Temporary storage device, method for manufacturing temporary storage device and method for transferring micro-component

Abstract

The present invention relates to a temporary storage device, a method for manufacturing the temporary storage device, and a method for transferring microcomponents. The temporary storage device comprises: a substrate; a plurality of weakened structures arranged at intervals, each weakened structure being located on the surface of the substrate, each weakened structure having a receiving space between the substrate and the weakened structure, and each weakened structure having at least one depression on the surface facing the receiving space. The manufacturing process of the weakened structure is relatively simple, which solves the problem of the difficulty in manufacturing the weakened structure in the prior art. In addition, the weakened structure has at least one depression on the surface facing the receiving space, which makes the weakened structure easier to break and easier to separate from the substrate later, thereby making it easier to transfer the microcomponent to be transferred to other transfer heads.

Description

Technical Field

[0001] The present invention relates to the field of chip transfer, and in particular to a temporary storage device, a method for manufacturing the temporary storage device, and a method for transferring a micro-component. Background Art

[0002] At present, a key technology facing Micro LED and other chips is to transfer Micro LED and other chips to the display backplane through mass transfer. Generally, they are transferred to the first temporary substrate through a removable adhesive material, and then transferred to the backplane after using the second temporary substrate or transfer head to expand the crystal. In this process, because the adhesive has strong adhesion to the LED, it is necessary to debond the adhesive on the first temporary substrate by light or heat during transfer, so as to transfer the chip to the second temporary substrate. This method is more complicated and difficult to perform selective transfer.

[0003] Currently, there is a method of fixing the chip by forming a weakened structure to make the first temporary substrate slightly sticky to the chip. When transferring the chip to the second temporary substrate, the chip can be fixed on the second temporary substrate without debonding. The process is simpler, and patterned adhesive materials can be used on the second temporary substrate to achieve selective transfer. However, the weakened structure is currently difficult to manufacture, and it is difficult to control the accuracy and uniformity.

[0004] Therefore, how to reduce the difficulty of making weakened structures is an urgent problem to be solved. Summary of the invention

[0005] In view of the above-mentioned deficiencies in the prior art, the purpose of the present application is to provide a temporary storage device, a method for manufacturing the temporary storage device and a method for transferring micro-components, aiming to solve the problem of high difficulty in manufacturing the weakened structure in the prior art.

[0006] A temporary storage device comprises: a substrate; a plurality of weakened structures arranged at intervals, each of the weakened structures is located on the surface of the substrate, a receiving space is provided between each of the weakened structures and the substrate, and each of the weakened structures has at least one recess on its surface facing the receiving space.

[0007] In the above-mentioned temporary storage device, a weakening structure is provided on the surface of the substrate. The manufacturing process of the weakening structure is relatively simple and only requires conventional deposition and etching processes to form it. Therefore, the manufacturing process of the weakening structure is relatively simple, which solves the problem of the difficulty of manufacturing the weakening structure in the prior art. In addition, the surface of the weakening structure facing the accommodation space has at least one depression, which makes the weakening structure easier to break and easier to separate from the substrate later, thereby making it easier to transfer the micro-component to be transferred to other transfer heads.

[0008] Optionally, the weakening structure includes a main body and two supporting parts, one end of the main body is connected to one end of one supporting part, the other end of the main body is connected to one end of another supporting part, the other ends of the two supporting parts are respectively arranged on the substrate at intervals, and the recess is located on the surface of the main body facing the substrate. The manufacturing process of the weakening structure is simpler, and the problem of the difficulty of manufacturing the weakening structure in the prior art is further solved.

[0009] Optionally, the temporary storage device further comprises: a plurality of sacrificial parts arranged at intervals, at least part of the sacrificial parts being located in the accommodating space, and the sacrificial parts having protrusions adapted to the recesses. In the temporary storage device, the weakening structure can be formed by arranging a material layer of the weakening structure on the sacrificial parts, which further simplifies the manufacturing process of the weakening structure.

