Electronic component and board having the same

Abstract

The present disclosure provides an electronic component and a board having the electronic component. The electronic component includes: a capacitor body; a pair of external electrodes, respectively disposed on opposite end surfaces of the capacitor body; and a pair of metal frames, including a pair of connecting parts and a pair of mounting parts, the pair of connecting parts are respectively connected to the pair of external electrodes, the pair of mounting parts are respectively bent at one end of the pair of connecting parts and extend from the one end of the pair of connecting parts, wherein the corners of the ends of the pair of mounting parts facing each other have a curvature.

Description

[0001] This application claims the benefit of priority from Korean Patent Application No. 10-2020-0121563 filed on September 21, 2020, in the Korean Intellectual Property Office, the disclosure of which is incorporated herein in its entirety by reference. Technical Field

[0002] The present disclosure relates to an electronic component and a board having the electronic component. Background Art

[0003] Since multilayer capacitors have a small size and can achieve high capacitance, they have been used in various types of electronic devices.

[0004] Recently, demands for electronic components manufactured by connecting external electrodes of a multilayer capacitor to a circuit board using a metal frame to achieve a high voltage and increase capacitance have increased.

[0005] High voltage electronic components require excellent performance at high frequencies as well as high levels of thermal and electrical reliability, and in particular require a high level of durability against high voltages in a limited space.

[0006] In such an electronic component using a metal frame, it is important to ensure the distance between two metal frames mounted on a circuit board to suppress sparks and short circuits caused by high voltage. Therefore, the length of the mounting portion of the metal frame combined with the electrode pad of the circuit board is reduced.

[0007] However, when the length of the mounting portion is reduced as described above, the fixing strength of the metal frame to the circuit board is reduced. Therefore, the risk that the electronic component will fall over when being mounted on the circuit board increases. Summary of the invention

[0008] One aspect of the present disclosure may provide an electronic component and a board having the electronic component, in which when a multilayer capacitor having a metal frame is mounted on a circuit board, the fixing strength of the metal frame can be maintained at a predetermined level or higher, and the occurrence of sparks and short circuits can be reduced.

[0009] According to one aspect of the present disclosure, an electronic component may include: a capacitor body; a pair of external electrodes, respectively disposed on opposite end surfaces of the capacitor body; and a pair of metal frames, including a pair of connecting parts and a pair of mounting parts, the pair of connecting parts are respectively connected to the pair of external electrodes, the pair of mounting parts are respectively bent at one end of the pair of connecting parts and extend from the one end of the pair of connecting parts. The corners of the ends of the pair of mounting parts facing each other have a curvature.

[0010] According to another aspect of the present disclosure, a board having an electronic component may include: a circuit board having a plurality of electrode pads disposed on an upper surface of the circuit board; and an electronic component mounted on the circuit board. The electronic component includes: a capacitor body; a pair of external electrodes, respectively disposed on opposite end surfaces of the capacitor body; and a pair of metal frames, including a pair of connecting portions and a pair of mounting portions, the pair of connecting portions being respectively connected to the pair of external electrodes, the pair of mounting portions being respectively bent at one end below the pair of connecting portions and extending from one end below the pair of connecting portions, the pair of mounting portions being respectively connected to the plurality of electrode pads. The corners of the ends of the pair of mounting portions facing each other have a curvature.

[0011] The curvature of the corner of the end of the mounting portion may be less than or equal to 15 mm. -1 .

[0012] The electronic component may further include a conductive bonding layer disposed between the external electrode and the connection part.

[0013] The capacitor body may include a dielectric layer and a plurality of inner electrodes that are alternately disposed, and each of the dielectric layers is interposed between the plurality of inner electrodes.

[0014] The external electrode may include a head portion disposed on one surface of the capacitor body, and a band portion extending from the head portion to a portion of each of upper and lower surfaces and opposite side surfaces of the capacitor body.

