An electronic device

Abstract

The embodiment of the present application provides an electronic device, which comprises a resonance structure, can be applied to a metal cavity formed by a metal layer in the electronic device, can inhibit the propagation of interference signals in the cavity, and effectively improves the radiation performance of an antenna unit in the electronic device. The resonance structure can be arranged in the cavity and located between an interference element and an antenna. The resonance structure comprises a dielectric layer and a first metal piece. The dielectric layer is arranged in the metal cavity. The first metal piece is arranged on the dielectric layer. The first metal piece is electrically connected with the metal cavity.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of wireless communication, in particular to an electronic device. BACKGROUND

[0002] With the development of the fifth generation (5G) mobile communication system, more application scenarios of electronic devices are developed, such as a horizontal high-definition video scene, a horizontal entertainment scene, a low-latency video chat, and the like. The increase of these new applications gives birth to new frequency bands and the demand for high throughput, thus requiring multiple antennas under the original architecture. Meanwhile, there are multiple small cavities inside the electronic device, such as the cavity formed between the battery and the middle frame, the cavity formed between the middle frame and the display screen, the middle frame and the printed circuit board (PCB), the cavity formed between the middle frame and the flexible printed circuit (FPC) trace slot and the display screen, and the like. These cavities are connected in series, and finally form a low-loss electromagnetic wave transmission path. The interference signals generated at the source of some cavities can be transmitted through these cavities to other places to affect the antennas of the electronic device, causing the whole machine interference problem. For example, the interference signals generated by the mobile industry processor interface (MIPI) control signals under the display can be transmitted through the cavity formed between the display and the middle frame to the top antenna area to cause interference. Therefore, in the 5G communication system, more antenna architectures are required to solve the problem of signal transmission through the cavities inside the electronic device to the antennas, improve the communication experience of the 5G frequency band, and ensure the advantages of communication performance. SUMMARY

[0003] The electronic device provided by the embodiments of the present application includes a resonance structure which can be applied to the cavity formed by the metal layer in the electronic device, can inhibit the propagation of interference signals in the cavity, and effectively improve the radiation performance of the antenna unit in the electronic device.

[0004] In a first aspect, an electronic device is provided, which includes an electronic component, a middle frame, a metal layer, a resonance structure, and an antenna unit; the electronic component is arranged in a metal cavity, the metal cavity is surrounded by the metal layer and the middle frame arranged opposite to each other; the antenna unit is arranged on the side surface of the metal cavity; the resonance structure is arranged in the metal cavity and located between the electronic component and the antenna unit; the resonance structure includes a dielectric layer and a first metal piece, the dielectric layer includes a first surface and a second surface, the first metal piece is arranged on the first surface of the dielectric layer, the second surface of the dielectric layer is fixed in the metal cavity, and the first metal piece is electrically connected with the middle frame or the first metal layer.

[0005] According to the technical scheme of the embodiment of the present application, the first metal piece of different shapes and different sizes can be set according to the frequency of the actual interference signal, so as to prevent the interference signal from interfering with the antenna unit. Moreover, the resonant structure is not sensitive to the setting position in the metal cavity surrounded by the metal layer inside the electronic device, and has good robustness.

[0006] With reference to the first aspect, in some implementations of the first aspect, the resonant structure further includes a first connecting piece that is electrically conductive; a first end of the first connecting piece is electrically connected to the first metal piece, and a second end of the first connecting piece is electrically connected to the middle frame or the metal layer.

[0007] According to the technical scheme of the embodiment of the present application, the first connecting piece can be metal or other conductive material, and can provide good grounding for the first metal piece.

[0008] With reference to the first aspect, in some implementations of the first aspect, the dielectric layer includes a first dielectric layer and a second dielectric layer, the first metal piece is arranged between the first dielectric layer and the second dielectric layer, the first dielectric layer is insulating glue, the first connecting piece is conductive foam, and the first connecting piece is fixed in the metal cavity through the first dielectric layer.

[0009] According to the technical scheme of the embodiment of the present application, the scheme has low cost, and at the same time, the conductive foam has elasticity, so that the electrical connection effect of the first connecting piece and the metal frame can be ensured.

[0010] With reference to the first aspect, in some implementations of the first aspect, the dielectric layer includes a first dielectric layer and a second dielectric layer, the first metal piece is arranged between the first dielectric layer and the second dielectric layer, the resonant structure is fixed in the metal frame by welding, and the first connecting piece is a welding point.

[0011] According to the technical scheme of the embodiment of the present application, the scheme does not need to additionally fix the resonant structure separately, and is simpler.

[0012] With reference to the first aspect, in some implementations of the first aspect, the resonant structure further includes a second metal piece and a second connecting piece that is electrically conductive; the dielectric layer further includes a third surface, the second metal piece is arranged on the third surface, a first end of the second connecting piece is electrically connected to the second metal piece, and a second end of the second connecting piece is electrically connected to the middle frame or the first metal layer.

[0013] According to the technical scheme of the embodiment of the present application, the resonant structure can include multiple metal pieces, and the working bandwidth of the resonant structure can be expanded.

[0014] In some implementations of the first aspect, a distance between the first connection point and the second connection point along the first direction is greater than or equal to 40 mm, where the first connection point is a connection point between the first connecting element and the first metal element, the second connection point is a connection point between the second connecting element and the second metal element, and the first direction is a direction in which the first connecting line points to the antenna unit.

[0015] According to the technical solution of the embodiments of the present application, when the distance L between the first connection point and the second connection point is less than one fourth of the working wavelength corresponding to the working frequency band of the resonant structure, the resonant frequencies generated by the first metal element and the second metal element partially overlap, and therefore, the resonant points of the resonances generated by the first metal element and the second metal element are included in the same working frequency band of the resonant structure, which can expand the working bandwidth of the resonant structure. When the distance L between the first connection point and the second connection point along the first direction is greater than or equal to one fourth of the working wavelength corresponding to the working frequency band of the resonant structure, the resonant frequencies generated by the first metal element and the second metal element do not overlap, and therefore, the working bandwidth of the resonant structure includes different frequency bands.

[0016] In some implementations of the first aspect, the first metal element includes a first branch and a second branch, where the first branch and the second branch are electrically connected, the first end of the first connecting element is electrically connected to the first branch, and the second end of the first connecting element is electrically connected to the middle frame or the first metal layer.

[0017] According to the technical solution of the embodiments of the present application, since the first metal element includes the first branch and the second branch, which can be used as different resonant units and work in different frequency bands, the resonant structure can work in multiple different frequency bands, and therefore, the influence of interference signals on the radiation performance of the antenna unit can be prevented in multiple frequency bands.

[0018] In some implementations of the first aspect, the electronic device further includes a third connecting element, a first end of the third connecting element is electrically connected to the first branch, and a second end of the third connecting element is electrically connected to the middle frame or the first metal layer.

[0019] According to the technical solution of the embodiments of the present application, for the first metal element, another grounding point is added, which provides better grounding characteristics for the first metal element and can also change the current distribution and the corresponding working frequency band.

[0020] In a second aspect, an electronic device is provided, comprising: an interference element, a first metal layer, a second metal layer, a resonant structure and an antenna unit; wherein the interference element is arranged in a metal cavity, the metal cavity is surrounded by the first metal layer and the second metal layer arranged oppositely; the antenna unit is arranged on a side of the metal cavity; the resonant structure is arranged in the metal cavity and between the interference element and the antenna unit; the resonant structure comprises a dielectric layer and a first metal piece, the dielectric layer comprises a first surface and a second surface, the first metal piece is arranged on the first surface of the dielectric layer, the second surface of the dielectric layer is fixed in the metal cavity, and the first metal piece is grounded. BRIEF DESCRIPTION OF DRAWINGS

[0021] Figure 1 FIG. 1 is a schematic diagram of an electronic device provided by an embodiment of the present application.

[0022] Figure 2 FIG. 1 is a schematic diagram of an electronic device provided by an embodiment of the present application.

