Wafer pre-alignment apparatus and method

Abstract

An apparatus includes: a base, a driving device disposed on the base, a sensor unit disposed on the base, and an engaging device. The driving device has an output shaft, the output shaft has a wafer receiving surface, and the driving device is configured to rotate the output shaft around a rotation axis. The sensor unit is configured to sense a wafer received on the wafer receiving surface. The engaging device is configured to engage and disengage a translation mechanism between the driving device and the sensor unit. When the engaging device engages the translation mechanism, the rotation of the output shaft around the rotation axis by means of the driving device changes the relative positional relationship between the sensor unit and the rotation axis.

Description

Technical Field

[0001] The present invention relates to semiconductor wafer processing. Background Art

[0002] Before performing various processing operations on a semiconductor wafer, it is necessary to determine the orientation of the semiconductor wafer. Some methods for identifying the orientation of the wafer may include providing notches on the periphery of the wafer and rotating the wafer using a device so that the notches can be detected by a sensor to determine that the wafer is oriented in a desired orientation. Summary of the invention

[0003] The present disclosure advantageously provides a device comprising: a base; a driving device arranged on the base, the driving device having an output shaft, the output shaft having a wafer receiving surface, the driving device being configured to rotate the output shaft around a rotation axis; a sensor unit arranged on the base, the sensor unit being configured to sense a wafer received on the wafer receiving surface; and a coupling device configured to engage and disconnect a translation mechanism between the driving device and the sensor unit, wherein when the coupling device engages the translation mechanism, the rotation of the output shaft around the rotation axis by means of the driving device changes the relative position relationship between the sensor unit and the rotation axis.

[0004] The present disclosure also advantageously provides an apparatus comprising: a base; a driving device disposed on the base, the driving device having an output shaft, the output shaft having a wafer receiving surface, the driving device being configured to rotate the output shaft around a rotation axis; a sensor unit disposed on the base, the sensor unit being configured to sense a wafer received on the wafer receiving surface; and a bracket slidably coupled to the base, the sensor unit being mounted on the bracket; and an engaging device configured to engage and disconnect a coupling member between the driving device and the bracket, wherein, when the engaging device engages the coupling member, the rotation of the output shaft around the rotation axis caused by the driving device changes the relative positional relationship between the sensor unit and the rotation axis.

[0005] The present disclosure further advantageously provides a method, which includes: providing an apparatus, the apparatus including: a base; a driving device disposed on the base, the driving device having an output shaft, the output shaft having a wafer receiving surface, the driving device configured to rotate the output shaft around a rotation axis; a sensor unit disposed on the base, the sensor unit configured to sense a wafer received on the wafer receiving surface; and an engaging device configured to engage and disconnect a translation mechanism between the driving device and the sensor unit, and rotate the output shaft around the rotation axis by the driving device to change the relative position relationship between the sensor unit and the rotation axis; and disconnect the translation mechanism between the driving device and the sensor unit, and rotate the output shaft around the rotation axis by the driving device to rotate the wafer on the wafer receiving surface. BRIEF DESCRIPTION OF THE DRAWINGS

[0006] A more complete understanding of the present invention and many of its attendant advantages will become apparent by reference to the following detailed description, particularly when considered in conjunction with the accompanying drawings, in which:

[0007] Figure 1 is a front left perspective view of a wafer pre-alignment apparatus according to an embodiment of the present invention;

[0008] Figure 2 yes Figure 1 A top plan view of the wafer pre-alignment apparatus shown, wherein the outer housing is shown as transparent;

[0009] Figure 3 yes Figure 1 A front elevation view of the wafer pre-alignment apparatus is shown, wherein the outer housing is shown as transparent;

[0010] Figure 4 It is along Figure 3 A cross-sectional view of the wafer pre-alignment apparatus taken along line 4--4 in FIG.

[0011] Figure 5 yes Figure 1 A left side elevation view of the wafer pre-alignment apparatus is shown, wherein the outer housing is shown as transparent;

[0012] Figure 6 It is along Figure 5 A cross-sectional view of the wafer pre-alignment apparatus taken along line 6--6 in FIG.

[0013] Figure 7 yes Figure 1 A bottom elevation view of the wafer pre-alignment apparatus is shown, with the outer housing shown as transparent;

[0014] Fig. 8A is a bottom view schematically showing the rotating member and the base plate of the wafer pre-alignment device when the base plate is in the first position, and Figure 8B When the base plate is in the second position Fig. 8A A bottom view of the rotating member and the bottom plate;

[0015] Fig. 9 is a bottom schematic view of a rotating member and a base plate of a wafer pre-alignment apparatus according to an alternative embodiment;

[0016] Fig. 10A is a bottom view of a rotating member and a base plate of a wafer pre-alignment apparatus according to another alternative embodiment when the base plate is in a first position, and Fig. 10B When the base plate is in the second position Fig. 10A A bottom view of the rotating member and the bottom plate;

[0017] Fig.11Ais a bottom view of a rotating member and a base plate of a wafer pre-alignment apparatus according to yet another alternative embodiment, when the base plate is in a first position, and Fig. 11B When the base plate is in the second position Fig.11A A bottom view of the rotating member and the bottom plate;

[0018] Fig.12 is a bottom view schematically showing a rotating member and a base plate of a wafer pre-alignment apparatus according to yet another alternative embodiment;

[0019] Fig.13 An embodiment of a clutch is shown, the clutch being configured to engage and disengage power transmission from rotation of an output shaft of a drive device to rotation of a rotating member, and to engage and disengage power transmission from rotation of an output shaft of the drive device to a linear member engaged with the rotating member; and

[0020] Fig.14 is a schematic diagram of a computer that may implement an embodiment of the pre-alignment apparatus of the present invention. DETAILED DESCRIPTION

[0021] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. In the following description, constituent elements having substantially the same function and arrangement are denoted by the same reference numerals, and repeated description will be made only when necessary.

