Optical sensor and method of manufacturing an optical sensor

Abstract

A light sensor (10) includes a substrate (20) having a substrate main surface (21) intersecting a thickness direction (Z); a light emitting element (30) provided on the substrate main surface (21); a light receiving element (40) provided on the substrate main surface (21); a first cover member (50) having light transmissivity, which is provided on the substrate main surface (21) so as to cover the light emitting element (30); and a second cover member (60) having light transmissivity, which is provided on the substrate main surface (21) so as to cover the light receiving element (40). A gap (GP) is formed between the first cover member (50) and the second cover member (60).

Description

Technical Field

[0001] This invention relates to optical sensors and methods for manufacturing optical sensors. Background Technology

[0002] Patent Document 1 discloses a reflective optical sensor as an example of an optical sensor, comprising: a substrate with an electrode pattern formed thereon; a light-emitting diode (LED) disposed on the substrate; and an optical IC disposed on the substrate adjacent to the LED; an outer wall enclosing the LED and the optical IC as a single unit; and an inner wall separating the LED and the optical IC. This optical sensor reduces crosstalk by using a light-shielding wall to block diffused light emitted from the LED.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent document 1: Japanese Patent Application Publication No. 2007-13050. Summary of the Invention

[0006] The problem the invention aims to solve

[0007] However, there is still room for improvement in miniaturizing the aforementioned optical sensors. The object of this invention is to provide an optical sensor and a method for manufacturing the optical sensor that can reduce crosstalk and achieve miniaturization.

[0008] Technical means for solving problems

[0009] The technical means used to solve the above problems and their effects are explained below.

[0010] A light sensor for solving the above problems includes: a substrate having a main surface of a substrate intersecting the thickness direction; a light-emitting element disposed on the main surface of the substrate; a light-receiving element disposed on the main surface of the substrate; a first cover having light transmittance disposed on the main surface of the substrate to cover the light-emitting element; and a second cover having light transmittance disposed on the main surface of the substrate to cover the light-receiving element, with a gap formed between the first cover and the second cover.

[0011] In the optical sensor, a gap is provided between a first cover covering the light-emitting element and a second cover covering the light-receiving element. Therefore, compared to a case where no gap is provided between the first and second covers, the optical sensor can reduce the amount of light from the light-emitting element toward the light-receiving element without being reflected by objects. In other words, the optical sensor can reduce crosstalk. Furthermore, the optical sensor does not require a light-shielding wall between the first and second covers, which facilitates the miniaturization of the device.

[0012] The effects of the invention

[0013] Based on the aforementioned optical sensor, crosstalk can be reduced and miniaturization can be achieved. Attached Figure Description

[0014] Figure 1 This is a top view of the optical sensor according to the first embodiment.

[0015] Figure 2 This is a side view of the light sensor according to the first embodiment.

[0016] Figure 3 This is a side view of the light sensor according to the first embodiment.

[0017] Figure 4 This is a manufacturing process diagram of the optical sensor according to the first embodiment.

[0018] Figure 5 This is a top view of the intermediate body used in manufacturing the optical sensor of the first embodiment.

[0019] Figure 6 This is a side view of the intermediate body used in manufacturing the optical sensor of the first embodiment.

[0020] Figure 7 This is a schematic diagram showing a portion of the cut surface of the optical sensor according to the first embodiment.

[0021] Figure 8 This is a side view used to illustrate the function of the optical sensor in the comparative example.

[0022] Figure 9 This is a side view used to illustrate the function of the optical sensor in the first embodiment.

[0023] Figure 10 This is a side view of the light sensor according to the second embodiment.

[0024] Figure 11 This is a side view of the optical sensor of a modified example of the second embodiment.

[0025] Figure 12 This is a side view of the optical sensor of a modified example of the second embodiment.

[0026] Figure 13 This is a side view of the light sensor according to the third embodiment.

[0027] Figure 14 This is a side view of the light sensor according to the fourth embodiment.

[0028] Figure 15 This is a side view of the optical sensor of a modified example of the fourth embodiment.

[0029] Figure 16This is a top view of a modified optical sensor.

[0030] Figure 17 This is a side view of a modified optical sensor.

[0031] Figure 18 This is a side view of a modified optical sensor. Detailed Implementation

[0032] Hereinafter, various embodiments of the optical sensor will be described with reference to the accompanying drawings. The embodiments described below illustrate structures and methods for realizing the technical concept; the materials, shapes, structures, arrangements, and dimensions of the constituent components are not limited to those described below. Various modifications can be made to the embodiments described below.

[0033] (First Embodiment)

[0034] The light sensor 10 of the first embodiment will be described. The light sensor 10 is used to detect objects at a close distance of about 6 mm from the light sensor 10. As an example, the light sensor 10 is applied to wearable devices such as headphones. In this case, the object to be detected is a human body or the inner wall of a case containing the wearable device.

[0035] like Figure 1 and Figure 2 As shown, the light sensor 10 includes a substrate 20, a light-emitting element 30, a light-receiving element 40, a first cover 50, a second cover 60, and bonding lines 71 and 72. Figure 1 The following figures show the first cover 50 and the second cover 60 in perspective.

[0036] The light sensor 10 is a rectangular plate. In the following description, the orientation defined according to the shape of the light sensor 10 will be used. In detail, the thickness direction of the light sensor 10 is called the "thickness direction Z", the direction orthogonal to the thickness direction Z is called the "first direction X", and the direction orthogonal to both the thickness direction Z and the first direction X is called the "second direction Y".

[0037] The length of the light sensor 10 in the thickness direction Z is preferably 0.3 mm or more and 0.55 mm or less, and in the first embodiment, it is 0.55 mm. The length of the light sensor 10 in the first direction X and the second direction Y is preferably 0.5 mm or more and 1.0 mm or less, and in the first embodiment, it is 1.0 mm. That is, the light sensor 10 has a square shape when viewed from above in the thickness direction Z.

[0038] like Figure 1 and Figure 2As shown, the substrate 20 is a rectangular plate. The material of the substrate 20 can be, for example, ceramics such as alumina and aluminum nitride, or silicon, or glass epoxy resin, etc.

[0039] The substrate 20 has: a main substrate surface 21 intersecting the thickness direction Z; and a side substrate surface 22 extending from the outer edge of the main substrate surface 21 in the thickness direction Z. The side substrate surface 22 is composed of four surfaces, including a first side substrate surface 221, a second side substrate surface 222, a third side substrate surface 223, and a fourth side substrate surface 224. Figure 1 As shown, the first substrate side surface 221 and the fourth substrate side surface 224 extend along the first direction X, and the second substrate side surface 222 and the third substrate side surface 223 extend along the second direction Y. The second substrate side surface 222 and the third substrate side surface 223 connect the first substrate side surface 221 and the fourth substrate side surface 224.

[0040] A recessed groove 23 extending along the second direction Y is formed on the main surface 21 of the substrate. The groove 23 extends linearly from one end of the main surface 21 in the second direction Y to the other end, dividing the main surface 21 into a first region A1 and a second region A2. That is, the long side of the groove 23 is in the second direction Y, and the width direction of the groove 23 is in the first direction X. The groove 23 is formed at a position slightly offset from the center of the main surface 21 in the first direction X. That is, the groove 23 is formed in the first direction X at a position closer to the second substrate side surface 222 than the third substrate side surface 223. The cross-sectional shape of the groove 23 orthogonal to the second direction Y can be a semi-circular shape or a rectangular shape.

[0041] Viewed from above along the thickness direction Z, region A1 is a rectangle with its shorter side in the first direction X and its longer side in the second direction Y. Similarly, region A2 is also a rectangle with its shorter side in the first direction X and its longer side in the second direction Y. In the first direction X, the length of region A1 is shorter than that of region A2, while in the second direction Y, the lengths of region A1 and A2 are the same. Therefore, when viewed from above along the thickness direction Z, the area of ​​region A1 is smaller than the area of ​​region A2.

[0042] A first pad 211, a second pad 212, a third pad 213, and a fourth pad 214 formed of conductors are formed on the main surface 21 of the substrate. The first pad 211, the second pad 212, the third pad 213, and the fourth pad 214 are formed in a rectangular plate shape. When viewed from above in the thickness direction Z, the first pad 211 is formed to be the same size as the second pad 212, and is smaller than the other pads 213 and 214. On the other hand, when viewed from above in the thickness direction Z, the fourth pad 214 is formed to be larger than the other pads 211 to 213. The first pad 211 and the second pad 212 are formed in a first region A1, and the third pad 213 and the fourth pad 214 are formed in a second region A2. That is, in the main surface 21 of the substrate, the first pad 211, the second pad 212, the third pad 213, and the fourth pad 214 are respectively formed on both sides of the groove 23.

