Electronic device including heat dissipation structure

Abstract

According to various embodiments, the electronic device may include: a circuit board; an electrical component, which is arranged on the upper surface of the circuit board; a shielding cover, which surrounds at least a portion of the electrical component and has a first opening arranged through a portion of the shielding cover facing the electrical component; a shielding sheet, which includes a shielding layer arranged on at least a portion of the shielding cover and a supporting layer arranged on the upper surface of the shielding layer, and the supporting layer includes a second opening corresponding to the first opening; and a first heat transfer member, which contains a heat dissipation material, has at least a portion arranged in the second opening, and has at least one surface in contact with the shielding layer.

Description

Technical Field

[0001] The present disclosure relates to a heat dissipation structure for shielding electromagnetic waves of electrical components disposed inside an electronic device and / or for dissipating heat, and an electronic device including the heat dissipation structure. Background Art

[0002] With the remarkable development of information and communication technology and semiconductor technology, the popularity and use of various electronic devices are rapidly increasing. In particular, recent electronic devices have been developed so that they can communicate while being carried around.

[0003] For example, an electronic device may refer to a device that performs a specific function according to a program installed on a household appliance, an electronic notebook, a portable multimedia player, a mobile communication terminal, a tablet PC, a video / sound device, a desktop / laptop computer, a vehicle navigation device, etc. For example, these electronic devices can output stored information as audio and / or video. With the increase in the degree of integration of electronic devices and the popularization of ultra-high-speed and large-capacity wireless communications, various functions can be installed in one electronic device such as a mobile communication terminal. For example, not only communication functions, but also entertainment functions such as games, multimedia functions such as music / video playback, communication and security functions for mobile banking, and functions such as schedule management and electronic wallets are all integrated into one electronic device. These electronic devices have been miniaturized so that users can carry them conveniently. Summary of the Invention

[0004] Technical issues

[0005] Typically, electronic devices include various electronic components and a printed circuit board (PCB) within a bracket for mounting the components. Some of the circuit electrical components mounted on the PCB generate electromagnetic waves and / or heat, which may cause malfunction and degradation of the electronic device.

[0006] To dissipate heat generated within electronic devices, various heat dissipation components can be used. However, due to limitations in EMI shielding, insulation, thickness, and strength, it is difficult to directly connect heat dissipation components to electrical components (e.g., APs). Furthermore, auxiliary materials with large heat capacity and low heat resistance should be used to increase the thermal density of electrical components (e.g., APs), but designing such materials is difficult.

[0007] Solution to the problem

[0008] Embodiments of the present disclosure may provide an electronic device including a heat dissipation structure to shield at least one electrical component of the electronic device from electromagnetic waves and to effectively dissipate heat.

[0009] According to various example embodiments, an electronic device may include: a circuit board; an electrical component disposed on an upper surface of the circuit board; a shielding cover surrounding at least a portion of the electrical component and including a first opening passing through a portion of the shielding cover and disposed facing the electrical component; a shielding sheet including a shielding layer disposed on at least a portion of the shielding cover and a supporting layer disposed on an upper surface of the shielding layer, and the shielding sheet including a second opening corresponding to the first opening; and a first heat transfer member including a heat dissipation material (e.g., a thermal interface material), at least a portion of the first heat transfer member being disposed within the second opening, and at least one surface of the first heat transfer member being in contact with the shielding layer.

[0010] According to various example embodiments, an electronic device may include: a housing; a circuit board disposed inside the housing; an electrical component disposed on an upper surface of the circuit board; a shielding cover surrounding at least a portion of the electrical component and including a first opening passing through a portion of the shielding cover and disposed facing the electrical component; a shielding sheet covering the first opening of the shielding cover and including a recess facing at least a portion of the first opening; and a first heat transfer member including a heat dissipation material (e.g., a thermal interface material) stably disposed in the recess of the shielding sheet and configured to guide a heat transfer path in which heat generated in the electrical component is directed to the housing.

[0011] According to various example embodiments, an electronic device may include: a circuit board; an electrical component disposed on an upper surface of the circuit board; a bracket; a shielding sheet disposed between the electrical component and the bracket, the shielding sheet including a shielding layer and a supporting layer, and the supporting layer being disposed on an upper surface of the shielding layer and including an opening; and a first heat transfer member containing a heat transfer material (e.g., a thermal interface material), at least a portion of the first heat transfer member being disposed in the opening, and at least one surface of the first heat transfer member being in contact with the shielding layer.

[0012] Beneficial effects of the present invention

[0013] Electronic devices according to various example embodiments may provide a heat dissipation structure including a shielding function and a heat dissipation function.

[0014] The heat dissipation structure according to various example embodiments may provide effective heat dissipation performance by providing a heat transfer member and / or a shielding layer disposed in contact with electrical components disposed on a circuit board.

[0015] The heat dissipation structure according to various exemplary embodiments may provide an effective heat transfer path by not including an auxiliary material having high heat resistance on a path of heat generated in an electrical component and reducing a thickness between a bracket and the electrical component. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The above and other aspects, features and advantages of certain embodiments of the present disclosure will become more apparent from the following detailed description taken in conjunction with the accompanying drawings, in which:

[0017] Figure 1 is a block diagram illustrating an example electronic device in a network environment according to various embodiments;

[0018] Figure 2 is a front perspective view illustrating an example electronic device according to various embodiments;

[0019] Figure 3 is a rear perspective view illustrating an example electronic device according to various embodiments;

[0020] Figure 4 is an exploded perspective view illustrating an example electronic device according to various embodiments;

[0021] Figure 5A is a cross-sectional view illustrating an example structure for shielding and dissipating heat around electrical components according to various embodiments;

[0022] Figure 5B is a cross-sectional view illustrating an example structure for shielding and dissipating heat around electrical components according to various embodiments;

[0023] Figure 6 is a cross-sectional view illustrating an example structure for shielding and dissipating heat around electrical components according to various embodiments;

[0024] Figure 7A is a cross-sectional view illustrating an example structure for shielding and dissipating heat around electrical components according to various embodiments;

[0025] Figure 7B is a cross-sectional view illustrating an example structure for shielding and dissipating heat around electrical components according to various embodiments;

[0026] Figure 8 is a cross-sectional view illustrating an example structure for shielding and dissipating heat around electrical components according to various embodiments;

[0027] Figure 9 is a cross-sectional view illustrating an example structure for shielding and dissipating heat around electrical components according to various embodiments;

[0028] Figure 10is a cross-sectional view illustrating an example structure for shielding and dissipating heat around electrical components according to various embodiments;

[0029] Figure 11 is a cross-sectional view illustrating an example structure for shielding and dissipating heat around electrical components according to various embodiments;

[0030] Figure 12 is a cross-sectional view illustrating an example structure for shielding and dissipating heat around electrical components according to various embodiments;

[0031] Figure 13 is a cross-sectional view illustrating an example structure for shielding and dissipating heat around electrical components according to various embodiments;

[0032] Figure 14 is a cross-sectional view illustrating an example structure for shielding and dissipating heat around electrical components according to various embodiments;

[0033] Figure 15 is a cross-sectional view illustrating an example structure for shielding and dissipating heat around electrical components according to various embodiments;

[0034] Figure 16 is a cross-sectional view illustrating an example structure for shielding and heat dissipation disposed around an electrical component according to various embodiments;

[0035] Figure 17 is a cross-sectional view illustrating an example structure for shielding and dissipating heat around electrical components according to various embodiments;

[0036] Figure 18 is a cross-sectional view illustrating an example structure for shielding and dissipating heat around electrical components according to various embodiments;

[0037] Figure 19 is a cross-sectional view illustrating an example structure for shielding and dissipating heat around electrical components according to various embodiments;

[0038] Figure 20 is a cross-sectional view illustrating an example of manufacturing a heat dissipation structure according to various embodiments;

[0039] Figure 21 is a cross-sectional view illustrating an example of manufacturing a heat dissipation structure according to various embodiments. DETAILED DESCRIPTION

[0040] Figure 1 is a block diagram illustrating an electronic device 101 in a network environment 100 according to various embodiments.

[0041] Reference Figure 1 , the electronic device 101 in the network environment 100 can communicate with the electronic device 102 via the first network 198 (e.g., a short-range wireless communication network), or communicate with the electronic device 104 or the server 108 via the second network 199 (e.g., a long-range wireless communication network). According to an embodiment, the electronic device 101 can communicate with the electronic device 104 via the server 108. According to an embodiment, the electronic device 101 may include a processor 120, a memory 130, an input device 150, a sound output device 155, a display device 160, an audio module 170, a sensor module 176, an interface 177, a haptic module 179, a camera module 180, a power management module 188, a battery 189, a communication module 190, a subscriber identification module (SIM) 196, or an antenna module 197. In some embodiments, at least one of the components (e.g., the display device 160 or the camera module 180) may be omitted from the electronic device 101, or one or more other components may be added to the electronic device 101. In some embodiments, some of the components may be implemented as a single integrated circuit. For example, the sensor module 176 (eg, a fingerprint sensor, an iris sensor, or an illumination sensor) may be implemented as embedded in the display device 160 (eg, a display).

[0042] The processor 120 may run, for example, software (e.g., program 140) to control at least one other component of the electronic device 101 connected to the processor 120 (e.g., a hardware component or a software component), and may perform various data processing or calculations. According to an embodiment, as at least part of the data processing or calculation, the processor 120 may load commands or data received from another component (e.g., sensor module 176 or communication module 190) into the volatile memory 132, process the commands or data stored in the volatile memory 132, and store the resulting data in the non-volatile memory 134. According to an embodiment, the processor 120 may include a main processor 121 (e.g., a central processing unit (CPU) or an application processor (AP)) and an auxiliary processor 123 (e.g., a graphics processing unit (GPU), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)) that is operationally independent of or integrated with the main processor 121. Additionally or alternatively, the auxiliary processor 123 may be configured to consume less power than the main processor 121 or to be specifically configured for a designated function. The secondary processor 123 may be implemented separately from the primary processor 121 or as part of the primary processor 121 .

[0043] When the main processor 121 is in an inactive (e.g., sleep) state, the auxiliary processor 123 may control at least some of the functions or states related to at least one component (e.g., the display device 160, the sensor module 176, or the communication module 190) among the components of the electronic device 101 (not the main processor 121), or when the main processor 121 is in an active state (e.g., running an application), the auxiliary processor 123 may control at least some of the functions or states related to at least one component (e.g., the display device 160, the sensor module 176, or the communication module 190) together with the main processor 121. Depending on the embodiment, the auxiliary processor 123 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., the camera module 180 or the communication module 190) that is functionally related to the auxiliary processor 123.

[0044] The memory 130 may store various data used by at least one component of the electronic device 101 (e.g., the processor 120 or the sensor module 176). The various data may include, for example, software (e.g., the program 140) and input data or output data for commands related thereto. The memory 130 may include a volatile memory 132 or a non-volatile memory 134.

[0045] The program 140 may be stored as software in the memory 130 , and may include, for example, an operating system (OS) 142 , middleware 144 , or applications 146 .

