Heat sink for communication setup

Abstract

This application belongs to the field of communication technology and discloses a heat sink for communication devices. The heat sink includes: a base assembly with a liquid inlet chamber inside, configured to contain refrigerant; a top cover assembly with a liquid return chamber; and heat dissipation fins erected between and connected to the base assembly and the top cover assembly, respectively. A channel is provided within the heat dissipation fins, with the bottom end of the channel connected to the liquid inlet chamber and the top end connected to the liquid return chamber. When the area where the base assembly and the chip are in contact is heated, heat is transferred through the base assembly to the liquid inlet chamber, causing the refrigerant in the liquid inlet chamber to boil and vaporize into gaseous refrigerant. The gaseous refrigerant enters the liquid return chamber through the channel and condenses into liquid refrigerant, which can then flow back into the liquid inlet chamber through the channel.

Description

Technical Field

[0001] This application relates to the field of communication technology, for example to a heat sink for communication devices. Background Technology

[0002] With the enrichment of people's lives and the rapid development of 5G mobile communication technology, chip technology has been extensively developed, leading to increased chip power and enhanced power for outdoor communication base station equipment. As the power consumption of chips increases and the usage time extends, chips release a large amount of heat. If this heat cannot be dissipated in time, the chip will be damaged due to overheating.

[0003] To address this issue, heat dissipation devices employ two methods. The first method relies on natural convection within the substrate, using airflow for heat exchange. However, this method is ineffective and fails to meet the cooling requirements of communication equipment. The second method involves inlets and outlets at both ends of the substrate. Refrigerant enters the substrate through the inlets, absorbs heat from within, and exits through the outlets. The second method requires a continuous supply and discharge of refrigerant during the heat dissipation process. The additional pumps or piping result in a complex structure, larger footprint, and higher production costs. Summary of the Invention

[0004] This application provides a heat sink for communication devices, which has good heat dissipation effect and low production cost.

[0005] A heat sink for communication setups, used for cooling chips, is provided, comprising:

[0006] A base assembly, wherein a liquid inlet chamber is provided inside the base assembly, and the liquid inlet chamber is configured to contain refrigerant;

[0007] A top cover assembly is arranged parallel and spaced apart from the base assembly, and a liquid return chamber is provided on the top cover assembly;

[0008] A heat dissipation fin is erected between the base assembly and the top cover assembly and is connected to the base assembly and the top cover assembly respectively. A channel is provided in the heat dissipation fin, the bottom end of the channel is connected to the liquid inlet chamber, and the top end of the channel is connected to the liquid return chamber.

[0009] When the base assembly and the chip are in contact with each other, the heat is transferred to the liquid inlet chamber through the base assembly, causing the refrigerant in the liquid inlet chamber to boil and vaporize into gaseous refrigerant. The gaseous refrigerant enters the liquid return chamber through the channel and condenses into liquid refrigerant. The liquid refrigerant can flow back into the liquid inlet chamber through the channel.

[0010] Optionally, the number of heat dissipation fins is multiple, and the multiple heat dissipation fins are arranged in parallel and spaced apart, and the multiple heat dissipation fins are of at least one type.

[0011] Optionally, each heat sink fin has multiple channels, with a first interval or a second interval between adjacent channels.

[0012] Optionally, a through groove is provided at the bottom of the heat dissipation fin, the through groove is connected to the channel, and the angle between the extending direction of the through groove and the extending direction of the channel is in the range of 85 degrees to 95 degrees.

[0013] Optionally, the base assembly includes a base plate and a bottom insert plate. The bottom insert plate is located above the base plate and connected to the base plate. The liquid inlet cavity is formed between the bottom insert plate and the base plate. A first insertion hole is provided on the bottom insert plate. A first protrusion is correspondingly provided on the bottom of the heat dissipation fin. The first protrusion passes through the first insertion hole.

[0014] Optionally, one of the base plate and the bottom insert plate is provided with a limiting post, and the other is provided with a limiting hole, with the limiting post passing through the limiting hole.

[0015] Optionally, a support column is provided on the side of the base plate near the bottom insert plate, and the base plate is connected to the bottom insert plate through the support column.

