Wafer automatic angle sorting system

Abstract

The present invention discloses an automatic wafer angle sorting system for improving positioning accuracy, improving measurement accuracy and avoiding wafer fragmentation. The present invention comprises a workbench, on which a clip-type loading mechanism, a direction testing mechanism, an angle testing mechanism and a sorting unloading tray are sequentially arranged, a first material transport module is arranged between the clip-type loading mechanism and the direction testing mechanism, a second material transport module is arranged between the direction testing mechanism and the angle testing mechanism, and a third material transport module is arranged between the angle testing mechanism and the sorting unloading tray; the direction testing mechanism comprises a direct drive motor and a direction testing seat connected to the direct drive motor, an optical fiber sensor is arranged obliquely above the direction testing seat, and the angle testing mechanism comprises an X-ray transmitter, a test suction cup seat and an X-ray receiver which are sequentially distributed on the workbench in an oblique line, and electric finger positioning devices are arranged at both ends of the test suction cup seat. The present invention is applied to the technical field of wafer angle sorting equipment.

Description

Technical Field

[0001] The present invention relates to an automatic angle sorting system, in particular to an automatic angle sorting system for wafers. Background Art

[0002] The chip is the main component of the crystal oscillator. The characteristics of the chip determine the performance of the crystal oscillator, and the cutting angle of the crystal single crystal into the chip determines the stability of the crystal oscillator frequency and the operating temperature range. Therefore, it is extremely important. With the development of the communications industry, the requirements for crystal oscillators are getting higher and higher. In order to ensure the consistency of the crystal oscillator performance, the cut chips must be sorted. At present, the chip sorting of relevant domestic production units is completely completed manually.

[0003] Existing wafers are also sorted by an automated sorting machine, which automatically loads the wafers through a vibration plate, then places the wafers on a steering mechanism for direction rotation through a first transport module, and then places the wafers on an angle test seat through a second transport module for angle testing through an X-ray device, and finally sorts the wafers into different material slots according to the measured angles; although the automated sorting machine can save labor and improve sorting efficiency, the current steering mechanism drives the direction test seat to rotate through a worm gear to measure the direction, and the mechanical method of the worm gear is adopted, and the mechanical transmission of the worm gear is subject to wear, resulting in poor repeat positioning accuracy, long measurement time, inaccurate measurement positioning, etc.; in addition, the wafers are placed on the angle test seat through the second transport module without a positioning device, and it is easy for the wafers to deviate from the angle test seat, affecting the angle measurement accuracy of the X-ray device; furthermore, the method of loading the wafers on the vibration plate is easy to cause the influence of fragments on some larger and thinner wafers, and due to the large size of the wafers, the vibration plate needs to be made into an adaptive large vibration plate, which also increases the space occupied by the equipment. Summary of the invention

[0004] The technical problem to be solved by the present invention is to overcome the deficiencies of the prior art and provide a wafer automatic angle sorting system which can improve positioning accuracy, improve measurement accuracy and avoid wafer fragmentation.

[0005] The technical solution adopted by the present invention is: the present invention includes a workbench, on which a clip-type loading mechanism, a direction testing mechanism, an angle testing mechanism and a sorting unloading tray are sequentially arranged, a first material transport module is arranged between the clip-type loading mechanism and the direction testing mechanism, a second material transport module is arranged between the direction testing mechanism and the angle testing mechanism, and a third material transport module is arranged between the angle testing mechanism and the sorting unloading tray; the direction testing mechanism includes a direct drive motor and a direction testing seat connected to the direct drive motor, an optical fiber sensor is arranged obliquely above the direction testing seat, the angle testing mechanism includes an X-ray transmitter, a test suction cup seat and an X-ray receiver which are sequentially distributed on the workbench in an oblique line, and electric finger positioning devices are arranged at both ends of the test suction cup seat;

[0006] The clip-type loading mechanism comprises a first front-to-back moving device, a first front-to-back slide rail and a clip-type component, the middle part of the bottom of the clip-type component is adapted to be slidably connected to the first front-to-back slide rail, the first front-to-back moving device is installed below the first front-to-back slide rail and is connected to the two ends of the bottom of the clip-type component; the clip-type component comprises a U-shaped frame, both ends of the U-shaped frame are provided with lifting slide rails and sliders adapted to the lifting slide rails, a front panel adapted to the U-shaped frame is provided between the two sliders, a height fine-adjusting mechanism connected to the slider is provided at one end of the U-shaped frame, the bottom of the U-shaped frame is inside and adapted to be slidably connected to the first front-to-back slide rail, and the bottom of the U-shaped frame is provided with wafer support plates at both ends of the first front-to-back slide rail, and a vacuum suction hole is provided at the front end of the first front-to-back slide rail;

[0007] The sorting and unloading tray includes a plurality of product angle classification boxes arranged in an array.

