Electronic device

Abstract

The present disclosure relates to an electronic device including a display module in which a folding area is defined, a plate disposed below the display module to support the display module, a digitizer disposed between the plate and the display module, a first adhesive layer disposed between the display module and the digitizer, and a second adhesive layer disposed between the digitizer and the plate. At least one of the first adhesive layer and the second adhesive layer includes a first sub-adhesive layer and a second sub-adhesive layer spaced apart with respect to the folding area.

Description

[0001] This application claims priority to and all benefits arising therefrom of Korean Patent Application No. 10-2020-0122176, filed on September 22, 2020, the contents of which are incorporated herein by reference in their entirety. Technical Field

[0002] This disclosure relates to an electronic device, and more specifically, to a foldable electronic device. Background Technology

[0003] Electronic devices display various images on screens to provide information to users. Typically, electronic devices display information within a designated screen area. Flexible electronic devices, including foldable flexible display panels, are under development. Unlike rigid electronic devices, flexible electronic devices are foldable, rollable, or bendable. Flexible electronic devices, whose shapes can be modified in various ways, are portable and not limited to existing screen sizes, thus enhancing user-friendliness. Summary of the Invention

[0004] This disclosure provides an electronic device with improved folding reliability.

[0005] An embodiment of the present invention provides an electronic device comprising: a display module defining a folding region; a board disposed below the display module to support the display module; a digitizer disposed between the board and the display module; a first adhesive layer disposed between the display module and the digitizer; and a second adhesive layer disposed between the digitizer and the board. At least one of the first adhesive layer and the second adhesive layer includes a first sub-adhesive layer and a second sub-adhesive layer spaced apart relative to the folding region.

[0006] In an embodiment of the present invention, the electronic device includes a display module, a window, a panel, a digitizer, and a first adhesive layer and a second adhesive layer. The display module has a first non-folding region, a second non-folding region, and a folded region defined therebetween, and has a flat first state in which the display module is flat and a second state in which the display module is folded such that the first non-folding region and the second non-folding region face each other. The window is disposed on the display module, and the panel is disposed below the display module. The panel includes a curved portion having a plurality of opening patterns overlapping the folded region in a plan view. The digitizer is disposed between the panel and the display module, the first adhesive layer is disposed between the display module and the digitizer, and the second adhesive layer is disposed between the digitizer and the panel. At least one of the first adhesive layer and the second adhesive layer includes a first sub-adhesive layer and a second sub-adhesive layer spaced apart relative to the folded region. Attached Figure Description

[0007] The accompanying drawings are included to provide a further understanding of the inventive concept and are incorporated in and constitute a part of this specification. The drawings illustrate exemplary embodiments of the inventive concept and, together with the description, serve to explain the principles of the inventive concept. In the drawings:

[0008] Figure 1A This is a perspective view showing an electronic device in an unfolded state according to an embodiment of the present invention;

[0009] Figure 1B It is shown Figure 1A A perspective view of the inward folding process of the electronic device shown;

[0010] Figure 1C It is shown Figure 1A The electronic device shown is in a plan view in an inward folded state;

[0011] Figure 1D This is a perspective view illustrating the outward folding process of an electronic device according to an embodiment of the present invention;

[0012] Figure 2A This is a perspective view showing an electronic device in an unfolded state according to another embodiment of the concept of the present invention;

[0013] Figure 2B It is shown Figure 2A A perspective view of the inward folding process of the electronic device shown;

[0014] Figure 3A This is an exploded perspective view of an electronic device according to an embodiment of the present invention;

[0015] Figure 3B It is along Figure 3A The sectional view shown is taken by line I-I'.

[0016] Figure 4 yes Figure 3A A plan view of the digitizer shown;

[0017] Figure 5 yes Figure 3B An enlarged cross-sectional view of the digitizer shown;

[0018] Figure 6A This is an exploded perspective view of an electronic device according to another embodiment of the concept of the present invention;

[0019] Figure 6B It is along Figure 6A The sectional view shown is taken by line II-II'.

[0020] Figures 7A to 7C This is an enlarged cross-sectional view of a digitizer according to another embodiment of the present invention;

[0021] Figure 8A This is an exploded perspective view of an electronic device according to an embodiment of the present invention;

[0022] Figure 8B It is along Figure 8A The sectional view shown is taken by line III-III'.

[0023] Figure 9A and Figure 9B This is a cross-sectional view of the display module and the lower module according to an embodiment of the present invention; and

[0024] Figure 10A and Figure 10B This is a cross-sectional view of an electronic device according to an embodiment of the present invention. Detailed Implementation

[0025] In this specification, when an element (or region, layer, part, etc.) is referred to as being "on", "connected to", or "attached to" another element, it means that the element may be directly disposed on / connected to / attached to the other element, or that a third element may be disposed between them.

[0026] The same reference numerals denote the same elements. Furthermore, in the accompanying drawings, the thickness, ratios, and dimensions of elements are exaggerated for the purpose of effectively describing the technical content. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting. As used herein, the singular forms “a(a)”, “an”, and “the” are intended to include the plural forms (including “at least one”) unless the context clearly indicates otherwise. “At least one” should not be construed as limiting “a(a)” or “an”. “Or” means “and / or”. The term “and / or” includes all combinations that can be defined by one or more associated configurations.

[0027] It will be understood that although the terms “first,” “second,” etc., may be used herein to describe various elements, these elements should not be limited by these terms. These terms are used only to distinguish one element from another. For example, a first element may be referred to as a second element, and similarly, a second element may be referred to as a first element, without departing from the scope of exemplary embodiments of the inventive concept. Singular terms may include plural forms unless the context clearly indicates otherwise.

[0028] In addition, terms such as "below," "down," "above," and "up" are used to describe the relationships of the configurations shown in the figure. These terms are used as relative concepts and are described with reference to the directions indicated in the figure.

[0029] It should be understood that the terms “comprising” or “having” are intended to specify the presence of features, integers, steps, operations, elements, components or combinations thereof stated in this disclosure, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components or combinations thereof.

[0030] Unless otherwise specified, all terms used herein (including technical and scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art to which the inventive concept pertains. It will also be understood that terms defined in commonly used dictionaries shall be interpreted as having a meaning consistent with their meaning in the context of the relevant art and shall not be interpreted in an ideal or overly formal sense unless expressly so defined herein.

[0031] As used herein, “about” or “approximately” includes the value and the average of the specific value within an acceptable range of deviations as determined by one of ordinary skill in the art when considering the measurement in question and the errors associated with the measurement of the specific quantity (i.e., limitations of the measurement system). For example, “about” may mean within one or more standard deviations, or within ±30%, ±20%, ±10%, or ±5% of the value. Embodiments of the inventive concept will be described below with reference to the accompanying drawings.

[0032] Figure 1A This is a perspective view showing an electronic device in an unfolded state according to an embodiment of the present invention. Figure 1B It is shown Figure 1A A perspective view of the inward folding process of the electronic device shown. Figure 1C It is shown Figure 1A The diagram shows the electronic device in an inward-folded state. Figure 1D This is a perspective view illustrating the outward folding process of an electronic device according to an embodiment of the present invention. As used herein, the plan view is a view shown on a third-party DR3.

[0033] refer to Figure 1A An electronic device EA can be a device activated by an electrical signal. An electronic device EA can include various implementations. For example, an electronic device EA can include a tablet computer, a laptop computer, a desktop computer, a smart TV, etc. In the following text, a smartphone is shown as an example of an electronic device EA.

[0034] The electronic device EA can display an image IM on a first display surface FS that is parallel to a first direction DR1 and a second direction DR2, facing a third direction DR3. The first display surface FS that displays the image IM may correspond to the front surface of the electronic device EA. The image IM may include still images and moving images. Figure 1AAn example of an image IM is shown, illustrating an Internet search window and a view window.

[0035] In this implementation, a front surface (i.e., upper surface) and a rear surface (i.e., lower surface) of a corresponding member are defined relative to the direction in which the image IM is displayed. The front and rear surfaces may face away from each other on a third direction DR3, and the normal direction of each of the front and rear surfaces may be parallel to the third direction DR3.

[0036] The distance between the front and rear surfaces in the third direction DR3 can correspond to the thickness / height of the electronic device EA in the third direction DR3 (i.e., the thickness direction). The directions indicated by the first direction DR1, the second direction DR2, and the third direction DR3 are relative concepts and can therefore be changed to other directions.