[0015] According to another aspect of the present disclosure, an electronic component may include: a capacitor body; a pair of external electrodes, respectively disposed on opposite end surfaces of the capacitor body; and a pair of metal frames, respectively connected to the pair of external electrodes, each metal frame having an L shape. Ends of the pair of metal frames facing each other each have a corner, and the curvature of the corner is greater than zero.

[0016] A shortest distance between the pair of mounting portions may be less than or equal to 1.6 mm. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The above and other aspects, features and advantages of the present disclosure will be more clearly understood through the following detailed description in conjunction with the accompanying drawings, in which:

[0018] Figure 1 is a schematic perspective view showing a multilayer capacitor according to an exemplary embodiment of the present disclosure;

[0019] Figure 2A and Figure 2B It is shown separately Figure 1A plan view of a first inner electrode and a second inner electrode of a multilayer capacitor in FIG.

[0020] Figure 3 It is along Figure 1 A cross-sectional view taken along line II';

[0021] Figure 4 is a schematic perspective view showing an electronic component according to an exemplary embodiment of the present disclosure;

[0022] Figure 5 is shown in the separation Figure 4 A top view of the first metal frame and the second metal frame in a state of the multilayer capacitor;

[0023] Figure 6 It shows that the installation Figure 4 A cross-sectional view of a board of an electronic component taken along an XZ plane; and

[0024] Figure 7 is a diagram showing a spherometer and the principle of the spherometer. DETAILED DESCRIPTION

[0025] Hereinafter, exemplary embodiments of the present disclosure will be described in detail with reference to the accompanying drawings.

[0026] Directions will be defined to clearly describe exemplary embodiments in the present disclosure. X, Y, and Z in the drawings refer to the length direction, width direction, and thickness direction of the multilayer capacitor and the electronic component, respectively.

[0027] Here, the Z direction may be used as the same concept as a stacking direction in which dielectric layers are stacked in the present exemplary embodiment.

[0028] Figure 1 is a schematic perspective view showing a multilayer capacitor according to an exemplary embodiment of the present disclosure, Figure 2A and Figure 2B It is shown separately Figure 1 A plan view of a first inner electrode and a second inner electrode of a multilayer capacitor in FIG. Figure 3 It is along Figure 1 A cross-sectional view taken along line II'.

[0029] Will refer to Figures 1 to 3 The structure of the multilayer capacitor 100 used in the electronic component according to the present exemplary embodiment is described.

[0030] The multilayer capacitor 100 according to the present exemplary embodiment may include: a capacitor body 110 ; and first and second external electrodes 131 and 132 respectively located on opposite end surfaces of the capacitor body 110 in the X direction.

[0031] The capacitor body 110 may be formed by stacking a plurality of dielectric layers 111 in the Z direction and then sintering the plurality of dielectric layers 111 .

[0032] Adjacent dielectric layers 111 of the capacitor body 110 may be integrated with each other so that a boundary therebetween is not easily distinguishable without using a scanning electron microscope (SEM).

[0033] In addition, the capacitor body 110 may include a plurality of dielectric layers 111 and first and second internal electrodes 121 and 122 alternately disposed in the Z direction, and each of the dielectric layers 111 is interposed between the first and second internal electrodes 121 and 122. In this case, the first and second internal electrodes 121 and 122 may have different polarities.

[0034] Additionally, the capacitor body 110 may include an active area and cover areas 112 and 113 .

[0035] The active area may contribute to the capacitance of the multilayer capacitor.

[0036] In addition, the cover regions 112 and 113 may be provided as edge portions located on the upper and lower surfaces of the effective region in the Z direction, respectively.

[0037] The cover regions 112 and 113 may be formed by stacking a single dielectric layer or two or more dielectric layers on the upper and lower surfaces of the active region, respectively.

[0038] In addition, the cover regions 112 and 113 may substantially serve to prevent the first and second internal electrodes 121 and 122 from being damaged due to physical stress or chemical stress.

[0039] The shape of the capacitor body 110 is not particularly limited, but may be substantially a hexahedral shape.