[0023] Figure 3 FIG. 1 is a schematic diagram of an electronic device provided by an embodiment of the present application.

[0024] Figure 4 FIG. 1 is a schematic diagram of an electronic device provided by an embodiment of the present application.

[0025] Figure 5 FIG. 1 is a schematic diagram of an electronic device provided by an embodiment of the present application.

[0026] Figure 6 FIG. 1 is a schematic diagram of an electronic device provided by an embodiment of the present application.

[0027] Figure 7 FIG. 1 is a schematic diagram of an electronic device provided by an embodiment of the present application. Figure 5 FIG. 1 is a schematic diagram of an electronic device provided by an embodiment of the present application.

[0028] Figure 8 FIG. 1 is a schematic diagram of an electronic device provided by an embodiment of the present application. Figure 5 FIG. 1 is a schematic diagram of an electronic device provided by an embodiment of the present application.

[0029] Figure 9 FIG. 1 is a schematic diagram of an electronic device provided by an embodiment of the present application.

[0030] Figure 10 FIG. 1 is a schematic diagram of an electronic device provided by an embodiment of the present application. Figure 9 FIG. 1 is a schematic diagram of an electronic device provided by an embodiment of the present application.

[0031] Figure 11 FIG. 1 is a schematic diagram of an electronic device provided by an embodiment of the present application.

[0032] Figure 12 FIG. 1 is a schematic diagram of an electronic device provided by an embodiment of the present application. Figure 11 FIG. 1 is a schematic diagram of an electronic device provided by an embodiment of the present application.

[0033] Figure 13 This is a schematic diagram of another metal cavity structure provided in an embodiment of this application.

[0034] Figure 14 yes Figure 13 The S-parameter diagram of the metal cavity is shown.

[0035] Figure 15 This is a schematic diagram of another metal cavity structure provided in an embodiment of this application.

[0036] Figure 16 yes Figure 15 S-parameter plots of the metal cavity for different values ​​of L.

[0037] Figure 17 yes Figure 15 Current distribution diagram when L = 60mm.

[0038] Figure 18 This is a schematic diagram of another metal cavity structure provided in an embodiment of this application.

[0039] Figure 19 yes Figure 18 The S-parameter diagram of the metal cavity is shown.

[0040] Figure 20 yes Figure 18 The current distribution diagram of the metal cavity is shown.

[0041] Figure 21 This is a schematic diagram of another metal cavity structure provided in an embodiment of this application.

[0042] Figure 22 yes Figure 21 The S-parameter diagram of the metal cavity is shown.

[0043] Figure 23 yes Figure 21 The current distribution diagram of the metal cavity is shown. Detailed Implementation

[0044] The technical solutions in this application will now be described with reference to the accompanying drawings. The terminology used in the embodiments section of this application is only for explaining specific embodiments of this application and is not intended to limit this application. In the embodiments of this application, words such as "exemplary" or "for example" are used to indicate examples, illustrations, or descriptions. Specifically, the use of words such as "exemplary" or "for example" is intended to present related concepts in a specific manner. It should be understood that in the description of the embodiments of this application, "coupling" includes direct coupling or indirect coupling, and "connection" includes direct connection or indirect connection.

[0045] The technical solutions provided in the present application are applicable to electronic devices using one or more of the following communication technologies: Bluetooth (BT) communication technology, global positioning system (GPS) communication technology, wireless fidelity (WiFi) communication technology, global system for mobile communications (GSM) communication technology, wideband code division multiple access (WCDMA) communication technology, long term evolution (LTE) communication technology, 5G communication technology, and other future communication technologies. The electronic device in the embodiments of the present application can be a mobile phone, a tablet computer, a notebook computer, a smart bracelet, a smart watch, a smart helmet, smart glasses, a smart television, and the like. The electronic device can also be a cellular phone, a cordless phone, a session initiation protocol (SIP) phone, a wireless local loop (WLL) station, a personal digital assistant (PDA), a handheld device with wireless communication function, a computing device, or other processing devices connected to a wireless modem, a vehicle-mounted device, an electronic device in a 5G network, or an electronic device in a future evolved public land mobile network (PLMN), and the like, which are not limited in the embodiments of the present application.

[0046] Figure 1 An internal environment of an electronic device provided in the present application is exemplarily shown, and the electronic device is a mobile phone.

[0047] As shown in FIG. 1, the electronic device 10 can include a cover glass 13, a display 15, a printed circuit board (PCB) 17, a housing 19, and a rear cover 21. Figure 1

[0048] The cover glass 13 can be arranged close to the display 15, and can be mainly used to protect the display 15 from dust.

[0049] ​Optionally, the display screen 15 can be a liquid crystal display (LCD), a light emitting diode (LED), an organic light-emitting diode (OLED), or the like, and the present application does not limit this.

[0050] The printed circuit board PCB 17 can be made of a flame retardant material (FR-4) medium plate, a Rogers medium plate, a hybrid medium plate of Rogers and FR-4, or the like. Here, FR-4 is a code of a flame retardant material grade, and the Rogers medium plate is a high-frequency plate. The side of the printed circuit board PCB 17 close to the middle frame 19 can be provided with a metal layer, which can be formed by etching metal on the surface of the PCB 17. The metal layer can be used for grounding the electronic elements carried on the printed circuit board PCB 17 to prevent user electric shock or equipment damage. The metal layer can be referred to as a PCB floor. Without being limited to the PCB floor, the electronic device 10 can also have other floors for grounding, such as a metal middle frame or other metal planes in the electronic device. In addition, the PCB 17 is provided with a plurality of electronic elements, including a processor (such as one or more of a power management module, a memory, a sensor, a SIM card interface, etc.), and the inside or surface of these electronic elements can also be provided with metal.

[0051] The electronic device 10 can also include a battery, which is not shown here. The battery can be disposed in the middle frame 19, and the battery can divide the PCB 17 into a main board and a sub-board. The main board can be disposed between the bezel 11 of the middle frame 19 and the upper edge of the battery, and the sub-board can be disposed between the middle frame 19 and the lower edge of the battery. The inside or surface of the battery can also be provided with a metal layer.

[0052] The middle frame 19 mainly serves as a support for the entire device. The middle frame 19 can include the bezel 11, which can be formed of a conductive material such as metal. The bezel 11 can extend around the periphery of the electronic device 10 and the display screen 15, and specifically can surround the four sides of the display screen 15 to help secure the display screen 15. In one implementation, the bezel 11 made of metal material can be directly used as a metal bezel of the electronic device 10 to form a metal bezel appearance, which is suitable for a metal industrial design (ID). In another implementation, the outer surface of the bezel 11 can also be a non-metallic material, such as a plastic bezel, to form a non-metallic bezel appearance, which is suitable for a non-metallic ID.

[0053] The back cover 21 can be a back cover made of metal material, or a back cover made of non-conductive material, such as a glass back cover, a plastic back cover, or the like.

[0054] Figure 1 The actual shape, actual size and actual structure of the components included in the electronic device 10 are not limited. Figure 1 In addition, the electronic device 10 can further include a camera, a sensor and the like.

[0055] Figure 2 The cross-sectional schematic diagram of the electronic device provided by the present application is exemplarily shown.

[0056] As shown in Figure 2 , the glass cover plate 13 can be arranged close to the display screen 15, and the display screen 15 can be arranged in the area surrounded by the middle frame 19 and the bezel 11. The surface of the display screen 15 close to the middle frame 19 can be provided with a metal layer 16, which can prevent the imaging unit in the display screen 15 from being interfered by electromagnetic signals, and also can provide good heat dissipation for the display screen 15.