[0043] like Figure 1 As shown, the first pad 211 is formed closer to the first substrate side 221 than the fourth substrate side 224, and the second pad 212 is formed closer to the fourth substrate side 224 than the first substrate side 221. On the other hand, the third pad 213 is formed closer to the first substrate side 221 than the fourth substrate side 224, and the fourth pad 214 is formed closer to the fourth substrate side 224 than the first substrate side 221.

[0044] Furthermore, the first pad 211 and the third pad 213 are formed to at least partially overlap in the first direction X, and the second pad 212 and the fourth pad 214 are formed to at least partially overlap in the first direction X. The first pad 211 and the second pad 212 are formed to completely overlap in the second direction Y, and the third pad 213 and the fourth pad 214 are formed to completely overlap in the second direction Y. That is, the first pad 211 and the second pad 212 are arranged along the second direction Y, and the third pad 213 and the fourth pad 214 are arranged along the second direction Y.

[0045] The first pad 211 and the fourth pad 214 are formed so as not to overlap in the first direction X and the second direction Y. Similarly, the second pad 212 and the third pad 213 are formed so as not to overlap in the first direction X and the second direction Y. Thus, when viewed from above in the thickness direction Z, the first pad 211 and the fourth pad 214 are arranged spaced apart on one diagonal of the main surface 21 of the substrate, and the second pad 212 and the third pad 213 are arranged spaced apart on the other diagonal of the main surface 21 of the substrate.

[0046] In addition, on the back side of the substrate 20, which is opposite to the main surface 21 of the substrate, four back electrodes are provided, which are respectively connected to the four pads 211, 212, 313 and 414, but they are not shown in the figure.

[0047] like Figure 1 and Figure 2 As shown, the light-emitting element 30 is approximately cuboid in shape. When viewed from above in the thickness direction Z, the light-emitting element 30 appears square. That is, the length of the light-emitting element 30 in the first direction X is the same as its length in the second direction Y.

[0048] The light-emitting element 30 is disposed on the first region A1 of the main surface 21 of the substrate. Specifically, the light-emitting element 30 is mounted on the first pad 211 of the main surface 21 of the substrate. Therefore, the light-emitting element 30 is disposed in the second direction Y at a position closer to the first substrate side surface 221 than the fourth substrate side surface 224. The light-emitting element 30 is electrically connected to the second pad 212 via bonding wire 71.

[0049] The light-emitting element 30 is, for example, an LED. The light-emitting element 30 emits light in a direction substantially perpendicular to the main surface 21 of the substrate. At this time, the light emitted by the light-emitting element 30 may have a certain diffusion angle. The wavelength of the light emitted from the light-emitting element 30 is, for example, in the range of 650 nm to 1300 nm. Furthermore, the upper surface 31 of the light-emitting element 30 is the light-emitting surface.

[0050] like Figure 1 and Figure 2 As shown, the light-receiving element 40 is approximately rectangular. When viewed from above in the thickness direction Z, the light-receiving element 40 is rectangular. Similar to the second region A2, the light-receiving element 40 has its first direction X as the shorter side direction and its second direction Y as the longer side direction. Furthermore, the length of the light-receiving element 40 in both the first and second directions X and Y is longer than that of the light-emitting element 30, while its length in the thickness direction Z is equal to that of the light-emitting element 30.

[0051] The light-receiving element 40 is disposed on the second region A2 of the main surface 21 of the substrate, adjacent to the light-emitting element 30. Specifically, the light-receiving element 40 is mounted on the fourth pad 214 of the main surface 21 of the substrate. Therefore, the light-receiving element 40 is positioned in the second direction Y closer to the fourth substrate side surface 224 than the first substrate side surface 221. The light-receiving element 40 is electrically connected to the third pad 213 via a bonding wire 72.

[0052] The light-receiving element 40 is a structure used to detect reflected light emitted from the light-emitting element 30 toward the detection object. The light-receiving element 40 outputs an analog signal corresponding to the amount of light received. The light-receiving element 40 is, for example, a photodiode, a phototransistor, or an optical IC. The upper surface 41 of the light-receiving element 40 becomes the light-receiving surface for receiving light.

[0053] In the first embodiment, the upper surface 31 of the light-emitting element 30 and the upper surface 41 of the light-receiving element 40 are substantially aligned in the thickness direction Z. That is, in the thickness direction Z, the length from the main surface 21 of the substrate to the upper surface 31 of the light-emitting element 30 is substantially equal to the length from the main surface 21 of the substrate to the upper surface 41 of the light-receiving element 40.

[0054] like Figure 1 and Figure 2 As shown, the first cover 50 is disposed on the main surface 21 of the substrate to cover the light-emitting element 30. In the first embodiment, the first cover 50 seals the first pad 211 and the second pad 212, the light-emitting element 30, and the bonding wire 71. The first cover 50 is provided for the purpose of protecting these components of the photosensor 10. The first cover 50 is formed, for example, of a resin material that is transparent with respect to the wavelength of light emitted from the light-emitting element 30. Examples of such resin materials include epoxy resin, silicone resin, silicone-modified epoxy resin, polyamide resin, acrylic resin, and urea-formaldehyde resin.

[0055] The first cover member 50 is generally rectangular and, when viewed from above in the thickness direction Z, has the same size as the first region A1 of the main surface 21 of the substrate. The first cover member 50 has a first upper surface 51, a first back surface 52, a first side surface 53, and a first inclined surface 54.

[0056] The first upper surface 51 is the side opposite to the first back surface 52 and is rectangular in shape. The first upper surface 51 is opposite to the upper surface 31 of the light-emitting element 30 in the thickness direction Z. The first back surface 52 is the side facing the main surface 21 of the substrate and is rectangular in shape. The first back surface 52 has a recessed portion corresponding to the shape of the first pad 211, the second pad 212 and the light-emitting element 30. On the first back surface 52, the portion without recesses is bonded to the first region A1 of the main surface 21 of the substrate.

[0057] The first side surface 53 is the surface that intersects the first upper surface 51, the first back surface 52, and the first inclined surface 54. It is the surface that connects the first upper surface 51 and the first inclined surface 54 to the first back surface 52 in the thickness direction Z. In the first embodiment, the first side surface 53 is composed of four generally rectangular surfaces. The first side surface 53 includes a first inner side surface 531 facing the second cover 60 and first outer side surfaces 532, 533, and 534 that do not face the second cover 60.

[0058] The first inner surface 531 is composed of one surface, and the first outer surfaces 532, 533, and 534 are composed of three surfaces. The first inner surface 531 and the first outer surface 533 are surfaces that intersect with the first direction X, and the first outer surfaces 532 and 534 are surfaces that intersect with the second direction Y. The first inner surface 531 is on the same surface as the inner surface of the groove 23 of the substrate 20. On the other hand, the first outer surface 532 is on the same surface as the first substrate side surface 221, the first outer surface 533 is on the same surface as the second substrate side surface 222, and the first outer surface 534 is on the same surface as the fourth substrate side surface 224.

[0059] A first inclined surface 54 is formed on the first cover 50 at the corner connecting the first upper surface 51 and the first inner surface 531. The first inclined surface 54 intersects both the first upper surface 51 and the first inner surface 531. The first inclined surface 54 is rectangular in shape, with its long side in the second direction Y and its short side in the direction intersecting the first upper surface 51 and the first inner surface 531. The forming angle and size of the first inclined surface 54 can be appropriately selected. In the first embodiment, the angle formed between the first inclined surface 54 and the first upper surface 51 is the same as the angle formed between the first inclined surface 54 and the first inner surface 531.

[0060] like Figure 3 As shown, the first side surface 53 is rougher than the first upper surface 51. That is, the first inner side surface 531 is rougher than the first upper surface 51, and the first outer side surfaces 532, 533, and 534 are rougher than the first upper surface 51. On the other hand, the first inclined surface 54 has the same surface roughness as the first upper surface 51. Furthermore, Figure 3 for Figure 2 The enlarged view is an exaggerated depiction of the uneven shape of surfaces such as the first inner surface 531 compared to the actual surface. Furthermore, in Figure 3 In the text, regarding the first outer surface 532, the diagram of the surface's uneven shape is omitted.

[0061] like Figure 1 and Figure 2 As shown, the second cover 60 is disposed on the main surface 21 of the substrate to cover the light-receiving element 40. In the first embodiment, the second cover 60 seals the third pad 213 and the fourth pad 214, the light-receiving element 40, and the bonding line 72. The purpose of the second cover 60 is to protect these components. The second cover 60, like the first cover 50, is formed of a resin material that is transparent relative to the wavelength of light emitted from the light-emitting element 30.

[0062] The second cover member 60 is generally cuboid in shape and is larger than the first cover member 50. Specifically, the second cover member 60 is longer than the first cover member 50 in the first direction X, and its lengths in both the second direction Y and the thickness direction Z are equal to those of the first cover member 50. Viewed from above in the thickness direction Z, the second cover member 60 has the same size as the second region A2 of the main surface 21 of the substrate. The second cover member 60 has a second upper surface 61, a second back surface 62, a second side surface 63, and a second inclined surface 64.