[0037] The electronic device EA can detect external inputs applied from outside. External inputs can include various forms of input provided from outside the electronic device EA.

[0038] In implementations, for example, external input may include external input applied when approaching the electronic device EA or when adjacent at a predetermined distance (e.g., hovering), as well as contact via a part of the body (such as a user's hand). Furthermore, external input may take various forms such as force, pressure, temperature, light, etc.

[0039] Figure 1A An example is shown using external input via a user's pen SP. Although not shown, the pen SP can be installed or removed from the inside or outside of the electronic device EA, and the electronic device EA can provide or receive signals from the pen SP corresponding to the installation and removal of the pen SP.

[0040] An electronic device EA according to an embodiment may include a first display surface FS and a second display surface RS. The first display surface FS may include a first active area F-AA, a first peripheral area F-NAA, and an electronic module area EMA. The second display surface RS may be defined as a surface facing away from at least a portion of the first display surface FS. That is, the second display surface RS may be defined as a portion of the rear surface of the electronic device EA.

[0041] The first effective area F-AA can be an area activated by an electrical signal. The first effective area F-AA is the area that displays the image IM and detects various forms of external input. The first peripheral area F-NAA is adjacent to the first effective area F-AA. The first peripheral area F-NAA can have a predetermined color. The first peripheral area F-NAA can surround the first effective area F-AA. The shape of the first effective area F-AA can be substantially defined by the first peripheral area F-NAA. However, this is shown as an example, and the first peripheral area F-NAA can be configured to be adjacent only to one side of the first effective area F-AA, or it can be omitted. The electronic device EA according to embodiments of the present invention can include various embodiments, and the invention is not limited to any one embodiment.

[0042] Various electronic modules can be disposed in the Electronic Module Area (EMA). For example, the electronic module may include at least one of a camera, a speaker, a light detection sensor, and a thermal detection sensor. The Electronic Module Area (EMA) can detect external objects received via the first display surface (FS) and the second display surface (RS), or provide sound signals such as speech to the outside via the first display surface (FS) and the second display surface (RS). The electronic module may include multiple components, and the invention is not limited to any one embodiment.

[0043] The electronic module region EMA can be surrounded by a first effective region F-AA and a first peripheral region F-NAA. However, the embodiments of the present invention are not limited to this, and in another embodiment, the electronic module region EMA can be disposed within the first effective region F-AA, and the present invention is not limited to any one embodiment.

[0044] An electronic device EA according to an embodiment may include at least one folded region FA1 and a plurality of non-folded regions NFA1 and NFA2 extending from the folded region FA1. The non-folded regions NFA1 and NFA2 may be arranged to be spaced apart from each other, with the folded region FA1 between them.

[0045] refer to Figure 1B According to an embodiment, the electronic device EA includes a virtual folding axis AX1 extending in a second direction DR2. The folding axis AX1 may extend along the second direction DR2 on a first display surface FS. That is, the folding axis AX1 may extend along the long axis direction of the electronic device EA (e.g., the second direction DR2).

[0046] In an embodiment, the non-foldable regions NFA1 and NFA2 may include a first non-foldable region NFA1 and a second non-foldable region NFA2 disposed adjacent to the foldable region FA1, with the foldable region FA1 located between them. The first non-foldable region NFA1 may be disposed on one side of the foldable region FA1 along a first direction DR1, and the second non-foldable region NFA2 may be disposed on the other side of the foldable region FA1 along the first direction DR1.

[0047] The electronic device EA can be folded relative to the folding axis AX1 to become an inward folded state, such that a region on the first display surface FS that overlaps with the first non-folded region NFA1 and another region on the first display surface FS that overlaps with the second non-folded region NFA2 face each other in the plan view.

[0048] refer to Figure 1C In the electronic device EA according to an embodiment, the second display surface RS can be viewed by the user in an inwardly folded state. In this case, the second display surface RS may include a second effective area R-AA for displaying images and a second peripheral area R-NAA adjacent to the second effective area R-AA. The second effective area R-AA may be an area activated by an electrical signal. The second effective area R-AA is the area that displays images and detects various forms of external input. The second peripheral area R-NAA may have a predetermined color. The second peripheral area R-NAA may surround the second effective area R-AA. In addition, although not shown, the second display surface RS may also include an electronic module area in which an electronic module including various components is disposed, and the present invention is not limited to any one embodiment.

[0049] refer to Figure 1D According to the embodiment, the electronic device EA can be folded relative to the folding axis AX1 to become an outward folded state, such that a region on the second display surface RS that overlaps with the first non-folded region NFA1 and another region on the second display surface RS that overlaps with the second non-folded region NFA2 face each other in a plan view.

[0050] However, the embodiments of the present invention are not limited thereto, and the electronic device EA can be folded relative to multiple folding axes such that portions of each of the first display surface FS and the second display surface RS can face each other, and the number of folding axes and the corresponding number of non-folded areas are not particularly limited.

[0051] Figure 2A This is a perspective view showing an electronic device in an unfolded state according to another embodiment of the concept of the present invention. Figure 2B It is shown Figure 2A A perspective view of the inward folding process of the electronic device shown.

[0052] refer to Figure 2A and Figure 2B The electronic device EA can fold inward or outward relative to a virtual folding axis AX2. The folding axis AX2 can extend along a second direction DR2. Figures 1A to 1D In the middle, the folding axis AX1 can extend along the long axis (i.e., the longitudinal axis) of the electronic device EA; however, in Figure 2A and Figure 2B In this case, the folding axis AX2 can extend along the short axis (i.e., the horizontal axis) of the electronic device EA.

[0053] In an electronic device EA, multiple regions can be defined according to the type of operation. These multiple regions can be divided into a folded region FA2 and at least one non-folded region NFA3 or NFA4. The folded region FA2 is defined between two non-folded regions NFA3 and NFA4.

[0054] The folded region FA2 is the region that is folded relative to the folding axis AX2 and substantially forms a curvature. As an example of the inventive concept, the non-folded regions NFA3 and NFA4 may include a first non-folded region NFA3 and a second non-folded region NFA4. The first non-folded region NFA3 is adjacent to one side of the folded region FA2 in the first direction DR1, and the second non-folded region NFA4 is adjacent to the other side of the folded region FA2 in the first direction DR1.

[0055] In one embodiment, a folded region FA2 is defined in the electronic device EA; however, the embodiments of the present invention are not limited to this. According to another embodiment of the present invention, multiple folded regions may be defined in the electronic device EA.

[0056] When the electronic device EA is in the unfolded state, the first display surface FS can be viewed by the user, and when the electronic device EA is in the folded-in state, the second display surface RS can be viewed by the user. The second display surface RS may include an electronic module area EMA in which electronic modules comprising various components are disposed.

[0057] Figure 3A This is an exploded perspective view of an electronic device according to an embodiment of the present invention, and Figure 3B It is along Figure 3A The sectional view shown is taken by line I-I'. Figure 4 yes Figure 3A The diagram shows a plan view of the digitizer. Figure 5 yes Figure 3B An enlarged cross-sectional view of the digitizer shown. Figure 5 It is a cross-sectional view of the digitizer taken along the diagonal between the first direction DR1 and the second direction DR2.

[0058] refer to Figure 3A An electronic device EA according to an embodiment of the present invention may include a display module DM for displaying images, an upper module UM disposed on the display module DM, and a lower module LM disposed below the display module DM. The display module DM is part of the electronic device EA, and in particular, can generate images.

[0059] The display module DM may include a display panel DP and an input sensing unit ISP. In embodiments of the present invention, the display panel DP may be a light-emitting display panel, but the invention is not limited thereto. For example, the display panel DP may be an organic light-emitting display panel or a quantum dot light-emitting display panel. The emitting layer of an organic light-emitting display panel may include organic light-emitting materials. The emitting layer of a quantum dot light-emitting display panel may include quantum dots, quantum rods, etc.

[0060] The display panel DP can be a flexible display panel. Therefore, the display panel DP can be fully rolled up, folded, or unfolded relative to the folding axis AX2.

