Circuit board and display device
By creating slots in the circuit board substrate to isolate the effects of ceramic capacitor deformation and cut off the vibration propagation path, the whistling problem caused by the electrostriction effect of ceramic capacitors on the circuit board is solved, improving user experience and heat dissipation performance.
Patent Information
- Application Number
- CN202111255947.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2021-10-27
- Publication Date
- 2025-12-30
- Estimated Expiration
- 2041-10-27
AI Technical Summary
Existing circuit boards vibrate and produce a whistling sound due to the electrostriction effect of ceramic capacitors, which affects the user experience, and existing solutions are also expensive.
A first and second through slot are made on the circuit board substrate. A ceramic capacitor is connected across the first slot, and the pads are located on both sides of the slot. The second slot is located on one side of the capacitor to isolate the influence of the deformation of the ceramic capacitor on the circuit board and cut off the vibration propagation path.
It effectively suppresses circuit board vibration caused by the electrostriction effect of ceramic capacitors, reduces howling noise, improves user satisfaction, and enhances heat dissipation.
Smart Images

Figure CN114222416B_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of circuit board technology, and in particular to a circuit board and a display device. Background Technology
[0002] Currently, the most widely used capacitors on panel driver circuit boards are MLCCs (Multi-layer Ceramic Capacitors), which have advantages such as small size and low parasitic inductance. They are typically surface-mounted onto the printed circuit board. However, due to the inverse piezoelectric effect of strong electrolyte ceramics, when an AC voltage is applied across the MLCC capacitor, it will expand and contract in the direction of the layered structure. Specifically, when AC is applied across the ceramic capacitor, it expands and contracts in both directions perpendicular to the layered structure and parallel to the circuit board. Since the ceramic capacitor is rigidly connected to the PCB board via surface mounting, this expansion and contraction causes a certain degree of deformation in the PCB board. When the AC frequency is high, the ceramic capacitor and PCB will produce a vibration-like effect. If the vibration frequency falls within the human ear's perception range of 20Hz-20kHz, a sharp noise will be perceived; this phenomenon is called howling. If the howling problem cannot be improved, it will significantly impact the user experience when it reaches customers or the market. Currently, ceramic capacitor suppliers add sponge or hollow supports under the capacitor to form pad capacitors or support capacitors, which can reduce capacitor squealing. However, these capacitors are expensive and not suitable for mass production. Summary of the Invention
[0003] The main technical problem addressed by this application is to provide a circuit board and a display device to reduce the squealing caused by circuit board vibration due to the electrostriction effect of ceramic capacitors.
[0004] To solve the above-mentioned technical problems, one technical solution adopted in this application is to provide a circuit board, the circuit board including a circuit board substrate and a ceramic capacitor, the ceramic capacitor being disposed on the circuit board substrate, the circuit board substrate having a first slot and at least one second slot, the first slot and the second slot penetrating the circuit board substrate; wherein, the ceramic capacitor is connected across the first slot, the ceramic capacitor having a first pin and a second pin, the circuit board substrate having a first pad corresponding to the first pin and a second pad corresponding to the second pin, the first pad and the second pad being located on both sides of the first slot, the second slot being located on at least one side of the ceramic capacitor, and the second slot being spaced apart from the ceramic capacitor.
[0005] Optionally, the extension directions of the first slot and the second slot are straight lines.
[0006] Optionally, the first slot and the second slot are parallel; or, the first slot and the second slot are perpendicular.
[0007] Optionally, the number of the second slots is two, and the two second slots are located on different sides of the ceramic capacitor; the two second slots are parallel to each other, or the two second slots are perpendicular to each other.
[0008] Optionally, the number of the second slots is three, and the three second slots are located on different sides of the ceramic capacitor; the three second slots and the first slots form an E-shaped structure.
[0009] Optionally, the first slot extends in a straight line, the second slot extends in a curved line, and the second slot surrounds at least both sides of the ceramic capacitor.
[0010] Optionally, there are two second slots, located on different sides of the ceramic capacitor; wherein one end of one second slot is connected to the first end of the first slot, and one end of the other second slot is connected to the second end of the first slot, and the two second slots are centrally symmetrical about the center point of the first slot.
[0011] Optionally, there may be multiple ceramic capacitors arranged side by side along the extension direction of the first slot, with each ceramic capacitor connected across the first slot.
[0012] Optionally, the width of the first slot and the second slot is 1-2 mm; and / or, the length of the first slot and the second slot is greater than the length of the first pad and the second pad.
