding to the position and shape of the continuous solder joints; The number of continuous solder joints is two, and the continuous solder joints are strip-shaped. The first surface is a hollow, closed planar shape. One of the continuous solder joints is located around the inner edge of the first surface, and the other continuous solder joint is located around the outer edge of the first surface. The plurality of solder joints also include a plurality of independent solder joints, which are located in the middle region between the inner edge and the outer edge of the first surface. The two opposing sides of the continuous solder joints located on the inner edge of the first surface and the continuous solder joints located on the outer edge of the first surface are both wavy. or, The number of continuous solder joints is multiple, and the orthographic projection of the continuous solder joints on the first surface is a closed shape. The first surface is a hollow planar closed shape, and the multiple continuous solder joints are spaced apart along the perimeter of the first surface. The plurality of solder joints also includes a plurality of independent solder joints, which are distributed in the enclosed area of ​​the continuous solder joints. The enclosed area of ​​the continuous solder joints is also provided with through holes, and the inner surface of the continuous solder joints is wavy.

2. The printed circuit board assembly according to claim 1, characterized in that, The first surface is also provided with a plurality of through holes, which are located in the middle region between the inner edge and the outer edge of the first surface and are spaced apart along the perimeter of the first surface.

3. The printed circuit board assembly according to claim 1, characterized in that, The first printed circuit board and the frame board are integrally formed.

4. The printed circuit board assembly according to claim 1, characterized in that, The plurality of solder joints also includes a second solder joint, the continuous solder joints surrounding the outer periphery of the second solder joint, the second solder joint being the solder joint for the target signal.

5. An electronic device, characterized in that, Includes the printed circuit board assembly as described in any one of claims 1-4.

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