[0040] In the present exemplary embodiment, the capacitor body 110 may include a first surface 1 and a second surface 2 opposite to each other in the Z direction, a third surface 3 and a fourth surface 4 connected to the first surface 1 and the second surface 2 and opposite to each other in the X direction, and a fifth surface 5 and a sixth surface 6 connected to the first surface 1 and the second surface 2, connected to the third surface 3 and the fourth surface 4 and opposite to each other in the Y direction. Here, the first surface 1 may be a mounting surface.

[0041] In addition, the shape and size of the capacitor body 110 and the number of stacked dielectric layers 111 are not limited to those shown in the drawings of the present exemplary embodiment.

[0042] The dielectric layer 111 may include ceramic powder, such as BaTiO 3 -based ceramic powder, or the like.

[0043] Examples of BaTiO3-based ceramic powders may include Ca, Zr, etc. partially dissolved in BaTiO3 (Ba 1-x Ca x )TiO3、Ba(Ti 1-y Ca y )O3、(Ba 1-x Ca x )(Ti 1-y Zr y )O3、Ba(Ti 1-y Zr y )O3, etc. However, the BaTiO3-based ceramic powder according to the present disclosure is not limited thereto.

[0044] In addition, the dielectric layer 111 may further include ceramic additives, organic solvents, plasticizers, adhesives, dispersants, and the like.

[0045] The ceramic additive may include transition metal oxides or transition metal carbides, rare earth elements, magnesium (Mg), aluminum (Al), and the like.

[0046] The first and second internal electrodes 121 and 122 may be electrodes to which different polarities are applied.

[0047] The first and second internal electrodes 121 and 122 may be respectively formed on the dielectric layer 111 and stacked in the Z direction.

[0048] In addition, the first and second internal electrodes 121 and 122 may be alternately disposed in the capacitor body 110 along the Z direction and face each other with each of the dielectric layers 111 interposed therebetween.

[0049] In this case, the first and second internal electrodes 121 and 122 may be electrically insulated from each other by each of the dielectric layers 111 disposed between the first and second internal electrodes 121 and 122 .

[0050] Furthermore, in the present exemplary embodiment, a structure in which a plurality of internal electrodes are stacked in the Z direction has been shown and described. However, the present disclosure is not limited thereto, and a structure in which internal electrodes are stacked in the Y direction may also be applied if necessary.

[0051] One end portion of the first internal electrode 121 may be exposed through the third surface 3 of the capacitor body 110 .

[0052] One end portion of the first internal electrode 121 exposed through the third surface 3 of the capacitor body 110 as described above may be electrically connected to the first external electrode 131 disposed on one end surface of the capacitor body 110 in the X direction.

[0053] One end portion of the second internal electrode 122 may be exposed through the fourth surface 4 of the capacitor body 110 .

[0054] One end portion of the second internal electrode 122 exposed through the fourth surface 4 of the capacitor body 110 as described above may be electrically connected to the second external electrode 132 disposed on the other end surface of the capacitor body 110 in the X direction.

[0055] According to the configuration as described above, when a predetermined voltage is applied to the first and second external electrodes 131 and 132 , charges may be accumulated between the first and second internal electrodes 121 and 122 .

[0056] In this case, the capacitance of the multilayer capacitor 100 may be proportional to an area in which the first and second internal electrodes 121 and 122 overlap each other in the Z direction in an active region.

[0057] In addition, the material of each of the first and second internal electrodes 121 and 122 is not particularly limited.

[0058] In addition, the first and second internal electrodes 121 and 122 may be formed using a conductive paste formed using one or more of a noble metal material, nickel (Ni), and copper (Cu).

[0059] The noble metal material may be platinum (Pt), palladium (Pd), palladium-silver (Pd-Ag) alloy, or the like.

[0060] In addition, the method of printing the conductive paste may be a screen printing method, a gravure printing method, etc., but is not limited thereto.

[0061] Voltages having different polarities may be supplied to the first and second external electrodes 131 and 132, respectively, and the first and second external electrodes 131 and 132 may be respectively disposed on opposite end surfaces of the capacitor body 110 in the X direction and may be respectively electrically connected to exposed ends of the first and second internal electrodes 121 and 122.