[0013] To solve the above-mentioned technical problems, another technical solution adopted in this application is to provide a display device, which includes any of the circuit boards mentioned above.
[0014] The beneficial effects of this application are as follows: Unlike the prior art, the circuit board of this application includes a circuit board substrate and a ceramic capacitor. The ceramic capacitor is disposed on the circuit board substrate. The circuit board substrate has a first slot and at least one second slot, which penetrate the circuit board substrate. The ceramic capacitor is connected across the first slot and has a first pin and a second pin. The circuit board substrate has a first pad corresponding to the first pin and a second pad corresponding to the second pin. The first pad and the second pad are located on both sides of the first slot. The second slot is located on at least one side of the ceramic capacitor and is spaced apart from the ceramic capacitor. By creating a first slot on the circuit board substrate, a ceramic capacitor is connected across the first slot, with the first and second pads corresponding to the ceramic capacitor located on either side of the first slot. This method of creating a first slot below the ceramic capacitor and separating the two pads effectively isolates the impact of ceramic capacitor deformation on the circuit board, suppresses resonance between the ceramic capacitor and the circuit board, and thus effectively suppresses the howling caused by circuit board vibration due to the electrostriction effect of the ceramic capacitor. Furthermore, by providing at least one second slot around the ceramic capacitor, the second slot can cut off the vibration propagation path on the circuit board, preventing the main body of the circuit board substrate from vibrating due to the electrostriction effect of the ceramic capacitor, further solving the howling problem, reducing product noise, and improving user satisfaction. In addition, the first and second slots can enhance the heat dissipation capacity of the circuit board. Attached Figure Description
[0015] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. Wherein:
[0016] Figure 1 This is a schematic diagram of the structure of the circuit board of the first embodiment of this application;
[0017] Figure 2 This is a schematic diagram of the structure of the second embodiment of the circuit board of this application;
[0018] Figure 3 This is a schematic diagram of the structure of the circuit board of the third embodiment of this application;
[0019] Figure 4 This is a schematic diagram of the fourth embodiment of the circuit board of this application;
[0020] Figure 5 This is a schematic diagram of the fifth embodiment of the circuit board of this application;
[0021] Figure 6This is a schematic diagram of the sixth embodiment of the circuit board of this application;
[0022] Figure 7 This is a schematic diagram of the structure of the seventh embodiment of the circuit board of this application;
[0023] Figure 8 This is a schematic diagram of the structure of the circuit board of the eighth embodiment of this application;
[0024] Figure 9 This is a schematic diagram of the structure of the ninth embodiment of the circuit board of this application;
[0025] Figure 10 This is a schematic diagram of the tenth embodiment of the circuit board of this application.
[0026] Among them, 10 / 50 / 70 / 80 are circuit boards; 100 / 500 / 700 / 800 are circuit board substrates; 101 / 501 / 701 / 801 are ceramic capacitors; 102 / 502 / 702 / 802 are first slots; 103 / 503 / 703 / 803 are second slots; 104 / 504 / 704 / 804 are first pads; and 105 / 505 / 705 / 805 are second pads. Detailed Implementation
[0027] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.
[0028] Please see Figure 1 , Figure 1This is a schematic diagram of the structure of the first embodiment of the circuit board of this application. In this embodiment, the circuit board 10 includes a circuit board substrate 100 and a ceramic capacitor 101. The ceramic capacitor 101 is disposed on the circuit board substrate 100. The circuit board substrate 100 has a first slot 102 and at least one second slot 103, which penetrate the circuit board substrate 100. The ceramic capacitor 101 is connected across the first slot 102, meaning that the ceramic capacitor 101 is located above the first slot 102, and both ends of the ceramic capacitor 101 are respectively connected to the main body of the circuit board substrate 100 on both sides of the first slot 102. The ceramic capacitor 101 has a first pin (not shown) and a second pin (not shown). The circuit board substrate 100 has a first pad 104 corresponding to the first pin and a second pad 105 corresponding to the second pin. The first pad 104 and the second pad 105 are located on both sides of the first slot 102, and the second slot 103 is located on one side of the ceramic capacitor 101, and the second slot 103 is spaced apart from the ceramic capacitor 101.