[0063] The second upper surface 61 is a rectangular surface opposite the second back surface 62 in the thickness direction Z. The second upper surface 61 is opposite the upper surface 41 of the light-receiving element 40 in the thickness direction Z. The second back surface 62 is a rectangular surface facing the main surface 21 of the substrate. The second back surface 62 has recessed portions corresponding to the shapes of the third pad 213, the fourth pad 214, and the light-emitting element 30. The non-recessed portions of the second back surface 62 are bonded to the second region A2 of the main surface 21 of the substrate.

[0064] The second side surface 63 is the surface that intersects the second upper surface 61, the second back surface 62, and the second inclined surface 64. It is the surface that connects the second upper surface 61 and the second inclined surface 64 to the second back surface 62 in the thickness direction Z. In the first embodiment, the second side surface 63 is composed of four generally rectangular surfaces. The second side surface 63 includes a second inner side surface 631 facing the first cover 50 and second outer side surfaces 632, 633, and 634 that do not face the first cover 50.

[0065] The second inner surface 631 consists of one surface, and the second outer surfaces 632, 633, and 634 consist of three surfaces. The second inner surface 631 and the second outer surface 633 are surfaces that intersect the first direction X, and the second outer surfaces 632 and 634 are surfaces that intersect the second direction Y. The second inner surface 631 is on the same surface as the inner surface of the groove 23 of the substrate 20. On the other hand, the second outer surface 632 is on the same surface as the first substrate side surface 221, the second outer surface 633 is on the same surface as the third substrate side surface 223, and the second outer surface 634 is on the same surface as the fourth substrate side surface 224.

[0066] The second inclined surface 64 is formed in the second cover 60 at the corner connecting the second upper surface 61 and the second inner surface 631. The second inclined surface 64 intersects both the second upper surface 61 and the second inner surface 631. The second inclined surface 64 is rectangular in shape, with its long side in the second direction Y and its short side in the direction intersecting the second upper surface 61 and the second inner surface 631. The forming angle and size of the second inclined surface 64 can be appropriately selected. In the first embodiment, the angle formed between the second inclined surface 64 and the second upper surface 61 is the same as the angle formed between the second inclined surface 64 and the second inner surface 631.

[0067] like Figure 3 As shown, the second side surface 63 is rougher than the second upper surface 61. That is, the second inner side surface 631 is rougher than the second upper surface 61, and the second outer side surfaces 632, 633, and 634 are rougher than the second upper surface 61. On the other hand, the surface roughness of the second inclined surface 64 is the same as that of the second upper surface 61. Figure 3 In the illustration, similar to the first inner surface 531, the uneven shape of the second inner surface 631 and other surfaces is exaggerated compared to the actual surface. Figure 3 In the same way as the first outer surface 532, the diagram of the surface irregularity of the second outer surface 632 is omitted.

[0068] like Figure 1 and Figure 2 As shown, the first cover 50 is disposed in the first region A1 of the main surface 21 of the substrate, and the second cover 60 is disposed in the second region A2 of the main surface 21 of the substrate. In this respect, it can be said that the first cover 50 and the second cover 60 are arranged along the first direction X.

[0069] Furthermore, a gap GP is formed between the first cover 50 and the second cover 60. Specifically, the gap GP is formed in the first direction X, between the first inner surface 531 and the first inclined surface 54 of the first cover 50 and the second inner surface 631 and the second inclined surface 64 of the second cover 60, along the second direction Y. The first cover 50 and the second cover 60 are opposite each other in the first direction X, separated by the gap GP. In the first embodiment, the relative direction of the first cover 50 and the second cover 60 is the first direction X. That is, the first direction X can be described as the relative direction of the first cover 50 and the second cover 60, or it can be described as the arrangement direction of the first cover 50 and the second cover 60.

[0070] The first inner surface 531, the second inner surface 631, the first inclined surface 54, and the second inclined surface 64 are surfaces facing the gap GP, while the first outer surfaces 532, 533, 534 and the second outer surfaces 632, 633, 634 are surfaces not facing the gap GP. In other words, the first inner surface 531, the second inner surface 631, the first inclined surface 54, and the second inclined surface 64 are surfaces that define the gap GP, while the first outer surfaces 532, 533, 534 and the second outer surfaces 632, 633, 634 are not surfaces that define the gap GP. Furthermore, the first inner surface 531 and the second inner surface 631 are opposite each other in the first direction X, separated by the gap GP, and the first inclined surface 54 and the second inclined surface 64 are opposite each other in the first direction X, separated by the gap GP.

[0071] like Figure 2 As shown, the first inclined surface 54 and the second inclined surface 64 extend in different directions. In the first embodiment, the first inclined surface 54 and the second inclined surface 64 extend in directions orthogonal to each other. On the other hand, the inclination of the first inclined surface 54 with respect to the thickness direction Z is the same as the inclination of the second inclined surface 64 with respect to the thickness direction Z. Therefore, as... Figure 2 As shown, the first inclined surface 54 and the second inclined surface 64 are symmetrical about the line segment passing through the center of the gap GP. The forming angle and size of the first inclined surface 54 and the second inclined surface 64 do not necessarily need to be the same.

[0072] The gap GP opens above in the thickness direction Z and in the second direction Y. In the first embodiment, the gap GP is filled with a gas, such as air, from the environment in which the light sensor 10 is installed. The gap GP has: a first portion GP1 with a fixed width in the first direction X; and a second portion GP2 with a width in the first direction X that gradually widens as it moves away from the main surface 21 of the substrate.

[0073] The first portion GP1 is formed between the first inner surface 531 of the first cover 50 and the second inner surface 631 of the second cover 60, and the second portion GP2 is formed between the first inclined surface 54 of the first cover 50 and the second inclined surface 64 of the second cover 60. The first portion GP1 is closer to the substrate 20 than the second portion GP2. The first portion GP1 is connected to the second portion GP2 in the thickness direction Z.

[0074] In the first embodiment, when viewed from above in the thickness direction Z, the long side direction of the gap GP is the second direction Y. For example... Figure 2 As shown, the gap GP is connected to the groove 23 in the thickness direction Z. In other words, the groove 23 is formed on the portion of the gap GP facing the main surface 21 of the substrate. The width of the gap GP in the first direction X is preferably formed to be 0.03 mm or more and less than 0.1 mm.

[0075] Furthermore, comparing the first cover 50 and the second cover 60, the surface roughness of the first inner surface 531 and the second inner surface 631 is the same, and the surface roughness of the first outer surfaces 532, 533, 534 and the second outer surfaces 632, 633, 634 is also the same. Similarly, the surface roughness of the first upper surface 51 and the second upper surface 61 is the same, and the surface roughness of the first inclined surface 54 and the second inclined surface 64 is also the same.

[0076] Next, a brief description of the manufacturing method of the optical sensor 10 will be given. The manufacturing method of the first embodiment is a method for manufacturing a large number of optical sensors 10 at once.

[0077] like Figure 4 As shown, the manufacturing method of the optical sensor 10 includes a preparation step S11, an installation step S12, a forming step S13, a first cutting step S14 as a "cutting step", and a second cutting step S15.

[0078] Preparation step S11 is the process of preparing a large substrate 110, which is made of the same material as substrate 20 and is larger than substrate 20. Mounting step S12 is the process following preparation step S11, which is to form multiple pads 211-214 and multiple back electrodes on the large substrate 110, and to mount multiple light-emitting elements 30 and multiple light-receiving elements 40 on the large substrate 110.

[0079] The molding process S13 is a subsequent process after the mounting process S12. It involves forming a resin layer 120 on a large substrate 110 using a mold. Through the implementation of the molding process S13, a resin layer 120 covering the upper surface of the large substrate 110, including multiple pads 211-214, multiple light-emitting elements 30, and multiple light-receiving elements 40, can be formed. This allows for the formation of… Figure 5 and Figure 6 The intermediate body 100 is shown. In the intermediate body 100, a plurality of recesses 122 extending in a direction orthogonal to the thickness direction Z of the large substrate 110 are formed on the surface 121 of the resin layer 120. The cross-sectional shape orthogonal to the long side direction of the recesses 122 is an equilateral trapezoidal shape. In the intermediate body 100, the surface 121 of the resin layer 120 and the inclined surface 123 of the recesses 122 are both forming surfaces of the mold. Figure 5 and Figure 6 Due to the area depicted in the diagram of intermediate body 100, only one recess 122 is shown.