[0062] The first external electrode 131 may include a first head portion 131 a and a first band portion 131 b .

[0063] The first head portion 131 a may be disposed on the third surface 3 of the capacitor body 110 .

[0064] The first head portion 131 a may make contact with an end portion of the first internal electrode 121 exposed to the outside through the third surface 3 of the capacitor body 110 for electrically connecting the first internal electrode 121 and the first external electrode 131 to each other.

[0065] The first band portion 131 b may extend from the first head portion 131 a to a portion of the first surface 1 , a portion of the second surface 2 , a portion of the fifth surface 5 , and a portion of the sixth surface 6 of the capacitor body 110 .

[0066] The first band portion 131 b may be used to improve the fixing strength of the first external electrode 131 .

[0067] The second external electrode 132 may include a second head portion 132 a and a second band portion 132 b .

[0068] The second head portion 132 a may be disposed on the fourth surface 4 of the capacitor body 110 .

[0069] The second head portion 132 a may make contact with an end portion of the second internal electrode 122 exposed to the outside through the fourth surface 4 of the capacitor body 110 , for electrically connecting the second internal electrode 122 and the second external electrode 132 to each other.

[0070] The second band portion 132 b may extend from the second head portion 132 a to a portion of the first surface 1 , a portion of the second surface 2 , a portion of the fifth surface 5 , and a portion of the sixth surface 6 of the capacitor body 110 .

[0071] The second band portion 132 b may be used to improve the fixing strength of the second external electrode 132 .

[0072] In addition, the first external electrode 131 and the second external electrode 132 may further include a plating layer.

[0073] The plating layer may include: first and second nickel (Ni) plating layers disposed on the capacitor body 110; and first and second tin (Sn) plating layers covering the first and second nickel plating layers, respectively.

[0074] Figure 4 is a schematic perspective view showing an electronic component according to an exemplary embodiment of the present disclosure, Figure 5 is shown in the separation Figure 4 A top view of the first metal frame and the second metal frame in the state of the multilayer capacitor.

[0075] Reference Figure 4 and Figure 5 According to the present exemplary embodiment, the electronic component 101 may include: a multilayer capacitor 100 including a capacitor body 110, a first external electrode 131 and a second external electrode 132; and a first metal frame 140 and a second metal frame 150 having an L shape and connected to the first external electrode 131 and the second external electrode 132, respectively.

[0076] The first metal frame 140 may include a first connection portion 141 and a first mounting portion 142 .

[0077] The first connection portion 141 may be coupled and physically connected to the first head portion 131 a of the first external electrode 131 , and may be electrically connected to the first head portion 131 a of the first external electrode 131 .

[0078] In this case, the first conductive bonding layer 160 may be disposed between the first head 131 a of the first external electrode 131 and the first connection part 141 .

[0079] The first conductive bonding layer 160 may be formed using high temperature solder, a conductive bonding material, etc., and is not limited thereto.

[0080] The first mounting portion 142 may be bent at a lower end of the first connection portion 141 and extend inwardly from the lower end of the first connection portion 141 along the X direction, and be formed horizontally with the mounting surface.

[0081] The first mounting portion 142 can be used to mount the electronic component 100 on the circuit board 210 (eg, Figure 6 ) as a connection terminal.

[0082] In this case, the first mounting portion 142 may be disposed to be spaced apart from the lower end of the multilayer capacitor 100 .

[0083] The second metal frame 150 may include a second connection portion 151 and a second mounting portion 152 .

[0084] The second connection part 151 may be physically connected to the second head part 132 a of the second external electrode 132 , and may be electrically connected to the second head part 132 a of the second external electrode 132 .

[0085] In this case, the second conductive bonding layer 170 may be disposed between the second head 132 a of the second external electrode 132 and the second connection part 151 .

[0086] The second conductive bonding layer 170 may be formed using high temperature solder, a conductive bonding material, etc., and is not limited thereto.