[0016] Optionally, at least one of the base plate and the bottom insert plate is provided with a liquid injection pipe, which is connected to the liquid inlet chamber and supplies refrigerant to the liquid inlet chamber.

[0017] Optionally, the top cover assembly includes a cover plate and a top insert plate. The top insert plate is located below the cover plate and connected to the cover plate. The return fluid chamber is formed between the top insert plate and the cover plate. A second insertion hole is provided on the top insert plate. A second protrusion is correspondingly provided on the top of the heat dissipation fins. The second protrusion passes through the second insertion hole.

[0018] Optionally, the base assembly, the top cover assembly, and the heat dissipation fins are connected by high-temperature brazing. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the heat sink used in the communication setup of this application;

[0020] Figure 2 This is a cross-sectional view of the heat sink used in the communication setup of this application;

[0021] Figure 3 yes Figure 2 A magnified view of a portion at point A;

[0022] Figure 4 This is a schematic diagram of the heat sink used in the communication setup of this application;

[0023] Figure 5 This is a schematic diagram of the base plate of the heat sink used in the communication setup of this application;

[0024] Figure 6 This is a schematic diagram of the bottom insert plate of the heat sink used in the communication setup of this application;

[0025] Figure 7 This is a schematic diagram of the structure of the cover plate in the heat sink used for communication settings in this application;

[0026] Figure 8 This is a schematic diagram of the top insert plate in the heat sink used for communication settings in this application;

[0027] Figure 9 This is a schematic diagram of the heat sink fins in the heat sink used for communication devices in this application;

[0028] Figure 10 yes Figure 9 A magnified view of a section at point B.

[0029] In the picture:

[0030] 1. Base assembly; 2. Top cover assembly; 3. Heat sink fins; 4. Liquid injection pipe;

[0031] 11. Liquid inlet chamber; 12. Base plate; 13. Bottom insert plate;

[0032] 121. Limiting post; 122. Supporting post; 123. Receiving groove; 131. Limiting hole; 132. First insertion hole;

[0033] 21. Return chamber; 22. Cover plate; 23. Top insert plate; 231. Second insertion hole;

[0034] 31. Channel; 32. First protrusion; 33. Second protrusion; 34. Through groove. Detailed Implementation

[0035] The technical solutions of the embodiments of this application will be described below with reference to the accompanying drawings. The described embodiments are only some embodiments of this application, and not all embodiments.

[0036] In the description of this application, unless otherwise specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two elements or the interaction between two elements. The meaning of the above terms in this application can be understood according to the specific circumstances.

[0037] In this application, unless otherwise specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0038] The technical solution of this application will be described below with reference to the accompanying drawings and embodiments.

[0039] In the field of communications, chips serve as controllers for the communication process and have a wide range of applications. However, chips tend to generate significant heat during prolonged use, and if this heat is not dissipated in a timely manner, it can cause damage. Heat sinks used for chip cooling suffer from poor heat dissipation performance, high production costs, and difficulty in meeting user needs.

[0040] To address this issue, this embodiment provides a heat sink for communication settings, used for cooling the chip. The heat sink for communication setup includes: a base assembly 1, with a liquid inlet chamber 11 inside, the liquid inlet chamber 11 being configured to contain refrigerant; a top cover assembly 2, parallel and spaced apart from the base assembly 1, with a liquid return chamber 21 on the top cover assembly 2; and heat dissipation fins 3, erected between the base assembly 1 and the top cover assembly 2 and connected to both, with a channel 31 within the heat dissipation fins 3, the bottom end of the channel 31 connecting to the liquid inlet chamber 11 and the top end of the channel 31 connecting to the liquid return chamber 21. When the area where the base assembly 1 and the chip are in contact is heated, heat is transferred through the base assembly 1 to the liquid inlet chamber 11, causing the refrigerant in the liquid inlet chamber 11 to boil and vaporize into gaseous refrigerant. The gaseous refrigerant enters the liquid return chamber 21 through the channel 31 and condenses into liquid refrigerant. The liquid refrigerant can flow back into the liquid inlet chamber 11 through the channel 31. Figure 1As shown, the heat sink for communication devices includes a base assembly 1, a top cover assembly 2, and heat dissipation fins 3. The top cover assembly 2 is disposed above the base assembly 1, and the base assembly 1 provides overall support. The top cover assembly 2 is disposed parallel to the base assembly 1 to form an accommodating space between the top cover assembly 2 and the base assembly 1. The heat dissipation fins 3 are erected in the accommodating space, that is, the heat dissipation fins 3 are disposed perpendicularly to the base assembly 1. The bottom and top ends of the heat dissipation fins 3 are respectively connected to the base assembly 1 and the top cover assembly 2 to form an integral structure with good structural stability.