[0057] It should be understood that the metal layer 16 of the display screen 15 and the middle frame 19 surround a metal cavity 20, and the metal cavity 20 has a metal wall (or a metal frame), for example, in 1 and Figure 2 , the metal layer 16 and the middle frame 19 are arranged opposite to each other in the Y-axis direction, forming a metal cavity 20 extending in the XZ plane, and the metal layer 16 and the middle frame 19 can be understood as two of the metal cavity 20. In addition, the bezel 11 surrounds the side of the metal cavity 20 to form a closed cavity (a non-metal antenna slot can be formed on the bezel 11 for wireless communication). In other embodiments, when the middle frame 19 is not provided with the bezel 11, or the bezel 11 is only located on part of the side (for example, only on the side in the Z-axis direction, that is, on the top side or the bottom side of the mobile phone), the metal cavity 20 can be a cavity with at least part of the side open.

[0058] In order to realize the transmission of electrical signals between the display screen 15 and the electronic elements (such as processors) on the PCB 17, the MIPI 18 can be passed through the metal cavity 20 to electrically connect the display screen 15 and the PCB 17. As shown in Figure 2 (a), the MIPI 18 can be mostly arranged in the metal cavity 20, or as shown in Figure 2 (b), the MIPI 18 can be mostly arranged between the middle frame 19 and the PCB 17, and the present application does not limit the comparison.

[0059] The electronic device can further include an antenna unit 210 for wireless communication. In one implementation, the antenna unit 210 can be arranged on one or more sides of the metal cavity 20. For example, the antenna unit 210 can be arranged on the side in the positive direction of the Z axis, i.e., on the top side of the electronic device. Alternatively, the antenna unit 210 can be arranged on the side in the positive direction of the Z axis and the side in the negative direction of the Z axis, i.e., on the top side and the bottom side of the electronic device. In addition, the antenna unit 210 can be arranged on one or both sides in the X axis direction. The antenna unit 210 can be a frame antenna, a flexible printed circuit (FPC) antenna, or other types of antennas.

[0060] When powered on, the components (electronic components) in the electronic device can generate electromagnetic waves, which can interfere with the antenna unit 210. For example, when the MIPI 18 transmits electrical signals, the MIPI 18 can generate interference signals as an interference source. Because the metal cavity 20 has metal walls (e.g., the metal layer 16, the middle frame 19, and the frame on the side), the interference signals cannot penetrate the metal walls and can only be transmitted inside the metal cavity 20. The interference signals transmitted through the metal cavity 20 to the antenna unit 210 located at the opening of the metal cavity 20 can affect the performance of the antenna unit 210. To reduce the impact of the interference source on the antenna unit 210 and other devices, one method can add a shield cover to the interference source, e.g., a shield cover can be arranged on the surface of the processor and other components. The shield cover is generally made of metal, and it is difficult for interference signals to radiate from the shield cover and interfere with the antenna signals. However, as the functions of electronic devices become more and more complex, the components in the electronic devices become more and more complex, and it is difficult for the shield cover to solve all interference problems. For example, it is difficult to shield the MIPI connection line, which is an interference source, with a shield cover.

[0061] To solve the problem caused by the unshielded interference signals, one method can add a surface wave-absorbing material inside the metal cavity 20. The wave-absorbing material can absorb specific electromagnetic waves, and the electromagnetic waves can be difficult to transmit out of the metal cavity 20 after being absorbed by the wave-absorbing material, thereby suppressing the interference of the interference signals on the antenna unit. However, the wave-absorbing material can also absorb the antenna signals when absorbing the interference signals, which can affect the radiation performance of the antenna unit. In addition, the technical solution of adding the wave-absorbing material is sensitive to the position. The wave-absorbing material needs to be arranged at a suitable position in the metal cavity 20 to produce good results. However, for the increasingly tight internal space of electronic devices, there may not be a suitable position.

[0062] The embodiments of the present application provide a resonant structure which can be applied to the metal cavity 20 formed in the electronic device. Figure 2The metal cavity can inhibit the propagation of interference signals in the metal cavity, and effectively improve the radiation performance of the antenna unit in the electronic device. It should be understood that the technical solutions provided by the embodiments of the present application can also be applied to the cavities formed between other metal layers in the electronic device to prevent the electronic components in the cavities from interfering with the antenna unit.

[0063] Figure 3 and Figure 4 is a cross-sectional schematic diagram of an electronic device 100 provided by an embodiment of the present application.

[0064] As Figure 3 , the electronic device 100 can include an electronic component 120, a middle frame 19, a first metal layer 130, a resonant structure 140, and an antenna unit 150. Figure 3 and Figure 4 the same reference signs in Figure 1 and Figure 2 have the same meaning. The material of the middle frame 19 can be metal, or part of the material of the middle frame 19 is metal, and the middle frame 19 can be understood as a metal layer.

[0065] The electronic component 120 can be disposed in the metal cavity 20, and the metal cavity 20 is surrounded by the first metal layer 130 and the middle frame 19 disposed opposite each other. The antenna unit 150 is disposed on the side of the metal cavity 20, for example, in Figure 3 , the antenna unit 150 is disposed on the side of the metal cavity 20 in the first direction (e.g., the positive direction of the Z-axis). In one specific embodiment, the antenna unit 150 is disposed outside the metal cavity 20, in one specific embodiment, the antenna unit 150 is disposed at the edge of the metal cavity 20, and in one specific embodiment, the antenna unit 150 can be partially disposed in the metal cavity 20 and partially disposed outside the metal cavity 20. The resonant structure 140 is disposed in the metal cavity 20 between the electronic component 120 and the antenna unit 150. That is, the electronic component 120, the resonant structure 140, and the antenna unit 150 are sequentially disposed along the first direction, and the first direction is the direction in which the electronic component 120 points to the antenna unit 150 along the surface of the metal cavity 20. It should be understood that the electronic component 120, the resonant structure 140, and the antenna unit 150 can be staggered along the first direction and do not necessarily lie on a straight line. Alternatively, the antenna unit 150 can be a bezel antenna or an FPC antenna, and when the antenna unit 150 is an FPC antenna, it can be disposed along the bezel.

[0066] Alternatively, the electronic component 120 can be a connection line in the electronic device, connected between other electronic components and the PCB 17, and used to power other electronic components. For example, the electronic component 120 can be MIPI (e.g., MIPI 18), used to connect the PCB 17 to power the display screen 15, as Figure 3As shown. Alternatively, electronic component 120 can be a connecting wire for camera module 111, used to electrically connect camera module 111 to PCB 17, such as... Figure 4 As shown. Alternatively, electronic component 120 could also be other power components on PCB 17 that would generate interference, and this application does not limit this to such components.

[0067] It should be understood that when electronic component 120 transmits electrical signals, the resulting interference signals are transmitted to antenna element 150 via metal cavity 20, affecting the performance of antenna element 150. For the sake of simplicity in the following embodiments, the end of resonant structure 140 within metal cavity 20 closest to electronic component 120 can be considered as first port 101, and the end of resonant structure 140 within metal cavity 20 closest to antenna element 150 as second port 102. A simplified model is that first port 101 transmits interference signals to second port through the metal cavity formed by the metal layer within the electronic device. Figure 3 and Figure 4 The electronic device shown has a mid-frame and a metal cavity 20 enclosed by the first metal layer that are equivalent to, as follows: Figure 5 The metal cavity shown, wherein, Figure 5 (a) in the diagram is a three-dimensional structural diagram of the metal cavity. Figure 5 (b) is a top view of the metal cavity. The direction from the first port to the second port is the transmission direction of the interference signal. The first or second port can be located in the middle of the metal cavity or at its edge (e.g., near the side).

[0068] It should be understood that, for the sake of brevity, the embodiments of this application only use the metal cavity 20 formed between the middle frame and the display screen and the metal cavity 20 formed between the middle frame and the PCB as examples for illustration. Figure 3 and Figure 4 As shown. An electronic device may include multiple second metal layers, which may form a metal cavity, or the multiple second metal layers may form different metal cavities with the first metal layer. This application only uses the mid-frame as the second metal layer for illustration. The second metal layer may also be the metal layer of the battery, FPC traces, display screen, or PCB within the electronic device; this application does not impose any limitations on this. Alternatively, the mid-frame of the electronic device may have a recess corresponding to the battery, and the battery may be disposed in the recess. The second metal layer may be composed of both the mid-frame and the battery. Meanwhile, the first or second metal layer may be any component or structure with a metal surface within the electronic device. In some embodiments, because the first and second metal layers are different in size or shape, the shape of the enclosed metal cavity may not be regular; it may be a cuboid, a triangular prism, or an irregular shape, etc.