[0022] A semiconductor wafer pre-alignment apparatus is described herein that advantageously accommodates a variety of semiconductor wafer diameters.

[0023] Semiconductor wafers may be provided with notches or marks which can be used to identify the orientation of the wafer in order to ensure that the wafer is in the desired orientation for processing. For example, a single notch may be provided on the periphery of the wafer. If a pre-alignment device is provided with a wafer stage that supports and rotates the wafer, and a fixed read head that scans the edge of the wafer as the wafer rotates, such a device has significant disadvantages. For such a device, the sensor range of the read head may be only 20 mm, so the sensor must be radially positioned for wafers of different diameters.

[0024] The semiconductor wafer pre-alignment apparatus described herein advantageously uses the same motor to rotate the wafer and radially move the read head to allow for use with wafers of different sizes. In one embodiment of the apparatus, when the apparatus requires radial movement of the read head, an actuator (such as a cylinder or solenoid) drives a rack gear linearly toward a rotating gear. The rotating gear is rigidly attached to the rotating motor. Once engaged, the motor can drive the rack and read head to the appropriate radial position.

[0025] Figure 1The apparatus 100 is shown, which can be used, for example, as a semiconductor wafer alignment apparatus to align semiconductor wafers for inspection and / or processing. The apparatus 100 can be advantageously used with semiconductor wafers having various diameters, such as Figure 1 As shown in the concentric circles 10.

[0026] The apparatus 100 includes a base 200 , a driving device 300 , a sensor unit 400 , and an engaging device 600 .

[0027] Figure 1 The illustrated base 200 includes a housing (or outer housing) 210, which includes an upper wall 212, a lower wall 214, a first side wall 216, a second side wall 218, a third side wall 220, and a fourth side wall 222. The upper wall 212 includes an opening 224 through which a portion of the drive device 300 extends. The upper wall 212 also includes a slot 226 through which a portion of the sensor unit 400 extends. The slot 226 allows relative movement between the sensor unit 400 and the drive device 300. The base 200 can be mounted to a support in a fixed manner (e.g., by fixing the base 200 relative to the floor of the manufacturing facility), or in a movable manner (e.g., by mounting the base 200 on a movable stage that can provide movement along the X-axis, Y-axis, and Z-axis relative to the floor using a drive motor). The base 200 can be mounted by mounting the lower wall 214 to the support, or by mounting one of the other walls of the housing 210 to the support.

[0028] The drive device 300 is disposed on the base 200. The drive device 300 has an output shaft 302 having a wafer platform 304 mounted to a distal end 303 of the output shaft 302. The wafer platform 304 has a wafer receiving surface 306 configured to receive a semiconductor wafer. The wafer receiving surface 306 supports the wafer (see circle 10) and may be provided with a surface material that provides friction between the wafer and the wafer receiving surface 306 to prevent the wafer from moving relative to the wafer receiving surface 306. Alternatively, or in addition to the surface material, the wafer receiving surface 306 may be provided with a suction hole, and the wafer platform 304 may be provided with a suction device to hold the wafer on the wafer receiving surface 306 to prevent the wafer from moving relative to the wafer receiving surface 306. The wafer platform 304 may be fixed to the distal end 303 of the output shaft 302 so that the wafer platform 304 does not rotate relative to the output shaft 302. Alternatively, the wafer platform 304 can be coupled to the distal end 303 so that the wafer platform 304 can selectively rotate or not rotate relative to the output shaft 302, such as using a clutch configured to engage and disengage the transmission of rotation of the output shaft 302 to the rotation of the wafer platform 304.

[0029] The drive device 300 is configured to rotate the output shaft 302 around the rotation axis 302a. The drive device 300 may be, for example, an electric motor. The drive device 300 includes a housing 310 mounted to the housing 210. Figure 1-Figure 4 In the illustrated embodiment, the housing 310 is fixedly mounted to the upper wall 212; however, the housing 310 may alternatively be mounted to another wall of the housing 210 of the base 200. The drive device 300 includes a stator 312 mounted in a fixed relationship to the housing 310 and a rotor 314 that rotates relative to the stator 312. The rotor 314 is supported by a rotation support 315 via a bearing 316, and the rotation support 315 is mounted in a fixed relationship to the housing 310. The output shaft 302 is part of the rotor 314 or is connected to the rotor 314, so that rotation of the rotor 314 causes the output shaft 302 to rotate about the rotation axis 302a.

[0030] The output shaft 302 includes a lower portion 318 having a lower end 320. A rotational member 322 is coupled to the lower end 320 of the output shaft 302. The rotational member 322 may be fixed to the lower end 320 such that the rotational member 322 does not rotate relative to the output shaft 302. Alternatively, the rotational member 322 may be coupled to the lower end 320 such that the rotational member 322 may selectively rotate or not rotate relative to the output shaft 302, for example using a clutch configured to engage and disengage the transmission of the rotation of the output shaft 302 to the rotational member 322.

[0031] The sensor unit 400 is disposed on the base 200. The sensor unit 400 is configured to sense a wafer received on the wafer receiving surface 306. The sensor unit 400 includes a read head 402 having an optical sensor 404 directed toward the upper surface of the wafer in the -Z direction (see, e.g., Figure 3 and Figure 6 ), the optical sensor 404 can sense the wafer within a sensing area 406, such as the edge of the wafer or a mark / notch formed thereon, so as to align the semiconductor wafer for inspection and / or processing. The read head 402 is mounted to a support member 408 that extends from within the housing 210 through the slot 226.