[0010] Optionally, the material of the sacrificial part is selected from at least one of metal and alkaline organic matter, and the material of the weakening structure is an inorganic material. In this way, the sacrificial part can be removed by using an acidic solution, and the inorganic material has better brittleness.

[0011] Based on the same inventive concept, the present application also provides a method for manufacturing a temporary storage device, including: providing a substrate; forming a plurality of spaced weakening structures on the substrate, each of the weakening structures being located on the surface of the substrate, each of the weakening structures having a receiving space between it and the substrate, and each of the weakening structures having at least one recess on its surface facing the receiving space.

[0012] In the manufacturing method of the temporary storage device described above, only conventional deposition and etching processes are needed to form a weakened structure on the substrate. The manufacturing process of the weakened structure is relatively simple, which solves the problem of the difficulty of manufacturing the weakened structure in the prior art. In addition, the weakened structure manufactured by the manufacturing method has at least one depression on the surface facing the accommodation space, which makes the weakened structure easier to break and easier to separate from the substrate later, thereby making it easier to transfer the micro-component to be transferred to other transfer heads.

[0013] Optionally, forming a plurality of spaced weakening structures on the substrate comprises: providing a sacrificial material layer on the substrate; etching the sacrificial material layer to form a plurality of spaced sacrificial parts, wherein the edge region of the surface of each sacrificial part away from the substrate has a protrusion adapted to the depression; forming a covering layer on the exposed surface of the substrate and the exposed surface of the sacrificial part; etching and removing part of the covering layer to form a plurality of spaced weakening structures, wherein the weakening structures are located on the surface of the sacrificial part that is not in contact with the substrate. This method can further reduce the difficulty of manufacturing the weakening structure, and further solves the problem of the difficulty of manufacturing the weakening structure in the prior art.

[0014] Based on the same inventive concept, the present application also provides a method for transferring a microcomponent, comprising: providing a growth substrate, on which a plurality of microcomponents are grown; setting a protective film on the exposed surface of each of the microcomponents to form a microcomponent source structure; transferring the microcomponent source structure to any one of the temporary storage devices, wherein the protective film is in contact with the weakened structure in the temporary storage device; providing a transfer head, and fitting the transfer head to the exposed surface of the microcomponent source structure; applying a force to the weakened structure to break the weakened structure, and transferring the microcomponent source structure to the transfer head; removing the protective film to expose the microcomponent, and using the transfer head to transfer the microcomponent to the bonding area of ​​the backplane.

[0015] In the above transfer method, first, a microcomponent source structure is formed, and then the microcomponents and protective films in the microcomponent source structure are transferred to any of the above-mentioned temporary storage devices; thereafter, the transfer head is fitted with the microcomponent, and pressure is applied to break the weakened structure, thereby transferring the microcomponent to the transfer head; finally, the protective film is removed to transfer the microcomponent to the predetermined structure. In the above transfer process of the microcomponent, since the above-mentioned temporary storage device including the weakened structure is adopted, the manufacturing process of the weakened structure in the temporary storage device is relatively simple, thereby making the transfer process of the microcomponent relatively simple, avoiding the problem in the prior art that the entire microcomponent transfer process is relatively complicated due to the difficult manufacturing process of the weakened structure.

[0016] Optionally, the temporary storage device further comprises a plurality of spaced apart sacrificial parts, at least part of which is located in the accommodation space between the substrate and the weakening structure, and the sacrificial part has a protrusion adapted to the recess. The weakening structure can be formed by arranging a material layer of the weakening structure on the sacrificial part, which further simplifies the manufacturing process of the weakening structure.

[0017] Optionally, after transferring the micro-component source structure to the temporary storage device and before attaching the transfer head to the exposed surface of the micro-component, the micro-component transfer method further includes: removing the sacrificial portion in the temporary storage device. After the sacrificial portion is removed, the weakened structure is easier to break and later detach from the substrate, thereby making it easier to transfer the micro-component to be transferred to another transfer head.