[0029] In this embodiment, by opening a first slot 102 on the circuit board substrate 100, a ceramic capacitor 101 is connected across the first slot 102, and the first pad 104 and the second pad 105 corresponding to the ceramic capacitor 101 are located on both sides of the first slot 102. This method of opening a first slot 102 below the ceramic capacitor 101 and separating the two pads by the first slot 102 can effectively isolate the influence of the deformation of the ceramic capacitor 101 on the circuit board 10, suppress the resonance between the ceramic capacitor 101 and the circuit board 10, and thus effectively suppress the howling caused by the vibration of the circuit board 10 due to the electrostriction effect of the ceramic capacitor 101. Furthermore, by providing at least one second slot 103 around the ceramic capacitor 101, the second slot 103 can separate the ceramic capacitor 101 from the main body of the circuit board substrate 100, preventing the main body of the circuit board substrate 100 from vibrating due to the electrostriction effect of the ceramic capacitor 101, further solving the howling problem, reducing product noise, and improving user satisfaction. In addition, the first slot 102 and the second slot 103 can enhance the heat dissipation capacity of the circuit board 10.
[0030] In some embodiments, the width of the first slot 102 and the second slot 103 is 1-2 mm; and / or, the length of the first slot 102 and the second slot 103 is greater than the length of the first pad 104 and the second pad 105. It is understood that the length of the first slot 102 and the second slot 103 needs to be determined according to the size of the ceramic capacitor 101, because the ceramic capacitor 101 has various package sizes such as 0402 / 0603 / 0805. Setting the length of the slot to be longer than the pad size can further reduce the vibration of the circuit board 10 caused by the electrostriction effect of the ceramic capacitor 101, thereby reducing howling.
[0031] In one embodiment, the first slot 102 and the second slot 103 extend in a straight line. The straight-line slot structure is easy to create and has a simple manufacturing process.
[0032] In some embodiments, the number of second slots 103 is one. For example... Figure 1 As shown, in this embodiment, the first slot 102 and the second slot 103 are parallel. In other embodiments, such as... Figure 2 As shown, Figure 2 This is a schematic diagram of the second embodiment of the circuit board of this application, in which the first slot 102 and the second slot 103 are perpendicular. In the scenario where a second slot 103 is provided, the second slot 103 can separate the ceramic capacitor 101 from the main body of the circuit board substrate 100, cutting off the vibration propagation path on the circuit board 10 in one direction. This can prevent the main body of the circuit board substrate 100 from vibrating due to the electrostriction effect of the ceramic capacitor 101, thereby effectively suppressing the howling caused by the vibration of the circuit board 10 due to the electrostriction effect of the ceramic capacitor 101.
[0033] In some embodiments, the number of second slots 103 is two, and the two second slots 103 are located on different sides of the ceramic capacitor 101. For example... Figure 3 As shown, Figure 3 This is a schematic diagram of the structure of the circuit board of the third embodiment of this application. In this embodiment, the two second slots 103 are parallel to each other, and the second slots 103 shown are parallel to the first slot 102. Of course, in other embodiments, the second slots 103 may also be perpendicular to the first slot 102. Figure 4 As shown, Figure 4 This is a schematic diagram of the fourth embodiment of the circuit board of this application. In this embodiment, the two second slots 103 are perpendicular to each other. In the scenario where two second slots 103 are provided, the two second slots 103 can separate the ceramic capacitor 101 from the main body of the circuit board substrate 100, cutting off the vibration propagation path on the circuit board 10 in two directions. Since the more directions of cutting are cut off, the greater the buffering effect on the vibration of the circuit board 10, the vibration of the main body of the circuit board substrate 100 due to the electrostriction effect of the ceramic capacitor 101 can be better avoided, thereby effectively suppressing the howling caused by the vibration of the circuit board 10 due to the electrostriction effect of the ceramic capacitor 101.