[0032] The apparatus 100 includes a translation mechanism 500 between the drive device 300 and the sensor unit 400. The translation mechanism 500 includes a bracket 410 that is slidably coupled to the base 200, and the sensor unit 400 is mounted on the bracket 410 via a support member 406 that is mounted to the bracket 410. Figure 1-Figure 7In the illustrated embodiment, the housing 310 of the drive device 300 is mounted to the housing 210 of the base 200, and the first sliding members 330 and 332 are mounted to opposite outer surfaces of the housing 310. Alternatively, the first sliding members 330 and 332 may be mounted directly to the wall of the housing 210. The bracket 410 includes second sliding members 412 and 414 fixed thereto. The second sliding members 412 and 414 are slidably supported by the first sliding members 330 and 332, respectively, to allow the bracket 410 to slide along the X-axis. Figure 1-Figure 7 In the illustrated embodiment, the first sliding members 330 and 332 respectively have grooves 331 and 333 extending longitudinally along the X-axis, and the second sliding members 412 and 414 are slide rails respectively arranged in the grooves 331 and 333; however, alternatively, the second sliding members 412 and 414 can be provided with grooves extending longitudinally along the X-axis, and the first sliding members 330 and 332 can be slide rails arranged in the grooves.

[0033] The translation mechanism 500 also includes a rotation member 322 coupled to the output shaft 302 and a linear member 440 connected to the bracket 410. Figure 1-Figure 7 In the embodiment of the present invention, the linear member 440 is a rack having a linear arrangement of teeth 441. The linear member 440 is mounted on a base plate 442, and the base plate 442 is mounted to the second sliding members 412 and 414 through flexures 450 and 460, respectively. Therefore, the linear member 440 is connected to the bracket 410 via the base plate 442 and the flexures 450 and 460. The upper ends 452 and 462 of the flexures 450 and 460 are fixedly mounted to the second sliding members 412 and 414, and the lower ends 454 and 464 of the flexures 450 and 460 are fixedly mounted to the opposite sides of the base plate 442. The flexures 450 and 460 are flexible elements that can bend when a cantilever force is applied to the lower ends 454 and 464 around the fixed upper ends 452 and 462. The bracket 410, the base plate 442, and the flexures 450 and 460 form a four-bar linkage structure.

[0034] The engaging device 600 is configured to engage and disengage the translation mechanism 500 between the driving device 300 and the sensor unit 400, so that when the engaging device 600 engages the translation mechanism, the rotation of the output shaft 302 around the rotation axis 302a by means of the driving device 300 changes the relative positional relationship between the sensor unit 400 and the rotation axis 302a, thereby changing the relative positional relationship between the sensor unit 400 and the wafer receiving surface 306. In addition, when the engaging device 600 disengages the translation mechanism 500, the rotation of the output shaft 302 around the rotation axis 302a by means of the driving device 300 does not change the relative positional relationship between the sensor unit 400 and the rotation axis 302a.

[0035] The engagement device 600 includes an actuator 602 configured to move the linear member 440 to make it contact with the outer peripheral surface 324 of the rotating member 322 to engage the linear member 440 with the rotating member 322. Figure 1-Figure 7 In the illustrated embodiment, the actuator 602 is configured to move the linear member 440 into contact with the outer peripheral surface 324 of the rotating member 322 so that the teeth 441 of the linear member 440 engage with the teeth 326 on the outer peripheral surface 324 of the rotating member 322 .

[0036] exist Figure 1-Figure 7 In the illustrated embodiment, the actuator 602 is a cylinder 610 that extends a piston rod 612 along the Y axis when actuated. The actuator 600 may alternatively be a solenoid. When the cylinder 610 is not actuated, the piston rod 612 is retracted along the Y axis by an internal biasing member such as a spring. The cylinder 610 has a first end 611 with a support member 613, which connects the first end 611 to a bracket 614. The bracket 614 is mounted to the bracket 410 to maintain the first end 611 of the cylinder in a fixed relationship with the bracket 410. The piston rod 612 has a coupling member 616 mounted to its terminal end. The coupling member 616 extends and retracts along the Y axis with the movement of the piston rod 612. The coupling member 616 is coupled to a connecting member 620 by a pin 618, and the connecting member 620 is fixedly mounted to the bottom plate 442.

[0037] Actuation of the actuator 602 bends the flexure members 450 and 460 to move the linear member 440 into contact with the outer peripheral surface 324 of the rotating member 322, thereby engaging the linear member 440 with the rotating member 322. When the actuator 602 is actuated, the cylinder 610 extends the piston rod 612 along the Y-axis, thereby moving the coupling member 616 along the Y-axis, which pushes the base plate 442 via the pin 618 and the connecting member 620, thereby bending the flexure members 450 and 460 and moving the linear member 440 mounted to the base plate 442. Therefore, actuation of the actuator 602 moves the linear member 440 from the disconnected position in which the teeth 441 of the linear member 440 are not engaged with the teeth 326 of the rotating member 322 to the engaged position in which the teeth 441 of the linear member 440 are engaged with the teeth 326 of the rotating member 322 (i.e., engaged with the teeth 326 of the rotating member 322). When actuation of the actuator 602 is stopped, the cylinder 610 retracts the piston rod 612 along the Y-axis (e.g., by the force of the internal biasing member), thereby moving the coupling member 616 along the Y-axis, which pulls the base plate 442 via the pin 618 and the connecting member 620, thereby allowing the flexure members 450 and 460 to straighten and move the linear member 440 mounted to the base plate 442. The stopping of the actuation moves the linear member 440 from the engaged position in which the teeth 441 of the linear member 440 engage the teeth 326 of the rotating member 322 (i.e., engage with the teeth 326 of the rotating member 322) to the disengaged position in which the teeth 441 of the linear member 440 do not engage with the teeth 326 of the rotating member 322.

