A semiconductor laser mount applicable to installations in different environments

Abstract

The present invention provides a semiconductor laser mount applicable to installation in different environments, relating to the technical field of mounts, including a collecting member: the bottom of the collecting member is inserted into the inner part of the top groove, a channel is provided inside the collecting member, and the collecting member includes: a contact member, both sides of the contact member are inclined structures, a groove is provided inside the contact member, the contact member is arranged inside an auxiliary member, and the top end of the contact member is communicated with the inside of the auxiliary member. When it rains, rainwater is converged and circulated by the side plate, so that the rainwater can enter the inside of the contact member and the auxiliary member, and then the rainwater is used for heat dissipation. When the rainwater is discharged, a part of it is blocked by the baffle, thereby increasing the residence time of the rainwater, and further enhancing the heat dissipation effect, solving the problem that the existing semiconductor laser mount cannot use rainwater for heat dissipation when it rains and lacks a structure for enhancing the heat dissipation effect.

Description

Technical Field

[0001] The present invention relates to the technical field of mounting bases, and particularly relates to a semiconductor laser mounting base applicable to installation in different environments. Background Art

[0002] When a semiconductor laser is in use, a mounting base is usually required so that the semiconductor laser can be fixedly installed and used, and the semiconductor laser can be installed in an appropriate position.

[0003] However, for the existing semiconductor laser mounting bases, the fixed contact area with the laser is relatively large, which easily affects air circulation and heat dissipation effect, easily causes scratches on the surface of the laser, and the installation environment of the mounting base is restricted. When installed in other environments such as outdoors, there is a lack of a protection mechanism. When it rains, it is impossible to use rainwater for heat dissipation, and there is a lack of a structure to enhance the heat dissipation effect. Summary of the Invention

[0004] In view of this, the present invention provides a semiconductor laser mounting base applicable to installation in different environments, which has contact blocks, can reduce the contact area with the laser, make air circulation smoother, and is in flexible contact with the laser to avoid scratches or marks on the outside of the laser.

[0005] The present invention provides a semiconductor laser mounting base applicable to installation in different environments, specifically including: a main body; the main body is the mounting base body, the main body is in a rectangular frame structure, and the main body includes: contact blocks, the contact blocks are in a rectangular structure, the contact blocks are made of rubber, there are four contact blocks in total, and every two contact blocks are respectively installed on both sides inside a moving member. There are two arc-shaped grooves inside each contact block, and a top member is embedded in the arc-shaped grooves. A protection member is installed at the top of the main body. The protection member is in an L-shaped structure. There is a rectangular groove inside the protection member, and there is a rectangular groove above the rear end of the protection member. A collection member is installed at the top of the protection member. The collection member is in a T-shaped structure. The bottom of the collection member is inserted into the inside of the top groove. There is a channel inside the collection member. The collection member includes: a contact member, the contact member is in a rectangular structure, both sides of the contact member are inclined structures, there is a groove inside the contact member, the contact member is made of silica gel, the contact member is arranged inside an auxiliary member, and the top of the contact member is communicated with the inside of the auxiliary member.

[0006] Optionally, the main body further includes: a connecting member, the connecting member is in an L-shaped structure, the outer end of the connecting member is in a wedge-shaped structure, a circular hole is provided inside the connecting member, there are four connecting members in total, and the four connecting members are respectively fixed on both sides of the bottom of the main body. A bottom plate is provided between every two connecting members, and the bottom plate is in an inclined plate-like structure; the main body further includes: a bracket, the bracket is in an inverted U-shaped structure, there are two brackets in total, and the two brackets are respectively fixed at both ends above the main body. On both sides of the inner side of the top end of each bracket, a bump is provided respectively. On both sides of each bracket, two guiding holes are provided respectively, and the guiding holes are in a circular structure; the main body further includes: a moving member, the moving member is in an H-shaped structure, a rectangular groove is provided inside the moving member, there are two moving members in total, and the two moving members are respectively arranged on both sides of the two brackets. On both sides of the outer end of each moving member, a pulling member is provided respectively. The outer end of the pulling member is in a rectangular plate-like structure. The inside of the pulling member is composed of two round rods, a spring is sleeved outside the round rods, the round rods are inserted inside the guiding holes, and an outer member is provided on the outer side of each moving member. The outer member is in a rectangular frame structure, and the upper and lower sides inside the outer member are in an inclined shape. There are two outer members in total, and the two outer members are respectively fixed on the outer sides of the two moving members; the main body further includes: a top member, the top member is in an arc-shaped plate-like structure, the top member is made of spring plate material, and there are eight top members in total. Every four top members are respectively fixed on both sides inside one moving member.