[0080] The first cutting step S14 is a subsequent step after the forming step S13, and is a cutting step performed to form a portion corresponding to the gap GP of the light sensor 10. The first cutting step S14, by cutting along... Figure 5 and Figure 6The straight line C1 shown is used to move the rotating cutting blade. At this time, in the resin layer 120, the portion that will become the first cover 50 and the portion that will become the second cover 60 are separated in the first direction X. That is, in the resin layer 120, the portion covering the light-emitting element 30 and the portion covering the light-receiving element 40 are cut off. The first cutting process S14 is performed with the lowermost part of the cutting blade positioned below the upper surface of the large substrate 110 in the thickness direction Z. Therefore, the groove 23 formed on the substrate 20 of the light sensor 10 is formed when the gap GP is formed in the resin layer 120.

[0081] In the first embodiment, since the gap GP is formed by a cutting blade, the production efficiency is better than that of forming the gap GP by etching, and the shape of the mold does not become complicated compared to forming the gap GP by using a mold.

[0082] Finally, the second cutting process S15 is to cut multiple optical sensors 10 from the intermediate body 100 along... Figure 5 and Figure 6 The process involves cutting along the straight line C2 shown. During this process, the large substrate 110 and the resin layer 120 are cut simultaneously. Whether cutting multiple light sensors 10 from the intermediate body 100 or forming gaps GP in the resin layer 120, the same type of cutting blade can be used, or different types of cutting blades can be used.

[0083] Here, the surface 121 of the resin layer 120 is the portion that subsequently becomes the first upper surface 51 of the first cover 50 and the second upper surface 61 of the second cover 60, and the slope 123 of the recess 122 is the portion that subsequently becomes the first inclined surface 54 of the first cover 50 and the second inclined surface 64 of the second cover 60. Therefore, in the first embodiment, the surface roughness of the first upper surface 51 and the second upper surface 61, as well as the first inclined surface 54 and the second inclined surface 64, is the same. Furthermore, in this respect, the first upper surface 51 and the second upper surface 61 are on the same plane.

[0084] The groove 23 of the substrate 20 and the first inner surface 531 of the first cover 50 and the second inner surface 631 of the second cover 60, through along Figure 6 The straight line C1 shown is cut into the intermediate body 100 to form it. Therefore, on the first inner surface 531 and the second inner surface 631, there are remnants of... Figure 7 The cut marks are shown. The result is, as... Figure 3As shown, the surface roughness of the first inner surface 531 and the second inner surface 631 is the same, and compared with the first upper surface 51 and the second upper surface 61, the first inner surface 531 and the second inner surface 631 are rough surfaces. Furthermore, the cross-sectional shape orthogonal to the long side direction of the groove 23 corresponds to the shape of the cutting blade's tip. Further, the inner surface of the groove 23 is a rough surface.

[0085] The substrate side surface 22 and the first outer side surfaces 532, 533, 534 and the second outer side surfaces 632, 633, 634, through along... Figure 6 The straight line C2 shown is used to cut the intermediate body 100 to form it. Therefore, residues also remain on the first outer surfaces 532, 533, 534 and the second outer surfaces 632, 633, 634. Figure 7 The cut marks are shown. The result is, as... Figure 3 As shown, the surface roughness of the first outer surface 532, 533, 534 and the second outer surface 632, 633, 634 is the same, and compared with the first upper surface 51 and the second upper surface 61, the first outer surface 532, 533, 534 and the second outer surface 632, 633, 634 are rough surfaces.

[0086] Figure 7 The cut mark shown is an example. The diameter of the cutting blade, the direction of movement of the cutting blade, the rotation speed of the cutting blade, and the speed of movement of the cutting blade in the cutting direction may vary depending on the material of the cutting blade and the material of the resin layer 120.

[0087] The function and effects of the first embodiment will be explained.

[0088] In detail, refer to Figure 8 and Figure 9 The optical sensor 10X of the comparative example and the optical sensor 10 of the first embodiment will be described while making a comparison. Figure 8 and Figure 9 In order to make the explanation easier to understand, part of the structure of the light sensors 10 and 10X has been omitted.

[0089] (1) As Figure 8 As shown, in the comparative example of the light sensor 10X having a cover 50X that integrally covers the light-emitting element 30 and the light-receiving element 40, when diffused light L1 is emitted from the light-emitting element 30, a portion of the diffused light L1 is reflected on the upper surface 51X of the cover 50X and directed towards the light-receiving element 40. And as... Figure 9As shown, in the light sensor 10 of the first embodiment, a gap GP is provided between the first cover 50 covering the light-emitting element 30 and the second cover 60 covering the light-receiving element 40. Therefore, when diffused light L1 is emitted from the light-emitting element 30, the diffused light L1 passes through the gap GP and is not reflected on the first upper surface 51 of the first cover 50 and the second upper surface 61 of the second cover 60.

[0090] In addition, such as Figure 9 As shown, when diffused light L4 travels from the first cover 50 to the second cover 60 through the gap GP, a portion of this diffused light L4 is reflected by either the first inner surface 531 or the second inner surface 631. Therefore, the intensity of the diffused light tends to decrease when it reaches the interior of the second cover 60.

[0091] In this way, compared with the comparative example's light sensor 10X, the light sensor 10 is not reflected by objects, and the light from the light-emitting element 30 toward the light-receiving element 40 can be reduced. In other words, the light sensor 10 can reduce crosstalk.

[0092] Furthermore, since the light sensor 10 does not have a light-shielding wall between the first cover 50 and the second cover 60, it is easy to miniaturize the device in this respect. In addition, because the structure of the light sensor 10 can be simplified in the same way, the manufacturing process of the light sensor 10 can be kept from becoming complicated.

[0093] (2) Figure 8 As shown, in the comparative example where the cover 50X does not have the first inclined surface 54, when the diffused light L2 is emitted from the light-emitting element 30, a portion of the diffused light L2 reflected by the first upper surface 51 may be directed toward the light-receiving element 40.

[0094] Regarding this point, as Figure 9 As shown, the light sensor 10 of the first embodiment has a first inclined surface 54 formed on the first cover 50. Therefore, as Figure 9 As shown, diffused light L2 easily passes through the first inclined surface 54, and diffused light L2 is not easily reflected by the first upper surface 51. As a result, the optical sensor 10 can reduce crosstalk caused by the reflection of diffused light L2 by the first upper surface 51.

[0095] (3) Figure 8 As shown, in the comparative example where the cover 50X does not have the second inclined surface 64, when the diffused light L3 is emitted from the light-emitting element 30, there is a possibility that the diffused light L3 is reflected by the upper surface 51X of the cover 50X and goes towards the light-receiving element 40. Regarding this, as Figure 9 As shown, in the first embodiment, the light sensor 10 has a second inclined surface 64 formed on the second cover 60. Therefore, as Figure 9As shown, the diffused light L3 has difficulty entering the interior of the second cover 60 and is not easily directed toward the light-receiving element 40. As a result, the light sensor 10 is able to reduce crosstalk caused by the reflection of the diffused light L3 by the second upper surface 61.

[0096] (4) Figure 9 As shown, in the light sensor 10, the first outer surfaces 532, 533, and 534 of the first cover 50 are on the same plane as the substrate sides 22 (221, 222, and 224), and the second outer surfaces 632, 633, and 634 of the second cover 60 are on the same plane as the substrate sides 22 (221, 223, and 224). That is, the light sensor 10 does not have a peripheral wall surrounding the first cover 50 and the second cover 60. This makes it easier to miniaturize the light sensor 10.

[0097] (5) In the optical sensor 10, the first inner surface 531 and the second inner surface 631 are rougher than the first upper surface 51 and the second upper surface 61. Therefore, as Figure 9 As shown, when diffused light L4 is emitted from the light-emitting element 30, it is reflected, scattered, or refracted when it is emitted from the first cover 50 to the gap GP or from the gap GP into the second cover 60. In this way, the light sensor 10 can reduce diffused light L4 by utilizing the first inner surface 531 and the second inner surface 631, which are rough surfaces.

[0098] (6) The first outer surfaces 532, 533, and 534 of the light sensor 10 are rougher than the first upper surface 51 and the second upper surface 61. Therefore, the light sensor 10 can suppress the leakage of diffused light emitted from the light-emitting element 30 to the outside of the light sensor 10 through the first outer surfaces 532, 533, and 534.

[0099] (7) The second outer surfaces 632, 633, and 634 of the light sensor 10 are rougher than the first upper surface 51 and the second upper surface 61. Therefore, the light sensor 10 can suppress light incident from the outside onto the second cover 60 in the first direction X and the second direction Y from reaching the light receiving element 40.

[0100] (8) Figure 1 As shown, when viewed from above in the thickness direction Z, the light-emitting element 30 and the light-receiving element 40 are staggered in the second direction Y, which is the extension direction of the gap GP. More specifically, when viewed from above in the thickness direction Z, the light-emitting element 30 and the light-receiving element 40 are arranged to overlap in the upper part of the second direction Y. Therefore, compared to the case where the light-emitting element 30 and the light-receiving element 40 are arranged to at least partially overlap in the second direction Y, the light sensor 10 allows the light-emitting element 30 and the light-receiving element 40 to be arranged far apart from each other. In this way, the light sensor 10 can further reduce crosstalk.