[0018] Optionally, when the material of the sacrificial layer is selected from at least one of metal and alkaline organic matter, the removing of the sacrificial part in the temporary storage device includes: using an acidic solution to etch and remove the sacrificial part, and the material of the protective film is a material that is insoluble in the acidic solution. In this solution, the protective film is insoluble in the acidic solution, which further ensures that the protective film will not be removed when the sacrificial part is removed using the acidic solution. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 A schematic diagram of the structure of a temporary storage device provided according to an embodiment of the present application;

[0020] Figure 2 A schematic diagram of the structure of another temporary storage device provided according to an embodiment of the present application;

[0021] Figure 3 for Figure 1 Schematic diagram of some structures;

[0022] Figure 4 for Figure 1 A top view of

[0023] Figure 5 A schematic diagram of a process for manufacturing a temporary storage device according to an embodiment of the present application;

[0024] Figure 6 A schematic diagram of a process of transferring a micro-component provided according to an embodiment of the present application;

[0025] Figure 7 A schematic diagram of a micro-element source structure provided according to an embodiment of the present application;

[0026] Figure 8 A partial structural schematic diagram of a temporary storage device provided according to an embodiment of the present application is shown;

[0027] Fig. 9 A schematic diagram showing a structure formed by laminating a micro-component source structure and a temporary storage device according to an embodiment of the present application;

[0028] Fig.10 To remove Fig. 9 Schematic diagram of the structure behind the growth substrate;

[0029] Fig.11 To remove Fig.10 A schematic diagram of a structure formed after a sacrificial portion in FIG.

[0030] Fig.12 For transfer head and Fig.11 A schematic diagram of the structure after the structure shown is bonded;

[0031] Fig.13 For Fig.12 A schematic diagram of a structure formed after pressure is applied to the structure shown so that the weakened structure breaks;

[0032] Fig.14 To remove Fig.13 Schematic diagram of the structure behind the protective film;

[0033] Fig.15 for Fig.14 A schematic diagram of a structure formed after the structure shown is fitted with a predetermined structure; and

[0034] Fig.16 A schematic diagram of transferring a microcomponent to a predetermined structure.

[0035] Description of reference numerals:

[0036] 10. Temporary storage device; 11. Substrate; 12. Sacrificial part; 121. Protrusion; 13. Weakened structure; 20. Microcomponent source structure; 21. Growth substrate; 22. Microcomponent; 23. Protective film; 30. Transfer head; 31. Transfer substrate; 32. Adhesive layer; 40. Back plate; 41. Base; 42. Back plate film layer; 43. Welding layer; 130. Recess; 131. Main body; 132. Support part. DETAILED DESCRIPTION

[0037] In order to facilitate the understanding of the present application, the present application will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present application are given in the drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present application more thoroughly and comprehensively understood.

[0038] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application.

[0039] In the prior art, it is difficult to manufacture the weakening structure. Based on this, the present application hopes to provide a solution that can solve the above technical problems, and its details will be described in the subsequent embodiments.

[0040] In a typical implementation of the present application, a temporary storage device 10 is provided, such as Figure 1 and Figure 2 As shown, it includes a substrate 11 and a plurality of spaced weakening structures 13, wherein the weakening structures 13 are located on the surface of the substrate 11, and there is a receiving space between each of the weakening structures 13 and the substrate 11, and each of the weakening structures has at least one recess 130 on its surface facing the receiving space.

[0041] In the above-mentioned temporary storage device, a weakening structure is provided on the surface of the substrate. The manufacturing process of the weakening structure is relatively simple and only requires conventional deposition and etching processes to form it. Therefore, the manufacturing process of the weakening structure is relatively simple, which solves the problem of the difficulty of manufacturing the weakening structure in the prior art. In addition, the surface of the weakening structure facing the accommodation space has at least one recess 130, and the recess 130 makes the weakening structure easier to break and easier to separate from the substrate later, so that it is easier to transfer the micro-component to be transferred to other transfer heads.

[0042] In another embodiment of the present application, Figure 1 As shown, the weakening structure comprises a main body 131 and two supporting parts 132, one end of the main body 131 is connected to one end of one supporting part 132, the other end of the main body 131 is connected to one end of another supporting part 132, the other ends of the two supporting parts 132 are respectively arranged on the substrate at intervals, and the recess 130 is located on the surface of the main body 131 facing the substrate. The manufacturing process of the weakening structure is simpler, and the problem of the difficulty of manufacturing the weakening structure in the prior art is further solved.