[0034] Please see Figure 5 , Figure 5This is a schematic diagram of the fifth embodiment of the circuit board of this application. In this embodiment, there are three second slots 503, which are located on different sides of the ceramic capacitor 501. The three second slots 503 and the first slot 502 form an E-shaped structure. Specifically, the circuit board 50 includes a circuit board substrate 500 and a ceramic capacitor 501. The ceramic capacitor 501 is disposed on the circuit board substrate 500. The circuit board substrate 500 has a first slot 502 and three second slots 503. The first slot 502 and the second slot 503 penetrate the circuit board substrate 500. The first slot 502 and the two second slots 503 extend in the X direction, and one second slot 503 extends in the Y direction. The slots in the X direction and the slots in the Y direction are arranged perpendicularly. Thus, the three slots in the X direction and the one slot in the Y direction combine to form an E-shaped structure. Therefore, the ceramic capacitor 501 is connected across the first slot 502. The ceramic capacitor 501 has a first pin and a second pin. The circuit board substrate 500 has a first pad 504 corresponding to the first pin and a second pad 505 corresponding to the second pin. The first pad 504 and the second pad 505 are located on both sides of the first slot 502. Since the three second slots 503 are located on different sides of the ceramic capacitor 501, three of the positions around the pads that are rigidly connected to the ceramic capacitor 501 by solder are separated from the main body of the circuit board substrate 500. The remaining position can be used for circuit trace connection, which can reduce the vibration of the circuit board 50 caused by the electrostriction effect of the ceramic capacitor 501, thereby reducing the howling.
[0035] In one embodiment, there are multiple ceramic capacitors 501 arranged side-by-side along the extension direction of the first slot 502, with each ceramic capacitor 501 connected across the first slot 502. It is understood that for large circuit boards 50, multiple capacitors may be required in parallel, such as... Figure 6 As shown, Figure 6 This is a schematic diagram of the sixth embodiment of the circuit board of this application. The difference from the fifth embodiment is that, in order to save space in the circuit layout, the length of the first slot 502 and the two second slots 503 extending in the X direction in the E-shaped slot structure can be extended according to the number of ceramic capacitors 501 that need to be placed. This not only facilitates the routing but also saves space in the circuit layout. It can also reduce the squealing caused by the vibration of the circuit board 50 due to the electrostriction effect of the ceramic capacitors 501.
[0036] Please see Figure 7 , Figure 7This is a schematic diagram of the seventh embodiment of the circuit board of this application. In some embodiments, the extension direction of the first slot 702 is a straight line, and the extension direction of the second slot 703 is a curve. Specifically, the curve in this application can be an arc or a broken line. The second slot 703 surrounds at least both sides of the ceramic capacitor 701. It can be understood that the second slot 703 can correspond to a portion of the side surface of the ceramic capacitor 701, or the second slot 703 can correspond to the entire side surface of the ceramic capacitor 701. In this embodiment, the circuit board 70 includes a circuit board substrate 700 and a ceramic capacitor 701. The ceramic capacitor 701 is disposed on the circuit board substrate 700. The circuit board substrate 700 has a first slot 702 and a second slot 703, which penetrate the circuit board substrate 700. The first slot 702 is a straight slot, and the ceramic capacitor 701 is connected across the first slot 702. The ceramic capacitor 701 has a first pin and a second pin. The circuit board substrate 700 has a first pad 704 corresponding to the first pin and a second pad 705 corresponding to the second pin. The first pad 704 and the second pad 705 are located on both sides of the first slot 702. The second slot 703 is a curved slot and is disposed around the ceramic capacitor 701. The second slot 703 is set around the ceramic capacitor 701 in a semi-enclosed manner, so that part of the area around the pad that is rigidly connected to the ceramic capacitor 701 by solder is separated from the main body of the circuit board substrate 700. The remaining area can be used for circuit trace connection, which can reduce the vibration of the circuit board 70 caused by the electrostriction effect of the ceramic capacitor 701, thereby reducing the howling.