[0069] like Figure 5As shown, in some embodiments, the resonant structure 140 can include a dielectric layer 141 and a first metal piece 142.

[0070] The dielectric layer 141 can be arranged in the metal cavity 20, and the first metal piece 142 can be arranged on the dielectric layer 141. The dielectric layer 141 provides support for the first metal piece, and can also make the first metal piece 142 have a certain height. The first metal piece 142 can be arranged to be grounded. The dielectric layer 141 includes a first surface and a second surface. The first surface and the second surface can be external surfaces of the dielectric layer 141, or the first surface can be a cross section inside the dielectric layer 141. The first surface and the second surface can be opposite surfaces, or can be surfaces in contact with each other. The dielectric layer 141 can be fixed to the metal cavity through the second surface, for example, the dielectric layer 141 can be fixed to any wall of the metal cavity through the second surface. In Figure 5 The first surface is a surface facing the metal layer 130, and the first surface is a surface facing the middle frame 19.

[0071] Optionally, the first metal piece 142 arranged to be grounded can be considered as the first metal piece 142 being electrically connected to any metal wall (grounded metal) of the metal cavity 20, for example, the middle frame or the first metal layer, or the bezel on the middle frame. Alternatively, the first metal piece 142 can also be electrically connected to other grounded metals in the electronic device to achieve grounding. Arranging the first metal piece 142 to be grounded can effectively improve the reflection ability of the first metal piece 142 to electromagnetic waves. In an embodiment, the resonant structure 140 is connected to the grounded metal through a single-point grounding connection, that is, the resonant structure 140 is connected through only one point, which can effectively avoid the inconsistency caused by a large number of point grounding connections or large-area grounding connections, and improve the reflection ability. The contact area of the single-point grounding connection can be less than or equal to 50 square millimeters, for example, 10 square millimeters. In other embodiments, the resonant structure 140 can also be grounded through fewer points, for example, 2, 3, 4, or 5 points.

[0072] Optionally, the resonant structure 140 can further include a first connecting piece 143. The first end of the first connecting piece 143 is electrically connected to the first metal piece 142, and the second end is grounded. Through the first connecting piece 143, the resonant structure 140 can conveniently achieve a single-point grounding connection. The first end of the first connecting piece 143 is connected to one point of the resonant structure 140, and the second end of the first connecting piece 143 is grounded through one point.

[0073] Optionally, the resonant structure 140 can be arranged at any position in the metal cavity 20. For example, as shown in the scenario, the resonant structure 140 can be arranged on the first metal layer, or can also be arranged on the surface of the middle frame opposite to the first metal layer, or can also be arranged on the bezel, and the present application does not limit this. Figure 3 As shown in the scenario, the resonant structure 140 can be arranged on the first metal layer, or can also be arranged on the surface of the middle frame opposite to the first metal layer, or can also be arranged on the bezel, and the present application does not limit this.

[0074] Optionally, the first connecting member 143 can be a metal via, silver paste, conductive foam, conductive glue, etc. to ensure that the first metal member 142 can be electrically connected to the ground and can be conveniently connected to the ground at a single point, thereby improving the reflection effect.

[0075] Optionally, the dielectric layer 141 can be arranged on any surface of the metal cavity 20. In the embodiment shown in Figure 3 and Figure 4 , the surface can be the surface of the first metal layer or the surface of the middle frame. It should be understood that when the first metal layer is the metal layer of the PCB, the dielectric layer 141 can be arranged on the surface of the PCB.

[0076] Optionally, the first metal member 142 can have a rectangular structure, an open ring structure, a T-shaped structure, an L-shaped structure or other structures, and the present application does not limit the same. For the convenience of introduction, the embodiment of the present application takes the first metal member 142 as an example to illustrate the rectangular structure. The first metal member 142 can be arranged along the first direction or can be arranged along a direction perpendicular to the first direction. The arrangement can be made according to the actual design or production needs, which is more flexible.

[0077] Figure 6 is a structural schematic diagram of the resonant structure provided by the embodiment of the present application.

[0078] As shown in Figure 6 , the dielectric layer 141 can include a first dielectric layer 1411 and a second dielectric layer 1412, and the first metal member 142 can be arranged between the first dielectric layer 1411 and the second dielectric layer 1412. It should be understood that the greater the distance H between the first metal member 142 and the metal cavity 20, i.e. the greater the thickness of the first dielectric layer 1411, the wider the working bandwidth of the resonant structure 140.

[0079] Optionally, the materials of the first dielectric layer 1411 and the second dielectric layer 1412 can be different. The first dielectric layer 1411 can be insulating glue for fixing the resonant structure in the metal cavity 20. The second dielectric layer 1412 can be plastic for providing support for the first metal member 142 during preparation. It should be understood that since the materials of the first dielectric layer 1411 and the second dielectric layer 1412 are different, the physical size of the first metal member 142 will also change.

[0080] Optionally, as shown in Figure 6As shown in (a), the resonant structure can be fixed inside the metal cavity 20 by welding. Specifically, after the first metal component 142, the first dielectric layer 1411, and the second dielectric layer 1412 are prepared, they are placed on any inner surface of the metal cavity 20 and spot-welded, with the weld point electrically connected to the first metal component 142. In this case, the first connector 143 can be a weld point. This approach eliminates the need for separate fixing of the resonant structure, making it simpler.

[0081] Optionally, the first connector 143 can be electrically connected to the first metal part 142 at any position, which can be selected according to actual production or design. For example, the first connector 143 can be electrically connected to one end of the first metal part 142, or it can be electrically connected to it between the two ends. It should be understood that when the first connector 143 is electrically connected to one end of the first metal part 142, the resonant structure can operate in a single frequency band; when the first connector 143 is electrically connected to it between the two ends of the first metal part 142, the resonant structure can operate in two frequency bands, and the operating frequencies of the two frequency bands can be adjusted by adjusting the position of the electrical connection point.

[0082] Optionally, such as Figure 6 As shown in (b), the first connector 143 can be conductive foam. During the fabrication of the resonant structure, the first metal part 142 can be etched or printed on the second dielectric layer 1412, which provides support for the first metal part 142. Then, insulating adhesive is sprayed onto the surface of the first metal part 142, leaving space for the connection between the first connector 143 and the first metal part 142. At this point, the first dielectric layer 1411 is an insulating adhesive. The first connector 143 is placed at the reserved position, and then the first dielectric layer 1411 is adhered to the surface of the metal cavity 20. This approach is cost-effective. Furthermore, because the conductive foam is elastic, the surface of the conductive foam in contact with the metal cavity can be higher than the second dielectric layer during fabrication, ensuring a good electrical connection between the first connector 143 and the metal cavity 20.

[0083] Optionally, such as Figure 6 As shown in (b), the dielectric layer 141 may further include a third dielectric layer 1413, which is an insulating adhesive. In this case, the first dielectric layer 1411 and the second dielectric layer 1412 can be made of the same material, namely plastic, which can fix the resonant structure on the surface of the metal cavity 20. In this case, the resonant structure is a stripline, which can further reduce the size of the resonant structure.

[0084] Figure 7 and Figure 8 yes Figure 5 The image shows a simulation of the metal cavity. Among them, Figure 7 yesFigure 5 S-parameter plot of the metal cavity shown. Figure 8 is Figure 5 Current distribution plot of the metal cavity shown.

[0085] It should be understood that, as Figure 7 shown, is an S-parameter plot, where S11 is the input reflection coefficient, that is, the input return loss, which is specifically the reflection coefficient of the first port when the second port is matched. S22 is the output reflection coefficient, that is, the output return loss, which is specifically the reflection coefficient of the second port when the first port is matched. S12 is the reverse transmission coefficient, that is, the isolation, which is specifically the reflection coefficient of the second port to the first port when the first port is matched.