[0046] The input device 150 may receive commands or data from outside the electronic device 101 (e.g., a user) to be used by other components of the electronic device 101 (e.g., the processor 120). The input device 150 may include, for example, a microphone, a mouse, a keyboard, or a digital pen (e.g., a stylus).

[0047] The sound output device 155 can output sound signals to the outside of the electronic device 101. The sound output device 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as playing multimedia or records, and the receiver can be used for incoming calls. Depending on the embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0048] The display device 160 can visually provide information to the outside of the electronic device 101 (e.g., a user). The display device 160 may include, for example, a display, a holographic device, or a projector, and a control circuit for controlling a corresponding one of the display, the holographic device, and the projector. Depending on the embodiment, the display device 160 may include a touch circuit adapted to detect a touch or a sensor circuit adapted to measure the strength of the force caused by the touch (e.g., a pressure sensor).

[0049] The audio module 170 can convert sound into an electrical signal, and vice versa. According to an embodiment, the audio module 170 can obtain sound via the input device 150, or output sound via the sound output device 155 or an earphone of an external electronic device (e.g., electronic device 102) directly (e.g., wired) or wirelessly connected to the electronic device 101.

[0050] The sensor module 176 can detect an operating state (e.g., power or temperature) of the electronic device 101 or an environmental state (e.g., a user's state) outside the electronic device 101, and then generate an electrical signal or data value corresponding to the detected state. Depending on the embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illumination sensor.

[0051] The interface 177 may support one or more specific protocols to be used to connect the electronic device 101 directly (e.g., wired) or wirelessly to an external electronic device (e.g., the electronic device 102). Depending on the embodiment, the interface 177 may include, for example, a High-Definition Multimedia Interface (HDMI), a Universal Serial Bus (USB) interface, a Secure Digital (SD) card interface, or an audio interface.

[0052] The connection end 178 may include a connector, wherein the electronic device 101 can be physically connected to an external electronic device (e.g., the electronic device 102) via the connector. Depending on the embodiment, the connection end 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0053] The haptic module 179 may convert the electrical signal into mechanical stimulation (eg, vibration or motion) or electrical stimulation that can be recognized by the user via his sense of touch or kinesthetic sense. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulator.

[0054] The camera module 180 may capture still images or moving images. Depending on the embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.

[0055] The power management module 188 may manage power supply to the electronic device 101. According to an embodiment, the power management module 188 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0056] The battery 189 may power at least one component of the electronic device 101. According to an embodiment, the battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0057] The communication module 190 may support establishing a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (e.g., electronic device 102, electronic device 104, or server 108), and perform communication via the established communication channel. The communication module 190 may include one or more communication processors capable of operating independently from the processor 120 (e.g., an application processor (AP)) and supporting direct (e.g., wired) communication or wireless communication. Depending on the embodiment, the communication module 190 may include a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., a local area network (LAN) communication module or a power line communication (PLC) module). A corresponding one of these communication modules can communicate with an external electronic device via a first network 198 (e.g., a short-range communication network such as Bluetooth, Wireless Fidelity (Wi-Fi) Direct, or Infrared Data Association (IrDA)) or a second network 199 (e.g., a long-range communication network such as a cellular network, the Internet, or a computer network (e.g., a LAN or a wide area network (WAN))). These various types of communication modules can be implemented as a single component (e.g., a single chip), or these various types of communication modules can be implemented as multiple components separated from each other (e.g., multiple chips). The wireless communication module 192 can identify and authenticate the electronic device 101 in a communication network (such as the first network 198 or the second network 199) using user information (e.g., an International Mobile Subscriber Identity (IMSI)) stored in the user identification module 196.

[0058] Antenna module 197 can transmit or receive signals or power to or from the outside of electronic device 101 (e.g., an external electronic device). Depending on the embodiment, antenna module 197 may include an antenna comprising a radiating element formed of a conductive material or conductive pattern formed in or on a substrate (e.g., a PCB). Depending on the embodiment, antenna module 197 may include multiple antennas. In this case, at least one antenna suitable for the communication scheme used in a communication network (such as first network 198 or second network 199) may be selected from the multiple antennas by, for example, communication module 190 (e.g., wireless communication module 192). Signals or power can then be transmitted or received between communication module 190 and the external electronic device via the selected at least one antenna. Depending on the embodiment, additional components other than the radiating element (e.g., a radio frequency integrated circuit (RFIC)) may also be formed as part of antenna module 197.

[0059] At least some of the above components can be connected to each other via an inter-peripheral communication scheme (e.g., a bus, general-purpose input output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)) and communicatively transmit signals (e.g., commands or data) therebetween.

[0060] According to an embodiment, commands or data may be transmitted or received between the electronic device 101 and the external electronic device 104 via the server 108 connected to the second network 199. Each of the electronic device 102 and the electronic device 104 may be a device of the same type as the electronic device 101, or a device of a different type than the electronic device 101. According to an embodiment, all or some operations to be executed on the electronic device 101 may be executed on one or more of the external electronic device 102, the external electronic device 104, or the server 108. For example, if the electronic device 101 should automatically execute a function or service or should execute a function or service in response to a request from a user or another device, the electronic device 101 may request the one or more external electronic devices to execute at least part of the function or service instead of executing the function or service, or the electronic device 101 may request the one or more external electronic devices to execute at least part of the function or service in addition to executing the function or service. The one or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or execute another function or service related to the request, and transmit the result of the execution to the electronic device 101. The electronic device 101 may provide the result as at least a partial response to the request, either by further processing the result or without further processing the result. To this end, for example, cloud computing technology, distributed computing technology, or client-server computing technology may be used.

[0061] The electronic device according to various embodiments may be one of various types of electronic devices. The electronic device may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a household appliance. According to an embodiment, the electronic device is not limited to those described above.

[0062] It should be understood that the various embodiments and the terms used therein are not intended to limit the technical features set forth herein to specific embodiments, but rather include various variations, equivalents or substitutes of corresponding embodiments. For the description of the accompanying drawings, the same reference numerals may be used to refer to identical or related elements. It will be understood that the nouns in the singular form corresponding to the term may include one or more things, unless the relevant context clearly indicates otherwise. As used herein, each of the phrases such as "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B and C" and "at least one of A, B or C" may include any one or all possible combinations of the items listed together with the corresponding phrase in the multiple phrases. As used herein, terms such as "1st" and "2nd" or "first" and "second" may be used to simply distinguish the corresponding component from another component, and do not limit the components in other aspects (e.g., importance or order). It will be understood that if an element (e.g., a first element) is referred to as being “coupled with another element (e.g., a second element)”, “coupled to another element (e.g., a second element)”, “connected with another element (e.g., a second element)”, or “connected to another element (e.g., a second element)”, when the term “operably” or “communicatively” is used or when the term “operably” or “communicatively” is not used, it means that the element can be directly (e.g., wired) connected to the other element, wirelessly connected to the other element, or connected to the other element via a third element.

[0063] As used herein, the term "module" may include units implemented in hardware, software, or firmware, and may be used interchangeably with other terms (e.g., "logic," "logic block," "portion," or "circuit"). A module may be a single integrated component adapted to perform one or more functions or the smallest unit or portion of the single integrated component. For example, depending on an embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0064] The various embodiments described herein can be implemented as software (e.g., program 140) comprising one or more instructions stored in a storage medium (e.g., internal memory 136 or external memory 138) that can be read by a machine (e.g., electronic device 101). For example, under the control of a processor, a processor (e.g., processor 120) of the machine (e.g., electronic device 101) can call at least one of the one or more instructions stored in the storage medium and execute the at least one instruction with or without the use of one or more other components. This enables the machine to be operable to perform at least one function according to the called at least one instruction. The one or more instructions may include code generated by a compiler or code that can be executed by an interpreter. The machine-readable storage medium can be provided in the form of a non-transitory storage medium. The term "non-transitory" only means that the storage medium is a tangible device and does not include signals (e.g., electromagnetic waves), but the term does not distinguish between data being semi-permanently stored in the storage medium and data being temporarily stored in the storage medium.

[0065] According to an embodiment, the method according to various embodiments may be included and provided in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be released in the form of a machine-readable storage medium (e.g., a compact disk read-only memory (CD-ROM)), or may be downloaded via an application store (e.g., PlayStore). TM ) is published online (e.g., downloaded or uploaded), or the computer program product can be distributed (e.g., downloaded or uploaded) directly between two user devices (e.g., smart phones). If it is published online, at least part of the computer program product can be temporarily generated, or at least part of the computer program product can be at least temporarily stored in a machine-readable storage medium (such as a memory of a manufacturer's server, an application store's server, or a forwarding server).

[0066] According to various embodiments, each component (e.g., module or program) in the above-mentioned components may include a single entity or multiple entities. According to various embodiments, one or more components in the above-mentioned components may be omitted, or one or more other components may be added. Alternatively or additionally, multiple components (e.g., module or program) may be integrated into a single component. In this case, according to various embodiments, the integrated component may still perform the one or more functions of each component in the multiple components in the same or similar manner as a corresponding component in the multiple components performed one or more functions before integration. According to various embodiments, the operations performed by a module, program or another component may be performed sequentially, in parallel, repeatedly or in a heuristic manner, or one or more operations in the operations may be run or omitted in different orders, or one or more other operations may be added.

[0067] Figure 2 is a front perspective view illustrating an example electronic device 101 according to various embodiments, Figure 3 is a rear perspective view illustrating the electronic device 101 according to various embodiments.

[0068] refer to Figure 2 and Figure 3 The electronic device 101 according to the embodiment may include a housing 310 including a first surface 310A (or front surface), a second surface 310B (or rear surface), and a side surface 310C surrounding a space between the first surface 310A and the second surface 310B. In another embodiment (not shown), Figure 2 The structure of a portion of the first surface 310A, the second surface 310B and the side surface 310C can be referred to as a shell. According to an example embodiment, the first surface 310A can be configured by a front plate 302 (e.g., a glass plate or a polymer plate), and the front plate 302 has at least a portion that is substantially transparent. The second surface 310B can be composed of a substantially opaque back plate 311. The back plate 311 can be configured by, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel or magnesium) or a combination of at least two thereof. The side surface 310C can be configured by a side frame structure 318 (or "side surface member"), which is coupled to the front plate 302 and the back plate 311 and includes metal and / or polymer. In an embodiment, the back plate 311 and the side frame structure 318 can be configured as a whole and include the same material (e.g., a metal material such as aluminum).

[0069] In the illustrated embodiment, the front plate 302 may include two first regions 310D, which are respectively arranged at opposite ends of the longer edge of the front plate 302 and are curved and seamlessly extend from the first surface 310A toward the rear plate 311. Figure 3 ), the back plate 311 may include two second areas 310E, which are respectively arranged at opposite ends of the longer edges thereof, are curved, and seamlessly extend from the second surface 310B toward the front plate 302. In an embodiment, the front plate 302 (or the back plate 311) may include only one of the first areas 310D (or the second areas 310E). In another embodiment, the electronic device may not include one of the first area 310D or the second area 310E. In the above embodiment, when viewed from the side of the electronic device 101, the side frame structure 318 may have a first thickness (or width) on the side surface not including the first area 310D or the second area 310E, and may have a second thickness thinner than the first thickness on the side surface including the first area 310D or the second area 310E.