[0101] (9) such as Figure 9 As shown, the light sensor 10 detects an object 200 located at a distance Ln within 6 mm of the upper surfaces of the first cover 50 and the second cover 60. Therefore, in the light sensor 10, a large amount of light emitted from the light-emitting element 30 is easily reflected by the object 200 and directed towards the light-receiving element 40. Thus, even without a light-shielding wall, the light sensor 10 can ensure a sufficient signal-to-noise ratio when detecting the object 200, even if crosstalk becomes stronger.

[0102] (Second Implementation)

[0103] based on Figure 10 The second embodiment of the optical sensor 10A will be described. In the second embodiment, the same reference numerals are used for structures common to the first embodiment, and descriptions are omitted. The main difference between the second embodiment and the first embodiment of the optical sensor 10A is the structure of the gap GP.

[0104] like Figure 10 As shown, the light sensor 10A includes a substrate 20, a light-emitting element 30, a light-receiving element 40, a first cover 50A, a second cover 60A, bonding lines 71 and 72, and a light-shielding ink 80.

[0105] The first cover 50A is generally cuboid in shape and has a first upper surface 51, a first back surface 52, and a first side surface 53. The second cover 60A is generally cuboid in shape and has a second upper surface 61, a second back surface 62, and a second side surface 63.

[0106] The light-blocking ink 80 is an ink of a color capable of absorbing the wavelength of light emitted by the light-emitting element 30. The light-blocking ink 80 fills the gap GP between the first cover 50 and the second cover 60. The light-blocking ink 80 is preferably cured in the gap GP, but if it can remain in the gap GP, it can be liquid or gel-like. Furthermore, in the second embodiment, the so-called gap GP, which is formed between the first cover 50 and the second cover 60, is considered to be formed even if it is filled with light-blocking ink 80.

[0107] The effects of the second embodiment will be explained.

[0108] (10) Because the gap GP between the first cover 50A and the second cover 60A is filled with light-shielding ink 80, the light sensor 10A can absorb the diffused light emitted from the light-emitting element 30 using the light-shielding ink 80. In this way, the light sensor 10A can further reduce crosstalk. In addition, the light sensor 10A of the second embodiment can obtain the effects of the first embodiment (1), (4) to (9).

[0109] The second embodiment can be implemented with modifications as described below.

[0110] ·like Figure 11 and Figure 12 As shown, the light sensor 10A of the second embodiment can also be a light sensor 10A1, 10A2 including a first cover 50 having a first inclined surface 54 and a second cover 60 having a second inclined surface 64. In this case, as Figure 11 As shown, the light sensor 10A1 may also have a light-shielding ink 80A1 filling the first portion GP1 located between the first inner surface 531 and the second inner surface 631 in the gap GP. Furthermore, as... Figure 12 As shown, the light sensor 10A2 may also have a light-shielding ink 80A2 that fills the entire gap GP.

[0111] (Third Implementation)

[0112] based on Figure 13 The light sensor 10B according to the third embodiment will be described. In the third embodiment, the same reference numerals are used for structures common to the first embodiment, and descriptions are omitted. The main difference between the light sensor 10B of the third embodiment and the light sensor 10 of the first embodiment is that it has a lens.

[0113] like Figure 13 As shown, the light sensor 10B includes a substrate 20, a light-emitting element 30, a light-receiving element 40, a first cover 50B, a second cover 60B, bonding lines 71 and 72, a first lens 81, and a second lens 82.

[0114] The first cover 50B is generally rectangular parallelepiped in shape. The first cover 50B has a first upper surface 51, a first back surface 52, and a first side surface 53. The second cover 60B is generally rectangular parallelepiped in shape. The second cover 60B has a second upper surface 61, a second back surface 62, and a second side surface 63.

[0115] A first lens 81 is formed on the first upper surface 51 of the first cover 50B. The first lens 81 focuses the light emitted from the light-emitting element 30, or tilts the direction of the light emitted from the light-emitting element 30, so that the light reflected by the object can easily reach the light-receiving element 40. A second lens 82 is formed on the second upper surface 61 of the second cover 60B. The second lens 82 focuses the light to be incident on the second cover 60 toward the light-receiving element 40.

[0116] Both the first lens 81 and the second lens 82 are Fresnel lenses. In this respect, the first lens 81 is an example of a "first Fresnel lens," and the second lens 82 is an example of a "second Fresnel lens." The first lens 81 and the second lens 82 can be formed separately from the first cover 50B and the second cover 60B, or they can be formed integrally with the first cover 50B and the second cover 60B. When the first lens 81 and the second lens 82 are integrally formed with the first cover 50B and the second cover 60B, the first lens 81 and the second lens 82 can, for example, be formed simultaneously with the first cover 50B and the second cover 60B in the forming process S13.

[0117] The effects of the third embodiment will be explained.

[0118] (11) Because the light sensor 10B has a first lens 81 and a second lens 82, a large amount of light emitted from the light-emitting element 30 is reflected by the object 200, and the reflected light from the object 200 easily travels to the light-receiving element 40. Furthermore, because the first lens 81 and the second lens 82 are Fresnel lenses, the length of the light sensor 10B in the thickness direction Z can be suppressed. In addition, the light sensor 10B of the third embodiment can obtain the effects of the first embodiment (1), (4) to (9).

[0119] The third embodiment can be implemented after modification as described below.

[0120] • The first lens 81 and the second lens 82 can be ordinary condenser lenses.

[0121] • The light sensor 10B may have at least one of the first lens 81 and the second lens 82.

[0122] (Fourth implementation)

[0123] based on Figure 14 The fourth embodiment of the light sensor 10C will now be described. In the fourth embodiment, the same reference numerals are used for structures common to the first embodiment, and descriptions are omitted. The main difference between the fourth embodiment's light sensor 10C and the first embodiment's light sensor 10 is the structure of the light-emitting element.

[0124] like Figure 14 As shown, the light sensor 10C includes a substrate 20, a light-emitting element 30C, a light-receiving element 40, a first cover 50C, a second cover 60C, and bonding lines 71 and 72. Figure 14 The diagrams of the joining lines 71 and 72 are omitted in the text.

[0125] The light-emitting element 30C is mounted on the first pad 211 and connected to the second pad 212 via bonding wire 71. The length of the light-emitting element 30C in the thickness direction Z is shorter than the length of the light-receiving element 40 in the thickness direction Z.

[0126] The first cover 50C is generally rectangular parallelepiped in shape. The first cover 50C has a first upper surface 51, a first back surface 52, and a first side surface 53. The second cover 60C is generally rectangular parallelepiped in shape. The second cover 60C has a second upper surface 61, a second back surface 62, and a second side surface 63.

[0127] like Figure 14 As shown, in the thickness direction Z, the length Ln1 from the main surface 21 of the substrate to the upper surface 31C of the light-emitting element 30C is shorter than the length Ln2 from the main surface 21 of the substrate to the upper surface 41 of the light-receiving element 40. That is, in the thickness direction Z, the length from the upper surface 31C of the light-emitting element 30C to the first upper surface 51 of the first cover 50C is longer than the length from the upper surface 41 of the light-receiving element 40 to the second upper surface 61 of the second cover 60C. Thus, the upper surface 31C of the light-emitting element 30C and the upper surface 41 of the light-receiving element 40 are offset in the thickness direction Z.

[0128] The effects of the fourth embodiment will be explained.

[0129] (12) In the light sensor 10C, the upper surface 41 of the light-receiving element 40 is offset upwards from the upper surface 31C of the light-emitting element 30C. Therefore, as Figure 14 As shown, when there is diffused light L5 emitted from the light-emitting element 30C in the first direction X or in a direction slightly tilted from the first direction X, the diffused light L5 is less likely to reach the upper surface 41 of the light-receiving element 40. In this way, the light sensor 10C can further reduce crosstalk. In addition, the light sensor 10C of the fourth embodiment can obtain the effects of the first embodiment (1), (4) to (9).

[0130] The fourth embodiment can be implemented after modification as described below.

[0131] ·like Figure 15 As shown, the light sensor 10C can also be a light sensor 10C1 having a light-emitting element 30 and a light-receiving element 40C. For example... Figure 15As shown, in the thickness direction Z, the length Ln1 from the main surface 21 of the substrate to the upper surface 31 of the light-emitting element 30 is longer than the length Ln2 from the main surface 21 of the substrate to the upper surface 41C of the light-receiving element 40C. That is, in the thickness direction Z, the length from the upper surface 31 of the light-emitting element 30 to the first upper surface 51 of the first cover member 50C is shorter than the length from the upper surface 41C of the light-receiving element 40C to the second upper surface 61 of the second cover member 60C. Figure 15 The diagrams of the joining lines 71 and 72 are omitted in the text.