[0037] Please see Figure 8 , Figure 8This is a schematic diagram of the eighth embodiment of the circuit board of this application. Further, when the extension direction of the second slot 803 is curved, there are two second slots 803. The two second slots 803 are located on different sides of the ceramic capacitor 801. One end of one second slot 803 is connected to the first end of the first slot 802, and one end of the other second slot 803 is connected to the second end of the first slot 802. The two second slots 803 are centrally symmetrically arranged about the center point of the first slot 802. In this embodiment, the two second slots 803 and the first slot 802 form an S-shaped structure. Specifically, the circuit board 80 includes a circuit board substrate 800 and a ceramic capacitor 801. The ceramic capacitor 801 is disposed on the circuit board substrate 800. The circuit board substrate 800 has a first slot 802 and two second slots 803, which penetrate the circuit board substrate 800. The first slot 802 extends in the X direction, and the two second slots 803 are zigzag slots, each including a portion extending in the X direction and a portion extending in the Y direction. The slots in the X direction and the slots in the Y direction are arranged perpendicularly. The end of the Y-direction extension of one second slot 803 communicates with the first end of the first slot 802, and the end of the Y-direction extension of the other second slot 803 communicates with the second end of the first slot 802. The two second slots 803 are centrally symmetrical about the center point of the first slot 802, thus forming an S-shaped structure. Please refer to [link to relevant documentation]. Figure 9 , Figure 9 This is a schematic diagram of the structure of the ninth embodiment of the circuit board of this application. The difference from the eighth embodiment is that the two second slots 803 and the first slot 802 in this embodiment form a structure opposite to the S-shape. Therefore, the ceramic capacitor 801 is connected across the first slot 802. The ceramic capacitor 801 has a first pin and a second pin. The circuit board substrate 800 has a first pad 804 corresponding to the first pin and a second pad 805 corresponding to the second pin. The first pad 804 and the second pad 805 are located on both sides of the first slot 802. Thus, the first pad 804 and the second pad 805 are centrally symmetrically distributed in the S-shaped structure. That is, three of the four sides of the first pad 804 and the second pad 805 are separated from the main body of the circuit board substrate 800 through the slot, and the remaining one side can be used for circuit trace connection. Moreover, the direction of circuit trace connection for the first pad 804 is opposite to the direction of circuit trace connection for the second pad 805. Therefore, while reducing the squealing caused by the vibration of the circuit board 80 due to the electrostriction effect of the ceramic capacitor 801, it can also effectively reduce the resonance between the first pad 804 and the second pad 805, thereby further reducing the squealing.
[0038] Furthermore, there are multiple ceramic capacitors 801 arranged side by side along the extension direction of the first slot, and each ceramic capacitor 801 is connected across the first slot 802, such as... Figure 10 As shown, Figure 10 This is a schematic diagram of the tenth embodiment of the circuit board of this application. The difference from the eighth embodiment is that multiple capacitors need to be connected in parallel in this embodiment. Therefore, in order to save space in the circuit layout, the length of the first slot 802 and the two second slots 803 extending in the X direction in the S-shaped slot structure can be extended according to the number of ceramic capacitors 801 that need to be placed. This not only facilitates the routing but also saves space in the circuit layout. It can also reduce the squealing caused by the vibration of the circuit board 80 due to the electrostriction effect of the ceramic capacitors 801.
[0039] This application also provides a display device, which includes a circuit board, wherein the circuit board is any of the circuit boards described above.
[0040] It should be noted that in this application, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising..." does not exclude the presence of additional identical elements in the process, method, article, or apparatus that includes said element.
[0041] The above description is merely an embodiment of this application and does not limit the patent scope of this application. Any equivalent structural or principle transformations made based on the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.
Claims
1. A circuit board comprising a circuit board substrate and a ceramic capacitor provided on the circuit board substrate, characterized by, The circuit board substrate is provided with a first slot hole and two second slot holes, the first slot hole and the second slot hole penetrating the circuit board substrate; The ceramic capacitor is connected across the first slot hole, the ceramic capacitor having a first pin and a second pin, the circuit board substrate being provided with a first pad corresponding to the first pin and a second pad corresponding to the second pin, the first pad and the second pad being located on two sides of the first slot hole, the second slot hole being located on at least one side of the ceramic capacitor, and the second slot hole being spaced apart from the ceramic capacitor; The first slot hole extends in a straight line, and the second slot hole extends in a curve, the second slot hole being located on at least two sides of the ceramic capacitor; The two second slot holes are located on different sides of the ceramic capacitor, one end of one second slot hole being in communication with a first end of the first slot hole, one end of the other second slot hole being in communication with a second end of the first slot hole, and the two second slot holes being centrally symmetrically arranged with respect to a center point of the first slot hole; The two second slot holes and the first slot hole form an S-shaped structure, or the two second slot holes and the first slot hole form a structure opposite to the S-shaped structure, and the first pad and the second pad are centrally symmetrically distributed in the S-shaped structure.
2. The circuit board of claim 1, wherein, The number of the ceramic capacitors is multiple, and the multiple ceramic capacitors are arranged side by side along the extension direction of the first slot hole, and each ceramic capacitor is connected across the first slot hole.
3. The circuit board of claim 1, wherein The width of the first slot hole and the second slot hole is 1-2 mm; And / or, the length of the first slot hole and the second slot hole is greater than the length of the first pad and the second pad.
4. A display device, characterized by comprising: The display device comprises the circuit board of any one of claims 1-3.
Citation Information
Patent Citations
Pad structure, circuit board and display device
CN113556868A