[0086] As Figure 7 shown, in the process of the electrical signal being transmitted from the first port to the second port, after passing through the resonant structure, at a specific frequency band, the electrical signal cannot be transmitted to the second port, and the electrical signal is mostly reflected back to the first port. At this time, when the characteristic appears at a specific frequency band, the resonant structure is a reflective resonant structure, which suppresses the transmitted energy by reflection of electromagnetic waves.

[0087] It should be understood that, as Figure 7 shown, in the S-parameter plot of the metal cavity, two resonances are generated, at 1.6 GHz and 4.8 GHz, respectively. It should be understood that the resonance mode corresponding to 1.6 GHz is the fundamental mode, and the resonance mode corresponding to 4.8 GHz is the high-order mode. The embodiments of the present application only take 1.6 GHz as an example for description, and in actual production and design, the high-order mode can be applied to prevent the influence of the interference of the frequency band corresponding to the high-order mode on the radiation performance of the antenna unit, and the present application does not limit this.

[0088] Optionally, the length of the first metal piece 142 can be about one quarter of the working wavelength corresponding to the working frequency band of the resonant structure. The working wavelength corresponding to the working frequency band of the resonant structure can refer to the working wavelength corresponding to the resonance point at which the resonant structure generates resonance, or can also refer to the working wavelength corresponding to the center frequency of the working frequency band.

[0089] Optionally, the length of the first metal piece 142 can be between 1 mm and 30 mm.

[0090] Figure 8 The current plot of the metal cavity shown in Figure 5 is the current plot of the metal cavity at each frequency point. Among them, Figure 8 (a) in is the current distribution plot when the frequency of the transmitted electrical signal is 0.9 GHz. Figure 8 (b) in is the current distribution plot when the frequency of the transmitted electrical signal is 1.62 GHz. Figure 8(c) is the current distribution diagram when the frequency of the transmitted electrical signal is 2.0 GHz. Figure 8 (d) is the current distribution diagram when the frequency of the transmitted electrical signal is 2.7 GHz. Figure 8 (e) is the current distribution diagram when the frequency of the transmitted electrical signal is 3.3 GHz. Figure 8 (f) is the current distribution diagram when the frequency of the transmitted electrical signal is 4.5 GHz. Figure 8 (g) is the current distribution diagram when the frequency of the transmitted electrical signal is 5.2 GHz. Figure 8 (h) is the current distribution diagram when the frequency of the transmitted electrical signal is 5.8 GHz.

[0091] As shown in Figure 8 , the transmission of energy at a specific frequency point is obviously inhibited, and for the selected frequency points, the electromagnetic wave or other electrical signal generated by the antenna unit can be transmitted through without being affected by the resonant structure. Therefore, in the electronic device, the resonant structure corresponding to the frequency of the electrical signal interfering with the antenna unit can be designed, so that when the interfering signal is transmitted in the direction of the antenna unit, it is reflected and cannot be transmitted to the antenna unit, effectively improving the radiation performance of the antenna unit.

[0092] Figure 9 is a schematic diagram of the resonant structure provided by the embodiment of the present application in the metal cavity being arranged at different positions.

[0093] As shown in Figure 9 (a), the resonant structure can be arranged at a position close to the second port in the metal cavity 20, i.e. close to the antenna unit. As shown in Figure 9 (b), the resonant structure can be arranged at a position close to the first port in the metal cavity 20, i.e. close to the electronic element.

[0094] Figure 10 is the S parameter diagram of the metal cavity shown in Figure 9 . Among them, Figure 10 (a) corresponds to the metal cavity shown in Figure 9 (a). Figure 10 (b) corresponds to the metal cavity shown in Figure 9 (b).

[0095] As shown in Figure 10 , when the resonant structure is arranged at different positions in the metal cavity 20, the transmission effect of the equivalent metal cavity hardly changes, so when the resonant structure is selected, a more appropriate position can be selected according to the specific layout inside the electronic device, and it does not need to be fixed at a position, and its arrangement is more flexible.

[0096] Figure 11 is another structure schematic diagram of the metal cavity provided by the embodiment of the present application.

[0097] As shown in Figure 11 , the resonant structure 140 can further include a second metal piece 242 and a second connecting piece 243. The dielectric layer 141 further includes a third surface, and the second metal piece 242 is disposed on the third surface. The third surface can be an outer surface or a section surface of the dielectric layer 141, and the third surface and the second surface can be the same surface.

[0098] The second metal piece 242 is disposed on the dielectric layer 141, and the dielectric layer 141 can provide support for the second metal piece 242. The first end of the second connecting piece 243 is electrically connected to the second metal piece 242, and the second end is electrically connected to the metal cavity 20.

[0099] Optionally, the size of the first metal piece 142 can be the same as the size of the second metal piece 242, which can expand the corresponding working frequency band of the resonant structure.

[0100] In an embodiment, at least part of the first metal piece 142 or / and at least part of the second metal piece 242 extends in the first direction to better reflect the electromagnetic waves of the interference element. Optionally, the first metal piece 142 can be disposed in parallel with the second metal piece 242, for example, the first metal piece 142 and the second metal piece 242 can both extend along the first direction.

[0101] Optionally, the second metal piece 242 can be a rectangular structure, an open ring structure, a T-shaped structure, an L-shaped structure or other structures, which are not limited in the present application. For the convenience of introduction, the embodiment of the present application takes the second metal piece 242 as a rectangular structure as an example for description.

[0102] Figure 12 As shown in Figure 11 , the S parameter diagram of the metal cavity.

[0103] As shown in Figure 12 , during the transmission of the electrical signal from the first port to the second port, after passing through the resonant structure, the electrical signal cannot be transmitted to the second port at a specific frequency band, and the electrical signal is mostly reflected back to the first port. At this time, the resonant structure is a reflective resonant structure when the characteristic appears at a specific frequency band, and the transmission energy is suppressed by reflection of the electromagnetic wave.

[0104] Figure 13 As shown in Figure 14 , the structure diagram of another metal cavity provided by the embodiment of the present application and the corresponding S parameter diagram thereof.

[0105] As shown in Figure 13 , the first metal piece 142 can be disposed perpendicularly to the second metal piece 242, that is, it can be considered that the second metal piece 242 is disposed along the second direction. The second direction is a direction perpendicular to the first direction in the surface of the metal cavity where the resonant structure is located.

[0106] As shown in FIG. 2, when the first metal piece 142 and the second metal piece 242 are arranged vertically, the transmission effect of the equivalent metal cavity is almost unchanged. Therefore, when arranging the first metal piece 142 and the second metal piece 242 in the resonant structure, a more appropriate arrangement mode can be selected according to the specific layout inside the electronic device, and the arrangement mode is more flexible. Figure 14

[0107] Figure 15 FIG. 3 is another structural schematic diagram of a metal cavity provided by an embodiment of the present application.

[0108] As shown in FIG. 3, the distance L of the first connection point and the second connection point along the first direction can be adjusted, so as to adjust the relative positions of the first metal piece 142 and the second metal piece 242. Figure 15 The first connection point is the connection point of the first connecting piece 143 and the first metal piece 142, i.e., the grounding point of the first metal piece 142. The second connection point is the connection point of the second connecting piece 243 and the second metal piece 242, i.e., the grounding point of the second metal piece 242. The first direction is the direction of the electronic element pointing to the antenna unit (the direction of the connecting line of the electronic element and the antenna unit), i.e., the direction of the first port pointing to the second port, or it can also be considered as the length direction of the metal cavity 20.