[0087] The second mounting portion 152 may be bent at a lower end of the second connection portion 151 and extend inwardly from the lower end of the second connection portion 151 along the X direction, and be formed horizontally with the mounting surface.

[0088] The second mounting portion 152 may be used as a connection terminal when the electronic component 101 is mounted on the circuit board 210 .

[0089] In this case, the second mounting portion 152 may be disposed to be spaced apart from the lower end of the multilayer capacitor 100 .

[0090] In addition, both corners of an end portion of the first mounting portion 142 (facing the second mounting portion 152 in the X direction) may be formed in a circular arc shape to have a curvature greater than zero.

[0091] In addition, both corners of an end portion of the second mounting portion 152 (facing the first mounting portion 142 in the X direction) may be formed in an arc shape to have a curvature greater than zero.

[0092] In this case, the curvature of two opposite corners of the first mounting portion 142 in the Y direction may be less than or equal to 15 mm. -1 The curvature of the two opposite corners of the second mounting portion 152 in the Y direction may be less than or equal to 15 mm. -1 In addition, the shortest distance between the first mounting portion 142 and the second mounting portion 152 may be less than or equal to 1.6 mm.

[0093] Table 1 shows the evaluation results of the breakdown voltage according to the curvature of the corner portion of the mounting portion of the metal frame.

[0094] The curvature of the corner of the mounting portion of the metal frame may be measured by a method to be described later.

[0095] Reference Figure 7 , first place the mounting part of the metal frame whose curvature is to be measured on the spherometer, rotate N, and obtain the vertical distance h between plane ABC and the threaded end D of the rotating shaft by reading the scale line L and the scale of the dial M at the moment when the threaded end of the rotating shaft contacts the spherical surface.

[0096] Then, by measuring Figure 7 The curvature radius R is obtained by using the dimensions α and h in . Since the curvature κ (kappa) is the inverse of the curvature radius (1 / R), when R is obtained, the curvature κ of the corner can also be obtained.

[0097] Here, the length of the multilayer capacitor in the X direction and the width of the multilayer capacitor in the Y direction may be 3.2 mm and 2.5 mm respectively, the distance from the mounting portion of the metal frame to the band portion of the outer electrode along the Z direction may be 0.9 mm, and the width of the mounting portion of the metal frame in the Y direction may be 2.5 mm.

[0098] For each of the shortest distances between two mounting portions facing each other, a discharge test was performed while changing the magnitude of the curvature of the corner portion of the mounting portion, and the discharge test results are shown in Tables 1 and 2, respectively.

[0099] Table 1 shows that the length of the two mounting parts in the X direction is 0.8 mm and the shortest distance between the two mounting parts is 1.6 mm, and Table 2 shows that the length of the two mounting parts in the X direction is 1.0 mm and the shortest distance between the two mounting parts is 1.2 mm. OK means good, and NG means bad.

[0100] The comparative example is a case where the corner of the mounting portion is bent 90° and has no curvature.

[0101] [Table 1]

[0102]

[0103]

[0104] [Table 2]

[0105]

[0106] Referring to Table 1, when the shortest distance between the two mounting portions was 1.6 mm, in the case of the comparative example in which no curvature was formed in the corner of the mounting portion, a short circuit occurred at all applied voltages higher than or equal to 500 V.

[0107] On the other hand, in the case of the invention example in which the curvature is formed at the corner of the mounting portion, the occurrence of short circuit is reduced, and in particular, the curvature at the corner of the mounting portion is less than or equal to 15 mm. -1 When the applied voltage reaches 2000V, short circuit does not occur.

[0108] In addition, referring to Table 2, even when the shortest distance between the two mounting portions is reduced to 1.2 mm by increasing the length of the mounting portion of the metal frame in the X direction to increase the mounting stability of the electronic component, the curvature at the corner of the mounting portion is less than or equal to 15 mm. -1 When the applied voltage reaches 2000V, short circuit does not occur.

[0109] Therefore, it can be seen that when considering the surge voltage in addition to the rated voltage of the electronic component, the curvature of the corner of the mounting portion of the metal frame is preferably less than or equal to 15 mm. -1 .