[0070] According to example embodiments, the electronic device 101 may include at least one of a display 301, audio modules 303, 307, and 314, sensor modules 304, 316, and 319, camera modules 305, 312, and 313, a key input device 317, a light emitting element 306, and connector holes 308 and 309. In embodiments, at least one element (e.g., the key input device 317 or the light emitting element 306) may be omitted from the electronic device 101, or another element may be added to the electronic device 101.

[0071] According to an example embodiment, the display 301 may be visually exposed (e.g., visible) through, for example, a majority of the front panel 302. In an embodiment, at least a portion of the display 301 may be exposed through the front panel 302 forming the first area 310D of the first surface 310A and the side surface 310C. In an embodiment, the edge of the display 301 may be configured to have substantially the same shape as the outer edge of the front panel 302 adjacent thereto. In another embodiment (not shown), in order to expand the area where the display 301 is exposed, the display 301 may be configured such that the distance between the outer edge of the display 301 and the outer edge of the front panel 302 remains substantially the same.

[0072] In another embodiment (not shown), a portion of the screen display area of ​​the display 301 may have a recess or opening disposed therein and include at least one of the audio module 314, sensor module 304, camera module 305, and light-emitting element 306 aligned with the recess or opening. In another embodiment (not shown), the rear surface of the screen display area of ​​the display 301 may include at least one of the audio module 314, sensor module 304, camera module 305, sensor module 316, and light-emitting element 306. In another embodiment (not shown), the display 301 may be coupled to or adjacent to a touch sensing circuit, a pressure sensor capable of measuring touch intensity (pressure), and / or a digitizer for detecting a magnetic field-type stylus. In an embodiment, at least a portion of the sensor modules 304 and 319 and / or at least a portion of the key input device 317 may be disposed on the first area 310D and / or the second area 310E.

[0073] According to an example embodiment, the audio modules 303, 307 and 314 may include, for example, a microphone hole 303 and speaker holes 307 and 314. A microphone for acquiring external sounds may be provided inside the microphone hole 303, and in an embodiment, a plurality of microphones may be arranged inside it to sense the direction of the sound. The speaker holes 307 and 314 may include an external speaker hole 307 and a call receiver hole 314. In an embodiment, the speaker holes 307 and 314 and the microphone hole 303 may be implemented by one hole, or a speaker (e.g., a piezoelectric speaker) without the speaker holes 307 and 314 may be provided. The audio modules 303, 307 and 314 are not limited to the above-described structures, and various designs and changes may be made according to the structure of the electronic device 101 by installing only a portion of the audio module, adding a new audio module, etc.

[0074] According to example embodiments, the sensor modules 304, 316, and 319 may generate electrical signals or data values ​​corresponding to, for example, an internal operating state or an external environmental state of the electronic device 101. The sensor modules 304, 316, and 319 may include, for example, a first sensor module 304 (e.g., a proximity sensor) and / or a second sensor module (not shown) (e.g., a fingerprint sensor) disposed on the first surface 310A of the housing 310, and / or a third sensor module 319 (e.g., an HRM sensor) and / or a fourth sensor module 316 (e.g., a fingerprint sensor) disposed on the second surface 310B of the housing 310. The fingerprint sensor may be disposed not only on the first surface 310A (e.g., the display 301) of the housing 310, but also on the second surface 310B thereof. The electronic device 101 may further include a sensor module (not shown), such as at least one of a gesture sensor, a gyroscope sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illumination sensor. The sensor modules 304 , 316 , and 319 are not limited to the above-described structure and may be variously designed and changed according to the structure of the electronic device 101 by installing only a part of the sensor module, adding a new sensor module, and the like.

[0075] According to an example embodiment, the camera modules 305, 312, and 313 may include, for example, a first camera module 305 provided on a first surface 310A of the electronic device 101, a second camera module 312 provided on a second surface 310B thereof, and / or a flash 313. The camera modules 305 and 312 may include one or more lenses, an image sensor, and / or an image signal processor. The flash 313 may include, for example, a light emitting diode or a xenon lamp. In an embodiment, two or more lenses (an infrared camera, a wide-angle lens, and a telephoto lens) and an image sensor may be provided on one surface of the electronic device 101. The camera modules 305, 312, and 313 are not limited to the above-described structures, and various designs and changes may be made according to the structure of the electronic device 101 by installing only a portion of the camera modules, adding new camera modules, and the like.

[0076] According to an example embodiment, the key input device 317 may be provided, for example, on the side surface 310C of the housing 310. In another embodiment, the electronic device 101 may not include one or all of the above-described key input devices 317, and the key input device 317 not included on the electronic device 101 may be implemented as another form of soft keys or the like on the display 301. In an embodiment, the key input device may include a sensor module 316 provided on the second surface 310B of the housing 310.

[0077] According to an example embodiment, the light emitting element 306 may be provided on, for example, the first surface 310A of the housing 310. The light emitting element 306 may provide, for example, status information of the electronic device 101 in the form of light. In another embodiment, the light emitting element 306 may provide, for example, a light source that interacts with the operation of the camera module 305. The light emitting element 306 may include, for example, a light emitting LED, an infrared LED, and a xenon lamp.

[0078] According to an exemplary embodiment, the connector holes 308 and 309 may include, for example, a first connector hole 308 and / or a second connector hole 309. The first connector hole 308 may receive a connector (e.g., a universal serial bus connector) for transmitting and receiving power and / or data to and from an external electronic device, and the second connector hole 309 may receive a connector for transmitting and receiving audio signals to and from an external electronic device. The connector holes 308 and 309 are not limited to the above-described structure, and various designs and changes may be made according to the structure of the electronic device 101 by installing only a portion of the connector holes, adding new connector holes, etc.

[0079] Figure 4 is an exploded perspective view illustrating an electronic device 101 according to various embodiments.

[0080] refer to Figure 4 , according to various embodiments of the electronic device 101 (eg, Figure 1 、 Figure 2 and Figure 3 The electronic device 101 may include a side frame structure 331, a first support member 332 (e.g., a bracket), a front panel 320, a display 330, a printed circuit board 340, a battery 350, a second support member 360 (e.g., a back cover), an antenna 370, and a back panel 380. In an embodiment, at least one element (e.g., the first support member 332 or the second support member 360) may be omitted from the electronic device 101, or another element may be added to the electronic device 101. At least one element of the electronic device 101 may be identical to the first support member 332 or the second support member 360. Figure 2 or Figure 3 At least one element of the electronic device 101 is the same or similar, and overlapping descriptions thereof will be omitted.

[0081] According to various embodiments, the first support member 332 may be disposed within the electronic device 101 and connected to the side frame structure 331, or may be integrally configured with the side frame structure 331. The first support member 332 may be formed of, for example, a metal material and / or a non-metallic (e.g., polymer) material. The first support member 332 may have one surface coupled to the display 330 and another surface coupled to the printed circuit board 340.

[0082] The printed circuit board 340 may be equipped with a processor, memory and / or interface. The processor may include, for example, but not limited to, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, a communication processor, etc.

[0083] According to various embodiments, the memory may include, for example but not limited to, volatile memory and / or non-volatile memory.

[0084] According to various embodiments, the interface may include, for example, but not limited to, a High-Definition Multimedia Interface (HDMI), a Universal Serial Bus (USB) interface, an SD card interface, and / or an audio interface, etc. The interface may, for example, electrically or physically connect the electronic device 101 to an external electronic device, and may include a USB connector, an SD card / MMC connector, or an audio connector.

[0085] According to various embodiments, the battery 350, which is a device for supplying power to at least one element of the electronic device 101, may include, for example, but not limited to, a non-rechargeable primary battery, a rechargeable secondary battery, a fuel cell, etc. At least a portion of the battery 350 may be provided, for example, on substantially the same plane as the printed circuit board 340. The battery 350 may be integrally provided inside the electronic device 101, or may be provided so as to be attachable to or detachable from the electronic device 101.

[0086] According to various embodiments, the antenna 370 may be provided between the back plate 380 and the battery 350. The antenna 370 may include, for example, but not limited to, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna 370 may, for example, perform local area network communication with an external device, or wirelessly transmit and receive power required for charging. In another embodiment, the antenna structure may be configured by a portion of the side frame structure 331 and / or the first support member 332, or a combination thereof.

[0087] Figure 5A is a cross-sectional view illustrating example structures for shielding and dissipating heat around electrical components according to various embodiments.

[0088] According to various embodiments, an electronic device (e.g., Figures 1 to 4 The electronic device 101 may include a circuit board 340, at least one electrical component (e.g., including a circuit) 510, a shielding cover 570, a shielding sheet 400 (e.g., a shielding layer 520, a support layer 530), at least one heat transfer member (e.g., a first heat transfer member) 540 (e.g., including a heat transfer interface material), and a bracket 332. According to example embodiments, Figure 5A The configuration of the circuit board 340 and the bracket 332 in the Figure 4The configurations of the printed circuit board 340 and the first supporting member 332 are the same.

[0089] exist Figure 5A In the embodiment, when the heat dissipation structure 500 is viewed from the side, "+Z" or -Z" may indicate an upper direction and a lower direction. In addition, in an example embodiment, "+Z" may refer to, for example, an electrical component 510 disposed inside the electronic device facing the front cover (e.g., Figure 4 The front direction of the front panel 320 of the electronic device, and "-Z" may refer to, for example, that the electrical component 510 disposed inside the electronic device faces the rear cover (eg, Figure 4 The rear direction of the rear plate 380).

[0090] According to various embodiments, a plurality of electrical components may be arranged on a circuit board 340 (eg, Figure 4 On at least one side surface of the circuit board 340). Some of the multiple electrical components 510 that are heat-generating sources may include, for example, but not limited to, at least one chip disposed on at least one side surface of the circuit board 340, and may include, for example, but not limited to, at least one of a power management integrated circuit (PMIC), a power amplifier (PAM), an application processor (AP), a communication processor (CP), a charger integrated circuit (IC), etc. In this example, the electrical component 510 may be an application processor (AP). However, it should be understood that the present disclosure is not limited thereto.

[0091] According to various embodiments, the shield cover 570 can be configured to surround at least a portion of the electrical component 510. According to another embodiment, when the heat dissipation structure 500 of the electronic device is viewed from the top (e.g., when viewed in the -Z direction), the shield cover 570 can have a structure having a first opening 571. The first opening 571 is provided on a portion of the electrical component 510 facing the shield cover 570, or on an area where at least a portion of the electrical component 510 and the shield cover 570 overlap each other, for example, an area where at least a portion of the electrical component 510 may come into contact with another material, so as to disperse heat generated in the electrical component 510 to the outside. The shield cover 570 can be coupled to one surface of the circuit board 340 (e.g., a surface facing the first direction (+Z)). The shield cover 570 can be coupled to at least a portion of one side surface of the circuit board 340 by, for example, but not limited to, soldering. For example, the shield cover 570 can include an upper surface including the first opening 571 and a side surface forming a space between the upper surface and the circuit board 340. The first opening 571 may provide a travel path for heat generated in the electrical element 510 , and the shield case 570 may be manufactured to have a shape (eg, a closed square ring) surrounding at least a portion of the electrical element 510 .