[0061] The input sensing unit (ISP) can be directly disposed on the display panel (DP). According to an embodiment of the present invention, the ISP can be formed on the display panel (DP) using a continuous manufacturing process. That is, when the ISP is directly disposed on the display panel (DP), no adhesive film is provided between the ISP and the DP. However, the embodiments of the present invention are not limited to this. In another embodiment, an adhesive film can be provided between the ISP and the DP. In this case, the ISP is not manufactured simultaneously with the DP using a continuous manufacturing process, and after being manufactured using a process separate from the DP, the ISP can be fixed to the upper surface of the DP using an adhesive film. The ISP can obtain the coordinate information of user input (e.g., touch events).

[0062] The upper module UM may include a window disposed on the display module DM. The window may include an optically transparent insulating material. Therefore, the image generated in the display module DM can be easily recognized by the user through the window.

[0063] The upper module UM may also include a protective layer disposed on the window. The protective layer may be a layer used to improve the window's impact resistance and prevent dispersion in the event of damage. The protective layer may include at least one selected from urethane-based resins, epoxy-based resins, polyester-based resins, polyether-based resins, acrylate-based resins, acrylonitrile-butadiene-styrene resin (“ABS”), and rubber. As an example of the inventive concept, the protective layer may include at least one selected from phenylene, polyethylene terephthalate (“PET”), polyimide (“PI”), polyamide (“PAI”), polyethylene naphthalate (“PEN”), and polycarbonate (“PC”).

[0064] Furthermore, the upper module UM may also include at least one functional layer disposed between the display module DM and the window. As an example of the inventive concept, the functional layer may be an anti-reflective layer that blocks external light reflection.

[0065] The display module DM can display images and send / receive external input information based on electrical signals. The display module DM may include a display area DA and a non-display area NDA. The display area DA can be defined as the area that outputs the image provided by the display module DM.

[0066] The non-display area NDA is adjacent to the display area DA. For example, the non-display area NDA may surround the display area DA. However, this is shown as an example, and the non-display area NDA may be defined in various shapes, and the invention is not limited to any one embodiment. According to an embodiment, the display area DA of the display module DM may correspond to at least a portion of the first effective area F-AA.

[0067] The lower module LM includes a plate PT disposed on the rear surface of the display module DM to support the display module DM. The plate PT may have a plate shape. As an example of the inventive concept, the plate PT may be formed as a single plate shape having dimensions corresponding to the display module DM. Additionally, the plate PT may comprise a metallic material. That is, the plate PT may be a metal plate. As an example of the inventive concept, the plate PT may comprise stainless steel, aluminum, or an alloy thereof. The strength of the plate PT may be greater than the strength of the display module DM.

[0068] The plate PT may include a curved portion BP having a plurality of patterns OP. The curved portion BP may correspond to the folding region FA2. The plurality of patterns OP may be arranged in the curved portion BP at a predetermined distance from each other. The plurality of patterns OP may be arranged in a zigzag pattern in a direction perpendicular to the folding axis AX2 (e.g., the first direction DR1). In addition, each of the plurality of patterns OP may be an opening pattern defined in and passing through the plate PT. However, embodiments of the inventive concept are not limited to this. That is, each of the plurality of patterns OP may be a recessed pattern recessed from one surface (upper or lower surface) of the plate PT. Each of the plurality of patterns OP may have a rectangular shape extending along the folding region FA2 in the second direction DR2 (i.e., the direction of the folding axis AX2). However, the shape of the plurality of patterns OP according to the invention is not limited to this. For example, in another embodiment, each of the plurality of patterns OP may have a rhomboid shape or a circular shape.

[0069] The flexibility of the bent portion BP can be increased by providing multiple patterned OPs to it. The plate PT can facilitate the folding operation of the electronic device EA while supporting the display module DM.

[0070] The curved portion BP of the plate PT may include a plurality of support rods. Each of the plurality of support rods has a rod shape extending parallel to the folding axis AX2 in a second direction DR2. The curved portion BP may define a plurality of patterns OP disposed between the plurality of support rods. Each of the plurality of patterns OP may be a slit pattern. The plurality of support rods may be spaced apart from each other by the plurality of slit patterns. Each of the plurality of support rods may have a square cross-sectional structure in the first direction DR1. However, the cross-sectional shape of the plurality of support rods according to the invention is not limited thereto. For example, in another embodiment, each of the plurality of support rods may have a trapezoidal cross-sectional shape or a triangular cross-sectional shape.

[0071] The lower module LM also includes a digitizer DZ located between the board PT and the display module DM.

[0072] refer to Figure 4 The digitizer DZ can detect external input via electromagnetic resonance (“EMR”). The electromagnetic resonance (EMR) method is configured in the pen SP (reference). Figure 1A A magnetic field is generated in the internal resonant circuit, and the vibrating magnetic field induces signals in multiple coils included in the digitizer DZ, and the position of the external input provided by the pen SP is detected by the signals induced in the coils.

[0073] The sensing area (SA) and the non-sensing area (NSA) can be defined within the digitizer (DZ). The non-sensing area (NSA) can surround the sensing area (SA). The sensing area (SA) can be the area that detects external input from an externally applied pen (SP). The sensing area (SA) can overlap with the display area (DA) of the display panel (DP) in a plan view.

[0074] The digitizer DZ may include a base layer BL, first sensors CF1, CF2 and CF3, and second sensors RF1 and RF2.

[0075] The substrate layer BL may be a substrate layer in which first sensors CF1, CF2, and CF3 and second sensors RF1 and RF2 are disposed. The substrate layer BL may include organic materials. For example, the substrate layer BL may include polyimide (PI).

[0076] First sensors CF1, CF2, and CF3 each include multiple first sensing lines. For example, first sensor CF1 may include first sensing lines CF1-1, CF1-2, and CF1-3; first sensor CF2 may include first sensing lines CF2-1, CF2-2, and CF2-3; and first sensor CF3 may include first sensing lines CF3-1, CF3-2, and CF3-3. Second sensors RF1 and RF2 each include multiple second sensing lines. For example, second sensor RF1 may include second sensing lines RF1-1, RF1-2, and RF1-3; and second sensor RF2 may include second sensing lines RF2-1, RF2-2, and RF2-3. Each of the multiple first sensing lines CF1-1 to CF3-3 and the multiple second sensing lines RF1-1 to RF2-3 may include metal. In an embodiment, each of the multiple first sensing lines CF1-1 to CF3-3 and the multiple second sensing lines RF1-1 to RF2-3 may include copper (Cu).

[0077] The first sensing lines CF1-1 to CF3-3 can extend along the second direction DR2. The first sensing lines CF1-1 to CF3-3 can be arranged to be spaced apart from each other along the first direction DR1. The second sensing lines RF1-1 to RF2-3 can extend along the first direction DR1. The second sensing lines RF1-1 to RF2-3 can be arranged to be spaced apart from each other along the second direction DR2. The first sensing lines CF1-1 to CF3-3 and the second sensing lines RF1-1 to RF2-3 can be configured to be insulated from each other.

[0078] The first sensors CF1, CF2 and CF3 correspond to the input coils of the electromagnetic resonant digitizer DZ, and the second sensors RF1 and RF2 correspond to the output coils of the electromagnetic resonant digitizer DZ.

[0079] The digitizer DZ may also include a first pad TC1 and a second pad TC2. The first pad TC1 is connected to the first sensing lines CF1-1 to CF3-3, and the second pad TC2 is connected to the second sensing lines RF1-1 to RF2-3. The first pad TC1 is connected to the first ends of the first sensing lines CF1-1 to CF3-3, and the second ends of the first sensing lines CF1-1 to CF3-3 (i.e., the ends opposite to the first ends) can be grounded. The second pad TC2 is connected to the first ends of the second sensing lines RF1-1 to RF2-3, and the second ends of the second sensing lines RF1-1 to RF2-3 (i.e., the ends opposite to the first ends) can be grounded.

[0080] The first sensing lines CF1-1 to CF3-3 each receive scanning signals activated at different time periods. Each of the first sensing lines CF1-1 to CF3-3 generates a magnetic field in response to a corresponding scanning signal in the scanning signal.

[0081] Pen SP (see) Figure 1A The device may include an LC resonant circuit, which includes an inductor and a capacitor. When the pen SP is adjacent to the first sensing lines CF1-1 to CF3-3, the magnetic field induced from the first sensing lines CF1-1 to CF3-3 resonates with the LC resonant circuit of the pen SP. The pen SP generates a resonant frequency. The second sensing lines RF1-1 to RF2-3 output sensing signals to the second pad TC2 according to the resonant frequency of the pen SP.