[0132] • If lengths Ln1 and Ln2 are different, the lengths of the light-emitting element 30C and the light-receiving element 40 in the thickness direction Z can be the same. In this case, a conductive spacer can be provided between the first pad 211 and the light-emitting element 30C, or a conductive spacer can be provided between the fourth pad 214 and the light-receiving element 40. Furthermore, the thickness of the first pad 211 on which the light-emitting element 30C is mounted and the thickness of the fourth pad 214 on which the light-receiving element 40 is mounted can be different. Additionally, in the substrate 20, the thickness of the portion forming the first pad 211 and the thickness of the portion forming the fourth pad 214 can be different.

[0133] Each implementation can be modified as described below. Each implementation and the following variations can be combined with each other to the extent that they are not technically contradictory.

[0134] • The light sensors 10, 10A to 10C can detect objects located at a distance Ln of 6 mm from the surfaces of the first cover 50 and the second cover 60. In this case, to ensure the signal-to-noise ratio, it is preferable to change the shape, size, and positional relationship of the constituent components of the light sensors 10, 10A to 10C.

[0135] • When viewed from above along the thickness direction Z, the shape of the light sensors 10, 10A to 10C does not have to be square. For example, the shape of the light sensors 10, 10A to 10C can be rectangular, polygonal, or circular.

[0136] ·like Figure 16As shown, the light sensor 10 can be a light sensor 10D. In the light sensor 10D, the first pad 211 and the fourth pad 214 can be formed to be adjacent in the first direction X, and the second pad 212 and the third pad 213 can be formed to be adjacent in the first direction X. In other words, the first pad 211 and the fourth pad 214 can be formed to overlap at least partially in the first direction X, and the second pad 212 and the third pad 213 can be formed to overlap at least partially in the first direction X. That is, the light-emitting element 30 and the light-receiving element 40 can be respectively disposed in the area divided by the groove 23.

[0137] ·like Figure 17 As shown, the light sensor 10 can also be a light sensor 10E in which the groove 23 is not formed on the substrate 20. That is, when manufacturing the light sensor 10E, it is also possible to ensure that the lower end of the cutting blade is aligned with the main surface 21 of the substrate in the thickness direction Z. Figure 5 and Figure 6 Cut the line C1 shown.

[0138] ·like Figure 18 As shown, the light sensor 10 can also be a light sensor 10F with a connecting part 90, which is disposed on the main surface 21 of the substrate and connects the first cover 50 and the second cover 60.

[0139] The connecting portion 90 is cylindrical with the second direction Y as its height direction. The connecting portion 90 connects the first cover 50 and the second cover 60 in the second direction Y. That is, the connecting portion 90 has the same length as both the first cover 50 and the second cover 60 in the second direction Y. In addition, the cross-sectional shape of the connecting portion 90 in the second direction Y is the same.

[0140] The connecting portion 90 has a connecting portion upper surface 91 that intersects the thickness direction Z. The connecting portion upper surface 91 is a concave curved surface recessed towards the main surface 21 of the substrate and facing the gap GP. Therefore, in the light sensor 10F, it can be said that the gap GP is formed between the first inner surface 531 of the first cover 50, the second inner surface 631 of the second cover 60, and the connecting portion upper surface 91 of the connecting portion 90. In other words, it can be said that the gap GP is formed between the first cover 50, the second cover 60, and the connecting portion 90. Thus, the first cover 50 and the second cover 60 can be separate structures, or if the gap GP is formed, the first cover 50 and the second cover 60 can be connected structures.

[0141] In the thickness direction Z, the length from the main surface 21 of the substrate to the upper surface 91 of the connection portion is the thickness Th of the connection portion 90. Preferably, the thickness Th of the connection portion 90 is shorter than the length Ln1 from the main surface 21 of the substrate to the upper surface 31 of the light-emitting element 30, and more preferably shorter than the length from the main surface 21 of the substrate to the light-emitting layer of the light-emitting element 30. Furthermore, preferably, the thickness Th of the connection portion 90 is shorter than the length Ln2 from the main surface 21 of the substrate to the upper surface 41 of the light-receiving element 40, and more preferably shorter than the length from the main surface 21 of the substrate to the light-receiving layer of the light-receiving element 40.

[0142] As described above, the upper surface 91 of the connector is curved. In this structure, the thickness Th of the connector 90 is the length from the main surface 21 of the substrate to the portion of the upper surface 91 of the connector closest to the main surface 21 of the substrate.

[0143] like Figure 18 As shown, the thickness Th of the connecting portion 90 is shorter than the length Ln3 of the gap GP in the thickness direction Z, and also shorter than the length Ln4 of the first portion GP1 in the thickness direction Z. Therefore, between the first cover member 50 and the second cover member 60, the area occupied by the gap GP is larger than the area occupied by the connecting portion 90. However, this is not a limitation; the thickness Th of the connecting portion 90 can be arbitrarily set, for example, it can be longer than the length Ln4 of the first portion GP1 in the thickness direction Z.

[0144] The length Ln3 of the gap GP in the thickness direction Z is the length from the upper surface 91 of the connecting portion (e.g., the portion of the upper surface 91 of the connecting portion closest to the main surface 21 of the substrate) to the upper ends of the first upper surface 51 and the second upper surface 61 in the thickness direction Z. The length Ln4 of the first portion GP1 in the thickness direction Z is the length from the upper surface 91 of the connecting portion (e.g., the portion of the upper surface 91 of the connecting portion closest to the main surface 21 of the substrate) to the upper ends of the first inner surface 531 and the second inner surface 631 in the thickness direction Z.

[0145] Furthermore, during the manufacturing of the optical sensor 10F, the lower end of the cutting blade is positioned above the main surface 21 of the substrate in the thickness direction Z, along... Figure 5 and Figure 6 The connecting portion 90 is formed by cutting the straight line shown. Therefore, the connecting portion 90 is formed of the same resin material as the first cover 50 and the second cover 60, and the connecting portion 90 is integrally formed with the first cover 50 and the second cover 60.

[0146] Figure 18The light sensor 10F shown is designed so that the first cover 50 and the second cover 60 are integrated via the connecting portion 90, thus improving the light sensor 10F's intensity. Furthermore, because the thickness Th of the connecting portion 90 is less than the length Ln1 from the main surface 21 of the substrate to the upper surface 31 of the light-emitting element 30, the light sensor 10F can suppress light emitted from the light-emitting element 30 from passing through the connecting portion 90 to the light-receiving element 40. In other words, the light sensor 10F can reduce crosstalk caused by the connection portion 90.

[0147] The shapes of the light-emitting element 30 and the light-receiving element 40 do not have to be rectangular. For example, the shapes of the light-emitting element 30 and the light-receiving element 40 can be cubic, cylindrical, or plate-shaped.

[0148] • The light-emitting element 30 can also be a semiconductor laser element. A semiconductor laser element is, for example, a VCSEL (Vertical Cavity Surface Emitting Laser) that emits laser light in a vertical direction. By adopting such a structure, the diffusion of light emitted from the light-emitting element 30 can be reduced.

[0149] • The first inner surface 531 of the first cover 50 and the second inner surface 631 of the second cover 60 may not be formed as rough surfaces. Similarly, at least one of the first outer surfaces 532, 533, and 534 of the first cover 50 may not be formed as rough surfaces, and at least one of the second outer surfaces 632, 633, and 634 of the second cover 60 may not be formed as rough surfaces.

[0150] • The first inclined surface 54 of the first cover 50 and the second inclined surface 64 of the second cover 60 may also be formed as rough surfaces. In this case, the first inclined surface 54 and the second inclined surface 64 can be roughened by making the surface of the mold rough, or the first inclined surface 54 and the second inclined surface 64 can be roughened by processing after resin molding.

[0151] Alternatively, by providing a reflective film or a light-shielding film on the first inner surface 531 of the first cover 50, diffused light emitted from the light-emitting element 30 may not enter the interior of the second cover 60. Similarly, by providing a reflective film or a light-shielding film on the second inner surface 631 of the second cover 60, diffused light emitted from the light-emitting element 30 may not enter the interior of the second cover 60.

[0152] • The gap GP between the first cover 50 and the second cover 60 can also be formed by molding during the molding of the resin layer 120.

[0153] • The first upper surface 51 of the first cover 50 and the second upper surface 61 of the second cover 60 may also be offset in the thickness direction Z.

[0154] • When cutting intermediate 100, a cutting blade may not be used. For example, a laser may be used for cutting.

[0155] (Appendix format)

[0156] Next, the technical ideas based on the above-described embodiments and variations will be described.

[0157] (Appendix Method 1)

[0158] An optical sensor comprising:

[0159] A substrate having a main surface that intersects the thickness direction;

[0160] Light-emitting elements disposed on the main surface of the substrate;

[0161] A light-receiving element disposed on the main surface of the substrate;

[0162] A first cover with light transmittance is disposed on the main surface of the substrate in a manner that covers the light-emitting element; and

[0163] A second, light-transmitting cover is disposed on the main surface of the substrate in a manner that covers the light-receiving element.