[0008] Furthermore, the workbench is provided with an MCU control system, and the clip-type feeding mechanism, the direction testing mechanism, the angle testing mechanism, the first material transport module, the second material transport module and the third material transport module are all electrically connected to the MCU control system.

[0009] Furthermore, the first material transport module includes a second forward and backward moving device located on one side between the clip-type loading mechanism and the direction testing mechanism, the second forward and backward moving device is provided with a first material transport robot arm, the lower end of the first material transport robot arm is provided with a first lifting device, and the lower end of the first lifting device is provided with a first vacuum suction cup.

[0010] Furthermore, the second material transport module includes a third forward and backward moving device located on the other side between the clip-type loading mechanism and the direction testing mechanism, and a second lifting device is arranged on the third forward and backward moving device. A first rotating cylinder and a second material transport robot arm connected to the first rotating cylinder are arranged at the front end of the second lifting device, and a second vacuum suction cup is arranged at the lower end of the second material transport robot arm.

[0011] Furthermore, the test suction cup seat includes a mounting seat, a front and rear telescope is arranged inside the mounting seat, a front end surface of the mounting seat is provided with a plurality of vacuum suction nozzles connected to the front and rear telescopes, the electric finger positioning device includes a clamping claw driver, both ends of the clamping claw driver are provided with positioning gold fingers, the front ends of the positioning gold fingers are provided with positioning plates, and the two positioning plates are respectively located at the two ends of the front end surface of the mounting seat.

[0012] Furthermore, the third material transport module includes a third lifting device, on which a second rotating cylinder and a third material transport robot arm connected to the second rotating cylinder are provided, a third vacuum suction cup is provided at the front end of the third material transport robot arm, and the third vacuum suction cup is located directly in front of the mounting seat; the third material transport module also includes a fourth front-and-rear moving device and a left-and-right moving device connected to the fourth front-and-rear moving device and a fourth material transport robot arm connected to the left-and-right moving device, a fourth vacuum suction cup is provided at the lower end of the fourth material transport robot arm, the fourth vacuum suction cup will transfer the product on the third vacuum suction cup, and the fourth front-and-rear moving device and the left-and-right moving device can drive the fourth material transport robot arm to move in the sorting and unloading tray.

[0013] Furthermore, the height fine-adjustment mechanism includes a mounting block, a tension spring is arranged between the side end of the mounting block and the slider, a micrometer adjustment screw is installed in the mounting block, the micrometer adjustment screw is located at the upper end of the slider, and the micrometer adjustment screw can adjust the slider to move downward, thereby adjusting the opening between the front panel and the bottom of the C-shaped frame.

[0014] The beneficial effects of the present invention are: 1. The direction test seat is driven to rotate by a direct drive motor, and the direction is determined by an optical fiber sensor. This design effectively avoids the problems of poor repeated positioning accuracy, long measurement time, inaccurate measurement positioning, etc. caused by transmission wear of the traditional worm gear machine; 2. Electric finger positioning devices are provided at both ends of the test suction cup seat. This design can position the chip on the test suction cup seat, thereby improving the angle measurement accuracy of the X-ray transmitter and the X-ray receiver; 3. The clip-type loading mechanism is used instead of the traditional vibration plate loading, which can effectively avoid the adverse consequences of large and thin chips being fragmented due to vibration in the vibration plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 is a top view of the present invention;

[0016] Figure 2 This is the main view of the test suction cup mount;

[0017] Figure 3 It is a top view of the test suction cup mount. DETAILED DESCRIPTION

[0018] like Figures 1 to 3 As shown, in this embodiment, the present invention includes a workbench 1, on which a clip-type loading mechanism 2, a direction testing mechanism 3, an angle testing mechanism 4 and a sorting unloading tray 5 are sequentially arranged, a first material transport module 6 is arranged between the clip-type loading mechanism 2 and the direction testing mechanism 3, a second material transport module 7 is arranged between the direction testing mechanism 3 and the angle testing mechanism 4, and a third material transport module 8 is arranged between the angle testing mechanism 4 and the sorting unloading tray 5; the direction testing mechanism 3 includes a direct drive motor and a direction testing seat 31 connected to the direct drive motor, an optical fiber sensor 32 is arranged obliquely above the direction testing seat 31, and the angle testing mechanism 4 includes an X-ray transmitter 41, a test suction cup seat 42 and an X-ray receiver 43 which are sequentially distributed in an oblique line on the workbench 1, and electric finger positioning devices 44 are arranged at both ends of the test suction cup seat 42.