[0109]

[0110] FIG. 4 is the S parameter diagram of the metal cavity corresponding to different values of L in FIG. 3. In FIG. 4, Figure 16 (a) in FIG. 4 is the S parameter diagram when L=15 mm. Figure 15 (b) in FIG. 4 is the S parameter diagram when L=35 mm. Figure 16 (c) in FIG. 4 is the S parameter diagram when L=60 mm. Figure 16 Figure 16 As shown in FIG. 3, when the distance L of the first connection point and the second connection point along the first direction is less than one fourth of the working wavelength corresponding to the working frequency band of the resonant structure, the transmission effect of the equivalent metal cavity is almost unchanged. When the distance L of the first connection point and the second connection point along the first direction is greater than or equal to one fourth of the working wavelength corresponding to the working frequency band of the resonant structure, the first metal piece and the second metal piece can respectively produce two resonances, respectively covering different frequency bands. Therefore, the distance between the first connection point and the second connection point can be adjusted according to actual production or design needs, so as to obtain different transmission effects. When the distance L between the first connection point and the second connection point is less than one fourth of the working wavelength corresponding to the working frequency band of the resonant structure, a more appropriate arrangement mode can be selected according to the specific layout inside the electronic device, and the arrangement mode is more flexible.

[0111] As shown in FIG. 3, when the distance L of the first connection point and the second connection point along the first direction is less than one fourth of the working wavelength corresponding to the working frequency band of the resonant structure, the transmission effect of the equivalent metal cavity is almost unchanged. When the distance L of the first connection point and the second connection point along the first direction is greater than or equal to one fourth of the working wavelength corresponding to the working frequency band of the resonant structure, the first metal piece and the second metal piece can respectively produce two resonances, respectively covering different frequency bands. Therefore, the distance between the first connection point and the second connection point can be adjusted according to actual production or design needs, so as to obtain different transmission effects. When the distance L between the first connection point and the second connection point is less than one fourth of the working wavelength corresponding to the working frequency band of the resonant structure, a more appropriate arrangement mode can be selected according to the specific layout inside the electronic device, and the arrangement mode is more flexible. Figure 16 As shown in FIG. 3, when the distance L of the first connection point and the second connection point along the first direction is less than one fourth of the working wavelength corresponding to the working frequency band of the resonant structure, the transmission effect of the equivalent metal cavity is almost unchanged. When the distance L of the first connection point and the second connection point along the first direction is greater than or equal to one fourth of the working wavelength corresponding to the working frequency band of the resonant structure, the first metal piece and the second metal piece can respectively produce two resonances, respectively covering different frequency bands. Therefore, the distance between the first connection point and the second connection point can be adjusted according to actual production or design needs, so as to obtain different transmission effects. When the distance L between the first connection point and the second connection point is less than one fourth of the working wavelength corresponding to the working frequency band of the resonant structure, a more appropriate arrangement mode can be selected according to the specific layout inside the electronic device, and the arrangement mode is more flexible.​​

[0112] Optionally, when the electronic component is a MIPI connector for the display screen, and the distance L between the first connection point and the second connection point along the first direction is greater than 40mm, the first metal component and the second metal component can generate two resonances respectively, covering different frequency bands.

[0113] It should be understood that, in this case, the operating wavelength corresponding to the operating frequency band of the resonant structure can be considered as the operating wavelength corresponding to the resonant point of the resonance generated by the first metal component, or the operating wavelength corresponding to the resonant point of the resonance generated by the second metal component, or the operating wavelength corresponding to the center frequency of the operating frequency band of the resonant structure.

[0114] Figure 17 yes Figure 15 The current distribution diagram corresponding to L = 60mm. Among them, Figure 17 (a) in the figure is the current distribution diagram when the frequency of the transmitted electrical signal is 1.53 GHz. Figure 17 (b) in the diagram shows the current distribution when the frequency of the transmitted electrical signal is 1.66 GHz.

[0115] Figure 17 The current distribution shown in (a) is dominated by the resonance generated by the first metal component. Figure 17 The current distribution shown in (b) is dominated by the resonance generated by the second metal component.

[0116] It should be understood that both the first and second metal components operate in quarter-mode. When the dimensions of the first and second metal components are the same, and the distance L between the first and second connection points is less than one-quarter of the operating wavelength corresponding to the operating frequency band of the resonant structure, the frequency bands corresponding to the resonances generated by the first and second metal components partially overlap. Therefore, the resonant points of the resonances generated by the first and second metal components are both included in the same operating frequency band of the resonant structure, which can extend the operating bandwidth of the resonant structure. However, when the distance L between the first and second connection points along the first direction is greater than or equal to one-quarter of the operating wavelength corresponding to the operating frequency band of the resonant structure, the frequency bands corresponding to the resonances generated by the first and second metal components do not overlap. Therefore, two operating frequency bands will appear on the S-parameter diagram, allowing the operating bandwidth of the resonant structure to include different frequency bands.

[0117] Figure 18 This is a schematic diagram of another metal cavity structure provided in an embodiment of this application.

[0118] like Figure 18 As shown, the width W1 of the first metal part 142 and the width W2 of the second metal part 242 can be different. For the sake of brevity, this embodiment of the application uses W1>W2 as an example for illustration, but it does not impose any limitations on it.

[0119] It should be understood that as the width W1 of the first metal component 142 or the width W2 of the second metal component 242 changes, the resonant point of the corresponding resonance will also change. When the width increases, the corresponding resonant point will shift to a lower frequency; when the width decreases, the corresponding resonant point will shift to a higher frequency. The width W1 of the first metal component 142 or the width W2 of the second metal component 242 can be adjusted according to actual production or design needs so that the operating frequency band of the resonant structure can cover the frequencies of interference signals, thereby improving the radiation performance of the antenna element.

[0120] Figure 19 and Figure 20 yes Figure 18 The image shows a simulation of the metal cavity. Among them, Figure 19 yes Figure 18 The S-parameter diagram of the metal cavity is shown. Figure 20 yes Figure 18 The current distribution diagram of the metal cavity is shown. Figure 20 (a) in the figure is the current distribution diagram when the frequency of the transmitted electrical signal is 1.318 GHz. Figure 20 (b) in the diagram shows the current distribution when the frequency of the transmitted electrical signal is 1.58 GHz.

[0121] like Figure 19 As shown, when the width W1 of the first metal component 142 and the width W2 of the second metal component 242 are different, the first metal component and the second metal component can generate two resonances respectively, covering different frequency bands. Therefore, the width W1 of the first metal component or the width W2 of the second metal component can be adjusted according to actual production or design needs to obtain different transmission effects.

[0122] like Figure 20 As shown, Figure 20 The current distribution shown in (a) is dominated by the resonance generated by the first metal component. Figure 20 The current distribution shown in (b) is dominated by the resonance generated by the second metal component.

[0123] Figure 21 This is a schematic diagram of another metal cavity structure provided in an embodiment of this application.

[0124] like Figure 21 As shown, the first metal part 142 may include a first branch 1421 and a second branch 1422.

[0125] The first branch 1421 and the second branch 1422 can be electrically connected, the first end of the first connecting piece 143 is electrically connected with the first branch 1421, and the second end of the first connecting piece 143 is electrically connected with the metal cavity 20. Since the first branch 1421 and the second branch 1422 can be used as different resonant units respectively, they work in different frequency bands. Therefore, the resonant structure can work in multiple different frequency bands, that is, the influence of the interference signal on the radiation performance of the antenna unit can be prevented in multiple frequency bands.

[0126] Optionally, the first branch 1421 can be one of a rectangular branch, an open loop type branch, a T-shaped branch or an L-shaped branch.

[0127] Optionally, the second branch 1422 can be at least one of a rectangular branch, an open loop type branch, a T-shaped branch or an L-shaped branch.

[0128] Optionally, the electronic device further includes a third connecting piece 343, the first end of the third connecting piece 343 is electrically connected with the first branch 1421, and the second end is electrically connected with the metal cavity 20. Since the third connecting piece 343, for the first metal piece 142, adds another grounding point, provides better grounding characteristics for the first metal piece 142, and can also change the current distribution and the corresponding working frequency band.