[0007] Optionally, the protective member includes: a top groove, the top groove is in a rectangular structure, and the top groove is arranged at the middle position of the top end of the protective member; an insertion plate, the insertion plate is in an L-shaped plate-like structure, there are four insertion plates in total, and the four insertion plates are arranged at the bottom of the protective member, and the insertion plates are inserted inside the inner side of the top end of the bracket; the protective member further includes: a baffle plate, the baffle plate is in an L-shaped plate-like structure, the baffle plate is inserted inside the rectangular groove of the protective member, and a bottom groove is provided at the bottom of the baffle plate, and the top end of the bottom groove is in an arc-shaped structure.

[0008] Optionally, the collecting member further includes: side plates, the side plates are in an inclined plate-like structure, there are two side plates in total, and the two side plates are respectively fixed on both sides of the top end of the collecting member; auxiliary blocks, the auxiliary blocks are in a triangular structure, there are two auxiliary blocks in total, and the two auxiliary blocks are respectively arranged on both sides of the collecting member; the collecting member further includes: an auxiliary member, the auxiliary member is in a rectangular frame structure, the auxiliary member is arranged at the bottom of the collecting member, and the inside of the auxiliary member is communicated with the channel of the collecting member; the collecting member further includes: a blocking block, the blocking block is in a wedge-shaped structure, there are two blocking blocks in total, and the two blocking blocks are respectively fixed on both sides of the inner bottom end of the auxiliary member, and an outer rod is provided at both ends of the outer side of each blocking block, and the outer rod is in a U-shaped structure.

[0009] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0010] 1. Compared with traditional semiconductor laser mounts, the semiconductor laser mount of each embodiment of the present invention has a collector that can collect rainwater and wind, allowing the rainwater and wind to assist the semiconductor laser in heat dissipation, resulting in better heat dissipation effects.

[0011] 2. By installing a moving member, the spring outside the pull rod pushes the moving member to displace, causing the moving member to contact the semiconductor laser through a contact block. Since the pull member is a long strip structure, the contact area is reduced when it contacts the semiconductor laser, avoiding affecting air circulation and improving the heat dissipation efficiency at the same time.

[0012] The inside of the contact block is connected to a top member with an arc structure through an arc groove, allowing the wind to pass through the inside of the top member, making the air circulation smoother. The top member continuously pushes the moving member, providing a better contact fixation effect with the semiconductor laser, enabling the heat generated by the semiconductor laser to be dissipated better. The contact block is made of rubber material, providing anti-slip fixation and flexible contact when contacting the semiconductor laser, preventing the semiconductor laser from loosening and avoiding scratching the surface of the semiconductor laser, preventing deformation of the semiconductor laser.

[0013] 3. By installing a protective member and a collector, the main body can be used in various environments. The protective member protects the semiconductor laser from damage.

[0014] When the semiconductor laser is used outdoors, the collector is installed above the protective member through the protective member. When the wind passes by, the side and auxiliary blocks of the collector assist in converging the wind, changing the flow direction of the wind, and entering the inside of the auxiliary member through the collector, thereby taking away the heat transferred from the semiconductor laser to the contact member.

