A display panel structure and method suitable for efficient cutting of a special-shaped screen

Abstract

The application discloses a kind of special-shaped screen efficient cutting display panel structure and method suitable for, including TFT layer, the upper end of the TFT layer is equipped with GIP layer, the upper end of the GIP layer is equipped with Seal layer, the upper end of the Seal layer is equipped with BM layer, the upper end of the BM layer is equipped with CF layer, the BM layer is in shrinkage distance 200um or more, a BM pad layer is added at the Seal collinear place of the Seal layer, and the BM pad layer width is below 80um.The panel of the present application adopts BM shrinkage design, which is beneficial to laser cutting, prevents direct exposure of BM, reduces the risk of PCT liquid leakage, to improve the yield of automatic cutting and splitting, a BM pad layer is added at the Seal collinear place of the cutting panel edge, which is convenient for laser alignment and focusing cutting Seal, which is beneficial to the separation process of split piece and improves the production efficiency of panel.

Description

Technical Field

[0001] This invention belongs to the field of display panel technology, specifically relating to a structure and method for efficiently cutting display panels for irregularly shaped screens. Background Technology

[0002] A TFT-LCD panel is composed of an upper substrate (CF) and a lower substrate (TFT), with liquid crystal filling the space between them. Voltage controls the orientation of the liquid crystal, thereby adjusting the backlight flux to achieve grayscale display. The lower substrate (TFT) contains the pixels that control the liquid crystal and the peripheral circuitry that sends signals to the pixels. The upper substrate (CF) mainly provides RGB apertures and PS support, and is also coated with organic material for planarization. The photomask design involves laying out the required pattern based on the upper and lower glass substrates. The factory uses coating / lithography / etching processes to fabricate the upper and lower substrates separately based on the photomask. Then, the cells are assembled using the cell assembly process, including seal coating.

[0003] With the development of TFT-LCD display technology, narrow-bezel displays have become the main trend in high-quality display development due to their advantages such as simplicity, aesthetics, and large viewable area for the same size. This is especially true for small-sized displays, where the demand for narrow bezels is increasing, often accompanied by waterdrop / notch / punch-hole designs. In the production of TFT-LCD displays, to improve production efficiency, reduce manufacturing costs, and achieve large-scale mass production, panels of the required size are arranged in optimal layout on large-size glass panels for cell assembly. These are then split into individual display panels through a cutting process. Examples include G6, G8.5, and G10.5 generation lines that correspond to different large-size glass panels.

[0004] The main panel cutting methods include: rotary cutting, laser cutting, and CNC grinding. Laser cutting has significant advantages in irregular-shaped cutting, and it is the primary solution used for cutting irregular shapes for full-screen displays in the industry. Laser cutting is further divided into surface ablation cutting and internal focusing cutting. Surface ablation cutting can cut through directly without requiring a subsequent dicing process, but it has a large heat-affected zone; while internal focusing cutting requires a dicing separation process, but has a smaller heat-affected zone. Generally, LCD panels are cut into cut sizes from a large plate, and then further cut into PCBs. If it is an irregularly shaped screen, then further irregular cutting is performed. With technological advancements, automated cutting and automated wafer removal have been introduced into the cutting process, which can improve panel production efficiency.

[0005] For narrow-bezel irregular-shaped screen designs, traditional panels are covered with metal matrix (BM) and grooves around the edges. When laser surface ablation cutting is used, the BM is greatly affected by heat and is exposed. During PCT (high-temperature sterilization) verification, the BM is prone to peeling, leading to panel leakage. Limited by the narrow bezel, when the seal coating is cut flush with the panel edges and tightly arranged, the seals at the collinear points are prone to sticking, which is detrimental to the wafer separation process and affects yield. Therefore, we propose a structure and method for efficiently cutting display panels suitable for irregular-shaped screens to solve the problems mentioned in the background. Summary of the Invention

[0006] The purpose of this invention is to provide a structure and method for efficiently cutting display panels for irregularly shaped screens, so as to solve the problems mentioned in the background art.