[0041] A chip is attached to the side of the base assembly 1 away from the top cover assembly 2. To ensure timely and effective heat dissipation for the chip, such as... Figure 2-Figure 3 As shown, a liquid inlet chamber 11 is provided inside the base assembly 1 to contain refrigerant. A liquid return chamber 21 is provided on the top cover assembly 2. A channel 31 is provided inside the heat dissipation fins 3. The bottom end of the channel 31 is connected to the liquid inlet chamber 11, and the top end of the channel 31 is connected to the liquid return chamber 21 to form a complete circulation loop. The inner diameter of the channel 31 is very small, so the channel 31 can also be referred to as a microchannel.

[0042] The heat sink provided in this embodiment for communication setup, when the position where the base assembly 1 and the chip are in contact is heated, the heat is transferred through the base assembly 1 to the liquid inlet chamber 11, causing the liquid refrigerant in the liquid inlet chamber 11 to boil and vaporize rapidly to form gaseous refrigerant. The gaseous refrigerant diffuses to the top of the heat dissipation fins 3 through the channel 31. Under the condensation effect of the channel 31, rapid heat dissipation is achieved, and finally it enters the return chamber 21 to condense and form liquid refrigerant. At this time, under the action of gravity, the liquid refrigerant can flow back to the liquid inlet chamber 11 through the channel 31 to realize a complete refrigerant circulation loop. The two-phase flow conversion is continuously realized in the two chambers of the heat sink 11 and the return chamber 21, so that the base assembly 1, which is the heat-generating end, the heat dissipation fins 3, which is the condensing end, and the top cover assembly 2 reach a state of rapid temperature uniformity, thereby removing the heat from the heat-generating part of the chip through the heat sink to achieve the purpose of rapid cooling.

[0043] This heat sink for communication equipment, compared with the heat dissipation method of natural convection, uses the refrigerant to achieve heat exchange through heating, vaporization and condensation, and reflux, which improves the heat dissipation effect. Moreover, it does not require additional pumps and connecting pipes. It only needs to open cavity structures in multiple parts to achieve heat dissipation. It has a simple structure, small footprint, and low production cost.

[0044] In one embodiment, the base assembly 1 includes a base plate 12 and a bottom insert plate 13. The bottom insert plate 13 is located above the base plate 12 and connected to the base plate 12. The liquid inlet cavity 11 is formed between the bottom insert plate 13 and the base plate 12. A first insertion hole 132 is provided on the bottom insert plate 13. A first protrusion 32 is correspondingly provided on the bottom of the heat dissipation fin 3. The first protrusion 32 passes through the first insertion hole 132.

[0045] like Figure 4 As shown, the base assembly 1 includes a base plate 12 and a bottom insert plate 13. The base plate 12 is manufactured by forging or liquid forging, and the bottom insert plate 13 is formed by stamping composite material. The bottom insert plate 13 is located above the base plate 12 and connected to the base plate 12. The bottom insert plate 13 and the base plate 12 are arranged parallel to each other and form a liquid inlet cavity 11 between them.

[0046] In one embodiment, if both the base plate 12 and the bottom insert plate 13 are plate-shaped structures, the liquid inlet chamber 11 is merely a gap between the base plate 12 and the bottom insert plate 13, resulting in a small volume for accommodating the refrigerant. To ensure that the liquid inlet chamber 11 has a larger volume, optionally, as follows: Figure 5 As shown, a receiving groove 123 is provided on the side of the base plate 12 near the bottom insert plate 13. This is equivalent to forming a receiving groove 123 by recessing the top surface of the base plate 12. When the bottom surface of the bottom insert plate 13 and the top surface of the base plate 12 are attached, the bottom insert plate 13 covers the receiving groove 123. This not only ensures that the liquid inlet chamber 11 has a certain volume, but also prevents the refrigerant from overflowing from the liquid inlet chamber 11, thus achieving the function of encapsulating the refrigerant.