[0043] Of course, in actual application, the weakening structure of the present application is not limited to the above-mentioned weakening structure including the support portion 132 and the main body portion 131, and may also be a weakening structure of other structures.

[0044] It should be noted that the recess 130 of the weakened structure in the present application is not limited to being located on the main body 131 , and may also be located on the support portion 132 . Compared with being located on the main body 131 , the manufacturing process of being located on the support portion 132 may be relatively complicated.

[0045] It should also be noted that, for the convenience of describing the specific structure of the weakening structure, the applicant divides the weakening structure into a main body portion 131 and a support portion 132, etc., but in fact, the weakening structure is not necessarily formed by separate structures such as the main body portion 131 and the support portion 132, and it may be an integrated structure.

[0046] In another embodiment of the present application, Figure 2 As shown, the temporary storage device further includes a plurality of spaced sacrificial parts 12, at least part of which is located in the accommodation space, and the sacrificial part 12 has a protrusion adapted to the recess 130. In the temporary storage device, the weakening structure can be formed by arranging a material layer of the weakening structure on the sacrificial part, which further simplifies the manufacturing process of the weakening structure.

[0047] The arrangement and distribution of the sacrificial parts in the present application may correspond to the arrangement and distribution of the micro-components to be arranged on the temporary storage device, that is, the sacrificial parts may be arranged in a one-to-one correspondence with the micro-components to be arranged.

[0048] In order to further simplify the manufacturing process of the temporary storage device, in a specific embodiment of the present application, Figure 3 As shown, the plurality of sacrificial portions 12 are arranged at intervals along the first direction, and the width of the sacrificial portions 12 in the first direction is greater than the width of the micro-component 22 to be transferred in the first direction.

[0049] In another embodiment of the present application, Figure 4 As shown, the plurality of weakening structures 13 form a plurality of weakening structure columns arranged at intervals along the first direction, all the weakening structures 13 in one weakening structure column are located on one sacrificial portion 12, each weakening structure column includes a plurality of weakening structures 13 arranged at intervals along the second direction, the first direction is perpendicular to the second direction, the width of the weakening structure 13 in the second direction is greater than the width of the micro-component 22 to be transferred in the second direction, so that the interval between two adjacent micro-components 22 in the second direction is greater than the interval between two adjacent weakening structures 13. This solution enables the subsequent formation of more and smaller weakening structures, which makes the weakening structures easier to break, thereby making it more convenient to transfer the subsequent micro-components 22 from the temporary storage device 10 to other transfer heads 30.

[0050] In order to further make the weakened structure easier to break, so that the micro-component 22 set on the temporary storage device 10 is easier to transfer to other transfer heads 30, in one embodiment of the present application, Figure 3 As shown, each of the sacrificial parts 12 has a plurality of protrusion columns arranged at intervals along the first direction, and each of the protrusion columns includes a plurality of protrusions 121 arranged at intervals along the second direction, so that each sacrificial part 12 includes a plurality of protrusions 121, so that when the sacrificial part 12 is subsequently removed, the weakened structure formed has a plurality of recesses 130.

[0051] In a more specific embodiment, Figure 3As shown, there are two protrusion columns, and the center lines of each of the four adjacent protrusions 121 in the two protrusion columns form a predetermined pattern, the width of the microcomponent 22 to be transferred in the first direction is less than or equal to the width of the predetermined pattern in the first direction, and the width of the microcomponent 22 to be transferred in the second direction is less than or equal to the width of the predetermined pattern in the second direction, that is, the projection of the microcomponent 22 to be transferred on the plane where the predetermined pattern is located is located within the predetermined image, and each of the weakening structures 13 covers the four protrusions 121 forming the predetermined pattern. Each inorganic structure covers four protrusions 121, so that the weakening structure formed after removing the sacrificial portion 12 has depressions 130 at the four corners, so that the weakening structure is easier to break. The relationship between the size of the predetermined pattern and the size of the microcomponent 22 to be transferred further ensures that it is convenient to apply force to break the weakening structure in the future, and can ensure that the weakening structure can be broken by applying a small force.