[0038] For example, the amount of bending or deflection of the flexure members 450 and 460 may be determined based on the distance required to move between the engaged and disengaged states of the teeth 441 and 326 (e.g., based on the height of the teeth 441 of the linear member 440 and the height of the teeth 326 of the rotating member 322) and a predetermined gap distance. In embodiments where teeth are not present and frictional engagement is used, the amount of bending or deflection of the flexure members 450 and 460 may be determined, for example, based on a predetermined gap distance.

[0039] When the linear member 440 is engaged with the rotating member 322 (i.e., when the linear member 440 is in an engaged position where the teeth 441 of the linear member 440 are engaged with the teeth 326 of the rotating member 322), the rotation of the output shaft 302 by means of the driving device 300 causes the rotating member 322 to rotate, which causes the teeth 326 of the rotating member 322 to drive the teeth 441 of the linear member 440 in the direction along the X-axis. Therefore, the linear member 440, the base plate 442, the flexures 450 and 460, and the bracket 410 are driven in the direction along the X-axis, so that the second sliding members 412 and 414 slide along the first sliding members 330 and 332, respectively, to allow the bracket 410 and the sensor unit 400 to slide in the direction along the X-axis. Therefore, when the linear member 440 is engaged with the rotating member 322, the rotation of the output shaft 302 by the driving device 300 in the clockwise and counterclockwise directions will cause the translational movement of the sensor unit 400 along the X-axis to change the relative positional relationship between the sensor unit 400 and the rotation axis 302a by moving the sensor unit 400 closer to or farther away from the rotation axis 302a, thereby changing the relative positional relationship between the sensor unit 400 and the wafer receiving surface 306. The change in the relative positional relationship between the sensor unit 400 and the rotation axis 302a allows the apparatus 100 to be used with semiconductor wafers of various different diameters, so that the relative positional relationship between the sensor unit 400 and the rotation axis 302a can be adjusted so that the sensing area 406 of the optical sensor 404 can be aligned with the outer edge area of ​​the wafer. Therefore, the sensor unit 400 and the rotation axis 302a can be adjusted to be closer to each other for wafers with smaller diameters, and the sensor unit 400 and the rotation axis 302a can be adjusted to be farther away from each other for wafers with larger diameters.

[0040] In contrast, when the linear member 440 is disconnected from the rotating member 322 (i.e., when the linear member 440 is in a disconnected position where the teeth 441 of the linear member 440 are not engaged with the teeth 326 of the rotating member 322), then the rotation of the output shaft 302 by means of the driving device 300 will not cause the teeth 326 of the rotating member 322 to drive the teeth 441 of the linear member 440 in the direction along the X-axis. Therefore, when the linear member 440 is disconnected from the rotating member 322, the rotation of the output shaft 302 in the clockwise and counterclockwise directions by means of the driving device 300 will not cause the translational movement of the sensor unit 400 along the X-axis, and thus will not change the relative positional relationship between the sensor unit 400 and the rotation axis 302a. Therefore, when the linear member 440 is disconnected from the rotating member 322, the apparatus 100 can be used to perform alignment of semiconductor wafers for inspection and / or processing by rotating the wafer using the driving device 300 and scanning the wafer in the sensing area 406 by the optical sensor 404.

[0041] exist Figure 1-Figure 7 In the illustrated embodiment, the engagement device 600 is configured to engage and disengage the coupling member 550 between the drive device 300 and the bracket 410. The coupling member 550 includes a rotating member 322 and a linear member 440. When the rotating member 322 and the linear member 440 are engaged (i.e., when the linear member 440 is in an engagement position where the teeth 441 of the linear member 440 engage with the teeth 326 of the rotating member 322), the drive device 300 and the bracket 410 are coupled together, so that the rotation of the output shaft 302 in the clockwise and counterclockwise directions by the drive device 300 will cause the sensor unit 400 to translate along the X-axis, thereby changing the relative positional relationship between the sensor unit 400 and the rotation axis 302a by moving the sensor unit 400 closer to or away from the rotation axis 302a, thereby changing the relative positional relationship between the sensor unit 400 and the wafer receiving surface 306. In contrast, when the linear member 440 is disconnected from the rotating member 322 (i.e., when the linear member 440 is in the disconnected position where the teeth 441 of the linear member 440 are not engaged with the teeth 326 of the rotating member 322), the drive device 300 and the bracket 410 are not coupled together, so that the rotation of the output shaft 302 by means of the drive device 300 will not cause the teeth 326 of the rotating member 322 to drive the teeth 441 of the linear member 440 in the direction along the X-axis. Therefore, when the linear member 440 is disconnected from the rotating member 322, the rotation of the output shaft 302 in the clockwise and counterclockwise directions by means of the drive device 300 will not cause the translational movement of the sensor unit 400 along the X-axis, and thus will not change the relative positional relationship between the sensor unit 400 and the rotation axis 302a.