[0082] exist Figure 4 In this context, the center of the area where the second line CF1-2 of the first sensing lines CF1-1 to CF3-3 intersects with the second line RF2-2 of the second sensing lines RF1-1 to RF2-3 is assumed to be the input point PP that contacts the pen SP.

[0083] In this example, the sensing signal output from the second line CF1-2 among the first sensing lines CF1-1 to CF3-3 has a higher level than the sensing signals output from the remaining first sensing lines CF1-1, CF1-3 to CF3-3. Similarly, the sensing signal output from the second line RF2-2 among the second sensing lines RF1-1 to RF2-3 has a higher level than the sensing signals output from the remaining second sensing lines RF1-1 to RF2-1, RF2-3.

[0084] In this example, the sensing signals output from the first line RF2-1 and the third line RF2-3 of the second sensing lines RF1-1 to RF2-3 have a lower level than the sensing signal output from the second line RF2-2, and the sensing signals output from the first line RF2-1 and the third line RF2-3 of the second sensing lines RF1-1 to RF2-3 have a higher level than the sensing signals output from the remaining second sensing lines RF1-1, RF1-2 and RF1-3.

[0085] In this example, based on the time when a high-level sensing signal is detected from the second line RF2-2 and the relative position of the second line RF2-2 with respect to the remaining second sensing lines RF1-1 to RF2-1 and RF2-3, the two-dimensional coordinate information of the input point PP through the pen SP can be calculated.

[0086] The digitizer DZ includes a first dummy line DML1 and a second dummy line DML2. The first dummy line DML1 extends in the second direction DR2 and is arranged to be spaced apart from each other in the first direction DR1. The first dummy line DML1 is disposed in the first sensing lines CF1-1 to CF1-3 and in the first sensing lines CF3-1 to CF3-3, and is electrically insulated from the first sensing lines CF1-1 to CF3-3. As an example of the inventive concept, the first dummy line DML1 may be in a floating state.

[0087] The second dummy line DML2 extends along the first direction DR1 and is arranged to be spaced apart from each other along the second direction DR2. The second dummy line DML2 is disposed within the second sensing lines RF1-1 to RF1-3 and within the second sensing lines RF2-1 to RF2-3, and is electrically insulated from the second sensing lines RF1-1 to RF2-3. As an example of the inventive concept, the second dummy line DML2 may be in a floating state.

[0088] like Figure 4 As shown, the first dummy line DML1 and the second dummy line DML2 are disposed in the first non-folded region NFA3 and the second non-folded region NFA4, but not in the folded region FA2. Therefore, in the plan view, the first dummy line DML1 and the second dummy line DML2 overlap with the first non-folded region NFA3 and the second non-folded region NFA4, but do not overlap with the folded region FA2. The first dummy line DML1 and the second dummy line DML2 may include metal. For example, the first dummy line DML1 and the second dummy line DML2 may include the same material as the first sensing lines CF1-1 to CF3-3 and the second sensing lines RF1-1 to RF2-3.

[0089] refer to Figure 4 and Figure 5First sensing lines CF1-1 to CF3-3 are disposed on a first surface of the substrate layer BL, and second sensing lines RF1-1 to RF2-3 are disposed on a second surface of the substrate layer BL. The first surface of the substrate layer BL can be defined as the upper surface of the substrate layer BL, and the second surface of the substrate layer BL can be defined as the lower surface of the substrate layer BL. The arrangement of the first sensing lines CF1-1 to CF3-3 and the second sensing lines RF1-1 to RF2-3 according to the present invention is not limited thereto. That is, in another embodiment, the first sensing lines CF1-1 to CF3-3 can be disposed on the second surface of the substrate layer BL, and the second sensing lines RF1-1 to RF2-3 can be disposed on the first surface of the substrate layer BL.

[0090] The digitizer DZ may also include a first cover layer CVL1 covering the first sensing lines CF1-1 to CF3-3 and a second cover layer CVL2 covering the second sensing lines RF1-1 to RF2-3. The first cover layer CVL1 and the second cover layer CVL2 may each comprise the same material as the substrate layer BL. That is, the first cover layer CVL1 and the second cover layer CVL2 may each comprise polyimide (PI).

[0091] The digitizer DZ also includes a first inner adhesive layer IAF1 and a second inner adhesive layer IAF2. The first inner adhesive layer IAF1 is disposed between a first cover layer CVL1 and a base layer BL, and the second inner adhesive layer IAF2 is disposed between a second cover layer CVL2 and a base layer BL. Therefore, the first cover layer CVL1 is bonded to a first surface of the base layer BL via the first inner adhesive layer IAF1, and the second cover layer CVL2 is bonded to a second surface of the base layer BL via the second inner adhesive layer IAF2. Each of the first inner adhesive layer IAF1 and the second inner adhesive layer IAF2 may comprise an optically transparent adhesive material. Each of the first inner adhesive layer IAF1 and the second inner adhesive layer IAF2 may comprise a pressure-sensitive adhesive (“PSA”), an optically transparent adhesive (“OCA”), or an optically transparent resin (“OCR”).

[0092] The digitizer DZ may also include a magnetic sheet. The magnetic sheet may be disposed beneath the second inner adhesive layer IAF2 or the second cover layer CVL2. The magnetic sheet may be a layer comprising magnetic metal powder (“MMP”).

[0093] In the first non-folded region NFA3 and the second non-folded region NFA4, a first dummy line DML1 is disposed within the first sensing lines CF1-1 to CF1-3 and the first sensing lines CF3-1 to CF3-3. In the first non-folded region NFA3 and the second non-folded region NFA4, a second dummy line DML2 is disposed within the second sensing lines RF1-1 to RF1-3 and the second sensing lines RF2-1 to RF2-3. The first dummy line DML1 is disposed in the separated region of the first sensing lines CF1-1 to CF1-3 and the first sensing lines CF3-1 to CF3-3. The first dummy line DML1 is formed on the first surface of the substrate layer BL using the same manufacturing process as the first sensing lines CF1-1 to CF3-3. The first dummy line DML1 and the first sensing lines CF1-1 to CF3-3 are disposed on the same layer.

[0094] In the plane defined by the first direction DR1 and the second direction DR2, the distance d2 between two adjacent first dummy lines DML1 can be smaller than the distance d1 between any two of the first sensing lines CF1-1 to CF3-3. The first dummy lines DML1 are arranged at intervals smaller than the interval between any two of the first sensing lines CF1-1 to CF3-3 and between the first sensing lines CF1-1 to CF3-3, and in the first non-folded region NFA3 and the second non-folded region NFA4, thus effectively reducing or eliminating the surface steps on the upper surface of the digitizer DZ caused by the first sensing lines CF1-1 to CF3-3.

[0095] The second dummy line DML2 is disposed in the separation region between the second sensing lines RF1-1 to RF1-3 and between the second sensing lines RF2-1 to RF2-3. The second dummy line DML2 is formed on the second surface of the substrate layer BL using the same manufacturing process as the second sensing lines RF1-1 to RF2-3. The second dummy line DML2 and the second sensing lines RF1-1 to RF2-3 are disposed on the same layer. In the plane defined by the first direction DR1 and the second direction DR2, the distance d4 between two adjacent second dummy lines DML2 can be less than the distance d3 between any two of the second sensing lines RF1-1 to RF2-3. The second dummy line DML2 is disposed between the second sensing lines RF1-1 to RF1-3 and between the second sensing lines RF2-1 to RF2-3 at a smaller interval than the interval between any two of the second sensing lines RF1-1 to RF2-3, and in the first non-folded region NFA3 and the second non-folded region NFA4. Therefore, the surface steps of the lower surface of the digitizer DZ caused by the second sensing lines RF1-1 to RF2-3 can be effectively reduced or eliminated.

[0096] The first dummy line DML1 and the second dummy line DML2 are not provided in the folded region FA2. When the first dummy line DML1 and the second dummy line DML2 are provided in the folded region FA2, the flexibility of the folded region FA2 may be degraded due to the first dummy line DML1 and the second dummy line DML2. That is, the first dummy line DML1 and the second dummy line DML2 do not overlap with the folded region FA2 in the plan view to prevent the electronic device EA (see...) from being compromised. Figure 1A The deterioration of the folding properties of ).