[0047] When assembling the heat sink, the base plate 13 needs to be installed on the base plate 12. To ensure the installation accuracy between the base plate 13 and the base plate 12, such as... Figure 5 and Figure 6 As shown, one of the base plate 12 and the bottom insert plate 13 is provided with a limiting post 121, and the other is provided with a limiting hole 131. The limiting post 121 passes through the limiting hole 131. Through the mutual cooperation of the limiting post 121 and the limiting hole 131, a good positioning effect between the bottom insert plate 13 and the base plate 12 is achieved, ensuring precise alignment between the two. In this embodiment, the limiting post 121 can be provided on the side of the base plate 12 near the bottom insert plate 13, and the limiting hole 131 is provided on the bottom insert plate 13 corresponding to the limiting post 121. The limiting post 121 has a cylindrical structure, and the limiting hole 131 has a circular hole structure. The limiting post 121 is inserted into the limiting hole 131, which is simple in structure and convenient to use.

[0048] Since a receiving groove 123 is provided in the middle of the base plate 12, the limiting post 121 can have two types, a first limiting post and a second limiting post, depending on the inner and outer areas of the receiving groove 123. There can be multiple first limiting posts, arranged around the receiving groove 123. Each first limiting post passes through a corresponding limiting hole 131, used to limit the base plate 12 when it is located in the outer area of ​​the receiving groove 123. Similarly, there can be multiple second limiting posts, arranged parallel and spaced apart inside the receiving groove 123. Each second limiting post passes through a corresponding limiting hole 131, used to limit the base plate 12 when it is located in the inner area of ​​the receiving groove 123.

[0049] In one embodiment, since there is a height difference between the bottom wall of the receiving groove 123 and the top surface of the bottom plate 12, in order to ensure that the top surfaces of the first limiting post and the second limiting post are at the same height, a limiting platform can be provided between the second limiting post and the bottom wall of the receiving groove 123. The limiting platform is equivalent to compensating for the height of the second limiting post and realizing the function of raising the height of the second limiting post, thereby ensuring that the top surface heights of the two limiting posts 121 are at the same height and avoiding the situation where the heat dissipation fins 3 are pushed out or protruded.

[0050] If the heat sink fins 3 and the base plate 13 are fixed by plugging in, it is difficult to guarantee the overall structural fixation effect. Optionally, the base assembly 1, the top cover assembly 2 and the heat sink fins 3 are connected by high-temperature brazing. The solder is not limited to powder. The high-temperature brazing process is simple to operate and the structure is reliable.

[0051] Optionally, a support column 122 is provided on the side of the base plate 12 near the bottom insert plate 13. The support column 122 can be set in the receiving groove 123 of the base plate 12. The base plate 12 is connected to the bottom insert plate 13 through the support column 122. The support column 122 has two functions. First, the support column 122 supports the bottom insert plate 13 and prevents the bottom insert plate 13 from becoming hollow and collapsing in the area corresponding to the receiving groove 123. Second, the top surface of the support column 122 provides a welding position for high-temperature brazing. That is, the support column 122 is the welding position between the base plate 12 and the bottom insert plate 13, realizing the planning of the welding path and the high welding strength to ensure the stability of the overall structure.

[0052] To ensure that the inlet chamber 11 between the receiving tank 123 and the bottom plate 13 can receive refrigerant in a timely manner, such as Figure 4-Figure 6 As shown, at least one of the base plate 12 and the bottom insert plate 13 is provided with a liquid injection pipe 4. The liquid injection pipe 4 is connected to the liquid inlet chamber 11 and supplies refrigerant to the liquid inlet chamber 11, so that the refrigerant can be delivered into the liquid inlet chamber 11 through the liquid injection pipe 4 to achieve sufficient replenishment of the refrigerant. Figure 6As shown, in this embodiment, a circular hole can be provided on the bottom plate 13, and the liquid injection pipe 4 passes through the circular hole to provide sufficient refrigerant to the liquid inlet chamber 11. The liquid injection pipe 4 can adopt a bent pipe structure to avoid the bottom plate 13 and the heat dissipation fins 3. The bottom end of the liquid injection pipe 4 can be at a certain distance from the bottom wall of the receiving tank 123 to avoid blockage at the bottom of the liquid injection pipe 4, which would lead to poor flow.