[0015] In case of rain, the rainwater is converged and flowed by the side plate, entering the inside of the contact member and the auxiliary member, thereby using the rainwater for heat dissipation. At the same time, a part of the rainwater can remain inside the contact member, making the heat dissipation effect better. When the rainwater drains, a part of it is blocked by the block, increasing the residence time of the rainwater and enhancing the heat dissipation effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings of the embodiments will be briefly introduced below.

[0017] The drawings in the following description only relate to some embodiments of the present invention and do not limit the present invention.

[0018] In the drawings:

[0019] Figure 1 A schematic diagram showing the three-dimensional structure of the mount according to the embodiment of the present invention is shown;

[0020] Figure 2 The figure shows a schematic view of the bottom-up structure of the mounting base according to an embodiment of the present invention;

[0021] Figure 3 The figure shows a schematic view of the exploded three-dimensional structure of the mounting base according to an embodiment of the present invention;

[0022] Figure 4 The figure shows a schematic view of the exploded bottom-up structure of the mounting base according to an embodiment of the present invention;

[0023] Figure 5 The figure shows a schematic view of the exploded three-dimensional structure of the main body of the mounting base according to an embodiment of the present invention;

[0024] Figure 6 The figure shows a schematic view of the exploded bottom-up structure of the main body of the mounting base according to an embodiment of the present invention;

[0025] Figure 7 The figure shows a schematic view of the exploded bottom-up structure of the protective member of the mounting base according to an embodiment of the present invention;

[0026] Figure 8 The figure shows a schematic view of the internal structure of a partial cross-section of the collection member of the mounting base according to an embodiment of the present invention.

[0027] List of reference numerals

[0028] 1. Main body; 101. Connecting member; 102. Bottom plate; 103. Bracket; 104. Guide hole; 105. Moving member; 106. Outer member; 107. Top member; 108. Contact block;

[0029] 2. Protective member; 201. Top groove; 202. Insert plate; 203. Baffle; 204. Bottom groove;

[0030] 3. Collection member; 301. Side plate; 302. Auxiliary block; 303. Auxiliary member; 304. Contact member; 305. Stopper; 306. Outer rod. Detailed description of the specific embodiments

[0031] In order to make the objectives, solutions, and advantages of the technical solutions of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings of the specific embodiments of the present invention. Unless otherwise specified, the terms used herein have the ordinary meanings in the art. The same reference numerals in the drawings represent the same components.

[0032] Embodiment: Please refer to Figures 1 to 8 :

[0033] The present invention provides a semiconductor laser mount that can be adapted for installation in different environments, including: a main body 1; the main body 1 is the mount body, and the main body 1 is in a rectangular frame structure, which allows air flow to be smoother. The main body 1 includes: a contact block 108, the contact block 108 is in a rectangular structure, and the contact block 108 is made of rubber, which can anti-slip fix and flexibly contact with the semiconductor laser, avoiding scratches on the surface of the semiconductor laser and preventing the semiconductor laser from being deformed under pressure. There are four contact blocks 108 in total, which can contact the semiconductor laser at multiple positions. Every two contact blocks 108 are respectively installed on both sides inside a moving member 105. Each contact block 108 has two arc-shaped grooves inside, and a top member 107 is embedded in the arc-shaped grooves, so that the top member 107 can be supported and fixed inside the arc-shaped grooves, making the fixing effect of the contact block 108 better. A protective member 2 is installed at the top of the main body 1. The protective member 2 is in an L-shaped structure. There is a rectangular groove inside the protective member 2, and there is a rectangular groove above the rear end of the protective member 2, which can effectively protect the semiconductor laser, and the joint position of the semiconductor laser can also be protected, avoiding contamination by rainwater. A collecting member 3 is installed at the top of the protective member 2. The collecting member 3 is in a T-shaped structure. The bottom of the collecting member 3 is inserted into the top groove 201. There is a channel inside the collecting member 3, so that wind or rainwater can flow inside it, thereby enhancing the heat dissipation effect of the semiconductor laser. The collecting member 3 includes: a contact member 304, the contact member 304 is in a rectangular structure, both sides of the contact member 304 are inclined structures, and there is a groove inside the contact member 304, which can intercept a part of the rainwater, so that the rainwater can enhance the heat dissipation effect. The contact member 304 is made of silica gel, which allows better temperature transfer. The contact member 304 is arranged inside the auxiliary member 303, and the top of the contact member 304 is communicated with the inside of the auxiliary member 303.