[0110] Figure 6 It shows that the installation Figure 4 A cross-sectional view of a board of an electronic component taken along the XZ plane.

[0111] The board according to the present exemplary embodiment may include: a circuit board 210; and first and second electrode pads 221 and 222 disposed on an upper surface of the circuit board 210 and spaced apart from each other in the X direction.

[0112] In this case, the electronic component 101 can be installed on the circuit board 210 in the following state: the first mounting portion 142 of the first metal frame 140 is positioned on the first electrode pad 221 to contact the first electrode pad 221, and the second mounting portion 152 of the second metal frame 150 is positioned on the second electrode pad 222 to contact the second electrode pad 222.

[0113] The first mounting portion 142 may be coupled to the first electrode pad 221 and electrically and physically connected to the first electrode pad 221 by the solder 231, and the second mounting portion 152 may be coupled to the second electrode pad 222 and electrically and physically connected to the second electrode pad 222 by the solder 232. The lengths of the first mounting portion 142 and the second mounting portion 152 in the X direction may be respectively greater than the lengths of the first electrode pad 221 and the second electrode pad 222 in the X direction.

[0114] In the electronic assembly according to the present exemplary embodiment, a gap between the multilayer capacitor 100 and the circuit board 210 may be secured by bonding the first metal frame 140 and the second metal frame 150 to both end portions of the multilayer capacitor 100 , respectively.

[0115] Therefore, when the electronic component 101 is mounted on the circuit board 210 , stress may not be directly transferred from the circuit board 210 to the multilayer capacitor 100 , so that thermal reliability, electrical reliability, mechanical reliability, etc. of the electronic component 101 may be improved.

[0116] In addition, corners of ends of the first mounting portion 142 and the second mounting portion 152 facing each other in the X direction may be formed in an arc shape to have a curvature.

[0117] That is, peak points may not be formed at the two corners of the end of the first mounting portion 142 , thereby preventing the electric field from being concentrated at the peak points of the first mounting portion 142 due to high voltage, surge voltage, etc. in the prior art.

[0118] In addition, peaks may not be formed at the two corners of the end of the second mounting portion 152 , thereby preventing the electric field from being concentrated at the peaks of the second mounting portion 152 due to high voltage, surge voltage, etc. in the prior art.

[0119] Therefore, sparks and short circuits between the first mounting portion 142 and the second mounting portion 152 can be prevented, thereby realizing an electronic component suitable for a high voltage environment (without the side effects caused by increasing the length of the electronic component or reducing the length of the mounting portion to increase the distance between the mounting portions in the prior art).

[0120] As described above, according to an exemplary embodiment, the corners of the ends facing each other of the first mounting portion of the first metal frame and the second mounting portion of the second metal frame can be formed to have a curvature, so that when the electronic component is mounted on the circuit board, the occurrence of sparks and short circuits can be reduced without increasing the length of the multilayer capacitor or reducing the length of the mounting portion, and the fixing strength of the metal frame can be maintained at a predetermined level or higher.

[0121] While exemplary embodiments have been shown and described above, it will be readily apparent to those skilled in the art that modifications and variations may be made without departing from the scope of the present invention as defined by the appended claims.

Claims

1. An electronic component comprising: Capacitor body; a pair of external electrodes, respectively disposed on opposite end surfaces of the capacitor body; as well as a pair of metal frames, comprising a pair of connecting parts and a pair of mounting parts, wherein the pair of connecting parts are respectively connected to the pair of external electrodes, and the pair of mounting parts are respectively bent at one end of the pair of connecting parts and extend from the one end of the pair of connecting parts, wherein corners of the ends of the pair of mounting portions facing each other have a curvature, and Wherein, the curvature of the corners of the ends of the pair of mounting portions is less than or equal to 15 mm -1 . 2 . The electronic component according to claim 1 , further comprising a pair of conductive bonding layers, wherein the pair of conductive bonding layers are respectively disposed between the pair of external electrodes and the pair of connecting portions.