[0129] It should be understood that, for the sake of brevity, the first branch 1421 is taken as an open loop type branch, and the second branch 1422 includes a T-shaped branch and two L-shaped branches in the embodiments of the present application. The T-shaped branch and the L-shaped branches can be arranged in the area surrounded by the open loop type branch, and the two L-shaped branches are located on the two sides of the T-shaped branch.

[0130] Figure 22 and Figure 23 is Figure 21 a simulation effect diagram of the metal cavity shown in FIG. 14B. In the diagram, Figure 22 is Figure 21 a S parameter diagram of the metal cavity shown in FIG. 14B. Figure 23 is Figure 21 a current distribution diagram of the metal cavity shown in FIG. 14B. Figure 23 (a) in FIG. 14B is a current distribution diagram when the frequency of the transmitted electrical signal is 1.56 GHz. Figure 23 (b) in FIG. 14B is a current distribution diagram when the frequency of the transmitted electrical signal is 2.12 GHz. Figure 23 (c) in FIG. 14B is a current distribution diagram when the frequency of the transmitted electrical signal is 2.46 GHz. Figure 23 (d) in FIG. 14B is a current distribution diagram when the frequency of the transmitted electrical signal is 4.5 GHz.

[0131] As Figure 22As shown, since the first metal piece includes multiple resonance branches, different resonance branches can generate resonances with different frequency points, and the resonant structure can work at different frequency bands.

[0132] For the open loop type branch, the T type branch and the L type branch, the frequency corresponding to the base mode can be 1.56GHz, 2.12GHz and 2.46GHz respectively, and the high order mode of the open loop type branch can correspond to 4.5GHz.

[0133] As shown in (a) of FIG. 6, the current distribution of the resonant structure is mainly generated by the open loop type branch. Figure 23 As shown in (b) of FIG. 6, the current distribution of the resonant structure is mainly generated by the T type branch. Figure 23 As shown in (c) of FIG. 6, the current distribution of the resonant structure is mainly generated by the L type branch. Figure 23 As shown in (d) of FIG. 6, the current distribution of the resonant structure is mainly generated by the open loop type branch. Figure 23 Figure 23 In the above embodiments, the metal in the resonant structure (including the first metal piece and the second metal piece) does not block the metal cavity, that is, the metal in the resonant structure only occupies part of the space of the metal cavity, and the path for the electromagnetic wave to propagate from the first port to the second port is reserved, so that the signal of the antenna unit can pass through the metal cavity to better communicate.

[0134] It should be understood that for the embodiments of the present application, the first metal piece with different shapes and different sizes can be set according to the actual frequency of the interference signal to prevent the interference signal from interfering with the antenna unit. Moreover, for the resonant structure, its setting position in the metal cavity formed inside the electronic device is not sensitive, and it has good robustness.

[0135] In several embodiments provided in the present application, it should be understood that the disclosed system, device and method can be implemented in other ways. For example, the above-described device embodiments are only schematic, for example, the division of the units is only a logical function division, and actual implementation can have another division manner, for example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. In addition, the coupling or direct coupling or communication connection between the units shown or discussed can be indirect coupling or communication connection through some interface, device or unit, and can be electrical or other forms.

[0136] In several embodiments provided in the present application, it should be understood that the disclosed system, device and method can be implemented in other ways. For example, the above-described device embodiments are only schematic, for example, the division of the units is only a logical function division, and actual implementation can have another division manner, for example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. In addition, the coupling or direct coupling or communication connection between the units shown or discussed can be indirect coupling or communication connection through some interface, device or unit, and can be electrical or other forms.

[0137] ​The above merely provides a specific implementation of the present application, but the protection scope of the present application is not limited thereto, any person skilled in the art can easily think of changes or replacements within the technical range disclosed by the present application, which should be covered in the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

[0138] An electronic device, comprising:

[0139] An electronic component, a middle frame, a metal layer, a resonant structure and an antenna unit; wherein,

[0140] The electronic component is arranged in a metal cavity, and the metal cavity is surrounded by the metal layer and the middle frame arranged oppositely;

[0141] The antenna unit is arranged on a side surface of the metal cavity;

[0142] The resonant structure is arranged in the metal cavity and located between the electronic component and the antenna unit;

[0143] The resonant structure comprises a dielectric layer and a first metal piece, the dielectric layer comprises a first surface and a second surface, the first metal piece is arranged on the first surface of the dielectric layer, the second surface of the dielectric layer is fixed in the metal cavity, and the first metal piece is electrically connected with the middle frame or the first metal layer.

[0144] The resonant structure further comprises a first conductive connecting piece.

[0145] A first end of the first connecting piece is electrically connected with the first metal piece, and a second end of the first connecting piece is electrically connected with the middle frame or the metal layer.

[0146] The electronic device further comprises a display screen.

[0147] The metal layer is a metal layer of the display screen.

[0148] The electronic component is a mobile industry processor interface (MIPI) electrically connected with the display screen.

[0149] The electronic device further comprises a printed circuit board (PCB).

[0150] The metal layer is a metal layer of the PCB.

[0151] The electronic component is a camera module.

[0152] Example 5. The electronic device of any of examples 1-4, the dielectric layer comprising a first dielectric layer and a second dielectric layer, the first metal piece disposed between the first dielectric layer and the second dielectric layer.

[0153] Example 6. The electronic device of example 5, the first dielectric layer and the second dielectric layer being of different materials.

[0154] Example 7. The electronic device of example 5 or 6, the first dielectric layer being an insulating glue, the first connecting piece being a conductive foam, the first connecting piece being fixed in the metal cavity through the first dielectric layer.

[0155] Example 8. The electronic device of any of examples 1-7, the resonant structure being fixed in the metal cavity by soldering, the first connecting piece being a soldering point.

[0156] Example 9. The electronic device of any of examples 1-8, the resonant structure further comprising:

[0157] a second metal piece and a second conductive connecting piece;

[0158] the dielectric layer comprising a third face, the second metal piece disposed on the third face of the dielectric layer, a first end of the second connecting piece electrically connected to the second metal piece, a second end of the second connecting piece electrically connected to the middle frame or the first metal layer.

[0159] Example 10. The electronic device of example 9,

[0160] a distance between the first connecting point and the second connecting point in a first direction being greater than or equal to 40 mm;

[0161] wherein the first connecting point is a connecting point of the first connecting piece and the first metal piece, the second connecting point is a connecting point of the second connecting piece and the second metal piece, and the first direction is a direction in which the electronic component points to the antenna unit.

[0162] Example 11. The electronic device of example 9 or 10, the first metal piece and the second metal piece being of different widths.

[0163] Example 12. The electronic device of any of examples 9-11, at least part of the first metal piece or / and at least part of the second metal piece extending in the first direction.

[0164] Example 13. The electronic device of any of examples 2-12,

[0165] the first metal piece comprising a first branch and a second branch.

[0166] The first branch and the second branch are electrically connected, a first end of the first connecting member is electrically connected with the first branch, and a second end of the first connecting member is electrically connected with the middle frame or the first metal layer.

[0167] In some embodiments, the electronic device further includes a third electrically conductive connecting member, a first end of the third connecting member is electrically connected with the first branch, and a second end of the third connecting member is electrically connected with the middle frame or the first metal layer.

[0168] In some embodiments, the electronic device further includes a third electrically conductive connecting member, a first end of the third connecting member is electrically connected with the first branch, and a second end of the third connecting member is electrically connected with the middle frame or the first metal layer.

[0169] The first branch is one of a rectangular branch, an open ring type branch, a T-shaped branch, or an L-shaped branch.

[0170] The second branch is at least one of a rectangular branch, an open ring type branch, a T-shaped branch, or an L-shaped branch.

[0171] In some embodiments, the first metal member does not partition the metal cavity.

[0172] In some embodiments, the electronic device further includes a third electrically conductive connecting member, a first end of the third connecting member is electrically connected with the first branch, and a second end of the third connecting member is electrically connected with the middle frame or the first metal layer.