[0053] Since the heat dissipation fins 3 are erected between the bottom plate 13 and the top cover assembly 2, the bottom plate 13 needs to both support and fix the heat dissipation fins 3. Therefore, as follows... Figure 4 and Figure 6 As shown, a first insertion hole 132 is provided on the bottom plate 13, and a first protrusion 32 is correspondingly provided on the bottom of the heat dissipation fin 3, with the first protrusion 32 passing through the first insertion hole 132. Optionally, the first insertion hole 132 is a through hole with a strip-shaped structure, and the first protrusion 32 extends along the length direction of the heat dissipation fin 3 so that the first protrusion 32 can be inserted into the first insertion hole 132. This embodiment does not limit the number and length of the first insertion holes 132, as long as the number and length of each first insertion hole 132 can match the first protrusion 32 corresponding to that first insertion hole 132, it is within the protection scope of this embodiment.

[0054] In one embodiment, the top cover assembly 2 includes a cover plate 22 and a top insert plate 23. The top insert plate 23 is located below the cover plate 22 and connected to the cover plate 22. The return fluid chamber 21 is formed between the top insert plate 23 and the cover plate 22. A second insertion hole 231 is provided on the top insert plate 23. A second protrusion 33 is correspondingly provided on the top of the heat dissipation fin 3. The second protrusion 33 passes through the second insertion hole 231.

[0055] In one embodiment, such as Figure 4 As shown, the top cover assembly 2 includes a cover plate 22 and a top insert plate 23. Both the cover plate 22 and the top insert plate 23 are made of composite material through stamping. The top insert plate 23 is located below the cover plate 22 and connected to the cover plate 22. The top insert plate 23 and the cover plate 22 are arranged parallel to each other and form a return liquid cavity 21 between them. In one embodiment, if both the cover plate 22 and the top insert plate 23 are flat structures, the return liquid cavity 21 is only a gap between the cover plate 22 and the top insert plate 23, and the volume for accommodating the refrigerant is small. To ensure that the return liquid cavity 21 has a larger volume, optionally, as shown... Figure 7As shown, a groove is provided along the length direction on the side of the cover plate 22 near the top insert plate 23. This groove is formed by the bottom surface of the cover plate 22 facing the top surface of the cover plate 22. When the top surface of the top insert plate 23 and the bottom surface of the cover plate 22 are in contact, the cover plate 22 is equivalent to the cover plate 22 of the groove. The groove and the cover plate 22 form a flat tube-like structure. In addition to ensuring that the return liquid chamber 21 has a certain volume, it can also prevent the refrigerant from overflowing from the return liquid chamber 21, thus realizing the function of encapsulating the refrigerant.

[0056] Since the heat dissipation fins 3 are positioned between the top plate 23 and the bottom plate 13, the top plate 23 needs to both support and fix the heat dissipation fins 3. Therefore, as follows... Figure 8 As shown, a second insertion hole 231 is provided on the top insertion plate 23, and a second protrusion 33 is correspondingly provided on the bottom of the heat dissipation fin 3, with the second protrusion 33 passing through the second insertion hole 231. Optionally, the second insertion hole 231 is a through hole with a strip-shaped structure, and the second protrusion 33 extends along the length direction of the heat dissipation fin 3 so that the second protrusion 33 can be inserted into the second insertion hole 231. This embodiment does not limit the number and length of the second insertion holes 231, as long as the number and length of each second insertion hole 231 can match the second protrusion 33 corresponding to that second insertion hole 231, it is within the protection scope of this embodiment.

[0057] After introducing the base assembly 1 and the top cover assembly 2, the heat dissipation fins 3 will be introduced. For example... Figure 4 As shown, the heat dissipation fins 3 are formed by extruding microchannel aluminum plates, adopting an integrated molding structure, reducing the steps of parts assembly and reducing production costs. Simultaneously, the aluminum plate has excellent heat dissipation performance and good heat transfer effect. Multiple heat dissipation fins 3 are arranged in parallel and spaced apart, and at least one type of heat dissipation fin 3 is used. This embodiment does not limit the number and type of heat dissipation fins 3 and can be adjusted according to actual production needs. In this embodiment, there can be five types of heat dissipation fins 3: eight of the first type, five of the second type, six of the third type, two of the fourth type, and eight of the fifth type.