[0097] The first dummy line DML1 and the second dummy line DML2 are not provided in the folded region FA2, and the surface step st1 in the thickness direction (i.e., the third direction DR3) caused by the first sensing lines CF1-1 to CF3-3 can therefore be formed on the upper surface of the digitizer DZ in the folded region FA2, and the surface step st2 in the third direction DR3 caused by the second sensing lines RF1-1 to RF2-3 can therefore be formed on the lower surface of the digitizer DZ in the folded region FA2. That is, due to these surface steps st1 and st2, the surface roughness of the digitizer DZ in the folded region FA2 can be greater than the surface roughness of the digitizer DZ in the non-folded regions NFA3 and NFA4.

[0098] refer to Figure 3A and Figure 3B The lower module LM may further include a first adhesive layer AF1 and a second adhesive layer AF2. The first adhesive layer AF1 is disposed above the digitizer DZ, and the second adhesive layer AF2 is disposed below the digitizer DZ. The first adhesive layer AF1 includes a first sub-adhesive layer AF1_1 and a second sub-adhesive layer AF1_2. The first sub-adhesive layer AF1_1 and the second sub-adhesive layer AF1_2 may be configured to be spaced apart from each other relative to the folded region FA2. That is, the first sub-adhesive layer AF1_1 and the second sub-adhesive layer AF1_2 are spaced apart from each other in a first direction DR1 to form a first separation region SA1 (i.e., an empty space) between them. The first separation region SA1 may be configured to correspond to the folded region FA2. The first sub-adhesive layer AF1_1 may be configured to correspond to the first non-folded region NFA3, and the second sub-adhesive layer AF1_2 may be configured to correspond to the second non-folded region NFA4.

[0099] The first adhesive layer AF1 and the second adhesive layer AF2 may each comprise an optically transparent adhesive material. As an example of the inventive concept, the first adhesive layer AF1 and the second adhesive layer AF2 may each comprise a pressure-sensitive adhesive (“PSA”), an optically transparent adhesive (“OCA”), or an optically transparent resin (“OCR”).

[0100] The lower module LM also includes a protective layer PL disposed below the display module DM. The protective layer PL can be disposed between the digitizer DZ and the display module DM. The protective layer PL can be bonded to the rear surface of the display module DM via a separate adhesive layer. The protective layer PL prevents scratches from occurring on the rear surface of the display module DM during manufacturing. The protective layer PL can be a colored polyimide film. For example, the protective layer PL can be an opaque yellow film, but the invention is not limited thereto.

[0101] As an example of the inventive concept, a protective layer PL is disposed between a first adhesive layer AF1 and a display module DM. A first portion of the protective layer PL in the first non-folded region NFA3 is bonded to the digitizer DZ via a first sub-adhesive layer AF1_1, and a second portion of the protective layer PL in the second non-folded region NFA4 is bonded to the digitizer DZ via a second sub-adhesive layer AF1_2. The first sub-adhesive layer AF1_1 and the second sub-adhesive layer AF1_2 are spaced apart from each other in the folded region FA2, and an air gap AP is disposed between the protective layer PL and the digitizer DZ as a first separation region SA1 between the first sub-adhesive layer AF1_1 and the second sub-adhesive layer AF1_2.

[0102] Due to the air gap AP in the folded region FA2, the digitizer DZ and the protective layer PL can be spaced apart on the third-direction DR3. Therefore, the surface steps st1 and st2 formed on the digitizer DZ are effectively reduced or prevented (see...). Figure 5 The light is reflected in the display module DM and the upper module UM, and thus reduces or prevents it from being viewed on the first display surface FS of the electronic device EA.

[0103] The second adhesive layer AF2 is disposed between the digitizer DZ and the board PT. Therefore, the digitizer DZ can be bonded to the upper surface of the board PT through the second adhesive layer AF2.

[0104] As an example of the inventive concept, the first adhesive layer AF1 and the second adhesive layer AF2 may each have a thickness of about 0.1 micrometers (μm) to about 25 μm on the third-direction DR3. Furthermore, the first adhesive layer AF1 and the second adhesive layer AF2 may each have a modulus of about 0.01 megapascals (MPa) to about 0.2 MPa at -20 degrees Celsius (°C). However, the thickness and modulus of the first adhesive layer AF1 and the second adhesive layer AF2 according to the present invention are not limited thereto.

[0105] Figure 6A This is an exploded perspective view of an electronic device according to another embodiment of the present invention, and Figure 6B It is along Figure 6A The sectional view shown is taken from line II-II'.

[0106] See Figure 6A and Figure 6B The lower module LM may further include a first adhesive layer AF1 and a second adhesive layer AF2. The first adhesive layer AF1 is disposed above the digitizer DZ, and the second adhesive layer AF2 is disposed below the digitizer DZ. The first adhesive layer AF1 includes a first sub-adhesive layer AF1_1 and a second sub-adhesive layer AF1_2. The first sub-adhesive layer AF1_1 and the second sub-adhesive layer AF1_2 may be configured to be spaced apart from each other relative to the folded region FA2. That is, the first sub-adhesive layer AF1_1 and the second sub-adhesive layer AF1_2 are spaced apart from each other in a first direction DR1 to define a first separation region SA1 between them. The first separation region SA1 (i.e., the empty space) may be configured to correspond to the folded region FA2. The first sub-adhesive layer AF1_1 may be configured to correspond to the first non-folded region NFA3, and the second sub-adhesive layer AF1_2 may be configured to correspond to the second non-folded region NFA4.

[0107] The second adhesive layer AF2 includes a third sub-adhesive layer AF2_1 and a fourth sub-adhesive layer AF2_2. The third sub-adhesive layer AF2_1 and the fourth sub-adhesive layer AF2_2 can be configured to be spaced apart from each other relative to the folded region FA2. That is, the third sub-adhesive layer AF2_1 and the fourth sub-adhesive layer AF2_2 are spaced apart from each other in the first direction DR1 to define a second separation region SA2 between them. The second separation region SA2 (i.e., the empty space) can be configured to correspond to the folded region FA2. The third sub-adhesive layer AF2_1 can be configured to correspond to the first non-folded region NFA3, and the fourth sub-adhesive layer AF2_2 can be configured to correspond to the second non-folded region NFA4.

[0108] The first adhesive layer AF1 and the second adhesive layer AF2 may each comprise an optically transparent adhesive material. As an example of the inventive concept, the first adhesive layer AF1 and the second adhesive layer AF2 may each comprise a pressure-sensitive adhesive (“PSA”), an optically transparent adhesive (“OCA”), or an optically transparent resin (“OCR”).

[0109] The lower module LM also includes a protective layer PL disposed below the display module DM. The protective layer PL can be disposed between the digitizer DZ and the display module DM. As an example of the inventive concept, the protective layer PL is disposed between the first adhesive layer AF1 and the display module DM. That is, the first portion of the protective layer PL disposed in the first non-folded region NFA3 is bonded to the digitizer DZ via the first sub-adhesive layer AF1_1, and the second portion of the protective layer PL disposed in the second non-folded region NFA4 is bonded to the digitizer DZ via the second sub-adhesive layer AF1_2. The first sub-adhesive layer AF1_1 and the second sub-adhesive layer AF1_2 are spaced apart from each other in the folded region FA2, and a first air gap AP1 is disposed between the protective layer PL and the digitizer DZ as a first separation region SA1 between the first sub-adhesive layer AF1_1 and the second sub-adhesive layer AF1_2.

[0110] The second adhesive layer AF2 is disposed between the digitizer DZ and the board PT. The first portion of the board PT disposed in the first non-folded region NFA3 is bonded to the digitizer DZ via the third sub-adhesive layer AF2_1, and the second portion of the board PT disposed in the second non-folded region NFA4 is bonded to the digitizer DZ via the fourth sub-adhesive layer AF2_2. The third sub-adhesive layer AF2_1 and the fourth sub-adhesive layer AF2_2 are spaced apart from each other in the folded region FA2, and a second air gap AP2 is disposed between the board PT and the digitizer DZ as a second separation region SA2 between the third sub-adhesive layer AF2_1 and the fourth sub-adhesive layer AF2_2.