[0164] A gap is formed between the first cover and the second cover.

[0165] (Appendix Method 2)

[0166] The optical sensor as described in Appendix 1, wherein...

[0167] The first cover has a first upper surface intersecting the thickness direction and a first side surface intersecting the first upper surface.

[0168] The second cover has a second upper surface intersecting the thickness direction and a second side surface intersecting the second upper surface.

[0169] The first side surface includes a first inner side surface facing the gap and a first outer side surface not facing the gap.

[0170] The second side includes a second inner side facing the gap and a second outer side not facing the gap.

[0171] (Appendix Method 3)

[0172] The optical sensor as described in Appendix 2, wherein...

[0173] The first cover has a first inclined surface at the corner connecting the first upper surface and the first inner surface, which intersects both the first upper surface and the first inner surface.

[0174] (Appendix Method 4)

[0175] The optical sensor as described in Appendix 2 or 3, wherein...

[0176] The second cover has a second inclined surface at the corner connecting the second upper surface and the second inner surface, which intersects both the second upper surface and the second inner surface.

[0177] (Appendix Method 5)

[0178] The optical sensor described in any of the embodiments 2 to 4 in the appendix, wherein...

[0179] The substrate has a substrate side surface.

[0180] The first outer surface and the second outer surface are on the same plane as the side surface of the substrate in the thickness direction.

[0181] (Appendix Method 6)

[0182] The optical sensor described in any of the embodiments 2 to 5 in the appendix, wherein...

[0183] The first inner surface is rougher than the first upper surface.

[0184] (Appendix Method 7)

[0185] The optical sensor described in any of the embodiments 2 to 6 in the appendix, wherein...

[0186] The second inner surface is rougher than the second upper surface.

[0187] (Appendix Method 8)

[0188] The optical sensor described in any of the embodiments 2 to 7 in the appendix, wherein...

[0189] The first outer surface is rougher than the first upper surface.

[0190] (Appendix Method 9)

[0191] The optical sensor described in any of the embodiments 2 to 8 in the appendix, wherein...

[0192] The second outer surface is rougher than the second upper surface.

[0193] (Appendix Method 10)

[0194] The optical sensor described in any of the embodiments 1 to 9 in the appendix, wherein...

[0195] This includes light-blocking ink that fills the gaps.

[0196] (Appendix Method 11)

[0197] The optical sensor described in any of the embodiments 1 to 9 in the appendix, wherein...

[0198] The gap is filled with air.

[0199] (Appendix Method 12)

[0200] The optical sensor described in any of the embodiments 1 to 11 in the appendix, wherein...

[0201] The upper surface of the light-emitting element and the upper surface of the light-receiving element are offset in the thickness direction.

[0202] (Appendix Method 13)

[0203] The optical sensor as described in Appendix 12, wherein...

[0204] In the thickness direction, the length from the main surface of the substrate to the upper surface of the light-emitting element is shorter than the length from the main surface of the substrate to the upper surface of the light-receiving element.

[0205] (Appendix Method 14)

[0206] The optical sensor described in any of the embodiments 2 to 13 in the appendix, wherein...

[0207] The first upper surface and the second upper surface are located on the same plane.

[0208] (Appendix Method 15)

[0209] The optical sensor described in any of the embodiments 2 to 14 in the appendix, wherein...

[0210] This includes a first Fresnel lens formed on the first upper surface.

[0211] (Appendix Method 16)

[0212] The optical sensor described in any of the embodiments 2 to 15 in the appendix, wherein...

[0213] This includes a second Fresnel lens formed on the second upper surface.

[0214] (Appendix Method 17)

[0215] The optical sensor described in any of the embodiments 1 to 16 in the appendix, wherein...

[0216] The first cover and the second cover are opposite each other with the gap between them.

[0217] Viewed from above in the thickness direction, the gap extends in a direction orthogonal to the relative directions of the first cover and the second cover.

[0218] When viewed from above in the thickness direction, the light-emitting element and the light-receiving element are arranged offset from each other in the extension direction of the gap.

[0219] (Appendix Method 18)

[0220] The optical sensor described in any of the embodiments 1 to 17 in the appendix, wherein...

[0221] A groove is formed on the portion of the main surface of the substrate facing the gap, which is recessed in the thickness direction.

[0222] (Appendix Method 19)

[0223] The optical sensor as described in Appendix 18, wherein...

[0224] The main surface of the substrate has a first region and a second region divided by the groove.

[0225] The light-emitting element is disposed on the first region.

[0226] The light-receiving element is disposed on the second region.

[0227] The first cover is disposed on the first region in a manner that covers the light-emitting element.

[0228] The second cover is disposed on the second region in a manner that covers the light-receiving element.

[0229] When viewed from above in the thickness direction, the light-receiving element is larger than the light-emitting element, and the second region is larger than the first region.

[0230] (Appendix Method 20)

[0231] The optical sensor as described in Appendix 19, wherein...

[0232] The first cover and the second cover are opposite each other with the gap between them.

[0233] Viewed from above in the thickness direction, the groove extends in a direction orthogonal to the relative directions of the first cover and the second cover.

[0234] The first region and the second region are rectangular in shape, with the width direction of the groove as the short side and the extension direction of the groove as the long side.

[0235] The length of the first region in the short side direction is shorter than the length of the second region in the short side direction.

[0236] The length of the first region in the long side direction is the same as the length of the second region in the long side direction.

[0237] (Appendix Method 21)

[0238] The optical sensor as described in Appendix 19 or 20, wherein,

[0239] The first cover and the second cover are opposite each other with the gap between them.

[0240] Viewed from above in the thickness direction, the groove extends in a direction orthogonal to the relative directions of the first cover and the second cover.

[0241] The substrate has: a first pad and a second pad arranged in the first region along the extension direction of the groove; and a third pad and a fourth pad arranged in the second region along the extension direction of the groove.

[0242] The light-emitting element is mounted on the first pad and electrically connected to the second pad.

[0243] The light-receiving element is mounted on the fourth pad and is electrically connected to the third pad.

[0244] (Appendix Method 22)

[0245] The optical sensor as described in Appendix 21, wherein...

[0246] The first pad is formed such that, in the width direction of the groove, at least a portion overlaps with the third pad and also overlaps with the fourth pad.

[0247] The second pad is formed such that at least a portion of it overlaps with the fourth pad and also overlaps with the third pad in the width direction of the groove.

[0248] (Appendix Method 23)

[0249] The optical sensor described in any of the embodiments 1 to 17 in the appendix, wherein...

[0250] The system includes a connecting portion disposed on the main surface of the substrate, which connects the first cover and the second cover.

[0251] The gap is formed between the first cover, the second cover, and the connecting portion.

[0252] (Appendix Method 24)

[0253] The optical sensor as described in Appendix 23, wherein...

[0254] The connecting portion has a connecting portion upper surface facing the gap.

[0255] In the thickness direction, the length from the main surface of the substrate to the upper surface of the connecting portion, i.e., the thickness of the connecting portion, is shorter than the length from the main surface of the substrate to the upper surface of the light-emitting element.

[0256] (Appendix Method 25)

[0257] The optical sensor as described in Appendix 23 or 24, wherein...

[0258] The connecting portion has a connecting portion upper surface facing the gap.

[0259] The length from the main surface of the substrate to the upper surface of the connection portion in the thickness direction, i.e., the thickness of the connection portion, is shorter than the length of the gap in the thickness direction.

[0260] (Appendix Method 26)

[0261] The optical sensor described in any of the embodiments 1 to 25 in the appendix, wherein...

[0262] The first cover and the second cover are opposite each other with the gap between them.

[0263] Viewed from above in the thickness direction, the substrate is rectangular in shape and has: a first substrate side surface and a fourth substrate side surface extending in the opposite direction of the first cover and the second cover; and a second substrate side surface and a third substrate side surface extending in a direction orthogonal to the opposite direction, connecting the first substrate side surface and the fourth substrate side surface.

[0264] The light-emitting element is positioned closer to the side of the first substrate than the side of the fourth substrate.

[0265] The light-receiving element is positioned closer to the side of the fourth substrate than the side of the first substrate.

[0266] (Appendix Method 27)

[0267] The optical sensor described in any of the embodiments 1 to 26 in the appendix, wherein...

[0268] The light-emitting element is a semiconductor laser element that emits laser light in the vertical direction.

[0269] (Appendix Method 28)

[0270] The optical sensor described in any of the embodiments 1 to 27 in the appendix, wherein...

[0271] When viewed from above in the thickness direction, it has a square shape.

[0272] (Appendix Method 29)

[0273] The optical sensor as described in Appendix 28, wherein...