[0052] In a specific embodiment, the above-mentioned micro-component is an LED chip, and the distance between two adjacent protrusions in the first direction among the four protrusions corresponds to the pixel spacing on the back panel (in order to reduce costs, LED chips are produced more densely, and the distance between LED chips needs to be adjusted to be consistent with the pixel spacing on the back panel).

[0053] The selection of the material of the sacrificial part and the material of the inorganic structure in this application needs to meet the condition that the weakening structure will hardly be removed when the sacrificial part is removed. In the actual application process, two relatively large materials should be selected for etching as the material of the sacrificial part and the material of the weakening structure, and in order to make the weakening structure easier to break, a material with better brittleness can be selected. Those skilled in the art can select suitable materials to form the sacrificial part according to actual conditions, and can select suitable materials to form the weakening structure according to actual conditions.

[0054] In order to make the sacrificial part easier to remove, thereby further simplifying the manufacturing process of forming the weakened structure, in one embodiment of the present application, the material of the sacrificial part is selected from at least one of metal and alkaline organic matter, wherein the alkaline organic matter can be a metal having an amino group -NH 2 The sacrificial part can be removed by using an acidic solution.

[0055] In order to further make the weakened structure easier to break, the material of the weakened structure is an inorganic material, which has better brittleness. In a specific embodiment, at least one of a silicon oxide compound and a silicon nitrogen compound is selected, and both materials have good brittleness.

[0056] In another typical embodiment of the present application, a method for manufacturing a temporary storage device is provided, such as Figure 5As shown, including:

[0057] Step S101, providing a substrate 11;

[0058] Step S102, forming a plurality of spaced weakening structures 13 on the substrate 11, wherein the weakening structures 13 are on the surface of the substrate, each of the weakening structures 13 and the substrate 11 has a receiving space, and each of the weakening structures 13 has at least one recess 130 on the surface facing the substrate 11, forming a Figure 1 and Figure 2 shown.

[0059] In the manufacturing method of the temporary storage device described above, only conventional deposition and etching processes are needed to form a weakened structure on the substrate. The manufacturing process of the weakened structure is relatively simple, which solves the problem of the difficulty of manufacturing the weakened structure in the prior art. In addition, the weakened structure manufactured by the manufacturing method has at least one depression on the surface facing the accommodation space, which makes the weakened structure easier to break and easier to separate from the substrate later, thereby making it easier to transfer the micro-component to be transferred to other transfer heads.

[0060] In another embodiment of the present application, a plurality of spaced weakened structures are formed on the substrate, including: providing a sacrificial material layer on the substrate 11; etching the sacrificial material layer to form a plurality of spaced sacrificial portions 12, such as Figure 8 As shown, at least one of the sacrificial parts 12 includes a protrusion 121 adapted to the recess 130, wherein the protrusion 121 is located at the edge area of ​​the surface of the body; a covering layer is provided on the exposed surface of the sacrificial part 12 and the exposed surface of the substrate 11, and a portion of the covering layer is etched away to form a plurality of the weakening structures 13 arranged at intervals, such as Figure 2 As shown, the weakening structure 13 is located on the surface of the sacrificial portion 12 that is not in contact with the substrate 11. This method can further reduce the difficulty of manufacturing the weakening structure, and further solves the problem of the difficulty of manufacturing the weakening structure in the prior art.