[0058] The differences between these five types of heat dissipation fins 3 are as follows: First, the length of the heat dissipation fins 3 differs, with the middle heat dissipation fins 3 being longer and the fins 3 on both sides being shorter; Second, the number and structure of the first protrusions 32 at the bottom of the heat dissipation fins 3 differ, with the first protrusions 32 being either continuous strip structures or discontinuous block structures; Third, the length of the second protrusions 33 at the top of the heat dissipation fins 3 differs, with the second protrusions 33 at the middle heat dissipation fins 3 being longer and the second protrusions 33 on both sides being shorter; Fourth, a clearance groove is provided at the bottom of the heat dissipation fins 3 at the position corresponding to the limit post 121, and the clearance groove is used to avoid the limit post 121.

[0059] like Figures 9-10 As shown, each heat dissipation fin 3 has multiple channels 31 inside, with a first interval or a second interval between adjacent channels 31. In one embodiment, the first interval is smaller than the second interval. Each heat dissipation fin 3 has a first interval, but some heat dissipation fins 3 have a second interval, while others do not. The reason for this arrangement is that the first interval serves as a partition between adjacent channels 31, ensuring the independence of each channel 31 and preventing the blockage of one channel 31 from affecting the working state of other channels 31. The second interval corresponds to the clearance groove, and the second interval is larger than the diameter of the limiting post 121, so that no channel 31 is provided at the position of the heat dissipation fin 3 corresponding to the limiting post 121, thus avoiding the blocking of the channel 31 by the limiting post 121 and affecting the heat dissipation efficiency.

[0060] In one embodiment, a through groove 34 is formed at the bottom of the heat dissipation fin 3, and the through groove 34 is connected to the channel 31. The angle between the extending direction of the through groove 34 and the extending direction of the channel 31 is in the range of 85 degrees to 95 degrees. Optionally, a through groove 34 is formed at the bottom of the heat dissipation fin 3, and the through groove 34 is connected to the channel 31. The extending direction of the through groove 34 and the extending direction of the channel 31 are perpendicular to each other. Optionally, the extending direction of the through groove 34 and the extending direction of the channel 31 can also be approximately perpendicular. Absolute perpendicularity is only the optimal process route state. If the channel 31 is not formed at the bottom of the heat dissipation fin 3, and only the bottom port of the channel 31 can be used to transport refrigerant, by forming a through groove 34 at the bottom of the heat dissipation fin 3, the through groove 34 is a rectangular groove structure, and the through groove 34 is connected to the channel 31. This is equivalent to increasing the contact area between the bottom of the channel 31 and the liquid inlet chamber 11, so that the bottom port and both sides of the channel 31 can provide an inlet for the refrigerant to enter the channel 31, which facilitates the transport of refrigerant.

[0061] The heat sink used for communication equipment has undergone comparative thermal testing. Its temperature uniformity and heat dissipation capacity are significantly better than those of the original die-cast or extruded aluminum heat sinks. Under high-temperature operating conditions, the temperature difference between the liquid inlet chamber 11 and the channel 31 and the liquid return chamber 21 is ≤3℃, thus reducing the temperature difference range.

[0062] The installation process of the heat sink for communication settings provided in this embodiment is as follows:

[0063] 1. The limiting post 121 of the base plate 12 is inserted into the limiting hole 131 of the base plate 13 for pairing and combination.

[0064] 2. Install the liquid injection tube 4 in the round hole of the bottom plate 13, and insert the first protrusion 32 of the heat dissipation fin 3 into the first insertion hole 132 of the bottom plate 13.

[0065] 3. After installing multiple heat dissipation fins 3 in sequence, insert the second protrusion 33 of the heat dissipation fin 3 through the second insertion hole 231 of the top insertion plate 23, and cover the top insertion plate 22 on the top insertion plate 23.

[0066] 4. After being fixed with a special clamp, high-temperature brazing is performed to ensure good welding.