[0111] The digitizer DZ and the protective layer PL can be spaced apart from each other on the third direction DR3 by a first air gap AP1, and the digitizer DZ and the board PT can be spaced apart from each other on the third direction DR3 by a second air gap AP2. Therefore, the surface steps st1 and st2 formed on the digitizer DZ are effectively reduced or prevented (see...). Figure 5 The light is reflected in the display module DM and the upper module UM, and thus reduces or prevents it from being viewed on the first display surface FS of the electronic device EA_1.

[0112] As an example of the inventive concept, the first adhesive layer AF1 and the second adhesive layer AF2 may each have a thickness of about 0.1 μm to about 25 μm on the third-direction DR3. Furthermore, the first adhesive layer AF1 and the second adhesive layer AF2 may each have a modulus of about 0.01 MPa to about 0.2 MPa at -20°C. However, the thickness and modulus of the first adhesive layer AF1 and the second adhesive layer AF2 according to the present invention are not limited thereto.

[0113] Figures 7A to 7C This is an enlarged cross-sectional view of a digitizer according to another embodiment of the present invention.

[0114] refer to Figure 4 and Figure 7A The first sensing lines CF1-1 to CF3-3 are disposed on the second surface of the substrate layer BL. The second surface of the substrate layer BL can be defined as the lower surface of the substrate layer BL. The digitizer DZ_1 also includes a first cover layer CVL1 covering the first sensing lines CF1-1 to CF3-3. The second sensing lines RF1-1 to RF2-3 are disposed on the first cover layer CVL1. The digitizer DZ_1 may also include a second cover layer CVL2 covering the second sensing lines RF1-1 to RF2-3. The first cover layer CVL1 and the second cover layer CVL2 may each comprise the same material as the substrate layer BL. That is, the first cover layer CVL1 and the second cover layer CVL2 may each comprise polyimide (PI).

[0115] The digitizer DZ_1 also includes a first inner adhesive layer IAF1 and a second inner adhesive layer IAF2. The first inner adhesive layer IAF1 is disposed between the substrate layer BL and the first cover layer CVL1, and the second inner adhesive layer IAF2 is disposed between the first cover layer CVL1 and the second cover layer CVL2. Therefore, the first cover layer CVL1 is bonded to the second surface of the substrate layer BL through the first inner adhesive layer IAF1, and the second cover layer CVL2 is bonded to the first cover layer CVL1 through the second inner adhesive layer IAF2.

[0116] like Figure 7A As shown, when the first sensing lines CF1-1 to CF3-3 and the second sensing lines RF1-1 to RF2-3 are disposed on the second surface of the substrate layer BL and not on the first surface of the substrate layer BL, a surface step may not be formed on the upper surface (i.e., the first surface) of the digitizer DZ_1. That is, with the first sensing lines CF1-1 to CF3-3 and the second sensing lines RF1-1 to RF2-3 as shown... Figure 5 Compared to the structures shown, which are disposed on the two surfaces of the substrate layer BL, the first sensing lines CF1-1 to CF3-3 and the second sensing lines RF1-1 to RF2-3 are as follows: Figure 7A The structure shown, disposed on one surface of the substrate layer BL, can have surface steps formed only on one surface of the digitizer DZ_1. That is, the surface roughness of the upper surface of the digitizer DZ_1 can be less than the surface roughness of the lower surface of the digitizer DZ_1.

[0117] In the first non-folded region NFA3 and the second non-folded region NFA4, a first dummy line DML1 is disposed between the first sensing lines CF1-1 to CF1-3 and between the first sensing lines CF3-1 to CF3-3. In the first non-folded region NFA3 and the second non-folded region NFA4, a second dummy line DML2 is disposed between the second sensing lines RF1-1 to RF1-3 and between the second sensing lines RF2-1 to RF2-3. The first dummy line DML1 is disposed in the separation region between the first sensing lines CF1-1 to CF1-3 and between the first sensing lines CF3-1 to CF3-3. The first dummy line DML1 is disposed on the second surface of the substrate layer BL using the same manufacturing process as the first sensing lines CF1-1 to CF3-3. The first dummy line DML1 and the first sensing lines CF1-1 to CF3-3 are disposed on the same layer.

[0118] The second dummy line DML2 is disposed in the separation region between the second sensing lines RF1-1 to RF1-3 and between the second sensing lines RF2-1 to RF2-3. The second dummy line DML2 is formed on the first cover layer CVL1 using the same manufacturing process as the second sensing lines RF1-1 to RF2-3. The second dummy line DML2 and the second sensing lines RF1-1 to RF2-3 are disposed on the same layer. Due to the first sensing lines CF1-1 to CF3-3 and the second sensing lines RF1-1 to RF2-3 in the first non-folded region NFA3 and the second non-folded region NFA4, the arrangement of the first dummy line DML1 and the second dummy line DML2 can reduce or eliminate the surface steps on the lower surface of the digitizer DZ_1.

[0119] The first dummy line DML1 and the second dummy line DML2 are not provided in the folded region FA2. When the first dummy line DML1 and the second dummy line DML2 are provided in the folded region FA2, the flexibility of the folded region FA2 may be degraded due to the first dummy line DML1 and the second dummy line DML2. That is, the first dummy line DML1 and the second dummy line DML2 do not overlap with the folded region FA2 in the plan view to prevent the electronic device EA (see...) from being compromised. Figure 1A The deterioration of the folding properties of ).

[0120] The first dummy line DML1 and the second dummy line DML2 are not provided in the folded region FA2, and the surface step st3 on the third direction DR3 caused by the first sensing lines CF1-1 to CF3-3 and the second sensing lines RF1-1 to RF2-3 can therefore be formed on the lower surface of the digitizer DZ_1 in the folded region FA2. That is, due to the surface step st3, the surface roughness of the lower surface of the digitizer DZ_1 in the folded region FA2 can be greater than the surface roughness of the lower surface of the digitizer DZ_1 in the non-folded regions NFA3 and NFA4.

[0121] refer to Figure 7B The digitizer DZ_2 may not include Figure 7A The second inner adhesive layer IAF2 is shown. In this case, the second cover layer CVL2 can be disposed on the first cover layer CVL1 to directly cover the second sensing lines RF1-1 to RF2-3. The first cover layer CVL1 and the second cover layer CVL2 can comprise the same material or be formed of the same material. As an example of the inventive concept, the first cover layer CVL1 and the second cover layer CVL2 can each comprise a photocurable polyimide. The first cover layer CVL1 and the second cover layer CVL2 can be cured together, and in this case, after the digitizer DZ_2 is fully manufactured, it is difficult to observe the boundary between the first cover layer CVL1 and the second cover layer CVL2 with the naked eye.

[0122] refer to Figure 7C The digitizer DZ_3 may not include Figure 7A The diagram shows a first inner adhesive layer IAF1 and a second inner adhesive layer IAF2. In this case, a first cover layer CVL1 can be disposed on the base layer BL to directly cover the first sensing lines CF1-1 to CF3-3, and a second cover layer CVL2 can be disposed on the first cover layer CVL1 to directly cover the second sensing lines RF1-1 to RF2-3. The base layer BL, the first cover layer CVL1, and the second cover layer CVL2 can comprise the same material or be formed from the same material. As an example of the inventive concept, the base layer BL, the first cover layer CVL1, and the second cover layer CVL2 can each comprise a photocurable polyimide. The base layer BL, the first cover layer CVL1, and the second cover layer CVL2 can be cured together, and in this case, after the digitizer DZ_3 is fully manufactured, it is difficult to observe the boundary between the base layer BL, the first cover layer CVL1, and the second cover layer CVL2 with the naked eye.

[0123] In having Figures 7A to 7C In the digitizer with the structure, the first dummy line DML1 and the second dummy line DML2 are not provided in the folded region FA2, and the surface step st3 caused by the first sensing lines CF1-1 to CF3-3 and the second sensing lines RF1-1 to RF2-3 can therefore be formed on the lower surface of the digitizer corresponding to the folded region FA2.

[0124] exist Figures 7A to 7C The digitizer shown in the diagram produces almost no surface steps on its upper surface. In this case, the surface steps on the upper surface of the digitizer can be about 2 μm or less.

[0125] Figure 8AThis is an exploded perspective view of an electronic device according to an embodiment of the present invention, and 8B is along... Figure 8A The sectional view shown is taken from line Ⅲ-Ⅲ'.