[0042] With Figure 1-Figure 7 In the same way as the example, Fig. 8A and Figure 8B An embodiment is shown in which the rotating member 322a is configured as a gear having an outer peripheral surface 324a on which teeth 326a are provided. In addition, a linear member 440a is mounted on a base plate 442a. The linear member 440a is configured as a rack having teeth 441a arranged linearly. Fig. 8A and Figure 8B The linear member 440a is shown engaged with the rotating member 322a (i.e., the linear member 440a is in an engaged position where the teeth 441 of the linear member 440a are engaged with the teeth 326a of the rotating member 322a). Therefore, in this engaged state, by sliding the second sliding member 412a along the first sliding member 330a, the rotating member 322a is rotated in the counterclockwise direction (as shown in FIG. Fig. 8A The rotation of the base plate 442a (as shown) will cause the base plate 442a (and the attached bracket and sensor unit) to translate along the X-axis in the first direction 20a. (For the sake of simplicity of the drawings, Fig. 8Aand Figure 8B Only one first sliding member and one second sliding member are shown; however, additional first sliding members and second sliding members may be included to provide stability of the sliding motion. ) In addition, in this engaged state, by sliding the second sliding member 412a along the first sliding member 330a, the rotating member 322a moves in a clockwise direction (such as Figure 8B Rotation of the base plate 442a (as shown) will cause translational movement of the base plate 442a (and the attached bracket and sensor unit) along the X-axis in a second direction 22a opposite to the first direction 20a.

[0043] Figure 9-12 An alternative embodiment of the present invention is shown.

[0044] Fig. 9 An embodiment is shown in which the rotating member 322b has an outer peripheral surface 324b that can frictionally engage with the surface 441b of the linear member 440b. The outer peripheral surface 324b and / or the surface 441b can be provided with a surface material that provides friction between the surfaces when the surfaces contact each other so as to prevent the surfaces from sliding relative to each other when the rotating member 322b rotates. Fig. 9 The linear member 440b is shown to be engaged with the rotating member 322b (i.e., the outer peripheral surface 324b is in contact with the surface 441b). Therefore, in this engaged state, by sliding the second sliding member 412b along the first sliding member 330b, the rotating member 322b is rotated in the counterclockwise direction (eg, Fig. 9 The rotation of the base plate 442b (as shown) will cause the base plate 442b (and the attached bracket and sensor unit) to translate along the X-axis in the first direction 20b. (For the sake of simplicity of the drawings, Fig. 9 Only one first sliding member and one second sliding member are shown; however, additional first sliding members and second sliding members may be included to provide stability of the sliding motion.) In addition, in this engaged state, by sliding the second sliding member 412b along the first sliding member 330b, the rotation of the rotating member 322b in the clockwise direction will cause the base plate 442b (and the connected bracket and sensor unit) to translate along the X-axis in a second direction opposite to the first direction 20b.

[0045] Fig. 10A and Fig. 10BAn embodiment is shown in which a rotating member 322c is provided with a belt and pulley arrangement to convert the rotation of the rotating member 322c into the translation of the sensor unit. Therefore, the drive device includes pulleys 340c and 342c, and the pulleys 340c and 342c are rotatably mounted to the housing of the drive device. The rotating member 322c has an outer peripheral surface 324c around the pulleys 340c and 342c driving belt 344c. The belt 344c is fixed to a member 440c, and the member 440c is mounted on a base plate 442c. In this embodiment, a clutch 323c is arranged at the junction between the lower end of the output shaft of the drive device and the rotating member 322c. The clutch 323c is configured to engage and disconnect the power transmission from the rotation of the output shaft to the rotation of the rotating member 322c. Fig. 10A and Fig. 10B 323c and the presence of the belt 344c. Thus, in this engaged state, the rotating member 322c is rotated in a counterclockwise direction (eg, Fig. 10A The rotation of the base plate 442c (as shown) will cause the base plate 442c (and the attached bracket and sensor unit) to translate along the X-axis in the first direction 20c. (For the sake of simplicity of the drawings, Fig. 10A and Fig. 10B Only one first sliding member and one second sliding member are shown; however, additional first sliding members and second sliding members may be included to provide stability of the sliding motion. ) In addition, in this engaged state, by sliding the second sliding member 412c along the first sliding member 330c, the rotating member 322c moves in a clockwise direction (such as Fig. 10B Rotation of the base plate 442c (as shown) will cause translational movement of the base plate 442c (and the attached bracket and sensor unit) along the X-axis in a second direction 22c opposite to the first direction 20c.

[0046] The clutch described above and below may be any conventional clutch that allows engaging and disengaging the transmission of power from the rotation of the output shaft to the rotation of the rotating member. Fig. 10A and Fig. 10B The described clutch can be used as a coupling device 600 to be coupled to Figure 1-Figure 9 In any of the embodiments shown, the need for actuator 602 is eliminated and the need for the base plate to move in the Y-axis direction is eliminated. Therefore, the rotating member and the linear member can be maintained in an engaged state, and the clutch can be used to engage or disengage the power transmission from the rotation of the output shaft to the rotation of the rotating member, and thus engage or disengage the power transmission of the output shaft for rotating the rotating member and thus for driving the motion of the linear member. In addition, in this configuration, the flexure can be made of a more rigid material.