[0067] In this description, the terms "upper," "lower," and "right," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used solely for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. Furthermore, the terms "first" and "second" are used merely for descriptive distinction and have no special meaning.

[0068] In the description of this specification, references to terms such as "an embodiment" and "example" mean that a feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, illustrative expressions of the above terms do not necessarily refer to the same embodiment or example.

Claims

1. A heat sink for communication devices, used for cooling a chip, comprising: A base assembly (1) is provided with a liquid inlet chamber (11) inside the base assembly (1), the liquid inlet chamber (11) being configured to contain refrigerant; The top cover assembly (2) is arranged parallel to and spaced apart from the base assembly (1), and a return liquid chamber (21) is provided on the top cover assembly (2); A heat dissipation fin (3) is erected between the base assembly (1) and the top cover assembly (2) and is connected to the base assembly (1) and the top cover assembly (2) respectively. A channel (31) is provided in the heat dissipation fin (3). The bottom end of the channel (31) is connected to the liquid inlet chamber (11) and the top end of the channel (31) is connected to the liquid return chamber (21). When the base assembly (1) and the chip are in contact with each other, the heat is transferred through the base assembly (1) to the liquid inlet chamber (11), causing the refrigerant in the liquid inlet chamber (11) to boil and vaporize to form gaseous refrigerant. The channel (31) is configured to allow the gaseous refrigerant passing through the channel (31) to enter the liquid return chamber (21) and condense to form liquid refrigerant. The channel (31) is also configured to allow the liquid refrigerant passing through the channel (31) to flow back into the liquid inlet chamber (11). The base assembly (1) includes a base plate (12) and a bottom insert plate (13). The bottom insert plate (13) is located above the base plate (12) and connected to the base plate (12). The liquid inlet cavity (11) is formed between the bottom insert plate (13) and the base plate (12). A first insertion hole (132) is provided on the bottom insert plate (13). A first protrusion (32) is provided at the bottom of the heat dissipation fin (3). The first protrusion (32) passes through the first insertion hole (132) and extends to the bottom of the liquid inlet cavity (11). A through groove (34) is provided at the bottom of the heat dissipation fin (3), and the through groove (34) is connected to the channel (31).

2. The heat sink for communication setup according to claim 1, wherein, The number of heat dissipation fins (3) is multiple, and the multiple heat dissipation fins (3) are arranged in parallel and spaced apart. The multiple heat dissipation fins (3) are of at least one type.

3. The heat sink for communication setup according to claim 2, wherein, Each heat dissipation fin (3) has multiple channels (31) and there is a first interval or a second interval between two adjacent channels (31).

4. The heat sink for communication setup according to claim 1, wherein, The angle between the extending direction of the through groove (34) and the extending direction of the channel (31) is between 85 degrees and 95 degrees.

5. The heat sink for communication setup according to claim 1, wherein, One of the base plate (12) and the bottom insert plate (13) is provided with a limiting post (121) and the other is provided with a limiting hole (131), with the limiting post (121) passing through the limiting hole (131).

6. The heat sink for communication setup according to claim 1, wherein, A support column (122) is provided on the side of the base plate (12) near the bottom insert plate (13), and the base plate (12) is connected to the bottom insert plate (13) through the support column (122).

7. The heat sink for communication setup according to claim 1, wherein, At least one of the base plate (12) and the bottom insert plate (13) is provided with a liquid injection pipe (4), which is connected to the liquid inlet chamber (11) and supplies refrigerant to the liquid inlet chamber (11).

8. The heat sink for communication setup according to claim 1, wherein, The top cover assembly (2) includes a cover plate (22) and a top insert plate (23). The top insert plate (23) is located below the cover plate (22) and connected to the cover plate (22). The return fluid chamber (21) is formed between the top insert plate (23) and the cover plate (22). A second insertion hole (231) is provided on the top insert plate (23). A second protrusion (33) is correspondingly provided on the top of the heat dissipation fin (3). The second protrusion (33) passes through the second insertion hole (231).

9. The heat sink for communication setup according to any one of claims 1-8, wherein, The base assembly (1), the top cover assembly (2), and the heat dissipation fins (3) are connected by high-temperature brazing.

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