[0126] See Figure 8A and Figure 8B The lower module LM may further include a first adhesive layer AF1 and a second adhesive layer AF2. The first adhesive layer AF1 is disposed above the digitizer DZ2, and the second adhesive layer AF2 is disposed below the digitizer DZ2. In this case, the digitizer DZ2 may have Figures 7A to 7C The structure shown.

[0127] The first adhesive layer AF1 has dimensions corresponding to the digitizer DZ2 and can be configured to overlap with the folded region FA2 and the first non-folded region NFA3 and the second non-folded region NFA4 in a plan view. The second adhesive layer AF2 includes a third sub-adhesive layer AF2_1 and a fourth sub-adhesive layer AF2_2. The third sub-adhesive layer AF2_1 and the fourth sub-adhesive layer AF2_2 can be configured to be spaced apart from each other relative to the folded region FA2. That is, the third sub-adhesive layer AF2_1 and the fourth sub-adhesive layer AF2_2 are spaced apart from each other in a first direction DR1 to provide a third separation region SA3 (i.e., empty space) between them. The third sub-adhesive layer AF2_1 can be configured to correspond to the first non-folded region NFA3, and the fourth sub-adhesive layer AF2_2 can be configured to correspond to the second non-folded region NFA4.

[0128] The first adhesive layer AF1 and the second adhesive layer AF2 may each comprise an optically transparent adhesive material. As an example of the inventive concept, the first adhesive layer AF1 and the second adhesive layer AF2 may each comprise a pressure-sensitive adhesive (“PSA”), an optically transparent adhesive (“OCA”), or an optically transparent resin (“OCR”).

[0129] The lower module LM also includes a protective layer PL disposed below the display module DM. The protective layer PL can be disposed between the digitizer DZ2 and the display module DM. As an example of the inventive concept, the protective layer PL is disposed between the first adhesive layer AF1 and the display module DM. The protective layer PL is bonded to the upper surface of the digitizer DZ2 via the first adhesive layer AF1. Figures 7A to 7C The digitizer DZ2 in the structure shown has almost no surface steps on its upper surface, and therefore the first adhesive layer AF1 can not be separated into two sub-adhesive layers.

[0130] The second adhesive layer AF2 is disposed between the digitizer DZ2 and the board PT. The first portion of the board PT, located in the first non-folded region NFA3, is bonded to the digitizer DZ2 via the third sub-adhesive layer AF2_1, and the second portion of the board PT, located in the second non-folded region NFA4, is bonded to the digitizer DZ2 via the fourth sub-adhesive layer AF2_2. The third sub-adhesive layer AF2_1 and the fourth sub-adhesive layer AF2_2 are spaced apart from each other in the folded region FA2, and a third air gap AP3 is disposed between the board PT and the digitizer DZ2 as a third separation region SA3 between the third sub-adhesive layer AF2_1 and the fourth sub-adhesive layer AF2_2.

[0131] The digitizer DZ2 and board PT can be spaced apart from each other on the third-direction DR3 via a third air gap AP3. This effectively reduces or prevents the formation of surface steps st3 on the lower surface of the digitizer DZ2 (see...). Figures 7A to 7C The light is reflected in the display module DM and the upper module UM, and thus reduces or prevents it from being viewed on the first display surface FS of the electronic device EA_2.

[0132] Figure 9A and Figure 9B This is a cross-sectional view of the display module and the lower module according to an embodiment of the present invention.

[0133] refer to Figure 9A The DZ2 digitizer can have Figures 7A to 7C The structure shown is as follows. The first adhesive layer AF1 includes a first sub-adhesive layer AF1_1 and a second sub-adhesive layer AF1_2. The first sub-adhesive layer AF1_1 and the second sub-adhesive layer AF1_2 can be arranged to be spaced apart from each other relative to the folded region FA2. The second adhesive layer AF2 includes a third sub-adhesive layer AF2_1 and a fourth sub-adhesive layer AF2_2. The third sub-adhesive layer AF2_1 and the fourth sub-adhesive layer AF2_2 can be arranged to be spaced apart from each other relative to the folded region FA2.

[0134] The fourth air gap AP4 is located in the folded area FA2 between the protective layer PL and the digitizer DZ2, and the third air gap AP3 is located in the folded area FA2 between the board PT and the digitizer DZ2.

[0135] The digitizer DZ2 and the protective layer PL can be spaced apart from each other on the third direction DR3 via a fourth air gap AP4, and the digitizer DZ2 and the board PT can be spaced apart from each other on the third direction DR3 via a third air gap AP3. Therefore, the surface steps st3 formed on the lower surface of the digitizer DZ2 are effectively reduced or prevented (see...). Figures 7A to 7C In the display module DM and the upper module UM (see...) Figure 3AIt is reflected in the electronic device EA (see Figure 1A The first display surface FS is viewed.

[0136] refer to Figure 9B The DZ2 digitizer can have Figures 7A to 7C The structure shown is as follows. The first adhesive layer AF1 includes a first sub-adhesive layer AF1_1 and a second sub-adhesive layer AF1_2. The first sub-adhesive layer AF1_1 and the second sub-adhesive layer AF1_2 can be arranged to be spaced apart from each other relative to the folded region FA2. The second adhesive layer AF2 may not be separated into two sub-adhesive layers.

[0137] A fourth air gap AP4 is provided between the protective layer PL and the digitizer DZ2, defined by a first sub-adhesive layer AF1_1 and a second sub-adhesive layer AF1_2 spaced apart from each other in the folded region FA2. The digitizer DZ2 and the protective layer PL can be spaced apart from each other on the third-direction DR3 via the fourth air gap AP4. Therefore, the formation of surface steps st3 on the lower surface of the digitizer DZ2 is effectively reduced or prevented (see...). Figures 7A to 7C In the display module DM and the upper module UM (see...) Figure 3A It is reflected in the electronic device EA (see Figure 1A The first display surface FS is viewed.

[0138] Figure 10A and Figure 10B This is a cross-sectional view of an electronic device according to an embodiment of the present invention.

[0139] refer to Figure 10A In the electronic device EA according to an embodiment of the present invention, the upper module UM may include a window WM. The window WM is disposed on the display module DM.

[0140] The window WM can comprise an optically transparent insulating material. Therefore, the image generated in the display module DM can be easily recognized by the user through the window WM. For example, the window WM can comprise a glass substrate or a synthetic resin film. When the window WM is a thin-film glass, its thickness can be from about 0.1 μm to about 80 μm, and for example, about 30 μm, but the invention is not limited thereto. When the window WM is a synthetic resin film, it can comprise a polyimide (PI) film or a polyethylene terephthalate (PET) film.

[0141] The window WM can have a multi-layered or single-layered structure. For example, the window WM may include multiple synthetic resin films bonded by an adhesive, or it may include a glass substrate and a synthetic resin film bonded by an adhesive. The window WM may include or be formed of a soft material. Therefore, the window WM can be relative to the folding axis AX2 ( Figure 2A (As shown in the diagram) Fold or unfold. That is, when the shape of the display module DM is modified, the shape of the window WM can be modified together.

[0142] The window WM transmits the image from the display module DM while reducing external impacts to prevent damage or malfunction of the display module DM due to external shocks. External impacts refer to forces, such as pressure or stress, that cause defects in the display module DM as external forces.

[0143] An upper protective layer (UPL) is applied to the window membrane (WM). The UPL can be a layer used to improve the impact resistance of the window membrane and prevent dispersion upon damage. The UPL can include at least one selected from urethane-based resins, epoxy-based resins, polyester-based resins, polyether-based resins, acrylate-based resins, acrylonitrile-butadiene-styrene (ABS) resins, and rubber. As an example of the inventive concept, the UPL can include at least one selected from phenylene, polyethylene terephthalate (PET), polyimide (PI), polyamide (PAI), polyethylene naphthalate (PEN), and polycarbonate (PC). The UPL can also include a hard coating material and an anti-fingerprint material.