[0047] Fig.11A and Fig. 11B The embodiment that the rotating member 322d is provided with the member 340d fixedly connected to the rotating member 322d is shown. The member 340d can extend from the outer peripheral surface 424d of the rotating member 322d as shown in the figure, or can be arranged on the outer edge of the rotating member 322d at a position spaced apart from the rotation axis of the rotating member 322d. The member 340d is pivotally connected to the arm member 342d by the first pivot joint 344d. The arm member 342d is pivotally connected to the member 440d by the second pivot joint 346d to provide a connection between the rotating member 322d and the member 440d. The member 440d is mounted on the bottom plate 442d. In this embodiment, the clutch 323d is arranged at the joint between the lower end of the output shaft of the drive device and the rotating member 322d. The clutch 323d is configured to engage and disconnect the power transmission from the rotation of the output shaft to the rotation of the rotating member 322d. Fig.11A and Fig. 11B 323d and the connecting rod including the arm member 342d are present. Therefore, in this engaged state, the rotating member 322d is rotated in a clockwise direction (eg, Fig.11A The rotation of the base plate 442d (as shown) will cause the base plate 442d (and the attached bracket and sensor unit) to translate along the X-axis in the first direction 20d. (For the sake of simplicity of the drawings, Fig.11A and Fig. 11B Only one first sliding member and one second sliding member are shown; however, additional first sliding members and second sliding members may be included to provide stability of the sliding motion.) In addition, in this engaged state, by sliding the second sliding member 412d along the first sliding member 330d, the rotating member 322d moves in a counterclockwise direction (such as Fig. 11B Rotation of the base plate 442d (as shown) will cause translational movement of the base plate 442d (and the attached bracket and sensor unit) along the X-axis in a second direction 22d opposite to the first direction 20d.

[0048] Fig.12The embodiment of the rotating member 322e is shown, and the driving arm 340e is fixedly connected to the rotating member 322e and extends from the outer peripheral surface 424e of the rotating member 322e. The driving arm 340e has an elongated shape, and it has a cam groove 342e extending longitudinally along the driving arm 340e. The cam follower 344e is fixedly mounted on the member 440e. The member 440e is mounted on the base plate 442e, and the base plate 442e is connected to the bracket through a flexure. The cam follower 344e is arranged in the cam groove 342e, so that the driving arm 340e causes the pivoting motion due to the rotation of the rotating member 322e to cause the cam groove 342e to drive the cam follower 344e along the X-axis direction. In this embodiment, the clutch 323e is arranged at the joint between the lower end of the output shaft of the driving device and the rotating member 322e. The clutch 323e is configured to engage and disengage power transmission from the rotation of the output shaft to the rotation of the rotating member 322e. Fig.12 323e and the presence of the drive arm 340e, the cam groove 342e and the cam follower 344e. Therefore, in this engaged state, the rotating member 322e is rotated in the counterclockwise direction (eg, Fig.12 The rotation of the base plate 442e (as shown) will cause the base plate 442e (and the attached bracket and sensor unit) to translate along the X-axis in the first direction 20e. (For the sake of simplicity of the drawings, Fig.12 ) In addition, in this engaged state, by sliding the second sliding member 412e along the first sliding member 330e, the rotation of the rotating member 322e in the clockwise direction will cause the base plate 442e (and the connected bracket and sensor unit) to translate along the X-axis in a second direction opposite to the first direction 20e.

[0049] The apparatus of the present invention advantageously provides a drive device that can be used to rotate the semiconductor wafer about the rotation axis and adjust the positional relationship between the sensor unit and the rotation axis. Adjustment of the positional relationship between the sensor unit and the rotation axis advantageously allows the apparatus to be used for semiconductor wafers of various sizes having a wide range of diameters.

[0050] about Figure 1-Figure 7In the illustrated embodiment, the apparatus 100 may be utilized, for example, by placing a semiconductor wafer on the wafer receiving surface 306 of the wafer platform 304, engaging the engagement device 600 by actuating the actuator 602 to bend the flexures 450 and 460 to engage the teeth 441 with the teeth 326, actuating the drive device 300 to rotate the output shaft 302 and the rotation member 322 to drive the carriage 410 and the sensor unit 400 in a direction along the X-axis toward the rotation axis 302a, and utilizing the optical sensor 404 to detect the presence or absence of the semiconductor wafer in the sensing region 406. Once the optical sensor 404 detects the presence of an edge of the semiconductor wafer moving within the sensing region 406, the drive device 330 and / or the engagement device 600 may be deactivated to stop the movement of the carriage 410 and the sensor unit 400 in a direction along the X-axis toward the rotation axis 302a. Once optical sensor 404 is located at a desired position relative to a semiconductor wafer on wafer receiving surface 306, apparatus 100 may be used to perform alignment of the semiconductor wafer for inspection and / or processing by rotating the wafer using drive device 300 and optical sensor 404 scanning the wafer in sensing area 406.

[0051] The apparatus 100 advantageously allows the relative positional relationship between the sensor unit 400 and the rotation axis 302 to be adjusted using the same drive device used to rotate the semiconductor wafer about the rotation axis. The change in the relative positional relationship between the sensor unit 400 and the rotation axis 302a allows the apparatus 100 to be used with semiconductor wafers of various different diameters, so that the relative positional relationship between the sensor unit 400 and the rotation axis 302a can be adjusted so that the sensing area 406 of the optical sensor 404 can be aligned with the outer edge area of ​​the wafer. Therefore, the sensor unit 400 and the rotation axis 302a can be adjusted to be closer to each other for a smaller diameter wafer, and the sensor unit 400 and the rotation axis 302a can be adjusted to be farther away from each other for a larger diameter wafer.

[0052] Fig.13 An embodiment of a clutch 700 is shown, and the clutch 700 is configured to engage and disengage power transmission from the rotation of the output shaft 302 of the drive device 300 to the rotation of the rotating member 702, and to engage and disengage power transmission from the rotation of the output shaft 302 of the drive device 300 to the linear member 440 engaged with the rotating member 702. The clutch 700 can be used with the rotating member 702 configured as a gear having an outer peripheral surface 703 on which teeth are provided, and the linear member 440 configured as a rack having a linear arrangement of teeth 441, such as Fig.13 Alternatively, clutch 700 may be used as a clutch for any of the other embodiments shown herein.