[0007] To achieve the above objectives, the present invention provides the following technical solution: a display panel structure suitable for high-efficiency cutting of irregularly shaped screens, comprising a TFT layer, a GIP layer on the upper end of the TFT layer, a Seal layer on the upper end of the GIP layer, a BM layer on the upper end of the Seal layer, a CF layer on the upper end of the BM layer, the inward distance of the BM layer being more than 200um, and an additional BM pad layer at the collinearity of the Seal layer, the width of the BM pad layer being less than 80um.

[0008] A processing method for efficiently cutting display panel structures for irregularly shaped screens specifically includes the following steps:

[0009] S1. Shrink the BM layer inward by more than 200um to prevent the BM layer from being directly exposed and reduce the risk of PCT leakage.

[0010] S2. To improve the yield of automatic cutting and sheet taking, a BM pad layer is added at the collinearity of the Seal layer. The width of the BM pad layer is less than 80um. It is used for laser to adjust the laser energy, speed and focal length by observing the BM laser phenomenon.

[0011] Compared with the prior art, the beneficial effects of the present invention are as follows: The present invention provides a structure and method for high-efficiency cutting of display panels suitable for irregular screens. The panel of the present invention adopts a BM inward design, which is conducive to laser cutting, prevents the BM from being directly exposed, and reduces the risk of PCT leakage. In order to improve the yield of automatic cutting and sheet removal, a BM pad layer is added at the collinearity of the Seal on the edge of the panel, which facilitates the use of laser alignment for internal focusing cutting of the Seal, which is beneficial to the sheet separation process and improves the panel production efficiency. Attached Figure Description

[0012] Figure 1 Layout design for large-format LCD panel production;

[0013] Figure 2 for Figure 1A schematic diagram of a single Panel structure;

[0014] Figure 3 for Figure 1 A schematic diagram of the 1 / 4 Cut;

[0015] Figure 4 This is a schematic diagram of the first cutting method for current LCD panel two-cutting;

[0016] Figure 5 This is a schematic diagram of the second cutting method for LCD panels.

[0017] Figure 6 A schematic diagram of a traditional LCD panel BM design;

[0018] Figure 7 A schematic diagram of a cross-section of a traditional LCD panel BORDER;

[0019] Figure 8 This is a cross-sectional view of the BORDER in the BM inward design of this invention;

[0020] Figure 9 This is a schematic diagram of the BM inward reduction design of the present invention.

[0021] Figure 10 This is a cross-sectional view of the BORDER design for the BM cushion layer of this invention;

[0022] Figure 11 This is a schematic diagram of the BM pad design of the present invention. Detailed Implementation

[0023] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0024] This invention provides, for example Figure 8-11 A display panel structure suitable for high-efficiency cutting of irregularly shaped screens includes a TFT layer, a GIP layer on the upper end of the TFT layer, a Seal layer on the upper end of the GIP layer, a BM layer on the upper end of the Seal layer, a CF layer on the upper end of the BM layer, the inward distance of the BM layer is more than 200um, and an additional BM pad layer is added at the collinearity of the Seal layer, the width of the BM pad layer is less than 80um.

[0025] A processing method for efficiently cutting display panel structures for irregularly shaped screens specifically includes the following steps:

[0026] S1. Shrink the BM layer inward by more than 200um to prevent the BM layer from being directly exposed and reduce the risk of PCT leakage.

[0027] S2. To improve the yield of automatic cutting and sheet taking, a BM pad layer is added at the collinearity of the Seal layer. The width of the BM pad layer is less than 80um. It is used for laser to adjust the laser energy, speed and focal length by observing the BM laser phenomenon.

[0028] Figure 1 It is a layout design drawing for large LCD panel production. Figure 2 This is a schematic diagram of a single panel structure. Figure 3 This is a 1 / 4-cut diagram: In the production of TFT-LCD displays, to improve production efficiency, reduce manufacturing costs, and achieve large-scale mass production, panels of the required size are arranged in an optimal layout on large-size glass for cell assembly, and then split into individual display panels through a cutting process. Due to the narrow bezels, when the seal coating is aligned with the panel edges and the panels are tightly arranged, the seals at the collinear points are prone to sticking, which is detrimental to the splitting process and affects yield.