[0092] According to an example embodiment, the shielding sheet 400 may include a shielding layer 520 and a supporting layer 530. The shielding sheet 400 is disposed on one side surface of the electrical component 510 and may be used to prevent and / or reduce electromagnetic waves that may be generated in the electrical component 510 from affecting other electrical components (not shown) disposed inside the electronic device.

[0093] According to various embodiments, the shielding layer 520 is provided on at least a portion of the shielding cover 570. The shielding layer 520 can provide a shielding function against electromagnetic waves that may be generated by the electrical element 510, as well as a heat conduction function for transferring heat that may be generated by the electrical element 510 to the outside of the electrical element 510. According to an example embodiment, the shielding layer 520 can be provided to cover at least a portion of the first opening 571 of the shielding cover 570 to shield the electromagnetic waves from the electrical element 510. According to another embodiment, the shielding layer 520 can be provided on one side surface (e.g., the upper surface) of the shielding cover 570, for example, along a peripheral portion of the first opening 571 and a portion forming the first opening 571.

[0094] According to an exemplary embodiment, the shielding layer 520 may have elasticity to be compressed when subjected to external pressure. Heat generated in the electrical element 510 may be transferred to another layer through the shielding layer 520 after passing through the first opening 571 .

[0095] According to example embodiments, the shielding layer 520 can be implemented as a single shielding layer 520 by stacking various layers. For example, the shielding layer 520 may include a shielding film 523 and conductive adhesive films 521 and 525. According to example embodiments, the shielding film 523 may include, for example, a fiber film having a nanostructure to shield electromagnetic waves. For example, the fibers of the fiber film may be formed thin and long by, for example, a process based on an electrostatic spinning method, and the fiber film may be formed by a process in which the fibers thus formed are plated with, for example, copper (Cu), then plated with, for example, nickel (Ni), and finally plated with, for example, copper (Cu) again. The fiber film may be implemented as, for example, a nanostructure configured by overlapping each fiber formed by an electroplating process several times. The shielding film 523 may be configured to have a thickness of approximately 5 to 20 μm. According to example embodiments, the shielding film 523 may be disposed between the conductive adhesive films 521 and 525. According to example embodiments, a first conductive adhesive film 521 disposed between the support layer 530 and / or the first heat transfer member 540 and the shielding film 523 can adhere the shielding film 523 to the support layer 530 and / or the first heat transfer member 540. According to example embodiments, a second conductive adhesive film 525 is disposed between the shielding film 523 and the shielding cover 570 and / or the electrical component 510, and can adhere the shielding film 523 to at least a portion of the shielding cover 570 and / or the electrical component 510. When the shielding film 523 and the electrical component 510 are directly bonded by the second conductive adhesive film 525, heat transfer can be more efficient than when the shielding film 523 and the electrical component 510 are spaced apart from each other or when other foreign matter is disposed between them. For example, when the shielding film 523 and the electrical component 510 are spaced apart from each other or when other foreign matter is disposed between them, or when an air gap is formed between them, heat transfer may not be performed effectively. For example, when direct adhesion without other foreign matter or an air gap is present, heat transfer may be faster.

[0096] According to example embodiments, the conductive adhesive films 521 and 525 may have a thickness of, for example, about 5 μm.

[0097] According to various embodiments, the support layer 530 may be disposed between the shielding layer 520 and the bracket 332 and may include a second opening 535 corresponding to the first opening 571. The support layer 530 may support at least a portion of the shielding layer to prevent and / or reduce bending of at least a portion of the shielding layer 520 and may, for example, have a stacked structure including, for example, a copper (Cu) sheet 533 and an insulating sheet 531. The second opening 535 may penetrate a portion of the support layer 530 and may include at least a portion located at a position corresponding to the first opening 571. For example, the second opening 535 may be substantially formed as a space within which the first heat transfer member 540 is located. For example, a heat transfer path may be formed such that heat generated in the electrical element 510 is transferred to the shielding layer 520 through the first opening 571, and a portion of the heat transferred to the shielding layer 520 is transferred to the first heat transfer member 540 through the second opening 535 formed through the support layer 530. According to example embodiments, the support layer 530 may be configured to have a thickness of approximately 15 to 25 μm.

[0098] According to various embodiments, the first heat transfer member 540 can be positioned such that at least a portion of the first heat transfer member 540 is disposed within the second opening 535 of the support layer 530, and at least one surface of the first heat transfer member 540 contacts the shielding layer 520. The first heat transfer member 540 can be disposed between the bracket 332 and the electrical component 510 and can be formed, for example, from a carbon fiber thermal interface material (TIM) to effectively receive heat from the electrical component 510. However, the first heat transfer member 540 is not limited to a carbon fiber TIM and can include various heat dissipation materials or components for transferring heat generated in the electrical component 510 to the bracket 332. For example, the various heat dissipation materials or components can include, but are not limited to, heat pipes, heat sinks, and heat dissipation coatings. In this regard, the materials of the heat pipes, heat sinks, or heat dissipation coatings can include, for example, highly thermally conductive materials such as, but not limited to, graphite, carbon nanotubes, recycled natural materials, and silicon. As another example, the carbon fiber thermal interface material can include, for example, but not limited to, at least one of a liquid-phase thermal interface material and / or a solid-phase thermal interface material. In various embodiments, the carbon fiber thermal interface material may be formed from a solid phase thermal interface material (TIM).

[0099] According to an exemplary embodiment, the first heat transfer member 540 disposed within the second opening 535 may be bonded by the first conductive adhesive film 521. For example, the first heat transfer member 540 may be disposed such that at least a portion of the first heat transfer member 540 contacts the first conductive adhesive film 521, and at least another portion of the first heat transfer member 540 contacts at least a portion of the bracket 332. The first heat transfer member 540 can quickly and stably transfer heat generated in the electrical component 510 to the bracket 332 via the second opening 535 formed through the support layer 530. Since the support layer 530 is generally made of a material with high heat resistance, the heat dissipation function may be degraded when the support layer 530 is located on the heat transfer path. For example, without the second opening 535, the support layer 530 may make it difficult to transfer heat generated in the electrical component 510 to the bracket 332. In order to effectively perform heat transfer, the heat dissipation structure can be configured by forming a second opening 535 penetrating a portion of the support layer 530 with high heat resistance and arranging a first heat transfer member 540 formed of a material with low heat resistance for heat transfer in the opening so as to effectively transfer the heat generated in the electrical element 510.

[0100] In addition to the support layer 530, the heat dissipation structure 500 according to the present disclosure may include a first heat transfer member 540 disposed along the heat transfer path, which has excellent heat transfer properties. This allows heat generated in the electrical component 510 to be quickly distributed to the exterior of the electronic device via the bracket 332, thereby providing a cooling effect that reduces the temperature surrounding the electrical component 510. Furthermore, since a portion of the first heat transfer member 540 can be in direct contact with at least a portion of the shielding layer 520, the overall thickness of the heat dissipation structure can be reduced. For example, when the first heat transfer member 540 is disposed within the second opening 535 of the support layer 530, the length of the heat transfer path can be shortened compared to when the first heat transfer member 540 is disposed above the support layer 530. For example, the length of the heat transfer path for heat generated in the electrical component (e.g., AP) can be reduced by approximately 10 μm. Consequently, heat resistance is reduced by approximately 0.585°C / W, potentially resulting in a cooling effect on the electrical component (e.g., AP) to approximately 2 to 3°C (e.g., 2.34°C). As yet another example, a portion of the insulating sheet 531 of the support layer 530 having a large thermal resistance value is removed from the heat transfer path, so that thermal resistance from the electrical element 510 toward the first direction (+Z) may be reduced.

[0101] Figure 5B is a cross-sectional view illustrating an example structure for shielding and dissipating heat around electrical components according to example embodiments.

[0102] According to various embodiments, an electronic device (e.g., Figures 1 to 4The electronic device 101 may include a circuit board 340, at least one electrical element 510, a shielding cover 570, a shielding sheet (eg, a shielding layer 520), at least one heat transfer member (eg, a first heat transfer member 540), and a bracket 332. According to example embodiments, Figure 5B The elements in Figure 5A The components shown in are the same.

[0103] and Figure 5A The heat dissipation structure is different. Figure 5B The heat dissipation structure 500 may include a shielding sheet made of a shielding layer 520 (eg, excluding a support layer 530). The shielding layer 520 may include a shielding film 523 and conductive adhesive films 521 and 525 extending through the support layer (eg, Figure 5A The area where the supporting layer 530 is excluded, and thus the heat transferred from the electrical element 510 can be effectively transferred.

[0104] Figure 6 is a cross-sectional view illustrating an example structure for shielding and dissipating heat around electrical components according to another embodiment.

[0105] According to various embodiments, an electronic device (e.g., Figure 1 、 Figure 2 、 Figure 3 and Figure 4 The electronic device 101) may include a circuit board 340, at least one electrical component 510, a shielding cover 570, a shielding sheet (a shielding layer 520 and a supporting layer 530), at least one heat transfer member (for example, a first heat transfer member 540 and a second heat transfer member 550) and a bracket 332.

[0106] exist Figure 6 In the embodiment, “+Z” or “-Z” may refer to a direction viewed from the side of the heat dissipation structure 500, for example. In addition, in an example embodiment, “+Z” may refer to a direction in which, for example, the electrical component 510 disposed inside the electronic device faces the front cover (e.g., Figure 4 The front direction of the front panel 320 of the electronic device, and "-Z" may refer to, for example, that the electrical component 510 disposed inside the electronic device faces the rear cover (eg, Figure 4 The rear direction of the rear plate 380).

[0107] According to an exemplary embodiment, Figure 6 The configuration of the circuit board 340 and the bracket 332 in the Figure 4 The configurations of the printed circuit board 340 and the first supporting member 332 are the same. Figure 6 The configuration of at least one electrical element 510, the shielding cover 570, the shielding layer 520, the supporting layer 530 and the at least one first heat transfer member 540 may be partially or completely the same as Figure 5AThe configuration of at least one electrical element 510, shielding cover 570, shielding layer 520, supporting layer 530 and at least one first heat transfer member 540 is the same. Figure 5A A different second heat transfer member 550 .

[0108] According to various embodiments, a second heat transfer member 550 may be disposed between the electrical component 510 and the shielding layer 520 to form a heat transfer path through which heat generated in the electrical component 510 is transferred to the shielding layer 520. The second heat transfer member 550 may be disposed such that at least a portion thereof passes through the first opening 571 of the shielding cover 570. The second heat transfer member 550 may have a first surface 551 facing the first direction (+Z), which is adhered to a portion of the shielding film 523 (e.g., one side surface facing downward) via the second conductive adhesive film 525. The second heat transfer member 550 may be disposed such that a second surface 552 thereof facing the second direction (-Z) is in direct contact with at least a portion of the electrical component 510.