[0053] The clutch 700 includes a drive device 710 configured to drive a shaft 704, on which a rotating member 702 is mounted in the Z direction. For example, the drive device 710 may be a cylinder, a solenoid, etc., which drives the shaft 704 in a linear direction and passively allows the shaft 704 to rotate, so that when the rotating member 702 is engaged with the output shaft 302, the rotating member 702 can be driven to rotate by the drive device 300. The lower end 320 of the output shaft 302 has a disk 320a, and the disk 320a has a lower engagement surface 321. When the drive device 710 is actuated to drive the shaft 704 in the Z direction, the upper engagement surface 706 of the rotating member 302 contacts and thereby engages (e.g., frictionally engages using grooves, teeth, etc.) the lower engagement surface 321, and once the drive device 710 is no longer actuated, the drive shaft 704 will move in the -Z direction, and the rotating member 702 will be disconnected from the output shaft 302. Note that the amount of movement of shaft 704 to perform this engagement may be small and is not shown for illustration purposes. Fig.13 During Z-direction movement, the teeth on peripheral surface 703 may slide relative to teeth 441, and in other embodiments, components may slide or flex relative to each other (e.g., belt 344c, member 340d, arm member 342d) to allow such small relative motion.

[0054] To allow movement of the shaft 704, the shaft 704 may be rotatably mounted using a bearing 720. The outer periphery of the bearing 720 may be rigidly mounted to the drive device 710 via a mounting bracket 724, which is mounted to the lower wall 214 as shown, or may be rigidly mounted directly to the lower wall 214. The inner periphery of the bearing 720 is slidably engaged with a slide 722 fixed to the shaft 704 to allow the shaft 704 to move along the Z axis and also allow the shaft 704 to rotate about the Z axis.

[0055] Fig.14 An embodiment of a computer 800 is shown that can be used to implement embodiments of the present invention. Although the computer 800 is depicted with respect to a particular device or devices, it is contemplated that Fig.14 The hardware and components shown in the system 800 may be deployed in other devices or equipment (e.g., network elements, servers, etc.) in the computer system 800. The computer system 800 is programmed (e.g., via computer program code or instructions) to provide the functions described herein, and includes a communication mechanism such as bus 802 for transferring information between other internal and external components of the computer system 800. One or more processors 804 for processing information are coupled to the bus 802 to perform a set of operations on the information specified by the computer program code.

[0056] The computer system 800 also includes a memory 806 coupled to the bus 810. The memory 806, such as a random access memory (RAM) or other dynamic storage device, stores information including processor instructions. The processor 804 also uses the memory 806 to store temporary values ​​during the execution of the processor instructions. The computer system 800 also includes a read-only memory (ROM) 808 or other static storage device coupled to the bus 802 for storing static information that does not change with the computer system 800, including instructions. The computer 800 includes a communication interface 810 that allows the computer 800 to communicate with other devices or equipment (e.g., network elements, servers, etc.).

[0057] Information including user input instructions is provided to bus 802 from user interface 812, such as a keyboard containing alphanumeric keys operated by a human user, a display device, a pointing device such as a mouse or trackball or cursor direction keys, for use by processor 804.

[0058] The drive device 814 (e.g., the drive device 300) can communicate with the processor 804 via the bus 802 to send and receive data, operating instructions / commands, or other information therebetween. The processor 804 can use the operating instructions / commands to control the operation of the drive device 814 to control the rotation (e.g., start, stop, direction (e.g., clockwise, counterclockwise), speed, etc.) of the output shaft (e.g., output shaft 302) of the drive device 814.

[0059] The engagement device 816 (e.g., actuator 602, clutch 323c, clutch 323d, clutch 323e, etc.) can communicate with the processor 804 via the bus 802 to send and receive data, operating instructions / commands or other information therebetween. The processor 804 can use the operating instructions / commands to control the operation of the engagement device 816 so as to control the actuation of the engagement device 816.

[0060] The optical sensor 818 (e.g., optical sensor 404) can communicate with the processor 804 via the bus 802 to send and receive data, operating instructions / commands, or other information therebetween. The processor 804 can use the operating instructions / commands to control the operation of the optical sensor 818 in conjunction with the operation of the drive device 814 and / or the engagement device 818 to control the operation of the optical sensor 818.

[0061] For example, as described above, a semiconductor wafer may be placed on the wafer receiving surface of the wafer platform, the processor 804 (using instructions input by a user via the user interface 812 or stored in the memory 806) sends a command to the engagement device 816 to actuate, the processor 804 (using instructions input by a user via the user interface 812 or stored in the memory 806) sends a command to the drive device 814 to rotate the output shaft to drive the optical sensor 818 in a direction along the X-axis toward the axis of rotation, and the processor 804 (using instructions input by a user via the user interface 812 or stored in the memory 806) sends a command to the optical sensor 818 to detect the presence or absence of the semiconductor wafer. Once the optical sensor 818 detects the presence of the edge of the semiconductor wafer moving within the sensing area and sends such data to the processor 804, the processor 804 sends a command to the drive device 814 and / or the engagement device 816 to deactivate to stop the movement of the optical sensor 818 in the direction along the X-axis toward the axis of rotation. Once optical sensor 818 is located at a desired position relative to the semiconductor wafer on the wafer receiving surface, processor 804 may perform alignment of the semiconductor wafer for inspection and / or processing by rotating the wafer using drive 814 and optical sensor 818 scanning the wafer in a sensing area.

[0062] It should be noted that the exemplary embodiments described and described herein set forth preferred embodiments of the present invention and are not meant to limit the scope of the claims herein in any way. According to the above teachings, many modifications and variations of the present invention are possible. Therefore, it should be understood that within the scope of the appended claims, the present invention may be practiced in a manner different from that specifically described herein.