[0019] In this embodiment, the workbench 1 is provided with an MCU control system 9, and the clip-type feeding mechanism 2, the direction testing mechanism 3, the angle testing mechanism 4, the first material transport module 6, the second material transport module 7 and the third material transport module 8 are all electrically connected to the MCU control system 9.

[0020] In this embodiment, the clip-type feeding mechanism 2 includes a first front-to-back moving device 21, a first front-to-back slide rail 22 and a clip-type component 23. The middle part of the bottom of the clip-type component 23 is adapted to be slidably connected to the first front-to-back slide rail 22. The first front-to-back moving device 21 is installed below the first front-to-back slide rail 22 and is connected to the two ends of the bottom of the clip-type component 23. The clip-type component 23 includes a U-shaped frame 231. The two ends of the U-shaped frame 231 are provided with a lifting slide rail 232 and a slider 233 adapted to the lifting slide rail 232. A front panel 24 adapted to the U-shaped frame 231 is provided between the two sliders 233. A height fine-adjustment mechanism 25 connected to the slider 233 is provided at one end of the U-shaped frame 231. The bottom of the shaped frame 231 is adapted to be slidably connected to the first front and rear slide rails 22, and a wafer support plate 234 is provided in the bottom of the shaped frame 231 and at both ends of the first front and rear slide rails 22, and a vacuum suction hole 221 is provided at the front end of the first front and rear slide rails 22. This design is achieved by placing the wafer into the clip-type assembly 23. When the first front and rear moving device 21 drives the clip-type assembly 23 to move on the first front and rear slide rails 22, when it moves to the front end, the wafer at the bottom of the clip-type assembly 23 is sucked by the vacuum suction hole 221, so when the clip-type assembly 23 moves back, the bottom wafer of the clip-type assembly 23 will be sucked at the vacuum suction hole 221, which is convenient for subsequent loading. This not only realizes automatic loading, but also can effectively avoid the adverse consequences of fragments caused by vibration plate loading.

[0021] In this embodiment, the first material transport module 6 includes a second front-to-back moving device 61 located on one side between the clip-type loading mechanism 2 and the direction testing mechanism 3, and a first material transport robot arm 62 is arranged on the second front-to-back moving device 61. A first lifting device is arranged at the lower end of the first material transport robot arm 62, and a first vacuum suction cup is arranged at the lower end of the first lifting device.

[0022] In this embodiment, the second material transport module 7 includes a third forward and backward moving device 71 located on the other side between the clip-type loading mechanism 2 and the direction testing mechanism 3, and a second lifting device 72 is arranged on the third forward and backward moving device 71. The front end of the second lifting device 72 is provided with a first rotating cylinder 73 and a second material transport robot arm 74 connected to the first rotating cylinder 73, and the lower end of the second material transport robot arm 74 is provided with a second vacuum suction cup.

[0023] In this embodiment, the test suction cup seat 42 includes a mounting seat 421, a front and rear telescope is arranged inside the mounting seat 421, and a plurality of vacuum suction nozzles 422 connected to the front and rear telescopes are arranged on the front end surface of the mounting seat 421. The electric finger positioning device 44 includes a clamping claw driver, and positioning gold fingers 423 are arranged at both ends of the clamping claw driver. The front ends of the positioning gold fingers 423 are arranged with positioning plates 424, and the two positioning plates 424 are respectively located at the two ends of the front end surface of the mounting seat 421.