[0061] In another typical embodiment of the present application, a method for transferring a micro-component is provided, such as Figure 6 As shown, the method includes:

[0062] Step S201, providing a growth substrate, on which a plurality of micro-components 22 are grown;

[0063] Step S202: a protective film 23 is provided on the exposed surface of each of the micro-components 22 to form a micro-component source structure 20. Figure 7 As shown;

[0064] Step S203, transferring the micro-component source structure 20 to any of the above-mentioned temporary storage devices 10, wherein the protective film 23 is in contact with the weakened structure 13 in the above-mentioned temporary storage device 10, such as Fig. 9 As shown;

[0065] Step S204, providing a transfer head 30, and attaching the transfer head 30 to the exposed surface of the micro-component 22, such as Fig.12 As shown;

[0066] Step S205, applying pressure to the weakened structure to break the weakened structure, and transferring the micro-component 22 to the transfer head 30, such as Fig.13 As shown, it should be noted that the application of pressure to the weakened structure herein may be direct application of pressure to the weakened structure, or may be indirect application of pressure to the weakened structure;

[0067] Step S206, removing the protective film 23 to expose the micro-component 22, and using the transfer head 30 to transfer the micro-component 22 to the bonding area of ​​the backplane 40 to form a bonding surface. Fig.16 The structure shown.

[0068] In the above transfer method, first, a microcomponent source structure is formed, and then the microcomponents and protective films in the microcomponent source structure are transferred to any of the above-mentioned temporary storage devices; thereafter, the transfer head is fitted with the microcomponent, and pressure is applied to break the weakened structure, thereby transferring the microcomponent to the transfer head; finally, the protective film is removed to transfer the microcomponent to the predetermined structure. In the above transfer process of the microcomponent, since the above-mentioned temporary storage device including the weakened structure is adopted, the manufacturing process of the weakened structure in the temporary storage device is relatively simple, thereby making the transfer process of the microcomponent relatively simple, avoiding the problem in the prior art that the entire microcomponent transfer process is relatively complicated due to the difficult manufacturing process of the weakened structure.

[0069] In another embodiment of the present application, after transferring the micro-component source structure to the temporary storage device and before attaching the transfer head to the exposed surface of the micro-component, the micro-component transfer method further includes: Fig.11 As shown, the sacrificial part in the temporary storage device is removed. After the sacrificial part is removed, the weakened structure is easier to break and later to separate from the substrate, so that the micro-component to be transferred is easier to transfer to other transfer heads.

[0070] It should be noted that the above transfer head can be any feasible transfer head in the prior art. In a specific embodiment of the present application, Fig.12 As shown, the transfer head includes a transfer substrate 31 and an adhesive layer 32 .

[0071] In a specific embodiment of the present application, before transferring the micro-component 22 and the protective film 23 in the micro-component source structure 20 to any of the temporary storage devices 10, the transfer method further includes: providing the temporary storage device 10. The method for forming the temporary storage device 10 is simpler, which further ensures that the weakening structure manufacturing process is relatively simple.

[0072] The above-mentioned sacrificial material layer and inorganic structural material layer can be set by a suitable method according to actual conditions, such as coating (Coater), physical vapor deposition (Physical Vapor Deposition, PVD), plasma enhanced chemical vapor deposition (Plasma Enhanced Chemical Vapor Deposition, referred to as PECVD). For the organic sacrificial layer, it can be formed by coating, for the metal sacrificial layer, it can be formed by PVD, and SiOx (silicon oxide compound) or SiNx (nitrogen silicon compound) and other brittle covering layers can be formed by PECVD.

[0073] It should be noted that the etching mentioned in the above solution is etching in a broad sense, and the process includes a photolithography process and a subsequent corrosion process. The specific etching process method and corresponding parameters can be selected according to actual conditions.

[0074] In another embodiment of the present application, Figure 2 As shown, the temporary storage device further includes a plurality of sacrificial portions 12 disposed at intervals, at least a portion of the sacrificial portions 12 is located in the accommodating space, and the sacrificial portions 12 have protrusions adapted to the recesses 130 .

[0075] In another embodiment of the present application, transferring the micro-component source structure 20 to any of the above-mentioned temporary storage devices 10 includes: attaching the micro-component source structure 20 to the above-mentioned temporary storage device 10 so that the protective film 23 contacts the weakened structure 13, such as Fig. 9 As shown; remove the above-mentioned growth substrate 21 to form Fig.10 The structure shown.