[0034] As Figure 7 shown, among them, the protective member 2 includes: a top groove 201, the top groove 201 is in a rectangular structure, and the top groove 201 is arranged at the middle position of the top of the protective member 2, which is used to insert and install the bottom of the collecting member 3, so that the collecting member 3 can be installed, and at the same time the collecting member 3 can move downward, so that the contact member 304 can continuously contact the semiconductor laser for heat dissipation; an insertion plate 202, the insertion plate 202 is in an L-shaped plate structure, and there are four insertion plates 202 in total. The four insertion plates 202 are arranged at the bottom of the protective member 2, which are used to insert into the inner side of the bracket 103, so that the protective member 2 can be conveniently installed and used. The insertion plate 202 is inserted into the inner side of the top of the bracket 103; the protective member 2 also includes: a baffle 203, the baffle 203 is in an L-shaped plate structure, and the baffle 203 is inserted into the rectangular groove inside the protective member 2, and can be installed and moved behind the protective member 2, thereby sealing the rear of the protective member 2, avoiding rainwater from contaminating the wiring part of the semiconductor laser when it rains. There is a bottom groove 204 at the bottom of the baffle 203, which is used for the line to pass through, avoiding the line from being bent. The top of the bottom groove 204 is in an arc-shaped structure.

[0035] As Figure 5 and Figure 6 shown, wherein, the main body 1 further includes: a connecting member 101, the connecting member 101 is an L-shaped structure, the outer end of the connecting member 101 is a wedge-shaped structure, which can increase the installation connection area, there is a round hole inside the connecting member 101, and it can be fixedly installed through bolts. There are four connecting members 101 in total, and the four connecting members 101 are respectively fixed on both sides of the bottom of the main body 1. There is a bottom plate 102 between every two connecting members 101. The bottom plate 102 is an inclined plate-like structure, so that the wind flowing through the bottom of the main body 1 can be guided, and the wind can pass through the bottom of the semiconductor laser; the main body 1 further includes: a bracket 103, the bracket 103 is an inverted U-shaped structure, there are two brackets 103 in total, and the two brackets 103 are respectively fixed at both ends above the main body 1. There is a bump on both sides inside the top end of each bracket 103, which is used to assist in installing the protective member 2 and the moving member 105. There are two guiding holes 104 on both sides of each bracket 103. The guiding holes 104 are circular structures, which are used to insert and install the pulling round rod of the moving member 105, so that the pulling member can drive the moving member 105 to receive the spring power and guide the displacement, and then clamp and fix the semiconductor laser; the main body 1 further includes: a moving member 105, the moving member 105 is an H-shaped structure, there is a rectangular groove inside the moving member 105, so that the wind can pass through. There are two moving members 105 in total, and the two moving members 105 are respectively arranged on both sides of the two brackets 103, and can fix both sides of the semiconductor laser. There is a pulling member on both outer sides of each moving member 105. The outer end of the pulling member is a rectangular plate-like structure, which is used to conveniently control the outward movement of the moving member 105. The inside of the pulling member is composed of two round rods, and a spring is sleeved on the outside of the round rod, which is used to push the moving member 105 to move, so that the moving member 105 can clamp the semiconductor laser. The round rod is inserted into the inside of the guiding hole 104. There is an outer member 106 on the outside of each moving member 105. The outer member 106 is a rectangular frame structure, and the upper and lower sides inside the outer member 106 are inclined structures, which play a role in allowing the wind to pass through and enhancing the heat dissipation effect of the semiconductor laser. There are two outer members 106 in total, and the two outer members 106 are respectively fixed on the outside of the two moving members 105; the main body 1 further includes: a top member 107, the top member 107 is an arc-shaped plate-like structure, which can effectively enhance the supporting effect on the contact block 108. The top member 107 is made of spring plate material and can have better elasticity. There are eight top members 107 in total, and every four top members 107 are respectively fixed on both sides inside a moving member 105.