Claims

1. A wafer pre-alignment device, comprising: Pedestal; a drive device disposed on the base, the drive device having an output shaft, the output shaft having a wafer receiving surface, the drive device being configured to rotate the output shaft about a rotation axis; a sensor unit disposed on the base, the sensor unit being configured to sense a wafer received on the wafer receiving surface; and an engagement device configured to engage and disengage a translation mechanism between the drive device and the sensor unit, Wherein, when the engagement device engages with the translation mechanism, the rotation of the output shaft around the rotation axis by means of the driving device changes the relative position relationship between the sensor unit and the rotation axis.

2. The wafer pre-alignment apparatus according to claim 1, wherein: When the engagement device disengages the translation mechanism, the rotation of the output shaft about the rotation axis by means of the drive device does not change the relative positional relationship between the sensor unit and the rotation axis.

3. The wafer pre-alignment apparatus according to claim 1, in, The translation mechanism comprises: a rotating member coupled to the output shaft; a bracket slidably coupled to the base, the sensor unit being mounted on the bracket; and a linear member connected to the bracket, and Wherein, the outer peripheral surface of the rotating member is engageable with the linear member when the engagement device is activated, so that the rotation of the rotating member causes the bracket to move relative to the rotation axis.

4. The wafer pre-alignment apparatus according to claim 3, wherein: The engaging device includes an actuator configured to move the linear member into contact with the outer peripheral surface to engage the linear member with the rotating member.

5. The wafer pre-alignment apparatus according to claim 4, wherein: The linear member is mounted to the bracket via a flexure member such that activation of the actuator flexes the flexure member to move the linear member into contact with the outer peripheral surface to engage the linear member with the rotating member.

6. The wafer pre-alignment apparatus according to claim 5, wherein: The bracket, the linear member and the flexure member form a four-bar linkage structure.

7. The wafer pre-alignment apparatus according to claim 4, in, The rotating member is a gear, and The linear member is a rack having a linear tooth arrangement, and the gear can engage with the tooth.

8. The wafer pre-alignment apparatus according to claim 4, in, The outer peripheral surface of the rotating member is frictionally engageable with a surface of the linear member.

9. The wafer pre-alignment apparatus according to claim 1, further comprising a rotating member coupled to the output shaft, in, The engagement device is a clutch configured to engage and disengage the transmission of the rotation of the output shaft to the rotation of the rotating member, wherein the translation mechanism comprises a bracket slidably coupled to the base, the sensor unit is mounted on the bracket, and The translation mechanism further comprises a driving member, wherein the driving member connects the rotating member to the bracket, so that rotation of the rotating member causes the bracket to move relative to the rotation axis.

10. The wafer pre-alignment apparatus according to claim 9, in, The drive member is a linear member connected to the carriage, the linear member engaging with an outer peripheral surface of the rotating member so that rotation of the rotating member moves the carriage relative to the rotation axis.

11. The wafer pre-alignment apparatus according to claim 10, in, The rotating member is a gear, and Wherein, the linear member is a rack having a linear tooth device, and the gear is engaged with the tooth.

12. The wafer pre-alignment apparatus according to claim 10, in, The outer peripheral surface of the rotating member is frictionally engaged with a surface of the linear member.

13. The wafer pre-alignment apparatus according to claim 9, wherein: The driving member is a belt and pulley arrangement, the belt being driven by the rotating member and the belt being connected to the carriage; The drive member is a link including an arm member having a first end pivotally connected to the rotation member and a second end pivotally connected to the bracket; or The drive member is a drive arm having a cam slot, and the bracket includes a cam follower disposed in the cam slot.

14. A wafer pre-alignment device comprising: Pedestal; a drive device disposed on the base, the drive device having an output shaft, the output shaft having a wafer receiving surface, the drive device being configured to rotate the output shaft about a rotation axis; a sensor unit disposed on the base, the sensor unit being configured to sense a wafer received on the wafer receiving surface; a bracket slidably coupled to the base, the sensor unit being mounted on the bracket; and an engagement device configured to engage and disengage a coupling between the drive device and the carriage, Wherein, when the engagement device engages the coupling member, the rotation of the output shaft around the rotation axis by means of the driving device changes the relative positional relationship between the sensor unit and the rotation axis.

15. The wafer pre-alignment apparatus according to claim 14, wherein: When the engagement device disconnects the coupling, the rotation of the output shaft about the rotation axis by means of the drive device does not change the relative positional relationship between the sensor unit and the rotation axis.

16. A wafer pre-alignment method comprising the following steps: A device is provided, the device comprising: Pedestal; a drive device disposed on the base, the drive device having an output shaft, the output shaft having a wafer receiving surface, the drive device being configured to rotate the output shaft about a rotation axis; a sensor unit disposed on the base, the sensor unit being configured to sense a wafer received on the wafer receiving surface, and an engagement device configured to engage and disengage a translation mechanism between the drive device and the sensor unit; engaging the translation mechanism between the drive device and the sensor unit, and rotating the output shaft about the rotation axis by the drive device to change the relative positional relationship between the sensor unit and the rotation axis; and The translation mechanism between the drive device and the sensor unit is disconnected, and the output shaft is rotated about the rotation axis by the drive device to rotate the wafer on the wafer receiving surface.

17. The wafer pre-alignment method according to claim 16, wherein: When the translation mechanism is disconnected, the rotation of the output shaft about the rotation axis by means of the drive device does not change the relative positional relationship between the sensor unit and the rotation axis.

18. The wafer pre-alignment method according to claim 16, further comprising: The sensor unit is used to sense alignment of the wafer when the translation mechanism is disconnected and the output shaft is rotated by the driving device.

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