[0076] The specific method of removing the growth substrate 21 can be selected according to the material of the growth substrate 21. For a sapphire growth substrate 21, laser lift off (LLO) technology can be used for lift-off.

[0077] Of course, the growth substrate of the present application is not limited to the above-mentioned sapphire growth substrate, and it can also be a GaN growth substrate or a GaAs growth substrate, etc. For different micro-components, the corresponding growth substrate may be different, and those skilled in the art can select the corresponding growth substrate according to the actual micro-components, etc.

[0078] Specifically, the micro-component source structure is bonded to the temporary storage device so that the protective film is in contact with the weakened structure, including: using the protective film with adhesive material to bond the weakened structure, that is, the protective film can not only protect the micro-components, but also play an adhesion role. In a specific embodiment, the protective film is an adhesive film.

[0079] In another embodiment of the present application, laminating the micro-component source structure with the temporary storage device so that the protective film contacts the weakened structure includes laminating the micro-component source structure with the temporary storage device using a vacuum laminating method. Specifically, plasma can be used to bombard the surface of the protective film and the surface of the weakened structure so that the two are laminating at room temperature in a vacuum.

[0080] In order to make the sacrificial part easier to remove, thereby further simplifying the manufacturing process of forming the weakened structure and simplifying the transfer process of the micro-components, in one embodiment of the present application, the material selected for the sacrificial layer is selected from at least one of metal and alkaline organic matter, and the material of the protective film is a material insoluble in the acidic solution. Removing the sacrificial layer in the temporary storage device includes: using an acidic solution to etch and remove the sacrificial layer, and the material of the protective film is a material insoluble in the acidic solution to form the weakened structure. In this solution, the protective film is insoluble in the acidic solution, which further ensures that the protective film will not be removed when the sacrificial part is removed using the acidic solution.

[0081] Of course, the material of the protective film and the material of the sacrificial layer in the present application are not limited to the above materials, but can also be any other feasible material. The choice of specific material can be determined according to the process, as long as it can ensure that the protective film is not removed when the sacrificial part is removed.

[0082] In order to further make the weakened structure easier to break, the material of the weakened structure is an inorganic material, which has better brittleness. In a specific embodiment, the material of the weakened structure is selected from at least one of a silicon oxide compound and a silicon nitrogen compound, both of which have good brittleness.

[0083] Of course, the choice of materials for the sacrificial part and the weakening structure in the present application is not limited to the materials in the above scheme, and can also be any other material that "satisfies the condition that the weakening structure will hardly be removed when the sacrificial part is removed". In the actual application process, two relatively large materials should be selected for etching as the material of the sacrificial part and the material of the weakening structure, and in order to make the weakening structure easier to break, a material with better brittleness can be selected. Those skilled in the art can select suitable materials to form the sacrificial part according to actual conditions, and can select suitable materials to form the weakening structure according to actual conditions.

[0084] In a specific application process, a suitable method can be selected to remove the protective film 23 according to the material of the protective film and the material of the inorganic structure layer, so as to form Fig.14 In the structure shown, the remaining weakened structure is removed while removing the protective film. In a specific embodiment of the present application, the material of the protective film includes at least one of PI and PMMA, and a solvent such as N-methylpyrrolidone (NMP) can be used to remove the protective film, and after removal, the electrode is dried.

[0085] The micro-component in the present application can be any tiny component that needs to be transferred in the prior art. Those skilled in the art can apply the above-mentioned temporary storage device and transfer method to the transfer process of feasible micro-components according to actual conditions.

[0086] In a specific embodiment of the present application, the above-mentioned micro-component includes at least one of an LED chip, an OLED chip, a Micro LED chip and a Mini LED chip.