[0109] According to an exemplary embodiment, the second heat transfer member 550 may be formed, for example, of a carbon fiber thermal interface material (TIM) capable of transferring heat generated in the electrical element 510. However, the second heat transfer member 550 is not limited to the carbon fiber TIM, and may include various heat dissipation materials or members for transferring heat generated in the electrical element 510 to the bracket 332. For example, the various heat dissipation materials or members may include, for example, but not limited to, thermal interface materials (TIMs), heat pipes, heat sinks, heat dissipation paints, etc. In this regard, the material of the heat sink or heat dissipation paint may include, for example, but not limited to, highly thermally conductive materials such as graphite, carbon nanotubes, natural recycled materials, and silicon. As another example, the carbon fiber TIM may include at least one of a liquid-phase thermal interface material (TIM) and / or a solid-phase thermal interface material (TIM).

[0110] Reference again Figure 6 The heat transfer path through which heat generated by the electrical component 510 is transferred to the bracket 332 can be provided within the electronic device through a shielding sheet and at least one heat transfer member. For example, the heat of the electrical component 510 can be transferred to the shielding layer 520 via the second heat transfer member 550 disposed within the first opening 571 of the shield cover 570. The heat transferred to the shielding layer 520 can then be transferred to the bracket 332 via the first heat transfer member 540 that passes through the second opening 535 of the support layer 530.

[0111] Figure 7A is a cross-sectional view illustrating an exemplary structure for shielding and dissipating heat around electrical components according to various embodiments, Figure 7B is a cross-sectional view illustrating an exemplary structure for shielding and dissipating heat around electrical components according to various embodiments.

[0112] According to various embodiments, an electronic device (e.g., Figure 1 、 Figure 2 、 Figure 3 and Figure 4 The electronic device 101 may include a circuit board 340, at least one electrical component 510, a shielding cover 570, a shielding sheet (a shielding layer 520 and a supporting layer 530), at least one heat transfer member (e.g., a first heat transfer member 540), and a bracket 332. According to yet another example, the electronic device 101 may include a plurality of cooling members 581 and 582 and a plurality of heat sinks 591 and 592 disposed inside and / or near the bracket 332.

[0113] exist Figure 7A and Figure 7B In the embodiment, “+Z” or “-Z” may refer to, for example, the thickness direction of the heat dissipation structure 501. In addition, in an example embodiment, “+Z” may refer to, for example, the direction in which the electrical component 510 disposed inside the electronic device faces the front cover (e.g., Figure 4 The front direction of the front panel 320 of the electronic device, and "-Z" may refer to, for example, that the electrical component 510 disposed inside the electronic device faces the rear cover (eg, Figure 4 The rear direction of the rear plate 380).

[0114] According to an example embodiment, Figure 7A and Figure 7B At least a portion of the components (e.g., circuit board 340) may be partially or completely connected to Figure 4 or Figure 5A The following will focus on the description of Figure 5A Different plurality of cooling members 581 and 582 and plurality of heat sinks 591 and 592 .

[0115] According to various embodiments, the plurality of cooling members 581 and 582 and the plurality of heat dissipating fins 591 and 592 may be provided on at least one surface of the bracket 332, or may be provided inside the bracket 332. For example, the first heat dissipating fin 591 and the second cooling member 582 may be provided between the second heat dissipating fin 592 and the first cooling member 581. According to various embodiments, at least a portion of the lower surface of the bracket 332 facing the second direction (-Z) may be provided to contact at least a portion of the first heat transfer member 540.

[0116] The first heat sink 591 may be provided on at least a portion of the upper surface of the bracket 332 facing the first direction (+Z). The first heat sink 591 may be attached to the upper surface of the bracket 332 in the form of a plate, and the heat transferred from the electrical component 510 may be quickly diffused therethrough. As another example, the second heat sink 592 may be provided on the upper surface of the first heat sink 591, and thus may quickly dissipate heat together with the first heat sink 591. The first heat sink 591 and the second heat sink 592 may include materials having high thermal conductivity and may have different thermal conductivities from each other. For example, the first heat sink 591 may include, for example, but not limited to, a graphite plate, and the second heat sink 592 may include, for example, but not limited to, polyurethane (PU).

[0117] According to various embodiments, the bracket 332 may include an opening or a recessed structure provided inside thereof, and the first cooling member 581 and / or the second cooling member 582 may be provided in at least a portion of the opening or the recessed structure. Figure 7A The first cooling member 581 can be stably disposed in a recess (e.g., a seating groove) formed within the bracket 332, including at least a portion of its surface that substantially contacts at least a portion of the first heat transfer member 540, thereby forming a heat transfer path. The first cooling member 581 can transfer heat received from the first heat transfer member 540 to the bracket 332 and / or the second cooling member 582. As another example, the second cooling member 582 can be disposed between the first cooling member 581 and the first heat sink 591.

[0118] refer to Figure 7B The second cooling member 582 can be stably disposed in a recess (e.g., a seating groove) formed within the bracket 332, including at least a portion of its surface that substantially contacts at least a portion of the first heat transfer member 540, thereby forming a heat transfer path. The second cooling member 582 can transfer heat received from the first heat transfer member 540 to the bracket 332 and / or the first cooling member 581. The first cooling member 581 can be disposed between the second cooling member 582 and the first heat sink 591. According to another embodiment, the first cooling member 581 or the second cooling member 582 can be selectively omitted. The first cooling member 581 and the second cooling member 582 can include materials having high thermal conductivity and can have different thermal conductivities from each other. For example, the first cooling member 581 can include, for example, but not limited to, a water-cooled heat diffusion member, such as, but not limited to, a heat pipe, a steam chamber, etc., and the second cooling member 582 can include, for example, but not limited to, a metal plate, such as, but not limited to, a copper (Cu) plate.

[0119] According to example embodiments, the heat dissipation structure 501 may include a heat transfer path through which heat generated in the electrical element 510 may be transferred through the bracket 332, the plurality of cooling members 581 and 582, and the plurality of heat sinks 591 and 592. For example, heat from the electrical element 510 may be transferred to the first opening 571 of the shield cover 570 and the shielding layer 520, and the heat transferred to the shielding layer 520 may be transferred to the first heat transfer member 540 through the second opening 535 of the support layer 530, and then transferred through the bracket 332, the plurality of cooling members 581 and 582, and the plurality of heat sinks 591 and 592. At least a portion of the heat transferred to the first heat transfer member 540 may be transferred to the outside through the first cooling member 581, the second cooling member 582, the first heat sink 591, and the second heat sink 592 in sequence, thereby cooling the electrical element 510. As yet another example, heat provided to the first heat sink 591 , the second heat sink 592 , the first cooling member 581 , and the second cooling member 582 may be transferred to the bracket 332 .

[0120] Figure 8 is a cross-sectional view illustrating an example structure for shielding and dissipating heat around an electrical device according to various embodiments, Figure 9 is a cross-sectional view illustrating an example structure for shielding and dissipating heat around an electrical device according to various embodiments.

[0121] According to various embodiments, an electronic device (e.g., Figure 1 、 Figure 2 、 Figure 3 and Figure 4 The electronic device 101 may include a circuit board 340, at least one electrical component 510, a shielding cover 570, a shielding sheet (a shielding layer 520, a supporting layer 530), at least one heat transfer member (e.g., a first heat transfer member 540 and a second heat transfer member 550), and a bracket 332. According to another example, the electronic device 101 may include a cooling member 581 and / or 583 disposed within the bracket 332.

[0122] According to an example embodiment, Figure 8 and Figure 9 The components can be partially connected with Figure 4 7. The description will focus on the configuration of the cooling member 581 or 583 that is different from the previous drawings.

[0123] According to various embodiments, the heat dissipation structure 502 may include a second heat transfer member 550, a shielding layer 520, a first heat transfer member 540, a cooling member 581 or 583, a conductive adhesive member 585 and a bracket 332, which can be stacked sequentially along a first direction (+Z) based on the electrical components 510 set on the circuit board 340.

[0124] According to various embodiments, the shielding layer 520 may be disposed between the first heat transfer member 540 and the second heat transfer member 550. The first heat transfer member 540 may be partially or entirely disposed between the first heat transfer member 540 and the second heat transfer member 550. Figure 5A The second heat transfer member 550 may be in contact with at least a portion of the electrical component 510 to transfer heat generated in the electrical component 510 to the shielding layer 520. The second heat transfer member 550 may include at least a portion of the first opening 571 that passes through the shielding cover 570 and may include, for example, but not limited to, a liquid thermal interface material (TIM) to directly receive heat from the electrical component 510.

[0125] According to various embodiments, the cooling member 581 or 583 may be installed inside the bracket 332, and a conductive adhesive member 585 may be provided to fix the cooling member 581 or 583 to the bracket 332 and effectively transfer heat. For example, the cooling member 581 or 583 and the conductive adhesive member 585 may be stably placed in a recess (e.g., a seating groove) formed inside the bracket 332, and the cooling member 581 or 583 may have at least a portion in contact with the first heat transfer member 540 to transfer heat. The cooling member 581 or 583 may include, for example, but not limited to, a heat pipe (e.g., Figure 8 cooling member 581), a steam chamber (e.g., Figure 9 Cooling member 583) etc. Heat pipes and vapor chambers are one of the heat exchangers that can effectively transfer heat between two objects by utilizing the characteristics of rapid changes in thermal conductivity and physical properties (phase change). For example, a heat pipe can be configured in the form of a tube containing copper or aluminum, and can be used to transfer heat generated from a heat source to a heat sink through a liquid stored therein, the liquid having high thermal conductivity. The vapor chamber can disperse heat based on the principle that a heated liquid turns into vapor and returns to the liquid again when the heat is dispersed therefrom, and can effectively disperse heat over a larger area than a heat pipe.

[0126] The conductive adhesive member 585 may be a structure constructed of a conductive tape or welding in order to fix the cooling member 581 or 583 to the bracket 332 and prevent and / or reduce an increase in thermal resistance.

[0127] Reference again Figure 8 and Figure 9The heat dissipation structure 502 can provide a heat path through which heat generated in the electrical component 510 is transferred to the bracket 332 and the cooling member 581 or 583. For example, the heat from the electrical component 510 can be transferred to the shielding layer 520 via the second heat transfer member 550 that passes through the first opening 571 of the shield cover 570. The heat transferred to the shielding layer 520 can then be directly transferred to the bracket 332 after being concentrated in the first heat transfer member 540 through the second opening 535 of the support layer 530. As another example, the heat transferred to the first heat transfer member 540 can be diffused to the outside through the cooling member 581 or 583. As yet another example, the heat provided to the cooling member 581 or 583 can be transferred to the bracket 332.