[0029] Figures 4-5 Currently, there are two main cutting methods used for LCD panel dicing: LCD panels are composed of an upper substrate (CF) and a lower substrate (TFT). Both methods require cutting the TFT and CF glass substrates into slabs. The main difference lies in the slab splitting method. Manual slab splitting is labor-intensive and time-consuming, but adjustments can be made promptly in special cutting situations. Automated wafer picking automates production and improves efficiency, but it is affected by differences in panel design. With technological advancements, factory automation is the mainstream trend.

[0030] Figure 6 It is a traditional LCD panel BM design drawing. Figure 7 This is a cross-sectional view of a traditional LCD panel border: Traditional LCD panels are surrounded by metal bricks (BMs) with grooves. The BM grooves are smaller than the metal lines on the arc side, generally less than 15um. When laser surface ablation cutting is used, the BMs are greatly affected by heat and are exposed. During PCT (high-temperature sterilization) verification, the BMs are prone to peeling, which can lead to liquid leakage in the panel.

[0031] Figure 8 This is a cross-sectional view of the BORDER with its inward-curving design, as per this patent. Figure 9This is a schematic diagram of the cutting process using the BM (Block Module) inward-shrinking design of this patent: To reduce the thermal impact of laser cutting on the BM, an inward-shrinking design is implemented, with a shrinkage distance 'a' required to be at least 200µm. This prevents direct exposure of the BM and reduces the risk of PCT (Polymer Transformer) leakage. During automatic cutting, there is no BM at the collinearity of the seal along the panel edge, and direct laser sealing shows no obvious phenomena, making it impossible to adjust the laser energy, laser speed, and focal length. If the energy is too high, the seal vaporizes, generating bubbles, leading to liquid crystal leakage on the substrate; if the energy is too low, the seal remains sticky, and the cracked frame adhesive line of the CF / TFT cannot completely coincide with the cutting position, resulting in wafer sticking during automatic wafer removal.

[0032] Figure 10 This is a cross-sectional view of the BORDER design for the BM cushioning layer in this patent. Figure 11 This is a schematic diagram of the BM pad design for cutting: To improve the yield of automatic cutting and wafer picking, a BM pad is added at the collinearity of the Seal on the edge of the panel. The width b of the BM pad is less than 80um and is used for laser cutting. By observing the BM laser cutting phenomenon, the laser energy, speed and focal length are adjusted. While laser cutting the BM, the Seal is vaporized. When the Seal extends from the TFT side to the CF, there is no adhesion in this area, and the wafer can be picked up smoothly, thereby improving the panel production efficiency.

[0033] In summary, compared with the prior art, the panel of the present invention adopts a BM inward design, which is conducive to laser cutting, prevents the BM from being directly exposed, reduces the risk of PCT leakage, and improves the yield of automatic cutting and sheet removal. A BM pad layer is added at the collinearity of the seals on the edge of the panel, which facilitates the use of laser alignment for internal focusing cutting of the seal, which is beneficial to the sheet separation process and improves the panel production efficiency.

[0034] Finally, it should be noted that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A display panel structure suitable for efficient cutting of a special-shaped screen, comprising a TFT layer, characterized in that: The TFT layer is provided with a GIP layer at the upper end, the GIP layer is provided with a Seal layer at the upper end, the Seal layer is provided with a BM layer at the upper end, the BM layer is provided with a CF layer at the upper end, the BM layer is inwardly retracted by a distance of 200 um or more, and a BM pad layer is added at the Seal collinear position of the Seal layer, and the width of the BM pad layer is less than 80 um. ​ 2. The processing method of claim 1, which is suitable for efficient cutting of a display panel structure of a special-shaped screen, characterized in that: Specifically, the following steps are included: S1, inwardly retracting the BM layer by a distance of 200 um or more, to prevent the BM layer from being directly exposed, and to reduce the risk of PCT liquid leakage; S2, to improve the yield of automatic cutting and breaking, a BM pad layer is added at the Seal collinear position of the Seal layer, and the width of the BM pad layer is less than 80 um, for adjusting the laser energy, speed and focal length by observing the BM laser phenomenon through laser.

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