[0087] In actual application, different micro components have different corresponding structures to be transferred to. For LED chips, the corresponding structures to be transferred to include backplanes, such as Fig.15 As shown, the back plate 40 includes a substrate 41, a back plate film layer 42 and a welding layer 43. The material of the welding layer 43 is generally tin Sn or indium In. Specifically, the micro-component 22 is transferred to the bonding area of ​​the back plate 40, including: the electrode of the LED chip is connected to the welding layer 43 by pressure bonding, and then the welding layer 43 is heated to melt, thereby welding the electrode of the LED chip to form Fig.15 Then, the transfer substrate 31 is removed to form a structure as shown in Fig.16 In the structure shown, since the transfer substrate 31 has weak adhesion to the LED chip, the fixing force of the LED chip after the electrode is bound needs to be greater than the adhesion force of the transfer substrate 31 to the LED chip, so the transfer substrate 31 does not need to be debonded and can be separated from the LED chip to complete the transfer.

[0088] It should be understood that the application of the present invention is not limited to the above examples. For ordinary technicians in this field, improvements or changes can be made based on the above description. All these improvements and changes should fall within the scope of protection of the claims attached to the present invention.

Claims

1. A temporary storage device, characterized in that: include: A substrate, the substrate being used to receive a plurality of micro-components grown on the growth substrate; A plurality of weakening structures are arranged at intervals, each of the weakening structures is located on the surface of the substrate, each of the weakening structures includes a main body and at least two supporting parts, one end of the at least two supporting parts is respectively connected to the main body, and the other end is respectively connected to the substrate, the main body, at least two supporting parts and the substrate together form a accommodating space, and the inner side surface of the main body facing the substrate has at least one recess, and one of the weakening structures corresponds to receiving one of the micro-components.

2. The temporary storage device according to claim 1, characterized in that: The temporary storage device also includes: A plurality of sacrificial parts are arranged at intervals, at least part of the sacrificial parts are located in the accommodating space, and the sacrificial parts have protrusions adapted to the recesses.

3. The temporary storage device according to claim 2, characterized in that: The material of the sacrificial part is selected from at least one of metal and alkaline organic matter, and the material of the weakening structure is an inorganic material.

4. A method for manufacturing a temporary storage device, characterized in that: include: Providing a substrate, the substrate being used to receive a plurality of micro-components grown on the growth substrate; A plurality of spaced weakening structures are formed on the substrate, each of the weakening structures is located on the surface of the substrate, each of the weakening structures includes a main body and at least two supporting parts, one end of the at least two supporting parts is respectively connected to the main body, and the other end is respectively connected to the substrate, the main body, at least two supporting parts and the substrate together form a accommodating space, and the inner side surface of the main body facing the substrate has at least one recess, and one of the weakening structures corresponds to receiving one of the micro-components.

5. The method for manufacturing a temporary storage device according to claim 4, characterized in that: A plurality of spaced weakened structures are formed on the substrate, comprising: Disposing a sacrificial material layer on the substrate; Etching the sacrificial material layer to form a plurality of sacrificial parts arranged at intervals, wherein the surface of each sacrificial part has a protrusion adapted to the depression; forming a covering layer on the surfaces of the substrate and the sacrificial portion; A portion of the cover layer is removed by etching to form a plurality of weakened structures arranged at intervals, wherein the weakened structures are located on the surface of the sacrificial portion that is not in contact with the substrate.

6. A method for transferring a microcomponent, characterized in that: include: Providing a growth substrate, on which a plurality of micro-components are grown; Providing a protective film on the surface of each micro-component to form a micro-component source structure; transferring the micro-component source structure to a temporary storage device according to any one of claims 2 to 3, wherein the protective film is in contact with the weakened structure in the temporary storage device; Providing a transfer head, and attaching the transfer head to the surface of the micro-component source structure; Applying a force to the weakened structure to break the weakened structure and transfer the micro-component source structure to the transfer head; The protective film is removed to expose the micro-component, and the micro-component is transferred to the bonding area of ​​the backplane using the transfer head.

7. The micro-component transfer method according to claim 6, characterized in that: Before the transfer head is attached to the surface of the micro-component, the micro-component transfer method further comprises: The sacrificial portion in the temporary storage device is removed.

8. The micro-component transfer method according to claim 7, characterized in that: The removing the sacrificial portion in the temporary storage device comprises: The sacrificial portion is removed by etching with an acidic solution, and the material of the protective film is a material insoluble in the acidic solution.

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