[0128] Figure 10 is a cross-sectional view illustrating example structures for shielding and dissipating heat around electrical components according to various embodiments.

[0129] According to various embodiments, an electronic device (e.g., Figures 1 to 4 The electronic device 101 may include a circuit board 340, at least one electrical component 510, a shielding cover 570, a shielding layer 520, a supporting layer 530, at least one heat transfer member (e.g., a first heat transfer member 540 and a second heat transfer member 550), and a bracket 332. According to another example, the electronic device 101 may include the bracket 332 and a plurality of cooling members 581 and 582 disposed therein.

[0130] According to an example embodiment, Figure 10 The components can be partially connected with Figure 4 Or the same as the elements described in Fig. 7. Hereinafter, the configuration of the plurality of cooling members 581 and 582 which is different from the elements described in the previous drawings will be described with emphasis.

[0131] According to various embodiments, the heat dissipation structure 502 may include a second heat transfer member 550, a shielding layer 520, a first heat transfer member 540, a first cooling member 581 and a second cooling member 582, which may be stacked sequentially along a first direction (+Z) based on the electrical components 510 set on the circuit board 340.

[0132] According to various embodiments, the first cooling member 581 and the second cooling member 582 may be mounted within the bracket 332. The bracket 332 may include an opening or a recessed structure formed through the interior of the bracket 332, and the first cooling member 581 and the second cooling member 582 may be disposed in the opening or recessed structure. For example, the first cooling member 581 may be stably placed in a recess (e.g., a seating groove) formed within the bracket 332, including at least a portion of its surface substantially in contact with the first heat transfer member 540, thereby minimizing and / or reducing the heat transfer path.

[0133] According to an exemplary embodiment, a conductive adhesive member 585 including a structure constructed by, for example, conductive tape or welding may be provided within the bracket 332 to secure the second cooling member 582 to the inside of the bracket 332 and prevent and / or reduce an increase in thermal resistance. Figure 10 The heat dissipation structure 502 can provide a heat transfer path through which heat generated in the electrical component 510 is transferred to the bracket 332 and the cooling members 581 and 582. For example, heat from the electrical component 510 can be transferred to the shielding layer 520 via the second heat transfer member 550 that passes through the first opening 571 of the shield cover 570. The heat transferred to the shielding layer 520 can then be directly transferred to the bracket 332 after being concentrated in the first heat transfer member 540 through the second opening 535 of the support layer 530. As another example, the heat transferred to the first heat transfer member 540 can then be transferred to the outside through the first cooling member 581 and / or the second cooling member 582 and then transferred to the bracket 332. As another example, the heat provided to the first cooling member 581 and / or the second cooling member 582 can be transferred to the bracket 332, at least a portion of the provided heat can be transferred through the first cooling member 581 and / or the second cooling member 582, or at least a portion of the heat can be transferred back from the bracket 332.

[0134] Figure 11 is a cross-sectional view illustrating example structures for shielding and dissipating heat around electrical components according to various embodiments.

[0135] According to various embodiments, an electronic device (e.g., Figures 1 to 4 The electronic device 101 may include a circuit board 340, at least one electrical component 510, a shielding cover 570, a shielding layer 520, a supporting layer 530, at least one heat transfer member (e.g., a first heat transfer member 540 and a second heat transfer member 550), and a bracket 332. According to another example, the electronic device 101 may include a bracket 332 and a plurality of cooling members 581 and 582.

[0136] According to an exemplary embodiment, Figure 11 The components can be partially connected with Figure 4 7. Hereinafter, description will be focused on the configuration of the plurality of cooling members 581 and 582 that are different from the elements described in the previous drawings.

[0137] According to various embodiments, the heat dissipation structure 503 may include a second heat transfer member 550, a shielding layer 520, a first heat transfer member 540, a second cooling member 582 and a first cooling member 581, which may be stacked sequentially along a first direction (+Z) based on the electrical components 510 set on the circuit board 340.

[0138] According to various embodiments, the second cooling member 582 may be disposed between the bracket 332 and the first heat transfer member 540. For example, the second cooling member 582 may be in contact with the lower surface of the bracket 332 and the upper surface of the first heat transfer member 540, thereby minimizing and / or reducing the heat transfer path. The first cooling member 581 may be mounted inside the bracket 332. For example, the first cooling member 581 may be stably placed in a recess (e.g., a seating groove) formed inside the bracket 332, including a lower surface that is substantially in contact with one surface of the second cooling member 582, thereby minimizing and / or reducing the heat transfer path.

[0139] According to example embodiments, a conductive adhesive member 585 may be provided on at least one surface of the first cooling member 581 and the second cooling member 582 to secure them to one side or inner side of the bracket 332 and prevent and / or reduce an increase in thermal resistance. The conductive adhesive member 585 may be a structure configured by conductive tape or welding. The conductive adhesive member 585 may be located on the upper surface of the first cooling member 581 and the upper surface of the second cooling member 582 that are in contact with the bracket 332.

[0140] Reference again Figure 11 , the heat dissipation structure 503 can provide a heat path through which heat generated from the electrical component 510 is transferred to the bracket 332 and the cooling members 581 and 582. For example, the heat from the electrical component 510 can be transferred to the shielding layer 520 via the second heat transfer member 550 that passes through the first opening 571 of the shield cover 570. The heat transferred to the shielding layer 520 can be directly transferred to the bracket 332 after being concentrated in the first heat transfer member 540 and the second cooling member 582 through the second opening 535 of the support layer 530, or can be transferred to the bracket 332 via the first cooling member 581. As another example, the heat provided to the first cooling member 581 and / or the second cooling member 582 can be transferred to the bracket 332 or can be transferred back from the bracket 332.

[0141] Figure 12 is a cross-sectional view illustrating an example structure for shielding and dissipating heat around an electrical device according to various embodiments, Figure 13 is a cross-sectional view illustrating an example structure for shielding and dissipating heat around an electrical device according to various embodiments.

[0142] According to various embodiments, an electronic device (e.g., Figure 1 、 Figure 2 、 Figure 3 and Figure 4The electronic device 101 may include a circuit board 340, at least one electrical component 510, a shielding cover 570, a shielding layer 520, a supporting layer 530, at least one heat transfer member (e.g., a first heat transfer member 540 and a second heat transfer member 550), and a bracket 332. According to another example, the electronic device 101 may include a plurality of cooling members 582 and 583 disposed in the bracket 332.

[0143] According to an example embodiment, Figure 12 and Figure 13 The configuration can be partially or completely Figure 4 Or the same as the configuration of Figure 7. The description will focus on the configurations of cooling members 582 and 583, which are shown different in the previous figures.

[0144] According to various embodiments, the heat dissipation structure 503 may include a second heat transfer member 550 , a shielding layer 520 , a first heat transfer member 540 , and cooling members 582 and 583 , which may be sequentially stacked along a first direction (+Z) based on the electrical elements 510 disposed on the circuit board 340 .

[0145] According to various embodiments, the second cooling member 582 and the third cooling member 583 may be installed in the bracket 332. The bracket 332 may include an opening or a recessed structure passing through the interior of the bracket 332, and the second cooling member 582 and the third cooling member 583 may be disposed in the opening or recessed structure. The second cooling member 582 may include, for example, but not limited to, a metal plate, such as, but not limited to, a copper (Cu) plate, and the third cooling member 583 may include, for example, but not limited to, a steam chamber.

[0146] refer to Figure 12 The third cooling member 583 can be stably placed in a recess (e.g., a seating groove) formed inside the bracket 332, including at least a portion of the surface that is substantially in contact with the first heat transfer member 540, thereby minimizing and / or reducing the heat transfer path. The second cooling member 582 can be provided on the upper surface of the third cooling member 583 to diffuse heat transferred from the third cooling member 583 or transfer the heat to the bracket 332.

[0147] refer to Figure 13The third cooling member 583 may be disposed within the bracket 332 and may include at least one recess formed therein. The second cooling member 582 may be stably positioned within a recess (e.g., a seating groove) formed within the third cooling member 583, including at least a portion of a surface that is substantially in contact with the first heat transfer member 540, thereby minimizing and / or reducing the heat transfer path. The second cooling member 582 may transfer heat transferred from the first heat transfer member 540 to the third cooling member 583, and the third cooling member 583 may diffuse the heat transferred therefrom or transfer the heat to the bracket 332.

[0148] Figure 14 is a cross-sectional view illustrating an example structure for shielding and dissipating heat around an electrical device according to various embodiments, Figure 15 is a cross-sectional view illustrating an example structure for shielding and dissipating heat around an electrical device according to various embodiments.

[0149] According to various embodiments, an electronic device (e.g., Figure 1 、 Figure 2 、 Figure 3 and Figure 4 The electronic device 101 may include a circuit board 340, at least one electrical component 510, a shielding cover 570, a shielding layer 520, a supporting layer 530, at least one heat transfer member (e.g., a first heat transfer member 540), and a bracket 332. According to yet another embodiment, the electronic device 101 may include a plurality of cooling members 581 and 582 and a plurality of heat sinks 591 and 592 disposed inside and / or near the bracket 332.

[0150] According to an exemplary embodiment, Figure 14 and Figure 15 The components can be partially connected with Figure 4 7. The description will focus on the configuration of the plurality of cooling members 581 and 582 and the plurality of heat sinks 591 and 592, which are different from the elements described in the previous drawings.

[0151] According to various embodiments, the heat dissipation structure 504 may include a shielding layer 520, a first heat transfer member 540, a cooling member (for example, a first cooling member 581 and a second cooling member 582), a bracket 332, a first heat sink 591 and a second heat sink 592, which can be stacked sequentially along a first direction (+Z) based on the electrical components 510 set on the circuit board 340.

[0152] According to various embodiments, the first cooling member 581 and the second cooling member 582 may be disposed within the bracket 332, and a conductive adhesive member 585 including a structure constructed of conductive tape or welding may be located within the bracket 332 to secure the first cooling member 581 and the second cooling member 582 to the bracket 332 and prevent and / or reduce an increase in thermal resistance. The first cooling member 581 may be, for example, a heat pipe, and the second cooling member 582 may be, for example, a metal plate, such as a copper (Cu) plate.

[0153] Reference Figure 14 , the first cooling member 581 and the second cooling member 582 may be disposed in a recess formed inside the bracket 332, and the second cooling member 582 and the first cooling member 581 may be sequentially disposed on the upper surface of the first heat transfer member 540. Compared to the first cooling member 581, the second cooling member 582 may have a relatively larger area. Figure 15 , the first cooling member 581 and the second cooling member 582 may pass through the bracket 332. The first cooling member 581 and the second cooling member 582 may be sequentially disposed on the upper surface of the first heat transfer member 540, and the second cooling member 582 may have a relatively larger area than the first cooling member 581.