[0274] When viewed from above in the thickness direction, the length of one side is more than 0.5 mm and less than 1.0 mm.

[0275] (Appendix Method 30)

[0276] The optical sensor described in any of the embodiments 1 to 29 in the appendix, wherein...

[0277] The objects to be detected are those located within a range of 6 mm or less from the first cover and the second cover.

[0278] (Appendix Method 31)

[0279] A method for manufacturing an optical sensor, the optical sensor comprising:

[0280] A substrate having a main surface that intersects the thickness direction;

[0281] Light-emitting elements disposed on the main surface of the substrate;

[0282] A light-receiving element disposed on the main surface of the substrate;

[0283] A first cover with light transmittance is disposed on the main surface of the substrate in a manner that covers the light-emitting element; and

[0284] A second, light-transmitting cover is disposed on the main surface of the substrate in a manner that covers the light-receiving element.

[0285] The method for manufacturing the optical sensor is characterized by comprising:

[0286] A molding process in which a resin layer covering the main surface of the substrate is formed according to each of the light-emitting elements and the light-receiving elements; and

[0287] A cutting process that forms a gap between the first cover and the second cover by cutting off the portion of the resin layer that covers the light-emitting element and the portion that covers the light-receiving element.

[0288] Explanation of reference numerals in the attached figures

[0289] 10, 10A, 10A1, 10A2, 10B, 10C, 10C1, 10D, 10E, 10F… optical sensors

[0290] 10X… Comparative example optical sensor

[0291] 20...Substrate

[0292] 21…Main surface of substrate

[0293] 211… Pad 1

[0294] 212… Pad 2

[0295] 213… Pad 3

[0296] 214…Pad 4

[0297] 22…Substrate side

[0298] 221…First substrate side surface

[0299] 222…Second substrate side surface

[0300] 223…3rd substrate side

[0301] 224…4th substrate side

[0302] 23…groove

[0303] 30, 30C... Light-emitting elements

[0304] 31, 31C... Upper surface

[0305] 40, 40C...light receiving element

[0306] 41, 41C… Upper surface

[0307] 50, 50A, 50B, 50C… First Cover

[0308] 50X… Comparative example cover

[0309] 51…First upper surface

[0310] 51X… Top Surface

[0311] 52… First back view

[0312] 53…First side view

[0313] 531…First inner surface

[0314] 532…First outer surface

[0315] 533…First outer surface

[0316] 534…First outer surface

[0317] 54…First Inclined Surface

[0318] 60, 60A, 60B, 60C… Second Cover

[0319] 61…Second upper surface

[0320] 62…Second Back

[0321] 63…Second side view

[0322] 631…Second inner side

[0323] 632…Second outer surface

[0324] 633…Second outer surface

[0325] 634…Second outer surface

[0326] 64…Second Inclined Surface

[0327] 71, 72… joint lines

[0328] 80, 80A1, 80A2... Opaque Inks

[0329] 81…The first lens (an example of the first Fresnel lens)

[0330] 82… Second Lens (An example of the second Fresnel lens)

[0331] 90…Connecting part

[0332] 91… Upper surface of the connecting part

[0333] 100… intermediate

[0334] 110…large base plate

[0335] 120…resin layer

[0336] 121…Surface

[0337] 122…concave

[0338] 123…slope

[0339] 200… objects

[0340] A1…Area 1

[0341] A2…Area 2

[0342] GP…gap

[0343] GP1…Part 1

[0344] GP2…Part 2

[0345] L1~L5…Diffuse light

[0346] X…First Direction

[0347] Y...2nd direction

[0348] Z…thickness direction

Claims

1. An optical sensor, characterized in that, include: A substrate having a main surface that intersects the thickness direction; A VCSEL (Vertical Resonator Surface Laser) is disposed on the main surface of the substrate to emit laser light in a vertical direction. A light-receiving element disposed on the main surface of the substrate; A first cover element that is transparent to light is disposed on the main surface of the substrate in a manner that covers the VCSEL; and A second, light-transmitting cover is disposed on the main surface of the substrate in a manner that covers the light-receiving element. A gap is formed between the first cover and the second cover. The width of the gap is greater than 0.03 mm and less than 0.1 mm. The sides of the first and second covers that form the gap are translucent. The first cover has a first upper surface intersecting the thickness direction and a first side surface intersecting the first upper surface. The second cover has a second upper surface intersecting the thickness direction and a second side surface intersecting the second upper surface. The first side surface includes a first inner side surface facing the gap and a first outer side surface not facing the gap. The second side includes a second inner side facing the gap and a second outer side not facing the gap. The first cover has a first inclined surface at the corner connecting the first upper surface and the first inner surface, which intersects both the first upper surface and the first inner surface, thereby allowing a portion of light to easily pass through the first inclined surface. To make it difficult for some light to enter the interior of the second cover, the second cover has a second inclined surface at the corner connecting the second upper surface and the second inner surface, which intersects the second upper surface and the second inner surface.

2. The optical sensor as described in claim 1, characterized in that: The substrate has a substrate side surface. The first outer surface and the second outer surface are on the same plane as the side surface of the substrate in the thickness direction.

3. The optical sensor as described in claim 1, characterized in that: The first inner surface is rougher than the first upper surface.

4. The optical sensor as described in claim 1, characterized in that: The second inner surface is rougher than the second upper surface.

5. The optical sensor as described in claim 1, characterized in that: The first outer surface is rougher than the first upper surface.

6. The optical sensor as described in claim 1, characterized in that: The second outer surface is rougher than the second upper surface.

7. The optical sensor as described in claim 1, characterized in that: The gap is filled with air.

8. The optical sensor as described in claim 1, characterized in that: The upper surface of the VCSEL and the upper surface of the light-receiving element are offset in the thickness direction.

9. The optical sensor as described in claim 8, characterized in that: In the thickness direction, the length from the main surface of the substrate to the upper surface of the VCSEL is shorter than the length from the main surface of the substrate to the upper surface of the light-receiving element.

10. The optical sensor as described in claim 1, characterized in that: The first upper surface and the second upper surface are located on the same plane.

11. The optical sensor as described in claim 1, characterized in that: This includes a first Fresnel lens formed on the first upper surface.

12. The optical sensor as described in claim 1, characterized in that: This includes a second Fresnel lens formed on the second upper surface.

13. The optical sensor as described in claim 1, characterized in that: The first cover and the second cover are opposite each other with the gap between them. Viewed from above in the thickness direction, the gap extends in a direction orthogonal to the relative directions of the first cover and the second cover. When viewed from above in the thickness direction, the VCSEL and the light-receiving element are staggered in the extension direction of the gap.

14. The optical sensor as described in any one of claims 1 to 13, characterized in that: A groove is formed in the thickness direction on the portion of the main surface of the substrate facing the gap.

15. The optical sensor as described in claim 14, characterized in that: The main surface of the substrate has a first region and a second region divided by the groove. The VCSEL is set on the first region. The light-receiving element is disposed on the second region. The first cover is disposed on the first region in a manner that covers the VCSEL. The second cover is disposed on the second region in a manner that covers the light-receiving element. When viewed from above in the thickness direction, the light-receiving element is larger than the VCSEL, and the second region is larger than the first region.

16. A method for manufacturing an optical sensor, the optical sensor comprising: A substrate having a main surface that intersects the thickness direction; A VCSEL (Vertical Resonator Surface Laser) is disposed on the main surface of the substrate to emit laser light in a vertical direction. A light-receiving element disposed on the main surface of the substrate; A first cover element that is transparent to light is disposed on the main surface of the substrate in a manner that covers the VCSEL; and A second, light-transmitting cover is disposed on the main surface of the substrate in a manner that covers the light-receiving element. The method for manufacturing the optical sensor is characterized by: A gap is formed between the first cover and the second cover. The width of the gap is greater than 0.03 mm and less than 0.1 mm. The sides of the first and second covers that form the gap are translucent. The first cover has a first upper surface intersecting the thickness direction and a first side surface intersecting the first upper surface. The second cover has a second upper surface intersecting the thickness direction and a second side surface intersecting the second upper surface. The first side surface includes a first inner side surface facing the gap and a first outer side surface not facing the gap. The second side includes a second inner side facing the gap and a second outer side not facing the gap. The first cover has a first inclined surface at the corner connecting the first upper surface and the first inner surface, which intersects both the first upper surface and the first inner surface, thereby allowing a portion of light to easily pass through the first inclined surface. To prevent light from penetrating the interior of the second cover, the second cover has a second inclined surface at the corner connecting the second upper surface and the second inner surface, which intersects both the second upper surface and the second inner surface. The method for manufacturing the optical sensor includes: A molding process in which a resin layer covering the main surface of the substrate is formed according to each VCSEL and the light-receiving element; and The cutting process forms the gap between the first cover and the second cover by cutting off the portion of the resin layer that covers the VCSEL and the portion that covers the light-receiving element.

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