[0024] In this embodiment, the third material transport module 8 includes a third lifting device 81, on which a second rotating cylinder 82 and a third material transport robot arm 83 connected to the second rotating cylinder 82 are provided, and a third vacuum suction cup 84 is provided at the front end of the third material transport robot arm 83, and the third vacuum suction cup 84 is located directly in front of the mounting seat 421; the third material transport module 8 also includes a fourth front-and-back moving device 85 and a left-and-right moving device 86 connected to the fourth front-and-back moving device 85 and a fourth material transport robot arm 87 connected to the left-and-right moving device 86, and a fourth vacuum suction cup is provided at the lower end of the fourth material transport robot arm 87, and the fourth vacuum suction cup will transfer the third vacuum suction cup 84 Product, the fourth front-to-back moving device 85 and the left-to-right moving device 86 can drive the fourth material transport robot 87 to move in the sorting and unloading tray 5. This design is that after the chip on the test suction cup seat 42 is tested, the third lifting device 81 indirectly drives the third vacuum suction cup 84 to move down to the front of the test suction cup seat 42, and the front and rear telescopic devices push the vacuum suction nozzle 422 with the chip forward and transfer it to the third vacuum suction cup 84, and then the third lifting device 81 is reset, and then the second rotating cylinder 82 drives the third material transport robot 83 to rotate 90°, and then the chip is transferred away by the fourth vacuum suction cup of the fourth material transport robot 87, and moved in the sorting and unloading tray 5 under the action of the fourth front-to-back moving device 85 and the left-to-right moving device 86.

[0025] In this embodiment, the height fine-tuning mechanism 25 includes a mounting block 251, a tension spring 252 is provided between the side end of the mounting block 251 and the slider 233, a micrometer adjustment screw 253 is installed in the mounting block 251, and the micrometer adjustment screw 253 is located at the upper end of the slider 233. The micrometer adjustment screw 253 can adjust the slider 233 to move downward, thereby adjusting the opening between the front panel 24 and the bottom of the U-shaped frame 231; this design can adjust the front panel according to the thickness of the processed wafer. 24 and the opening between the bottom of the U-shaped frame 231 make the size of the opening larger than the thickness of one chip but smaller than the sum of the thickness of two chips. The specific adjustment operation is to push the slider 233 downward by rotating the thousandth adjustment screw 253 clockwise, thereby driving the front panel 24 to move downward, so as to adapt to different opening sizes. When the opening needs to be enlarged, it is only necessary to rotate the thousandth adjustment screw 253 counterclockwise, the screw in the thousandth adjustment screw 253 extends upward, and the slider 233 also rises to the bottom of the screw under the action of the tension spring 252.

[0026] In this embodiment, the sorting discharge tray 5 includes a plurality of product angle classification boxes arranged in an array.

[0027] In this embodiment, the working process of the present invention is as follows: when the first front-to-rear moving device 21 drives the clip-type assembly 23 to move to the front end on the first front-to-rear slide rail 22 and then moves back, the bottom chip of the clip-type assembly 23 will be sucked at the vacuum suction hole 221, and then the first material transport module 6 moves the chip to the direction test seat 31, and then the direct drive motor drives the chip to rotate on the direction test seat 31, and after the direction of the chip is determined by the optical fiber sensor 32, it is adsorbed and rotated 90° by the second material transport module 7 and placed on the test suction cup seat 42, and then the angle of the chip is tested by the cooperation of the X-ray transmitter 41 and the X-ray receiver 43, and finally the chip is placed in the product angle classification box of the corresponding angle through the third material transport module 8.

[0028] The invention is applied to the technical field of wafer angle sorting equipment.

[0029] Although the embodiments of the present invention are described with practical solutions, they do not constitute limitations on the meaning of the present invention. For those skilled in the art, it is obvious to modify the implementation scheme and combine it with other solutions based on this description.

Claims

1. A wafer automatic angle sorting system, characterized in that: It comprises a workbench (1), on which a clip-type loading mechanism (2), a direction testing mechanism (3), an angle testing mechanism (4) and a sorting material tray (5) are arranged in sequence, a first material transport module (6) is arranged between the clip-type loading mechanism (2) and the direction testing mechanism (3), a second material transport module (7) is arranged between the direction testing mechanism (3) and the angle testing mechanism (4), and a third material transport module (8) is arranged between the angle testing mechanism (4) and the sorting material tray (5); the direction testing mechanism (3) comprises a direct drive motor and a direction testing seat (31) connected to the direct drive motor, an optical fiber sensor (32) is arranged obliquely above the direction testing seat (31), and the angle testing mechanism (4) comprises an X-ray transmitter (41), a test suction cup seat (42) and an X-ray receiver (43) which are distributed in an oblique line in sequence on the workbench (1), and electric finger positioning devices (44) are arranged at both ends of the test suction cup seat (42); The clip-type feeding mechanism (2) comprises a first front-to-back moving device (21), a first front-to-back sliding rail (22) and a clip-type assembly (23); the middle portion of the bottom of the clip-type assembly (23) is slidably connected to the first front-to-back sliding rail (22); the first front-to-back moving device (21) is installed below the first front-to-back sliding rail (22) and is connected to the two ends of the bottom of the clip-type assembly (23); the clip-type assembly (23) comprises a U-shaped frame (231); both ends of the U-shaped frame (231) are provided with lifting rails (232) and a lifting rail (232) adapted to be connected to the lifting rail (232) A slider (233) is provided between the two sliders (233) and a front panel (24) adapted to the C-shaped frame (231); one end of the C-shaped frame (231) is provided with a height fine-adjustment mechanism (25) connected to the slider (233); the bottom of the C-shaped frame (231) is adapted to be slidably connected to the first front and rear slide rails (22); a wafer support plate (234) is provided in the bottom of the C-shaped frame (231) and at both ends of the first front and rear slide rails (22); and a vacuum suction hole (221) is provided at the front end of the first front and rear slide rails (22); The sorting unloading tray (5) comprises a plurality of product angle classification boxes arranged in an array.