[0144] At least one functional layer may be disposed between the display module DM and the window WM. As an example of the inventive concept, the functional layer may be an anti-reflective layer RPP capable of reducing the reflectivity of external light incident from the outside. The anti-reflective layer RPP can prevent the components forming the display module DM from being visible from the outside due to external light incident through the front surface of the electronic device EA. The anti-reflective layer RPP may include a retarder and a polarizer. The retarder may be a film type or a liquid crystal coating type, and may include a λ / 2 retarder and / or a λ / 4 retarder. The polarizer may also be a film type or a liquid crystal coating type. The film type may include a stretchable synthetic resin film, and the liquid crystal coating type may include liquid crystals arranged in a predetermined pattern. The stretchable synthetic resin film can be provided by dyeing a polyvinyl alcohol film (“PVA” film) with an iodine compound. The retarder and polarizer can be implemented as a single polarizing film. The functional layer may also include a protective film disposed above or below the anti-reflective layer RPP.

[0145] The upper module UM may also include a third adhesive layer AF3 and a fourth adhesive layer AF4. The third adhesive layer AF3 is disposed between the anti-reflective layer RPP and the display module DM, and the fourth adhesive layer AF4 is disposed between the window WM and the anti-reflective layer RPP. The third adhesive layer AF3 and the fourth adhesive layer AF4 can be transparent adhesive layers such as pressure-sensitive adhesive films, optically transparent adhesive films, or optically transparent adhesive resins. The third adhesive layer AF3 can be omitted, and in this case, the anti-reflective layer RPP can be directly disposed on the display module DM.

[0146] refer to Figure 10B In an embodiment of the present invention, the lower module LM may further include a support plate SP and a stepped compensation film SCL. The support plate SP may be disposed below the plate PT to support the display module DM. The support plate SP may be a metal plate. The support plate SP may be a stainless steel plate. The support plate SP may comprise a material having an elastic modulus of approximately 60 gigapascals (GPa) at room temperature. For example, the support plate SP may be SUS304, but the present invention is not limited thereto. The support plate SP can improve the heat dissipation performance of the electronic device EA_3.

[0147] The support plate SP may include multiple support plates SP1 and SP2 corresponding to the non-folding regions NFA3 and NFA4. As an example of the inventive concept, the support plate SP may include a first support plate SP1 and a second support plate SP2 spaced apart from the first support plate SP1. The first support plate SP1 and the second support plate SP2 may be configured to correspond to the non-folding regions NFA3 and NFA4, respectively. That is, the first support plate SP1 is configured to correspond to the first non-folding region NFA3 of the display module DM, and the second support plate SP2 is configured to correspond to the second non-folding region NFA4 of the display module DM. When the display module DM is relative to the folding axis AX2 ( Figure 2A When folded (as shown in the diagram), the first support plate SP1 and the second support plate SP2 can be spaced apart from each other on the third direction DR3.

[0148] The first support plate SP1 and the second support plate SP2 may be spaced apart in the folded region FA2. The first support plate SP1 and the second support plate SP2 may partially overlap with the folded region FA2 in a plan view. That is, the separation distance between the first support plate SP1 and the second support plate SP2 in the first direction DR1 may be less than the width of the folded region FA2 in the first direction DR1.

[0149] The support plate SP may also include a connecting module for connecting the first support plate SP1 and the second support plate SP2. The connecting module may include a hinge module or a multi-joint module.

[0150] The present invention presents a case where the support plate SP is provided with two support plates SP1 and SP2, but the embodiments of the present invention are not limited to this. That is, when the number of folding shafts AX2 increases, the support plate SP may include multiple support plates that are separate from the folding shafts AX2.

[0151] The support plate SP can be bonded to the plate PT via the fifth adhesive layer AF5. Figure 10BIn this embodiment, the fifth adhesive layer AF5 is configured to overlap with the folded region FA2 and the non-folded regions NFA3 and NFA4 in a planar view. However, the embodiments of the present invention are not limited thereto. That is, in another embodiment, the fifth adhesive layer AF5 may be configured to overlap with the non-folded regions NFA3 and NFA4 in a planar view, but not with the folded region FA2. Additionally, as another example, the fifth adhesive layer AF5 may include a non-adhesive portion formed due to the loss of adhesive force in the folded region FA2.

[0152] The stepped compensation membrane SCL can be disposed below the plate PT. The stepped compensation membrane SCL can be disposed in an area that does not overlap with the support plate SP in the plan view. Therefore, the stepped compensation membrane SCL can compensate for the steps between the area where the support plate SP is disposed and the area where the support plate SP is not disposed from the plate PT.

[0153] The stepped compensation membrane SCL may include at least one adhesive layer. The stepped compensation membrane SCL can be fixed to the rear surface of the plate PT through the adhesive layer.

[0154] The stepped compensation membrane SCL may include a first stepped compensation membrane SCL1 disposed adjacent to the first support plate SP1 and a second stepped compensation membrane SCL2 disposed adjacent to the second support plate SP2. The first stepped compensation membrane SCL1 and the second stepped compensation membrane SCL2 may be spaced apart from the folded area FA2 and the support plates SP1 and SP2.

[0155] According to an embodiment of the present invention, in an electronic device including a digitizer, in order to prevent surface steps formed on the digitizer from being reflected in the upper module, an adhesive layer disposed adjacent to the digitizer and corresponding to the folded area is removed, thereby providing an air gap.

[0156] Therefore, even when surface steps are formed due to the sensing lines of the digitizer in the folded area, these surface steps will not be transmitted to the upper module, thus preventing the problem of the digitizer's surface steps being visible. Therefore, the present invention can provide an electronic device with improved product reliability.

[0157] As described above, embodiments of the inventive concept have been disclosed in the accompanying drawings and specification. Although specific terminology has been used in this specification, these terms are intended merely to describe the inventive concept and not to limit its meaning or the scope of the inventive concept as set forth in the appended claims. Therefore, those skilled in the art will recognize that various modifications and other equivalent embodiments are possible. Consequently, the technical scope of the inventive concept should be defined by the technical spirit of the claims.

Claims

1. An electronic device comprising: The display module has a defined folding area; A plate is disposed below the display module to support the display module; A digitizer is disposed between the board and the display module; A first adhesive layer is disposed between the display module and the digitizer; and A second adhesive layer is disposed between the digitizer and the board. Wherein, at least one of the first adhesive layer and the second adhesive layer includes a first sub-adhesive layer and a second sub-adhesive layer spaced apart relative to the folded region. Wherein, at least one of the upper and lower surfaces of the digitizer includes a surface step that overlaps with the folded region, and The separation region between the first sub-adhesive layer and the second sub-adhesive layer provides an air gap that overlaps with the folded region in a plan view.

2. The electronic device according to claim 1, wherein, The digitizer includes: basal layer; Multiple first sensing lines are disposed on the first surface of the substrate layer; and Multiple second sensing lines are disposed on the second surface of the substrate layer. The second surface is opposite to the first surface.

3. The electronic device according to claim 2, wherein, The digitizer also includes: A first dummy line is disposed between the plurality of first sensing lines; and The second dummy line is disposed between the plurality of second sensing lines. The first and second dummy lines do not overlap with the folded area in the plan view.

4. The electronic device according to claim 3, wherein: The first adhesive layer includes a first sub-adhesive layer and a second sub-adhesive layer; The separation region includes a first separation region between the first sub-adhesive layer and the second sub-adhesive layer; and The air gap includes a first air gap disposed between the display module and the digitizer through the first separation region.

5. The electronic device according to claim 4, wherein: The second adhesive layer includes a third sub-adhesive layer and a fourth sub-adhesive layer spaced apart from each other; The second separation region between the third sub-adhesive layer and the fourth sub-adhesive layer overlaps with the folded region in the plan view; as well as A second air gap is provided between the digitizer and the board through the second separation region between the third sub-adhesive layer and the fourth sub-adhesive layer.

6. The electronic device according to claim 1, wherein, The digitizer includes: basal layer; Multiple first sensing lines are disposed on the substrate layer; A first covering layer covers the plurality of first sensing lines; Multiple second sensing lines are disposed on the first cover layer; and The second overlay layer covers the plurality of second sensing lines.

7. The electronic device according to claim 6, wherein, The digitizer also includes a first inner adhesive layer disposed between the first cover layer and the base layer.

8. The electronic device according to claim 7, wherein, The digitizer also includes a second inner adhesive layer disposed between the second cover layer and the first cover layer.

9. The electronic device according to claim 6, wherein, The first and second cover layers comprise photocurable polyimide.

10. The electronic device according to claim 6, wherein, The base layer, the first cover layer, and the second cover layer each comprise a photocurable polyimide.

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