[0036] As Figure 8As shown, the collecting member 3 further includes: side plates 301 which are inclined plate-like structures. There are two side plates 301 in total, and the two side plates 301 are respectively fixed on both sides of the top end of the collecting member 3. When the wind passes, it can converge, thereby changing the flowing direction of the wind, enabling the wind to enter the interior of the auxiliary member 303 for heat dissipation, and at the same time, it can converge rainwater so that the rainwater can flow for heat dissipation; auxiliary blocks 302 which are triangular structures. There are two auxiliary blocks 302 in total, and the two auxiliary blocks 302 are respectively arranged on both sides of the collecting member 3. When the rainwater falls, it can be converged to prevent the rainwater from flowing out laterally; the collecting member 3 further includes: an auxiliary member 303 which is a rectangular frame structure. The auxiliary member 303 is arranged at the bottom of the collecting member 3, and the interior of the auxiliary member 303 is communicated with the channel of the collecting member 3, and is used to drive the contact member 304 to contact the semiconductor laser, so that the heat dissipated by the semiconductor laser can be directly taken away or dissipated by the passing wind or rainwater; the collecting member 3 further includes: a stop block 305 which is a wedge-shaped structure. There are two stop blocks 305 in total, and the two stop blocks 305 are respectively fixed on both sides of the inner bottom end of the auxiliary member 303. When the water is discharged, a part of it can be intercepted to reduce the flow rate of the water, thereby enhancing the heat dissipation duration. An outer rod 306 is respectively arranged at both outer ends of each stop block 305, and the outer rod 306 is a U-shaped structure to enable the rainwater to be discharged.

[0037] Specific usage method and function of this embodiment: In the present invention, the main body 1 can be placed at an appropriate position manually first, and then the bolt passes through the round hole of the connecting member 101 and is fixed to the connecting position, so that the main body 1 can be stably installed. Then, the pulling member is pulled manually to move the two moving members 105 outwards. Then, the semiconductor laser to be installed is placed on the top of the main body 1. Then, the pulling member is released, and the spring can push the moving member 105 to displace, so that the moving member 105 can push the top member 107 and the contact block 108, and the contact block 108 can be in flexible contact with the semiconductor laser, avoiding scratches on the surface of the semiconductor laser and deformation of the semiconductor laser. At the same time, the wind can pass through the inside of the top member 107 without affecting the air flow. When the semiconductor laser and the main body 1 are installed and used outdoors or in other environments, the protective member 2 can be controlled to be installed, so that the plug board 202 can be inserted into the inside of the bracket 103, and the protective member 2 can be installed, and the baffle 203 can fall freely, thereby protecting the rear end of the semiconductor laser. When encountering rain, the rainwater will not contaminate the wiring part. At the same time, the bottom of the contact member 304 contacts the top of the semiconductor laser. When the device is in use and there is wind passing by, the side plate 301 can divert and collect the wind, so that the wind can enter the inside of the auxiliary member 303, and then take away the heat transferred from the semiconductor laser to the contact member 304, so that the heat can be quickly discharged. When encountering rainy days, the top of the side plate 301 can collect rainwater. After the rainwater enters, it can be above the contact member 304, thereby making the heat dissipation effect better. When the rainwater is discharged, it can pass through the baffle 305, and the baffle 305 can block part of the water, reducing the water flow rate and increasing the residence time of the water, making the heat dissipation effect better. Then the rainwater is discharged through the outer rod 306. After the rain stops, part of the rainwater will stay above the contact member 304, so that not all of the rainwater is discharged, and the remaining rainwater can increase the heat dissipation time.