[0154] According to various embodiments, the first heat transfer member may contact the lower surface of the bracket 332 facing the second direction (-Z), and the first heat sink 591 may be disposed on the upper surface of the bracket 332 facing the first direction (+Z). The first heat sink 591 may include at least a portion facing the first heat transfer member 540 and be attached to the top surface of the bracket 332 in the form of a plate, thereby rapidly dissipating heat transferred from the electrical component 510. As another example, a second heat sink 592 having a size corresponding to that of the first heat sink 591 may be disposed on the upper surface of the first heat sink 591, thereby rapidly dissipating heat together with the first heat sink 591. The first and second heat sinks 591, 592 may include materials with high thermal conductivity and may have different thermal conductivities. For example, the first heat sink 591 may include, for example but not limited to, a graphite plate, and the second heat sink 592 may include, for example but not limited to, a foam containing a material such as, but not limited to, polyurethane (PU).

[0155] Reference again Figure 14 and Figure 15The heat dissipation structure 504 can provide a heat transfer path through which heat generated from the electrical component 510 is transferred to the bracket 332, the plurality of cooling members 581 and 582, and the plurality of heat sinks 591 and 592. For example, the heat from the electrical component 510 can be transferred to the shielding layer 520 through the first opening 571 of the shield cover 570, and the heat transferred to the shielding layer 520 can be directly transferred to the second cooling member 582 or the first cooling member 581 after being concentrated in the first heat transfer member 540 through the second opening 535 of the support layer 530. The heat of the second cooling member 582 and the first cooling member 581 can be diffused to the first heat sink 591 and the second heat sink 592 through the bracket 332.

[0156] Figure 16 is a cross-sectional view illustrating example structures disposed around electrical components for shielding and heat dissipation according to various embodiments.

[0157] According to various embodiments, an electronic device (e.g., Figures 1 to 4 The electronic device 101 may include a circuit board 340, at least one electrical component 510, a shielding cover 570, a shielding layer 520, a supporting layer 530, at least one heat transfer member (e.g., a first heat transfer member 540), and a bracket 332. According to another example, the electronic device 101 may include a cooling member 583 and heat sinks 591 and 592 disposed inside and / or near the bracket 332.

[0158] According to an exemplary embodiment, Figure 16 The configuration of the circuit board 340 and the bracket 332 in the Figure 4 The configurations of the printed circuit board 340 and the first supporting member 332 are the same. Figure 16 The configuration of the at least one electrical element 510, the shielding cover 570, the shielding layer 520, the support layer 530 and the first heat transfer member 540 in FIG. 5 may be partially or entirely the same as the configuration of the at least one electrical element 510, the shielding cover 570, the shielding layer 520, the support layer 530 and the first heat transfer member 540 in FIG. 5 . Figure 16 The configuration of the plurality of cooling members 583 and the plurality of heat sinks 591 and 592 can be the same as Figure 9 The configurations of the multiple cooling members 583 in FIG. 7 and the multiple heat sinks 591 and 592 in FIG. 7 are partially or entirely the same.

[0159] According to various embodiments, the heat dissipation structure 504 may include a shielding layer 520, a first heat transfer member 540, a third cooling member 583, a first heat sink 591 and a second heat sink 592, which may be stacked sequentially along a first direction (+Z) based on the electrical components 510 set on the circuit board 340.

[0160] According to various embodiments, the third cooling member 583 may be disposed inside the bracket 332 and may penetrate the bracket 332 to thereby diffuse heat. The third cooling member 583 may contact the first heat transfer member 540 on its lower surface and may contact the first heat sink 591 on its upper surface, thereby reducing thermal resistance through the third cooling member 583.

[0161] According to various embodiments, the first heat sink 591 may be provided on the upper surface of the third cooling member 583, facing the first direction (+Z). The first heat sink 591 may include at least a portion facing the first heat transfer member 540, attached in the form of a plate, so that heat can be quickly transferred from the electrical element 510 through the third cooling member 583. As another example, the second heat sink 592 may be provided on the upper surface of the first heat sink 591, and thus can quickly dissipate heat together with the first heat sink 591. The first heat sink 591 and the second heat sink 592 may include materials with high thermal conductivity and may have different thermal conductivities from each other. For example, the first heat sink 591 may include, for example but not limited to, a graphite plate, and the second heat sink 592 may include, for example but not limited to, a foam of a material including, for example but not limited to, polyurethane (PU).

[0162] Figure 17 is a cross-sectional view illustrating an example structure for shielding and dissipating heat around an electrical device according to various embodiments, Figure 18 is a cross-sectional view illustrating an example structure for shielding and dissipating heat around an electrical device according to various embodiments, Figure 19 is a cross-sectional view illustrating an example structure for shielding and dissipating heat around an electrical device according to various embodiments.

[0163] According to an example embodiment, Figure 17 、 Figure 18 and Figure 19 The components can be partially connected with Figure 4 、 Figure 11 or Figure 12 Hereinafter, description will focus on the configuration of the shielding structure 580 that is different from the elements described in the previous figures.

[0164] refer to Figure 17 The heat dissipation structure 505 may include a shielding structure 580, a first heat transfer member 540, a second cooling member 582, a first cooling member 581 and a bracket 332, which may be sequentially stacked along the first direction (+Z) based on the electrical components 510 disposed on the circuit board 340. Figure 11 Different from the heat dissipation structure 503, the second heat transfer member 550 can be Figure 17 The heat dissipation structure 505 is excluded.

[0165] According to various embodiments, the shielding structure 580 may surround at least a portion (e.g., all surfaces except the bottom surface) of the electrical component 510 disposed on the circuit board 340. The shielding structure 580 may be manufactured by directly coating the upper surface or side surface of the electrical component 510 using a coating process using a shielding coating material, such as a nano-spraying process.

[0166] According to various embodiments, the first heat transfer member 540, the second cooling member 582, and the first cooling member 581 may be stacked on the upper surface of the shielding structure 580 implemented by the silver nanocoating. For example, the second cooling member 582 may include a metal plate, such as but not limited to a copper (Cu) plate, and the first cooling member 581 may include, for example, but not limited to, a heat pipe.

[0167] refer to Figure 18 The heat dissipation structure 505 may include a shielding structure 580, a first heat transfer member 540, a first cooling member 581, and a second cooling member 582, which may be sequentially stacked along the first direction (+Z) based on the electrical components 510 disposed on the circuit board 340. Figure 11 Different from the heat dissipation structure 503, the second heat transfer member 550 can be Figure 18 The heat dissipation structure 505 is excluded.

[0168] According to various embodiments, the shielding structure 580 may be formed by a process similar to Figure 17 The shielding structure is manufactured by directly coating the upper and side surfaces of the electrical component 510 using a nano-spraying process. The first cooling member 581 and the second cooling member 582 can be set in the bracket 332, and the conductive adhesive member 585 including a structure constructed by conductive tape or welding can be set in at least a portion of the bracket 332 to fix the first cooling member 581 or the second cooling member 582 to the interior of the bracket 332 and prevent and / or reduce the increase in thermal resistance. For example, the first cooling member 581 can include, for example but not limited to, a heat pipe, and the second cooling member 582 can include a metal plate, for example but not limited to a copper (Cu) plate.

[0169] refer to Figure 19 The heat dissipation structure 505 may include a shielding structure 580, a first heat transfer member 540, and a third cooling member 583, which may be sequentially stacked along the first direction (+Z) based on the electrical components 510 disposed on the circuit board 340. Figure 12 Different from the heat dissipation structure 503, the second heat transfer member 550 can be Figure 18 The heat dissipation structure 505 is excluded.

[0170] According to various embodiments, the shielding structure 580 may be formed by a process similar to Figure 17The shielding structure is manufactured by directly coating the upper and side surfaces of the electrical element 510 with a nano-spraying process. The third cooling member 583 can pass through the bracket 332 to directly receive heat from the first heat transfer member 540, and can transfer the heat to the bracket 332 or directly diffuse the heat.

[0171] Figure 20 is a cross-sectional view showing an example of manufacturing a heat dissipation structure according to various embodiments, Figure 21 is a cross-sectional view illustrating an example of manufacturing a heat dissipation structure according to various embodiments.

[0172] According to various embodiments, a method for controlling an electrical component (eg, Figure 5A The heat dissipation assembly 401 for shielding and dissipating the electrical component 510 may include a shielding sheet 400 and a first heat transfer member 540. For example, the shielding sheet 400 and the first heat transfer member 540 may be assembled to a shielding cover (e.g., a heat shielding cover) covering the electrical component 510 after being manufactured as one component. Figure 5A On the shielding cover 570).

[0173] According to various embodiments, the shielding sheet 400 may include a shielding layer 520 and a supporting layer 530, and may be partially or completely connected to the shielding layer 520 and the supporting layer 530. Figure 5A The configurations of the shielding layer 520 and the supporting layer 530 are the same.

[0174] refer to Figure 20 , the shielding layer 520 and the supporting layer 530 can be stacked on the upper surface of the release paper 701, and the first heat transfer member 540 can be stably placed in the second opening 535 of the supporting layer 530. The release paper can adhere to or attach to a specific adhesion surface and attachment surface. The guide pad 702 can be set on the edge of the upper surface of the release paper 701. The guide pad 702 can surround the shielding layer 520, the supporting layer 530 and the first heat transfer member 540 together with the release paper 701. The guide pad 702 can be configured to be higher than the shielding sheet 400 and the first heat transfer member 540. Then, the reel is wound with reference to the guide pad 702, so that the heat dissipation assembly 401 can be moved to the automatic line in a protected state of the shielding sheet 400 and the first heat transfer member 540.

[0175] Reference Figure 21 , the heat dissipation assembly 401 can be moved to an automatic line by placing a guide pad 702 on the edge of the bottom of the release paper 701 and winding it on a reel in a state where the first heat transfer member 540 is protected therein.

[0176] According to an exemplary embodiment, heat dissipation assembly 401 may be moved around electrical component 510 while being protected by guide pad 702 and release paper 701 , and then adhered to electrical component 510 after release paper 701 is removed therefrom.

[0177] According to various exemplary embodiments, electronic devices (eg, Figure 1 、 Figure 2 、 Figure 3 and Figure 4 The electronic device 101 may include: a circuit board (eg, Figure 5A 340); electrical components arranged on the upper surface of the circuit board (eg, Figure 5A 510); shielding cover (for example, Figure 5A 570), which surrounds at least a portion of the electrical component and includes a first opening (e.g., Figure 5A 571); shielding sheet (e.g., Figure 5A 400), the shielding sheet includes a shielding layer (eg, Figure 5A 520) and a second opening (eg, Figure 5A 535) of the support layer (eg, 530); and a first heat transfer member (eg, Figure 5A 540), the first heat transfer member includes a heat dissipation material, and the first heat transfer member includes at least a portion disposed inside the second opening, and at least one surface of the first heat transfer member contacts the shielding layer.

[0178] According to various example embodiments, the electronic device may further include a second heat transfer member (eg, Figure 6 550), the second heat transfer member includes a heat dissipation material disposed between the electrical component and the shielding layer, the second heat transfer member includes at least a portion passing through the first opening, and includes at least one surface in contact with the electrical component.

[0179] According to various example embodiments, the shielding layer may cover the first opening.