[0173] In some embodiments, the electronic device further includes a third electrically conductive connecting member, a first end of the third connecting member is electrically connected with the first branch, and a second end of the third connecting member is electrically connected with the middle frame or the first metal layer.

[0174] The interference element is disposed in a metal cavity, and the metal cavity is surrounded by the first metal layer and the second metal layer disposed opposite to each other.

[0175] The antenna unit is disposed on a side of the metal cavity.

[0176] The resonant structure is disposed in the metal cavity and located between the interference element and the antenna unit.

[0177] The resonant structure includes a dielectric layer and a first metal member, the dielectric layer includes a first surface and a second surface, the first metal member is disposed on the first surface of the dielectric layer, the second surface of the dielectric layer is fixed in the metal cavity, and the first metal member is grounded.

[0178] In some embodiments, the resonant structure further includes a first electrically conductive connecting member.

[0179] A first end of the first connecting member is electrically connected with the first metal member, and a second end of the first connecting member is grounded.

[0180] Embodiment 19. The electronic device of any of embodiments 17-18, further comprising:

[0181] a display screen and a middle frame;

[0182] wherein the first metal layer is a metal layer of the display screen;

[0183] the second metal layer is the middle frame.

[0184] Embodiment 20. The electronic device of any of embodiments 17-18, further comprising:

[0185] a printed circuit board (PCB) and a middle frame;

[0186] wherein the first metal layer is a metal layer of the PCB;

[0187] the second metal layer is the middle frame.

[0188] Embodiment 21. The electronic device of any of embodiments 17-20, wherein the dielectric layer comprises a first dielectric layer and a second dielectric layer, and the first metal piece is disposed between the first dielectric layer and the second dielectric layer.

[0189] Embodiment 22. The electronic device of embodiment 21, wherein the first dielectric layer and the second dielectric layer are made of different materials.

[0190] Embodiment 23. The electronic device of any of embodiments 21-22, wherein the first dielectric layer is an insulating glue, the first connecting piece is a conductive foam, and the first connecting piece is fixed in the metal cavity through the first dielectric layer.

[0191] Embodiment 24. The electronic device of any of embodiments 17-23, wherein the resonant structure is fixed in the metal cavity by welding, and the first connecting piece is a welding point.

[0192] Embodiment 25. The electronic device of any of embodiments 17-27, wherein the resonant structure further comprises:

[0193] a second metal piece and a second conductive connecting piece;

[0194] the second metal piece is disposed on the dielectric layer, a first end of the second connecting piece is electrically connected to the second metal piece, and a second end of the second connecting piece is grounded.

[0195] Embodiment 26. The electronic device of embodiment 25,

[0196] a distance between the first connecting point and the second connecting point in a first direction is greater than or equal to 40 mm;

[0197] The first connecting point is a connecting point of the first connecting member and the first metal member, the second connecting point is a connecting point of the second connecting member and the second metal member, and the first direction is a direction in which the interference element points to the antenna unit.

[0198] Embodiment 27. The electronic device of any of embodiments 25-26, wherein the first metal member and the second metal member have different widths.

[0199] Embodiment 28. The electronic device of any of embodiments 25-27, wherein at least part of the first metal member or / and at least part of the second metal member extends in the first direction.

[0200] Embodiment 29. The electronic device of any of embodiments 18-28,

[0201] the first metal member includes a first branch and a second branch;

[0202] wherein the first branch and the second branch are electrically connected, a first end of the first connecting member is electrically connected to the first branch, and a second end of the first connecting member is grounded.

[0203] Embodiment 30. The electronic device of embodiment 29, further comprising a third electrically conductive connecting member, a first end of the third connecting member is electrically connected to the first branch, and a second end of the third connecting member is grounded.

[0204] Embodiment 31. The electronic device of embodiment 29,

[0205] the first branch is one of a rectangular branch, an open loop type branch, a T-shaped branch, or an L-shaped branch;

[0206] the second branch is at least one of a rectangular branch, an open loop type branch, a T-shaped branch, or an L-shaped branch.

[0207] Embodiment 32. The electronic device of any of embodiments 17-31, wherein the first metal member does not partition the metal cavity.

Claims

1. An electronic device, characterized in that, include: Display screen, electronic components, mid-frame, metal layer, resonant structure, and antenna unit; among which... The electronic component is disposed within a metal cavity, which is enclosed by the metal layer and the middle frame disposed opposite to each other. The antenna unit is disposed on the side of the metal cavity; The resonant structure is disposed within the metal cavity, the electronic component is located at the first end of the resonant structure, and the antenna unit is located at the second end of the resonant structure. The first end is the end of the resonant structure within the metal cavity that is closer to the electronic component, and the second end is the end of the resonant structure within the metal cavity that is closer to the antenna unit. The resonant structure includes a dielectric layer, a first metal component, and a second metal component. The dielectric layer includes a first surface and a second surface. The first metal component and the second metal component are disposed on the first surface of the dielectric layer. The second surface of the dielectric layer is fixed inside the metal cavity. The first metal component is electrically connected to the middle frame or the metal layer. The metal layer is disposed on the side of the display screen near the middle frame; The electronic component is a Mobile Industrial Processor Interface (MIPI) cable that is electrically connected to the display screen. The dimensions of the first metal part are the same as the dimensions of the second metal part; At least a portion of the first metal member and at least a portion of the second metal member extend in a first direction, the first direction being the direction in which the electronic component points toward the antenna unit; The resonant structure is a reflective resonant structure in the first frequency band. The resonant structure is configured such that the electrical signal in the first frequency band generated by the electronic component in the metal cavity is at least partially reflected back to the end where the electronic component is located after passing through the resonant structure.

2. The electronic device according to claim 1, characterized in that, The resonant structure also includes a first conductive connector; The first end of the first connector is electrically connected to the first metal part, and the second end of the first connector is electrically connected to the middle frame or the metal layer.

3. The electronic device according to claim 2, characterized in that, The dielectric layer includes a first dielectric layer and a second dielectric layer, and the first metal component is disposed between the first dielectric layer and the second dielectric layer.

4. The electronic device according to claim 3, characterized in that, The first dielectric layer and the second dielectric layer are made of different materials.

5. The electronic device according to claim 3 or 4, characterized in that, The first dielectric layer is an insulating adhesive, the first connector is a conductive foam, and the first connector is fixed inside the metal cavity through the first dielectric layer.

6. The electronic device according to claim 2, characterized in that, The resonant structure is fixed inside the metal cavity by welding, and the first connecting member is a solder joint.

7. The electronic device according to claim 2, characterized in that, The resonant structure also includes: A conductive second connector; The first end of the second connector is electrically connected to the second metal part, and the second end of the second connector is electrically connected to the metal cavity.

8. The electronic device according to claim 7, characterized in that, The distance between the first connection point and the second connection point along the first direction is greater than or equal to 40mm; Wherein, the first connection point is the connection point between the first connector and the first metal part, and the second connection point is the connection point between the second connector and the second metal part.

9. The electronic device according to claim 2, characterized in that, The first metal component includes a first branch, three second branches, and a conductive third connector; Wherein, the first branch and the three second branches are electrically connected, the first end of the first connector is electrically connected to the first branch, and the second end of the first connector is electrically connected to the metal cavity; The first end of the third connector is electrically connected to the first branch, and the second end of the third connector is electrically connected to the metal cavity; The first branch is an open ring-shaped branch, and the three second branches include two L-shaped branches and one T-shaped branch. The two L-shaped branches and the T-shaped branch are located in the area enclosed by the open ring-shaped branch, and the two L-shaped branches are located on both sides of the T-shaped branch.

10. The electronic device according to claim 9, characterized in that, The open-ring stub is used to generate the first resonance and the second resonance. The two L-shaped stubs and the T-shaped stub are used to generate a third resonance and a fourth resonance, the resonance point of the third resonance and the resonance point of the fourth resonance being located between the resonance point of the first resonance and the resonance point of the second resonance.

11. The electronic device according to any one of claims 1 to 10, characterized in that, The first metal component does not isolate the metal cavity.

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