3. The electronic component according to claim 1, wherein: The capacitor body includes a dielectric layer and a plurality of inner electrodes that are alternately arranged, and each of the dielectric layers is interposed between the plurality of inner electrodes.

4. The electronic component according to claim 1, wherein: Each of the pair of external electrodes comprises: a head portion provided on one end surface of the capacitor body among the opposite end surfaces; and A band portion extends from the head portion to a portion of each of the upper and lower surfaces of the capacitor body connected to the one end surface and the opposite side surfaces.

5. A board with electronic components, comprising: a circuit board having a plurality of electrode pads disposed on an upper surface of the circuit board; as well as electronic components mounted on the circuit board, The electronic component comprises: a capacitor body; a pair of external electrodes, respectively arranged on opposite end surfaces of the capacitor body; and a pair of metal frames, comprising a pair of connecting parts and a pair of mounting parts, the pair of connecting parts are respectively connected to the pair of external electrodes, the pair of mounting parts are respectively bent at one end of the pair of connecting parts and extend from the one end of the pair of connecting parts, the pair of mounting parts are respectively connected to the plurality of electrode pads, wherein corners of the ends of the pair of mounting portions facing each other have a curvature, and Wherein, the curvature of the corners of the ends of the pair of mounting portions is less than or equal to 15 mm -1 .

6. The plate according to claim 5, wherein The electronic component further includes a pair of conductive bonding layers, which are respectively disposed between the pair of external electrodes and the pair of connecting portions.

7. The plate according to claim 5, wherein The capacitor body includes a dielectric layer and a plurality of inner electrodes that are alternately arranged, and each of the dielectric layers is interposed between the plurality of inner electrodes.

8. The plate according to claim 5, wherein Each of the pair of external electrodes comprises: a head portion provided on one end surface of the capacitor body among the opposite end surfaces; and A band portion extends from the head portion to a portion of each of the upper and lower surfaces of the capacitor body connected to the one end surface and the opposite side surfaces.

9. The plate according to claim 5, wherein The pair of mounting portions are electrically and physically connected to the plurality of electrode pads, respectively, by solder.

10. The plate according to claim 5, wherein A length of each of the pair of mounting portions in a first direction in which the opposing end surfaces of the capacitor body oppose each other is greater than a length of each of the plurality of electrode pads in the first direction.

11. An electronic component comprising: Capacitor body; a pair of external electrodes, respectively disposed on opposite end surfaces of the capacitor body; as well as a pair of metal frames, respectively connected to the pair of external electrodes, each metal frame having an L shape, The ends of the pair of metal frames facing each other each have a corner portion, the curvature of the corner portion is greater than zero, and Wherein, the curvature of the corners of the ends of the pair of metal frames is less than or equal to 15 mm -1 .

12. The electronic component according to claim 11, wherein: The pair of metal frames includes: a pair of connection parts respectively connected to the pair of external electrodes; and a pair of mounting parts respectively bent at one ends of the pair of connection parts and extending from the one ends of the pair of connection parts. 13 . The electronic component according to claim 12 , further comprising a pair of conductive bonding layers, wherein the pair of conductive bonding layers are respectively disposed between the pair of external electrodes and the pair of connecting portions.

14. The electronic component according to claim 12, wherein: The shortest distance between the pair of mounting portions is less than or equal to 1.6 mm.

15. The electronic component according to claim 11, wherein: The capacitor body includes a dielectric layer and a plurality of inner electrodes that are alternately arranged, and each of the dielectric layers is interposed between the plurality of inner electrodes.

16. The electronic component according to claim 11, wherein Each of the pair of external electrodes comprises: a head portion provided on one end surface of the capacitor body among the opposite end surfaces; and A band portion extends from the head portion to a portion of each of the upper and lower surfaces of the capacitor body connected to the one end surface and the opposite side surfaces.

17. The electronic component according to claim 12, wherein: The pair of mounting portions extend from the one ends of the pair of connecting portions to face each other, respectively.

Images