[0038] Finally, it should be noted that when the present invention describes the positions of various components and their cooperation relationships, etc., usually one / a pair of components are taken as examples. However, those skilled in the art should understand that such positions, cooperation relationships, etc. are equally applicable to other components / other pairs of components.

[0039] The above description is only an exemplary embodiment of the present invention and is not used to limit the protection scope of the present invention. The protection scope of the present invention is determined by the appended claims.

Claims

1. A semiconductor laser mounting base applicable to installations in different environments, characterized in that, Comprising: A main body (1); the main body (1) is a mounting base body, and the main body (1) includes: a contact block (108), the contact block (108) is installed inside the moving member (105), two arc-shaped grooves are provided inside the contact block (108), a top member (107) is embedded inside the arc-shaped grooves, a protective member (2) is installed at the top end of the main body (1), a rectangular groove is provided inside the protective member (2), a rectangular groove is provided above the rear end of the protective member (2), a collecting member (3) is installed at the top end of the protective member (2), the bottom of the collecting member (3) is inserted inside the top groove (201), a channel is provided inside the collecting member (3), and the collecting member (3) includes: side plates (301), the side plates (301) are fixed to the top end of the collecting member (3); auxiliary blocks (302), the auxiliary blocks (302) are provided on the outside of the collecting member (3); contact members (304), both sides of the contact members (304) are inclined structures, grooves are provided inside the contact members (304), the contact members (304) are provided inside the auxiliary members (303), and the top ends of the contact members (304) communicate with the inside of the auxiliary members (303); the main body (1) further includes: a connecting member (101), the outer end of the connecting member (101) is a wedge-shaped structure, a round hole is provided inside the connecting member (101), the connecting member (101) is fixed to the bottom of the main body (1), a bottom plate (102) is provided between the connecting members (101), and the bottom plate (102) is an inclined plate-shaped structure; the main body (1) further includes: a bracket (103), the bracket (103) is fixed above the main body (1), a convex block is provided inside the top end of the bracket (103), and a guiding hole (104) is provided on the outside of the bracket (103); the main body (1) further includes: a moving member (105), a rectangular groove is provided inside the moving member (105), the moving member (105) is provided on both sides of the bracket (103), pulling members are provided on both outer ends of the moving member (105), the outer ends of the pulling members are rectangular plate-shaped structures, the inside of the pulling members is composed of two round rods, the round rods are inserted inside the guiding holes (104), an outer member (106) is provided on the outside of the moving member (105), both the upper and lower sides of the inside of the outer member (106) are inclined structures, and the outer member (106) is fixed to the outside of the moving member (105); the main body (1) further includes: a top member (107), the top member (107) is made of spring plate material, and the top member (107) is fixed inside the moving member (105); the collecting member can collect rainwater and wind, and the rainwater and wind assist the semiconductor laser in heat dissipation; the protective member (2) includes: a top groove (201), the top groove (201) is provided at the middle position of the top end of the protective member (2); an insertion plate (202), the insertion plate (202) is provided at the bottom of the protective member (2), and the insertion plate (202) is inserted inside the inner side of the top end of the bracket (103); the protective member (2) further includes: a baffle (203), the baffle (203) is inserted inside the rectangular groove of the protective member (2), a bottom groove (204) is provided at the bottom of the baffle (203), and the top end of the bottom groove (204) is an arc-shaped structure.

2. The semiconductor laser mount applicable to installation in different environments as described in claim 1, wherein: The collecting member (3) further includes: an auxiliary member (303), the auxiliary member (303) is provided at the bottom of the collecting member (3), and the inside of the auxiliary member (303) is communicated with the channel of the collecting member (3).

3. The semiconductor laser mount applicable to installation in different environments according to claim 1, characterized in that: The collecting member (3) further includes: a stopper (305), the stopper (305) is fixed to the inner bottom end of the auxiliary member (303), and an outer rod (306) is provided on the outer side of the stopper (305).

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