2. The wafer automatic angle sorting system according to claim 1, characterized in that: The workbench (1) is provided with an MCU control system (9); the clip-type feeding mechanism (2), the direction testing mechanism (3), the angle testing mechanism (4), the first material transport module (6), the second material transport module (7) and the third material transport module (8) are all electrically connected to the MCU control system (9).

3. The wafer automatic angle sorting system according to claim 2, characterized in that: The first material transport module (6) comprises a second front-to-back moving device (61) located on one side between the clip-type loading mechanism (2) and the direction testing mechanism (3); a first material transport robot arm (62) is arranged on the second front-to-back moving device (61); a first lifting device is arranged at the lower end of the first material transport robot arm (62); and a first vacuum suction cup is arranged at the lower end of the first lifting device.

4. The wafer automatic angle sorting system according to claim 2, characterized in that: The second material transport module (7) comprises a third front-to-back moving device (71) located on the other side between the clip-type loading mechanism (2) and the direction testing mechanism (3); a second lifting device (72) is arranged on the third front-to-back moving device (71); a first rotating cylinder (73) and a second material transport robot arm (74) connected to the first rotating cylinder (73) are arranged at the front end of the second lifting device (72); and a second vacuum suction cup is arranged at the lower end of the second material transport robot arm (74).

5. The wafer automatic angle sorting system according to claim 2, characterized in that: The test suction cup seat (42) comprises a mounting seat (421), a front and rear telescoping device is arranged inside the mounting seat (421), a front end surface of the mounting seat (421) is provided with a plurality of vacuum suction nozzles (422) connected to the front and rear telescoping devices, and the electric finger positioning device (44) comprises a clamping claw driver, both ends of the clamping claw driver are provided with positioning gold fingers (423), and the front ends of the positioning gold fingers (423) are provided with positioning plates (424), and the two positioning plates (424) are respectively located at both ends of the front end surface of the mounting seat (421).

6. The wafer automatic angle sorting system according to claim 5, characterized in that: The third material transport module (8) comprises a third lifting device (81), on which a second rotary cylinder (82) and a third material transport robot arm (83) connected to the second rotary cylinder (82) are arranged, and a third vacuum suction cup (84) is arranged at the front end of the third material transport robot arm (83), and the third vacuum suction cup (84) is located directly in front of the mounting seat (421); the third material transport module (8) also comprises a fourth front-to-back moving device (85), a left-to-right moving device (86) connected to the fourth front-to-back moving device (85), and a fourth material transport robot arm (87) connected to the left-to-right moving device (86), and a fourth material transport robot arm (87) connected to the left-to-right moving device (86), and a fourth vacuum suction cup is arranged at the lower end of the fourth material transport robot arm (87), and the fourth vacuum suction cup will transfer the product on the third vacuum suction cup (84), and the fourth front-to-back moving device (85) and the left-to-right moving device (86) can drive the fourth material transport robot arm (87) to move in the sorting unloading tray (5).

7. The wafer automatic angle sorting system according to claim 2, characterized in that: The height fine-adjustment mechanism (25) comprises a mounting block (251), a tension spring (252) being arranged between the side end of the mounting block (251) and the slider (233), a micrometer adjustment screw (253) being installed in the mounting block (251), the micrometer adjustment screw (253) being located at the upper end of the slider (233), and the micrometer adjustment screw (253) being capable of adjusting the slider (233) to move downward, thereby adjusting the opening between the front panel (24) and the bottom of the U-shaped frame (231).

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