[0180] According to various example embodiments, the shielding layer may include: a shielding film including a fiber film (eg, Figure 5A 523); a first conductive adhesive film (eg, Figure 5A and a second conductive adhesive film (eg, Figure 5A 525 in). The first conductive adhesive film can be adhered to the upper surface of the shielding film and the first heat transfer member, and the second conductive adhesive film can be adhered to the lower surface of the shielding film and the upper surface of the electrical component.

[0181] According to various example embodiments, the shielding layer may include: a shielding film including a fiber film (eg, Figure 6 523); a first conductive adhesive film (eg, Figure 6 and a second conductive adhesive film (eg, Figure 6 525 in). The first conductive adhesive film can be adhered to the upper surface of the shielding film and the first heat transfer member, and the second conductive adhesive film can be adhered to the lower surface of the shielding film and the second heat transfer member.

[0182] According to various example embodiments, the at least one electrical element may include at least one of a power management integrated circuit (PMIC), a power amplifier (PAM), an application processor (AP), a communication processor (CP), and a charger integrated circuit (IC).

[0183] According to various example embodiments, the support layer may include a copper (Cu) sheet (eg, Figure 5A 533) and insulating sheets (e.g., Figure 5A 531 in), and the copper sheet can be arranged between the insulating sheet and the shielding layer.

[0184] According to various exemplary embodiments, heat generated from the electrical element may be transferred to the shielding layer through the first opening of the shield cover, and the heat transferred to the shielding layer may be transferred to the bracket through the first heat transfer member passing through the second opening of the support layer.

[0185] According to various exemplary embodiments, heat generated from the electrical element may be transferred to the shielding layer through the second heat transfer member passing through the first opening of the shield cover, and the heat transferred to the shielding layer may be transferred to the bracket through the first heat transfer member passing through the second opening of the support layer.

[0186] According to various exemplary embodiments, the first heat transfer member and the second heat transfer member comprise a carbon fiber thermal interface material (TIM).

[0187] According to various example embodiments, the electronic device may further include at least one cooling member (eg, 581 and 582 in FIG. 7 ) disposed inside the bracket, and the cooling member may include at least one of a heat pipe, a copper (Cu) plate, and a vapor chamber.

[0188] According to various example embodiments, the electronic device may further include at least one heat sink (e.g., 591 and 592 in FIG. 7 ) disposed on one surface of the bracket, and the heat sink may include at least one of a graphite plate and a foam including a material such as polyurethane (PU).

[0189] According to various example embodiments, the cooling member may include a first cooling member (e.g., 581 in FIG. 7 ) and a second cooling member (e.g., 582 in FIG. 7 ), and the first cooling member may be in contact with at least a portion of the upper surface of the first heat transfer member, and the second cooling member may be in contact with the upper surface of the first cooling member. The first cooling member and the second cooling member may pass through the bracket.

[0190] According to various example embodiments, the electronic device may further include a conductive adhesive member (eg, Figure 8 585) to secure at least one cooling member to the bracket and provide a heat transfer path.

[0191] According to various example embodiments, the cooling member may include a first cooling member (eg, Figure 13 581) and a third cooling member (e.g., Figure 13 583), and the third cooling member may surround at least a portion of the first cooling member.

[0192] According to various exemplary embodiments, electronic devices (eg, Figure 1 、 Figure 2 、 Figure 3 and Figure 4 The electronic device 101 may include: a housing (eg, Figure 2 and Figure 3 310 in); a circuit board (eg, Figure 5A 340 in); electrical components arranged on the upper surface of the circuit board (eg, Figure 5A 510 in); shielding cover (e.g., Figure 5A 570 in the figure), the shielding cover surrounds at least a portion of the electrical component, and the shielding cover includes a first opening (eg, Figure 5A 571 in); shielding sheet (e.g., Figure 5A 400 in the figure), the shielding sheet covers the first opening of the shielding cover and includes a recessed portion facing at least a portion of the first opening (eg, Figure 5A a second opening 535 in the middle); and a first heat transfer member (eg, Figure 5A 540), the first heat transfer member comprises a heat dissipation material stably disposed in the recess of the shielding sheet, and the first heat transfer member is configured to guide a heat transfer path for directing heat generated in the electrical component to the housing.

[0193] According to various exemplary embodiments, a shielding sheet may include: a shielding film; a first conductive adhesive film disposed on an upper surface of the shielding film; a second conductive adhesive film disposed on a lower surface of the shielding film; and a support layer disposed on an upper surface of the first conductive adhesive film, the support layer including a second opening formed therethrough. The first heat transfer member may be adhered to the first conductive adhesive film while passing through the second opening.

[0194] According to various example embodiments, the second opening may have a closed loop shape and a size corresponding to an area of ​​the electrical component.

[0195] According to various example embodiments, the electronic device may further include a second heat transfer member (eg, Figure 6 550), the second heat transfer member includes a heat dissipation material disposed between the electrical component and the shielding layer, the second heat transfer member has at least a portion passing through the first opening, and has a lower surface in contact with the electrical component.

[0196] According to various example embodiments, the electronic device may further include at least one cooling member including a heat dissipation material disposed inside the bracket, and at least one heat dissipation fin disposed on an upper surface of the bracket and having at least a portion facing the first heat transfer member.

[0197] According to various exemplary embodiments, electronic devices (eg, Figure 1 、 Figure 2 、 Figure 3 and Figure 4 The electronic device 101) may include: a circuit board; an electrical component arranged on the upper surface of the circuit board; a bracket; a shielding sheet arranged between the electrical component and the bracket, the shielding sheet including a shielding layer and a supporting layer, the supporting layer being arranged on the upper surface of the shielding layer and including an opening; and a first heat transfer member containing a heat dissipation material, the first heat transfer member including at least a portion arranged in the opening and at least one surface in contact with the shielding layer.

[0198] According to various example embodiments, the electronic device may further include a second heat transfer member including a heat dissipation material disposed between the electronic device and the shielding sheet.

[0199] The heat dissipation structure according to various embodiments and the electronic device including the heat dissipation structure are not limited to the above-mentioned exemplary embodiments and drawings, and it is obvious to those skilled in the art in the art that various replacements, modifications and changes can be made without departing from the true spirit and full scope of the present disclosure including the appended claims and their equivalents.

Claims

1. An electronic device, comprising: circuit boards; an electrical component disposed on the upper surface of the circuit board; a shielding cover surrounding at least a portion of the electrical component and including a first opening formed through a portion of the shielding cover facing the electrical component; a shielding sheet comprising a shielding layer disposed on at least a portion of the shielding cover and a supporting layer disposed on an upper surface of the shielding layer, wherein the supporting layer comprises a second opening corresponding to the first opening; as well as a first heat transfer member including a heat dissipating material, at least a portion of the first heat transfer member being disposed within the second opening, and having at least one surface in contact with the shielding layer, Wherein, the shielding layer comprises: a shielding membrane comprising a fiber membrane; and a first conductive adhesive film and a second conductive adhesive film, wherein the first conductive adhesive film and the second conductive adhesive film are respectively arranged on opposite surfaces of the shielding film, The first conductive adhesive film is adhered to the upper surface of the shielding film, the support layer and the first heat transfer member, and the second conductive adhesive film is adhered to the lower surface of the shielding film and the surface of the shielding cover.

2. The electronic device according to claim 1 , further comprising a second heat transfer member disposed between the electrical component and the shielding layer, the second heat transfer member comprising a heat dissipation material, and including at least a portion passing through the first opening and at least one surface in contact with the electrical component.

3. The electronic device according to claim 1, wherein The shielding layer is configured to cover the first opening.

4. The electronic device according to claim 1, wherein The second conductive adhesive film is adhered to the upper surface of the electrical component.

5. The electronic device according to claim 2, wherein: The second conductive adhesive film is adhered to the second heat transfer member. The electronic device according to claim 1 , wherein: The supporting layer includes a copper sheet and an insulating sheet, Wherein, the copper sheet is arranged between the insulating sheet and the shielding layer.

7. The electronic device according to claim 1, further comprising a bracket, in, heat generated from the electrical component is configured to be transferred to the shielding layer and the first opening of the shield case, The heat transferred from the shielding layer is configured to be transferred to the bracket through the first heat transfer member passing through the second opening of the supporting layer.

8. The electronic device according to claim 2, further comprising a bracket, in, heat generated from the electrical component is configured to be transferred to the shielding layer through the second heat transfer member passing through the first opening of the shield case, The heat transferred from the shielding layer is configured to transfer the heat transferred to the bracket through the first heat transfer member passing through the second opening of the support layer, and Wherein, the first heat transfer component and the second heat transfer component include carbon fiber thermal interface material.

9. The electronic device according to claim 1, further comprising a bracket and at least one cooling member disposed inside the bracket. in, The at least one cooling member includes at least one of a heat pipe, a copper plate, and a vapor chamber.

10. The electronic device according to claim 1, further comprising a bracket and at least one heat sink disposed on one surface of the bracket. in, The heat sink includes at least one of a graphite plate and a foam including polyurethane.

11. The electronic device according to claim 9, wherein: The cooling member includes a first cooling member and a second cooling member, The first cooling member contacts at least a portion of an upper surface of the first heat transfer member, the second cooling member contacts an upper surface of the first cooling member, and the first cooling member and the second cooling member are disposed to pass through the bracket. 12 . The electronic device according to claim 9 , further comprising a conductive adhesive disposed inside the bracket, wherein the conductive adhesive is configured to fix the at least one cooling member to the bracket and provide a heat transfer path.

13. The electronic device according to claim 11, wherein: The cooling member includes a first cooling member and a third cooling member, Wherein, the third cooling member is configured to surround at least a portion of the first cooling member.

14. An electronic device, comprising: case; a circuit board, the circuit board being arranged inside the housing; an electrical component disposed on the upper surface of the circuit board; a shielding cover surrounding at least a portion of the electrical component, the shielding cover including a first opening disposed through a portion of the shielding cover facing the electrical component; a shielding sheet comprising a shielding layer disposed on at least a portion of the shielding cover and a supporting layer disposed on an upper surface of the shielding layer, the supporting layer comprising a second opening corresponding to the first opening; as well as a first heat transfer member, the first heat transfer member comprising a heat dissipation material, at least a portion of the first heat transfer member being disposed within the second opening, and the first heat transfer member being configured to guide a heat transfer path so that heat generated in the electrical component is directed to the housing, Wherein, the shielding layer comprises: a shielding membrane comprising a fiber membrane; and a first conductive adhesive film and a second conductive adhesive film, wherein the first conductive adhesive film and the second conductive adhesive film are respectively arranged on opposite surfaces of the shielding film, The first conductive adhesive film is adhered to the upper surface of the shielding film, the support layer and the first heat transfer member, and the second conductive adhesive film is adhered to the lower surface of the shielding film and the surface of the shielding cover.

15. The electronic device according to claim 14, in, The support layer is provided on the upper surface of the first conductive adhesive film, and The second opening has a closed loop shape and a size corresponding to the area of ​​the electrical component.

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